JP2011080853A - Humidity sensor package and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a humidity sensor package certainly sealing those other than a humidity sensor and achieving high reliability and lower height and a method of manufacturing thereof. <P>SOLUTION: In the humidity sensor package which is made by adhesive fixing a sensor chip substrate forming a humidity sensor and an IC substrate detecting an output change of the humidity sensor to a support substrate, the sensor tip substrate and the IC substrate are covered by a sealing resin, while exposing the humidity sensor, and the surface of the sealing resin and a face of forming the humidity sensor of the sensor tip substrate are positioned at the same height. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a humidity sensor package in which a humidity sensor and an IC substrate are bonded and fixed on the same support substrate, and a manufacturing method thereof.

  Humidity formed by bonding and fixing a sensor chip substrate on which a humidity sensor whose capacitance or electric resistance changes according to humidity and an IC substrate that detects capacitance change or resistance change of the humidity sensor on the same support substrate Sensor packages are known. In such a humidity sensor package, it is desirable to seal the entire substrate in order to protect the electric wiring part of the sensor chip substrate and the IC substrate and the IC substrate from damage and corrosion due to impact. (Moisture sensitive part) needs to be exposed to the atmosphere. Therefore, conventionally, a humidity sensor is exposed and only the electric wiring portion of the sensor chip substrate and the IC substrate is covered with a protective resin (Patent Document 1), or a humidity sensor whose output changes depending on humidity as a humidity sensor. An area covered with a protective material provided with a reference material that maintains a constant output regardless of the humidity and humidity, provided an area that exposes only the moisture sensitive part and covers the periphery of the moisture sensitive part Other than that, the structure was covered with a protective resin.

JP 2007-127612 A

  However, in the structure in which the protective resin is provided only in the electric wiring portion, the protective resin may flow into the humidity sensor, and it is difficult to expose only the humidity sensor. On the other hand, in a structure in which a protective material that covers the periphery of the moisture sensitive part of the humidity sensor is provided separately from the protective resin, for example, if the sensor chip substrate is a Si substrate and the protective material is glass, the difference in thermal expansion coefficient between Si and glass When the sensor chip substrate is bonded and fixed to the support substrate, thermal distortion of the Si-glass occurs, and the temperature characteristic of the humidity sensor deteriorates, resulting in poor reliability.

  Further, in the conventional structure in which the sensor chip substrate and the IC substrate are electrically connected by wire bonding, the protective resin must be thickened to protect the wire bonding portion, and it has been difficult to reduce the package height. For this reason, there has been a demand for facilitating external mounting of the humidity sensor package, but a humidity sensor package that is small and low in profile and can be externally mounted has not been realized.

  An object of the present invention is to provide a humidity sensor package that can reliably seal other than the humidity sensor based on the above problem awareness, and that can achieve high reliability and low profile, and a method for manufacturing the same.

  In the present invention, the humidity sensor forming surface on which the humidity sensor of the sensor chip substrate is formed is provided higher than the plurality of electrode pads electrically connected to the humidity sensor, and the sealing resin covering the sensor chip substrate and the IC substrate is provided with this humidity If it is provided up to the same height as the sensor formation surface, the height can be reduced even if the sensor chip substrate, IC substrate and its electrical wiring part are covered with the sealing resin, and only the humidity sensor can be exposed to the package surface. It was completed with attention.

  That is, the present invention relates to a humidity sensor package in which a sensor chip substrate on which a humidity sensor is formed and an IC substrate that detects an output change of the humidity sensor are bonded and fixed to the same support substrate, and the humidity sensor is exposed. In this state, the sensor chip substrate and the IC substrate are covered with a sealing resin, and the surface of the sealing resin and the humidity sensor forming surface of the sensor chip substrate are at the same height.

  The support substrate is preferably provided with an SMD terminal for connecting the IC substrate to an external circuit on the surface opposite to the surface covered with the sealing resin. According to this aspect, a humidity sensor package capable of supporting SMD is obtained.

  Specific modes for setting the sealing resin surface and the humidity sensor forming surface of the sensor chip substrate to the same height include the following first to fourth modes.

  In the first aspect, on the surface of the sensor chip substrate, there are provided a high plane portion and a low plane portion having different surface heights, and an inclined surface portion connecting between the high and low plane portions, and the humidity is provided on the high plane portion. A sensor is formed, a plurality of electrode pads are formed on the low plane portion, and an electrode wiring for electrically connecting the humidity sensor and the plurality of electrode pads is formed along the inclined surface portion. According to this aspect, when the electrode pad of the sensor chip substrate and the electrode pad of the IC substrate are connected by wire bonding, the space for wire bonding and the wire bonding are determined by the difference in surface height between the high plane portion and the low plane portion. A space for sealing the portion can be secured and the height can be reduced.

  When the sensor chip substrate and the IC substrate are electrically connected by wire bonding, the sensor chip substrate and the electrode pad of the IC substrate are connected by a conductive wire, and the humidity sensor is formed on the sensor chip substrate. It is practical to provide it lower than the surface.

  In the second aspect, the sensor chip substrate has the humidity sensor and a plurality of electrode pads that are electrically connected to the humidity sensor formed on one and the other of the electrically conductive front and back surfaces. Respectively form a plurality of electrode wirings electrically connected to the IC substrate at positions facing the plurality of electrode pads of the sensor chip substrate bonded and fixed. According to this aspect, since the sensor chip substrate and the support substrate are electrically connected at the bonding surface, and the support substrate and the IC substrate are electrically connected, the sensor chip substrate and the IC substrate are directly connected by wire bonding. The space in the substrate thickness direction can be omitted as compared with the case, and the height can be reduced.

  The plurality of electrode pads of the sensor chip substrate are preferably provided in a recess formed by cutting the sensor chip substrate to a predetermined depth. According to this aspect, a space corresponding to the thickness of the electrode pad can be omitted, which can contribute to a reduction in height.

  When connecting an IC substrate and a support substrate by wire bonding, a plurality of wiring conductors of the IC substrate and the support substrate are connected by a conductive wire, and the conductive wire is connected to a humidity sensor forming surface of the sensor chip substrate. It is practical to provide a low level.

  In the third aspect, a plurality of electrode pads of the sensor chip substrate are formed on a side surface of the sensor chip, and the plurality of electrode pads and one end of the electrode wiring provided on the support substrate are connected in a positional relationship orthogonal to each other, The other end of the electrode wiring provided on the support substrate is electrically connected to the plurality of electrode pads of the IC substrate. According to this aspect, since the plurality of electrode pads of the sensor chip substrate and the wiring conductor of the support substrate are directly connected, space saving can be achieved as compared with the case of connecting by wire bonding. When the other end of the electrode wiring of the support substrate and the plurality of electrode pads of the IC substrate are connected by a conductive wire, the conductive wire is provided lower than the surface on which the humidity sensor is formed.

  In a fourth aspect, a plurality of electrode pads of the sensor chip substrate are formed on a side surface of the substrate, and the plurality of electrode pads and the plurality of electrode pads of the IC substrate are connected in a positional relationship orthogonal to each other. According to this aspect, since the plurality of electrode pads of the sensor chip substrate and the plurality of electrode pads of the IC substrate are directly connected, space saving can be achieved as compared with the case of connecting by wire bonding.

  According to the first aspect of the manufacturing method of the present invention, the humidity sensor has a plurality of electrode pads electrically connected to the humidity sensor, and the humidity sensor forming surface is provided higher than the electrode pad forming surface. A plurality of sensor chip substrates, a plurality of sensor chip substrates and a plurality of IC chip corresponding to each sensor chip substrate are bonded and fixed on a single support substrate, and a plurality of sensor chip substrates in pairs A step of electrically connecting the electrode pads and a plurality of electrode pads of the IC substrate; and pressing the mold against the humidity sensor forming surface of the sensor chip substrate to thereby form the mold, the sensor chip substrate, the IC substrate, and the support A step of filling a cavity formed between the substrates with a sealing resin, and removing the mold after the sealing resin is cured; and the supporting substrate is a package comprising a pair of sensor chip substrates and an IC substrate. It is characterized by a step of cutting with di units.

  When the plurality of electrode pads of the sensor chip substrate and the plurality of electrode pads of the IC substrate are connected by a conductive wire, the conductive wire is preferably provided lower than the humidity sensor forming surface of the sensor chip substrate. .

  The sensor chip substrate includes a step of forming the humidity sensor and a plurality of electrode wirings electrically connected to the humidity sensor on an insulating film covering the substrate surface, and a first non-moisture permeable protection covering the humidity sensor. Forming a film; and removing the first moisture-impermeable protective film and a part of the substrate at a position where the humidity sensor is not formed to form an electrode pad forming surface lower than the humidity sensor forming surface A step of forming an insulating film covering the electrode pad formation surface, removing the first moisture-impermeable protective film located on the end portions of the plurality of electrode wirings, and removing the plurality of electrodes at a removed portion. A step of forming a contact hole exposing each end of the wiring, and a lead connected to the plurality of electrode wirings through the contact hole and extended from the contact hole to the insulating film on the electrode pad formation surface A step of forming an electrode wiring, a step of forming a second non-moisture permeable protective film covering the extraction electrode wiring and the first non-moisture permeable protective film, and the second non-moisture protective film on the electrode pad forming surface. Forming a plurality of electrode pads by removing the moisture-permeable protective film and exposing the end portions of the extraction electrode wiring to the removed portions.

  According to another aspect, the sensor chip substrate includes a step of forming, on the substrate surface, a high plane portion having a different surface height, a low plane portion, and an inclined plane portion connecting the height plane portion, Forming an insulating film on the substrate surface including the flat surface portion, the low flat surface portion, and the inclined surface portion; and forming the humidity sensor on the insulating film so as to be positioned on the high flat surface portion; A step of forming an electrode wiring connected to the lower plane portion along the inclined surface portion, a step of forming a non-moisture permeable protective film covering the humidity sensor, and the lower plane portion. Forming a plurality of electrode pads by removing the non-moisture permeable protective film on the portion and exposing the end portion of the electrode wiring to the removed portion.

