JP2011129726A - Base of package for electronic component, and package for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a base of a package for an electronic component that improves reliability of mounting bonding between the package for the electronic component and a circuit board by preventing solder cracking, and the package for the electronic component. <P>SOLUTION: The base 1 of the package for the electronic component holds an electronic component element 3. The base has its undersurface formed rectangularly in plane view, a plurality of terminal electrodes which are bonded to an external circuit board 4 using a conductive bonding material D, and are rectangular in plane view are formed, and a bump made of a metal film of the same material with a terminal electrode is laminated and integrally formed on an upper surface of the terminal electrode, the bump being smaller than the terminal electrode, having its outline formed concentrically or concentrically and elliptically with respect to a base center point of the package for the electronic component or having a point-symmetrical inclined portion formed, and being isolated from an outline end of the terminal electrode. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a base for an electronic component package used in an electronic device or the like, and an electronic component package.

  Examples of electronic components that require hermetic sealing include piezoelectric vibration devices such as crystal resonators, crystal filters, and crystal oscillators. In each of these products, a metal thin film electrode is formed on the surface of the crystal diaphragm, and the crystal diaphragm (specifically, the metal thin film electrode is hermetically sealed to protect the metal thin film electrode from the outside air.

  Due to the demand for surface mounting of components, these piezoelectric vibration devices are increasingly being stored in a package made of an insulating material such as ceramic. For example, Patent Document 1 discloses a package made of a ceramic material, which includes a base (mounting substrate) having a quartz vibration plate mounting portion and a lid (cover) having an inverted concave cross section, and these are hermetically sealed. A configuration that is mounted on a circuit board and bonded via a conductive bonding material such as solder is disclosed.

  In this conventional piezoelectric vibration device, a terminal electrode is formed on the bottom surface of the base, and a castellation in which the terminal electrode is formed on the side surface of the base in order to confirm the connection state due to the rising of the solder (conductive bonding material) Extends from the bottom of the base to the side.

  By the way, a so-called glass epoxy substrate in which a mesh-like glass fiber is impregnated with an epoxy resin material is widely used for a circuit board on which the conventional piezoelectric vibration device is mounted because of ease of processing and cost advantages. . In addition, a solder paste is applied to the upper part of the electrode pattern of the circuit board by a method such as screen printing. Then, the terminal electrode of the package of the piezoelectric vibration device is mounted on the electrode pattern of the circuit board, and the solder paste is melted in a melting furnace (such as a heating furnace) to cause piezoelectric vibration on the circuit board. Solder the device.

JP 2002-76813 A JP 2009-1003333 A

  However, due to a difference in thermal expansion between the package and the circuit board, stress may be generated in the solder that joins the package and the circuit board, and cracks may occur. In particular, when a ceramic material such as alumina is used as a package and a glass epoxy substrate is used as a circuit board, and the heat resistance application such as a vehicle is used, the package and the circuit board Therefore, the thermal expansion coefficient of the circuit board is larger than the thermal expansion coefficient of the package, and fatigue breakdown is likely to occur from the solder. As described above, the problem of solder cracks, which did not become a serious problem in normal temperature environments, appears prominently in high temperature environments, and further, when an impact is applied to the package and circuit board, peeling from the solder cracks occurs. There was a point.

  On the other hand, in Patent Document 2, the terminal electrode on the bottom surface of the base is made into a pair of two-layer terminal electrodes, and the second-layer terminal electrode above the first-layer terminal electrodes is formed smaller. The generation of solder cracks is suppressed by releasing bubbles in the solder joint. However, only the terminal configuration of Patent Document 2 cannot sufficiently release the stress generated on the solder that joins the package and the circuit board due to a difference in thermal expansion between the package and the circuit board as described above. That is, when the ambient temperature environment is relatively low, or when the temperature is lowered from the high temperature environment to a room temperature or lower, stress concentrates on the solder portion near the outer periphery of the terminal electrode. On the other hand, when the ambient temperature environment is relatively high, or when the ambient temperature rises from a room temperature or lower to a high temperature, stress concentrates on the solder portion near the inner periphery of the terminal electrode. The influence of the stress generated in the solder portion with respect to such a change in temperature environment cannot be reduced, and as a result, the problem of solder cracks cannot be solved.

  The present invention has been made to solve the above-described problems, and provides an electronic component package base and an electronic component package that prevent solder cracks and improve the reliability of mounting and bonding between the electronic component package and the circuit board. It is intended to provide.

  In the present invention, in the base of the electronic component package that holds the electronic component element, the bottom surface of the base is rectangular in plan view, and a plurality of terminals in rectangular shape in plan view that are joined to an external circuit board using a conductive bonding material. An electrode is formed, and a bump made of a metal film is integrally formed on the upper surface of the terminal electrode, the bump is smaller than the terminal electrode, and the outer periphery of the bump is at the base center point of the electronic component package On the other hand, it is formed concentrically or concentrically with an ellipse, or is formed in a state in which a point-symmetric inclined portion is formed and is isolated from the outer edge of the terminal electrode.

  With the above-described configuration, the formation area can be formed to the maximum necessary by forming the terminal electrode having a rectangular shape in plan view with respect to the base having a rectangular shape in plan view. Correspondingly, the bonding area is not reduced.

  The bump is smaller than the terminal electrode, and the outer periphery of the bump is formed concentrically or concentrically with respect to the base center point of the electronic component package, or a point-symmetric inclined portion is formed, and the terminal electrode The conductive bonding material (solder) accumulates in the gap portion between the terminal electrode and the electrode pattern of the circuit board that floats outside the outer portion of the bump, and this gap portion. Therefore, the bonding strength between the terminal electrode and the electrode pattern of the circuit board can be increased.

  In particular, a gap portion between the outer side of the bump and the electrode pattern of the circuit board that is formed between the outer side of the rectangular terminal electrode and the inner side of the base electrode in the plan view is more conductive in a region farther from the base center point of the electronic component package. Since the conductive bonding material (solder) is configured to gradually accumulate, the bonding strength of the conductive bonding material can be gradually increased toward the maximum portion of the difference in thermal expansion between the electronic component package and the circuit board. As a result, it is possible to further improve the bonding strength in the region where the stress is applied to the maximum without unnecessarily increasing the application amount of the conductive bonding material. Also, the stress generated on the inside of the conductive bonding material near the outside of the base caused by the difference in thermal expansion between the electronic component package and the circuit board can be gradually relaxed. When the conductive bonding material is a metal brazing material such as solder, metal slip in the solder can be absorbed.

