JP2011068532A - Device for filling molten metal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an improved filling device for filling a molten metal into a through-hole pierced in a body to be filled, such as a glass substrate or a ceramic substrate. <P>SOLUTION: The filling device for filling a molten metal into a through-hole pierced in a body to be filled has a filling means with a filling tube which has, at one end, a melting surface with which a solid low melting point metal material comes into contact and melts to generate a molten metal and an inflow port in which the molten metal generated on the melting surface flows, and, at the other end, an outflow port which is placed opposite to one opening of the through-hole and from which the molten metal flows out, and in which a passage is formed so that the molten metal generated on the melting surface flows from the inflow port to the outflow port, wherein the area of the inflow port of the filling tube is smaller than the area of the low melting point metal material which comes into contact with the melting surface. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a filling apparatus for filling molten metal into, for example, a glass substrate, a ceramic substrate, and other through holes provided in an object to be filled.

  For example, a glass panel constituting a multi-layer glass (so-called pair glass) or an image display device is (1) preparing two glass substrates and forming a through hole in one glass substrate, (2) outer peripheral edge of the glass substrate (3) Join the glass substrates together via the sealing member to form an airtight chamber separated by the glass substrate and the sealing member, (4) Form on one glass substrate The gas is exhausted through the formed through hole to make the hermetic chamber a vacuum atmosphere, or if necessary, a predetermined gas is introduced thereafter to make the hermetic chamber a gas atmosphere. (5) The through hole is sealed. It is manufactured through a process. Conventionally, in the step (4), a glass tube called a chip tube is hermetically inserted into the through hole of the glass panel intermediate formed in the steps (1) to (3). The step (5) was performed by heating and reducing the diameter of the middle portion of the tip tube and sealing the tip tube itself (referred to as chip-off or sealing-off). In the following, the conventional technique will be described by taking as an example a sealing technique for a through hole of a glass panel, but the application target of the present invention is not limited thereto.

  Here, the structural method and the cost disadvantage of the sealing method itself for sealing the through-hole using the above-described conventional tip tube, and the disadvantages such as the aesthetics of the glass panel manufactured by the method and the mountability as a part. Techniques to overcome are disclosed in Patent Documents 1 to 6 below.

  In Patent Document 1, when a sealing material is supplied to a through-hole and the sealing material is melted to form a sealing plug that seals the through-hole, the gas evaporated from the molten sealing material enters the hermetic chamber. In order to prevent mixing, “in a vacuum display having a container hermetically sealed in a high vacuum, after exhausting through a non-projecting exhaust hole provided in a part of the container, the exhaust hole is sealed. In this case, the solder is sandwiched between energizing ribbons so as to close the exhaust holes, and the ultrasonic vibration is applied by applying pressure from above the energizing ribbon, and at the same time, the ribbon is energized to preheat the solder, The invention described in the gist is a sealing method for a vacuum display characterized in that the solder is sealed at a temperature just before the melting point, and then the unnecessary portion of the ribbon is cut.

  Patent Document 2 aims to provide a method of manufacturing a double-glazed glass and an apparatus therefor that can shorten the exhaust time of the hermetic chamber and reduce the number of steps for exhausting and closing. Low melting point formed by furnace body solder in a hole drilled in one of a pair of parallel glass plates sealed and formed with an intermediate layer inside so that the air in the intermediate layer can be sucked from the outside Producing a double-glazed glass characterized in that a blocking member is provided, a predetermined degree of vacuum is achieved by suction of air in the intermediate layer, and then the end of the low melting point blocking member is heated and melted to close the hole. The invention having the gist of “method” is described.

  Patent Document 3 provides a method for manufacturing a sealing panel device with excellent mass productivity that has a high degree of vacuum in the hermetic chamber, has few three-dimensional restrictions when assembling the final product, and can be thinned. "The first panel and the second panel are arranged opposite to each other with the vacuum space interposed therebetween, and the opening provided in at least one of the first panel, the second panel, and the seal member is a low melting point metal material. A sealing panel device manufacturing method having a structure closed by a sealing plug member comprising: (a) a peripheral edge portion of a first panel and a peripheral edge portion of a second panel that are arranged opposite to each other using a sealing member; An invention having the gist of a manufacturing method of a sealing panel device comprising: a bonding step, and (b) a step of closing an opening with a sealing member made of a low melting point metal material in a vacuum atmosphere. Description It has been.

