JP2011077218A - Electromagnetic shield, and electronic apparatus - Google Patents

Electromagnetic shield, and electronic apparatus Download PDF

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JP2011077218A
JP2011077218A JP2009225795A JP2009225795A JP2011077218A JP 2011077218 A JP2011077218 A JP 2011077218A JP 2009225795 A JP2009225795 A JP 2009225795A JP 2009225795 A JP2009225795 A JP 2009225795A JP 2011077218 A JP2011077218 A JP 2011077218A
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lead
shield
frame
insulating layer
electromagnetic
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JP5347880B2 (en
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Hiroshi Matsuoka
洋 松岡
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NEC Corp
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NEC Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic shield capable of efficiently utilizing the installation space of the electromagnetic shield and enlarge the mounting area on a substrate. <P>SOLUTION: An electromagnetic shield 20 shielding electromagnetic wave has a frame 1, having a conductive lead 7 and a conductive shield 8, an insulating layer 2 covering at least a part of the lead 7 and the shield 8, and a circuit layer provided on the insulating layer 2 and electrically connected to the lead 7 via an opening 13H that opens on the insulating layer 2 on the lead 7. The lead 7 is electrically insulated from the shield 8, and the end part of the lead 7 is exposed to an outer periphery of the frame 1 as an exterior terminal. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、電磁シールド及びそれを備えた電子機器に関するものである。   The present invention relates to an electromagnetic shield and an electronic device including the electromagnetic shield.

一般に、携帯電話などの電子機器に用いられる高周波電子部品の周囲には、電磁波の侵入や漏洩を防止するための電磁シールドが設けられている（特許文献１参照）。図３は、従来の電磁シールドを示す断面模式図である。図３の電子機器においては、基板５５上に実装された電子部品５３の周囲を金属フレームからなる電磁シールド５１が覆っている。基板５５には電子部品と接続される各種配線が形成されており、これらの配線が基板端部に設けられた外部コネクタ５４に接続されている。図３では図示を省略したが、基板５５上には電子部品５３以外にも多数の配線及び電子部品が設けられており、これらの配線及び電子部品が電磁シールド５１と重ならない位置に配置されている。   In general, an electromagnetic shield for preventing intrusion and leakage of electromagnetic waves is provided around high-frequency electronic components used in electronic devices such as mobile phones (see Patent Document 1). FIG. 3 is a schematic cross-sectional view showing a conventional electromagnetic shield. In the electronic device of FIG. 3, an electromagnetic shield 51 made of a metal frame covers the periphery of the electronic component 53 mounted on the substrate 55. Various wirings connected to electronic components are formed on the substrate 55, and these wirings are connected to an external connector 54 provided at the end of the substrate. Although not shown in FIG. 3, a large number of wirings and electronic components are provided on the substrate 55 in addition to the electronic component 53, and these wirings and electronic components are arranged at positions where they do not overlap the electromagnetic shield 51. Yes.

特開２００５−１０１３６５号公報JP 2005-101365 A

しかしながら、従来の電子機器では、電子部品５３を電磁シールド５１で覆うために、電磁シールド５１を基板５５に接着するスペースが必要であり、また、その周囲に隣接させて他の電子部品を実装することが難しく、実装エリアの狭小化の一因となっている。また、携帯型電子機器の多機能化により、実装する部品点数が多くなり、これらの電子部品の実装面積を増やすために基板サイズを大きくする、或いは、サブボードと呼ばれるメイン基板５５とは別の基板に電子部品を実装しコネクタ等で接続するなどにより対応を図っているため、電子機器の小型化がますます困難となってきている。   However, in the conventional electronic device, in order to cover the electronic component 53 with the electromagnetic shield 51, a space for adhering the electromagnetic shield 51 to the substrate 55 is necessary, and other electronic components are mounted adjacent to the periphery thereof. This is difficult and contributes to the narrowing of the mounting area. In addition, the number of components to be mounted increases due to the multi-functionality of portable electronic devices, and the substrate size is increased in order to increase the mounting area of these electronic components, or different from the main substrate 55 called a sub board. Since electronic parts are mounted on a board and connected by a connector or the like, downsizing of electronic devices has become increasingly difficult.

