JP2011104844A - Method of manufacturing wafer level lens - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wafer level lens array by which the adhesion of a resin material to a transferring surface of a mold is kept even in the shrinkage due to the curing of the resin material, the shape of the transferring surface of the mold is precisely transferred and the distance between the lenses is precisely secured. <P>SOLUTION: The method of manufacturing the wafer level lens array having a plurality of lens parts arranged one-dimensionally or two-dimensionally and a substrate part 1 for connecting the lens parts to each other in which the lens parts and the substrate part 1 are integrally formed with the resin material, has a first curing step and a second curing step in this order. In the first curing step, the resin material is arranged between the transferring surface of a first mold 102 conformed to a surface of one side of the lens array and the transferring surface of a second mold 104 conformed to a surface of opposite side of the lens array and the resin material of the lens part is cured. In the second curing step, the resin material of the substrate part including the substrate part is cured. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a wafer level lens.

  Currently, portable terminals of electronic devices such as mobile phones and PDAs (Personal Digital Assistants) are equipped with small and thin imaging units. Such an imaging unit generally includes a solid-state imaging device such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) image sensor, a lens for forming a subject image on the solid-state imaging device, It has.

  With the downsizing and thinning of portable terminals, there is a demand for downsizing and thinning of imaging units. Moreover, in order to reduce the cost of the portable terminal, it is desired to increase the efficiency of the manufacturing process. As a method for manufacturing such a small and large number of lenses, a lens module is manufactured by manufacturing a wafer level lens having a configuration in which a plurality of lenses are molded on a substrate, and cutting the substrate to separate each of the plurality of lenses. A method for mass production is known.

  In addition, the imaging unit is obtained by integrally combining a substrate on which a plurality of lenses are formed and a sensor substrate on which a plurality of solid-state imaging elements are formed, and cutting the sensor substrate together with the substrate so as to include the lens and the solid-state imaging elements as a set. There are known methods for mass production.

  Conventional wafer level lenses include those shown in the following patent documents, for example.

  Patent Document 1 describes a configuration of a multilayer wafer level lens in which substrates on which a plurality of lenses are molded are overlapped.

  Patent Document 2 describes a method of supplying a molding material onto a substrate and molding a lens on the substrate using a mold.

In addition to the wafer level lens described above, a microlens array having a configuration that is not integral with the substrate is known as having a plurality of lenses.
For example, Patent Document 3 eliminates the need for a mold by pressing and curing a resin layer formed on one side of a substrate to a substrate with holes.
Further, in Patent Document 4, in manufacturing a microlens array having a two-layer structure, the first layer is formed first, and the second layer is cured with light transmitted through the first layer. A technique for aligning the optical axis is described.

JP 2005-539276 A International Publication No. 07/1007025 JP 7-248404 A JP 2003-294912 A

When a lens made of a resin material is formed using a mold, the resin material generally contracts in the process of curing, and residual stress is generated due to regulation with the mold, causing contraction of the molded body. When the resin material shrinks, the shape of the transfer surface with the mold is not accurately transferred to the resin material, and there is a concern that, for example, the optical characteristics of the lens portion made of the resin material will deteriorate.
In the case of a wafer level lens, one lens unit is configured by bonding a plurality of wafers. At that time, if the reproducibility of the distance (pitch) between the lenses in each wafer surface is good, the optical axis of each unit will be the same every time, but if the distance between the lenses in the surface varies, Since the axis varies, it causes variations in optical performance within the surface. As a result, the number of units satisfying the optical characteristics is reduced, which causes a reduction in yield.
The present invention accurately forms each lens portion of a molded article having a plurality of lens portions made of a resin material arranged one-dimensionally or two-dimensionally, and accurately forms a distance between the plurality of lens portions. For the purpose.

The present invention is a method for manufacturing a wafer level lens array, in which a wafer level lens array comprising a substrate portion and a plurality of lens portions arranged on the substrate portion is integrally molded with an energy curable resin,
Supplying the resin between a pair of mold members;
A first curing step of molding and curing the resin by applying energy only to the resin to be the lens portion in a state where the resin is sandwiched between the pair of mold members;
And a second curing step in which the resin is molded and cured by applying energy to the resin in a region including at least the substrate portion.

The manufacturing method of this invention includes the process of hardening the resin material of a lens part ahead of a board | substrate part. As a result, even if the resin material of the lens portion is cured and contracted, the resin material can flow from the uncured substrate portion, so that the residual stress on the lens surface is reduced and the transfer accuracy of the lens shape is improved. it can. According to this method, unlike injection molding, it is not necessary to supply additional resin in anticipation of curing shrinkage, and a high-precision lens can be molded easily.
Further, since the lens portion is cured first and the fluidity of the lens portion is lowered, the residual stress in the lens array surface is dispersed, and the distance between the lenses can be made uniform with high accuracy.

  According to the method for manufacturing a wafer level lens array of the present invention, the close contact between the transfer surface of the mold and the resin material is maintained even when the resin material shrinks due to curing, and the shape of the transfer surface of the mold is accurately transferred. . Further, since the residual stress in the resin is distributed in the plane, the distance accuracy between the lens portions is maintained. Thereby, the lens part and lens connection part which consist of resin materials can be formed accurately.

It is a top view which shows an example of a structure of a wafer level lens array. FIG. 2 is a cross-sectional view taken along line AA of the configuration of the wafer level lens array shown in FIG. 1. It is sectional drawing which shows an example of a structure of a lens module. It is sectional drawing which shows an example of a structure of an imaging unit. It is a figure which shows the structural example of the shaping | molding die for shape | molding a lens on the board | substrate of a wafer level lens array. It is a figure explaining the process of shape | molding a wafer level lens array with a shaping | molding die. It is a flowchart which shows the procedure of the manufacturing method of a wafer level lens set. It is a figure explaining the process of releasing a wafer level lens array from a shaping | molding die. It is a figure which shows the other structural example of a board | substrate part. 10A and 10B are diagrams illustrating a process of dicing the wafer level lens array. 11A and 11B are diagrams illustrating a procedure of a method for manufacturing a lens module. It is a figure which shows another example of the procedure which manufactures a lens module. 13A and 13B are diagrams illustrating a procedure for manufacturing the imaging unit. 14A and 14B are diagrams illustrating another example of a procedure for manufacturing the imaging unit. It is a figure which shows an exposure mask. 16A and 16B are diagrams showing first and second curing steps by exposure. 17A and 17B are diagrams showing first and second curing steps by heating. It is a figure which shows the pitch between the lenses on the array evaluated in the Example. 19A to 19C are conceptual diagrams showing resin flow and stress in the curing step.

