JP2011089102A - Base generating agent, photosensitive resin composition, pattern-forming material comprising the photosensitive resin composition, method for forming pattern and article using photosensitive resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in resolution, obtainable at low cost, and containing a polymer precursor which has a wide range of options applicable in terms of structure and whose reaction to a final product is facilitated by a basic substance or by heating in the presence of a basic substance, and a base generating agent usable for such a photosensitive resin composition. <P>SOLUTION: The photosensitive resin composition includes a base generating agent having a specific structure, and generating a base by irradiating with electromagnetic waves and heating, and the polymer precursor whose reaction to a final product is facilitated by the base generating agent and a basic substance or by heating in the presence of a basic substance. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a base generator that generates a base upon irradiation and heating of electromagnetic waves, and a photosensitive resin composition using the base generator, and in particular, a product formed through a patterning step or a curing acceleration step using electromagnetic waves. Or a photosensitive resin composition that can be suitably used as a material for a member, a pattern forming material comprising the photosensitive resin composition, a pattern forming method, and an article produced using the resin composition. is there.

The photosensitive resin composition is used for, for example, an electronic component, an optical product, a molding material of an optical component, a layer forming material or an adhesive, and particularly preferably used for a product or a member formed through a patterning process using electromagnetic waves. Has been.
For example, polyimide, which is a polymer material, exhibits top-class performance among organic materials such as heat resistance, dimensional stability, and insulation characteristics, so it is widely applied to insulating materials for electronic components. It has been actively used as a coating film, a base material for flexible printed wiring boards, and the like.
In recent years, in order to solve the problems that polyimide has, polybenzoxazole, which has low water absorption and low dielectric constant, and polybenzimidazole with excellent adhesion to the substrate, to which processing processes similar to polyimide are applied, etc. It has been studied energetically.

  In general, polyimide is poorly soluble in a solvent and difficult to process. As a method for patterning polyimide into a desired shape, patterning is performed by exposure and development in the state of a polyimide precursor having excellent solvent solubility, and then heat treatment. For example, there is a method of obtaining a polyimide pattern by imidization by the method described above.

Various methods have been proposed as means for forming a pattern using a polyimide precursor. Two typical ones are as follows.
(1) A method of forming a pattern by providing a photosensitive resin on the polyimide precursor as a resist layer, and the polyimide precursor does not have a pattern forming ability. (2) Bonding or coordination of a photosensitive site to the polyimide precursor itself. A method of introducing a pattern and forming a pattern by its action. Alternatively, a method in which a photosensitive component is mixed with a polyimide precursor to form a resin composition, and a pattern is formed by the action of the photosensitive component.

  As a typical patterning technique using the above (2), (i) a polyimide precursor polyamic acid acts as a dissolution inhibitor before exposure to electromagnetic waves, and after exposure, a carboxylic acid is formed to form a dissolution accelerator; The naphthoquinonediazide derivative is mixed, and pattern formation is performed by increasing the contrast of the dissolution rate of the exposed area and unexposed area to the developer, followed by imidization to obtain a polyimide pattern (Patent Document 1) (Ii) A methacryloyl group is introduced into the polyimide precursor via an ester bond or an ionic bond, a photo radical generator is added thereto, and the exposed area is crosslinked to dissolve the exposed and unexposed areas in the developer. A method to obtain a polyimide pattern by forming a pattern by increasing the speed contrast and then imidizing it Etc. have been put into practical use (Patent Document 2).

  Compared with the method (1), the method (2) does not require a resist layer and can greatly simplify the process. However, in the method (i), a naphthoquinonediazide derivative is used to increase the solubility contrast. When the amount of addition is increased, there is a problem that the original physical properties of the polyimide cannot be obtained. Further, the method (ii) has a problem that the structure of the polyimide precursor is restricted.

  As another patterning technique, (iii) a polyamic acid as a polyimide precursor is mixed with a photobase generator and heated after exposure to cause cyclization to proceed by the action of a base generated by exposure. A technique for obtaining a polyimide pattern by reducing the solubility, forming a pattern by increasing the contrast of the dissolution rate in the developing solution of the exposed part and the unexposed part, and then imidizing is reported ( Patent Document 3).

  As another example of the photosensitive resin composition using the photobase generator, there is an example using an epoxy compound (for example, Patent Document 4). By irradiating the photobase generator with light, amines are generated in the layer containing the epoxy compound, so that the amines act as an initiator or a catalyst, and the epoxy compound can be cured only in the exposed area. Pattern formation can be performed.

JP 52-13315 A JP 54-145794 A JP-A-8-227154 Japanese Patent Laid-Open No. 2003-212856

  A photosensitive resin composition using a photobase generator is a resin composition because a photosensitive polymer precursor can be obtained simply by mixing a photobase generator at a certain ratio with an existing polymer precursor. The process for manufacturing is simple. In particular, a polyimide precursor in which the structure of a precursor compound used in the past is restricted has an advantage of high versatility because it can be applied to polyimide precursors having various structures. However, since conventional photobase generators have low sensitivity, there has been a problem that the amount of electromagnetic wave irradiation increases. When the amount of electromagnetic wave irradiation increases, there is also a problem that the processing amount (throughput) per unit time decreases.

Also, for example, when combined with a polyimide precursor, a polyimide precursor that is originally highly soluble in the developer due to the mechanism that only the exposed part is imidized by the catalytic action of the base generated by exposure and that part becomes insoluble in the developer. As for the exposed area, the dissolution rate of the exposed area is also fast, and there is a limit to increasing the solubility contrast of the exposed area and the unexposed area.
The higher the solubility contrast between the exposed and unexposed areas, the greater the residual film ratio after development and the better the pattern can be obtained. The process margin was reduced because it was necessary to adjust the concentration and amount of photobase generator and to add a dissolution accelerator.

  The present invention has been made in view of the above circumstances, and its main purpose is excellent in sensitivity and a base generator that can be used regardless of the type of the polymer precursor, and excellent in sensitivity and polymer precursor. Provided is a photosensitive resin composition capable of obtaining a pattern having a good shape while maintaining a sufficient process margin, with a large solubility contrast between the exposed and unexposed areas, regardless of the type. There is to do.

  The base generator according to the present invention is represented by the following chemical formula (1) and is characterized by generating a base by irradiation with electromagnetic waves and heating.

（式（１）中、Ｒ^１及びＲ^２は、それぞれ独立に、水素又は１価の有機基であり、同一であっても異なっていても良い。Ｒ^１及びＲ^２は、それらが結合して環状構造を形成していても良く、ヘテロ原子の結合を含んでいても良い。但し、Ｒ^１及びＲ^２の少なくとも１つは１価の有機基である。Ｒ^３、Ｒ^４、Ｒ^５及びＲ^６は、それぞれ独立に、水素、ハロゲン、水酸基、メルカプト基、スルフィド基、シリル基、シラノール基、ニトロ基、ニトロソ基、スルフィノ基、スルホ基、スルホナト基、ホスフィノ基、ホスフィニル基、ホスホノ基、ホスホナト基、アミノ基、アンモニオ基又は１価の有機基であり、同一であっても異なっていても良い。但し、Ｒ^３、Ｒ^４、Ｒ^５及びＲ^６の少なくとも１つが、水酸基、メルカプト基、スルフィド基、シリル基、シラノール基、ニトロ基、ニトロソ基、スルフィノ基、スルホ基、スルホナト基、ホスフィノ基、ホスフィニル基、ホスホノ基、ホスホナト基、アミノ基、又はアンモニオ基である。Ｒ^３、Ｒ^４、Ｒ^５及びＲ^６は、それらの２つ以上が結合して環状構造を形成していても良く、ヘテロ原子の結合を含んでいても良い。）

(In Formula (1), R ¹ and R ² are each independently hydrogen or a monovalent organic group, and may be the same or different. R ¹ and R ² are bonded to each other. ^May form a cyclic structure and may include a heteroatom bond, provided that at least one of R ¹ and R ² is a monovalent organic group R ³ , R ⁴ , R ⁵ And R ⁶ are each independently hydrogen, halogen, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfino group, sulfo group, sulfonate group, phosphino group, phosphinyl group, phosphono group , Phosphonato group, amino group, ammonio group or monovalent organic group, which may be the same or different, provided that at least one of R ³ , R ⁴ , R ⁵ and R ⁶ is a hydroxyl group, mercapto Group, sul I de group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonate group, an amino group, or an ammonio a group .R ^3, R ⁴ , R ^5, and R ⁶ may be bonded to each other to form a cyclic structure or may include a hetero atom bond.

  Since the base generator represented by the chemical formula (1) has the above specific structure, it generates a basic substance with a small amount of electromagnetic wave irradiation by combining irradiation with electromagnetic waves and heating, and thus has high sensitivity and high It can be used regardless of the type of molecular precursor and is a versatile base generator.

  In addition, the photosensitive resin composition according to the present invention relates to a polymer precursor whose reaction to the final product is accelerated by heating with a basic substance or in the presence of the basic substance, and the above-described present invention. It contains a base generator.

  The photosensitive resin composition according to the present invention is represented by the chemical formula (1) and generates a base upon irradiation with electromagnetic waves and heating, with a basic substance or by heating in the presence of a basic substance. By combining with a polymer precursor that promotes reaction to the final product, excellent sensitivity, regardless of the type of polymer precursor, a large solubility contrast can be obtained in exposed and unexposed areas, As a result, it is possible to obtain a pattern having a good shape while maintaining a sufficient process margin.

  The base generator of the present invention preferably has a 5% weight loss temperature of 100 ° C. or higher and 350 ° C. or lower. When the 5% weight loss temperature is high, the coating film can be formed under drying conditions that reduce the influence of the residual solvent. Thereby, the reduction | decrease of the solubility contrast by the influence of a residual solvent in an exposed part and an unexposed part can be suppressed. On the other hand, if the 5% weight loss temperature is too high, impurities derived from the base generator remain in the product, which may deteriorate the physical properties of the product.

  In the present invention, the base generator preferably has a high sensitivity as a base generator, wherein the generated base is a secondary amine and / or heterocyclic compound having one NH group capable of forming an amide bond. Moreover, it is preferable from the viewpoint of strong basicity and large catalytic effect.

  In the present invention, in the base generator, the structure of the generated base is represented by the following chemical formula (2) from the viewpoint that the sensitivity as a base generator is high, the basicity is strong, and the catalytic effect is large. preferable.

（式（２）中、Ｒ^１及びＲ^２は、それぞれ独立に、１価の有機基であり、置換基を有してもよい炭素数１〜２０のアルキル基、又は置換基を有してもよい炭素数４〜２２のシクロアルキル基である。Ｒ^１及びＲ^２は、同一であっても異なっていても良い。Ｒ^１及びＲ^２は、それらが結合して環状構造を形成していても良く、ヘテロ原子の結合を含んでいても良い。）

(In the formula (2), R ¹ and R ² are each independently a monovalent organic group having an alkyl group having 1 to 20 carbon atoms which may have a substituent, or a substituent. Or a cycloalkyl group having 4 to 22 carbon atoms, R ¹ and R ² may be the same or different, and R ¹ and R ² are bonded to each other to form a cyclic structure. Or may contain a heteroatom bond.)

  In the present invention, the base generator can function not only as a curing accelerator but also as a curing agent, even if the generated base is a base having two or more NH groups capable of forming an amide bond. From this point, it can be suitably used.

  In the present invention, it is preferable that the base generator has absorption at at least one of the wavelengths of electromagnetic waves of 365 nm, 405 nm, or 436 nm from the viewpoint that the number of applicable polymer precursors is further increased.

  In the photosensitive resin composition according to the present invention, the polymer precursor includes a compound and polymer having an epoxy group, an isocyanate group, an oxetane group, or a thiirane group, a polysiloxane precursor, a polyimide precursor, and a polybenzo. One or more selected from the group consisting of oxazole precursors is preferably used.

  In the photosensitive resin composition according to the present invention, the polymer precursor is preferably soluble in a basic solution from the viewpoint that the solubility contrast between the exposed portion and the unexposed portion can be increased.

  In one embodiment of the present invention, a polyimide precursor such as polyamic acid or a polybenzoxazole precursor can be used as the polymer precursor of the photosensitive resin composition. When such a polymer precursor is used, a photosensitive resin composition having excellent physical properties such as heat resistance, dimensional stability, and insulating properties can be obtained. The polyimide precursor is preferably a polyamic acid from the viewpoint of easy availability of raw materials.

  Moreover, this invention provides the material for pattern formation which consists of the photosensitive resin composition which concerns on the said invention.

Furthermore, this invention provides the negative pattern formation method using the said photosensitive resin composition.
In the negative pattern forming method according to the present invention, a coating film or a molded body is formed using the photosensitive resin composition, the coating film or the molded body is irradiated with electromagnetic waves in a predetermined pattern, and after irradiation or irradiation. At the same time, heating is performed to change the solubility of the irradiated portion, and then development is performed.

  In the said negative pattern formation method, the coating film or shaping | molding which consists of a photosensitive resin composition by using combining a polymer precursor and a compound as represented by the said Formula (1) as a base generator. Pattern formation for development can be performed without using a resist film for protecting the surface of the body from the developer.

  The present invention also provides a printed material, a paint, a sealant, an adhesive, a display device, a semiconductor device, an electronic component, a microelectromechanical system, light, which is at least partly formed of the photosensitive resin composition or a cured product thereof. Articles of either shaped objects, optical members or building materials are also provided.

Since the base generator of the present invention has a structure represented by the formula (1), a base is generated by irradiation with electromagnetic waves, and further generation of the base is promoted by heating. It has excellent sensitivity compared to the generator. Moreover, when using for the photosensitive resin composition, it can be utilized combining regardless of the kind of polymer precursor.
In the photosensitive resin composition of the present invention, the base generator represented by the formula (1) included has a sensitivity superior to that of a conventionally used photobase generator. It is a composition. The photosensitive resin composition of the present invention has a phenolic hydroxyl group when the base is generated in addition to the change in solubility of the polymer precursor by the base derived from the base generator by irradiation with electromagnetic waves and heating. Since the solubility in the basic aqueous solution changes due to the loss of the water, it is possible to further increase the difference in solubility between the exposed portion and the unexposed portion. As a result of obtaining a large solubility contrast between the exposed portion and the unexposed portion, a pattern having a good shape can be obtained while maintaining a sufficient process margin.
Furthermore, in the photosensitive resin composition of the present invention, unlike an acid, a base does not cause metal corrosion, so that a more reliable cured film can be obtained.
In addition, when the pattern forming step includes a heating step, the photosensitive resin composition of the present invention can use the heating step in heating that promotes the generation of a base. , It has the advantage that the irradiation amount of electromagnetic waves can be reduced. Therefore, when used in a process including such a heating process, the photosensitive resin composition of the present invention can be streamlined compared to a conventional resin composition that generates a base only by electromagnetic wave irradiation.

FIG. 1 is a graph showing the relationship between the exposure amount and the remaining film ratio, which was prepared using the photosensitive resin composition (1) and the comparative photosensitive resin composition (1).

The present invention will be described in detail below.
In the present invention, (meth) acryloyl means acryloyl and / or methacryloyl, (meth) acryl means acryl and / or methacryl, and (meth) acrylate means acrylate and / or methacrylate. means.
In the present invention, the electromagnetic wave is not only an electromagnetic wave having a wavelength in the visible and non-visible regions, but also a particle beam such as an electron beam, and radiation or a general term for the electromagnetic wave and the particle beam, unless the wavelength is specified. Contains ionizing radiation. In this specification, irradiation with electromagnetic waves is also referred to as exposure. Note that electromagnetic waves with wavelengths of 365 nm, 405 nm, and 436 nm may be referred to as i-line, h-line, and g-line, respectively.
<Base generator>
The base generator according to the present invention is represented by the following chemical formula (1), and generates a base (basic substance) efficiently by irradiation and heating of electromagnetic waves, and is one kind of photobase generator. It is. The photobase generator refers to an agent that does not exhibit activity under normal conditions of normal temperature and pressure, but generates a base when electromagnetic waves are applied as an external stimulus.

（式（１）中、Ｒ^１及びＲ^２は、それぞれ独立に、水素又は１価の有機基であり、同一であっても異なっていても良い。Ｒ^１及びＲ^２は、それらが結合して環状構造を形成していても良く、ヘテロ原子の結合を含んでいても良い。但し、Ｒ^１及びＲ^２の少なくとも１つは１価の有機基である。Ｒ^３、Ｒ^４、Ｒ^５及びＲ^６は、それぞれ独立に、水素、ハロゲン、水酸基、メルカプト基、スルフィド基、シリル基、シラノール基、ニトロ基、ニトロソ基、スルフィノ基、スルホ基、スルホナト基、ホスフィノ基、ホスフィニル基、ホスホノ基、ホスホナト基、アミノ基、アンモニオ基又は１価の有機基であり、同一であっても異なっていても良い。但し、Ｒ^３、Ｒ^４、Ｒ^５及びＲ^６の少なくとも１つが、水酸基、メルカプト基、スルフィド基、シリル基、シラノール基、ニトロ基、ニトロソ基、スルフィノ基、スルホ基、スルホナト基、ホスフィノ基、ホスフィニル基、ホスホノ基、ホスホナト基、アミノ基、又はアンモニオ基である。Ｒ^３、Ｒ^４、Ｒ^５及びＲ^６は、それらの２つ以上が結合して環状構造を形成していても良く、ヘテロ原子の結合を含んでいても良い。）

(In Formula (1), R ¹ and R ² are each independently hydrogen or a monovalent organic group, and may be the same or different. R ¹ and R ² are bonded to each other. ^May form a cyclic structure and may include a heteroatom bond, provided that at least one of R ¹ and R ² is a monovalent organic group R ³ , R ⁴ , R ⁵ And R ⁶ are each independently hydrogen, halogen, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfino group, sulfo group, sulfonate group, phosphino group, phosphinyl group, phosphono group , Phosphonato group, amino group, ammonio group or monovalent organic group, which may be the same or different, provided that at least one of R ³ , R ⁴ , R ⁵ and R ⁶ is a hydroxyl group, mercapto Group, sul I de group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonate group, an amino group, or an ammonio a group .R ^3, R ⁴ , R ^5, and R ⁶ may be bonded to each other to form a cyclic structure or may include a hetero atom bond.

