JP2011134700A - Resistance temperature fuse package and resistance temperature fuse - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resistance temperature fuse package and a resistance temperature fuse, capable of contributing to improvement of operational characteristics. <P>SOLUTION: The resistance temperature fuse 1 has a base plate 4, a pair of base bodies 5 arranged on the base plate 4, a temperature fuse element 3 arranged on the base plate 4 and arranged on narrowed zones of the pair of base plates 4 viewed in a plane, and a heat-generating resistor 6 arranged on the base plate 4 and arranged by spacing out from the temperature fuse element 3 at a zone overlapped with the temperature fuse element 3 viewed in a plane. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a resistance temperature fuse package in which a temperature fuse element is mounted, and a resistance temperature fuse that heats a heating resistor based on an external signal and blows the temperature fuse element due to the temperature of the heating resistor About.

  In recent years, developments have been made to improve the operating characteristics of resistance temperature fuse packages and resistance temperature fuses (see, for example, Patent Document 1).

JP-A-11-96871

  In the development of resistance thermal fuses, there is a need for improved operating characteristics that efficiently transmit the temperature of the heating resistor to the thermal fuse element. The present invention has been made in view of the above, and an object of the present invention is to provide a resistance temperature fuse package and a resistance temperature fuse that can contribute to improvement of operating characteristics.

  A resistance thermal fuse according to an embodiment of the present invention includes a substrate, a pair of bases provided on the substrate, and a thermal fuse provided on the substrate and provided in a region sandwiched between the pair of bases as seen in a plan view. And an exothermic resistor provided on the substrate and in a region that overlaps with the thermal fuse element in a plan view and is provided to be spaced from the thermal fuse element.

  A resistance thermal fuse package according to an embodiment of the present invention includes a substrate having a mounting surface on which a thermal fuse element is mounted, a pair of bases provided on the substrate, and provided on the substrate. And a heating resistor provided in a region overlapping with the mounting surface and spaced from the mounting surface.

  ADVANTAGE OF THE INVENTION According to this invention, the resistance temperature fuse package and resistance temperature fuse which can contribute to the improvement of an operating characteristic can be provided.

It is a perspective view which shows the general view of the resistance temperature fuse which concerns on this embodiment. It is sectional drawing of the resistance thermal fuse along X-X 'of FIG. FIG. 2 is a cross-sectional view of a resistance temperature fuse taken along Y-Y ′ in FIG. 1. It is a permeation | transmission perspective view of the board | substrate which shows the heating resistor of the resistance temperature fuse which concerns on this embodiment. It is a perspective view which shows the state which joined the resistance temperature fuse and support body which concern on this embodiment. It is a perspective view which shows the external appearance of the resistance temperature fuse which concerns on one modification. FIG. 7 is a cross-sectional view of a resistance temperature fuse taken along Z-Z ′ in FIG. 6. It is sectional drawing of the resistance temperature fuse which concerns on one modification. It is sectional drawing of the resistance temperature fuse which concerns on one modification. It is a perspective view which shows the state which joined the resistance temperature fuse and support body which concern on one modification.

  Embodiments of a resistance temperature fuse according to the present invention will be described below with reference to the accompanying drawings. In addition, this invention shall not be limited to the following embodiment.

<Schematic configuration of resistance thermal fuse>
FIG. 1 is a schematic perspective view of a resistance thermal fuse according to the present embodiment, which is a transmission of flux covering a thermal fuse element. 2 is a cross-sectional view of the resistance thermal fuse taken along the line XX ′ of FIG. FIG. 3 is a cross-sectional view of the resistance temperature fuse taken along YY ′ of FIG. FIG. 4 is a transparent perspective view of the substrate showing the heating resistor of the resistance temperature fuse.

  The resistance temperature fuse of this embodiment is used as a circuit protection element, and is incorporated in a specific circuit together with an abnormality detector. When a circuit abnormality occurs, the abnormality detector detects the circuit abnormality and energizes the heating resistor. As a result, the resistance temperature fuse is a circuit in which the operation of the circuit is urgently stopped by fusing the temperature fuse element by the temperature of the heating resistor.

