JP2011134803A - Device and method for cooling of electronic device stored in rack group - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method for efficiently cooling electronic devices stored in a rack group by minimizing the load on the entire air conditioning system for the computer room, or the like. <P>SOLUTION: The device for cooling the electronic devices stored in the rack group includes walls 11 which reside at the opposite ends of a warm-air passage 3 and shield the warm-air passage 3, a ceiling body 12 located over the warm-air passage 3 and shields the warm-air passage 3, and a heat exchanger 14 which cools the air, wherein the heat exchanger 14 cools the warm air discharged to the warm-air passage 3 and isolated in a warm air space 10 formed so that the side surface is surrounded by two rows of rack and the walls 11 and the upper surface is surrounded by the ceiling body 12, and then discharges the cold air to the outside of the warm air space. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a cooling device for an electronic equipment storage rack group that stores electronic equipment such as computers and network equipment, and in particular, a passage formed between rows of electronic equipment storage racks is alternately formed into a cool air passage and a warm air passage. The present invention relates to a cooling device for a group of electronic equipment storage racks arranged to form.

  Electronic devices such as computers or network devices housed in computer rooms such as data centers are being miniaturized by increasing their density and reducing installation space, and the temperature rise of electronic devices directly leads to system troubles. It is becoming increasingly important to address the heat generation problem of these electronic devices. In general, an air conditioning system that controls the overall temperature of a computer room or the like is used to cool an electronic device as a countermeasure.

As such prior art, there are Patent Document 1 and Patent Document 2.
Patent Document 1 discloses a passage having an internal space under the floor, a device housing rack group installed on both sides of the passage, for supplying air from the front surface and exhausting exhaust heat to the upper surface or the rear surface, and an air conditioner The cooling air blown out from the air conditioner flows through the internal space under the passage floor, and is blown out from the hole provided in the floor surface of the passage onto the floor of the passage. After cooling the equipment accommodated in the rack, the air flows through the space above the rack and is sucked into the air conditioner again, and at least one rack in the rack group includes an upper portion of the casing. A configuration is disclosed in which a wraparound prevention wall (plate material) protruding outward from the casing is provided in the vicinity of the edge on the front side.
Further, Patent Document 2 is an equipment storage rack for storing information processing equipment, a rack main body that supports the information processing equipment, a cold air introduction section that maintains the wind pressure of the cold air, and introduces cold air into the rack main body, A configuration of an equipment storage rack is disclosed that includes a wind pressure adjusting unit that is arranged in the cold air introducing unit and opens the wind pressure in the cold air introducing unit to the exhaust side.

JP 2004-184070 A JP 2007-316989 A

Any of the above configurations is based on the premise of air cooled by an air conditioning system for cooling the entire computer room, and aims to efficiently supply the cold air to a rack group containing electronic devices.
However, in recent years, the amount of heat generated during the use of these electronic devices has been increasing, and it is not efficient to cool the entire computer room to cool the electronic devices. Therefore, a more efficient electronic device cooling method is required. In addition, since the density of electronic devices is becoming higher and higher, attempts to increase the number of electronic devices may exceed the air conditioning capability of existing air conditioning systems, and it is not easy to cope with this.
Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to minimize the load on the air conditioning system with respect to the entire computer room and the like, and to store the electronic equipment stored in the rack group. An object of the present invention is to provide an apparatus and a method for efficiently cooling equipment.

In order to solve the above problems, according to an aspect of the present invention, a plurality of electronic device storage racks having electronic devices therein are installed in a plurality of rows, and the rows of the electronic device storage racks facing each other are arranged. A cooling device for an electronic equipment storage rack group arranged such that a passage formed between the cooling air passage and the warm air passage is alternately formed, and is located at both ends of the warm air passage and shields the warm air passage A wall body, a ceiling body that is located above the warm air passage and shields the warm air passage, and a heat exchanger that cools the air, and the heat exchanger is discharged to the warm air passage and has a side surface 2 An electronic apparatus that cools warm air isolated in a warm air space formed by surrounding each of the rows, the wall body, and the upper surface with the ceiling body, and discharges cool air to the outside of the warm air space Cooling device for storage rack group provided It is.
According to this configuration, it is possible to minimize the load on the air conditioning system with respect to the entire computer room and to efficiently cool the electronic devices housed in the rack group.

