JP2011128298A - Positive type resist material and pattern forming method using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a positive type resist material which has an extremely high alkaline dissolution-rate contrast before and after exposure, a high resolution, a high sensitivity, and good roughness (LWR) after exposure, and further which suppresses acid diffusion rate, in particular, a positive type resist material using a high molecular compound suitable as a base resin of a chemical amplification positive type resist material, and to provide a pattern forming method. <P>SOLUTION: The positive type resist material contains a high molecular compound including a repeating unit (a) having a group represented by a general formula (1) and a repeating unit (b) having a carboxyl group having hydrogen atom substituted for an acid labile group. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a positive resist material, particularly a positive resist material using a polymer compound suitable as a base resin for a chemically amplified positive resist material, and a pattern forming method using the same.

  With the high integration and high speed of LSI, pattern rule miniaturization is progressing rapidly. In particular, the expansion of the flash memory market and the increase in storage capacity are leading to miniaturization. As for the fine line, the 65 nm node device is mass-produced by ArF lithography, and the mass production of 45 nm node by the next generation ArF immersion lithography is in progress. Next generation 32nm node includes immersion lithography with ultra high NA lens combining liquid with higher refractive index than water, high refractive index lens and high refractive index resist film, vacuum ultraviolet light (EUV) with wavelength of 13.5nm Lithography, double exposure of ArF lithography (double patterning lithography), and the like are candidates and are being studied.

Light elements such as hydrocarbons used in resist materials are hardly absorbed by high energy rays such as EB and X-rays, and polyhydroxystyrene-based resist materials are being studied.
The resist material for EB has been practically used for mask drawing. In recent years, mask manufacturing techniques have become a problem. A reduction projection exposure apparatus has been used since the light used for exposure was g-line, and its reduction magnification was 1/5. However, the magnification is 1/4 with the enlargement of the chip size and the enlargement of the projection lens. Therefore, the influence of the dimensional deviation of the mask on the dimensional change of the pattern on the wafer has become a problem. It has been pointed out that with the miniaturization of the pattern, the dimensional deviation on the wafer has become larger than the value of the dimensional deviation of the mask. There is a need for a mask error enhancement factor (MEEF) calculated using a mask dimensional change as a denominator and a dimensional change on a wafer as a numerator. It is not uncommon for MEEF to exceed 4 for 45 nm-class patterns. If the reduction ratio is 1/4 and the MEEF is 4, it can be said that the mask production requires the same accuracy as the substantially equal-size mask.
In order to increase the accuracy of the line width in the mask manufacturing exposure apparatus, an exposure apparatus using an electron beam (EB) has been used from an exposure apparatus using a laser beam. Furthermore, since further miniaturization is possible by increasing the acceleration voltage in the electron gun of EB, 10 keV to 30 keV, and recently 50 keV is the mainstream, and studies of 100 keV are also underway.

  Here, as the acceleration voltage increases, lowering the sensitivity of the resist film has become a problem. When the acceleration voltage is improved, the influence of forward scattering in the resist film is reduced, so that the contrast of the electron drawing energy is improved and the resolution and dimensional controllability are improved. Since it passes, the sensitivity of the resist film decreases. Since the mask exposure machine exposes by direct drawing with a single stroke, a decrease in sensitivity of the resist film leads to a decrease in productivity, which is not preferable. In view of the demand for higher sensitivity, chemically amplified resist materials are being studied.

With the miniaturization of patterns in mask manufacturing EB lithography, the resist film is becoming thinner in order to prevent pattern collapse during development with a high aspect ratio. In the case of photolithography, the thinning of the resist film greatly contributes to the improvement of the resolution. This is because the planarization of the device has progressed with the introduction of CMP or the like. In the case of mask production, the substrate is flat, and the thickness of the substrate to be processed (for example, Cr, MoSi, SiO ₂ ) is determined for light shielding rate and phase difference control. In order to reduce the thickness, it is necessary to improve the dry etching resistance of the resist film.
Here, it is generally said that there is a correlation between the carbon density of the resist film and the dry etching resistance. In EB drawing that is not affected by absorption, a resist material based on a novolak polymer having excellent etching resistance has been developed.

Further, it has been reported that the absorption of carbon atoms is small in soft X-ray (EUV) exposure at a wavelength of 5 to 20 nm, which is expected as an exposure method in fine processing of 70 nm or later along with F ₂ exposure. Increasing the carbon density is effective not only for improving dry etching resistance but also for improving transmittance in the soft X-ray wavelength region.

  As miniaturization progresses, image blur due to acid diffusion has become a problem. In order to ensure the resolution in a fine pattern having a dimension size of 45 nm or more, it is proposed that not only the improvement of dissolution contrast conventionally proposed but also the control of acid diffusion is important. However, chemically amplified resist materials have increased sensitivity and contrast due to acid diffusion. Therefore, reducing the post-exposure bake temperature (PEB) temperature and time to limit acid diffusion results in sensitivity and contrast. It drops significantly.

  The relationship between sensitivity, resolution and roughness triangle trade-off is shown. High-sensitivity resists have degraded resolution and roughness, and it is necessary to suppress acid diffusion in order to increase the exposure margin. However, it has been reported that roughness deteriorates rapidly when the acid diffusion distance is 50 nm or less.

  It is effective to suppress acid diffusion by adding an acid generator that generates a bulky acid. Thus, it has been proposed to copolymerize an acid generator of an onium salt having a polymerizable olefin with a base polymer.

  As an acid generation mechanism in electron beam exposure, a mechanism has been proposed in which electrons move to the PAG due to polymer excitation by exposure and acid is released. Both EB and EUV are higher than the ionization potential energy threshold of 10 eV, and it is estimated that the base polymer is easily ionized.

  It is shown that poly-4-hydroxystyrene has higher acid generation efficiency in EB exposure than poly-4-methoxystyrene, and poly-4-hydroxystyrene efficiently moves electrons to the PAG by EB irradiation. Has been suggested.

Therefore, a material was proposed in which hydroxystyrene was copolymerized to increase acid generation efficiency by electron transfer, PAG methacrylate with sulfonic acid directly attached to the polymer main chain to suppress acid diffusion, and methacrylate with acid labile groups. ing.
ArF resist materials based on vinyl naphthalene copolymer have been proposed (see Non-Patent Document 1, Patent Documents 1 and 2, etc.). A resist material based on methacrylic ester having naphthol has also been proposed (see Patent Document 3). The naphthalene ring having a hydroxyl group is expected to be effective for preventing swelling during development because it exhibits weak acidity such as phenol. Furthermore, the naphthalene ring has an advantage of high etching resistance.

A resist for a double patterning process using ArF immersion lithography has been studied. In order to insolubilize the first resist pattern in the second photoresist solvent and alkali developer in order to process the base substrate in the double patterning process by the dry etching of the resist pattern formed in the second exposure. Freezing technology is required.
As resists for freezing, materials that are crosslinked by heat, materials that are insolubilized by light irradiation, and materials for these hybrid processes have been proposed.
A phenolic hydroxyl group has a property of cross-linking when irradiated with ultraviolet rays, and a resist material having a naphthol relatively transparent to an ArF excimer laser having a wavelength of 193 nm has been studied.
The phenolic hydroxyl group also has an effect of reducing edge roughness by reducing swelling during development.
Naphthol has a relatively high transparency at a wavelength of 193 nm and can be used for ArF exposure.

JP 2004-163877 A JP 2002-107933 A JP 2007-114728 A

J. et al. Photopolym. Sci. Technol. , Vol. 11, no. 3, p489 (1998)

  The present invention has been made in view of the above circumstances. The alkali dissolution rate contrast before and after exposure is significantly high, the resolution is high, the sensitivity is high, and the roughness (LWR) after exposure is good. In particular, a positive resist material capable of suppressing the acid diffusion rate, particularly a positive resist material using a polymer compound suitable as a base resin of a chemically amplified positive resist material, particularly a positive resist suitable for ArF excimer laser, EB and EUV exposure. An object of the present invention is to provide a mold resist material and a pattern forming method using the same.

（式中、ｍは１〜３の整数である。） In order to solve the above problems, the present invention comprises at least a repeating unit a having a group represented by the following general formula (1) and a repeating unit b having a carboxyl group in which a hydrogen atom is substituted with an acid labile group. Provided is a positive resist material characterized by containing a polymer compound.

(In the formula, m is an integer of 1 to 3.)

（式中、ｍは前述と同様である。Ｒ^１は水素原子又はメチル基である。Ｘは単結合、エステル基、ラクトン環を有する炭素数１〜１２の連結基、フェニレン基、ナフチレン基のいずれかである。ａは０＜ａ＜１．０である。） In this case, it is preferable that the repeating unit a is represented by the following general formula (2).

(In the formula, m is the same as described above. R ¹ is a hydrogen atom or a methyl group. X is a single bond, an ester group, a linking group having 1 to 12 carbon atoms having a lactone ring, a phenylene group, or a naphthylene group. A is 0 <a <1.0.)

（式中、Ｒ^１、Ｘ、ｍは前述と同様である。Ｒ^２は水素原子又はメチル基、Ｒ^３は酸不安定基を表す。Ｙは単結合、エステル基、ラクトン環を有する炭素数１〜１２の連結基、フェニレン基、ナフチレン基のいずれかである。ａは０＜ａ＜１．０、ｂは０＜ｂ＜１．０、ａ＋ｂは０．１≦ａ＋ｂ≦１．０の範囲である。） In this case, the repeating unit a and the repeating unit b are preferably those represented by the following general formula (3).

