JP2011070740A - Flexure, suspension, suspension with head, hard disk drive, and method of manufacturing flexure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexure, a suspension, suspension with a head, a hard disk drive and a method of manufacturing the flexure which can mount a piezoelectric element to a flexure tip easily and inexpensively without forming a notch at the thin flexure and without obstructing the extension/contraction operation of the piezoelectric element, and can more finely adjust a tracking operation. <P>SOLUTION: Concave structure in which an adhesive for fixing temporarily a piezoelectric element is applied is formed at the flexure, the piezoelectric element is fixed temporarily with the adhesive, successively, after an electrode of the piezoelectric element is joined with a conductive material for joining, the adhesive is removed, thus solving the problem. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a flexure used in a hard disk drive (HDD), and more particularly to a flexure provided with a piezoelectric element.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed, and along with this, the capacity of hard disk drives (HDD) incorporated in personal computers has increased. Increasing information transmission speed is required.

  A hard disk drive is a magnetic disk that is a magnetic recording medium, a spindle motor that rotates the magnetic disk at high speed, a magnetic head that reads or writes information on the magnetic disk, and each component that moves it while holding it with high precision. Drive control circuit and signal processing circuit.

  In addition, a component called a magnetic head suspension that supports the magnetic head used in this hard disk drive also has a signal line such as a copper wiring directly formed on a stainless steel spring from a conventional type in which a signal line such as a gold wire is connected. The so-called wireless suspension is now integrated into a wiring integrated type (flexure). The suspension having such a configuration has at least a flexure, and usually further has a load beam formed of a stainless steel leaf spring material.

  Further, as the capacity of a hard disk drive (HDD) increases, that is, the recording density of the magnetic disk increases, the recording track on the magnetic disk becomes finer. Therefore, in order to keep the magnetic head on the desired recording track. Therefore, a tracking operation that can be finely adjusted is required.

In response to such a demand, a method has been proposed in which a piezoelectric element, which is a fine movement actuator, is mounted on the load beam in the above suspension, and only the tip of the load beam is moved by this fine movement actuator (Patent Document 1).
The piezoelectric element is an element that expands and contracts when a voltage is applied, and is installed in a configuration in which a swingable tip end and a fixed base end are bridged via a gap provided in the load beam. By applying a voltage to the piezoelectric element, the magnetic head slider mounted on the tip is moved minutely to perform a precise tracking operation.

JP 2002-251853 A

In the suspension having a piezoelectric element mounted on the load beam as described above, as shown in FIG. 12, notches 111f and 111g are formed at both ends of the swinging portion 111a and the fixed portion 111b. The piezoelectric element 112 is mounted by joining the ends of the piezoelectric element 112 with the adhesive resin 115 or the like at the portions 111f and 111g.
Here, the load beam 111 is thicker than the flexure, and as shown in FIG. 11, the piezoelectric elements 112 and 113 are mounted on a portion having a thickness slightly apart from the tip portion on which the magnetic head slider 121 is mounted. It was. The mounted piezoelectric elements 112 and 113 were relatively large sized piezoelectric elements called milliactuators.

  However, in order to realize a tracking operation that can be further finely adjusted, it is necessary to mount a piezoelectric element of a smaller size at the tip of the thin flexure, but it is not possible to form a notch at the tip of the thin flexure. It is technically difficult and the production cost may increase.

  On the other hand, in a method in which an adhesive resin is provided and fixed not on the end portion of the piezoelectric element but on the body portion of the piezoelectric element without forming the notch as described above, the expansion / contraction operation of the piezoelectric element may be hindered.

  The present invention has been made in view of the above circumstances, and can easily and inexpensively mount a piezoelectric element without forming the above-described notch and without inhibiting the expansion and contraction operation of the piezoelectric element. It is another object of the present invention to provide a flexure, a suspension, a suspension with a head, a hard disk drive, and a flexure manufacturing method capable of further fine-tuning the tracking operation.

