JP2011079005A - Wire solder delivery mechanism - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wire solder delivery mechanism which does not occur cutting during the supply of a wire solder independently of the diameter of the a wire solder, and is high in delivery accuracy adaptable to the soldering of a minute part. <P>SOLUTION: By adopting the mechanism in which wire solder 1 is transferred forward and backward by rotating a holder 4 for holding the wire solder 1, no excessive load is imparted to the wire solder and also high accuracy in delivery is made possible. In other words, as a relation between a screw and a nut, a spiral trace is provided on the outer surface so that the wire solder 1 moves forward or backward by rotation. Otherwise, using a wire solder 3 for which a plurality of single wire solders 1 are twisted into a stranded wire solder, machining is performed to make the spiral trace of the wire solder 1 or a spiral groove to be screwed on the outer shape of the stranded wire solder 3 inside the holder 4, so that the wire solder is moved forward and backward by rotating the holder. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a wire solder feeding mechanism in a wire solder supply device, and more specifically, a mechanism for accurately feeding wire solder to a predetermined position by moving the wire solder back and forth by a rotational movement of a gripping body that grips the wire solder to be supplied. About.

The conventional wire solder supply device is composed of a wire solder reel stocked with wire solder, a guide for guiding the wire solder to a soldering place, and a mechanism for sending the wire solder. As a mechanism for sending the wire solder, two rollers are used. A method is generally used in which the wire solder is sandwiched and the wire solder is sent out by rotation of a roller.
In recent years, a wire solder supply device (Patent Document 2) has also been proposed in which a grooving blade is provided on one of the rollers and a V-shaped groove is provided on the wire solder as a countermeasure against flux scattering.

However, most of the wire solder feeding mechanisms conventionally used in wire solder supply devices use a roller. For example, wire solder is sandwiched between two rollers and the resistance between the roller and wire solder is used. Then, the wire solder is sent out by rotating the roller.
In the case of having such a feeding mechanism using a roller, there has been a problem of stabilization of torque for rotating the roller, a load applied to the wire solder, and the like, and the wire solder cannot be supplied smoothly.

  Recently, with the miniaturization of electronic parts that are the subject of soldering, there has been a demand for soldering using wire solder with a thin wire diameter, and it has responded to soldering using wire solder with a thin wire diameter. There is a request for a soldering device, but as the wire diameter becomes thinner, the tensile strength of the wire solder decreases, so there is a problem that the wire solder breaks while the wire solder is being supplied to the soldering location. It was.

  Therefore, studies have been made to solve the above-mentioned problems, and a method for controlling the torque and a roller for gripping the wire solder with a microcomputer (Patent Document 1) and reducing the load on the wire solder being supplied are reduced. A method of preventing cutting (Patent Document 3) has been proposed.

However, since either method uses a roller as a method for feeding wire solder as a wire solder supply mechanism, no sufficiently satisfactory proposal has been made, especially for wire solder with a thin wire diameter. Issues remain in generation and delivery accuracy.

JP 7-164142 A JP 2003-200290 A JP 2008-142769 A

  An object of the present invention is to provide a wire solder feeding mechanism with high accuracy of feeding corresponding to soldering to a fine part without occurrence of cutting during the feeding of the wire solder regardless of the wire diameter of the wire solder to be supplied. Is to provide.

As a result of intensive studies to solve the above problems, the present inventor employs a mechanism that moves the wire solder back and forth by rotating a gripping body that grips the wire solder, thereby overloading the wire solder. The present invention has been completed by finding out that it is possible to increase the accuracy with which the feed is performed without applying it.
That is, according to the present invention, as in the relationship between the screw and the nut, the outer surface is provided with a screw-like mark so that the wire solder moves forward or backward by rotation, or a plurality of single-wire solders are twisted to form a stranded wire shape. The processed wire solder is used to form a spiral groove on the inner side of the gripping body for gripping the wire solder so as to be screwed into the outer shape of the wire solder or the stranded wire solder. This is a mechanism for moving the wire solder back and forth by rotating the gripping body.
Further, by making the wire solder contact portion of the gripping body have a spring-like structure, it is possible to send out the wire solder in contact with the outer surface of the wire solder as if it is screwed.
And by having the said spring-like structure, the feed which spreads a freedom degree also to the supply method to a soldering workpiece | work part is attained, without applying load also to the bending of wire solder.
On the other hand, it is possible to reduce the frictional resistance between the wire solder and the gripping body by attaching a ball-shaped object to the place where the outside of the wire solder contacts the inside of the gripping body and using a mechanism like a so-called ball screw. This makes it possible to send out the wire solder more smoothly and accurately.

According to the wire solder feeding mechanism of the present invention, since the load on the wire solder to be used is reduced, even in the case of wire solder having a thin wire diameter, cutting is performed in the feeding process, switching operation between forward and reverse, etc. Therefore, by controlling the rotation of the gripping body, it is possible to accurately control the amount and speed of wire solder delivery.
The improvement of wire solder feeding accuracy can be expected to reduce the loss of solder used and the maintenance load of the solder supply equipment.