The base generator of the present invention can efficiently generate a base with a small amount of electromagnetic wave irradiation by combining electromagnetic wave irradiation and heating, and has a higher sensitivity than conventional so-called photobase generators. Have.
Since the base generator according to the present invention has the specific structure described above, (—CH═CH—C (═O) — in formula (1) as shown by the following formula when irradiated with electromagnetic waves. ) Moiety isomerizes to the cis form and further cyclized by heating to produce the base (NHR ¹ R ² ). By the catalytic action of the amine, the temperature at which the reaction when the polymer precursor becomes the final product can be lowered, or the curing reaction where the polymer precursor becomes the final product can be started.
The base generator according to the present invention generates a base only by being irradiated with electromagnetic waves, but generation of the base is promoted by heating appropriately.

  When the base generator represented by the chemical formula (1) is cyclized, the phenolic hydroxyl group disappears, the solubility changes, and in the case of a basic aqueous solution, the solubility decreases. Thereby, when the polymer precursor contained in the photosensitive resin composition according to the present invention is a polyimide precursor or a polybenzoxazole precursor, the solubility is further reduced due to the reaction of the precursor to the final product. It has a function of assisting, and it becomes possible to increase the solubility contrast between the exposed portion and the unexposed portion.

R ¹ and R ² are each independently a hydrogen atom or a monovalent organic group, but at least one of R ¹ and R ² is a monovalent organic group. NHR ¹ R ² is a base (basic substance), but R ¹ and R ² are each preferably an organic group not containing an amino group. If an amino group is contained in R ¹ and R ² , the base generator itself becomes a basic substance, which accelerates the reaction of the polymer precursor, resulting in a solubility contrast between the exposed and unexposed areas. There is a risk of the difference becoming smaller. However, when there is a difference in basicity between the electromagnetic wave irradiation and the base generated after heating, such as when an amino group is bonded to the aromatic ring present in the organic group of R ¹ and R ^2. May be used even if the organic group of R ¹ and R ² contains an amino group.
Examples of the monovalent organic group include a saturated or unsaturated alkyl group, a saturated or unsaturated cycloalkyl group, an aryl group, an aralkyl group, and a saturated or unsaturated halogenated alkyl group. These organic groups may contain bonds and substituents other than hydrocarbon groups such as heteroatoms in the organic group, and these may be linear or branched.

R ¹ and R ² may be bonded to form a cyclic structure.
The cyclic structure is a combination of two or more selected from the group consisting of saturated or unsaturated alicyclic hydrocarbons, heterocycles, and condensed rings, and the alicyclic hydrocarbons, heterocycles, and condensed rings. The structure which becomes may be sufficient.

The bond other than the hydrocarbon group in the organic group of R ¹ and R ² is not particularly limited as long as the effect of the present invention is not impaired. , Amide bond, urethane bond, imino bond (—N═C (—R) —, —C (═NR) —, where R is a hydrogen atom or a monovalent organic group), carbonate bond, sulfonyl bond, sulfinyl bond And an azo bond.
From the viewpoint of heat resistance, the bond other than the hydrocarbon group in the organic group includes an ether bond, a thioether bond, a carbonyl bond, a thiocarbonyl bond, an ester bond, an amide bond, a urethane bond, and an imino bond (—N═C (— R)-, -C (= NR)-: where R is a hydrogen atom or a monovalent organic group), a carbonate bond, a sulfonyl bond, or a sulfinyl bond.

The substituent other than the hydrocarbon group in the organic group of R ¹ and R ² is not particularly limited as long as the effects of the present invention are not impaired. A halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a cyano group, Isocyano group, cyanato group, isocyanato group, thiocyanato group, isothiocyanato group, silyl group, silanol group, alkoxy group, alkoxycarbonyl group, carbamoyl group, thiocarbamoyl group, nitro group, nitroso group, carboxyl group, carboxylate group, acyl group Acyloxy group, sulfino group, sulfo group, sulfonate group, phosphino group, phosphinyl group, phosphono group, phosphonate group, hydroxyimino group, saturated or unsaturated alkyl ether group, saturated or unsaturated alkyl thioether group, aryl ether group, and Arylthioether group, a Amino group (-NH2, -NHR, -NRR ': wherein, R and R' are independently a hydrocarbon group) include an ammonio group. Hydrogen contained in the substituent may be substituted with a hydrocarbon group. Further, the hydrocarbon group contained in the substituent may be any of linear, branched, and cyclic.
Examples of the substituent other than the hydrocarbon group in the organic group of R ¹ and R ² include a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a cyano group, an isocyano group, a cyanato group, an isocyanato group, a thiocyanato group, an isothiocyanato group, Silyl group, silanol group, alkoxy group, alkoxycarbonyl group, carbamoyl group, thiocarbamoyl group, nitro group, nitroso group, carboxyl group, carboxylate group, acyl group, acyloxy group, sulfino group, sulfo group, sulfonate group, phosphino group , A phosphinyl group, a phosphono group, a phosphonato group, a hydroxyimino group, a saturated or unsaturated alkyl ether group, a saturated or unsaturated alkyl thioether group, an aryl ether group, and an aryl thioether group.

Since the basic substance to be generated is NHR ¹ R ² , a primary amine, a secondary amine, or a heterocyclic compound is exemplified. The amine includes an aliphatic amine and an aromatic amine, respectively. In addition, the heterocyclic compound here means that NHR ¹ R ² has a cyclic structure and has aromaticity. Non-aromatic heterocyclic compounds that are not aromatic heterocyclic compounds are included here in aliphatic amines as alicyclic amines.

Further, the generated NHR ¹ R ² includes not only a basic substance such as a monoamine having only one NH group capable of forming an amide bond but also 2 NH groups capable of forming an amide bond such as diamine, triamine, and tetraamine. It may be a basic substance having two or more. When the generated NHR ¹ R ² is a basic substance having two or more NH groups, an NH group capable of forming an amide bond is formed at one or more terminals of R ¹ and / or R ^{2 in} the formula (1). An example is a structure in which a photolatent moiety that is generated by irradiation with electromagnetic waves and heating is further bonded to a base having the same. As the photolatent site, a residue other than R ¹ and / or R ² in the formula (1) is further bonded to one or more terminals of R ¹ and / or R ² in the formula (1). Structure.

  Aliphatic primary amines include methylamine, ethylamine, propylamine, isopropylamine, n-butylamine, sec-butylamine, tert-butylamine, pentylamine, isoamylamine, tert-pentylamine, cyclopentylamine, hexylamine, cyclohexylamine , Heptylamine, cycloheptaneamine, octylamine, 2-octaneamine, 2,4,4-trimethylpentan-2-amine, cyclooctylamine and the like.

  Examples of the aromatic primary amine include aniline, 2-aminophenol, 3-aminophenol, and 4-aminophenol.

  Aliphatic secondary amines include dimethylamine, diethylamine, dipropylamine, diisopropylamine, dibutylamine, ethylmethylamine, aziridine, azetidine, pyrrolidine, piperidine, azepan, azocan, methylaziridine, dimethylaziridine, methylazetidine, dimethyl Examples thereof include azetidine, trimethylazetidine, methylpyrrolidine, dimethylpyrrolidine, trimethylpyrrolidine, tetramethylpyrrolidine, methylpiperidine, dimethylpiperidine, trimethylpiperidine, tetramethylpiperidine, pentamethylpiperidine and the like, among which alicyclic amine is preferable.

  Aromatic secondary amines include methylaniline, diphenylamine, and N-phenyl-1-naphthylamine. In addition, as an aromatic heterocyclic compound having an NH group capable of forming an amide bond, an imino bond (—N═C (—R) —, —C (═NR) — Here, R preferably has a hydrogen atom or a monovalent organic group), and examples thereof include imidazole, purine, triazole, and derivatives thereof.

As amines higher than diamine, ethylenediamine, 1,3-propanediamine, 1,4-butanediamine, 1,5-pentanediamine, 1,6-hexanediamine, 1,7-heptanediamine, 1,8-octanediamine, Linear aliphatic alkylenediamines such as 1,9-nonanediamine and 1,10-decanediamine; 1-butyl-1,2-ethanediamine, 1,1-dimethyl-1,4-butanediamine, 1-ethyl- 1,4-butanediamine, 1,2-dimethyl-1,4-butanediamine, 1,3-dimethyl-1,4-butanediamine, 1,4-dimethyl-1,4-butanediamine, 2,3- Branched aliphatic alkylenediamine such as dimethyl-1,4-butanediamine; diethylenetriamine, triethylenetetramine, tetraethylenepentami Polyethylene amines represented by the general formula _{NH 2 (CH 2 CH 2 NH} ) n H and the like; cyclohexane diamine, methylcyclohexane diamine, isophorone diamine, norbornane dimethylamine, tricyclodecane dimethylamine, alicyclic such as menthenediamine Diamine; aromatic diamine such as p-phenylenediamine, m-phenylenediamine, p-xylylenediamine, m-xylylenediamine, 4,4′-diaminodiphenylmethane, diaminodiphenylsulfone; benzenetriamine, melamine, 2,4, Examples include triamines such as 6-triaminopyrimidine; tetraamines such as 2,4,5,6-tetraaminopyrimidine.

Depending on the substituents introduced at the positions of R ¹ and R ² , the thermophysical properties and basicity of the basic substance to be generated are different.
Catalytic action, such as lowering the reaction start temperature for the reaction from the polymer precursor to the final product, is more effective as a catalyst with a basic substance having a higher basicity, and a lower temperature with a smaller amount of addition. Reaction to the final product is possible. In general, secondary amines have higher basicity than primary amines, and their catalytic effect is greater.
In addition, aliphatic amines are preferred over aromatic amines because they are more basic.

Further, when the base generated in the present invention is a secondary amine and / or a heterocyclic compound, it is preferable from the viewpoint of increasing the sensitivity as a base generator. It is presumed that this is because the use of a secondary amine or a heterocyclic compound eliminates active hydrogen at the amide bond site, thereby changing the electron density and improving the sensitivity of isomerization.

Further, from the viewpoint of the thermophysical properties of the leaving base and the basicity, the organic groups of R ¹ and R ² each independently preferably have 1 to 20 carbon atoms, more preferably 1 to 12 carbon atoms, and particularly carbon. It is preferable that it is number 1-8.

  The base generated from the base generator represented by the chemical formula (1) preferably has one NH group capable of forming an amide bond. When the generated base has two or more NH groups capable of forming an amide bond, the base generator has two or more amide bonds that are cleaved by irradiation with electromagnetic waves and heating, for example, cinnamic acid derivatives There will be two or more photophores, such as residues, per molecule. In such a case, since the molecular weight is usually increased, there is a problem that the solvent solubility is deteriorated. In addition, when there are two or more photophores in one molecule, it becomes a base if one amide bond where the photophore and the base are bonded is cleaved, but a base that still contains the photophore has a large molecular weight. Therefore, the diffusibility is deteriorated, and the sensitivity when used as a base generator is deteriorated. Furthermore, when synthesizing a base generator, if there is one light-absorbing group, it is synthesized by adding an excessive amount of a relatively inexpensive base, but if there are two or more light-absorbing groups, it is relatively expensive. It is necessary to add an excessive amount of the raw material of the photophore portion. In addition, in the case of a base having two or more NH groups capable of forming an amide bond, there is a problem that purification after synthesis is difficult. In particular, when combined with a polyimide precursor or a polybenzoxazole precursor, it is preferable to have one NH group capable of forming an amide bond.

  On the other hand, when combined with an epoxy compound or an isocyanate compound, the base generated from the base generator represented by the chemical formula (1) is one having two or more NH groups capable of forming an amide bond. It can be suitably used because it can function not only as a curing accelerator but also as a curing agent.

  The structure of the generated secondary amine and / or heterocyclic compound is preferably represented by the following chemical formula (2).

（式（２）中、Ｒ^１及びＲ^２は、それぞれ独立に、１価の有機基であり、置換基を有してもよい炭素数１〜２０のアルキル基、又は置換基を有してもよい炭素数４〜２２のシクロアルキル基である。Ｒ^１及びＲ^２は、同一であっても異なっていても良い。Ｒ^１及びＲ^２は、それらが結合して環状構造を形成していても良く、ヘテロ原子の結合を含んでいても良い。）

(In the formula (2), R ¹ and R ² are each independently a monovalent organic group having an alkyl group having 1 to 20 carbon atoms which may have a substituent, or a substituent. Or a cycloalkyl group having 4 to 22 carbon atoms, R ¹ and R ² may be the same or different, and R ¹ and R ² are bonded to each other to form a cyclic structure. Or may contain a heteroatom bond.)

In R ¹ and R ² of formula (2), the alkyl group may be linear or branched. The alkyl group preferably further has 1 to 12 carbon atoms, and the cycloalkyl group preferably further has 4 to 14 carbon atoms. Also, cycloaliphatic amine which is the R ¹ and R ² are bonded which may have a substituent cyclic structure having 4 to 12 carbon atoms are also preferred. Moreover, heterocyclic compounds become R ¹ and R ² are bonded which may have a substituent ring structure having 2 to 12 carbon atoms are also preferred.

R ³ , R ⁴ , R ⁵ and R ⁶ are each independently hydrogen, halogen, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfino group, sulfo group, sulfonate group, A phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, an ammonio group, or a monovalent organic group, which may be the same or different. Provided that at least one of R ³ , R ⁴ , R ⁵ and R ⁶ is a hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfino group, sulfo group, sulfonate group, phosphino group, A phosphinyl group, a phosphono group, a phosphonato group, an amino group, or an ammonio group; Two or more of R ³ , R ⁴ , R ^5, and R ⁶ may be bonded to form a cyclic structure, and may include a hetero atom bond.
Examples of halogen include fluorine, chlorine, bromine and the like.
The monovalent organic group is not particularly limited, and may be a saturated or unsaturated alkyl group, a saturated or unsaturated cycloalkyl group, an aryl group, an aralkyl group, and a saturated or unsaturated halogenated alkyl group, a cyano group, an isocyano group, Examples include cyanato group, isocyanato group, thiocyanato group, isothiocyanato group, alkoxy group, alkoxycarbonyl group, carbamoyl group, thiocarbamoyl group, carboxyl group, carboxylate group, acyl group, acyloxy group, and hydroxyimino group. These organic groups may contain bonds and substituents other than hydrocarbon groups such as heteroatoms in the organic group, and these may be linear or branched.

The bond other than the hydrocarbon group in the organic group of R ^{3 to} R ⁶ is not particularly limited as long as the effect of the present invention is not impaired. Amide bond, urethane bond, carbonate bond, sulfonyl bond, sulfinyl bond, azo bond and the like.
From the viewpoint of heat resistance, the bond other than the hydrocarbon group in the organic group includes an ether bond, a thioether bond, a carbonyl bond, a thiocarbonyl bond, an ester bond, an amide bond, a urethane bond, and an imino bond (—N═C (— R)-, -C (= NR)-: where R is a hydrogen atom or a monovalent organic group), a carbonate bond, a sulfonyl bond, or a sulfinyl bond.

The substituent other than the hydrocarbon group in the organic group of R ^{3 to} R ⁶ is not particularly limited as long as the effect of the present invention is not impaired. A halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a cyano group, Isocyano group, cyanato group, isocyanato group, thiocyanato group, isothiocyanato group, silyl group, silanol group, alkoxy group, alkoxycarbonyl group, carbamoyl group, thiocarbamoyl group, nitro group, nitroso group, carboxyl group, carboxylate group, acyl group Acyloxy group, sulfino group, sulfo group, sulfonate group, phosphino group, phosphinyl group, phosphono group, phosphonate group, hydroxyimino group, saturated or unsaturated alkyl ether group, saturated or unsaturated alkyl thioether group, aryl ether group, and Arylthioether group, amino Group (-NH2, -NHR, -NRR ': wherein, R and R' each independently represent a hydrocarbon group) include an ammonio group. Hydrogen contained in the substituent may be substituted with a hydrocarbon group. Further, the hydrocarbon group contained in the substituent may be any of linear, branched, and cyclic.
Among them, examples of the substituent other than the hydrocarbon group in the organic group of R ^{3 to} R ⁶ include a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a cyano group, an isocyano group, a cyanato group, an isocyanato group, a thiocyanato group, and an isothiocyanato group. , Silyl group, silanol group, alkoxy group, alkoxycarbonyl group, carbamoyl group, thiocarbamoyl group, nitro group, nitroso group, carboxyl group, carboxylate group, acyl group, acyloxy group, sulfino group, sulfo group, sulfonate group, phosphino Group, phosphinyl group, phosphono group, phosphonato group, hydroxyimino group, saturated or unsaturated alkyl ether group, saturated or unsaturated alkyl thioether group, aryl ether group and aryl thioether group are preferred.

Examples of the monovalent organic group include an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group, and a propyl group; a cycloalkyl group having 4 to 23 carbon atoms such as a cyclopentyl group and a cyclohexyl group; a cyclopentenyl group and a cyclohexenyl group. A cycloalkenyl group having 4 to 23 carbon atoms such as a group; an aryloxyalkyl group having 7 to 26 carbon atoms (-ROAr group) such as a phenoxymethyl group, a 2-phenoxyethyl group and a 4-phenoxybutyl group; a benzyl group, 3 An aralkyl group having 7 to 20 carbon atoms such as phenylpropyl group; an alkyl group having 2 to 21 carbon atoms having a cyano group such as cyanomethyl group and β-cyanoethyl group; 1 to 20 carbon atoms having a hydroxyl group such as hydroxymethyl group Alkyl group, methoxy group, ethoxy group, etc., C1-C20 alkoxy group, acetamide group, benzenesulfonamide group _{C 6 H 5 SO 2 NH 2} -) amide group having a carbon number of 2 to 21, such as a methylthio group, an alkylthio group (-SR group having 1 to 20 carbon atoms such as an ethylthio group), an acetyl group, carbon atoms such as benzoyl group 6 to 20 carbon atoms such as an acyl group having 1 to 20 carbon atoms, an methoxycarbonyl group, an acetoxy group or the like, an ester group having 2 to 21 carbon atoms (-COOR group and -OCOR group), a phenyl group, a naphthyl group, a biphenyl group, a tolyl group, etc. ˜20 aryl group, electron donating group and / or electron withdrawing group substituted aryl group having 6 to 20 carbon atoms, electron donating group and / or electron withdrawing group substituted benzyl group, cyano group, and It is preferably a methylthio group (—SCH ₃ ). The alkyl moiety may be linear, branched or cyclic.