  The resistance thermal fuse 1 according to this embodiment includes a resistance thermal fuse package 2 and a thermal fuse element 3 mounted on the resistance thermal fuse package 2.

  Further, the resistance thermal fuse package 2 according to the present embodiment is provided on the substrate 4 having the mounting surface R on which the thermal fuse element 3 is mounted, a pair of bases 5 provided on the substrate 4, and the substrate 4. The heating resistor 6 is provided in a region overlapping the mounting surface R and spaced from the mounting surface R.

  The substrate 4 is an insulating substrate and is made of, for example, a ceramic material such as alumina, mullite, or aluminum nitride, or a glass ceramic material. Or it consists of a composite material which mixed several materials among these materials. In addition, the thickness of the board | substrate 4 is set to 0.05 mm or more and 2 mm or less, for example. The thermal conductivity of the substrate 4 is set to, for example, 14 W / m · K or more and 200 W / m · K or less.

  An electrode layer 7 that is electrically connected to the thermal fuse element when the thermal fuse element 3 is mounted is formed on the upper surface of the substrate 4. A part of the electrode layer 7 is formed from the upper surface of the substrate 4 to the lower surface of the substrate 4 via the side surface of the substrate 4. In the present embodiment, the electrode layer 7 is formed so that the electrode layer 7 is electrically open when the thermal fuse element 3 is blown. The electrode layer 7 is electrically connected to the thermal fuse element 3 and is formed in an arbitrary pattern. The width of the electrode layer 7 is set to, for example, 0.05 mm or more and 10 mm or less. Here, the width of the electrode layer 7 refers to the width in the direction orthogonal to the direction of current flowing in the electrode layer 7.

  The electrode layer 7 is made of, for example, a metal material such as tungsten, molybdenum, nickel, copper, silver, gold, or aluminum, an alloy thereof, a composite material obtained by mixing a plurality of these materials, or a material thereof. It consists of a composite layer.

A pair of base bodies 5 that support the substrate 4 are provided on the lower surface of the substrate 4. The base 5 serves as a foundation when the resistance temperature fuse 1 is provided in an external circuit. Since the base 5 serves as a base for bonding with an external circuit, heat transmitted from the external circuit can be made difficult to be transmitted to the substrate 4 provided on the base 5, and the resistance temperature fuse of the resistance temperature fuse due to the external temperature influence can be prevented. The temperature rise characteristic of the resistance temperature fuse can be improved by suppressing malfunction and making it difficult for the heat generated when the resistor of the resistance temperature fuse generates heat to be transmitted to an external circuit.

  The substrate 5 is made of, for example, a ceramic material such as alumina or mullite, a glass ceramic material, or plastic. Or it consists of a composite material which mixed several materials among these materials. In addition, the thickness of the base | substrate 5 is set to 0.05 mm or more and 2 mm or less, for example. The thermal conductivity of the substrate 5 is set to, for example, 14 W / m · K or more and 200 W / m · K or less.

  Note that the base body 5 has a reduced heat conduction by reducing the heat transfer cross-sectional area of the base body 5 by means of, for example, providing a notch corresponding to the height of the base body 5 in the longitudinal direction of the base body 5, The thermal conductivity of the base 5 by means such as reducing the thermal conductivity of the base 5 by using a material having a thermal conductivity smaller than that of the substrate 4 or a closed pore-containing material that is the same material as the substrate 4. If the means for reducing the temperature is selected, the heat transmitted from the external circuit can be made difficult to be transmitted to the substrate 4, and the heat generated by the heating resistor 6 can be easily transmitted to the thermal fuse element 3 through the substrate 4. .