Hereinafter, the best mode for carrying out the present invention will be described.
First, the configuration of the wafer level lens array, the lens module, and the imaging unit will be described.
FIG. 1 is a plan view showing an example of the configuration of a wafer level lens array. FIG. 2 is a cross-sectional view taken along line AA of the configuration of the wafer level lens array shown in FIG.
The wafer level lens array includes a substrate unit 1 and a plurality of lens units 10 arranged on the substrate unit 1. The plurality of lens units 10 are arranged one-dimensionally or two-dimensionally with respect to the substrate unit 1. In this configuration example, as illustrated in FIG. 1, a configuration in which a plurality of lens units 10 are two-dimensionally arranged with respect to the substrate unit 1 will be described as an example. The lens unit 10 is made of the same material as the substrate unit 1 and is integrally formed with the substrate unit 1. The shape of the lens unit 10 is not particularly limited, and can be appropriately changed depending on the application. The resin having substantially the same optical characteristics means a resin that has substantially the same optical characteristics when the resin of the substrate unit 1 and the lens unit 10 is cured. Here, substantially equivalent optical characteristics are those in which the difference in refractive index (nd) is 0.01 or less and the difference in Abbe number (νd) is 5 or less. The difference in refractive index (nd) is more preferably 0.005 or less, still more preferably 0.003 or less, and most preferably 0. The difference in Abbe number (νd) is more preferably 2 or less, still more preferably 1 or less, and most preferably 0.
The lens part has a predetermined lens surface formed on both sides. The shape of the lens back and front may be the same or different. The lens shape is not limited to a convex spherical surface, and may be a concave spherical surface or an aspherical surface, and various combinations of convex or concave spherical surfaces or aspherical surfaces can be used. In the present proposal, since the resin material is integrally formed, it is possible to adopt a lens shape that is embedded in the thickness of the substrate portion, and the degree of freedom in lens design is increased.

FIG. 3 is a cross-sectional view showing an example of the configuration of the lens module.
The lens module includes a substrate unit 1 and a lens unit 10 formed integrally with the substrate unit 1. For example, the substrate unit 1 of the wafer level lens array shown in FIGS. 1 and 2 is diced. Those separated for each lens unit 10 are used. A spacer 2 is provided around the lens unit 10 on one surface of the substrate unit 1. The operation and configuration of the spacer 2 are the same as those of the imaging unit described below.

FIG. 4 is a cross-sectional view illustrating an example of the configuration of the imaging unit.
The imaging unit includes the lens module described above and a sensor module. The lens unit 10 of the lens module forms a subject image on the solid-state imaging device D provided on the sensor module side. The substrate portion 1 of the lens module and the semiconductor substrate W of the sensor module are formed in a substantially rectangular shape in plan view so as to be substantially the same.

  The sensor module includes a semiconductor substrate W and a solid-state imaging device D provided on the semiconductor substrate W. The semiconductor substrate W is formed by cutting a wafer formed of a semiconductor material such as silicon into a substantially rectangular shape in plan view. The solid-state image sensor D is provided at a substantially central portion of the semiconductor substrate W. The solid-state image sensor D is, for example, a CCD image sensor or a CMOS image sensor. The sensor module can have a configuration in which a solid-state imaging device D that is made into a chip is bonded onto a semiconductor substrate on which wirings and the like are formed. Alternatively, the solid-state imaging device D is configured by repeating a well-known film forming process, photolithography process, etching process, impurity adding process, etc. on the semiconductor substrate W, and forming electrodes, insulating films, wirings, etc. on the semiconductor substrate. May be.

  The lens module has a substrate portion 1 superimposed on a semiconductor substrate W of the sensor module via a spacer 2. The spacer 2 of the lens module and the semiconductor substrate W of the sensor module are bonded using, for example, an adhesive. The spacer 2 is designed so that the lens unit 10 of the lens module forms a subject image on the solid-state imaging device D of the sensor module, and the lens unit 10 and the solid-state imaging so that the lens unit 10 does not contact the sensor module. It is formed with a thickness separating a predetermined distance from the element D.

  The shape of the spacer 2 is not particularly limited as long as the spacer 2 can maintain a positional relationship with a predetermined distance between the substrate portion 1 of the lens module and the semiconductor substrate W of the sensor module, and can be appropriately modified. For example, the spacer 2 may be a columnar member provided at each of the four corners of the substrate. Further, the spacer 2 may be a frame-shaped member that surrounds the solid-state imaging device D of the sensor module. If the solid-state image pickup device D is surrounded by the frame-shaped spacer 2 to be isolated from the outside, the solid-state image pickup device D can be shielded from light other than the light passing through the lens. Moreover, it can prevent that dust adheres to the solid-state image sensor D by sealing the solid-state image sensor D from the outside.

  The lens module shown in FIG. 3 is configured to include one substrate unit 1 on which the lens unit 10 is formed, but may be configured to include a plurality of substrate units 1 on which the lens unit 10 is formed. At this time, the substrate portions 1 that are overlapped with each other are assembled together via the spacer 2.

  The imaging unit may be configured by joining a sensor module via a spacer 2 to the lowermost substrate portion 1 of the lens module including a plurality of substrate portions 1 on which the lens portions 10 are formed. A lens module including a plurality of substrate units 1 on which the lens unit 10 is formed and a method for manufacturing an imaging unit including the lens module will be described later.

  The imaging unit configured as described above is reflow-mounted on a circuit board (not shown) built in a portable terminal or the like. The circuit board is preliminarily printed with paste-like solder at a position where the imaging unit is mounted, and the imaging unit is mounted on the circuit board. The circuit board including the imaging unit is irradiated with infrared rays or hot air is blown. Heat treatment is performed, and the imaging unit is welded to the circuit board.

Next, a manufacturing method of the wafer level lens array will be described in detail.
FIG. 5 is a diagram illustrating a configuration example of a molding die for integrally molding the substrate portion and the lens portion of the wafer level lens array. FIG. 5 shows the mold open state of the mold. FIG. 6 shows a process of molding a wafer level lens array using the mold of FIG. FIG. 6 shows the mold closed state of the mold.

