JP2011146498A - Laser light source device, projector and monitor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser light source device that is high in output without causing a rise in cost. <P>SOLUTION: The laser light source device 100 includes: a substrate 110 having a recessed portion; a pair of light emission portions disposed on a substrate surface 110a of the substrate 110; a fitting member joined in the recessed portion; a first reflection portion 140 reflecting light emitted from one light emission portion 120 of the pair of light emission portions; and a second reflection portion 150 reflecting the light reflected by the first reflection portion 140 toward the other light emission portion 130 of the pair of light emission portions. The first reflection portion 140 has: a support member 141 having a through hole penetrating the fitting member with a gap left; and a light reflection member 142 abutting on the support member 141 and supported. A resonator includes the pair of light emission portions, the first reflection portion 140, and the second reflection portion 150. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a laser light source device, a projector, and a monitor device.

  Conventionally, in the field of optical devices such as projectors, high-pressure mercury lamps are frequently used as illumination light sources. The high-pressure mercury lamp has the advantage that high-power light can be obtained, but there are also problems such as limited color reproducibility, difficulty in instantaneous lighting and extinguishing, and short life. Under such circumstances, a laser light source device using a solid light source such as a semiconductor laser instead of a high-pressure mercury lamp is expected.

  As said semiconductor laser, what is disclosed by patent document 1 is mentioned, for example. The semiconductor laser disclosed in Patent Document 1 includes a light emitting unit and an external resonator. The light emitting unit includes a 100% reflective abutting Bragg mirror, a partially reflective intermediate Bragg mirror, and an active layer provided between the Bragg mirrors. The light emitted from the active layer resonates to the extent that laser oscillation does not occur in the light emitting portion. The light passing through the intermediate Bragg mirror is resonated by an external resonator to generate laser oscillation.

Special Table 2003-526930

  According to the semiconductor laser of Patent Document 1, the resonator length can be made longer than that of laser oscillation by an internal resonator, and high-power laser light can be obtained. However, in order to construct a high-power laser light source device using a semiconductor laser as in Patent Document 1, there is a point to be improved.

  In order to make the resonator length longer than the internal resonator as in Patent Document 1, it is necessary to dispose an external mirror (output coupler) that reflects and folds the light emitted from the light emitting unit away from the light emitting unit. . Since the external mirror is independent of the light emitting unit, it is necessary to align the external mirror with respect to the light emitting unit with high accuracy. If the positional accuracy is insufficient, the optical axis is shifted between the light traveling from the light emitting unit to the external mirror and the light traveling from the external mirror to the light emitting unit. Then, the laser oscillation becomes insufficient and the loss of light becomes large, so that high output light cannot be obtained.

  By the way, since there is a limit to the intensity of light emitted from one light emitting unit, a technique for increasing the output of a laser light source device using a plurality of light emitting units has been studied. However, according to this method, the above-described disadvantage becomes remarkable for the following reasons.

  As a laser light source device having a plurality of light emitting portions, for example, a device in which a pair of light emitting portions are arranged in a resonator can be considered. High output light can be obtained by resonating light emitted from each light emitting section. When one light emitting unit is used, an external mirror may be arranged so that the light from the light emitting unit is folded back 180 °, and it is not important at which position of the external mirror the light enters. However, in the case of using a pair of light emitting units, a high degree of positional accuracy is required for the external mirrors in order for light from each light emitting unit to enter the same position in the external mirrors.

  A laser light source device in which a plurality of pairs of light emitting units are arranged in an array is also conceivable. In this case, if an external mirror is disposed for each pair of light emitting units, it is necessary to perform alignment for each pair of light emitting units, which increases the labor and cost of alignment. On the other hand, when an external mirror is arranged in common for a plurality of pairs of light emitting units, the position of the external mirror is also regulated by the arrangement direction of the light emitting units, and a higher degree of positional accuracy is required for the external mirror.

  As described above, it is extremely important to arrange the external mirror with a high degree of positional accuracy in configuring a high-power laser light source device. However, since a method for easily arranging the external mirror with high positional accuracy is not known, it is difficult to further increase the output of the laser light source device.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a laser light source device that can cope with an increase in output without causing an increase in cost. Another object is to provide a projector including a high-power laser light source device. Another object is to provide a monitor device including a high-power laser light source device.

  The laser light source device of the present invention includes a substrate provided with a recess, a pair of light emitting portions disposed on the substrate surface of the substrate, a fitting member joined to the recess, and one of the pair of light emitting portions. A first reflecting unit that reflects light emitted from the light emitting unit, and a second reflecting unit that reflects the light reflected by the first reflecting unit toward the other light emitting unit of the pair of light emitting units, The first reflecting portion includes a support member provided with a through hole through which the fitting member is inserted with a gap, and a light reflecting member supported in contact with the support member, and the pair of light emitting portions And a resonator including the first reflection part and the second reflection part.

  If it does in this way, the light inject | emitted from one light emission part will inject into the other light emission part through a 1st reflection part and a 2nd reflection part. The light emitted from the other light emitting part enters the one light emitting part through the second reflecting part and the first reflecting part. In this way, the light emitted from each of the pair of light emitting units reciprocates between the pair of light emitting units and resonates with each other, thereby causing laser oscillation. As a result, the laser light source device can obtain a laser beam with much higher output than when laser oscillation is generated in the light emitted from one light emitting unit.

  Further, by inserting the fitting member into the through hole and disposing the fitting member in the recess, the rough position of the support member with respect to the substrate can be defined very easily. Further, since there is a gap between the inner wall of the through hole and the fitting member, the position of the support member relative to the substrate can be finely adjusted by the gap. Thus, the position of the support member relative to the substrate can be easily adjusted with high accuracy. Further, the light reflecting member is provided in contact with the support member, and the position of the light reflecting member with respect to the support member is defined with high accuracy. Therefore, the position of the light reflecting member relative to the substrate can be made highly accurate, and the position of the light reflecting member relative to the light emitting portion can be made highly accurate. Therefore, the optical axis of the forward path and the optical axis of the return path can be matched between the pair of light emitting units, and laser oscillation can be generated satisfactorily.

The support member may be arranged at a position away from the substrate surface and joined to the fitting member.
If the support member is disposed at a position away from the substrate surface, the support member can be moved in three directions, ie, two directions along the substrate surface and one direction orthogonal to the substrate surface. The support member can also be rotated around. Since the position of the support member relative to the substrate can be adjusted in all directions in this way, the position of the support member relative to the substrate can be made highly accurate. Further, since the support member is joined to the fitting member, the support member arranged at a highly accurate position can be fixed to the substrate.