  A conductive layer 8 is formed on the lower surface of the substrate 5. The conductive layer 8 is formed from the lower surface of the substrate 5 to the upper surface of the substrate 5 through the side surface of the substrate 5. By detecting the abnormality of the circuit by the abnormality detector incorporated in the circuit together with the resistance temperature fuse 1, the heating resistor 6 is energized through the conductive layer 8 to increase the temperature of the heating resistor 6. Furthermore, the temperature fuse element 3 can be blown due to the temperature of the heating resistor 6. The width of the conductive layer 8 is set to 0.05 mm or more and 10 mm or less, for example. Here, the width of the conductive layer 8 refers to the width in the direction orthogonal to the direction of the current flowing through the conductive layer 8.

  The conductive layer 8 is made of, for example, a metal material such as tungsten, molybdenum, nickel, copper, silver, gold, or aluminum, an alloy thereof, a composite material in which a plurality of materials are mixed, or a composite layer of these materials.

  A thermal fuse element 3 is mounted on the upper surface of the substrate 4. The thermal fuse element 3 is blown when the temperature exceeds a specific temperature. The thermal fuse element 3 is made of, for example, a conductive material such as indium, bismuth, or tin, or a mixed material thereof. Further, the melting point at which the thermal fuse element 3 melts is set to, for example, 80 ° C. or higher and 180 ° C. or lower.

  The thermal fuse element 3 is provided in a region overlapping with the heating resistor 6 when viewed through, and is formed in a rectangular shape. Further, when the thermal fuse element 3 is provided so as not to protrude from the region where the heating resistor 6 is present when seen through, the temperature of the heating resistor 6 can be efficiently transmitted to the thermal fuse element 3. . The thickness of the thermal fuse element 3 is, for example, not less than 0.1 mm and not more than 3 mm, and the length of one side when viewed in plan is set, for example, not less than 0.1 mm and not more than 10 mm.

  On the substrate 4, as shown in FIG. 2, a coating layer 9 is formed in a part of the region overlapping with the thermal fuse element 3. The covering layer 9 is formed on the mounting surface R on which the thermal fuse element 3 of the substrate 4 is mounted. The covering layer 9 is a wettability material whose wettability with the melt of the thermal fuse element 3 is smaller than the wettability of the thermal fuse element mounting surface R formed on the upper surface of the substrate 4, for example, glass or fluorine. Made of resin or other material.

  The mounting surface R is for facilitating the wetting of the melt of the material constituting the thermal fuse element 3 when the thermal fuse element 3 is melted, and is a part of the thermal fuse element 3 melted on the coating layer 9. This makes it difficult for the part to adhere. As for the mounting surface R, the melt of the material constituting the thermal fuse element 3 melted on the mounting surface R gets wet, and the melt of the material constituting the thermal fuse element 3 on the coating layer 9 is caused by the surface tension action of the melt. The absorbing action makes it difficult for the molten material of the material constituting the thermal fuse element 3 to remain and adhere to the coating layer 9, thereby electrically opening the pair of electrode layers 7 positioned immediately below the thermal fuse element 3. be able to.

  A heating resistor 6 is formed on the lower surface of the substrate 4 as shown in FIG. The heating resistor 6 transmits the temperature of heat generated to the thermal fuse element 3 and melts the thermal fuse element 3. The heating resistor 6 is a region that overlaps the thermal fuse element 3 in a plan view, and is provided via the thermal fuse element 3 and the substrate 4.

  The heating resistor 6 has one end connected to the electrode layer 7 and the other end connected to the conductive layer 8. The heating resistor 6 has a resistance value for securing a required amount of heat generation. As an example of the resistance value securing method, the pattern shape is bent many times on the lower surface of the substrate 4. Yes. The width of the heating resistor 6 is set smaller than the widths of the electrode layer 7 and the conductive layer 8. By making the width of the heating resistor 6 smaller than the width of the electrode layer 7 and the conductive layer 8, the electrical resistance of the heating resistor 6 is increased, and the control of Joule heat generated in the heating resistor 6 portion is easy. can do.

