JP2011129673A - Charged-particle beam lithographic apparatus and method of regulating temperature in substrate placement chamber - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lithographic apparatus capable of more quickly regulating a temperature in a placement chamber in which a substrate is placed. <P>SOLUTION: The lithographic apparatus 100 includes: a drawing chamber 103 in which a substrate 101 is placed and a pattern is drawn on the substrate by using an electron beam; a transfer system that transfers a temperature-sensor incorporated substrate 10 into the drawing chamber 103 so that the temperature-sensor incorporated substrate 10 is carried into the chamber in a state that the drawing chamber 103 is maintained at an equilibrium temperature by using the temperature-sensor incorporated substrate 10 that measures its own temperature change, and the temperature-sensor incorporated substrate 10 is carried out before the temperature measured by the temperature-sensor incorporated substrate 10 becomes equilibrium in the drawing chamber; a control computer 110 which determines an equilibrium temperature in the drawing chamber by using temperature change data obtained by the temperature-sensor incorporated substrate; and a temperature control circuit 118 which controls a temperature in the drawing chamber 103 on the basis of the determined equilibrium temperature. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a charged particle beam drawing apparatus and a temperature adjustment method for a substrate arrangement chamber, and more particularly to a temperature adjustment mechanism and method for a substrate arrangement chamber including a drawing chamber for drawing a pattern on a substrate using an electron beam.

  Lithography technology, which is responsible for the progress of miniaturization of semiconductor devices, is an extremely important process for generating a pattern among semiconductor manufacturing processes. In recent years, with the high integration of LSI, circuit line widths required for semiconductor devices have been reduced year by year. In order to form a desired circuit pattern on these semiconductor devices, a highly accurate original pattern (also referred to as a reticle or a mask) is required. Here, the electron beam (electron beam) drawing technique has an essentially excellent resolution, and is used for producing a high-precision original pattern.

  FIG. 7 is a conceptual diagram for explaining the operation of the variable shaped electron beam drawing apparatus. The variable shaped electron beam (EB) drawing apparatus operates as follows. In the first aperture 410, a rectangular opening for forming the electron beam 330, for example, a rectangular opening 411 is formed. Further, the second aperture 420 is formed with a variable shaping opening 421 for shaping the electron beam 330 having passed through the opening 411 of the first aperture 410 into a desired rectangular shape. The electron beam 330 irradiated from the charged particle source 430 and passed through the opening 411 of the first aperture 410 is deflected by the deflector, passes through a part of the variable shaping opening 421 of the second aperture 420, and passes through a predetermined range. The sample 340 mounted on a stage that continuously moves in one direction (for example, the X direction) is irradiated. That is, the drawing area of the sample 340 mounted on the stage in which the rectangular shape that can pass through both the opening 411 of the first aperture 410 and the variable shaping opening 421 of the second aperture 420 is continuously moved in the X direction. Drawn on. A method of creating an arbitrary shape by passing both the opening 411 of the first aperture 410 and the variable shaping opening 421 of the second aperture 420 is referred to as a variable shaping method.

  Here, in the electron beam drawing apparatus, it is necessary to measure the temperature in the chamber in order to adjust the temperature in the chamber. For example, a temperature measurement mask with a built-in sensor is placed in the chamber, and the temperature measurement mask is waited in the chamber until the temperature of the temperature measurement mask reaches an equilibrium state. Thereby, it is determined that the temperature in the equilibrium state is the temperature in the chamber (see, for example, Patent Document 1). When the chamber temperature is measured by such a method, it is necessary to wait until the temperature of the temperature measurement mask reaches an equilibrium state, which causes a problem that it takes a long time to start up the apparatus. In addition, since a plurality of chambers are usually arranged in the drawing apparatus in addition to the drawing room for drawing, when waiting until the temperature of the temperature measurement mask reaches an equilibrium state for each chamber, There is a problem that it takes a considerably long time to grasp the temperature in the chamber. In recent years, a battery-type temperature measurement mask is sometimes used. However, since the battery-type temperature measurement mask is used, the measurement time is limited. In order to continuously measure the inside of a plurality of chambers, for example, a measurement time of about 15 hours is required when waiting for an equilibrium state. However, since the lifetime of the battery is shorter than this, it is difficult to continuously measure the entire apparatus with the battery-type temperature measurement mask.

Japanese Patent No. 4150493

  As described above, when adjusting the chamber temperature of the drawing apparatus, it is necessary to wait until the temperature of the temperature measurement mask reaches an equilibrium state, and there is a problem that it takes a long time to start up the apparatus. In particular, if the number of chambers is increased, there is a problem that it takes a longer time for the apparatus to start up.