  According to the second aspect of the manufacturing method of the present invention, the step of forming a plurality of sensor chip substrates in which a humidity sensor provided on one and the other of the front and back surfaces and a plurality of electrode pads are electrically connected, A step of preparing a single support substrate on which a plurality of electrode wirings corresponding to a plurality of electrode pads of the sensor chip substrate are formed; and bonding and fixing the plurality of sensor chip substrates on the single support substrate; Electrically connecting one end portions of the plurality of electrode wirings of the support substrate corresponding to the plurality of electrode pads of the chip substrate, and bonding and fixing a number of IC substrates corresponding to the sensor chip substrates on the support substrate; Electrically connecting the plurality of electrode pads of the IC substrate and the other end of the plurality of electrode wirings of the support substrate; and pressing the mold against the humidity sensor forming surface of the sensor chip substrate And the Sen A step of filling a cavity formed between the chip substrate, the IC substrate and the support substrate with a sealing resin, and removing the mold after the resin is cured; and the support substrate is a package comprising a pair of sensor chip substrate and IC substrate And a step of cutting in units.

  When the plurality of electrode pads of the IC substrate and the other end portions of the plurality of wiring conductors of the support substrate are connected by a conductive wire, the conductive wire is provided lower than the humidity sensor forming surface of the sensor chip substrate. It is preferable.

  The sensor chip substrate is a silicon substrate in which the front and back surfaces are electrically connected. Specifically, an insulator for defining a humidity sensor forming area is embedded in one of the front and back surfaces of the silicon substrate. A step of forming and embedding an insulator for defining a plurality of electrode pad formation areas overlapped with the humidity sensor formation area in the substrate thickness direction on the other of the front and back surfaces of the silicon substrate; Forming a humidity sensor in the humidity sensor forming area, and forming a plurality of electrode pads in the plurality of electrode pad forming areas through the silicon substrate to be electrically connected to the humidity sensor. Can do. Alternatively, a step of embedding an insulator on one of the front and back surfaces of the silicon substrate, excluding a wiring connection area that ensures electrical continuity of the front and back surfaces, and a substrate thickness on the other of the front and back surfaces of the silicon substrate Forming a recess having a predetermined depth at a position overlapping the wiring connection area in the vertical direction, and forming a plurality of electrode pads in the recess; and the wiring connection area on one of the front and back surfaces of the silicon substrate Forming a humidity sensor, and forming an opening for electrically separating a plurality of electrode pads on the other of the front and back surfaces of the silicon substrate at a depth that exposes the insulator. And the process of performing. According to this aspect, the sensor chip substrate itself can be used as the wiring, and insulation between the wirings can be ensured by an insulator such as glass embedded in the front and back surfaces of the substrate. Moreover, if a plurality of electrode pads are provided in the recesses on the back surface of the substrate, a space corresponding to the pad thickness can be omitted, which can contribute to a reduction in height.

  According to a third aspect of the manufacturing method of the present invention, the step of forming a plurality of sensor chip substrates in which a plurality of electrode pads electrically connected to the humidity sensor formed on the substrate surface is disposed on the side surface of the substrate, A step of preparing a support substrate on which a plurality of electrode wirings corresponding to a plurality of electrode pads of the sensor chip substrate are formed; and the plurality of sensor chip substrates are bonded and fixed on the support substrate, and the plurality of electrodes of the sensor chip substrate Electrically connecting one end portions of the plurality of electrode wirings of the support substrate corresponding to the pads in a mutually orthogonal positional relationship, and bonding and fixing a number of IC substrates corresponding to each sensor chip substrate on the support substrate; Electrically connecting the plurality of electrode pads of the IC substrate to the other end of the plurality of electrode wirings of the support substrate, and pressing a mold against the humidity sensor forming surface of the sensor chip substrate A step of filling a cavity formed between the mold and the sensor chip substrate, the IC substrate and the support substrate with a sealing resin, and removing the mold after the resin is cured; and the support substrate is a pair of sensor chip substrates. And a step of cutting in package units made of an IC substrate.

  When connecting the plurality of electrode pads of the IC substrate and the other end of the plurality of electrode wirings of the support substrate with a conductive wire, the conductive wire is provided lower than the humidity sensor forming surface of the sensor chip substrate. Is preferred.

  According to a fourth aspect of the manufacturing method of the present invention, a process for forming a plurality of sensor chip substrates in which a plurality of electrode pads electrically connected to a humidity sensor formed on the substrate surface are arranged on the side surface of the substrate, A plurality of sensor chip substrates and an IC substrate corresponding to each sensor chip are placed in close contact with each other in a positional relationship in which the electrode pads are orthogonal to each other, and bonded and fixed; Electrically connecting the sensor chip substrate and the plurality of electrode pads of the IC substrate facing each other in a positional relationship, and pressing the mold against the humidity sensor forming surface of the sensor chip substrate, A step of filling a cavity formed between the sensor chip substrate, the IC substrate and the support substrate with a sealing resin and removing the mold after the resin is cured; It is characterized by comprising a step of cutting a package unit consisting flop substrate and the IC substrate.

  In the first to fourth aspects of the manufacturing method, the support substrate is provided with an SMD terminal for connecting the IC substrate to an external circuit on a surface opposite to the surface covered with the sealing resin. It is preferable to form.

  According to the present invention, the humidity sensor forming surface on which the humidity sensor of the sensor chip substrate is formed is located higher than the electrode pad forming surface, and the sealing resin is provided up to the same height as the humidity sensor forming surface. Only the sensor is exposed on the surface of the package, and a space in the package height direction for sealing the electric wiring portions of the sensor chip substrate and the IC substrate is omitted, and the height can be reduced. At the same time, since the sensor chip substrate, the IC substrate, and the electric wiring portion thereof are embedded with the sealing resin, the sensor chip substrate, the IC substrate, and the electric wiring portion are resistant to corrosion and impact, and reliability is improved.

1 is an external perspective view of a humidity sensor package according to a first embodiment of the present invention. It is sectional drawing which shows the structure of the humidity sensor package typically. It is a top view which shows the structure of a humidity sensor. It is sectional drawing which shows the moisture sensitive part of a humidity sensor. It is sectional drawing which shows the fixing | fixed part of a humidity sensor. It is sectional drawing which follows the AA line of FIG. It is sectional drawing explaining the sealing process of a humidity sensor package. It is a top view explaining 1 process of the manufacturing process of the sensor chip board | substrate by a 1st aspect. It is sectional drawing which shows the process of FIG. 8 in the cross section (cross section which follows the AA line of FIG. 3) concerning a lower electrode wiring from a moisture sensitive part. FIG. 10 is a cross-sectional view showing the next step of FIG. 9. It is sectional drawing which shows the next process of FIG. FIG. 12 is a cross-sectional view showing a next step of FIG. 11. It is sectional drawing which shows the next process of FIG. It is sectional drawing which shows the next process of FIG. It is sectional drawing which shows the next process of FIG. FIG. 16 is a cross-sectional view showing a next step of FIG. 15. It is sectional drawing which shows 1 process of the manufacturing process of the sensor chip board | substrate by a 2nd aspect in the cross section (cross section which follows the BB line of FIG. 3) concerning an upper electrode wiring from a moisture sensitive part. FIG. 18 is a cross-sectional view showing a next step of FIG. 17. It is sectional drawing which shows the next process of FIG. FIG. 20 is a cross-sectional view showing the next step of FIG. 19. It is sectional drawing which shows the next process of FIG. FIG. 22 is a cross-sectional view showing a next step of FIG. 21. FIG. 23 is a cross-sectional view showing a next process of FIG. 22. FIG. 24 is a cross-sectional view showing the next step of FIG. 23. FIG. 25 is a cross-sectional view showing a next step of FIG. 24. FIG. 26 is a cross-sectional view showing the next step of FIG. 25. It is an external appearance perspective view of the humidity sensor package by 2nd Embodiment of this invention. It is sectional drawing which shows the structure of the humidity sensor package typically. It is sectional drawing which shows 1 process of the manufacturing process of the sensor chip board | substrate of 2nd Embodiment. FIG. 30 is a plan view showing a step of FIG. 29. FIG. 30 is a cross-sectional view showing a next process of FIG. 29. FIG. 32 is a cross-sectional view showing a next step of FIG. 31. FIG. 33 is a cross-sectional view showing the next step of FIG. 32. It is a top view which shows the process of FIG. FIG. 34 is a cross-sectional view showing the next step of FIG. 33. FIG. 36 is a plan view showing a step of FIG. 35. FIG. 36 is a cross-sectional view showing the next step of FIG. 35. It is a top view which shows the process of FIG. FIG. 38 is a cross-sectional view showing a next process of FIG. 37. FIG. 40 is a cross-sectional view showing a next process of FIG. 39. It is sectional drawing which shows 1 process of the manufacturing process of the sensor chip board | substrate of 2nd Embodiment by another aspect. FIG. 42 is a cross-sectional view showing a next process of FIG. 41. FIG. 43 is a cross-sectional view showing the next step of FIG. 42. FIG. 44 is a cross-sectional view showing the next step of FIG. 43. FIG. 45 is a cross-sectional view showing the next process of FIG. 44. FIG. 46 is a cross-sectional view showing the next step of FIG. 45. It is a top view which shows the process of FIG. It is an external appearance perspective view which shows the state before the humidity sensor package sealing by 3rd Embodiment of this invention. It is a top view which shows the state before sealing of the same humidity sensor package seeing from the top. It is a side view which shows the state before sealing of the humidity sensor package seen from the side. It is an external appearance perspective view which shows the state before sealing of the humidity sensor package by 4th Embodiment of this invention. It is a top view which shows the state before sealing of the same humidity sensor package seeing from the top. It is a side view which shows the state before sealing of the humidity sensor package seen from the side.

  1 to 26 show a first embodiment of the present invention. FIG. 1 is an external perspective view showing the humidity sensor package 1 according to the first embodiment, and FIG. 2 is a cross-sectional view schematically showing the main configuration of the humidity sensor package 1.