  As a result of various studies, the present inventor has formed a concave structure in which a bonding agent for temporarily fixing the piezoelectric element is disposed on the flexure, and temporarily fixed the piezoelectric element with the adhesive. The present invention has been completed by finding that the above-mentioned problem can be solved by removing the adhesive after joining the electrode portions at the ends of the piezoelectric elements with a bonding conductive material such as solder.

  That is, the invention according to claim 1 of the present invention includes a metal substrate, an insulating layer formed on one side of the metal substrate, a signal wiring formed on the insulating layer, and the signal wiring and the electrical circuit. A flexure having a mounting area for the magnetic head slider connected to the piezoelectric element, the piezoelectric element for changing the position of the magnetic head slider, and temporarily mounting the piezoelectric element when mounting the piezoelectric element on the flexure It is a flexure characterized by having a concave structure in which an adhesive for fixing is disposed.

  The invention according to claim 2 of the present invention is the flexure according to claim 1, wherein the concave structure has a side wall formed by processing the insulating layer.

  The invention according to claim 3 of the present invention is characterized in that the capacity of the concave portion of the concave structure is larger than the amount of the adhesive. It is.

  The invention according to claim 4 of the present invention is characterized in that the concave structure has an opening through which a cleaning liquid for removing the adhesive comes and goes between the piezoelectric element. The flexure according to any one of Items 1 to 3.

  Moreover, the invention which concerns on Claim 5 of this invention is a suspension characterized by including the flexure in any one of Claims 1-4.

  According to a sixth aspect of the present invention, there is provided a suspension with a head comprising the suspension according to the fifth aspect and a magnetic head slider mounted in the mounting region of the suspension.

  According to a seventh aspect of the present invention, there is provided a hard disk drive including the suspension with a head according to the sixth aspect.

  According to an eighth aspect of the present invention, there is provided a metal substrate, an insulating layer formed on one side of the metal substrate, a signal wiring formed on the insulating layer, and the signal wiring and the electrical circuit. A flexure manufacturing method for mounting a piezoelectric element for changing the position of the magnetic head slider, which has a mounting area for the magnetic head slider connected to the magnetic head slider, for temporarily fixing the piezoelectric element Forming a concave structure in which the adhesive is disposed, and then temporarily fixing the piezoelectric element with the adhesive, and subsequently bonding the electrode portion of the piezoelectric element with a conductive material for bonding, Thereafter, the piezoelectric element is mounted by removing the adhesive, which is a flexure manufacturing method.

  The invention according to claim 9 of the present invention is characterized in that, in forming the concave structure, the insulating layer is processed to form a side wall of the concave structure. It is a manufacturing method.

  The invention according to claim 10 of the present invention is the method for manufacturing a flexure according to any one of claims 8 to 9, wherein a conductive paste is used for the conductive material for bonding.

  The invention according to claim 11 of the present invention is the flexure manufacturing method according to any one of claims 8 to 10, wherein a solder jet is used for joining the electrode portions of the piezoelectric element.

  According to the present invention, the concave structure in which the adhesive for temporarily fixing the body of the piezoelectric element is disposed is formed on the flexure, and the piezoelectric element is temporarily fixed with the adhesive, for bonding. By removing the adhesive after joining the electrode part of the piezoelectric element with a conductive material, the piezoelectric element can be easily and inexpensively formed without forming a notch and without inhibiting the expansion and contraction operation of the piezoelectric element. It is possible to provide a flexure that can be mounted on a flexure and can realize a fine-tuning tracking operation.

  In addition, the concave structure can be easily formed by having a side wall formed by processing the insulating layer of the flexure, and further disposed in the concave portion of the concave structure. When the piezoelectric element is temporarily bonded to the adhesive, the piezoelectric element is supported by the side wall, and the thickness of the side wall is the same as the thickness of the insulating layer of the flexure. Becomes easier.

  Further, by setting the capacity of the concave portion of the concave structure larger than the amount of the adhesive, the spread of the adhesive is kept in the concave portion of the concave structure. And the contamination of the piezoelectric element and the flexure due to the spread of the adhesive can be prevented.