The heat exchanger may take in the warm air through an opening of the ceiling body.
According to this configuration, warm air can be efficiently recovered.

The heat exchanger may be arranged above the warm air passage.
According to this configuration, cooling can be performed in the vicinity of the warm air, and equipment such as a pipe for carrying the warm air from the warm air space to the heat exchanger becomes unnecessary.

The heat exchanger may be arranged above the row.
According to this structure, while being able to cool near warm air, facilities, such as a pipe for conveying the air which the heat exchanger cooled out of warm air space, become short.

The heat exchanger may discharge the cold air to the cold air passage.
According to this configuration, the air cooled by the heat exchanger can be directly supplied to the cold air passage.

Further, the discharge to the cold air passage may be performed from the upper side to the lower side of the cold air passage.
According to this configuration, the air cooled by the heat exchanger can be directly supplied to the electronic device storage rack group.

In addition, the intake of the warm air may be performed by a fan.
According to this configuration, the warm air in the warm air space can be strongly supplied to the heat exchanger.

The cool air may be discharged by a fan.
According to this configuration, the cool air cooled by the heat exchanger can be strongly supplied to the cool air passage or the like.

  The heat exchanger may be a water-cooled heat exchanger.

  The heat exchanger may be a refrigerant heat exchanger.

  According to another aspect of the present invention, a plurality of electronic device storage racks having electronic devices therein are installed so as to form a plurality of rows, and are formed between the rows of the opposing electronic device storage racks. A cooling method for an electronic equipment storage rack group that is arranged so that a cold air passage and a warm air passage are alternately formed, and is discharged to the warm air passage, and the side faces of the two rows and both ends of the warm air passage The wall that shields the warm air passage located at the top and the ceiling that is located above the warm air passage with the upper surface shielded from the warm air passage are cooled in the warm air space that is surrounded by the wall. Thereafter, a cooling method of the electronic device storage rack group is provided, wherein the cool air is discharged out of the warm air space.

  As described above, according to the present invention, the entire computer room is isolated by isolating the warm air heated by the electronic equipment and discharged into the warm air passage, and after cooling the warm air, the cool air is discharged to the computer room. It is possible to provide an apparatus and a method for minimizing the load on the air conditioning system and efficiently cooling the electronic equipment stored in the rack group.

The sectional view in the 1st embodiment of the present invention, and the figure showing the flow of air. Explanatory drawing explaining the flow of the air in the computer room to which 1st Embodiment of this invention is applied. The side view in 1st Embodiment of this invention. The front view in 1st Embodiment of this invention. The top view in 1st Embodiment of this invention. The perspective view in 1st Embodiment of this invention. Sectional drawing and the figure which showed the flow of air in 2nd Embodiment of this invention. Sectional drawing and the figure which showed the flow of air in 3rd Embodiment of this invention. The side view in 3rd Embodiment of this invention. The front view in 3rd Embodiment of this invention. The top view in 3rd Embodiment of this invention. The perspective view in 3rd Embodiment of this invention. Sectional drawing and the figure which showed the flow of air in 4th Embodiment of this invention. The figure showing the heat exchanger in one Embodiment of this invention. Explanatory drawing explaining the flow of the air in the computer room to which a prior art is applied.

