JP2011150828A - Organic el device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL device having a structure to enhance sealability without enlarging a peripheral region. <P>SOLUTION: The organic EL device includes a first substrate 110, a plurality of organic EL elements 120 arranged on the first substrate, a sealing film to cover the plurality of the organic EL elements, a second substrate arranged opposed to the first substrate with the plurality of the organic EL elements interposed, a sealing material 300 placed so as to surround the plurality of the organic EL elements in a space between the first substrate and the second substrate in a region on the first substrate where the plurality of the organic EL elements are not arranged, and a barrier rib member 220 placed in a space between the sealing film and the second substrate so as to surround at least effective organic EL elements 120e having a light emitting function out of the plurality of organic EL elements, in a region on the first substrate where the organic EL elements are arranged. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an organic EL device including a plurality of organic electroluminescent elements (hereinafter referred to as “organic EL elements”) and a manufacturing method thereof, and particularly relates to a sealing structure of an organic EL device.

In recent years, organic EL elements that have been researched and developed are light-emitting elements that utilize the electroluminescence phenomenon of organic materials. The element has a structure in which an organic light emitting layer including a light emitting layer made of an organic light emitting material is sandwiched between an anode and a cathode electrode pair.
The general configuration of an organic EL device including a plurality of such organic EL elements will be described. The device includes a first substrate having a plurality of organic EL elements on one surface, and the one of the first substrates. And a second substrate disposed opposite to the surface.

The organic light emitting layer in the organic EL element is altered when it comes into contact with a gas containing moisture, oxygen, ozone or the like, which may cause generation of a non-light emitting portion (dark spot) or luminance reduction. Therefore, a sealing film is provided on the plurality of organic EL elements formed on the first substrate for the purpose of preventing moisture and gas from touching the organic light emitting layer (see, for example, Patent Document 1). ).
Further, in order to prevent moisture and gas contained in the external atmosphere of the surrounding environment from entering the inside of the organic EL device, the organic EL device has a first region in a peripheral region where a plurality of organic EL elements are not formed. By providing a sealing material that joins the substrate and the second substrate, the space between the substrates is internally sealed (see, for example, Patent Document 2).

JP 2000-223264 A JP 2007-103317 A

However, the sealing film formed on the plurality of organic EL elements does not completely cover them, and the sealing film may have a sealing defect in terms of manufacturing technology. This sealing defect portion can be an intrusion route for moisture and gas.
In addition, in the organic EL device, a sealing material is used to internally seal between both substrates. However, since this sealing material is generally a resin material, moisture and gas can enter from the outside.

Therefore, there is a possibility that moisture and gas contained in the external atmosphere of the surrounding environment enter the organic EL device and further enter the organic light emitting layer using the sealing defect portion of the sealing film as an intrusion route.
As a method for further enhancing the sealing performance of the organic EL device, it is conceivable to double the sealing material, but generally the width of the sealing material is formed in millimeters, and the organic EL element is formed in microns. It is significantly larger than what is done. Therefore, it is required to improve the sealing performance without using a sealing material as much as possible.

  An object of the present invention is to provide an organic EL device having a structure that enhances sealing performance without enlarging a peripheral region.

  In order to solve the above problems, an organic EL device according to one embodiment of the present invention includes a first substrate, a plurality of organic EL elements provided over the first substrate, and the plurality of organic EL elements. The sealing film to be coated, the first substrate, the second substrate disposed opposite to the plurality of organic EL elements, and the plurality of organic EL elements on the first substrate are not provided. In the region, a sealing material provided to surround the plurality of organic EL elements in a gap between the first substrate and the second substrate, and the plurality of organic EL elements on the first substrate are provided. And a partition member provided in a space between the sealing film and the second substrate so as to surround at least an effective organic EL element having a light emitting function among the plurality of organic EL elements. It was.

  In the organic EL device according to one aspect of the present invention, the partition member is disposed so as to surround at least the effective organic EL element having a light emitting function among the plurality of organic EL elements in the gap between the sealing film and the second substrate. Is formed. For this reason, even if moisture or gas penetrates the inside of the organic EL device through the sealing material from the outside of the organic EL device, these are blocked by the partition member. Therefore, with respect to the effective organic EL element surrounded by the partition member, deterioration due to moisture or gas entering from the outside can be delayed, and a long life of the organic EL element can be expected.

Further, since the partition member is provided in the region where the plurality of organic EL elements are provided on the first substrate, it is not necessary to enlarge the peripheral region.
As described above, according to one embodiment of the present invention, the sealing performance can be improved without enlarging the peripheral region.

1 is a cross-sectional view showing a configuration of an organic EL device 1 according to Embodiment 1. FIG. 1 is a partial cross-sectional view illustrating a configuration of an organic EL device 1 according to Embodiment 1. FIG. FIG. 6 is a diagram showing an example of a manufacturing process of the element formation substrate 100 of the first embodiment. 6 is a diagram illustrating an example of a manufacturing process of the sealing substrate 200 according to Embodiment 1. FIG. It is a fragmentary sectional view showing the composition of organic EL device 1 of modification 1-1. It is a figure which shows an example of the manufacturing process of the sealing substrate 200 of the modification 1-1. It is sectional drawing which shows the structure of the organic electroluminescent apparatus 1 of the modification 1-2. It is sectional drawing which shows the structure of the organic electroluminescent apparatus 1 of the modification 1-3. 5 is a cross-sectional view showing a configuration of an organic EL device 1 according to Embodiment 2. FIG. It is sectional drawing which shows the structure of the organic EL apparatus 1 of the modification 2-1. It is sectional drawing which shows the structure of the organic electroluminescent apparatus 1 of the modification 2-2. 6 is a partial cross-sectional view showing a configuration of an organic EL device 1 according to Embodiment 3. FIG. It is a fragmentary sectional view showing the composition of organic EL device 1 of modification 3-1. 2 is an external perspective view showing an external appearance of a display device 1000. FIG.

[Aspect]
An organic EL device according to one embodiment of the present invention includes a first substrate, a plurality of organic EL elements provided over the first substrate, a sealing film that covers the plurality of organic EL elements, In a region where the plurality of organic EL elements are not provided on the first substrate and the second substrate disposed opposite to the first substrate via the plurality of organic EL elements, the first substrate And a sealing material provided so as to surround the plurality of organic EL elements in a gap between the first substrate and the second substrate, and in the region where the plurality of organic EL elements are provided on the first substrate, the sealing In the gap between the film and the second substrate, a partition member provided so as to surround at least an effective organic EL element having a light emitting function among the plurality of organic EL elements is provided.