  In addition, the concave structure is configured to have an opening through which the cleaning liquid for removing the adhesive enters and exits between the piezoelectric elements, so that the adhesive is removed by entering and exiting the cleaning liquid. And the adhesive can be removed more efficiently.

It is a schematic plan view which shows an example of the flexure which concerns on this invention. It is an enlarged view which shows the piezoelectric element mounting area | region of an example of the flexure which concerns on this invention, (a) is a top view, (b) is AA sectional drawing of (a). It is a top view which shows the example of the concave structure body of the flexure which concerns on this invention, (a) An example with a recessed part is a rectangular shape, (b) is an example with a recessed part being an H shape. It is explanatory drawing which shows the example of the relationship between the concave-shaped structure body of the flexure which concerns on this invention, an adhesive agent, and a piezoelectric element, (a) A recessed part is an example of a rectangular shape, (b) is an example where a recessed part is an H shape. It is process drawing which shows the manufacturing method of the flexure which concerns on this invention. It is process drawing which shows the manufacturing method of the flexure which concerns on this invention following FIG. It is process drawing which shows the manufacturing method of the flexure which concerns on this invention following FIG. 1 is a schematic plan view showing an example of a suspension according to the present invention. It is a schematic plan view showing an example of a suspension with a head according to the present invention. 1 is a schematic plan view showing an example of a hard disk drive according to the present invention. It is a perspective view which shows an example of the conventional magnetic head apparatus. It is an expanded sectional view which follows the BB line of FIG.

  The flexure, suspension, suspension with head, hard disk drive, and flexure manufacturing method of the present invention will be described in detail below.

[Flexure]
First, the flexure of the present invention will be described.
FIG. 1 is a schematic plan view showing an example of the flexure of the present invention. A flexure 10 shown in FIG. 1 has a magnetic head slider mounting region 1 at a tip portion and a tail pad 3 for connecting to a reading circuit or a writing circuit at a distal end portion. Between the pad 3 is a signal wiring 2 electrically connected to the magnetic head slider.
Here, in order to avoid mutual electrical influence as much as possible and to maintain the mechanical balance of the flexure, the signal wiring 2 is disposed along the outer periphery of the flexure.

  Although not shown in detail in FIG. 1, the position of the magnetic head slider is located in the vicinity of the portion corresponding to the magnetic head slider mounting region 1 on the surface opposite to the surface on which the signal wiring 2 of the flexure 10 is provided. And a concave structure in which an adhesive for temporarily fixing the piezoelectric element when the piezoelectric element is bonded to the flexure is formed.

2A and 2B are enlarged views showing a piezoelectric element mounting region as an example of a flexure according to the present invention, in which FIG. 2A is a plan view and FIG. 2B is a cross-sectional view taken along line AA in FIG.
As shown in FIGS. 2A and 2B, the flexure 10 basically has a laminated structure of a metal substrate 11, an insulating layer 12, and a conductive layer 13, and the magnetic head slider swings due to expansion and contraction of the piezoelectric element 19. The swinging portion 16 that is a portion where the magnetic head slider is mounted and the fixing portion 17 that is another portion of the flexure 10 are bridged by the piezoelectric element 19 with the gap portion 18 interposed therebetween so that the magnetic head slider is mounted. It has a configuration like this.
2A and 2B, a cover layer 14 or a plating layer 15 is formed on the surface of the conductive layer 13 as a protective layer for preventing corrosion or the like.

The piezoelectric element 19 is joined to the oscillating part 16 and the fixing part 17 by the joining conductive material 22 at the electrode parts 21 at both ends, and under the body part 20 for temporarily fixing the piezoelectric element. A concave structure 24 in which an adhesive is disposed is provided.
The concave structure 24 includes a side wall obtained by processing the insulating layer 12 and a bottom portion obtained by processing the conductive layer 13, and an adhesive is disposed in the concave portion surrounded by the side wall.

