JP2011146450A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To secure cooling reliability and maintainability and to suppress the device height while achieving improvement in function and performance by adopting a front and rear suction and exhaust system for a cooling air flow, in an electronic device that has a plurality of circuit board units respectively mounted with semiconductor elements, a plurality of cooling units and power supply units for the circuit board units, and allows them to be inserted/extracted from the outside. <P>SOLUTION: An electronic device has the following structure. Power supply units are arranged on both sides of the rear surface of the electronic device. As for the horizontal width of each circuit board unit, a level difference is provided between the front and the rear so as to separate a cooling air flow path in the circuit board units and the power supply units while maximally securing a mounting area of the power supply units. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic device, and more particularly to an electronic device having a mounting structure that improves cooling performance.

  In the network field, switches and routers are widely used as network communication devices that perform data transfer. In general, a network communication device such as a switch or a router includes a circuit board unit having an interface function for data transfer in a network, a circuit board unit having a control function for controlling data transfer, and the like. The unit is removable (Patent Document 1).

  Signal exchange and power feeding between the circuit board units in a state where the circuit board unit is installed in the apparatus are executed via a relay circuit board (so-called back board) arranged in the apparatus. In installing the network communication device, it is generally mounted on a 19-inch standard rack.

  FIG. 5 shows a configuration diagram of a general state of the electronic device. In this electronic apparatus, the circuit board unit 120 is mounted in a horizontal state, and the circuit board unit 120 is forcibly cooled by a detachable cooling unit 136, and the flow of the cooling air generally has a side intake / exhaust structure. take.

  For this reason, when mounted on the housing 110 (also referred to as a rack), when an appropriate space cannot be secured between the side air intake / exhaust surface of the electronic device and the side plate 200 of the rack, the pressure increases and the electronic device Cooling efficiency deteriorates due to the decrease in the flow inside, or the temperature rises by passing through the circuit board unit 120, and the discharged air circulates to the intake side of the device, and the temperature on the intake side gradually increases May cause problems due to cooling performance. In particular, in an electronic device in which a semiconductor element having a high calorific value is mounted in order to realize high performance, there is a high possibility that the above problem will occur. In addition, it is in a very advantageous state from the viewpoints of mounting density and performance of external interface functions, device mounting density, and expandability.

  As an improvement measure for the electronic device, a mounting structure as shown in FIGS. 6 and 7 may be employed. In the case of the system shown in FIG. 6, the circuit board unit 120 is mounted in the vertical direction, and air is sucked from the lower part of the front surface and exhausted from the upper part of the rear surface. However, since the width of the apparatus is limited by the rack standard, this causes a limitation on the number of cards mounted, and has a demerit that the apparatus becomes considerably larger than the above state.

  On the other hand, in the structure in which the cooling air is guided straight from the front surface to the rear surface, as in the case of the method of FIG. However, it is not easy to provide a large number of connectors for the interface with the outside on the front, or in the circuit board 140 for relay inside the electronic device, considering the wiring property for performance. Therefore, the cooling performance cannot be easily improved. Therefore, the cooling performance is relatively low and the heat generation amount is small. Furthermore, it is common to arrange a unit product in which the power supply unit 137 and the cooling unit 136 are integrated on the rear surface side, but since the air heated through the circuit board unit enters the integrated unit, The cooling condition of the power supply is in a severe state.

JP 2007-266528 A

  In recent years, there has been an increasing demand for improvement in processing performance in network communication devices, and there is a high demand for adopting a front-rear intake / exhaust airflow structure in terms of the environment in which the devices are installed.

  In order to adopt the front / rear intake / exhaust type structure, adopting a structure in which the circuit board unit is vertically mounted leads to an increase in the size of the apparatus and is disadvantageous in terms of expandability. In addition, the structure that allows cooling air to flow straight from the front to the rear provides a lot of external interface functions on the front and the wiring reliability for improving the transmission characteristics between circuit board units. It becomes a severe state in terms of sex. Furthermore, since the air whose temperature has risen through the circuit board unit enters the power supply unit, the reliability of the power supply unit becomes severe.