The support member may be disposed along the substrate surface and joined to the fitting member.
In this way, since the support member is arranged along the substrate surface, the movement of the support member is restricted in one direction orthogonal to the substrate surface, and the position of the support member relative to the substrate in this one direction is highly accurate. It is prescribed. Further, the rotation of the support member around the axis in two directions along the substrate surface is restricted, and the angle of the support member with respect to the substrate is defined with high accuracy in this rotation direction. On the other hand, the position of the support substrate relative to the substrate can be adjusted in two directions along the substrate surface by moving the support member along the substrate surface. In addition, by rotating the support member around an axis in one direction orthogonal to the substrate surface, the angle of the support substrate with respect to the substrate in this one direction can be adjusted.

  As described above, since the position of the support member with respect to the substrate is regulated or adjustable with high accuracy in all directions, the position of the support member with respect to the substrate can be made highly accurate. Further, since the support member is joined to the fitting member, the support member arranged at a highly accurate position can be fixed to the substrate.

In addition, it is preferable that the fitting member is bonded to the inner wall of the through hole with an adhesive to form a bonding portion between the substrate and the first reflecting portion, and a plurality of the bonding portions are provided. .
If it does in this way, the change of the position of the support member with respect to the board | substrate resulting from an adhesive agent shrink | contracting at the time of hardening in one junction part will be controlled by another junction part. Accordingly, the positional deviation between the support member and the substrate due to the shrinkage of the adhesive is remarkably reduced, and the light reflecting member can be arranged with a high degree of positional accuracy. In addition, if a plurality of joints are provided, the joint strength between the substrate and the support member becomes stronger than when one joint is provided.

Moreover, it is preferable that the said adhesive agent is a photocurable adhesive agent.
Since the photo-curable adhesive can be cured in a shorter time than the thermosetting adhesive, the support member is prevented from being displaced with respect to the substrate during the period until the adhesive is cured. The In addition, since the photo-curable adhesive can be cured at a lower temperature than the thermosetting adhesive, misalignment is caused by different deformation amounts due to thermal expansion between the substrate and the support member when the adhesive is cured. It is prevented from occurring.

In addition, the fitting member has an outer dimension of a cross section perpendicular to the major axis direction that is reduced from one end portion to the other end portion in the major axis direction, It is preferable that the edge part is joined in the said recessed part.
In this way, the gap between the opening of the through hole and the fitting member is wider on the side opposite to the substrate than on the substrate side. Therefore, it becomes easy to fill the inside of the through hole with the adhesive from the side opposite to the substrate of the through hole, and leakage of the filled adhesive from the opening of the through hole on the substrate side is reduced.

Moreover, it is preferable that the said fitting member is joined in this recessed part by fitting with the said recessed part.
This eliminates the need for an adhesive to join the fitting member into the recess, and prevents the refractive index from changing unexpectedly in the optical path due to the volatile component of the adhesive.

Moreover, it is preferable that the said 2nd reflection part also has the said support member and the said light reflection member.
If it does in this way, in any of the 1st reflective part and the 2nd reflective part, it will become possible to adjust the position to a substrate of a light reflection member. Therefore, the light axis of the light reflected by either the first reflecting part or the second reflecting part can be changed in a desired direction. Therefore, the optical axis of light traveling from one light emitting unit to the other light emitting unit and the optical axis of light traveling from the other light emitting unit to the one light emitting unit can be matched with high accuracy.

  A plurality of sets of the pair of light emitting units, wherein a first light emitting element having a plurality of light emitting units and a second light emitting element having a plurality of light emitting units are joined to the substrate; Each of the plurality of light emitting units in the second light emitting element constitutes the pair of light emitting units with each of the plurality of light emitting units in the second light emitting element, and the plurality of pairs of light emitting units share the first light emitting unit. It is preferable that a reflection part and the second reflection part are provided.

  In this way, since a plurality of pairs of light emitting units are provided, the laser light source device has a higher output than that provided with a pair of light emitting units. On the other hand, since the position of the first reflection part and the position of the second reflection part are regulated in the arrangement direction of the light emitting parts, highly accurate alignment is necessary. According to the present invention, the position of the light reflecting member is defined or adjustable with respect to the three independent translational directions and the rotational directions around the respective axes in these three directions. The first reflection part and the second reflection part can be arranged in correspondence with the arrangement direction of the parts. Further, since the first reflecting portion and the second reflecting portion are provided in common for the plurality of pairs of light emitting portions, the component is more than the case where the plurality of first reflecting portions and the plurality of second reflecting portions are arranged. The number is reduced and the labor of alignment can be saved.

Moreover, it is preferable that a wavelength conversion element for converting incident fundamental wavelength light into converted wavelength light is disposed in an optical path between the first reflection unit and the second reflection unit.
If it does in this way, it will become possible to take out the laser beam of the wavelength which cannot be obtained directly from a light emission part, and it will become a laser light source device which can obtain a laser beam of high output and desired wavelength.

The projector according to the present invention includes the laser light source device according to the present invention, an image forming device that forms image light indicating an image by laser light emitted from the laser light source device, and image light formed by the image forming device. And a projection device for projecting.
According to the laser light source device of the present invention, high output laser light can be obtained, and thus the high output laser light is projected by the projection device after becoming image light indicating an image by the image forming apparatus. Therefore, it is possible to obtain a high-luminance projection image and to obtain a high-quality projection image with a wide dynamic range.

A monitor device according to the present invention includes the laser light source device according to the present invention and an imaging device that captures an image of a subject illuminated by the laser light source device.
According to the laser light source device of the present invention, high output laser light can be obtained, so that the subject can be illuminated with high output laser light. Therefore, the amount of light reflected by the subject is ensured, and a good monitor device can be obtained in which a clear captured image can be obtained by capturing this.

