JP2011077169A5 - - Google Patents

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Publication number
JP2011077169A5
JP2011077169A5 JP2009225056A JP2009225056A JP2011077169A5 JP 2011077169 A5 JP2011077169 A5 JP 2011077169A5 JP 2009225056 A JP2009225056 A JP 2009225056A JP 2009225056 A JP2009225056 A JP 2009225056A JP 2011077169 A5 JP2011077169 A5 JP 2011077169A5
Authority
JP
Japan
Prior art keywords
wire
bonding wires
liquid resin
wrf
wrs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009225056A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011077169A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009225056A priority Critical patent/JP2011077169A/ja
Priority claimed from JP2009225056A external-priority patent/JP2011077169A/ja
Priority to US12/608,712 priority patent/US7943433B2/en
Publication of JP2011077169A publication Critical patent/JP2011077169A/ja
Publication of JP2011077169A5 publication Critical patent/JP2011077169A5/ja
Pending legal-status Critical Current

Links

JP2009225056A 2008-11-13 2009-09-29 半導体装置の製造方法 Pending JP2011077169A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009225056A JP2011077169A (ja) 2009-09-29 2009-09-29 半導体装置の製造方法
US12/608,712 US7943433B2 (en) 2008-11-13 2009-10-29 Method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009225056A JP2011077169A (ja) 2009-09-29 2009-09-29 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2011077169A JP2011077169A (ja) 2011-04-14
JP2011077169A5 true JP2011077169A5 (cg-RX-API-DMAC7.html) 2012-06-21

Family

ID=44020870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009225056A Pending JP2011077169A (ja) 2008-11-13 2009-09-29 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2011077169A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111834323B (zh) * 2020-07-29 2025-08-19 北京燕东微电子科技有限公司 一种半导体封装件及其制造方法
WO2025074951A1 (ja) * 2023-10-04 2025-04-10 ローム株式会社 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167808A (ja) * 1997-08-21 1999-03-09 Hitachi Ltd 半導体装置の製造方法および半導体装置
JP4957513B2 (ja) * 2007-11-05 2012-06-20 富士通セミコンダクター株式会社 半導体装置及び半導体装置の製造方法

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