  Such a problem is not limited to a network communication device such as a switch or a router, but is a problem common to an electronic device having a plurality of removable circuit board units.

  The present invention has been made to solve the above-described problems, and an electronic device having a plurality of circuit board units adopts a front / rear intake / exhaust type structure to maximize the processing speed of the device and the mounting of an interface function. It is an object of the present invention to provide a technology capable of ensuring cooling reliability and suppressing the height of the apparatus while achieving the above.

  In order to solve at least a part of the above problems, the present invention provides a first circuit board unit having an external interface connector, a cooling unit, a power supply unit, the first circuit board unit, the cooling unit, and the A relay circuit board for connecting a power supply unit, the cooling unit is located on the back side of the surface to which the first circuit board unit of the relay circuit board is connected, and the power supply unit is The electronic device is located on a side surface of the first circuit board unit and the cooling unit.

  In the electronic device having the above-described configuration, the power supply unit is disposed on the left and right sides on the rear surface side of the electronic device, so that the height of the electronic device can be minimized. In addition, since the flow of cooling air can be made independent between the circuit board unit and the power supply unit, the air whose temperature has risen through the circuit board unit does not flow into the power supply unit. Cooling reliability can be improved, and deterioration in conversion efficiency due to temperature rise can be reduced.

  In addition, since the cooling unit disposed on the rear surface portion is an independent unit, independent maintenance is possible, the maintainability is improved, and the degree of freedom for improving the performance of the cooling unit is increased.

  It should be noted that the present invention can be realized in various modes, and can be realized in the form of, for example, an electronic device, a network communication device, a signal transmission method in the electronic device or a network communication device, and these methods. it can.

It is explanatory drawing which shows schematically the structure of the electronic device in the Example of this invention from the front side. It is explanatory drawing which shows roughly the structure of the electronic device in the Example of this invention from the rear surface side. It is explanatory drawing which shows planarly the structure of the 1st circuit board unit of the electronic device in the Example of this invention. It is explanatory drawing which shows planarly the structure of the 2nd circuit board unit of the electronic device in the Example of this invention. It is explanatory drawing which shows the state which looked at one structure of the circuit board unit of the electronic device in the Example of this invention from the side. It is explanatory drawing which showed the structure of the main circuit board for relay, and the sub circuit board for relay in detail. It is explanatory drawing which shows the state which mounted the electronic device which takes the side intake / exhaust system in a prior art in the rack. It is explanatory drawing which shows the mounting structure of the electronic device which takes the structure which mounts the circuit board unit in a prior art vertically. It is explanatory drawing which shows the mounting structure of the electronic device which takes the structure which flows a wind straight from the front surface to a rear surface in a prior art.

  Embodiments of the present invention will be described based on examples and modifications.

  1 and 2 are diagrams schematically showing a configuration of an electronic device 100 according to an embodiment of the present invention. The electronic device 100 functions as a network communication device that transfers data (for example, called a frame or a packet) in a computer network. Specific examples of network communication devices include routers and switches.

  1A shows a front perspective view of the electronic device 100, and FIG. 1B shows a rear perspective view. As shown in FIGS. 1A and 1B, an electronic device 100 includes a plurality of circuit board units 120, a plurality of cooling units 136, a power supply unit 137, and a relay main circuit inside a housing 110. It has a substrate 140 and a relay subcircuit substrate 141. 1A and 1B also show components of the electronic device 100 that are actually installed inside the housing 110 and cannot be seen from the outside. In addition, the circuit board unit 120 has a case unit structure in which the back surface and the side surface are covered with sheet metal, but in this drawing, components that are not visible from the outside are also shown. In FIG. 1B, the cooling unit 136 and the power supply unit 137 are not shown.