It is a perspective view which shows the structure of the laser light source apparatus of 1st Embodiment. It is a top view which shows the structure of the laser light source apparatus of 1st Embodiment. FIG. 3 is a cross-sectional view taken along line A-A ′ in FIG. 2. FIG. 3 is a cross-sectional view taken along line B-B ′ in FIG. 2. FIG. 3 is a cross-sectional view taken along line B-B ′ in FIG. 2. (A)-(c) is sectional process drawing which shows the manufacturing method of a laser light source device. (A), (b) is sectional process drawing which continues from FIG.6 (c). It is sectional drawing which shows schematic structure of the laser light source apparatus of 2nd Embodiment. (A), (b) is process drawing which shows schematically the manufacturing method of a laser light source device. (A)-(c) is process drawing which shows the manufacturing method of a modification schematically. It is a schematic block diagram which shows a projector. It is a schematic block diagram which shows a scanning projector. It is a schematic block diagram which shows a monitor apparatus.

  Hereinafter, although embodiment of this invention is described, the technical scope of this invention is not limited to the following embodiment. In the following description, various structures are illustrated using drawings, but in order to show the characteristic parts of the structures in an easy-to-understand manner, the structures in the drawings are shown in different sizes and scales from the actual structures. There is.

[First Embodiment]
FIG. 1 is a perspective view showing a first embodiment of a laser light source device of the present invention. As shown in FIG. 1, the laser light source apparatus 100 of the first embodiment uses a base substrate (substrate) 110 as a base. The first light emitting element 120, the second light emitting element 130, the first reflecting part 140, and the second reflecting part 150 are bonded to the substrate surface 110 a of the base substrate 110. As will be described in detail later, each of the first light emitting element 120 and the second light emitting element 130 is formed with a plurality of light emitting portions. One light emitting unit formed in the first light emitting element 120 constitutes one light emitting unit formed in the second light emitting element 130 and a pair of light emitting units. That is, the laser light source device 100 includes a plurality of pairs of light emitting units.

  In addition, a wavelength conversion element 160 and a band pass filter 170 are disposed on the optical path between the first reflection unit 140 and the second reflection unit 150. The wavelength conversion element 160 and the band pass filter 170 are fixed on a base 165 bonded to the substrate surface 110 a of the base substrate 110.

  Although not shown in FIG. 1, a triangular prism that adjusts the optical axis of the laser light extracted outside is disposed on the opposite side of the first reflector 140 from the second reflector 150 (see FIG. 5). ). In addition, a beam polarizer that functions as polarization separation means is disposed between the first reflection unit 140 and the first light emitting element 120.

Hereinafter, the XYZ orthogonal coordinate system shown in FIG. 1 is set, and the positional relationship of the members will be described based on this. In this XYZ orthogonal coordinate system, the direction parallel to the substrate surface 110a and in which the first light emitting element 120 and the second light emitting element 130 are arranged is the X direction, and the rotation direction around the _X direction is the θ _X direction. A direction parallel to the substrate surface 110a and perpendicular to the X direction is a Y direction, and a rotation direction around the _Y direction is a θ _Y direction. The normal direction of the substrate surface 110a is the Z direction, and the rotation direction around the _Z direction is the θ _Z direction.

FIG. 2 is a plan view showing a schematic configuration of the laser light source device 100.
As shown in FIG. 2, the first light emitting element 120 includes a substrate 121 and a plurality of light emitting units 122 formed on the substrate 121. The planar shape of the substrate 121 is a substantially rectangular shape having a long side along the direction (Y direction) orthogonal to the direction (X direction) in which the first light emitting element 120 and the second light emitting element 130 are arranged. The plurality of light emitting units 122 are arranged along the long side (Y direction) of the substrate 121.

  The second light emitting element 130 has the same configuration as the first light emitting element 120, and includes a substrate 131 and a plurality of light emitting units 132. The plurality of light emitting units 132 are arranged along the long side (Y direction) of the substrate 131. The light emitting unit 122 constitutes a pair of light emitting units with the light emitting unit 132 positioned in the orthogonal direction (X direction) of the arrangement direction (Y direction) of the light emitting units 122.

  The first reflection unit 140 includes a support member 141 and a plate-like light reflection member 142. The light reflecting member 142 is supported by the support member 141, and the light emitted from the light emitting unit 122 is incident on the light reflecting member 142. The second reflection unit 150 has the same configuration as the first reflection unit 140 and includes a support member 151 and a light reflection member 152.

  The support member 141 of the first reflection unit 140 is a member that is long in the long side direction (Y direction) of the first light emitting element 120. The support member 141 has two ends that sandwich the first light emitting element 120 in the long side direction (Y direction). The two end portions are integrated with an extending portion extending along the long side direction (Y direction) outside the first light emitting element 120. The support member 141 of the present embodiment is bonded to the base substrate 110 and the bonding portion 143 at each of the two end portions.

  Each of the two end portions of the support member 141 is provided with a holding portion 141 a that holds the light reflecting member 142. The holding portion 141a of this embodiment is formed integrally with the support member 141. Hereinafter, the structure of the joint part 143 and the structure of the holding part 141a will be described in detail.

3 is a cross-sectional view taken along line AA ′ in FIG.
As shown in FIG. 3, the holding part 141a has a V-shaped groove. One surface of the V-shaped groove is at a predetermined angle with respect to the substrate surface 110a and serves as a support surface 141b. The support surface 141b of this embodiment forms an angle of approximately 45 ° with respect to the substrate surface 110a. When one surface of the plate-like light reflecting member 142 is brought into contact with the support surface 141b, the angle of the light reflecting member 142 with respect to the substrate surface 110a becomes approximately 45 °. The light reflecting member 142 is joined to the support member 141 in a state of being in contact with the support surface 141b.

  The material of the support member 141 may be selected so that the linear expansion coefficient is approximately the same as that of the light reflecting member 142. When the linear expansion coefficient of the support member 141 is different from that of the light reflecting member 142, the light reflecting member 142 may be mechanically joined to the support member 141 with a spring or the like, or may be joined with an elastic adhesive or the like. This is due to the following reason.

  When the light emitted from the light emitting unit 122 enters the light reflecting member 142, the light reflecting member 142 is heated by light absorption, and this heat is also transmitted to the support member 141. If the linear expansion coefficient of the support member 141 is different from that of the light reflecting member 142, the amount of deformation due to thermal expansion differs between the support member 141 and the light reflecting member 142. Then, the light reflecting member 142 is distorted, and the light incident on the light reflecting member 142 is reflected in a direction other than desired. As described above, by selecting the material of the support member 141, or by devising a joining method between the support member 141 and the light reflecting member 142, the distortion of the light reflecting member 142 can be released, and the light utilization efficiency is improved. Can be prevented.

