JP2011088311A - Method of manufacturing actuator and method of manufacturing liquid ejection head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an actuator of high reliability. <P>SOLUTION: The method of manufacturing the actuator includes steps of: removing at least a part of a coating layer 130 located above a first area 125 to form a first opening 150, and also, removing at least a part of the coating layer 130 located above a second area 127 to form a second opening 152; depositing a first metal layer 142 located above the first and second areas 125 and 127 and on the covering layer 130; depositing a second metal layer 144 on the first metal layer 142; patterning the first metal layer 142 and the second metal layer 144 to form a lead wire 140 which electrically connects to a second conductive layer 146 through the second opening 152; and removing the second metal layer 144 deposited above the first area 125 to form a third conductive layer 128. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an actuator manufacturing method and a liquid jet head manufacturing method.

  In a liquid ejecting apparatus such as an ink jet printer, for example, a liquid ejecting head including an actuator is used to eject a droplet such as ink. Such a liquid jet head can change the pressure in the pressure chamber formed below the actuator by deforming the piezoelectric layer of the piezoelectric element by a drive signal or the like. Thereby, droplets of ink or the like supplied from the nozzle hole into the pressure chamber can be ejected.

  In an actuator including such a piezoelectric element, for example, in order to protect a piezoelectric layer that deteriorates due to moisture or the like, a protection made of aluminum oxide or the like covering the upper surface of the upper electrode and the side surface of the piezoelectric layer of the piezoelectric element. A piezoelectric element having a film is used. However, in a piezoelectric element having such a protective film, since the protective film prevents deformation of the piezoelectric layer, the ejection characteristics of ink or the like may be impaired. Therefore, for example, in Patent Document 1, an opening is formed in the protective film on the upper surface of the upper electrode to relax the restriction on the deformation of the piezoelectric layer.

  However, in such a piezoelectric element having an opening in the protective film, the upper electrode may be over-etched by forming the opening in the protective film in the manufacturing process. In general, in the piezoelectric element, a noble metal such as platinum or iridium is used for the upper electrode, but it is desirable that the upper electrode is thin in order to reduce the cost. In such a thin upper electrode, when a protective film is formed on the upper electrode, the influence of over-etching at the opening is large, and the upper electrode becomes thinner at this opening, resulting in high resistance or extreme In such a case, the upper electrode may be disconnected. Therefore, there is a problem that the reliability of the piezoelectric element is lowered.

JP 2007-276384 A

  One of the objects according to some aspects of the present invention is to provide a method of manufacturing a reliable actuator. Another object of some aspects of the present invention is to provide a method of manufacturing a liquid ejecting head including the above-described method of manufacturing an actuator.

The method for manufacturing an actuator according to the present invention includes:
Forming a diaphragm above the substrate;
Forming a first conductive layer above the diaphragm;
Forming a piezoelectric layer covering the first conductive layer;
A second conductive layer having a first region that overlaps the first conductive layer and a second region that does not overlap the first conductive layer when viewed from the thickness direction of the piezoelectric layer above the piezoelectric layer. Forming a layer;
Forming a coating layer on the side of the piezoelectric layer, on the side and above the second conductive layer;
The covering layer in at least a part above the first region is removed to form a first opening, and the covering layer in at least a part above the second region is removed to form a second opening. Forming, and
Depositing a first metal layer above the first region, above the second region, and above the coating layer;
Forming a second metal layer above the first metal layer;
Patterning the first metal layer and the second metal layer to form a lead wiring electrically connected to the second conductive layer through the second opening;
Removing the second metal layer deposited above the first region to form a third conductive layer;
including.

  According to such an actuator manufacturing method, since the third conductive layer is formed above the first region, a highly reliable actuator can be obtained.

In the manufacturing method of the actuator according to the present invention,
The first metal layer is a layer containing at least a nickel-chromium alloy,
The second metal layer may be a layer containing at least gold.

  According to such an actuator manufacturing method, the first metal layer can function as a layer for bringing the second metal layer into close contact, and the second metal layer can have high conductivity.

In the manufacturing method of the actuator according to the present invention,
The step of forming the third conductive layer by removing the second metal layer may be performed by wet etching.

  According to such an actuator manufacturing method, the second metal layer can be selectively removed.

A method for manufacturing a liquid jet head according to the present invention includes:
Forming an actuator according to the present invention;
Forming a flow path forming plate in communication with the nozzle hole and having a pressure chamber whose volume is changed by the operation of the actuator;
including.