Two or more of R ^{3 to} R ⁶ may be bonded to form a cyclic structure.
The cyclic structure is a combination of two or more selected from the group consisting of saturated or unsaturated alicyclic hydrocarbons, heterocycles, and condensed rings, and the alicyclic hydrocarbons, heterocycles, and condensed rings. The structure which becomes may be sufficient. For example, R ³ to R ⁶ are formed by combining two or more of them, naphthalene share atoms of the benzene ring of R ³ to R ⁶ are attached, anthracene, phenanthrene, and fused ring indene In this case, the absorption wavelength is preferable from the viewpoint of increasing the wavelength.

In the present invention, in particular, at least one of R ³ , R ⁴ , R ⁵ and R ⁶ is a hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfino group, sulfo group, sulfonate group. Group, phosphino group, phosphinyl group, phosphono group, phosphonato group, amino group, or ammonio group. By introducing at least one substituent as described above into the substituents R ^{3 to} R ⁶ , the wavelength of light to be absorbed can be adjusted, and the desired wavelength is absorbed by introducing the substituent. It can also be made to do. It is also possible to improve the solubility and compatibility with the polymer precursor to be combined. Thereby, it is possible to improve the sensitivity of the photosensitive resin composition in consideration of the absorption wavelength of the polymer precursor to be combined.

  As a guideline of what substituents should be introduced to shift the absorption wavelength with respect to a desired wavelength, the Interspection of the Ultraviolet Products (AI Scott 1964) and the spectrum of organic compounds The table described in the identification method 5th edition (RM Silverstein 1993) can be referred to.

Among them, compared the base generator according to the present ^invention, the R ^3, R 4, when at least one of ^{R 5} and ^{R 6} is a hydroxyl ^group, R ^3, R 4, does not contain a hydroxyl group at ^{R 5} and ^{R 6} Compound From the viewpoint of improving the solubility in a basic aqueous solution or the like and increasing the absorption wavelength. In particular, when R ⁶ is a phenolic hydroxyl group, a reaction site for cyclization of a compound isomerized to a cis isomer increases, which is preferable from the viewpoint of easy cyclization.

  The structure represented by the chemical formula (1) has a geometric isomer at the (—CH═CH—C (═O) —) moiety, but it is preferable to use only the trans isomer. However, cis isomers that are geometric isomers may be mixed during synthesis and purification steps and storage, and in this case, a mixture of trans isomer and cis isomer may be used. It is preferable that the ratio of cis-isomer is less than 10%.

The base generator represented by the chemical formula (1) preferably has a temperature (5% weight reduction temperature) of 100 ° C. or higher when heated to reduce 5% by weight from the initial weight, and more preferably 200 ° C. The above is preferable. For example, in the case of a polyimide precursor or a polybenzoxazole precursor, it is necessary to use a high-boiling solvent such as N-methyl-2-pyrrolidone when forming a coating film. Thus, the 5% weight loss temperature is high. In some cases, the coating film can be formed under drying conditions such that the influence of the residual solvent is reduced. Thereby, the reduction | decrease of the solubility contrast in the exposed part and the unexposed part by the influence of a residual solvent can be suppressed.
In the present invention, the 5% weight loss temperature is the time when the weight of the sample is reduced by 5% from the initial weight when the weight loss is measured using a thermogravimetric analyzer (that is, the sample weight becomes 95% of the initial weight). Temperature).

On the other hand, since it is preferable that impurities derived from the base generator of the present invention do not remain in the product using the photosensitive resin composition of the present invention, the base generator of the present invention is a heating process (after development) ( For example, when the polymer to be combined is a polyimide precursor, it is preferably decomposed or volatilized by an imidization process). Specifically, the base generator of the present invention preferably has a 5% weight loss temperature of 350 ° C. or lower, more preferably 300 ° C. or lower.
The 5% weight loss temperature of the base generator represented by the chemical formula (1) can be adjusted by appropriately selecting the substituents R ^{3 to} R ⁶ .
Moreover, it is preferable that the boiling point of the generated base is 25 ° C. or more because the handleability at room temperature is improved. When the boiling point of the generated base is not 25 ° C. or higher, when it is used as a coating film, the amine generated during drying tends to evaporate, which may make the operation difficult. When the generated base is used as a curing accelerator that does not remain in the film, if the weight loss of the generated base at 350 ° C. is 80% or more, the base remains in the cured polymer. It is preferable because it is easy to suppress the above. However, when the generated base is used as a crosslinking agent or a curing agent remaining in the film, the weight reduction of the generated base is not a problem.

The heating temperature for generating the base when using the base generator represented by the formula (1) is appropriately selected depending on the polymer precursor to be combined and the purpose, and is not particularly limited. Heating by the temperature (for example, room temperature) of the environment where the base generator is placed may be used, and in this case, the base is gradually generated. Further, since the base is also generated by heat generated as a by-product during irradiation with electromagnetic waves, heating may be performed substantially simultaneously with the heat generated as a by-product during irradiation with electromagnetic waves. From the viewpoint of increasing the reaction rate and generating the base efficiently, the heating temperature for generating the base is preferably 30 ° C. or higher, more preferably 60 ° C. or higher, still more preferably 100 ° C. or higher, Especially preferably, it is 120 degreeC or more. However, depending on the polymer precursors used in combination, for example, the unexposed part may be cured by heating at 60 ° C. or higher, so that the suitable heating temperature is not limited to the above.
Moreover, in order to prevent decomposition | disassembly other than base generation | occurrence | production of the base generator represented by said Formula (1), it is preferable to heat at 300 degrees C or less.

  The base generator represented by the formula (1) generates a base only by irradiation with electromagnetic waves, but generation of the base is promoted by heating appropriately. Therefore, in order to generate a base efficiently, when using the base generator represented by the formula (1), the base is generated by heating after exposure or simultaneously with exposure. Exposure and heating may be performed alternately. The most efficient method is a method of heating simultaneously with exposure.

  The method for synthesizing the base generator represented by the chemical formula (1) of the present invention will be described by taking 2-hydroxycinnamic acid amide as an example, but the present invention is not limited thereto. The base generator of the present invention can be synthesized by a plurality of conventionally known synthesis routes.

2-hydroxycinnamic amide can be synthesized, for example, by reacting 2-hydroxy cinnamic acid with cyclohexylamine. The desired product can be obtained by dissolving 2-hydroxycinnamic acid and cyclohexylamine in tetrahydrofuran in the presence of a condensing agent such as 1-ethyl-3- (3-dimethylaminopropyl) carbodiimide hydrochloride and stirring.
Cinnamic acid into which each substituent is introduced can be synthesized by performing wittig reaction, Knoevenagel reaction, or Perkin reaction on hydroxybenzaldehyde having a corresponding substituent. Among these, the wittig reaction is preferable from the viewpoint that a trans isomer can be selectively obtained. For example, the aldehyde having the corresponding substituent can be synthesized by performing Duff reaction or Vilsmeier-Haack reaction on phenol having the corresponding substituent.

  The base generator represented by the chemical formula (1) of the present invention absorbs at least a part of the exposure wavelength in order to sufficiently exhibit the function of base generation for the polymer precursor to be the final product. It is necessary to have. The wavelength of a high-pressure mercury lamp that is a general exposure light source includes 365 nm, 405 nm, and 436 nm. For this reason, it is preferable that the base generator represented by the chemical formula (1) of the present invention absorbs at least one electromagnetic wave having a wavelength of 365 nm, 405 nm, or 436 nm. In such a case, it is preferable because the number of applicable polymer precursors is further increased.

  The base generator represented by the chemical formula (1) has a molar extinction coefficient of 100 or more at an electromagnetic wave wavelength of 365 nm, or 1 or more at 405 nm, and the number of applicable polymer precursors further increases. It is preferable from the point.

The fact that the base generator represented by the chemical formula (1) of the present invention has absorption in the wavelength region is expressed by the chemical formula (1) in a solvent (for example, acetonitrile) that does not absorb in the wavelength region. bases generating agent 1 × ¹⁰ -4 mol / L or less of the concentration ^{(usually, 1 × 10 -4 mol / L~1} × 10 -5 mol / L or so. so as to give suitable absorption intensity, as appropriate, And may be clarified by measuring the absorbance with an ultraviolet-visible spectrophotometer (for example, UV-2550 (manufactured by Shimadzu Corporation)).

The base generator represented by the chemical formula (1) according to the present invention has excellent sensitivity as compared with conventionally used photobase generators, and therefore can be applied in various ways. A base such as an acid-base indicator, not limited to combining with a polymer precursor whose reaction to the final product is promoted by heating in the presence of a basic substance or in the presence of a basic substance, which will be described in detail later Thus, various photosensitive compositions can be formed in combination with a compound whose structure and physical properties change. Such photosensitive compositions can be used for paints, printing inks, sealants or adhesives, display devices, semiconductor devices, electronic components, micro electro mechanical systems (MEMS), optical members, or architecture. It can be used as a material forming material.
For example, in an image forming medium obtained by coating or impregnating a base material with an image forming layer containing at least a photobase generator and an acid-base indicator, the photobase generator is exposed to light. However, it can also be applied to a display device such as an image forming medium characterized in that a base that reacts with an acid-base indicator is generated and an image is formed.

<Photosensitive resin composition>
The photosensitive resin composition according to the present invention includes a polymer precursor whose reaction to a final product is promoted by heating with a basic substance or in the presence of a basic substance, and the following chemical formula according to the present invention: A base generator is contained, which is represented by (1) and generates a base by irradiation with electromagnetic waves and heating.

（式（１）中、Ｒ^１及びＲ^２は、それぞれ独立に、水素又は１価の有機基であり、同一であっても異なっていても良い。Ｒ^１及びＲ^２は、それらが結合して環状構造を形成していても良く、ヘテロ原子の結合を含んでいても良い。但し、Ｒ^１及びＲ^２の少なくとも１つは１価の有機基である。Ｒ^３、Ｒ^４、Ｒ^５及びＲ^６は、それぞれ独立に、水素、ハロゲン、水酸基、メルカプト基、スルフィド基、シリル基、シラノール基、ニトロ基、ニトロソ基、スルフィノ基、スルホ基、スルホナト基、ホスフィノ基、ホスフィニル基、ホスホノ基、ホスホナト基、アミノ基、アンモニオ基又は１価の有機基であり、同一であっても異なっていても良い。但し、Ｒ^３、Ｒ^４、Ｒ^５及びＲ^６の少なくとも１つが、水酸基、メルカプト基、スルフィド基、シリル基、シラノール基、ニトロ基、ニトロソ基、スルフィノ基、スルホ基、スルホナト基、ホスフィノ基、ホスフィニル基、ホスホノ基、ホスホナト基、アミノ基、又はアンモニオ基である。Ｒ^３、Ｒ^４、Ｒ^５及びＲ^６は、それらの２つ以上が結合して環状構造を形成していても良く、ヘテロ原子の結合を含んでいても良い。）

(In Formula (1), R ¹ and R ² are each independently hydrogen or a monovalent organic group, and may be the same or different. R ¹ and R ² are bonded to each other. ^May form a cyclic structure and may include a heteroatom bond, provided that at least one of R ¹ and R ² is a monovalent organic group R ³ , R ⁴ , R ⁵ And R ⁶ are each independently hydrogen, halogen, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfino group, sulfo group, sulfonate group, phosphino group, phosphinyl group, phosphono group , Phosphonato group, amino group, ammonio group or monovalent organic group, which may be the same or different, provided that at least one of R ³ , R ⁴ , R ⁵ and R ⁶ is a hydroxyl group, mercapto Group, sul I de group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonate group, an amino group, or an ammonio a group .R ^3, R ⁴ , R ^5, and R ⁶ may be bonded to each other to form a cyclic structure or may include a hetero atom bond.

As described above, the base generator represented by the formula (1) has the specific structure described above, and the (—CH═CH—C (═O) —) moiety is converted into a cis form upon irradiation with electromagnetic waves. And the base (NHR ¹ R ² ) is generated by further heating. Further, when the amine is generated, the structure represented by the formula (1) is cyclized, and as a result, the phenolic hydroxyl group is lost, and the solubility of the basic aqueous solution in the developer is lowered.
The polymer precursor is promoted to react with the final product by the action of the basic substance generated from the base generator, and usually changes in solubility.

  Due to such a change in solubility of the base generator and the polymer precursor, the photosensitive resin composition according to the present invention has a large difference in solubility between the exposed part and the unexposed part. The characteristic contrast increases, and pattern formation becomes possible.

  As described above, since the base generator represented by the formula (1) has higher sensitivity than the conventional photobase generator, the photosensitive resin composition of the present invention has high sensitivity. In addition, the photosensitive resin composition of the present invention has a wide range of applicable polymer precursors, and is widely applied in fields where it is possible to make use of characteristics such as solubility changes of the polymer precursor and the base generator. The For example, it is suitably applied in a field where the characteristics of the photosensitive polyimide precursor resin composition and its imidized product can be utilized. According to the present invention, a polyimide precursor that is originally highly soluble in a developer can also be suitably used.

Hereinafter, the constituent components of the photosensitive resin composition according to the present invention will be described. The base generator used in the photosensitive resin composition according to the present invention is the same as the base generator according to the present invention. Since it can be used, explanation here is omitted. Therefore, the polymer precursor and other components that can be appropriately included as necessary will be described in order.
Each of the base generator and the polymer precursor may be used alone or in combination of two or more.

<Polymer precursor>
The polymer precursor used in the photosensitive resin composition of the present invention means a substance that finally becomes a polymer exhibiting the desired physical properties by reaction, and the reaction includes intermolecular reaction and intramolecular reaction. The polymer precursor itself may be a relatively low molecular compound or a high molecular compound.
The polymer precursor of the present invention is a compound whose reaction to the final product is promoted by a basic substance or by heating in the presence of the basic substance. Here, in the aspect in which the polymer precursor is accelerated by the basic substance or by heating in the presence of the basic substance, the reaction to the final product is accelerated only by the action of the basic substance. In addition to the mode of changing to the final product, the mode includes the mode in which the reaction temperature of the polymer precursor to the final product is lowered by the action of the basic substance as compared to the case where there is no action of the basic substance. .
If there is a reaction temperature difference due to the presence or absence of such a basic substance, an appropriate temperature at which only the polymer precursor coexisting with the basic substance reacts to the final product using the reaction temperature difference. By heating at, only the polymer precursor coexisting with the basic substance reacts with the final product, and the solubility in a solvent such as a developer changes. Therefore, the solubility of the polymer precursor in the solvent can be changed depending on the presence or absence of the basic substance, and thus patterning by development can be performed using the solvent as a developer.

  The polymer precursor of the present invention can be used without particular limitation as long as the reaction to the final product is promoted by the basic substance as described above or by heating in the presence of the basic substance. is there. The following are typical examples, but the invention is not limited to these.

[Polymer precursor that becomes polymer by intermolecular reaction]
Examples of the polymer precursor that becomes a target polymer by intermolecular reaction include a compound having a reactive substituent and a polymerization reaction and a polymer, or a compound that forms a bond (crosslinking reaction) between molecules. And polymers. Examples of the reactive substituent include an epoxy group, an oxetane group, a thiirane group, an isocyanate group, a hydroxyl group, and a silanol group. The polymer precursor also includes a compound that undergoes hydrolysis and polycondensation between molecules, and the reactive substituent includes -SiX of the polysiloxane precursor (where X is an alkoxy group, an acetoxy group, an oxime). A hydrolyzable group selected from the group consisting of a group, an enoxy group, an amino group, an aminoxy group, an amide group, and a halogen).

Examples of the compound having a reactive substituent and undergoing a polymerization reaction include a compound having one or more epoxy groups, a compound having one or more oxetane groups, and a compound having one or more thiirane groups. .
Examples of the polymer that has a reactive substituent and undergoes a polymerization reaction include a polymer having two or more epoxy groups (epoxy resin), a polymer having two or more oxetane groups, and two or more thiiranes. And a polymer having a group. The compounds and polymers having an epoxy group are specifically described below, but compounds and polymers having an oxetane group and a thiirane group can also be used in the same manner.

(Compound having epoxy group and polymer)
The compound and polymer having one or more epoxy groups are not particularly limited as long as they have one or more epoxy groups in the molecule, and conventionally known compounds can be used.
The base generator generally also has a function as a curing catalyst for a compound having one or more epoxy groups in the molecule.

When using a compound having one or more epoxy groups in the molecule or a polymer (epoxy resin) having two or more epoxy groups in the molecule, two functional groups having reactivity with the epoxy group are contained in the molecule. Two or more compounds may be used in combination. Here, examples of the functional group having reactivity with an epoxy group include a carboxyl group, a phenolic hydroxyl group, a mercapto group, a primary or secondary aromatic amino group, and the like. It is particularly preferable to have two or more of these functional groups in one molecule in consideration of three-dimensional curability.
Moreover, it is preferable to use what introduce | transduced the said functional group into the polymer side chain of weight average molecular weight 3,000-100,000. If it is less than 3,000, the strength of the film is lowered and tackiness is caused on the surface of the cured film, so that impurities and the like are likely to adhere. On the other hand, if it exceeds 100,000, the viscosity may increase, which is not preferable.