  In the joint portion 143, the support member 141 is provided with a through hole 141c, and the base substrate 110 is provided with a recess 110b. A pin (fitting member) 143a is press-fitted into the recess 110b through the through hole 141c, and the pin 143a is fitted (joined) into the recess 110b. The periphery of the pin 143a inside the through hole 141c is filled with an adhesive portion 143b made of a cured adhesive. The adhesive portion 143b of the present embodiment is formed by irradiating an ultraviolet curable (photo-curable) adhesive with ultraviolet rays. The support member 141 is bonded to the base substrate 110 by the pins 143a and the bonding portions 143b.

  As a cross-sectional shape of the through-hole 141c, the concave portion 110b, and the pin 143a, a circular shape, a rectangular shape, a shape with rounded corners, or the like can be appropriately selected. Here, the cross-sectional shapes of the through hole 141c, the recess 110b, and the pin 143a are all substantially circular. The inner dimension (inner diameter) of the through-hole 141c is larger than the outer dimension (outer diameter) of the pin 143a by a predetermined dimension. It is possible to adjust the position of the support member 141 with respect to the base substrate 110 within the predetermined dimension or less in the uncured state of the bonding portion 143b. That is, the predetermined dimension is set according to the adjustment width of the position of the support member 141 with respect to the base substrate 110. The pin 143a of the present embodiment has a truncated cone shape whose outer diameter decreases from the concave portion 110b side toward the through hole 141c side.

  The fitting member may have a substantially constant outer diameter in the major axis direction, for example, a cylindrical shape or a prismatic shape. Further, an adhesive may be filled around the pin in the recess, and the pin may be joined in the recess by the adhesive.

  4 and 5 are both cross-sectional views taken along line B-B 'of FIG. 4 shows the optical axis of the light emitted from the first light emitting element 120 by a two-dot chain line, and FIG. 5 shows the optical axis of the light emitted from the second light emitting element 130 by a two-dot chain line. Show.

  As shown in FIG. 4, the first light emitting element 120 and the second light emitting element 130 are provided in contact with the substrate surface 110 a of the base substrate 110. A beam polarizer 190 is disposed on the side of the first light emitting element 120 opposite to the base substrate 110 (Z direction side). A light reflecting member 142 is disposed on the side opposite to the base substrate 110 (Z direction side) of the beam polarizer 190. A light reflecting member 152 is disposed on the opposite side (Z direction side) of the second light emitting element 130 to the base substrate 110. A wavelength conversion element 160 and a band pass filter 170 are disposed between the light reflecting members 142 and 152. The wavelength conversion element 160 and the band pass filter 170 are bonded on a base 165 bonded to the substrate surface 110a. On the opposite side (X direction side) of the light reflecting member 142 to the wavelength conversion element 160, a triangular prism 180 for adjusting the emission direction of the laser light extracted outside is disposed.

  The light emitting unit 122 of the first light emitting element 120 includes a first electrode 122a formed on the substrate 121 and an active layer 122b formed on the first electrode 122a. An insulating film 122c is provided to cover the first electrode 122a and the active layer 122b. The insulating film 122c is provided with an opening for exposing a part of the active layer 122b, and a second electrode 122d that is in conductive contact with the active layer 122b is provided in the opening. The second electrode 122d is provided with an opening exposing a part of the active layer 122b, and a DBR layer 122e is provided in the opening. The first electrode 122a is configured to reflect incident light and fold back. Further, the DBR layer 122e transmits the light having the fundamental wavelength of the incident light, and reflects the light having the wavelength other than the fundamental wavelength to be folded.

  In the light emitting unit 122 as described above, when a voltage is applied between the first electrode 122a and the second electrode 122d, light is generated in the active layer 122b. This light reciprocates between the first electrode 122a and the DBR layer 122e and resonates. Of the light resonated in the light emitting unit 122, light having a fundamental wavelength is emitted from the light emitting unit 122 in the normal direction of the substrate surface 110a through the DBR layer 122e. Here, infrared light IR11 having a wavelength of about 1065 nm is emitted as the fundamental wavelength light. The light emitting unit 132 of the second light emitting element 130 has the same configuration as the light emitting unit 122, and includes a first electrode 132a, an active layer 132b, an insulating film 132c, a second electrode 132d, and a DBR layer 132e.

  In addition, as a light emission part, you may employ | adopt what generate | occur | produces a laser oscillation only by internal resonance. Moreover, you may employ | adopt what reflects the light emitted from the active layer with reflective layers other than a 1st electrode. For example, a DBR layer may be disposed between the first electrode and the active layer, and light emitted from the active layer may be reflected by this DBR layer.

The infrared light IR11 emitted from the light emitting unit 122 enters the beam polarizer 190 that is a polarization separation element. Of the incident light, S-polarized light with respect to the beam polarizer 190 is reflected by the beam polarizer 190. The beam polarizer 190 is disposed such that the surface on which the infrared light IR11 is incident is inclined with respect to the substrate surface 110a. The light reflected by the beam polarizer 190 travels in a different direction from the light emitting unit 122 and is removed from between the beam polarizer 190 and the light emitting unit 122. Of the incident light to the beam polarizer 190, the P-polarized infrared light IR 12 for the beam polarizer 190 passes through the beam polarizer 190 and enters the light reflecting member 142.
In the following description, the S polarization for the beam polarizer 190 may be simply referred to as S polarization, and the P polarization for the beam polarizer 190 may be simply referred to as P polarization.

  In the light reflecting member 142 of the present embodiment, the surface 142a on which the infrared light IR12 is incident has wavelength selectivity. Here, the surface 142a is formed of a dielectric multilayer film, the infrared light IR12 is reflected by the surface 142a, and the visible light is transmitted through the surface 142a. As described above, the light reflecting member 142 is held by the support member 141 so that the surface 142a forms an angle of approximately 45 ° with the substrate surface 110a. The infrared light IR12 emitted from the beam polarizer 190 is reflected by the surface 142a, the optical axis is bent by approximately 90 °, and is incident on the wavelength conversion element 160.

  The wavelength conversion element 160 and the band pass filter 170 are arranged on a base 165 joined to the substrate surface 110a. The wavelength conversion element 160 converts at least a part of the incident light into light having a substantially half wavelength to generate a second harmonic. The wavelength conversion element 160 is made of, for example, a nonlinear optical crystal such as PPLN (periodically poled lithium niobate). The wavelength conversion element 160 is arranged so that the polarization inversion axis direction is parallel to the vibration direction of the infrared light IR12 reflected by the light reflecting member 142. As a result, the polarization dependence of the wavelength conversion element matches the polarization state of the incident light, and second harmonics are efficiently generated.

