JP2011118024A - Method of fabricating developing roller - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of fabricating developing roller using a coating method in which a resin layer with a uniform film thickness is formed on the circumferential surface of a conductive base body without requiring elaborate management and a complicated apparatus, while preventing coating failure due to foreign matter occurrence. <P>SOLUTION: In the method of fabricating a developing roller having the resin layer for supplying a developer to an electrophotographic photoreceptor, on the peripheral surface of the conductive base body, a coating liquid for forming the resin layer is applied onto an application surface of the conductive base body by using an ultrasonic atomizer while the distance from a spray port of the ultrasonic atomizer to the application surface of the conductive base body is set to be 20-300 mm. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a developing roller used in an electrophotographic image forming apparatus.

  In recent years, electrophotographic image forming apparatuses have been strongly demanded for higher image quality in line with higher image quality and full color. As is conventionally known, an electrophotographic image forming apparatus includes a charging member that uniformly charges a photosensitive member, an exposure member that forms an electrostatic latent image on the photosensitive member, and an electrostatic latent image that is converted into a toner image. A developing member for developing the toner image, a transfer member for transferring the obtained toner image to the transfer member, a fixing member for fixing the toner image on the transfer member, a cleaning member for cleaning residual toner on the photosensitive member, and an electrostatic on the photosensitive member. It has structural members such as a charge eliminating member that removes the latent image.

  Each component is required to improve the quality of each component and shorten the length of the roller in accordance with the increase in quality and size.

  An electrophotographic image forming apparatus supplies charged toner to an electrostatic latent image on a photoconductor in contact or non-contact manner, and transfers a toner image formed through a developing process to make the electrostatic latent image a visible image. And final fixing to form a final image.

  As a developing method for forming a toner image, a two-component developing system composed of a carrier and a toner, and a developer composed only of toner is transported by a developing roller, and developed with resistance against electricity due to friction with a developer regulating member. There is a one-component development system. Since the one-component developing method does not use a carrier, the developing device can be simplified, and the image forming apparatus can be downsized.

  As a developing roller used in the one-component developing system, a resin layer in which conductive fine particles are dispersed on the surface for the purpose of frictional charging control, transportability control and image defect prevention on the peripheral surface of a cylindrical (columnar) conductive substrate. What is formed is known. It is known that due to variations in the thickness of the resin layer, defects, and the like, charging unevenness occurs, causing unevenness in the amount of toner transport, causing development unevenness. A method of adding conductive fine particles to the resin layer is known as a method for suppressing the occurrence of charging unevenness. By adjusting the resistance value and surface roughness of the resin layer with the conductive fine particles, it is carried on the developing roller. In addition, the charge amount and transport amount of the toner are appropriately controlled, and the occurrence of image defects such as a development ghost is suppressed. In the present invention, the development ghost refers to an image defect caused by uneven toner density (developer density).

  As a developing roller manufacturing method in which a resin layer is formed on a coated surface of a conductive substrate, a method of forming a resin layer by a dip coating method, a spray coating method, or a ring coating method is known. For example, when a resin layer is formed by applying a coating solution containing roughness-imparting particles on the coated surface of a cylindrical or columnar conductive substrate, the wet film thickness immediately after coating and the dry film thickness after drying A method of coating by a dip coating method while controlling the film thickness ratio (Dry film thickness / Wet film thickness) to be 0.2 to 0.5 is disclosed (for example, see Patent Document 1). However, a problem with the method described in Patent Document 1 is that complicated management is required.

  When a resin layer is formed on the peripheral surface of a cylindrical or columnar conductive substrate by a ring coating method, the substrate is held by a 6-axis flange of a 6-axis robot in order to minimize the external deflection of the substrate. A method of eliminating coating unevenness by coating is disclosed (for example, see Patent Document 2). However, a problem with the method described in Patent Document 2 is that a complicated apparatus is required.

A method is disclosed in which the number of play coatings is defined when a resin layer having a film thickness of 1 μm or less is formed by spray coating on the peripheral surface of a cylindrical or columnar conductive substrate (see, for example, Patent Document 3). .) However, it has been found that the spray coating method described in Patent Document 3 has the following problems.
1) By spraying the coating liquid and mixing with gas, depending on the type of the coating liquid, an agglomerate is formed, which is applied as a coating foreign matter and becomes a coating defect.
2) Since the concentration of the mist of the coating liquid sprayed from the nozzle is high at the center and low at the periphery, unevenness of the film thickness is likely to occur on the substrate surface, and it is difficult to apply a uniform film thickness.
3) Spattering of the coating liquid occurs, adheres to the non-coated surface of the conductive substrate, and extra man-hours are required to remove the deposit.

  From such a situation, a method for manufacturing a developing roller that does not require complicated management and complicated equipment, and does not have a coating failure due to the generation of foreign matter, and forms a resin layer with a uniform film thickness on the coating surface of the conductive substrate. Development is desired.

JP 2009-58865 A JP 2008-152127 A JP 2003-98699 A

  The present invention has been made in view of such a situation, and its purpose is not to require complicated management and complicated equipment, and there is no coating failure due to the generation of foreign matter, and it is uniform on the peripheral surface of the conductive substrate. It is providing the manufacturing method of the developing roller which forms a resin layer with the film thickness of by the apply | coating method.

  The above object of the present invention has been achieved by the following constitution.

1. In the manufacturing method of the developing roller having a resin layer for supplying the developer to the electrophotographic photosensitive member on the peripheral surface of the conductive substrate,
Using an ultrasonic atomizer for the resin layer forming coating solution for forming the resin layer,
Production of a developing roller, wherein the resin layer forming coating solution is applied to the conductive substrate coating surface at a distance of 20 mm to 300 mm between the spray port of the ultrasonic atomizer and the coating surface of the conductive substrate. Method.

  2. 2. The method for producing a developing roller according to 1 above, wherein the solid content concentration of the coating liquid for forming a resin layer is 3% by mass to 8% by mass.

  3. 3. The method for producing a developing roller according to 1 or 2, wherein the resin layer forming coating solution has a viscosity of 2 mPa · s to 50 mPa · s.

  4). When applying the coating liquid for forming the resin layer on the coated surface of the conductive substrate, the ultrasonic atomizer is applied per second while rotating the conductive substrate at a peripheral speed of 600 mm / min to 2000 mm / min. Any one of 1 to 3 above, wherein a length corresponding to 50% to 90% of the coating width by the ultrasonic atomizer is applied while moving in a direction parallel to the rotation axis of the conductive substrate. 2. A method for producing a developing roller according to item 1.

  5. When applying the coating liquid for forming the resin layer on the coating surface of the conductive substrate, the ultrasonic atomizer is fixed, the conductive substrate is rotated at a peripheral speed of 600 mm / min to 2000 mm / min, and While maintaining a constant distance from the spraying opening of the ultrasonic atomizer to the coating surface of the conductive substrate, the conductive substrate is applied to the conductive substrate at a length corresponding to 50% to 90% of the coating width by the ultrasonic atomizer per second. 4. The method for producing a developing roller according to any one of 1 to 3, wherein the coating is applied while moving in the width direction of the conductive substrate.

  6). 6. The method for producing a developing roller according to any one of 1 to 5, wherein a coating width of the ultrasonic atomizer is 5 mm to 200 mm.

  7. 7. The method for producing a developing roller according to any one of 1 to 6, wherein the spray amount of the resin layer forming coating liquid of the ultrasonic atomizer is 2 ml / min to 350 ml / min.

  Development method of developing roller that does not require complicated management, complicated apparatus, and does not have coating failure due to generation of foreign matter, and forms resin layer with uniform film thickness on peripheral surface of cylindrical or columnar conductive substrate Was able to provide.

1 is a schematic cross-sectional configuration diagram illustrating an example of an electrophotographic image forming apparatus. It is the schematic of the developing roller shown in FIG. It is a schematic sectional drawing of the developing roller of the other structure shown by Fig.1 (a). It is the schematic of the manufacturing process which forms a resin layer with the application | coating method which uses an ultrasonic atomizer on the surrounding surface of the application surface of an electroconductive base | substrate, and manufactures a developing roller. FIG. 5 is a schematic view taken along the line BB ′ of FIG. 4 showing a state in which a coating solution for forming a resin layer is applied to an application surface of a conductive substrate by an ultrasonic atomizer by the coating apparatus of the manufacturing process shown in FIG. is there. In the manufacturing apparatus shown in FIG. 4, when applying the resin layer forming coating liquid onto the surface of the cylindrical conductive substrate using an ultrasonic atomizer, both the ultrasonic atomizer and the cylindrical conductive substrate are moved simultaneously. It is a flowchart in the case of apply | coating. Flow diagram when applying the coating solution for resin layer formation to the surface of a cylindrical conductive substrate using an ultrasonic atomizer, fixing the ultrasonic atomizer and moving the cylindrical conductive substrate while rotating It is.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to FIGS. 1 to 7, but the present invention is not limited thereto.