  The boundary region between the thick conductive bonding material formed in the gap region raised by the bump and the thin conductive bonding material formed in the gap region where the bump exists is the center of the base of the electronic component package. Concentric circles or concentric ellipses with respect to the point, or a point-symmetric inclined part is formed, so that the stress at the time of contraction or expansion of the circuit board applied to the conductive bonding material at these boundaries is also It is alleviated and is less likely to be affected by cracks with the boundary as a base point.

  In addition, since the bump is formed by integrating the terminal electrode and the metal film, the bump can be formed very easily and inexpensively.

  In the present invention, in the base of the electronic component package that holds the electronic component element, the bottom surface of the base is rectangular in plan view, and a plurality of rectangular in plan view that are joined to an external circuit board using a conductive bonding material. A terminal electrode is formed, and a bump made of a metal film is integrally formed on the upper surface of the terminal electrode, the bump is smaller than the terminal electrode, and the inner surface of the bump is the center of the base of the electronic component package It is formed concentrically or concentrically with respect to the point, or is formed in a state in which a point-symmetric inclined portion is formed and is isolated from the inner end portion of the terminal electrode.

  With the above-described configuration, the formation area can be formed to the maximum necessary by forming the terminal electrode having a rectangular shape in plan view with respect to the base having a rectangular shape in plan view. Correspondingly, the bonding area is not reduced.

  The bump is smaller than the terminal electrode, and the inside of the bump is formed concentrically or concentrically with respect to the center center point of the electronic component package, or a point-symmetric inclined portion is formed, and the terminal Since it is formed in a state of being isolated from the inner edge of the electrode, a conductive bonding material (solder) accumulates in the gap portion between the terminal electrode and the electrode pattern of the circuit board that floats inside the inner edge of the bump, Since the thickness of the conductive bonding material in the gap portion can be increased, the bonding strength between the terminal electrode and the electrode pattern of the circuit board can be increased.

  In particular, a gap portion between the inner side of the bump and the inner side of the base from the inner side of the terminal electrode and the outer side of the base electrode of the rectangular terminal electrode in plan view is a gap between the base point of the electronic component package. Concentric circles or concentric ellipses are formed, or point-symmetrical slopes are formed, and a thick conductive bonding material (solder) that accumulates in this gap region is also at the base center point of the electronic component package. On the other hand, it is formed concentrically or concentrically with an ellipse, or is formed with a point-symmetric slope, so that it occurs with respect to the inside of the conductive bonding material near the center of the base that occurs when the circuit board contracts or expands. The stress can be gradually relaxed. When the conductive bonding material is a metal brazing material such as solder, metal slip in the solder can be absorbed. Further, the bonding strength between the electronic component package and the circuit board due to the conductive bonding material is less likely to vary, and generation of unnecessary stress due to the conductive bonding material can be eliminated.

  The boundary region between the thick conductive bonding material formed in the gap region raised by the bump and the thin conductive bonding material formed in the gap region where the bump exists is also the center of the base of the electronic component package. Concentric circles or concentric ellipses with respect to the point, or a point-symmetric inclined part is formed, so that the stress at the time of contraction or expansion of the circuit board applied to the conductive bonding material at these boundaries is also It is alleviated and is less likely to be affected by cracks with the boundary as a base point.

  In addition, since the bump is formed by integrating the terminal electrode and the metal film, the bump can be formed very easily and inexpensively.

  In the present invention, in the base of the electronic component package that holds the electronic component element, the bottom surface of the base is rectangular in plan view, and a plurality of rectangular in plan view that are joined to an external circuit board using a conductive bonding material. A terminal electrode is formed, and a bump made of a metal film is integrally formed on the upper surface of the terminal electrode, the bump is smaller than the terminal electrode, and the outer and inner surfaces of the bump are the electronic component package. The bump is formed concentrically or concentrically with respect to the base center point, or is formed in a state where a point-symmetrical inclined portion is formed and is isolated from the outer edge and inner edge of the terminal electrode. Has been.

  With the above-described configuration, the formation area can be formed to the maximum necessary by forming the terminal electrode having a rectangular shape in plan view with respect to the base having a rectangular shape in plan view. Correspondingly, the bonding area is not reduced.

  The bump is smaller than the terminal electrode, and the outline and the outline of the bump are formed concentrically or concentrically with respect to the base center point of the electronic component package, or a point-symmetric inclined portion is formed, In addition, since it is formed in a state of being isolated from the outer edge and inner edge of the terminal electrode, the gap between the terminal electrode and the electrode pattern of the circuit board that floats outside the outer edge of the bump, and the inner area of the bump Conductive bonding material (solder) accumulates in the gap between the terminal electrode floating on the inner side of the outline and the electrode pattern of the circuit board, and the thickness of the conductive bonding material in this gap can be increased, so the terminal electrode and the circuit board The bonding strength with the electrode pattern can be increased.

  In particular, a gap portion between the outer side of the bump and the electrode pattern of the circuit board that is formed between the outer side of the rectangular terminal electrode and the inner side of the base electrode in the plan view is more conductive in a region farther from the base center point of the electronic component package. Since the conductive bonding material (solder) is configured to gradually accumulate, the bonding strength of the conductive bonding material can be gradually increased toward the maximum portion of the difference in thermal expansion between the electronic component package and the circuit board. Further, a gap portion between the inner side of the bump and the inner side of the base from the inner side of the bump and the outer side of the base electrode from the inner side of the terminal electrode having a rectangular shape in plan view is a base point of the base of the electronic component package. Concentric circles or concentric ellipses are formed, or point-symmetrical slopes are formed, and a thick conductive bonding material (solder) that accumulates in this gap region is also at the base center point of the electronic component package. On the other hand, it can be formed concentrically or concentrically oval, or a point-symmetric slope can be formed. As a result, it is possible to further improve the bonding strength in the region where the stress is applied to the maximum without unnecessarily increasing the application amount of the conductive bonding material. Further, the stress generated on the inside of the conductive bonding material caused by the difference in thermal expansion between the electronic component package and the circuit board can be gradually relaxed. When the conductive bonding material is a metal brazing material such as solder, metal slip in the solder can be absorbed. In addition, the bonding strength between the electronic component package and the circuit board due to the conductive bonding material near the center of the base is less likely to vary, and generation of unnecessary stress due to the conductive bonding material can be eliminated.