  Examples of the polymer having one or more epoxy groups in the molecule include epoxy resins, bisphenol A type epoxy resins derived from bisphenol A and epichlorohydrin, bisphenol F type epoxy derived from bisphenol F and epichlorohydrin. Resin, bisphenol S type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy resin, alicyclic epoxy resin, diphenyl ether type epoxy resin, hydroquinone type epoxy resin, Polyfunctional epoxy resins such as naphthalene type epoxy resin, biphenyl type epoxy resin, fluorene type epoxy resin, trifunctional type epoxy resin and tetrafunctional type epoxy resin, There are lysidyl ester type epoxy resins, glycidyl amine type epoxy resins, hydantoin type epoxy resins, isocyanurate type epoxy resins, aliphatic chain epoxy resins, etc. These epoxy resins may be halogenated and hydrogenated. It may be. As commercially available epoxy resin products, for example, JER Coat 828, 1001, 801N, 806, 807, 152, 604, 630, 871, YX8000, YX8034, YX4000 manufactured by Japan Epoxy Resin Co., Ltd., Epicron manufactured by DIC Corporation 830, EXA835LV, HP4032D, HP820, EP4100 series, EP4000 series, EPU series, manufactured by ADEKA Corporation, Celoxide series (2021, 2021P, 2083, 2085, 3000, etc.) manufactured by Daicel Chemical Industries, Inc. Series, YD series, YDF series, YDFN series, YDB series by Toto Kasei Co., Ltd., Denacol series by Nagase ChemteX, Epolite series by Kyoeisha Chemical Co., Ltd. Although's etc. but the invention is not limited thereto. Two or more of these epoxy resins may be used in combination. Among these, bisphenol-type epoxy resins are preferable because grades having different molecular weights are widely available as compared with other various epoxy compounds, and adhesiveness and reactivity can be arbitrarily set.

On the other hand, examples of the compound that undergoes a cross-linking reaction between molecules include a combination of a compound having two or more isocyanate groups in the molecule and a compound having two or more hydroxyl groups in the molecule. By reacting with a hydroxyl group, a urethane bond is formed between the molecules, which can be a polymer.
As a polymer that undergoes a cross-linking reaction between molecules, for example, a combination of a polymer having two or more isocyanate groups in the molecule (isocyanate resin) and a polymer having two or more hydroxyl groups in the molecule (polyol) Is mentioned.
Further, a combination of a compound that undergoes a crosslinking reaction between molecules and a polymer may be used. For example, a combination of a polymer having two or more isocyanate groups in the molecule (isocyanate resin) and a compound having two or more hydroxyl groups in the molecule, and a compound having two or more isocyanate groups in the molecule Examples include a combination of polymers (polyols) having two or more hydroxyl groups in the molecule.

(Compounds and polymers having isocyanate groups)
As the compound and polymer having an isocyanate group, any known compound can be used without particular limitation as long as it has two or more isocyanate groups in the molecule. As such compounds, in addition to low molecular weight compounds represented by p-phenylene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,5-naphthalene diisocyanate, hexamethylene diisocyanate, oligomers, A polymer having an isocyanate group in the side chain or terminal of a polymer having a weight average molecular weight of 3,000 or more may be used.

(Compounds and polymers having hydroxyl groups)
The compound and polymer having an isocyanate group are usually used in combination with a compound having a hydroxyl group in the molecule. The compound having such a hydroxyl group is not particularly limited as long as it has two or more hydroxyl groups in the molecule, and known compounds can be used. As such a compound, in addition to low molecular weight compounds such as ethylene glycol, propylene glycol, glycerin, diglycerin and pentaerythritol, a polymer having a weight average molecular weight of 3,000 or more has a hydroxyl group in the side chain or terminal. A molecule may be used.

(Polysiloxane precursor)
Examples of the compound that undergoes hydrolysis and polycondensation between molecules include polysiloxane precursors.
As the polysiloxane precursor, Y _n SiX _(4-n) (wherein Y represents an alkyl group, fluoroalkyl group, vinyl group, or phenyl group which may have a substituent, and X represents an alkoxy group. , An acetoxy group, an oxime group, an enoxy group, an amino group, an aminoxy group, an amide group, and a hydrolyzable group selected from the group consisting of halogens, where n is an integer from 0 to 3. Examples include organosilicon compounds and hydrolyzed polycondensates of the organosilicon compounds. Among these, those in which n is 0 to 2 in the above formula are preferable. In addition, the hydrolyzable group is preferably an alkoxy group because the silica-dispersed oligomer solution is easily prepared and easily available.
As said organosilicon compound, a well-known thing can be used without a restriction | limiting in particular. For example, trimethoxysilane, triethoxysilane, methyltrichlorosilane, methyltrimethoxysilane, methyltriethoxysilane, methyltriisopropoxysilane, methyltrit-butoxysilane, ethyltribromosilane, ethyltrimethoxysilane, ethyltriethoxysilane , N-propyltriethoxysilane, n-hexyltrimethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, tetramethoxysilane, tetraethoxysilane, tetrabutoxysilane, dimethoxydiethoxysilane, dimethyldichlorosilane, dimethyldimethoxysilane , Diphenyldimethoxysilane, vinyltrimethoxysilane, trifluoropropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane γ-glycidoxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane, γ-mercaptopropyltrimethoxysilane, β- (3 4-epoxycyclohexyl) ethyltrimethoxysilane, fluoroalkylsilanes known as fluorine-based silane coupling agents, and their hydrolysis condensates or cohydrolysis condensates; and mixtures thereof.

[Polymer precursor that becomes polymer by intramolecular ring-closing reaction]
Examples of the polymer precursor that finally becomes a polymer that exhibits the desired physical properties by the intramolecular ring-closing reaction include a polyimide precursor and a polybenzoxazole precursor. These precursors may be a mixture of two or more separately synthesized polymer precursors.
Hereinafter, although the polyimide precursor and polybenzoxazole precursor which are the preferable polymer precursors of this invention are demonstrated, this invention is not limited to these.

(Polyimide precursor)
As a polyimide precursor, the polyimide precursor represented by following formula (3) is mentioned.

（式（３）中、Ｒ^７は４価の有機基である。Ｒ^８は２価の有機基である。Ｒ^7ａ及びＲ^７bは、水素原子、又は１価の有機基である。ｎは１以上の自然数である。）

(In Formula (3), R ⁷ is a tetravalent organic group. R ⁸ is a divalent organic group. R ^7a and R ^7b are a hydrogen atom or a monovalent organic group. N is (It is a natural number of 1 or more.)

Examples of the case where R ^7a and R ^7b are monovalent organic groups include alkyl groups, alkenyl groups, alkynyl groups, aryl groups, and C _n H _2n OC _m H _{2m + 1} containing an ether bond thereto. The structure represented can be mentioned.

  As the polyimide precursor, a polyamic acid represented by the following formula (3 ') is preferably used from the viewpoint of alkali developability.

（式（３）中、式（３）中、Ｒ^７は４価の有機基である。Ｒ^８は２価の有機基である。ｎは１以上の自然数である。）

(In formula (3), in formula (3), R ⁷ is a tetravalent organic group. R ⁸ is a divalent organic group. N is a natural number of 1 or more.)

In the formulas (3) and (3 ′), the tetravalent R ⁷ represents a tetracarboxylic acid residue derived from an acid dianhydride or the like, and the divalent R ⁸ represents a diamine residue.
In addition, although the tetravalence of R ⁷ shows only the valence for bonding with an acid, it may have another substituent. Similarly, the divalent value of R ⁸ indicates only the valence for bonding to the amine, but may have other substituents.

  Polyamic acid is preferable because it can be obtained by simply mixing acid dianhydride and diamine in a solution, so that it can be synthesized by a one-step reaction, and can be synthesized easily and at low cost.

  As a secondary effect, when the polymer precursor to be used is a polyamic acid, the final curing temperature is less than 300 ° C., more preferably because the temperature required for imidization is low due to the catalytic effect of the basic substance. It can be lowered to 250 ° C. or lower. In order to imidize the conventional polyamic acid, the final cure temperature had to be 300 ° C. or higher, so the use was limited. However, it became possible to lower the final cure temperature, so a wider range Applicable to usage.

Polyamic acid is obtained by the reaction of acid dianhydride and diamine. From the viewpoint of imparting excellent heat resistance and dimensional stability to the finally obtained polyimide, in the chemical formula (3 ′), R ⁷ or R ⁸ is preferably an aromatic compound, more preferably R ⁷ and R ⁸ are aromatic compounds. At this time, in R ⁷ of the chemical formula (3 ′), four groups ((—CO—) ₂ (—COOH) ₂ ) bonded to R ⁷ may be bonded to the same aromatic ring. It may be bonded to different aromatic rings. Similarly, in R ⁸ of the chemical formula (3 ′), two groups ((—NH—) ₂ ) bonded to R ⁸ may be bonded to the same aromatic ring, and may be bonded to different aromatic rings. It may be combined.

  In addition, the polyamic acid represented by the chemical formula (3 ′) may be composed of a single repeating unit or may be composed of two or more kinds of repeating units.

  As a method for producing the polyimide precursor of the present invention, a conventionally known method can be applied. For example, (1) A method of synthesizing a polyamic acid as a precursor from an acid dianhydride and a diamine. (2) A polyimide precursor is synthesized by reacting a carboxylic acid such as an ester acid or an amic acid monomer with a monohydric alcohol, an amino compound, or an epoxy compound synthesized with an acid dianhydride. However, the method is not limited to this.

  Examples of the acid dianhydride applicable to the reaction for obtaining the polyimide precursor of the present invention include ethylene tetracarboxylic dianhydride, butane tetracarboxylic dianhydride, cyclobutane tetracarboxylic dianhydride, and methylcyclobutane. Aliphatic tetracarboxylic dianhydrides such as tetracarboxylic dianhydride and cyclopentanetetracarboxylic dianhydride; pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride 2,2 ′, 3,3′-benzophenone tetracarboxylic dianhydride, 2,3 ′, 3,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic Acid dianhydride, 2,2 ', 3,3'-biphenyltetracarboxylic dianhydride, 2,3', 3,4'-biphenyltetracarboxylic acid Anhydride, 2,2 ′, 6,6′-biphenyltetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3- Dicarboxyphenyl) propane dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride, 1,1-bis (2,3-di Carboxyphenyl) ethane dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, 2,2-bis (3,4-dicarboxy) Phenyl) -1,1,1,3,3,3-hexafluoropropane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) -1,1,1,3,3,3-hexa Fluoropropane dianhydride, , 3-bis [(3,4-dicarboxy) benzoyl] benzene dianhydride, 1,4-bis [(3,4-dicarboxy) benzoyl] benzene dianhydride, 2,2-bis {4- [ 4- (1,2-dicarboxy) phenoxy] phenyl} propane dianhydride,

2,2-bis {4- [3- (1,2-dicarboxy) phenoxy] phenyl} propane dianhydride, bis {4- [4- (1,2-dicarboxy) phenoxy] phenyl} ketone dianhydride Bis {4- [3- (1,2-dicarboxy) phenoxy] phenyl} ketone dianhydride, 4,4′-bis [4- (1,2-dicarboxy) phenoxy] biphenyl dianhydride, 4,4′-bis [3- (1,2-dicarboxy) phenoxy] biphenyl dianhydride, bis {4- [4- (1,2-dicarboxy) phenoxy] phenyl} ketone dianhydride, bis { 4- [3- (1,2-dicarboxy) phenoxy] phenyl} ketone dianhydride, bis {4- [4- (1,2-dicarboxy) phenoxy] phenyl} sulfone dianhydride, bis {4- [3- (1,2-dicarbo Cis) phenoxy] phenyl} sulfone dianhydride, bis {4- [4- (1,2-dicarboxy) phenoxy] phenyl} sulfide dianhydride, bis {4- [3- (1,2-dicarboxy) Phenoxy] phenyl} sulfide dianhydride, 2,2-bis {4- [4- (1,2-dicarboxy) phenoxy] phenyl} -1,1,1,3,3,3-hexafluoropropane dianhydride 2,2-bis {4- [3- (1,2-dicarboxy) phenoxy] phenyl} -1,1,1,3,3,3-hexafluoropropane dianhydride, 2,3,6 , 7-naphthalenetetracarboxylic dianhydride, 1,1,1,3,3,3-hexafluoro-2,2-bis (2,3- or 3,4-dicarboxyphenyl) propane dianhydride, 1,4,5,8-naphthalenetetraca Boronic acid dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic Acid dianhydride, 2,3,6,7-anthracenetetracarboxylic dianhydride, 1,2,7,8-phenanthrenetetracarboxylic dianhydride, pyridinetetracarboxylic dianhydride, sulfonyldiphthalic anhydride , Aromatic tetra such as m-terphenyl-3,3 ′, 4,4′-tetracarboxylic dianhydride, p-terphenyl-3,3 ′, 4,4′-tetracarboxylic dianhydride Examples thereof include carboxylic dianhydrides. These may be used alone or in combination of two or more. And as a particularly preferred tetracarboxylic dianhydride, pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyltetra Carboxylic dianhydride, 2,2 ′, 6,6′-biphenyltetracarboxylic dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, 2,2-bis (3,4-di Carboxyphenyl) -1,1,1,3,3,3-hexafluoropropane dianhydride.

  When acid dianhydride into which fluorine is introduced or acid dianhydride having an alicyclic skeleton is used as the acid dianhydride to be used in combination, the physical properties such as solubility and thermal expansion coefficient are adjusted without significantly impairing transparency. It is possible. Also, rigid acid dianhydrides such as pyromellitic acid anhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, etc. If used, the linear thermal expansion coefficient of the finally obtained polyimide becomes small, but it tends to inhibit the improvement of transparency, so it may be used in combination while paying attention to the copolymerization ratio.

  On the other hand, the amine component can also be used alone or in combination of two or more diamines. The diamine component used is not limited, and p-phenylenediamine, m-phenylenediamine, o-phenylenediamine, 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 3, 3'-diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl Sulfone, 3,3′-diaminobenzophenone, 4,4′-diaminobenzophenone, 3,4′-diaminobenzophenone, 3,3′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, 3,4′-diaminodiphenylmethane, , 2-di (3-aminophenyl) propane, 2,2-di (4-aminophenyl) propane, 2- (3-aminophenyl) -2- (4-aminophenyl) propane, 2,2-di ( 3-aminophenyl) -1,1,1,3,3,3-hexafluoropropane, 2,2-di (4-aminophenyl) -1,1,1,3,3,3-hexafluoropropane, 2- (3-aminophenyl) -2- (4-aminophenyl) -1,1,1,3,3,3-hexafluoropropane, 1,1-di (3-aminophenyl) -1-phenylethane 1,1-di (4-aminophenyl) -1-phenylethane, 1- (3-aminophenyl) -1- (4-aminophenyl) -1-phenylethane, 1,3-bis (3-amino) Phenoxy) benzene, 1,3-bis (4-a Nophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (3-aminobenzoyl) benzene, 1,3-bis ( 4-aminobenzoyl) benzene, 1,4-bis (3-aminobenzoyl) benzene, 1,4-bis (4-aminobenzoyl) benzene, 1,3-bis (3-amino-α, α-dimethylbenzyl) Benzene, 1,3-bis (4-amino-α, α-dimethylbenzyl) benzene, 1,4-bis (3-amino-α, α-dimethylbenzyl) benzene, 1,4-bis (4-amino-) α, α-dimethylbenzyl) benzene, 1,3-bis (3-amino-α, α-ditrifluoromethylbenzyl) benzene, 1,3-bis (4-amino-α, α-ditrifluoromethyl) Rubenzyl) benzene, 1,4-bis (3-amino-α, α-ditrifluoromethylbenzyl) benzene, 1,4-bis (4-amino-α, α-ditrifluoromethylbenzyl) benzene, 2,6- Bis (3-aminophenoxy) benzonitrile, 2,6-bis (3-aminophenoxy) pyridine, 4,4′-bis (3-aminophenoxy) biphenyl, 4,4′-bis (4-aminophenoxy) biphenyl Bis [4- (3-aminophenoxy) phenyl] ketone, bis [4- (4-aminophenoxy) phenyl] ketone, bis [4- (3-aminophenoxy) phenyl] sulfide, bis [4- (4- Aminophenoxy) phenyl] sulfide,

Bis [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (4-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] ether, bis [4- (4-amino) Phenoxy) phenyl] ether, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [3- (3-Aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl] -1,1,1,3 3,3-hexafluoropropane, 1,3-bis [4- (3-aminophenoxy) benzoyl] benzene, 1,3-bis [4- (4-aminophenoxy) benzoyl] ben 1,4-bis [4- (3-aminophenoxy) benzoyl] benzene, 1,4-bis [4- (4-aminophenoxy) benzoyl] benzene, 1,3-bis [4- (3-amino Phenoxy) -α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-aminophenoxy) -α, α-dimethylbenzyl] benzene, 1,4-bis [4- (3-aminophenoxy) -Α, α-dimethylbenzyl] benzene, 1,4-bis [4- (4-aminophenoxy) -α, α-dimethylbenzyl] benzene, 4,4'-bis [4- (4-aminophenoxy) benzoyl ] Diphenyl ether, 4,4′-bis [4- (4-amino-α, α-dimethylbenzyl) phenoxy] benzophenone, 4,4′-bis [4- (4-amino-α, α-dimethylbenzen) ) Phenoxy] diphenylsulfone, 4,4′-bis [4- (4-aminophenoxy) phenoxy] diphenylsulfone, 3,3′-diamino-4,4′-diphenoxybenzophenone, 3,3′-diamino-4 , 4′-Dibiphenoxybenzophenone, 3,3′-diamino-4-phenoxybenzophenone, 3,3′-diamino-4-biphenoxybenzophenone, 6,6′-bis (3-aminophenoxy) -3,3 Such as 3 ′, 3′-tetramethyl-1,1′-spirobiindane, 6,6′-bis (4-aminophenoxy) -3,3,3 ′, 3′-tetramethyl-1,1′-spirobiindane, etc. Aromatic amines;

  1,3-bis (3-aminopropyl) tetramethyldisiloxane, 1,3-bis (4-aminobutyl) tetramethyldisiloxane, α, ω-bis (3-aminopropyl) polydimethylsiloxane, α, ω -Bis (3-aminobutyl) polydimethylsiloxane, bis (aminomethyl) ether, bis (2-aminoethyl) ether, bis (3-aminopropyl) ether, bis (2-aminomethoxy) ethyl] ether, bis [ 2- (2-aminoethoxy) ethyl] ether, bis [2- (3-aminoprotoxy) ethyl] ether, 1,2-bis (aminomethoxy) ethane, 1,2-bis (2-aminoethoxy) ethane 1,2-bis [2- (aminomethoxy) ethoxy] ethane, 1,2-bis [2- (2-aminoethoxy) ethoxy] ethane Ethylene glycol bis (3-aminopropyl) ether, diethylene glycol bis (3-aminopropyl) ether, triethylene glycol bis (3-aminopropyl) ether, ethylenediamine, 1,3-diaminopropane, 1,4-diaminobutane, 1 , 5-diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, 1,12 -Aliphatic amines such as diaminododecane;

  1,2-diaminocyclohexane, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, 1,2-di (2-aminoethyl) cyclohexane, 1,3-di (2-aminoethyl) cyclohexane, 1,4 -Di (2-aminoethyl) cyclohexane, bis (4-aminocyclohexyl) methane, 2,6-bis (aminomethyl) bicyclo [2.2.1] heptane, 2,5-bis (aminomethyl) bicyclo [2.2.1] Alicyclic diamines such as heptane. Examples of guanamines include acetoguanamine, benzoguanamine, and the like, and some or all of the hydrogen atoms on the aromatic ring of the diamine are fluoro group, methyl group, methoxy group, trifluoromethyl group, or trifluoromethoxy group. Diamines substituted with substituents selected from the group can also be used.