Here, “at least surrounding the effective organic EL element having a light emitting function among the plurality of organic EL elements” means that it surrounds all of the plurality of organic EL elements or a part or all of the plurality of effective organic EL elements. Including the surrounding case.
In the organic EL device according to one aspect of the present invention, the partition member is disposed so as to surround at least the effective organic EL element having a light emitting function among the plurality of organic EL elements in the gap between the sealing film and the second substrate. Is formed. For this reason, even if moisture or gas penetrates the inside of the organic EL device through the sealing material from the outside of the organic EL device, these are blocked by the partition member. Therefore, with respect to the effective organic EL element surrounded by the partition member, deterioration due to moisture or gas entering from the outside can be delayed, and a long life of the organic EL element can be expected.

Further, since the partition member is provided in the region where the plurality of organic EL elements are provided on the first substrate, it is not necessary to enlarge the peripheral region.
Here, as another aspect of the present invention, each organic EL element located outside the partition member is a dummy organic EL element, and the dummy organic EL element is an organic EL element having no light emitting function. Also good.

  In the organic EL device of this aspect, since each organic EL element located outside the partition member is a dummy organic EL element, even if moisture or gas enters the inside of the organic EL device from the surrounding environment, the organic EL device deteriorates. The organic EL element that can generate is a dummy organic EL element. Therefore, when moisture or gas enters the organic EL device from the surrounding environment, it is possible to reduce the possibility that the effective organic EL element is first deteriorated.

Here, as another aspect of the present invention, the dummy organic EL element may have the same configuration as the effective organic EL element.
In the organic EL device of this aspect, since all the organic EL elements including the effective organic EL element and the dummy organic EL element can be formed at once, there is a merit in manufacturing.
Here, as another aspect of the present invention, the partition member may be further formed so as to be divided for each dummy organic EL element in a dummy region where the dummy organic EL element is formed.

In the organic EL device according to this aspect, since the partition member is further formed so as to partition for each dummy organic EL element in the dummy region in which the dummy organic EL element is formed, the dummy that is not related to light emission. In the region, it is possible to attenuate the moisture and gas that have entered from the surrounding environment step by step.
By the way, an organic EL element is comprised including an organic material. Accordingly, moisture or the like that causes deterioration of the organic EL element can be generated not only from the outside of the organic EL device but also from the inside of the organic EL element. Since the sealing film is present on the organic EL element, the influence of the generated water or the like on the other organic EL elements is extremely small. However, as described above, if a sealing defect portion exists in the sealing film, moisture or the like can diffuse into other organic EL elements using the sealing defect portion as a passage. As a result, there is a possibility that other organic EL elements adjacent to the organic EL element may be deteriorated due to moisture generated from one organic EL element.

Therefore, as another aspect of the present invention, the partition member may be further formed so as to partition the plurality of organic EL elements every predetermined number.
In the organic EL device of this aspect, since the partition member is further formed so as to partition the plurality of organic EL elements at every predetermined number, moisture generated from the organic EL elements in one partition is separated from the other partitions. It is possible to prevent diffusion into the organic EL element. Therefore, in addition to preventing intrusion of moisture and gas contained in the external atmosphere of the surrounding environment, it is possible to prevent diffusion of moisture generated from the inside of the organic EL element.

Here, as another aspect of the present invention, the predetermined number may be 1.
In the organic EL device according to this aspect, since the partition member is provided for each organic EL element, the deterioration of the element due to moisture generated from the inside of the organic EL element can be minimized.
Therefore, it is possible to provide a high-quality organic EL device with few dark spots and luminance reduction portions.

Here, as another aspect of the present invention, the partition member may include a base member and a covering member that covers the base member, and the covering member may be made of a material having a sealing property. A covering member made of a material having a sealing property can be realized by, for example, a sealing layer 222 described later.
In the organic EL device according to this aspect, the sealing performance can be further enhanced because the organic EL device includes a base member and a covering member that covers the base member, and the covering member is made of a material having a sealing property.

Here, as another aspect of the present invention, an elastic modulus of a portion of the partition member that contacts the sealing film may be smaller than an elastic modulus of the sealing film.
In the organic EL device according to this aspect, since the elastic modulus of the portion in contact with the sealing film in the partition member is smaller than the elastic modulus of the sealing film, the portion is deformed when contacting the sealing film. The sealing film and the partition member are in contact with each other in a close contact state. As a result, the sealing performance by the partition member is further improved, and high sealing performance can be realized.

Here, as another aspect of the present invention, the partition member has a laminated structure, and the layer in contact with the sealing film is made of an organic material, and the film thickness is 20 nm or more and 100 nm or less. In addition, the other layer in the partition member may be made of a material having a higher sealing property than the organic material, and the film thickness may be larger than the film thickness of the layer in contact with the sealing film.
In the organic EL device according to this aspect, the layer in contact with the sealing film, which is a layer having a low sealing property in the partition member, is thinner than the other layers in the partition member. The area can be reduced and the sealing performance can be improved.

Here, as another aspect of the present invention, a closed space formed by the first substrate, the second substrate, and the sealing material, the first substrate, the second substrate, and the partition wall The closed space formed by the member may be lower than the atmospheric pressure.
In the organic EL device of this aspect, since the closed space is lower than the atmospheric pressure, a compressive force due to the pressure difference between the atmospheric pressure and the atmospheric pressure in the closed space is applied to the junction between the partition wall member and the sealing film. Will be. Therefore, the sealing film and the partition member are in contact with each other in a more closely contacted form, and the sealing performance can be further improved.

Here, as another aspect of the present invention, a closed space formed by the first substrate, the second substrate, and the sealing material, the first substrate, the second substrate, and the partition wall The closed space formed by the member may be filled with an inert gas.
In the organic EL device of this aspect, since the closed space is filled with an inert gas, the organic EL device remains in the closed space as well as blocking moisture and gas intrusion from the outside of the organic EL device. The partial pressure of moisture and oxidizing gas can be reduced. Therefore, the deterioration of the organic EL element can be further suppressed.