  The boundary region between the thick conductive bonding material formed in the gap region raised by the bump and the thin conductive bonding material formed in the gap region where the bump exists is the center of the base of the electronic component package. Concentric circles or concentric ellipses with respect to the point, or a point-symmetric inclined part is formed, so that the stress at the time of contraction or expansion of the circuit board applied to the conductive bonding material at these boundaries is also It is alleviated and is less likely to be affected by cracks with the boundary as a base point.

  In addition, since the bump is formed by integrating the terminal electrode and the metal film, the bump can be formed very easily and inexpensively.

  Further, in the above-described configuration, the first terminal configured to be deviated to one corner position with respect to the bottom surface and to be formed of a first terminal electrode made up of one terminal electrode or two or more terminal electrodes formed in parallel. An electrode group is formed, and a second terminal electrode consisting of one terminal electrode, or two or more terminal electrodes are displaced to a first diagonal position corresponding to the diagonal position of the one corner position with respect to the bottom surface. A second terminal electrode group formed in parallel is formed, an opposite corner position facing the short edge direction of the bottom surface with respect to the one corner position, and a diagonal position of the other angle position with respect to the bottom surface The second diagonal position corresponding to this is defined as an electrodeless region in which the terminal electrode is not formed.

  With the above configuration, in addition to the above-described effects, the thermal expansion difference between the electronic component package (specifically, the base) and the circuit board when electrically and mechanically bonded to the circuit board by the conductive bonding material. Even when the other corner position is opposite to the one corner position in the short-side direction of the bottom surface of the base, and the second diagonal position is a diagonal position of the other corner position with respect to the bottom surface of the base ( In the second diagonally opposed position, since no electrode is formed as an electrodeless region, the stress generated when the electronic component package (base) is joined is directed from the terminal electrode formation region toward the electrodeless region. The electronic component package (base) can be escaped so as to rotate in a plane. As a result, since stress does not concentrate on the conductive bonding material interposed between the electronic component package and the circuit board, it is possible to reduce fatigue damage from the conductive bonding material. The adverse effects of cracks (for example, solder cracks) can be further reduced and prevented.

  Further, the electronic component package may include a lid that hermetically seals the electronic component element with respect to the base of the electronic component package described above. With this configuration, an electronic component package hermetically sealed using a base that can obtain the above-described effects can be obtained. Therefore, an electronic component package that improves the reliability of circuit board mounting and bonding can be provided at low cost. .

  According to the present invention, it is possible to further reduce and prevent the adverse effects of cracks (for example, solder cracks) in a conductive bonding material, and to reduce the cost and improve the reliability of circuit board mounting bonding. And an electronic component package can be provided.

FIG. 3 is a bottom view of the surface-mount type crystal resonator showing the first embodiment. Sectional drawing along the AA line of the state which mounted the surface mount-type crystal oscillator of FIG. 1 in the circuit board. FIG. 6 is a bottom view of a surface-mount type crystal resonator showing a first modification of the first embodiment. FIG. 6 is a bottom view of a surface-mounted crystal resonator showing a second modification of the first embodiment. FIG. 6 is a bottom view of a surface-mounted crystal resonator showing a third modification of the first embodiment. FIG. 6 is a bottom view of a surface-mount type crystal resonator showing a fourth modification of the first embodiment. FIG. 10 is a bottom view of a surface-mount type crystal resonator showing Modification Example 5 of the first embodiment. FIG. 10 is a bottom view of a surface-mount type crystal resonator showing Modification Example 6 of the first embodiment. Sectional drawing along the BB line of the state which mounted the surface mount-type crystal oscillator of FIG. 8 on the circuit board. The bottom view of the surface mount-type crystal resonator which shows a 2nd Example. The bottom view of the surface mount-type crystal resonator which shows a 3rd Example. FIG. 10 is a bottom view of a surface-mounted crystal resonator showing a first modification of the third embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each of the following embodiments, the case where the present invention is applied to a surface-mount type crystal resonator as an electronic component is shown.

  As shown in FIGS. 1 and 2, the surface-mount type crystal resonator according to Example 1 has a crystal diaphragm 3 that is an electronic component element, and a quartz diaphragm 3 that has a concave portion that is open at the top. It consists of a base 1 (to be housed) and a lid 2 that hermetically seals the crystal diaphragm 3 that is joined to the opening of the base 1 and held on the base 1.

  The base 1 is a rectangular parallelepiped as a whole, and has a configuration in which a ceramic such as alumina and a conductive material such as tungsten or molybdenum are appropriately laminated. As shown in FIG. 2, the base 1 includes a storage section 10 that is concave in a sectional view, and a bank portion 11 that is provided around the storage section 10 so as to surround the storage section 10. Specifically, the base 1 is a rectangular (planar view rectangular) flat plate-shaped ceramic base base 1a, and a ceramic having a large central portion and an outer size (planar view outer size) substantially equal to the base base 1a. The base body 1a, the frame body 1b, and the sealing member 11a are integrally fired. The top surface of the bank portion 11 (frame body 1b) is flat, and a sealing member 11a (a sealing material, a metal layer, or the like) is formed on the bank portion 11. In the first embodiment, for example, glass is formed as the sealing member 11a. However, when the lid 2 described later is a metal lid, the sealing member 11a is formed on the upper surface of a metallized layer made of tungsten, molybdenum, or the like. It is good also as a structure by which each layer of the nickel plating layer and the gold plating layer was formed, and also the structure by which the metal ring was formed in the upper part of these each layer.

  Further, there are four corners K1, K2, K3, and K4 on the outer periphery (outer peripheral edge in plan view) of the base 1, and the castellations C1 and C2 are vertically moved from the bottom surface of the base 1 to the top surface (upper surface) on the side surface of the base 1. C3 and C4 are formed, and castellations C5 and C6 are formed vertically on the side surface near the center of the short side of the base 1 from the bottom surface of the base 1 to the top surface (upper surface). Further, side terminal electrodes 121 and 131 which are connection electrodes are formed below the castellations C5 and C6 (from the bottom surface of the base 1 to a part below the side surface). 13 is electrically connected (connected).

The bottom surface of the base 1 has a rectangular shape in plan view. In the vicinity of both end portions of the bottom surface of the base 1, two rectangular shapes in plan view that are bonded to the external circuit board 4 (see FIG. 2) using the conductive bonding material D are used. Terminal electrodes 12 and 13 are formed. The terminal electrodes 12 and 13 are functional terminal electrodes that function as input / output external connection terminals of the crystal diaphragm 3 described later, and the side terminal electrodes 121 and 131 (the side terminal electrodes 131 are not shown) via castellations C5 and C6. ) Are extended to and electrically connected to electrode pads 122 and 132 (the electrode pad 132 is not shown) formed on the bottom surface inside the base 1. The terminal electrodes 12 and 13, the side terminal electrodes 121 and 131, and the electrode pads 122 and 132 are formed by metallizing a metallized material such as tungsten or molybdenum integrally with the base 1 to form metallized thereon. Plating is formed, and gold plating is formed on the top thereof.

