JP2011068081A - Metal vapor deposition film for insert molding and manufacturing method of insert molding using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure of a metal vapor deposition film having an effect for suppressing the generation of a crack on a metal vapor deposition film layer in a metal vapor deposition film having metal glossiness usable to a film insert method. <P>SOLUTION: A metal vapor deposition film for insert molding described in the Claim 1 comprises a metal vapor deposition layer having a thickness of 200-400 nm formed on one surface of a substrate plastic film and a printing layer formed on the metal vapor deposition layer, and the metal vapor deposition film for insert molding includes such a structure as laminating a plastic film having the same material and the same thickness with the substrate material as a backer layer on the printing layer. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to surface decoration of plastics such as electric devices such as mobile phones and personal computers and cosmetic containers, and in particular, metal vapor-deposited films having a metallic luster used in film insert methods and insert molding which is a decorative molded product It relates to the structure and manufacturing method of the product.

In recent years, surface decoration of plastic molded products has been required to be highly expressive.
In general, surface decoration of plastic molded products includes direct printing, transfer printing, foil stamping, painting, underwater transfer, and other methods for decorating plastic molded products after molding, in-mold molding methods and inserts. There is a method of decorating at the same time as molding using simultaneous painting with injection molding by a molding method. By these decoration methods, it is possible to express by decoration using a variety of patterns such as abstract patterns, photographs, woodgrains, designs of various patterns, and gradations.

  However, as a method for obtaining a product having a gloss like a metal surface, a method of directly metal plating on the surface of a plastic molded product has been the mainstream.

Japanese Patent Application No. 8-219170

  The conventional plating film formed on the surface of plastic molded products is a thick film with a thickness of 0.5 to 1 mm, so the flexibility that is a characteristic of the resin is completely obscured, and the product with poor shock absorption It becomes. In addition, the overcoat material must be clear-coated after plating to protect the plating film, and when colored, another colored coating is required after plating, which increases the number of processes and costs. It becomes large and productivity is bad. In addition, since waste liquid treatment for plating and painting is required, it is necessary to take measures against deterioration of the working environment.

  On the other hand, in a metal vapor deposition film, the said vapor deposition layer is extended by processes, such as shaping | molding, and a crack is produced, and in the surface decoration of the plastic molded article using a metal vapor deposition film, the fall of the design property tends to be a problem.

In order to solve the above-mentioned drawbacks, the present invention has an effect of suppressing the occurrence of cracks in the metal vapor deposition layer related to the decoration performance in insert molding using a metal vapor deposition film bearing the surface decoration having a metallic surface gloss. It is an object of the present invention to provide a production method for obtaining a molded article with high design properties by realizing a structure of a metal vapor-deposited film and using it for injection molding by a film insert method.

  As means for solving the above problems, the invention according to claim 1 is characterized in that a metal vapor deposition layer having a thickness of 200 to 400 nm is formed on one surface of a plastic film serving as a substrate, and the metal vapor deposition layer is formed on the metal vapor deposition layer. A metal-deposited film for insert molding, which is characterized in that a printed layer is formed.

  The invention described in claim 2 is characterized in that a plastic film having the same material and the same film thickness as the base material is further bonded as a backer layer on the printed layer. The metal-deposited film for insert molding as described.

  The invention according to claim 3 is the insert molded metal vapor-deposited film according to claim 1 or claim 2, wherein the metal vapor-deposited layer is not formed on the surface of the plastic film as the base material. The metal-deposited film for insert molding is characterized in that a hard coat layer is formed.

  In the invention according to claim 4, a metal vapor deposition layer having a thickness of 200 to 400 nm is formed on one surface of a plastic film serving as a substrate, and a printing layer is formed on the other surface of the plastic film. This is a metal vapor deposition film for insert molding characterized by this.

