JP2011128065A - Infrared array sensor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an infrared sensor array device capable of reducing heat noise and performing highly-accurate and high-reliability infrared detection. <P>SOLUTION: The infrared sensor array device includes an infrared sensor element 30, wherein cells are arrayed two-dimensionally at prescribed intervals on a substrate 10 for receiving an infrared signal in each cell; a signal processing circuit element 40 for processing output from the infrared sensor element 30, and outputting the result as a two-dimensional plane temperature; a metal case 20, provided at a prescribed distance from the infrared sensor element 30 and having an incident window, including an optical system, such as, a lens 22 for imaging an external infrared signal on the infrared sensor element 30, for storing the infrared sensor element 30 and the signal processing circuit element 40; and a sensor cover 50, having a translucent part 51 for guiding an infrared signal entering via the optical system into the infrared sensor element 30, between the infrared sensor element 30, and the case 20 and the signal processing circuit element 40. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an infrared array sensor device, and more particularly to a thermal noise reduction structure thereof.

  Conventionally, infrared sensors can detect temperature without contact. Therefore, an automatic lighting system that detects the presence of a person, controls the lighting according to the movement of the person, and a warehouse for a microwave oven. It is widely used for detecting the internal temperature and detecting the temperature distribution of the object to be cooked. An infrared sensor is a device that outputs a voltage corresponding to the amount of infrared light received by a built-in sensor chip.

In an infrared array sensor device that arranges such infrared sensor elements in an array and measures the temperature of a detected object at a plurality of points, an object in the form of 8 elements × 1 row is usually scanned to the left and right. The temperature of the detected object is calculated and measured in a two-dimensional plane.
However, with this method, when trying to warm food with a microwave oven, problems such as the finished temperature becoming too high occur.

  For example, lighting devices for lighting fixtures have been proposed in which a tracking system is used to detect the movement of a person and perform partial illumination. In such a case, in order to obtain a two-dimensional plane temperature, Is an operation of pasting data for each column, and it is difficult to recognize a moving object such as a human body from the relationship between the calculation time and the moving speed.

  Under such circumstances, it is necessary to perform temperature detection on a two-dimensional plane with high accuracy in both temperature measurement of a microwave oven and detection of a moving object.

  By the way, although the detection viewing angle of this infrared sensor is determined by the specification, in reality, unnecessary infrared light from outside the viewing angle also enters the device, and the infrared light enters the sensor chip from within the reflection inside the package. In such a case, there is a problem that thermal noise is generated and the detection accuracy is deteriorated.

  As an example of such an infrared sensor, for example, a large number of resistors (single elements) are arranged in a matrix and a change in resistance value accompanying a rise in temperature when infrared rays are projected is taken out as a signal. Some of them generate and output an image signal based on the above. In such an infrared sensor, it is necessary to supply a predetermined bias current in order to extract a resistance change as a signal, and the temperature of the infrared sensor may increase due to Joule heat due to the bias current. For this reason, a new signal is generated from the infrared sensor due to the temperature rise due to the Joule heat, and this signal is output as noise in the infrared sensor.

  In order to prevent noise due to such a bias current, as shown in FIG. 9, even when a ring-shaped inner 250 is fixed in the case 220 and disturbance noise enters the case 220. A structure has been proposed in which disturbance noise does not reach the sensor chip 230 mounted on the circuit board 210 but is radiated and only the infrared energy collected by the lens is guided to the sensor chip 230 (patent). Reference 1).

  In Patent Document 2, as shown in FIG. 10, a circuit board 110, an electronic cooling device 140, and an infrared detection element 130 are sequentially mounted on a package 120, and a shield cylinder 150 is provided so as to cover the infrared detection element 130. The shield cylinder 150 is arranged to be cooled by the electronic cooling device 140. The infrared detecting element 130 is cooled by the electronic cooling device 140 to prevent the temperature of the infrared detecting element 130 from being increased due to the bias current, and the temperature of the infrared detecting element 130 due to radiant heat through the shield cylinder 150 is cooled by cooling the shield cylinder 150. Prevent rise and reduce noise. Further, by forming the incident window 150a that opens in the shield tube 150 with an appropriate opening diameter, incident infrared rays are not leaked outside each single element of the infrared detection element 130, and noise generation is prevented. To do.