Here, as another aspect of the present invention, the sealing film may be made of at least one of SiO, SiON, SiN, SiC, SiOC, AlN, and Al2O3.
Here, as another aspect of the present invention, the partition member includes a sealing member and a covering member that covers the sealing member and contacts the sealing film, and the sealing member includes at least SiO, SiON , SiN, SiC, SiOC, AlN, Al2O3, and the covering member may be made of an organic material. The sealing member can be realized by, for example, a sealing layer 222 described later, and the covering member that covers the sealing member and is in contact with the sealing film can be realized by, for example, a low elastic layer 223 described later.

Here, as another aspect of the present invention, the material of the portion in contact with the sealing film in the partition member may be a polyparaxylylene resin.
Here, as another aspect of the present invention, a first step of forming a plurality of organic EL elements on a first substrate, a second step of forming a sealing film covering the plurality of organic EL elements, When the second substrate is disposed opposite to the first substrate via the plurality of organic EL elements, the plurality of organic EL elements on the first substrate is on the second substrate. A third step of forming a partition member in a region corresponding to the region where the partition member is provided, and a second substrate on which the partition member is formed are arranged to face each other with the first substrate interposed between the plurality of organic EL elements. A fourth step and a fifth step of bonding a gap between the first substrate and the second substrate with a sealing material in a region where the plurality of organic EL elements are not provided on the first substrate. The partition member includes the sealing film and the second substrate. Disposed in the gap may be surrounding at least an effective organic EL element having a light emitting function among the plurality of organic EL elements.

By the way, in each aspect of the present invention, the partition member is provided in order to improve the sealing performance. However, the same effect can be obtained with the following configuration.
As another aspect of the present invention, a first substrate, a plurality of organic EL elements provided on the first substrate, a sealing film covering the plurality of organic EL elements, and the first substrate In the region where the plurality of organic EL elements are not provided on the first substrate, and the second substrate disposed so as to face each other with the plurality of organic EL elements interposed therebetween. A sealing material provided so as to surround the plurality of organic EL elements in a gap with the substrate, and a coating film that covers a facing surface of the second substrate facing the first substrate, The coating film may have an elastic modulus lower than that of the sealing film, and the sealing film and the second substrate may be in contact with each other through the coating film.

  In the organic EL device of this aspect, the sealing film and the second substrate are in contact with each other through the low elastic layer. For this reason, compared with the case where the sealing film and the second substrate are in direct contact with each other, the low elastic layer having an elastic modulus lower than the elastic modulus of the sealing film is deformed, so that the sealing film and the second substrate The substrate can be in close contact with the low elastic layer. As a result, even if moisture or gas penetrates the inside of the organic EL device from the outside of the organic EL device, they are blocked by the sealing film and the second substrate that are in close contact with each other. Become. Therefore, the deterioration of the organic EL element due to moisture or gas entering from the outside can be delayed, and the lifetime of the organic EL element can be expected to be extended.

Moreover, in this aspect, since the low elastic layer is covered on the facing surface of the second substrate that faces the first substrate, it is not necessary to enlarge the peripheral region.
[Embodiment 1]
<Outline configuration>
FIG. 1 is a cross-sectional view schematically showing a cross section of the organic EL device 1 according to the first embodiment (a cross section indicated by a one-dot chain line in FIG. 2) and a partially enlarged view thereof.

  The organic EL device 1 of Embodiment 1 is a top emission type display device. As shown in FIG. 1, in the central region on the first substrate 110, a plurality of organic EL elements 120 are adjacently arranged in a matrix. In the organic EL device 1, the organic EL elements 120 (R), (G), and (B) corresponding to the RGB colors are set as subpixels, and a combination of adjacent RGB subpixels is set as one pixel (pixel).

A region where a plurality of organic EL elements are adjacently arranged in a matrix is referred to as an element formation region (also referred to as a display region) 10, and a peripheral region surrounding the element formation region 10 is referred to as a peripheral region 20.
In the central region of the element formation region 10, a plurality of effective organic EL elements 120e having a light emitting function are arranged adjacent to each other in a matrix, and the structure of the effective organic EL element 120e is formed in an end region of the element formation region 10. A plurality of dummy organic EL elements 120d that have the same function but have no light emitting function are disposed adjacent to each other. As described above, the plurality of dummy organic EL elements 120d are not necessarily required to have the same structure as that of the effective organic EL element 120e. For example, the reflective anode 121 described later may not be patterned. . In addition, when it is set as the same structure as the effective organic EL element 120e, since an organic EL element can be formed collectively, there exists a merit on manufacture.

A partition wall member 220 is provided on the outer periphery of the element formation region 10 so as to surround all the organic EL elements 120 including the effective organic EL elements 120e and the dummy organic EL elements 120d.
In addition, a sealing material 300 that seals the first substrate 110 and the second substrate 210 is provided at the periphery of the first substrate 110 so as to surround the element formation region 10.

  FIG. 2 is a cross-sectional view (a cross section of a region corresponding to A-A ′ in FIG. 1) schematically showing a partial cross section of the organic EL device 1 according to the first embodiment. In the drawing, the upper surface side of the second substrate 210 is a display surface. As shown in FIG. 2, a planarization layer 112 is formed on the TFT substrate 111, and a reflective anode 121 is formed on the planarization layer 112 by patterning in a matrix. A hole injection layer 122 is formed on the reflective anode 121. On the hole injection layer 122, a light emitting layer 124 is stacked in a region partitioned by the bank 123. Further, an electron injection layer 125, a transparent cathode 126, and a sealing film 130 are formed on the light emitting layer 124 so as to be continuous with those of adjacent organic EL elements beyond the area partitioned by the bank 123. Has been.

  In the present embodiment, the organic EL element 120 includes a reflective anode 121, a hole injection layer 122, a light emitting layer 124, an electron injection layer 125, functional layers such as a transparent cathode 126, and a bank 123 that defines the organic EL element. ing. The organic EL element 120 lacks one or both of the hole injection layer 122 and the electron injection layer 125 among the functional layers, or further includes other functional layers such as a hole transport layer and an electron transport layer. It is good also as a structure including.

In addition, a partition wall member 220 and a plurality of photo spacers 230 are formed on a surface of the second substrate 210 facing the first substrate 110. The partition member 220 includes a base member 221 a, a sealing layer 222 that covers the base member 221 a, and a low elastic layer 223 that covers the sealing layer 222. The internal structure of the photo spacer 230 can be the same as that of the partition wall member 220.
The sealing layer 222 and the low elastic layer 223 are formed over the entire region corresponding to the element formation region 10.

