JP2011075185A - Constant-temperature storage - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a constant-temperature storage which drastically reduces an electric power consumption amount and achieves highly accurate temperature control. <P>SOLUTION: The constant-temperature storage 1 includes a refrigerant circuit 18 constituted by sequentially interconnecting a compressor 20, a radiator 23, an expansion valve 27 and a cooler 10. A storage chamber 6 within a heat insulating casing 2 is cooled by cooling action by the cooler 10 and inside of the storage chamber 6 is heated by a heating means, so as to control the inside of the storage chamber 6 to a set temperature. The constant-temperature storage 1 further includes: a heater 11 in which a high temperature refrigerant discharged from the compressor 20 is circulated; and a solenoid valve 22 controlling the supply of the high temperature refrigerant to the heater 11. At least part of the heating means is constituted of the heater 11. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a thermostatic chamber which is adjusted to a set temperature by cooling a storage chamber in a heat insulation box with a cooler and heating with a heating means, and in particular, an electric component such as a hard disk or a precision component is set at a set temperature. This is related to a constant temperature chamber for testing.

  In the production process of electrical parts such as hard disks and precision parts, various tests are carried out in order to maintain the quality of the electrical parts and precision parts above a certain level. Among these, this type of thermostatic chamber is used when performing a temperature test. Such a thermostatic chamber realizes a predetermined temperature in a predetermined time schedule for the article to be tested, so that the temperature in the storage chamber is precisely managed.

  In the conventional thermostatic chamber, an air circulation path is formed in a cabinet configured in a heat insulating box, and air circulation in the cabinet is performed by a circulation fan. In the air circulation path, a cooler and a heater are arranged. Based on the output of the temperature detector, the cooler and the heater are controlled, so that the inside of the cabinet has a desired temperature, for example, 0 ° C. to + 60 ° C. (See, for example, Patent Document 1).

Japanese Patent No. 3863784

  In the conventional thermostat as described above, a cooling unit is used to lower the internal temperature, and a heater as a heating means is used to increase the internal temperature. The cooling unit is composed of a compressor, a condenser, a decompression means, a cooler, a condenser blower, and the like, and air containing waste heat from the compressor and the condenser is placed in the room where the thermostat is installed. Released.

  As described above, in such a thermostatic chamber, in the test of electrical parts such as a hard disk, the temperature is adjusted to, for example, 0 ° C. to + 60 ° C., so that the power consumption of the heater during heating becomes enormous. Therefore, it has been desired to develop a thermostatic chamber that can reduce the power consumption of the heater and save energy.

  The present invention has been made in order to solve the conventional technical problem, and provides a thermostatic chamber that can realize a significant reduction in power consumption and can realize highly accurate temperature control. .

  In order to solve the above-described problems, the thermostatic chamber of the present invention includes a refrigerant circuit formed by sequentially connecting a compressor, a heat radiating device, a decompression device, and a cooler, and is a storage chamber in a heat insulating box by a cooling action by the cooler. And the heating chamber is heated by the heating means to control the storage chamber to a set temperature, and a high-temperature refrigerant discharged from the compressor is circulated to the heater. And a valve device for controlling the supply of the high-temperature refrigerant. At least a part of the heating means is configured by a heater.

  The invention of claim 2 comprises a refrigerant cooling circuit for passing the high-temperature refrigerant discharged from the compressor through the heat radiating device to cool it once, returning it to the compressor and discharging it again to the heat radiating device in the above invention, The high-temperature refrigerant diverted from the refrigerant cooling circuit before passing through the heat dissipation device is circulated through the heater.

  According to a third aspect of the present invention, in each of the above-described inventions, after the refrigerant discharged from the heat radiating device is diverted and depressurized, the bypass circuit is joined with the return refrigerant from the cooler, and the flow of the refrigerant to the bypass circuit is controlled. A valve device is provided, and the return refrigerant from the heater is joined to the bypass circuit.

  The invention of claim 4 is characterized in that, in each of the above inventions, the return refrigerant from the heater is passed through the upper part of the cooler.

  The invention of claim 5 is characterized in that, in each of the above inventions, the return refrigerant from the heater exchanges heat with the return refrigerant from the cooler.

  The invention of claim 6 is characterized in that, in each of the above inventions, the heat dissipation device is a water-cooled heat dissipation device that cools the high-temperature refrigerant with cooling water.

  The invention of claim 7 comprises, in each of the above-mentioned inventions, a control means for controlling the compressor and each valve device, and a temperature detection means for detecting the temperature in the containing chamber, and the control means provides an output of the temperature detection means. On the basis of this, the temperature in the storage chamber is controlled to a preset temperature between a predetermined low temperature and a high temperature.