本発明はこのような事情に鑑みてなされたものであって、電磁シールドの設置スペースを有効に活用し、基板上の実装面積を拡大することのできる電磁シールド及びそれを備えた電子機器を提供することを目的とする。   The present invention has been made in view of such circumstances, and provides an electromagnetic shield capable of effectively utilizing the installation space of the electromagnetic shield and expanding the mounting area on the substrate, and an electronic apparatus including the electromagnetic shield. The purpose is to do.

上記の課題を解決するため、本発明の電磁シールドは、電磁波を遮蔽する電磁シールドであって、導電性のリード部と導電性のシールド部とを有するフレームと、前記リード部と前記シールド部との少なくとも一部を覆う絶縁層と、前記絶縁層上に設けられ、前記リード部上の前記絶縁層に開口した開口部を介して前記リード部と電気的に接続された回路層と、を有し、前記リード部は前記シールド部と電気的に絶縁され、前記リード部の端部が外部端子として前記フレームの外周部に露出していることを特徴とする。   In order to solve the above problems, the electromagnetic shield of the present invention is an electromagnetic shield for shielding electromagnetic waves, and includes a frame having a conductive lead portion and a conductive shield portion, the lead portion, and the shield portion. An insulating layer that covers at least a part of the circuit layer, and a circuit layer that is provided on the insulating layer and is electrically connected to the lead portion through an opening that opens in the insulating layer on the lead portion. The lead portion is electrically insulated from the shield portion, and an end portion of the lead portion is exposed to an outer peripheral portion of the frame as an external terminal.

また、上記の課題を解決するため、本発明の電子機器は、基板と、前記基板の実装領域に実装された電子部品と、前記電子部品を覆って電磁波を遮蔽する電磁シールドと、を有する電子機器であって、前記基板上の前記実装領域の周囲には、中継電極とグラウンド電極とを含む第１回路層が設けられ、前記電磁シールドは、導電性のリード部と導電性のシールド部とを有するフレームと、前記リード部と前記シールド部との少なくとも一部を覆う絶縁層と、前記絶縁層上に設けられ、前記リード部上の前記絶縁層に開口した開口部を介して前記リード部と電気的に接続された第２回路層と、を有し、前記リード部は前記シールド部と電気的に絶縁され、前記リード部の端部は前記中継電極と電気的に接続されていると共に、前記シールド部の端部は前記グラウンド電極と電気的に接続されていることを特徴とする。   In order to solve the above problems, an electronic device according to the present invention includes an electronic board having a substrate, an electronic component mounted on a mounting region of the substrate, and an electromagnetic shield that covers the electronic component and shields electromagnetic waves. A first circuit layer including a relay electrode and a ground electrode is provided around the mounting region on the substrate, and the electromagnetic shield includes a conductive lead portion, a conductive shield portion, and the like. A lead frame, an insulating layer covering at least a part of the lead part and the shield part, and the lead part through an opening provided on the insulating layer and opened in the insulating layer on the lead part A second circuit layer electrically connected to the shield portion, the lead portion being electrically insulated from the shield portion, and an end portion of the lead portion being electrically connected to the relay electrode , Of the shield part Parts are characterized by being electrically connected to the ground electrode.

本発明によれば、電磁シールドの設置スペースを回路層として有効利用することができる。そのため、実装面積が実質的に増大し、電子機器の小型化に寄与することができる。   According to the present invention, the installation space of the electromagnetic shield can be effectively used as a circuit layer. Therefore, the mounting area is substantially increased, which can contribute to downsizing of the electronic device.

本願発明の電磁シールドを備えた電子機器の平面図及び断面図である。It is the top view and sectional drawing of an electronic device provided with the electromagnetic shield of this invention. 電磁シールドの導電性フレームの平面図及び側面図である。It is the top view and side view of the electroconductive frame of an electromagnetic shield. 従来の電磁シールドを備えた電子機器の断面図である。It is sectional drawing of the electronic device provided with the conventional electromagnetic shield.

図１は本発明の一実施形態に係る電子機器１００の概略構成を示す模式図である。図１（ａ）は電子機器１００の基板垂直方向から見た平面図であり、図１（ｂ）は図１（ａ）のＡ−Ａ断面図である。   FIG. 1 is a schematic diagram showing a schematic configuration of an electronic device 100 according to an embodiment of the present invention. 1A is a plan view of the electronic device 100 as viewed from the direction perpendicular to the substrate, and FIG. 1B is a cross-sectional view taken along the line AA in FIG.