As shown in FIGS. 5 and 6, the molding die of this configuration example includes an upper die 12 and a lower die 14. By sandwiching a material such as a resin constituting the lens unit 10 and the substrate unit 1 between the upper mold 12 and the lower mold 14, the lens unit and the substrate unit having a predetermined shape are integrally formed.
At least one of the wafer level lens arrays constituting the wafer level lens set of the present invention is a monolithic type wafer level lens array obtained by integrally molding a substrate portion and the substrate portion with a resin composition to be described later. A lens is not formed on the molded substrate portion, but a resin composition having fluidity is poured into a mold, and the substrate portion and the lens portion are molded at the same time.

  In the upper mold 12, the surface on the side facing the lower mold 14 is equivalent to a region other than the concave portion 12 a for transferring the upper shape of the lens unit 10 and the region in the substrate unit 1 where the lens unit 10 is molded. And a flat portion 12b for transferring the flat shape to be transferred.

  In the lower mold 14, the surface on the side facing the upper mold 12 is provided with a recess 14 a for transferring the shape of the lower side of the lens unit 10 and a region other than the region where the lens unit 10 is molded in the substrate unit 1. A flat portion 14b for transferring a corresponding flat shape is provided.

  Here, “upper” and “lower” only indicate the positional relationship in the drawing explaining this configuration example. For example, the positional relationship may be switched up and down. That is, in the molding die, when one of the upper die 12 and the lower die 14 is the first die and the other is the second die, the first die and the second die can be in the closed state and the open state. If possible, their positional relationship is not particularly limited.

  The upper mold 12 and the lower mold 14 can be relatively moved between the position of the mold closed state and the position of the mold open state, respectively. That is, it is possible to move at least one of the upper mold 12 and the lower mold 14 in a method of approaching and moving away from the other.

  The mold open state is a state in which the upper mold 12 and the lower mold 14 are separated by a certain distance. The mold closed state means that the upper mold 12 and the lower mold 14 are close to each other, and a predetermined pressure is applied to the molded article sandwiched between the upper mold 12 and the lower mold 14. Is in a state of being completely adhered.

  As shown in FIG. 6, the shape of the lens portion 10 is defined by the concave portion 12a of the upper die 12 and the concave portion 14a of the lower die 14 when the mold is in the closed state. The types of the upper mold 12 and the lower mold 14 of the mold may be appropriately changed according to the change in the shape of the lens unit 10 to be molded.

In the case where an ultraviolet curable resin is used as the material of the lens portion, at least one of the upper mold 12 and the lower mold 14 located on the side irradiated with the ultraviolet light is made transparent to the ultraviolet light. Moreover, the board | substrate part 1 may be the material which permeate | transmits an ultraviolet-ray.
When a thermosetting resin is used as the material of the lens portion, the substrate portion 1 may be heated together with the upper die 12 and the lower die 14 in an oven or the like, and at least one of the upper die 12 and the lower die 14 is a hot plate. You may heat by etc. When using a thermosetting resin, the mold is preferably made of a material having high thermal conductivity, for example, metal.

  Next, the procedure of the wafer level lens manufacturing method will be described with reference to FIG. In the following description, the configurations of the mold and the wafer level lens shown in FIGS. 5 and 6 will be referred to as appropriate.

First, the upper mold 12 and the lower mold 14 are opened, and material is injected (step S1).
Here, a thermosetting resin is used as the material.

  After injecting the material, a predetermined pressure is applied to the material by closing the upper die 12 and the lower die 14 (step S2).

  Next, the material is cured by heating while maintaining a state where a predetermined pressure is applied to the material (step S3). As a means for heating the material, for example, at least one of the upper mold 12 and the lower mold 14 is made of a metal material having good thermal conductivity, and the upper mold 12 and the lower mold 14 are heated by a heating unit such as a heater. Heat may be applied to the material.

Further, since the molded product shrinks when cured, the pressure applied to the molded product by the upper mold 12 and the lower mold 14 may be adjusted according to the amount of shrinkage. Specifically, the pair of mold members at the same time as at least one of the first curing step and the second curing step described later, or between the first curing step and the second curing step. It is preferable to apply a pressure to the resin with a small interval.
The pressure is appropriately adjusted in view of the balance between the transfer accuracy of the lens shape and mechanical breakage (cracking) of the lens, but is generally 100 kgf to 600 kgf, preferably 300 to 450 kgf.

  After curing, the upper mold 12 and the lower mold 14 are opened (step S4). In this configuration example, it is assumed that the upper mold 12 is easier to release the wafer level lens than the lower mold 14, and therefore can be released according to the mold opening operation.

  Next, the wafer level lens is released from the lower mold 14 (step S5).

FIG. 8 shows an example of means for releasing the wafer level lens. In the example of FIG. 8, the suction part 32 is attracted to the upper surface of the wafer level lens and pulled upward to release the wafer level lens from the lower mold 1 and take it out from between the molds.
For example, the suction unit 32 is configured to adhere to the upper surface of the wafer level lens by performing air suction to generate a negative pressure. A plurality of suction units 32 are provided for one wafer level lens, and each suction unit 32 is disposed so as to be in close contact with a flat region other than the region where the lens unit 10 is formed in the wafer level lens. Since the suction part 32 does not come into contact with the lens part 10, it is possible to avoid the occurrence of damage such as deformation.
The wafer level lens can be released from the lower mold 12 by lifting the wafer level lens upward in a state where the plurality of suction portions 32 are in close contact with the upper surface of the wafer level lens.
In this way, a wafer level lens integrally molded by the upper mold 12 and the lower mold 14 can be obtained.

  FIG. 9 is a diagram illustrating another configuration example of the substrate unit 1. As shown in FIG. 9, the substrate portion 1 may be provided with a rib 14 formed to be thick in order to prevent warpage of the substrate portion 1 in a region excluding a portion where the lens portion 10 is molded. . By doing so, the rigidity of the substrate portion 1 at the position where the rib is provided is increased, so that it is possible to prevent warping. The ribs 14 can be formed in a lattice shape, a radial shape, or an annular shape on the surface of the substrate portion 1. The shape of the rib 14 is not particularly limited.

Spacers 12 for overlapping with other members may be provided in a region excluding the part where the lens unit 10 of the substrate unit 1 is molded. Other members include, for example, other wafer level lens arrays and semiconductor substrates. By doing so, it is possible to omit the step of providing a separate spacer in order to superimpose the wafer level lens array on another wafer level lens array or a semiconductor substrate.
The spacer 12 may be separately attached with a material made of another material different from the substrate unit 1 and the lens unit 10.