Below, the apparatus etc. which concern on each embodiment of this invention are demonstrated, referring drawings.
First, based on FIG. 15, the flow of air in a computer room using a conventional technique will be described. FIG. 15A is a plan view of the computer room, and FIG. 15B is a cross-sectional view of the elevation surface of the computer room.
The computer room 30 is provided with an air conditioning system 34 to cool the entire computer room 30. In particular, the cold air cooled by the air conditioning system 34 is jetted into the underfloor space 33 below the floor 31 where the electronic equipment and the electronic equipment storage rack are installed, and the underfloor space 33 is filled with the cold air with a positive pressure. Therefore, the cold air is ejected upward from the floor opening 32.

  Further, in the computer room 30, the electronic equipment storage racks 21 are arranged in a row in order to efficiently arrange the racks indoors. The electronic device storage rack 21 normally draws in cool air from the front surface and discharges warm air heated by the electronic device from the back surface. Therefore, when the electronic device storage rack group 20 including the electronic device storage racks 21 arranged in a row is arranged so as to be parallel to each other, in order to enhance the cooling effect of the electronic device storage racks 21, The floor opening 32 to be ejected is disposed on both sides with the front face facing the passage. Then, the back side of the electronic device storage rack 21 that discharges warm air is also arranged to face the back side of the electronic device storage rack 21 of the adjacent electronic device storage rack group 20. As a result, in the computer room 30, the passage having the floor opening 32 from which the cold air blows, that is, the cold air passage 2 and the warm air passage 3 through which the electronic device storage rack groups 20 on both sides discharge warm air alternately appear. Become.

The warm air discharged to the warm air passage 3 rises and reaches the vicinity of the ceiling of the computer room 30, and then the air conditioning system 34 sucks the warm air from the upper part of the wall surface or the opening of the ceiling (not shown). By cooling, it becomes cold air again and circulates in the computer room 30.
In this way, if the cool air passage and the warm air passage are clearly separated, the cool air and the warm air are less mixed, so that the air cooled using the air conditioning system can be efficiently supplied to the electronic device.

  However, when the calorific value is increased due to higher density of electronic devices, it is not easy to enhance the air conditioning capability of the air conditioning system 34 that cools the computer room 30. In addition, it can be said that the warm air passage 3 and the cold air passage 2 are separated, and the warm air enters the cooling passage 2, or the cold air is sucked into the air conditioning system 34 without cooling the electronic device storage rack 20, thereby reducing the cooling efficiency. Sometimes.

<First Embodiment>
FIG. 1 is a cross-sectional view and an air flow diagram according to an embodiment of the present invention. As a result of the cold air cooled by the air conditioning system 34 being blown out to the underfloor space 33, the cold air is blown upward from the floor opening 32 to form the cold air passage 2 as in FIG. Moreover, the place where such a cool air passage 2 and a warm air passage 3 appear alternately is the same.

However, in the present embodiment, the warm air passage 3 includes the ceiling body 12 that covers the upper surface of the warm air passage 3 and the back surface of the electronic device storage rack group 20 that forms a side surface on the long side of the warm air passage 3 (in the drawing, since it is a cross section, The other side of the electronic device storage rack 21 and the wall body 11 having a side surface at the short side of the warm air passage 3 are blocked from each other, thereby forming a warm air space 10 that is a closed space. (Of course, the bottom surface of the warm air space 10 is shielded by the floor 31.)
The cold air blown out from the floor opening 32 forms the cold air passage 2. The cold air is sucked from the front surface of the electrical equipment storage rack 21 to cool the internal electronic equipment. The warm air that has cooled and heated the electronic device is discharged from the back surface of the electronic device storage rack 21, and the discharged warm air is confined in the warm air space 10 that is a closed space.

  The ceiling body opening 121 provided in the ceiling body 12 corresponds to the fan unit 13 and serves as a path for warm air that the fan unit 13 sucks out. In the present embodiment, the fan unit 13 is a propeller type axial fan. The total air volume of the fan unit 13 installed for one warm air space 10 is preferably substantially the same as or larger than the total air volume discharged to the warm air space 10 by the electronic equipment storage rack that constitutes the warm air space 10. .