  According to the present invention, the back surface of the body portion 20 of the piezoelectric element 19 is temporarily fixed with the adhesive, and the adhesive is removed after the electrode portion 21 of the piezoelectric element 19 is bonded with the bonding conductive material 22. Therefore, the piezoelectric element can be mounted on the flexure easily and at low cost without forming a notch as in the prior art and without hindering the expansion / contraction operation of the piezoelectric element.

  Hereinafter, the flexure of the present invention will be described for each configuration.

[Metal substrate]
For example, stainless steel (SUS) can be used as the material of the metal substrate 11. The film thickness is preferably in the range of 10 μm to 30 μm, and more preferably in the range of 15 μm to 25 μm.

[Insulation layer]
The material of the insulating layer 12 is not particularly limited as long as it has insulating properties, and examples thereof include polyimide (PI). The film thickness of the insulating layer 12 is preferably in the range of, for example, 1 μm to 30 μm, more preferably in the range of 3 μm to 20 μm, particularly in the range of 5 μm to 10 μm.

[Conductive layer]
The material of the conductive layer 13 is not particularly limited as long as it has good conductivity, and examples thereof include copper (Cu). The film thickness of the conductive layer 13 is preferably in the range of 1 μm to 18 μm, and more preferably in the range of 5 μm to 12 μm.

[Concave structure]
The concave structure 24 includes a side wall obtained by processing the insulating layer 12 and a bottom portion obtained by processing the conductive layer 13, and an adhesive is disposed in the concave portion 23 surrounded by the side wall.

The side wall of the concave structure 24 also functions as a support when the piezoelectric element 19 is mounted, and the thickness (height) of the side wall is the same as the thickness of the insulating layer 12 at each portion. It becomes easy to mount 19 horizontally.
Here, the capacity | capacitance of the recessed part 23 may be comprised so that it may become larger than the arrangement | positioning amount of an adhesive agent. By adopting such a configuration, the spreading of the adhesive is limited as if the side wall of the concave structure 24 is a dam, so that contamination of the piezoelectric element 19 and the flexure 10 due to the spreading of the adhesive can be prevented. Because it can.

The concave structure may have an opening between the piezoelectric element. For example, as shown in FIG. 2A, the recess 23 surrounded by the side wall of the concave structure 24 is assumed to be smaller than the length of the piezoelectric element 19 in the expansion / contraction direction (longitudinal direction) of the piezoelectric element 19; In the direction perpendicular to the expansion / contraction direction of the piezoelectric element 19 (short direction), an opening can be formed between the piezoelectric element 19 and the piezoelectric element 19.
By setting it as such a structure, the washing | cleaning liquid for removing an adhesive agent can be made in and out through this opening, and an adhesive agent can be removed more efficiently.

In addition to the rectangular recess as shown in FIG. 2, the concave structure is formed by a rectangular portion and a plurality of groove-like portions as shown in FIG. 3B, for example. It is good also as a made form. In addition, although the example of H shape was shown in FIG.3 (b), the said groove-shaped part is not limited to this position and this number.
Examples of the relationship between the concave structure, the adhesive, and the piezoelectric element in each form shown in FIGS. 3A and 3B are shown in FIGS. The adhesive 26 is disposed approximately at the center of the concave portion 23 of the concave structure 24 corresponding to the back side of the body portion of the piezoelectric element to be mounted. An opening through which the cleaning liquid for removing the adhesive enters and exits is formed between the body 20 of the piezoelectric element and the recess 23 (up and down of the piezoelectric element in FIGS. 4A and 4B).
In FIG. 4, for the sake of explanation, only the outline of the piezoelectric element is shown. The adhesive 26 is removed after bonding the electrode portions of the piezoelectric element.

[Cover layer]
Examples of the resin for forming the cover layer 14 include a polyimide resin and an epoxy resin. The resin for forming the cover layer 14 may be a photosensitive resin or a non-photosensitive resin.
The thickness of the cover layer is preferably in the range of 1 μm to 30 μm, for example.

[Plating layer]
The material of the plating layer 15 is not particularly limited as long as it has conductivity and can prevent corrosion or the like of the conductive layer 13, and examples thereof include gold (Au) or nickel-gold (Ni-Au). Can do.
The film thickness of the plating layer 15 is, for example, preferably 5 μm or less, and more preferably in the range of 1 μm to 2 μm.