  Accordingly, an object of the present invention is to provide a drawing apparatus capable of overcoming such problems and adjusting the temperature of the arrangement chamber in which the substrate is arranged in a shorter time and a method for adjusting the temperature of the arrangement chamber.

A charged particle beam drawing apparatus according to one embodiment of the present invention includes:
A drawing chamber for placing a substrate and drawing a pattern on the substrate using a charged particle beam;
Using a temperature sensor built-in board that measures its own temperature change, the temperature sensor built-in board is carried in while the drawing chamber is maintained at an equilibrium temperature, and the temperature measured by the temperature sensor built-in board is in an equilibrium state in the drawing room. A transport system for transporting the temperature sensor built-in substrate to the drawing chamber so that the temperature sensor built-in substrate is unloaded before
A calculation unit that calculates the equilibrium temperature of the drawing room using the data of the temperature change measured by the temperature sensor built-in substrate,
A control unit for controlling the temperature of the drawing chamber based on the calculated equilibrium temperature;
It is provided with.

  After carrying in, the temperature sensor built-in substrate is carried out before the temperature measured by the temperature sensor built-in substrate reaches the equilibrium state in the drawing chamber, so that it is not necessary to wait until the temperature sensor built-in substrate becomes the equilibrium state. The measurement time can be shortened accordingly.

In addition, the apparatus further includes a plurality of substrate placement chambers for placing such substrates, including a drawing chamber.
In the transfer system, the temperature sensor built-in substrate is carried in with each of the plurality of substrate placement chambers held at the equilibrium temperature, and the temperature measured by the temperature sensor built-in substrate is changed to the equilibrium state in each substrate placement chamber. The temperature sensor built-in substrate is sequentially transferred into a plurality of substrate placement chambers so as to move to the substrate placement chamber,
The calculation unit calculates the equilibrium temperature of each substrate placement chamber using the temperature change data measured on the temperature sensor built-in substrate,
It is preferable that the controller controls the temperature of each substrate placement chamber based on the calculated equilibrium temperature.

  In addition, it is preferable that the calculation unit calculates the equilibrium temperature of each substrate placement chamber using a model formula for each substrate placement chamber.

In addition, the temperature sensor built-in board has a plurality of temperature sensors with different arrangement positions.
It is preferable that the calculation unit calculates the equilibrium temperature using an average value of a plurality of temperatures measured by a plurality of temperature sensors.

The temperature adjustment method for the substrate placement chamber of one embodiment of the present invention is
Using the temperature sensor built-in substrate that measures its own temperature change, the temperature sensor built-in substrate is carried in while the drawing chamber for placing the substrate and drawing the pattern on the substrate using the charged particle beam is maintained at the equilibrium temperature. A step of transporting the temperature sensor built-in substrate to the drawing chamber so that the temperature sensor built-in substrate is unloaded before the temperature measured by the temperature sensor built-in substrate reaches an equilibrium state in the drawing chamber;
Calculating the equilibrium temperature of the drawing room using the temperature change data measured on the temperature sensor built-in substrate;
Controlling the temperature of the drawing chamber based on the calculated equilibrium temperature;
It is provided with.

  According to the present invention, the temperature measurement time can be greatly shortened. Therefore, the start-up time of the drawing apparatus can be greatly shortened.

1 is a conceptual diagram illustrating a configuration of a drawing apparatus according to Embodiment 1. FIG. 3 is a conceptual top view showing an example of a temperature sensor built-in substrate in Embodiment 1. FIG. FIG. 3 is a flowchart showing main steps of a substrate arrangement chamber temperature adjustment method according to the first embodiment. FIG. 3 is a conceptual diagram showing a transport path of a substrate with a built-in temperature sensor in the substrate placement chamber temperature adjustment method according to the first embodiment. 6 is a graph showing an example of a result of calculating an equilibrium temperature from a model equation using temperature measurement data in the alignment chamber in the first embodiment. 7 is a graph showing another example of the result of calculating the equilibrium temperature from the model equation using the temperature measurement data in the alignment chamber in the first embodiment. It is a conceptual diagram for demonstrating operation | movement of a variable shaping type | mold electron beam drawing apparatus.

  Hereinafter, in the embodiment, a configuration using an electron beam will be described as an example of a charged particle beam. However, the charged particle beam is not limited to an electron beam, and a beam using charged particles such as an ion beam may be used.