  Next, a procedure for manufacturing a lens module and an imaging unit using the wafer level lens array will be described.

10A and 10B are diagrams illustrating a process of dicing the wafer level lens array. A spacer 12 is integrally provided on one surface (the lower surface in the figure) of the substrate unit 1 of the wafer level lens array.
As shown in FIG. 10B, alignment is performed between the substrate unit 1 of the wafer level lens array and the semiconductor substrate W formed like a wafer in the same manner as the substrate unit 1. On one surface (the upper surface in the figure) of the semiconductor substrate W, the solid-state imaging device D is provided in the same arrangement as the arrangement of the plurality of lens units 10 provided on the substrate unit 1. Then, the substrate portion 1 of the wafer level lens array is superimposed on the semiconductor substrate W formed in a wafer shape similarly to the substrate portion 1 via the spacer 12 (see FIG. 14), and is integrally bonded. Thereafter, the integrated wafer level lens array and the semiconductor substrate W are cut using a cutting means such as a blade C along a cutting line defined between the arrays of the lens unit 10 and the solid-state imaging device D. And separated into a plurality of imaging units. The cutting line is, for example, in a lattice shape in plan view of the substrate unit 1.

  In this example, the description is given by taking an example of dicing when an imaging unit is manufactured. On the other hand, the dicing when manufacturing the lens module is not bonded to the semiconductor substrate W, but is cut according to the arrangement of the lens portions 10 and separated into a plurality of lens modules.

  11A and 11B are diagrams illustrating a procedure of a method for manufacturing a lens module. In this procedure, an example will be described in which a wafer level lens array in which a plurality of lens portions 10 are integrally formed on one substrate portion 1 is diced and separated into a plurality of lens modules.

  First, as shown in FIG. 11A, a wafer level lens array is prepared. The wafer level lens array can be manufactured by the procedure described above, and in the following description, the procedure is omitted without being described.

Next, as shown in FIG. 11B, the substrate unit 1 of the wafer level lens array is cut along a cutting line indicated by a dotted line in the drawing, and separated into a plurality of lens modules. At this time, the spacers 12 positioned on each cutting line are also cut simultaneously. The spacer 12 is divided with each cutting line as a boundary, and is attached to each lens module adjacent to each cutting line.
Thus, the lens module is completed.

  Note that the separated lens module may be assembled to a substrate including a sensor module (not shown) and other optical elements via the spacer 12.

  As described above, if the spacer 12 is integrally formed in advance on the substrate unit 1 of the wafer level lens array, and then the substrate unit 1 of the wafer level lens array is cut together with the spacer 12 in the dicing process, the separated lens module is obtained. As compared with the case where the spacers 12 are bonded to each other, the lens module can be mass-produced more efficiently and the productivity can be improved.

  FIG. 12 is a diagram illustrating another example of a procedure for manufacturing a lens module. In this procedure, an example will be described in which two substrate portions 1 and a wafer level lens array in which a plurality of lens portions 10 are integrally formed on each substrate portion 1 are diced and separated into a plurality of lens modules.

  First, as shown in FIG. 12, a plurality of wafer level lens arrays are prepared. The wafer level lens array can be manufactured by the procedure described above, and in the following description, the procedure is omitted without being described. A spacer 12 is formed on one surface of each substrate portion 1 of the plurality of wafer level lens arrays. Then, the substrate portions 1 of the wafer level lens array to be overlaid are aligned with each other, and the lower surface of the substrate portion 1 of the wafer level lens array to be overlaid is placed on the upper surface of the substrate portion 1 of the wafer level lens array to be placed below the spacer. 12 is joined. In a state where the wafer level lens arrays are overlapped with each other, the position of the spacer 12 with respect to each substrate unit 1 is set to be the same in each substrate unit 1.

  And the board | substrate part 1 of a wafer level lens array is cut | disconnected along the cutting line shown with a dotted line in a figure, and is isolate | separated into a some lens module. At this time, the spacers 12 at the overlapping positions on the respective cutting lines are also cut at the same time, and the spacers 12 divided with the respective cutting lines as boundaries are attached to the lens modules adjacent to the respective cutting lines. Thus, a lens module including a plurality of lens units 10 is completed. In this procedure, since the positions of the lens unit 10 and the spacer 12 with respect to the respective substrate units 1 to be overlaid are the same, the configurations of the plurality of separated lens modules are all the same. Further, the position of the cutting line may be determined based on the uppermost substrate portion 1 among the respective substrate portions 1 to be overlapped and cut.

  Note that the separated lens module may be assembled to a substrate including a sensor module (not shown) and other optical elements via the spacer 12.

  In this way, if a plurality of wafer level lens arrays are overlapped, and then the substrate part 1 of the wafer level lens array is cut together with the spacers 2 in the dicing process, compared to the case where the separated lens modules are individually overlapped. Thus, the lens module can be mass-produced efficiently, and the productivity is improved.

  13A and 13B are diagrams illustrating a procedure for manufacturing the imaging unit. In this procedure, an example will be described in which a single substrate unit 1 and a lens module in which a plurality of lens units 10 are integrally formed on the substrate unit 1 are joined to a sensor module and diced to be separated into a plurality of imaging units.

  First, as shown in FIG. 13A, a wafer level lens array is prepared. The wafer level lens array can be manufactured by the procedure described above, and in the following description, the procedure is omitted without being described. A spacer 12 is integrally formed on the lower surface of the substrate unit 1.

  Next, a semiconductor substrate W on which a plurality of solid-state imaging elements D are arranged is prepared. After aligning the substrate unit 1 of the wafer level lens array with the semiconductor substrate W, the substrate unit 1 is bonded to the upper surface of the semiconductor substrate W via the spacer 12. At this time, the extension of the optical axis of each lens unit 10 provided on the substrate unit 1 intersects with the central part of the solid-state imaging device D.

  Then, as shown in FIG. 13B, after bonding the substrate unit 1 of the wafer level lens array and the semiconductor substrate W, the substrate unit 1 is cut along a cutting line indicated by a dotted line in the drawing, and a plurality of imaging units To separate. At this time, the spacers 12 positioned on each cutting line are also cut simultaneously. The spacer 12 is divided with each cutting line as a boundary, and is attached to each imaging unit adjacent to each cutting line. Thus, the imaging unit is completed.