  Furthermore, depending on the purpose, any one or two or more of the ethynyl group, benzocyclobuten-4′-yl group, vinyl group, allyl group, cyano group, isocyanate group, and isopropenyl group serving as a crosslinking point, Even if it introduce | transduces into some or all of the hydrogen atoms on the aromatic ring of diamine as a substituent, it can be used.

  The diamine can be selected depending on the desired physical properties. If a rigid diamine such as p-phenylenediamine is used, the finally obtained polyimide has a low expansion coefficient. Rigid diamines include p-phenylenediamine, m-phenylenediamine, 1,4-diaminonaphthalene, 1,5-diaminonaphthalene, 2, 6 as diamines in which two amino groups are bonded to the same aromatic ring. -Diaminonaphthalene, 2,7-diaminonaphthalene, 1,4-diaminoanthracene and the like can be mentioned.

  In addition, diamines in which two or more aromatic rings are bonded by a single bond, and two or more amino groups are each bonded directly or as part of a substituent on a separate aromatic ring, for example, There exists what is represented by following formula (4). Specific examples include benzidine and the like.

（化学式（４）中、ａは１以上の自然数、アミノ基はベンゼン環同士の結合に対して、メタ位または、パラ位に結合する。）

(In the chemical formula (4), a is a natural number of 1 or more, and the amino group is bonded to the meta position or the para position with respect to the bond between the benzene rings.)

Furthermore, in the above formula (4), it is also possible to use a diamine having a substituent at a position where the amino group on the benzene ring is not substituted without being involved in the bond with another benzene ring. These substituents are monovalent organic groups, but they may be bonded to each other.
Specific examples include 2,2′-dimethyl-4,4′-diaminobiphenyl, 2,2′-ditrifluoromethyl-4,4′-diaminobiphenyl, 3,3′-dichloro-4,4′-diamino. Biphenyl, 3,3′-dimethoxy-4,4′-diaminobiphenyl, 3,3′-dimethyl-4,4′-diaminobiphenyl and the like can be mentioned.

  When the finally obtained polyimide is used as an optical waveguide or an optical circuit component, the transmittance for electromagnetic waves having a wavelength of 1 μm or less can be improved by introducing fluorine as a substituent of the aromatic ring.

On the other hand, when a diamine having a siloxane skeleton such as 1,3-bis (3-aminopropyl) tetramethyldisiloxane is used as the diamine, the elastic modulus of the finally obtained polyimide is lowered and the glass transition temperature is lowered. be able to.
Here, the selected diamine is preferably an aromatic diamine from the viewpoint of heat resistance. However, depending on the desired physical properties, the diamine may be an aliphatic diamine or siloxane within a range not exceeding 60 mol%, preferably not exceeding 40 mol%. Non-aromatic diamines such as diamines may be used.

On the other hand, in order to synthesize a polyimide precursor, for example, while cooling a solution prepared by dissolving 4,4′-diaminodiphenyl ether as an amine component in an organic polar solvent such as N-methylpyrrolidone, an equimolar amount of 3,4 3 ′, 4,4′-biphenyltetracarboxylic dianhydride is gradually added and stirred to obtain a polyimide precursor solution.
The polyimide precursor thus synthesized should have a copolymerization ratio of the aromatic acid component and / or aromatic amine component as large as possible when the final polyimide obtained is required to have heat resistance and dimensional stability. Is preferred. Specifically, the proportion of the aromatic acid component in the acid component constituting the repeating unit of the imide structure is preferably 50 mol% or more, particularly preferably 70 mol% or more, and the amine component constituting the repeating unit of the imide structure The proportion of the aromatic amine component in the total is preferably 40 mol% or more, particularly preferably 60 mol% or more, and particularly preferably a wholly aromatic polyimide.

<Polybenzoxazole precursor>
As the polybenzoxazole precursor used in the present invention, a polyamide alcohol having a repeating unit represented by the following chemical formula (5) is preferably used.

  Polyamide alcohol can be synthesized by a conventionally known method. For example, it can be obtained by addition reaction of a dicarboxylic acid derivative such as a dicarboxylic acid halide and dihydroxydiamine in an organic solvent.

（化学式（５）中、Ｒ^９は２価の有機基である。Ｒ^１０は４価の有機基である。ｎは１以上の自然数である。）

(In the chemical formula (5), R ⁹ is a divalent organic group. R ¹⁰ is a tetravalent organic group. N is a natural number of 1 or more.)

In addition, although the divalent value of R ⁹ indicates only the valence for bonding with an acid, it may have another substituent. Similarly, the tetravalent value of R ¹⁰ indicates only the valency for bonding with an amine and a hydroxyl group, but may have other substituents.

Polyamide alcohol having a repeating unit represented by the chemical formula (5) gives excellent heat resistance and dimensional stability to the finally obtained polybenzoxazole. In the chemical formula (5), R ⁹ or R ¹⁰ is preferably an aromatic compound, and R ⁹ and R ¹⁰ are more preferably aromatic compounds. At this time, in R ⁹ of the chemical formula (5), two groups (—CO—) ₂ bonded to R ⁹ may be bonded to the same aromatic ring or bonded to different aromatic rings. May be. Similarly, in R ¹⁰ of the chemical formula (5), four groups ((—NH—) ₂ (—OH) ₂ ) bonded to R ¹⁰ may be bonded to the same aromatic ring, It may be bonded to different aromatic rings.

  The polyamide alcohol represented by the chemical formula (5) may be composed of a single repeating unit or may be composed of two or more kinds of repeating units.

  Examples of the dicarboxylic acid and its derivatives applicable to the reaction for obtaining the polybenzoxazole precursor include phthalic acid, isophthalic acid, terephthalic acid, 4,4′-benzophenone dicarboxylic acid, and 3,4′-benzophenone dicarboxylic acid. Acid, 3,3′-benzophenone dicarboxylic acid, 4,4′-biphenyl dicarboxylic acid, 3,4′-biphenyl dicarboxylic acid, 3,3′-biphenyl dicarboxylic acid, 4,4′-diphenyl ether dicarboxylic acid, 3,4 '-Diphenyl ether dicarboxylic acid, 3,3'-diphenyl ether dicarboxylic acid, 4,4'-diphenyl sulfone dicarboxylic acid, 3,4'-diphenyl sulfone dicarboxylic acid, 3,3'-diphenyl sulfone dicarboxylic acid, 4,4'- Hexafluoroisopropylidene dibenzoic acid, 4 4′-dicarboxydiphenylamide, 1,4-phenylenediethanoic acid, 1,1-bis (4-carboxyphenyl) -1-phenyl-2,2,2-trifluoroethane, bis (4-carboxyphenyl) Tetraphenyldisiloxane, bis (4-carboxyphenyl) tetramethyldisiloxane, bis (4-carboxyphenyl) sulfone, bis (4-carboxyphenyl) methane, 5-t-butylisophthalic acid, 5-bromoisophthalic acid, 5 -Fluoroisophthalic acid, 5-chloroisophthalic acid, 2,2-bis- (p-carboxyphenyl) propane, 4,4 '-(p-phenylenedioxy) dibenzoic acid, 2,6-naphthalenedicarboxylic acid, or These acid halides and active esters with hydroxybenzotriazole, etc. It can be exemplified, but the invention is not limited thereto. These may be used alone or in combination of two or more.

  Specific examples of hydroxydiamine include, for example, 3,3′-dihydroxybenzidine, 3,3′-diamino-4,4′-dihydroxybiphenyl, 4,4′-diamino-3,3′-dihydroxybiphenyl, 3,3′-diamino-4,4′-dihydroxydiphenylsulfone, 4,4′-diamino-3,3′-dihydroxydiphenylsulfone, bis- (3-amino-4-hydroxyphenyl) methane, 2,2- Bis- (3-amino-4-hydroxyphenyl) propane, 2,2-bis- (3-amino-4-hydroxyphenyl) hexafluoropropane, 2,2-bis- (4-amino-3-hydroxyphenyl) Hexafluoropropane, bis- (4-amino-3-hydroxyphenyl) methane, 2,2-bis- (4-amino-3- Droxyphenyl) propane, 4,4′-diamino-3,3′-dihydroxybenzophenone, 3,3′-diamino-4,4′-dihydroxybenzophenone, 4,4′-diamino-3,3′-dihydroxydiphenyl ether 3,3′-diamino-4,4′-dihydroxydiphenyl ether, 1,4-diamino-2,5-dihydroxybenzene, 1,3-diamino-2,4-dihydroxybenzene, 3-diamino-4,6- Examples thereof include, but are not limited to, dihydroxybenzene. These may be used alone or in combination of two or more.

Polymer precursors such as polyimide precursors and polybenzoxazole precursors have a film thickness of 1 μm in order to increase the sensitivity when a photosensitive resin composition is used and to obtain a pattern shape that accurately reproduces the mask pattern. Furthermore, it is preferable that the transmittance is at least 5% or more with respect to the exposure wavelength, and it is more preferable that the transmittance is 15% or more.
The high transmittance of polymer precursors such as polyimide precursors and polybenzoxazole precursors with respect to the exposure wavelength means that there is little loss of electromagnetic waves, and a highly sensitive photosensitive resin composition is used. Obtainable.

  In addition, when exposure is performed using a high-pressure mercury lamp, which is a general exposure light source, a transmittance with respect to an electromagnetic wave having a wavelength of at least 436 nm, 405 nm, and 365 nm is formed on a film having a thickness of 1 μm. Is preferably 5% or more, more preferably 15%, particularly preferably 50% or more.

  The weight average molecular weight of a polymer precursor such as a polyimide precursor or a polybenzoxazole precursor is preferably in the range of 3,000 to 1,000,000, although it depends on the application, 5,000 to 500. Is more preferably in the range of 10,000 to 500,000. When the weight average molecular weight is less than 3,000, it is difficult to obtain sufficient strength when a coating film or film is used. In addition, the strength of the film is reduced when heat treatment or the like is performed to obtain a polymer such as polyimide. On the other hand, when the weight average molecular weight exceeds 1,000,000, the viscosity increases, the solubility tends to decrease, and it is difficult to obtain a coating film or film having a smooth surface and a uniform film thickness.

  The molecular weight used here is a value in terms of polystyrene measured by gel permeation chromatography (GPC), which may be the molecular weight of a polymer precursor itself such as a polyimide precursor, or chemical imidization with acetic anhydride or the like. It may be after processing.

  In addition, the solvent at the time of the polyimide precursor or polybenzoxazole precursor synthesis is preferably a polar solvent, and representative examples thereof include N-methyl-2-pyrrolidone, N-acetyl-2-pyrrolidone, and N, N-dimethylformamide. , N, N-dimethylacetamide, N, N-diethylformamide, N, N-diethylacetamide, N, N-dimethylmethoxyacetamide, dimethylsulfoxide, hexamethylphosphoamide, pyridine, dimethylsulfone, tetramethylenesulfone, dimethyltetra Examples include methylene sulfone, diethylene glycol dimethyl ether, cyclopentanone, γ-butyrolactone, α-acetyl-γ-butyrolactone, and these solvents are used alone or in combination of two or more. In addition to these, non-polar solvents such as benzene, benzonitrile, 1,4-dioxane, tetrahydrofuran, butyrolactone, xylene, toluene, cyclohexanone, and the like can be used as a solvent. It is used as a reaction regulator, a volatilization regulator of a solvent from the product, a film smoothing agent, and the like.

  Since the solubility of polyamic acid and polybenzoxazole precursor decreases due to the reaction to the final product by the action of the basic substance, the base generation of the base generator represented by the chemical formula (1) By combining with a decrease in solubility, the photosensitive resin composition of the present invention has an advantage that the solubility contrast between the exposed portion and the unexposed portion can be further increased.

<Other ingredients>
The photosensitive resin composition according to the present invention may be a simple mixture of the base generator represented by the chemical formula (1), one or more kinds of polymer precursors, and a solvent. Alternatively, a photosensitive resin composition may be prepared by blending a thermosetting component, a non-polymerizable binder resin other than the polymer precursor, and other components.

  Various general-purpose solvents can be used as a solvent for dissolving, dispersing or diluting the photosensitive resin composition. Moreover, when using polyamic acid as a precursor, you may use the solution obtained by the synthesis reaction of polyamic acid as it is, and may mix other components there as needed.

  Usable general-purpose solvents include, for example, diethyl ether, tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, and other ethers; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, Glycol monoethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether (so-called cellosolves); ketones such as methyl ethyl ketone, acetone, methyl isobutyl ketone, cyclopentanone, cyclohexanone; acetic acid Ethyl, butyl acetate, vinegar n-propyl, i-propyl acetate, n-butyl acetate, i-butyl acetate, acetate esters of the above glycol monoethers (for example, methyl cellosolve acetate, ethyl cellosolve acetate), methoxypropyl acetate, ethoxypropyl acetate, dimethyl oxalate, Esters such as methyl lactate and ethyl lactate; alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, glycerin; methylene chloride, 1,1-dichloroethane, 1,2-dichloroethylene, 1-chloropropane Halogenated hydrocarbons such as 1-chlorobutane, 1-chloropentane, chlorobenzene, bromobenzene, o-dichlorobenzene, m-dichlorobenzene; Amides such as muamide, N, N-diethylformamide, N, N-dimethylacetamide, N, N-diethylacetamide; Pyrrolidones such as N-methylpyrrolidone; Lactones such as γ-butyrolactone; Sulfoxides such as dimethylsulfoxide And other organic polar solvents, and further include aromatic hydrocarbons such as benzene, toluene and xylene, and other organic nonpolar solvents. These solvents are used alone or in combination.

  Among them, N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, N, N-diethylformamide, N, N-diethylacetamide, N, N-dimethylmethoxyacetamide, dimethyl sulfoxide, hexa Polar solvents such as methylphosphoamide, N-acetyl-2-pyrrolidone, pyridine, dimethyl sulfone, tetramethylene sulfone, dimethyltetramethylene sulfone, diethylene glycol dimethyl ether, cyclopentanone, γ-butyrolactone, α-acetyl-γ-butyrolactone It is mentioned as a suitable thing.

  As the photocurable component, a compound having one or more ethylenically unsaturated bonds can be used. For example, an amide monomer, a (meth) acrylate monomer, a urethane (meth) acrylate oligomer, a polyester (meth) Aromatic vinyl compounds such as acrylate oligomers, epoxy (meth) acrylates, hydroxyl group-containing (meth) acrylates, and styrene can be exemplified. In addition, when the polyimide precursor has a carboxylic acid component such as polyamic acid in the structure, the use of an ethylenically unsaturated bond-containing compound having a tertiary amino group causes the carboxylic acid of the polyimide precursor to have an ionic bond. When the photosensitive resin composition is formed, the contrast of the dissolution rate of the exposed area and the unexposed area is increased.

  When using a photocurable compound having such an ethylenically unsaturated bond, a photoradical generator may be further added. Examples of the photo radical generator include benzoin such as benzoin, benzoin methyl ether, benzoin ethyl ether and benzoin isopropyl ether and alkyl ethers thereof; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2 Acetophenones such as phenylacetophenone, 1,1-dichloroacetophenone, 1-hydroxyacetophenone, 1-hydroxycyclohexyl phenyl ketone and 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propan-1-one Anthraquinones such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-tertiary-butylanthraquinone, 1-chloroanthraquinone and 2-amylanthraquinone; 2,4-dimethyl Thioxanthone such as luthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone and 2,4-diisopropylpyroxanthone; ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; 2,4,6-trimethylbenzoyl diphenylphosphine oxide, etc. Monoacylphosphine oxides or bisacylphosphine oxides; benzophenones such as benzophenone; and xanthones.

As long as the effect of the present invention is not hindered, the photosensitive resin composition of the present invention may contain other photosensitive components that generate an acid or a base by light as an auxiliary role of the base generator of the present invention. good. Further, a base proliferating agent or a sensitizer may be added.
Compounds that generate an acid by light include photosensitive diazoquinone compounds having a 1,2-benzoquinonediazide or 1,2-naphthoquinonediazide structure. US Pat. Nos. 2,772,972, No. 213, No. 3,669,658.
In addition, known photoacid generators such as triazine and derivatives thereof, sulfonic acid oxime ester compounds, sulfonic acid iodonium salts, and sulfonic acid sulfonium salts can be used. Examples of the compound that generates a base by light include 2,6-dimethyl-3,5-dicyano-4- (2′-nitrophenyl) -1,4-dihydropyridine, 2,6-dimethyl-3,5-diacetyl. Examples include -4- (2′-nitrophenyl) -1,4-dihydropyridine, 2,6-dimethyl-3,5-diacetyl-4- (2 ′, 4′-dinitrophenyl) -1,4-dihydropyridine, and the like. it can.

A base proliferating agent that generates a base by a decomposition or rearrangement reaction by the action of a small amount of base generated from the base generator may be used in combination. Examples of the base proliferating agent include a compound having a 9-fluorenylmethyl carbamate bond, 1,1-dimethyl-2-cyanomethyl carbamate bond ((CN) CH ₂ C (CH ₃ ) ₂ OC (O) NR ₂ ), Compounds having a paranitrobenzyl carbamate bond, compounds having a 2,4-dichlorobenzyl carbamate bond, and other urethane compounds described in paragraphs 0010 to 0032 of JP 2000-330270 A And urethane compounds described in paragraphs 0033 to 0060 of JP-A-2008-250111.