[Piezoelectric element]
The piezoelectric element 19 is not particularly limited as long as it has a good piezoelectric effect and can withstand mounting on a flexure, and examples thereof include lead zirconate titanate (PZT).

[Conductive material for bonding]
As the bonding conductive material 22 for bonding the electrode portion 21 of the piezoelectric element 19 and the electrode portion formed by the conductive layer 13 of the swinging portion 16 and the fixed portion 17, lead-containing solder or lead-free solder is used. Can be used. Among these, in the present invention, it is preferable to use lead-free solder. This is because the load on the environment can be reduced. Specific examples of the lead-free solder include Sn—Sb, Sn—Cu, Sn—Cu—Ni, Sn—Ag, Sn—Ag—Cu, Sn—Ag—Cu—Bi, Examples thereof include Sn—Zn, Sn—Ag—In—Bi, Sn—Bi, and Sn—In solders. Moreover, it may not be a pure metal like a conductive paste.

[Manufacturing method of flexure]
Next, the manufacturing method of the flexure of this invention is demonstrated. The method for producing the flexure of the present invention is not particularly limited as long as the flexure having the above-described configuration can be obtained. Hereinafter, an example of the manufacturing method of the flexure of this invention is demonstrated using FIGS.

(1) Preparation of Laminated Body First, a laminated body in which the metal substrate 11, the insulating layer 12, and the conductive layer 13 are laminated in this order is prepared (FIG. 5A). Originally, there is a layer called a seed layer (Ni—Cr—Cu sputtering layer) between the insulating layer 12 and the conductive layer 13, but it is omitted in FIG. 5 for simplification.

  The material of the seed layer is not particularly limited as long as the adhesion between the insulating layer 12 and the conductive layer 13 can be improved. Examples thereof include Ni, Cu, Cr, and alloys thereof. The seed layer is preferably a layer formed by a sputtering method. The film thickness of the seed layer is not particularly limited as long as desired adhesion can be obtained, but is usually in the range of 5 nm to 300 nm.

  The method for forming the laminate used in the present invention is not particularly limited as long as it is a method capable of obtaining the above laminate. For example, a polyimide precursor is formed on the surface of SUS as the metal substrate 11. An insulating layer 12 made of polyimide is formed by applying and heat-treating a body-containing coating solution, then a seed layer is formed by sputtering, and finally a conductive layer 13 made of copper is formed by electrolytic plating. A method can be mentioned.

(2) Processing of Metal Substrate and Conductive Layer Next, a patterned resist 25 a is formed on the surface of the metal substrate 11. Similarly, a patterned resist 25b is also formed on the surface of the conductive layer 13 (FIG. 5B).
The resists 25a and 25b may be solid resists or liquid resists, but are preferably solid resists because the number of steps is reduced. Specifically, it is preferable to use a dry film resist (DFR).

  The method for forming the patterned resists 25a and 25b on the surface of the metal substrate 11 and the surface of the conductive layer 13 is not particularly limited, and a general method can be used. Specifically, a method of developing after arranging a resist on the surface of the metal substrate 11 and the surface of the conductive layer 13 and exposing to a desired pattern can be exemplified.

Next, the metal substrate 11 and the conductive layer 13 exposed from the patterned resists 25a and 25b are etched, and after the etching, the resists 25a and 25b are peeled to process the metal substrate 11 and the conductive layer 13 into a predetermined shape. (FIG. 5C).
By this processing, a bottom portion of the concave structure 24 and a portion where the bonding conductive material 22 is provided are formed.

Examples of the method for etching the metal substrate 11 and the conductive layer 13 include wet etching. And it is preferable to select suitably the etching liquid used for wet etching according to the material of the metal substrate 11 and the conductive layer 13 to be used.
For example, when the metal substrate 11 is SUS, a ferric chloride etching solution can be used. When the conductive layer 13 is made of copper, a ferric chloride etching solution or a copper chloride etching solution can be used. In the present invention, after the patterned resists 25a and 25b are formed, the metal substrate 11 and the conductive layer 13 may be etched separately, or the metal substrate 11 and the conductive layer 13 may be etched simultaneously.