  Bumps 12B and 13B that are slightly smaller than the terminal electrodes 12 and 13 are formed on the terminal electrodes 12 and 13, respectively. These bumps 12B, 13B are integrally formed by laminating metallized (tungsten, molybdenum, etc.) as a metal film of the same material on the metallized upper portions of the terminal electrodes 12,13. The terminal electrodes 12 and 13 and the bumps 12B and 13B are configured by firing these metallized materials integrally with the base 1, forming nickel plating on the metallized upper part, and forming gold plating on the upper part.

  Between the electrode pads 122 and 132, a crystal diaphragm 3 (an electronic component element in the present invention) is mounted. A pair of excitation electrodes and extraction electrodes (not shown) are formed on the front and back surfaces of the crystal diaphragm 3. The pair of excitation electrodes and extraction electrodes are in contact with, for example, the quartz diaphragm 3 (from the top of the quartz diaphragm 3) in the order of chromium, gold, chromium, gold, chromium, chromium, silver, chromium, or chromium, It is formed by laminating in the order of silver. Each of these electrodes (a pair of excitation electrode and extraction electrode) can be formed by a thin film forming means such as a vacuum evaporation method or a sputtering method. The extraction electrode of the crystal diaphragm 3 is conductively bonded to the electrode pads 122 and 132 by a conductive bonding material (not shown), and the crystal diaphragm 3 is held on the base 1. For example, a conductive bonding material such as a conductive resin adhesive, a metal bump, a metal plating bump, or a brazing material is used for conductive bonding between the excitation electrode of the crystal diaphragm 3 and the electrode pads 122 and 123 of the base 1. Can do.

  As the lid 2 that hermetically seals the base 1, a ceramic material such as plate-like alumina formed with a sealing member 11 a such as a glass sealing material is used. The plan view outline of the lid 2 is substantially the same as or slightly smaller than the outline of the base 1.

  The crystal vibrating plate 3 is housed in the storage portion 10 of the base 1 and covered with the lid 2 and hermetically sealed by a technique such as fusion bonding using a heating furnace, whereby a surface-mounted crystal resonator (electronic The component package is completed. Further, as shown in FIG. 1, the finished product of the crystal resonator is bonded to the upper part of the electrode patterns 41 and 42 of the circuit board 4 made of a glass epoxy material via a conductive bonding material D such as solder. .

  Since the present invention is characterized by this bump shape, the details will be described below. In the first embodiment shown in FIG. 1, the outer shells 121 </ b> B and 131 </ b> B of the bumps 12 </ b> B and 13 </ b> B are formed along the concentric circle R <b> 1 with respect to the center point O of the base 1 and from the outer peripheral ends of the terminal electrodes 12 and 13. It is formed in an isolated state. The terminal electrodes 12 and 13 and the bumps 12B and 13B are arranged point-symmetrically on the bottom surface of the base 1 with the center point O on the bottom surface of the base 1 as the center. Further, as shown in FIG. 2, the thickness T2 of the bumps 12B and 13B is more than three times thicker than the thickness T1 of the terminal electrodes 12 and 13. For example, in Example 1, two metallization layers (30 μm as the total thickness T2) of the bumps having a thickness of 15 μm are laminated on the metallization layer that is the basis of the terminal electrode having a thickness of T1 of 8 μm. Forming. Since the bump is thicker than the terminal electrode in this way, a solder pool is formed only in the region of the terminal electrode, the solder meniscus portion can be thickened, and the maximum stress occurrence point at the base end is kept away from the circuit board, It is possible to absorb the stress (strain) applied to the solder joint.

  In the first modification of the first embodiment shown in FIG. 3, the outlines 121 </ b> B and 131 </ b> B of the bumps 12 </ b> B and 13 </ b> B are formed along the concentric circle R <b> 1 with respect to the center point O of the base 1. It is formed in a state of being isolated from only the outer edges 122 and 132 of the outer wall. The terminal electrodes 12 and 13 and the bumps 12B and 13B are arranged point-symmetrically on the bottom surface of the base 1 with the center point O on the bottom surface of the base 1 as the center.

  4, the inner surfaces 122B and 132B of the bumps 12B and 13B are formed along the concentric circle R2 with respect to the center point O of the base 1, and the terminal electrodes 12, 13 is formed in a state of being isolated from the outer peripheral end portion. The terminal electrodes 12 and 13 and the bumps 12B and 13B are arranged point-symmetrically on the bottom surface of the base 1 with the center point O on the bottom surface of the base 1 as the center.

  Further, in the third modification of the first embodiment shown in FIG. 5, the outlines 121B and 131B of the bumps 12B and 13B are formed along the concentric circle R1 with respect to the center point O of the base 1, and the outline 122B of the bumps 12B and 13B. , 132B are formed along a concentric circle R2 with respect to the center point O of the base 1, and are formed in a state of being isolated from the outer peripheral ends of the terminal electrodes 12, 13. The terminal electrodes 12 and 13 and the bumps 12B and 13B are arranged point-symmetrically on the bottom surface of the base 1 with the center point O on the bottom surface of the base 1 as the center.

  Further, in the fourth modification of the first embodiment shown in FIG. 6, the outlines 121B and 131B of the bumps 12B and 13B are formed along the concentric ellipse R3 with respect to the center point O of the base 1, and the outlines of the bumps 12B and 13B are formed. 122B and 132B are formed along a concentric ellipse R4 with respect to the center point O of the base 1, and are formed in a state of being isolated from the outer peripheral ends of the terminal electrodes 12 and 13. The terminal electrodes 12 and 13 and the bumps 12B and 13B are arranged point-symmetrically on the bottom surface of the base 1 with the center point O on the bottom surface of the base 1 as the center. Note that the area where stress is applied to the maximum differs depending on the shape of the terminal electrode of the base and the shape of the electrode pattern of the circuit board. The strength of the area to be improved can be set, and the joint strength can be further improved in areas where stress is applied to the maximum according to the base size, base terminal shape, and circuit board electrode pattern shape. It becomes possible.