  At least a part of light having a fundamental wavelength (for example, infrared light IR12 having a wavelength of 1065 nm) incident on the wavelength conversion element 160 is converted into light having a converted wavelength (for example, green light G13 having a wavelength of 532.5 nm). The The green light G13 and the infrared light IR13 that has not been wavelength-converted are emitted from the wavelength conversion element 160 and enter the band-pass filter 170.

  The band pass filter 170 transmits light in a predetermined wavelength band of incident light. Here, the wavelength band centered on the wavelength of the infrared light IR13 and the wavelength band centered on the wavelength of the green light G13 are set as predetermined wavelength bands. The width of the wavelength band can be appropriately selected according to the degree of narrowing the band. The infrared light IR13 and the green light G13 emitted from the bandpass filter 170 are incident on the light reflecting member 152 of the second reflecting unit 150.

  The light reflecting member 152 of this embodiment is the same as the light reflecting member 142 of the first reflecting unit 140. The surface 152a on which the infrared light IR13 and the green light G13 are incident is composed of a dielectric multilayer film. The light reflecting member 152 is held by the support member 151 so that the surface 152a forms an angle of approximately 45 ° with the substrate surface 110a. The green light G13 that is visible light is extracted to the outside through the surface 152a. The infrared light IR13 is reflected by the surface 152a, the optical axis is bent by approximately 90 °, and is incident on the light emitting unit 132 of the second light emitting element 130. The infrared light IR13 incident on the light emitting unit 132 is reflected by the first electrode 132a of the light emitting unit 132 and is emitted together with the infrared light generated by the light emitting unit 132.

  As shown in FIG. 5, the infrared light IR <b> 21 emitted from the light emitting unit 132 of the second light emitting element 130 is reflected by the surface 152 a of the light reflecting member 152. The infrared light IR21 reflected by the surface 152a is incident on the wavelength conversion element 160 through the band pass filter 170. At least a part of the infrared light IR21 incident on the wavelength conversion element 160 is converted into green light G22. The green light G22 and the infrared light IR22 that has not been wavelength-converted are emitted from the wavelength conversion element 160 and are incident on the light reflecting member 142. The green light G22 that has entered the light reflecting member 142 enters the triangular prism 180 through the surface 142a.

  The triangular prism 180 has a columnar shape with the arrangement direction (Y direction) of the light emitting units 122 as an axial direction. The triangular prism 180 has a cross section perpendicular to the axial direction that is a substantially right-angled isosceles triangle, and has three side surfaces 180a, 180b, and 180c that are parallel to the axial direction. The side surface 180a and the side surface 180b are orthogonal to each other, and the green light G22 is incident on the remaining side surface 180c. The green light G22 incident on the triangular prism 180 is reflected on the inner surface corresponding to the side surface 180a and then reflected on the inner surface corresponding to the side surface 180b. As a result, the optical axis of the green light G22 is bent by 180 ° compared to that before entering the triangular prism 180. The green light G22 is emitted in the same direction as the green light G13 shown in FIG. 4, and is extracted outside.

  On the other hand, the infrared light IR22 incident on the light reflecting member 142 is reflected by the surface 142a, the optical axis is bent by 90 °, and is incident on the beam polarizer 190. The S-polarized light in the infrared light IR 22 that has entered the beam polarizer 190 is reflected by the beam polarizer 190 and removed from between the beam polarizer 190 and the light reflecting member 142. The P-polarized light in the infrared light IR22 that has entered the beam polarizer 190 is emitted from the beam polarizer 190 and is incident on the light emitting unit 122 of the first light emitting element 120. The infrared light IR23 incident on the light emitting unit 122 is reflected by the first electrode 122a of the light emitting unit 122 and is emitted together with the infrared light generated by the light emitting unit 122.

  The pair of light emitting units 122 and 132, the first reflecting unit 140, and the second reflecting unit 150 constitute a resonator. Infrared light emitted from the light emitting units 122 and 132 resonates between the light emitting units 122 and 132 and resonates to generate laser oscillation. A part of the generated infrared laser light is converted into green laser light each time it passes through the wavelength conversion element 160. The converted green laser light is extracted to the outside through the light reflecting member 142 and the triangular prism 180 or through the light reflecting member 152. The band-pass filter 170, the triangular prism 180, and the beam polarizer 190 may be disposed on the first reflection unit 140 side with respect to the wavelength conversion element 160, or may be disposed on the second reflection unit 150 side. .

  In the laser light source device 100, since the light reflecting members 142 and 152 are arranged with a high degree of positional accuracy, the light reciprocating in the resonator generates a good laser oscillation. Next, an example of a method for arranging the light reflecting member 142 in the manufacturing process of the laser light source device 100 will be described.

  6A to 6C, 7 </ b> A, and 7 </ b> B are process diagrams schematically illustrating an example of a method for manufacturing the laser light source device 100. 6A to 6C and FIGS. 7A and 7B all correspond to the portions shown in FIG.

  In order to manufacture the laser light source device 100, first, the first light emitting element 120 having a plurality of light emitting portions 122 formed on the substrate 121 is prepared. As shown in FIG. 6A, a recess 110b is formed in the substrate surface 110a of the base substrate 110, and the first light emitting element 120 is mounted. The recess 110b may be formed after the first light emitting element 120 is mounted. In addition, before or after mounting the first light emitting element 120, the pin 143a is fitted into the recess 110b.

  Further, as shown in FIG. 6B, a support member 141 having a holding portion 141a and a through hole 141c is prepared. Then, the light reflecting member 142 is joined to the support member 141 in contact with the support surface 141b of the holding portion 141a.

  Next, as illustrated in FIG. 6C, the support member 141 to which the light reflecting member 142 is bonded is temporarily disposed on the base substrate 110 on which the first light emitting element 120 and the pin 143 a are disposed. By temporarily arranging the support member 141 so that the pin 143a passes through the through-hole 141c, the rough position of the support member 141 can be determined very easily. The support member 151 is temporarily disposed also for the second reflecting portion 150.