  In Patent Documents 4 and 5, the amount of protrusion from the surface of the glass substrate is small and excellent in aesthetics, and it is possible to suppress damage caused by contact with other objects, and reliably with a relatively simple method. An object of the present invention is to provide a method for producing a glass panel capable of sealing a through-hole, and “both a plurality of spacers are interposed between a pair of plate glasses and the outer peripheral portions of both plate glasses are sealed with outer peripheral sealing portions. A void portion is formed between the plate glasses, and a suction hole for decompressing the void portion is provided in one of the plate glasses, and after the gas in the void portion is sucked from the suction hole, the suction hole is A method for producing a sealed glass panel, wherein metal solder is used as a sealing material for sealing the suction hole, the metal solder piece is heated and melted in the vicinity of the suction hole, and the molten state is obtained. Some metal solder piece surface An invention having the gist of `` a manufacturing method of a glass panel that breaks the chemical film and causes the metal solder of the contents to flow out, directly contacts the flowed metal solder to the one plate glass, and solidifies by cooling and seals the suction holes '' Is described.

  Patent Document 6 aims to provide a sealing method capable of performing a sealing operation of a through-hole at a relatively low temperature, and “seal a glass hole for sealing a glass hole formed in a glass material”. In this method, a first metal solder and a second metal solder having different melting points are used as a sealing material for sealing the glass hole, and the metal hole is surrounded in advance so as to surround the entire circumference of the glass hole. A preparatory process including a peripheral wall portion forming step of forming a peripheral wall portion made of the first metal solder having a higher melting point by rising and a mounting step of mounting the solid second metal solder on the peripheral wall portion was performed. Thereafter, the second metal solder placed on the peripheral wall portion is heated and melted, and the second metal solder in a molten state is flown into the glass hole side, and the peripheral wall portion is melted to the peripheral wall portion. In contact An interface activation step for imparting kinetic energy to the metal solder to activate the contact interface with the peripheral wall, and a second metal solder in a molten state at least on the inner peripheral side of the peripheral wall An invention having a gist of a sealing method of a glass hole that includes a cooling and solidification step of cooling and solidifying in close contact with the glass hole and sealing the glass hole is described. Has been.

JP 59-189534 JP-A-11-240739 JP 2000-208031 JP 2001-180985 A JP 2002-137940 A JP 2002-187743 A

  The present invention has been made in view of the above prior art, and an object of the present invention is to provide an improved filling apparatus that fills a molten hole into a through-hole provided in a filling substrate such as a glass substrate, a ceramic substrate, or the like. .

  One aspect of the present invention that achieves the above object is a filling device that fills a through-hole provided in an object to be filled with molten metal, and a low-melting-point metal material in a solid phase contacts and melts to generate molten metal. The molten surface generated at the molten surface and an inflow port through which the molten metal generated at the molten surface flows in at one end surface, and an outflow port disposed at one end surface of the through hole through which the molten metal flows out is disposed at the other end surface. And a filling means having a filling cylinder formed with a flow path through which the molten metal generated at the melting surface flows from the inlet to the outlet, and the area of the inlet of the filling cylinder corresponds to the melting surface. It is a filling apparatus characterized by being less than the area of the low melting metal material which contacts.