FIG. 1 shows a conventional single wire solder. FIG. 2 is a view showing a state in which screw-shaped marks are provided on the outer surface of the single-wire solder so that the single-wire solder can be screwed onto the gripping body of the wire solder feeding mechanism of the present invention. Figure 3 shows stranded wire solder. FIG. 4 is a diagram showing a wire solder feeding mechanism of the present invention. FIG. 5 is a cross-sectional view of a gripping body in a state where the stranded wire solder is gripped and a surface representing the stranded wire solder in the gripping portion of the wire solder feeding mechanism of the present invention. FIG. 6 shows a cross section of a gripping body gripping stranded wire, a ball-shaped object, and a state of stranded wire solder in a gripping portion when a ball-shaped object is attached to the wire solder delivery mechanism of the present invention. The surface representing. FIG. 7 is a conceptual diagram showing a state where the wire solder and the gripping part spring-like structure are screwed together when the wire solder contact part of the gripping body has a spring-like structure in the gripping part of the wire solder feeding mechanism of the present invention. . FIG. 8 is a diagram illustrating an example of a shape obtained by shaping a single-wire solder for the purpose of preventing rotation and an example of a cross-section of a spiral trace, which are used in the wire solder feeding mechanism of the present invention.

The present invention is described in detail below.
FIG. 4 is a view showing the wire solder feeding mechanism of the present invention. 4 is a stranded wire solder constituting the wire solder delivery mechanism of the present invention, and 4 is a gripping body constituting the wire solder delivery mechanism of the present invention.
As shown in FIG. 5, the inner surface portion of the gripping body in contact with the stranded wire solder is processed into a shape that is screwed into the outer shape of the stranded wire solder, and the gripping body is attached to the wire solder supply device having the mechanism of the present invention. Is a mechanism that enables the stranded wire solder to move back and forth, and the stranded wire solder is sent out and supplied to the solder joint work part by rotating the gripper so that it can rotate. .
Of course, the single wire solder can also be sent out by moving back and forth in the same manner, even if a wire solder having a screw-like mark on the outer surface as described above is used.

That is, the present invention is arranged so that it can be screwed into a single wire solder or a stranded wire solder provided with a screw-like mark on the surface and a single wire solder or a stranded wire solder provided with a screw mark so that it can move back and forth by rotation. It is a wire solder feeding mechanism composed of a gripping body with processing on the surface. By rotating the gripping body, wire solder can be sent out, and by controlling the rotation, the wire solder feeding accuracy It features a mechanism that improves

Below, the wire solder which comprises the wire solder delivery mechanism of this invention is demonstrated.
Examples of the wire solder that can be used in the wire solder feeding mechanism of the present invention include a single wire solder and a stranded wire solder obtained by twisting a plurality of single wires. First, the single wire solder will be described.
The single wire solder that can be used in the wire solder feeding mechanism of the present invention is not particularly limited within the range having the effects of the present invention, and the composition, wire diameter, and flux content of the solder alloy can be arbitrarily set. is there. Examples of solder alloys include lead-free alloys such as Sn—Cu—Ni alloys and Sn—Ag—Cu alloys, and may be Pb-containing alloys.
Wire diameter, flux content, etc. are also available on the market and can be handled. For example, the wire diameter may be 0.1 mm to 1 mmφ if the flux is blended, 0.5 mm to 3 mmφ if the flux is not blended, and the flux content may be 0% to 4%. However, it is not limited to these examples.

There are no particular restrictions on the screw traces provided on the single wire solder used in the wire solder delivery mechanism of the present invention as long as the effects of the present invention are achieved, and the screw pitch, depth, and trace length can be arbitrarily set. is there.
In addition, there is no problem with the method of providing the screw trace on the single wire solder as long as the screw trace can be moved back and forth in accordance with the rotation of the gripping body to be screwed. It is possible to process a shape that is screwed with a screw-shaped mark provided on the surface.
In addition, the spiral trace which the wire solder of this invention has is the spiral shape of the outer surface of the wire solder provided in the whole or a part of the wire solder for the purpose of the wire solder moving forward and backward by the rotation of the gripping body. Say a wound.

Next, the stranded wire solder that can be used in the present invention will be described.
The stranded wire solder that can be used in the present invention is not particularly limited as long as it has the effects of the present invention, and the composition of the alloy of the single wire solder, the wire diameter, the flux content, and the number of twists are arbitrarily set. Is possible.
For example, when a plurality of wires are used to form a stranded wire solder, the alloy composition of the single wire solder constituting the stranded wire solder may be the same, or a single wire solder made of a different kind of alloy composition may be combined.
Moreover, the wire diameter of the single wire solder constituting the stranded wire solder may be the same diameter, or a combination of single wire solders having different diameters may be used.
And also about the flux content of the single wire solder which comprises stranded wire solder, the same amount may be sufficient, and you may combine the single wire solder from which quantity differs.
On the other hand, the number of wire solder constituting the stranded wire solder and the twisting method are not limited and can be arbitrarily set, and as a stranded wire center or a part of the configuration, a composition other than a solder alloy, such as a piano wire or a stainless wire, A combination of resin lead wires may be used as stranded wire solder.