(In the formula, R ¹ , X and m are the same as described above. R ² represents a hydrogen atom or a methyl group, R ³ represents an acid labile group. Y represents a carbon number having a single bond, an ester group or a lactone ring. Any one of 1 to 12 linking groups, a phenylene group, and a naphthylene group, a is 0 <a <1.0, b is 0 <b <1.0, and a + b is 0.1 ≦ a + b ≦ 1.0. Range.)

  By using such a positive resist material of the present invention, the alkali dissolution rate contrast before and after exposure is significantly high, the resolution is high, the sensitivity is high, and the roughness (LWR) after exposure is good, In addition, the acid diffusion rate can be suppressed.

  In addition to the repeating unit a and the repeating unit b, a polymer containing a repeating unit c having an adhesive group selected from a hydroxyl group, a lactone ring, an ether group, an ester group, a carbonyl group, and a cyano group. A compound (where 0 <a <1.0, 0 <b <1.0, 0 <c ≦ 0.9, 0.2 ≦ a + b + c ≦ 1.0). Can do.

  Thus, if the polymer compound contained in the positive resist material contains a repeating unit c having an adhesive group in addition to the repeating unit a and the repeating unit b, the adhesion can be further improved. it can.

The positive resist material is preferably a chemically amplified positive resist material.
Thus, the positive resist material containing the polymer compound is converted so that the acid labile group of the repeating unit b is eliminated by the acid generated from the acid generator, for example, and the resist exposed portion is dissolved in the developer. By doing so, it is possible to obtain a chemically amplified positive resist material from which a highly accurate pattern can be obtained.

  The positive resist material may contain any one or more of an organic solvent, a dissolution controller, an acid generator, a basic compound, and a surfactant.

  Thus, by mix | blending an organic solvent, the applicability | paintability to the board | substrate etc. of a resist material can be improved, for example. Moreover, by mix | blending a dissolution control agent, the difference of the dissolution rate of an exposed part and an unexposed part can be enlarged further, and the resolution can be improved further. Further, by adding an acid generator, it can be made more sensitive. By compounding the basic compound, the acid diffusion rate in the resist film can be suppressed, and the resolution can be further improved. Furthermore, the application | coating property of a resist material can further be improved or controlled by mix | blending surfactant.

  Such a positive resist material of the present invention includes at least a step of applying the positive resist material on a substrate, a step of exposing to high energy rays after heat treatment, and a step of developing using a developer. Can be used as a method for forming a pattern on a semiconductor substrate, a mask substrate, or the like.

  Needless to say, development may be performed after the post-exposure heat treatment, and various other processes such as an etching process, a resist removal process, and a cleaning process may be performed.

  In this case, in the step of exposing with the high energy beam, any one of an electron beam, a soft X-ray having a wavelength of 3 to 15 nm, and an ultraviolet ray having a wavelength of 180 to 250 nm can be used as a light source.

  Thus, the positive resist material of the present invention forms a fine pattern using one of an electron beam, soft X-ray with a wavelength of 3 to 15 nm, and ultraviolet light with a wavelength of 180 to 250 nm as a light source. It can be particularly preferably used.

As described above, the positive resist material of the present invention has a significantly high alkali dissolution rate contrast before and after exposure, high resolution, high sensitivity, and good roughness (LWR) after exposure. In addition, the acid diffusion rate can be particularly suppressed. Therefore, a positive resist material, particularly a chemically amplified positive resist material, which is particularly suitable as a fine pattern forming material for VLSI manufacturing or photomask fine pattern formation, EB, EUV, and ArF excimer laser exposure can be obtained. .
The positive resist material of the present invention, particularly the chemically amplified positive resist material, is used not only for lithography in semiconductor circuit formation, but also for mask circuit pattern formation, micromachines, thin film magnetic heads, etc. It can also be applied to circuit formation.

Hereinafter, the present invention will be described in more detail.
As described above, with the high integration and high speed of LSI, while miniaturization of the pattern rule is progressing, the acid diffusion is suppressed and the resolution is ensured, and the sensitivity is high and the contrast is good. There has been a demand for a positive resist material having a low roughness (LWR).

  As a result of intensive investigations to obtain the above-described positive resist materials that have been recently requested, the present inventors have found that polymers containing specific repeating units include positive resist materials, particularly chemically amplified positive resists. It has been found that it is extremely effective when used as a base resin for materials.

  More specifically, the present inventors have represented a repeating unit in which a hydrogen atom of a carboxyl group is substituted with an acid labile group in order to suppress acid diffusion and improve dissolution contrast, and the following general formula (1): By using a polymer obtained by copolymerization with a repeating unit having an adhesive group in which the naphthol group shown is linked by an amide bond as a base resin of a positive resist material, particularly a chemically amplified positive resist material, Alkali dissolution rate contrast is significantly high, the effect of suppressing acid diffusion is high, high resolution, and good roughness (LWR) after exposure, especially for ultra-LSI manufacturing or photomask fine pattern forming material As a result, the present invention has been completed with the knowledge that a positive resist material, particularly a chemically amplified positive resist material, can be obtained.

（式中、ｍは１〜３の整数である。） That is, the positive resist material of the present invention comprises at least a repeating unit a having a group represented by the following general formula (1) and a repeating unit b having a carboxyl group in which a hydrogen atom is substituted with an acid labile group. A resist material characterized by containing a polymer compound.

(In the formula, m is an integer of 1 to 3.)

  A naphthol group has the same acidity as a phenol group, and has a function as an adhesive group that improves alkali solubility. The adhesive group in which the naphthol group of the present invention is linked by an amide bond is not only effective in reducing swelling and adhesion due to the synergistic effect of the hydrophilicity of the amide group and the alkali solubility of naphthol, but also weakly basic. The amide group bearing a higher effect of suppressing acid diffusion than the case of bonding with an ester group in place of the amide group can improve the resolution.

  Such a positive resist material of the present invention has a particularly high dissolution contrast of the resist film, a high effect of suppressing acid diffusion, a high resolution, a high sensitivity, and a roughness (LWR) after exposure. It is good. Therefore, since it has these excellent characteristics, it is very practical and is very effective as a resist material for VLSI and a mask pattern forming material.

（式中、ｍは前述と同様である。Ｒ^１は水素原子又はメチル基である。Ｘは単結合、エステル基、ラクトン環を有する炭素数１〜１２の連結基、フェニレン基、又はナフチレン基である。ａは０＜ａ＜１．０である。） The repeating unit a having a group represented by the general formula (1) can be preferably represented by the following general formula (2).

(In the formula, m is the same as described above. R ¹ is a hydrogen atom or a methyl group. X is a single bond, an ester group, a linking group having 1 to 12 carbon atoms having a lactone ring, a phenylene group, or a naphthylene group. A is 0 <a <1.0.)

（式中、Ｒ^１、Ｘ、ｍは前述と同様である。Ｒ^２は水素原子又はメチル基、Ｒ^３は酸不安定基を表す。Ｙは単結合、エステル基、ラクトン環を有する炭素数１〜１２の連結基、フェニレン基、又はナフチレン基である。ａは０＜ａ＜１．０、ｂは０＜ｂ＜１．０、ａ＋ｂは０．１≦ａ＋ｂ≦１．０の範囲である。） In particular, the base resin is preferably a polymer compound represented by at least the following general formula (3).

(In the formula, R ¹ , X and m are the same as described above. R ² represents a hydrogen atom or a methyl group, R ³ represents an acid labile group. Y represents a carbon number having a single bond, an ester group or a lactone ring. 1 to 12 linking groups, phenylene groups, or naphthylene groups, a is 0 <a <1.0, b is 0 <b <1.0, and a + b is in the range of 0.1 ≦ a + b ≦ 1.0. is there.)

Specific examples of the monomer for obtaining the repeating unit a represented by the general formulas (2) and (3) are shown below.

（式中、Ｒ^１は前述と同様である。）

(Wherein R ¹ is the same as described above.)

  The repeating unit a in the positive resist composition of the present invention is characterized by having a naphthol group linked by an amide group in the repeating unit. The naphthol group linked by this amide group can be obtained by amidating aminonaphthol. Both amide groups and naphthol groups are highly hydrophilic and exhibit excellent properties as adhesive groups. Furthermore, the amide group and naphthol group have a high effect of suppressing acid diffusion, and can have excellent adhesion and acid diffusion control performance by copolymerizing a repeating unit having these two groups in one repeating unit. It is.

（式中、Ｒ^２、Ｒ^３、Ｙは前述と同様である。） The monomer for obtaining the repeating unit b having an acid labile group in the general formula (3) can be represented by the following general formula (4).

(Wherein R ² , R ³ and Y are the same as described above.)

In this case, the following can be illustrated as a C1-C12 coupling group which has a lactone ring in X and Y.

The acid labile groups of R ^{3 in} the general formulas (3) and (4) are variously selected, but may be the same or different, and are particularly the following formulas (A-1) to (A-3): The thing shown by the substituted group is mentioned.

