JP2011133661A - Imaging apparatus and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact imaging apparatus 1 in which distances between a CCD 41 and lens substrates 11, 13, and 15 are variable. <P>SOLUTION: The imaging apparatus 1 includes: a fixed part 3 having a CCD substrate part 40 and a drive substrate part 30 on which a coil 31 is stacked through an insulator and in which an optical path region is hollow; and a movable part 2 having the lens substrate parts 11, 13 and 15, spacer substrate parts 12 and 14, and a magnetic substrate part 20 made of magnetic materials of which an optical path region is hollow. The movable part 2 which is fitted into periphery of the fixed part 3 sectioned from a fixed part substrate 3A on which a plurality of CCD substrate parts 40A and drive substrate parts 30 are arranged in a lattice with a prescribed spacing and sectioned from a movable part substrate 2A on which the plurality of lens substrate parts 11, 13, 15 and the spacer substrate parts 12, 14 are arranged in a lattice is movable in an optical axis O. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an image pickup apparatus using a wafer level chip size package technique and a method for manufacturing the image pickup apparatus.

  Electronic endoscopes, camera-equipped mobile phones, digital cameras, and the like equipped with an imaging device having a solid-state imaging device such as a CCD are widely used. The imaging apparatus includes a main part including a solid-state imaging device and an imaging optical system having a lens that guides an optical image of a subject to the solid-state imaging device.

  In order to downsize and mass-produce an imaging device, a manufacturing method of an imaging device using a wafer level chip size package (WCSP) method is known. For example, Japanese Patent Application Laid-Open No. 2003-204053 discloses a method for obtaining an imaging device by cutting a semiconductor wafer having a CCD and a substrate having a lens or the like into pieces after bonding.

  However, since the imaging device manufactured using the WCSP method is a fixed focus type in which the distance between the imaging element and the lens is fixed, focusing and zooming cannot be performed.

JP 2003-204053 A

  An object of the present invention is to provide a small-sized imaging device in which a distance between an imaging element and a lens is variable, and a method for manufacturing the imaging device.

  In order to achieve the above object, an imaging device according to an embodiment of the present invention includes an imaging element substrate unit having an imaging element, and a plurality of coil units that are disposed on the outer periphery of the imaging element of the imaging element substrate unit. Are stacked via an insulator, and the optical path region for determining the interval in the optical axis direction of the lens substrate unit, a plurality of lens substrate units, and a fixing unit having a drive substrate unit having a hollow optical path region A movable portion having a hollow spacer substrate portion and a magnetic substrate portion made of a magnetic material having a hollow optical path region, and the plurality of imaging element substrate portions and the driving substrate portions are arranged in a lattice pattern A plurality of the lens substrate portions and the spacer substrate portions, which are fitted to the inner peripheral portion of the drive substrate portion of the fixed portion separated from the fixed portion substrate, with a predetermined interval, are arranged in the lattice shape. From the movable part substrate The movable part, characterized in that it is movable in the optical axis direction.

  An imaging device manufacturing method according to another embodiment of the present invention includes: an imaging element substrate creating step of creating an imaging element substrate in which a plurality of imaging element substrate portions having imaging elements are arranged in a lattice pattern; A driving substrate creating step of creating a driving substrate in which a coil substrate is laminated via an insulator and a driving substrate portion having a hollow optical path region is arranged in the lattice shape; and a plurality of the lens substrate portion and the spacer substrate portion A movable part substrate creating step of creating the movable part substrate arranged in the lattice shape, a fixed part individualizing step of cutting the image pickup device substrate and the drive substrate into pieces into a fixed part, and the movable part substrate The movable part singulation step of cutting the substrate into pieces into movable parts, and the movable part having a magnetic substrate part made of a magnetic substance having a hollow optical path region on the inner peripheral part of the drive substrate part of the fixed part Can be moved in the direction of the optical axis. Characterized in that with a spacing to anda assembly process to be fitted.

  According to the present invention, it is possible to provide a small-sized imaging device in which the distance between the imaging element and the lens is variable, and a method for manufacturing the imaging device.