  The invention of claim 8 is characterized in that, in the above invention, the control means changes the temperature in the accommodation chamber with a preset temperature gradient based on the output of the temperature detection means.

  The invention of claim 9 is the bypass according to the invention of claim 7 or claim 8, wherein the refrigerant discharged from the heat radiating device is diverted and depressurized, and then the heat is exchanged with the return refrigerant from the cooler and then returned to the compressor. And a valve device that controls the flow of the refrigerant to the bypass circuit, and the control means supplies the refrigerant to the bypass circuit by the valve device when the temperature in the accommodation chamber is equal to or higher than a predetermined temperature based on the output of the temperature detection means. It is characterized by flowing.

  The invention of claim 10 is characterized in that, in each of the above inventions, carbon dioxide is used as a refrigerant to be sealed in the refrigerant circuit.

  According to the present invention, a refrigerant circuit comprising a compressor, a heat radiating device, a decompression device, and a cooler connected in sequence is provided, the housing chamber in the heat insulation box is cooled by the cooling action of the cooler, and is accommodated by the heating means. A heater that controls the interior of the storage room to a set temperature by heating the room, and that controls the supply of the high-temperature refrigerant to the heater, in which the high-temperature refrigerant discharged from the compressor is circulated. And adjusting the cooling capacity of the cooler and the heating capacity of the heating means to adjust the temperature in the storage room to the set temperature with high accuracy. In this case, a part of the heating capacity of the heating means is borne by the heater in which the high-temperature refrigerant discharged from the compressor is circulated, thereby reducing the capacity of other heating means, for example, the heater, that is, reducing the power consumption. Possible and That.

  As a result, it is possible to realize a significant reduction in power consumption and to realize highly accurate temperature control.

  According to the invention of claim 2, in the above, the refrigerant cooling circuit for passing the high-temperature refrigerant discharged from the compressor through the heat radiating device, once cooling it, returning it to the compressor, and discharging it again to the heat radiating device It is possible to circulate the hottest refrigerant discharged from the compressor to the heater by circulating the high-temperature refrigerant diverted from the refrigerant cooling circuit before passing through the heat dissipation device to the heater, The heating efficiency by the heater can be improved.

  According to the invention of claim 3, in addition to each of the above-described inventions, after the refrigerant discharged from the heat dissipation device is diverted and depressurized, the bypass circuit that joins the return refrigerant from the cooler, and the refrigerant to the bypass circuit With a valve device that controls the flow, the refrigerant radiated from the heater is decompressed together with the refrigerant flowing through the bypass circuit by merging the return refrigerant from the heater into the bypass circuit, and then from the cooler. It becomes possible to merge with the return refrigerant. Thereby, the problem that the liquid refrigerant flows into the compressor can be solved.

  According to the invention of claim 4, in addition to the above inventions, the return refrigerant from the heater is passed through the upper part of the cooler so that the return refrigerant from the heater exchanges heat with the refrigerant at the upper part of the cooler. Thus, the return refrigerant from the heater can be prevented from returning at a high temperature. As a result, it is possible to prevent inconvenience that the high-temperature refrigerant flows to the valve device that is provided downstream of the heater and controls the supply of the high-temperature refrigerant to the heater. It can be avoided.

  According to the invention of claim 5, in addition to each of the above inventions, the return refrigerant from the heater is heat-exchanged with the return refrigerant from the cooler, thereby returning the return refrigerant from the heater as in the case of claim 4. Can be prevented from returning at a high temperature. In this case, since the return refrigerant from the heater and the return refrigerant from the cooler are heat-exchanged, the cooling capacity of the cooler can be prevented from being affected.

  According to invention of Claim 6, in addition to said each invention, a heat radiating device is a water-cooling type heat radiating device which cools a high temperature refrigerant | coolant with cooling water, Therefore A heat radiating device is provided in the environment where the said thermostat is installed. It is possible to eliminate the inconvenience of waste heat from the exhaust. In addition, the cooling capacity of the heat radiating device can be secured by the water-cooled heat radiating device without being affected by the temperature of the environment where the thermostatic chamber is installed, and smooth temperature control can be realized. Furthermore, the air conditioning load of the environment where the thermostat is installed can be reduced, and energy saving can be achieved as a whole.

  According to the invention of claim 7, in addition to the above inventions, the compressor and the control means for controlling each valve device, and the temperature detection means for detecting the temperature in the housing chamber are provided, and the control means comprises temperature detection Based on the output of the means, the temperature in the storage chamber is controlled to a preset temperature between a predetermined low temperature and a high temperature, thereby adjusting the cooling capacity by the cooler and the heating capacity by the heating means to achieve high accuracy. The temperature in the storage room can be adjusted to the set temperature.