In the above formula (A-1), R ³⁰ is a tertiary alkyl group having 4 to 20 carbon atoms, preferably 4 to 15 carbon atoms, each alkyl group is a trialkylsilyl group having 1 to 6 carbon atoms, and 4 to 20 carbon atoms. Or a group represented by the above formula (A-3). Specific examples of the tertiary alkyl group include a tert-butyl group, a tert-amyl group, a 1,1-diethylpropyl group, and 1-ethyl. Cyclopentyl group, 1-butylcyclopentyl group, 1-ethylcyclohexyl group, 1-butylcyclohexyl group, 1-ethyl-2-cyclopentenyl group, 1-ethyl-2-cyclohexenyl group, 2-methyl-2-adamantyl group, etc. Specific examples of the trialkylsilyl group include trimethylsilyl group, triethylsilyl group, dimethyl-tert-butylsilyl group, and the like. Specific examples of the oxoalkyl group include a 3-oxocyclohexyl group, a 4-methyl-2-oxooxan-4-yl group, and a 5-methyl-2-oxooxolan-5-yl group. a1 is an integer of 0-6.

  Specific examples of the acid labile group of the above formula (A-1) include tert-butoxycarbonyl group, tert-butoxycarbonylmethyl group, tert-amyloxycarbonyl group, tert-amyloxycarbonylmethyl group, 1,1 -Diethylpropyloxycarbonyl group, 1,1-diethylpropyloxycarbonylmethyl group, 1-ethylcyclopentyloxycarbonyl group, 1-ethylcyclopentyloxycarbonylmethyl group, 1-ethyl-2-cyclopentenyloxycarbonyl group, 1-ethyl Examples include 2-cyclopentenyloxycarbonylmethyl group, 1-ethoxyethoxycarbonylmethyl group, 2-tetrahydropyranyloxycarbonylmethyl group, 2-tetrahydrofuranyloxycarbonylmethyl group and the like.

Furthermore, the substituent shown by following formula (A-1) -1-(A-1) -10 can also be mentioned.

Here, R ³⁷ is the same or different from each other, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 20 carbon atoms, R ³⁸ is a hydrogen atom, or 1 to 1 carbon atoms. 10 linear, branched or cyclic alkyl groups.
R ³⁹ is a linear, branched or cyclic alkyl group having 2 to 10 carbon atoms, or an aryl group having 6 to 20 carbon atoms, which are the same or different from each other.
a1 is the same as described above.

In the above formula (A-2), R ³¹ and R ³² each independently represent a hydrogen atom or a linear, branched or cyclic alkyl group having 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms. Examples include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, cyclopentyl group, cyclohexyl group, 2-ethylhexyl group, and n-octyl group. R ³³ represents a monovalent hydrocarbon group which may have a hetero atom such as an oxygen atom having 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms, a linear, branched or cyclic alkyl group, Examples include those in which a part of hydrogen atoms are substituted with a hydroxyl group, an alkoxy group, an oxo group, an amino group, an alkylamino group, and the like, and specific examples include the following substituted alkyl groups.

R ³¹ and R ³² , R ³¹ and R ³³ , R ³² and R ³³ may be combined to form a ring together with the carbon atom to which they are bonded, and in forming a ring, it is involved in the formation of the ring R ³¹ , R ³² and R ³³ each represent a linear or branched alkylene group having 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms, and preferably the ring has 3 to 10 carbon atoms, particularly 4 to 10 carbon atoms. is there.

  Of the acid labile groups represented by the above formula (A-2), examples of the linear or branched groups include those of the following formulas (A-2) -1 to (A-2) -35. be able to.

  Among the acid labile groups represented by the above formula (A-2), the cyclic ones include tetrahydrofuran-2-yl group, 2-methyltetrahydrofuran-2-yl group, tetrahydropyran-2-yl group, 2- Examples thereof include a methyltetrahydropyran-2-yl group.

  Further, the base resin may be intermolecularly or intramolecularly crosslinked by an acid labile group represented by the following formula (A-2a) or (A-2b).

In the formula, R ⁴⁰ and R ⁴¹ each independently represent a hydrogen atom or a linear, branched or cyclic alkyl group having 1 to 8 carbon atoms. Alternatively, R ⁴⁰ and R ⁴¹ may combine to form a ring together with the carbon atom to which they are bonded, and when forming a ring, R ⁴⁰ and R ⁴¹ are linear or branched having 1 to 8 carbon atoms. -Like alkylene group. R ⁴² is a straight-chain having 1 to 10 carbon atoms, branched or cyclic alkylene group, b1, d10 is 0 or 1 to 10, preferably 0 or an integer of 1 to 5, c1 is an integer of 1-7 . A represents a (c1 + 1) -valent aliphatic or alicyclic saturated hydrocarbon group having 1 to 50 carbon atoms, an aromatic hydrocarbon group or a heterocyclic group, and these groups may intervene a hetero atom, Alternatively, a part of hydrogen atoms bonded to the carbon atom may be substituted with a hydroxyl group, a carboxyl group, a carbonyl group, or a fluorine atom. B represents —CO—O—, —NHCO—O— or —NHCONH—.

  In this case, preferably, A is a divalent to tetravalent linear, branched or cyclic alkylene group having 1 to 20 carbon atoms, an alkyltriyl group, an alkyltetrayl group, or an arylene group having 6 to 30 carbon atoms. In these groups, a hetero atom may be interposed, and a part of hydrogen atoms bonded to the carbon atom may be substituted with a hydroxyl group, a carboxyl group, an acyl group, or a halogen atom. C1 is preferably an integer of 1 to 3.

  Specific examples of the crosslinked acetal groups represented by the above formulas (A-2a) and (A-2b) include those represented by the following formulas (A-2) -36 to (A-2) -43.

Next, in the formula (A-3), R ³⁴ , R ³⁵ and R ³⁶ are each independently a monovalent hydrocarbon such as a hydrogen atom or a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms. R ³⁴ and R ³⁵ , R ³⁴ and R ³⁶ , R ³⁵ and R ³⁶ are bonded to each other, and together with the carbon atom to which they are bonded, may include heteroatoms such as oxygen, sulfur, nitrogen, fluorine, etc. An alicyclic ring having 3 to 20 carbon atoms may be formed.

  The tertiary alkyl group represented by the above formula (A-3) includes a tert-butyl group, a triethylcarbyl group, a 1-ethylnorbornyl group, a 1-methylcyclohexyl group, a 1-ethylcyclopentyl group, 2- (2 -Methyl) adamantyl group, 2- (2-ethyl) adamantyl group, tert-amyl group and the like.

Moreover, as a tertiary alkyl group, following formula (A-3) -1-(A-3) -18 can also be specifically mentioned.

Among the above formula (A-3) -1~ (A -3) -18, R 43 is identical or C1-8 independently a straight, branched or cyclic alkyl group, or a carbon number 6 to 20 An aryl group such as a phenyl group of R ⁴⁴ and R ⁴⁶ represent a hydrogen atom or a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms. R ⁴⁵ represents an aryl group such as a phenyl group having 6 to 20 carbon atoms.

Further, as shown in the following formulas (A-3) -19 and (A-3) -20, the polymer contains a divalent or higher valent alkylene group and R ⁴⁷ which is an arylene group, and the polymer within or between the molecules is crosslinked. May be.

In the above formulas (A-3) -19 and (A-3) -20, R ⁴³ is the same as described above, and R ⁴⁷ is a linear, branched or cyclic alkylene group having 1 to 20 carbon atoms, or a phenylene group. An arylene group such as an oxygen atom, a sulfur atom, or a nitrogen atom. e1 is an integer of 1 to 3.

  In particular, as the repeating unit in which (meth) acrylic acid is substituted with the acid labile group of the above formula (A-3), a repeating unit having an exo structure represented by the following formula (A-3) -21 is preferable. It is done.

（式中、Ｒ^２、ｂは前述の通り、Ｒ^ｃ３は炭素数１〜８の直鎖状、分岐状又は環状のアルキル基又は炭素数６〜２０の置換されていてもよいアリール基を示す。Ｒ^ｃ４〜Ｒ^ｃ９及びＲ^ｃ１２、Ｒ^ｃ１３はそれぞれ独立に水素原子又は炭素数１〜１５のヘテロ原子を含んでもよい１価の炭化水素基を示し、Ｒ^ｃ１０、Ｒ^ｃ１１は水素原子を示す。あるいは、Ｒ^ｃ４とＲ^ｃ５、Ｒ^ｃ６とＲ^ｃ８、Ｒ^ｃ６とＲ^ｃ９、Ｒ^ｃ７とＲ^ｃ９、Ｒ^ｃ７とＲ^ｃ１３、Ｒ^ｃ８とＲ^ｃ１２、Ｒ^ｃ１０とＲ^ｃ１１又はＲ^ｃ１１とＲ^ｃ１２は互いに環を形成していてもよく、その場合には炭素数１〜１５のヘテロ原子を含んでもよい２価の炭化水素基を示す。またＲ^ｃ４とＲ^ｃ１３、Ｒ^ｃ１０とＲ^ｃ１３又はＲ^ｃ６とＲ^ｃ８は隣接する炭素に結合するもの同士で何も介さずに結合し、二重結合を形成してもよい。また、本式により、鏡像体も表す。）

(In the formula, R ² and b are as described above, and R ^c3 represents a linear, branched or cyclic alkyl group having 1 to 8 carbon atoms or an optionally substituted aryl group having 6 to 20 carbon atoms. R ^{c4 to} R ^c9 and R ^c12 and R ^c13 each independently represent a hydrogen atom or a monovalent hydrocarbon group that may contain a hetero atom having 1 to 15 carbon atoms, and R ^c10 and R ^c11 represent a hydrogen atom. Alternatively, R ^c4 and R ^c5 , R ^c6 and R ^c8 , R ^c6 and R ^c9 , R ^c7 and R ^c9 , R ^c7 and R ^c13 , R ^c8 and R ^c12 , R ^c10 and R ^c11, or R ^c11 and R ^{c12 Represents} a divalent hydrocarbon group which may form a ring with each other and may contain a hetero atom having 1 to 15 carbon atoms, R ^c4 and R ^c13 , R ^c10 and R ^c13 or R carbon ^c6 and ^{R c8} is adjacent Nothing binds not through with each other that bind, may form a double bond. The formula also represents enantiomer.)