  According to such a method for manufacturing a liquid jet head, since the method for manufacturing an actuator according to the present invention is included, a highly reliable liquid jet head can be obtained.

FIG. 3 is an exploded perspective view schematically illustrating the liquid ejecting head according to the embodiment. FIG. 3 is a plan view schematically showing a main part of the liquid jet head according to the embodiment. FIG. 3 is a cross-sectional view schematically illustrating a main part of the liquid ejecting head according to the embodiment. FIG. 3 is a cross-sectional view schematically illustrating a main part of the liquid ejecting head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing a manufacturing process of the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing a manufacturing process of the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing a manufacturing process of the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing a manufacturing process of the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing a manufacturing process of the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing a manufacturing process of the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing a manufacturing process of the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing a manufacturing process of the liquid jet head according to the embodiment. FIG. 6 is a cross-sectional view schematically showing a manufacturing process of the liquid jet head according to the embodiment.

  Preferred embodiments of the present invention will be described below with reference to the drawings.

1. Actuator and Liquid Ejecting Head First, the actuator 100 and the liquid ejecting head 1000 according to the present embodiment will be described. Here, a case where the actuator 100 is used in the liquid ejecting head 1000 will be described as an example of the actuator 100. The application of the actuator 100 is not limited to the liquid ejecting head.

  FIG. 1 is an exploded perspective view schematically showing a liquid jet head 1000 using the actuator 100 according to the present embodiment. FIG. 2 is a plan view schematically showing the flow path forming plate 10 and the actuator 100 which are the main parts of the liquid jet head 1000. 3 is a cross-sectional view taken along line III-III in FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.

  As shown in FIGS. 1 to 4, the liquid ejecting head 1000 includes an actuator 100, a flow path forming plate 10 having a pressure chamber 11, and a nozzle plate 20 having nozzle holes 21. The liquid ejecting head 1000 can further include, for example, a sealing plate 40. The actuator 100 can include a vibration plate 110 and a piezoelectric element 120. The piezoelectric element 120 can include a first conductive layer 122, a piezoelectric layer 124, a second conductive layer 126, a third conductive layer 128, a covering layer 130, and a lead wiring 140.

  The flow path forming plate 10 has a pressure chamber 11. As shown in FIG. 1, the flow path forming plate 10 has a wall portion 12 that constitutes a side wall of the pressure chamber 11. Further, the flow path forming plate 10 may have a reservoir 15 that communicates with the pressure chamber 11 via the supply path 13 and the communication path 14. Liquid may be supplied to the reservoir 15 from the outside through the through hole 16. By supplying the liquid to the reservoir 15, the liquid can be supplied to the pressure chamber 11 through the supply path 13 and the communication path 14. The shape of the pressure chamber 11 is not particularly limited. The shape of the pressure chamber 11 may be, for example, a parallelogram in a plan view or a rectangle. The number of the pressure chambers 11 is not particularly limited, and may be one or a plurality. The material of the flow path forming plate 10 is not particularly limited. The flow path forming plate 10 may be formed of, for example, single crystal silicon, nickel, stainless steel, stainless steel, glass ceramics, various resin materials, or the like.

  The nozzle plate 20 is formed below the flow path forming plate 10 as shown in FIG. The nozzle plate 20 is a plate-like member and has a nozzle hole 21. The nozzle hole 21 is formed so as to communicate with the pressure chamber 11. The shape of the nozzle hole 21 is not particularly limited as long as the liquid can be discharged. Through the nozzle hole 21, the liquid in the pressure chamber 11 can be discharged toward the lower side of the nozzle plate 20, for example. Moreover, the number of the nozzle holes 21 is not specifically limited, One may be sufficient and multiple may be provided. The material of the nozzle plate 20 is not particularly limited. The nozzle plate 20 may be formed of, for example, single crystal silicon, nickel, stainless steel, stainless steel, glass ceramics, various resin materials, or the like.