  According to the invention of claim 8, in addition to the above-mentioned invention, the control means changes the temperature in the accommodation chamber with a preset temperature gradient based on the output of the temperature detection means, thereby increasing the temperature in the accommodation chamber. For example, the dew condensation which adheres to the wall surface of a storage room, etc. which arises by rapidly cooling to low temperature can be prevented.

  Thereby, even when an electrical component such as a hard disk that dislikes water is stored in the storage chamber, the inconvenience of water adhering to the stored article can be eliminated, and a stable temperature test can be realized.

  According to the invention of claim 9, in the invention of claim 7 or claim 8, after the refrigerant discharged from the heat radiating device is diverted and depressurized, the refrigerant is returned to the return refrigerant from the cooler and then exchanged with heat. A bypass circuit for returning and a valve device for controlling the flow of the refrigerant to the bypass circuit, and the control means, based on the output of the temperature detection means, when the temperature in the accommodation chamber is equal to or higher than a predetermined temperature, The refrigerant flow rate is limited by restricting the refrigerant flow rate to the cooler.

  Thereby, especially when the temperature in the storage room rises, if the cooling capacity by the cooler is superior to the heating capacity by the heating means, the capacity of the heating means has to be further increased in order to further increase the temperature in the storage room. It can be suppressed by limiting the refrigerant flow rate to the cooler. Thereby, it becomes possible to reduce the energization amount of the heating means comprised, for example with a heater.

  In particular, as in the tenth aspect of the invention, by using carbon dioxide as the refrigerant to be sealed in the refrigerant circuit, the refrigerant whose high pressure side becomes supercritical pressure and becomes high temperature can be supplied to the heater, thereby improving the heating capacity. Will be able to.

It is a schematic block diagram of the thermostat of a present Example. Example 1 It is a figure which shows the time schedule as an example. 3 is a timing chart in the case of FIG. It is a schematic block diagram of the thermostat of another Example. (Example 2)

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic configuration diagram of a thermostatic chamber 1. The constant temperature chamber 1 in the present embodiment is used when a temperature-related test is performed in the production process of electrical parts such as hard disks and precision parts. The upper part of the thermostatic chamber 1 is composed of a heat insulating box 2 having an opening on the front surface, and the front opening is used as an article delivery outlet for delivering articles such as hard disks and can be opened and closed by a heat insulating door (not shown). Obstructed.

  A partition plate 4 is attached to the back of the heat insulation box 2 and the inside of the top surface with a space therebetween, and a duct 5 is provided between the back and top of the heat insulation box 2 and the partition plate 4. Is formed. The inner side of the partition plate 4 is a storage chamber 6. A circulation fan 15 is disposed in the duct 5, and the air in the duct 5 and the accommodation chamber 6 is circulated by the circulation fan 15. In the storage chamber 6, shelves 8 for placing articles in a plurality of stages are installed vertically. In the duct 5, a cooler 10 and a heater 11 and a heater 12 constituting heating means are disposed, and the circulating air is cooled or heated to adjust to a predetermined set temperature.

  Here, in the present embodiment, the cooler 10 is disposed on the upstream side of the air circulation in the duct 5, and the heater 12 is disposed on the downstream side. And the heater 11 is arrange | positioned between the cooler 10 and the heater 12 in consideration of these thermal efficiencies. Note that a plurality of heaters 12 may be provided, and the heating capacity of the heater may be adjusted by adjusting the number of heaters to be energized, and the heater may be heated by controlling the energization amount to a single heater. The ability may be adjusted.

  A temperature sensor (temperature detection means) 14 for detecting the temperature in the storage chamber 6 is disposed on the circulating air discharge port side from the duct 5 in the storage chamber 6. A control panel (not shown) is connected to the control device C constituted by a general-purpose microcomputer, and the set temperature in the storage chamber 6 can be set by the control panel. The control device C is a first valve device that controls the compressor 20 constituting the refrigeration cycle together with the cooler 10 and the refrigerant flow rate to the cooler 10 so that the detection value of the temperature sensor 14 becomes a set value. The electromagnetic valve 21, the second electromagnetic valve 22 as a valve device that controls the flow rate of the refrigerant to the heater 11, and the heater 12 are controlled. Thereby, the inside of the storage chamber 6 is precisely controlled between a predetermined low temperature and a high temperature, for example, between 0 ° C. and + 60 ° C. or −10 ° C. to + 70 ° C. according to the time schedule.