  Examples of such an ester monomer for obtaining a repeating unit having an exo structure represented by the above formula (A-3) -21 include those described in JP-A No. 2000-327633. . Specific examples include the following, but are not limited thereto.

  Furthermore, as a repeating unit in which (meth) acrylic acid is substituted with an acid labile group of the above formula (A-3), frangyl, tetrahydrofurandiyl or oxanorbornanediyl represented by the following formula (A-3) -22 is included. A repeating unit can be preferably mentioned.

（式中、Ｒ^２、ｂは前述の通りである。Ｒ^ｃ１４、Ｒ^ｃ１５はそれぞれ独立に炭素数１〜１０の直鎖状、分岐状又は環状の１価炭化水素基を示す。又は、Ｒ^ｃ１４、Ｒ^ｃ１５は互いに結合してこれらが結合する炭素原子と共に脂肪族炭化水素環を形成してもよい。Ｒ^ｃ１６はフランジイル、テトラヒドロフランジイル又はオキサノルボルナンジイルから選ばれる２価の基を示す。Ｒ^ｃ１７は水素原子又はヘテロ原子を含んでもよい炭素数１〜１０の直鎖状、分岐状又は環状の１価炭化水素基を示す。）

(Wherein R ² and b are as described above. R ^c14 and R ^c15 each independently represent a linear, branched or cyclic monovalent hydrocarbon group having 1 to 10 carbon atoms. ^c14 and R ^c15 may be bonded to each other to form an aliphatic hydrocarbon ring together with the carbon atom to which they are bonded, and R ^c16 represents a divalent group selected from ^flangedyl , tetrahydrofurandiyl or ^{oxanorbornanediyl} . R ^c17 represents a linear, branched or cyclic monovalent hydrocarbon group having 1 to 10 carbon atoms which may contain a hydrogen atom or a hetero atom.

  The monomer for obtaining a repeating unit substituted with an acid labile group having frangiyl, tetrahydrofurandiyl or oxanorbornanediyl represented by the above formula (A-3) -22 is specifically shown below. Illustrated. In the following formulae, Ac represents an acetyl group, and Me represents a methyl group.

  Further, the positive resist material of the present invention has an adhesive group in the repeating unit a, but the adhesive group represented by the general formula (1) has 4 carbon atoms more than phenol. Since the fat solubility is increased, the base resin has a repeating unit a having a group represented by the above general formula (1), preferably a repetition of the above general formulas (2) and (3), in order to further improve the adhesion. In addition to the unit a and the repeating unit b in which the hydroxyl group of the carboxyl group is substituted with an acid labile group, preferably the repeating unit b of the general formula (3), a hydroxyl group, lactone ring, ether group, ester group, carbonyl And a polymer compound containing a repeating unit c having an adhesive group selected from a cyano group (0 <a <1.0, 0 <b <1.0, 0 <c ≦ 0.9, 0.2 ≦ a + b + c ≦ 1.0. ) Preferably contains a.

  Specific examples of the monomer for obtaining the repeating unit c having any one of a hydroxyl group, a lactone ring, an ether group, an ester group, a carbonyl group, and a cyano group as an adhesive group can be exemplified below.

  In the case of a monomer having a hydroxyl group, the hydroxyl group may be replaced with an acetal that can be easily deprotected with an acid such as an ethoxyethoxy group at the time of polymerization, and then deprotected with a weak acid and water after the polymerization. It may be substituted with a group, a pivaloyl group or the like and subjected to alkali hydrolysis after polymerization.

  In addition, repeating units d such as indene d1, acenaphthylene d2, chromone d3, coumarin d4, norbornadiene d5 represented by the following general formula (5) can also be copolymerized.

（式中、Ｒ^４〜Ｒ^８はそれぞれ独立に、水素原子、炭素数１〜３０のアルキル基、一部又は全てがハロゲン原子で置換されたアルキル基、ヒドロキシル基、アルコキシ基、アルカノイル基又はアルコキシカルボニル基、又は炭素数６〜１０のアリール基、ハロゲン原子、又は１，１，１，３，３，３−ヘキサフルオロ−２−プロパノール基である。Ｑはメチレン基、酸素原子、又は硫黄原子である。ｄ１は０≦ｄ１≦０．４、ｄ２は０≦ｄ２≦０．４、ｄ３は０≦ｄ３≦０．４、ｄ４は０≦ｄ４≦０．４、ｄ５は０≦ｄ５≦０．４、０≦ｄ１＋ｄ２＋ｄ３＋ｄ４＋ｄ５≦０．４である。）

Wherein R ^{4 to} R ⁸ are each independently a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkyl group partially or entirely substituted with a halogen atom, a hydroxyl group, an alkoxy group, an alkanoyl group or an alkoxy group. A carbonyl group, an aryl group having 6 to 10 carbon atoms, a halogen atom, or a 1,1,1,3,3,3-hexafluoro-2-propanol group, Q is a methylene group, an oxygen atom, or a sulfur atom; D1 is 0 ≦ d1 ≦ 0.4, d2 is 0 ≦ d2 ≦ 0.4, d3 is 0 ≦ d3 ≦ 0.4, d4 is 0 ≦ d4 ≦ 0.4, and d5 is 0 ≦ d5 ≦ 0. .4, 0 ≦ d1 + d2 + d3 + d4 + d5 ≦ 0.4.

（式中、Ｒ^９は水素原子又はメチル基を表し、Ｒ^１０は酸不安定基である。ｑは１又は２である。ｅは０≦ｅ≦０．４である。） The repeating unit e represented by the following general formula (6) can be additionally copolymerized.

(In the formula, R ⁹ represents a hydrogen atom or a methyl group, R ¹⁰ is an acid labile group, q is 1 or 2, and e is 0 ≦ e ≦ 0.4.)

  Examples of the repeating unit f that can be copolymerized in addition to the repeating units a, b, c, d, and e include styrene, vinyl naphthalene, vinyl anthracene, vinyl pyrene, and methylene indan.

  Furthermore, an onium salt acid generator g having a polymerizable olefin can be copolymerized. For example, JP-A-4-230645, JP-A-2005-84365, JP-A-2006-045311 A sulfonium salt and an iodonium salt having a polymerizable olefin that generates a specific sulfonic acid have been proposed. Further, for example, JP 2006-178317 A proposes a sulfonium salt in which a sulfonic acid is directly bonded to the main chain.

（式中、Ｒ^２０、Ｒ^２４、Ｒ^２８はそれぞれ独立に、水素原子又はメチル基、Ｒ^２１は単結合、フェニレン基、−Ｏ−Ｒ−、又は−Ｃ（＝Ｏ）−Ｗ−Ｒ−である。Ｗは酸素原子又はＮＨ、Ｒは炭素数１〜６の直鎖状、分岐状又は環状のアルキレン基、フェニレン基又はアルケニレン基であり、カルボニル基、エステル基、エーテル基又はヒドロキシル基を含んでいてもよい。Ｒ^２２、Ｒ^２３、Ｒ^２５、Ｒ^２６、Ｒ^２７、Ｒ^２９、Ｒ^３００、Ｒ^３１０は同一又は異種の炭素数１〜１２の直鎖状、分岐状又は環状のアルキル基であり、カルボニル基、エステル基又はエーテル基を含んでいてもよく、又は炭素数６〜１２のアリール基、炭素数７〜２０のアラルキル基又はチオフェニル基を表す。Ｚ_０は単結合、メチレン基、エチレン基、フェニレン基、フッ素化されたフェニレン基、−Ｏ−Ｒ^３２０−、又は−Ｃ（＝Ｏ）−Ｚ_１−Ｒ^３２０−である。Ｚ_１は酸素原子又はＮＨ、Ｒ^３２０は炭素数１〜６の直鎖状、分岐状又は環状のアルキレン基、フェニレン基又はアルケニレン基であり、その炭素原子に結合する水素原子がフッ素原子等によって置換されていてもよく、カルボニル基、エステル基、エーテル基又はヒドロキシル基を含んでいてもよい。Ｍ⁻は非求核性対向イオンを表す。ｇ１は０≦ｇ１≦０．３、ｇ２は０≦ｇ２≦０．３、ｇ３は０≦ｇ３≦０．３、０≦ｇ１＋ｇ２＋ｇ３≦０．３である。） Among these, in the present invention, it is preferable to copolymerize repeating units g1, g2, and g3 having a sulfonium salt represented by the following general formula (7).