1 is a perspective transparent view showing an appearance for explaining the structure of an imaging apparatus according to a first embodiment. 1 is an assembly diagram for explaining a cross-sectional structure of an imaging apparatus according to a first embodiment. FIG. It is a perspective view for demonstrating the manufacturing method of the lens unit part of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the movable part of 1st Embodiment. It is a figure for demonstrating the manufacturing method of the fixing | fixed part of 1st Embodiment. It is a figure for demonstrating the manufacturing method of the fixing | fixed part of 1st Embodiment. It is a figure for demonstrating the manufacturing method of the fixing | fixed part of 1st Embodiment. It is a figure for demonstrating the manufacturing method of the thin film coil of the fixing | fixed part of 1st Embodiment. It is a figure for demonstrating the manufacturing method of the fixing | fixed part of 1st Embodiment. It is a figure for demonstrating the manufacturing method of the fixing | fixed part of 1st Embodiment. It is sectional drawing for demonstrating operation | movement of the imaging device of 1st Embodiment. It is sectional drawing for demonstrating operation | movement of the imaging device of 1st Embodiment. It is a figure for demonstrating the cross-section of the imaging device of 2nd Embodiment.

<First Embodiment>
Hereinafter, an imaging apparatus according to a first embodiment of the present invention will be described with reference to the drawings. First, the basic structure of the imaging apparatus 1 according to the present embodiment will be described. As shown in FIG. 1, the imaging apparatus 1 includes a fixed portion 3 and a movable portion 2 that is fitted into the hollow portion 3H of the inner peripheral portion of the fixed portion 3 with a predetermined interval and is movable in the optical axis O direction. . The fixed portion 3 includes a CCD substrate portion 40 that is an image pickup device substrate portion, an optical path region disposed on the upper portion of the CCD substrate portion 40 covers the drive substrate portion 30 of the cavity portion 3H, and the upper portion of the drive substrate portion 30. And a cover substrate portion 39 having at least an optical path region made of a transparent material. The optical path region is a region through which incident light to the image sensor passes. The cover substrate portion 39 has the effect of preventing foreign matter from entering the hollow portion 3H and has the effect of placing the movable portion 2 in the hollow portion 3H.

  V-grooves 51 are formed on the side surfaces in the four directions of the cavity 3H of the drive substrate 30 to reduce friction when the movable part 2 moves in the direction of the optical axis O between the V-shaped groove 51 and the fixed part 3. A ball 50, which is a spherical body, is disposed. In the imaging apparatus 1 in which the ball 50 for friction reduction is disposed between the fixed portion 3 and the movable portion 2, the movable portion 2 moves smoothly and can be moved with a small force. Further, by providing two or more balls 50 in the vertical direction on each side surface, shaft blurring or the like can be prevented.

  As will be described later, the movable portion 2 and the fixed portion 3 are manufactured by singulating a bonded substrate in which a plurality of substrates are bonded by the WCSP method. Note that when the substrate is cut by blade dicing, a square shape is obtained. However, when laser dicing or the like is used, a polygonal columnar shape or a cylindrical shape can be obtained.

  Next, FIG. 2 is a diagram for explaining a cross-sectional structure along the line II-II of the imaging device 1 shown in FIG. 1, but for the sake of explanation, a part of the structure is different from FIG. ing. Each figure is a schematic diagram for explanation, and the scale in the thickness direction differs depending on the constituent elements. For example, a thickly illustrated substrate portion is not necessarily thicker than a thinly illustrated substrate portion. Hereinafter, the upper surface (front surface) of the substrate means the surface on the subject side, and the lower surface (back surface, back surface) means the surface on the opposite side of the subject. Moreover, the code | symbol of the some component which has the same function may be shown by attaching | subjecting one alphabetic character to the end of a code | symbol. For example, the through wirings 32 </ b> A to 32 </ b> E (see FIG. 6) are referred to as the through wiring 32.

  As shown in FIG. 2, in the movable unit 2, a magnetic substrate 20 made of a magnetic material having a hollow optical path region is joined to the lens unit 10. The lens unit portion 10 includes a plurality of lens substrate portions 11, 13, 15 and spacer substrate portions 12, 14 having a hollow optical path region for defining an interval in the optical axis direction of the lens substrate portions 11, 13, 15; Have A recess 52 for holding the ball 50 is formed on the side surfaces of the spacer substrate portions 12 and 14.

  On the other hand, the fixed portion 3 is disposed at the CCD substrate portion 40 having the CCD 41 as an image pickup device and the upper periphery of the CCD 41 of the CCD substrate portion 40, that is, at the outer periphery of the optical path region, and the plurality of coil portions 31 are insulators. The drive substrate unit 30 is stacked through the layers (see FIG. 9), and the optical path region has the cavity 3H. As will be described later, the coil portion 31 is a thin film spiral coil wound so as to surround the optical path region.