  On the other hand, a machine room 17 is defined in the lower part of the thermostatic chamber 1, that is, below the heat insulating box 2. The machine room 17 accommodates a compressor 20, a radiator 23, a radiator fan 24, and the like that constitute a refrigeration cycle together with the cooler 10. In the present embodiment, the radiator 23 and the radiator fan 24 constitute a radiator, but the radiator is not limited to this, and a water-cooled radiator that cools a high-temperature refrigerant with cooling water. May be adopted.

  Here, the refrigerant circuit 18 of the present embodiment will be described with reference to FIG. The refrigerant circuit 18 in the present embodiment connects the compressor 20, the radiator 23, the receiver tank 25, the dry core 26, the expansion valve 27 as a pressure reducing device, the cooler 10, the accumulator 28, and the like in an annular shape. It is comprised by. The expansion valve 27 in the present embodiment employs a constant pressure expansion valve for making the pressure on the suction side of the compressor 20 constant, and the detected value from the low pressure gauge 31 provided on the low pressure side of the compressor 20 is used. The opening degree is controlled based on this.

  The refrigerant discharge pipe 20 </ b> A of the compressor 20 is connected to the inlet side of the radiator 23, and the receiver tank 23 and the dry core 26 are sequentially connected to the outlet side of the radiator 23. An internal heat exchanger 33 is provided between the dry core 26 and the expansion valve 27, and heat is exchanged between the refrigerant cooled by the radiator 23 and the return refrigerant from the cooler 10. ing. Thereby, the refrigerant cooled by the radiator 23 is further cooled by the return refrigerant from the cooler 10.

  In addition, the refrigerant circuit 18 is provided with a bypass circuit 35 that diverts the refrigerant from the radiator 23 and decompresses it with the decompression device, in this case, the capillary tube 34, and then merges with the return refrigerant from the cooler 10. It has been. The bypass circuit 35 is divided by a flow divider 36 provided on the refrigerant downstream side of the dry core 26 and upstream of the heat exchanger 33 before flowing into the expansion valve 27, and is downstream of the cooler 10. They are merged by a merger 37 provided on the upstream side of the heat exchanger 33 through which the return refrigerant from the cooler 10 flows. The bypass circuit 35 is provided with a first electromagnetic valve 21 upstream of the refrigerant in the capillary tube 34, and the flow of the refrigerant to the bypass circuit 35 is controlled by opening / closing control of the first electromagnetic valve 21. .

  The compressor 20 of the present embodiment employs an internal high-pressure compressor, passes the high-temperature refrigerant discharged from the compressor 20 through the radiator 23, temporarily cools it, returns it to the compressor 20, and then releases heat again. A refrigerant cooling circuit 30 for discharging to the vessel 23 is provided, in this case a desuperheater.

  A flow divider 38 is provided on the upstream side of the radiator 23 of the refrigerant cooling circuit 30, and a hot gas circuit 39 is connected to the flow divider 38. In the hot gas circuit 39, the heater 11, the second electromagnetic valve 22 for controlling the supply of the high-temperature refrigerant to the hot gas circuit 39 (heater 11), and the check valve 40 are sequentially connected. Thus, the return refrigerant from the heater 11 is joined to the bypass circuit 35 via the merger 41 provided in the bypass circuit 35.

  The check valve 40 has a forward direction from the heater 11 toward the bypass circuit 35. A junction 41 with the hot gas circuit 39 provided in the bypass circuit 35 is provided between the first electromagnetic valve 21 and the capillary tube 34 of the bypass circuit 35.

  In the present embodiment, the return pipe 39A from the heater 11 connected to the refrigerant outflow side of the heater 11 and the other end connected to the second electromagnetic valve 22 is connected to the return refrigerant from the heater 11. A heat exchanger 43 for exchanging heat with the return refrigerant from the cooler 10 is provided. Note that the heat exchanger 43 may simply be provided in a heat exchange state in which the return pipe 39A from the heater 11 and the return pipe 10A from the cooler 10 are joined together by soldering or the like. And