(Wherein R ²⁰ , R ²⁴ and R ²⁸ are each independently a hydrogen atom or a methyl group, R ²¹ is a single bond, a phenylene group, —O—R—, or —C (═O) —W—R—. W is an oxygen atom or NH, R is a linear, branched or cyclic alkylene group, a phenylene group or an alkenylene group having 1 to 6 carbon atoms, and a carbonyl group, an ester group, an ether group or a hydroxyl group. R ²² , R ²³ , R ²⁵ , R ²⁶ , R ²⁷ , R ²⁹ , R ³⁰⁰ , R ³¹⁰ are the same or different linear, branched or cyclic alkyl having 1 to 12 carbon atoms. A carbonyl group, an ester group or an ether group, or an aryl group having 6 to 12 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or a thiophenyl group, Z ₀ is a single bond, methylene Group, Ethile Group, phenylene group, fluorinated phenylene group, —O—R ³²⁰ —, or —C (═O) —Z ₁ —R ³²⁰ —, wherein Z ₁ is an oxygen atom or NH, and R ³²⁰ is the number of carbon atoms. 1 to 6 linear, branched or cyclic alkylene group, phenylene group or alkenylene group, the hydrogen atom bonded to the carbon atom may be substituted by a fluorine atom or the like, a carbonyl group, an ester group, It may contain an ether group or a hydroxyl group, M ⁻ represents a non-nucleophilic counter ion, g1 is 0 ≦ g1 ≦ 0.3, g2 is 0 ≦ g2 ≦ 0.3, g3 is 0 ≦ g3 ≦. 0.3, 0 ≦ g1 + g2 + g3 ≦ 0.3.)

Examples of non-nucleophilic counter ions of M ⁻ include halide ions such as chloride ions and bromide ions, triflate, fluoroalkyl sulfonates such as 1,1,1-trifluoroethanesulfonate, nonafluorobutanesulfonate, tosylate, and benzene. Sulfonate, 4-fluorobenzene sulfonate, aryl sulfonate such as 1,2,3,4,5-pentafluorobenzene sulfonate, alkyl sulfonate such as mesylate and butane sulfonate, bis (trifluoromethylsulfonyl) imide, bis (perfluoroethyl) Mention acid such as imide) such as sulfonyl) imide, bis (perfluorobutylsulfonyl) imide, tris (trifluoromethylsulfonyl) methide, tris (perfluoroethylsulfonyl) methide Can do.

  As described above, by using a polymer main chain having an acid generator bonded thereto, acid diffusion can be reduced, and degradation of resolution due to blurring of acid diffusion can be prevented. Further, the line edge roughness (LER) and the line width roughness (LWR) are improved by uniformly dispersing the acid generator.

  In order to synthesize these polymer compounds, one method is to add a monomer that gives repeating units a and b and a desired monomer among monomers that give c to g, and add a radical polymerization initiator in an organic solvent. A polymer compound of a copolymer can be obtained by performing heat polymerization.

  Examples of the organic solvent used at the time of polymerization include toluene, benzene, tetrahydrofuran, diethyl ether, dioxane and the like. As polymerization initiators, 2,2′-azobisisobutyronitrile (AIBN), 2,2′-azobis (2,4-dimethylvaleronitrile), dimethyl 2,2-azobis (2-methylpropionate) ), Benzoyl peroxide, lauroyl peroxide and the like, and preferably polymerized by heating to 50 to 80 ° C. The reaction time is 2 to 100 hours, preferably 5 to 20 hours.

  When copolymerizing hydroxystyrene and hydroxyvinylnaphthalene, acetoxystyrene and acetoxyvinylnaphthalene are used in place of hydroxystyrene and hydroxyvinylnaphthalene, and after polymerization, the acetoxy group is deprotected by the above alkaline hydrolysis to produce polyhydroxystyrene and hydroxyhydroxyl. There is also a method of making polyvinyl naphthalene.

  Ammonia water, triethylamine, etc. can be used as the base during the alkali hydrolysis. The reaction temperature is −20 to 100 ° C., preferably 0 to 60 ° C., and the reaction time is 0.2 to 100 hours, preferably 0.5 to 20 hours.

Here, the ratio of the repeating units a to c is 0 <a <1.0, 0 <b <1.0, 0 ≦ c ≦ 0.9, preferably 0 <c ≦ 0.9, 0. 2 ≦ a + b + c ≦ 1.0, particularly preferably 0.05 ≦ a ≦ 0.9, 0.1 ≦ b ≦ 0.8, 0.1 ≦ c ≦ 0.8, 0.3 ≦ a + b + c ≦ 1.0 More preferably, 0.1 ≦ a ≦ 0.8, 0.15 ≦ b ≦ 0.7, 0.15 ≦ c ≦ 0.7, and 0.4 ≦ a + b + c ≦ 1.0.
In this case, the ratio of the repeating units d to g is preferably 0 ≦ d + e + f + g ≦ 0.8, particularly preferably 0 ≦ d + e + f + g ≦ 0.7, and a + b + c + d + e + f + g = 1.

  For example, a + b + c = 1 means that in a polymer compound containing repeating units a, b, and c, the total amount of repeating units a, b, and c is 100 mol% with respect to the total amount of all repeating units. A + b + c <1 means that the total amount of the repeating units a, b and c is less than 100 mol% with respect to the total amount of all the repeating units and has other repeating units in addition to a, b and c. It shows that.

The polymer compound used in the positive resist material of the present invention has a weight average molecular weight of 1,000 to 500,000, preferably 2,000 to 30,000. If the weight average molecular weight is 1,000 or more, the resist material is excellent in heat resistance, and if it is 500,000 or less, the alkali solubility is not lowered, and a trailing phenomenon may occur after pattern formation. Nor.
The weight average molecular weight (Mw) is a measured value in terms of polystyrene using gel permeation chromatography (GPC).

Furthermore, in the high molecular compound used in the positive resist material of the present invention, when the molecular weight distribution (Mw / Mn) of the multi-component copolymer is wide, there is a low molecular weight or high molecular weight polymer. Foreign matter is seen on the pattern or the shape of the pattern is deteriorated. Therefore, since the influence of such molecular weight and molecular weight distribution tends to increase as the pattern rule becomes finer, in order to obtain a resist material suitably used for fine pattern dimensions, the multi-component copolymer used is used. The molecular weight distribution is preferably 1.0 to 2.0, particularly preferably 1.0 to 1.5 and narrow dispersion.
It is also possible to blend two or more polymers having different composition ratios, molecular weight distributions, and molecular weights.

  The polymer compound used in the present invention is suitable as a base resin for a positive resist material. Such a polymer compound is used as a base resin, and an organic solvent, an acid generator, a dissolution controller, a basic compound, an interface By combining the activator and the like appropriately in accordance with the purpose to form a positive resist material, the dissolution rate of the polymer compound in the developing solution is accelerated by a catalytic reaction in the exposed area, so that a highly sensitive positive resist is formed. Resist film has high dissolution contrast and resolution, exposure margin, excellent process adaptability, good pattern shape after exposure, and better etching resistance In particular, since the acid diffusion can be suppressed, the difference in density between the dense and dense layers is small. It can be such things.

  In particular, when a chemically amplified positive resist material containing an acid generator and utilizing an acid catalyzed reaction is used, the sensitivity can be increased, and various characteristics are further improved and extremely useful. .

In addition, by adding a dissolution control agent to the positive resist material, the difference in dissolution rate between the exposed area and the unexposed area can be further increased, and the resolution can be further improved.
Furthermore, by adding a basic compound, for example, the acid diffusion rate in the resist film can be suppressed to further improve the resolution, and by adding a surfactant, the coatability of the resist material can be further improved. Or can be controlled

In order to make the positive resist material of the present invention function as a chemically amplified positive resist material used in the pattern forming method of the present invention, for example, a compound that generates an acid in response to actinic rays or radiation (photoacid generator) ) Can be contained. The component of the photoacid generator may be any compound that generates an acid upon irradiation with high energy rays. Suitable photoacid generators include sulfonium salts, iodonium salts, sulfonyldiazomethane, N-sulfonyloxyimide, oxime-O-sulfonate type acid generators, and the like. Although described in detail below, these can be used alone or in admixture of two or more.
Specific examples of the acid generator are described, for example, in paragraphs [0122] to [0142] of JP-A-2008-111103.

  Specific examples of the organic solvent that can be blended in the positive resist material of the present invention include, for example, cyclohexanone and methyl-2-n described in paragraphs [0144] to [0145] of JP-A-2008-111103. -Ketones such as amyl ketone, alcohols such as 3-methoxybutanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, propylene glycol monomethyl ether, ethylene glycol monomethyl ether , Ethers such as propylene glycol monoethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether, diethylene glycol dimethyl ether, propylene glycol monomethyl ether acetate, propylene group Cole monoethyl ether acetate, ethyl lactate, ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, tert-butyl acetate, tert-butyl propionate, propylene glycol mono tert-butyl ether acetate, etc. Examples include esters, lactones such as γ-butyrolactone, and mixed solvents thereof. Examples of basic compounds include primary, secondary, and tertiary amine compounds described in paragraphs [0146] to [0164], particularly hydroxy groups, An amine compound having an ether, ester group, lactone ring, cyano group, sulfonic acid ester group or a compound having a carbamate group described in Japanese Patent No. 3790649 can be exemplified, and the surfactants are dissolved in paragraphs [0165] to [0166]. Special control agent It is described in paragraphs [0155] to [0178] of Kaikai 2008-122932.

  Furthermore, a polymer type quencher described in JP-A-2008-239918 can also be added. Moreover, acetylene alcohols can also be added as a further optional component as required, and specific examples of acetylene alcohols are described in paragraphs [0179] to [0182].