  The heating resistor 6 is energized to the heating resistor 6 through the conductive layer 8 by detecting an abnormality of the circuit by an abnormality detector incorporated in the circuit together with the resistance temperature fuse. And since the electrical resistance of the heating resistor 6 is large, the temperature of the heating resistor 6 rises. Further, the temperature is transmitted to the thermal fuse element 3 through the substrate 4 and is melted when the temperature fuse element 3 reaches a predetermined temperature or higher. The heating resistor 6 is made of a material such as tungsten or platinum, for example.

  The thermal fuse element 3 is covered with a flux 10. The flux 10 is a material having excellent thermal conductivity, and is made of, for example, a material obtained by dissolving pine resin in turpentine oil into a paste, or a material such as zinc chloride. The flux 10 makes it easy to convey the temperature of the heating resistor 6 to the thermal fuse element 3. Then, the temperature difference between the temperature of the heating resistor 6 and the temperature fuse element 3 can be reduced.

  FIG. 5 is a schematic perspective view showing a state in which the resistance temperature fuse 1 and the support 11 are connected.

  As shown in FIG. 5, a support 11 is formed on the base 5 of the resistance temperature fuse 1. The support 11 is electrically connected to an external circuit when the resistance temperature fuse 1 is mounted on the external circuit. When the resistance temperature fuse 1 is mounted on an external circuit, if there is no support 11 and the base 5 of the resistance temperature fuse 1 is to be connected to an external circuit via an adhesive such as solder, the adhesive is melted. Depending on the temperature, the temperature fuse element 3 of the resistance temperature fuse 1 may melt. In such a case, the resistance temperature fuse 1 is provided with a support 11 and connected to an external circuit via the lower surface of the support 11 to facilitate the mounting operation of the resistance temperature fuse, and after the mounting. The operational reliability of the resistance temperature fuse can be improved.

For example, as shown in FIG. 5, a through hole H is formed in the support 11. The through hole H is higher than the height position of the lower surface of the support 11 and is provided between the resistance temperature fuse 1 and the support 11. When the lower surface of the support 11 is connected to an external circuit via an adhesive such as solder, heat at the time of bonding of the electrically conductive bonding material on the lower surface of the support 11 tends to be transmitted to the resistance temperature fuse 1. Since the through-hole H is formed between the support 11 and the resistance temperature fuse 1, the heat conduction cross-sectional area of the heat transferred from the lower surface of the support 11 toward the resistance temperature fuse 1 can be reduced. It is possible to make it difficult to transfer heat to the resistance temperature fuse 1.

  As described above, according to the present embodiment, the resistance thermal fuse 1 incorporated in the external circuit transmits the heat transmitted from the external circuit to the substrate 4 via the base body 5 or the support body 11, so that the thermal fuse element 3 It is possible to suppress fusing due to the heat of the external circuit. Therefore, the resistance temperature fuse 1 according to the present embodiment can be hardly affected by the environmental temperature, and the temperature fuse element 3 can be blown by the temperature resulting from the temperature of the heating resistor 6. As a result, it is possible to provide a resistance temperature fuse package and a resistance temperature fuse that can contribute to improvement of operating characteristics.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. Hereinafter, modifications of the present embodiment will be described. Note that, in the resistance temperature fuse 1 according to the modification of the present embodiment, the same portions as those of the resistance temperature fuse 1 according to the present embodiment are denoted by the same reference numerals, and description thereof is omitted as appropriate.

<Modification>
FIG. 6 is a perspective view showing an overview of the resistance thermal fuse 1 according to a modification, in which the substrate 4 is composed of a plurality of layers. FIG. 7 is a cross-sectional view of the resistance thermal fuse 1 taken along the line ZZ ′ of FIG. 6 and shows the positional relationship between the thermal fuse element 3 and the heating resistor 6.