  FIG. 1 is a schematic sectional view showing an example of an electrophotographic image forming apparatus. This figure shows the case of a full-color image forming apparatus.

  In the figure, reference numeral 1 denotes a full-color image forming apparatus. The full-color image forming apparatus 1 includes a plurality of sets of image forming units 10Y, 10M, 10C, and 10K, an endless belt-shaped intermediate transfer body forming unit 7 as a transfer unit, and an endless belt-shaped paper feeding conveyance for conveying a recording medium P. And a belt type fixing device 24 as fixing means. A document image reading device SC is arranged on the upper part of the main body A of the full-color image forming apparatus 1.

  An image forming unit 10Y that forms a yellow image as one of different color toner images formed on each of the photoreceptors 1Y, 1M, 1C, and 1K is a drum-like photoreceptor as a first image carrier. 1Y, a charging unit 2Y disposed around the photoreceptor 1Y, an exposure unit 3Y, a developing unit 4Y having a developing roller 4Y1, a primary transfer roller 5Y as a primary transfer unit, and a cleaning unit 6Y.

  An image forming unit 10M that forms a magenta image as another different color toner image is disposed around a drum-shaped photoconductor 1M as a first image carrier, and the photoconductor 1M. The charging unit 2M, the exposure unit 3M, the developing unit 4M having the developing roller 4M1, the primary transfer roller 5M as the primary transfer unit, and the cleaning unit 6M.

  Further, an image forming unit 10C for forming a cyan image as one of different toner images of different colors is disposed around a drum-shaped photoreceptor 1C as a first image carrier, and the photoreceptor 1C. The charging unit 2C, the exposure unit 3C, the developing unit 4C having the developing roller 4C1, the primary transfer roller 5C as the primary transfer unit, and the cleaning unit 6C are provided.

  In addition, an image forming unit 10K that forms a black image as one of other different color toner images is disposed around a drum-shaped photosensitive member 1K as a first image carrier, and the photosensitive member 1K. It has a charging means 2K, an exposure means 3K, a developing means 4K having a developing roller 4K1, a primary transfer roller 5K as a primary transfer means, and a cleaning means 6K.

  The endless belt-shaped intermediate transfer body forming unit 7 has an endless intermediate transfer belt 70 as a semiconductive endless belt-shaped second image carrier that is wound around a plurality of rollers and is rotatably supported.

  Each color image formed by the image forming units 10Y, 10M, 10C, and 10K is sequentially transferred and synthesized on the rotating endless intermediate transfer belt 70 by the primary transfer rollers 5Y, 5M, 5C, and 5K. A color image is formed. A recording medium P such as paper as a recording medium accommodated in the paper feeding cassette 20 is fed by the paper feeding / conveying means 21, passes through a plurality of intermediate rollers 22 A, 22 B, 22 C, 22 D, and a registration roller 23, and is secondary. A color image is transferred onto the recording medium P at a time by being conveyed to a secondary transfer roller 5A as a transfer means.

  The recording medium P onto which the color image has been transferred is fixed by the fixing device 24 equipped with the heat roller fixing device 270, is sandwiched between the paper discharge rollers 25, and is placed on the paper discharge tray 26 outside the apparatus.

  On the other hand, after the color image is transferred to the recording medium P by the secondary transfer roller 5A, the residual toner is removed from the endless intermediate transfer belt 70 from which the recording medium P is separated by the curvature by the cleaning means 6A.

  During the image forming process, the primary transfer roller 5K is always in pressure contact with the photoreceptor 1K. The other primary transfer rollers 5Y, 5M, and 5C are in pressure contact with the corresponding photoreceptors 1Y, 1M, and 1C, respectively, only during color image formation.

  The secondary transfer roller 5A comes into pressure contact with the endless intermediate transfer belt 70 only when the recording medium P passes through the secondary transfer roller 5A and secondary transfer is performed.

  Further, the housing 8 can be pulled out from the apparatus main body A through the support rails 82L and 82R. The housing 8 includes image forming units 10Y, 10M, 10C, and 10K, and an endless belt-shaped intermediate transfer body forming unit 7.

  The image forming units 10Y, 10M, 10C, and 10K are arranged in tandem in the vertical direction. An endless belt-shaped intermediate transfer body forming unit 7 is disposed on the left side of the photoreceptors 1Y, 1M, 1C, and 1K in the figure. The endless belt-shaped intermediate transfer body forming unit 7 includes an endless intermediate transfer belt 70 that can be rotated by winding rollers 71, 72, 73, 74, and 76, primary transfer rollers 5Y, 5M, 5C, and 5K, and a cleaning unit 6A. And have.

  The image forming units 10Y, 10M, 10C, and 10K and the endless belt-shaped intermediate transfer body forming unit 7 are integrally pulled out from the main body A by the drawer operation of the housing 8.

  In this way, the outer peripheral surfaces of the photoreceptors 1Y, 1M, 1C, and 1K are charged and exposed to form a latent image on the outer peripheral surface, and then a toner image (developed image) is formed by development. The toner images of the respective colors are superposed on each other, transferred onto the recording medium P at once, and fixed and fixed by the belt-type fixing device 24 by pressure and heating. In the present invention, the time of image formation includes latent image formation and transfer of a toner image (developed image) to a recording medium P to form a final image.

  The photoreceptors 1Y, 1M, 1C, and 1K after the toner image is transferred to the recording medium P are transferred by the cleaning units 6Y, 6M, 6C, and 6K disposed on the photoreceptors 1Y, 1M, 1C, and 1K. After cleaning the toner remaining on the photoreceptor, the charging, exposure and development cycle described above is entered, and the next image formation is performed.

  In the color image forming apparatus, an elastic blade is used as a cleaning member of the cleaning unit 6A for cleaning the intermediate transfer member. Further, means (11Y, 11M, 11C, 11K) for applying a fatty acid metal salt to each photoconductor is provided. As the fatty acid metal salt, the same fatty acid metal salt as used in the toner can be used.

  FIG. 2 is a schematic view of the developing roller shown in FIG. FIG. 2A is a schematic perspective view of the developing roller shown in FIG. FIG. 2B is a schematic cross-sectional view along AA ′ in FIG.

  In the figure, 4Y1 indicates a developing roller. The developing roller 4Y1 has a main body 4Y11 and holding members 4Y12 attached to both sides of the main body 4Y11 via attachment members (not shown). 4Y11a indicates an end face of the main body 4Y11. The main body 4Y11 includes a cylindrical conductive substrate 4Y1a, a first resin layer 4Y1a1 formed on the peripheral surface of the cylindrical conductive substrate 4Y1a, a second resin layer 4Y1a2, and a third resin layer 4Y1a3. Yes. The first resin layer 4Y1a1 functions as an adhesive layer and can be provided as necessary. The second resin layer 4Y1a2 has a charge imparting function and may be formed of a plurality of layers as necessary. The third resin layer 4Y1a3 has a function as a protective layer for the second resin layer 4Y1a2, and can be provided as necessary.

  Since the shape of the holding member 4Y12 varies depending on the type on the side where the developing roller is attached, there is no particular limitation, and the holding member 4Y12 shown in the figure is composed of a first holding member 4Y12a and a second holding member 4Y12b having different diameters. Shows the case. In the developing roller 4Y1 shown in this figure, the portions where the resin layer is formed are the peripheral surface of the conductive substrate 4Y1a and the end surfaces 4Y11a at both ends, and the holding member 4Y12 is in a state where the resin layer is not formed. . That is, in the developing roller 4Y1 shown in this drawing, the holding member 4Y12 is a non-coating area.

  The diameter of the conductive substrate 4Y1a is preferably 1.0 mm to 30 mm. The thickness of the dry coating film of the first resin layer 4Y1a1 is preferably 0.5 μm to 100 μm. The thickness of the dried coating film of the second resin layer 4Y1a2 is preferably 0.5 μm to 200 μm. The second resin layer 4Y1a2 may be a single layer or a multilayer structure composed of a plurality of layers, and can be appropriately selected as necessary. The thickness of the dry coating film of the third resin layer 4Y1a3 is preferably 0.5 μm to 200 μm.

  FIG. 3 is a schematic sectional view of a developing roller having another configuration shown in FIG.

  In the figure, 4Y'11 indicates the main body of the developing roller shown in FIG. The main body 4Y′11 includes a conductive substrate 4Y′1a, a first resin layer (elastic layer) 4Y′1b formed on the peripheral surface of the conductive substrate 4Y′1a, and a peripheral surface of the first resin layer 4Y′1b. The second resin layer 4Y′1c is formed, and the third resin layer 4Y′1d is formed on the peripheral surface of the second resin layer 4Y′1c. The first resin layer 4Y′1b has a function as an elastic layer. The second resin layer 4Y′1c has a charge imparting function and may be formed of a plurality of layers as necessary. The third resin layer 4Y′1d functions as a protective layer for the second resin layer 4Y′1c. The resin layer 4Y′1d can be provided as necessary.