本実施形態の電子機器１００は、基板５と、基板５上に実装された電子部品３と、電子部品３を覆って電磁波を遮蔽する電磁シールド２０と、を有する。   The electronic device 100 of this embodiment includes a substrate 5, an electronic component 3 mounted on the substrate 5, and an electromagnetic shield 20 that covers the electronic component 3 and shields electromagnetic waves.

基板５は、ガラスエポキシ基板等からなり、公知のプリント配線基板等が用いられる。基板５の実装領域には、半導体ＩＣ等の高周波電子部品３が実装されており、電子部品３の実装領域の周囲には、第１中継電極６ａ、６ｂ、６ｃと、該第１中継電極６ａ、６ｂ、６ｃと電気的に接続された第１配線１６と、グラウンド電極１０と、を含む第１回路層が設けられている。第１配線１６には、基板５上に実装されたコンデンサや抵抗等の電子部品１５が電気的に接続されている。   The substrate 5 is made of a glass epoxy substrate or the like, and a known printed wiring board or the like is used. A high-frequency electronic component 3 such as a semiconductor IC is mounted on the mounting region of the substrate 5, and the first relay electrodes 6 a, 6 b and 6 c and the first relay electrode 6 a are mounted around the mounting region of the electronic component 3. , 6b, 6c, a first circuit layer including a first wiring 16 electrically connected to the ground electrode 10 is provided. Electronic components 15 such as capacitors and resistors mounted on the substrate 5 are electrically connected to the first wiring 16.

電磁シールド２０は、ワイヤ状に形成された導電性のリード部７と板状に形成された導電性のシールド部８とを有するフレーム１と、フレーム１のリード部７及びシールド部８を覆う樹脂フレーム（絶縁層）２と、樹脂フレーム２上に設けられた、第２中継電極１３ａ，１３ｂ，１３ｃ、外部端子１４及びこれらに電気的に接続された第２配線１１を含む第２回路層と、を備えている。   The electromagnetic shield 20 includes a frame 1 having a conductive lead portion 7 formed in a wire shape and a conductive shield portion 8 formed in a plate shape, and a resin that covers the lead portion 7 and the shield portion 8 of the frame 1. A second circuit layer including a frame (insulating layer) 2, a second relay electrode 13 a, 13 b, 13 c, an external terminal 14, and a second wiring 11 electrically connected thereto, provided on the resin frame 2; It is equipped with.

樹脂フレーム２には、リード部７と重なる位置に開口部１３Ｈが形成されており、該開口部１３Ｈを介して第２中継電極１３とリード部７とが電気的に接続されている。リード部７の端部は基板５上に設けられた第１中継電極６と接しており、これにより両者の導通が図られている。また、シールド部８の端部は基板５上に設けられたグラウンド電極１０と接しており、これにより両者の導通が図られている。第２配線１１には、樹脂フレーム２上に実装されたコンデンサや抵抗等の電子部品１２と接続されている。また、外部端子１４にはフレキシブルコネクタ（外部コネクタ）４が接続されている。   An opening 13H is formed in the resin frame 2 at a position overlapping the lead portion 7, and the second relay electrode 13 and the lead portion 7 are electrically connected through the opening 13H. The end portion of the lead portion 7 is in contact with the first relay electrode 6 provided on the substrate 5, thereby achieving electrical connection therebetween. Further, the end portion of the shield portion 8 is in contact with a ground electrode 10 provided on the substrate 5, thereby achieving electrical connection between them. The second wiring 11 is connected to an electronic component 12 such as a capacitor or a resistor mounted on the resin frame 2. A flexible connector (external connector) 4 is connected to the external terminal 14.

図２はフレーム１の概略構成を示す模式図である。図２（ａ）はフレーム１の基板垂直方向から見た平面図であり、図２（ｂ）は図２（ａ）のＢ−Ｂ矢視図である。   FIG. 2 is a schematic diagram showing a schematic configuration of the frame 1. 2A is a plan view of the frame 1 viewed from the direction perpendicular to the substrate, and FIG. 2B is a view taken along the line BB in FIG. 2A.