  Furthermore, as shown in FIG. 11, the thermopile element 330 is covered with an inner cap 350 that is thermally connected to the stem 310, instead of shielding the thermopile element (infrared sensor element) 330. An infrared sensor array device has also been proposed that improves the temperature followability of the cold junction of the thermopile element 330 against temperature fluctuations (Patent Document 3). In this configuration, the thermopile element and the thermistor are covered with the inner cap so that the internal atmosphere is thermally connected to the stem so that secondary radiation from the case 320 and the inner cap 350 is not irradiated to the thermopile element 330. Yes.

  By the way, in recent years, an infrared sensor element mounting structure incorporating an IC chip such as an ASIC (Application Specific Integrated Circuit) for signal amplification processing has been proposed. According to this configuration, it is possible to reduce wiring routing, and theoretically, it is possible to further improve the detection accuracy. However, when the IC chip is built in the housing in this way, it is necessary to use a metal housing as a measure against electric noise. In this case, in particular, since the light reflectance of the metal is high, internal reflection is likely to occur, and thermal noise is more likely to occur. In addition, the influence of thermal noise on the IC chip for signal amplification processing sometimes becomes a magnitude that cannot be ignored.

JP 2007-101513 A Japanese Patent Laid-Open No. 08-101062 JP 2003-344156 A

In the infrared sensor array device incorporating the signal processing circuit element as described above, it is necessary to use a metal housing as a measure against electric noise. In this case, in particular, internal reflection tends to occur due to the high light reflectance of the metal. There was a problem. Further, there is a problem of thermal noise due to heat generation of the signal processing circuit element, and the structure is more likely to generate thermal noise.
The present invention has been made in view of the above circumstances, and provides an infrared sensor array device capable of detecting two-dimensional plane temperature by reducing thermal noise and performing highly accurate and reliable infrared detection. With the goal.

  Therefore, in the infrared sensor array device of the present invention, cells are two-dimensionally arranged at predetermined intervals on a substrate, an infrared sensor element that receives an infrared signal for each cell, an output of the infrared sensor element, and a two-dimensional plane. A signal processing circuit element that outputs as a temperature, and an incident window that is provided at a predetermined distance from the infrared sensor element and includes an optical system for imaging an external infrared signal on the infrared sensor element; The infrared signal incident through the optical system between the infrared sensor element and the metal case housing the signal processing circuit element, the infrared sensor element, and the case and the signal processing circuit element. And a sensor cover having a translucent portion leading to the infrared sensor element.

Further, the infrared sensor array device of the present invention, the cells are arranged in a line at predetermined intervals on the substrate, the infrared sensor element that receives the infrared signal for each cell, the scanning unit that scans the infrared sensor element, A signal processing circuit element that processes the output of the infrared sensor element and outputs it as a two-dimensional plane temperature; and a predetermined distance from the infrared sensor element, and forms an external infrared signal on the infrared sensor element A metal case that accommodates the infrared sensor element and the signal processing circuit element, and between the infrared sensor element and the case and the signal processing circuit element. And a sensor cover having a translucent portion for guiding the infrared signal incident through the optical system to the infrared sensor element.
According to this configuration, not only the infrared sensor element is covered with the sensor cover, but also the sensor cover is provided between the signal processing circuit element and the infrared sensor element. The thermal noise due to the mutual radiation can be prevented, the infrared signal that becomes the noise is removed, and the infrared signal of only the object can be detected, so that the measurement accuracy is improved.

Therefore, the present invention is characterized in that, in the infrared sensor array device, the infrared sensor element is mounted on the substrate by surface mounting.
According to this configuration, since the thermal change of the infrared sensor element itself also has a great influence on the signal processing circuit element, thermal noise due to radiation from the infrared sensor element to the signal processing circuit element can be prevented.