  The circuit board unit 120 is configured by a circuit board on which a semiconductor element is mounted, and realizes various functions for data processing. The electronic device 100 of this embodiment has a plurality of circuit board units 120, and the first circuit board unit 120a having the external interface connector 122 mounted on the front side performs processing such as interface control with the outside. The second circuit board unit 120b, which does not have an external interface connector on the front side and is arranged above the first circuit board unit, is a crossbar for each circuit board unit 120 inside the electronic device 100. It has a switch function. Note that the number of the circuit board units 120 is not limited to the number in the drawing.

  In the first circuit board unit 120a, the external interface connector 122 is mounted over the entire area on the front side, and therefore, an intake port for taking in air for cooling cannot be easily provided on the front side. On the other hand, since the second circuit board unit 120b does not have an external interface connector on the front side, a mesh-shaped ventilation port 128 for taking in cooling air is provided.

  These circuit board units 120 are configured to be insertable / removable along slots (not shown) formed in the housing 110. Thereby, the function expansion of the electronic device 100 can be achieved. FIG. 1A shows a state in which the lowermost circuit board unit 120 is removed and the remaining circuit board units 120 are installed in the electronic apparatus.

  A cooling unit 136 configured with a fan for forcibly flowing cooling air is installed at the center of the rear surface side of the housing 110 and cools the circuit board unit 120. In addition, since the cooling unit 136 is not integrated with, for example, the power supply unit 137 or the like, the cooling unit 136 has a structure and an arrangement that can be maintained independently.

  The power supply unit 137 is installed on both sides of the housing 110 on the rear side, and supplies power to the circuit board unit 120 and the cooling unit 136 via the relay main circuit board 140 and the relay sub circuit board 141. At the same time, control signals are exchanged with the circuit board unit 120.

  The relay main circuit board 140 and the relay sub circuit board 141 are for connecting the plurality of circuit board units 120, the cooling unit 136, and the power supply unit 137 with connectors. As will be described in detail later with reference to FIG. 4, a plurality of circuit board units 120 are connected to the relay main circuit board 140, and a cooling unit 136 and a power supply unit 137 are connected to the relay sub circuit board 141. The relay main circuit board 140 and the relay sub circuit board 141 are also connected by a connector.

  FIG. 2 shows a plan view of the first circuit board unit 120a on which the external interface connector 122 is mounted. As shown in FIG. 2, the circuit board unit 120 includes a board unit side connector 124 for connection to the relay main circuit board 140, a board unit side connector 125 for connection to a cable 150 described later, And an external interface connector 122 for connection to the interface.

  The external interface connector 122 is disposed on the front side edge of the circuit board unit 120a. On the other hand, the board unit side connector 124 and the board unit side connector 125 are arranged at the edge on the rear surface side of the circuit board unit 120a. The lateral width on the rear side is slightly narrower than the lateral width on the front side of the circuit board unit 120a, and a step 180 is formed. The left and right sides of the slightly narrower portion on the rear side are used as mounting areas for the power supply unit 137.

  FIG. 3A shows a plan view of the second circuit board unit 120b not mounted with the external interface connector, and FIG. 3B shows the circuit board unit 120 viewed from the right side. FIG. As shown in FIG. 3A, in the second circuit board unit 120b, the main parts of the first circuit board unit 120a are directed upward, whereas the second circuit board unit 120b is reversed. The main parts are facing down. Note that the entire upper surface (the back surface when viewed from the substrate itself) of the second circuit board unit 120b is covered with a sheet metal. Further, the circuit board itself is close to the relay main circuit board 140 side, and there is nothing on the front side. Similarly to the circuit board unit 120a, the second circuit board unit 120b is slightly narrower on the rear side than the front side and has a step 180. The left and right sides of the slightly narrower portion on the rear side are used as mounting areas for the power supply unit 137.