Embodiment 1 FIG.
FIG. 1 is a conceptual diagram illustrating a configuration of a drawing apparatus according to the first embodiment. In FIG. 1, a drawing apparatus 100 is an example of a charged particle beam drawing apparatus. Here, in particular, an example of a variable shaping type electron beam drawing apparatus is shown. The drawing apparatus 100 includes a drawing unit 150, a control unit 160, a loading / unloading port (I / F) 120, a load lock (L / L) chamber 130, a robot (R) chamber 140, an alignment (ALN) chamber 146, a vacuum pump 170, And a constant temperature fluid supply device 180. The drawing apparatus 100 draws a desired pattern on the substrate 101 using the electron beam 200. Examples of the substrate 101 to be drawn include an exposure mask substrate that transfers a pattern to a wafer. The mask substrate includes, for example, mask blanks on which no pattern is formed yet.

  The drawing unit 150 includes an electron column 102 and a drawing chamber 103. In the electron column 102, an electron gun 201, an illumination lens 202, a first aperture 203, a projection lens 204, a deflector 205, a second aperture 206, an objective lens 207, and a deflector 208 are arranged. In the drawing chamber 103, an XY stage 105 is arranged so as to be movable. When drawing a pattern, the substrate 101 is placed on the XY stage 105. In addition, a transfer robot 122 that transfers the substrate 101 is disposed in the carry-in / out opening 120. A transfer robot 142 that transfers the substrate 101 is disposed in the robot chamber 140.

  The vacuum pump 170 exhausts the gas in the robot chamber 140 and the alignment chamber 146 via the valve 172. Thereby, the robot chamber 140 and the alignment chamber 146 are maintained in a vacuum atmosphere. The vacuum pump 170 exhausts the gas in the electron column 102 and the drawing chamber 103 via the valve 174. As a result, the inside of the electron column 102 and the drawing chamber 103 are maintained in a vacuum atmosphere. Further, the vacuum pump 170 exhausts the gas in the load lock chamber 130 via the valve 176. Thereby, the inside of the load lock chamber 130 is controlled to a vacuum atmosphere as necessary. In addition, gate valves 132, 134, and 136 are disposed at boundaries between the loading / unloading port 120, the load lock chamber 130, the robot chamber 140, and the drawing chamber 103.

  Further, in each of the plurality of substrate placement chambers such as the loading / unloading port 120, the L / L chamber 130, the robot chamber 140, the alignment chamber 146, and the drawing chamber 103 where the substrate 101 is placed, the temperature is set for each drawing operation. It is required to be maintained at the set temperature. Therefore, the primary thermostatic fluid 181 whose temperature is controlled separately by a chiller device or the like is supplied to the thermostatic fluid supply device 180 to perform heat exchange, and the secondary thermostatic fluids 182 to 185 exchanged heat from the thermostatic fluid supply device 180. However, it is supplied to various temperature-controlled products in which temperature management is important. Then, the thermostatic fluids 182 to 185 that have undergone heat exchange are returned to the thermostatic fluid supply device 180 again. Thus, the constant temperature fluids 182 to 185 circulate. In FIG. 1, as an example, four systems of constant temperature fluids 182 to 185 are circulated. However, it is not restricted to this, Furthermore, you may supply to another to-be-heated material. For example, it is preferable to be supplied to the electron column 102.

  The control unit 160 includes a control computer 110, a memory 111, an external interface (I / F) circuit 112, a drawing control circuit 114, a conveyance control circuit 116, and a temperature control circuit 118. The control computer 110, the memory 111, the external interface (I / F) circuit 112, the drawing control circuit 114, the transport control circuit 116, and the temperature control circuit 118 are connected to each other via a bus (not shown). The drawing control circuit 114, the conveyance control circuit 116, and the temperature control circuit 118 are controlled by the control computer 110. The drawing control circuit 114 controls the operation of the drawing unit 150 according to the control contents of the control computer 110. Further, according to the control contents of the control computer 110, the transfer control circuit 116 drives the devices in the transfer port 120, the L / L chamber 130, the robot chamber 140, and the alignment chamber 146, which become a transfer system. Further, the temperature control circuit 118 controls the constant temperature fluid supply device 180 according to the control contents of the control computer 110. By controlling the constant temperature fluid supply device 180, the temperatures in a plurality of substrate placement chambers such as the loading / unloading port 120, the L / L chamber 130, the robot chamber 140, the alignment chamber 146, and the drawing chamber 103 are adjusted and controlled. Information input to or output from the control computer 110 and information being calculated are stored in the memory 111 each time.

  Here, FIG. 1 shows components necessary for explaining the first embodiment. The drawing apparatus 100 may normally include other necessary configurations. The transport robots 122 and 142 may be any mechanical mechanism such as an elevator mechanism or a rotation mechanism.