<Configuration of each part>
The TFT substrate 111 is, for example, non-alkali glass, soda glass, non-fluorescent glass, phosphoric acid glass, boric acid glass, quartz, acrylic resin, styrene resin, polycarbonate resin, epoxy resin, polyethylene, polyester, silicone type. A TFT, a wiring member, and a passivation film (not shown) for covering the TFT are formed on a substrate body of an insulating material such as resin or alumina. The substrate body may be an organic resin film.

The planarization layer 112 is provided to adjust the surface step of the TFT substrate 111 to be flat, and is made of an insulating material such as polyimide resin or acrylic resin.
In the present embodiment, the first substrate 110 is composed of a TFT substrate 111 and a planarization layer 112, and refers to the TFT substrate 111 in a region where the planarization layer 112 is not formed. Further, it may be included.

  The reflective anode 121 is made of Ag (silver). The reflective anode 121 is, for example, Al (aluminum), an alloy of silver, palladium and copper, an alloy of silver, rubidium and gold, MoCr (alloy of molybdenum and chromium), NiCr (alloy of nickel and chromium), or the like. It may be formed by. Since the organic EL device 1 according to the first embodiment is a top emission type, the reflective anode 121 is preferably formed of a light reflective material. A known transparent conductive film may be provided on the surface of the reflective anode 121. As a material for the transparent conductive film, for example, ITO (indium tin oxide) can be used.

The hole injection layer 122 is made of MoOx (molybdenum oxide), WOx (tungsten oxide), or MoxWyOz (molybdenum-tungsten oxide). The hole injection layer 122 only needs to be formed of a material that performs a hole injection function, and examples of such a material include metal oxide, metal nitride, and metal oxynitride.
The bank 123 is made of an organic material such as resin and has an insulating property. Examples of organic materials include acrylic resins, polyimide resins, novolac type phenol resins, and the like. The bank 123 preferably has organic solvent resistance. Further, since the bank 123 may be subjected to an etching process, a baking process, or the like, it is preferable that the bank 123 be formed of a highly resistant material that does not excessively deform or alter the process.

  The light emitting layer 124 includes, for example, an oxinoid compound, a perylene compound, a coumarin compound, an azacoumarin compound, an oxazole compound, an oxadiazole compound, a perinone compound, a pyrrolopyrrole compound, a naphthalene compound, an anthracene compound described in JP-A-5-163488. Fluorene compound, fluoranthene compound, tetracene compound, pyrene compound, coronene compound, quinolone compound and azaquinolone compound, pyrazoline derivative and pyrazolone derivative, rhodamine compound, chrysene compound, phenanthrene compound, cyclopentadiene compound, stilbene compound, diphenylquinone compound, styryl compound, Butadiene compounds, dicyanomethylenepyran compounds, dicyanomethylenethiopyran compounds, fluorescein compounds, pyridine Compounds, thiapyrylium compounds, serenapyrylium compounds, telluropyrylium compounds, aromatic aldadiene compounds, oligophenylene compounds, thioxanthene compounds, cyanine compounds, acridine compounds, metal complexes of 8-hydroxyquinoline compounds, metal complexes of 2-bipyridine compounds, It is preferably formed of a fluorescent material such as a complex of a Schiff salt and a group III metal, an oxine metal complex, or a rare earth complex.

The electron injection layer 125 has a function of transporting electrons injected from the transparent cathode 126 to the light emitting layer 124, and is preferably formed of, for example, barium, phthalocyanine, lithium fluoride, or a combination thereof.
The transparent cathode 126 is made of, for example, ITO, IZO (indium zinc oxide) or the like. Since the organic EL device 1 is a top emission type, the transparent cathode 126 is preferably formed of a light transmissive material.

  The sealing film 130 has a function of preventing the light emitting layer 124, the electron injection layer 125, and the like from being exposed to moisture or air, for example, SiO (silicon oxide), SiN (silicon nitride). , SiON (silicon oxynitride), SiC (silicon carbide), SiOC (carbon-containing silicon oxide), AlN (aluminum nitride), Al2O3 (aluminum oxide) and the like. Since the organic EL device 1 is a top emission type, the sealing film 130 is preferably formed of a light transmissive material.

Here, in the sealing film 130, there are sealing defect portions called pinholes in some places and sealing defect portions due to foreign matters (so-called particles) attached in a process before the sealing film 130 is formed. These sealing defect portions can serve as moisture and gas intrusion paths.
The above-described constituent elements (111 to 130) are collectively referred to as an element forming substrate 100.
The second substrate 210 is formed of, for example, a glass-based sealing material such as alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, borate glass, or quartz. Opposing to the EL element formation surface.

The partition member 220 has a three-layer structure in which a base member 221a, a sealing layer 222, and a low elastic layer 223 are stacked in this order.
The base member 221a is made of, for example, methacrylic acid esters. The thickness of the base member 221a is preferably, for example, 5 μm or more. This is because the size of the foreign matter adhering in the TFT forming process and the organic EL element forming process is often about 0.1 to 5 μm, and if the thickness of the base member 221a is less than 5 μm, the second substrate is This is because the foreign matter is crushed when being bonded, and the reflective anode 121 and the transparent cathode 126 are short-circuited and the organic EL element is likely to become a dark spot.

The sealing layer 222 is formed of a material such as SiN, SiON, SiON, SiC, SiOC, AlN, Al 2 O 3, etc., like the sealing film 130.
By forming the sealing layer 222 so as to cover the base member 221a, the base member 221a functions as a sealing material. The thickness of the sealing layer 222 is preferably 100 to 500 nm, for example. When the thickness of the sealing layer 222 is less than 100 nm, it is difficult to ensure sufficient sealing performance. On the other hand, when the thickness of the sealing layer 222 is thicker than 500 nm, the transmittance of light from the light emitting layer tends to decrease.

  The low elastic layer 223 is made of an organic material such as polyparaxylylene resin. Since the low elastic layer 223 is formed of an organic material, its elastic modulus is smaller than the elastic modulus of the sealing film 130 and the sealing layer 222 formed of a glass or ceramic material. By forming the low elastic layer 223 so as to cover the sealing layer 222, when the low elastic layer 223 comes into contact with the sealing film 130, the shape thereof is deformed, and the sealing film 130 is more closely adhered. Can be contacted. Thereby, sealing property can be improved further. In particular, polyparaxylylene resin is preferable because it is a low-elasticity organic material and has the most excellent sealing properties.