According to the present invention, in the infrared sensor array device, the sensor cover is in contact with the substrate so as to surround the periphery of the infrared sensor element, and the infrared sensor element and the optical device are connected to the substrate. The light-transmitting part has a top surface that forms an opening.
According to this configuration, since the sensor cover has the side wall portion that is in contact with the substrate so as to surround the infrared sensor element, the sensor cover is surrounded as much as possible around the infrared sensor element. By disposing in this way, it is possible to remove noise not only from the top surface but also from the side surface direction.

In the infrared sensor array device according to the present invention, the sensor cover is made of a metal material.
According to this configuration, noise incident on the sensor can be reflected by the sensor cover made of a metal material, and noise can be prevented from entering the sensor.

In the infrared sensor array device according to the present invention, the sensor cover is bonded to the substrate with a heat conductive material.
According to this configuration, the sensor cover can easily exchange heat with the substrate, and heat can be prevented from being partially trapped around the sensor.

According to the present invention, in the infrared sensor array device, the sensor cover is bonded to the substrate with a conductive material.
According to this configuration, the sensor cover can be electrically connected to the shield surface, and electromagnetic shielding can be provided.

According to the present invention, in the infrared sensor array device, a band-shaped metal ring is placed in a region surrounding the infrared sensor element mounting region and the signal processing circuit element mounting region of the substrate, and the metal ring is the substrate of the case The seal portion is configured by abutting against the flange portion provided at the side end portion.
According to this configuration, it is possible to improve the sealing performance and the electrical shielding performance.

In the infrared sensor array device according to the present invention, an inner case made of a resin molded body is provided inside the case.
According to this configuration, it is possible to prevent the noise from entering the sensor by absorbing the thermal noise entering the case with the resin internal case.

In the infrared sensor array device according to the present invention, a black plating layer is formed on the inner wall of the case.
According to this configuration, the thermal noise entering the case can be absorbed by the black plating layer, and the noise can be prevented from entering the sensor.

According to the present invention, in the infrared sensor array device, the infrared sensor element is connected to the substrate via a wire, and the sensor cover has a peripheral edge of the infrared sensor element except for a lead-out region of the wire. It is formed so as to cover.
According to this structure, the avoidance of the thermal noise to an infrared sensor element can be improved more.

In the infrared sensor array device according to the present invention, the wire of the infrared sensor element is led out from two opposite sides of the infrared sensor element, and the sensor cover is two opposite sides where the wire is not disposed. It is bonded to the substrate.
According to this configuration, the sensor cover fixing side and the wire bond side can be separated, and the size of the infrared sensor array device can be reduced.

According to the present invention, in the infrared sensor array device, the infrared sensor element is connected to the substrate via a bump.
According to this configuration, since the infrared sensor element can be mounted without leading the wire, the periphery of the infrared sensor element can be completely surrounded by the sensor cover.

  In the infrared sensor array device according to the present invention, the sensor cover is in contact with the substrate all around the infrared sensor element.

  In the infrared sensor array device according to the present invention, the connection between the infrared sensor element and the signal processing circuit element is realized through an internal wiring formed on the substrate.

  According to the present invention, in the infrared sensor array device, a heat blocking portion is formed on the substrate between the infrared sensor element and the sensor cover.

  According to the present invention, in the infrared sensor array device, the heat blocking part is a ring-shaped groove part.

  According to the present invention, in the infrared sensor array device, the substrate includes a thin region in a region where the signal processing circuit element is mounted.

  According to the present invention, in the infrared sensor array device, the substrate is a ceramic substrate, and a wiring conductor layer is formed in a region where the sensor cover abuts.

  According to the infrared sensor array device of the present invention, the sensor cover prevents the infrared noise from the outside of the viewing angle that is reflected by the case and reduces the influence of the infrared noise due to the generation of radiant heat due to the heating of the case. It is possible to detect a two-dimensional plane temperature with high reliability.