  Further, the invention described in claim 5 is the surface of the metallized film for insert molding according to claim 4 on which the metal deposited layer is formed and the hard of the plastic film in which a hard coat layer is formed on one side. A metal-deposited film for insert molding, which is characterized in that surfaces having no coating layer are bonded together.

  The invention according to claim 6 is the insert molded metal vapor-deposited film according to any one of claims 1 to 5, wherein a buffer layer is formed between the plastic film as the base material and the metal vapor-deposited layer. The metal-deposited film for insert molding characterized by the above.

  The invention according to claim 7 is characterized in that the metal vapor deposition layer of the metal vapor deposition film for insert molding according to any one of claims 1 to 6 has a laminated structure of tantalum oxide and silicon dioxide. This is a metal vapor deposition film for insert molding.

  The invention according to claim 8 is an insert characterized in that the metal vapor deposition layer of the metal vapor deposition film for insert molding according to any one of claims 1 to 6 has a laminated structure of zirconia and silicon dioxide. This is a metal vapor deposition film for molding.

The invention according to claim 9 is a three-dimensional shape by installing the metal-deposited film for insert molding according to any one of claims 1 to 8 in an injection mold, heating, and vacuum-sucking. After being processed into a mold and closely contacting the cavity forming surface of the injection mold, the mold is clamped and the molding resin is injected into the cavity. At the same time as molding the resin molded product, the metal vapor deposited film is adhered to the resin molded product. This is a method for producing a featured insert molded product.

  In the present invention, by using a metal vapor deposition film for insert molding obtained by forming a metal vapor deposition layer on one surface of a plastic film, the metal vapor deposition film and the molding in an injection mold are used. Since it can be integrally formed with resin, there is no need for waste liquid treatment for plating and painting. Moreover, since the hard coat layer for protecting the metal vapor deposition layer is formed in advance on the metal vapor deposition film for insert molding, a separate coating is unnecessary, and the production efficiency is good.

Moreover, since it becomes possible to suppress generation | occurrence | production of the crack in the said metal vapor deposition layer by setting it as the structure which provided the backer layer in the metal vapor deposition film of this invention, it has the high design property without metal coloring deterioration. A resin molded product can be obtained.

It is sectional drawing of 1st Embodiment of the metal vapor deposition film for insert molding of this invention. It is sectional drawing of 2nd Embodiment of the metal vapor deposition film for insert molding of this invention. It is sectional drawing of 3rd Embodiment of the metal vapor deposition film for insert molding of this invention. It is sectional drawing of 4th Embodiment of the metal vapor deposition film for insert molding of this invention. It is sectional drawing which shows the structure at the time of forming a buffer layer between the plastic film and metal vapor deposition layer of the metal vapor deposition film for insert molding of the 1st Embodiment of this invention. It is sectional drawing which shows the structure at the time of forming a buffer layer between the plastic film and metal vapor deposition layer of the metal vapor deposition film for insert molding of the 2nd Embodiment of this invention. It is sectional drawing which shows the structure at the time of forming a buffer layer between the plastic film and metal vapor deposition layer of the metal vapor deposition film for insert molding of the 4th Embodiment of this invention.

  Below, the metal vapor deposition film of this invention and embodiment of invention regarding the manufacturing method of the insert molded product using the said metal vapor deposition film are described.

  The structure 10 shown in FIG. 1 shows the explanatory drawing which shows the example of 1st Embodiment of the metal vapor deposition film of this invention in a cross section. First, the plastic film 0 is heated and vacuum-sucked, so that the plastic film 0 comes into close contact with the cavity forming surface of the injection mold and can be processed into a three-dimensional shape having a large unevenness difference.

  As the plastic film 0, polyethylene (polyethylene terephthalate, polyethylene naphthalate), olefin, acrylic, and polyimide can be used. At this time, by using the plastic film 0 on which one side of the hard coat layer 3 has been applied in advance, it is not necessary to separately apply the hard coat layer 3 in a later step, so that the number of steps increases and It is possible to avoid an increase in cost.