However, since the low elastic layer 223 is formed of an organic material, the sealing property is lower than that of the sealing layer 222. Therefore, it is preferable to form the low elastic layer 223 thin so that the area of the low elastic layer 223 is small. Specifically, the thickness of the low elastic layer 223 is preferably thinner than the thickness of the base member 221a, and is preferably 20 to 100 nm, for example.
In the partition member 220 composed of the base member 221 a, the sealing layer 222, and the low elastic layer 223 formed so as to surround the outer periphery of the element formation region 10 in this way, both ends in the vertical direction are connected to the second substrate 210. The sealing film 130 is in contact with each other. As a result, the space 401 surrounded by the partition member 220, the sealing film 130, and the second substrate 210 is sealed. Therefore, even if there is a sealing defect portion in the sealing film 130, it is possible to block the moisture and gas that has entered from the sealing material 300 by the partition member 200, thereby delaying the deterioration of the organic EL element. it can.

Further, as shown in FIG. 1, since the partition member 220 is formed on the outer periphery of the element forming region 10, the sealing property can be improved without enlarging the peripheral region.
The sealant 300 is formed around the first substrate 110 and the second substrate 210 to seal the inside of both substrates. The sealing material 300 is made of a dense resin material, and examples thereof include a silicone resin.

  The photo spacer 230 has a three-layer structure like the partition member 220 and is used mainly for the purpose of adjusting the facing distance between the first substrate 110 and the second substrate 210. In the configuration shown in FIG. 1, the photo spacer 230 is formed in a cylindrical shape having the Z direction as an axial direction, and is disposed so that both ends in the Z direction are in contact with the respective substrates 110 and 210. The shape is not limited to a cylindrical shape, and may be a rectangular parallelepiped or a sphere. A known material can be used as the material of the base member in the photo spacer 230, and examples thereof include highly transparent resin materials such as methacrylic acid esters. That is, the same material as the base member 221a of the partition wall member 220 can be used.

As shown in the partially enlarged view of FIG. 1, the photo spacers 230 are arranged in accordance with the positions of the intersections of the banks formed in a lattice pattern on the first substrate 110. However, the present invention is not limited to this. .
The constituent elements (210 to 230) described above are collectively referred to as a sealing substrate 200.
The spaces 401 and 402 have a pressure lower than the atmospheric pressure and are filled with an inert gas such as nitrogen. Therefore, a compressive force due to the differential pressure between the atmospheric pressure and the atmospheric pressure in the spaces 401 and 402 is applied to the contact portion between the partition wall member 230 and the sealing film 130. As a result, since the partition wall member 230 and the sealing film 130 are in contact with each other in a more closely contacted form, the sealing performance can be further improved.

In addition, since the spaces 401 and 402 are filled with an inert gas, the spaces 401 and 402 remain in the spaces 401 and 402 in addition to blocking moisture and gas intrusion from the outside of the organic EL device 1. The partial pressure of moisture and oxidizing gas can be reduced.
<Manufacturing method>
Then, the manufacturing process of the organic EL apparatus 1 is illustrated. FIG. 3 is a diagram illustrating an example of a manufacturing process of the element formation substrate 100.

First, as shown in FIG. 3A, an Ag thin film is formed on the planarizing layer 112 formed on the TFT substrate 111 by, for example, sputtering, and the Ag thin film is patterned by, for example, photolithography to form a matrix. The reflective anode 121 is formed on the substrate. The Ag thin film may be formed by vacuum deposition or the like.
Next, as shown in FIG. 3B, a hole injection layer 122 of WOx or MoxWyOz is formed by a technique such as vacuum deposition or sputtering using a target composition containing WOx or MoxWyOz.

  Next, a film made of an insulating organic material is formed on the hole injection layer 122, and a photoresist is uniformly applied thereon. A mask having an opening (a pattern of a bank to be formed) with a predetermined shape for removing a part of the insulating organic material layer and exposing a part of the hole injection layer 122 is overlaid on the applied photoresist. . Then, it is exposed from above the mask to form a resist pattern. Thereafter, excess insulating organic material and uncured photoresist are washed out with an aqueous or non-aqueous etching solution (peeling agent). Thereby, patterning of the insulating organic material is completed. Thereafter, the photoresist (resist residue) on the patterned insulating organic material is removed by washing with pure water. Thus, the bank 123 is completed (see FIG. 3C).

  Next, as shown in FIG. 3D, a composition ink containing an organic EL material (hereinafter simply referred to as “ink”) is dropped into each region partitioned by the bank 123 by, for example, an ink jet method. The ink is dried to form the light emitting layer 124. The light emitting layer 124 may be formed by a dispenser method, a nozzle coating method, a spin coating method, intaglio printing, letterpress printing, or the like.

Next, as shown in FIG. 3E, a barium thin film to be the electron injection layer 125 is formed by, for example, vacuum deposition, an ITO thin film to be the transparent cathode 126 is formed by, for example, sputtering, and a sealing film 130 is further formed. To do. Through the above steps, the element formation substrate 100 is completed.
Then, the manufacturing process of the sealing substrate 200 is illustrated. FIG. 4 is a diagram illustrating an example of a manufacturing process of the sealing substrate 200.

  First, a film made of a highly transparent resin material such as methacrylic acid esters is formed on the second substrate 210, and a photoresist is uniformly applied thereon. Thereafter, a mask having an opening with a predetermined shape is overlaid. Then, it is exposed from above the mask to form a resist pattern. Thereafter, excess resin material and uncured photoresist are washed out with an aqueous or non-aqueous etching solution (peeling agent). Thereby, the patterning of the resin material is completed. Thereafter, the photoresist (resist residue) on the patterned resin material is removed by washing with pure water. As a result, as shown in FIG. 4A, base members 221a and 221b are formed at positions corresponding to bank intersections and positions corresponding to the outer periphery of the element formation region.

  Next, as shown in FIG. 4B, a sealing layer 222 is formed in a region corresponding to the element formation region on the surface of the second substrate 210, and as shown in FIG. 4C, the sealing layer 222 is formed. A low elastic layer 223 is formed thereon by, for example, plasma CVD. Thereby, the partition member 220 and the plurality of photo spacers 230 arranged discretely are completed. The sealing substrate 200 is completed through the above steps.

