JP2011099847A - Pressure sensor element and sheet-like pressure sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cheap and compact pressure sensor element which can be densely-arranged and also arranged even on a curved surface. <P>SOLUTION: A pressure sensor element 10, comprising a mixture of silicone-containing elastomer and ionic liquid, includes its element body 11 the electric property of which varies by impressed pressure, and electrodes 12, 13 prepared on the element body 11 to retrieve variation in its electric property. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a pressure sensor element and a sheet-like pressure sensor.

  In the manufacture of semiconductor elements, elements are formed on a semiconductor wafer, and electrical characteristics of the elements are inspected by a probe device before being separated into individual elements by dicing.

  In the conventional probe device, the pressure of the probe or the contact in the probe device is partially measured, and the information is used to realize a relatively uniform pressure distribution over the entire surface of the semiconductor wafer (for example, patent document). 1).

  Further, in a bonding apparatus that performs stacking of silicon chips and bonding between silicon chips and an interposer, various materials are heated and applied to a wafer under a predetermined pressure (for example, Patent Document 2).

  Furthermore, in semiconductor manufacturing apparatuses, pressure measurement on gas piping, curved surfaces in a chamber, and the like is required for grasping process conditions.

JP 2000-155128 A JP 2005-010555 A

  By the way, semiconductor wafers have been increased in diameter from the viewpoint of improving productivity, and those having a diameter of 450 mm have been studied. In such a large-diameter semiconductor wafer, a partial pressure as in the conventional case is used in the probe apparatus. Even if measurement is performed, it is difficult to achieve the required pressure of the probe or contactor or the uniformity thereof.

  Also, in the laminating apparatus, it is necessary to perform pressure control in consideration of stress due to the difference in thermal expansion coefficient that occurs when different types of materials are heated and pasted, and there is a problem that conventional pressure sensors cannot perform sufficient pressure control. is there.

  In order to solve these problems, a pressure sensor that can be arranged at high density over the entire surface of the wafer and can measure the pressure or pressure distribution on the entire surface with high accuracy is required. There is a problem that the wafer cannot be arranged with high density over the entire surface of the wafer, and the pressure distribution over the entire surface of the wafer cannot be measured with high accuracy. Moreover, the conventional pressure sensor is expensive.

  Moreover, since the conventional pressure sensor is not only large, but is mounted on a rigid substrate, it cannot be installed on the curved surface of a chamber or piping.

The present invention is intended to provide a pressure sensor element that is small, can be arranged at high density, can be arranged on a curved surface, and is inexpensive.
Another object of the present invention is to provide a pressure sensor sheet capable of measuring a large area pressure or pressure distribution with high accuracy.

  According to a first aspect of the present invention, there is provided an element body made of a mixture of an elastomer containing silicone and an ionic liquid, the electric characteristics of which are changed by applying pressure, and the electric characteristics of the element body. There is provided a pressure sensor element comprising an electrode for taking out the change in the pressure sensor element.

  A second aspect of the present invention is an element body made of a mixture of an elastomer containing silicone and an ionic liquid, the electric characteristics of which changes by applying pressure, and the electric characteristics of the element body. There is provided a sheet-like pressure sensor comprising a plurality of pressure sensor elements each having an electrode for taking out the change in a flat shape in a flat container.

  According to the pressure sensor element of the present invention, since the element body is an organic material made of a mixture of an elastomer containing silicone and an ionic liquid, deformation due to pressure application is large, and the electrical characteristics change linearly over a wide pressure range. The pressure can be detected with high accuracy in a wide pressure range. Further, the pressure sensor element of the present invention can detect pressure even in principle even if the element body is small, and can be downsized because it has a simple configuration in which electrodes are formed on the element body. For this reason, it can arrange | position with high density and can measure the pressure or pressure distribution of a large area with high precision by this. Moreover, since the element body is made of a mixture of an elastomer containing silicone and an ionic liquid, it is inexpensive. Furthermore, since the pressure sensor element which is small and has an element main body and an electrode has flexibility, it can be installed on a curved surface of a chamber, piping, or the like.

  According to the sheet-like pressure sensor of the present invention, since the pressure sensor element has a small and simple structure, it can be arranged at a high density. Therefore, the sheet-like pressure sensor according to the present invention is formed by arranging a plurality of pressure sensor elements. Is extremely suitable for detecting pressure or pressure distribution on a large-area measuring object such as a wafer.