It is a figure which shows the infrared sensor array apparatus of Embodiment 1 of this invention, (a) is sectional drawing, (b) is a top view which shows the state which removed the case and the cover, (c) is sectional side view Exploded perspective view showing the infrared sensor array device The figure which shows the infrared sensor array apparatus of Embodiment 2 of this invention, (a) is sectional drawing, (b) is principal part expanded sectional drawing. The figure which shows the infrared sensor array apparatus of Embodiment 3 of this invention. It is a figure which shows the infrared sensor array apparatus of Embodiment 4 of this invention, (a) is sectional drawing, (b) is a top view which shows the state which removed the case and the cover, (c) is sectional side view Exploded perspective view showing the infrared sensor array device It is a figure which shows the infrared sensor array apparatus of the modification of Embodiment 4 of this invention, (a) is sectional drawing, (b) is a top view which shows the state which removed the case and the cover, (c) is side sectional drawing Figure The figure which shows the heat cooking apparatus using the infrared sensor array apparatus of Embodiment 5 of this invention. The figure which shows the infrared sensor module of a prior art example The figure which shows the infrared sensor module of a prior art example The figure which shows the infrared sensor module of a prior art example

  Hereinafter, an infrared sensor array device according to an embodiment of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
1A and 1B are diagrams showing an infrared sensor array device according to Embodiment 1 of the present invention, in which FIG. 1A is a cross-sectional view, FIG. 1B is a top view showing a state where a case and a cover are removed, and FIG. FIG. FIG. 2 is an exploded perspective view showing the infrared sensor array device.
The infrared sensor array device according to the first embodiment of the present invention is arranged on a substrate 10 and receives an infrared sensor element 30 that receives an infrared signal, a signal processing circuit element 40 that processes an output of the infrared sensor element 30, and the The infrared sensor element 30 includes an incident window provided at a predetermined distance from the infrared sensor element 30 and having a lens 22 as an optical system for imaging an external infrared signal on the infrared sensor element 30. And the infrared signal incident through the optical system between the metal case 20 housing the signal processing circuit element 40, the infrared sensor element 30, and the case and the signal processing circuit element 40. And a sensor cover 50 made of Kovar having a translucent portion 51 led to the infrared sensor element 30. The substrate 10 has a wiring pattern (not shown) on the surface.

  The infrared sensor element used here is a thermopile type sensor formed by two-dimensionally arranging 8 rows × 8 columns of cells and mounted on the substrate 10 by surface mounting. And it is electrically connected to the substrate 10 by wire bonding. Reference numeral 32 denotes a bonding wire. Although not shown here, a thermopile type sensor is a thermocouple formed by polysilicon micromachining, which generates a temperature difference between these contacts due to infrared heat, and generates a potential difference between the contacts due to this temperature difference. It is configured to detect infrared rays as a voltage using the electromotive force effect (Seebeck effect). This thermopile infrared sensor converts the received infrared light into heat with an infrared absorbing film, adds this heat to the thermocouples connected in series, and generates a temperature change at the hot junction using a thermocouple. Output as. In this thermopile, as a material of an infrared absorption film that absorbs infrared rays, a gold black film, a carbon film, or the like having a high infrared absorption rate is used.

  The sensor cover 50 is bonded to the substrate 10 with a heat conductive material such as a silver paste 52. The silver paste makes it easy for the sensor cover 50 to exchange heat with the substrate 10. , It is possible to prevent heat from being partially trapped around the sensor.

  A band-shaped metal ring 13 is placed in a region surrounding the infrared sensor element mounting region Rt and the signal processing circuit element mounting region Rs of the substrate 10, and the metal ring 13 is provided on the substrate side end of the case 20. The seal portion 24 is configured in contact with the portion 23.

  Here, 11 is a wiring conductor layer formed on the substrate surface, and is electrically connected to the infrared sensor element 30 via the bonding wire 32. The electrical connection between the infrared sensor element 30 and the signal processing circuit element 40 is also made through a bonding wire 32.