  The supply member of this aspect has the following effects. That is, the low-melting-point metal material in the solid phase comes into contact with the melting surface of the filling cylinder and melts to generate molten metal. Molten metal flows in from the inflow port formed on the same end surface as the melting surface, flows through the flow path, and flows out from the outflow port. The molten metal that has flowed out is supplied from one opening disposed opposite to the outlet and is filled in the through hole. Here, since the area of the inlet is less than the area where the low melting point metal material is in contact with the melting surface, the molten metal flows into the flow path by bringing the low melting point metal material into contact with the melting part so as to close the inlet. Circulate while filling the inside. As a result, in the process of supplying the molten metal, the molten metal does not come into contact with the atmosphere, and the generation of oxide is suppressed, and mixing of the oxide into the molten metal is avoided. Furthermore, since the area where the low melting point metal material is in contact with the melted part is an area exceeding the inflow port, the entry of the oxide adhering to the excess part, that is, the surface of the low melting point metal material, into the passage It is blocked by a non-opening around the inlet (that is, one end face of the filling cylinder). As a result, it is possible to suppress the oxide already existing on the surface of the low-melting-point metal material in the solid phase from being mixed into the molten metal. As described above, a clean molten metal with a very small amount of oxide mixed is filled in the through-holes, and it is possible to avoid poor bonding and poor strength due to the oxide mixed in the molten metal. Note that the “low melting point metal” in this specification refers to a metal that melts at a relatively low temperature of approximately 400 ° C. or less, exemplified by Sn, In, Zn, Ga, and the like.

  In the above filling device, in order to smoothly supply the molten metal to the through hole, and to prevent surplus molten metal from adhering to the leakage filler from the other opening of the through hole, the filling means includes the flow A protrusion that protrudes from the other end surface of the filling cylinder in a state in which the base end is included in the outlet and that can be inserted into the through hole is provided, and the protrusion is located at a position facing one opening of the through hole. It is desirable to have a protrusion height that reaches the tip in the vicinity of the other opening of the through hole in a state where the outlet is disposed. According to such a preferred embodiment of the filling device, the molten metal flowing out from the outlet is smoothly supplied to the through hole while being guided by the protrusion inserted into the through hole, and the protrusion located near the other opening of the through hole. The flow of the molten metal is regulated by the tip of the part, and the flow end of the molten metal remains in the vicinity of the other opening. Thereafter, when the filling cylinder is moved in a direction in which the inlet is separated from the one opening of the through hole, the molten metal is also replenished to the portion where the protrusion is present, and the through hole is filled with the molten metal.

  For example, when the molten metal has a low viscosity and easily flows, the flow of the molten metal is restricted and retained in the through hole by utilizing the wetness between the peripheral wall of the through hole and the molten metal. It is desirable that the protrusion has a contact portion that contacts the peripheral wall of the through hole and guides the molten metal to the peripheral wall of the through hole through the contact portion.

  Further, in order to smoothly supply the molten metal to the through hole, it is desirable that a guide groove for guiding the molten metal is formed in the projection, and in addition, the size of the outlet is the through hole. It is desirable that it is larger than the size of the one opening of the hole.

  In addition, in order to avoid the molten metal containing oxide generated at one end surface of the filling cylinder and not flowing in from the inlet as described above from adhering to the object to be filled, the filling means includes the filling A storage part is provided so as to surround the cylinder and stores molten metal overflowing from one end face of the filling cylinder, and the storage part receives molten metal containing oxide leaked from one end face of the filling cylinder. Is desirable.

  According to the molten metal filling apparatus of the present invention, the above-described operational effects can be achieved.

It is a schematic block diagram of the filling apparatus concerning this invention. It is a block diagram of the filling means integrated in the filling apparatus of FIG. It is a partial expanded sectional view which shows the modification of the filling means of FIG. It is a figure explaining operation | movement of the filling apparatus of FIG. It is a figure which shows the structure of the glass panel containing the through-hole with which a molten metal is filled with the filling apparatus of FIG.

  Hereinafter, the present invention will be described with reference to FIGS. In the following description of the embodiments, a case where a molten metal obtained by melting a raw material of a SnAgAl-based alloy, which is a low melting point metal, is filled in a through hole of a glass substrate will be specifically described as an example. Even when the substrate or the ceramic substrate is used, similar actions and effects can be obtained. Further, the present invention is not limited to these embodiments, and can be modified within the scope of the sameness as the present invention, and the components of the filling device can be used alone or in appropriate combination as long as they do not contradict the gist of the present invention. Can be implemented.