  When drawing a pattern on the substrate 101, the substrate 101 is transferred onto the XY stage 105 through the following transfer path. First, the substrate 101 is placed at the carry-in / out entrance 120. The substrate 101 disposed at the carry-in / out port 120 is transported onto a support member in the L / L chamber 130 by the transport robot 122. Then, the transfer robot 142 is transferred to the stage in the alignment chamber 146 via the robot chamber 140. Then, the substrate 101 is aligned in the alignment chamber 146. The aligned substrate 101 is transferred onto the XY stage 105 of the drawing chamber 103 by the transfer robot 142 via the robot chamber 140.

  Then, after the substrate 101 is placed on the XY stage 105, the following operation is performed. An electron beam 200 emitted from an electron gun 201 which is an example of an irradiation unit illuminates the entire first aperture 203 having a rectangular hole, for example, a rectangular hole, by an illumination lens 202. Here, the electron beam 200 is first formed into a rectangle, for example, a rectangle. Then, the electron beam 200 of the first aperture image that has passed through the first aperture 203 is projected onto the second aperture 206 by the projection lens 204. The position of the first aperture image on the second aperture 206 is deflection-controlled by the deflector 205, and the beam shape and size can be changed. As a result, the electron beam 200 is shaped. Thus, the electron beam 200 is variably shaped. Then, the electron beam 200 of the second aperture image that has passed through the second aperture 206 is focused by the objective lens 207 and deflected by the deflector 208. As a result, for example, a desired position of the substrate 101 on the continuously moving XY stage 105 is irradiated. As described above, in the drawing chamber 103, the substrate 101 is arranged and a pattern is drawn on the substrate 101 using the electron beam 200.

  Here, before drawing a pattern on the substrate 101, as one of the startup operations of the apparatus, a plurality of substrates such as the carry-in / out entrance 120, the L / L chamber 130, the robot chamber 140, the alignment chamber 146, and the drawing chamber 103 are used. The temperature in the placement chamber is controlled to each set temperature. Since it is important that the substrate 101 to be drawn has a desired equilibrium temperature, it is necessary to measure the temperature on the substrate in order to control the temperature with high accuracy. Therefore, in the first embodiment, the temperature in each substrate placement chamber is measured using a temperature sensor built-in substrate with a built-in temperature sensor.

  FIG. 2 is a conceptual top view showing an example of the temperature sensor built-in substrate in the first embodiment. In FIG. 2, a plurality of temperature sensors 12 are built in the temperature sensor built-in substrate 10. FIG. 2 shows an example in which the temperature sensors 12 are built in a total of nine locations including the center position of the substrate surface, the four corners of the outer peripheral portion, and the central portion of each peripheral side. Thereby, the temperature distribution of the whole substrate surface can be obtained. Needless to say, the position of the sensor is not limited to this. A circuit board 14 is built in the temperature sensor built-in substrate 10, and a battery serving as a power source for driving the circuit board 14 and the temperature sensor 12 is incorporated in the circuit board 14 in a replaceable manner. And the circuit board 14 has a memory circuit, and can memorize | store the temperature change in each temperature sensor 12 position with progress of time. For example, each temperature sensor 12 may measure the temperature at a predetermined interval, and the measured temperature may be sequentially stored in the memory for each temperature sensor 12. The measured temperature data can be read and input to the control computer 110 via the I / F circuit 112. Communication specifications are not particularly limited, and generally usable ones may be used. As described above, the temperature sensor built-in substrate 10 measures and stores its own temperature change.

  FIG. 3 is a flowchart showing main steps of the temperature adjustment method for the substrate placement chamber in the first embodiment. In FIG. 3, the temperature adjustment method for the substrate placement chamber in the first embodiment includes prior single measurement and model formula setting step (S101), I / F placement and temperature measurement step (S102), and temperature measurement step at L / L. (S104), temperature measurement step with ALN arrangement (S106), temperature measurement step with drawing room arrangement (S108), unloading process to I / F (S110), equilibrium temperature calculation step (S112), and temperature adjustment step ( A series of steps of S114) is performed.

  FIG. 4 is a conceptual diagram showing a transfer path of the temperature sensor built-in substrate in the temperature adjustment method for the substrate placement chamber in the first embodiment. In FIG. 4, the conveyance path | route in the carrying out process (S110) from I / F arrangement | positioning and temperature measurement process (S102) to I / F is shown.

  First, as a prior single measurement and model formula setting step (S101), before the drawing apparatus 100 is installed and the start-up work is performed, the drawing apparatus 100 is carried out in advance using the apparatus that performs the start-up work or another similar apparatus. Model equations for temperature changes in a plurality of substrate placement chambers such as the inlet 120, the L / L chamber 130, the robot chamber 140, the alignment chamber 146, and the drawing chamber 103 are set. For this purpose, the temperature in a plurality of substrate placement chambers such as the loading / unloading port 120, the L / L chamber 130, the robot chamber 140, the alignment chamber 146, and the drawing chamber 103 is controlled by the constant temperature fluid supply device 180 controlled by the temperature control circuit 118. Equilibrate at each set temperature. In such a state of the equilibrium temperature, the temperature in each substrate placement chamber is individually measured. Specifically, it operates as follows.