(3) Formation of cover layer Next, the cover layer 14 is formed using a liquid cover material (FIG.5 (d)).
The liquid cover material used in the present invention contains at least a cover layer forming resin. Furthermore, you may contain the solvent which dissolves the resin for cover layer formation as needed.

Examples of the cover layer forming resin include a polyimide resin and an epoxy resin. The cover layer forming resin may be a photosensitive resin or a non-photosensitive resin.
The viscosity of the liquid cover material is, for example, preferably in the range of 500 cP to 5000 cP at room temperature, and more preferably in the range of 500 cP to 1000 cP.

  Next, a patterned resist 25c is formed on the surface of the cover layer 14 (FIG. 5E), the cover layer 14 is etched using a chemical etching solution, and then the resist 25c is peeled off to obtain a desired form. The cover layer is formed (FIG. 6F).

(4) Processing of insulating layer Next, a patterned resist 25d is formed on the surfaces of the metal substrate 11 and the insulating layer 12 (FIG. 6G), the insulating layer 12 is etched using a chemical etching solution, and then By peeling off the resist 25d, the insulating layer 12 is processed into a predetermined shape (FIG. 6H). This etching process may be performed by plasma etching.
In the etching process of the insulating layer 12, the gap 18, the portion where the bonding conductive material 22 is provided, and the sidewall of the concave structure 24 can be formed.

(5) Formation of Plating Layer Next, gold (Au) plating or nickel-gold (Ni—Au) plating is applied to the exposed portion of the conductive layer 13 to form the plating layer 15 (FIG. 6 (i)). )).
The plating layer 15 can be formed by a general plating method. In particular, in the present invention, it is preferable to form by an electrolytic plating method.

(6) Disposition of adhesive Next, an adhesive 26 for temporarily fixing the piezoelectric element 19 is disposed at a predetermined position of the concave structure 24 (FIG. 6 (j)).
A method for disposing the adhesive 26 at a predetermined position is not particularly limited, and examples thereof include a dispensing method and an ink jet method.
The height of the disposed adhesive 26 must be higher than the thickness of the insulating layer 12 that becomes the side wall of the concave structure 24. Since the piezoelectric element 19 is supported by the side wall of the concave structure 24 processed from the insulating layer 12, the piezoelectric element 19 cannot be sufficiently fixed by bonding unless the disposed adhesive 26 is higher than the side wall. It is.
The material of the adhesive 26 is not particularly limited as long as it has adhesive ability and can be removed after the completion of the process, and examples thereof include an organic solvent-based positive resist.

The viscosity of the adhesive 26 is, for example, preferably in the range of 1 cP to 10000 cP, more preferably in the range of 10 cP to 1000 cP, and particularly preferably in the range of 50 cP to 500 cP.
If the viscosity of the adhesive 26 is too low, it may be difficult to dispose the adhesive 26 higher than the side wall of the concave structure 24, and sufficient adhesive ability may not be exhibited. This is because if it is too high, there is a possibility of causing a positional deviation when mounting the piezoelectric element.
The viscosity of the adhesive 26 can be adjusted by a method such as diluting the material of the adhesive with a solvent such as thinner. For example, when an AZ resist manufactured by AZ Electronic Materials is used as the material of the adhesive 26, AZ5200 thinner can be used as a diluent solvent.

(7) Mounting and Fixing of Piezoelectric Element Next, the piezoelectric element 19 is mounted at a predetermined position and temporarily fixed by the adhesive 26 (FIG. 7 (k)).
Here, the side wall of the concave structure 24 also functions as a support when the piezoelectric element 19 is mounted, and the thickness (height) of the side wall is the same as the thickness of the insulating layer 12 in any part. It becomes easy to mount the piezoelectric element 19 horizontally.