  Further, in the fifth modification of the first embodiment shown in FIG. 7, the outlines 121B and 131B of the bumps 12B and 13B are point-symmetric inclined portions 1211B and 1212B, and point-symmetric inclined portions with respect to the center point O of the base 1, respectively. 1311B and 1312B are formed, and the inner surfaces 122B and 132B of the bumps 12B and 13B are point-symmetric two-stage inclined parts 1221B and 1222B with respect to the center point O of the base 1, and point-symmetric two-stage inclined parts 1321B 1322B is formed, and is formed in a state of being isolated from the outer peripheral ends of the terminal electrodes 12 and 13. The terminal electrodes 12 and 13 and the bumps 12B and 13B are arranged point-symmetrically on the bottom surface of the base 1 with the center point O on the bottom surface of the base 1 as the center. Note that the area where stress is applied to the maximum differs depending on the shape of the terminal electrode on the base and the shape of the electrode pattern on the circuit board. By forming a point-symmetric inclined portion in this way, the stress is relieved and bonded. It is possible to set the strength area of the area where the strength is improved, and further increase the bonding strength in the area where the stress is applied to the maximum according to the base size, base terminal shape, and circuit board electrode pattern shape. Improvement is possible.

  With these configurations, since the two terminal electrodes 12 and 13 having a rectangular shape in plan view are formed on the base 1 having a rectangular shape in plan view, the formation area can be formed to the maximum necessary, so that the base 1 can be downsized. However, the bonding area does not decrease corresponding to the electrode patterns 41 and 42 of the circuit board 4.

  Further, since the bumps 12B and 13B are formed by integrally stacking metalized metal films made of the same material as the terminal electrodes 12 and 13, the bumps can be formed very easily and inexpensively.

  Further, since the terminal electrodes 12 and 13 are arranged point-symmetrically with respect to the center point O of the bottom surface of the base 1, the directionality of each terminal electrode is lost, and the center point of the bottom surface of the base 1 (center point in plan view) The stress can be relaxed more efficiently without deviation from O, and the occurrence of cracks (for example, solder cracks) in the conductive bonding material D can be remarkably suppressed.

  The bumps 12B and 13B disclosed in Example 1 (FIG. 1), Modification 1 (FIG. 3), Modification 3 (FIG. 5), and Modification 4 (FIG. 6) are smaller than the terminal electrodes 12 and 13. The outer shells 121B and 131B of the bumps are formed along the concentric circle R1 or the concentric ellipse R3 with respect to the center point O of the base 1, and are also formed in a state of being isolated from the outer or outer peripheral ends of the terminal electrodes 12 and 13. Has been. Further, the bumps 12B and 13B disclosed in the modified example 5 (FIG. 7) are smaller than the terminal electrodes 12 and 13, and the outer surfaces 121B and 131B of the bumps are point-symmetric inclined portions with respect to the center point O of the base 1, respectively. 1211B and 1212B, and point-symmetrical inclined portions 1311B and 1312B are formed, and are also formed in a state of being isolated from the outer edges or outer peripheral edges of the terminal electrodes 12 and 13. For this reason, the conductive bonding material (solder) D accumulates in the gaps between the terminal electrodes 12 and 13 and the electrode patterns 41 and 42 of the circuit board 4 that float on the outer sides of the outer shells 121B and 131B of the bumps. Since the thickness of the conductive bonding material D can be increased, the bonding strength between the terminal electrodes 12 and 13 and the electrode patterns 41 and 42 of the circuit board can be increased.

  In particular, the gaps between the bumps 121B and 131B and the electrode patterns 41 and 42 of the circuit board 4 between the outer sides 122 and 132 of the terminal electrodes 12 and 13 and the inner side of the base 1 Since the conductive bonding material (solder) D is configured to gradually accumulate in the region farther from the center point O, the maximum portion of the thermal expansion difference between the crystal resonator (electronic component package) and the circuit board 4 is approached. The bonding strength by the conductive bonding material D can be gradually increased. As a result, it is possible to further improve the bonding strength in the region where the stress is applied to the maximum without unnecessarily increasing the application amount of the conductive bonding material D. Further, the stress generated on the inside of the conductive bonding material D near the outside of the base 1 caused by the difference in thermal expansion between the crystal resonator (electronic component package) and the circuit board 4 can be gradually relaxed. When the conductive bonding material D is a metal brazing material such as solder, metal slip in the solder can be absorbed.

  Further, the boundary region between the thick conductive bonding material D formed in the gap region lifted by the bumps 12B and 13B and the thin conductive bonding material D formed in the gap region where the bumps 12B and 13B exist is, It is formed along the concentric circle R1 or the concentric ellipse R3 with respect to the center point O of the base 1, or the point-symmetric inclined portions 1211B and 1212B and the point-symmetric inclined portion 1311B with respect to the center point O of the base 1, respectively. Since it is formed along 1312B, the stress at the time of contraction or expansion of the circuit board 4 applied to the conductive bonding material D at these boundary portions is also relieved, and the influence of cracks based on the boundary portions hardly occurs.

  The bumps 12B and 13B disclosed in the modification 2 (FIG. 4), the modification 3 (FIG. 5), and the modification 4 (FIG. 6) are smaller than the terminal electrodes 12 and 13 in the bumps 12B and 13B. Are formed along a concentric circle R2 or a concentric ellipse R4 with respect to the center point O of the base 1 and are also isolated from the inner or outer peripheral ends of the terminal electrodes 12 and 13. Has been. Further, the bumps 12B and 13B disclosed in the modified example 5 (FIG. 7) are smaller than the terminal electrodes 12 and 13, and the inner surfaces 122B and 132B of the bumps are 2 symmetrical with respect to the center point O of the base 1, respectively. Stepped inclined portions 1221B and 1222B and point-symmetric two-step inclined portions 1321B and 1322B are formed, and are also formed in a state of being isolated from the outer end or outer peripheral end of the terminal electrodes 12 and 13. For this reason, the conductive bonding material (solder) D accumulates in the gaps between the terminal electrodes 12 and 13 and the electrode patterns 41 and 42 of the circuit board 4 floating inside the bumps 122B and 132B. Since the thickness of the conductive bonding material D can be increased, the bonding strength between the terminal electrodes 12 and 13 and the electrode patterns 41 and 42 of the circuit board 4 can be increased.