It is a schematic sectional drawing which shows the pressure sensor element which concerns on the 1st Embodiment of this invention. It is a schematic sectional drawing for demonstrating the mode of a change when a pressure is applied with respect to the pressure sensor element which concerns on the 1st Embodiment of this invention from the state which does not apply a pressure. It is a top view which shows the sheet-like pressure sensor which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows a part of sheet-like pressure sensor which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows an example of the probe apparatus carrying the sheet-like pressure sensor of the said 2nd Embodiment. It is sectional drawing which shows an example of the bonding apparatus carrying the sheet-like pressure sensor of the said 2nd Embodiment. It is a schematic diagram which shows the state which provided the pressure sensor element of the said 1st Embodiment in the convex surface upward. It is a schematic diagram which shows the example which provided the pressure sensor element of the said 1st Embodiment in the concave surface.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic sectional view showing a pressure sensor element according to the first embodiment of the present invention.

  As shown in FIG. 1, a pressure sensor element 10 according to the present embodiment includes an element body 11 made of a mixture of an elastomer containing silicone and an ionic liquid, which is an electrically driven polymer, and electrodes 12 provided on both sides thereof. And 13. The pressure sensor element 10 is accommodated in a container 14 made of an elastic material, for example, a resin such as polyimide, and the lower surface of the pressure sensor element 10 is bonded to the container 14. The container 14 is fixed to a fixing plate 15 made of a metal such as Al or Cu or a flexible material, for example. A measurement wiring 16 extends from the electrodes 12 and 13, and the measurement wiring 16 is connected to a sensor amplifier 17. When pressure is applied to the element body 11 from one direction, for example, from above, the element body 11 is deformed, and the electrical characteristics change due to the deformation. A signal of the electrical characteristics is transmitted from the electrodes 12 and 13 to the measurement wiring 16. It is taken out, amplified by the sensor amplifier 17 and output. The element body 11 returns to its original shape when the pressure is released.

  As the elastomer containing silicone constituting the element body 11, polydimethylsiloxane produced by cross-linking reaction of DVPDMS (α, ω-divinyl-polydimethylsiloxane) and PMHS (polymethyl hydrogen siloxane) is used. Can do.

  As the ionic liquid, an imidazolium salt, a piperidinium salt, a pyridinium compound, a pyrrolidinium salt, or the like can be used. Preferably, 1-ethyl-3-methylimidazolium tetrafluoroborate ([EMI] [BF4]: 1-Ethyl-3-methylimidazolium Tetrafluoroborate), 1-butyl-3-methylimidazolium tetrafluoroborate ([BMI ] [BF4]: 1-Butyl-3-methylimidazolium Tetrafluoroborate), 1-Hexyl-3-methylimidazolium tetrafluoroborate ([HMI] [BF4]: 1-Hexyl-3-methylimidazolium Tetrafluoroborate), 1-ethyl -3-methylimidazolium 2- (2-methoxyethoxy) -ethyl sulfate ([EMI] [MEES]: 1-ethyl-3-methylimidazolium 2- (2-methoxyethoxy) ethyl sulfate), 1-ethyl-3- Methylimidazolium bis (trifluoromethanesulfonyl) imide ([EMI] [TFSI]: 1-Ethyl-3-methylimidazolium Bis (trifluoromethanesulfonyl) imide 1-butyl-1-methyl-pyrrolidinium bis (trifluoromethane) imide ([BMP] [TFSI]: 1-Butyl-1-methylpyrrolidinium Bis (trifluoromethanesulfonyl) imide) and the like.