The addition of a sensitizer may be effective when it is desired to make the base generator sufficiently use the energy of electromagnetic waves having a wavelength that passes through the polymer to improve the sensitivity.
In particular, when the absorption of the polyimide precursor is also at a wavelength of 360 nm or more, the effect of adding a sensitizer is great. Specific examples of compounds called sensitizers include thioxanthone and derivatives thereof such as diethylthioxanthone, coumarins and derivatives thereof, ketocoumarin and derivatives thereof, ketobiscoumarin and derivatives thereof, cyclopentanone and derivatives thereof , Cyclohexanone and derivatives thereof, thiopyrylium salts and derivatives thereof, thioxanthene series, xanthene series and derivatives thereof.

Specific examples of coumarin, ketocoumarin and derivatives thereof include 3,3′-carbonylbiscoumarin, 3,3′-carbonylbis (5,7-dimethoxycoumarin), 3,3′-carbonylbis (7-acetoxycoumarin). ) And the like. Specific examples of thioxanthone and derivatives thereof include diethyl thioxanthone and isopropyl thioxanthone. Furthermore, benzophenone, acetophenone, phenanthrene, 2-nitrofluorene, 5-nitroacenaphthene, benzoquinone, 2-ethylanthraquinone, 2-tertiarybutylanthraquinone, 1,2-benzanthraquinone, 1,2-naphthoquinone, etc. Is mentioned.
Since these exhibit a particularly excellent effect in combination with a base generator, a sensitizer exhibiting an optimal sensitizing action is appropriately selected depending on the structure of the base generator.

  In order to impart processing characteristics and various functionalities to the resin composition according to the present invention, various organic or inorganic low-molecular or high-molecular compounds may be blended. For example, dyes, surfactants, leveling agents, plasticizers, fine particles and the like can be used. The fine particles include organic fine particles such as polystyrene and polytetrafluoroethylene, inorganic fine particles such as colloidal silica, carbon, and layered silicate, and these may have a porous or hollow structure. The function or form includes pigments, fillers, fibers, and the like.

In the photosensitive resin composition according to the present invention, the polymer precursor (solid content) is based on the entire solid content of the photosensitive resin composition from the viewpoint of film physical properties of the pattern to be obtained, particularly film strength and heat resistance. 30% by weight or more, preferably 50% by weight or more.
The base generator represented by the chemical formula (1) is usually 0.1 to 95% by weight, preferably 0.5 to 60% by weight based on the solid content of the polymer precursor contained in the photosensitive resin composition. %. If it is less than 0.1% by weight, the solubility contrast between the exposed part and the unexposed part may not be sufficiently increased. It is hard to be done.
When used as a curing agent, such as in combination with an epoxy compound, it is usually contained in the range of 0.1 to 95% by weight, preferably 0.5 to 60% by weight, depending on the degree of curing.
On the other hand, when used as a curing accelerator, it can be cured with a small amount of addition, and the base generator represented by the chemical formula (1) is a solid content of the polymer precursor contained in the photosensitive resin composition. On the other hand, it is preferable to make it contain 0.1 to 30 weight% normally in the range of 0.5 to 20 weight% normally.
In addition, solid content of the photosensitive resin composition is all components other than a solvent, and a liquid monomer component is also contained in solid content.

  Moreover, the mixture ratio of arbitrary components other than a solvent has the preferable range of 0.1 weight%-95 weight% with respect to the whole solid content of the photosensitive resin composition. When the amount is less than 0.1% by weight, the effect of adding the additive is hardly exhibited, and when it exceeds 95% by weight, the properties of the finally obtained resin cured product are not easily reflected in the final product.

  The photosensitive resin composition according to the present invention can be used in various coating processes and molding processes to produce films and molded articles having a three-dimensional shape.

  When a polyimide precursor or a polybenzoxazole precursor is used as a polymer precursor as an embodiment of the photosensitive resin composition of the present invention, the resulting polyimide and polybenzoxazole have heat resistance, dimensional stability, and insulating properties. From the viewpoint of securing the above properties, the 5% weight loss temperature measured in nitrogen of the polyimide and polybenzoxazole is preferably 250 ° C. or higher, more preferably 300 ° C. or higher. In particular, when used in applications such as electronic parts that pass through the solder reflow process, if the 5% weight loss temperature is 300 ° C. or less, defects such as bubbles occur due to the decomposition gas generated in the solder reflow process. There is a fear.

  The glass transition temperature of the polyimide and polybenzoxazole obtained from the photosensitive resin composition of the present invention is preferably as high as possible from the viewpoint of heat resistance, but in applications where a thermoforming process is considered like an optical waveguide, It preferably exhibits a glass transition temperature of about 120 ° C. to 450 ° C., more preferably about 200 ° C. to 380 ° C.

  Here, the glass transition temperature in the present invention is tan δ (tan δ = loss elastic modulus (tan δ) by dynamic viscoelasticity measurement when polyimide and polybenzoxazole obtained from the photosensitive resin composition can be formed into a film shape. E ″) / determined from the peak temperature of the storage elastic modulus (E ′). As the dynamic viscoelasticity measurement, for example, the frequency is increased by 3 Hz by using a viscoelasticity measuring device Solid Analyzer RSA II (manufactured by Rheometric Scientific). If the polyimide and polybenzoxazole obtained from the photosensitive resin composition cannot be formed into a film shape, the temperature is determined by the inflection point of the baseline of differential thermal analysis (DTA). To do.

  From the viewpoint of the dimensional stability of the polyimide and polybenzoxazole obtained from the photosensitive resin composition of the present invention, the linear thermal expansion coefficient is preferably 60 ppm or less, and more preferably 40 ppm or less. In the case of forming a film on a silicon wafer in a manufacturing process of a semiconductor element or the like, 20 ppm or less is more preferable from the viewpoint of adhesion and warpage of the substrate.

The linear thermal expansion coefficient in this invention can be calculated | required with the thermomechanical analyzer (TMA) of the film of the polyimide and polybenzoxazole obtained from the photosensitive resin composition obtained by this invention. Using a thermomechanical analyzer (for example, Thermo Plus TMA8310 (manufactured by Rigaku Corporation), the heating rate is 10 ° C./min, and the tensile load is 1 g / 25,000 μm so that the weight per cross-sectional area of the evaluation sample is the same. ² is obtained.

As described above, according to the present invention, the photosensitive resin composition can be obtained by a simple method of simply mixing the base generator represented by the chemical formula (1) with the polymer precursor. Excellent cost performance.
The aromatic component-containing carboxylic acid constituting the base generator represented by the chemical formula (1) and the basic substance can be obtained at low cost, and the price as the photosensitive resin composition can be suppressed.
The photosensitive resin composition according to the present invention can be applied to promote the reaction of a wide variety of polymer precursors to the final product by the base generator represented by the chemical formula (1). The structure of the resulting polymer can be selected from a wide range.
Furthermore, since the base generator represented by the chemical formula (1) is cyclized when the base is generated and the phenolic hydroxyl group disappears, the solubility in a developer such as a basic solution is changed, and the polymer precursor is changed. In the case of a polyimide precursor, a polybenzoxazole precursor or the like, it helps to lower the solubility of the photosensitive resin composition and contributes to the improvement of the solubility contrast in the exposed and unexposed areas.
In addition, due to the catalytic effect of basic substances such as amines generated by irradiation of electromagnetic waves, the processing temperature required for reactions such as cyclization such as imidation from a polyimide precursor or polybenzoxazole precursor to the final product is reduced. Therefore, it is possible to reduce the load on the process and damage to the product due to heat.
Furthermore, since the base generator of the present invention that generates a base by irradiation and heating of electromagnetic waves includes a heating step in the step of obtaining a final product from the polymer precursor, the heating step can be used. The amount can be reduced, and the process can be effectively used.

  For the photosensitive resin composition according to the present invention, resin materials such as printing ink, paint, sealant, adhesive, electronic material, optical circuit component, molding material, resist material, building material, stereolithography, and optical member are used. It can be used for all known fields and products. It can be suitably used both for applications that are used by exposing the entire surface, such as paints, sealants, and adhesives, and for applications that form patterns such as permanent films and release films.

  The photosensitive resin composition according to the present invention can be used in a wide range of fields, products such as heat resistance, dimensional stability, and insulation, such as paints, printing inks, sealants, or adhesives, or It is suitably used as a forming material for display devices, semiconductor devices, electronic components, micro electro mechanical systems (MEMS), optical members or building materials. For example, specifically, as a forming material for an electronic component, a sealing material and a layer forming material can be used for a printed wiring board, an interlayer insulating film, a wiring covering film, and the like. Moreover, as a forming material of a display device, a layer forming material or an image forming material can be used for a color filter, a film for flexible display, a resist material, an alignment film, and the like. Further, as a material for forming a semiconductor device, a resist material, a layer forming material such as a buffer coat film, or the like can be used. Further, as a material for forming an optical component, it can be used as an optical material or a layer forming material for holograms, optical waveguides, optical circuits, optical circuit components, antireflection films and the like. Moreover, as a building material, it can use for a coating material, a coating agent, etc. It can also be used as a material for an optically shaped object. A printed matter, a paint, a sealant, an adhesive, a display device, a semiconductor device, an electronic component, a microelectromechanical system, an optically shaped article, an optical member, or a building material is provided.

  Since it has the above characteristics, the photosensitive resin composition according to the present invention can also be used as a pattern forming material. In particular, when a photosensitive resin composition containing a polyimide precursor or a polybenzoxazole precursor is used as a pattern forming material (resist), the pattern formed thereby is a permanent film made of polyimide or polybenzoxazole. Functions as a component that imparts heat resistance and insulation, such as color filters, flexible display films, electronic components, semiconductor devices, interlayer insulation films, wiring coating films, optical circuits, optical circuit components, antireflection films, etc. It is suitable for forming an optical member or an electronic member.

<Pattern formation method>
The pattern forming method according to the present invention includes forming a coating film or a molded body made of the photosensitive resin composition according to the present invention, irradiating the coating film or the molded body with electromagnetic waves in a predetermined pattern, and after irradiation or It develops, after heating simultaneously with irradiation, changing the solubility of the said irradiation site | part, and developing.

  The photosensitive resin composition according to the present invention is coated on some support to form a coating film, or a molded body is formed by a suitable molding method, and the coating film or molded body is formed into a predetermined pattern shape. Is irradiated with electromagnetic waves and heated at the same time as irradiation or irradiation, the base generator represented by the above chemical formula (1) is isomerized and cyclized only in the exposed portion to produce a basic substance. The basic substance acts as a catalyst that promotes the reaction of the polymer precursor in the exposed area to the final product.

When using a polymer precursor whose thermal curing temperature is lowered by the catalytic action of a base, such as a polyimide precursor or a polybenzoxazole precursor, first, such a polymer precursor and the chemical formula (1) The part which wants to leave the pattern on the coating film or molded object of the photosensitive resin composition which combined the base generator represented by these is exposed. When heated after exposure or simultaneously with exposure, a basic substance is generated in the exposed portion, and the thermosetting temperature of that portion is selectively lowered. After the exposure or simultaneously with the exposure, the exposed portion is heat-cured but the unexposed portion is heated at a processing temperature that is not heat-cured, and only the exposed portion is cured. The heating step for generating the basic substance and the heating step (post-exposure bake) for performing the reaction for curing only the exposed portion may be the same step or different steps.
Next, the unexposed portion is dissolved with a predetermined developer (such as an organic solvent or a basic aqueous solution) to form a pattern made of a thermoset. This pattern is further heated as necessary to complete thermosetting. Through the above steps, a desired negative two-dimensional resin pattern (general plane pattern) or a three-dimensional resin pattern (three-dimensionally shaped shape) is obtained.

  Further, even when using a polymer precursor that initiates the reaction by the catalytic action of a base, such as a compound having an epoxy group or a cyanate group and a polymer, first, such a polymer precursor, and The part which wants to leave the pattern on the coating film or molded object of the photosensitive resin composition which combined the base generator represented by said Formula (1) is exposed. When it is heated after exposure or simultaneously with exposure, a basic substance is generated in the exposed area, the reaction of the compound having an epoxy group or cyanate group and a polymer in that area is initiated, and only the exposed area is cured. The heating step for generating the basic substance and the heating step (post-exposure bake) for performing the reaction for curing only the exposed portion may be the same step or different steps. Next, the unexposed portion is dissolved with a predetermined developer (such as an organic solvent or a basic aqueous solution) to form a pattern made of a thermoset. This pattern is further heated as necessary to complete thermosetting. Through the above steps, a desired negative two-dimensional resin pattern (general plane pattern) or a three-dimensional resin pattern (three-dimensionally shaped shape) is obtained.

  The photosensitive resin composition of the present invention includes N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, N, N-diethylformamide, N, N-diethylacetamide, N, N- Dimethyl methoxyacetamide, dimethyl sulfoxide, hexamethylphosphoamide, N-acetyl-2-pyrrolidone, pyridine, dimethyl sulfone, tetramethylene sulfone, dimethyltetramethylene sulfone, diethylene glycol dimethyl ether, cyclopentanone, γ-butyrolactone, α-acetyl- After being dissolved in a polar solvent such as γ-butyrolactone, it is applied to the surface of a substrate such as a silicon wafer, a metal substrate, or a ceramic substrate by dipping, spraying, screen printing, spin coating, etc. Removing part More, it is possible to provide a tack-free coating on the substrate surface. Although there is no restriction | limiting in particular in the thickness of a coating film, it is preferable that it is 0.5-50 micrometers, and it is more desirable that it is 1.0-20 micrometers from a sensitivity and a development speed surface. As drying conditions of the apply | coated coating film, 80-100 degreeC and 1 minute-20 minutes are mentioned, for example.

  This coating film is irradiated with electromagnetic waves through a mask having a predetermined pattern, and is exposed to a pattern. After heating, the unexposed portion of the film is developed and removed with an appropriate developer to obtain a desired pattern. A patterned film can be obtained.

  The exposure method and the exposure apparatus used in the exposure process are not particularly limited, and may be contact exposure or indirect exposure. A contact / proximity exposure machine using a g-line stepper, i-line stepper, ultrahigh pressure mercury lamp, or mirror projection exposure machine. Alternatively, a projector or a radiation source that can irradiate ultraviolet rays, visible rays, X-rays, electron beams, or the like can be used.

The heating temperature for generating a heated base after exposure or simultaneously with exposure is appropriately selected depending on the polymer precursor to be combined and the purpose, and is not particularly limited. Heating by the temperature (for example, room temperature) of the environment where the photosensitive resin composition is placed may be used, and in that case, a base is gradually generated. In addition, since the base is also generated by heat generated as a by-product during irradiation with electromagnetic waves, heating may be performed substantially simultaneously with the heat generated as a by-product during irradiation with electromagnetic waves. From the viewpoint of increasing the reaction rate and efficiently generating amine, the heating temperature for generating the base is preferably 30 ° C. or higher, more preferably 60 ° C. or higher, still more preferably 100 ° C. or higher, Especially preferably, it is 120 degreeC or more. However, depending on the polymer precursors used in combination, for example, the unexposed part may be cured by heating at 60 ° C. or higher, so that the suitable heating temperature is not limited to the above.
For example, in the case of an epoxy resin, a preferable heat treatment temperature range is appropriately selected depending on the type of the epoxy resin, but is usually about 100 ° C to 150 ° C.

The coating film of the photosensitive resin composition according to the present invention is a post-exposure bake (Post) between the exposure process and the development process in order to physically accelerate the cross-linking reaction or to perform a reaction to cure only the exposed area. It is preferable to perform Exposure Bake (PEB). The PEB is a temperature at which the reaction rate of the curing reaction such as the imidization rate differs between the site where the base is present and the site where the base is not present without irradiation due to the action of the base generated by electromagnetic wave irradiation and heating. It is preferable to carry out with. For example, in the case of imidization, the preferable heat treatment temperature range is usually about 60 ° C to 200 ° C, more preferably 120 ° C to 200 ° C. When the heat treatment temperature is lower than 60 ° C., the imidization efficiency is poor, and it becomes difficult to cause a difference in the imidization ratio between the exposed portion and the unexposed portion under realistic process conditions. On the other hand, when the heat treatment temperature exceeds 200 ° C., imidization may proceed even in an unexposed portion where no amine is present, and it is difficult to cause a difference in solubility between the exposed portion and the unexposed portion.
This heat treatment may be any method as long as it is a known method, and specific examples thereof include heating with a circulating oven in a nitrogen atmosphere or a hot plate, or the like, but is not particularly limited.
In the present invention, a base is generated from the base generator by irradiation with electromagnetic waves and heating. The heating and PEB process for generating the base may be the same process or separate processes.

(Developer)
The developer used in the development step is not particularly limited as long as the solvent that changes the solubility of the irradiation site is used as the developer, and is appropriately selected according to the polymer precursor to be used, such as a basic aqueous solution or an organic solvent. It is possible to select.

Although it does not specifically limit as basic aqueous solution, For example, other than tetramethylammonium hydroxide (TMAH) aqueous solution whose density | concentration is 0.01 weight%-10 weight%, Preferably, 0.05 weight%-5 weight%. , Diethanolamine, diethylaminoethanol, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate, triethylamine, diethylamine, methylamine, dimethylamine, dimethylaminoethyl acetate, dimethylaminoethanol, dimethylaminoethyl Examples of the aqueous solution include methacrylate, cyclohexylamine, ethylenediamine, hexamethylenediamine, and tetramethylammonium.
The solute may be one type or two or more types, and may contain 50% or more of the total weight, more preferably 70% or more, and an organic solvent or the like as long as water is contained.

  The organic solvent is not particularly limited, but polar solvents such as N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfoxide, γ-butyrolaclone, dimethylacrylamide, methanol, Alcohols such as ethanol and isopropanol, esters such as ethyl acetate and propylene glycol monomethyl ether acetate, ketones such as cyclopentanone, cyclohexanone, isobutyl ketone and methyl isobutyl ketone, other tetrahydrofuran, chloroform, acetonitrile and the like alone or Two or more types may be added in combination. After development, washing is performed with water or a poor solvent. Also in this case, alcohols such as ethanol and isopropyl alcohol, esters such as ethyl lactate and propylene glycol monomethyl ether acetate may be added to water.