The warm air sucked out from the warm air space 3 by the fan unit 13 goes to the heat exchanger 14 and is cooled while passing through the heat exchanger 14. That is, the warm air heated by the electronic device is not discharged into the computer room 30 as it is, but only the air cooled by the heat exchanger 14 is surely discharged.
As a result, even when the calorific value is increased by increasing the density of the electronic equipment or when the electronic equipment is to be strengthened, the air conditioning system 34 for cooling the computer room 30 is not enhanced in air conditioning capability. It is possible to deal with such a situation. Further, since the warm air passage 3 is shielded from the other spaces by the warm air space 10, the warm air does not enter the cooling passage 2 and the cooling efficiency is not lowered.
The heat exchanger 14 preferably cools the warm air to a temperature as close as possible to the cool air in the cool air passage 2. If it does so, the load to the air conditioning system 34 which the computer room 30 cools will decrease.

  The air cooled by the heat exchanger 14 is discharged upward in the ceiling direction. Then, it is again sucked and cooled by the air conditioning system 34 and circulates in the computer room 30.

  In addition, in embodiment of this invention, warm air is shielded and the warm space 10 is formed. On the other hand, it is conceivable that the cool air is shielded by the cool air passage and the cool air cooled by the air conditioning system is supplied to the electronic device storage rack without being mixed with the warm air. This approach avoids warm air being mixed with cold air and reducing cooling efficiency. However, once the warm air diffuses into the computer room, it is the air conditioning system 34 that cools it. As described above, it is difficult to cope with an increase in the amount of heat generated by the electronic device and an increase in the electronic device.

FIG. 2 is an explanatory diagram for explaining the flow of air in a computer room to which an embodiment of the present invention is applied. (A) is a plan view of the computer room, and (b) is an elevation view of the computer room. It is sectional drawing.
Compared with FIG. 15, the electronic device storage rack groups 20 are arranged in parallel, and the cold air passage 2 and the warm air passage 3 appear alternately between the electronic device storage rack groups 20. The difference is that the warm air passage 3 is shielded by the cooling device 1 of the electronic device storage rack group and the warm air space 10 is formed. The warm air heated by the electronic device storage rack group 20 is confined in the warm air space 10, and the cooling device 1 of the electronic device storage rack group cools the warm air and is then discharged into the computer room 30. Therefore, the load on the air conditioning system 34 in the computer room 30 can be reduced.

FIG. 3 is a side view of an embodiment of the present invention.
The wall body 11 exists so that the side surface of the electronic device storage rack 21 located at the end of each electronic device storage rack group 20 may be connected, and the wall body 11 has no gap with the side surface body 24 of the electronic device storage rack 21. It is preferable to be installed as described above. As a result, the wall 11 shields warm air on the short side surface of the warm air passage 3. Moreover, the ceiling body 12 is installed so as to straddle the electronic device storage rack groups 20 on both sides, and the ceiling body 12 shields warm air on the upper surface of the warm air passage 3. In addition, the cooling device 1 of the electronic device storage rack group is installed on the ceiling body 11. As a result, the cooling device 1 of the electronic equipment storage rack group and the heat exchanger 14 provided therein are disposed above the warm air passage 3.
In consideration of the weight of the cooling device 1 of the electronic device storage rack group, it is preferable that both ends of the lower portion of the cooling device 1 of the electronic device storage rack group are over the upper portion of the electronic device storage rack group 20.