The second circuit board unit 120b includes a board unit side connector 124 for connection to the relay main circuit board 140 and a board unit side connector 125 for connection to the cable 150 described later. ing. The board unit side connector 124 and the board unit side connector 125 are arranged on the rear surface side of the circuit board unit 120. A notch is formed around the center of the rear surface side of the second circuit board unit 120b, and the board unit side connector 125 is disposed in the portion where the notch is formed. Accordingly, the position of the board unit side connector 125 in the second circuit board unit 120b is located on the front side of the position of the board unit side connector 124 in the second circuit board unit 120b. (See Fig. 3 (a) (b))
The board unit side connector 124 corresponds to the first board unit side connector in the present invention, and is a connector for connection to a relay main circuit board 140 described later. The board unit side connector 125 is the present invention. Corresponds to the second board unit side connector in FIG. 2, and is a connector for connection with a cable 150 to be described later.

  Further, as shown in FIG. 3B, a wind direction adjusting component 129 is provided on the front side of the second circuit board unit 120b. Cooling air for cooling the semiconductor elements of the circuit board unit 120 enters from the mesh-shaped air vent 128 on the front surface of the second circuit board unit 120b, and once by the wind direction adjusting component 129, the first circuit board is obtained. It is guided to the unit 120a side, and then heads to the relay main circuit board 140 side.

  FIG. 4 is an explanatory diagram showing in detail the configuration of the relay main circuit board 140 and the relay sub circuit board 141. The relay main circuit board 140 is a circuit board (so-called backboard) that electrically connects the circuit board units 120 and relays signals exchanged between the circuit board units. The relay circuit board 140 is fixed inside the casing 110 of the electronic device 100 in a direction perpendicular to an axis from the front surface to the rear surface of the electronic device.

  The relay main circuit board 140 has a ventilation opening 148 in the front side portion where the cooling unit 136 is disposed. In addition, a relay board side connector 144 corresponding to the circuit board unit 120 is provided on both sides of the front side surface. The position of the relay board-side connector 144 is such that when the circuit board unit 120 is installed in the electronic device 100, the board-side connector 124 of the circuit board unit 120 is fitted. For example, in this embodiment, except for the upper and lower ends, if the first circuit board unit 120a is connected to the connector 144a and the second circuit board unit 120b is connected to the connector 144b, the wind path shown in FIG. Thus, the ventilation port 148 is located at the front, and the cooling performance is improved. However, this shape is not necessarily required. Since the second circuit board unit 120b has a space between it and the main circuit board for relay 140 as can be seen from FIG. 3A, there is no problem even if the position of the second circuit board unit 120b is slightly shifted from the ventilation port 148.

  One board unit side connector 124 and one relay board side connector 144 are configured as a socket and the other is configured as a header, and constitutes a connector pair that fits and is electrically connected to each other. As a result, the circuit board units 120 are electrically connected, and signal exchange and power feeding are possible.

  Further, a relay sub circuit board 141 is connected to both sides of the relay main circuit board 140 via a relay inter-board connector 142. The left and right relay sub-circuit boards 141 are similar, but are arranged symmetrically with respect to each other when viewed from the relay main circuit board 140.

  It is not necessary to be completely symmetrical. The two relay circuit boards 141 and the relay sub-circuit board 141 are provided instead of one relay circuit board, because the connectors are concentrated toward the end of the relay circuit board and in the central portion. This is to secure a space for providing a ventilation opening. If all connectors are prepared on a single circuit board for relay, the connector placement positions cannot be overlapped on the front and rear surfaces, so it is necessary to expand the connector installation area to the center part more than in FIG. Yes, the area of the vent will be reduced. Therefore, if the circuit board unit 120, the cooling unit 136, and the power supply unit 137 can be brought closer to the end of the relay circuit board by stacking the two circuit boards for relay, the shape can be any. May be.

  The relay sub circuit board 141 has a relay board side connector 146 for the cooling unit 136 and a relay board side connector 147 for the power supply unit 137. The circuit board unit 120, the cooling unit 136, and the power supply unit 137 are electrically connected by the relay main circuit board 140 and the relay sub circuit board 141 described above.

  A board unit side connector 125 is installed at the center of the rear side of the circuit board unit 120. The board unit side connector 125 is a connector for signals related to high-speed processing performance, and connects the cable 150, thereby connecting each part.