  The diameter of the conductive substrate 4Y′1a is preferably 1.0 mm to 30 mm. The thickness of the dry coating film of the first resin layer (elastic layer) 4Y′1b is preferably 10 μm to 1000 μm. The thickness of the dried coating film of the second resin layer is preferably 0.5 μm to 200 μm. The second resin layer 4Y′1c may be a single layer or a multilayer structure composed of a plurality of layers, and can be appropriately selected as necessary. The thickness of the dry coating film of the third resin layer 4Y′1d is preferably 0.5 μm to 200 μm.

  The other developing rollers 4M1, 4C1, and 4K1 shown in FIG. 1 have the same configuration as the developing rollers shown in FIGS.

  The conductive substrate shown in FIGS. 2 and 3 may be cylindrical or columnar, and can be selected as necessary.

  In the present invention, the resin layer includes the first resin layer, the second resin layer, and the third resin layer shown in FIGS.

  The present invention relates to a method of manufacturing a developing roller that eliminates unevenness in charging and toner transport by eliminating variations and defects in the resin layer thickness of the developing roller shown in FIGS.

  FIG. 4 is a schematic view of a production process for producing a developing roller by forming a resin layer on the peripheral surface of the application surface of the conductive substrate by an application method using an ultrasonic atomizer. FIG. 4A is a schematic perspective view of a manufacturing process in which a resin layer is formed on the peripheral surface of the coating surface of the conductive substrate by a coating method using an ultrasonic atomizer and a developing roller is manufactured. FIG. 4B is a schematic front view of the manufacturing process shown in FIG. This figure shows a case where a cylindrical conductive substrate is used as the conductive substrate.

  In the figure, 9 indicates a manufacturing process. The manufacturing process 9 has a holding part 9a and an application part 9b. The holding unit 9a includes a first holding table 9a1, a second holding table 9a2, and a driving motor 9a3. The driving motor 9a3 is disposed on the first holding base 9a1, and is connected to the rotating shaft of the driving motor 9a3 through the holding member 10a of the conductive base 10 and the connection member. The second holding base 9a2 is provided with a receiving portion 9a21 that receives the other holding member 10b of the conductive substrate 10, and thereby holds the conductive substrate 10 while rotating the drive motor 9a3. Is possible.

  The coating unit 9b includes a coating device 9b1 and a driving unit 9b2. Reference numeral 9b11 denotes a coating solution supply pipe for supplying a coating solution for resin layer formation to the coating device 9b1. The coating device 9b1 is attached to the guide rail 9b4 by an attachment member 9b12 so as to be movable in parallel along the width direction of the cylindrical (columnar) conductive substrate 10. In this figure, the coating liquid supply unit and the control unit for the coating apparatus 9b1 are omitted.

  The drive unit 9b2 has a motor 9b21 and a guide rail mounting plate 9b3. An attachment member 9b12 is attached to the guide rail attachment plate 9b3, and two guides for moving the coating device 9b1 (in the direction of the arrow in the figure) parallel to the rotation axis of the conductive substrate 10 held by the holding portion 9a. Rail 9b4 is provided.

  The motor 9b21 is screwed with a slide screw 9b13 mounted on the mounting member 9b12, and the female screw 9b22 has a length for moving the mounting member 9b12 longer than the width of the conductive base 10 held by the holding portion 9a. have.

  By driving the motor 9b21, the coating device 9b1 attached to the attachment member 9b12 can move in the width direction in parallel with the rotation axis of the conductive substrate 10 as the slide screw 9b13 rotates. .

  The conductive substrate 10 used is a columnar conductive substrate, but it may be a cylindrical conductive substrate and can be selected as appropriate.

  This figure shows a coating device of a type in which the conductive substrate is rotated with the holding position of the conductive substrate fixed, and the coating device is moved in parallel with the rotation axis of the conductive substrate. It is also possible to move the conductive substrate in the width direction of the conductive substrate while rotating it. The width direction refers to the direction from the holding member 10b to the holding member 10a. An ultrasonic atomizer is used as the coating device 9b1.

  In the present invention, the ultrasonic atomizer supplies a liquid without applying pressure, vibrates the ultrasonic atomizer (nozzle) by the vibration of the piezoelectric ceramic, vibrates the supplied liquid, and forms fine particles for spraying. Say device.

  A commercially available ultrasonic atomizer can be used as the ultrasonic atomizer. Examples thereof include an ultrasonic atomizer (manufactured by Tick Corporation), an ultrasonic spray coating apparatus (manufactured by USI), and an ultrasonic spray nozzle system (manufactured by Sonotech).

  Although this figure shows the case where the coating is performed with the conductive substrate lying sideways, it is of course possible to perform the coating with the conductive substrate standing upright.

  FIG. 5 shows a state in which a coating solution for forming a resin layer is applied to the coated surface of the conductive substrate by the ultrasonic atomizer by the coating apparatus of the manufacturing process shown in FIG. 4 along BB ′ of FIG. FIG. FIG. 5A shows a state in which the coating liquid for forming the resin layer is applied to the coating surface of the conductive substrate by the ultrasonic atomizer by the coating apparatus of the manufacturing process shown in FIG. It is a schematic sectional drawing in alignment with. FIG. 5B is an enlarged schematic plan view of a portion indicated by P in FIG. In this figure, the mounting member, guide rail, slide screw, etc. are omitted.

  In the figure, J indicates the distance from the spray port 9b1a of the coating device 9b1 to the coating surface of the conductive substrate 10. The distance J is 20 mm to 300 mm. When the thickness is less than 20 mm, the droplet sprayed from the spray port 9b1a rebounds from the coating surface of the conductive substrate 10 and the film thickness and the surface roughness become non-uniform. If it exceeds 300 mm, the droplet sprayed from the spray port 9b1a is affected by the wind (environment), deviates from the desired position, and the film thickness and surface roughness are not uniform.

  K indicates the width of a circular application region L formed on the application surface of the conductive substrate 10 by droplets sprayed from the spray port 9b1a. The width K indicates the diameter of the application region L and also indicates the application width. The width K is preferably 5 mm to 200 mm in consideration of the coarsening of the droplets due to the adjacent droplets, the gap between the droplets, the stabilization of the film thickness and the surface roughness, and the like. M indicates the periphery of a circular application region L. N indicates the center of the circular application region L.

  The solid concentration of the coating liquid for forming a resin layer supplied from the coating liquid supply pipe 9b11 to the coating apparatus 9b1 is 3% by mass to 8% in consideration of wet film thickness, film thickness unevenness, film thickness control, surface roughness, and the like. It is preferable that it is mass%.

  The viscosity of the coating liquid for forming a resin layer is preferably 50 mPa · s or less in consideration of droplet forming properties. More preferably, it is 2 mPa · s to 50 mPa · s.

  In the case of a coating method in which the position is fixed while rotating the conductive substrate and the ultrasonic atomizer as the coating device is moved in parallel with the rotation axis of the conductive substrate, the rotational speed of the conductive substrate and the moving distance of the ultrasonic atomizer The relationship is shown below.

  When applying the resin layer forming coating solution, the peripheral speed of rotation of the conductive substrate 10 is from 600 mm / min in consideration of the film thickness, surface roughness, and the like due to the influence of a cold during transport to the droplets. 2000 mm / min is preferable.

  When the resin layer forming coating solution is applied, the distance of the ultrasonic atomizer moved in parallel with the direction of the rotation axis of the conductive substrate 10 is per second, depending on the influence of the cold accompanying the movement of the ultrasonic atomizer to the droplet. Considering the film thickness, surface roughness, etc., a length corresponding to 50% to 90% of the coating width by the ultrasonic atomizer is preferable. Specifically, when the width K is 80 mm, the ultrasonic atomizer moves from 40 mm / sec to 72 mm / sec.

  Coating that moves the conductive substrate in the width direction of the conductive substrate while fixing the ultrasonic atomizer and rotating the conductive substrate, keeping the distance between the spray port of the ultrasonic atomizer and the coating surface of the conductive substrate constant. In the case of the method, the relationship between the rotational speed of the conductive substrate and the moving distance of the ultrasonic atomizer is shown below.

  When the coating liquid for forming the resin layer is applied, the peripheral speed of rotation of the conductive substrate 10 starts from 600 mm / min in consideration of the film thickness, surface roughness, etc. due to the influence of a cold during transport to the droplets. 2000 mm / min is preferable.

  The moving distance of the conductive substrate 10 is from 50% to 90% of the coating width by the ultrasonic atomizer in consideration of the film thickness, surface roughness, etc. due to the influence of the cold accompanying the movement of the conductive substrate 10 to the droplets per second. A length corresponding to% is preferred. Specifically, when the width K is 80 mm, the conductive substrate 10 moves from 40 mm / sec to 72 mm / sec.