  The temperature sensor built-in substrate 10 is disposed at the carry-in / out port 120. At that time, temperature measurement is already started. Then, in the loading / unloading port 120, the apparatus waits until the measured temperature of the temperature sensor built-in substrate 10 is balanced, and stores the temperature change in a storage device such as a memory. A sufficient waiting time may be set based on the experience value. Then, the measured temperature change data up to the equilibrium temperature in the carry-in / out port 120 is output to the control computer 110 via the I / F circuit 112.

  Next, after replacing or charging the battery, the temperature sensor built-in substrate 10 is disposed at the carry-in / out port 120, and this time, after opening the gate valve 132, the transfer robot 122 causes the L / L chamber 130 to be opened. It is conveyed on the support member inside. The temperature measurement may already be started when placing at the carry-in / out port 120. After the gate valve 132 is closed, the system waits in the L / L chamber 130 until the measured temperature of the temperature sensor built-in substrate 10 is balanced, and the temperature change is stored in a storage device such as a memory. A sufficient waiting time may be set based on the experience value. Then, it is carried out of the L / L chamber 130 by the transfer robot 122 and returned to the carry-in / out port 120. The measured temperature change data until the equilibrium temperature in the L / L chamber 130 is reached is output to the control computer 110 via the I / F circuit 112.

  Next, after replacing or charging the battery, the temperature sensor built-in substrate 10 is disposed at the carry-in / out port 120, and this time, after opening the gate valve 132, the transfer robot 122 causes the L / L chamber 130 to be opened. Then, the gate valve 134 is opened and the transfer robot 142 is transferred to the stage in the alignment chamber 146 via the robot chamber 140. The temperature measurement may already be started when placing at the carry-in / out port 120. Then, after closing the gate valve 134, it waits in the alignment chamber 146 until the measured temperature of the temperature sensor built-in substrate 10 is balanced, and the temperature change is stored in a storage device such as a memory. A sufficient waiting time may be set based on the experience value. Then, the transfer robot 142 carries out from the alignment chamber 146 to the L / L chamber 130 via the robot chamber 140, and further carries out from the L / L chamber 130 by the transfer robot 122 and returns to the carry-in / out port 120. Then, the measured temperature change data until reaching the equilibrium temperature in the alignment chamber 146 is output to the control computer 110 via the I / F circuit 112.

  Next, after replacing or charging the battery, the temperature sensor built-in substrate 10 is disposed at the carry-in / out port 120, and this time, after opening the gate valve 132, the transfer robot 122 causes the L / L chamber 130 to be opened. Then, the gate valves 134 and 136 are opened, and the transfer robot 142 is transferred onto the XY stage 105 of the drawing chamber 103 via the robot chamber 140. The temperature measurement may already be started when placing at the carry-in / out port 120. After the gate valve 136 is closed, the drawing chamber 103 waits until the measured temperature of the temperature sensor built-in substrate 10 is balanced, and the temperature change is stored in a storage device such as a memory. A sufficient waiting time may be set based on the experience value. Then, the transfer robot 142 carries out from the drawing chamber 103 to the L / L chamber 130 via the robot chamber 140, and further carries out the L / L chamber 130 by the transfer robot 122 and returns to the carry-in / out port 120. Then, the measured temperature change data until reaching the equilibrium temperature in the drawing chamber 103 is output to the control computer 110 via the I / F circuit 112.

  As described above, the temperature change data until the equilibrium temperature is reached individually for each substrate placement chamber is measured. If it is a single measurement, it can be measured within the battery life of the temperature sensor built-in substrate 10. For example, it is sufficient to measure 5 to 6 hours for each substrate placement chamber.

Then, the control computer 110 sets a model formula that fits and approximates the temperature change data of the temperature sensor built-in substrate 10 for each substrate placement chamber. As the model formula, for example, the following formula (1) can be used for all substrate placement chambers.
(1) f (t) = A · e ^{t / r} + B

Here, t is time, and A, B, and r are parameters. In particular, B is a convergence value (equilibrium temperature). Alternatively, the following equation (2) may be used as the model equation.
(2) f (t) = A ₁ · ^{et / r1} + B ₁ + A ₂ · ^{et / r2} + B ₂

Here, t is time, and A _i , B _i and r _i are parameters. In particular, B ₁ + B ₂ is a convergence value (equilibrium temperature). The approximation calculation for setting the model formula is not performed by the control computer 110 but may be performed externally. Further, the model formula is not limited to the above-described formulas (1) and (2), and a preferable formula may be set in each substrate placement chamber.