  First, the structure of the glass panel P will be described with reference to FIG. In FIG. 5, reference numeral G1 is a first glass substrate (hereinafter abbreviated as a first substrate), reference numeral G2 is a second glass substrate (hereinafter abbreviated as a second substrate), and a spherical gap maintaining member B. The main surfaces S1 and S2 (surfaces to which the following bonding member m is bonded) are arranged to face each other via the predetermined gap g formed in (1). A substantially cylindrical through hole H is formed in the first substrate G1, and this through hole H is a low melting point metal solder, specifically, Ag is 8.5% by mass and Al is Al. It is sealed with a sealing plug M made of SnAgAl-based alloy excellent in bondability with a glass substrate made of 0.35% and the remaining Sn.

  A symbol m is provided in a frame shape on the outer peripheral edge portions of the first substrate G1 and the second substrate G2, specifically, slightly inward of the respective outer peripheral edges, and is directly bonded to the respective main surfaces S1 and S2, which will be described later. It is a joining member that hermetically seals the hermetic chamber. In addition, although the joining member m of the glass panel P of this aspect is comprised using the SnAgAl type | system | group alloy excellent in the bondability with a glass substrate similarly to the sealing plug M, for example, an indium or Zn type solder is used. Glass frit or the like may be used. In addition, when filling the through hole H with a low melting point metal as will be described later, it is necessary to heat the first substrate to a temperature about the melting point of the low melting point metal. It is desirable to be made of a material having a melting point higher than M.

  The symbol k is an airtight chamber that is a space defined by the first substrate G1, the second substrate G2, and the bonding member m. As will be described later, the hermetic chamber k is evacuated through a through hole H, and then the through hole H is sealed with a sealing plug M so that the hermeticity is maintained.

  Such a glass panel P is manufactured through the following steps. That is, (1) a first substrate G1 and a second substrate G2 are prepared, and a through hole H is formed at a predetermined position of the first substrate G1 (through hole forming step). (2) A predetermined gap is formed on the main surface S1. The first substrate G1 and the second substrate G2 are arranged to face each other via the gap holding member B so as to be formed between S2, and the melted SnAgAl-based alloy is predetermined in the outer peripheral gap g of the first substrate G1 and the second substrate G2. , The sealing member m is formed by cooling and solidifying (substrate bonding step), (3) the through hole H is sealed with the sealing plug M through the through hole forming step and the substrate bonding step. The air in the airtight chamber k defined by the first substrate G1, the second substrate G2, and the joining member m of the previous glass panel intermediate is exhausted through the through-hole H formed in the first substrate G1, and the airtight chamber K is exhausted. To a vacuum atmosphere (exhaust process), (4) molten SnAgAl alloy ( Filling the through hole H of the glass panel intermediate (through hole filling step), (5) forming the sealing plug M by cooling and solidifying the molten solder filled in the through hole H. The through hole H is sealed (through hole sealing step). The molten metal filling apparatus according to the present invention is an apparatus used in the through-hole filling process.

  A filling apparatus according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the filling device 10 includes a thread solder supply means 11, a heating supply means 12, a moving means 14, an airtight chamber 15 containing each of the above means, a control means 16 for controlling the operation of each of the above means, It is comprised with the atmosphere control means 17 which controls the atmosphere of the closed room 15. FIG. Hereinafter, each component will be described.

[Thread solder supply means]
Reference numeral 11a is a bobbin-shaped thread solder sending section for winding wire-shaped thread solder M made of a SnAgAl alloy, which is a low-melting-point metal material. . Reference numeral 11c denotes a substantially tubular thread solder guide portion having both ends open and having a through hole which is a guide passage through which the thread solder M can be inserted. In the filling device 10, the thread solder M formed to have a diameter of about 2 mm is used, and in the initial state, the tip portion of the thread solder M wound around the thread solder delivery part 11a is drawn out from the thread solder delivery part 11a. The yarn solder guide portion 11c is set in a state of being inserted into the guide passage from the upper end opening and protruding from the lower end opening.