  Other ionic liquids that can be used include cyclohexyltrimethylammonium bis (trifluoromethanesulfonyl) imide, methyltri-n-octylammonium bis (trifluoromethanesulfonyl) imide (Methyltri-sulfonyl) imide. n-octylammonium Bis (trifluoromethanesulfonyl) imide), Tetrabutylammonium Bromide, Tetrabutylammonium Chloride, Tetrabutylphosphonium Bromide, Tributyl (2-methoxyethyl) phosphonium bis (trifluoromethanesulfonyl) ) Imide (Tributyl (2-methoxyethyl) phosphonium Bis (trifluoromethanesulfonyl) imide), triethylsulfonium bis (trifluoromethanesulfonyl) imide (Triethyls) ulfonium Bis (trifluoromethanesulfonyl) imide), 1,3-dimethylimidazolium chloride (1,3-Dimethylimidazolium Chloride), 1,3-dimethylimidazolium dimethyl phosphate (1,3-Dimethylimidazolium Dimethyl Phosphate), 1-butyl-2, 3-dimethylimidazolium bis (trifluoromethanesulfonyl) imide (1-Butyl-2,3-dimethylimidazolium bisimide), 1-butyl-2,3-dimethylimidazolium chloride (1-Butyl-2,3- Dimethylimidazolium Chloride), 1-Butyl-2,3-dimethylimidazolium hexafluorophosphate, 1-Butyl-2,3-dimethylimidazolium polyethylene glycol hexadecyl ether sulfate Coated lipase (1-Butyl-2,3-dimethylimidazolium Polyethylene Glycol Hexadecyl Ether Sulfate coated Lipase), 1-Butyl-2,3-dimethylimidazole 1-Butyl-2,3-dimethylimidazolium Tetrafluoroborate, 1-Butyl-3-methylimidazolium Bis (trifluoromethanesulfonyl) imide, 1 1-Butyl-3-methylimidazolium Bromide, 1-Butyl-3-methylimidazolium Chloride, 1-Butyl-3-methylimidazolium Chloride Hexafluorophosphate (1-Butyl-3-methylimidazolium Hexafluorophosphate), 1-butyl-3-methylimidazolium iodide (1-Butyl-3-methylimidazolium Iodide), 1-butyl-3-methylimidazolium tetrachloroferrate (1-Butyl-3-methylimidazolium Tetrachloroferrate), 1-Butyl-3-methylimidazolium Trifluoromethanesulfonate, 1-Ethyl-2,3-dimethylimidazolium bis (trifluoromethanesulfonyl) imide (1-Ethyl-2,3-dimethylimidazolium Bis (trifluoromethanesulfonyl) imide), 1-ethyl-3-methylimidazolium bromide (1-Ethyl- 3-methylimidazolium Bromide), 1-Ethyl-3-methylimidazolium Chloride, 1-Ethyl-3-methylimidazolium Dicyanamide, 1 1-Ethyl-3-methylimidazolium Ethyl Sulfate, 1-Ethyl-3-methylimidazolium Hexafluorophosphate, 1-Ethyl-3-methylimidazolium Hexafluorophosphate 3-Ethyl-3-methylimidazolium Hydrogen Sulfate, 1-Ethyl-3-methylimidazolium Iodide, 1-Ethyl-3-methyl 1-Ethyl-3-methylimidazolium Methanesulfonate, 1-Ethyl-3-methylimidazolium Tetrachloroferrate, 1-ethyl-3-methylimidazo 1-Ethyl-3-methylimidazolium Trifluoromethanesulfonate, 1-hexyl-3-methylimidazolium bromide, 1-hexyl-3-methylimidazolium chloride (1- Hexyl-3-methylimidazolium Chloride), 1-Hexyl-3-methylimidazolium Hexafluorophosphate, 1-Methyl-3-n-octylimidazolium bromide (1-Methyl-3 -n-octylimidazolium bromide), 1-methyl-3-n-octylimidazolium chloride, 1-methyl-3-n-octylimidazolium chloride 1-Methyl-3-n-octylimidazolium Hexafluorophosphate, 1-Methyl-3-propylimidazolium Iodide, 1-butyl-1-methylpiperidinium Bromide (1-Butyl-1-methylpiperidinium Bromide), 1-Butyl-3-methylpyridinium Bromide, 1-Butyl-4-methylpyridinium Bromide ), 1-Butyl-4-methylpyridinium Chloride, 1-Butyl-4-methylpyridinium Hexafluorophosphate, 1-Butylpyridinium bromide (1-Butylpyridinium Bromide), 1-Butylpyridinium Chloride, 1-Butylpyridinium Hexafluorophosphate 1-ethyl-3- (hydroxymethyl) pyridinium ethyl sulfate (1-Ethyl-3- (hydroxymethyl) pyridinium Ethyl Sulfate), 1-ethyl-3-methylpyridinium ethyl sulfate (1-Ethyl-3-methylpyridinium Ethyl Sulfate) Sulfate), 1-Ethylpyridinium Bromide, 1-Ethylpyridinium Chloride, 1-Butyl-1-methylpyrrolidinium Bromide, 1 -Butyl-1-methylpyrrolidinium chloride and the like.

  As a method of manufacturing the element body 11, an elastomer containing silicone and an ionic liquid are mixed so that the ionic liquid is 40% by weight, for example, to generate a mixed liquid, and the mixed liquid is poured into a mold having a desired shape. An example is a method of removing the mold after vacuum degassing, for example, heat treatment at 150 ° C. for 30 minutes.

  The electrodes 12 and 13 are preferably made of a flexible material capable of following the deformation of the element body 11, and can be formed by, for example, gold sputtering. As materials other than gold, Al, Cu, Pt, carbon nanotubes, conductive polymers such as PEDOT / PSS, silver grease, and the like can be suitably used.

Next, the operation of the pressure sensor element 10 configured as described above will be described.
First, as shown in FIG. 2A, the output from the sensor amplifier 17 is taken with no pressure applied. At this time, in the element body 11, the ionic liquid is uniformly dispersed in the elastomer containing silicone.

  Next, as shown in FIG. 2B, pressure is applied from above the element body 11 by the pressure element 18 through the insulating film 14 and the electrode 12. At this time, the element main body 11 made of a mixture of an elastomer containing silicone and an ionic liquid is deformed by the applied pressure, and the structure of the ionic liquid changes due to polarization or the like. The dielectric constant of the element body 11 changes with such a change in structure, thereby changing the electrical characteristics such as the capacitance of the entire element body 11 and detecting the change in the electrical characteristics such as the capacitance. The applied pressure can be detected.

