JP2011073014A - Laser beam machining method and laser beam machining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an excellent machined shape of a laser beam-machined workpiece. <P>SOLUTION: In a laser beam machining method for machining a workpiece by irradiating the workpiece with the laser beam, the laser beam machining is performed by jetting pulsed assist gas to the workpiece irradiated with the laser beam while irradiating the workpiece with the laser beam. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a laser processing method and a laser processing apparatus.

In recent years, laser processing has attracted attention as a method of cutting or welding a metal plate or the like. Since the laser beam can be narrowed down very small, it is excellent for fine processing of a workpiece. Further, it is advantageous in that the workpiece can be processed without contact.
And recently, when irradiating a workpiece with laser light, a method is disclosed in which processing is performed while an assist gas is jetted onto the laser light irradiated portion (see, for example, Patent Document 1).

  According to such a method, it is possible to prevent oxidation of the laser-irradiated portion or promote oxidation during cutting, or promote melting, evaporation, sublimation, removal of attached residues near the processing point, and the like. As a result, laser processing becomes good.

Japanese Patent Laid-Open No. 08-236678

However, in the conventional methods, laser processing is performed while continuously supplying the assist gas. Therefore, there is a problem that a large amount of assist gas is consumed.
In the conventional methods, the assist gas is usually supplied from the assist gas supply source, such as a gas cylinder or factory piping, to the laser light irradiation portion via the valve. Therefore, the injection amount of the assist gas is left to the sealed pressure of the assist gas supply source. As a result, the injection amount of the assist gas has reached its peak, and there has been a problem in that machining defects occur under optimum machining conditions.
The present invention is to solve the above problems.

  According to one aspect of the present invention, there is provided a laser processing method for processing a workpiece by irradiating the workpiece with a laser beam, the laser beam being irradiated with the laser beam on the workpiece. There is provided a laser processing method, characterized in that laser processing is performed by jetting an assist gas in a pulsed manner on the workpiece irradiated with a laser beam.

  According to another aspect of the present invention, there is provided a laser processing apparatus for processing a workpiece by irradiating the workpiece with laser light, the irradiation means irradiating the workpiece with the laser light. There is provided a laser processing apparatus comprising: an injection means for injecting an assist gas in a pulsed manner onto the workpiece irradiated with the laser light.

  According to the present invention, the processed shape of the workpiece by laser processing becomes better, and the consumption amount of the assist gas can be suppressed.

It is a principal part figure of the laser processing apparatus concerning this Embodiment. It is a principal part figure of the laser processing apparatus concerning this Embodiment. It is a figure explaining the laser processing method. It is a figure explaining the modification of a laser processing method. It is a figure explaining another modification of a laser processing method. It is a figure explaining another modification of a laser processing method. It is a figure explaining another modification of a laser processing method. It is a figure explaining another modification of a laser processing method.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 and 2 are main parts of the laser processing apparatus according to the present embodiment.
First, FIG. 1A shows a conceptual configuration of the laser processing apparatus 1, and FIG. 1B shows an internal structure of the gas supply device 20 of the laser processing apparatus 1.

  As shown in FIG. 1A, the laser processing apparatus 1 includes a laser oscillator 10, a processing main body 11, a processing nozzle 12, a gas supply device 20, a stage 30, and a control unit 40. Yes. In the processing main body 11, a mirror 11m and a condenser lens 11l are provided. Further, the processing nozzle 12 is provided on the condenser lens 11 l side of the processing main body 11.

A pipe 21A is connected to a part of the gas supply device 20, and at least one gas species is supplied to the pipe 21A from a gas cylinder, a factory pipe, or the like. Further, another part of the gas supply device 20 is connected to the processing nozzle 12 via a pipe 21B.
The laser oscillator 10, the gas supply device 20, and the stage 30 are controlled by the control unit 40.

  From the laser oscillator 10 of the laser processing apparatus 1 as described above, a laser beam 101 having a pulsed or continuous intensity is emitted. Then, the emitted laser light 101 is reflected by the mirror 11m in the processing main body 11, and reaches the condenser lens 11l located below the mirror 11m. Further, the laser beam 101 is condensed by the condenser lens 111 and is emitted from the opening 12 h at the tip of the processing nozzle 12. As a result, the laser beam 10 l emitted from the laser oscillator 10 can be applied to the workpiece 50 placed on the stage 30. In the laser processing apparatus 1, the processing position of the workpiece 50 can be changed by moving (scanning) the position of the stage 30 (or the processing main body 11).