  Next, as illustrated in FIG. 7A, the position of the light reflecting member 142 with respect to the light emitting unit 122 is adjusted by moving the support member 141 along the substrate surface 110 a. Since the inner diameter of the through hole 141c is larger than the outer diameter of the pin 143a, the position of the light reflecting member 142 with respect to the light emitting portion 122 can be finely adjusted by the gap between the inner wall of the through hole 141c and the pin 143a. Here, light is emitted from the light emitting unit 122, and the position of the support member 141 is finely adjusted based on the direction in which the light is reflected by the light reflecting member 142 and travels. Further, the position of the light reflecting member 152 is also adjusted for the second reflecting unit 150 based on the traveling direction of the light emitted from the light emitting unit 132.

  Specifically, a position adjusting mirror M that reflects the light reflected by the light reflecting member 142 again is disposed. Both surfaces of the position adjusting mirror M are mirror surfaces. Light reflected by the light reflecting member 142 is incident on one surface, and light reflected by the light reflecting member 152 is incident on the other surface. Then, the position of the support member 141 is adjusted in the direction (X direction) in which the first reflecting portion 140 and the second reflecting portion 150 are aligned while measuring the position where the light enters the position adjusting mirror M.

  For example, when the support member 141 is moved away from the second reflecting portion 150 in the X direction, the light incident position on the light reflecting member 142 is moved away from the substrate surface 110a (Z direction). Thereby, the optical axis between the 1st reflective part 140 and the 2nd reflective part 150 in a Z direction can be adjusted. Therefore, the optical axis of the light emitted from the first light emitting element 120 and reflected by the light reflecting member 142 coincides with the optical axis of the light emitted from the second light emitting element 130 and reflected by the light reflecting member 152 with high accuracy in the Z direction. As described above, the position of the support member 141 can be adjusted.

Further, the surface on which light is incident on the position adjusting mirror M is set parallel to the arrangement direction of the light emitting units 122. Then, the position of the light reflecting member 142 in the rotation direction (θ _Z direction) around the normal direction of the substrate surface 110a so that the light reflected by the position adjusting mirror M enters the light emitting unit 122 through the light reflecting member 142. Adjust. Thereby, the optical axis between the 1st reflection part 140 and the 2nd reflection part 150 in (theta) _Z direction can be adjusted. Therefore, the optical axis of the light emitted from the first light emitting element 120 and reflected by the light reflecting member 142 is parallel to the optical axis of the light emitted from the second light emitting element 130 and reflected by the light reflecting member 152 with high accuracy. In addition, the position of the support member 141 can be adjusted.

  Next, as shown in FIG. 7B, an ultraviolet curable adhesive is filled around the pin 143a in the through hole 141c. Since the pin 143a has a truncated cone shape, the gap between the pin 143a and the inner wall of the through hole 141c is wider on the opposite side of the base substrate 110 than on the base substrate 110 side. Therefore, the adhesive can be satisfactorily filled between the pin 143a and the inner wall of the through hole 141c, and leakage of the filled adhesive from the opening on the base substrate 110 side of the through hole 141c is reduced. .

  Then, the adhesive portion 143b is formed by irradiating the filled adhesive with ultraviolet rays. Since the ultraviolet curable adhesive can be cured in a shorter time than the thermosetting adhesive, the occurrence of displacement of the support member 141 with respect to the base substrate 110 during the curing time is reduced. . In addition, since the plurality of joint portions 143 are provided, the movement of the support member 141 due to the shrinkage of the adhesive is prevented from being biased in one direction.

  As described above, the support member 141 is bonded (fixed) to the base substrate 110. In addition, before adjusting the position of the support member 141, you may fill the inside of the through-hole 141c and the recessed part 110b with the adhesive agent. Further, the laser light source device 100 can be obtained by arranging the wavelength conversion element 160, the band pass filter 170, the triangular prism 180, and the like.

In the laser light source device 100 configured as described above, the position of the light reflecting member 142 with respect to the substrate surface 110a includes three independent translational directions (X direction, Y direction, Z direction), and these three translations. It is highly accurate in three rotation directions (θ _X direction, θ _Y direction, and θ _Z direction) around each of the directions. In addition, with respect to the second reflecting portion 150, the position of the light reflecting member 152 with respect to the substrate surface 110a is highly accurate. Therefore, the optical axes of the light traveling from the light emitting unit 122 of the first light emitting element 120 toward the light emitting unit 132 of the second light emitting element 130 and the light traveling from the light emitting unit 132 toward the light emitting unit 122 can be matched with high accuracy. Therefore, these lights can be satisfactorily resonated and a high-power laser beam can be obtained.

  In addition, since the light reflecting member 142 is held by the supporting member by contacting the supporting surface 141b of the supporting member 141, the angle of the light reflecting member 142 with respect to the substrate surface 110a can be easily defined. Further, by moving the support member 141 along the substrate surface 110a, the light reflecting member 142 can be easily and accurately positioned. Thereby, the high-power laser light source apparatus 100 can be obtained without increasing the manufacturing cost.

  In the first embodiment, two joints 143 between the base substrate 110 and the support member 141 are provided. However, if one or more joints are provided, the effect of the present invention can be obtained. If two or more joint portions are provided, the change in the position of the support member relative to the base substrate due to the shrinkage of the adhesive accompanying curing in one joint portion is regulated by the other joint portions. Therefore, displacement of the support member with respect to the base substrate due to shrinkage of the adhesive is prevented. Three or more joint portions may be provided, and the support member 141 can be firmly joined to the base substrate 110 as the number of the joint portions 143 is increased. Further, a screw may be used as the fitting member and the recess may be a screw hole.

Further, in the first embodiment, a plurality of pairs of light emitting units are provided, but a configuration in which one pair of light emitting units is provided may be employed. Since the first light emitting element 120 and the second light emitting element 130 are in contact with the substrate surface 110a, the position of the base substrate 110 in the normal direction of the pair of light emitting portions is approximately the same, but the pair of light emitting elements The position in the normal direction may be different in each part.

  Moreover, it is sufficient that at least one of the first reflecting portion and the second reflecting portion has the joint portion and the holding portion. For example, the second reflecting part may be fixed to the first light emitting element, and the optical axis between the first light emitting element and the second light emitting element may be adjusted by the second reflecting part. The first reflecting portion and the second reflecting portion that are common to a plurality of pairs of light emitting portions are provided, but the plurality of pairs of light emitting portions are divided into two or more groups, and the first reflection is performed for each group. It is good also as a structure by which the part and the 2nd reflection part are provided.