  In the pressure sensor element 10 of the present embodiment, since the element body 11 is made of an organic material, deformation due to pressure application is large, and the electrical characteristics change linearly over a wide pressure range, so pressure is detected with high accuracy over a wide pressure range. can do. In addition, the pressure sensor element 10 can detect pressure even if the element body 11 is small in principle, and can be downsized because of the simple configuration in which the electrodes 12 and 13 are formed on the element body 11. For this reason, it can arrange | position with high density and can measure the pressure or pressure distribution of a large area with high precision by this. Further, since the element body 11 is made of a mixture of an elastomer containing silicone and an ionic liquid, it is inexpensive. Furthermore, since the pressure sensor element 10 which is small in size and has the element body 11 and the electrodes 12 and 13 has flexibility, the curved surface of the chamber can be obtained if the fixing plate 15 has flexibility to be able to cope with a curved surface. It can be installed in pipes.

<Second Embodiment>
Next, a second embodiment of the present invention will be described.
The present embodiment shows a sheet-like pressure sensor provided with a plurality of the pressure sensor elements 10. FIG. 3 is a plan view showing a sheet-like pressure sensor according to the second embodiment of the present invention, and FIG. 4 is a sectional view showing a part thereof.

  The sheet-like pressure sensor 20 is formed by flattening a pressure sensor element 10 in which electrodes 12 and 13 are formed on both surfaces of the element body 11 in a flat container 21 made of an elastic material, for example, a resin such as polyimide. A plurality of these are arranged at a high density, and the lower surface of the pressure sensor element 10 is attached to the inner surface of the container 21. The container 21 is fixed to a fixing plate 23 made of a metal such as Al or Cu or a flexible material. Composed.

  The measurement wiring 16 extends from the electrodes 12 and 13 of each pressure sensor element 10, the measurement wirings 16 from all the pressure sensor elements 10 extend to the sensor amplifier 31, and the sensor amplifier 31 is connected to the arithmetic circuit 32. Yes. The arithmetic circuit 32 is supplied with power from a power source 33, calculates the pressure received by each pressure sensor element 10 based on signals from the plurality of pressure sensor elements 10, and displays the calculation result on the display 34. The calculation result is output as a control output to the controlled object at the same time as it is displayed on the display 34 or without being displayed on the display 34.

  As described above, since the pressure sensor element 10 has a small and simple structure, the pressure sensor element 10 can be arranged at high density. This is extremely suitable for detecting the pressure or pressure distribution for such a large area measurement object.

<Application example>
Hereinafter, application examples of the pressure sensor element and the sheet-like pressure sensor of the above embodiment will be described.

(Application to probe equipment)
FIG. 5 is a cross-sectional view showing an example of a probe device equipped with the sheet-like pressure sensor of the second embodiment.
The probe device 40 has a probe card 41 and a mounting table 42 on which a wafer W as an object to be inspected is mounted. On the mounting table 42, the sheet-like pressure sensor 20 having the above-described structure having almost the same area as the wafer W is fixed, and the wafer W is mounted thereon.

  The probe card 41 is formed in a substantially disk shape as a whole. The probe card 41 is provided on the upper surface side of the support substrate 51 that supports the contact (probe) 90 that contacts the electrode pad U of the wafer W at the time of inspection, and sends a test electrical signal to the contact 90. 52.

  The circuit board 52 is formed in a substantially disk shape and is electrically connected to a tester (not shown). An electronic circuit for transmitting an electrical signal for inspection with the contact 90 is mounted inside the circuit board 52. An electrical signal for inspection from the tester is transmitted to and received from the contact 90 via the electronic circuit of the circuit board 52. A connection terminal 52 a is disposed on the lower surface of the circuit board 52.

  A reinforcing member 53 that reinforces the circuit board 52 is provided on the upper surface side of the circuit board 52. The reinforcing member 53 includes a main body portion 53a arranged in parallel to the upper side of the circuit board 52, and a fixing portion 53b that extends downward from the outer peripheral portion of the main body portion 53a and fixes the outer peripheral portion of the circuit board 52. 53b protrudes to the inside of the circuit board 52 and extends to the outside, and the outer peripheral portion of the fixed portion 53b is held by a holder (not shown).

  A connecting member 54 is provided on the upper surface of the circuit board 52 in parallel with the circuit board 52. The connecting member 54 has a substantially disk shape smaller in diameter than the circuit board 52 and is provided inside the fixing portion 53 b of the reinforcing member 53.

  A connecting body 55 for connecting and integrating the support plate 51 and the connecting member 54 is fixed to the lower surface of the outer peripheral portion of the connecting member 54. The connecting body 55 extends in the vertical direction, and is provided at a plurality of locations, for example, 4 locations on the outer periphery of the support plate 51.