  In the laser processing apparatus 1, for example, the assist gas 20 g having a pulsed injection amount (or injection pressure) can be intermittently (or periodically) injected from the opening 12 h of the processing nozzle 12. . As the injection means for injecting the assist gas 20g in a pulse shape, for example, a pressure pump such as a piston pump or a rotary pump is used. Alternatively, a pressurizing chamber that enables stable gas injection, an electromagnetic valve that can be controlled to open and close, and the like are used.

  That is, the laser processing apparatus 1 includes irradiation means for irradiating the workpiece 50 with laser light, and injection means for injecting the assist gas 20g in a pulse shape onto the workpiece 50 irradiated with the laser light. Yes. As a result, the laser beam 10l can be passed through the opening 12h, and at the same time, the pulsed assist gas 20g can be injected in the vicinity of the workpiece 50 irradiated with the laser beam.

Next, the principle that the assist gas 20g is intermittently injected will be described with reference to FIG. In the following description, as an example of the injection unit, a unit using a solenoid valve, a pressure pump, or the like is illustrated.
As shown in the figure, the gas supply device 20 includes an electromagnetic valve 20a, a pressurizing chamber 20b, and a pressurizing pump 20c. The solenoid valve 20a will be described as having a pressure or flow rate adjusting function.

  Here, gas is supplied from the pipe 21A to the pressurization pump 20c, and the high-pressure assist gas 20g is formed in the pressurization chamber 20b by the pressurization pump 20c. In this state, the electromagnetic valve 20a is in a closed state. When the electromagnetic valve 20a is opened, the assist gas 20g is instantaneously released from the gas supply device 20. At this time, the pressure or flow rate of the assist gas released is set to a desired state. Then, the assist gas 20g is supplied into the machining nozzle 12 via the pipe 21B, and is ejected as a pulse jet from the opening 12h of the machining nozzle 12. Further, in the gas supply device 20, the opening and closing of the electromagnetic valve 20a is repeated. As a result, the assist gas 20g having a pulsed injection amount is intermittently injected from the opening 12h.

  The pressurizing chamber 20b may be removed as appropriate, and the electromagnetic valve 20a and the pressurizing pump 20c may be directly connected. The above means can also be implemented by a method in which a plurality of gas supply devices 20 are connected to the processing nozzle 12 and the timing of gas discharge from each gas supply device 20 is shifted.

  With such a configuration, the laser light 10 l is emitted from the opening 12 h of the processing nozzle 12. Further, the assist gas 20g having a pulsed injection amount is intermittently injected from the opening 12h. The laser beam transmission means may use, for example, an optical fiber instead of the mirror 11m. The gas to be supplied may be configured such that the gas type can be selected by a switching valve or the like as necessary.

Moreover, in the laser processing apparatus 1, when irradiating the laser beam 101 in a pulse shape, the pulse period and the pulse period of the assist gas 20g are made the same, the pulse period is shifted, or the rising position of each pulse is adjusted. be able to.
Further, in the laser processing apparatus 1, the injection amount of the assist gas 20g per pulse, the supply pressure, the pulse width, the cycle, etc., the capacity of the pressurization chamber 20b, pressurization by the pressurization pump 20c, the solenoid valve 20a It can be arbitrarily selected by appropriately selecting the opening / closing timing and the like.

The assist gas 20g corresponds to, for example, nitrogen (N ₂ ) gas, rare gas, oxygen (O ₂ ) gas, or the like. As for these gases, for example, nitrogen gas, rare gas or the like is used when the workpiece 50 is welded, and oxygen gas or the like is used when the workpiece 50 is cut. However, the selection of the gas type is not limited to this example, and can be changed as needed. The workpiece 50 corresponds to, for example, a metal plate (aluminum, copper, iron, stainless steel, etc.), a ceramic plate, a glass plate, or the like.