  The actuator 100 is formed on the flow path forming plate 10 as shown in FIG. In the actuator 100, the piezoelectric element 120 is electrically connected to the external drive circuit 50 and can operate (vibrate or deform) based on a signal from the external drive circuit 50. The diaphragm 110 can be displaced by the operation of the piezoelectric element 120 and can appropriately deform the internal pressure of the pressure chamber 11. The piezoelectric element 120 is formed for each pressure chamber 11. As shown in FIG. 2, the plurality of piezoelectric elements 120 are arranged in a first direction A perpendicular to the longitudinal direction of the second conductive layer 126. A plurality of piezoelectric elements 120 may be arranged in a direction intersecting the longitudinal direction of the second conductive layer 126. For example, when the longitudinal direction of the pressure chamber 11 is the second direction B, the longitudinal direction of the second conductive layer 126 is the same as the second direction B in the illustrated example. That is, the first direction A is a direction orthogonal to the second direction B in the illustrated example.

  As shown in FIGS. 3 and 4, the diaphragm 110 is formed on the flow path forming plate 10. The diaphragm 110 is a plate-like member, for example. The diaphragm 110 can have a laminated structure including, for example, a first layer 112 and a second layer 114. As the first layer 112, for example, silicon oxide can be used. As the second layer 114, for example, zirconium oxide can be used. The diaphragm 110 is not limited to this. For example, a single layer structure or a plurality of materials including an insulating film such as zirconium oxide or silicon oxide, a metal film such as nickel, and a polymer material film such as polyimide are stacked. It may be a structure. The diaphragm 110 can vibrate (displace) when the piezoelectric layer 124 of the piezoelectric element 120 is deformed. Thereby, the volume of the pressure chamber 11 formed below can be changed. A through-hole 16 communicating with the reservoir 15 is formed in the vibration plate 110. The shape of the through hole 16 is not particularly limited as long as the liquid can be supplied to the reservoir 15. For example, a laminated body 17 including a first metal layer 142 and a second metal layer 144 may be formed around the through hole 16.

The first conductive layer 122 is formed above the diaphragm 110. The first conductive layer 122 is one electrode (a lower electrode formed below the piezoelectric layer 124) for applying a voltage to the piezoelectric layer 124. As shown in FIG. 2, the first conductive layer 122 is, for example, a common electrode for the plurality of piezoelectric elements 120. Examples of the material of the first conductive layer 122 include various metals such as tungsten, nickel, iridium, palladium, gold, and platinum, conductive oxides thereof (for example, iridium oxide), and composite oxides of strontium and ruthenium ( Examples thereof include SrRuO _x : SRO), lanthanum and nickel composite oxide (LaNiO _x : LNO), and the like. The first conductive layer 122 may have a single-layer structure of the exemplified materials or a structure in which a plurality of materials are stacked. Further, an adhesion layer (not shown) or the like may be formed between the first conductive layer 122 and the diaphragm 110, for example. Examples of the adhesion layer in this case include a titanium layer. The thickness of the first conductive layer 122 can be, for example, not less than 50 nm and not more than 300 nm.

  The piezoelectric layer 124 is formed so as to cover the first conductive layer 122. As shown in FIG. 3, the piezoelectric layer 122 covers at least the side surface and the upper surface of the first conductive layer 122. Another layer may be formed between the piezoelectric layer 124 and the first conductive layer 122. Examples of other layers in this case include an orientation control layer (for example, a titanium layer) for controlling the crystal orientation of the piezoelectric layer 124, for example. The thickness of the piezoelectric layer 124 can be, for example, not less than 300 nm and not more than 3000 nm. If the thickness of the piezoelectric layer 124 is out of the above range, the expansion / contraction necessary for deforming the diaphragm 110 may not be obtained.

  As shown in FIG. 4, the piezoelectric layer 124 has an upper surface 124a and a side surface 124b connected to the upper surface 124a. In the example of FIG. 4, the upper surface 124 a of the piezoelectric layer 124 is a flat surface (a plane) and is substantially parallel to the upper surface of the diaphragm 110. The upper surface 124 a of the piezoelectric layer 124 is not necessarily limited to a flat surface, and may have a convex shape reflecting the shape of the underlying first conductive layer 122. The side surface 124 b of the piezoelectric layer 124 is a surface that connects the upper surface 124 a of the piezoelectric layer 124 and the upper surface of the diaphragm 110. The side surface 124b of the piezoelectric layer 124 may be composed of a single flat surface or a plurality of flat surfaces. Further, the side surface 124b of the piezoelectric layer 124 may be configured to include a curved surface.