[Second Embodiment]
Next, a second embodiment of the laser light source device of the present invention will be described. The laser light source device of the second embodiment is composed of the same components as those of the first embodiment, but differs from the first embodiment in that the support member 141 is disposed away from the base substrate 110.

  FIG. 8 is a cross-sectional view showing the first reflecting portion of the laser light source device of the second embodiment. FIG. 8 shows a portion corresponding to the cross-sectional view (see FIG. 3) taken along the line A-A 'of FIG. As shown in FIG. 8, in the present embodiment, the support member 141 is disposed away from the substrate surface 110 a in the joint portion 143. The support member 141 is joined to the pin 143a by an adhesive portion 143b filled inside the through hole 141c. The inner diameter of the through hole 141c is larger than the inner diameter of the pin 143a at the opening end of the recess 110b. The 1st reflection part and the 2nd reflection part are arranged by the following arrangement methods.

FIGS. 9A and 9B are process diagrams schematically showing an example of a method for manufacturing the laser light source device of the second embodiment.
First, similarly to the manufacturing method described in the first embodiment, the recess 110b is formed in the base substrate 110, the first light emitting element 120 is mounted, and the pin 143a is fitted into the recess 110b (see FIG. 6A). ). Further, the support member 141 is brought into contact with the support surface 141b of the holding portion 141a to join the light reflecting member 142 to the support member 141 (see FIG. 6B).

  Next, as shown in FIG. 9A, the support member 141 is temporarily arranged so that the pin 143a passes through the through hole 141c. Here, the support member 141 is held at a position away from the substrate surface 110 a so that the support member 141 does not contact the base substrate 110.

  Next, as shown in FIG. 9B, light is emitted from the light emitting unit 122, and the position of the support member 141 is finely adjusted based on the direction in which this light is reflected by the light reflecting member 142 and travels. Specifically, a position adjusting mirror M that reflects the light reflected by the light reflecting member 142 again is disposed. Then, the position of the support member 141 is adjusted while measuring the position where the light enters the position adjusting mirror M.

  Since the support member 141 is temporarily arranged away from the base substrate 110, it is supported in any of two directions (X direction and Y direction) along the substrate surface 110a and one direction (Z direction) orthogonal to the substrate surface. The member 141 can be moved. In addition, the support member 141 can be rotated in any rotation direction around any of the X, Y, and Z axes. Therefore, the position of the support member 141 can be adjusted in the three translation directions independent of each other and the rotation directions around the respective axes of the three translation directions, and the light reflecting member 142 joined in contact with the support member 141. Can be arranged at a highly accurate position.

Next, an ultraviolet curable adhesive is filled around the pin 143a in the through hole 141c, and the adhesive 143b is formed by irradiating the adhesive with ultraviolet light. As a result, the support member 141 is bonded to the base substrate 110 as shown in FIG.
In the laser light source device of the second embodiment as described above, there are more directions in which the position of the support member 141 can be adjusted than in the first embodiment, and therefore the light reflecting member 142 is arranged at a highly accurate position. Can do.

  In addition, it is good also as a structure where the internal diameter of the through-hole 141c is smaller than the internal diameter of the pin 143a in the opening end part of the recessed part 110b. Hereinafter, a method of arranging the first reflecting portion in the modified example having such a configuration will be described.

  FIGS. 10A to 10C are process diagrams schematically showing an example of a method for manufacturing a modified laser light source device. 10B and 10C, illustration of a part of the support member 141, the first light emitting element 120, and the like is omitted.

  First, similarly to the manufacturing method described in the first embodiment, the recess 110b is formed in the base substrate 110, the first light emitting element 120 is mounted, and the pin 143a is fitted into the recess 110b (see FIG. 6A). ). Further, the support member 141 is brought into contact with the support surface 141b of the holding portion 141a to join the light reflecting member 142 to the support member 141 (see FIG. 6B).

  Next, as shown in FIG. 10A, the support member 141 is temporarily arranged so that the pin 143a passes through the through hole 141c. Here, as shown in FIG. 10B, the support member 141 is temporarily placed close to the base substrate 110 until the opening end of the through hole 141c on the base substrate 110 side contacts the side surface of the pin 143a. Since the inner diameter of the through hole 141c is smaller than the inner diameter of the pin 143a at the opening end of the recess 110b, the support member 141 is disposed at a position away from the substrate surface 110a. Moreover, since the opening end part of the through-hole 141c is substantially in line contact with the side surface of the pin 143a, the support member 141 is held movably.

  Next, as shown in FIG. 10C, the angle of the support member 141 with respect to the substrate surface 110a is adjusted by sliding along the side surface of the pin 143a while bringing the opening end of the through hole 141c into contact with the side surface of the pin 143a. To do. For the adjustment of the angle, the light emitted from the light emitting unit 122 may be used as in the first and second embodiments.

  Then, with the position of the support member 141 adjusted, an ultraviolet curable adhesive is filled around the pin 143a in the through hole 141c. Since the opening end portion of the through hole 141c on the base substrate 110 side is in contact with the side surface of the pin 143a, leakage of the filled adhesive is significantly reduced. Then, the adhesive portion 143 b is formed by irradiating the adhesive with ultraviolet rays, and the support member 141 is bonded to the base substrate 110.

  In the laser light source device of the modified example as described above, the angle of the support member 141 with respect to the base substrate can be adjusted while the support member 141 is held movably. It can be easily placed at a precise position.

  Next, an embodiment of the projector of the present invention will be described. FIG. 11 is a schematic configuration diagram showing the projector 400 of the present embodiment. As shown in FIG. 11, the projector 400 includes laser light source devices (light source devices) 410R, 410G, and 410B, transmissive liquid crystal light valves (image forming devices) 430R, 430G, and 430B, a cross dichroic prism 440, and a projection device. 450. Laser light source devices 410R, 410G, and 410B emit red light, green light, and blue light, respectively, and the emitted color lights are modulated (formed) into liquid crystal light valves 430R, 430G, and 430B, respectively. The modulated color lights are combined by the cross dichroic prism 440, and the combined light is projected by the projection device 450.

  In addition, the projector 400 according to this embodiment includes uniformizing optical systems 420R, 420G, and 420B that uniformize the illuminance distribution of the laser light emitted from the laser light source devices 410R, 410G, and 410B. Accordingly, the liquid crystal light valves 430R, 430G, and 430B are illuminated with light having a uniform illuminance distribution. Here, the homogenizing optical system 420R includes a hologram 421R, a field lens 422R, and the like, and the homogenizing optical systems 420G and 420B have the same configuration.