  The CCD substrate unit 40 is made of, for example, a single crystal silicon substrate, and a CCD 41 that is an image pickup device is disposed in the approximate center of the upper surface using a semiconductor circuit creation technique. Note that a CMOS or the like may be used as the imaging device, or a separately created imaging device chip may be disposed on the CCD substrate unit 40. The CCD substrate section 40 has a power supply and signal transmission through wiring 42 for the CCD 41 through an insulating film (not shown), an electrode 43 connected to the through wiring 42, a through wiring 32 for energizing the coil section 31, 33 and electrodes 44 and 45 connected to the through wirings 32 and 33 are formed.

  Then, as will be described later, the magnetic substrate portion 20, that is, the movable portion 2 moves in the direction of the optical axis O by a magnetic field generated by energizing the coil portion 31.

  Next, a method for manufacturing the imaging device of the present embodiment will be described with reference to FIGS. In the manufacturing method of the imaging apparatus 1, after the movable part 2 and the fixed part 3 are manufactured by the WCSP method, the movable part 2 is fitted and arranged in the cavity 3H of the fixed part 3 in the assembly process, and further the cover substrate. The part 39 is joined.

  Initially, the manufacturing method of the movable part 2 is demonstrated. As shown in FIG. 3, the lens unit section 10 of the movable section 2 includes a lens unit substrate 10A obtained by bonding a plurality of lens substrates 11A, 13A, and 15A and a plurality of spacer substrates 12A and 14A along a cutting line L. Are cut into pieces. The lens substrate 11A has a plurality of lens substrate portions 11 arranged in a lattice pattern. Similarly, in the lens substrates 13 </ b> A and 15 </ b> A, the plurality of lens substrate portions 13 and 15 are arranged in the same lattice shape as the lens substrate portion 11. In the spacer substrates 12A and 14A, a plurality of spacer substrate portions 12 and 14 are arranged in the same grid as the lens substrate portion 11.

  In addition, as shown to the lens board | substrate 15A of FIG. 3, the outer peripheral part of each board | substrate is not displayed. FIG. 3 shows an example in which the components are arranged in a 10 × 10 grid pattern on each substrate. However, for mass productivity, the components are arranged in a grid pattern of 20 × 20 or more. It is preferable.

  The lens substrates 11A, 13A, and 15A are created, for example, by pouring a material between two molds or press-molding a flat plate. As a material of the lens substrates 11A, 13A, and 15A, glass, polycarbonate, polyester, acrylic, or the like can be used as long as it is a transparent material. Moreover, it is not limited to a single material, and may be a composite member of resin and glass, for example. Furthermore, it is not necessary that all be made of a transparent material, and at least a portion corresponding to the optical path of the imaging optical system is made of a transparent material.

  The spacer substrates 12A and 14A may be made of the same glass as the lens substrate 11A or the like, or a transparent resin material, but need not be transparent, ABS resin, epoxy resin, phenol resin, metal, silicon, ceramic material You may make from etc.

  In addition, the imaging device in which the lens frame portions of the lens substrates 11A, 13A, and 15A and the spacer substrates 12A and 14A are made of a light shielding material is not easily affected by ambient light.

  In the bonding step, the lens substrates 11A, 13A, and 15A are bonded via the spacer substrates 12A and 14A, thereby creating the lens unit substrate 10A (movable part substrate 2A). In the joining process, an adhesive is applied to the joining surfaces. Various known adhesives can be used as the adhesive. Note that the adhesive need not be applied to the entire joining surface to be joined, and may be applied only to a predetermined region by a known method, for example, an inkjet method.

  The substrates to which the adhesive has been applied are joined together by curing the adhesive while being pressed in a state of being overlaid. Note that it is not necessary to bond all the substrates at the same time, and it is not necessary to bond them from the lower or upper substrate. Moreover, the resin substrate made into the high temperature state may be joined without using an adhesive, or may be joined by anodic bonding.

  Further, if necessary, the flatness of the bonded substrate as a whole is adjusted after the adhesive is cured. The other bonding steps described below are the same as described above.