  With the above configuration, the operation of the thermostatic chamber 1 according to a time schedule given as an example as shown in FIG. 2 will be described. Since the constant temperature chamber 1 in this embodiment is for testing electrical parts such as hard disks and precision parts at a set temperature as described above, the air is adjusted to a predetermined temperature range, for example, + 25 ° C. to + 35 ° C. It shall be installed in a factory. When testing a test part such as an electrical part or a precision part in the thermostatic chamber 1, the test part is stored on the shelf 8 in the storage chamber 6 and detected by the temperature sensor 14 according to a predetermined time schedule. The temperature in the storage chamber 6 is adjusted by the cooler 10, the heater 11, and the heater 12 so that the temperature becomes a predetermined temperature. The test is performed in a state where the test part is in operation. In FIG. 2, it cools to 0 degreeC with the substantially uniform temperature gradient over 25 minutes from the state of room temperature (for example, +25 degreeC) (at the time of cooling transition), and maintains 0 degreeC for 45 minutes (at the time of cooling stable). Thereafter, heating is performed from 0 ° C. to + 60 ° C. with a substantially uniform temperature gradient over 90 minutes (at the time of heating transition), and maintained at + 60 ° C. for 75 minutes (when heating is stable). Thereafter, it is cooled from + 60 ° C. to + 30 ° C. with a substantially uniform temperature gradient over 80 minutes (at the time of cooling transition), and then maintained at + 30 ° C. (when the room temperature is stable).

  In this embodiment, when changing the temperature, the temperature is changed with a preset temperature gradient over a predetermined time based on the detection output of the temperature sensor 14. This is because it is a test product stored in the storage chamber 6, and therefore it is necessary to perform a test in the same environment. In addition, it dislikes condensation because it is a device such as electrical parts and precision parts. A sudden temperature change causes the formation of condensation in the accommodation chamber 6, and therefore, a control for realizing such a slow temperature change is performed.

  The control device C shifts from the predetermined low temperature state to the predetermined high temperature state at the time of cooling transition to shift from the normal temperature or the predetermined high temperature state to the predetermined low temperature state as described above, and at the time of cooling stable to maintain the predetermined low temperature state. The cooling action by the cooler 10 and the heating action by the heater 11 and the heater 12 are performed at the time of heating transition, at the time of stable heating for maintaining a predetermined high temperature state, and at the normal temperature stable state for maintaining a predetermined normal temperature (medium temperature). The compressor 20 is continuously operated so as to realize a set temperature by controlling with high accuracy. Accordingly, the fan motor 24M of the radiator fan 24 and the fan motor 15M of the air circulation fan 15 are continuously operated.

  Thus, when the compressor 20 is operated by the control device C, the high-temperature and high-pressure gas refrigerant discharged from the compressor 20 is first discharged to the refrigerant cooling circuit (dissuperheater) 30 and passed through the radiator 23. Once cooled and returned to the compressor 20. Then, it is discharged again from the discharge side of the compressor 20 and flows to the radiator 23. Since the radiator blower 24 is provided in the vicinity of the radiator 23, the high-temperature and high-pressure gas refrigerant that has flowed into the radiator 23 is air-cooled and condensed to form a liquid refrigerant that sequentially passes through the receiver tank 23 and the dry core 26. Then, the constant pressure expansion valve 27 is reached. The refrigerant depressurized by the expansion valve 27 flows into the cooler 10 and evaporates, and at that time, absorbs heat from the surroundings to exert a cooling action. Thereby, the air in the duct 5 is cooled.

  The low-temperature gas refrigerant flowing out of the cooler 10 exchanges heat with the refrigerant before being decompressed by the expansion valve 27 in the internal heat exchanger 33, and supercools the refrigerant flowing into the expansion valve 27. Thereafter, the circulation that is sucked into the suction side of the compressor 20 through the accumulator 28 is repeated.

  On the other hand, if only the cooling action of the cooler 10 by the operation of the compressor 20 is exhibited, the temperature in the storage chamber 6 rapidly decreases, and the storage chamber 6 has a preset temperature gradient as described above. The temperature inside cannot be changed. Therefore, adjustment of the cooling capacity in the cooler 10 is performed, for example, when the temperature in the housing chamber 6 is equal to or higher than a predetermined temperature (t ° C., ON / OFF set temperature of the first electromagnetic valve 21. As an example, + 32 ° C.). The first first solenoid valve 21 is opened, and a part of the refrigerant flowing into the cooler 10 is caused to flow to the bypass circuit 35 to lower the cooling capacity. And by using together the heating in the storage chamber 6 by a heating means, the temperature in the storage chamber 6 is changed with a predetermined temperature gradient with high accuracy, or is maintained at a predetermined temperature.

  The control device C controls the heating capability of the heating unit so that the cooling capability by the cooler 10 is superior to the heating capability by the heating unit at the time of cooling transition, and the heating capability by the heating unit is cooled at the transition of heating. The heating capability of the heating means is controlled so as to be superior to the cooling capability of the vessel 10.