The piezoelectric layer 124 is formed of a piezoelectric material. Therefore, the piezoelectric layer 124 can be deformed by applying an electric field by the first conductive layer 122 and the second conductive layer 126. Due to this deformation, the diaphragm 110 can bend and vibrate. The material of the piezoelectric layer 124 is preferably a perovskite oxide represented by the general formula ABO ₃ (for example, A includes Pb and B includes Zr and Ti). Specific examples of such materials include lead zirconate titanate (Pb (Zr, Ti) O ₃ ) (hereinafter sometimes abbreviated as “PZT”), barium titanate (BaTiO ₃ ), potassium niobate. Sodium ((K, Na) NbO ₃ ) and the like can be mentioned. Of these, PZT is particularly suitable as the material of the piezoelectric layer 124 because of excellent piezoelectric characteristics.

  The second conductive layer 126 is formed above the piezoelectric layer 124. The second conductive layer 126 is formed to extend in the second direction B. As shown in FIGS. 2 and 3, the second conductive layer 126 includes a first region 125 that overlaps the first conductive layer 122 when viewed from the thickness direction of the piezoelectric layer 124 (in plan view), and a first conductive layer. And a second region 127 that does not overlap 122. In the illustrated example, the second region 127 is a region other than the first region 125 of the second conductive layer 126. The thickness of the second conductive layer 126 can be, for example, not less than 10 nm and not more than 200 nm. The second conductive layer 126 is the other electrode for applying a voltage to the piezoelectric layer 124 (an upper electrode formed on the piezoelectric layer 124). Examples of the material of the second conductive layer 126 include various metals such as nickel, iridium, palladium, gold, platinum, and tungsten, their conductive oxides (such as iridium oxide), SRO, LNO, and the like. it can. The second conductive layer 126 may be a single layer or a structure in which a plurality of layers are stacked.

  The third conductive layer 128 is formed above the first region 125 of the second electrode 126. As shown in FIGS. 3 and 4, the third conductive layer 128 is formed so as to cover the first opening 150. The third conductive layer 128 is in contact with the second conductive layer 126 in the illustrated example. Although not shown, for example, the first opening 150 may penetrate the second conductive layer 124 a and the third conductive layer 128 may be in contact with the piezoelectric layer 124. Similar to the second conductive layer 126, the third conductive layer 128 can function as the other electrode (upper electrode formed on the piezoelectric layer 124) for applying a voltage to the piezoelectric layer 124. . The third conductive layer 128 may be formed of the first metal layer 142 that constitutes the lead wiring 140. Since the third conductive layer 128 (first metal layer 142) is thin as will be described later, the deformation of the piezoelectric layer 124 can be prevented.

  As shown in FIGS. 3 and 4, the covering layer 130 includes a side 124 b of the piezoelectric layer 124, a region excluding the openings 150 and 152 above the second conductive layer 126, and the second conductive layer 126. It is formed on the side 126b. The covering layer 130 is made of an insulating material having high moisture resistance, and for example, aluminum oxide or silicon oxide can be used. As the coating layer 130, it is preferable to use aluminum oxide having higher moisture resistance. A first opening 150 and a second opening 152 are formed in the coating layer 130. In the illustrated example, the first opening 150 is formed above the first region 125 of the second conductive layer 126 and exposes a part of the first region 125. The second opening 152 is formed above the second region 127 of the second conductive layer 126 and exposes a part of the second region 127. Although not shown, the first opening 150 may remove at least a part of the first region 125 of the second conductive layer 126 to bring the piezoelectric layer 124 and the third conductive layer 128 into contact with each other. The second opening 152 may remove at least a part of the second region 127 of the second conductive layer 126 so that the piezoelectric layer 124 and the third conductive layer 128 are in contact with each other. In the actuator 100, since the first opening 150 is formed in the coating layer 130, the deformation of the piezoelectric layer 124 by the coating layer 130 can be suppressed.

  The lead wiring 140 is electrically connected to the second conductive layer 126 through the second opening 152. The lead wiring 140 may be a wiring for electrically connecting the second conductive layer 126 and the external driving circuit 50. For example, the lead wiring 140 includes a first metal layer 142 and a second metal layer 144. The material of the first metal layer 142 is not particularly limited as long as the adhesion between the second metal layer 144 and the base layer (for example, the coating layer 130) can be secured. For example, nickel-chromium alloy, titanium, titanium tungsten Alloys, nickel, and chromium are listed. The material of the second metal layer 144 may be any material having high conductivity, and examples thereof include gold, platinum, aluminum, and copper. The lead wiring 140 may have a layer other than the first metal layer 142 and the second metal layer 144. The thickness of the first metal layer 142 is, for example, about 50 nm. The thickness of the second metal layer 144 is 1 μm, for example.