  After development, if necessary, rinse with water or a poor solvent and dry at 80 to 100 ° C. to stabilize the pattern. In order to make this relief pattern heat resistant, a patterned high heat resistant resin layer is formed by heating at a temperature of 180 to 500 ° C., preferably 200 to 350 ° C. for several tens of minutes to several hours. The

Hereinafter, the present invention will be specifically described with reference to examples. These descriptions do not limit the present invention. In the examples, parts represent parts by weight unless otherwise specified.
Moreover, each measurement and experiment were performed using the apparatus shown below.
1H NMR measurement: JEOL JNM-LA400WB, manufactured by JEOL Ltd.
Manual exposure: manufactured by Dainippon Kaken, MA-1100
Absorbance measurement: Shimadzu Corporation UV-visible spectrophotometer UV-2550
5% weight loss temperature measurement: manufactured by Shimadzu Corporation, simultaneous differential heat and thermogravimetric measurement device DTG-60
Infrared absorption spectrum measurement: FTS 7000, manufactured by Varian Technologies Japan Limited
Heating of coating film: manufactured by ASONE Co., Ltd., HOT PLATE EC-1200 (may be described as hot plate in this example)

(Synthesis Example 1: Synthesis of polyimide precursor)
Di (4-aminophenyl) ether (10.0 g, 50 mmol) was put into a 300 mL three-necked flask, dissolved in 105.4 mL of dehydrated N, N-dimethylacetamide (DMAc), and an ice bath under a nitrogen stream. The mixture was stirred while cooling. Thereto, 14.7 g (50 mmol) of 3,3 ′, 4,4′-biphenyltetracarboxylic acid 3,4: 3 ′, 4′-dianhydride was added little by little. The solution was stirred for 5 hours, and the solution was reprecipitated with dehydrated diethyl ether, and the precipitate was dried at room temperature under reduced pressure for 17 hours to obtain a polyamic acid (polyimide precursor (1)) having a weight average molecular weight of 10,000. Was quantitatively obtained as a white solid.

(Synthesis Example 2: Synthesis of metal alkoxide condensate)
To a 100 ml flask equipped with a condenser, 5 g of phenyltriethoxysilane, 10 g of triethoxysilane, 0.05 g of ammonia water, 5 ml of water and 50 ml of propylene glycol monomethyl ether acetate were added. The solution was stirred using a semicircular type mechanical stirrer and reacted at 70 ° C. for 6 hours using a mantle heater. Subsequently, ethanol and residual water produced by the condensation reaction with water were removed using an evaporator. After completion of the reaction, the flask was left to reach room temperature to prepare an alkoxysilane condensate (alkoxysilane condensate (1)).

(Production Example 1: Synthesis of base generator (1))
In a 200 mL flask, 10.0 g of potassium carbonate was added to 75 mL of methanol. In a 100 mL flask, ethoxycarbonylmethyl (triphenyl) phosphonium bromide (manufactured by Tokyo Chemical Industry Co., Ltd.) 21.5 g (50 mmol), 2,4-dihydroxy-benzaldehyde (manufactured by Tokyo Chemical Industry Co., Ltd.) 6.9 g (50 mmol) was dissolved in 50 mL of methanol and slowly added dropwise to a well-stirred potassium carbonate solution. After stirring for 3 hours, the completion of the reaction was confirmed by thin layer chromatography (TLC). The reaction solution was filtered to remove potassium carbonate, and the reaction solution was concentrated under reduced pressure. After concentration, 50 mL of 1N aqueous sodium hydroxide solution was added and stirred for 12 hours. After completion of the reaction, triphenylphosphine oxide was removed by filtration. Thereafter, concentrated hydrochloric acid was added dropwise to the reaction solution to make the reaction solution acidic, and a precipitate was generated. The precipitate was collected by filtration and washed with a small amount of chloroform to obtain 3.8 g of 2,4-dihydroxy-cinnamic acid.

  Subsequently, 2,4-dihydroxy-cinnamic acid 500 mg (2.78 mmol) was dissolved in 10 mL of tetrahydrofuran in a 100 mL three-necked flask, and 1-ethyl-3- (3-dimethylaminopropyl) carbodiimide hydrochloride (EDC) was dissolved. ) (Tokyo Chemical Industry Co., Ltd.) 0.64 g (3.33 mmol) was added. After 30 minutes, 0.32 ml (3.33 mmol) of cyclohexylamine (manufactured by Tokyo Chemical Industry Co., Ltd.) was added. After completion of the reaction, the reaction mixture was dissolved in water, extracted with chloroform, and then washed with saturated aqueous sodium hydrogen carbonate solution, 1N hydrochloric acid and saturated brine. Then, 203 mg of base generators (1) represented by the following formula were obtained by purification by silica gel column chromatography (developing solvent: chloroform / methanol 100/1 to 10/1 (volume ratio)).

(Production Example 2: Synthesis of base generator (2))
Instead of using 0.32 ml (3.33 mmol, 1.2 eq) of cyclohexylamine (manufactured by Tokyo Chemical Industry Co., Ltd.) in Production Example 1, 0.32 ml (3.33 mmol, 1.2 eq) of piperidine (manufactured by Tokyo Chemical Industry Co., Ltd.) was used. Except having been used, in the same manner as in Production Example 1, 360 mg of a base generator (2) represented by the following formula was obtained.

(Production Example 3: Synthesis of base generator (3))
In a 100 mL flask, 2.28 g of potassium carbonate was added to 8 mL of methanol. In a 100 mL flask, ethoxycarbonylmethyl (triphenyl) phosphonium bromide 5.44 g (12.7 mmol) and 2-hydroxy-5-nitro-m-anisaldehyde 2.5 g (12.7 mmol) were dissolved in 12 mL of methanol and stirred well. The solution was slowly added dropwise to the potassium carbonate solution. After stirring for 3 hours, the completion of the reaction was confirmed by TLC, followed by filtration to remove potassium carbonate and concentration under reduced pressure. After concentration, 40 mL of 1N aqueous sodium hydroxide solution was added and stirred overnight. After completion of the reaction, triphenylphosphine oxide was removed by filtration, and then concentrated hydrochloric acid was added dropwise to acidify the reaction solution. The precipitate was collected by filtration and washed with a small amount of chloroform to obtain 1.01 g of 2-hydroxy-3-methoxy-5-nitrocinnamic acid.
Subsequently, 2-hydroxy-3-methoxy-5-nitrocinnamic acid was dissolved in 17 mL of dehydrated tetrahydroxyfuran in a 100 mL flask, and 0.959 g (5.0 mmol) of EDC was added and stirred. After 30 minutes, 0.50 ml (5.0 mmol) of piperidine was added. After completion of the reaction, the reaction solution was concentrated and dissolved in 1N aqueous sodium hydroxide solution. After extraction with chloroform, the mixture was washed with 1N hydrochloric acid and saturated brine. At this time, a large amount of solid that did not dissolve in the organic solvent precipitated. Thereafter, the product was purified by silica gel column chromatography (developing solvent: hexane / ethyl acetate 10/1 to 0/1 (volume ratio)) to obtain 21.4 mg of a base generator (3).

(Production Example 4: Synthesis of base generator (4))
In a 500 mL eggplant flask, 10.0 g (72.4 mmol) of 4-mercaptophenol (manufactured by Aldrich Co.) and 16.6 g (119 mmol, 1.5 eq) of hexamethylenetetramine (manufactured by Tokyo Chemical Industry Co., Ltd.) were trifluoro. It was dissolved in 100 ml of acetic acid (manufactured by Kanto Chemical Co., Ltd.) and reacted at 95 ° C. for 10 hours. After completion of the reaction, 200 ml of 1N hydrochloric acid was added in an ice bath and stirred for 15 minutes. After completion of the stirring, the mixture was extracted with chloroform and washed with hydrochloric acid / saturated saline to obtain 2.05 g (13.3 mmol) of 2-hydroxy-4-mercaptobenzaldehyde.
In a 100 mL flask, 2 g of potassium carbonate was added to 10 mL of acetonitrile. In a 100 mL flask, 5.57 g (13.0 mmol) of ethoxycarbonylmethyl (triphenyl) phosphonium bromide and 2.0 g (13.0 mmol) of 2-hydroxy-4-mercaptobenzaldehyde were dissolved in 10 mL of acetonitrile and stirred well. The solution was slowly added dropwise to the potassium carbonate solution. After stirring for 3 hours, the completion of the reaction was confirmed by TLC, followed by filtration to remove potassium carbonate and concentration under reduced pressure. After concentration, 40 mL of 1N aqueous sodium hydroxide solution was added and stirred overnight. After completion of the reaction, triphenylphosphine oxide was removed by filtration, and then concentrated hydrochloric acid was added dropwise to acidify the reaction solution. The precipitate was collected by filtration and washed with a small amount of chloroform to obtain 0.85 g of 2-hydroxy-4-mercaptocinnamic acid.
Subsequently, in a 100 mL flask, 0.50 g (2.55 mmol) of 2-hydroxy-4-mercaptocinnamic acid was dissolved in 10 mL of dehydrated tetrahydroxyfuran, and 0.54 g (2.80 mmol) of EDC was added and stirred. After 30 minutes, 0.28 mL (2.80 mmol) of piperidine was added. After completion of the reaction, the reaction solution was concentrated and dissolved in 1N aqueous sodium hydroxide solution. After extraction with chloroform, the mixture was washed with 1N hydrochloric acid and saturated brine. At this time, a large amount of solid that did not dissolve in the organic solvent precipitated. Thereafter, the product was purified by silica gel column chromatography (developing solvent: hexane / ethyl acetate 10/1 to 0/1 (volume ratio)) to obtain 15.2 mg of a base generator (4).

(Production Example 5: Synthesis of base generator (5))
In a 500 mL eggplant flask, 3-methyl-4-nitrosophenol (manufactured by Aldrich Co.) 5.0 g (36.5 mmol), hexamethylenetetramine (manufactured by Tokyo Chemical Industry Co., Ltd.) 7.63 g (54.7 mmol, 1 .5 eq) was dissolved in 100 ml of trifluoroacetic acid (manufactured by Kanto Chemical Co., Inc.) and reacted at 95 ° C. for 10 hours. After completion of the reaction, 200 ml of 1N hydrochloric acid was added in an ice bath and stirred for 15 minutes. After completion of the stirring, the mixture was extracted with chloroform and washed with hydrochloric acid / saturated saline to obtain 1.51 g (9.13 mmol) of 2-hydroxy-4-methyl-5-nitroso-benzaldehyde.
In a 100 mL flask, 2 g of potassium carbonate was added to 10 mL of acetonitrile. In a 100 mL flask, 3.91 g (9.12 mmol) of ethoxycarbonylmethyl (triphenyl) phosphonium bromide, 1.50 g (9.12 mmol) of 2-hydroxy-4-methyl-5-nitroso-benzaldehyde in 10 mL of acetonitrile. Dissolved and slowly added dropwise to a well-stirred potassium carbonate solution. After stirring for 3 hours, the completion of the reaction was confirmed by TLC, followed by filtration to remove potassium carbonate and concentration under reduced pressure. After concentration, 40 mL of 1N aqueous sodium hydroxide solution was added and stirred overnight. After completion of the reaction, triphenylphosphine oxide was removed by filtration, and then concentrated hydrochloric acid was added dropwise to acidify the reaction solution. The precipitate was collected by filtration and washed with a small amount of chloroform to obtain 0.67 g of 2-hydroxy-4-methyl-5-nitroso-cinnamic acid.
Subsequently, 0.50 g (2.41 mmol) of 2-hydroxy-4-methyl-5-nitroso-cinnamic acid was dissolved in 10 mL of dehydrated tetrahydroxyfuran in a 100 mL flask, and 0.51 g (2.65 mmol, 1.65 mmol) of EDC was dissolved. 1 eq) was added and stirred. After 30 minutes, 0.27 mL (2.70 mmol) of piperidine was added. After completion of the reaction, the reaction solution was concentrated and dissolved in 1N aqueous sodium hydroxide solution. After extraction with chloroform, the mixture was washed with 1N hydrochloric acid and saturated brine. At this time, a large amount of solid that did not dissolve in the organic solvent precipitated. Then, it refine | purified by silica gel column chromatography (developing solvent: hexane / ethyl acetate 10 / 1-0 / 1 (volume ratio)), and 17.2 mg of base generators (5) were obtained.

(Production Example 6: Synthesis of base generator (6))
In a 200 mL flask, 10.0 g of potassium carbonate was added to 75 mL of methanol. In a 100 mL flask, ethoxycarbonylmethyl (triphenyl) phosphonium bromide (manufactured by Tokyo Chemical Industry Co., Ltd.) 21.5 g (50 mmol), 2,4-dihydroxy-benzaldehyde (manufactured by Tokyo Chemical Industry Co., Ltd.) 6.9 g (50 mmol) was dissolved in 50 mL of methanol and slowly added dropwise to a well-stirred potassium carbonate solution. After stirring for 3 hours, the completion of the reaction was confirmed by thin layer chromatography (TLC). The reaction solution was filtered to remove potassium carbonate, and the reaction solution was concentrated under reduced pressure. After concentration, 50 mL of 1N aqueous sodium hydroxide solution was added and stirred for 12 hours. After completion of the reaction, triphenylphosphine oxide was removed by filtration. Thereafter, concentrated hydrochloric acid was added dropwise to the reaction solution to make the reaction solution acidic, and a precipitate was generated. The precipitate was collected by filtration and washed with a small amount of chloroform to obtain 3.8 g of 2,4-dihydroxy-cinnamic acid.

  Subsequently, 2.0 g (11.2 mmol) of 2,4-dihydroxy-cinnamic acid was dissolved in 20 mL of tetrahydrofuran in a 100 mL three-necked flask, and 2.35 g (3.33 mmol) of EDC was added. After 30 minutes, 630 mg (5.46 mmol) of 1,6-diaminohexane (manufactured by Tokyo Chemical Industry Co., Ltd.) was added. After completion of the reaction, the reaction mixture was dissolved in water, extracted with chloroform, and then washed with saturated aqueous sodium hydrogen carbonate solution, 1N hydrochloric acid and saturated brine. Then, 320 mg of base generator (6) represented by the following formula was obtained by purification by silica gel column chromatography (developing solvent: chloroform / methanol 100/1 to 10/1 (volume ratio)).

(Production Example 7: Synthesis of base generator (7))
In a 200 mL flask, 10.0 g of potassium carbonate was added to 75 mL of methanol. In a 100 mL flask, ethoxycarbonylmethyl (triphenyl) phosphonium bromide (manufactured by Tokyo Chemical Industry Co., Ltd.) 21.5 g (50 mmol), 2,4-dihydroxy-benzaldehyde (manufactured by Tokyo Chemical Industry Co., Ltd.) 6.9 g (50 mmol) was dissolved in 50 mL of methanol and slowly added dropwise to a well-stirred potassium carbonate solution. After stirring for 3 hours, the completion of the reaction was confirmed by thin layer chromatography (TLC). The reaction solution was filtered to remove potassium carbonate, and the reaction solution was concentrated under reduced pressure. After concentration, 50 mL of 1N aqueous sodium hydroxide solution was added and stirred for 12 hours. After completion of the reaction, triphenylphosphine oxide was removed by filtration. Thereafter, concentrated hydrochloric acid was added dropwise to the reaction solution to make the reaction solution acidic, and a precipitate was generated. The precipitate was collected by filtration and washed with a small amount of chloroform to obtain 3.8 g of 2,4-dihydroxy-cinnamic acid.

  Subsequently, 2.0 g (11.2 mmol) of 2,4-dihydroxy-cinnamic acid was dissolved in 20 mL of tetrahydrofuran in a 100 mL three-necked flask, and 2.35 g (3.33 mmol) of EDC was added. After 30 minutes, 740 mg (5.46 mmol) of p-xylylenediamine (manufactured by Tokyo Chemical Industry Co., Ltd.) was added. After completion of the reaction, the reaction mixture was dissolved in water, extracted with chloroform, and then washed with saturated aqueous sodium hydrogen carbonate solution, 1N hydrochloric acid and saturated brine. Thereafter, purification by silica gel column chromatography (developing solvent: chloroform / methanol 100/1 to 10/1 (volume ratio)) yielded 250 mg of a base generator (7) represented by the following formula.

(Production Example 7: Synthesis of base generator (8))
In a 200 mL flask, 10.0 g of potassium carbonate was added to 75 mL of methanol. In a 100 mL flask, ethoxycarbonylmethyl (triphenyl) phosphonium bromide (manufactured by Tokyo Chemical Industry Co., Ltd.) 21.5 g (50 mmol), 2,4-dihydroxy-benzaldehyde (manufactured by Tokyo Chemical Industry Co., Ltd.) 6.9 g (50 mmol) was dissolved in 50 mL of methanol and slowly added dropwise to a well-stirred potassium carbonate solution. After stirring for 3 hours, the completion of the reaction was confirmed by thin layer chromatography (TLC). The reaction solution was filtered to remove potassium carbonate, and the reaction solution was concentrated under reduced pressure. After concentration, 50 mL of 1N aqueous sodium hydroxide solution was added and stirred for 12 hours. After completion of the reaction, triphenylphosphine oxide was removed by filtration. Thereafter, concentrated hydrochloric acid was added dropwise to the reaction solution to make the reaction solution acidic, and a precipitate was generated. The precipitate was collected by filtration and washed with a small amount of chloroform to obtain 3.8 g of 2,4-dihydroxy-cinnamic acid.

  Subsequently, 2.0 g (11.2 mmol) of 2,4-dihydroxy-cinnamic acid was dissolved in 20 mL of tetrahydrofuran in a 100 mL three-necked flask, and 2.35 g (3.33 mmol) of EDC was added. After 30 minutes, 0.57 mL (5.46 mmol) of diethylamine (manufactured by Tokyo Chemical Industry Co., Ltd.) was added. After completion of the reaction, the reaction mixture was dissolved in water, extracted with chloroform, and then washed with saturated aqueous sodium hydrogen carbonate solution, 1N hydrochloric acid and saturated brine. Thereafter, purification by silica gel column chromatography (developing solvent: chloroform / methanol 100/1 to 10/1 (volume ratio)) yielded 870 mg of a base generator (8) represented by the following formula.