  Then, using the model formula set at the time of starting up the drawing apparatus 100, the equilibrium temperature of each substrate placement chamber is obtained by calculation in a short time as follows. First, after the drawing apparatus 100 is installed at the installation location, the constant temperature fluid supply apparatus 180 controlled by the temperature control circuit 118 is used to carry out the loading / unloading port 120, the L / L chamber 130, the robot chamber 140, the alignment chamber 146, and the drawing chamber 103. The temperature in the plurality of substrate placement chambers is kept in an equilibrium state at each set temperature.

  As the I / F arrangement and temperature measurement step (S102), the temperature sensor built-in substrate 10 whose battery is replaced with a new one is arranged at the carry-in / out port 120 in a state where the battery is maintained at the equilibrium temperature. At that time, temperature measurement is already started. Then, the temperature measured by the temperature sensor built-in substrate 10 by each device in the carry-in / out port 120 and the L / L chamber 130 controlled by the transfer control circuit 116 is built into the temperature sensor before it reaches the equilibrium state in the carry-in / out port 120. The substrate 10 is carried out so as to move from the carry-in / out port 120 to the next L / L chamber 130. In the carry-in / out port 120, the temperature sensor built-in substrate 10 waits for about one hour, for example, measures a temperature change, and stores it in a storage device such as a memory. Specifically, the temperature sensor built-in substrate 10 arranged at the carry-in / out port 120 is opened on the support member in the L / L chamber 130 by the transfer robot 122 after opening the gate valve 132 before the temperature reaches an equilibrium state. It is conveyed to.

  Subsequently, as a temperature measurement step (S104) at L / L, the temperature sensor built-in substrate 10 carried into the L / L chamber 130 maintained at the equilibrium temperature is closed after the gate valve 132 is closed. The vacuum pump 170 creates a vacuum atmosphere. Then, by each device controlled by the transfer control circuit 116, the temperature sensor built-in substrate 10 causes the L / L chamber before the temperature measured in the L / L chamber 130 reaches an equilibrium state in the L / L chamber 130. From inside 130, it is carried out to move to the next alignment chamber 146. In the L / L chamber 130, the temperature sensor built-in substrate 10 waits for about one hour, for example, measures a temperature change, and stores it in a storage device such as a memory. Specifically, the temperature sensor built-in substrate 10 disposed on the support member in the L / L chamber 130 opens the gate valve 134 before the temperature reaches an equilibrium state, and then the robot chamber 140 is moved by the transfer robot 142. To the stage in the alignment chamber 146.

  Subsequently, as a temperature measurement step (S106) in the ALN arrangement, the temperature sensor built-in substrate 10 carried into the alignment chamber 146 in a state of being maintained at the equilibrium temperature in the vacuum atmosphere is after the gate valve 134 is closed. Then, the temperature measured in the alignment chamber 146 is unloaded from the alignment chamber 146 to the next drawing chamber 103 before reaching an equilibrium state in the alignment chamber 146. In the alignment chamber 146, the temperature sensor built-in substrate 10 waits for about 1 hour, for example, measures a temperature change, and stores it in a storage device such as a memory. Specifically, the temperature sensor built-in substrate 10 arranged on the stage in the alignment chamber 146 opens the gate valve 136 before the temperature reaches an equilibrium state, and then the robot 10 is moved by the transfer robot 142 via the robot chamber 140. It is transferred to the XY stage 105 in the drawing chamber 103.

  Subsequently, as a temperature measurement step (S108) in the drawing chamber arrangement, the temperature sensor built-in substrate 10 carried into the drawing chamber 103 maintained at the equilibrium temperature in the vacuum atmosphere closed the gate valve 136. After that, the temperature measured in the drawing chamber 103 is carried out of the drawing chamber 103 before reaching an equilibrium state in the drawing chamber 103. In the drawing chamber 103, the temperature sensor built-in substrate 10 waits for about one hour, for example, measures a temperature change, and stores it in a storage device such as a memory. Specifically, the temperature sensor built-in substrate 10 disposed on the XY stage 105 in the drawing chamber 103 is opened in the drawing chamber 103 by the transfer robot 142 after the gate valve 136 is opened before the temperature reaches an equilibrium state. It is carried out from.