  In particular, the gaps between the bumps 122B and 132B inside the base 1 and the electrode patterns 41 and 42 of the circuit board 4 between the insides 123 and 133 of the terminal electrodes 12 and 13 and the base 1 are as follows. Two stages of inclined portions 1221B and 1222B that are formed along a concentric circle R2 or a concentric ellipse R4 with respect to the center point O of the base 1 or are point-symmetric with respect to the center point O of the base 1, and a point-symmetric inclination Since the conductive bonding material (solder) D having a large thickness accumulated in the gap region is formed along the concentric circle R2 or the concentric ellipse R4 with respect to the center point O of the base 1 in the same manner because it is formed along the portions 1321B and 1322B. Formed or formed along two stages of inclined portions 1221B and 1222B and point-symmetric inclined portions 1321B and 1322B that are point-symmetric with respect to the center point O of the base 1, respectively. Since the can stress generated against the interior of the conductive bonding material D around the center point O of the base 1 that occurs during the systolic or expansion of the circuit board 4 is relaxed gradually. When the conductive bonding material D is a metal brazing material such as solder, metal slip in the solder can be absorbed. Further, the bonding strength between the crystal resonator (electronic component package) and the circuit board 4 due to the conductive bonding material D is less likely to vary, and generation of unnecessary stress due to the conductive bonding material D can be eliminated. .

  In addition, the boundary region between the thick conductive bonding material D formed in the gap region lifted by the bumps 12B and 13B and the thin conductive bonding material D formed in the gap region where the bumps 12B and 13B are present, It is formed along a concentric circle R2 or a concentric ellipse R4 with respect to the base center point O, or two stages of inclined portions 1221B and 1222B that are point-symmetric with respect to the center point O of the base 1, and a point-symmetric inclined portion 1321B. And 1322B, the stress at the time of contraction or expansion of the circuit board 4 applied to the conductive bonding material D at these boundary portions is relieved, and the influence of cracks based on the boundary portions is less likely to occur. .

  The bumps 12B and 13B disclosed in the modification 3 (FIG. 5) and the modification 4 (FIG. 6) are such that the outer shells 121B and 131B and the inner shells 122B and 132B are concentric circles R1 with respect to the center point O of the base 1. And R2 or concentric ellipses R3 and R4. Further, the bumps 12B and 13B disclosed in the modified example 5 (FIG. 7) are inclined portions 1211B and 1212B in which the outer shells 121B and 131B and the inner shells 122B and 132B are point-symmetric with respect to the center point O of the base 1, respectively. , And point-symmetric inclined portions 1311B and 1312B are formed, and point-symmetric two-step inclined portions 1221B and 1222B and point-symmetric two-step inclined portions 1321B and 1322B are formed. It is more preferable that the effects can be synergistically combined.

  8 and 9, the bumps 12B and 13B are integrally formed, for example, by laminating two metallized layers, and the bumps 12B and 13B are formed on the lower layer side 12B-1. , 13B-1 are formed along the concentric circle R1 with respect to the center point O of the base 1, and the outer layers 121B-2 and 13B-2 of the upper layers 12B-2 and 13B-2 of the bumps 12B and 13B are formed. −2 and 131B-2 are formed along a concentric circle R2 with respect to the center point O of the base 1, and are isolated from the outer edges 122 and 132 of the terminal electrodes 12 and 13 (at the center point O of the base 1). It is formed in a step shape so that the thickness of the bump increases as it approaches.

  In the bumps 12B and 13B disclosed in the modified example 6 (FIGS. 8 and 9), in addition to the above-described effects, the conductive bonding material (solder) D is closer to the end region of the base farther from the center point O of the base 1. Since the thickness of the conductive bonding material D in the gap portion can be gradually increased, it approaches the end portion of the base, which is the largest portion of the difference in thermal expansion between the electronic component package and the circuit board 4. Accordingly, the bonding strength between the terminal electrodes 12 and 13 and the electrode patterns 41 and 42 of the circuit board can be gradually increased. As a result, it is possible to further improve the bonding strength in a region where stress is applied to the maximum without unnecessarily increasing the coating amount of the conductive bonding material D. The stress generated on the inside of the conductive bonding material D existing at the end of the base, which is the maximum portion of the difference in thermal expansion between the electronic component package and the circuit board 4, can be gradually reduced.

  Next, a surface-mount type crystal resonator according to a second embodiment of the present invention will be described with reference to FIG. In addition, while attaching the same number to the part similar to Example 1, a part of description is omitted.

  In the crystal resonator according to the second embodiment, as shown in FIG. 10, the conductive bonding material is connected to the external circuit board 4 (see FIG. 2) in the vicinity of the four corners with respect to the bottom surface of the base 1 having a rectangular shape in plan view. Four terminal electrodes 12, 13, 14, 15 having a rectangular shape in plan view that are joined using D are formed. More specifically, a terminal electrode 12 that functions as an input / output external connection terminal of the crystal diaphragm 3 is formed at a position of the corner K1, which is one corner position with respect to the bottom surface of the base 1, and the angle with respect to the bottom surface of the base 1 A terminal electrode 13 that functions as an input / output external connection terminal of the crystal diaphragm 3 is formed at the position of the corner K3 that is the first diagonal position corresponding to the diagonal position of K1. As shown in FIG. 10, the terminal electrodes 12 and 13 of this embodiment are formed in a rectangular shape in plan view, and are formed in a state of being slightly separated from the corners K1 and K3 via the side surface terminal electrodes 121 and 131. Further, a terminal electrode that functions as a ground external connection terminal electrically connected to a metal lid (not shown) at the position of the corner K2, which is the other corner facing the corner K1 in the short side direction of the bottom surface of the base 1. 14 is formed, and a ground external connection electrically connected to a metal lid (not shown) at a position of a corner K4 which is a second diagonal position corresponding to a diagonal position of the other angle K2 with respect to the bottom surface of the base 1 A terminal electrode 15 that functions as a terminal is formed. As shown in FIG. 10, the terminal electrodes 14 and 15 of this embodiment are formed in a rectangular shape in plan view, and are formed in a state of being slightly separated from the corners K2 and K4 via the side terminal electrodes 141 and 151. . The terminal electrodes 12, 13, 14, and 15 have the same shape. These terminal electrodes 12, 13, 14, 15 and side terminal electrodes 121, 131, 141, 151 are integrally fired with a base 1 from a metallized material such as tungsten or molybdenum, as in the first embodiment. The metallization is formed, the nickel plating is formed on the upper part, and the gold plating is formed on the upper part. In the second embodiment, only one of the terminal electrodes 14 and 15 may function as a ground external connection terminal. When it is not necessary to connect as a ground external connection terminal, both the terminal electrodes 14 and 15 are connected. It may be a non-functional terminal.