  Then, in the singulation step, the lens unit substrate 10A is cut along the cutting line L to be singulated into the respective lens unit portions 10. In the individualization step, the lens unit substrate 10A is cut into individual pieces while being fixed with a fixing film or the like (not shown). For the cutting, a wire saw, a blade dicing apparatus, a laser dicing apparatus, or the like can be used. Then, after cutting, the individual lens unit portions 10 are separated from the fixing film or the like. The other singulation steps described below are the same as described above.

  The recess 52 for holding the ball 50 is formed after singulation by laser processing or machining.

  And as shown in FIG. 4, the movable part 2 is manufactured by joining the magnetic substrate part 20 which consists of a magnetic body whose optical path area | region is the cavity part 20H to the lower part of the lens unit part 10 separated into pieces. Is done. As long as the magnetic body of the magnetic substrate 20 is a ferromagnetic body that receives a force by a magnetic field, a known material such as iron, nickel, cobalt, permalloy, invar, ferrite, cobalt platinum, SmCo, or NdFeB can be used. . In particular, by using a magnet that is a magnetized hard magnetic material, the driving force by a magnetic field can be improved. As the magnetic substrate portion 20, a plastic magnet in which a magnetic material and a resin are mixed, a magnetic material film formed by sputtering, plating, or the like, for example, an NdFeB film, or a magnetic material and a nonmagnetic material. Alternatively, a structure in which and are stacked may be used.

  In the movable part 2 that joins the magnetic substrate part 20 to the lens unit part 10, a high-performance magnetic material such as a sintered magnet whose magnetic substrate part 20 is not easy to apply the WCSP method can be used. For this reason, the movable part 2 moves with a small magnetic field, that is, a low current.

  As described above, the driving substrate 30A having a hollow optical path region has five coil layers 35A to 35E each having a coil portion 31 that is a thin film coil, and are laminated via insulator layers 34A to 34E, respectively. A spacer substrate 30ZA corresponding to the other insulator layer is stacked on the structure. A drive substrate 30A is integrally formed on the CCD substrate 40A. That is, the insulator layer 34 and the coil layer 35 are laminated on the CCD substrate 40A.

  Next, the manufacturing method of the fixing | fixed part 3 is demonstrated. As shown in FIG. 5, the fixing unit 3 is separated into pieces by cutting the fixing unit substrate 3 </ b> A including the CCD substrate 40 </ b> A that is an image sensor substrate and the drive substrate 30 </ b> A along the cutting line L. . The CCD substrate 40A has a plurality of CCD substrate portions 40 having CCDs 41 arranged in a lattice pattern. The drive substrate 30A has a plurality of drive substrate portions 30 arranged in a grid pattern. 5 shows an example in which the drive substrate 30A includes an intermediate substrate 30ZA having an intermediate substrate portion whose optical path region is a hollow portion as the uppermost insulating layer.

  Next, a manufacturing method of the fixed portion substrate 3A will be described with reference to FIGS. 6 to 8, 10, etc., (A) is a view when one fixed substrate portion is viewed from the upper surface in the step of forming the fixed portion substrate, and (B) describes the cross-sectional structure thereof. FIG.

  As shown in FIG. 6, a CCD substrate 40A having a CCD 41 is produced. By using a silicon substrate, the CCD 41 can be formed inside using a semiconductor manufacturing technique. Incidentally, the CCD substrate 40A is polished from the back surface side so as to facilitate the formation of the through wirings 32, 33, and 42, and the total thickness is processed to 100 μm or less, for example.

  A conductor is formed inside a through hole formed by a known etching method or the like, and through wirings 32, 33, and 42 are created. Furthermore, electrodes 43, 44, and 45 that are electrically connected to the through wirings 32, 33, and 42 are formed on the back surface side. The electrodes 43, 44, and 45 are connection bumps when the imaging apparatus 1 is mounted on another substrate, but may be formed after becoming the fixed portion substrate 3 </ b> A integrated with the drive substrate portion 30. In the following drawings, the electrodes 43, 44, and 45 may not be displayed.

  As shown in FIG. 6A, the through wiring for applying a current to the coil portion 31 includes through wiring 32A to 32E unique to each of the coil portions 31A to 31E, and one common through wiring 33. Is composed of. As will be described later, when a current is applied between the common through wiring 33 and the specific through wiring 32 of the selected one coil section 31, only the selected coil section 31 is driven.