FIG. 4 is a front view of an embodiment of the present invention.
The front of the electronic device storage rack 21 is usually provided with a rack front door 23. The rack front door 23 is usually provided with an opening (not shown) such as a slit shape or a mesh shape for sucking cold air from the cold air passage 2, but sucks cold air from under the floor to front the internal electronic device. It is not necessary to prepare for supplying cold air. As described above, the wall body 11 positioned at the end of the warm air passage 3 is installed so that there is no gap in the side body 24 of the electronic device storage rack 21. A ceiling body 12 is installed over the entire electronic equipment storage rack group 20, and the ceiling body 12 shields warm air on the upper surface of the warm air passage 3. In addition, the cooling device 1 of the electronic device storage rack group is installed on the ceiling body 11 corresponding to the number of electronic device storage racks 21. Accordingly, if the number of electronic device storage racks 21 in the electronic device storage rack group 20 increases, the number of cooling devices 1 in the electronic device storage rack group may be increased accordingly.
In this figure, one electronic device storage rack group 20 includes five electronic device storage racks 21, but of course it is not limited to this. Further, the number of cooling devices 1 in one electronic device storage rack group need not be the same as the number of electronic device storage racks 21 in the same electronic device storage rack group.

FIG. 5 is a plan view of an embodiment of the present invention.
The cooling device 1 of the electronic device storage rack group is installed so as to straddle the two rows of electronic device storage rack groups 20. In addition, as described above, the cooling device 1 of the electronic device storage rack group is installed corresponding to the number of electronic device storage racks 21. A heat exchanger 14 is provided above the cooling device 1 of the electronic equipment storage rack group, and a cover is preferably provided on the upper surface thereof.

FIG. 6 is a perspective view of one embodiment of the present invention.
There is a cooling passage 2 in front of the electronic equipment storage rack group 20, and the electronic equipment storage rack 21 takes in cool air from the rack front door 23 and the like to cool the internal electronic equipment. The back surface of the electronic device storage rack group 20 forms a warm air space shielded by the two electronic device storage rack groups 20, the wall body 11, and the ceiling body 12. The cooling device 1 of the electronic device storage rack group is installed on the ceiling body 12, takes warm air from an opening (not shown) of the ceiling body, cools it with the internal heat exchanger 14, and the electronic device storage rack group. It is discharged above the cooling device 1.

<Second Embodiment>
FIG. 7 is a cross-sectional view and a diagram showing the air flow in one embodiment of the present invention.
Compared to the first embodiment of FIG. 1, the structure above the ceiling body such as the cooling device 1A of the electronic device storage rack group according to the present embodiment is different.
The ceiling body opening 121A provided in the ceiling body 12A corresponds to the fan unit 13A and serves as a path for warm air from which the fan unit 13A sucks warm air. In the present embodiment, the fan unit 13A is a sirocco fan. The static pressure is high and the warm air can be reliably conveyed from the warm air space 10 to the heat exchanger 14A. In this embodiment, the sirocco fan is used. However, the present invention is not limited to this, and a fan having another structure such as a centrifugal fan or a mixed flow fan may be used. The total air volume of the fan unit 13 </ b> A installed for one warm air space 10 is preferably substantially the same as or larger than the total air volume discharged to the warm air space 10 by the electronic device storage rack constituting the warm air space 10. .
By adopting such a configuration, the same effect as the first embodiment can be obtained.

<Third Embodiment>
FIG. 8 is a cross-sectional view and an air flow diagram according to an embodiment of the present invention.
Compared with the first embodiment in FIG. 1 and the second embodiment in FIG. 7, the structures of the cooling device 1 </ b> B and the ceiling body 12 </ b> B of the electronic device storage rack group according to the present embodiment are different.
The cooling device 1B of the electrical equipment storage rack group in the present embodiment is configured to guide the warm air in the warm air passage 3 toward the cool air passage 2 while cooling it. As a result, the cooled air is directly brought into the cool air passage 2, whereby the load on the air conditioning system 34 for cooling the computer room 30 can be reduced.