The holding body used for the wire solder feeding mechanism of the present invention will be described.
The gripping body used in the wire solder feeding mechanism of the present invention is not particularly limited in shape, size, material, etc., as long as it has the action of moving the wire solder back and forth by rotating the gripping body within the range having the effects of the invention. Can be set.
For example, with respect to the shape, there is no particular problem as long as the gripping body can rotate and can be fixed to a supply device equipped with the wire solder feeding mechanism of the present invention, and a space where wire solder or stranded wire solder can be gripped at the center. The disk shape etc. which have can be illustrated.
Further, the size of the inner surface portion and the size of the inner surface portion are not particularly limited as long as the wire solder can be gripped and fed out as long as the shape can be screwed into the outer shape of the wire solder.
At that time, the possibility of damage is further reduced in the wire solder feeding process used in the present invention by processing the tip portion into a curved surface so that the shape of the inner portion screwed with the wire solder does not become an acute angle. Is possible.
Any material may be used as long as it has excellent durability and does not affect wire solder or stranded wire solder.

In addition, the material, pitch, size, etc. of the spring-like structure provided at the wire solder contact portion of the gripping body are not particularly limited within the range having the effects of the present invention, and as shown in FIG. It only needs to have an effect that the wire solder can move back and forth by contacting with the screw-shaped marks provided on the wire solder by rotating. However, it is possible to perform feeding with a greater degree of freedom in the supply method to the soldering work part without applying a load.
On the other hand, the driving method for rotating the gripping body is not particularly limited as long as it can rotate with the effect of the present invention, and the fixing method to the wire solder supply device also has a problem in the rotation of the gripping body. And can be freely selected within a range that does not affect the accuracy of rotation and wire solder feeding.

With respect to the wire solder feeding mechanism of the present invention, a so-called ball screw mechanism can be adopted by mounting a ball-like object in the gap between the wire solder and the gripping body.
Further, the size and material of the ball-like object can be arbitrarily set within a range having the effect of the present invention.
When a ball-like object is mounted, the frictional resistance between the wire solder and the gripping body is reduced, the load on the solder when the wire solder is sent out, and the wire solder can be moved forward and backward more smoothly. Higher accuracy delivery can be expected.

The rotational motion of the gripping portion of the wire solder delivery mechanism of the present invention can be controlled by a computer or the like in order to increase the rotational accuracy.
Further, by applying the mechanism of the ultrasonic motor, it is possible to control the delivery of the wire solder with higher accuracy.

By the way, in the wire solder delivery mechanism of the present invention, since the wire solder to be delivered is sent out by moving the wire solder back and forth by the rotation of the gripping body, the wire solder may rotate in conjunction with the rotational motion of the gripping body. In consideration, it may be necessary to prevent the wire solder itself from rotating.
As a method of preventing rotation, a guide is provided after wire solder is sent out, and when passing the guide, the solder is shaped into a shape similar to the internal shape of the guide so that rotation of the wire solder is suppressed by the internal shape of the guide and stops. The method of doing can be illustrated.
Specifically, the shape shown in FIG. 8 can be obtained by, for example, a method in which the wire solder is lightly pinched with a roller after being fed out from the gripping portion and rotation is stopped, or when a screw-like mark is provided on the single wire solder, and the shaping roller is passed through. An example of the method of shaping the wire solder is shown in FIG.

DESCRIPTION OF SYMBOLS 1 Single wire solder 1a Shaped single wire solder 1b Shaped single wire solder 2 Screw trace 2a provided on single wire solder Cross section of screw trace provided on single wire solder 3 Stranded wire solder 4 Holding body 4a Holding body cross section 5 Ball-shaped object 6 Spring-like structure provided on the wire solder contact part of the gripping body

Claims (5)

Wire solder feeding mechanism, consisting of wire solder and a gripping body for gripping the wire solder, rotating the gripping body to move the wire solder back and forth and supplying the wire solder to the soldering work part A wire solder feeding mechanism characterized by: A wire solder feeding mechanism, which has a screw-like trace on the outer surface of the wire solder where the wire solder can be moved forward or backward by rotation, and a groove-like process that engages with the wire solder screw-like trace on the side of the gripping body The wire solder feeding mechanism according to claim 1, wherein the wire solder moves back and forth by rotation of the grip body. 3. The wire solder feeding mechanism according to claim 1, wherein the wire solder is a stranded wire composed of a plurality of single wire solders.   4. The wire solder feeding mechanism according to claim 1, wherein the wire solder contact portion of the gripping body has a spring-like structure. 4. The wire solder feeding mechanism according to claim 1, wherein a ball-like object is attached to a place where the gripper grips the wire solder.

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