Moreover, the form shown in FIG. 2 may be sufficient as a laser processing apparatus.
For example, in the laser processing apparatus 2 shown in FIG. 2A, the assist gas 20 g can be injected onto the workpiece 50 by an injection unit in which the processing nozzle 12 is independent from the processing main body 11.
Moreover, in the laser processing apparatus 3 shown in FIG.2 (b), it has the structure provided with two or more above-mentioned injection means.
Such laser processing apparatuses 2 and 3 are also included in the present embodiment. Moreover, the piping 21B can be used as the processing nozzle 12.

Next, the laser processing method will be described using the laser processing apparatus 1 as an example. The laser processing method exemplified below is automatically performed by the control unit 40.
FIG. 3 is a diagram for explaining a laser processing method.
Here, the horizontal axis in FIG. 3A represents time (milliseconds), and the vertical axis represents the intensity of the laser light emitted from the opening 12h described above.
In FIG. 3B, the horizontal axis represents time (milliseconds), and the vertical axis represents the injection amount (or injection pressure) of the assist gas 20g injected from the opening 12h.
A combination of these FIGS. 3A and 3B is the laser processing method of the present embodiment.

  FIG. 3 (c) shows a comparative example corresponding to FIG. 3 (b). For example, FIG. 3C illustrates a state in which the assist gas 20g is continuously injected from the opening 12h, not in a pulse form. That is, the combination of FIGS. 3A and 3C is the laser processing method of the comparative example.

In the present embodiment, the irradiation point of the workpiece 50 can be changed by moving the stage 30. In this case, the horizontal axis in FIG. 3 corresponds to not only time (milliseconds) but also movement distance (mm).
FIG. 3 illustrates a case where the injection amount “Q” shown in FIG. 3B is equal to the injection amount “Q ′” shown in FIG. Moreover, all the vertical axes in FIG. 3 are standard values (au).

In the present embodiment, as shown in FIG. 3A, laser light having a pulse intensity is intermittently emitted from the opening 12 h of the processing nozzle 12. It is assumed that the intensity, frequency, and pulse width of the laser light are conditions commensurate with the processing capacity of the workpiece 50, the shape of the workpiece 50, the processing speed, the moving speed of the stage 30, and the like. Thereby, desired welding (or cutting) becomes possible.
For example, as an example, the frequency of the laser light is 100 PPS (Pulse Per Second), and the pulse width is 0.6 msec.

  Then, as shown in FIG. 3B, the assist gas 20 g described above is intermittently injected from the opening 12 h of the processing nozzle 12. In the assist gas 20g, the time (also referred to as pulse width) for injecting the assist gas 20g in a pulse shape, the injection amount (or injection pressure) for injecting the assist gas 20g in a pulse shape, and the injection of the assist gas 20g , The switching of the gas type of the assist gas 20g, the gas mixture ratio in the case of injecting a plurality of the assist gases 20g onto the workpiece 50, and the like are appropriately controlled.

For example, in FIG. 3B, the frequency of the assist gas 20g is the same as the pulse frequency of the laser light. However, the assist gas 20g starts to be injected before the rise of the pulsed laser beam, and the supply from the gas supply device 20 is stopped after the fall of the laser beam. As a result, while the workpiece 50 is being irradiated with the laser beam, the desired high-pressure assist gas 20g is injected to the irradiation point.
In this way, the pulsed assist gas 20g is similarly injected while irradiating the workpiece 50 with the pulsed laser light.

Here, the case of FIG.3 (c) quoted as a comparative example is demonstrated.
In FIG. 3C, the assist gas 20g is continuously injected from the opening 12h. Therefore, in the method shown in FIG. 3C, the assist gas 20g is continuously injected from the opening 12h even during a period in which the workpiece 50 is not irradiated with laser light.

  For example, since the frequency of the laser beam is 100 PPS and the pulse width is 0.6 msec, 9.4 msec of the pulse interval (10 msec) of the laser beam is a period during which the workpiece 50 is not irradiated with the laser beam. Also in this period, the assist gas 20g continues to be injected from the opening 12h. Therefore, in the method shown in FIG. 3C, the assist gas 20g is consumed wastefully compared to the method shown in FIG. Therefore, the method of continuously injecting the assist gas 20g to the workpiece 50 (FIG. 3C) is not preferable.