  Subsequently, as a step of carrying out to the I / F (S110), the temperature sensor built-in substrate 10 carried out from the drawing chamber 103 is carried out to the carry-in / out port 120 through the return path. Specifically, the substrate 101 placed on the XY stage 105 in the drawing chamber 103 is unloaded by the transfer robot 142 after the gate valve 136 is opened before the temperature reaches an equilibrium state, and the gate valve 136 is opened. Then, the gate valve 134 is opened via the robot chamber 140 and the material is transferred onto a support member in the L / L chamber 130. After the gate valve 134 is closed, the inside of the L / L chamber 130 becomes an atmospheric pressure atmosphere, and then the gate valve 132 is opened and the L / L chamber 130 is carried out to the loading / unloading port 120 by the transfer robot 122. As described above, the temperature change data in each substrate placement chamber continuously measured and stored by sequentially transporting the temperature sensor built-in substrate 10 into the plurality of substrate placement chambers is transmitted to the control computer via the I / F circuit 112. 110 is input.

As the equilibrium temperature calculation step (S112), the control computer 110 serving as a calculation unit calculates the equilibrium temperature of each substrate placement chamber using the temperature change data stored in the temperature sensor built-in substrate 10. The control computer 110 calculates the equilibrium temperature of each substrate placement chamber using the model formula for each substrate placement chamber. Specifically, the parameters A, B, and r (coefficients) of the model formula for each substrate placement chamber are calculated using the least square method. Alternatively, by using the least squares method, calculates the parameters _{A i,} B _{i, r} i of the model formula for each substrate disposed chambers.

  FIG. 5 is a graph showing an example of the result of calculating the equilibrium temperature from the model equation using the temperature measurement data in the alignment chamber in the first embodiment. In FIG. 5, the equilibrium temperature was calculated from the model equation using data obtained by measuring the temperature for 50 minutes after the temperature sensor built-in substrate 10 was carried into the alignment chamber 146. As a result, the equilibrium temperature of the alignment chamber 146 was calculated to be 23.144 ° C.

  FIG. 6 is a graph showing another example of the result of calculating the equilibrium temperature from the model equation using the temperature measurement data in the alignment chamber in the first embodiment. In FIG. 6, the equilibrium temperature was calculated from the model equation using data obtained by measuring the temperature for 30 minutes after carrying the temperature sensor built-in substrate 10 into the alignment chamber 146. As a result, the equilibrium temperature of the alignment chamber 146 was calculated to be 23.142 ° C.

  Further, the actual equilibrium temperature of the alignment chamber 146 at this time was 23.146 ° C. From the above results, it was possible to calculate with an accuracy of ± 0.01 ° C. from the actual equilibrium temperature for both 30-minute measurement data and 50-minute measurement data before reaching the equilibrium temperature. Thus, even if it does not measure until it reaches equilibrium temperature, equilibrium temperature can be predicted with high accuracy. In the above example, the case of the alignment chamber 146 is shown, but the same applies to a plurality of substrate placement chambers such as the other loading / unloading ports 120, the L / L chamber 130, and the drawing chamber 103.

  Here, the temperature sensor built-in substrate 10 includes a plurality of temperature sensors 12 having different arrangement positions, and the control computer 110 uses an average value of a plurality of temperatures measured by the plurality of temperature sensors 12. Thus, it is preferable to calculate the equilibrium temperature. Thereby, measurement errors can be averaged.

  Then, as the temperature adjustment step (S114), the temperature control circuit 118, which is an example of a control unit, controls each control signal for controlling the temperature of each substrate placement chamber to a desired temperature based on the calculated equilibrium temperature. Is output to the constant temperature fluid supply device 180. Then, the constant temperature fluid supply device 180 adjusts and controls the temperatures in a plurality of substrate placement chambers such as the loading / unloading port 120, the L / L chamber 130, the robot chamber 140, the alignment chamber 146, and the drawing chamber 103 to respective desired temperatures. To do. If necessary, the process returns to S102 and S102 to S114 may be repeated.

  By configuring as described above, it is possible to greatly shorten the time until the temperature sensor built-in substrate 10 becomes familiar with the temperature in each substrate placement chamber. Therefore, conventionally, it took 14 to 15 hours to measure the equilibrium temperature in all the substrate placement chambers, but according to the first embodiment, the equilibrium temperature can be acquired in 4 to 6 hours. Therefore, the temperature adjustment time in the substrate placement chamber can be greatly shortened. In the above-described example, the temperatures of the carry-in / out port 120, the L / L chamber 130, the alignment chamber 146, and the drawing chamber 103 are adjusted. If the number of substrate arrangement chambers constituting the drawing apparatus 100 is increased or decreased, It goes without saying that the temperature adjustment time increases or decreases accordingly. In any case, the time can be greatly shortened as compared with waiting the temperature sensor built-in substrate 10 to the equilibrium temperature in each substrate placement chamber. By shortening the measurement time, it is possible to measure the temperature of all the substrate placement chambers continuously within the battery life. And the start-up time of the drawing apparatus 100 can be greatly shortened by the significant shortening of the temperature adjustment time.