  The sealing plate 40 can seal the piezoelectric element 120. The sealing plate 40 has a region 41 for sealing the piezoelectric element 120. The size and shape of the region 41 of the sealing plate 40 are not particularly limited as long as the deformation of the piezoelectric element 120 (piezoelectric layer 124) is not hindered. The sealing plate 40 may be formed of, for example, single crystal silicon, nickel, stainless steel, stainless steel, glass ceramic, various resin materials, or the like.

  The liquid ejecting head 1000 may further include a housing (not shown) that is made of various resin materials and various metal materials and can accommodate the above-described configuration.

  The actuator 100 has the following features, for example.

  In the actuator 100, the first opening 150 can be formed in the coating film 130. Accordingly, it is possible to suppress or prevent the coating film 130 from hindering the deformation of the piezoelectric layer 124 while protecting the piezoelectric layer 124 from moisture or the like. Therefore, a highly reliable actuator can be obtained without hindering deformation of the piezoelectric layer 124.

  The actuator 100 has the characteristics as described above. Therefore, according to the liquid jet head 1000 including the actuator 100, the ejection characteristics are good and high reliability can be obtained.

2. Next, a method for manufacturing the actuator 100 and the liquid jet head 1000 according to the present embodiment will be described with reference to the drawings. 5 to 13 are cross-sectional views schematically showing the manufacturing method of the actuator 100 and the liquid jet head 1000. FIG.

  First, as shown in FIG. 5, the diaphragm 110 is formed on the silicon substrate 1. The diaphragm 110 is formed by a known film formation technique such as sputtering. When the diaphragm 110 is made of silicon oxide, for example, the diaphragm 110 may be formed by thermally oxidizing the silicon substrate 1. For example, the diaphragm 110 may be formed by forming a plurality of layers (the first layer 112 and the second layer 114).

  As shown in FIG. 6, the first conductive layer 122 is formed on the diaphragm 110. The first conductive layer 122 can be formed by, for example, a sputtering method, a plating method, a vacuum evaporation method, or the like. More specifically, the first conductive layer 122 can be formed by forming a conductive layer (not shown) on the entire surface of the vibration plate 110 and patterning the conductive layer. Here, before the conductive layer for forming the first conductive layer 122 is patterned by etching, an etching protective film (not shown) may be formed on the conductive layer. The etching protective film may be a piezoelectric layer formed of the same piezoelectric material as the piezoelectric layer 124 described later. The etching protective film may be formed at least in a region where the first conductive layer 122 is formed. According to this, in the etching process for patterning the first conductive layer 122, the surface of the first conductive layer 122 can be protected from chemical damage caused by the etchant used.

  As shown in FIG. 7, a piezoelectric film 124d that covers the first conductive layer 122 is formed. The piezoelectric film 124d can be made of the same material as the piezoelectric layer 124. The piezoelectric film 124d can be formed by, for example, a sol-gel method, a CVD (Chemical Vapor Deposition) method, a MOD (Metal Organic Deposition) method, a sputtering method, a laser ablation method, or the like. Here, when the material of the piezoelectric film 124d is, for example, PZT, the piezoelectric film 124d can be crystallized by performing annealing at about 700 ° C. in an oxygen atmosphere. The crystallization may be performed after patterning the piezoelectric film 124d. When the etching protective film is formed of the same material as the piezoelectric film 124d, it can be integrated with the piezoelectric film 124d by annealing. Next, a second conductive film 126d is formed on the entire surface of the piezoelectric film 124d. The second conductive film 126d is made of the same material as the second conductive layer 126, for example. The second conductive film 126d can be formed by, for example, a sputtering method, a plating method, a vacuum evaporation method, or the like.

  As shown in FIG. 8, the second conductive film 126d and the piezoelectric film 124d are patterned. The patterning can be performed by, for example, a known photolithography technique or etching technique. Thereby, the piezoelectric layer 124 and the second conductive layer 126 are formed. The second conductive layer 126 can have a first region 125 that overlaps the first conductive layer 122 and a second region 127 that does not overlap the first conductive layer 122 when viewed from the thickness direction of the piezoelectric layer 124. . The second conductive layer 126 may be formed by patterning the second conductive film 126d and the piezoelectric film 124d to form the piezoelectric layer 124, and then further patterning the second conductive film 126d.