  As shown in FIG. 7, in the production of the drive substrate 30A, the insulator layer 34A is first formed on the CCD substrate 40A. The insulator layer 34A is made of, for example, a photoresist such as a photosensitive polyimide resin or a novolac resin, and has a hollow portion 34AH in the optical path region at the substantially central portion thereof, and through wirings 32 and 33 are formed.

  Next, as shown in FIG. 8, the coil layer 35A is formed on the insulator layer 34A. As shown in FIG. 8A, the coil layer 35A has a coil portion 31A having a spiral structure with the optical path region as the center, and the end of the coil portion 31A has a common through wire 33 and a unique through wire 32A. It is connected. The coil layer 35 </ b> A has a hollow portion 35 </ b> AH in a substantially central optical path region, and through-wires 32 and 33 are also formed.

  Here, a method of creating the coil portion 31A, which is a thin film coil, will be briefly described with reference to FIG. First, as shown in FIG. 9A, a conductive layer 60 is formed on the insulator layer 34A by sputtering or the like. Next, as shown in FIG. 9B, a so-called frame 61 is formed in which a portion to be a coil is patterned using a photoresist or the like. Then, as shown in FIG. 9C, a conductor 62, for example, a copper film is formed in the frame by electroplating using the conductive layer 60 as a cathode. When the conductive layer 60 is removed by an argon ion milling method or the like after removing the frame 61 as shown in FIG. 9D, a coil portion 31A as shown in FIG. 9E is created. Note that an insulator is embedded in the portion where the frame 61 is removed when an upper insulator layer is formed. Of course, an insulator such as polyimide or non-conductive diamond may be embedded before the upper insulator layer is formed.

  The method of creating the coil portion 31A is not limited to the frame plating method described above or an additive method such as screen printing of a conductive paste or the like. For example, a subtracting method of performing an etching process after film formation by a sputtering method may be used. Good.

  Since the coil portion 31 of the drive substrate 30A is a thin film coil, it can be formed using a wafer process. For this reason, the drive substrate 30A can be formed by the WCSP method.

  Then, as shown in FIG. 10, the formation of the insulator layer 34 and the formation of the coil layer 35 are repeated. That is, the insulator layer 34B, the coil layer 35B, the insulator layer 34C, the coil layer 35C, the insulator layer 34D, the coil layer 35D, the insulator layer 34E, and the coil layer 35E are sequentially stacked on the CCD substrate 40A. . The driving substrate 30A may be subjected to a planarization process by a CMP method or the like in order to stack a large number of layers. Note that one end of each of the coil portions 31B, 31C, 31D, and 31D is connected to the through wirings 32B, 32C, 32D, and 32E, respectively.

  In the above description, the case where the hollow portion of the optical path region and the through hole for the through wiring are formed at the time of forming the respective insulator layers 34 and the respective coil layers 35 has been described. On the other hand, at least a part of the cavity and the through hole may be formed by etching, machining using a mechanical drill, laser processing, or the like after lamination.

  As described above, after the movable part 2 and the fixed part 3 are each manufactured by the WCSP method, the movable part 2 is fitted and arranged in the cavity 3H of the fixed part 3 in the assembly process, and further the cover substrate. The part 39 is joined.

  Since the imaging apparatus 1 is manufactured using the WCSP method frequently, it can be mass-produced in large quantities, and high yield and low cost can be realized.

  Next, the operation of the imaging device 1 will be described with reference to FIGS. 11 and 12. When the coil portion 31 is energized, a magnetic field having a predetermined distribution is generated in the space. Since the coil portion 31 is a thin film coil, the central magnetic path region M is the strongest magnetic field. Therefore, as shown in FIG. 11, when the coil portion 31B is energized, the magnetic substrate portion 20 moves to a position where the coil portion 31B is formed. That is, the movable part 2 moves upward. Similarly, as shown in FIG. 12, when the coil part 31E is energized, the magnetic substrate part 20 moves to a position where the coil part 31E is formed.

  The common through wiring 33 and the unique through wiring 32B, that is, the electrode 45 and the electrode 44B are used to energize the coil part 31B, and the electrode 45 and the electrode 44E are used to energize the coil part 31E. The imaging apparatus 1 has a simple structure and high productivity because a plurality of coil portions 31 for performing focusing have a common through wiring 33.

  In addition, it is possible to move the magnetic substrate part 20 to the middle of the two coil parts 31 by energizing the two coil parts 31 simultaneously. Furthermore, the magnetic substrate part 20 can be moved to a desired position by supplying different currents to the two coil parts 31. Further, the magnetic substrate portion 20 may be controlled to stop at a desired position after energizing the plurality of coil portions 31 simultaneously in order to move at a higher speed.