  Reference numeral 11b denotes an ultrasonic wave application unit that irradiates ultrasonic waves to the contact interface between the molten solder M1 and the surface S of the glass substrate w1 via the thread solder (hereinafter referred to as molten solder) M1 melted by the heating supply means 12. It is. In the filling apparatus 10, the ultrasonic application unit 11 b is incorporated in the heating supply means 12 for the convenience of the apparatus configuration, and the superposition of the molten metal M1 filled in the through hole H through the filling means 12 a of the heating supply means 12 is performed. It is comprised so that a sound wave may be applied (refer FIG. 2).

[Heating and melting means]
In the heating and melting means 12, reference numeral 12a is a filling means for filling the through hole H with molten solder M1 obtained by heating and melting the thread solder M supplied from the thread solder supply means 11. As shown in FIG. 2 (a), the filling means 12a having a filling cylinder 12b at the center has a substantially bowl shape and is made of stainless steel having a high thermal conductivity. Reference numeral 12c is a heater wound around the outer periphery of the filling means 12a, and heats the filling means 12a to a temperature equal to or higher than the melting point of the thread solder M. Reference numeral 12z denotes a main body portion in which the filling means 12a is fixed and a heating circuit of the heater 12c is incorporated. As described above, the ultrasonic generator, the control circuit, and the like of the ultrasonic application unit 11b are built in the main body 12z.

  As shown in FIG. 2 (a), which is a plan view of the filling means 12a, taken along the line aa of FIG. 2 (c), the cylindrical filling cylinder 12b provided at the center of the filling means 12a is 12 g of the melt surface where the end surface contacts the thread solder M to generate the molten solder M1, the opening of the upper end surface is the inlet 12e, the opening of the bottom end surface having the same diameter as the inlet 12e is the outlet 12f, the inlet 12e and the outlet 12f. The sealed pipe line connecting the two forms a flow path 12d, and the molten solder M1 generated at the melting surface 12g flows into the flow path 12d from the inlet 12e, flows down the flow path 12d, and passes through the through hole H. It flows out from the outflow port 12f arrange | positioned facing the upper opening H1. In FIG. 2A, the filling means 12a is arranged so that the upper opening H1 of the through hole H and the outlet 2f are in close contact with each other, but a predetermined gap is formed between them in the vertical direction. May be arranged.

  Here, in the filling cylinder 12b of this aspect, the diameter ΦB of the outlet 12f is equal to or larger than the diameter ΦC of the upper opening H1 of the through hole H. By setting the size of the outlet 12f in this way, the molten solder M1 supplied from the outlet 12f immediately contacts the peripheral wall of the through hole H at the inlet H1 and flows down while adhering to the peripheral wall due to wetting. It is possible to prevent the molten solder M1 from dripping downward from the through hole H and leaking out.

  As a preferable configuration for smoothly flowing the molten solder M1 on the melting surface 12g and the flow path 12d, a Cr layer is formed on the surface in order to improve wettability with the molten solder M1. A layer made of Al, Mo, W, V, Nb, Ta may be provided instead of the Cr layer. Further, the flow path 12d of this aspect is subjected to nitriding treatment as an elution preventing treatment so that the surface thereof is hardly eroded from the molten solder M1, and the Cr layer is formed on the nitrided surface. . What is necessary is just to select suitably the process which improves the said wettability, and the elution prevention process with the molten metal made into object.

  Here, the yarn solder guide portion 11c is positioned and fixed to the fixing member 14e of the moving means 14 with the lower end thereof directed toward the inlet 12e opened at the upper end surface of the filling cylinder 12b. When the filling device 10 is in operation, the thread solder M sent quantitatively from the thread solder delivery section 11a is guided through the guide passage of the thread solder guide section 11c and fed out from the opening at the lower end, and the end face thereof is It abuts on the melting surface 12g in a posture to close the inflow port 12e. The heating and melting means 12 is positioned and fixed to the fixing member 14e of the moving means 14 so that the positional relationship between the thread solder M fed from the thread solder supply portion 12c and the melting surface 12g can be maintained.