  Here, control of each device will be described along the time schedule of FIG. In a state where the test parts are stored in the storage chamber 6, when the temperature in the storage chamber 6 is equal to or lower than the predetermined temperature t ° C. (+ 32 ° C.), the control device C closes the first electromagnetic valve 21. Thereby, at the time of cooling transition, the refrigerant discharged from the refrigerant discharge pipe 20A of the compressor 20 and allowed to cool (condensate) by the radiator 23 is decompressed by the constant pressure expansion valve 27 and evaporated by the cooler 10. To do.

  At this time, the controller C has the second electromagnetic valve 22 that controls the supply of the high-temperature refrigerant to the heater 11 closed, and the heater C is determined from the reached temperature and time based on the temperature detected by the temperature sensor 14. 12 is PID controlled. As a result, the heater 12 is energized (for example, ON / OFF control) based on the set temperature gradient, so that the interior of the storage chamber 6 is cooled to achieve the temperature gradient.

  Even in the case of transition from cooling transition to cooling stabilization, the interior of the storage chamber 6 is similarly adjusted to a predetermined low temperature (in this case 0 ° C.) by adjusting the cooling action by the cooler 10 and the heating action to the heater 12. ) For a predetermined time.

  In the case of transition from the stable cooling time to the warming transition time, when the temperature in the storage chamber 6 is equal to or lower than the predetermined temperature t ° C. (+ 32 ° C.), the controller C keeps the first electromagnetic valve 21 closed. The high temperature refrigerant is supplied to the heater 11 by opening the second electromagnetic valve 22 provided in the hot gas circuit 39. As a result, the high-temperature refrigerant that is diverted from the refrigerant cooling circuit 30 before passing through the radiator 23 by the flow divider 38 and flows into the hot gas circuit 39, for example, high-temperature refrigerant of about + 80 ° C. to + 110 ° C. is supplied to the heater 11. At that time, heat is released by releasing heat to the surroundings, and the air in the duct 5 is heated. In addition to the heating action of the heater 11, the control device C outputs the output of the temperature sensor 14 that detects the temperature in the storage chamber 6 together with the heater 12 that constitutes the heating means, the reached temperature, and the time. Is energized to the heater 12 by PID control. As a result, the temperature in the accommodation chamber rises with a predetermined temperature gradient.

  At this time, in the present invention, since the heating means is configured together with the heater 12 by the heater 11 in which the high-temperature refrigerant from the compressor 20 is circulated, the cooling capacity by the cooler 10 and the heating capacity by the heating means are adjusted. When the temperature in the storage chamber 6 is adjusted to the set temperature with high accuracy, the heater 11 bears a part of the heating capability of the heating means, so that other heating means, in this embodiment, the heater 12 is used. It is possible to reduce the power consumption, that is, to reduce the power consumption and the number of installations. As a result, it is possible to realize a significant reduction in power consumption and to realize highly accurate temperature control.

  Further, in the present embodiment, the highest temperature refrigerant (+ 80 ° C.) discharged from the compressor 20 is circulated through the heater 11 by circulating the high temperature refrigerant diverted from the refrigerant cooling circuit 30 before passing through the radiator 23. ˜ + 110 ° C.) can be circulated through the heater 11, and the heating efficiency of the heater 11 can be improved.

  The high-temperature return refrigerant from the heater 11 is cooled by exchanging heat with the return refrigerant from the cooler 10 in the heat exchanger 43. Thereby, the return refrigerant from the heater 11 in a state cooled to, for example, about + 60 ° C. passes through the second electromagnetic valve 22. Thereby, the problem that the electromagnetic valve 22 breaks down due to heat can be avoided. In this case, since the return refrigerant from the heater 11 and the return refrigerant from the cooler 10 are heat-exchanged, the cooling capacity of the cooler 10 can be prevented from being affected.

  The return refrigerant from the heater 11 that has passed through the second electromagnetic valve 22 reaches the merger 41 of the bypass circuit 35 via the check valve 40 and is decompressed by the capillary tube 34 provided in the bypass circuit 35. After that, the merger 37 merges with the return refrigerant from the cooler 10. Thereby, the pressure difference between the return refrigerant from the cooler 10 and the return refrigerant from the heater 11 in the merger 37 can be reduced, and the disadvantage that the liquid refrigerant flows into the compressor 20 can be eliminated. it can.

  When the temperature in the storage chamber 6 reaches the predetermined temperature t ° C. (+ 32 ° C.) or more during such heating transition, the control device C opens the first electromagnetic valve 21 and exits from the radiator 23. A part of the refrigerant is diverted to the bypass circuit 35. In this case, the refrigerant flowing into the bypass circuit 35 merges with the return refrigerant from the heater 11 in the merger 41, and then is depressurized in the capillary tube 34, and the return refrigerant from the cooler 10 in the merger 37. To join.