(Production Example 9: Synthesis of base generator (9))
In a 200 mL flask, 10.0 g of potassium carbonate was added to 75 mL of methanol. In a 100 mL flask, ethoxycarbonylmethyl (triphenyl) phosphonium bromide (manufactured by Tokyo Chemical Industry Co., Ltd.) 21.5 g (50 mmol), 2,4-dihydroxy-benzaldehyde (manufactured by Tokyo Chemical Industry Co., Ltd.) 6.9 g (50 mmol) was dissolved in 50 mL of methanol and slowly added dropwise to a well-stirred potassium carbonate solution. After stirring for 3 hours, the completion of the reaction was confirmed by thin layer chromatography (TLC). The reaction solution was filtered to remove potassium carbonate, and the reaction solution was concentrated under reduced pressure. After concentration, 50 mL of 1N aqueous sodium hydroxide solution was added and stirred for 12 hours. After completion of the reaction, triphenylphosphine oxide was removed by filtration. Thereafter, concentrated hydrochloric acid was added dropwise to the reaction solution to make the reaction solution acidic, and a precipitate was generated. The precipitate was collected by filtration and washed with a small amount of chloroform to obtain 3.8 g of 2,4-dihydroxy-cinnamic acid.

  Subsequently, 2.0 g (11.2 mmol) of 2,4-dihydroxy-cinnamic acid was dissolved in 20 mL of tetrahydrofuran in a 100 mL three-necked flask, and 2.35 g (3.33 mmol) of EDC was added. After 30 minutes, 490 mg (5.46 mmol) of 4-amino-1-butanol (manufactured by Tokyo Chemical Industry Co., Ltd.) was added. After completion of the reaction, the reaction mixture was dissolved in water, extracted with chloroform, and then washed with saturated aqueous sodium hydrogen carbonate solution, 1N hydrochloric acid and saturated brine. Subsequently, 110 mg of a base generator (9) represented by the following formula was obtained by purification by silica gel column chromatography (developing solvent: chloroform / methanol 100/1 to 10/1 (volume ratio)).

(Production Example 10: Synthesis of base generator (10))
In a 200 mL flask, 10.0 g of potassium carbonate was added to 75 mL of methanol. In a 100 mL flask, ethoxycarbonylmethyl (triphenyl) phosphonium bromide (manufactured by Tokyo Chemical Industry Co., Ltd.) 21.5 g (50 mmol), 2,4-dihydroxy-benzaldehyde (manufactured by Tokyo Chemical Industry Co., Ltd.) 6.9 g (50 mmol) was dissolved in 50 mL of methanol and slowly added dropwise to a well-stirred potassium carbonate solution. After stirring for 3 hours, the completion of the reaction was confirmed by thin layer chromatography (TLC). The reaction solution was filtered to remove potassium carbonate, and the reaction solution was concentrated under reduced pressure. After concentration, 50 mL of 1N aqueous sodium hydroxide solution was added and stirred for 12 hours. After completion of the reaction, triphenylphosphine oxide was removed by filtration. Thereafter, concentrated hydrochloric acid was added dropwise to the reaction solution to make the reaction solution acidic, and a precipitate was generated. The precipitate was collected by filtration and washed with a small amount of chloroform to obtain 3.8 g of 2,4-dihydroxy-cinnamic acid.

  Subsequently, 2.0 g (11.2 mmol) of 2,4-dihydroxy-cinnamic acid was dissolved in 20 mL of tetrahydrofuran in a 100 mL three-necked flask, and 2.35 g (3.33 mmol) of EDC was added. After 30 minutes, 0.91 mL (5.46 mmol) of n-octylamine (manufactured by Tokyo Chemical Industry Co., Ltd.) was added. After completion of the reaction, the product was dissolved in water, extracted with chloroform, and then washed with a saturated aqueous sodium hydrogen carbonate solution, 1N hydrochloric acid, and saturated brine to obtain 250 mg of a base generator (10) represented by the following formula.

(Comparative Production Example 1: Synthesis of Comparative Base Generator (1))
As a comparative base generator (1), Macromolecules A.I. Mochizuki, Vol. 28, no. 1, 1995, a comparative base generator (1) represented by the following formula, [(4,5-dimethoxy-2-nitrobenzyl) oxy] carbonyl-2,6-dimethylpiperidine (hereinafter, “ DNCDP ”(sometimes abbreviated as“ DNCDP ”).

[Evaluation of base generator]
The synthesized base generators (1) to (10) and the comparative base generator (1) were measured and evaluated as follows. The results of molar extinction coefficient and 5% weight loss temperature are shown in Table 1. Table 2 shows the results of the base generating ability. In Table 2, the base generation rate is a percentage of the number of moles of the base generated relative to the number of moles of the base generator used, and the base generation rates of the base generators (1) to (10) are determined by light irradiation. And the ratio of heating.

(1) Molar extinction coefficient The base generators (1) to (10) and the comparative base generator (1) were each dissolved in acetonitrile at a concentration of 1 × 10 ⁻⁴ mol / L, and a quartz cell (optical path length 10 mm) was obtained. ) Was filled with the solution, and the absorbance was measured. The molar extinction coefficient ε is a value obtained by dividing the absorbance of the solution by the thickness of the absorption layer and the molar concentration of the solute.

(2) 5% weight loss temperature In order to evaluate the heat resistance of the base generators (1) to (10) and the comparative base generator (1), each was 5 under the condition of a heating rate of 10 ° C./min. The% weight loss temperature was measured.

(3) Base generation ability For each of the base generators (1) to (10), three 1 mg samples were prepared, and each was dissolved in 0.5 mL of deuterated acetonitrile in a quartz NMR bowl. Using a filter that transmits 20% of i-line and a high-pressure mercury lamp, one was irradiated with light at ² J / cm ² , and the other was irradiated with light at 20 J / cm ² . The remaining one was not irradiated with light. The 1H NMR of each sample was measured to determine the isomerization ratio.

Base generator (1) to (10) was isomerized by irradiation and 20 J / cm ² irradiation of 2J / cm ^2. When the isomerized sample was heated to 160 ° C., almost 100% of the isomerized compound was cyclized to generate bases, and the base generation rates shown in Table 2 were obtained.
In the comparative base generator (1), generation of base was not confirmed by irradiation at ² J / cm ² . When irradiated with 20 J / cm ² , 4.8% of base was generated.
From these results, it was found that the base generators (1) to (10) of the present invention have a small molar extinction coefficient compared to the comparative base generator (1), but can generate a base efficiently.

(Example 1: Preparation of photosensitive resin composition (1))
Using the base generator (2), a photosensitive resin composition (1) having the following composition was prepared.
Polyimide precursor (1): 85 parts by weight Base generator (2): 15 parts by weight Solvent (N-methyl-2-pyrrolidone): 733 parts by weight

(Comparative Example 1: Preparation of comparative photosensitive resin composition (1))
A comparative photosensitive resin composition (1) was prepared in the same manner as in Example 1 except that the comparative base generator (1) was used instead of the base generator (2) in Example 1.

(Creation of coating film)
The photosensitive resin composition (1) and the comparative photosensitive resin composition (1) were each spin-coated on a chrome-plated glass so as to have a final film thickness of 4 μm, and 15% on a hot plate at 80 ° C. It was dried for a minute to obtain 8 coating films of the photosensitive resin composition (1) and 6 coating films of the comparative photosensitive resin composition (1). Except for one sheet, the entire surface was exposed with a high-pressure mercury lamp using a manual exposure machine. The seven coating films of the photosensitive resin composition (1) were each exposed at 0, 10, 30, 50, 100, 300, and 1000 mJ / cm ² . The five coating films of the comparative photosensitive resin composition (1) were exposed at 0, 500, 1000, 2000, and 4000 mJ / cm ² , respectively. The remaining one sheet was exposed in a pattern. Thereafter, each coating film was heated at 155 ° C. for 10 minutes.

[Evaluation of photosensitive resin composition: remaining film ratio]
Each of the coating films exposed on the entire surface was immersed in a 9: 1 mixed solution of 2.38% by weight of tetramethylammonium hydroxide and isopropanol at room temperature for 10 minutes, and the remaining film thickness on the glass was measured. The results are shown in FIG. In the figure, the normalized residual film ratio was defined as film thickness after development × 100 / maximum film thickness after development.

  Since the residual film rate increases with the increase in the UV irradiation amount, the base generator generates a secondary amine having one NH group capable of forming an amide bond by UV irradiation and heating. Was shown to be in progress. The photosensitive resin composition (1) of the present invention had a normalized film thickness of about 1 at 50 mJ. In contrast, the comparative photosensitive resin composition (1) had a remaining film ratio of 0 at 500 mJ and a normalized film thickness of about 1 at 1000 mJ. From this, it was clarified that the photosensitive resin composition of the present invention proceeds with imidization with a small exposure amount as compared with the comparative photosensitive resin composition, and it was shown that the sensitivity was high.

[Evaluation of photosensitive resin composition: pattern forming ability]
About each coating film which exposed the pattern shape of the photosensitive resin composition of this invention, it was immersed in the solution which mixed tetramethylammonium hydroxide 2.38weight% aqueous solution and isopropanol by 9: 1. As a result, a pattern was obtained in which the exposed portion remained undissolved in the developer. Furthermore, it was heated at 350 ° C. for 1 hour to perform imidization. From this result, it became clear that the photosensitive resin composition of the present invention can form a good pattern. A pattern was formed with 100 mJ of the photosensitive resin composition (1) of the present invention. On the other hand, the comparative photosensitive resin composition finally formed a pattern at 2000 mJ.

(Example 2: Preparation of photosensitive resin composition (2))
A photosensitive resin composition (2) having the following composition was prepared using the base generator (2).
Epoxy resin (manufactured by jER828 Japan Epoxy Resin): 15 parts by weight Base generator (2): 15 parts by weight Solvent (N-methyl-2-pyrrolidone): 370 parts by weight

The photosensitive resin composition (2) was spin-coated on two chrome-plated glasses so that the final film thickness was 0.5 μm, and dried on an 80 ° C. hot plate for 15 minutes, Two coating films of the photosensitive resin composition were obtained. About 1 sheet of the coating film of the photosensitive resin composition, 10 J / cm < ² > whole surface exposure was performed with the high pressure mercury lamp using the manual exposure machine. Thereafter, each coating film was heated at 160 ° C. for 30 minutes. When the heated coating film was immersed in a mixed solution of isopropanol and chloroform (isopropanol: chloroform = 4: 1 (volume ratio)) at room temperature for 10 minutes, the heated coating film after the exposure did not dissolve in the mixed solution, but was epoxy. It became clear that the resin was cured. On the other hand, the coating film heated without exposure was dissolved in the mixed solution.

(Example 3: Preparation of photosensitive resin composition (3))
Photosensitivity comprising 100 parts by weight of hexamethylene diisocyanate (manufactured by Kanto Chemical) as an isocyanate resin, 150 parts by weight of polytetrahydrofuran (manufactured by Aldrich) as a resin having a hydroxyl group, 10 parts by weight of a base generator (2), and 500 parts by weight of tetrahydrofuran. Resin composition (3) was prepared.

The photosensitive resin composition (3) was spin-coated on a chromium-plated glass so that the final film thickness was 0.5 μm, and dried on a hot plate at 60 ° C. for 5 minutes. One coating film was obtained. The obtained coating film was subjected to 1 J / cm ² overall exposure with a high-pressure mercury lamp using a manual exposure machine. Then, when it heated at 120 degreeC for 10 minute (s) and cooled to room temperature, the low-elasticity solid substance was obtained and it confirmed that hardening with an isocyanate group and a hydroxyl group advanced.

(Example 4: Preparation of photosensitive resin composition (4))
After mixing 100 parts by weight of the alkoxysilane condensate (1) obtained in Synthesis Example 2 above and 10 parts by weight of the base generator (2), the mixture is dissolved in 500 parts by weight of tetrahydrofuran as a solvent to obtain a photosensitive resin composition. A product (4) was prepared.

The photosensitive resin composition (4) was spin-coated on two chrome-plated glasses so that the final film thickness was 0.5 μm, respectively, and dried on an 80 ° C. hot plate for 5 minutes. Two coating films of the conductive resin composition were obtained. About 1 sheet of the coating film of the photosensitive resin composition, 10 J / cm < ² > whole surface exposure was performed with the high pressure mercury lamp using the manual exposure machine. Thereafter, each of the exposed coating film and the unexposed coating film was heated at 120 ° C. for 30 minutes. Infrared absorption spectrum measurement was performed on each sample before and after heating. As a result, for the sample after heating of the exposed coating film, a peak of 1020 cm ^-1 attributed to the Si-O-Si bond indicating polymerization appeared, and it was attributed to Si-OCH ₃ indicating the raw material. The peaks at 2850 cm ^-1 and 850 cm ^-1 were reduced compared to the sample before heating. In the sample after heating the unexposed film, a peak of 1020 cm ^-1 attributed to the Si-O-Si bond, indicating that it was polymerized, appeared. It was small. From these, it has been clarified that, when the photobase generator of the present invention is used for exposure, a base is generated and the polymerization of the alkoxysilane condensate is promoted.

(Example 5: Preparation of photosensitive resin composition (5))
A photosensitive resin composition (5) having the composition shown below was prepared using the base generator (6).
Epoxy resin (manufactured by jER828 Japan Epoxy Resin): 15 parts by weight Base generator (6): 15 parts by weight Solvent (N-methyl-2-pyrrolidone): 370 parts by weight

The photosensitive resin composition (5) was spin-coated on two chrome-plated glasses so that the final film thickness was 0.5 μm, and dried on an 80 ° C. hot plate for 15 minutes, Two coating films of the photosensitive resin composition were obtained. About 1 sheet of the coating film of the photosensitive resin composition, 10 J / cm < ² > whole surface exposure was performed with the high pressure mercury lamp using the manual exposure machine. Thereafter, each coating film was heated at 160 ° C. for 30 minutes. When the heated coating film was immersed in a mixed solution of isopropanol and chloroform (isopropanol: chloroform = 4: 1 (volume ratio)) at room temperature for 10 minutes, the heated coating film after the exposure did not dissolve in the mixed solution, but was epoxy. It became clear that the resin was cured. On the other hand, the coating film heated without exposure was dissolved in the mixed solution.

Claims (14)

A base generator represented by the following chemical formula (1) and generating a base upon irradiation and heating of electromagnetic waves.

(In Formula (1), R ¹ and R ² are each independently hydrogen or a monovalent organic group, and may be the same or different. R ¹ and R ² are bonded to each other. ^May form a cyclic structure and may include a heteroatom bond, provided that at least one of R ¹ and R ² is a monovalent organic group R ³ , R ⁴ , R ⁵ And R ⁶ are each independently hydrogen, halogen, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfino group, sulfo group, sulfonate group, phosphino group, phosphinyl group, phosphono group , Phosphonato group, amino group, ammonio group or monovalent organic group, which may be the same or different, provided that at least one of R ³ , R ⁴ , R ⁵ and R ⁶ is a hydroxyl group, mercapto Group, sul I de group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonate group, an amino group, or an ammonio a group .R ^3, R ⁴ , R ^5, and R ⁶ may be bonded to each other to form a cyclic structure or may include a hetero atom bond.   The base generator according to claim 1, wherein the 5% weight loss temperature is 100 ° C or higher and 350 ° C or lower.   The base generator according to claim 1 or 2, wherein the base to be generated is a secondary amine and / or heterocyclic compound having one NH group capable of forming an amide bond. The base generator according to any one of claims 1 to 3, wherein the base generated is a base generator represented by the following chemical formula (2).

(In the formula (2), R ¹ and R ² are each independently a monovalent organic group having an alkyl group having 1 to 20 carbon atoms which may have a substituent, or a substituent. Or a cycloalkyl group having 4 to 22 carbon atoms, R ¹ and R ² may be the same or different, and R ¹ and R ² are bonded to each other to form a cyclic structure. Or may contain a heteroatom bond.)   The base generator according to claim 1 or 2, wherein the base to be generated is a base having two or more NH groups capable of forming an amide bond.   The base generator according to any one of claims 1 to 5, which has absorption at at least one of wavelengths of electromagnetic waves of 365 nm, 405 nm, and 436 nm.   A polymer precursor whose reaction to the final product is promoted by heating with a basic substance or in the presence of a basic substance, and the base generator according to any one of claims 1 to 6 The photosensitive resin composition characterized by the above-mentioned.   The polymer precursor is selected from the group consisting of a compound and polymer having an epoxy group, an isocyanate group, an oxetane group, or a thiirane group, a polysiloxane precursor, a polyimide precursor, and a polybenzoxazole precursor. The photosensitive resin composition according to claim 7, comprising the above.   The photosensitive resin composition according to claim 7, wherein the polymer precursor is soluble in a basic solution.   The photosensitive resin composition according to claim 7, wherein the polymer precursor is a polyimide precursor or a polybenzoxazole precursor.   Paint, printing ink, sealing material or adhesive, color filter, flexible display film, semiconductor device, electronic component, interlayer insulating film, wiring coating film, optical circuit, optical circuit component, antireflection film, hologram The photosensitive resin composition according to any one of claims 7 to 10, which is used as a material for forming an optical member or a building material.   A pattern forming material comprising the photosensitive resin composition according to claim 7.   A coating film or a molded body is formed using the photosensitive resin composition according to any one of claims 7 to 11, and the coating film or the molded body is irradiated with electromagnetic waves in a predetermined pattern, and after irradiation or irradiation A negative pattern forming method, wherein heating is performed at the same time to change the solubility of the irradiated portion, followed by development.   Printed matter, paint, sealant, adhesive, display device, semiconductor device, electronic component, microscopic part, at least part of which is formed of the photosensitive resin composition according to any one of claims 7 to 11 or a cured product thereof. An article that is an electromechanical system, an optically shaped object, an optical member, or a building material.

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