  The sensor cover 50 includes a side wall 50S that is brought into contact with the substrate 10 so as to surround the infrared sensor element 30, and the side wall 50S between the infrared sensor element 30 and the lens 22 as the optical system. The translucent part 51 is formed and has a top surface 50U constituting an opening.

As a result of the temperature measurement using the infrared sensor array device formed as described above, it was possible to obtain a highly accurate temperature distribution without thermal noise.
According to this configuration, not only the infrared sensor element 30 is covered with the sensor cover 50 but also the sensor cover 50 is provided between the signal processing circuit element 40 and the infrared sensor element 30. Thermal noise due to radiation from the infrared sensor element 30 to the infrared sensor element 30 and radiation from the infrared sensor element 30 to the signal processing circuit element 40 can be prevented, and radiation from which the infrared signal IR0 from the non-target object enters through the metal case. The infrared signal due to IR2 and the radiation line IR3 due to reflection from the metal case is removed, and the infrared signal IR1 of only the object can be detected, so that the measurement accuracy is improved.
In addition, since the side wall portion 50S is provided, the sensor cover 50 is disposed so as to surround the infrared sensor element 30 as much as possible, so that it is reliable against noise not only from the top surface but also from the side surface. Removal is possible.

  Here, the bonding wire 32 of the infrared sensor element 30 is led out from two opposite sides of the infrared sensor element, and the sensor cover 50 is bonded to the substrate at two opposite sides where the bonding wire 32 is not disposed. . For this reason, the side on the sensor cover fixing side and the side on the wire bond side can be separated, and the size of the infrared sensor array device can be reduced.

  In the above embodiment, the sensor cover is made of Kovar, but other metals such as copper and stainless steel may be used. Further, by connecting the sensor cover to the substrate with a conductive material, the sensor cover can be electrically connected to the shield surface, and electromagnetic shielding properties can be provided.

  Further, the band-shaped metal ring 13 formed in the region surrounding the infrared sensor element mounting region Rt and the signal processing circuit element mounting region Rs of the substrate 10 abuts on the flange portion 23 provided at the substrate side end portion of the case, and the seal portion 24 is configured, it is possible to improve the hermetic sealing property and the electrical shielding property. It also has a role as a heat shield. Moreover, you may comprise a ring-shaped groove part as a heat interruption | blocking part.

  Furthermore, using a ceramic substrate with high heat dissipation, such as aluminum nitride, as the substrate and forming the wiring conductor layer in a region where the sensor cover abuts can further improve heat dissipation.

In the first embodiment, the infrared sensor array apparatus using the two-dimensionally arranged cells has been described. However, the cells may be scanned using the one-dimensionally arranged cells.
(Embodiment 2)
In the above embodiment, the infrared sensor element 30 and the signal processing circuit element 40 are electrically connected via the bonding wires 32. However, as shown in FIG. 3, a multilayer wiring board 10S is used as the board. The inner layer can be electrically connected through the through hole h and the inner layer 10c. The multilayer wiring board 10S is composed of a laminate of an insulating layer 10i such as ceramic and a conductor layer as the inner layer 10c. The multilayer wiring board 10S can easily form desired wiring by firing the green sheet laminate. Connection between the signal processing circuit element 40 and the infrared sensor element 30 is obtained via the bonding wire 32, the through hole h, and the inner layer 10c. 3A is a cross-sectional view, and FIG. 3B is an enlarged cross-sectional view of the main part of FIG.
Thereby, the side wall part 50S of the sensor cover 50 can be disposed so as to contact the multilayer wiring board 10S. Therefore, it is possible to surely remove the noise from the side surface direction by reliably enclosing the sensor cover around the infrared sensor element.

  Here, furthermore, while using a ceramic substrate with high heat dissipation, such as aluminum nitride, as the substrate, the wiring conductor layer 21 is formed in the region where the sensor cover 50 abuts, thereby further improving heat dissipation. it can.