  In the embodiment described above, as shown in FIG. 1, the substrate 4 is a single layer, but is not limited thereto. For example, as shown in FIG. 6 or FIG. 7, the substrate 4 may be composed of a plurality of layers. By forming the substrate 4 in a plurality of layers, the heating resistor 6 for heating the thermal fuse element 3 can be provided inside the substrate 4, and the temperature of the heating resistor 6 is made difficult to be directly diffused to the outside. Can do. Further, by forming the substrate 4 from a plurality of layers and forming the heating resistor 6 on the lower surface of the uppermost layer, the distance between the heating resistor 6 and the thermal fuse element 3 can be shortened, and the heating resistor The temperature of the body 6 can be easily transmitted to the thermal fuse element 3.

  FIG. 8 is a cross-sectional view of a resistance temperature fuse 1 according to a modification, in which a heat transfer layer 12 is interposed between the temperature fuse element 3 and the heating resistor 6.

  In the above-described embodiment, as shown in FIG. 2, the substrate 4 is merely interposed between the thermal fuse element 3 and the heating resistor 6, but this is not a limitation. For example, as shown in FIG. 8, a heat transfer layer 12 having excellent thermal conductivity may be provided between the thermal fuse element 3 and the heating resistor 6.

  As shown in FIG. 8, the heat transfer layer 12 is provided between the thermal fuse element 3 and the heating resistor 6 and in a region where the thermal fuse element 3 and the heating resistor 6 overlap when seen in a plan view.

  In the heat transfer layer 12, heat is transferred from the heating resistor 6 through a part of the substrate 4 located between the heating resistor 6 and the heat transfer layer 12. The heat transferred to the heat transfer layer 12 is transferred from the heat transfer layer 12 through a part of the substrate 4 located between the heat transfer layer 12 and the thermal fuse element 3. The heat transfer layer 12 is made of, for example, a material having excellent thermal conductivity such as copper or tungsten, or a mixed material thereof so that heat can be easily transferred from the heating resistor 6.

  FIG. 9 is a cross-sectional view of a resistance thermal fuse 1 according to a modification, in which the thermal fuse element 3 is formed between the pair of bases 5 on the lower surface of the substrate 4.

  In the embodiment described above, the thermal fuse element 3 is formed on the upper surface of the substrate 4 as shown in FIG. 2, but the present invention is not limited to this. For example, as shown in FIG. 9, the thermal fuse element 3 is provided on the lower surface of the substrate 4. Further, the heating resistor 6 is provided on the upper surface of the substrate 4 in a region overlapping the temperature fuse element 3 as seen through the plane.

  By providing the thermal fuse element 3 in the lower surface of the substrate 4 and in the region where the pair of bases 5 are sandwiched, the thickness of the resistance thermal fuse 1 can be reduced, which contributes to the miniaturization of the resistance thermal fuse 1. be able to. Further, by providing the thermal fuse element 3 so as to be sandwiched between the pair of bases 5, the flux 10 and the thermal fuse element 3 are present at a position lower than the outer surface of the resistance thermal fuse. Can be made difficult to contact with the outside, and the influence of external force on the fuse element due to handling when mounting the resistance temperature fuse on the circuit board or mounting the circuit board on the electronic device after mounting the resistance temperature fuse is reduced can do. And the possibility that the thermal fuse element 3 and the flux 10 will peel from the board | substrate 4 can be reduced, and the operation | movement reliability after apparatus attachment improves. Furthermore, by providing the thermal fuse element 3 not on the upper surface of the substrate 4 but on the lower surface of the substrate 4, it is possible to make it difficult for heat transmitted from the upper side of the substrate 4 to the substrate 4 to be transmitted directly to the thermal fuse element 3. 3 can be made less susceptible to environmental temperature effects. As a result, it is possible to provide the resistance temperature fuse 1 having excellent operating characteristics.

  FIG. 10 is a perspective view showing a state in which the resistance temperature fuse 1 and the support 11 according to a modification are joined, and the support 11 is a flat plate.

  In the above-described embodiment, as shown in FIG. 5, the support 11 extends downward from the base body 5, but is not limited thereto. For example, as shown in FIG. 10, the support 11 may be extended along the plane direction along the substrate 4. By reducing the thickness of the support 11, the degree of freedom for incorporating the resistance temperature fuse 1 into an external circuit can be improved.