  The embodiments have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. In the above-described example, the battery built-in type temperature sensor built-in substrate 10 is used, but the present invention is not limited to this. Electric power may be supplied to the temperature sensor built-in substrate at each arrangement position. In the above-described example, the temperature sensor built-in substrate 10 that stores the measurement result in a storage device such as a memory is used. However, the present invention is not limited to this. Data measured by the temperature sensor built-in substrate at each arrangement position may be output to the drawing apparatus side.

  In addition, although descriptions are omitted for parts and the like that are not directly required for the description of the present invention, such as a device configuration and a control method, a required device configuration and a control method can be appropriately selected and used. For example, although the description of the control unit configuration for controlling the drawing apparatus 100 is omitted, it goes without saying that the required control unit configuration is appropriately selected and used.

  In addition, all charged particle beam drawing apparatuses, drawing methods, and substrate placement chamber temperature adjustment methods that include elements of the present invention and that can be appropriately modified by those skilled in the art are included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 10 Temperature sensor built-in board | substrate 12 Temperature sensor 14 Circuit board 100 Drawing apparatus 101 Board | substrate 102 Electronic lens tube 103 Drawing room 105 XY stage 110 Control computer 111 Memory 112 I / F circuit 114 Drawing control circuit 116 Conveyance control circuit 118 Temperature control circuit 120 Carry out Inlet 122, 142 Transfer robot 130 Load lock chamber 132, 134, 136 Gate valve 140 Robot chamber 146 Alignment chamber 150 Drawing unit 160 Control unit 170 Vacuum pumps 172, 174, 176 Valve 180 Constant temperature fluid supply devices 181, 182, 183, 184 , 185 Constant temperature fluid 200 Electron beam 201 Electron gun 202 Illumination lens 203, 410 First aperture 204 Projection lens 205, 208 Deflector 206, 420 Second aperture 207 Objective lens 330 Electron beam 340 Sample 411 Aperture 421 Variable shaping aperture 430 Charged particle source

Claims (5)

A drawing chamber for placing a substrate and drawing a pattern on the substrate using a charged particle beam;
Using the temperature sensor built-in substrate that measures its own temperature change, the temperature sensor built-in substrate is carried in while the drawing chamber is maintained at an equilibrium temperature, and the temperature measured by the temperature sensor built-in substrate is the drawing temperature. A transport system for transporting the temperature sensor built-in substrate to the drawing chamber so that the temperature sensor built-in substrate is unloaded before reaching an equilibrium state indoors;
Using the temperature change data measured on the temperature sensor built-in substrate, a calculation unit for calculating the equilibrium temperature of the drawing chamber;
A control unit for controlling the temperature of the drawing chamber based on the calculated equilibrium temperature;
A charged particle beam drawing apparatus comprising: A plurality of substrate placement chambers for placing the substrates, including the drawing chamber;
In the transport system, the temperature sensor built-in substrate is carried in with the plurality of substrate placement chambers maintained at an equilibrium temperature, and the temperature measured by the temperature sensor built-in substrate is balanced in each substrate placement chamber. In order to move to the next substrate placement chamber before becoming, the substrate with built-in temperature sensor is sequentially transferred into the plurality of substrate placement chambers,
The calculation unit calculates the equilibrium temperature of each substrate placement chamber using the data of the temperature change measured on the temperature sensor built-in substrate,
The charged particle beam drawing apparatus according to claim 1, wherein the controller controls the temperature of each substrate placement chamber based on the calculated equilibrium temperature.   The charged particle beam drawing apparatus according to claim 2, wherein the calculation unit calculates an equilibrium temperature of each substrate placement chamber using a model formula for each substrate placement chamber. The temperature sensor built-in substrate includes a plurality of temperature sensors with different arrangement positions,
The charged particle beam drawing apparatus according to claim 1, wherein the calculation unit calculates an equilibrium temperature using an average value of a plurality of temperatures measured by the plurality of temperature sensors. Using the temperature sensor built-in substrate that measures its own temperature change, placing the substrate and drawing a pattern on the substrate using a charged particle beam, the temperature sensor built-in substrate in a state where the drawing chamber is maintained at an equilibrium temperature Transporting the temperature sensor substrate to the drawing chamber so that the temperature sensor substrate is unloaded before the temperature measured by the temperature sensor substrate reaches an equilibrium state in the drawing chamber. When,
Using the temperature change data measured on the temperature sensor built-in substrate, calculating the equilibrium temperature of the drawing chamber;
Controlling the temperature of the drawing chamber based on the calculated equilibrium temperature;
A method for adjusting the temperature of the substrate placement chamber.