  In the imaging apparatus 1, the magnetic substrate unit 20 moves in accordance with the magnetic field, so that the movement of the movable unit 2 can be controlled by controlling the magnetic field distribution and the magnetic field strength. For this reason, since the distance between the CCD 41 of the fixed unit 3 and the lens of the lens unit unit 10 is variable, the imaging apparatus 1 can perform focusing.

  As described above, the imaging device 1 is a small imaging device manufactured using the WCSP method, but can perform focusing. In other words, the imaging device manufacturing method of the present embodiment can mass-produce small imaging devices that can perform focusing, and can achieve high yield and low cost. Since the imaging device 1 is a small imaging device, it can be preferably used for an endoscope, particularly a capsule endoscope, or a mobile phone with a camera.

<Second Embodiment>
Next, the imaging device 1B and the manufacturing method of the imaging device 1B according to the second embodiment of the present invention will be described. Since the imaging device 1B and the manufacturing method of the imaging device 1B according to the present embodiment are similar to the imaging device 1 and the manufacturing method of the imaging device 1 according to the first embodiment, the same components are denoted by the same reference numerals, Description is omitted.

  As illustrated in FIG. 13, the imaging device 1 </ b> B includes two movable parts 4 and 5. Each of the movable parts 4 and 5 includes spacer substrate parts 14M1 and 14M2 which are magnetic substrate parts movable in the direction of the optical axis O, and lens substrate parts 13B1 and 15B1 joined to the spacer substrate parts 14M1 and 14M2. 13B2 and 15B2, and the fixed portion 3B includes a coil portion 31 that generates a magnetic field for moving the movable portion 4, and a coil portion 36 for moving the movable portion 5. Further, the fixing unit 3B of the image pickup apparatus 1B has a base substrate unit 30D in which the drive substrate unit 30B is transparent, and the drive substrate unit 30B and the CCD substrate unit 40 are separated and joined together.

  First, the spacer substrate portions 14M1 and 14M2 which are magnetic substrate portions will be described. The first movable part 4 of the imaging device 1B defines the distance in the optical axis direction between the plurality of lens substrate parts 11B1, 13B1, and 15B1 and the lens substrate parts 11B1, 13B1, and 15B1 similarly to the movable part 2 of the imaging device 1. The lens unit portion 10B1 includes a plurality of spacer substrate portions 12B1 and 14M1 having a hollow optical path region.

  The magnetic substrate part 20 is not joined to the lens unit part 10B1 which is the movable part 4. However, the spacer substrate portion 14M1, which is one of the plurality of spacer substrate portions 12B1 and 14M1, is a magnetic substrate portion. That is, the spacer substrate portion 14M1 has a function of a magnetic substrate portion made of a magnetic material having a hollow optical path region in addition to the function of the spacer substrate portion that determines the interval in the optical axis direction of the lens substrate portion. Two or more of the plurality of spacer substrate portions may be magnetic substrate portions, and it is not necessary that all of the spacer substrate portions 14M1 are magnetic bodies, some are magnetic bodies and some are resin or the like. There may be.

  When the lens unit portion 10B1 is created, a spacer substrate 14M1A in which a plurality of spacer substrate portions 14M1 are arranged in the same lattice shape as the lens substrate portion 11B1 is created and joined to another substrate, and the movable portion substrate that is also a lens unit substrate 2AB is created. The spacer substrate 14M1A is created, for example, by pouring a material between two molds or press-molding a flat plate. As the material of the spacer substrate portion 14M1, a mixed plastic of magnetic material and resin, particularly a plastic magnet made of rare earth magnet powder and resin can be preferably used.

  As shown in FIG. 13, the basic configuration of the spacer substrate 14M1B of the second movable portion 5 (lens unit portion 10B2) is substantially the same as the spacer substrate 14M1A, but the lens substrate portions 11B2, 13B2, 15B2, spacers The substrate 12B1 differs depending on the optical design.

  The imaging device 1B, in which the spacer substrate portions 14M1 and 14M2 are magnetic substrate portions, is superior in mass productivity to the imaging device 1 because the movable portions 4 and 5 can be formed by the WCSP method.