  Bumps 12B, 13B, 14B, and 15B that are slightly smaller than the terminal electrodes 12, 13, 14, and 15 are formed on the terminal electrodes 12, 13, 14, and 15, respectively. These bumps 12B, 13B, 14B, and 15B are integrally formed by laminating metallization (tungsten, molybdenum, etc.) as a metal film of the same material on the metallization upper part of the terminal electrodes 12, 13, 14, and 15. These terminal electrodes 12, 13, 14, and 15 and bumps 12B, 13B, 14B, and 15B are formed by firing these metallized materials integrally with the base 1, nickel plating is formed on the metallized upper part, and gold plating is formed on the upper part. Formed and configured.

  In the second embodiment shown in FIG. 10, the outlines 121B, 131B, 141B, 151B of the bumps 12B, 13B, 14B, 15B are formed along the concentric circle R5 with respect to the center point O of the base 1, and the terminal electrodes It is formed in a state of being isolated from the outer peripheral ends of 12, 13, 14, and 15. The terminal electrodes 12, 13, 14, 15 and the bumps 12 </ b> B, 13 </ b> B, 14 </ b> B, 15 </ b> B are arranged point-symmetrically on the bottom surface of the base 1 around the center point O on the bottom surface of the base 1.

  A metal lid (not shown) that hermetically seals the base 1 is a metal member in which a sealing material such as a metal brazing material is formed on a metal base material. The metal lid has a multilayer structure in which, for example, a nickel plating layer, a Kovar base material, a copper intermediate layer, and a silver brazing layer are laminated in this order from the upper surface, and the silver brazing layer is joined to the metal layer of the base 1. The external shape of the metal lid in plan view is substantially the same as or slightly smaller than the external shape of the base 1. The sealing member is not limited to silver brazing, and other sealing brazing materials may be used, and the sealing member may be composed of a plating layer such as gold or gold tin.

  The crystal diaphragm 3 is stored in the storage portion 10 of the base 1, covered with a metal lid (not shown), and hermetically sealed by a technique such as seam welding, welding by beam irradiation, or brazing with a heating furnace. As a result, the surface-mounted crystal resonator of Example 2 is completed.

  In the present invention, the terminal electrode shown in the first embodiment is not limited to the one having two terminals, and the terminal electrode shown in the second embodiment can be applied to one having four terminals. In addition, in the second embodiment, not only the same effect as in the first embodiment described above can be obtained, but also some terminals can function as a ground external connection terminal. The electromagnetic noise can be detected by the metal lid, and the electromagnetic noise can be removed by the terminal electrodes 14 and 15. As a result, it is possible to eliminate the adverse effect of electromagnetic noise on the crystal diaphragm (electronic component element) inside the crystal resonator (electronic component package), and to have a configuration capable of taking EMS countermeasures. In addition, the concentric elliptical configuration disclosed in the first embodiment and the configuration of the point-symmetric inclined portion can be implemented on the bumps of the second embodiment. You may implement the structure formed not only in the outline of a bump but in the outline of a bump, or the outline and the outline of a bump.

  Next, a surface-mount type crystal resonator according to a third embodiment of the present invention will be described with reference to FIGS. In addition, while attaching the same number to the part similar to Example 1 or Example 2, a part of description is omitted.

  In the crystal resonator according to the third embodiment, as shown in FIG. 11, the terminal electrode 12 having a rectangular shape in plan view is formed by deviating from the bottom surface of the base 1 having a rectangular shape in plan view at an angle K1 that is a corner position thereof. The terminal electrode 13 having a rectangular shape in a plan view is formed by deviating to a corner K3 which is a first diagonal position corresponding to the diagonal position of the corner K1 with respect to the bottom surface of the base 1, and at the position of the corner K1. On the other hand, the angle K2 which is the other angle position facing the short side direction of the bottom surface of the base 1 and the angle K4 which is the second diagonal position corresponding to the diagonal position of the angle K2 with respect to the bottom surface of the base 1 are as described above. The electrodeless regions 16 and 17 are not formed with terminal electrodes. On the side surface near the center of the short side of the base 1, castellations C5 and C6 are formed vertically from the bottom surface of the base 1 to the top surface (upper surface), and below the castellations C5 and C6 (the bottom surface of the base 1). Side terminal electrodes 121 and 131 that are connecting electrodes are formed (from the first part to the lower part of the side surface), and the side terminal electrodes 121 and 131 are electrically connected to (connected to) the terminal electrodes 12 and 13. The terminal electrodes 12 and 13 and the side terminal electrodes 121 and 131 are formed by metallizing a metallized material such as tungsten or molybdenum integrally with the base 1 in the same manner as in the first and second embodiments. A nickel plating is formed on the upper part, and a gold plating is formed on the upper part.

  Bumps 12B and 13B that are slightly smaller than the terminal electrodes 12 and 13 are formed on the terminal electrodes 12 and 13, respectively. These bumps 12B, 13B are integrally formed by laminating metallized (tungsten, molybdenum, etc.) as a metal film of the same material on the metallized upper portions of the terminal electrodes 12,13. The terminal electrodes 12 and 13 and the bumps 12B and 13B are configured by firing these metallized materials integrally with the base 1, forming nickel plating on the metallized upper part, and forming gold plating on the upper part.

  In the third embodiment shown in FIG. 11, the outlines 121B and 131B of the bumps 12B and 13B are formed along a concentric circle R6 with respect to the center point O of the base 1, and the outlines 122B and 132B of the bumps 12B and 13B are the base 1 Is formed along a concentric circle R7 with respect to the center point O of the terminal electrode 12, and is formed in a state of being isolated from the outer peripheral ends of the terminal electrodes 12 and 13. The terminal electrodes 12 and 13 and the bumps 12B and 13B are arranged point-symmetrically on the bottom surface of the base 1 with the center point O on the bottom surface of the base 1 as the center.

  Further, in the crystal resonator according to the first modification of the third embodiment, as shown in FIG. 12, the crystal resonator is deviated from the bottom surface of the base 1 having a rectangular shape in plan view to an angle K1 that is one of the two positions in plan view. A first terminal electrode group configured by forming rectangular terminal electrodes 12 and 14 in parallel is formed, and a first diagonal position corresponding to a diagonal position of the angle K1 with respect to the bottom surface of the base 1 is set at a corner K3. The second terminal electrode group is formed by deviating to form two terminal electrodes 13 and 15 having a rectangular shape in plan view, and the short side of the bottom surface of the base 1 with respect to the position of the corner K1. The corner K2 which is the other corner position facing the direction and the corner K4 which is the second diagonal position corresponding to the diagonal position of the corner K2 with respect to the bottom surface of the base 1 are an electrodeless region 16 in which the terminal electrode is not formed. , 17. Among these, the terminal electrodes 12 and 13 function as input / output external connection terminals of the crystal diaphragm 3, and are formed in a state of being slightly separated from the corners K1 and K3 via the side surface terminal electrodes 121 and 131. The terminal electrodes 14 and 15 function as ground external connection terminals electrically connected to a metal lid (not shown), and are slightly separated from the castellations C5 and C6 via the side terminal electrodes 141 and 151. It is formed in a state. These terminal electrodes 12, 13, 14, 15 and side terminal electrodes 121, 131, 141, 151 are integrally formed with the base 1 using a metallized material such as tungsten or molybdenum, as in the first and second embodiments. The metallization is formed by firing, nickel plating is formed on the top, and gold plating is formed on the top.