  The connecting body 55 penetrates the circuit board 52 in the thickness direction, the lower end reaches the outer position of the outer peripheral portion of the support plate 51, and two protrusions formed at the lower part of the connecting body 55. The support plate 51 is held by the portion 55a. The support plate 51 and the connecting member 54 are fixed by bolts 56 extending through the circuit board 52 at their centers.

  On the upper surface of the connecting member 54, a spring member 60 is provided as a load adjusting member that maintains a constant contact load between the contact 90 and the electrode pad U. For example, three spring members 60 are arranged at equal intervals on the same circumference. The spring member 60 includes a spring 61 disposed so as to expand and contract in the vertical direction, and a support portion 62 that supports the spring 61 and can expand and contract in the vertical direction. The upper surface of the spring member 60 is in contact with the main body 53a of the reinforcing member 53 so that the contact load between the contact 90 and the electrode pad U can be kept constant.

  A plate spring 64 as an elastic member is provided on the outer peripheral portion of the connecting member 54. One end of the leaf spring 64 is fixed to the outer peripheral portion of the connecting member 54, and the other end is fixed to the fixing portion 53b of the reinforcing member 53, and a plurality of, for example, three, preferably equidistantly arranged in the circumferential direction. Yes. These plate springs 64 fix the horizontal position of the support plate 51.

  The support plate 51 is disposed so as to face the mounting table 42 and be parallel to the circuit board 52. The support plate 51 is formed in a substantially disc shape, and a plurality of connection terminals 51a are provided on the upper surface thereof. The connection terminal 51 a is disposed so as to correspond to the connection terminal 52 a of the circuit board 52.

  Between the connection terminal 51a of the support plate 51 and the connection terminal 52a of the circuit board 52 corresponding to the connection terminal 51a, a plurality of intermediate members 70 are provided for electrical connection therebetween. The plurality of intermediate members 70 are uniformly arranged in the upper surface of the support plate 51. Further, each intermediate member 70 is formed so as to expand and contract independently in the vertical direction. Therefore, even when, for example, the contact 90 and the electrode pad U contact at different heights, the intermediate member 70 It acts to make the in-plane distribution of the contact load between the contact 90 and the electrode pad uniform.

  Contacts 90 are provided on the lower surface of the support plate 51 at a narrower pitch than the connection terminals 51a on the upper surface. The same number of contacts 90 on the lower surface are provided corresponding to the connection terminals 51 a, and the corresponding connection terminals 51 a and the contacts 90 are connected by wiring inside the support plate 51. That is, the support plate 51 functions as a pitch conversion board that converts the pitch of the connection terminals 52 a of the circuit board 52.

  The mounting table 42 is configured to be movable in the horizontal direction and the vertical direction by the XYZ moving mechanism 43. By driving the XYZ moving mechanism 43 by the driving mechanism 44, the mounting table 42 is moved to the mounting table 42 via the sheet-like pressure sensor 20. The mounted wafer W can be moved three-dimensionally to perform precise alignment.

As shown in FIG. 3, the sheet-like pressure sensor 20 has a plurality of pressure sensor elements 10 arranged. However, when applied to the pressure measurement of the contact of the probe device 40 as in this example, the pressure sensor element 10 10 need to be provided so as to correspond to the contact 90, and the pressure sensor elements 10 need to be arranged at a very high density of every 2 to 5 mm square. The target specifications are measurement pressure: around 20 kgf / cm ² , operating temperature: −40 to 150 ° C., repeatability: ± 1% FS, which can be sufficiently achieved by the sheet-like pressure sensor 20 using the pressure sensor element 10. Is.

  Signals taken out from the plurality of pressure sensor elements 10 of the sheet-like pressure sensor 20 are amplified by the sensor amplifier 141 via the measurement wiring 140, and the amplified signal is sent to the calculation unit 142, where the pressure value is calculated and the wafer is calculated. The pressure applied to the entire surface of W and the pressure distribution are obtained with high accuracy. This pressure measurement signal is sent to the control unit 150 that controls the entire apparatus.

  Upon receiving the signal from the sheet-like pressure sensor 20, the control unit 150 has a desired pressure value or pressure distribution detected by the sheet-like pressure sensor 20 when the contact 90 is brought into contact with the electrode pad U on the wafer W. For example, if the height of the mounting table 42 is changed or abnormal pressure is detected so that the pressure or the pressure distribution falls within a desired range, the cause is removed. When the plate 51 is inclined, the control is performed so as to eliminate the inclination.