  The humidity sensor package 1 has a sensor chip substrate 20 and an IC substrate 50 that are bonded and fixed to the surface 10a of the support substrate 10, and the humidity sensor 21 (the polymer moisture sensitive film 25 of the moisture sensitive portion 22) of the sensor chip substrate 20 is provided. Except for this, the entire surface 1 a is covered with the sealing resin 60. A plurality of SMD (Surface Mount Device) terminals 11 that can be externally mounted are provided on the bottom surface of the humidity sensor package 1 (the back surface 10b of the support substrate 10).

  The sensor chip substrate 20 is made of, for example, a silicon substrate having an insulating film 20b on the surface of the Si layer 20a. On the surface of the sensor chip substrate 20, a high flat surface portion 20c and a low flat surface portion 20e having different surface heights, and an inclined surface portion 20d that smoothly connects the high and low flat surface portions 20c and 20e are formed. Specifically, the difference in surface height between the high flat surface portion 20c and the low flat surface portion 20e is about 100 to 300 μm.

  A capacitance-type humidity sensor using a polymer moisture-sensitive material whose dielectric constant is changed according to the amount of absorbed or released water, as a dielectric, on the substrate surface of the sensor chip substrate 20. 21 is formed. The humidity sensor 21 includes a humidity sensing unit 22 whose capacitance changes depending on humidity, and a fixed unit 23 that holds a constant capacitance regardless of humidity.

  FIG. 3 is a plan view showing the configuration of the humidity sensor 21. 4 is a cross-sectional view showing the moisture sensitive portion 22 (cross-sectional view taken along line BB in FIG. 3), and FIG. 5 is a cross-sectional view showing the fixed portion 23 (cross-sectional view taken along line CC in FIG. 3). 6 is a cross-sectional view taken along the line AA of FIG. In FIG. 3, the non-moisture permeable protective film 28 is not shown.

As shown in FIG. 3, the moisture sensitive portion 22 and the fixed portion 23 are in a mirror-inverted relationship with respect to the virtual center line X assumed at an intermediate position between the moisture sensitive portion 22 and the fixed portion 23, and have the same electrode material and dielectric material. Are formed by the same process using the lower electrode film 24, the polymer moisture sensitive film 25, and the upper electrode film 26 to form substantially the same parallel plate structure. More specifically, the lower electrode film 24 has a flat rectangular shape and is formed on each of the moisture sensitive portion 22 and the fixing portion 23, and the polymer moisture sensitive film 25 has a flat rectangular shape slightly larger than the lower electrode film 24 and has a moisture sensitive portion. 22 and the lower electrode film 24 of the fixing part 23, respectively, and the upper electrode film 26 has a planar rectangular shape equivalent to the lower electrode film 24 and is respectively formed on the moisture-sensitive part 22 and the polymer moisture-sensitive film 25 of the fixing part 23. Is formed. The film thickness of the polymer moisture sensitive film 25 is equal to the distance d between the lower electrode film 24 and the upper electrode film 26, and the capacitance C accumulated between the lower electrode film 24 and the upper electrode film 26 is the polymer moisture sensitive film. It is determined by the dielectric constant ε of the film 25, the distance d between the lower electrode film 24 and the upper electrode film 26, and the facing area S (C = εS / d). The upper electrode film 26A of the moisture sensitive part 22 is provided with many openings 27 for exposing the polymer moisture sensitive film 25, but the upper electrode film 26B of the fixed part 23 is not provided with any openings. The large number of openings 27 are arranged in a region facing the lower electrode film 24 at predetermined intervals in the left-right and up-down directions, and have a planar rectangular shape. The number, the planar shape, and the formation position of the openings 27 are arbitrary. The upper electrode film 26 of the moisture sensitive part 22 and the fixing part 23 is covered with a non-moisture permeable protective film 28 that blocks moisture exchange with the outside air. The lower electrode film 24 and the upper electrode film 26 are made of an electrode material such as Al, Ta, Ti, NiFe, Ni, etc., the polymer moisture sensitive film 25 is made of polyimide, for example, and the moisture-impermeable protective film 28 is made of, for example, a silicon nitride film. (SiNx film), SiO ₂ film, Al ₂ O ₃ / SiO ₂ laminated film, SiO ₂ / SiN laminated film, or the like.

  In the moisture sensitive portion 22, the polymer moisture sensitive film 25 is exposed to the atmosphere from a large number of openings 27 provided in the upper electrode film 26, and the polymer moisture sensitive film 25 is exposed according to the humidity (water content) in the atmosphere. The amount of moisture absorbed or released is increased or decreased to change the dielectric constant ε, and the capacitance (sensor capacitance) C20 between the lower electrode film 24 and the upper electrode film 26 is changed. On the other hand, in the fixing portion 23, the polymer moisture-sensitive film 25 is covered with the moisture-impermeable protective film 28 and the upper electrode film 26 and is not exposed to the atmosphere. Therefore, even if the humidity (water content) in the atmosphere changes, The amount of water in the molecular moisture sensitive film 25 does not change, and the dielectric constant ε does not change. As a result, a constant capacitance (fixed capacitance) C30 is held between the lower electrode film 24 and the upper electrode film 26.

  Further, on the substrate surface of the sensor chip substrate 20, a lower electrode wiring 34 and an upper electrode wiring 36 that are electrically connected to the lower electrode film 24 and the upper electrode film 26 of the humidity sensor 21 from the high flat surface portion 20c to the low flat surface portion 20e. Is formed along the inclined surface portion 20d, and a plurality of electrode pads 35 are formed on the low flat surface portion 20e. The lower electrode wiring 34 is provided in common to the lower electrode film 24 of the moisture sensitive portion 22 and the fixed portion 23, and one end thereof branches at an intermediate position (virtual center line X) between the moisture sensitive portion 22 and the fixed portion 23. Thus, each lower electrode film 24 is connected, and the other end side is connected to the electrode pad 35. The upper electrode wiring 36 is individually provided on the upper electrode film 26 of the moisture sensitive portion 22 and the fixing portion 23, and is connected to the upper electrode film 26 on one end side and connected to the electrode pad 35 on the other end side. ing. The lower electrode wiring 34, the upper electrode wiring 36, and the plurality of electrode pads 35 are made of an electrode material such as Al, Ta, Ti, NiFe, Ni, Au, or a laminated film thereof. The lower electrode wiring 34 and the upper electrode wiring 36 are covered with a moisture-impermeable protective film 28, and one end portion located on the high plane portion 20c is not covered with the sealing resin 60. The film 28 protects against corrosion and impact.

  In the sensor chip substrate 20, the humidity sensor forming surface is the high flat surface portion 20c, and the electrode pad forming surface is the low flat surface portion 20e.

  On the other hand, the IC substrate 50 is a control circuit substrate that has a plurality of electrode pads 55 corresponding to the plurality of electrode pads 35 of the sensor chip substrate 20 and detects an output change of the humidity sensor 21. More specifically, it has a function of converting a difference ΔC (= C20−C30) between the sensor capacitance C20 of the humidity sensor 21 and the fixed capacitance C30 into a voltage and outputting the voltage to an external circuit. As shown in FIG. 2, the IC substrate 50 is configured to be thinner than the sensor chip substrate 20, and its electrode pad forming surface (surface) 50 a is the electrode pad forming surface (low flat surface portion 20 e) of the sensor chip substrate 20. Is lower than.

  The plurality of electrode pads 35 of the sensor chip substrate 20 and the plurality of electrode pads 55 of the IC substrate 50 are electrically connected via conductive wires 51 made of, for example, Au. The surface height of the conductive wire 51 is lower than the humidity sensor forming surface (the high flat surface portion 20 c) of the sensor chip substrate 20.

  In addition to the plurality of electrode pads 55 for the sensor chip substrate, the IC substrate 50 is provided with electrode pads 56 for external connection. The electrode pad 56 is electrically connected to a contact conductor 10c provided on the surface 10a of the support substrate 10 by a conductive wire 52 made of, for example, Au. The surface height of the conductive wire 52 is also lower than the humidity sensor forming surface (high flat surface portion 20 c) of the sensor chip substrate 20. The contact conductor 10c is conductively connected to the SMD terminal 11 on the back surface 10b through a through-hole conductor 10d that penetrates the front and back surfaces 10a and 10b of the support substrate 10. An external circuit connected to the IC substrate 50 via the SMD terminal 11 can detect humidity change (relative humidity) from the output of the humidity sensor 21 (voltage corresponding to the capacity difference ΔC).

  The humidity sensor package 1 having the above configuration is manufactured as follows.

  First, as shown in FIG. 2, a large number of sensor chip substrates 20 and a large number of IC substrates 50 are bonded and fixed to the surface 10 a of a single support substrate 10.

  Next, as shown in FIG. 2, the plurality of electrode pads 35 of the corresponding sensor chip substrate 20 and the plurality of electrode pads 55 of the IC substrate 50 are electrically connected by the conductive wires 51, and further, the IC substrate 50 The electrode pads 56 for external connection and the contact conductors 10c of the support substrate 10 are electrically connected by the conductive wires 52. Here, the difference in surface height between the humidity sensor forming surface and the electrode pad forming surface is about 100 to 300 μm, and the difference in surface height between the humidity sensor forming surface and the electrode pad forming surface of the IC substrate 50 is about 50 to 200 μm. Therefore, the surface height of the conductive wires 51 and 52 is lower than the humidity sensor forming surface (the high flat surface portion 20 c) of the sensor chip substrate 20.

  Subsequently, as shown in FIG. 7, the mold 61 and the sensor chip substrate 20 (the inclined surface portion 20d, the low surface portion 20d) are placed in a state where the mold 61 is brought into contact with the humidity sensor forming surface (the high flat surface portion 20c) of the sensor chip substrate 20. The sealing resin 60 is filled in the cavity 62 formed between the flat portion 20e), the IC substrate 50 and the support substrate 10, and the mold 61 is removed when the sealing resin 60 is cured. FIG. 7 is a cross-sectional view (corresponding to FIG. 2) schematically illustrating the sealing process of the humidity sensor package. Since the mold 61 is pressed against the humidity sensor forming surface (high flat surface portion 20c) of the sensor chip substrate 20, the surface of the sealing resin 50 and the humidity sensor forming surface (high flat surface portion 20c) of the sensor chip substrate 20 are the same. It becomes the height position. By this process, a large number of sensor chip substrates 20 and IC substrates 50 can be collectively sealed on a single support substrate 10, and the sealing process becomes easy. The sensor chip substrate 20 and the IC substrate 50 are completely embedded in the sealing resin 60 except for one end of the humidity sensor 21 and the upper and lower electrode wirings 34 and 36 located on the humidity sensor forming surface. The included electrical wiring portion and the IC substrate 50 are resistant to corrosion and impact, and the reliability is improved. For the sealing resin 60, for example, an epoxy resin or an epoxy resin mixed with a filler is used.