  Thus, in this Embodiment, consumption of the assist gas 20g is suppressed and laser processing is performed. In the method shown in FIG. 3B, the consumption amount of the assist gas 20g is reduced by about 94% compared to the method shown in FIG.

  Further, the laser beam and the pulse width and pulse shape of the assist gas 20g in the present embodiment are not limited to those shown in FIGS. 3A and 3B, but are appropriately selected so that desired processing can be performed. .

  For example, in the form shown in FIG. 3, the assist gas 20g is injected for each pulse of the laser beam, but the present invention is not limited thereto, and the assist gas 20g over two or more laser beam pulses may be injected ( Details will be described later). Even in such a form, the gas consumption can be suppressed as compared with the continuous injection.

Moreover, about the assist gas 20g, you may increase the injection amount (or injection pressure) of the assist gas 20g per pulse rather than the case illustrated in FIG.3 (b).
In this case, the assist gas amount (pressure) in the laser irradiation portion is further increased. Therefore, the effect of the assist gas 20g can be further increased.

  FIG. 4 is a diagram for explaining a modification of the laser processing method. Here, the horizontal axis of the diagram shown in (1) of FIG. 4A is time (milliseconds), and the vertical axis is the intensity of the laser light emitted from the opening 12h described above. Further, the horizontal axis of the diagram shown in (2) of FIG. 4A is time (milliseconds), and the vertical axis is the injection amount (or injection pressure) of the assist gas 20g injected from the opening 12h. It is.

First, as shown in (1) of FIG. 4A, laser light having an intensity of pulses is intermittently emitted from the opening 12h of the processing nozzle 12.
However, in this embodiment, as shown in (2) of FIG. 4A, the injection timing of the pulsed assist gas 20g is shifted from the irradiation timing of the laser beam. For example, the assist gas 20g is injected over these two pulses so as to overlap the two laser light pulses.
As shown in FIG. 4B, such a configuration can be achieved by injecting the injection timing injected from one gas supply device 20 across two laser light pulses.

  FIG. 5 is a diagram for explaining another modification of the laser processing method. Here, the horizontal axis in FIG. 5A represents time (milliseconds), and the vertical axis represents the intensity of the laser light emitted from the opening 12h described above. In FIG. 5B, the horizontal axis represents time (milliseconds), and the vertical axis represents the injection amount (or injection pressure) of the assist gas 20g injected from the opening 12h.

  First, as illustrated in FIG. 5A, laser light having a pulsed intensity is intermittently emitted from the opening 12 h of the processing nozzle 12. However, in this embodiment, the intensity of the laser beam per pulse is changed stepwise. Correspondingly, even in the injection of the assist gas 20g shown in FIG. 5B, the pulsed injection amount (or injection pressure) is changed stepwise.

In this way, the pulsed assist gas 20g is similarly injected while irradiating the workpiece 50 with the pulsed laser light.
Further, as shown in FIG. 5C, various stepped assist gas 20g patterns can be formed as the stepped assist gas 20g pattern.
Moreover, such a pulse-like injection amount (pressure) change can be appropriately selected according to the laser processing state.

  That is, when the workpiece 50 is welded or cut using such a laser processing apparatus 1, oxidation of the welded portion is prevented and oxidation of the cut portion is promoted. Furthermore, it is possible to suppress the adhesion of metals and metal oxides in the vicinity of the laser irradiated portion, and to increase the assist gas effect such as the melting, evaporation, and sublimation promotion of the workpiece. Further, splash adhesion to optical system components (such as the condensing lens 11l) is further suppressed.

  Thus, according to the present embodiment, the consumption amount of the assist gas 20g is significantly reduced as compared with the method illustrated in FIG. 3C without impairing the effect of the assist gas 20g. Furthermore, since the injection amount of the assist gas 20g does not reach a peak and a high-pressure gas can be injected, the effect of the assist gas 20g can be increased, and the processed shape of the workpiece by laser processing becomes better. . Even in such a case, the consumption amount of the assist gas 20g can be reduced as in the conventional case. Moreover, since the injection pattern of the assist gas 20g can be optimized, the processed shape of the workpiece by laser processing is improved.