  Subsequently, a paste of the sealing material 300 is applied around the first substrate 110 or the second substrate 210. Then, the material of the sealing material 300 whose main component is an ultraviolet curable resin is applied to the surface of the first substrate 110 or the second substrate 210. Thereafter, the applied material is irradiated with ultraviolet rays to bond both substrates together. At this time, if the step of bonding the two substrates is performed in an inert gas atmosphere such as nitrogen or argon, the space formed between the two substrates can be filled with the inert gas.

Then, when both substrates are baked to complete the sealing process, the organic EL device 1 is completed.
According to this manufacturing process, the partition member 220 can be formed together in the same process as the formation of the photo spacer 230. Therefore, it is not necessary to increase the number of processes for forming the partition member 220.
[Modification 1-1]
As the sealing substrate 200 of the organic EL device 1, a sealing substrate with a color filter and a black matrix may be used. Here, a description will be given of a modified example in which the partition wall member 220 is replaced with a color filter, a black matrix, a sealing layer 222, and a low elastic layer 223.

<Schematic structure>
FIG. 5 is a cross-sectional view schematically showing a partial cross section of the organic EL device 1 according to Modification 1-1. Here, only differences from the organic EL device 1 shown in FIG. 2 will be described.
On one surface of the second substrate 210 of Modification 1-1, a partition wall member 220, a plurality of photo spacers 230, a black matrix (hereinafter referred to as “BM”) 241, and a color filter (hereinafter referred to as “ CF ”) 242 (R), (G), and (B) are formed.

In the modified example 1-1, the partition member 220 formed on the second substrate 210 includes a BM 241, a CF 242 (R), (G), (B), a sealing layer 222, and a low elastic layer 223 in this order. It becomes. That is, the modification 1-1 is different in that the portion corresponding to the base member 221a is formed by stacking BM241 and CF242 (R), (G), (B).
Each of the CFs 242 (R), (G), and (B) is arranged in accordance with the position of each light emitting layer 124 formed on the first substrate 110 side, and the BM 241 is formed on the first substrate 110 side. The organic EL elements are arranged in accordance with the positions of the banks 123 of the organic EL elements.

<Configuration of each part>
The BM 241 is a black layer provided for the purpose of preventing the reflection of external light and the incidence of external light on the display surface of the organic EL device and improving the display contrast. For example, it is comprised with the ultraviolet curable resin material containing the black pigment which is excellent in light absorptivity and light-shielding property.
Each of the CFs 242 (R), (G), and (B) is made of a known resin material that transmits visible light in each wavelength range corresponding to red, blue, and green.

<Manufacturing method>
Then, the manufacturing process of the sealing substrate 200 which concerns on the modified example 1-1 is illustrated. FIG. 6 is a diagram illustrating an example of a manufacturing process of the sealing substrate 200.
First, a BM paste is prepared by dispersing a BM material in which a UV curable resin (for example, an ultraviolet curable acrylic resin) material is a main component and a black pigment is added thereto in a solvent. This is applied to one surface of the substrate body.

When the applied BM paste is dried and the solvent can be volatilized to some extent to maintain the form, a pattern mask having an opening of a predetermined shape is overlaid so as to correspond to the position of the bank 123 of each organic EL element. Then, ultraviolet irradiation is performed on the superimposed pattern mask.
After that, the coated / solvent-removed BM paste is baked, the pattern mask and uncured BM paste are removed, developed, and cured, as shown in FIG. 6A, a BM 241 formed in a lattice shape is completed. To do.

Next, a material of CF242 (R in this case) mainly composed of an ultraviolet curable resin component is dispersed in a solvent on the surface of the substrate on which the BM241 is formed, and a paste (R) is applied. After removing the solvent to a certain extent, a predetermined pattern mask is placed and ultraviolet irradiation is performed.
Thereafter, curing is performed, and the pattern mask and the uncured paste (R) are removed and developed. As a result, CF242 (R) is formed as shown in FIG. The CF 242 (R) is formed not only in accordance with the position of the light emitting layer 124 but also in a region corresponding to the outer periphery of the element formation region.

  CF 242 (G) and 242 (B) are formed by repeating the CF forming step in the same manner for each color filter material. Thereby, not only CF242 (G) and 242 (B) are formed in accordance with the position of each light emitting layer 124, but also CF242 (G) and 242 (B) are formed in the region corresponding to the outer periphery of the element formation region. They are also formed (FIGS. 6C and 6D). As a result, a stack in which BM241, CF242 (R), CF242 (G), and 242 (B) are formed in this order in a region corresponding to the outer periphery of the element formation region is completed.

Next, as shown in FIG. 6E, the base member 221b is formed at each intersection position of the BM 241 formed in a lattice shape by the same method as described in FIG.
Next, as shown in FIG. 6F, a sealing layer 222 is formed in a region corresponding to the element formation region, and as shown in FIG. 6G, the sealing layer 222 is formed by, for example, plasma CVD. The low elastic layer 223 is formed. Thereby, the partition member 220 and the plurality of photo spacers 230 arranged discretely are completed. By passing through the above process, the sealing substrate 200 which concerns on the modified example 1-1 is completed.

According to this manufacturing method, the laminate of BM241 and CF242 (R), (G), (B) can be used as the base member of the partition wall member, so that the process for forming the base member is not increased separately. A base member can be formed.
Here, the formation process of the base member 221b of the photo spacer 230 is provided separately from the formation processes of BM241 and CF242 (R), (G), and (B), but BM241 and CF242 (R), ( In each of the forming steps G) and (B), the BM 241 and the CF 242 (R), (G), and (B) are used as the base member of the photo spacer 230 by forming these also at the intersections of the BM 241. May be used.

[Modification 1-2]
Next, a modified example in which the partition member 220 surrounds a part of the plurality of organic EL elements 120 formed in a matrix shape will be described.
FIG. 7 is a cross-sectional view schematically showing a cross section of the organic EL device 1 according to Modification 1-2. Here, only differences from the organic EL device 1 shown in FIG. 1 will be described.

As shown in FIG. 7, the partition member 220 is formed in a rectangular shape so as to surround a part of the plurality of organic EL elements 120.
Each organic EL element 120 positioned inside the partition wall member 220 is an effective organic EL element 120e, whereas each organic EL element 120 positioned outside the partition wall member 220 is a dummy organic EL element 120d. That is, the partition member 220 is formed so as to surround only the effective organic EL element 120e.