  When the electrical characteristics of the wafer W are actually inspected by the probe device 40 having such a configuration, the wafer W is first held on the mounting table 42 with an initial load applied to the spring member 60 in advance. Thereafter, the mounting table 42 is raised, and each electrode pad U of the wafer W comes into contact with the contact 90. When the electrode pad U is further raised, the contact 90 is compressed in the vertical direction by a force acting from below to above. At this time, the generated load is absorbed by the contact 90. When the electrode pad U is further raised, the generated load is transmitted to the intermediate member 70 via the support plate 51 and also transmitted to the spring member 60 via the support plate 51, the connecting body 55 and the connecting member 54. At this time, the support plate 51 is pushed toward the contact 90 by the biasing force of the spring member 60. Then, in a state where the wafer is pressed against the contact 90 with a predetermined contact load, an electrical signal for inspection passes from the circuit board 52 through the intermediate member 70, the connection terminal 51a of the support 51, and the contact 90 in order. It is sent to each electrode pad U on W, and the electrical characteristics of the circuit on wafer W are inspected.

  At this time, since the spring member 60 is provided on the upper surface of the connecting member 54 connected to the support plate 51, in principle, when the contact 90 and the electrode pad U contact at the time of inspection, the contact load is set to a predetermined load. Can be maintained.

(Application to bonding equipment)
FIG. 6 is a cross-sectional view showing an example of a laminating apparatus equipped with the sheet-like pressure sensor of the second embodiment.
The laminating apparatus 170 has an apparatus main body 161 arranged at the center, and a liquid crystal wax supply mechanism 162 that supplies liquid crystal wax onto the carrier body 202 that is in the middle of transportation. ing.

  The apparatus main body 161 has a head plate 171 and a base plate (not shown), and these are fixed to the top and bottom of a casing (not shown) so as to be parallel to each other and maintain a predetermined positional relationship. The head plate 171 can be opened and closed by opening in the direction of the arrow.

  On the lower surface of the head plate 171, a first holding member 174 having a plate shape for holding the thin plate body 201 to be bonded to the lower surface via the floating mechanism 173 is movable in a state of floating from the head plate 171. Is provided.

  On the other hand, on the base plate, a second holding member 176 having a plate shape for holding the carrier body 202 to be bonded to the upper surface via the XYZθ moving mechanism 175 is movable in the XYZθ direction. 174 is provided so as to face 174. On the second holding member 176, the sheet-like pressure sensor 20 having the above-described structure having substantially the same area as the carrier body 202 is fixed, and the carrier body 202 is placed thereon. The second holding member 176 drives the XYZθ moving mechanism 175 by the driving mechanism 172, thereby moving the carrier body 202 held by the second holding member 176 via the sheet-like pressure sensor 20 three-dimensionally and precisely. Can be aligned properly.

  As a result, the thin plate body 201 held by the first holding member 174 and the carrier body 202 held by the second holding member 176 are arranged so that their bonding surfaces face each other.

  The first holding member 174 is provided with a vacuum suction mechanism 177 as a holding mechanism for holding the thin plate body 201. The vacuum suction mechanism 177 includes a plurality of vacuum suction grooves 177a formed on the lower surface of the first holding member 174, an exhaust passage 177b that is connected to the vacuum suction grooves 177a and extends horizontally into the first holding member 174, And an exhaust line 177c connected to the exhaust path 174b. By operating a vacuum pump (not shown) and evacuating through the exhaust line 177c, the thin plate member 201 is vacuumed on the lower surface of the first holding member 174. Adsorbed. When the thin plate member 201 is extremely thin with a thickness of 100 μm or less, warpage or the like is likely to occur. However, by designing the vacuum suction groove 177a appropriately, even such a thin plate can be sucked with high flatness.

  The second holding member 176 is also provided with a vacuum suction mechanism 178 as a holding mechanism for holding the carrier body 202. The vacuum suction mechanism 178 includes a plurality of vacuum suction grooves 178a formed on the upper surface of the second holding member 176, an exhaust path 178b that is connected to the vacuum suction grooves 178a and extends horizontally into the second holding member 176, And an exhaust line 178c connected to the exhaust path 178b. Although not shown, the sheet-like pressure sensor 20 has a plurality of vacuum suction holes at positions corresponding to the vacuum suction grooves 178a. As a result, a vacuum pump (not shown) is operated to evacuate via the exhaust line 178 c, whereby the carrier body 202 is vacuum-adsorbed to the upper surface of the second holding member 176 via the sheet-like pressure sensor 20.

  A heater 179 as a heating unit is embedded in the second holding member 176. The heater 179 is supplied with power from the heater power supply 180 and generates heat. In addition, in the second holding member 176, a refrigerant flow path 181 through which a cooling medium such as cooling water flows is provided as a cooling means. By supplying power to the heater 179, the carrier body 202 held on the upper surface is heated, and the liquid crystal wax 204 as an adhesive supplied on the carrier body 202 is maintained in a liquid state. In addition, when a cooling medium such as cooling water flows through the refrigerant flow path 281, the liquid crystal wax supplied onto the carrier body 202 is solidified.