  As a result, the quality of the portion subjected to laser processing is improved, the yield of products subjected to laser processing is improved, and the cost of the assist gas 20g can be reduced.

  Next, another modified example of the laser processing method will be described. In the second embodiment, as an example, the assist gas 20g is sequentially injected from the respective injection means including the plurality of gas supply devices 20. In this embodiment, the injection timing is controlled in consideration of the rise and fall of the pressure of the assist gas 20g near the laser irradiation, the responsiveness of the gas device, and the like.

  FIG. 6 is a diagram for explaining another modification of the laser processing method. Here, the horizontal axis of the diagram shown in (1) of FIG. 6A is time (milliseconds), and the vertical axis is the intensity of the laser light emitted from the opening 12h described above. Further, the horizontal axis of the diagram shown in (2) of FIG. 6A is time (milliseconds), and the vertical axis is the injection amount (or injection pressure) of the assist gas 20g injected from the opening 12h. It is.

First, as shown in (1) of FIG. 6A, laser light having a pulsed intensity is intermittently emitted from the opening 12h of the processing nozzle 12. The frequency of the laser light is 100 PPS, and the pulse width is 0.6 msec.
Further, as shown in (2) of FIG. 6A, a pulsed assist gas 20g is injected so as to correspond to the pulsed laser beam.

However, in Example 2, the injection timing of each of the plurality of pulse-like assist gases 20g is shifted from the timing of laser light irradiation.
Such a form is achieved, for example, by shifting the injection timing of each of the injections from the plurality of gas supply devices 20. The method will be described below.

For example, FIG. 6B (1) shows the frequency of the assist gas 20g of the first gas supply device among the plurality of gas supply devices 20, and FIG. 6B (2) shows the frequency. The frequency of the assist gas 20g of the second gas supply device among the plurality of gas supply devices 20 is shown.
As shown in the figure, the frequency of the assist gas 20g of the first and second gas supply devices is ½ of the pulse frequency of the laser light. The cycle (phase) of the assist gas 20g injected from the first and second gas supply devices is out of phase, and the gas is alternately injected.

Next, still another modification of the laser processing method will be described.
FIG. 7 is a diagram for explaining another modification of the laser processing method. Here, FIG. 7 (a) shows the same diagram as FIG. 6 (a).

  Also in this embodiment, as an example, the assist gas 20g is sequentially injected from each injection means including the plurality of gas supply devices 20. In this embodiment, the injection timing is controlled in consideration of the rise and fall of the pressure of the assist gas 20g near the laser irradiation, the responsiveness of the gas device, and the like.

  First, as shown to (1) of FIG.7 (b), the frequency of the assist gas 20g of the 1st gas supply apparatus among the several gas supply apparatuses 20 is shown, (2) of FIG.7 (b). The frequency of the assist gas 20g of the second gas supply device among the plurality of gas supply devices 20 is shown. FIG. 7B (3) shows the frequency of the assist gas 20 g of the third gas supply device among the plurality of gas supply devices 20.

  As shown in the figure, the frequency of the assist gas 20g of the first to third gas supply devices is 1/3 of the pulse frequency of the laser beam. And the cycle (phase) of each assist gas 20g injected from the 1st-3rd gas supply apparatus has shifted | deviated, and the gas is injected alternately.

  Moreover, as shown to (1) of FIG.7 (c), the frequency of the assist gas 20g of the 1st gas supply apparatus among the several gas supply apparatuses 20 is shown, (2) of FIG.7 (c). The frequency of the assist gas 20g of the second gas supply device among the plurality of gas supply devices 20 is shown.

  Further, (3) of FIG. 7 (c) shows the frequency of the assist gas 20g of the third gas supply device among the plurality of gas supply devices 20, and (4) of FIG. 7 (c). The frequency of the assist gas 20g of the fourth gas supply device among the plurality of gas supply devices 20 is shown.

  As shown in the figure, the frequency of the assist gas 20g of the first and second gas supply devices is ½ of the pulse frequency of the laser light. And the period (phase) of each assist gas 20g injected from the 1st and 2nd gas supply apparatus has shifted | deviated a little. However, the assist gas 20g is injected for each pulse of the laser beam by combining the assist gases 20g injected from the first and second gas supply devices with each other.