The warm air is cooled from the ceiling body opening 121B of the ceiling body 12B provided at the upper part of the warm air space 10 by the positive pressure due to the exhaust of the electronic device 22 and the negative pressure due to the intake air of the fan unit 13B. It is guided toward the fan unit 13B provided at both ends of the apparatus 1B. A heat exchanger 14B is provided on the way from the ceiling body opening 121B to the fan unit 13B, and the warm air is cooled by passing through the heat exchanger 14B. In FIG. 8, one heat exchanger 14B is provided on each of the left and right sides of the ceiling body opening 121B. However, the heat exchanger 14B is not limited to this, and a plurality of heat exchanges are performed on the way from the ceiling body opening 121B to the fan unit 13B. The heat exchanger 14 </ b> B may be provided, and the heat exchanger 14 is disposed above the electronic device storage rack group 20. Further, in the present embodiment, one fan unit is provided, but a plurality of fan units 13B may be provided when it is desired to exhaust warm air more strongly.
As a result, even if the density of the electronic device 22 increases and the amount of heat generated increases, the cooling capacity can be increased by increasing the number of the heat exchangers 14B in the route. Then, the temperature of the cold air discharged from both ends of the cooling device 1B of the electronic device storage rack group can be made substantially the same as the temperature of the cold air discharged by the air conditioning system 34. Even if the cool air cooled by the cooling device 1B is directly discharged to the cool air passage 2, the temperature of the cool air sucked by the electric device 10 at the upper part of the electronic device storage rack 21 and the temperature of the cool air sucked by the electronic device 10 at the lower part are different. Can be almost the same.

FIG. 9 is a side view of an embodiment of the present invention.
Instead of a wall, there is a passage side door 11B so as to connect the side surfaces of the electronic device storage racks 21 positioned at the ends of the respective electronic device storage rack groups 20, and this passage side door 11B is an electronic device storage rack. It is preferable to install so that there is no gap with the side body 24 of 21. As a result, the passage side door 11 </ b> B shields warm air on the short side surface of the warm air passage 3. The passage side door 11B is composed of two sliding doors that are separated at the center of the passage. By opening the sliding door to the left and right, personnel can easily enter the warm air passage 3 for maintenance of the electronic equipment 22 or the like. it can. Warm air can be shut off by closing the sliding door during normal operation. In addition, although the sliding door was used in the present Example, you may have other door structures, such as a hinged door.

Further, a ceiling body 12B is installed so as to cover the warm air passage 3 and the electronic device storage rack groups 20 on both sides, and the ceiling body 12B shields the warm air on the upper surface of the warm air passage 3. In addition, the cooling device 1B of the electronic device storage rack group is installed on the electronic device storage rack group 20 and the ceiling body 11B on both sides.
A fan unit 13B for discharging the cool air to the cool air passage 2 is provided at the end of the cooler 1B of the electronic device storage rack group on the cool air passage 2 side. In order to supply, it has a form inclined downward.

FIG. 10 is a front view of an embodiment of the present invention.
The front surface of the electronic device storage rack 21 is the same as the other embodiments in that a normal rack front door 23 is provided. As described above, the passage side door 11 </ b> B positioned at the end of the warm air passage 3 is installed so that there is no gap in the side body 24 of the electronic device storage rack 21.

In addition, a ceiling body 12 </ b> B is installed over the entire electronic device storage rack group 20, and the ceiling body 12 </ b> B shields warm air also on the upper surface of the warm air passage 3. Moreover, the cooling device 1B of the electronic device storage rack group is installed on the electronic device storage rack group 20 and the ceiling body 11B corresponding to the number of electronic device storage racks 21. Thus, if the number of electronic device storage racks 21 in the electronic device storage rack group 20 increases, the number of cooling devices 1B in the electronic device storage rack group may be increased accordingly.
In FIG. 10, one electronic device storage rack group 20 includes five electronic device storage racks 21. However, the present invention is not limited to this. Further, the number of cooling devices 1B in one electronic device storage rack group need not be the same as the number of electronic device storage racks 21 in the same electronic device storage rack group.