  As a general problem of a fuse device such as a resistance temperature fuse, a current fuse, or a temperature fuse, when the fuse device is mounted on a circuit board, heat is applied to the fuse device, and the fuse device may be heated to an unnecessarily high temperature. In such a case, the temperature fuse element or the like of the fuse device may be melted and the fuse device may not function as a product. Here, when referred to as a fuse device, a temperature fuse element or a current fuse element provided in the fuse device is generically referred to as a fuse element.

  Therefore, the support body 11 is provided in the fuse device mounted on the circuit board, and the support body 11 is connected to the circuit board. At this time, it is preferable that the end portion of the support body 11 located outside the fuse device and outside the through hole H formed in the support body 11 is mounted on the circuit board. By directly connecting the support 11 and the circuit board, heat transmitted to the fuse device during mounting can be reduced. Further, by providing the through hole H in the support 11, when heat is transmitted from one end of the support 11 to the other end of the support 11, heat is transmitted avoiding the through hole H. This prevents heat from being transferred from one end of the support 11 to the other end of the support 11. As described above, the fuse mounting structure including the fuse device and the support 11 is provided on the lower surface of the fuse device on which the fuse element is mounted, and extends in a planar direction toward a region that does not overlap the fuse element. It is the structure provided with the support body 11 which has the existing through-hole H.

  In the example shown in FIG. 10, the fuse device is a device in which the resistance temperature fuse 1 and the support 11 are joined, but is not limited thereto. Instead of the resistance temperature fuse 1, a structure in which the temperature fuse and the support 11 are combined may be used. Further, instead of the resistance temperature fuse 1, a structure using a combination of a current fuse and a support may be used.

  Furthermore, in addition to the combined structure of the resistance temperature fuse 1 and the support 11 shown in FIG. 10, a structure in which a temperature fuse and a current fuse are added may be used.

  A thermal fuse or a current fuse is used as a circuit protection element, and is incorporated in a specific circuit. Then, when a circuit abnormality occurs, the operation of the circuit is urgently stopped.

  Here, the thermal fuse is an element that urgently stops the operation of the circuit when the thermal fuse element is blown under the influence of an abnormal temperature of an external device. That is, the thermal fuse is one in which the thermal fuse element is blown according to the external temperature. In addition, the thermal fuse does not melt the thermal fuse element due to the heated temperature of the heating resistor. The thermal fuse includes a substrate 4, a pair of bases 5 provided on the substrate 4, and a thermal fuse element 3 provided on the substrate 4 and provided in a region sandwiched between the pair of bases 5 when seen in a plan view. Yes.

  The current fuse is obtained by removing the temperature fuse element and the heating resistor from the resistance temperature fuse and providing a current fuse element instead of the temperature fuse element and the heating resistor.

  Here, the current fuse element of the current fuse is electrically connected to an external device, and if an overcurrent flows through the external device and the current value exceeds a predetermined value, the current fuse element of the current fuse Similarly, an overcurrent flows and the current value becomes a predetermined value or more. Then, the current fuse element is heated and the current fuse element is blown, whereby the operation of the circuit of the external device is urgently stopped. The current fuse includes a substrate 4, a pair of bases 5 provided on the substrate 4, and a current fuse element provided on the substrate 4 and provided in a region sandwiched between the pair of bases 4 when seen in a plan view. . In addition, when a current fuse is incorporated in the fuse device, it may be designed so that a desired current flows through the fuse device by joining a conductive member that separately supplies electricity to the support 11.

<Method of manufacturing resistance thermal fuse>
Here, a method of manufacturing the resistance temperature fuse 1 and the resistance temperature fuse package 2 shown in FIG. 1 will be described.

  First, the substrate 4 is prepared. When the substrate 4 is made of, for example, an aluminum oxide sintered body, a mixture obtained by adding and mixing an organic binder, a plasticizer, a solvent, and the like to raw powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide Mold green sheets.