This reduces the possibility that the effective organic EL element 120e is first deteriorated by sacrificing the dummy organic EL element 120d when moisture or gas enters the organic EL device from the surrounding environment. it can.
Here, the partition member 220 is formed so as to surround the outer periphery of the region where the plurality of effective organic EL elements 120e are formed in a matrix, but the partition member 220 is formed so as to partially include the dummy organic EL elements. Of course.

[Modification 1-3]
Subsequently, a modification in which the partition wall member 220 is provided in a double manner will be described.
FIG. 8 is a cross-sectional view schematically showing a cross section of the organic EL device 1 according to Modification 1-3. Here, only differences from the organic EL device 1 shown in FIG. 1 will be described.
As shown in FIG. 8, the partition member 220 is formed so as to surround a part of the plurality of organic EL elements 120 in addition to the outer periphery of the element formation region. Thereby, sealing performance can be further improved.

  Moreover, the partition member 220 is not limited to a double, and may be formed in a triple or more. The partition member 220 may be formed in accordance with the region where the dummy organic EL element 120d is formed. For example, when 12 organic EL elements are dummy organic EL elements from the end of the element formation region to the center direction of the element formation region, the partition wall member 220 may be formed in 12 layers. Further, the partition member 220 may be formed in a region where the effective organic EL element is formed.

[Embodiment 2]
In the organic EL device 1 according to the first embodiment, the partition member 220 is provided for the purpose of preventing the intrusion of moisture and gas contained in the external atmosphere of the surrounding environment. May occur and diffuse to other organic EL elements 120. Therefore, the organic EL device 1 according to the second embodiment has a configuration for suppressing the diffusion of moisture generated from the inside of the organic EL element 120.

FIG. 9 is a cross-sectional view schematically showing a cross section of the organic EL device 1 according to the second embodiment. Here, only differences from the organic EL device 1 shown in FIG. 1 will be described.
As shown in FIG. 9, in addition to the outer periphery of the element formation region, the partition member 220 is also formed in a region corresponding to the bank of each organic EL element so as to be partitioned for each organic EL element 120.
Accordingly, moisture generated from the inside of the organic EL element 120 can be prevented from diffusing into other organic EL elements 120, so that deterioration of the element due to moisture generated from the inside of the organic EL element 120 is minimized. Can be stopped.

[Modification 2-1]
Subsequently, a modified example in which the partition member 220 is provided so as to be partitioned for each of the plurality of organic EL elements will be described.
FIG. 10 is a cross-sectional view schematically showing a cross section of the organic EL device 1 according to Modification 2-1. Here, only differences from the organic EL device 1 shown in FIG. 1 will be described.

As shown in FIG. 10, in addition to the outer periphery of the element formation region, the partition member 220 is also formed in a region corresponding to the bank of each organic EL element so as to partition 12 organic EL elements as a unit. Yes.
In addition, although the partition member 220 is provided so as to partition 12 organic EL elements as one unit, for example, the partition member 220 may be provided so as to partition for each pixel (three organic EL elements). The unit to be divided may be determined according to how much the defective organic EL element can be tolerated.

  By the way, in general, a user who uses an organic EL device pays particular attention to the center portion of the display area of the organic EL device and pays little attention to the end of the display area. Accordingly, the deterioration of the organic EL element becomes a serious problem as the area is closer to the center of the display area. Conversely, even if the organic EL element located at the end of the display area deteriorates, the use of the user is greatly affected. is not.

Therefore, the partition unit for partitioning the organic EL element by the partition member 220 is not necessarily uniform over the entire display region, and the partition unit is determined so that the center portion of the display region is smaller than the end portion of the display region. Alternatively, it may be determined to be smaller as it is closer to the center of the display area.
[Modification 2-2]
Next, a description will be given of a modification in which the partition member 220 is provided so as to partition for each organic EL element in the dummy region where the dummy organic EL element is formed.

FIG. 11 is a cross-sectional view schematically showing a cross section of the organic EL device 1 according to Modification 2-2. Here, only differences from the organic EL device 1 shown in FIG. 1 will be described.
As shown in FIG. 11, the partition member 220 surrounds the effective organic EL element 120e and is formed so as to be divided for each dummy organic EL element in the dummy region where the dummy organic EL element is formed. As shown in FIG. 11, it is preferable that the dummy organic EL elements partitioned by the partition member 220 surround the effective organic EL elements in multiple stages.

Accordingly, moisture and gas that have entered from the surrounding environment can be attenuated step by step in a dummy region that is not related to light emission.
[Embodiment 3]
In each of the above embodiments, the organic EL device 1 has the partition member 220. However, other configurations may be used. FIG. 12 is a partial cross-sectional view showing the configuration of the organic EL device 1 according to the third embodiment. Here, only differences from the organic EL device 1 according to Embodiment 1 shown in FIG. 2 will be described. In the organic EL device shown in FIG. 12, a low elastic layer 223 is formed on the second substrate 210 on the surface facing the first substrate.

Therefore, the sealing film 130 and the second substrate 210 are in contact with each other through the low elastic layer 223 in the outer periphery of the element formation region. For this reason, when the sealing film 130 and the 2nd board | substrate 210 contact, the low elastic layer 223 deform | transforms and it can contact | connect in the form which contact | adhered more closely.
As a result, even if moisture or gas enters through the sealing material 300 from the outside of the organic EL device 1 and enters the inside of the organic EL device 1, these are blocked by the sealing film 130 and the second substrate 210. . Therefore, the deterioration of the organic EL element 120 due to moisture or gas entering from the outside can be delayed, and the life of the organic EL element 120 can be expected to be extended.