  The number of coatings of the resin layer forming coating solution on the surface of the conductive substrate 10 is preferably set as needed. The number of times of coating means that the ultrasonic atomizer starts coating at the coating start point of the edge of the conductive substrate 10, moves to the opposite edge of the conductive substrate 10, and sets the conductive substrate 10. This is the number of times the coating is applied once on the entire circumference of the surface.

  When applying the coating liquid for resin layer formation, the spray amount from the ultrasonic atomizer is 350 ml / min or less in consideration of droplet formation, dripping, and splashing of the droplet from the coated surface of the conductive substrate 10. Preferably there is. More preferably, it is 2 ml / min to 350 ml / min.

  Next, FIG. 6 shows a flow of applying the resin layer forming coating solution on the coating surface of the conductive substrate using the ultrasonic atomizer in the manufacturing apparatus shown in FIG.

  Next, FIG. 6 shows a flow of applying the resin layer forming coating solution on the coating surface of the conductive substrate using the ultrasonic atomizer in the manufacturing apparatus shown in FIG.

  FIG. 6 shows the manufacturing apparatus shown in FIG. 4. When applying the coating liquid for forming a resin layer on the conductive substrate coating surface using an ultrasonic atomizer, both the ultrasonic atomizer and the conductive substrate are moved simultaneously. It is a flowchart in the case of apply | coating.

  Step 1 shows an application start state in which an ultrasonic atomizer is set at the application start point and the application liquid for forming the resin layer is applied. At this time, the distance M from the spray of the ultrasonic atomizer to the application surface of the conductive substrate 10 is set so that the side M of the circular spray region L is at a preset position of the end of the conductive substrate 10. It is set to 20 mm to 300 mm. The application start point is the center N of the spray region L.

  Step 2 shows a state of several minutes after the application of the coating liquid for forming the resin layer is started. In the application, the position of the conductive substrate 10 is fixed and the ultrasonic atomizer simultaneously moves in the direction parallel to the rotation axis of the conductive substrate 10 (the spray region L moves) (the arrow a in the figure). Direction). The cylindrical (columnar) conductive substrate 10 preferably rotates at a peripheral speed of 600 mm / min to 2000 mm / min. The ultrasonic atomizer has a length corresponding to 50% to 90% of the coating width (width K of the coating region L shown in FIG. 5) by the ultrasonic atomizer per second in the direction parallel to the rotation axis direction of the conductive substrate 10. It is preferable to move. This figure shows a state where the ultrasonic atomizer is applied while moving a length corresponding to 50% of the application width (width K of the application region L shown in FIG. 5) by the ultrasonic atomizer.

  In step 3, the ultrasonic atomizer moves (in the direction of arrow a in the figure), and the periphery M of the spray region L faces the end of the conductive substrate 10 on which application of the conductive substrate 10 is started. The state where the position set at the edge is reached is shown.

  Step 4 shows a state in which the conductive substrate 10 is rotated once from the state of Step 3 and the coating liquid for resin layer formation is applied to the entire peripheral surface of the conductive substrate 10.

  In the present invention, the state shown in step 4 is referred to as one application. Thereafter, the thickness set by repeating the operations from step 2 to step 4 by moving the ultrasonic atomizer (in the direction of arrow b in the drawing) toward the edge of the conductive substrate 10 where coating has started, as necessary. It is possible to form a resin layer.

  FIG. 7 is a flow chart in the case of applying a coating solution for forming a resin layer on the surface of a conductive substrate using an ultrasonic atomizer, fixing the ultrasonic atomizer, and moving and applying the conductive substrate while rotating. is there. In this figure, the ultrasonic atomizer is omitted.

  Step 1 shows an application start state in which an ultrasonic atomizer is set at the application start point and the application liquid for forming the resin layer is applied. At this time, the side M of the circular spray region L is set to a preset position on the end side of the conductive substrate 10, and the cylindrical (columnar) conductive substrate 10 is sprayed from the spray of the ultrasonic atomizer. The distance to the application surface is set to 20 mm to 300 mm. The application start point is the center N of the spray region L.

  Step 2 shows a state of several minutes after the application of the coating liquid for forming the resin layer is started. In the application, the position of the ultrasonic atomizer is fixed, and the conductive substrate 10 is in a rotating state while maintaining the distance between the spray port of the ultrasonic atomizer and the application surface of the conductive substrate. This is performed while moving in the width direction of the conductive substrate 10 (in the direction of arrow c in the figure).

  The cylindrical (columnar) conductive substrate 10 preferably rotates at a peripheral speed of 600 mm / min to 2000 mm / min. The conductive substrate 10 is preferably moved by a length corresponding to 50% to 90% of the coating width (width K of the coating region L shown in FIG. 5) by the ultrasonic atomizer per second. This figure shows a state where the conductive substrate is applied while moving a length corresponding to 50% of the application width (width K of the application region L shown in FIG. 5) by the ultrasonic atomizer.

  In step 3, the conductive substrate 10 moves (in the direction of arrow c in the figure), and the periphery M of the spray region L is opposite to the edge on which application of the cylindrical (columnar) conductive substrate 10 is started. The state where the position set at is reached is shown.

  In step 4, the cylindrical (columnar) conductive substrate 10 rotates from the state of step 3, and the resin layer forming coating solution is applied to the entire peripheral surface of the cylindrical (columnar) conductive substrate 10. Indicates the state.

  In the present invention, the state shown in step 4 is referred to as one application. Thereafter, if necessary, the cylindrical (columnar) conductive substrate 10 is moved toward the edge of the cylindrical (columnar) conductive substrate 10 that has started coating (in the direction of arrow d in the figure). By repeating the operations from Step 2 to Step 4, it is possible to form a resin layer having a set thickness.

Using the ultrasonic atomizer, the distance from the application surface of the cylindrical (columnar) conductive substrate to the spraying port of the ultrasonic atomizer and the surface of the cylindrical (columnar) conductive substrate from 20 mm The following effect was acquired by apply | coating the coating liquid for resin layer formation by 300 mm, and forming a resin layer.
1) The occurrence of agglomeration of the coating liquid during application is eliminated, application failure due to the generation of foreign matter is eliminated, toner is not unevenly conveyed, and a stable image can be obtained.
2) A uniform resin layer with no film thickness unevenness was obtained, the charge amount was not uneven, the toner transport amount was constant, and a stable image could be obtained.
3) Complex management and complicated equipment are not required, man-hours for management can be reduced, and production efficiency can be improved.

  Next, the material constituting the developing roller of the present invention will be described.

(Conductive substrate)
Since the cylindrical or columnar substrate that is the substrate for the developing roller also serves as a member that leaks the electric charge accumulated on the surface of the developing roller, it is preferably composed of a conductive metal. Typical examples include conductive metals such as stainless steel (for example, SUS304) having a diameter of 1.0 to 30 mm, iron, aluminum, nickel, aluminum alloy, nickel alloy, metal powder, carbon black, and the like. It may be composed of a conductive resin in which a conductive material is filled in a resin.

(Elastic layer (corresponds to the first resin layer in FIG. 3))
Silicone rubber is generally used as the elastic layer. For example, an inorganic filler or a curing agent such as benzoyl peroxide may be added to organopolysiloxane, kneaded, heated after being molded, vulcanized and cured. Can be mentioned. For example, it can be obtained by crosslinking methylvinylpolysiloxane composed of dimethylpolysiloxane and methylvinylsiloxane with an organic peroxide. Although the elastic modulus differs depending on the degree of crosslinking, an elastic body having a JIS A hardness of about 10 to 60 ° is preferable.

In addition, this elastic layer is used by adjusting the resistance and reducing the resistance. In order to reduce the resistance, it is preferable to contain a low resistance component such as carbon black, graphite, zinc oxide, tin oxide, or titanium oxide. In this case, it is preferable to use a material having a volume resistivity of 1 × 10 ⁻⁴ to 1 × 10 ⁴ Ω · cm as the resistance of these materials. Particularly preferable examples include graphite, ketjen black and acetylene black. The amount added is not particularly limited, but is preferably 10 parts by mass to 100 parts by mass with respect to 100 parts by mass of the silicone rubber constituting the elastic layer.

(Resin layer (first resin layer, second resin layer in FIG. 2 and second resin layer in FIG. 3 correspond))
The resin constituting the resin layer is preferably a crosslinkable resin. The crosslinkable resin refers to a resin that is self-crosslinked by heat, a catalyst, air, moisture, an electron beam, or the like, or a resin that is crosslinked by a reaction with a crosslinking agent or another crosslinkable resin. For example, fluorine resin, polyamide resin, acrylic resin, alkyd resin, phenol resin, melamine resin, silicone resin, urethane resin, epoxy resin, polyether resin, amino resin, urea resin, and a mixture of these resins can be used. Moreover, a resin-silica hybrid body etc. are mentioned. In the resin layer, if necessary, a resin material containing as a main component various additives such as a conductive agent, a non-conductive filler, roughness particles (inorganic particles, organic particles), a crosslinking agent, a catalyst, and a dispersion accelerator. Can be blended as appropriate.