  Then, the support substrate 10 is cut in a package unit including one sensor chip substrate 20 and one IC substrate 50. In each divided package, an SMD terminal 11 is formed on the back surface 10b of the support substrate 10 so as to be conductively connected to the contact conductor 10c through the through-hole conductor 10d. The IC substrate 50 can be connected to an external circuit via the SMD terminal 11.

  As described above, many humidity sensor packages 1 shown in FIGS. 1 and 2 are obtained.

  Next, the manufacturing process of the sensor chip substrate 20 will be described in detail with reference to FIGS. 3 to 6 and FIGS. FIG. 8 is a plan view showing one process of the sensor chip substrate 20, and FIGS. 9 to 16 and FIG. 6 show the manufacturing process of the sensor chip board 20 in a cross section taken along the line AA of FIG.

First, an insulating film 20b1 made of SiO ₂ surface of the Si layer 20a of the sensor chip substrate 20 by thermal oxidation.

  Next, as shown in FIGS. 8 and 9, the lower electrode film 24 and the first-layer lower electrode wiring 34 a are simultaneously formed on the insulating film 20 b 1 of the sensor chip substrate 20. The lower electrode film 24 is formed in, for example, a planar rectangular shape that is mirror-inverted with respect to the virtual center line X assumed at an intermediate position between the moisture-sensitive portion to be formed and the fixed portion. The lower electrode wiring 34a of the first layer is common to the lower electrode film 24 of the moisture sensitive portion and the fixed portion, and branches at an intermediate position (virtual center line X) between the moisture sensitive portion and the fixed portion to be formed. Are connected to the lower electrode film 24 of the fixed part. For the lower electrode film 24 and the lower electrode wiring 34a, for example, an electrode material such as Al, Ta, Ti, NiFe, or Ni is used.

  Next, as shown in FIG. 10, a polymer moisture-sensitive film 25 made of polyimide, for example, having a planar rectangular shape slightly larger than, for example, the lower electrode film 24 mirror-inverted with respect to the virtual center line X on the lower electrode film 24. Form.

  Subsequently, as shown in FIG. 10, the upper electrode film 26 is formed on the polymer moisture sensitive film 25 in a plane rectangular shape substantially equivalent to the lower electrode film 24 that is mirror-inverted with respect to the virtual center line X, for example. To do. Here, the upper electrode film 26A having a large number of openings 27 is formed on the moisture sensitive part side, and the solid film-like upper electrode film 26B having no openings is formed on the fixed part side. For the upper electrode film 26, for example, an electrode material such as Al, Ta, Ti, NiFe, or Ni is used.

Subsequently, as shown in FIG. 10, the humidity sensor structure (the lower electrode film 24, the polymer moisture sensitive film 25, the upper electrode film 26, the lower electrode wiring 34a, and the upper electrode wiring 36a) on the insulating film 20b1 is formed. A first non-moisture permeable protective film 28a is formed. At this time, the first non-moisture permeable protective film 28a is formed with a film thickness that completely fills the opening 27 provided in the upper electrode film 26A on the moisture sensitive part side. A SiO ₂ film is used for the first moisture-impermeable protective film 28a.

  Subsequently, as shown in FIG. 11, the insulating film 20b1 in the area where the humidity sensor structure portion is not formed is removed by reactive ion etching (RIE), and the Si layer 20a of the sensor chip substrate 20 is removed in the removed portion. Expose.

  Subsequently, as shown in FIG. 12, a part of the Si layer 20a of the sensor chip substrate 20 exposed from the insulating film 20b1 is removed by wet etching. By this step, the substrate surface of the sensor chip substrate 20 is raised and lowered, and a low flat surface portion 20e (electrode pad formation area) lower than the substrate surface on which the humidity sensor structure portion is formed is formed. The surface of the substrate on which the humidity sensor structure is formed becomes a high flat surface portion 20c (humidity sensor forming surface), and the two flat surface portions 20c and 20e are smoothly and continuously inclined between the high flat surface portion 20c and the low flat surface portion 20e. The surface portion 20d is located.

  Subsequently, as shown in FIG. 13, an insulating film 20b2 made of SiN is formed in a region where the Si layer 20a of the sensor chip substrate 20 is exposed.

  Subsequently, as shown in FIG. 14, the lower electrode wiring 34a located on the high plane portion 20c and the first moisture-impermeable protective film 28a on one end of the upper electrode film 26 are partially removed, and the lower electrode wiring is removed. A contact hole 37 is formed to expose 34a and the upper electrode film 26 (see FIGS. 4 and 5 because they are not shown in FIG. 14).

  Subsequently, as shown in FIG. 15, the second layer lower electrode wiring 34b connected to the first layer lower electrode wiring 34a exposed in the contact hole 37 and extended from the contact hole 37 to the low flat surface portion 20e is formed. It is formed along the inclined surface portion 20d. At the same time, an upper electrode wiring 36 connected to the upper electrode film 26 exposed in the contact hole 37 and extending from the contact hole 37 to the low flat surface portion 20e is formed along the inclined surface portion 20d. The lower electrode wiring 34b and the upper electrode wiring 36 of the second layer are made of an electrode material such as Al, Ta, Ti, NiFe, Ni, Au, or a laminated film thereof. The lower electrode wirings 34 a and 34 b of the first layer and the second layer connected through the contact hole 37 become the lower electrode wiring 34.

  Subsequently, as shown in FIG. 16, a second moisture-impermeable protective film 28b covering the first moisture-impermeable protective film 28a, the second-layer lower electrode wiring 34b, and the upper electrode wiring 36 is formed. The second moisture-impermeable protective film 28b is made of SiN. The moisture-impermeable protective film 28 is formed by a laminated structure of the second moisture-impermeable protective film 28b and the first moisture-impermeable protective film 28a.

  Subsequently, the first and second moisture-impermeable protective films 28a and 28b on the large number of openings 27 provided in the upper electrode film 26 on the moisture sensitive part side are removed by dry etching, and the low planar part 20e is removed. The second non-moisture permeable protective film 28b on the other end of the upper and lower electrode wirings 34, 36 positioned above is removed. The other end portions of the second electrode lower electrode wiring 34b and the upper electrode wiring 36 exposed at the removed portion of the second moisture-impermeable protective film 28b serve as electrode pads 35, respectively.

  Through the above steps, the sensor chip substrate 20 shown in FIGS. 3 to 6 is obtained.

  Next, with reference to FIGS. 17 to 26, the manufacturing process of the sensor chip substrate 20, which is different from the above manufacturing process (FIGS. 8 to 16), will be described in detail. A plan view of the completed sensor chip substrate 20 formed in this manufacturing process is the same as FIG. FIGS. 17-24 has shown the manufacturing process of the sensor chip board | substrate 20 in the cross section which follows the BB line of FIG. 25 and 26 show the sensor chip substrate 20 in a completed state in a cross section taken along line CC in FIG. 3 and a cross section taken along line AA in FIG.

First, an insulating film 20b1 made of SiO ₂ surface of the Si layer 20a of the sensor chip substrate 20 by thermal oxidation.

  Next, as shown in FIG. 17, the insulating film 20b1 in the area (electrode pad forming area) where the humidity sensor structure is not formed is removed by reactive ion etching (RIE), and the Si of the sensor chip substrate 20 is removed in the removed portion. Layer 20a is exposed.

  Subsequently, as shown in FIG. 18, a part of the Si layer 20a of the sensor chip substrate 20 exposed from the insulating film 20b1 is removed by wet etching. By this step, the height of the substrate surface of the sensor chip substrate 20 is increased, and a lower flat portion 20e (electrode pad formation area) lower than the substrate surface covered with the insulating film 20b1 is formed. The substrate surface covered with the insulating film 20b1 becomes the high flat surface portion 20c (humidity sensor forming surface), and the two flat surface portions 20c and 20e are smoothly inclined between the high flat surface portion 20c and the low flat surface portion 20e. The surface portion 20d is located.

  Subsequently, as shown in FIG. 19, an insulating film 20b2 made of SiN is formed in a region where the Si layer 20a of the sensor chip substrate 20 is exposed.

  Subsequently, as shown in FIG. 20, the lower electrode film 24 is formed on the high flat surface portion 20c covered with the insulating film 20b1, and at the same time, the lower electrode wiring 34 and the upper electrode wiring 36 are formed. Here, the lower electrode film 24 is formed in, for example, a planar rectangular shape that is mirror-reversed with respect to the virtual center line X assumed at the intermediate position between the moisture-sensitive portion to be formed and the fixed portion. In FIG. 20, the lower electrode wiring 34 (not shown) is branched at the high plane portion 20c at one end side by a virtual center line X and is connected to the lower electrode film 24 of the moisture sensitive portion and the fixed portion. It forms along the inclined surface part 20d over the flat part 20e (refer FIG. 26). The upper electrode wiring 36 is formed along the inclined surface portion 20d from the end portion of the upper electrode film to be formed in a later process and the high flat surface portion 20c to the low flat surface portion 20e. For the lower electrode film 24, the lower electrode wiring 34, and the upper electrode wiring 36, for example, an electrode material such as Al, Ta, Ti, NiFe, or Ni is used.

  Subsequently, as shown in FIG. 21, a polymer moisture-sensitive film 25 made of polyimide, for example, having a planar rectangular shape slightly larger than, for example, the lower electrode film 24 mirror-inverted with respect to the virtual center line X on the lower electrode film 24. Form.