フレーム１は、天板部１ａと側壁部１ｂとを有する平面視矩形状の有頂筒状のキャップ構造を有する。第１リード部７ａ、第２リード部７ｂ、及び、第３リード部７ｃは、それぞれ天板部１ａの中央部から側壁部１ｂの外周端部に至るように短冊状（帯状）に複数設けられ、その側壁部１ｂ側の端部が基板５と接続する外部端子としてフレーム１の外周部に露出している。図２（ａ）では、第１リード部７ａをフレーム１の第１辺に沿って６本設け、第２リード部７ｂを第１辺と隣接する第２辺に沿って２本設け、第３リード部７ｃを第１辺と隣接し第２辺と対向する第３辺に沿って３本設けているが、各リード部７ａ，７ｂ，７ｃの設置位置及び本数はこれに限らない。   The frame 1 has a cap structure with a top cylindrical shape having a rectangular shape in plan view and having a top plate portion 1a and a side wall portion 1b. The first lead portion 7a, the second lead portion 7b, and the third lead portion 7c are each provided in a strip shape (band shape) so as to reach the outer peripheral end portion of the side wall portion 1b from the center portion of the top plate portion 1a. The end of the side wall 1b is exposed to the outer periphery of the frame 1 as an external terminal connected to the substrate 5. In FIG. 2A, six first lead portions 7a are provided along the first side of the frame 1, and two second lead portions 7b are provided along the second side adjacent to the first side. Three lead portions 7c are provided along the third side adjacent to the first side and facing the second side, but the installation positions and the number of the lead portions 7a, 7b, 7c are not limited thereto.

第１リード部７ａの本数は、基板５上の第１中継電極６ａの数及び樹脂フレーム２上の第２中継電極１３ａの数と同じである。第１リード部７ａと第１中継電極６ａ及び第２中継電極１３ａとはそれぞれ１対１に対応しており、第１リード部７ａの一端部は、対応する第１中継電極６ａ上に配置されてこれと電気的に接続され、第１リード部７ａの他端部は、対応する第２中継電極１３ａと接触し、これと電気的に接続されている。   The number of first lead portions 7 a is the same as the number of first relay electrodes 6 a on the substrate 5 and the number of second relay electrodes 13 a on the resin frame 2. The first lead portion 7a, the first relay electrode 6a, and the second relay electrode 13a correspond to each other one-to-one, and one end portion of the first lead portion 7a is disposed on the corresponding first relay electrode 6a. The other end of the first lead portion 7a is in contact with and electrically connected to the corresponding second relay electrode 13a.

第２リード部７ｂ及び第３リード部７ｃについても同様である。第２リード部７ｂの本数は、基板５上の第１中継電極６ｂの数及び樹脂フレーム２上の第２中継電極１３ｂの数と同じであり、各第２リード部７ｂの一端部は、対応する第１中継電極６ｂ上に配置されてこれと電気的に接続され、第２リード部７ｂの他端部は、対応する第２中継電極１３ｂと接触し、これと電気的に接続されている。第３リード部７ｃの本数は、基板５上の第１中継電極６ｃの数及び樹脂フレーム２上の第２中継電極１３ｃの数と同じであり、各第３リード部７ｃの一端部は、対応する第１中継電極６ｃ上に配置されてこれと電気的に接続され、第３リード部７ｃの他端部は、対応する第２中継電極１３ｃと接触し、これと電気的に接続されている。   The same applies to the second lead portion 7b and the third lead portion 7c. The number of the second lead portions 7b is the same as the number of the first relay electrodes 6b on the substrate 5 and the number of the second relay electrodes 13b on the resin frame 2, and one end portion of each second lead portion 7b corresponds to the number of the second lead portions 7b. The second lead portion 7b is in contact with and electrically connected to the corresponding second relay electrode 13b. The other end of the second lead portion 7b is disposed on the first relay electrode 6b and electrically connected thereto. . The number of third lead portions 7c is the same as the number of first relay electrodes 6c on the substrate 5 and the number of second relay electrodes 13c on the resin frame 2, and one end portion of each third lead portion 7c The other end of the third lead portion 7c is in contact with and electrically connected to the corresponding second relay electrode 13c. .

フレーム１の第１辺に設けられた複数の第１リード部７ａは、互いに接触しないように一定の間隔を空けて配置されている。隣接する第１リード部７ａ同士の間隔は、電磁遮蔽を行う対象となる電磁波がその隙間を通して侵入又は漏洩しないように、該電磁波の波長よりも十分に小さい間隔（例えば、電磁波の波長の半分以下の大きさ）とされている。   The plurality of first lead portions 7a provided on the first side of the frame 1 are arranged at a predetermined interval so as not to contact each other. The interval between the adjacent first lead portions 7a is sufficiently smaller than the wavelength of the electromagnetic wave (for example, less than half the wavelength of the electromagnetic wave so that the electromagnetic wave to be electromagnetically shielded does not enter or leak through the gap. ).