  Bumps 12B, 13B, 14B, and 15B that are slightly smaller than the terminal electrodes 12, 13, 14, and 15 are formed on the terminal electrodes 12, 13, 14, and 15, respectively. These bumps 12B, 13B, 14B, and 15B are integrally formed by laminating metallization (tungsten, molybdenum, etc.) as a metal film of the same material on the metallization upper part of the terminal electrodes 12, 13, 14, and 15. These terminal electrodes 12, 13, 14, and 15 and bumps 12B, 13B, 14B, and 15B are formed by firing these metallized materials integrally with the base 1, nickel plating is formed on the metallized upper part, and gold plating is formed on the upper part. Formed and configured.

  In the modification of the third embodiment shown in FIG. 12, the outlines 121B, 131B, 141B, 151B of the bumps 12B, 13B, 14B, 15B are formed along the concentric circle R8 with respect to the center point O of the base 1, and the bumps 12B , 13B, 14B, and 15B are formed near the center point O of the base 1 with no-bump regions 123B, 133B, 143B, and 153B having an outer contour along the concentric circle R9 and an inner contour along the concentric circle R10. In addition, the terminal electrodes 12, 13, 14 and 15 are formed so as to be isolated from only the outer end portions 122, 132, 142 and 152. The terminal electrodes 12, 13, 14, 15 and the bumps 12 </ b> B, 13 </ b> B, 14 </ b> B, 15 </ b> B are arranged point-symmetrically on the bottom surface of the base 1 around the center point O on the bottom surface of the base 1.

  The crystal vibration plate 3 is stored in the storage portion 10 of the base 1 configured as described above, and is covered with a lid (not shown) and hermetically sealed, so that the surface-mounted crystal resonator (electronic The component package is completed.

  The present invention can be applied not only to the first and second embodiments but also to the terminal electrode structure shown in the third embodiment. In addition, the third embodiment not only provides the same operational effects as those of the first and second embodiments, but also a surface-mount type crystal when electrically and mechanically bonded to the circuit board 4 by the conductive bonding material D. Even if a thermal expansion difference occurs between the vibrator (specifically, the base 1) and the circuit board 4, the other-angle position K2 and the second diagonal position K4 corresponding to the diagonal position of the other-angle position K2 are: Since no electrodes are formed as the non-electrode regions 16 and 17, the stress generated when the surface-mounted crystal resonator (specifically, the base 1) is joined is transferred from the terminal electrode formation region to the non-electrode region. The mounting-type crystal resonator (specifically, the base 1) can be released so as to rotate in a plane. As a result, since stress does not concentrate on the conductive bonding material D interposed between the surface-mount type crystal resonator (specifically, the base 1) and the circuit board 4, fatigue damage is less likely to occur from the conductive bonding material D. The adverse effects of cracks (for example, solder cracks) in the conductive bonding material D can be further reduced and prevented. Moreover, the concentric elliptical configuration disclosed in the first embodiment and the configuration of the point-symmetric inclined portion can be implemented on the bumps of the third embodiment. You may implement the structure formed only in the outline of a bump, or only in the outline of a bump.

  In the above-described embodiment, a surface-mount type crystal resonator is taken as an example, but the present invention can also be applied to other surface-mount type electronic component packages used in electronic devices such as crystal filters and crystal oscillators. Further, although a ceramic material is disclosed as an insulating package (base), a glass material may be used. Although metallization is disclosed as the metal film of the terminal electrode, a plating material may be used.

  The present invention can be implemented in various other forms without departing from the spirit or main features thereof, and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not limited by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

  The present invention can be applied to an electronic component package such as a crystal resonator and a base of an electronic component package.

1 Base 2 Lid 3 Crystal Diaphragm (Electronic Component Element)
4 Circuit board

Claims (4)

In the base of the electronic component package that holds the electronic component element,
The bottom surface of the base is rectangular in plan view, and a plurality of terminal electrodes in rectangular shape in plan view that are bonded to an external circuit board using a conductive bonding material are formed,
A bump made of a metal film is integrally formed on the upper surface of the terminal electrode, the bump is smaller than the terminal electrode, and the outer periphery of the bump is concentric or concentric with respect to the base center point of the electronic component package. A base for an electronic component package, characterized in that it is formed in a shape, or is formed in a state in which a point-symmetric inclined portion is formed and is also isolated from the outer edge of the terminal electrode. In the base of the electronic component package that holds the electronic component element,
The bottom surface of the base is rectangular in plan view, and a plurality of terminal electrodes in rectangular shape in plan view that are bonded to an external circuit board using a conductive bonding material are formed,
A bump made of a metal film is integrally formed on the upper surface of the terminal electrode. The bump is smaller than the terminal electrode, and the inner surface of the bump is concentric or concentric with the base center point of the electronic component package. A base for an electronic component package, characterized in that it is formed in an elliptical shape or has a point-symmetric inclined portion and is formed in a state of being isolated from the inner edge of the terminal electrode. In the base of the electronic component package according to claim 1 or 2,
A first terminal electrode group consisting of a first terminal electrode consisting of one terminal electrode or two or more terminal electrodes formed in parallel with a deviation from the bottom surface to the corner position,
A configuration in which a second terminal electrode consisting of one terminal electrode or two or more terminal electrodes are formed in parallel by shifting to a first diagonal position corresponding to the diagonal position of the one corner position with respect to the bottom surface. A second terminal electrode group is formed,
The terminal electrode is not formed between the other corner position facing the short side direction of the bottom surface with respect to the one corner position and the second diagonal position corresponding to the diagonal position of the other corner position with respect to the bottom surface. A base of an electronic component package characterized by being an electrode region. An electronic component package comprising: a base of the electronic component package according to claim 1; and a lid for hermetically sealing the electronic component element.

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