  Subsequently, as shown in FIG. 22, the upper electrode film 26 is formed on the polymer moisture sensitive film 25 in a planar rectangular shape that is substantially equivalent to the lower electrode film 24 that is mirror-reversed with respect to the virtual center line X, for example. . The end of the upper electrode film 26 is connected to the upper electrode wiring 36 formed simultaneously with the lower electrode film 24. Here, the upper electrode film 26A having a large number of openings 27 is formed on the moisture sensitive part side, and the solid film-like upper electrode film 26B having no openings is formed on the fixed part side. For the upper electrode film 26, for example, an electrode material such as Al, Ta, Ti, NiFe, or Ni is used.

  Subsequently, as shown in FIG. 23, a moisture-impermeable protective film that covers the humidity sensor structure (the lower electrode film 24, the polymer moisture sensitive film 25, the upper electrode film 26), the lower electrode wiring 34, and the upper electrode wiring 36. 28 is formed. For example, SiN is used for the moisture-impermeable protective film 28.

  Then, as shown in FIG. 24, the moisture-impermeable protective film 28 on the large number of openings 27 provided in the upper electrode film 26 on the moisture sensitive part side is removed. At the same time, the non-moisture permeable protective film 28 on the end portion of the lower electrode wiring 34 and the upper electrode film 36 located on the low flat surface portion 20e is removed, and the lower electrode wiring 34 and the upper electrode film 36 exposed to the removed portion are removed. These end portions are referred to as electrode pads 35, respectively.

  Through the above steps, the sensor chip substrate 20 shown in FIGS. 3 and 24 to 26 is obtained.

  27 to 47 show a second embodiment of the present invention. FIG. 27 is an external perspective view showing the humidity sensor package 2 according to the second embodiment, and FIG. 28 is a cross-sectional view schematically showing the main configuration of the humidity sensor package 2.

  In the humidity sensor package 2 according to the second embodiment, the front and back surfaces 220f and 220g of the sensor chip substrate 220 are provided with a humidity sensor 21 and a plurality of electrode pads 235 electrically connected to the humidity sensor 21. This is electrically connected to a plurality of electrode pads 55 of the IC substrate 50 through electrode wirings 10e provided on the surface 10a of the support substrate 10.

  The sensor chip substrate 220 is a low-resistance silicon substrate whose resistivity is lowered by doping impurities such as boron and phosphorus, and the front and back surfaces 220f and 220g are electrically connected. Insulators 221a and 221b (FIGS. 30 and 33) are embedded in the front and back surfaces 220f and 220g of the sensor chip substrate 220, and a humidity sensor formation area and an electrode pad formation area defined by the insulators 221a and 221b. , The substrate itself is a wiring that electrically connects the lower electrode film 24 and the upper electrode film 26 of the humidity sensor 21 on the front surface 220f side and the plurality of electrode pads 235 on the back surface 220g side. In FIG. 28, the through-hole wiring 220h is schematically shown as the through-hole wiring 220h, but the through-hole wiring 220h is actually the sensor chip substrate 220 in the humidity sensor forming area and the electrode pad forming area.

  The support substrate 10 has the same configuration as that of the first embodiment except that the electrode wiring 10e corresponding to the plurality of electrode pads 235 of the sensor chip substrate 220 is provided on the surface 10a that is an adhesive fixing surface of the sensor chip substrate 220. 10 is the same.

  The electrode wiring 10e of the support substrate 10 is connected to a plurality of electrode pads 55 of the IC substrate 50 by conductive wires 51 made of, for example, Au. The conductive wire 51 has a surface height lower than the surface 220 f (humidity sensor forming surface) of the sensor chip substrate 220 and is embedded in the sealing resin 60.

  As in this embodiment, a plurality of electrode pads 235 that are conductively connected to the humidity sensor 21 provided on the front surface 220f of the sensor chip substrate 220 are arranged on the back surface 220g, and a plurality of IC substrates 50 are connected via the electrode wiring 210e of the support substrate 210. If the electrode pad 55 is electrically connected, the space in the package height direction can be omitted and the height can be reduced as compared with the case where the electrode pad provided on the substrate surface and the IC substrate are connected by wire bonding.

The humidity sensor package 2 is manufactured as follows.
First, a large number of sensor chip substrates 220 and a large number of IC substrates 50 are bonded and fixed to the surface 10a of a single support substrate 10 one by one. At this time, as shown in FIG. 28, the sensor chip substrate 220 is positioned and supported such that the plurality of electrode pads 235 provided on the back surface 220g thereof face one end of the electrode wiring 10e on the front surface 10a of the support substrate 10. A plurality of electrode pads 235 and the electrode wiring 10e are electrically connected to the substrate 10 by solder bonding or a conductive adhesive. On the other hand, the IC substrate 50 is positioned and bonded and fixed so as to be adjacent to the other end of the electrode wiring 10e on the surface 10a of the support substrate 10.

  Next, the other end of the electrode wiring 10e of the support substrate 10 and the plurality of electrode pads 55 of the IC substrate 50 are electrically connected by the conductive wire 51, and further, the electrode pads 56 for external connection of the IC substrate 50 The contact conductor 10 c of the support substrate 10 is electrically connected by the conductive wire 52. Here, the IC substrate 50 is made thinner than the sensor chip substrate 220, and the gap between the electrode pad forming surface (surface 50 a) of the IC substrate 50 and the humidity sensor forming surface (surface 220 f) of the sensor chip substrate 220 is 50 to 200 μm. Since there is a difference in surface height, the height of the conductive wires 51 and 52 is lower than the humidity sensor forming surface.

  Subsequently, in the same manner as the sealing process of the first embodiment shown in FIG. 7, the mold and the sensor chip substrate 220 are pressed with the mold pressed against the humidity sensor forming surface (surface 220 f) of the sensor chip substrate 220. The cavity formed between the IC substrate 50 and the support substrate 10 is filled with the sealing resin 60, and the mold is removed when the sealing resin 60 is cured. By this step, the surface of the sealing resin 60 and the humidity sensor forming surface of the sensor chip substrate 220 are at the same height position. In addition, a large number of sensor chip substrates 220 and IC substrates 50 can be collectively sealed on a single support substrate 10, and the sealing process is facilitated. The sensor chip substrate 220 and the IC substrate 50 are completely embedded in the sealing resin 60 except for one end of the humidity sensor 21 and the upper and lower electrode wirings 34 and 36 located on the humidity sensor forming surface. The included electrical wiring portion and the IC substrate 50 are resistant to corrosion and impact, and the reliability is improved. For the sealing resin 60, for example, an epoxy resin or an epoxy resin mixed with a filler is used.

  Then, the support substrate 10 is cut by a package unit including one sensor chip substrate 220 and one IC substrate 50. In each divided package, an SMD terminal 11 is formed on the back surface 10b of the support substrate 10 so as to be conductively connected to the contact conductor 10c through the through-hole conductor 10d. The IC substrate 50 can be connected to an external circuit via the SMD terminal 11.

  As described above, many humidity sensor packages 2 shown in FIGS. 27 and 28 are obtained.

  Next, a manufacturing process of the sensor chip substrate 220 will be described in detail with reference to FIGS. 29, FIG. 31 to FIG. 33, FIG. 35, FIG. 37, FIG. 39 and FIG. 40 are cross-sectional views showing the manufacturing process of the sensor chip substrate 220 along the line BB in FIG. 34, 36 and 38 are plan views showing the manufacturing process of the sensor chip substrate 220 as viewed from the front surface 220f side. The BB line in FIG. 38 corresponds to the BB line in FIG.

  In the present embodiment, for example, a low resistance silicon substrate having a resistivity of a predetermined value or less by doping impurities such as boron and phosphorus is used as the sensor chip substrate 220. The front and back surfaces of the sensor chip substrate 220 are electrically connected.

  First, as shown in FIG. 29, the surface of the sensor chip substrate 220 is shaved to a predetermined depth by dry etching, and an insulator 221a made of glass is embedded in the shaved portion. Then, surface polishing is performed until the silicon layer of the sensor chip substrate 220 and the embedded insulator 221a have the same height, thereby forming a flat surface 220f without macroscopic unevenness. A region of the surface 220f where the insulator 221a is not embedded serves as a humidity sensor formation area for forming a humidity sensor in a later process. As shown in FIG. 30, the humidity sensor formation area of the present embodiment includes a sensor area α1 that forms a parallel plate structure with a lower electrode film, a polymer moisture sensitive film, and an upper electrode film, and a moisture sensitive part and a fixed part. It is electrically independent of the upper electrode areas α2 and α3 that respectively locate the end portions of the upper electrode film.

  Next, as shown in FIG. 31, an opening 221c for exposing the insulator 221a is formed on the surface of the sensor chip substrate 220 opposite to the surface on which the insulator 221a is formed by reactive ion etching (RIE). Form. Then, as shown in FIG. 32, an insulator 221b made of glass is embedded in the opening 221c, and surface polishing is performed until the embedded insulator 221b and the silicon layer of the sensor chip substrate 220 have the same height. And a flat back surface 220 g having no macroscopic unevenness is formed. The region of the back surface 220g where the insulator 221b is not embedded serves as an electrode pad formation area for forming an electrode pad on the support substrate 210 side in a later step. The electrode pad formation area overlaps with the humidity sensor formation area (sensor area α1, upper electrode area α2, α3) in the substrate thickness direction of the sensor chip substrate 220, and electrical continuity with the humidity sensor formation area is obtained. ing.

  Subsequently, as shown in FIGS. 33 and 34, the lower electrode film 24 is formed on the surface 220f of the sensor chip substrate 220 so as to be positioned in the sensor area α1 defined by the insulator 221a. The lower electrode film 24 is formed on each of the moisture sensitive portion and the fixed portion, for example, in a planar rectangular shape that is mirror-reversed with respect to the virtual center line X assumed at the intermediate position between the moisture sensitive portion and the fixed portion to be formed.

  Subsequently, as shown in FIG. 35 and FIG. 36, for example, a polymer rectangle made of polyimide having a planar rectangular shape slightly larger than, for example, the lower electrode film 24 mirror-inverted with respect to the virtual center line X on the lower electrode film 24. A wet film 25 is formed.