Conductive agents include various conductive metals or alloys such as carbon black, graphite, aluminum, copper, tin, stainless steel, tin oxide, zinc oxide, indium oxide, titanium oxide, tin oxide-antimony oxide solid solution, tin oxide-oxide Various conductive metal oxides such as indium solid solution and fine powders such as insulating substances coated with these conductive materials can be used. Among these, carbon black can be suitably used because it can be obtained relatively easily and good chargeability can be obtained regardless of the type of the main resin material. As a means for imparting conductivity, a method of adding a conductive polymer compound instead of the conductive agent or together with the conductive agent can be used. For example, as a conductive polymer compound, as a host polymer, polyacetylene, poly (p-phenylene), polypyrrole, polythiophenine, poly (p-phenylene oxide), poly (p-phenylene sulfide), poly (p-ferene vinylene) ), Poly (2,6-dimethylphenylene oxide), poly (bisphenol a carbonate), polyvinylcarbazole, polydiacetylene, poly (n-methyl-4-vinylpyridine), polyaniline, polyquinoline, poly (phenylene ether sulfone) and the like. These are used as dopants such as AsF ₅ , I ₂ , Br ₂ , SO ₃ , Na, K, ClO ₄ , FeCl ₃ , F, Cl, Br, I, Kr and other ions, Li, TCNQ (7 , 7,8,8-tetracyanoquinodimethane) Those over-flops, have been conventionally used.

  Non-conductive fillers include diatomaceous earth, quartz powder, dry silica, wet silica, titanium oxide, zinc oxide, aluminosilicate, calcium carbonate, and the like.

  As the inorganic particles as the coarse particles, various inorganic particles used for the conductive agent and the non-conductive filler can be used. The following resin particles can be used as the organic particles as the coarse particles. For example, rubber particles made of SBR, BR, NBR, CR, EVA, EP, ACR, EPDM, silicone rubber, etc., thermoplastic elastomer particles such as polystyrene, polyolefin, polyvinyl chloride, polyurethane, polyester, polyamide, acrylic resin, Examples thereof include resin particles made of urethane resin, fluorine resin, silicone resin, phenol resin, naphthalene resin, furan resin, xylene resin, divinylbenzene polymer, styrene-divinylbenzene copolymer, polyacrylonitrile resin, and the like.

  Examples of the crosslinking agent include polyol compounds, polyisocyanate compounds, polyaldehyde compounds, polyamine compounds, and polyepoxy compounds. Examples of the catalyst include radical catalysts such as peroxides, base catalysts, and acid catalysts.

(Resin layer (the third resin layer in FIG. 2 corresponds to the third resin layer in FIG. 3))
As the resin used for the surface side, it is possible to use the resin used for the resin layer. Among these, JIS A hardness is 60 ° to 90 °, and 100% modulus is 5 × 10 ⁶ Pa to 30 ×. The thing of 10 ⁶ Pa is preferable.

(Solvent for coating solution preparation)
Solvents used for preparing the coating solution include alcohol solvents such as methanol, ethanol, isopropanol and butanol, ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone, and aromatic hydrocarbon solvents such as toluene and xylene. And aliphatic hydrocarbon solvents such as hexane, ester solvents such as ethyl acetate, ether solvents such as isopropyl ether, water, and mixtures thereof. If necessary, a high boiling point solvent or a silicone compound may be mixed as a leveling agent.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.

Example 1
As a developing roller, a developing roller having the configuration of the first resin layer, the second resin layer, and the third resin layer shown in FIG. 2 was produced by the method described below.

(Preparation of cylindrical conductive substrate)
As a substrate for the developing roller shown in FIG. 2, a holding member composed of a first holding member having a diameter of 9 mm and a second holding member having a diameter of 7 mm is provided at both ends, the diameter is 16 mm, the wall thickness is 1.5 mm, A cylindrical conductive substrate made of stainless steel (SUS304) having a length of 240 mm was prepared.

(Preparation of coating solution for resin layer formation)
The following coating liquid for forming a first resin layer, coating liquid for forming a second resin layer, and coating liquid for forming a third resin layer were prepared.

(Preparation of coating solution for forming the first resin layer)
Primer No. 4 (Shin-Etsu Chemical Co., Ltd.) 100 parts by mass (Preparation of coating solution for forming second resin layer)
Polyurethane resin 50 parts by mass Carbon black (furnace black) 15 parts by mass Cross-linked acrylic resin (roughness particles) 10 parts by mass MEK 1000 parts by mass The total solid content concentration was 7.0% by mass.

Viscosity: 30 mPa · s (measured at 23 ° C. using a high-accuracy viscometer for laboratories VM-200T3 manufactured by CBC)
(Preparation of coating solution for forming the third resin layer)
Thermoplastic polyurethane resin 50 parts by mass Carbon black (furnace black) 15 parts by mass THF 1000 parts by mass The total solid content concentration was 6.1% by mass.

Viscosity: 15 mPa · s (measured at 23 ° C. using a high-accuracy viscometer for laboratories VM-200T3 manufactured by CBC)
(Development roller development)
Application of the first resin layer forming coating solution An ultrasonic atomizer is used as a coating device in the manufacturing process shown in FIG. 4 on the peripheral surface of the prepared cylindrical conductive substrate, and the jet port of the ultrasonic atomizer and the cylindrical conductive material are used. The first resin layer forming coating solution prepared under the conditions shown below with a distance of 100 mm from the substrate coating surface (surface) and a coating width of 83 mm was applied, and then dried at 140 ° C. for 60 minutes, and the first 1 μm thick first A cylindrical conductive substrate having a resin layer formed thereon was prepared. a. An ultrasonic atomizer manufactured by Tick Corporation was used.

  The same first resin layer forming coating solution is applied to the peripheral surface of the prepared cylindrical conductive substrate by a dip coating method at a pulling rate of 3 mm / sec, and then dried under the same conditions, and the first resin layer having a thickness of 1 μm. A cylindrical conductive substrate formed with no. b. The application conditions of other ultrasonic atomizers are shown below.

Discharge nozzle diameter: 2mm
Ultrasonic frequency: 100 kHz
Average droplet diameter: 200 μm
Spray amount: 100 ml / sec
Peripheral speed when rotating cylindrical conductive substrate: 600 mm / min
Ultrasonic atomizer travel distance: 50% of application width per second
Number of times of coating: 5 times Coating of the second resin layer forming coating solution The cylindrical conductive substrate No. 1 on which the prepared first resin layer was formed. An ultrasonic atomizer is used in the coating apparatus in the manufacturing process shown in FIG. 4 on the first resin layer a, and the distance between the jet port of the ultrasonic atomizer and the coating surface (surface) of the cylindrical conductive substrate is set to 100 mm. A cylindrical conductive substrate having a coating width of 83 mm and applying a second resin layer forming coating solution prepared under the following conditions, followed by drying at 140 ° C. for 60 minutes to form a second resin layer having a thickness of 10 μm No. 1-a. An ultrasonic atomizer manufactured by Tick Corporation was used.

  The same conductive liquid for forming the second resin layer was applied by a dip coating method at a pulling speed of 3 mm / sec, and the cylindrical conductive substrate No. 1 on which the prepared first resin layer was formed. A cylindrical conductive substrate having a second resin layer having a thickness of 10 μm was prepared by applying it to the peripheral surface of b and drying under the same conditions. 1-b. The application conditions of other ultrasonic atomizers are shown below.

Discharge nozzle diameter: 2mm
Ultrasonic frequency: 100 kHz
Average droplet diameter: 200 μm
Spray amount: 100 ml / sec
Peripheral speed when rotating cylindrical conductive substrate: 600 mm / min
Ultrasonic atomizer travel distance: 50% of application width per second
Number of times of coating: 5 times Coating of the third resin layer forming coating solution Cylindrical conductive substrate No. 1 formed up to the prepared second resin layer. On the second resin layer 1-a, an ultrasonic atomizer is used as a coating device in the manufacturing process shown in FIG. 4, and as shown in Table 1, the jet surface of the ultrasonic atomizer and the coated surface of the cylindrical conductive substrate ( The coating solution for forming the third resin layer was applied under the following conditions by changing the distance to the surface), and then dried at 140 ° C. for 60 minutes to form a third resin layer having a thickness of 5 μm. Sample No. 101 to 106. An ultrasonic atomizer manufactured by Tick Corporation was used.