In addition, since it is only necessary to form the low elastic layer 223 in a region corresponding to the outer periphery of the element formation region in the second substrate 210, it is not necessary to enlarge the peripheral region.
[Deformability 3-1]
Further, as shown in FIG. 13, the low elastic layer 223 may be formed over the entire region corresponding to the element formation region in the second substrate 210. FIG. 13 is a partial cross-sectional view showing the configuration of the organic EL device 1 of Modification 3-1. With this configuration, each organic EL element 120 can be sealed by the second substrate 210 and the sealing film 130, so that moisture generated from the inside of the organic EL element 120 diffuses to the other organic EL elements 120. Can be prevented.
(Supplement)
As described above, the organic EL device 1 according to the present invention has been described based on the embodiment, but the present invention is not limited to the above embodiment.
(1) In each of the above-described embodiments, the base member 221a in the partition wall member 220 is the same material as the base member 221b in the photo spacer 230, or a laminate of BM and CF, but is formed from other materials. Alternatively, a separate process may be provided for forming the base member 221a.
(2) In each of the above embodiments, the space between the sealing film 130 and the second substrate 210 is a space filled with an inert gas, but the sealing film 130 and the second substrate 210 Between them, the resin sealing layer may be densely filled. This resin sealing layer is disposed for the purpose of preventing moisture and gas from entering from the outside, and is made of various transparent resin materials (epoxy resin, silicone resin, etc.).
(3) In the organic EL device 1 of each of the above embodiments, the photo spacer 230 is provided. However, this is not always necessary, and the facing distance between the first substrate 110 and the second substrate 210 can be sufficiently adjusted. If so, it may not be formed.
(4) In each of the above embodiments, MoOx, WOx or MoxWyOz is used as the material constituting the hole injection layer 122, but even when a metal other than Mo (molybdenum) or W (tungsten) is used. By applying this embodiment, the same effect can be obtained.
(5) In each of the above embodiments, only the electron injection layer 125 is interposed between the light emitting layer 124 and the transparent cathode 126. In addition to this, the electron transport layer may be interposed. Good.
(6) In each of the above embodiments, a so-called pixel bank is adopted as the planar shape of the bank. However, as long as the bank is formed in the outer peripheral portion of the element formation region, the inside is formed in a lattice shape. For example, it may be formed in a stripe shape.
(7) Although the external appearance of the display device 1000 is not shown in each of the above embodiments, for example, the external appearance can be as shown in FIG.
(8) The above embodiments and the above modifications may be combined.

  The present invention can be used, for example, for home or public facilities, various display devices for business use, television devices, portable electronic device displays, and the like.

100 element formation substrate 110 first substrate 111 TFT substrate 112 planarization layer 120 organic EL element 121 reflective anode 122 hole injection layer 123 bank 124 light emitting layer 125 electron injection layer 126 transparent cathode 130 sealing film 200 sealing substrate 210 second Substrate 220 Partition member 221a, 221b Base member 222 Sealing layer 223 Low elastic layer 230 Photo spacer 300 Sealing material 241 Black matrix 242 Color filter

Claims (16)

A first substrate;
A plurality of organic EL elements provided on the first substrate;
A sealing film covering the plurality of organic EL elements;
A second substrate disposed opposite to the first substrate via the plurality of organic EL elements;
In a region where the plurality of organic EL elements are not provided on the first substrate, a seal provided so as to surround the plurality of organic EL elements in a gap between the first substrate and the second substrate. Material,
An effective organic EL having a light emitting function among the plurality of organic EL elements in a gap between the sealing film and the second substrate in a region where the plurality of organic EL elements are provided on the first substrate. An organic EL device comprising: a partition member provided so as to surround at least the element. Each organic EL element located outside the partition member is a dummy organic EL element,
The organic EL device according to claim 1, wherein the dummy organic EL element is an organic EL element having no light emitting function. The organic EL device according to claim 2, wherein the dummy organic EL element has the same configuration as the effective organic EL element. The organic EL device according to claim 2, wherein the partition member is further formed so as to be divided for each dummy organic EL element in a dummy region where the dummy organic EL element is formed. The organic EL device according to claim 1, wherein the partition member is further formed so as to partition the plurality of organic EL elements every predetermined number. The organic EL device according to claim 5, wherein the predetermined number is one. The organic EL device according to claim 1, wherein the partition member includes a base member and a covering member that covers the base member, and the covering member is made of a material having a sealing property. The organic EL device according to claim 1, wherein an elastic modulus of a portion of the partition wall member in contact with the sealing film is smaller than an elastic modulus of the sealing film. The partition member has a laminated structure,
The layer in contact with the sealing film is made of an organic material, and the film thickness is 20 nm or more and 100 nm or less,
The organic EL device according to claim 1, wherein another layer of the partition member is made of a material having a higher sealing property than an organic material, and a film thickness thereof is larger than a film thickness of a layer in contact with the sealing film. The closed space formed by the first substrate, the second substrate, and the sealing material, and the closed space formed by the first substrate, the second substrate, and the partition member are at atmospheric pressure. The organic EL device according to claim 1, which is also low pressure. The closed space formed by the first substrate, the second substrate, and the sealing material, and the closed space formed by the first substrate, the second substrate, and the partition member are not allowed. The organic EL device according to claim 10, which is filled with an active gas. The organic EL device according to claim 1, wherein the sealing film is made of at least one of SiO, SiON, SiN, SiC, SiOC, AlN, and Al 2 O 3. The partition member includes a sealing member and a covering member that covers the sealing member and contacts the sealing film,
The sealing member is made of at least one of SiO, SiON, SiN, SiC, SiOC, AlN, Al2O3,
The organic EL device according to claim 1, wherein the covering member is made of an organic material. The organic EL device according to claim 1, wherein a material of a portion of the partition member that contacts the sealing film is a polyparaxylylene resin. A first step of forming a plurality of organic EL elements on a first substrate;
A second step of forming a sealing film covering the plurality of organic EL elements;
When the second substrate is disposed opposite to the first substrate via the plurality of organic EL elements, the plurality of organic EL elements on the first substrate is on the second substrate. A third step of forming a partition member in a region corresponding to the region provided with,
A fourth step of disposing the second substrate on which the partition wall member is formed facing the first substrate via the plurality of organic EL elements; and the plurality of organic EL elements on the first substrate. A fifth step of bonding a gap between the first substrate and the second substrate with a sealing material in a region that is not
A method of manufacturing an organic EL device, wherein the partition member is disposed in a gap between the sealing film and the second substrate, and at least surrounds an effective organic EL element having a light emitting function among the plurality of organic EL elements. A first substrate;
A plurality of organic EL elements provided on the first substrate;
A sealing film covering the plurality of organic EL elements;
A second substrate disposed opposite to the first substrate via the plurality of organic EL elements;
In a region where the plurality of organic EL elements are not provided on the first substrate, a seal provided so as to surround the plurality of organic EL elements in a gap between the first substrate and the second substrate. Material,
A coating film that covers a facing surface of the second substrate facing the first substrate;
The coating film has an elastic modulus lower than that of the sealing film,
An organic EL device in which the sealing film is in contact with the second substrate through the coating film.

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