(Embodiment 3)
Next, a third embodiment of the present invention will be described.
In the first embodiment, the infrared sensor element 30 is connected to the substrate 10 by wire bonding. However, in this embodiment, the infrared sensor element 30 is directly connected to the substrate via the bumps 31 as shown in FIG. It is characterized by this. As in the second embodiment, the infrared sensor element 30 and the signal processing circuit element 40 are connected in the multilayer wiring board 10S through a through hole. Therefore, the sensor cover 50 is disposed so as to reliably surround the infrared sensor element 30 at a position very close to the infrared sensor element 30. The infrared sensor element 30 and the signal processing circuit element 40 are connected by the wiring conductor layer 11 formed on the substrate 10. Since other parts are formed in the same manner as in the first and second embodiments, description thereof is omitted here.
Therefore, also in this case, since the infrared sensor element 30 is more efficiently heat shielded and electrically shielded, generation of thermal noise due to generation of radiant heat can be suppressed. Further, by arranging the sensor cover in the vicinity, the size can be further reduced.
As in the second embodiment, in this case, as in the second embodiment, if the multilayer wiring board 10S is used as the substrate, the infrared sensor element is formed through the through hole h in the inner layer (not shown). 30 and the signal processing circuit element 40 can be electrically connected, and the sensor cover can be more closely attached to the substrate.

(Embodiment 4)
Next, a fourth embodiment of the present invention will be described.
5A and 5B are diagrams showing an infrared sensor array device according to Embodiment 4 of the present invention, in which FIG. 5A is a cross-sectional view, FIG. 5B is a top view showing a state where a case and a cover are removed, and FIG. FIG. FIG. 6 is an exploded perspective view showing the infrared sensor array device.
In addition to the configuration of the infrared sensor array device of the first embodiment, the infrared sensor array device of the fourth embodiment of the present invention is characterized in that an interior case 60 made of an insulating resin is formed inside the case 20. Is. Others are formed in the same manner as the infrared sensor array device shown in the first embodiment. Here, the same parts are denoted by the same reference numerals, and description thereof is omitted.
With this configuration, in addition to the effects of the first embodiment, it is possible to achieve further suppression of thermal noise.

In addition, the same effect can be acquired by arrange | positioning an antireflection member inside, without being limited to an interior case.
For example, the antireflection member may be a black nickel plating layer 26 provided inside the metal case 20, as shown in FIGS. 7 (a) to 7 (c). Here, the same parts as those in the first embodiment are denoted by the same reference numerals.

(Embodiment 5)
Next, the heating cooking apparatus provided with the temperature measuring apparatus using the infrared sensor array apparatus obtained as mentioned above is demonstrated.
FIG. 8 is an explanatory view showing the cooking device.
The temperature distribution in the cooking device 200 is measured by the infrared sensor array device 100 disposed downward in the cooking device 200 and the object 300 such as meat placed on the cooking tray 201 is measured. It is configured to measure temperature and control heating. Reference numeral 202 denotes a display panel.
Here, thermopile elements arranged in a 4 × 4 matrix are used, and an output signal obtained by signal processing by a signal processing circuit element is output to the display panel 202. The signal processing of the signal processing circuit element is not described in detail here, but usual signal processing is performed.

DESCRIPTION OF SYMBOLS 10 Board | substrate 10S Multilayer wiring board 10i Insulating layer 10c Inner layer 11 Wiring conductor layer 13 Metal ring 20 Case 22 Lens 23 Grow part 24 Seal part 26 Black nickel plating layer 30 Infrared sensor element 31 Bump 32 Bonding wire 40 Signal processing circuit element 50 Sensor Cover 50U Top surface 50S Side wall 51 Translucent part 60 Interior case IR0 Infrared signal from non-object IR1 Infrared signal from object IR2 Radiation from non-object IR3 Radiation from non-object

Claims (19)