  The color light modulated by each of the liquid crystal light valves 430R, 430G, and 430B enters the cross dichroic prism 440. The cross dichroic prism 440 is formed by bonding four right-angle prisms, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are arranged in a cross shape on the inner surface thereof. The three color lights are synthesized by these dielectric multilayer films and become light representing a color image. The combined light is enlarged and projected on the screen 460 by the projection device 450, whereby a projected image is displayed.

  In the projector 400 of the present embodiment, since the laser light source devices 410R, 410G, and 410B are configured by the light source device of the present invention, the projector has a wide dynamic range and a high-quality projection image can be obtained.

  Although the transmissive liquid crystal light valve is used as the image forming apparatus, a reflective light valve may be used, or an image forming apparatus other than the liquid crystal may be used. An example of such an image forming apparatus is a digital mirror device (DMD). What is necessary is just to change suitably the structure of a projection optical system according to the kind of image forming apparatus used. Further, although the cross dichroic prism is used as the color light combining means, the present invention is not limited to this. As the color light synthesizing means, for example, a dichroic mirror having a cross arrangement to synthesize color light, or a dichroic mirror arranged in parallel to synthesize color light can be used.

Next, another type of projector according to the present invention will be described. This embodiment is different from the above embodiment in that it is a scanning projector. FIG. 12 is a schematic configuration diagram illustrating the scanning projector according to the present embodiment.
The scanning projector 500 of this embodiment includes a laser light source device 510, a condenser lens 520, and a MEMS mirror (image forming device) 530. The laser light emitted from the laser light source device 510 is condensed on the MEMS mirror 530 by the condenser lens 520. The condensed laser light is scanned in the horizontal direction and the vertical direction on the screen 540 by driving the MEMS mirror 530. As a result, an image is drawn (formed) on the screen 540.

  Next, an embodiment of the monitor device according to the present invention will be described. FIG. 13 is a schematic configuration diagram showing the monitor device of the present embodiment. The monitor apparatus 600 of this embodiment includes an apparatus main body 610 and an optical transmission unit 620. The apparatus main body 610 is provided with a camera (imaging device) 611 and the laser light source device 612 of the present invention. The light transmission unit 620 is provided with a light guide 621 for illumination and a light guide 622 for light reception. The light guides 621 and 622 are a bundle of a large number of optical fibers, and can send laser light to a distant place. In the light guide 621 for illumination, a diffusion plate 623 is provided at one end (tip) on the emission side, and the other end is connected to the laser light source device 612. The laser light emitted from the laser light source device 612 is sent to the diffusion plate 623 through the light guide 621 and is diffused by the diffusion plate 623 to irradiate the subject.

  An imaging lens 624 is provided at the tip of the light transmission unit 620, and light reflected by the surface of the subject enters the imaging lens 624. The light incident on the imaging lens 624 is sent to a camera 611 provided in the apparatus main body 610 through a light guide 622 for receiving light. In this way, the laser light emitted from the laser light source device 612 irradiates the subject, and the light reflected by the subject surface can be imaged by the camera 611.

    In the monitor device 600 of the present embodiment, the light source device of the present invention is used for the laser light source device 612, so that the subject can be illuminated with high-power laser light. Therefore, the amount of light reflected from the surface of the subject is secured, and the monitor device is a good monitor that can obtain a clear captured image.

  100, 410R, 410G, 410B, 510, 612 ... laser light source device, 110 ... base substrate (substrate), 110a ... substrate surface, 120 ... first light emitting element, 130 ... second Light emitting element, 122, 132... Light emitting part, 140... First reflecting part, 150... Second reflecting part, 141, 151. ... wavelength conversion element, 400 ... projector, 500 ... scanning projector (projector), 600 ... monitor device.

Claims (12)

A substrate provided with a recess;
A pair of light emitting units disposed on a substrate surface of the substrate;
A fitting member joined in the recess;
A first reflecting portion that reflects light emitted from one light emitting portion of the pair of light emitting portions;
A second reflecting portion that reflects the light reflected by the first reflecting portion toward the other light emitting portion of the pair of light emitting portions, and
The first reflecting portion is
A support member provided with a through hole through which the fitting member is inserted with a gap;
A light reflecting member supported in contact with the support member,
A laser light source device comprising a resonator including the pair of light emitting units, the first reflecting unit, and the second reflecting unit.   The laser light source device according to claim 1, wherein the support member is disposed at a position away from the substrate surface and joined to the fitting member.   The laser light source device according to claim 1, wherein the support member is disposed along the substrate surface and joined to the fitting member.   The fitting member is bonded to an inner wall of the through hole with an adhesive to form a joint portion between the substrate and the first reflecting portion, and a plurality of the joint portions are provided. The laser light source apparatus as described in any one of Claims 1-3.   The laser light source device according to claim 4, wherein the adhesive is a photocurable adhesive.   The fitting member has an outer dimension of a cross section perpendicular to the major axis direction that is reduced from one end portion to the other end portion in the major axis direction, and the one end portion of the fitting member. The laser light source device according to claim 1, wherein the laser light source device is joined in the concave portion.   The laser light source device according to any one of claims 1 to 6, wherein the fitting member is joined to the concave portion by being fitted to the concave portion.   The laser light source device according to claim 1, wherein the second reflecting portion also includes the support member and the light reflecting member. A plurality of pairs of the light emitting units,
A first light emitting element having a plurality of light emitting portions and a second light emitting element having a plurality of light emitting portions are bonded to the substrate,
Each of the plurality of light emitting sections in the first light emitting element constitutes the pair of light emitting sections with each of the plurality of light emitting sections in the second light emitting element,
The laser light source device according to any one of claims 1 to 8, wherein the plurality of pairs of light emitting units are provided with the first reflecting unit and the second reflecting unit in common.   The wavelength conversion element which converts the light of the incident fundamental wavelength into the light of a conversion wavelength is arrange | positioned in the optical path between the said 1st reflection part and the said 2nd reflection part. The laser light source device according to any one of the above. The laser light source device according to any one of claims 1 to 10,
An image forming apparatus for forming image light indicating an image by laser light emitted from the laser light source device;
A projector for projecting image light formed by the image forming apparatus. The laser light source device according to any one of claims 1 to 10,
An image pickup device for picking up an image of a subject illuminated by the laser light source device.

Images