  In this way, the spacer 12 is formed in advance on the wafer level lens array, and then the substrate of the wafer level lens array and the semiconductor substrate W provided with the solid-state imaging device D are overlapped to form the substrate unit 1 and the semiconductor substrate W. Can be mass-produced and produced more efficiently than in the case of manufacturing the imaging unit by joining the sensor module to the separated lens modules via the spacers 12, respectively. Can be improved.

  14A and 14B are diagrams illustrating another example of a procedure for manufacturing an imaging unit. In this procedure, two substrate portions 1 and a wafer level lens array in which a plurality of lens portions 10 are integrally formed on each substrate portion 1 are bonded to a semiconductor substrate provided with a solid-state imaging device, and each is dized. An example of separation into a plurality of imaging units including one lens unit 10 will be described.

  First, as shown in FIG. 14A, two wafer level lens arrays are prepared. The wafer level lens array can be manufactured by the procedure described above, and in the following description, the procedure is omitted without being described. A spacer 12 is formed in advance on the lower surface of each of the two substrate portions 1 to be superimposed. Then, the substrate portions 1 of the wafer level lens array to be superimposed are aligned with each other, and the lower surface of the substrate portion 1 of the wafer level lens array disposed above is placed on the upper surface of the substrate portion 1 of the wafer level lens array disposed below. , And joined through the spacer 12. In a state where the wafer level lens arrays are overlapped with each other, the position of the spacer 12 with respect to each substrate unit 1 is set to be the same in each substrate unit 1.

  Next, a semiconductor substrate W on which a plurality of solid-state imaging elements D are arranged is prepared. The alignment of the semiconductor substrate W with the substrate portions 1 of the plurality of wafer level lens arrays in a superposed state is performed. Thereafter, the substrate portion 1 located at the bottom is bonded to the upper surface of the semiconductor substrate W via the spacer 2. At this time, the extension of the optical axis of each lens unit 10 provided on the substrate unit 1 intersects with the central part of the solid-state imaging device D.

  Then, as shown in FIG. 14B, after bonding the substrate unit 1 of the wafer level lens array and the semiconductor substrate W, the substrate unit 1 and the semiconductor substrate W are cut along a cutting line indicated by a dotted line in the drawing, Separated into a plurality of imaging units. At this time, the spacers 12 positioned on each cutting line are also cut simultaneously. The spacer 12 is divided with each cutting line as a boundary, and is attached to each imaging unit adjacent to each cutting line. In this way, an imaging unit including a plurality of lens units 10 is completed.

  In this way, a plurality of wafer level lens arrays are bonded to each other via the spacer 12, and then, the substrate portion 1 of the lowermost wafer level lens array and the semiconductor substrate W including the solid-state imaging device D are overlapped. The substrate portion 1 and the semiconductor substrate W are cut together in a dicing process. According to such a procedure, the separated lens modules are overlapped with each other, and further, the image pickup units are more efficiently compared with the case of manufacturing each image pickup unit by joining the lens modules and the sensor modules. Mass production is possible and productivity can be improved.

<Resin material>
In the wafer level lens, the lens portion and the substrate portion are integrally formed of a light transmissive resin material.
The resin material for forming the lens part and the substrate part preferably has at least one of photocuring and thermosetting, such as thermosetting epoxy resin and acrylic resin, or photocurable epoxy resin, Acrylic resins or mixtures thereof can be used.

  As the resin material, for example, an energy curable resin composition can be suitably used. The energy curable resin composition may be either a resin composition that is cured by heat or a resin composition that is cured by irradiation with active energy rays (for example, ultraviolet rays or electron beams). The resin material is also preferably a resin having thermosetting properties as well as active energy ray curable properties.

  The resin material preferably has an appropriate fluidity before curing from the viewpoint of moldability, such as mold shape transfer suitability. Specifically, it is liquid at room temperature and has a viscosity of about 1000 to 50000 mPa · s.

  Moreover, it is preferable that the resin material has heat resistance enough to prevent thermal deformation even after the reflow process after curing. From this viewpoint, the glass transition temperature of the cured product is preferably 200 ° C. or higher, more preferably 250 ° C. or higher, and particularly preferably 300 ° C. or higher. In order to impart such high heat resistance to the resin material, it is necessary to constrain the mobility at the molecular level, and effective means include (1) means for increasing the crosslinking density per unit volume, ( 2) Means utilizing a resin having a rigid ring structure (for example, alicyclic structures such as cyclohexane, norbornane, tetracyclododecane, aromatic ring structures such as benzene and naphthalene, cardo structures such as 9,9′-biphenylfluorene, spirobiindane Resins having a spiro structure such as JP-A-9-137043, JP-A-10-67970, JP-A-2003-55316, JP-A-2007-334018, and JP-A-2007-238883. (3) means for uniformly dispersing a substance having a high Tg such as inorganic fine particles (for example, JP-A-5-2090) 27, 10-298265, etc.). A plurality of these means may be used in combination, and it is preferable to make adjustments within a range that does not impair other characteristics such as fluidity, shrinkage rate, and refractive index characteristics.

  The resin material is preferably a resin composition having a small volume shrinkage due to the curing reaction from the viewpoint of shape transfer accuracy. The curing shrinkage rate of the resin composition is preferably 10% or less, more preferably 5% or less, and particularly preferably 3% or less. Examples of the resin composition having a low curing shrinkage rate include (1) resin compositions containing a high molecular weight curing agent (such as a prepolymer) (for example, JP-A Nos. 2001-19740, 2004-302293, and 2007-). The number average molecular weight of the high molecular weight curing agent is preferably in the range of 200 to 100,000, more preferably in the range of 500 to 50,000, and particularly preferably in the range of 1,000 to 20, as described in Japanese Patent No. 211247. The value calculated by the number average molecular weight of the curing agent / the number of curing reactive groups is preferably in the range of 50 to 10,000, and in the range of 100 to 5,000. More preferably, it is particularly preferably in the range of 200 to 3,000.), (2) Resins containing non-reactive substances (organic / inorganic fine particles, non-reactive resins, etc.) Composition (for example, described in JP-A-6-298883, JP-A-2001-247793, JP-A-2006-225434, etc.), (3) a resin composition containing a low shrinkage crosslinking reactive group (for example, ring-opening polymerization) Sex groups (for example, epoxy groups (for example, described in JP-A No. 2004-210932), oxetanyl groups (for example, described in JP-A No. 8-134405), episulfide groups (for example, JP-A No. 2002-105110) Etc.), cyclic carbonate groups (e.g. described in JP-A-7-62065 etc.), etc., ene / thiol curing groups (e.g. described in JP-A 2003-20334 etc.), hydrosilylation curing groups (e.g. (For example, described in JP-A-2005-15666), etc.), (4) rigid skeleton resins (fluorene, adamantane, isophorone, etc.) (5) Resin composition containing an interpenetrating network structure (so-called IPN structure) containing two types of monomers having different polymerizable groups (for example, described in JP-A-9-137043) For example, described in JP-A-2006-131868), (6) Resin composition containing an expansible substance (for example, described in JP-A-2004-2719, JP-A-2008-238417, etc.), etc. Can be suitably used in the present invention. In addition, it is preferable from the viewpoint of optimizing physical properties to use a plurality of curing shrinkage reducing means in combination (for example, a resin composition containing a prepolymer containing a ring-opening polymerizable group and fine particles).