  Further, the frequency of the assist gas 20g of the third and fourth gas supply devices is ½ of the pulse frequency of the laser beam. And the period (phase) of each assist gas 20g injected from the 3rd and 4th gas supply device has shifted a little. However, the assist gas 20g is injected for each pulse of the laser beam by combining the assist gases 20g injected from the third and fourth gas supply devices with each other.

  As described above, in the example shown in FIG. 7C, the assist gas 20g injected from the first and second gas supply device sets and the assist gas injected from the third and fourth gas supply device sets. The gas 20g is out of phase (phase).

  However, in any of the forms shown in FIGS. 6 and 7, the assist gas 20 g injected from the plurality of gas supply devices 20 is combined with each other, and as a result, the assist gas 20 g is injected for each pulse of the laser beam. The

Moreover, in Example 2, it is not restricted to the form mentioned above, Furthermore, the following form is also included.
For example, as described above, the injection of the assist gas 20g over a plurality of laser pulses can also be achieved by shifting the injection timing of each of the injections from the plurality of gas supply devices 20. The method will be described below.

FIG. 8 is a diagram for explaining another modification of the laser processing method.
Here, FIG. 8A shows the same form as FIG. 4A described above.
However, (1) in FIG. 8 (b) shows the frequency of the assist gas 20g of the first gas supply device among the plurality of gas supply devices 20, and (2) in FIG. 8 (b). The frequency of the assist gas 20g of the second gas supply device among the plurality of gas supply devices 20 is shown.

As shown in the figure, the frequency of the assist gas 20g is the same as the pulse frequency of the laser beam, and its period is synchronized with the cycle of the laser beam. However, the cycle (phase) of each assist gas 20g injected from the first and second gas supply devices is shifted.
By combining these assist gases 20g, the assist gas 20g straddling the two laser light pulses can be periodically ejected from the opening 12h of the processing nozzle 12.

Also, the assist gas 20g can be injected across the two laser light pulses by the method shown in FIG.
8C shows the frequency of the assist gas 20g of the first gas supply device among the plurality of gas supply devices 20, and FIG. 8C shows the frequency of (2). The frequency of the assist gas 20g of the second gas supply device of the gas supply device 20 is shown.

  As shown in the figure, the assist gas 20g injected from each gas supply device straddles two laser light pulses. However, the frequency of the assist gas 20g from the first and second gas supply devices is shifted. By combining these assist gases 20g, the assist gas 20g straddling two pulses can be periodically injected from the opening 12h of the processing nozzle 12.

  Thus, in Example 2, each of a plurality of gas injection devices is used properly. Thereby, the load of the solenoid valve 20a, the pressurizing pump 20c, etc. provided in each gas injection device decreases, and these responsiveness improves. As a result, the pulsed high-pressure gas can be more reliably injected onto the workpiece 50.

  Note that the number of the plurality of gas supply devices 20 is not limited to the first and second gas supply devices. More gas supply devices may be used to sequentially inject the gas, or the pulse width of the assist gas 20g injected from each gas supply device may be further narrowed. In this case, a plurality of gas supply devices 20 are set to correspond to laser pulses. In any method, the duty ratio of each gas supply device can be lowered. As a result, the failure rate of the gas supply device can be reduced, and a highly responsive component can be dispensed with.

  The same effect can be obtained not only by arranging a plurality of gas supply devices 20 but also by combining a plurality of solenoid valves 20a, pressurization chambers 20b, and pressurization pumps 20c constituting the gas supply device 20, respectively.

  For example, in the pressurizing chamber 20b, by providing a plurality, it becomes possible to reduce the capacity of each one. Thereby, pressurization in each pressurization chamber 20b can be completed in a shorter time. In addition, the pressurization chamber 20b can be easily increased in pressure. Furthermore, in the pressurizing chamber 20b, manufacture as a pressure vessel (welding, drawing, cutting, etc.) is facilitated. This also obtains the same effect in the pressurizing pump 20c.

  By providing a plurality of solenoid valves 20a, the operation duty of each solenoid valve 20a can be reduced. Thereby, as a solenoid valve 20a, a cheaper and low-speed solenoid valve can be adopted. Furthermore, since the number of operations is reduced, the service life is extended and failures are reduced.