  Above the electronic device storage rack group 20, there is an end portion on the cold air passage 2 side of the cooling device 1B of the electronic device storage rack group, and a fan unit 13B for discharging the cold air to the cold air passage 2 is provided at the end portion. Provided. The fan unit 13 </ b> B can supply cold air to openings (not shown) such as slits and meshes provided in the rack front door 23 by discharging the cold air downward.

FIG. 11 is a plan view of an embodiment of the present invention.
The cooling device 1 </ b> B of the electronic device storage rack group is installed so as to cover the warm air passage 3 and the entire two rows of electronic device storage rack groups 20. Further, as described above, the cooling device 1 </ b> B of the electronic device storage rack group is installed corresponding to the number of electronic device storage racks 21.

FIG. 12 is a perspective view of one embodiment of the present invention.
There is a cooling passage 2 in front of the electronic equipment storage rack group 20, and the electronic equipment storage rack 21 takes in cool air from the rack front door 23 and the like to cool the internal electronic equipment. The back surface of the electronic device storage rack group 20 forms a warm air space shielded by the two electronic device storage rack groups 20, the passage side door 11B, and the ceiling body 12B. The cooling device 1B of the electronic equipment storage rack group is installed on the ceiling body 12B, takes in warm air from an opening (not shown) of the ceiling body, cools it with an internal heat exchanger 14B, Cold air is discharged from the fan unit 13 </ b> B provided at the end toward the lower side of the cold air passage 2.

<Fourth embodiment>
FIG. 13 is a cross-sectional view and an air flow diagram according to an embodiment of the present invention.
Compared with the third embodiment of FIG. 8, the form for discharging the cool air to the cool air passage 2 at the end of the cooler 1 </ b> C of the cooling apparatus 1 </ b> C of the electronic device storage rack group according to this embodiment is different. In order to supply cool air to the cool air passage 2 more efficiently, the air is discharged directly below. Note that the fan unit 13C provided at the end of the cooling device 1C of the electronic device storage rack group according to the present embodiment on the cold air passage 2 side is a sirocco fan. The direction of air flow can be bent at a right angle. In this embodiment, the sirocco fan is used. However, the present invention is not limited to this, and a fan having another structure such as a centrifugal fan or a mixed flow fan may be used. The fan unit 13C discharges the cold air toward the cold air passage 2 directly below, so that the rack front door, which is normally provided toward the cold air passage 2 of the electronic equipment storage rack 21, has a slit shape at the top, Cold air can be directly supplied to openings (not shown) such as a mesh shape.

Similarly to the third embodiment, a heat exchanger 14C is provided on the way from the ceiling body opening 121C to the fan unit 13C, and the warm air is cooled by passing through the heat exchanger 14C. In FIG. 13, one heat exchanger 14 </ b> C is provided on each of the left and right sides of the ceiling body opening 121 </ b> C. However, the heat exchanger 14 </ b> C is not limited to this, and a plurality of heat exchanges are performed on the way from the ceiling body opening 121 </ b> C to the fan unit 13 </ b> C. A heat exchanger 14 </ b> C may be provided, and the heat exchanger 14 </ b> C is disposed on the electronic device storage rack group 20.
As a result, even when the density of the electronic device 22 increases and the amount of heat generated increases, the cooling capacity can be increased by increasing the number of the heat exchangers 14C in the route. Then, the temperature of the cold air discharged from both ends of the cooling device 1C of the electronic device storage rack group can be made substantially the same as the temperature of the cold air discharged by the air conditioning system 34. Even if the cold air cooled by the cooling device 1C is directly supplied to the electronic device 22 in the electronic device storage rack 21, the temperature of the cold air sucked by the electric device 10 in the upper part of the electronic device storage rack 21 and the electronic device 10 in the lower part The temperature of the cold air sucked in can be made almost the same.