  The same coating solution for forming the third resin layer was applied to the peripheral surface of the prepared cylindrical conductive substrate 1-g by a dip coating method at a pulling rate of 3 mm / sec, and then dried under the same conditions and dried to a thickness of 5 μm. 3 A developing roller having a resin layer formed thereon was prepared, and comparative sample no. 107. The application conditions of other ultrasonic atomizers are shown below.

Discharge nozzle diameter: 2mm
Ultrasonic frequency: 100 kHz
Average droplet diameter: 200 μm
Spray amount: 100 ml / sec
Peripheral speed when rotating the cylindrical conductive substrate: 600 mm / min
Ultrasonic atomizer travel distance: 50% of application width per second
Number of application: 5 times

Evaluation The produced sample No. Table 2 shows the results of the evaluation of the resin layer thickness uniformity, fine line reproducibility, fog, and image density by the test methods shown below and evaluated by the evaluation ranks shown below.

Resin layer thickness uniformity The resin layer of the developing roller was measured at 20 points in the length direction and 8 points on the peripheral surface, and the variation was calculated by the following formula to obtain the resin layer thickness uniformity. In addition, the thickness of the resin layer was measured with Co., Ltd. Fisher Instruments (model MMS).

Variation of resin layer thickness (%) = ((maximum resin layer thickness−minimum resin layer thickness) / average resin layer thickness) × 100
Evaluation rank of resin layer thickness uniformity ◎: Resin layer thickness variation of less than 3% ○: Resin layer thickness variation of 3% or more and less than 5% Δ: Resin layer thickness variation of 5% or more and less than 7% × : Resin layer thickness variation of 7% or more and less than 10% XX: Resin layer thickness variation of 10% or more Evaluation method of fine line reproducibility As an evaluation device, a commercially available color laser printer “Magicolor 2300DL2300DL (Konica Minolta Business Technologies ( Manufactured)), and the developed developing roller No. No. 201 to 207 are loaded in a developing device, and the pixel ratio is 20% (full color mode of 5% for each color of yellow, magenta, cyan, and black) in a normal temperature and low humidity environment (20 ° C., 10% RH) and 3000 in A4 size. An original image with a pixel rate of 10% after initial and 3000 sheets printing (A4 size original image with fine line image, portrait photo, solid white image, solid black image divided into 1/4 equal parts) ) Was printed, the fine line portion was enlarged using a 10-fold magnifier, and the presence or absence of blur was visually evaluated to evaluate the resolution.

Evaluation rank of fine line reproducibility ◎: Almost no blurring ○: Slightly blurring at the edge (When the loupe is not used, the blurring cannot be recognized)
△: less than 1/4 blurring ×: more than 1/4 fogging The solid white image portion of the original image used for evaluation of fine line reproducibility was measured with a Macbeth reflection densitometer “RD-918”, and the reflection of the transfer paper The fog was evaluated based on the relative reflection density with a density of 0.

Fog evaluation rank A: Fog density is 0.00 or more and less than 0.003 B: Fog density is 0.003 or more and less than 0.005 B: Fog density is 0.05 or more and less than 0.01 X: Fog density Is 0.01 or more (Image density)
The density of the solid black image portion was measured at 12 points using a reflection densitometer “RD-918”, and the average reflection density was evaluated. The relative reflection density with the paper reflection density of “0” was evaluated.

◎: Solid black image portion density 1.30 or more ○: Solid black image portion density 1.20 or more, less than 1.30 Δ: Solid black image portion density 1.10 or more, less than 1.20 ×: Solid black image Image area density less than 1.10

  When manufacturing a developing roller having a resin layer for supplying a developer to the electrophotographic photosensitive member on the peripheral surface of the conductive substrate, an ultrasonic atomizer is used as the resin layer forming coating solution to form the resin layer. Sample No. manufactured by applying a coating solution for resin layer formation to the coating surface of the conductive substrate at a distance between the spray port of the sonic atomizer and the coating surface of the conductive substrate of 20 to 300 mm. Nos. 102 to 105 showed excellent results in all of the resin layer thickness uniformity, fine line reproducibility, fogging, and image density.

  Sample No. produced by forming any one of the first resin layer to the third resin layer under the condition that the distance from the spray port of the ultrasonic atomizer to the coating surface of the conductive substrate is 10 mm, 350 mm and out of the scope of the present invention . Nos. 101 and 106 showed results in which the resin layer thickness uniformity, fine line reproducibility, fogging, and image density were all inferior to the sample of the present invention. Sample No. produced by the conventional dip coating method was applied. No. 107 showed the worst results in all of the resin layer thickness uniformity, fine line reproducibility, fog, and image density. The effectiveness of the present invention was confirmed.

Example 2
As a developing roller, a developing roller having the configuration of the first resin layer, the second resin layer, and the third resin layer shown in FIG. 2 was produced by the method described below.

(Preparation of cylindrical conductive substrate)
The same columnar conductive substrate as in Example 1 was prepared.

(Formation of resin layer)
(Preparation of coating solution for forming the first resin layer)
When preparing the same first resin layer forming coating solution as prepared in Example 1, the first resin layer forming coating solution was prepared in the same manner except that the solid concentration was 5%. Was prepared. In addition, solid content concentration was performed by changing the addition amount of 1-propanol and methyl isobutyl ketone. The viscosity was adjusted by adjusting the amount of the thickener to be constant.

(Preparation of coating solution for forming second resin layer)
The second resin layer forming coating solution was prepared in the same manner as the second resin layer forming coating solution prepared in Example 1 except that the solid content concentration was 5%. Was prepared. In addition, solid content concentration was performed by changing the addition amount of 1-propanol and methyl isobutyl ketone. The viscosity was adjusted by adjusting the amount of the thickener to be constant.

(Preparation of coating solution for forming the third resin layer)
When preparing the same third resin layer forming coating solution as the third resin layer forming coating solution prepared in Example 1, the third resin layer was prepared in the same manner except that the solid content concentration was changed as shown in Table 3. A coating solution for forming was prepared. From a to e. In addition, solid content concentration was performed by changing the addition amount of 1-propanol and methyl isobutyl ketone. The viscosity was adjusted by adjusting the amount of the thickener to be constant.

(Application of first resin layer forming coating solution)
The prepared coating solution for forming the first resin layer was subjected to sample No. A cylindrical conductive substrate having a first resin layer having a thickness of 1 μm was prepared by applying the sample 104 on the peripheral surface of a cylindrical conductive substrate prepared under the same coating conditions as when 104 was manufactured.

(Application of coating solution for forming second resin layer)
The prepared coating solution for forming the second resin layer was prepared using the sample No. 1 of Example 1. The cylindrical conductive substrate in which the second resin layer having a thickness of 10 μm is formed on the first resin layer of the cylindrical conductive substrate in which the first resin layer prepared under the same coating conditions as when 104 is manufactured Was made.

(Application of third resin layer forming coating solution)
The prepared coating solution No. 3 for forming the third resin layer was prepared. Samples Nos. a to e in Example 1 A third resin layer having a thickness of 5 μm is formed on the second resin layer of the cylindrical conductive substrate on which the second resin layer prepared under the same coating conditions as when 104 is manufactured, and a developing roller is manufactured. Sample No. 201 to 205.

Evaluation The produced sample No. Table 4 shows the results of 201 to 205, in which the resin layer thickness uniformity, fine line reproducibility, fog, and image density were tested by the same method as in Example 1 and evaluated with the same evaluation rank.

  When applying the resin layer forming coating solution to the surface of the photosensitive layer using an ultrasonic atomizer and setting the distance between the jet port and the surface of the photoreceptor to 50 mm of the present invention, the solid content concentration of the resin layer forming coating solution is It was confirmed that any of 3% by mass to 8% by mass showed excellent performance in film thickness stability, surface roughness stability, and durability. The effectiveness of the present invention was confirmed. The effectiveness of the present invention was confirmed.

Example 3
As a developing roller, a developing roller having the configuration of the first resin layer, the second resin layer, and the third resin layer shown in FIG. 2 was produced by the method described below.

(Preparation of cylindrical conductive substrate)
The same columnar conductive substrate as in Example 1 was prepared.

(Formation of resin layer)
(Preparation of coating solution for forming the first resin layer)
The first resin layer forming coating solution was prepared in the same manner as the first resin layer forming coating solution prepared in Example 1, except that the viscosity was changed to 10 mPa · s. Was prepared. The viscosity was changed by changing the amount of thickener added. The viscosity indicates a value measured with a rotational viscometer manufactured by Viscotec Corporation.

(Preparation of coating solution for forming second resin layer)
When preparing the same coating solution for forming the second resin layer as the coating solution for forming the second resin layer prepared in Example 1, the coating solution for forming the second resin layer was prepared in the same manner except that the viscosity was changed to 15 mPa · s. Was prepared. The viscosity was changed by changing the amount of thickener added. The viscosity indicates a value measured with a rotational viscometer manufactured by Viscotec Corporation.