And you may change suitably about the combination of the solenoid valve 20a, the pressurization chamber 20b, and the pressurization pump 20c.
For example, a plurality of gas injection means can be formed by providing a plurality of electromagnetic valves 20a in the pressurizing chamber 20b and the pressurizing pump 20c. Further, the above-described effect can be obtained even if a plurality of pressurizing chambers 20b are attached to the pressurizing pump 20c, or a plurality of pressurizing pumps 20c are prepared for the pair of electromagnetic valves 20a and the pressurizing chamber 20b. Furthermore, as shown in FIGS. 1 and 2, the same effect can be obtained even if a plurality of injection means including a nozzle are prepared.

  The embodiments of the present invention have been described above with reference to specific examples. However, the present embodiment is not limited to these specific examples. In other words, those obtained by appropriately modifying the design of the above specific examples by those skilled in the art are also included in the scope of the present invention as long as they have the characteristics of the present invention. For example, the processing of the laser processing apparatus 1 includes surface modification of the workpiece 50 in addition to welding and cutting. In addition, each element included in each of the specific examples described above and its formation, material, condition, shape, size, and the like are not limited to those illustrated, and can be appropriately changed.

In addition, each element included in each of the above-described embodiments can be combined as long as technically possible, and a combination thereof is also included in the scope of the present invention as long as it includes the features of the present invention.
In addition, in the category of the idea of the present invention, those skilled in the art can include various changes and modifications.

1, 2, 3 Laser processing equipment
10 Laser oscillator
10l laser light
11 Processing body
11l condenser lens
11m mirror
12 Processing nozzle
12h opening
20 Gas supply device
20a Solenoid valve 20b Pressurizing chamber 20c Pressurizing pump 20g Assist gas 21A, 21B Piping 30 Stage
40 Control unit
50 Workpiece

Claims (12)

A laser processing method for processing a workpiece by irradiating the workpiece with laser light,
A laser processing method comprising performing laser processing by irradiating the workpiece with the laser beam while irradiating the workpiece with the laser beam while jetting an assist gas in a pulse shape.   The laser processing method according to claim 1, wherein a pulsed laser beam is used as the laser beam. Time for injecting the assist gas in pulses,
Gas injection amount when injecting the assist gas in a pulse shape,
Gas injection pressure when injecting the assist gas in pulses,
A frequency at which the assist gas is repeatedly injected;
Gas type of the assist gas,
A gas mixture ratio when injecting a plurality of the assist gases onto the workpiece;
3. The laser processing method according to claim 1, wherein at least one of the two is controlled.   4. The laser processing method according to claim 2, wherein a timing for irradiating the workpiece with the pulsed laser light is shifted from a timing for injecting the assist gas to the workpiece.   The laser processing method according to claim 3 or 4, wherein at least one of the gas injection amount and the gas injection pressure is changed stepwise.   The laser processing method according to claim 1, wherein the assist gas is injected using a plurality of injection means.   The laser processing method according to claim 6, wherein the assist gas is sequentially injected from each of the plurality of injection means.   The laser processing method according to claim 1, wherein at least one of welding of the workpiece, cutting of the workpiece, and surface modification of the workpiece is performed. A laser processing apparatus for processing a workpiece by irradiating the workpiece with laser light,
Irradiating means for irradiating the workpiece with the laser beam;
An injection means for injecting an assist gas in a pulsed manner onto the workpiece irradiated with the laser beam;
A laser processing apparatus comprising: Time for injecting the assist gas in pulses,
Gas injection amount when injecting the assist gas in a pulse shape,
Gas injection pressure when injecting the assist gas in pulses,
A frequency at which the assist gas is repeatedly injected;
Gas type of the assist gas,
A gas mixture ratio when injecting a plurality of the assist gases onto the workpiece;
The laser processing apparatus according to claim 9, wherein at least one of the above can be controlled.   The laser processing apparatus according to claim 9, wherein a plurality of the injection units are provided.   The laser processing apparatus according to claim 11, wherein the plurality of ejection units can sequentially eject the assist gas by each unit.

Images