  Subsequently, as shown in FIGS. 37 and 38, the virtual center line X is formed on the polymer moisture sensitive film 25 and the surface 220f from the sensor area α1 defined by the insulator 221a to the upper electrode areas α2 and α3. An upper electrode film 26 having a pattern shape mirror-inverted is formed. Here, the portion of the upper electrode film 26 located on the polymer moisture sensitive film 25 is formed in a planar rectangular shape substantially equivalent to the lower electrode film 24, and the polymer moisture sensitive film 25 is formed on the moisture sensitive part side. A large number of openings 27 for exposing the film are provided, and the fixed part is provided with a solid film shape having no openings. For the upper electrode film 26, for example, an electrode material such as Al, Ta, Ti, NiFe, or Ni is used.

Subsequently, as shown in FIG. 39, a non-moisture permeable protective film 28 covering the upper electrode film 26 is formed. As the non-moisture permeable protective film 28, for example, a silicon nitride film (SiNx film), a SiO ₂ film, an Al ₂ O ₃ / SiO ₂ laminated film, a SiO ₂ / SiN laminated film, or the like is used.

  Subsequently, as shown in FIG. 40, a plurality of electrodes that can be connected to the electrode wiring 210e of the support substrate 210 by being positioned on the electrode pad formation area defined by the insulator 221b on the back surface 220g of the sensor chip substrate 220. A pad 235 is formed. As described above, since the humidity sensor formation area and the electrode pad formation area are electrically connected, the plurality of electrode pads 235 are electrically connected to the lower electrode film 24 and the upper electrode film 26.

  40, the sensor chip substrate 220 is completed by cutting the sensor chip substrate 220 at positions where the insulators 221a and 221b on both sides of the humidity sensor 21 are embedded.

  Next, a manufacturing process of the sensor chip substrate 220 according to an aspect different from the above-described manufacturing process (FIGS. 29 to 40) will be described in detail with reference to FIGS. 41 to 47. FIGS. 41 to 46 are cross-sectional views showing the manufacturing process of the sensor chip substrate 220, and FIG. 47 is a plan view showing the process shown in FIG. 46 from the back side of the substrate.

  Also in this embodiment, a low resistance silicon substrate having a resistivity of a predetermined value or less by doping impurities such as boron and phosphorus is used as the sensor chip substrate 220. The front and back surfaces of the sensor chip substrate 220 are electrically connected.

  First, as shown in FIG. 41, the surface of the sensor chip substrate 220 is cut to a predetermined depth by dry etching, leaving a predetermined wiring connection area. An insulator 221 made of glass is embedded in the shaved portion, and the surface is polished until the silicon layer of the sensor chip substrate 220 and the embedded insulator 221 have the same height, and a flat surface without macroscopic unevenness. A smooth surface 220f is formed. By this step, an area where the insulator 221 on the front surface 220f is not embedded, that is, an area where electrical conduction between the front and back surfaces is ensured becomes a wiring connection area.

  Next, as shown in FIG. 41, a recess 220i is formed on the back surface 220g of the sensor chip substrate 220 by overlapping the wiring connection area of the front surface 220f in the thickness direction of the sensor chip by cutting the sensor chip substrate 220 to a predetermined depth. A plurality of electrode pads 235 are formed in each recess 220i. The plurality of electrode pads 235 are electrically connected to the wiring connection area of the surface 220f.

  The step of embedding the insulator 221 and the step of forming the electrode pad are in no particular order.

  Subsequently, as shown in FIG. 42, the lower electrode film 24 is formed on the surface 220f (humidity sensor forming surface) of the sensor chip substrate 220 so as to be at least partially located in the wiring connection area. The lower electrode film 24 is electrically connected to the electrode pad 235 on the back surface 220g in the wiring connection area. The lower electrode film 24 is formed on each of the moisture-sensitive portion and the fixed portion, for example, in a planar rectangular shape that is mirror-reversed with respect to the virtual center line X assumed at an intermediate position between the moisture-sensitive portion to be formed and the fixed portion.

  Subsequently, as shown in FIG. 43, the polymer moisture-sensitive film 25 made of polyimide, for example, has a planar rectangular shape slightly larger than, for example, the lower electrode film 24 that is mirror-inverted with respect to the virtual center line X on the lower electrode film 24. Form.

  Subsequently, as shown in FIG. 44, the upper electrode film 26 having a pattern shape obtained by mirror inversion with respect to the virtual center line X is formed on the polymer moisture sensitive film 25 and the surface 220f. Here, the portion of the upper electrode film 26 located on the polymer moisture sensitive film 25 is formed in a planar rectangular shape substantially equivalent to the lower electrode film 24, and the polymer moisture sensitive film 25 is formed on the moisture sensitive part side. A large number of openings 27 for exposing the film are provided, and the fixed part is provided with a solid film shape having no openings. The upper electrode film 26 extends from the polymer moisture sensitive film 25 to the wiring connection area through the insulator 221 on the front surface 220f, and is electrically connected to the electrode pad 235 on the back surface 220g in the wiring connection area. The For the upper electrode film 26, for example, an electrode material such as Al, Ta, Ti, NiFe, or Ni is used.

Subsequently, as shown in FIG. 45, a moisture-impermeable protective film 28 covering the upper electrode film 26 is formed. As the non-moisture permeable protective film 28, for example, a silicon nitride film (SiNx film), a SiO ₂ film, an Al ₂ O ₃ / SiO ₂ laminated film, a SiO ₂ / SiN laminated film, or the like is used.

  Subsequently, as shown in FIGS. 46 and 47, openings 222 for electrically independent of the plurality of electrode pads 235 are formed in the back surface 220g. The opening 222 is formed by dry etching to a depth that exposes the insulator 221 embedded in the surface 220f.

  Then, if the sensor chip substrate 220 is cut as shown by the broken lines in FIGS. 46 and 47, the sensor chip substrate 220 is completed.

  According to the manufacturing process shown in FIGS. 41 to 47, the plurality of electrode pads 235 of the sensor chip substrate 220 are arranged in the recesses 220i formed on the back surface 220g. Space can be omitted and it can contribute to low profile.

  In the second embodiment described above, a low-resistance silicon substrate is used as the sensor chip substrate 220, and the humidity sensor 21 on the front surface 220f side and the plurality of electrode pads 235 on the back surface 220g side are conductively connected using the substrate itself as a wiring. The sensor chip substrate 220 does not need to be provided with through-hole wiring, and the configuration and manufacturing process are simple. Of course, a through-hole conductor may be provided on the sensor chip substrate 220 so that the humidity sensor on the front surface side and the electrode pad on the rear surface side are electrically connected.

  In the first and second embodiments described above, the plurality of electrode pads 35 of the sensor chip substrate 20 are provided on the low flat surface portion 20e or the substrate back surface 20g parallel to the humidity sensor formation surface. 3rd and 4th embodiment which provided the some electrode pad 35 of the sensor chip board | substrate 20 in the side surface orthogonal to is described.

  48 to 50 show a third embodiment of the present invention. 48 is an external perspective view showing the humidity sensor package 3 according to the third embodiment before sealing, FIG. 49 is a plan view showing the humidity sensor package 3 before sealing, and FIG. 50 is before sealing. It is a side view which shows the humidity sensor package 3 seen from the side. The humidity sensor package 3 sealed with the sealing resin 60 is the same as the humidity sensor package 1 of the first embodiment shown in FIG.

  In the humidity sensor package 3 according to the third embodiment, a plurality of electrode pads 335 of the sensor chip substrate 320 are provided on the side surface 320b, and the electrode wirings 310e provided on the surface 310a of the support substrate 310 are orthogonal to each other. In this embodiment, the Au balls 30 are connected in a positional relationship.

  The sensor chip substrate 320 is made of a silicon substrate having an insulating film formed on the surface thereof. In the sensor chip substrate 320, the humidity sensor 21 is formed on a flat surface (humidity sensor forming surface) 320a having no macroscopic unevenness, and one end portion is formed on the lower electrode film 24 and the upper electrode film 26 of the humidity sensor 21. The lower electrode wiring 34 and the upper electrode wiring 36 connected to each other are extended to the side surface 320b, and electrode pads 335 are provided at the other ends of the lower electrode wiring 34 and the upper electrode wiring 36, respectively. The side surface 320b of the sensor chip substrate 320 is a surface orthogonal to the surface 320a of the sensor chip substrate 320 and the surface 310a of the support substrate 310. The components of the humidity sensor 21 are the same as those of the humidity sensor 21 of the first embodiment.

  The support substrate 310 has the same configuration as that of the first embodiment except that the electrode wiring 310e corresponding to the plurality of electrode pads 235 of the sensor chip substrate 320 is provided on the surface 310a which is an adhesive fixing surface of the sensor chip substrate 320. 10 is the same.

  The IC substrate 50 is thinner than the sensor chip substrate 20, and the electrode pad forming surface (front surface) 50 a on which the plurality of electrode pads 55 and 56 are formed is lower than the humidity sensor forming surface (front surface 320 a) of the sensor chip substrate 320. Yes. The plurality of electrode pads 55 of the IC substrate 50 are connected to the electrode wiring 310e of the support substrate 310 by a conductive wire 53 made of, for example, Au. The conductive wire 53 has a surface height lower than the surface 320 a (humidity sensor forming surface) of the sensor chip substrate 320 and is embedded in the sealing resin 60.

  If a plurality of electrode pads 335 are provided on the side surface 320b of the sensor chip substrate 320 as in this embodiment, the plurality of electrode pads 335 and the electrode wiring 310e of the support substrate 310 can be directly connected without using a conductive wire. Since it is electrically connected to the plurality of electrode pads 55 of the IC substrate 50 via the electrode wiring 310e of the support substrate 310, the package height is higher than the case where the electrode pads provided on the substrate surface and the IC substrate are connected by wire bonding. Space in the vertical direction can be omitted, and the height can be reduced.

  The humidity sensor package 3 is manufactured as follows. First, a large number of sensor chip substrates 320 are bonded and fixed on the surface 310a of a single support substrate 310 so as to be positioned on one end side of the electrode wiring 310e of the support substrate 310, respectively. At this time, in each sensor chip substrate 320, a plurality of electrode pads 335 provided on the side surface 320b and one end portion of the electrode wiring 310e of the support substrate 310 are in a positional relationship (a relationship of facing each other at 90 °). ,Deploy. Next, the plurality of electrode pads 335 of the sensor chip substrate 320 opposed to each other in a positional relationship orthogonal to each other, for example, by the Au balls 30 are connected to one end of the electrode wiring 310 e of the support substrate 310.