  Further, the drive substrate unit 30B of the imaging device 1B is separated from the drive substrate in which the coil unit 31 and the like are stacked on the base substrate unit 30D. The fixed portion 3B is created by joining the separated drive substrate portion 30B to the separated CCD substrate portion 40 from the CCD substrate 40A. In the manufacturing method of the image pickup apparatus 1B, more CCD substrate portions 40 can be created in the CCD substrate 40A having a predetermined area, so that the cost can be reduced. Further, by evaluating the characteristics of the CCD 41 of the CCD substrate section 40 before bonding and not using the CCD 41 that does not satisfy the predetermined characteristics, the manufacturing yield of the imaging device can be improved.

Furthermore, the drive substrate unit 30B of the imaging device 1B includes an intermediate substrate 30F corresponding to a relatively thick insulating layer. That is, in the driving substrate unit 30B, the coil layer 31 and the insulating layer 30E are stacked on the base substrate unit 30D, the intermediate substrate 30F is bonded thereon, and the coil layer 36 and the insulating layer 30G are stacked thereon. Then, the intermediate substrate portion 30Z is bonded thereon. Instead of the intermediate substrate 30F, a laminated substrate in which the coil layer 36 and the insulating layer 30G are laminated on the intermediate substrate made of the same transparent material as that of the base substrate portion 30D may be bonded on the insulating layer 30E. Furthermore, the intermediate substrate made of a transparent material disposed between the insulating layer 30E and the insulating layer 30E may have a lens function.
The manufacturing process of the imaging device 1B in which the insulating layer constituting the drive substrate unit 30B is the intermediate substrate 30F is simplified. In addition, an image pickup apparatus having an intermediate substrate having a lens function can easily improve optical performance.

  The two movable parts 4 and 5 can move independently in the direction of the optical axis O. The movable part 4 moves by energizing any of the five coils of the coil part 31, and the movable part 5 moves by energizing any of the five coils of the coil part 36. In addition, the coil part 31 and the coil part 36 may have a different number of coil parts, and the thickness of the insulator layer between coil layers may differ.

  The image pickup apparatus 1B according to the present embodiment has the same effects as the image pickup apparatus 1 according to the first embodiment. Further, since the distance between the two lens unit portions 10B1 and 10B2 is variable, zooming can be performed. Is possible.

  In the imaging device 1B, the cover substrate portion 39B has a plano-concave lens portion. That is, the cover substrate portion 39B has a lens function in addition to the function of preventing foreign matters from entering the cavity 3H. In addition, when there exists a possibility that the air inside cavity 3H may prevent the movement of a movable part, you may join cover board | substrate part 39B in the state which exhausted air. Or you may arrange | position the ventilation part for making the movement of the air of the cavity 3H easy at the time of a movement of a movable part.

  In the above description, the case where the lens unit portion includes three lens substrate portions and two spacer substrate portions has been described. However, in an imaging device that requires higher optical characteristics, a lens unit unit in which a larger number of lens substrate units are joined via a spacer substrate unit may be used.

  The present invention is not limited to the above-described embodiment, and various changes and modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1, 1B ... Imaging device, 2 ... Movable part, 2A ... Movable part board | substrate, 3, 3B ... Fixed part, 3A ... Fixed part board | substrate, 3H ... Hollow part, 4, 5 ... Movable part, 10 ... Lens unit part, 10A ... lens unit substrate, 11 ... lens substrate portion, 11A ... lens substrate, 12 ... spacer substrate portion, 12A ... spacer substrate, 13 ... lens substrate portion, 13A ... lens substrate, 13B1 ... lens substrate portion, 14M1 ... spacer substrate portion, DESCRIPTION OF SYMBOLS 15A ... Lens substrate, 20 ... Magnetic substrate part, 20H ... Hollow part, 30 ... Drive board part, 30A ... Drive board, 30Z ... Intermediate board part, 31 ... Coil part, 32 ... Through wiring, 33 ... Through wiring, 34 ... insulator layer, 34AH ... cavity, 35 ... coil layer, 36 ... coil part, 39, 39B ... cover substrate part, 40 ... CCD substrate part, 40A ... CCD substrate, 41 ... CCD, 42 ... through wiring, 3,44,45 ... electrode, 50 ... ball, 51 ... V groove, 52 ... concave portion, 60 ... conductive layer, 61 ... frame, 62 ... conductor

Claims (19)