Infrared sensor elements in which cells are two-dimensionally arranged on the substrate at predetermined intervals and receive infrared signals for each cell;
A signal processing circuit element for processing the output of the infrared sensor element and outputting it as a two-dimensional plane temperature;
The infrared sensor element and the signal processing circuit element have an incident window provided at a predetermined distance from the infrared sensor element and provided with an optical system for imaging an external infrared signal on the infrared sensor element. And an infrared sensor array device comprising a metal case for housing the substrate,
Between the infrared sensor element, the optical system, and the signal processing circuit element, a sensor having a translucent portion for guiding the infrared signal incident through the optical system to the infrared sensor element and having an infrared shielding function An infrared sensor array device having a cover. An infrared sensor element in which cells are arranged in a line at a predetermined interval on a substrate and receives an infrared signal for each cell;
A scanning section for scanning the infrared sensor element;
A signal processing circuit element for processing the output of the infrared sensor element and outputting it as a two-dimensional plane temperature;
The infrared sensor element and the signal processing circuit element have an incident window provided at a predetermined distance from the infrared sensor element and provided with an optical system for imaging an external infrared signal on the infrared sensor element. And an infrared sensor array device comprising a metal case for housing the substrate,
Between the infrared sensor element, the optical system, and the signal processing circuit element, a sensor having a translucent portion for guiding the infrared signal incident through the optical system to the infrared sensor element and having an infrared shielding function An infrared sensor array device having a cover. The infrared sensor array device according to claim 1 or 2,
The sensor cover is
A side wall that is brought into contact with the substrate so as to surround the infrared sensor element;
An infrared sensor array device, which is formed between the infrared sensor element and the optical system from the side wall, and in which the translucent part constitutes an opening. The infrared sensor array device according to any one of claims 1 to 3,
The sensor cover is an infrared sensor array device made of a metal material. The infrared sensor array device according to any one of claims 1 to 4,
The sensor cover is an infrared sensor array device bonded to the substrate with a heat conductive material. The infrared sensor array device according to any one of claims 1 to 5,
The sensor cover is an infrared sensor array device bonded to the substrate with a conductive material. The infrared sensor array device according to any one of claims 1 to 6,
An infrared sensor array device in which a band-shaped metal ring is placed in a region surrounding the infrared sensor mounting region of the substrate and is in contact with a flange provided at an end of the case on the substrate side to constitute a seal portion. The infrared sensor array device according to claim 1,
The sensor cover is an infrared sensor array device made of a resin material. The infrared sensor array device according to claim 8,
The sensor cover is an infrared sensor array device composed of a resin molded body in which a black plating layer is formed on an inner wall. The infrared sensor array device according to claim 1,
The infrared sensor element is connected to the substrate via a wire;
The infrared sensor array device, wherein the sensor cover is formed so as to cover a peripheral edge of the infrared sensor element except for a lead-out region of the wire. The infrared sensor array device according to claim 10,
The wire of the infrared sensor element is derived from two opposite sides of the infrared sensor element,
The sensor cover is an infrared sensor array device bonded to the substrate at two opposite sides where the wires are not arranged. The infrared sensor array device according to claim 1,
The infrared sensor array device is an infrared sensor array device connected to the substrate via bumps. The infrared sensor array device according to claim 12,
The sensor cover is an infrared sensor array device in which the entire periphery of the infrared sensor element is in contact with the substrate. An infrared sensor array device according to any one of claims 1 to 13,
The connection between the infrared sensor element and the signal processing circuit element is an infrared sensor array device realized through an internal wiring formed on the substrate. The infrared sensor array device according to any one of claims 1 to 14,
An infrared sensor array device in which a heat blocking part is formed on the substrate between the infrared sensor element and the sensor cover. The infrared sensor array device according to claim 15,
An infrared sensor array device in which the heat shut-off unit is a ring-shaped groove. The infrared sensor array device according to any one of claims 1 to 16,
The substrate is an infrared sensor array device in which a thin region is formed in a region where the signal processing circuit element is mounted. The infrared sensor array device according to any one of claims 1 to 17,
The infrared sensor array device, wherein the substrate is a ceramic substrate, and a wiring conductor layer is formed in a region where the sensor cover abuts. The infrared sensor array device according to any one of claims 1 to 18,
The infrared sensor array device, wherein the infrared sensor element is a surface-mounted element.

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