リード部７ａ，７ｂ，７ｃは、対応する第１中継電極６ａ，６ｂ，６ｃと第２中継電極１３ａ，１３ｂ，１３ｃとを電気的に接続するための接続配線として機能する。そのため、各リード部７ａ，７ｂ，７ｃは互いに電気的に絶縁されると共に、シールド部８とも電気的に絶縁されている。具体的には、フレーム１の天板部１ａの中央部に平面視矩形枠状の絶縁部９が設けられており、該絶縁部９の第１辺に第１リード部７ａの端部が接続され、該第１辺と隣接する第２辺に第２リード部７ｂが接続され、該第１辺と隣接し該第２辺と対向する第３辺に第３リード部７ｃの端部が接続され、さらに、リード部７ａ，７ｂ，７ｃの配置されていない領域（矩形枠状に形成された絶縁部９の枠内領域を含む）にシールド部８が設けられ、該シールド部８が絶縁部９と接続されている。   The lead portions 7a, 7b, 7c function as connection wirings for electrically connecting the corresponding first relay electrodes 6a, 6b, 6c and the second relay electrodes 13a, 13b, 13c. Therefore, each lead part 7a, 7b, 7c is electrically insulated from each other, and is also electrically insulated from the shield part 8. Specifically, an insulating portion 9 having a rectangular frame shape in plan view is provided at the center of the top plate portion 1 a of the frame 1, and the end of the first lead portion 7 a is connected to the first side of the insulating portion 9. The second lead portion 7b is connected to the second side adjacent to the first side, and the end portion of the third lead portion 7c is connected to the third side adjacent to the first side and facing the second side. Further, a shield portion 8 is provided in a region where the lead portions 7a, 7b, and 7c are not disposed (including a region in the frame of the insulating portion 9 formed in a rectangular frame shape), and the shield portion 8 is an insulating portion. 9 is connected.

リード部７ａ，７ｂ，７ｃ、シールド部８、及び、絶縁部９は、例えば、絶縁シートにＣｕや４２アロイ、ＳＵＳ等の金属板を貼り付けたものをプレス加工することにより、一体で形成される。樹脂フレーム２は、フレーム１上にインジェクション等により液晶ポリマー等の熱可塑性のエンジニアリングプラスチックやエポキシ樹脂等の熱硬化性樹脂等を配置することで形成される。本実施形態の場合、樹脂フレーム２は、フレーム１の天板部１ａ及び側壁部１ｂの全体を覆っているが、樹脂フレーム２は、フレーム１のリード部７ａ，７ｂ，７ｃ及びシールド部８の少なくとも一部を覆っていればよく、好ましくは、天板部１ａの全面を覆っているのが良い。天板部１ａの全面に樹脂フレーム２を設けることにより、第２配線や外部端子１４の設置面積（第２回路層の面積）を大きくすることが可能である。   The lead parts 7a, 7b, 7c, the shield part 8, and the insulating part 9 are integrally formed by, for example, pressing a metal sheet made of Cu, 42 alloy, SUS or the like attached to an insulating sheet. The The resin frame 2 is formed by placing a thermoplastic engineering plastic such as a liquid crystal polymer or a thermosetting resin such as an epoxy resin on the frame 1 by injection or the like. In the case of the present embodiment, the resin frame 2 covers the entire top plate portion 1 a and side wall portion 1 b of the frame 1, but the resin frame 2 includes the lead portions 7 a, 7 b, 7 c and the shield portion 8 of the frame 1. It is only necessary to cover at least a part, and it is preferable to cover the entire top plate portion 1a. By providing the resin frame 2 on the entire surface of the top plate portion 1a, it is possible to increase the installation area (area of the second circuit layer) of the second wiring and the external terminals 14.