  The head plate 171 is provided with a piezo mechanism 182 as a parallelism adjusting mechanism that adjusts the parallelism between the bonding surface of the thin plate body 201 and the bonding surface of the carrier body 202. The piezo mechanism 182 is provided in a space 171a provided in the center of the head plate 171, and is fixed to the head plate 171 by a fixing plate 171b. The piezo mechanism 182 includes a support body 182a fixed to the fixed plate 171b and a plurality of piezo elements 182b supported on the lower surface of the support body 182a. The lower end of the piezo elements 182b is a first holding member. It is fixed to the upper surface of 174. Then, by applying a predetermined voltage to the piezo elements 182b, a desired displacement is generated in the piezo elements 182b, and the inclination of the first holding member 174 is adjusted to bond the laminating surface of the thin plate body 201 and the carrier body 202. Adjust the parallelism with the surface.

  Note that, on the side of the first holding member 174 and the side of the second holding member 176, an upper alignment mechanism for detecting the position of the carrier body 202 and the position of the thin plate body 201, respectively, and performing alignment. And a lower alignment mechanism (both not shown) are provided.

  The liquid crystal wax supply mechanism 162 includes a dispenser 189 that supplies the liquid crystal wax onto the carrier body 202 being conveyed, a liquid crystal wax supply source 190 that supplies the liquid crystal wax to the dispenser 189, and a drive mechanism that moves the dispenser 189 in the horizontal direction. 191. Then, the liquid crystal wax is changed to a liquid state from the liquid crystal wax supply source 190 to the dispenser 189 by a heating means (not shown), and the liquid liquid crystal wax is supplied onto the carrier body 202 from the dispenser 189. The liquid crystal wax used for bonding exhibits crystallinity even when melted, and has a property that abruptly occurs at a temperature at which there is a phase change between the liquid phase and the solid phase.

As shown in FIG. 3, the sheet-like pressure sensor 20 has a plurality of pressure sensor elements 10 arranged. However, when applied to the bonding pressure measurement of the bonding apparatus 170 as in this example, the sheet-shaped pressure sensor 20 has a 1 cm square. It is necessary to arrange the pressure sensor elements 10 at such a high density. The target specifications are measurement pressure: several hundred kgf / cm ² , operating temperature: 150 to 260 ° C., repeatability: ± 1% FS, which can be sufficiently achieved by the sheet-like pressure sensor 20 using the pressure sensor element 10. Is.

  Signals taken out from the plurality of pressure sensor elements 10 of the sheet-like pressure sensor 20 are amplified by the sensor amplifier 211 via the measurement wiring 210, and the amplified signals are sent to the calculation unit 212, where the pressure value is calculated and pasted. The pressure and pressure distribution applied at the time of alignment are obtained with high accuracy. This pressure measurement signal is sent to the controller 220 that controls the entire apparatus.

  The control unit 220 that has received a signal from the sheet-like pressure sensor 20 has a bonding pressure or pressure distribution detected by the sheet-like pressure sensor 20 when the thin plate body 201 and the carrier body 202 are stuck together. The height of the second holding member 176 is controlled by the drive mechanism 172 so that the pressure or the pressure distribution falls within a desired range.

Next, the laminating operation of the thin plate body 201 and the carrier body 202 using the above apparatus will be described.
The carrier body 202 is transported to the laminating apparatus 170 by a transport device (not shown). First, the liquid crystal wax is supplied onto the carrier body 202 from the liquid crystal wax supply mechanism 162, and then the carrier body to which the liquid crystal wax 204 is supplied And is held on the upper surface of the second holding member 176 via the sheet-like pressure sensor 20 by vacuum suction.

  Next, the thin plate body 201 is transported to a position corresponding to the first holding member 174 of the laminating apparatus 170 with the head plate 171 opened by a transport device (not shown), and then the head plate 171 is closed to close the first plate 171. The thin plate body 201 is adsorbed on the lower surface of the holding member 174.

  Next, positional information on the bonding surface of the carrier body 202 and the bonding surface of the thin plate body 201 is recognized by the upper alignment mechanism and the lower alignment mechanism, and based on this, the position between the thin plate body 201 and the carrier body 202 is recognized. Specifically, the planar alignment of the thin plate body 201 and the carrier body 202 by the XYZθ moving mechanism 175 and the parallelism of the thin plate body 201 and the carrier body 202 by the piezo mechanism 182 are adjusted.

  Thereafter, the driving mechanism 172 drives the XYZθ moving mechanism 175 to raise the second holding member 176, bring the thin plate body 201 and the carrier body 202 close to a predetermined position, and the heater 179 heats the second holding member 176. Then, the liquid crystal wax 204 on the carrier body 202 is melted. Then, with the melted liquid crystal wax 204 sandwiched between the thin plate body 201 and the carrier body 202, the carrier body 202 is rotated by combining the movement in the X direction and the movement in the Y direction of the XYZθ moving mechanism 175. The liquid crystal wax 204 is spread over the entire surface.