  These enhance the rectangularity of the resist after patterning by being oriented on the resist surface after coating. The polymer quencher also has an effect of preventing pattern film loss and pattern top rounding when a protective film for immersion exposure is applied.

  In addition, it is preferable that the compounding quantity of an acid generator shall be 0.01-100 mass parts with respect to 100 mass parts of base resins, especially 0.1-80 mass parts, and the compounding quantity of an organic solvent is 100 mass of base resins. The amount is preferably 50 to 10,000 parts by mass, particularly 100 to 5,000 parts by mass with respect to parts. Moreover, 0-100 mass parts, especially 0-40 mass parts, a basic compound are 0-100 mass parts with respect to 100 mass parts of base resins, especially 0.001-50 mass parts, surfactant is a surfactant. The blending amount is preferably 0 to 10 parts by mass, particularly 0.0001 to 5 parts by mass.

  In addition, the present invention includes at least a step of applying the positive resist material on a substrate, a step of exposing to high energy rays after heat treatment, and a step of developing using a developer. A pattern forming method is provided.

  In this case, in the step of exposing with the high energy beam, the light source is not particularly limited, but an electron beam, soft X-ray with a wavelength of 3 to 15 nm, or ultraviolet light with a wavelength of 180 to 250 nm can be used as the light source.

  The positive resist material of the present invention, for example, a polymer compound containing a repeating unit a having an adhesive group represented by the general formula (1) and a repeating unit b having an acid leaving group, an acid generator, an organic When a chemically amplified positive resist material containing a solvent and a basic compound is used for manufacturing various integrated circuits, a known lithography technique can be applied although it is not particularly limited.

For example, the positive resist material of the present invention is applied to a substrate for manufacturing an integrated circuit (Si, SiO ₂ , SiN, SiON, TiN, WSi, BPSG, SOG, organic antireflection film, etc.) or a substrate for manufacturing a mask circuit (Cr , CrO, CrON, MoSi, etc.) by a suitable coating method such as spin coating, roll coating, flow coating, dip coating, spray coating, doctor coating, etc., so that the coating film thickness is 0.1 to 2.0 μm. To do. This is pre-baked on a hot plate at 60 to 150 ° C. for 10 seconds to 30 minutes, preferably 80 to 120 ° C. for 30 seconds to 20 minutes. Next, a target pattern is passed through a predetermined mask with a light source selected from high energy rays such as ultraviolet rays, far ultraviolet rays, electron beams, X-rays, excimer lasers, γ rays, synchrotron radiation, vacuum ultraviolet rays (soft X-rays) or the like. Direct exposure is performed. It is preferable to expose so that the exposure amount is about 1 to 200 mJ / cm ² , preferably 10 to 100 mJ / cm ² , or 0.1 to 100 μC, preferably about 0.5 to 50 μC. Next, post-exposure baking (PEB) is performed on a hot plate at 60 to 150 ° C. for 10 seconds to 30 minutes, preferably 80 to 120 ° C. for 30 seconds to 20 minutes.

  Further, 0.1 to 5% by mass, preferably 2 to 10% by mass of tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH), tetrabutylammonium hydroxide ( Using an aqueous developer such as TBAH), development is performed for 3 seconds to 3 minutes, preferably 5 seconds to 2 minutes, by a conventional method such as a dip method, a paddle method, or a spray method. As a result, the irradiated portion is dissolved in the developer, and the unexposed portion is not dissolved, and a desired positive pattern is formed on the substrate.

  The resist material of the present invention is particularly suitable for fine patterning using electron beams, vacuum ultraviolet rays (soft X-rays), X-rays, γ rays, and synchrotron radiation among high-energy rays.

  TEAH, TPAH, and TBAH having a longer alkyl chain than the TMAH aqueous solution that is generally widely used have the effect of reducing the swelling during development and preventing pattern collapse. In Japanese Patent Publication No. 3429592, a repeating unit having an alicyclic structure such as adamantane methacrylate and a repeating unit having an acid labile group such as tbutyl methacrylate are copolymerized, and there is no hydrophilic group and water repellency. Examples using aqueous TBAH solutions for high polymer development are presented.

  As the tetramethylammonium hydroxide (TMAH) developer, an aqueous solution of 2.38% by mass is most widely used. This corresponds to 0.26N, and it is preferable that the TEAH, TPAH, and TBAH aqueous solutions have the same normality. The masses of TEAH, TPAH, and TBAH that are 0.26N are 3.84, 5.31, and 6.78 mass%, respectively.

  In a pattern of 32 nm or less that is resolved by EB or EUV, a phenomenon occurs in which lines are twisted, the lines are stuck together, or the stuck lines are tilted. This is thought to be because the lines swollen and swollen in the developer are stuck together. Since the swollen line is soft like a sponge containing a developer, it tends to collapse due to the stress of rinsing. For this reason, the developer having a long alkyl chain has the effect of preventing swelling and preventing pattern collapse.

EXAMPLES Hereinafter, although a synthesis example, a comparative synthesis example, an Example, and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example etc.
The weight average molecular weight (Mw) is a measured value in terms of polystyrene using gel permeation chromatography (GPC).
[Monomer synthesis example]
[Monomer Synthesis Example 1] Synthesis of 5- (methacryloylamino) -1-naphthol (monomer 1)

To a mixture of 104 g of methacrylic acid chloride and 1,500 g of toluene, 150 g of 5-amino-1-naphthol was added under ice cooling and stirring. Then, it stirred at room temperature for 16 hours. The crude product was obtained by ordinary aqueous work-up and solvent distillation. Purification was performed by column chromatography to obtain the desired 5- (methacryloylamino) -1-naphthol.
Monomers 2 to 5 were obtained in the same manner.
Monomers 1 to 5 and PAG monomers 1 to 3 used in the following synthesis examples are as follows.

Monomer 1: 5- (methacryloylamino) -1-naphthol monomer 2: 8- (methacryloylamino) -2-naphthol monomer 3: 4- (methacryloylamino) -1-naphthol monomer 4: N- (5-hydroxy-1) -Naphthyl) 4-vinylbenzamide monomer 5: N- (5-hydroxy-1-naphthyl) 5-vinyl-1-naphthamide PAG monomer 1: 4-oxyphenyl diphenylsulfonium methacrylate Perful
Orobutanesulfonate PAG monomer 2: Triphenylsulfonium 2,3,5,6-tetrafluoro-4-
Methacryloyloxybenzenesulfonate PAG monomer 3: Triphenylsulfonium 1,1,3,3,3-pentafluoro-
2-Methacryloyloxypropane-1-sulfonate

[Synthesis Example 1]
In a 2 L flask, methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl 8.2 g, methacrylic acid 3-oxo-2,7-dioxatricyclo [4.2.1.0 ^4,8 ] nonan-9-yl 8.7 g, monomer 1 6 0.8 g and 40 g of tetrahydrofuran as a solvent were added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: methacrylate 3-oxo-2,7-dioxatricyclo [4.2.1.0 ^4,8 ] nonan-9-yl: monomer 1 = 0.30: 0.40: 0.30
Weight average molecular weight (Mw) = 8,200
Molecular weight distribution (Mw / Mn) = 1.83
This polymer compound is referred to as (Polymer 1).

[Synthesis Example 2]
In a 2 L flask, methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl 8.2 g, monomer 2 6.8 g, tetrahydro-2-oxofuran-3-yl methacrylate 6.8 g, tetrahydrofuran 40 g as a solvent was added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: monomer 2: tetrahydro-2-oxofuran-3-yl methacrylate = 0.30: 0.30: 0.40
Weight average molecular weight (Mw) = 8,400
Molecular weight distribution (Mw / Mn) = 1.79
This polymer compound is referred to as (Polymer 2).

[Synthesis Example 3]
In a 2 L flask, methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl 8.2g, methacrylic acid 5-oxo-4-oxatricyclo [4.2.1.0 ^3,7 ] nonan-2-yl 8.9g, monomer 3 6.8g, solvent As a result, 40 g of tetrahydrofuran was added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: 5-oxo-4-oxatricyclo [4.2.1.0 ^3,7 ] nonan-2-yl methacrylate: monomer 3 = 0.30: 0.40: 0.30
Weight average molecular weight (Mw) = 8,100
Molecular weight distribution (Mw / Mn) = 1.72
This polymer compound is referred to as (Polymer 3).

[Synthesis Example 4]
In a 2 L flask, methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl 8.2 g, monomer 4 9.9 g, 1-hydroxynaphthalen-5-yl methacrylate 4.6 g, methacrylate 3-oxo-2,7-dioxatricyclo [4.2. 1.0 ^4,8 ] nonan-9-yl 4.5 g and tetrahydrofuran 40 g as a solvent were added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: monomer 4: 1-hydroxynaphthalen-5-yl methacrylate: 3-oxo-2,7-dioxatricyclo methacrylate [4.2.1.0 ^4,8 ] nonane-9 -Ile = 0.30: 0.30: 0.20: 0.20
Weight average molecular weight (Mw) = 6,900
Molecular weight distribution (Mw / Mn) = 1.79
This polymer compound is referred to as (Polymer 4).