  Moreover, the resin material is desired to be a mixture of two or more kinds of resins having different Abbe numbers. The resin on the high Abbe number side preferably has an Abbe number (νd) of 50 or more, more preferably 55 or more, and particularly preferably 60 or more. The refractive index (nd) is preferably 1.52 or more, more preferably 1.55 or more, and particularly preferably 1.57 or more. Such a resin is preferably an aliphatic resin, particularly a resin having an alicyclic structure (for example, a resin having a cyclic structure such as cyclohexane, norbornane, adamantane, tricyclodecane, tetracyclododecane, specifically, for example, JP-A-10-152551, JP-A-2002-212500, JP-A-2003-20334, JP-A-2004-210932, JP-2006-199790, JP-2007-2144, JP-2007-284650. And the resin described in JP-A-2008-105999. The resin on the low Abbe number side preferably has an Abbe number (νd) of 30 or less, more preferably 25 or less, and particularly preferably 20 or less. The refractive index (nd) is preferably 1.60 or more, more preferably 1.63 or more, and particularly preferably 1.65 or more. Such a resin is preferably a resin having an aromatic structure. For example, a resin having a structure such as 9,9′-diarylfluorene, naphthalene, benzothiazole, benzotriazole (specifically, for example, JP-A-60-38411). Publication No. 10-667977, No. 2002-47335, No. 2003-238848, No. 2004-83855, No. 2005-325331, No. 2007-238883, International Publication 2006. / 095610 publication, Japanese Patent No. 2537540 publication, etc.) are preferable.

  In the resin material, it is preferable to disperse the inorganic fine particles in the matrix in order to increase the refractive index or adjust the Abbe number. Examples of the inorganic fine particles include oxide fine particles, sulfide fine particles, selenide fine particles, and telluride fine particles. More specifically, for example, fine particles of zirconium oxide, titanium oxide, zinc oxide, tin oxide, niobium oxide, cerium oxide, aluminum oxide, lanthanum oxide, yttrium oxide, zinc sulfide, and the like can be given. In particular, it is preferable to disperse fine particles such as lanthanum oxide, aluminum oxide, and zirconium oxide for the high Abbe number resin, and titanium oxide, tin oxide, zirconium oxide, and the like for the low Abbe number resin. It is preferable to disperse the fine particles. The inorganic fine particles may be used alone or in combination of two or more. Moreover, the composite by several components may be sufficient. In addition, for various purposes such as reducing photocatalytic activity and water absorption, the inorganic fine particles are doped with different metals, the surface layer is coated with different metal oxides such as silica and alumina, silane coupling agents and titanate cups. The surface may be modified with a ring agent, an organic acid (carboxylic acid, sulfonic acid, phosphoric acid, phosphonic acid, etc.) or a dispersant having an organic acid group. The number average particle size of the inorganic fine particles is usually about 1 nm to 1000 nm, but if it is too small, the properties of the substance may change. If it is too large, the influence of Rayleigh scattering becomes remarkable, so 1 nm to 15 nm is preferable. 2 nm to 10 nm are more preferable, and 3 nm to 7 nm are particularly preferable. Further, it is desirable that the particle size distribution of the inorganic fine particles is narrow. There are various ways of defining such monodisperse particles. For example, a numerical value range as described in JP-A No. 2006-160992 applies to a preferable particle size distribution range. Here, the above-mentioned number average primary particle size can be measured by, for example, an X-ray diffraction (XRD) apparatus or a transmission electron microscope (TEM). The refractive index of the inorganic fine particles is preferably 1.90 to 3.00, more preferably 1.90 to 2.70, and more preferably 2.00 to 2.70 at 22 ° C. and a wavelength of 589 nm. It is particularly preferred that The content of the inorganic fine particles with respect to the resin is preferably 5% by mass or more, more preferably 10 to 70% by mass, and particularly preferably 30 to 60% by mass from the viewpoint of transparency and high refractive index.

  In order to uniformly disperse the fine particles in the resin material, for example, a dispersant containing a functional group having reactivity with the resin monomer forming the matrix (for example, described in Examples of JP-A-2007-238884), hydrophobic A block copolymer composed of a segment and a hydrophilic segment (for example, described in JP-A-2007-2111164), or a resin having a functional group capable of forming an arbitrary chemical bond with inorganic fine particles at the polymer terminal or side chain It is desirable to disperse the fine particles by using as appropriate (for example, described in JP-A-2007-238929, JP-A-2007-238930).

  In addition, additives such as known release agents such as silicone-based, fluorine-based, and long-chain alkyl group-containing compounds and antioxidants such as hindered phenols may be appropriately blended in the resin material.

  Moreover, a curing catalyst or an initiator can be mix | blended with a resin material as needed. Specifically, for example, a compound that accelerates a curing reaction (radical polymerization or ionic polymerization) by the action of heat or active energy rays described in JP-A-2005-92099 (paragraph numbers [0063] to [0070]) and the like. Can be mentioned. The amount of these curing reaction accelerators to be added varies depending on the type of catalyst and initiator, or the difference in the curing reactive site, and cannot be specified unconditionally, but in general, the total solid content of the curing reactive resin composition About 0.1-15 mass% is preferable with respect to a minute, and about 0.5-5 mass% is more preferable.