  As shown in FIGS. 9A and 9B, the coating layer 130 is formed on the side surface 124b of the piezoelectric layer 124 and the side surface 126b and the upper surface 126a of the second conductive layer 126. That is, the coating layer 130 is formed so as to cover the piezoelectric element 120. The covering layer 130 may be further formed on the vibration plate 110. The covering layer 130 can be formed by sputtering, for example.

  As shown in FIG. 10, the covering layer 130 in a part of the second conductive layer 126 on the first region 125 is removed to form the first opening 150, and on the second region 127 of the second conductive layer 126. The second layer 152 is formed by removing the covering layer 130 in a part of the first opening 152. Specifically, first, a resist layer (not shown) that covers the covering layer 130 is formed, and the resist layer is patterned. Next, the openings 150 and 152 can be formed by etching the covering layer 130 using the resist layer as a mask.

  Next, the through hole 16 may be formed (see FIG. 1). Specifically, for example, the diaphragm 110 in the region where the through hole 16 is formed can be removed by etching.

  As illustrated in FIG. 11, the first metal layer 142 is formed on the first region 125 of the second conductive layer 126, the second region 127 of the second conductive layer 126, and the covering layer 130. Further, the first metal layer 142 may be formed so as to cover the through hole 16. The first metal layer 142 can be formed by sputtering, for example. Next, a second metal layer 144 is formed on the first metal layer 142. The second conductive layer 144 can be formed by sputtering, for example.

  As shown in FIG. 12, the first metal layer 142 and the second metal layer 144 are patterned. Thereby, the lead wiring 140 electrically connected to the second conductive layer 126 through the second opening 152 can be formed. Specifically, the patterning can be performed by, for example, a known photolithography technique or an etching technique (for example, wet etching). When the first metal layer 142 has a nickel-chromium alloy as a main component, for example, cerium ammonium nitrate can be used as the etchant. In the case where the second conductive layer 144 is mainly composed of gold, potassium iodide can be used as an etching solution. Note that in this step, the first metal layer 142 and the second metal layer 144 formed on the first region 125 are not removed.

  Next, the second metal layer 144 on the first region 125 is removed. Thereby, the third conductive layer 128 can be formed. The second metal layer 144 can be removed by, for example, a photolithography technique or an etching technique. Etching can be performed, for example, by wet etching. Thereby, the second conductive layer 126 can be selectively removed. In the case where the second conductive layer 144 is mainly composed of gold, potassium iodide can be used as an etching solution. In the step of removing the second metal layer 144 on the first region 125, the second metal layer 144 around the region where the through hole 16 is formed may be removed. As a result, the ink or the like reacts with the second metal layer 144 to melt the second metal layer 144, thereby preventing the ink or the like from entering the region where the piezoelectric element 120 is formed.

  The actuator 100 can be manufactured through the above steps.

  As shown in FIG. 13, the sealing plate 40 is mounted on the actuator 100. Thereby, the piezoelectric element 120 can be sealed. The sealing plate 40 can be fixed with an adhesive, for example. Next, the silicon substrate 1 is thinned to a predetermined thickness. Next, the pressure chamber 11, the supply path 13, the communication path 14, and the reservoir 15 are formed in the silicon substrate 1 (see FIGS. 1 and 13). . For example, a mask (not shown) is formed on the surface opposite to the surface on which the vibration plate 110 is formed so as to be patterned into a desired shape, and etching is performed, whereby the pressure chamber 11, the wall portion 12, The supply path 13, the communication path 14, and the reservoir 15 can be partitioned. Through the above steps, the flow path forming plate 10 having the pressure chamber 11 can be formed. Next, the nozzle plate 20 having the nozzle holes 21 is bonded to a predetermined position by, for example, an adhesive. As a result, the nozzle hole 21 communicates with the pressure chamber 11.

  The liquid ejecting head 1000 can be manufactured through the above steps. Note that the manufacturing method of the liquid jet head 1000 is not limited to the above-described manufacturing method. For example, the flow path forming plate 10 and the nozzle plate 20 may be integrally formed using an electroforming method or the like.