  Next, based on the information when the planar alignment is performed, the position of the carrier body 202 is adjusted to the position at that time by the XYZθ moving mechanism 175, and the liquid crystal wax 204 is controlled to a predetermined thickness. .

  In this way, after controlling the thickness of the liquid crystal wax 204 and maintaining the heating state for a certain period of time, the cooling medium, for example, cooling water is passed through the refrigerant flow path 181 in the second holding member 176 to make the second. The holding member 176 is cooled, and the liquid crystal wax 204 is cooled and solidified while the thin plate body 201 and the carrier body 202 are pressurized by the driving mechanism 172.

  Since the above laminating operation involves heat, when the difference in thermal expansion coefficient between the thin plate body 201 and the carrier body 202 is large, when the pressure is not sufficient in the cooling process, these Due to the difference in thermal expansion, the thin plate body 201 and the carrier body 202 once bonded may be peeled off. For this reason, in this example, the pressure applied to these bonded bodies is measured by the sheet-like pressure sensor 20, and the entire pressure value and pressure distribution are controlled so as not to be peeled off due to thermal expansion. By controlling in this way, bonding without peeling can be realized.

(Pressure measurement on curved surface)
7 is a schematic diagram showing a state in which the pressure sensor element of the first embodiment is provided on the convex surface 230. FIG. 8 is a schematic diagram showing an example in which the pressure sensor element of the first embodiment is provided on the concave surface 240. FIG. In any example, the pressure sensor element 10 has electrodes 12 and 13 formed on both sides of the element body 11 as shown in FIG. 1 and is covered with a cover 251 made of an elastic resin such as polyimide, It is fixed to a fixed plate 252 made of a flexible material such as resin. A measurement wiring 253 extends from the electrodes 12 and 13. The measurement wiring 253 is connected to a sensor amplifier 254, and an amplified signal is sent to the calculation unit 255, where a pressure value is calculated, and the signal is sent to the control unit and the like. Sent.

The pressure sensor element 10 is flexible because the element body 11 is made of resin and is small in size, so it can be installed without problems even on curved surfaces as shown in FIGS. 7 and 8 and can measure pressure. . For this reason, it can also be installed on the inside and outside of the curved surface in the chamber and piping. The chamber and piping have a wide pressure range, and a pressure measurement range of 1 × 10 ^{−7 to} 10 kgf / cm ² is required. By using a mixture of an elastomer containing silicone and an ionic liquid as the element body Sufficient measurement is possible. Moreover, the specifications of operating temperature: -40 to 150 and repeatability: ± 1% FS can be sufficiently satisfied.

  The present invention can be variously modified without being limited to the above embodiment. For example, in the above embodiment, an example is shown in which the pressure sensor element is covered with an insulating film such as polyimide. However, depending on the application, such an insulating film is not necessarily required. In addition, the application examples described above are merely examples, and it goes without saying that the present invention is not limited to such examples.

DESCRIPTION OF SYMBOLS 10 ... Pressure sensor element 11 ... Element main body 12, 13 ... Electrode 14 ... Cover 15 ... Fixed plate 16 ... Measurement wiring 17, 31 ... Sensor amplifier 20 ... Sheet-like pressure sensor 21 ... Container 23 ... Fixed plate 32 ... Arithmetic circuit 33 ... Power supply 34 ... Display

Claims (7)

An element body that is composed of a mixture of an elastomer containing silicone and an ionic liquid, and whose electrical characteristics change by applying pressure,
A pressure sensor element comprising: an electrode provided on the element body, and an electrode for extracting a change in electrical characteristics of the element body.   The pressure sensor element according to claim 1, wherein the electrical characteristic is a capacitance of the element body.   The pressure sensor element according to claim 1, wherein the electrodes are respectively provided on a pair of opposed surfaces of the element body.   The pressure sensor element according to any one of claims 1 to 3, wherein the pressure sensor element is fixed to a fixed plate having flexibility and disposed on a curved surface.   A pressure comprising an element body made of a mixture of an elastomer containing silicone and an ionic liquid, the electric characteristics of which changes when a pressure is applied, and an electrode that is provided in the element main body and extracts changes in the electric characteristics of the element main body. A sheet-like pressure sensor comprising a plurality of sensor elements arranged in a flat shape in a flat container.   6. A probe apparatus for measuring electrical characteristics by bringing a contactor into contact with a large number of electrode pads formed on a substrate, wherein the probe device is provided on a mounting table on which the substrate is mounted so as to correspond to the substrate. 2. A sheet-like pressure sensor according to 1. In the bonding apparatus that bonds the first member held by the first holding member and the second member held by the second holding member with an adhesive, the bonding device is provided so as to correspond to one member. The sheet-like pressure sensor according to claim 5.

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