(Preparation of coating solution for forming the third resin layer)
When preparing the same third resin layer forming coating solution as prepared in Example 1, the same method was used except that the viscosity was changed as shown in Table 5 for the third resin layer forming. A coating solution was prepared and no. 3-a to 3-f. In addition, solid content concentration was performed by changing the addition amount of 1-propanol and methyl isobutyl ketone. The viscosity was adjusted by adjusting the amount of the thickener to be constant.

(Application of first resin layer forming coating solution)
The prepared coating solution for forming the first resin layer was subjected to sample No. A cylindrical conductive substrate having a first resin layer having a thickness of 1 μm was prepared by applying the sample 104 on the peripheral surface of a cylindrical conductive substrate prepared under the same coating conditions as when 104 was manufactured.

(Application of coating solution for forming second resin layer)
The prepared coating solution for forming the second resin layer was prepared using the sample No. 1 of Example 1. 104 is applied on the first resin layer of the cylindrical conductive substrate on which the first resin layer prepared under the same application conditions as that used for manufacturing 104 is formed, and the second resin layer having a thickness of 10 μm is formed. A conductive substrate was produced.

(Application of third resin layer forming coating solution)
The prepared coating solution No. 3 for forming the third resin layer was prepared. Samples Nos. 3-a to 3-f of Example 1 As shown in Table 6 under the same coating conditions as when 104 was prepared, the third resin was applied on the second resin layer of the cylindrical conductive substrate on which the prepared second resin layer was formed, and the thickness was 5 μm. A layer was formed, and a developing roller was prepared. 301 to 306.

Evaluation The produced sample No. Table 6 shows the results of 301 to 306, in which the resin layer thickness uniformity, fine line reproducibility, fog, and image density were tested in the same manner as in Example 1 and evaluated with the same evaluation rank.

  When applying the resin layer forming coating solution using an ultrasonic atomizer and setting the distance between the jet port and the surface of the photoconductor to 50 mm of the present invention, the viscosity of the resin layer forming coating solution is from 2 mPa · s to 50 mPa · s. If so, it was confirmed that all showed excellent performance in film thickness stability, surface roughness stability, and durability. The effectiveness of the present invention was confirmed. The effectiveness of the present invention was confirmed.

Example 4
As a developing roller, a developing roller having the configuration of the first resin layer, the second resin layer, and the third resin layer shown in FIG. 2 was produced by the method described below.

(Preparation of cylindrical conductive substrate)
The same columnar conductive substrate as in Example 1 was prepared.

(Formation of resin layer)
(Preparation of coating solution for forming the first resin layer)
The same first resin layer forming coating solution as the first resin layer forming coating solution prepared in Example 1 was prepared.

(Preparation of coating solution for forming second resin layer)
The same coating solution for forming the second resin layer as the coating solution for forming the second resin layer prepared in Example 1 was prepared.

(Preparation of coating solution for forming the third resin layer)
The same third resin layer forming coating solution as the third resin layer forming coating solution prepared in Example 1 was prepared.

(Application of first resin layer forming coating solution)
When the prepared coating resin for forming the first resin layer is applied to the peripheral surface of the prepared cylindrical conductive substrate, the rotational speed (circumferential speed) of the cylindrical conductive substrate is 1000 mm / min, and an ultrasonic atomizer is used. The distance moved in the direction parallel to the rotation axis of the cylindrical conductive substrate was 50% of the coating width by the ultrasonic atomizer, and coating was performed five times according to the flow shown in FIG. 6 to form the first resin layer. A cylindrical conductive substrate was produced. Other ultrasonic atomizer conditions are the same as the sample No. 1 in Example 1. 104 under the same conditions.

(Application of coating solution for forming second resin layer)
When the prepared coating solution for forming the second resin layer is applied onto the first resin layer of the cylindrical conductive substrate on which the prepared first resin layer is formed, the rotational speed of the cylindrical conductive substrate is set to 1000 mm. / Min, the distance of moving the ultrasonic atomizer in the direction parallel to the rotation axis of the cylindrical conductive substrate on which the first resin layer is formed is 50% of the coating width by the ultrasonic atomizer, and the flow shown in FIG. Was applied five times to produce a cylindrical conductive substrate formed up to the second resin layer. Other ultrasonic atomizer conditions are the same as the sample No. 1 in Example 1. 104 under the same conditions.

(Application of third resin layer forming coating solution)
When the prepared coating solution for forming the third resin layer is applied on the second resin layer of the cylindrical conductive substrate on which the prepared second resin layer is formed, as shown in Table 7, the cylindrical conductive property 5 times according to the flow shown in FIG. 6 while changing the rotation speed (circumferential speed) of the substrate and the distance the ultrasonic atomizer moves in the direction parallel to the rotation axis of the cylindrical conductive substrate on which the second resin layer is formed. Application is performed to form a third resin layer, and a developing roller is prepared. 401 to 412. Other ultrasonic atomizer conditions are the same as the sample No. 1 in Example 1. 104 under the same conditions.

Evaluation The produced sample No. Table 8 shows the results from 401 to 412, in which the resin layer thickness uniformity, fine line reproducibility, fog, and image density were tested in the same manner as in Example 1 and evaluated with the same evaluation rank as in Example 1.

  When the coating liquid for forming the resin layer is applied to the coated surface of the cylindrical conductive substrate, the ultrasonic atomizer is applied per second while rotating the conductive substrate at a peripheral speed of 600 mm / min to 2000 mm / min. Sample No. 2 was coated by a method of coating by repeatedly applying a length corresponding to 50% to 90% of the coating width by the sonic atomizer while moving parallel to the rotation axis direction of the cylindrical conductive substrate. It was confirmed that 402 to 405 and 408 to 411 all showed excellent performance in resin layer thickness uniformity, fine line reproducibility, and fog density. The effectiveness of the present invention was confirmed.

Example 5
As a developing roller, a developing roller having the configuration of the first resin layer, the second resin layer, and the third resin layer shown in FIG. 2 was produced by the method described below.

(Preparation of cylindrical conductive substrate)
The same columnar conductive substrate as in Example 1 was prepared.

(Formation of resin layer)
(Preparation of coating solution for forming the first resin layer)
The same first resin layer forming coating solution as the first resin layer forming coating solution prepared in Example 1 was prepared.

(Preparation of coating solution for forming second resin layer)
The same coating solution for forming the second resin layer as the coating solution for forming the second resin layer prepared in Example 1 was prepared.

(Preparation of coating solution for forming the third resin layer)
The same third resin layer forming coating solution as the third resin layer forming coating solution prepared in Example 1 was prepared.

(Application of first resin layer forming coating solution)
When applying the prepared coating solution for forming the first resin layer to the peripheral surface of the prepared cylindrical conductive substrate, the position of the ultrasonic atomizer is fixed and the rotational speed (circumferential speed) of the cylindrical conductive substrate is fixed. The first resin layer having a thickness of 1000 μm / min and a thickness of 1 μm is applied by applying five times in accordance with the flow shown in FIG. A columnar conductive substrate having a shape formed thereon was prepared. Other ultrasonic atomizer conditions are the same as the sample No. 1 in Example 1. 104 under the same conditions.

(Application of coating solution for forming second resin layer)
When applying the prepared coating solution for forming the second resin layer on the first resin layer of the cylindrical conductive substrate on which the prepared first resin layer is formed, the position of the ultrasonic atomizer is fixed, and the cylindrical shape The rotational speed (peripheral speed) of the conductive substrate of 1000 mm / min and the distance moved in the direction of the rotational axis of the cylindrical conductive substrate is 50% of the coating width by the ultrasonic atomizer, and 5 times according to the flow shown in FIG. Coating was performed to produce a columnar conductive substrate having a thickness up to 10 μm of the second resin layer. Other ultrasonic atomizer conditions are the same as the sample No. 1 in Example 1. 104 under the same conditions.

(Application of third resin layer forming coating solution)
When the prepared coating solution for forming the third resin layer is applied on the second resin layer of the cylindrical conductive substrate on which the prepared second resin layer is formed, the position of the ultrasonic atomizer is fixed, and Table 9 As shown in FIG. 7, while changing the rotational speed (circumferential speed) of the cylindrical conductive substrate and the distance (% relative to the coating width by the ultrasonic atomizer) that moves in the rotational axis direction of the cylindrical conductive substrate. In accordance with the flow shown, coating was performed five times to form a third resin layer having a thickness of 5 μm, and a developing roller was prepared. 501 to 512. Other ultrasonic atomizer conditions are the same as the sample No. 1 in Example 1. 104 under the same conditions.

Evaluation The produced sample No. Table 10 shows the results obtained by testing the resin layer thickness uniformity, fine line reproducibility, fogging, and image density in the same manner as in Example 1 and evaluating with the same evaluation rank as in Example 1.