  According to the method for manufacturing an actuator according to the present embodiment, the first opening 150 can be formed in the coating film 130. Accordingly, it is possible to suppress or prevent the coating film 130 from hindering the deformation of the piezoelectric layer 124 while protecting the piezoelectric layer 124 from moisture or the like. Therefore, a highly reliable actuator can be obtained without hindering deformation of the piezoelectric layer 124.

  According to the method for manufacturing an actuator according to the present embodiment, the third conductive layer 128 can be formed on the first region 125. For example, the second conductive layer 126 is over-etched in the reverse sputtering in the step of forming the first metal layer 142 and the step of forming the openings 150 and 152 shown in FIG. It may break. However, according to the manufacturing method of the actuator according to the present embodiment, the third conductive layer 128 can function as the second conductive layer 126 (one electrode of the piezoelectric element 120). It is possible to suppress or prevent the increase in resistance due to the increase in the length and disconnection. Therefore, a highly reliable actuator can be obtained. In particular, when a noble metal is applied to the second conductive layer 126, the thickness of the second conductive layer 126 is reduced in order to reduce the cost. In such a case, the above-described effect is remarkably generated.

  According to the manufacturing method of the actuator according to the present embodiment, the third conductive layer 128 can be formed of the first metal layer 142. That is, the third conductive layer 128 can be formed using the first metal layer 142 for forming the lead wiring 140. Therefore, a highly reliable actuator can be obtained with a simple process.

  According to the method for manufacturing the liquid jet head according to the present embodiment, the method for manufacturing the actuator according to the present embodiment can be included. Therefore, as described above, a highly reliable liquid jet head can be obtained.

  Here, the case where the liquid ejecting head is an ink jet recording head has been described. However, the liquid jet head of the present invention includes, for example, a color material jet head used for manufacturing a color filter such as a liquid crystal display, an electrode material jet head used for forming an electrode such as an organic EL display, FED (surface emitting display), It can also be used as a bioorganic matter ejecting head used for biochip manufacture.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is possible to combine the embodiment and each modification as appropriate.

  Although the embodiments of the present invention have been described in detail as described above, those skilled in the art will readily understand that many modifications are possible without substantially departing from the novel matters and effects of the present invention. Accordingly, all such modifications are intended to be included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Silicon substrate, 10 flow-path formation board, 11 pressure chamber, 12 wall part, 13 supply path,
14 communication passages, 15 reservoirs, 16 through holes, 17 laminates, 20 nozzle plates,
21 nozzle hole, 40 sealing plate, 41 area, 50 external drive circuit,
100 actuator, 110 diaphragm, 112 first layer, 114 second layer,
120 piezoelectric element, 122 first conductive layer, 124 piezoelectric layer, 124a upper surface,
124b side surface, 124d piezoelectric film, 125 first region, 126 second conductive layer,
126a upper surface, 126b side surface, 126d second conductive film, 127 second region,
128 third conductive layer, 130 coating layer, 140 lead wiring, 142 first metal layer,
144 second metal layer, 150 first opening, 152 second opening,
1000 Liquid jet head

Claims (4)

Forming a diaphragm above the substrate;
Forming a first conductive layer above the diaphragm;
Forming a piezoelectric layer covering the first conductive layer;
A second conductive layer having a first region that overlaps the first conductive layer and a second region that does not overlap the first conductive layer when viewed from the thickness direction of the piezoelectric layer above the piezoelectric layer. Forming a layer;
Forming a coating layer on the side of the piezoelectric layer, on the side and above the second conductive layer;
The covering layer in at least a part above the first region is removed to form a first opening, and the covering layer in at least a part above the second region is removed to form a second opening. Forming, and
Depositing a first metal layer above the first region, above the second region, and above the coating layer;
Forming a second metal layer above the first metal layer;
Patterning the first metal layer and the second metal layer to form a lead wiring electrically connected to the second conductive layer through the second opening;
Removing the second metal layer deposited above the first region to form a third conductive layer;
A method for manufacturing an actuator, comprising: In claim 1,
The first metal layer is a layer containing at least a nickel-chromium alloy,
The method for manufacturing an actuator, wherein the second metal layer is a layer containing at least gold. In claim 1 or 2,
The method of manufacturing an actuator, wherein the step of forming the third conductive layer by removing the second metal layer is performed by wet etching. Forming the actuator according to any one of claims 1 to 3,
Forming a flow path forming plate in communication with the nozzle hole and having a pressure chamber whose volume is changed by the operation of the actuator;
A method for manufacturing a liquid jet head, comprising:

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