  Thus, when the temperature in the storage chamber 6 is equal to or higher than a predetermined temperature (t ° C.), the refrigerant flow rate to the cooler 10 is caused by opening the first electromagnetic valve 21 and flowing the refrigerant through the bypass circuit 35. Can be limited. Therefore, especially when the temperature in the storage chamber 6 rises, if the cooling capacity by the cooler 10 is superior to the heating capacity by the heating means, the capacity of the heating means must be further increased to further increase the temperature in the storage chamber 6. It can be suppressed by limiting the flow rate of the refrigerant to the cooler 10. Thereby, the energization amount of the heater 12 can be reduced.

  Even in the case of transition from heating transition to stable heating, the interior of the storage chamber 6 is similarly adjusted to a predetermined high temperature (by adjusting the cooling action by the cooler 10 and the heating action to the heater 11 and the heater 12). In this case, the temperature is maintained at + 60 ° C. for a predetermined time.

  When the transition is made from the stable heating time to the cooling transition time, the temperature in the storage chamber 6 is equal to or higher than the predetermined temperature t ° C. (+ 32 ° C.), so that the control device C opens the first electromagnetic valve 21. And the cooling capacity in the cooler 10 is limited. And the 2nd solenoid valve 22 provided in the hot gas circuit 39 is closed, and supply of the high temperature refrigerant | coolant to the heater 11 is stopped. As a result, the PID control is performed on the energization amount to the heater 12 from the output of the temperature sensor 14 that detects the temperature in the storage chamber 6, the reached temperature, and the time, while restricting the refrigerant flow rate to the cooler 10. Thereby, the temperature in the storage chamber 6 can be lowered with a predetermined temperature gradient.

  When the temperature in the storage chamber 6 becomes equal to or lower than the predetermined temperature (t ° C.) during the cooling transition, the first electromagnetic valve 21 is closed and the restriction on the refrigerant flow rate to the cooler 10 is released. Thereafter, the PID control is performed on the amount of energization to the heater 12 from the output of the temperature sensor 14 that detects the temperature in the storage chamber 6 and the reached temperature and time, so that the temperature in the storage chamber 6 is maintained at a predetermined temperature gradient. Can be lowered.

  Thus, in the thermostat 1 in the present embodiment, the control device C changes the temperature in the storage chamber 6 from a predetermined low temperature to a high temperature based on the output of the temperature sensor 14 that detects the temperature in the storage chamber 6. The temperature in the storage chamber 6 is adjusted to the set temperature with high accuracy by adjusting the cooling capacity by the cooler 10 and the heating capacity by the heater 11 and the heater 12 by controlling to a preset temperature. It becomes possible to do.

  At this time, the control device C changes the temperature in the storage chamber 6 at a preset gentle temperature gradient based on the output of the temperature sensor 14, thereby rapidly changing the temperature in the storage chamber 6 from a high temperature to a low temperature. For example, the dew condensation which adheres to the inner wall surface of the storage chamber 6 caused by cooling can be prevented.

  As a result, even when an electrical component such as a hard disk that dislikes water is stored in the storage chamber 6 as in this embodiment, the problem of water adhering to the stored article can be eliminated, and a stable temperature test can be realized. be able to.

  In the above embodiment, the means for cooling the return refrigerant from the heater 11 is provided with the heat exchanger 43 for exchanging heat with the return refrigerant from the cooler 10, but is not limited thereto. For example, as shown in FIG. 4, a configuration may be adopted in which a return pipe 11 </ b> A through which the return refrigerant from the heater 11 flows is passed through the upper part of the cooler 10.

  As a result, the return refrigerant from the heater 11 exchanges heat with the refrigerant in the upper part of the cooler 10, so that the return refrigerant from the heater 11 flows into the second electromagnetic valve 22 at a high temperature, and the bypass circuit 35 and returning to the compressor 20 can be prevented. Therefore, it is possible to prevent the inconvenience that the high-temperature refrigerant flows to the second electromagnetic valve 22 provided downstream of the heater 11 and controlling the supply of the high-temperature refrigerant to the heater 11. It becomes possible to avoid the failure of the valve 22 and the like.