  The cable-side connector 155 corresponding to the board unit-side connector 125 is fixed to a component part of the housing 110 via the cable 150 or is fixed to an adapter-like part. The adapter part is attached to the relay main circuit board 140 and is not directly electrically connected to the relay main circuit board 140. As a result, a space is provided in the central portion of the relay main circuit board 140 for providing a vent hole.

  Further, the position of the cable-side connector 155 is such that when the circuit board unit 120 is installed in the electronic device 100, the cable-side connector 155 fits with the board unit-side connector 125 of the circuit board unit 120. One board unit side connector 125 and one cable side connector 155 are configured as a socket and the other is configured as a header, and constitute a connector pair that fits and is electrically connected to each other. As a result, the circuit board units are electrically connected, and signal exchange is possible.

  As described above, in the electronic device 100 according to the present embodiment, the power supply unit 137 is disposed on the left and right sides of the rear surface, so that the height of the electronic device 100 can be suppressed and the circuit board unit 120 is warmed. Therefore, the reliability of the power supply unit 137 is improved. Further, by providing the step 180 in the lateral width before and after the circuit board unit 120, the mounting space of the power supply unit 137 can be secured to the maximum without reducing the mounting density of the arrangement of the external interface connectors 122.

  On the other hand, since the cooling unit 136 can be arranged independently, the maintainability is improved, and the space for arranging the fans in two rows is secured. Fault tolerance in case of failure is also improved.

  Further, in the electronic device 100 of the present embodiment, the first circuit board unit 120b, which does not require an external interface connector on the front surface, is turned upside down with respect to the first circuit board unit 120a. The arrangement of the circuit board unit 120a on the upper side and the provision of the wind direction adjusting component 129 allow air for cooling the circuit board unit 120 to be supplied to the second circuit board without increasing the space inside the electronic device. The air can be taken in from the ventilation port 128 in the front part of the unit 120b, and can be efficiently sent to the heat-generating semiconductor element of the circuit board unit 120. The cooling efficiency is improved and the height of the device is suppressed. be able to.

  Further, in the electronic apparatus 100 of this embodiment, the high-speed signal between the circuit board units 120 is directly connected from the board unit side connector 125 via the cable 150 without using the relay main circuit board 140, so that the board unit side Since a connector corresponding to the connector 125 and serving as a receiving port on the relay main circuit board 140 and wiring related thereto are not necessary, the portion can be used as a ventilation port 148 for passing cooling air. It is advantageous for the sex.

  In addition, because high-speed signals are transmitted by cables, there is no load on the relay circuit board side, so the increase in material cost for performance improvement is suppressed, and the amount of wiring is also reduced. .

  Further, since the position of the board unit side connector 125 of the second circuit board unit 120b is on the front side from the position of the board unit side connector 125 of the first circuit board unit 120b, the relay main circuit of the circuit board unit 120 is provided. The space near the substrate 140 is widened, and it works preferentially on the flow of cooling air.

  In the electronic apparatus 100 according to the present embodiment, the cooling unit 136 and the power supply unit 137 are not directly connected to the relay main circuit board 140 but are connected to the relay sub circuit board 141. As a result, the degree of freedom of the mounting position of the board unit side connector 124 corresponding to the circuit board unit 120 is increased and the board unit side connector 124 can be placed at the end, and the ventilation opening for passing the cooling air provided in the relay main circuit board 140 148 can be expanded to the maximum.

  More specifically, when the circuit board unit 120, the cooling unit 136, and the power supply unit 137 are connected to the relay main circuit board 140, the connector positions cannot be overlapped. It is necessary to ensure. However, by using the relay sub circuit board 141, the connectors can be arranged independently on the relay main circuit board 140 and the relay sub circuit board 141, so the connectors are arranged so as to overlap when viewed from the front of the electronic device. It is also possible to do. As a result, more connectors can be positioned around the relay board than in the past.

  Thus, as can be seen from FIG. 3, the connector of the power supply unit 137 located on the side surface can also be positioned around the relay board, and a ventilation hole is provided in the center of the relay main circuit board 140. Is possible.