Next, the electrode portion 21 of the piezoelectric element 19 and the electrode portion formed by the conductive layer 13 of the swinging portion 16 and the fixing portion 17 are bonded by the bonding conductive material 22 (FIG. 7L).
The method for forming the bonding conductive material 22 is not particularly limited. For example, a Sn-Ag-Cu-based lead-free solder is used and formed by a screen printing method, a dispensing method, a solder jet method, or the like. Among them, the solder jet method is preferable. This is because it is not necessary to heat the piezoelectric element more than necessary.

(8) Removal of adhesive Finally, the adhesive 26 is removed to obtain a flexure according to the present invention (FIG. 7 (m)).
The chemical used for cleaning in this step is not particularly limited as long as the adhesive 26 can be removed and does not react with other substances. For example, an organic solvent positive resist is used for the adhesive 26. In this case, cleaning with acetone is effective. For example, cleaning steps of acetone cleaning, isopropyl alcohol (IPA) or ethanol substitution, pure water cleaning, and drying can be used.

[suspension]
Next, the suspension of the present invention will be described. The suspension of the present invention includes the above-described flexure.

  FIG. 8 is a schematic plan view showing an example of the suspension of the present invention. The suspension 40 shown in FIG. 8 has the flexure 10 described above and a load beam 30 provided on the surface of the flexure 10 opposite to the surface on which the magnetic head slider mounting region 1 is formed.

  According to the present invention, it is possible to provide a suspension capable of realizing a tracking operation that can be finely adjusted by using the flexure described above.

  The suspension of the present invention has at least a flexure, and usually further has a load beam. Since the flexure is the same as described above, description thereof is omitted here. The load beam can be the same as the load beam used for a general suspension.

[Suspension with head]
Next, the head suspension according to the present invention will be described. The suspension with a head of the present invention includes the above-described suspension and a magnetic head slider mounted on the suspension.

  FIG. 9 is a schematic plan view showing an example of the suspension with a head of the present invention. A suspension 50 with a head shown in FIG. 9 has the above-described suspension 40 and a magnetic head slider 41 mounted on the magnetic head slider mounting area 1 of the suspension 40.

  According to the present invention, by using the above-described suspension, it is possible to provide a suspension with a head that can realize a tracking operation that can be finely adjusted.

  The suspension with a head of the present invention has at least a suspension and a magnetic head slider. Since the suspension is the same as described above, description thereof is omitted here. Further, the magnetic head slider can be the same as the magnetic head slider used in a general suspension with a head.

[Hard disk drive]
Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention includes the above-described suspension with a head.

  FIG. 10 is a schematic plan view showing an example of the hard disk drive of the present invention. A hard disk drive 60 shown in FIG. 10 is connected to the suspension 50 with a head described above, a disk 61 on which the head suspension 50 writes and reads data, a spindle motor 62 that rotates the disk 61, and the suspension 50 with a head. The arm 63, the voice coil motor 64 that moves the magnetic head slider of the suspension 50 with head, and the case 65 that seals the above members are included.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the suspension with a head described above.

  The hard disk drive of the present invention has at least a suspension with a head, and usually further includes a disk, a spindle motor, an arm, and a voice coil motor. Since the suspension with a head is the same as described above, description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

Hereinafter, the present invention will be described more specifically with reference to examples.
Example 1
In accordance with the manufacturing method described above, a flexure according to the present invention having a structure in which the concave portion has a rectangular structure 24 as shown in FIG. 2 was manufactured. Here, SUS having a thickness of 20 μm was used for the metal substrate 11, polyimide having a thickness of 10 μm was used for the insulating layer 12, and copper having a thickness of 9 μm was used for the conductive layer 3.
Further, the cover layer 14 is made of a non-photosensitive polyimide resin having a thickness of 5 μm, the plating layer 15 is made of gold (Au) having a thickness of 1 μm, and the piezoelectric element 19 has a length in the expansion / contraction direction (longitudinal direction) of 900 μm, Lead zirconate titanate (PZT) whose length in the direction perpendicular to the expansion / contraction direction (short direction) was 200 μm, and Sn—Ag—Cu based lead-free solder for the bonding conductive material 22 were used.
Further, a positive resist (AZ Electronic Materials, AZ P4620) is used for the adhesive 26, and the cleaning process is acetone cleaning (5 min), isopropyl alcohol (IPA) substitution (1 min), pure water cleaning (1 min). And drying (80 ° C., 1 min).
In the obtained flexure, the adhesive that temporarily fixed the piezoelectric element was completely removed, and the expansion / contraction operation of the piezoelectric element was not hindered. Moreover, as a result of GC-MS analysis of the product after removing the adhesive, the outgas amount was 200 ng or less, and no cleaning liquid remained.