  The thread solder M fed out from the opening at the lower end of the thread solder guide portion 11c having the above configuration abuts on the molten surface 12g heated by the heater 12c and becomes the molten solder M1. Here, as shown in FIG. 2A, the diameter ΦB of the inflow port 12e is less than the diameter ΦA of the end surface of the thread solder M in contact with the melt surface 12g. Even when the oxide E1 is generated on the outer peripheral surface of the thread solder M, the inflow of the oxide E1 into the flow path 12d is caused by the non-opening portion on the outer periphery of the inlet 12e, that is, the molten surface 12g. Only the clean molten solder M1 that is blocked and not mixed with the oxide E1 flows into the flow path 12d. Furthermore, since the flow path 12d is a sealed non-oxidizing atmosphere, the progress of oxidation of the molten solder M1 during the supply process is also suppressed. Since the thickness of the layer of the oxide E1 generated on the surface of the thread solder M stored in the atmosphere is usually about several tens of μm, the difference in diameter between the thread solder M and the inlet 12e, that is, ΦA It is sufficient to set −ΦB around 1 mm, but the dimensions may be appropriately determined depending on the low melting point metal material to be supplied.

  In FIG. 2, reference numeral 12i indicates that the molten solder M1 containing the oxide E1 that has been prevented from flowing into the flow path 12d as described above is not attached to the first substrate G1 by mistake. It is the storage part 12i which receives and stores the leaked molten solder. The storage part 12i of this aspect connects the outer peripheral surface of the filling cylinder 12b, the inner peripheral surface of the outer cylinder 12h arranged coaxially so as to surround the filling cylinder 12b, and the bottom ends of the filling cylinder 12b and the outer cylinder 12h. An annular groove defined by the upper surface of the annular plate. The molten solder stored in the storage unit 12i may be recovered by appropriate means such as suction.

  In FIG. 2, reference numeral 12j denotes a substantially flat projection extending downward along the axis of the flow path 12d. As shown in FIG. 2B, which is a bb cross-sectional view of FIG. 2C, the protrusion 12j that can be inserted into the through hole H is formed so as to cross the bottom end of the filling cylinder 12b. The base end protrudes from the bottom end face of the filling cylinder 12b with the protrusion height shown in the drawing h in a state where the base end is included in the outflow port 12f. This protrusion height h is determined so that the filling means 12a is positioned at a predetermined position to fill the through hole H with the molten solder M1 and the outflow port 12f is disposed opposite to the upper opening H1 of the through hole H. The height is set so that the lower end of the protrusion 12j reaches the vicinity of the bottom opening of the hole H. Further, as shown in FIG. 2C, which is a plan view of the filling means 12a, a molten solder is provided between the protrusion 12j and the outlet 12f so as not to hinder the flow of the molten solder M1 flowing out from the outlet 12f. A gap through which M1 can flow is formed. In addition, in order to make the molten solder M1 flow smoothly, it is preferable that the surface of the protrusion 12j is subjected to a process for improving wettability with the molten solder M1.

  The protruding portion 12j is not limited to the above configuration, and a cylindrical protruding portion 22j that can be inserted into the through hole H may be provided below the outflow port 12f, for example, as a filling unit 22a illustrated in FIG. Although not shown, a columnar or needle-like protrusion may be provided. In addition, when the molten metal has a high viscosity and low fluidity, or when the ratio of the depth to the diameter of the through hole H is high, the molten metal is inside the through hole H due to the wetting of the peripheral wall of the through hole H and the molten metal. Therefore, the protrusions are not necessarily provided.

  Reference numeral 12k in the protrusion 12j is a contact portion that comes into contact with the peripheral wall of the through hole H. In the protrusion 12j of this aspect, as shown in FIG. 2 (b), the width of the protrusion 12j is such that the side surface can come into contact with the peripheral wall of the through-hole H when the protrusion 12j is inserted into the through-hole H. T is set to be approximately the same size as the diameter ΦC of the through hole H, and the side surface of the protrusion 12j is configured to be the contact portion 12k. Note that the contact portion 12k does not need to contact the entire peripheral wall in the axial direction of the through hole H as shown in the drawing, and the peripheral wall of the through hole H like the contact portion 32k of the filling means 32a shown in FIG. In this case, it is desirable to form a contact portion 32k at the lower end of the projection 32j as shown in the drawing.