  Further, in each of the above embodiments, carbon dioxide may be used as the refrigerant sealed in the refrigerant circuit. The refrigerant whose high pressure side becomes supercritical pressure and becomes high temperature can be supplied to the heater 11 and the heating capacity can be improved, which is particularly effective in the present invention. Further, when the carbon dioxide is employed as a refrigerant, an internal intermediate pressure type two-stage compression rotary compressor may be employed as the compressor 20, for example. This compressor is comprised in the airtight container by the electric element as a drive element, and the 1st and 2nd rotary compression element driven by the said electric element. Therefore, the refrigerant cooling circuit 30 constituted by the desuperheater in the above embodiment has a refrigerant introduction pipe for introducing the refrigerant compressed by the first rotary compression element of the compressor into the second rotary compression element. Adopt an intermediate cooling circuit outside the compressor connected to the. In this case, since the hottest refrigerant is discharged from the compressor after passing through the intermediate cooling circuit, the refrigerant flows into the heater 11. Also by this, the heating efficiency by the heater 11 can be improved.

  Moreover, in each said Example, although the heat radiating device is comprised with the heat radiator 23 and the air blower 24 for a heat radiator, as above-mentioned, the said heat radiating device is not limited to this, It is high-temperature with cooling water. You may employ | adopt the water cooling type thermal radiation apparatus which cools a refrigerant | coolant. In this case, the inconvenience that the waste heat from the radiator 23 is discharged in the environment where the thermostatic chamber 1 is installed can be solved. Therefore, the air-conditioning load of the environment where the thermostat is installed can be reduced, and overall energy saving can be achieved. In addition, the cooling capacity of the heat radiating device can be secured by the water-cooled heat radiating device without being affected by the temperature of the environment where the thermostatic chamber 1 is installed, and smooth temperature control can be realized. .

C Control device (control means)
DESCRIPTION OF SYMBOLS 1 Constant temperature chamber 2 Heat insulation box 6 Storage chamber 10 Cooler 11 Heater (heating means)
12 Heating heater (heating means)
14 Temperature sensor (temperature detection means)
15 Blower for air circulation 18 Refrigerant circuit 20 Compressor 21 First solenoid valve (valve device of bypass circuit)
22 Second solenoid valve (valve device for heater)
23 radiator 24 radiator blower 27 expansion valve (pressure reduction device)
30 Refrigerant cooling circuit 33 Internal heat exchanger 34 Capillary tube (pressure reduction device)
35 Bypass circuit 39 Hot gas circuit 43 Heat exchanger

Claims (10)

A refrigerant circuit comprising a compressor, a heat radiating device, a decompression device, and a cooler connected in sequence is provided. In a thermostatic chamber that controls the accommodation chamber to a set temperature,
A heater through which the high-temperature refrigerant discharged from the compressor is circulated; and a valve device that controls supply of the high-temperature refrigerant to the heater; and at least a part of the heating means is configured by the heater. A thermostatic chamber characterized by that.   A high-temperature refrigerant discharged from the compressor is allowed to pass through the heat radiating device to be cooled once, returned to the compressor, and then discharged again to the heat radiating device, before passing through the heat radiating device. The thermostat according to claim 1, wherein the high-temperature refrigerant diverted from the refrigerant cooling circuit is circulated to the heater.   A bypass circuit that diverts the refrigerant discharged from the heat dissipation device and decompresses it, and then merges with the return refrigerant from the cooler; and a valve device that controls the flow of the refrigerant to the bypass circuit; The thermostat according to claim 1 or 2, wherein the return refrigerant is merged with the bypass circuit.   The thermostat according to any one of claims 1 to 3, wherein the return refrigerant from the heater is passed through an upper portion of the cooler.   The thermostat according to any one of claims 1 to 4, wherein the return refrigerant from the heater is heat-exchanged with the return refrigerant from the cooler.   The thermostat according to any one of claims 1 to 5, wherein the heat dissipation device is a water-cooled heat dissipation device that cools a high-temperature refrigerant with cooling water.   Control means for controlling the compressor and each valve device, and temperature detection means for detecting the temperature in the storage chamber, the control means for controlling the temperature in the storage chamber based on the output of the temperature detection means. The constant temperature chamber according to any one of claims 1 to 6, wherein the temperature is controlled to a preset temperature between a predetermined low temperature and a high temperature.   8. The thermostatic chamber according to claim 7, wherein the control means changes the temperature in the accommodation chamber with a preset temperature gradient based on the output of the temperature detection means.   A bypass circuit that diverts the refrigerant discharged from the heat dissipation device and decompresses it, and then exchanges heat with the return refrigerant from the cooler and then returns to the compressor, and a valve device that controls the flow of the refrigerant to the bypass circuit The control means, based on the output of the temperature detection means, causes the refrigerant to flow through the bypass circuit by the valve device when the temperature in the accommodation chamber is equal to or higher than a predetermined temperature. The thermostat according to claim 8.   The thermostatic chamber according to any one of claims 1 to 9, wherein carbon dioxide is used as a refrigerant sealed in the refrigerant circuit.

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