[Synthesis Example 5]
In a 2 L flask, methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl 8.2 g, monomer 5 10.6 g, tetrahydro-2-oxofuran-3-yl methacrylate 6.8 g and tetrahydrofuran 40 g as a solvent were added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: monomer 5: tetrahydro-2-oxofuran-3-yl methacrylate = 0.30: 0.30: 0.40
Weight average molecular weight (Mw) = 6,300
Molecular weight distribution (Mw / Mn) = 1.67
This polymer compound is referred to as (Polymer 5).

[Synthesis Example 6]
In a 2 L flask, methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl 8.2 g, methacrylic acid (2-oxo-2,3-dihydrobenzoxazol-5-yl) 8.7 g, monomer 1 6.8 g, tetrahydro-2-oxofuran-3-methacrylate 3.4 g of yl and 40 g of tetrahydrofuran as a solvent were added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: methacrylic acid (2-oxo-2,3-dihydrobenzoxazol-5-yl): monomer 1: tetrahydro-2-oxofuran-3-yl methacrylate = 0.30: 0.20: 0.30: 0.20
Weight average molecular weight (Mw) = 7,300
Molecular weight distribution (Mw / Mn) = 1.83
This polymer compound is referred to as (Polymer 6).

[Synthesis Example 7]
In a 2 L flask, 7.4 g of 2-ethyl-2-adamantane methacrylate, 6.8 g of monomer 3, 3-oxo-2,7-dioxatricyclomethacrylate [4.2.1.0 ^4,8 6.7 g of nonan-9-yl, 6.5 g of PAG monomer 1 and 40 g of tetrahydrofuran as a solvent were added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Methacrylic acid-2-ethyl-2-adamantane: Monomer 3: 3-Oxo-2,7-dioxatricyclo [4.2.1.0 ^4,8 ] nonan-9-yl methacrylate: PAG monomer 1 = 0.30: 0.30: 0.30: 0.10
Weight average molecular weight (Mw) = 7,800
Molecular weight distribution (Mw / Mn) = 1.81
This polymer compound is referred to as (Polymer 7).

[Synthesis Example 8]
In a 2 L flask, methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl 8.2 g, monomer 3 6.8 g, 3-oxo-2,7-dioxatricyclo [4.2.1.0 ^4,8 ] nonan-9-yl methacrylate, PAG 5.7 g of monomer 2 and 40 g of tetrahydrofuran as a solvent were added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: monomer 3: 3-oxo-2,7-dioxatricyclomethacrylate [4.2.1.0 ^4,8 ] nonan-9-yl: PAG monomer 2 = 0.30: 0.30: 0.30: 0.10
Weight average molecular weight (Mw) = 7,100
Molecular weight distribution (Mw / Mn) = 1.77
This polymer compound is referred to as (Polymer 8).

[Synthesis Example 9]
In a 2 L flask, methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl 8.2 g, monomer 2 6.8 g, tetrahydro-2-oxofuran-3-yl methacrylate 5.1 g, PAG monomer 3 5.6 g, and tetrahydrofuran 40 g as a solvent were added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: monomer 2: tetrahydro-2-oxofuran-3-yl methacrylate: PAG monomer 3 = 0.30: 0.30: 0.30: 0.10
Weight average molecular weight (Mw) = 7,400
Molecular weight distribution (Mw / Mn) = 1.75
This polymer compound is referred to as (Polymer 9).

［合成例１０］
２Ｌのフラスコにメタクリル酸 ９−フルオレニル７．１ｇ、モノマー３を６．８ｇ、メタクリル酸３−オキソ−２，７−ジオキサトリシクロ［４．２．１．０^４，８］ノナン−９−イル６．８ｇ、ＰＡＧモノマー３を５．６ｇ、溶媒としてテトラヒドロフランを４０ｇ添加した。この反応容器を窒素雰囲気下、−７０℃まで冷却し、減圧脱気、窒素ブローを３回繰り返した。室温まで昇温後、重合開始剤としてＡＩＢＮ（アゾビスイソブチロニトリル）を１．２ｇ加え、６０℃まで昇温後、１５時間反応させた。この反応溶液をイソプロピルアルコール１Ｌ溶液中に沈殿させ、得られた白色固体を濾過後、６０℃で減圧乾燥し、白色重合体を得た。
得られた重合体を^１３Ｃ，^１Ｈ−ＮＭＲ、及び、ＧＰＣ測定したところ、以下の分析結果となった。
共重合組成比（モル比）
メタクリル酸 ９−フルオレニル：モノマー３：メタクリル酸３−オキソ−２，７−ジオキサトリシクロ［４．２．１．０^４，８］ノナン−９−イル：ＰＡＧモノマー３＝０．３０：０．３０：０．３０：０．１０
重量平均分子量（Ｍｗ）＝７，１００
分子量分布（Ｍｗ／Ｍｎ）＝１．７１
この高分子化合物を（ポリマー１０）とする。

[Synthesis Example 10]
In a 2 L flask, 7.1 g of 9-fluorenyl methacrylate, 6.8 g of monomer 3, 3-oxo-2,7-dioxatricyclomethacrylate [4.2.1.0 ^4,8 ] nonane-9- 6.8 g of yl, 5.6 g of PAG monomer 3 and 40 g of tetrahydrofuran as a solvent were added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Methacrylic acid 9-fluorenyl: Monomer 3: Methacrylic acid 3-oxo-2,7-dioxatricyclo [4.2.1.0 ^4,8 ] nonan-9-yl: PAG monomer 3 = 0.30: 0 .30: 0.30: 0.10
Weight average molecular weight (Mw) = 7,100
Molecular weight distribution (Mw / Mn) = 1.71
This polymer compound is referred to as (Polymer 10).

［合成例１１］
２Ｌのフラスコにメタクリル酸 アセナフテニル７．１ｇ、モノマー３を６．８ｇ、メタクリル酸３−オキソ−２，７−ジオキサトリシクロ［４．２．１．０^４，８］ノナン−９−イル６．８ｇ、ＰＡＧモノマー３を５．６ｇ、溶媒としてテトラヒドロフランを４０ｇ添加した。この反応容器を窒素雰囲気下、−７０℃まで冷却し、減圧脱気、窒素ブローを３回繰り返した。室温まで昇温後、重合開始剤としてＡＩＢＮ（アゾビスイソブチロニトリル）を１．２ｇ加え、６０℃まで昇温後、１５時間反応させた。この反応溶液をイソプロピルアルコール１Ｌ溶液中に沈殿させ、得られた白色固体を濾過後、６０℃で減圧乾燥し、白色重合体を得た。
得られた重合体を^１３Ｃ，^１Ｈ−ＮＭＲ、及び、ＧＰＣ測定したところ、以下の分析結果となった。
共重合組成比（モル比）
メタクリル酸 アセナフテニル：モノマー３：メタクリル酸３−オキソ−２，７−ジオキサトリシクロ［４．２．１．０^４，８］ノナン−９−イル：ＰＡＧモノマー３＝０．３０：０．３０：０．３０：０．１０
重量平均分子量（Ｍｗ）＝７，７００
分子量分布（Ｍｗ／Ｍｎ）＝１．７７
この高分子化合物を（ポリマー１１）とする。

[Synthesis Example 11]
In a 2 L flask, 7.1 g of acenaphthenyl methacrylate, 6.8 g of monomer 3, 3-oxo-2,7-dioxatricyclomethacrylate [4.2.1.0 ^4,8 ] nonan-9-yl 6 .8 g, 5.6 g of PAG monomer 3 and 40 g of tetrahydrofuran as a solvent were added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Acenaphthenyl methacrylate: monomer 3: 3-oxo-2,7-dioxatricyclomethacrylate [4.2.1.0 ^4,8 ] nonan-9-yl: PAG monomer 3 = 0.30: 0.30 : 0.30: 0.10
Weight average molecular weight (Mw) = 7,700
Molecular weight distribution (Mw / Mn) = 1.77
This polymer compound is referred to as (Polymer 11).

[Synthesis Example 12]
In a 2-L flask, methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl 5.5g, monomer 1 18.1g, tetrahydrofuran 40g as a solvent was added. The reaction vessel was cooled to −70 ° C. in a nitrogen atmosphere, and vacuum degassing and nitrogen blowing were repeated three times. After raising the temperature to room temperature, 1.2 g of AIBN (azobisisobutyronitrile) was added as a polymerization initiator, and the temperature was raised to 60 ° C. and reacted for 15 hours. This reaction solution was precipitated in 1 L of isopropyl alcohol, and the resulting white solid was filtered and dried under reduced pressure at 60 ° C. to obtain a white polymer.
When the obtained polymer was measured by ¹³ C, ¹ H-NMR and GPC, the following analysis results were obtained.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: monomer 1 = 0.20: 0.80
Weight average molecular weight (Mw) = 9,100
Molecular weight distribution (Mw / Mn) = 1.88
This polymer compound is referred to as (Polymer 12).

［比較合成例２］
上記合成例と同様の方法で下記ポリマーを合成した。
共重合組成比（モル比）
メタクリル酸−３−エチル−３−エキソテトラシクロ［４．４．０．１^２，５．１^７，１０］ドデカニル：ヒドロキシスチレン：インデン＝０．１３：０．７７：０．１０
重量平均分子量（Ｍｗ）＝７，５００
分子量分布（Ｍｗ／Ｍｎ）＝１．６９
この高分子化合物を（比較ポリマー２）とする。 [Comparative Synthesis Example 1]
The following polymers were synthesized by the same method as in the above synthesis example.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: 3-hydroxy-1-adamantyl methacrylate: 3-oxo-2,7-dioxatricyclomethacrylate [4.2.1.0 ^4,8 ] nonan-9-yl = 0 .30: 0.20: 0.50
Weight average molecular weight (Mw) = 8,200
Molecular weight distribution (Mw / Mn) = 1.72
This polymer compound is referred to as (Comparative Polymer 1).