  Moreover, a high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste.

  Then, the electrode layer 7 is formed by applying a metal paste to the upper surface of the substrate 4 in a green sheet state using, for example, a screen printing method. Similarly, the heating resistor 6 is formed on the lower surface of the substrate 4.

  Next, a pair of base | substrates 5 are prepared. Similar to the substrate 4, a green sheet for the base 5 is formed. Then, the conductive layer 8 is formed by applying a metal paste to the lower surface of the substrate 5 and the upper surface on the side surface side using, for example, a screen printing method.

  Next, baking is performed at a temperature of about 1600 degrees in a state where the prepared substrate 4 and base body 5 before sintering are connected. Then, the substrate 5 and the frame body 6 are integrally sintered. Necessary plating is performed on the surface of the temperature fuse element mounting portion, the circuit board mounting portion, and the support of the integrally sintered member. Here, although the manufacturing method of the individual piece product about the resistance temperature fuse was described, the manufacture by the multi-piece sheet shape is preferable from the viewpoint of mass productivity and cost. In this way, the resistance temperature fuse package 2 can be manufactured.

  Next, the thermal fuse element 3 is mounted at a predetermined location on the substrate 4. Then, the thermal fuse element 3 and the electrode layer 7 are electrically connected. Further, a flux 10 is formed on the substrate 4 so as to cover the thermal fuse element 3. As a result, the resistance temperature fuse 1 can be manufactured.

  In addition, after mounting the thermal fuse element 3 at a predetermined position corresponding to each resistance thermal fuse of the resistance thermal fuse package 2 created in a multi-piece sheet shape, a flux is applied so as to cover the thermal fuse element 3 It is preferable from the viewpoint of mass productivity and cost to form 10 and then divide the multi-piece sheet into pieces.

DESCRIPTION OF SYMBOLS 1 Resistance thermal fuse 2 Resistance thermal fuse package 3 Thermal fuse element 4 Board | substrate 5 Base | substrate 6 Heating resistor 7 Electrode layer 8 Conductive layer 9 Covering layer 10 Flux 11 Support body 12 Heat transfer layer R Mounting surface AS Cavity H Through-hole

Claims (8)

A substrate,
A pair of bases provided on the substrate;
A thermal fuse element provided in the substrate and provided in a region where the pair of bases are sandwiched in plan view;
A resistance thermal fuse, comprising: a heating resistor provided on the substrate and in a region that overlaps with the thermal fuse element as seen through a plane, and provided with a space between the thermal fuse element. The resistance thermal fuse of claim 1,
A resistance thermal fuse, wherein the thermal fuse element is provided on an upper surface of the substrate, and the heating resistor is provided on a lower surface of the substrate. The resistance thermal fuse of claim 1,
A resistance thermal fuse, wherein the thermal fuse element is provided on a lower surface of the substrate, and the heating resistor is provided on an upper surface of the substrate. The resistance thermal fuse of claim 1,
A resistance thermal fuse, wherein the thermal fuse element is provided on an upper surface of the substrate, and the heating resistor is provided inside the substrate. The resistance thermal fuse of claim 1,
A resistance thermal fuse, wherein the thermal fuse element is provided on a lower surface of the substrate, and the heating resistor is provided inside the substrate. A resistance thermal fuse according to any one of claims 1 to 5,
Between the thermal fuse element and the mounting surface of the substrate on which the thermal fuse element is mounted, a coating layer having a wettability with the molten thermal fuse element smaller than the wettability of the mounting surface is formed. A resistance temperature fuse characterized by having The resistance thermal fuse according to any one of claims 1 to 6,
The thermal fuse element is a resistance thermal fuse, wherein the thermal fuse element is covered with a flux. A substrate having a mounting surface on which the thermal fuse element is mounted;
A pair of bases provided on the substrate;
A resistance thermal fuse package, comprising: a heating resistor provided on the substrate and in a region that overlaps with the mounting surface as seen through a plane, and is provided with a gap from the mounting surface.

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