  Subsequently, a large number of IC substrates 50 are bonded and fixed on the same support substrate 310 on the other end side of the electrode wiring 310e of the support substrate 310, respectively. The other end of the electrode wiring 310 e is connected to the plurality of electrode pads 55 of each IC substrate 50 by the conductive wire 53, and the contact conductor 10 c and the plurality of electrode pads 56 of each IC substrate 50 are further connected by the conductive wire 52. Connect. Since the electrode pad forming surface 50a of the IC substrate 50 is lower than the humidity sensor forming surface 320a of the sensor chip substrate 320 and the surface height difference is about 50 to 200 μm, the conductive wires 52 and 53 are more than the humidity sensor forming surface. Also lower.

  The adhesion fixing and electrical connection process of the sensor chip substrate 320 and the adhesion fixing and electrical connection process of the IC substrate 50 may be performed in the reverse order.

  When the electrical connection of the sensor chip substrate 320, the support substrate 310, and the IC substrate 50 is completed, the sensor chip substrate 320 and the IC substrate 50 are sealed on the support substrate 310. As in the first embodiment described above, the sealing process is performed by pressing a mold against the humidity sensor forming surface of the sensor chip substrate 320, and between the mold and the sensor chip substrate 320, the IC substrate 50, and the support substrate 310. The resulting cavity is filled with the sealing resin 60, and the mold is removed when the sealing resin 60 is cured. By pressing the mold against the humidity sensor forming surface of the sensor chip substrate 320, the surface of the sealing resin 60 becomes the same height as the humidity sensor forming surface, and only the humidity sensor 21 is exposed on the package surface. Since the sensor chip substrate 320 excluding the humidity sensor 21, the IC substrate 50, and these electrical wiring portions are embedded with the sealing resin 60, they are resistant to corrosion and impact, and the reliability is improved. By this process, a large number of sensor chip substrates 320 and IC substrates 50 can be collectively sealed on a single support substrate 310, and the sealing process becomes easy. For the sealing resin 60, for example, an epoxy resin is used.

  After sealing, the support substrate 310 is cut in a package unit including one sensor chip substrate 320 and one IC substrate 50. In each of the divided packages, the SMD terminal 11 that is electrically connected to the contact conductor 310c through the through-hole conductor is formed on the back surface of the support substrate 310. The IC substrate 50 can be connected to an external circuit via the SMD terminal 11.

  Thus, the humidity sensor package 3 is obtained.

  51 to 53 show a fourth embodiment of the present invention. 51 is an external perspective view showing the humidity sensor package 4 before sealing, FIG. 52 is a plan view showing the humidity sensor package 4 before sealing, and FIG. 53 is a side view of the humidity sensor package 4 before sealing. FIG.

  The humidity sensor package 4 is an embodiment in which the plurality of electrode pads 335 provided on the side surface 320b of the sensor chip substrate 320 are connected to the plurality of electrode pads 55 of the IC substrate 50 in a positional relationship orthogonal to each other. The support substrate and the IC substrate are the same as the support substrate 10 and the IC substrate 50 of the first embodiment. In this way, if the plurality of electrode pads 335 of the sensor chip substrate 320 and the plurality of electrode pads 55 of the IC substrate 50 are directly connected, it is not necessary to use a conductive wire, and the package height is higher than the case of connecting by wire bonding. Space in the vertical direction can be omitted, and the height can be reduced. In addition, since it is not necessary to provide electrode wiring on the support substrate, the configuration is facilitated, and the support substrate can be reduced in size because the sensor chip substrate 320 and the IC substrate 50 are closely arranged.

  The humidity sensor package 4 is manufactured as follows. First, a pair of sensor chip substrates 320 and IC substrates 50 are arranged on the surface 10a of a single support substrate 10 and bonded and fixed. At this time, the sensor chip substrate 320 and the IC substrate 50 are in a positional relationship in which the plurality of electrode pads 335 provided on the side surface 320b of the sensor chip substrate 320 and the plurality of electrode pads 55 provided on the surface 50a of the IC substrate 50 are orthogonal to each other. Close so that they face each other.

  Next, the plurality of electrode pads 335 of the sensor chip substrate 320 and the plurality of electrode pads 55 of the IC substrate 50 which are opposed to each other in an orthogonal relationship are directly connected by the Au balls 30. Subsequently, the plurality of electrode pads 56 of the IC substrate 50 are connected to the contact conductors 10 c of the support substrate 10 by the conductive wires 52. Since the electrode pad forming surface of the IC substrate 50 is lower than the humidity sensor forming surface (surface 320a) of the sensor chip substrate 320, and the surface height difference is about 50 to 200 μm, the conductive wire 52 is more than the humidity sensor forming surface. Also lower.

  Subsequently, the sensor chip substrate 320 and the IC substrate 50 are sealed on the support substrate 10. As in the first embodiment described above, the sealing process is performed by pressing a mold against the humidity sensor forming surface of the sensor chip substrate 320 and between the mold and the sensor chip substrate 320, the IC substrate 50, and the support substrate 10. The resulting cavity is filled with the sealing resin 60, and the mold is removed when the sealing resin 60 is cured. By pressing the mold against the humidity sensor forming surface of the sensor chip substrate 320, the surface of the sealing resin 60 becomes the same height as the humidity sensor forming surface, and only the humidity sensor 21 is exposed on the package surface. Since the sensor chip substrate 320 excluding the humidity sensor 21, the IC substrate 50, and these electrical wiring portions are embedded with the sealing resin 60, they are resistant to corrosion and impact, and the reliability is improved. By this process, a large number of sensor chip substrates 320 and IC substrates 50 can be collectively sealed on the single support substrate 10, and the sealing process becomes easy. For the sealing resin 60, for example, an epoxy resin is used.

  After sealing, the support substrate 10 is cut in a package unit including one sensor chip substrate 320 and one IC substrate 50. In each divided package, an SMD terminal 11 is formed on the back surface 10b of the support substrate 10 so as to be conductively connected to the contact conductor 10c through the through-hole conductor 10d. The IC substrate 50 can be connected to an external circuit via the SMD terminal 11.

  Thus, the humidity sensor package 4 is obtained.

  According to each of the above embodiments, the humidity sensor 21 of the sensor chip substrate 20 is formed at a position higher than the plurality of electrode pads 35, and the sealing resin 60 is provided up to the same height as the humidity sensor formation surface. In addition, the space other than the humidity sensor 21 (the sensor chip substrate 20, the IC substrate 50, and the electric wiring portion thereof) can be reliably sealed with the sealing resin 60 while omitting the space in the package height direction, and only the humidity sensor 21 is package surface 1a. It becomes easy to expose to. As a result, the package can be reduced in height and an SMD-compatible humidity sensor package that can be easily mounted on an external circuit can be provided.

  In each of the embodiments, the present invention has been described in the embodiment including the humidity sensor 21 having the humidity sensing unit 22 and the fixing unit 23, but the humidity sensor having only the humidity sensing unit whose output changes according to the humidity is provided. The present invention is also applicable to a humidity sensor package. Further, the present invention can be applied not only to a capacitive humidity sensor but also to a resistance humidity sensor having a humidity sensitive portion whose electric resistance changes according to humidity.

1, 2, 3, 4 Humidity sensor package 10 Support substrate 10a Front surface 10b Back surface 10c Contact conductor 10d Through-hole conductor 20 Sensor chip substrate 20a Si layer 20b Insulating film 20c High flat surface portion (humidity sensor formation surface)
20d Inclined surface portion 20e Low flat surface portion (electrode pad forming surface)
DESCRIPTION OF SYMBOLS 21 Humidity sensor 22 Humidity sensing part 23 Fixed part 24 Lower electrode film 25 Polymer moisture sensitive film 26 Upper electrode film 27 Opening part 28 Non-moisture permeable protective film 30 Au ball 34 Lower electrode wiring 35 Electrode pad 36 Upper electrode wiring 37 Contact hole 50 IC substrate 51, 52, 53 Conductive wire 55, 56 Electrode pad 60 Sealing resin 61 Mold 62 Cavity 220 Sensor chip substrate 220f Surface (humidity sensor forming surface)
220g Back surface 220h Through-hole wiring 220i Recess 222 Opening 235 Electrode pad 310 Support substrate 310a Surface 310c Contact conductor 310e Electrode wiring 320 Sensor chip substrate 320a Surface (humidity sensor formation surface)
320b Side surface 335 Electrode pad

Claims (22)