[Comparative Synthesis Example 2]
The following polymers were synthesized by the same method as in the above synthesis example.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: hydroxystyrene: indene = 0.13: 0.77: 0.10
Weight average molecular weight (Mw) = 7,500
Molecular weight distribution (Mw / Mn) = 1.69
This polymer compound is referred to as (Comparative Polymer 2).

[Comparative Synthesis Example 3]
The following polymers were synthesized by the same method as in the above synthesis example.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: 4-hydroxystyrene: methacrylic acid 3-oxo-2,7-dioxatricyclo [4.2.1.0 ^4,8 ] nonan-9-yl = 0.30: 0. 40: 0.30
Weight average molecular weight (Mw) = 8,300
Molecular weight distribution (Mw / Mn) = 1.82
This polymer compound is referred to as (Comparative Polymer 3).

[Comparative Synthesis Example 4]
The following polymers were synthesized by the same method as in the above synthesis example.
Copolymer composition ratio (molar ratio)
Methacrylic acid-3-ethyl-3-exotetracyclo [4.4.0.1 ^2,5 . 1 ^7,10 ] dodecanyl: 3-oxo-2,7-dioxatricyclo [4.2.1.0 ^4,8 ] nonan-9-yl methacrylate: 1-hydroxynaphthalen-5-yl methacrylate: 0.30: 0.40: 0.30
Weight average molecular weight (Mw) = 8,700
Molecular weight distribution (Mw / Mn) = 1.89
This polymer compound is referred to as (Comparative Polymer 4).

[Comparative Synthesis Example 5]
The following polymers were synthesized by the same method as in the above synthesis example.
Copolymer composition ratio (molar ratio)
9-fluorenyl methacrylate: 1-hydroxynaphthalen-4-yl methacrylate: 3-oxo-2,7-dioxatricyclo [4.2.1.0 ^4,8 ] nonane-9-yl methacrylate: PAG Monomer 3 = 0.30: 0.30: 0.30: 0.10
Weight average molecular weight (Mw) = 7,200
Molecular weight distribution (Mw / Mn) = 1.72
This polymer compound is referred to as (Comparative Polymer 5).

[Examples 1 to 3, Comparative Example 1]
Exposure evaluation by ArF excimer laser The resist material shown in Table 1 was spin-coated on a substrate in which ARC-29A (Nissan Chemical Industry Co., Ltd.) was formed on a silicon wafer with a film thickness of 80 nm, and a hot plate was formed. The resist film was baked at 100 ° C. for 60 seconds to make the thickness of the resist film 80 nm. Using an ArF excimer laser scanner (Nikon Corporation, NSR-S610C, NA1.30, σ0.98 / 0.78, 35 ° dipole illumination, 6% halftone phase shift mask), 40 nm with azimuthally polarized illumination. A pattern with a line 80 nm pitch was exposed, baked (PEB) for 60 seconds at the temperature described in Table 1 after exposure, developed for 30 seconds with an aqueous solution of 2.38 mass% tetramethylammonium hydroxide, and the dimensions were A 40 nm line and space pattern was obtained.
The roughness (LWR) of the 40 nm line was measured with a length measurement SEM (S-9380 manufactured by Hitachi, Ltd.). The results are shown in Table 1.

有機溶剤：ＰＧＭＥＡ（プロピレングリコールモノメチルエーテルアセテート）
ＣｙＨ（シクロヘキサノン） In addition, each composition in Table 1 is as follows.
Polymers 1-3: Polymer compounds obtained in Synthesis Examples 1-3 Comparative polymer 1: Polymer compound obtained in Comparative Synthesis Example 1 Acid generator: PAG (photoacid generator) 4 (the following structural formula reference)
Basic compound: Quencher 1 (see the structural formula below)
Resist surface water repellent: water repellent polymer 1 (see structural formula below)

Organic solvent: PGMEA (propylene glycol monomethyl ether acetate)
CyH (cyclohexanone)

[Examples 4 to 20, Comparative Examples 2 to 6]
Electron beam drawing evaluation In the drawing evaluation, the composition shown in Table 2 is used in a solvent in which 100 ppm of the surfactant FC-4430 manufactured by Sumitomo 3M Limited is dissolved as a surfactant using the polymer compound synthesized above. The solution dissolved in (1) was filtered through a 0.2 μm size filter to prepare a positive resist material.
The obtained positive resist material was spin-coated on a 6-inch diameter Si substrate using a clean track Mark 5 (manufactured by Tokyo Electron Ltd.), pre-baked on a hot plate at 110 ° C. for 60 seconds, and 100 nm in thickness. A resist film was prepared. To this, drawing in a vacuum chamber was performed at an HV voltage of 50 keV using HL-800D manufactured by Hitachi, Ltd.
Immediately after the drawing, a post-exposure bake (PEB) was performed for 60 seconds at a temperature shown in the table on a hot plate using a clean track Mark 5 (manufactured by Tokyo Electron Co., Ltd.), and 30% with a 2.38 mass% TMAH aqueous solution. Paddle development was performed for 2 seconds to obtain a positive pattern.
The obtained resist pattern was evaluated as follows.
The minimum dimension at the exposure amount for resolving 100 nm line and space at 1: 1 was taken as the resolving power, and the roughness (LWR) of 100 nm LS was measured by SEM.
Table 2 shows the resist composition and the results of sensitivity, resolution, and roughness (LWR) in EB exposure.

Each composition in Table 2 is as follows.
Polymers 1 to 12: Polymer compounds obtained in Synthesis Examples 1 to 12 Comparative polymers 1 to 5: Polymer compounds obtained in Comparative Synthesis Examples 1 to 5 Organic solvent: PGMEA (propylene glycol monomethyl ether acetate)
CyH (cyclohexanone)
EL (ethyl lactate)
Acid generator: PAG5, PAG6 (see structural formula below)
Basic compounds: Amine1, Amine2, Amine3 (see the structural formula below)
Dissolution control agent: DRI1, DRI2 (see the following structural formula)

As shown in Tables 1 and 2, in Examples 1 to 20, both sensitivity and resolving power were high, and it was confirmed that Widoughness (LWR) was also good.
On the other hand, in Comparative Examples 1 to 6, although the sensitivity could be maintained, the resolution was poor and the Width Roughness (LWR) was also deteriorated.
From the above results, it was found that the positive resist material of the present invention satisfies sufficient resolution, sensitivity, and roughness (LWR).

  That is, as the positive resist composition of the present invention, as a polymer compound constituting the resist material, a repeating unit having an adhesive group in which naphthol groups are linked by an amide bond, and a repeating unit having an acid labile group In particular, since the effect of suppressing acid diffusion is high, the resist film has high dissolution contrast, high resolution, high sensitivity, and good post-exposure roughness (LWR). Therefore, it can be said that it can be used very effectively as a resist pattern mask pattern forming material for VLSI.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

Claims (8)

It contains a polymer compound containing at least a repeating unit a having a group represented by the following general formula (1) and a repeating unit b having a carboxyl group in which a hydrogen atom is substituted with an acid labile group. Positive resist material.

(In the formula, m is an integer of 1 to 3.) The positive resist material according to claim 1, wherein the repeating unit a is represented by the following general formula (2).

(In the formula, m is the same as described above. R ¹ is a hydrogen atom or a methyl group. X is a single bond, an ester group, a linking group having 1 to 12 carbon atoms having a lactone ring, a phenylene group, or a naphthylene group. A is 0 <a <1.0.) 3. The positive resist material according to claim 1, wherein the repeating unit a and the repeating unit b are those represented by the following general formula (3).

(In the formula, R ¹ , X and m are the same as described above. R ² represents a hydrogen atom or a methyl group, R ³ represents an acid labile group. Y represents a carbon number having a single bond, an ester group or a lactone ring. Any one of 1 to 12 linking groups, a phenylene group, and a naphthylene group, a is 0 <a <1.0, b is 0 <b <1.0, and a + b is 0.1 ≦ a + b ≦ 1.0. Range.)   In addition to the repeating unit a and the repeating unit b, a polymer compound containing a repeating unit c having an adhesive group selected from a hydroxyl group, a lactone ring, an ether group, an ester group, a carbonyl group, and a cyano group ( Wherein 0 <a <1.0, 0 <b <1.0, 0 <c ≦ 0.9, and 0.2 ≦ a + b + c ≦ 1.0.) The positive resist material according to any one of claims 1 to 3.   The positive resist material according to any one of claims 1 to 4, wherein the positive resist material is a chemically amplified positive resist material.   6. The positive resist material contains one or more of an organic solvent, a dissolution controller, an acid generator, a basic compound, and a surfactant. The positive resist material according to any one of the above.   At least a step of applying the positive resist material according to any one of claims 1 to 6 on a substrate, a step of exposing to high energy rays after heat treatment, and developing using a developer. A pattern forming method comprising the steps of:   8. The pattern according to claim 7, wherein, in the step of exposing with the high energy beam, any one of an electron beam, a soft X-ray having a wavelength of 3 to 15 nm, and an ultraviolet ray having a wavelength of 180 to 250 nm is used as a light source. Forming method.