FIG. 14 is a diagram illustrating a heat exchanger according to an embodiment of the present invention.
It is a figure showing heat exchanger 14C in one embodiment. Although comprised from a fin-type heat sink, it is not limited to this. Each heat exchanger 14C is provided with a heat exchanger supply pipe 142 and a heat exchanger discharge pipe 141, and a supply pipe and a discharge pipe (not shown) connected to a cooler (not shown) provided in the computer room 30, respectively. (Not shown). The supply pipe and the discharge pipe are usually arranged through the underfloor space 33 and the floor opening 32. In addition, what is supplied by this supply pipe is a liquid or gas that can be a heat exchange medium such as water or a refrigerant.
Preferably, a temperature measuring unit is provided on the cold air discharge surface side when this heat exchanger 14C is installed (not shown). Thereby, the temperature of the cold air cooled by the heat exchanger 14C can be measured.

1 Cooling device for electronic device storage rack group 1A Cooling device for electronic device storage rack group 1B Cooling device for electronic device storage rack group 2 Cold air passage 3 Warm air passage 10 Warm air space 11 Wall body 11B Passage side door 11C Passage side door 12 Ceiling body 12A Ceiling body 12B Ceiling body 12C Ceiling body 121 Ceiling body opening 121A Ceiling body opening 121B Ceiling body opening 121C Ceiling body opening 13 Fan unit 13A Fan unit 13B Fan unit 13C Fan unit 14 Heat exchanger 14A Heat exchanger 14B Heat exchanger 14C Heat exchanger 141 Heat exchanger discharge pipe 142 Heat exchanger supply pipe 20 Electronic equipment storage rack group 21 Electronic equipment storage rack 22 Electronic equipment 23 Rack front door 24 Rack side body 30 Computer room 31 Floor 32 Floor opening Part 33 Underfloor space 34 Air conditioning system 40 Air flow

Claims (11)

A plurality of electronic device storage racks having electronic devices therein are installed in a plurality of rows, and a passage formed between the rows of the electronic device storage racks facing each other is alternately a cold air passage and a warm air passage. A cooling device for a group of electronic equipment storage racks arranged to form,
Wall bodies that are located at both ends of the warm air passage and shield the warm air passage;
A ceiling body that is located above the warm air passage and shields the warm air passage;
A heat exchanger for cooling the air,
The heat exchanger cools the warm air that is discharged into the warm air passage and is isolated in a warm air space that is formed by the side surfaces surrounded by the two rows and the wall body and the upper surface by the ceiling body, A cooling device for an electronic equipment storage rack group, wherein cool air is discharged outside the warm air space.   The cooling device according to claim 1, wherein the heat exchanger takes in the warm air through an opening of the ceiling body.   The cooling device according to claim 1, wherein the heat exchanger is disposed above the warm air passage.   The cooling device according to claim 1, wherein the heat exchanger is disposed above the row.   The cooling device according to claim 1, wherein the heat exchanger discharges the cold air to the cold air passage.   6. The cooling device according to claim 5, wherein the discharge to the cold air passage is performed from the upper side to the lower side of the cold air passage.   The cooling apparatus according to claim 1, wherein the intake of the warm air is performed by a fan.   The cooling apparatus according to claim 1, wherein the cooling air is discharged by a fan.   The cooling device according to claim 1, wherein the heat exchanger is a water-cooled heat exchanger.   The cooling device according to claim 1, wherein the heat exchanger is a refrigerant heat exchanger. A plurality of electronic device storage racks having electronic devices therein are installed in a plurality of rows, and a passage formed between the rows of the electronic device storage racks facing each other is alternately a cold air passage and a warm air passage. A cooling method for a group of electronic equipment storage racks arranged to form,
A ceiling body that is discharged to the warm air passage, has a side surface positioned at both ends of the two rows and the warm air passage and shields the warm air passage, and an upper surface is located above the warm air passage and shields the warm air passage A cooling method for an electronic device storage rack group, wherein after cooling the warm air isolated in the warm air space formed by being surrounded by each, the cool air is discharged outside the warm air space.