[transportation]
As shown in FIG. 1, the driving means 14 includes a gate-shaped support 14a, an elevating part 14b fixed to the upper side of the support 14a, and provided between both sides of the support 14a. A horizontal moving portion 14c that can move in the horizontal direction; a table 14d provided in the horizontal moving portion 14c for placing the glass panel intermediate P1 in a horizontal posture with the first substrate G1 in which the through holes H are formed facing upward; It consists of As described above, the thread solder supply part 11c and the heating and melting means 12 are connected to the lower end of the elevating part 14b via the fixing member 14e. In the following, as shown in FIG. 1, the ascending / descending direction of the ascending / descending portion 14b is referred to as the Z-axis direction, the moving direction of the horizontal moving portion 14c and the direction parallel to the paper surface as the X-axis direction, and the perpendicular direction as the Y-axis direction. .

  The table 14d may be provided with a panel-like heating element that can heat the first substrate G1. By heating the first substrate G1 to about the melting temperature of the molten solder M1 with this heating element, it is possible to prevent damage to the first substrate G1 due to the stress caused by the temperature difference between the molten solder M1 and the first substrate G1. Moreover, since the wettability between the molten solder M1 and the first substrate G1 is increased, the sealing performance of the through hole H can be improved.

[Control means]
As shown in FIG. 1, the control means 16 is comprised by the control part 16b connected with the said each component of the filling apparatus 10 via the telecommunication line 16a, and controls operation | movement of each component. Specifically, the control unit 16b is configured by a computer, and a calculation unit (CPU) reads out an operation program and command data stored in the storage unit (memory) and appropriately calculates them, whereby the yarn solder sending unit 11a. To control the supply amount of the thread solder M, to control the heat generation temperature by instructing to the heater 12c, to instruct the elevator 14b and the horizontal moving part 14c constituting the moving means 14 to It is configured to control the movement route and movement speed.

[Airtight room]
The airtight chamber 15 is formed by a housing 15 a that forms an airtight space 15 b that encloses each of the components of the filling device 10. The housing 15a is provided with an opening (not shown) for loading and unloading the glass panel P, and the opening is provided with an airtight door for ensuring the airtightness of the airtight space 15b. Yes.

[Atmosphere control means]
The atmosphere control means 17 includes a supply pump, a gas supply unit 17b that can supply a predetermined gas stored therein at a predetermined pressure, a vacuum pump 17c that evacuates the hermetic space 15b of the hermetic chamber 15, and a gas supply unit 17b. And a supply pipe 17a that connects the vacuum pump 17c to the airtight space 15b, and controls the airtight space 15b to a predetermined atmosphere. Here, the gas supply unit 17b includes a plurality of types of gases applied according to the use of the first substrate G1, for example, an inert gas such as argon gas and nitrogen gas, and a reducing gas such as hydrogen gas and carbon monoxide. It is possible to separate and store gas and oxygen gas, which is an oxidizing gas, and further, these gases can be mixed at a predetermined ratio and supplied to the airtight space 15b by a mixing valve provided in the gas supply unit 17b. .

The operation of the filling apparatus 10 having the above configuration will be described with reference to FIGS.
As shown in FIG. 1, after the glass panel intermediate P1 formed through the through-hole forming step and the substrate bonding step already described is placed on the table 14d so that the first substrate G1 is on the upper side, the filling device 10 is started. To do. The filling device 10 supplies the oxygen gas from the gas supply unit 17b after operating the vacuum pump 17c to deaerate air from the airtight space 15b so that the airtight space 15b is replaced with an oxygen atmosphere having a predetermined concentration. Further, the filling device 10 generates heat from the heating element built in the table 12d, and heats the first substrate G1 so that the temperature becomes about the melting point of the molten solder M1.