In a humidity sensor package in which a sensor chip substrate on which a humidity sensor is formed and an IC substrate that detects an output change of the humidity sensor are bonded and fixed to the same support substrate,
The sensor chip substrate and the IC substrate are covered with a sealing resin with the humidity sensor exposed, and the surface of the sealing resin and the humidity sensor forming surface of the sensor chip substrate are at the same height position. Humidity sensor package characterized by 2. The humidity sensor package according to claim 1, wherein the support substrate is provided with an SMD terminal on the surface opposite to the surface covered with the sealing resin for connecting the IC substrate to an external circuit. Humidity sensor package. In the humidity sensor package according to claim 1 or 2, provided on the surface of the sensor chip substrate, a high flat portion and a low flat portion having different surface heights, and an inclined surface portion connecting between the high and low flat portions, The humidity sensor is formed on the high flat surface portion, a plurality of electrode pads are formed on the low flat surface portion, and an electrode wiring for electrically connecting the humidity sensor and the plurality of electrode pads is formed along the inclined surface portion. Humidity sensor package. 4. The humidity sensor package according to claim 3, wherein the sensor chip substrate and the electrode pad of the IC substrate are connected by a conductive wire, and the conductive wire is provided lower than the surface on which the humidity sensor is formed. 3. The humidity sensor package according to claim 1, wherein the humidity sensor package includes a plurality of electrode pads that are electrically connected to the humidity sensor on one and the other of the front and back surfaces that are electrically connected to each other. Forming,
A humidity sensor package in which a plurality of electrode wirings electrically connected to the IC substrate are formed on the support substrate at positions facing the plurality of electrode pads of the sensor chip substrate bonded and fixed. 6. The humidity sensor package according to claim 5, wherein the plurality of electrode pads of the sensor chip substrate are provided in a recess formed by cutting the sensor chip substrate to a predetermined depth. The humidity sensor package according to claim 5 or 6, wherein a plurality of wiring conductors of the IC substrate and the support substrate are connected by a conductive wire, and the conductive wire is provided lower than the humidity sensor forming surface. package. 3. The humidity sensor package according to claim 1, wherein a plurality of electrode pads of the sensor chip substrate are formed on a side surface of the substrate, and positions where the plurality of electrode pads and one end of the electrode wiring provided on the support substrate are orthogonal to each other. A humidity sensor package that is connected in relation to the other end of the electrode wiring provided on the support substrate and a plurality of electrode pads of the IC substrate. 9. The humidity sensor package according to claim 8, wherein the other end of the electrode wiring of the support substrate is connected to the plurality of electrode pads of the IC substrate by a conductive wire, and the conductive wire is lower than the humidity sensor forming surface. Humidity sensor package provided. 3. The humidity sensor package according to claim 1, wherein a plurality of electrode pads of the sensor chip substrate are formed on a side surface of the sensor chip substrate, and the plurality of electrode pads and the plurality of electrode pads of the IC substrate are in a positional relationship orthogonal to each other. Connected humidity sensor package. Forming a plurality of sensor chip substrates having a humidity sensor and a plurality of electrode pads electrically connected to the humidity sensor, and having a humidity sensor forming surface higher than the electrode pad forming surface;
A plurality of sensor chip substrates and a plurality of IC substrates corresponding to each sensor chip substrate are bonded and fixed on a single support substrate, and a plurality of electrode pads of the sensor chip substrate and a plurality of electrode pads of the IC substrate are paired. Electrically connecting
A mold is pressed against the humidity sensor forming surface of the sensor chip substrate to fill a cavity formed between the mold and the sensor chip substrate, the IC substrate and the support substrate with a sealing resin, and after the resin is cured, the mold Removing the mold,
Cutting the support substrate in a package unit composed of a pair of sensor chip substrate and IC substrate;
A method for manufacturing a humidity sensor package, comprising: 12. The method of manufacturing a humidity sensor package according to claim 11, wherein a plurality of electrode pads of the sensor chip substrate and a plurality of electrode pads of the IC substrate are connected by a conductive wire, and the conductive wire is connected to the humidity of the sensor chip substrate. A method of manufacturing a humidity sensor package provided lower than the sensor formation surface. 13. The method of manufacturing a humidity sensor package according to claim 11, wherein the sensor chip substrate is
Forming a humidity sensor and a plurality of electrode wirings electrically connected to the humidity sensor on an insulating film covering a substrate surface;
Forming a first non-breathable protective film covering the humidity sensor;
Removing the first moisture-impermeable protective film and a part of the substrate at a position where the humidity sensor is not formed, and forming an electrode pad forming surface lower than the humidity sensor forming surface;
Forming an insulating film covering the electrode pad forming surface;
Removing the first moisture-impermeable protective film located on the end portions of the plurality of electrode wirings, and forming contact holes that expose the end portions of the plurality of electrode wirings in the removed portions;
Connecting to the plurality of electrode wirings through the contact hole, and forming a lead electrode wiring extending from the contact hole to the insulating film on the electrode pad forming surface;
Forming a second non-moisture permeable protective film covering the lead electrode wiring and the first non-moisture permeable protective film;
Removing the second non-moisture permeable protective film on the electrode pad forming surface, exposing an end portion of the extraction electrode wiring to a removed portion, and forming a plurality of electrode pads;
A method for manufacturing a humidity sensor package formed by: 13. The method of manufacturing a humidity sensor package according to claim 11, wherein the sensor chip substrate is
Forming, on the substrate surface, a high plane portion and a low plane portion having different surface heights, and an inclined surface portion connecting between the high and low plane portions;
Forming an insulating film on the substrate surface including the high flat portion, the low flat portion and the inclined surface portion;
On the insulating film, the humidity sensor is formed so as to be positioned on the high plane portion, and the electrode wiring electrically connected to the humidity sensor is extended along the inclined surface portion from the high plane portion to the low plane portion. Forming the process,
Forming a moisture-impermeable protective film covering the humidity sensor as a whole;
Removing the non-moisture permeable protective film on the low planar portion, exposing the end of the electrode wiring to the removed portion, and forming a plurality of electrode pads;
A method for manufacturing a humidity sensor package formed by: Forming a number of sensor chip substrates in which a plurality of electrode pads are electrically connected to a humidity sensor provided on one and the other of the front and back surfaces;
Preparing a single support substrate having a plurality of electrode wirings corresponding to a plurality of electrode pads of the sensor chip substrate;
Bonding and fixing the plurality of sensor chip substrates on the single support substrate, and electrically connecting one end portions of the plurality of electrode wirings of the support substrate corresponding to the plurality of electrode pads of the sensor chip substrate; ,
Bonding and fixing a number of IC substrates corresponding to each sensor chip substrate on the support substrate, and electrically connecting a plurality of electrode pads of the IC substrate and the other end portions of the plurality of electrode wirings of the support substrate; ,
A mold is pressed against the humidity sensor forming surface of the sensor chip substrate to fill a cavity formed between the mold and the sensor chip substrate, the IC substrate, and the support substrate with a sealing resin. Removing the mold;
Cutting the support substrate in a package unit composed of a pair of sensor chip substrate and IC substrate;
A method for manufacturing a humidity sensor package, comprising: 16. The method of manufacturing a humidity sensor package according to claim 15, wherein the other electrode pads of the IC substrate and the other end portions of the wiring conductors of the support substrate are connected by a conductive wire, and the conductive wire is connected to the sensor. A manufacturing method of a humidity sensor package provided lower than a humidity sensor forming surface of a chip substrate. The method of manufacturing a humidity sensor package according to claim 15 or 16, wherein the sensor chip substrate is a silicon substrate in which front and back surfaces are electrically connected,
A step of embedding an insulator for defining a humidity sensor forming area on one of the front and back surfaces of the silicon substrate;
A step of embedding an insulator for defining a plurality of electrode pad forming areas overlapped with the humidity sensor forming area in the substrate thickness direction on the other of the front and back surfaces of the silicon substrate;
Forming a humidity sensor in the humidity sensor formation area;
Forming a plurality of electrode pads in conductive connection with the humidity sensor via the silicon substrate in the plurality of electrode pad formation areas;
A method for manufacturing a humidity sensor package formed by: The method of manufacturing a humidity sensor package according to claim 15 or 16, wherein the sensor chip substrate is a silicon substrate in which front and back surfaces are electrically connected,
A step of embedding an insulator on one of the front and back surfaces of the silicon substrate, except for a wiring connection area that ensures electrical conduction between the front and back surfaces;
Forming a recess having a predetermined depth in a position overlapping with the wiring connection area in the substrate thickness direction on the other of the front and back surfaces of the silicon substrate, and forming a plurality of electrode pads in the recess;
A step of forming a humidity sensor on one of the front and back surfaces of the silicon substrate so as to include the wiring connection area; and
Forming an opening that electrically separates a plurality of electrode pads on the other of the front and back surfaces of the silicon substrate at a depth that exposes the insulator;
A method for manufacturing a humidity sensor package formed by: Forming a plurality of sensor chip substrates having a plurality of electrode pads electrically connected to the humidity sensor formed on the substrate surface disposed on the side surface of the substrate;
Preparing a support substrate on which a plurality of electrode wirings corresponding to a plurality of electrode pads of the sensor chip substrate are formed;
The plurality of sensor chip substrates are bonded and fixed on the support substrate, and one end portions of the plurality of electrode wirings of the support substrate corresponding to the plurality of electrode pads of the sensor chip substrate are electrically connected in a mutually orthogonal positional relationship. And a process of
Bonding and fixing a large number of IC substrates corresponding to each sensor chip substrate on the support substrate, and electrically connecting a plurality of electrode pads of the IC substrate and the other end portions of the plurality of electrode wirings of the support substrate; ,
A mold is pressed against the humidity sensor forming surface of the sensor chip substrate to fill a cavity formed between the mold and the sensor chip substrate, the IC substrate and the support substrate with a sealing resin, and after the resin is cured, the mold Removing the mold,
Cutting the support substrate in a package unit composed of a pair of sensor chip substrate and IC substrate;
A method for manufacturing a humidity sensor package, comprising: 20. The manufacturing method of a humidity sensor package according to claim 19, wherein the plurality of electrode pads of the IC substrate and the other ends of the plurality of electrode wirings of the support substrate are connected by a conductive wire, and the conductive wire is connected to the sensor chip. A manufacturing method of a humidity sensor package provided lower than a humidity sensor forming surface of a substrate. Forming a plurality of sensor chip substrates having a plurality of electrode pads electrically connected to the humidity sensor formed on the substrate surface disposed on the side surface of the substrate;
A plurality of sensor chip substrates and an IC substrate corresponding to each sensor chip substrate are placed in close contact with each other in a positional relationship in which each electrode pad is orthogonal to each other on a single support substrate, and bonded and fixed;
Electrically connecting the sensor chip substrate and the plurality of electrode pads of the IC substrate facing each other in a positional relationship orthogonal to each other;
A mold is pressed against the humidity sensor forming surface of the sensor chip substrate to fill a cavity formed between the mold and the sensor chip substrate, the IC substrate and the support substrate with a sealing resin, and after the resin is cured, the mold Removing the mold,
Cutting the support substrate in a package unit composed of a pair of sensor chip substrate and IC substrate;
A method for manufacturing a humidity sensor package, comprising: The humidity sensor package manufacturing method according to any one of claims 11 to 21, wherein the IC substrate is placed on a surface opposite to the surface covered with the sealing resin on the supporting substrate. Manufacturing method of humidity sensor package which forms SMD terminal for connecting to.

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