  The resin material can be produced by appropriately blending the above components. At this time, if other components can be dissolved in the liquid low molecular weight monomer (reactive diluent), etc., it is not necessary to add a separate solvent, but if this is not the case, use a solvent. A curable resin composition can be produced by dissolving each component. The solvent that can be used in the curable resin composition is not particularly limited as long as the composition is uniformly dissolved or dispersed without precipitation, and specifically, for example, Ketones (eg, acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.), esters (eg, ethyl acetate, butyl acetate, etc.), ethers (eg, tetrahydrofuran, 1,4-dioxane, etc.) Alcohols (eg, methanol, ethanol) Isopropyl alcohol, butanol, ethylene glycol, etc.), aromatic hydrocarbons (eg, toluene, xylene, etc.), water and the like. When the curable composition contains a solvent, it is preferable to perform a mold shape transfer operation after drying the solvent.

<Curing>
In the production method of the present invention,
A first curing step of molding and curing the resin by applying energy only to the resin to be the lens portion in a state where the resin is sandwiched between the pair of mold members;
Thereafter, a second curing step is performed in which the resin is molded and cured by applying energy to the resin in at least a portion including the substrate portion (preferably the entire surface of the wafer level lens array).

  The type of energy in the curing step is not limited, but it is preferable that energy rays such as ultraviolet rays or heat is applied.

When the curing step is performed by light, the light source may be visible light, infrared light, or ultraviolet light, but ultraviolet light is preferable from the energy of the effect and ease of handling, for example, a wavelength of 460 nm or less, preferably a wavelength of 410 to 190 nm, More preferably, light having a wavelength of 380 nm to 280 nm can be used.
The exposure is preferably performed through a mold member. Therefore, when using ultraviolet light, it is preferable to make at least the lens portion of the mold with a material transparent to light used for exposure such as quartz glass.

When the first curing step is performed with light, light is emitted only from the outside of at least one (usually any one) of the pair of mold members to a portion corresponding to the lens portion via an exposure mask or the like. Irradiation is preferred.
As a method of irradiating only the lens part, for example, the light source can be laser light, and only the lens part of the array can be irradiated (direct drawing), or exposure is performed through a mask that shields the substrate part. You can also.

It is also preferable to perform the first curing with light and the second curing with heat. In this case, a mold in which the lens portion is made of a transparent material and the substrate portion is made of an opaque material may be used.
FIG. 15 shows an exposure mask 111 having a hole 112 at a position corresponding to the lens. The exposure mask 111 is opaque to the exposure light source. The lens unit 112 may be a hole or a transparent member with respect to the exposure light source.
FIG. 16A is a conceptual diagram in which the first curing process is performed with ultraviolet light through the mask 111 using the mold members 102 and 104. The mask 111 represents a cross section taken along line BB of the mask 111 in FIG. Since the substrate portion is shielded by the mask 111, only the lens portion of the array 1 is exposed and the ultraviolet curing reaction proceeds.
FIG. 16B is a conceptual diagram in which the second curing step is performed with ultraviolet light. In this step, the entire surface of the array 1 is exposed without using a mask, and the substrate portion is also cured.

  When the curing step is performed by heat, a thermosetting resin is usually used. The amount of heat applied is appropriately set according to the curing temperature of the thermosetting resin.

When the first curing is performed by heat, in order to selectively cure the lens unit, for example, a heating unit (for example, a hot plate) can be brought into contact with only the lens unit. In addition, a heating unit in which the lens unit and the substrate unit are set to different temperatures can be used. Further, heating can be performed by sandwiching a heat insulating material between one of the lens portion and the substrate portion, or a mold member corresponding thereto.
In the first curing step, a heating part provided at a position corresponding to the arrangement pattern of the lens part is disposed outside one of the pair of mold members, and the heating part corresponds to the lens part. It is preferable to supply heat only to the part to be performed.
FIG. 17A is a conceptual diagram in which the first curing process is performed using hot plates 113 and 114 in which only the lens portion is in contact with the mold members 102 and 104. Only portions corresponding to the lens portions of the hot plates 113 and 114 are in contact with the mold member, and the thermosetting reaction proceeds only by the lens portions of the array 1.
FIG. 17B is a conceptual diagram in which the second curing step is performed by heat. In this step, since the hot plates 115 and 116 are in contact with the entire surfaces of the mold members 102 and 104, the entire surface of the array 1 is heated and the substrate portion is also cured. The heating means 115 and 116 are not limited to hot plates. For example, in the second curing step, the entire surface may be heated in an oven or the like while the entire array is sandwiched between mold members.
When both the first and second curing steps are performed by heat, the mold member does not need to be transparent as described above, and for example, a metal mold can be used.
When the first curing step is performed by temperature, it is preferable that the temperature conductivity is low between the lens portion of the mold member and the substrate portion. For example, a heat insulating portion is provided between the lens portion of the mold member and the substrate portion. A material having low thermal conductivity can be used for either the lens portion or the substrate portion (preferably the substrate portion) of the mold member.

  FIG. 19A is a conceptual diagram showing the flow of the resin material when the first curing process by ultraviolet light (UV) proceeds. By the exposure through the mask 111, only the lens part 121 is cured. At this time, the resin material is cured and shrunk, but at this point, the resin material of the substrate portion 122 is not cured, and thus has fluidity. A decrease in the volume of the portion 121 is suppressed.

FIG. 19B is a conceptual diagram showing internal stress generated in the lens array 120 when the entire surface is exposed to ultraviolet light and cured without first curing the lens portion. Since the resin shrinks when it hardens, internal stress is accumulated toward the center of the lens array as indicated by the arrow. There is concern that this internal stress may affect the variation in distance between lenses and the transfer accuracy of the lens shape.
FIG. 19C is a conceptual diagram showing internal stress generated in the lens array when only the lens portion is cured in the method of the present invention, that is, in the first curing step, and then the entire array is cured in the second curing step. It is. Although the resin is cured, the internal stress is relieved in the lens portion as the resin material flows from the substrate portion 122 as described above. In addition, although the internal stress remains in the substrate portion 122, the lens portion 121 is hardened first, so that the lens portion 121 becomes a fixed end, and the influence of the stress becomes relatively small. When the lens array is an optical element, the function of the lens is not affected even if the thickness of the substrate 121 is reduced. Therefore, the transfer accuracy of the lens shape and the uniformity of the distance between the lenses are improved.

  In the first curing, it is preferable that the lens portion is cured to some extent, and the whole is cured by the second curing. Specifically, it is preferable that after the curing reaction proceeds in the resin of 30% or more of the lens portion in the first curing, the whole is cured by moving to the second curing. More preferably, after the curing reaction of the lens portion has progressed by 50% or more in the first curing, it is preferable to shift to the second curing and cure the whole.