  As shown in FIG. 4A, the filling apparatus 10 horizontally moves the horizontal moving portion 14c in the X and Y axis directions so that the through hole H of the first substrate G1 and the axis of the filling cylinder 12b coincide with each other. The filling means 12a is arranged at a position where the outlet 12f faces the upper opening H1 of the hole H. Thereafter, as shown in FIG. 4B, the filling device 10 lowers the elevating part 14b so that the protruding part 12j of the filling cylinder 12b is inserted into the through hole H, and moves the filling means 12a in the Z-axis direction. Position to. At this time, as shown in FIG. 2B, the lower end of the protrusion 12j is positioned in the vicinity of the lower opening of the through hole H, and the contact portion 12k of the protrusion 12j is in contact with the peripheral wall of the through hole H. It has become.

  Thereafter, the filling device 10 drives the motor of the yarn solder delivery unit 11a and feeds the yarn solder M from the yarn solder guide unit 11c. As shown in FIG. 4C, the fed-out solder Y is brought into contact with the molten surface 12g heated by the heater 12c to generate molten solder M1. As described above, the oxide E1 formed on the outer peripheral surface of the thread solder M is separated by the molten surface 12g (the upper end surface of the filling cylinder 12b), and only the clean molten solder M1 into which the oxide E1 is not mixed is introduced into the inlet. 12e flows into the flow path 12d, flows out from the outflow port 12f, and is supplied to the through hole H. Further, the molten solder M1 containing the separated oxide E1 overflows from the upper end surface of the filling cylinder 12b, and is received and stored in the storage unit 12i.

  The molten solder M <b> 1 supplied to the through-hole H flows downward while contacting the peripheral wall of the through-hole H due to wetting and filling the through-hole H. As shown in FIG. 4D, when the molten solder M1 reaches the lower end of the protruding portion 12j inserted into the through hole H, the downward flow of the molten solder M1 from the lower end of the protruding portion 12j causes the protruding portion to flow. Regulated by wetting with 12j. The filling device 10 stops the supply of the thread solder M when the molten solder M1 reaches the lower end of the protrusion 12j, and then raises the filling means 12. Then, the molten solder M1 is also filled in the portion where the protrusion 12j was present, and the through hole H is filled with the molten solder M1.

  Thereafter, heating of the first substrate G1 by the heating element is stopped, the molten solder M1 filled in the through hole H is cooled and solidified to form a sealing plug M, and the through hole H is sealed.

DESCRIPTION OF SYMBOLS 10 Filling device 11 Yarn solder supply means 12 Heat supply means 12a Filling means 12b Filling cylinder 14 Moving means 15 Airtight chamber 16 Control means 17 Atmosphere control means P Glass panel H Through hole M Yarn solder M1 Molten solder

Claims (6)

  A filling device that fills a through-hole provided in an object to be filled with molten metal, where a low-melting-point metal material in a solid phase contacts and melts to generate a molten metal, and a melting generated on the melting surface An inflow port through which the metal flows is provided at one end surface, and an outflow port is provided at the other end surface that is disposed opposite to the one opening of the through hole, and the molten metal generated at the melting surface is provided at the inflow port. A filling means provided with a filling cylinder in which a flow path flowing from the outlet to the outlet is formed, and the area of the inlet of the filling cylinder is less than the area of the low melting point metal material in contact with the melting surface Characteristic filling device.   The filling means includes a protrusion that protrudes from the other end surface of the filling cylinder in a state in which a base end is included in the outlet and can be inserted into the through hole, and the protrusion is formed in one opening of the through hole. The filling device according to claim 1, wherein the filling device has a protrusion height that reaches a tip near the other opening of the through hole in a state where the outlet of the filling cylinder is disposed at an opposed position.   The filling device according to claim 2, wherein the protrusion has a contact portion that contacts a peripheral wall of the through hole.   The filling device according to claim 2, wherein a guide groove for guiding the molten metal is formed in the protrusion.   The filling device according to any one of claims 1 to 4, wherein a size of the outlet is equal to or larger than a size of one opening of the through hole.   The filling device according to any one of claims 1 to 5, wherein the filling unit includes a storage portion that is provided so as to surround the filling tube and stores molten metal overflowing from one end surface of the filling tube.

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