  As described above, the ventilation hole 128 for cooling air can be secured on the front surface of the electronic device 100, and the ventilation hole 148 can be provided to the relay circuit board 140 as much as possible. Even when elements are mounted and when many external interface connectors 122 are mounted, it is possible to ensure cooling reliability and to suppress the height of the apparatus.

  The present invention is not limited to the above-described examples and embodiments, and can be implemented in various modes without departing from the gist thereof. For example, the following modifications are possible.

  In the above embodiment, the cooling air of the circuit board unit 120 is taken in from the ventilation port 128 on the front surface of the second circuit board unit 120b. However, the second circuit board unit 120b is functionally unnecessary. May be a dummy unit having the vent hole 128 and the wind direction adjusting function 129 in the same manner. Further, with respect to the second circuit board unit 120b, the board unit side connector 125 for connecting the cable 150 may be disposed in the vicinity of the relay main circuit board 140 without being cut out. In the figure of the above embodiment, the first circuit board unit 120a is divided into a part having the interface connector on the front side and a structure on the rear side to form a step 180. 180 may be formed.

  In the above embodiment, a part of the electrical signals of the circuit board unit 120 is electrically connected using the cable 150. However, the relay main circuit board 140 is not used without using the cable 150. It may be through.

  In the above embodiment, the relay sub-circuit board 141 is connected to the relay main circuit board 140 by one relay board-to-board connector 142, but a plurality of relay board-to-board connectors 142 may be provided. Further, although the cooling unit 136 and the power supply unit 137 are received by the relay sub circuit board 141, it may be directly connected to the relay main circuit board 140 so that the relay sub circuit board 141 is unnecessary.

  In the above embodiment, the circuit board unit 120 is horizontally mounted, but may be vertically mounted.

DESCRIPTION OF SYMBOLS 100 ... Electronic device 110 ... Housing 120 ... Circuit board unit 122 ... External interface connector 124 ... Board unit side connector 125 ... Board unit side connector 128 ... Ventilation hole 129 .. Wind direction adjustment component 136 ... Cooling unit 137 ... Power supply unit 140 ... Relay main circuit board 141 ... Relay sub-circuit board 142 ... Relay board connector 144 ... Relay Board side connector 146... Relay board side connector 147... Relay board side connector 148... Ventilation port 150 .. Cable 155 .. Cable side connector 180. ... Side plate of rack

Claims (20)