  When the resin layer forming coating solution is applied to the coated surface of the cylindrical conductive substrate, the ultrasonic atomizer is fixed, the conductive substrate is rotated at a peripheral speed of 600 mm / min to 2000 mm / min, and A method in which a conductive substrate is applied by repeatedly applying a length corresponding to 50% to 90% of the coating width by an ultrasonic atomizer per second while moving in the direction of the axis of rotation of the cylindrical conductive substrate. The coated sample No. It was confirmed that any of 502 to 505 and 508 to 511 showed excellent performance in resin layer thickness uniformity, fine line reproducibility, and fog density. The effectiveness of the present invention was confirmed.

Example 6
As a developing roller, a developing roller having the configuration of the first resin layer, the second resin layer, and the third resin layer shown in FIG. 2 was produced by the method described below.

(Preparation of cylindrical conductive substrate)
The same columnar conductive substrate as in Example 1 was prepared.

(Formation of resin layer)
(Preparation of coating solution for forming the first resin layer)
The same first resin layer forming coating solution as the first resin layer forming coating solution prepared in Example 1 was prepared.

(Preparation of coating solution for forming second resin layer)
The same coating solution for forming the second resin layer as the coating solution for forming the second resin layer prepared in Example 1 was prepared.

(Preparation of coating solution for forming the third resin layer)
The same third resin layer forming coating solution as the third resin layer forming coating solution prepared in Example 1 was prepared.

(Application of first resin layer forming coating solution)
When applying the prepared coating liquid for forming the first resin layer to the peripheral surface of the prepared cylindrical conductive substrate, sample No. 1 in Example 1 was used except that the coating width was 100 mm. A cylindrical conductive substrate having a first resin layer having a thickness of 1 μm was prepared by applying the same coating conditions as those used to prepare 104. The application width of the ultrasonic atomizer was changed by changing the distance from the jet port of the ultrasonic atomizer to the surface of the photoreceptor.

(Application of coating solution for forming second resin layer)
When the prepared coating solution for forming the second resin layer was applied on the first resin layer of the cylindrical conductive substrate on which the first resin layer was prepared, the coating width was 100 mm except that the coating width was 100 mm. Sample No. A cylindrical conductive substrate having a second resin layer having a thickness of 10 μm was prepared by applying the same coating conditions as those used for manufacturing 104. The application width of the ultrasonic atomizer was changed by changing the distance from the jet port of the ultrasonic atomizer to the surface of the photoreceptor.

(Application of third resin layer forming coating solution)
When applying the prepared coating solution for forming the third resin layer on the second resin layer of the cylindrical conductive substrate on which the prepared second resin layer is formed, the coating width is changed as shown in Table 11 to apply. Except that, the sample No. of Example 1 was changed. The sample was applied under the same application conditions as when producing No. 104, and a developing roller having a thickness of 5 μm was produced. 601 to 606. The application width of the ultrasonic atomizer was changed by changing the distance from the jet port of the ultrasonic atomizer to the surface of the photoreceptor.

Evaluation The produced sample No. Table 11 shows the results of 601 to 606, in which the resin layer thickness uniformity, fine line reproducibility, fog, and image density were tested in the same manner as in Example 1 and evaluated with the same evaluation rank as in Example 1.

  When an ultrasonic atomizer is used to apply the resin layer forming coating solution to the coated surface of the cylindrical conductive substrate, the coating thickness of the ultrasonic atomizer is 5 mm to 200 mm. It was confirmed that it showed excellent performance in stability and durability. The effectiveness of the present invention was confirmed.

Example 7
As a developing roller, a developing roller having the configuration of the first resin layer, the second resin layer, and the third resin layer shown in FIG. 2 was produced by the method described below.

(Preparation of cylindrical conductive substrate)
The same columnar conductive substrate as in Example 1 was prepared.

(Formation of resin layer)
(Preparation of coating solution for forming the first resin layer)
The same first resin layer forming coating solution as the first resin layer forming coating solution prepared in Example 1 was prepared.

(Preparation of coating solution for forming second resin layer)
The same coating solution for forming the second resin layer as the coating solution for forming the second resin layer prepared in Example 1 was prepared.

(Preparation of coating solution for forming the third resin layer)
The same third resin layer forming coating solution as the third resin layer forming coating solution prepared in Example 1 was prepared.

(Application of first resin layer forming coating solution)
When the prepared coating solution for forming the first resin layer was applied to the surface of the prepared cylindrical conductive substrate, the sample No. 1 in Example 1 was used except that the spray amount was 5 ml / min. A cylindrical conductive substrate having a first resin layer having a thickness of 1 μm was prepared by applying the same coating conditions as those used to prepare 104.

(Application of coating solution for forming second resin layer)
When the prepared coating solution for forming the second resin layer was applied on the first resin layer of the cylindrical conductive substrate on which the first resin layer was prepared, the spray amount was set to 10 ml / min. Sample No. 1 of Example 1 A cylindrical conductive substrate having a second resin layer having a thickness of 10 μm was prepared by applying the same coating conditions as those used for manufacturing 104.

(Application of third resin layer forming coating solution)
When the prepared coating solution for forming the third resin layer is applied onto the second resin layer of the cylindrical conductive substrate on which the second resin layer is prepared, the spray amount is changed as shown in Table 12 to change the thickness. A third resin layer having a thickness of 5 μm was formed to produce a developing roller. 701 to 707. The other conditions were the same as the sample No. 1 in Example 1. It apply | coated on the same application | coating conditions as the time of producing 104.

Evaluation The produced sample No. Table 12 shows the results of 701 to 707, in which the resin layer thickness uniformity, fine line reproducibility, fog and image density were tested in the same manner as in Example 1 and evaluated with the same evaluation rank as in Example 1.

  When applying the coating solution for resin layer formation using an ultrasonic atomizer and setting the distance between the jet nozzle and the coated surface of the cylindrical conductive substrate to 50 mm of the present invention, the spray amount of the ultrasonic atomizer is reduced from 2 ml / min. It was confirmed that any film with 350 ml / min showed excellent performance in film thickness stability, surface roughness stability, and durability. The effectiveness of the present invention was confirmed.

1 Full-color image forming apparatus 10Y, 10M, 10C, 10K Image forming unit 1Y, 1M, 1C, 1K Photosensitive member 4Y1, 4M1, 4C1, 4K1 Developing roller 4Y1a, 4Y'1a, 10 Conductive substrate 4Y1a1, 4Y'1b First Resin layer 4Y1a2, 4Y′1c Second resin layer 4Y1a3, 4Y′1d Third resin layer 7 Endless belt-like intermediate transfer body forming unit 70 Intermediate transfer belt 9 Manufacturing process 9a Holding portion 9b Application portion 9b1 Application device 9b11 Application liquid supply tube 9b2 Drive unit

Claims (7)

In the manufacturing method of the developing roller having a resin layer for supplying the developer to the electrophotographic photosensitive member on the peripheral surface of the conductive substrate,
Using an ultrasonic atomizer for the resin layer forming coating solution for forming the resin layer,
Production of a developing roller, wherein the resin layer forming coating solution is applied to the conductive substrate coating surface at a distance of 20 mm to 300 mm between the spray port of the ultrasonic atomizer and the coating surface of the conductive substrate. Method.   The method for producing a developing roller according to claim 1, wherein a solid content concentration of the coating liquid for forming a resin layer is 3% by mass to 8% by mass.   The method for producing a developing roller according to claim 1, wherein the resin layer forming coating solution has a viscosity of 2 mPa · s to 50 mPa · s.   When applying the coating liquid for forming the resin layer on the coated surface of the conductive substrate, the ultrasonic atomizer is applied per second while rotating the conductive substrate at a peripheral speed of 600 mm / min to 2000 mm / min. 4. The coating according to claim 1, wherein a length corresponding to 50% to 90% of the coating width by the ultrasonic atomizer is applied while moving in a direction parallel to the rotation axis of the conductive substrate. A method for producing a developing roller according to claim 1.   When applying the coating liquid for forming the resin layer on the coating surface of the conductive substrate, the ultrasonic atomizer is fixed, the conductive substrate is rotated at a peripheral speed of 600 mm / min to 2000 mm / min, and While maintaining a constant distance from the spraying opening of the ultrasonic atomizer to the coating surface of the conductive substrate, the conductive substrate is applied to the conductive substrate at a length corresponding to 50% to 90% of the coating width by the ultrasonic atomizer per second. The method for producing a developing roller according to any one of claims 1 to 3, wherein the coating is applied while moving in the width direction of the conductive substrate.   The method for producing a developing roller according to claim 1, wherein a coating width of the ultrasonic atomizer is 5 mm to 200 mm.   The method for producing a developing roller according to any one of claims 1 to 6, wherein a spray amount of the resin layer forming coating liquid of the ultrasonic atomizer is 2 ml / min to 350 ml / min.

Images