樹脂フレーム２上の第２配線１１や外部端子１４は、導電性ペーストや、導電膜を成膜してエッチングすること等により形成され、第２配線１１上には必要に応じてレジスト等の保護膜が形成される。樹脂フレーム２の開口部１３Ｈは、レーザやドリル等により形成され、この開口部１３Ｈを介して第２配線１１とリード部７（７ａ，７ｂ，７ｃ）とを接続する第２中継電極１３（１３ａ，１３ｂ，１３ｃ）は、メッキや導電性ペースト等により形成される。フレーム１のリード部７及びシールド部８は、基板５上に設けられた第１中継電極６とリフロー等の方法により半田接続される。   The second wiring 11 and the external terminal 14 on the resin frame 2 are formed by forming a conductive paste, a conductive film, and etching, and protecting the second wiring 11 with a resist or the like as necessary. A film is formed. The opening 13H of the resin frame 2 is formed by a laser, a drill, or the like, and the second relay electrode 13 (13a) that connects the second wiring 11 and the lead portion 7 (7a, 7b, 7c) through the opening 13H. , 13b, 13c) are formed by plating, conductive paste or the like. The lead portion 7 and the shield portion 8 of the frame 1 are solder-connected to the first relay electrode 6 provided on the substrate 5 by a method such as reflow.

以上の構成を有する本実施形態の電子機器１００においては、電磁シールド２０のフレーム１の一部をワイヤ状に形成し、これを基板５上の第１回路層と樹脂フレーム２上の第２回路層とを接続する接続配線（リード部７ａ，７ｂ，７ｃ）として用いているため、電磁シールド２０の設置スペースを回路層として有効利用することができる。そのため、基板５上の実装面積を実質的に増大させることができ、電子機器の小型化に寄与することが可能となる。   In the electronic apparatus 100 of the present embodiment having the above configuration, a part of the frame 1 of the electromagnetic shield 20 is formed in a wire shape, and this is formed into a first circuit layer on the substrate 5 and a second circuit on the resin frame 2. Since it is used as connection wiring (lead portions 7a, 7b, 7c) for connecting the layers, the installation space of the electromagnetic shield 20 can be effectively used as a circuit layer. Therefore, the mounting area on the substrate 5 can be substantially increased, which can contribute to downsizing of the electronic device.

１…フレーム、１ａ…天板部、１ｂ…側壁部、２…樹脂フレーム（絶縁層）、３…電子部品、４…フレキシブルコネクタ（外部コネクタ）、５…基板、６，６ａ，６ｂ，６ｃ…第１中継電極、７，７ａ，７ｂ，７ｃ…リード部、８…シールド部、１０…グラウンド電極、１３Ｈ…開口部、１４…外部端子、２０…電磁シールド、１００…電子機器 DESCRIPTION OF SYMBOLS 1 ... Frame, 1a ... Top plate part, 1b ... Side wall part, 2 ... Resin frame (insulation layer), 3 ... Electronic component, 4 ... Flexible connector (external connector), 5 ... Board | substrate, 6, 6a, 6b, 6c ... 1st relay electrode, 7, 7a, 7b, 7c ... Lead part, 8 ... Shield part, 10 ... Ground electrode, 13H ... Opening part, 14 ... External terminal, 20 ... Electromagnetic shield, 100 ... Electronic equipment

Claims (8)