This specification discloses the following contents.
1.
A wafer level lens array manufacturing method in which a wafer level lens array comprising a substrate portion and a plurality of lens portions arranged on the substrate portion is integrally molded with an energy curable resin,
Supplying the resin between a pair of mold members;
A first curing step of molding and curing the resin by applying energy only to the resin to be the lens portion in a state where the resin is sandwiched between the pair of mold members;
And a second curing step in which the resin is molded and cured by applying energy to the resin in a region including at least the substrate portion.
2.
A manufacturing method of the wafer level lens array according to the above 1,
A method for producing a wafer level lens array, wherein the resin is a resin having at least one of thermosetting and photosetting.
3.
The method for producing a wafer level lens array according to 1 or 2,
In the first curing step, a method of manufacturing a wafer level lens array in which light is irradiated only to a portion corresponding to a lens portion from the outside of one of the pair of mold members.
4).
A method for producing a wafer level lens array as described in 3 above,
In the second curing step, a wafer level lens array manufacturing method for supplying heat to the entire wafer level lens array from the outside of one of the pair of mold members.
5.
The method for producing a wafer level lens array according to 1 or 2,
In the first curing step, a heating part provided at a position corresponding to the arrangement pattern of the lens part is disposed outside one of the pair of mold members, and the heating part corresponds to the lens part. A method for manufacturing a wafer level lens array that supplies heat only to a portion to be heated.
6).
A method for producing the wafer level lens array according to any one of 1 to 5,
The distance between the pair of mold members is reduced simultaneously with at least one of the first curing step and the second curing step, or between the first curing step and the second curing step. A method of manufacturing a wafer level lens array in which pressure is applied to the resin.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these.

[Resin used]
0.5 parts by weight of Irgacure 907 (Ciba Specialty Chemicals Co., Ltd.) as a photopolymerization initiator with respect to 99.5% by weight of biscoat # 700 (Osaka Organic Chemical Co., Ltd.), an acrylic monomer as a curable resin What was mixed and stirred was used.

[Use type]
On the quartz glass substrate having a thickness of 1.0 mm and a diameter of 80.0 mm, recesses corresponding to a convex lens having a diameter of 2.0 mm were formed in the plane at intervals of 20.0 mm by wet etching. Further, in order to improve the releasability of the glass substrate used as a resin and a mold, the surface was fluorinated using a silane coupling agent after the etching treatment, and a pair of glass mold members was prepared.

[Curing method]
After the photocurable resin is dropped using a dispenser (super Σx: manufactured by Musashi Engineering Co., Ltd.) so that the lens portion and the substrate portion are filled on the mold, a spacer of 700 μm is installed on the outer periphery, and the other side. The mold member was placed, and UV exposure or heating was performed.

[UV exposure equipment]
As a UV exposure apparatus, a proximity type exposure machine (manufactured by Hitachi Electronics Engineering Co., Ltd.) having an ultrahigh pressure mercury lamp was used for exposure at a main wavelength of 365 nm and an exposure amount of 70 mJ / cm ² . When pattern exposure was performed, a quartz exposure mask having a light shielding portion other than the lens part was directly placed on the mold member, and pattern exposure was performed.

[Evaluation equipment]
For measuring the lens pitch of the molded lens array substrate, the distance between the lens apexes was measured by measuring the in-plane thickness distribution of the substrate produced using a laser displacement meter (LT-9000: manufactured by Keyence Corporation). . Moreover, the pitch interval of the mold member is measured in advance using the same method. Three lens array substrates produced under the same conditions were produced, and the difference from the pitch interval of the mold members was evaluated as variations. Further, on a single lens array substrate, a distance (pitch) between a total of eight lenses was measured as shown in FIGS.

[Comparative Example 1]
The entire surface of the mold member was exposed from the upper surface of the mold member without using a mask to press the resin pressed by the mold described above. Thereafter, the resin molded body was peeled from the mold, and evaluation between lens pitches was performed.

[Example 1]
The resin pressurized with the above-mentioned mold was subjected to pattern exposure from the upper surface of the mold member through the exposure mask. At that time, a photomask having translucency only at the lens part was used, and exposure was performed under a condition that reached 50% of the resin at the lens part from IR measurement. Subsequently, the photomask was removed and the second exposure was performed on the entire surface. Thereafter, the resin molded body was peeled from the mold, and evaluation between lens pitches was performed.

[Example 2]
Pattern exposure was performed from the upper surface of the mold member for the resin pressurized by the mold described above. At that time, a photomask having translucency only at the lens portion was used. Subsequently, after removing the photomask, the resin molded body was put into a muffle furnace together with a mold, and heated at 90 ° C. for 1 hour. Thereafter, the resin molded body was peeled from the mold, and evaluation between lens pitches was performed.

[Result comparison]
The results are shown in the table below. It can be seen that Examples 1 and 2 have higher pitch uniformity within each array and higher pitch uniformity among a plurality of manufactured arrays as compared with Comparative Example 1.

Claims (6)

A wafer level lens array manufacturing method in which a wafer level lens array comprising a substrate portion and a plurality of lens portions arranged on the substrate portion is integrally molded with an energy curable resin,
Supplying the resin between a pair of mold members;
A first curing step of molding and curing the resin by applying energy only to the resin to be the lens portion in a state where the resin is sandwiched between the pair of mold members;
And a second curing step in which the resin is molded and cured by applying energy to the resin in a region including at least the substrate portion. A method of manufacturing a wafer level lens array according to claim 1,
A method for producing a wafer level lens array, wherein the resin is a resin having at least one of thermosetting and photosetting. A method for producing a wafer level lens array according to claim 1 or 2,
In the first curing step, a method of manufacturing a wafer level lens array in which light is irradiated only to a portion corresponding to a lens portion from the outside of one of the pair of mold members. A method for producing a wafer level lens array according to claim 3,
In the second curing step, a wafer level lens array manufacturing method for supplying heat to the entire wafer level lens array from the outside of one of the pair of mold members. A method for producing a wafer level lens array according to claim 1 or 2,
In the first curing step, a heating part provided at a position corresponding to the arrangement pattern of the lens part is disposed outside one of the pair of mold members, and the heating part corresponds to the lens part. A method for manufacturing a wafer level lens array that supplies heat only to a portion to be heated. A method for producing a wafer level lens array according to any one of claims 1 to 5,
The distance between the pair of mold members is reduced simultaneously with at least one of the first curing step and the second curing step, or between the first curing step and the second curing step. A method of manufacturing a wafer level lens array in which pressure is applied to the resin.

Images