An image pickup device substrate portion having an image pickup device, a drive substrate portion disposed on an outer periphery of the image pickup device of the image pickup device substrate portion, a plurality of coil portions being stacked via an insulator, and an optical path region being a cavity; A fixing part having,
A plurality of lens substrate portions; a spacer substrate portion in which the optical path region for defining an interval in the optical axis direction of the lens substrate portion is hollow; and a magnetic substrate portion made of a magnetic material in which the optical path region is hollow. A movable part,
A plurality of the image pickup device substrate portions and a plurality of the drive substrate portions are fitted to the inner peripheral portion of the drive substrate portion of the fixed portion separated from the fixed portion substrate arranged in a grid pattern at a predetermined interval. The movable parts separated from the movable part substrate in which the plurality of lens substrate parts and the plurality of spacer substrate parts are arranged in a lattice shape are movable in the optical axis direction. Imaging device.   The imaging apparatus according to claim 1, wherein the movable unit moves in the optical axis direction by applying a current to the coil unit.   The imaging apparatus according to claim 2, wherein the coil portion of the drive substrate portion is a thin film coil.   The imaging apparatus according to claim 3, wherein the magnetic substrate unit is bonded to a lens unit unit including the lens substrate unit and the spacer substrate unit.   The imaging apparatus according to claim 3, wherein at least one of the plurality of spacer substrate portions is the magnetic substrate portion.   The imaging device according to claim 4, wherein the fixed substrate is integrally formed with the driving substrate on the imaging element substrate.   The movable part includes a plurality of the magnetic substrate parts that can move independently in the optical axis direction, and a lens substrate part that is joined to each of the plurality of magnetic substance substrate parts. The imaging apparatus according to any one of claims 1 to 6, wherein   The imaging apparatus according to claim 1, wherein the magnetic body of the magnetic substrate portion is a magnetized hard magnetic body.   9. The imaging apparatus according to claim 1, wherein at least an upper portion of the drive substrate portion is covered with a cover substrate portion in which at least the optical path region is made of a transparent material.   The imaging device according to any one of claims 1 to 9, wherein a sphere for reducing friction is disposed between the fixed portion and the movable portion. An image sensor substrate creating step for creating an image sensor substrate in which a plurality of image sensor substrate portions having an image sensor are arranged in a grid pattern;
A drive substrate creating step of creating a drive substrate in which a plurality of coil portions are stacked via an insulator and a plurality of drive substrate portions having a hollow optical path region are arranged in the lattice shape;
A movable part substrate creating step of creating a movable part substrate in which a plurality of lens unit parts joined by a lens substrate part via a spacer substrate part are arranged in the lattice shape;
A fixed part singulation step of cutting the image pickup device substrate and the drive substrate into pieces into a plurality of fixed parts;
A movable part singulation step of cutting the movable part substrate into pieces into a plurality of movable parts;
The movable portion having a magnetic substrate portion made of a magnetic material having a hollow optical path region is fitted to the inner peripheral portion of the driving substrate portion of the fixed portion at a predetermined interval so as to be movable in the optical axis direction. And an assembly process.   The method of manufacturing an imaging apparatus according to claim 11, wherein the movable section moves in the optical axis direction when the imaging apparatus applies a current to the coil section.   The method for manufacturing an imaging device according to claim 12, wherein the coil portion of the drive substrate portion is a thin film coil.   The method of manufacturing an imaging device according to claim 13, further comprising a magnetic substrate unit bonding step in which the magnetic substrate unit is bonded to a lens unit unit including the lens substrate unit and the spacer substrate unit. .   The method of manufacturing an imaging apparatus according to claim 13, wherein the movable portion includes a plurality of the spacer substrate portions, and at least one of the spacer substrate portions is the magnetic substrate portion.   The method of manufacturing an imaging apparatus according to claim 14, wherein the fixing substrate is integrally formed with the driving substrate on the imaging element substrate. Comprising a plurality of the movable parts;
12. Each of the movable parts includes the magnetic substrate part movable in the optical axis direction, and the lens substrate part joined to the magnetic substrate part. The manufacturing method of the imaging device of any one of Claim 16.   18. The method of manufacturing an imaging device according to claim 1, wherein the magnetic body of the magnetic substrate section is a hard magnetic body that is magnetized.   19. The method of manufacturing an imaging device according to claim 11, wherein at least an upper portion of the drive substrate portion is covered with a cover substrate portion in which at least the optical path region is made of a transparent material. .

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