電磁波を遮蔽する電磁シールドであって、
導電性のリード部と導電性のシールド部とを有するフレームと、
前記リード部と前記シールド部との少なくとも一部を覆う絶縁層と、
前記絶縁層上に設けられ、前記リード部上の前記絶縁層に開口した開口部を介して前記リード部と電気的に接続された回路層と、を有し、
前記リード部は前記シールド部と電気的に絶縁され、前記リード部の端部が外部端子として前記フレームの外周部に露出していることを特徴とする電磁シールド。 An electromagnetic shield for shielding electromagnetic waves,
A frame having a conductive lead portion and a conductive shield portion;
An insulating layer covering at least a part of the lead portion and the shield portion;
A circuit layer provided on the insulating layer and electrically connected to the lead portion through an opening opening in the insulating layer on the lead portion;
The electromagnetic shield according to claim 1, wherein the lead portion is electrically insulated from the shield portion, and an end portion of the lead portion is exposed to an outer peripheral portion of the frame as an external terminal. 前記リード部は前記フレームの外周に沿って複数設けられ、隣接する前記リード部同士の間隔は前記電磁波の波長よりも短いことを特徴とする請求項１に記載の電磁シールド。   2. The electromagnetic shield according to claim 1, wherein a plurality of the lead portions are provided along an outer periphery of the frame, and an interval between the adjacent lead portions is shorter than a wavelength of the electromagnetic wave. 前記フレームは、天板部と側壁部とを有する有頂筒状に形成され、前記リード部は、前記天板部から前記側壁部の外周端部に至るように形成され、前記絶縁層は、前記フレームの天板部の上面全体に設けられていることを特徴とする請求項１又は２に記載の電磁シールド。   The frame is formed in a cylindrical shape having a top plate portion and a side wall portion, the lead portion is formed so as to reach the outer peripheral end portion of the side wall portion from the top plate portion, and the insulating layer is The electromagnetic shield according to claim 1, wherein the electromagnetic shield is provided on the entire top surface of the top plate portion of the frame. 前記回路層には外部端子が設けられていることを特徴とする請求項１〜３のいずれか１項に記載の電磁シールド。   The electromagnetic shield according to claim 1, wherein an external terminal is provided on the circuit layer. 基板と、前記基板の実装領域に実装された電子部品と、前記電子部品を覆って電磁波を遮蔽する電磁シールドと、を有する電子機器であって、
前記基板上の前記実装領域の周囲には、中継電極とグラウンド電極とを含む第１回路層が設けられ、
前記電磁シールドは、導電性のリード部と導電性のシールド部とを有するフレームと、前記リード部と前記シールド部との少なくとも一部を覆う絶縁層と、前記絶縁層上に設けられ、前記リード部上の前記絶縁層に開口した開口部を介して前記リード部と電気的に接続された第２回路層と、を有し、
前記リード部は前記シールド部と電気的に絶縁され、前記リード部の端部は前記中継電極と電気的に接続されていると共に、前記シールド部の端部は前記グラウンド電極と電気的に接続されていることを特徴とする電子機器。 An electronic device having a substrate, an electronic component mounted on the mounting region of the substrate, and an electromagnetic shield that covers the electronic component and shields electromagnetic waves,
A first circuit layer including a relay electrode and a ground electrode is provided around the mounting area on the substrate,
The electromagnetic shield is provided on the insulating layer, a frame having a conductive lead portion and a conductive shield portion, an insulating layer covering at least a part of the lead portion and the shield portion, and the lead A second circuit layer electrically connected to the lead portion through an opening opened in the insulating layer on the portion,
The lead portion is electrically insulated from the shield portion, the end portion of the lead portion is electrically connected to the relay electrode, and the end portion of the shield portion is electrically connected to the ground electrode. An electronic device characterized by that. 前記リード部は前記フレームの外周に沿って複数設けられ、隣接する前記リード部同士の間隔は前記電磁波の波長よりも短いことを特徴とする請求項５に記載の電子機器。   The electronic device according to claim 5, wherein a plurality of the lead portions are provided along an outer periphery of the frame, and an interval between the adjacent lead portions is shorter than a wavelength of the electromagnetic wave. 前記フレームは天板部と側壁部とを有する有頂筒状に形成され、前記リード部は前記天板部から前記側壁部の外周端部に至るように形成され、前記絶縁層は前記フレームの天板部の上面全体に設けられていることを特徴とする請求項５又は６に記載の電子機器。   The frame is formed in a cylindrical shape having a top plate portion and a side wall portion, the lead portion is formed so as to extend from the top plate portion to an outer peripheral end portion of the side wall portion, and the insulating layer is formed on the frame. The electronic device according to claim 5, wherein the electronic device is provided on the entire top surface of the top plate portion. 前記第２回路層には、外部コネクタと接続する外部端子が設けられていることを特徴とする請求項５〜７のいずれか１項に記載の電子機器。   The electronic device according to claim 5, wherein an external terminal connected to an external connector is provided in the second circuit layer.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0361393U (en) * 1989-10-20 1991-06-17
JPH04229691A (en) * 1990-12-04 1992-08-19 Mitsubishi Electric Corp Wiring board and its manufacture
JPH08204305A (en) * 1995-01-31 1996-08-09 Sanyo Electric Co Ltd Hybrid integrated circuit device
JP2006253170A (en) * 2005-03-08 2006-09-21 Matsushita Electric Ind Co Ltd Circuit device and portable terminal circuit device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0361393U (en) * 1989-10-20 1991-06-17
JPH04229691A (en) * 1990-12-04 1992-08-19 Mitsubishi Electric Corp Wiring board and its manufacture
JPH08204305A (en) * 1995-01-31 1996-08-09 Sanyo Electric Co Ltd Hybrid integrated circuit device
JP2006253170A (en) * 2005-03-08 2006-09-21 Matsushita Electric Ind Co Ltd Circuit device and portable terminal circuit device

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