  As described above, in the present invention, a piezoelectric element of a smaller size is mounted on the tip in a thin flexure easily and at low cost without forming a notch and without inhibiting the expansion / contraction operation of the piezoelectric element. It is possible to manufacture a flexure, and by using this flexure, it is possible to provide a suspension, a suspension with a head, and a hard disk drive that enable fine adjustment of a tracking operation.

DESCRIPTION OF SYMBOLS 1 ... Magnetic head slider mounting area 2 ... Wiring 3 ... Tail pad 10 ... Flexure 11 ... Metal substrate 12 ... Insulating layer 13 ... Conductive layer 14 ... Cover layer 15 ... Plating layer 16, 111a ... Oscillating part 17, 111b ... Fixing part 18, 111e ... Gap part 19, 112, 113 ... Piezoelectric element 20 ... Body part 21 ... Electrode part 22 ... Conductive material for bonding 23 ... Recess 24 ... Concave structure 25a, 25b, 25c, 25d ... Resist 26 ... Adhesive 30 ... Load beam 40 ... Suspension 41 ... Magnetic head slider 50 ... Suspension with head 60 ... Hard disk drive 61 ... Disk 62 ... Spindle motor 63 ... Arm 64 ... Boy Scoil motor 65 ... Case 110 ... Magnetic head device 111 ... Load beam 111f, 111g ... Notch 115 ... Adhesive resin 121 ... Slider

Claims (11)

A flexure having a metal substrate, an insulating layer formed on one side of the metal substrate, a signal wiring formed on the insulating layer, and a magnetic head slider mounting region electrically connected to the signal wiring Because
A piezoelectric element for changing the position of the magnetic head slider;
A flexure having a concave structure in which an adhesive for temporarily fixing the piezoelectric element is mounted when the piezoelectric element is mounted on the flexure.   The flexure according to claim 1, wherein the concave structure has a side wall formed by processing the insulating layer.   The flexure according to claim 1, wherein a capacity of a concave portion of the concave structure is larger than an amount of the adhesive.   The flexure according to any one of claims 1 to 3, wherein the concave structure has an opening through which a cleaning liquid for removing the adhesive enters and leaves the piezoelectric element.   A suspension comprising the flexure according to claim 1.   6. A suspension with a head, comprising: the suspension according to claim 5; and a magnetic head slider mounted in the mounting region of the suspension.   A hard disk drive comprising the suspension with a head according to claim 6. A metal substrate; an insulating layer formed on one side of the metal substrate; a signal wiring formed on the insulating layer; and a mounting area for a magnetic head slider electrically connected to the signal wiring. And the manufacturing method of the flexure which mounts the piezoelectric element for changing the position of the magnetic head slider,
Forming a concave structure in which an adhesive for temporarily fixing the piezoelectric element is disposed;
Thereafter, the piezoelectric element is temporarily fixed with the adhesive,
Subsequently, the electrode part of the piezoelectric element is bonded with a conductive material for bonding,
Then, by removing the adhesive,
A flexure manufacturing method comprising mounting the piezoelectric element.   The method for manufacturing a flexure according to claim 8, wherein in forming the concave structure, the insulating layer is processed to form a side wall of the concave structure.   The method for manufacturing a flexure according to claim 8, wherein a conductive paste is used as the bonding conductive material. The method of manufacturing a flexure according to any one of claims 8 to 10, wherein a solder jet is used for joining the electrode portions of the piezoelectric element.

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