A first circuit board unit having an external interface connector;
A cooling unit;
A power supply unit;
A relay circuit board connecting the first circuit board unit, the cooling unit, and the power supply unit;
The cooling unit is located on the back side of the surface of the relay circuit board to which the first circuit board unit is connected,
The electronic device according to claim 1, wherein the power supply unit is located on a side surface of the first circuit board unit and the cooling unit. The electronic device according to claim 1,
And a second circuit board unit having no external interface connector,
The second circuit board unit includes a wind direction adjusting component that changes a direction of cooling air, and is connected to the relay circuit board in a direction in which the first circuit board unit and a surface having a semiconductor element are overlapped. An electronic device characterized by comprising: The electronic device according to claim 2,
The second circuit board unit has a connector for connecting to a high-speed processing signal cable, and there is a space between the connector portion and the relay circuit board,
The electronic device according to claim 1, wherein the relay circuit board is provided with a cutout in a portion other than a connection portion with the first circuit board unit or the second circuit board unit. The electronic device according to claim 2, wherein
The relay circuit board includes a first relay circuit board connected to the first circuit board unit and the second circuit board unit, and a second relay connected to the power supply unit and the cooling unit. Circuit board,
The electronic device, wherein the first relay circuit board and the second relay circuit board are connected by a connector. The electronic device according to claim 4,
A connector for connecting to the first circuit board unit or the second circuit board unit of the first relay circuit board is connected to the power supply unit or the cooling unit of the second relay circuit board. An electronic device, wherein the electronic device is disposed so as to overlap with a connector for performing the operation. The electronic device according to claim 2, wherein
The electronic device according to claim 1, wherein a part of the side surface of the first circuit board unit is narrower than the other part for accommodating the power supply unit when viewed from the direction of insertion into the connector of the relay circuit. The electronic device according to claim 2, wherein
The electronic device according to claim 2, wherein a part of the side surface of the second circuit board unit is narrower than the other part for accommodating the power supply unit when viewed from the direction of insertion into the connector of the relay circuit. The electronic device according to claim 2, wherein
An electronic apparatus, wherein a front portion of the circuit board unit is a vent hole when a connection portion between the second circuit board unit and the relay circuit board is located rearward. The electronic device according to claim 1, wherein
The electronic device according to claim 1, wherein the cooling units are arranged in a plurality of rows. A first circuit board unit having an external interface connector;
A second circuit board unit having no external interface connector;
A relay circuit board for connecting the first circuit board unit, the second circuit board unit, the cooling unit, and the power supply unit;
The circuit board unit includes a wind direction adjusting component that changes a direction of cooling air, and is connected to the relay circuit board in a direction in which the first circuit board unit and a surface having a semiconductor element are overlapped. Electronic device characterized. The electronic device according to claim 10, comprising:
The cooling unit is located on the back side of the surface to which the first circuit board unit and the second circuit board unit of the relay circuit board are connected,
The electronic device according to claim 1, wherein the power supply unit is located on a side surface of the first circuit board unit and the cooling unit. The electronic device according to claim 10 or 11,
The second circuit board unit has a connector for connecting to a high-speed processing signal cable, and there is a space between the connector portion and the relay circuit board,
The electronic device according to claim 1, wherein the relay circuit board is provided with a cutout in a portion other than a connection portion with the first circuit board unit or the second circuit board unit. The electronic device according to claim 10, comprising:
The relay circuit board includes a first relay circuit board connected to the first circuit board unit and the second circuit board unit, and a second relay connected to the power supply unit and the cooling unit. Circuit board,
The electronic device, wherein the first relay circuit board and the second relay circuit board are connected by a connector. 14. The electronic device according to claim 13, wherein
A connector for connecting to the first circuit board unit or the second circuit board unit of the first relay circuit board is connected to the power supply unit or the cooling unit of the second relay circuit board. An electronic device, wherein the electronic device is disposed so as to overlap with a connector for performing the operation. A first circuit board unit having an external interface connector;
A cooling unit;
A power supply unit;
A first relay circuit board for connecting the first circuit board unit;
A second circuit board unit for connecting the cooling unit and the power supply unit;
The electronic device, wherein the first relay circuit board and the second relay circuit board are connected by a connector. The electronic device according to claim 15, comprising:
A connector for connecting to the first circuit board unit or the second circuit board unit of the first relay circuit board is connected to the power supply unit or the cooling unit of the second relay circuit board. An electronic device, wherein the electronic device is disposed so as to overlap with a connector for performing the operation. The electronic device according to claim 16, comprising:
And a second circuit board unit having no external interface connector,
The second circuit board unit includes a wind direction adjusting component that changes a direction of cooling air, and the first circuit board unit is arranged on the first relay circuit board in a direction in which the first circuit board unit and a surface having a semiconductor element are overlapped. An electronic device characterized by being connected. An electronic device according to claim 17,
The second circuit board unit has a connector for connecting to a high-speed processing signal cable, and there is a space between the connector portion and the first relay circuit board,
The electronic device according to claim 1, wherein the first relay circuit board is provided with a cutout in a portion other than a connection portion with the first circuit board unit or the second circuit board unit. The electronic device according to claim 18, comprising:
The cooling unit is located on the back side of the surface of the relay circuit board to which the first circuit board unit is connected,
The electronic device according to claim 1, wherein the power supply unit is located on a side surface of the first circuit board unit and the cooling unit. 20. The electronic device according to claim 19, wherein
The electronic device according to claim 1, wherein the cooling units are arranged in a plurality of rows.

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