  The metal vapor-deposited layer 1 is heated together with the plastic film 0 and is vacuum-sucked so that the metal vapor-deposited layer 1 is brought into close contact with the cavity forming surface of the injection mold, thereby generating a crack when the metal vapor-deposited layer 1 is deformed into a three-dimensional shape. Therefore, it is necessary to suppress the occurrence of cracks. For this reason, although the one where the film thickness of the said metal vapor deposition layer 1 is thinner is preferable, since transparency will arise when a film thickness is too thin, it is desirable to set it as thickness 200-400 nm.

  In addition, the said metal vapor deposition layer 1 is good also as any structure of a single layer film and a laminated film, but when aiming at the improvement of the design property by metal-like surface gloss, it is better to raise the surface reflectance. Since it is more effective, in order to obtain an interference effect due to multiple reflection at the laminated interface of the metal vapor deposition layer, the metal vapor deposition layer 1 is preferably produced in a laminated configuration.

  In this case, in order to increase the surface reflectance due to the interference effect due to the multiple reflection at the laminated interface, it is advantageous that the difference in the refractive index of each layer is larger. A combination of layers or a combination of zirconia and silicon dioxide layers is preferred.

  Moreover, the metal vapor deposition layer 1 is produced by EB vapor deposition method or sputtering method, In this case, it is also possible to control the adhesiveness with the plastic film 0 by substrate heating or ion beam assist method. In addition, the metal vapor deposition film having the metal vapor deposition layer 1 can be used by performing film formation taking into account that the internal stress of the vapor deposition film produced by the film formation technique of the EB vapor deposition method or the sputtering method has a compressive stress. In the processing into a three-dimensional shape by vacuum suction in the injection mold and the subsequent injection molding, it is also possible to delay the generation of cracks due to the stretched metal deposition film.

  The suppression printing layer 2 is for absorbing and holding heat efficiently, and for maintaining the metal-like brightness of the metal vapor-deposited layer 1, but is formed by a printing method using a urethane-based resin. be able to. The suppression printing layer 2 efficiently absorbs and holds heat so that the other layers can be kept in a flexible state at a high temperature by transferring heat to the other layers and keeping them warm during injection molding. In order to improve the moldability. Moreover, when the suppression printing layer 2 is black, heat absorption and heat retention are better, and the effect of making the metal-like brightness of the metal vapor-deposited layer 1 more pronounced is higher.

  The structure 20 shown in FIG. 2 shows the explanatory drawing which shows the example of 2nd Embodiment in the metal vapor deposition film for insert molding of this invention characterized by providing the backer layer 4 in a cross section. By providing the backer layer 4 as shown in FIG. 2, it is possible to mitigate the impact against the injection of the molding resin from the suppressed printing layer 2 side during injection molding. This is effective because a certain deterrent effect can be obtained against the occurrence of cracks.

  Moreover, it is preferable to use the same material and the same film thickness as the plastic film 0 used as the base material for the backer layer 4. By adopting such a configuration, it becomes possible to make the thermal expansion and contraction of the plastic films 0 and 4 sandwiching the metal vapor deposition layer 1 to the same level, and therefore it occurs in the metal vapor deposition layer 1 located at the center of the overall configuration. It becomes possible to avoid the concentration of the load to one pole, which is effective in reducing cracks in the metal vapor deposition layer 1.

  FIG. 3 is a sectional view showing a structure 30 as an example of the third embodiment of the metal-deposited film for insert molding according to the present invention. The metal-deposited metal film formed on one surface of the plastic film 0 serving as a substrate. In this configuration, the suppression printing layer 2 is formed on the surface opposite to the layer 1.

  FIG. 4 is a sectional view showing a configuration 40 as an example of the fourth embodiment of the metal-deposited film for insert molding according to the present invention. On the metal-deposited layer 1 of the configuration 30, the plastic film 0 and The backer layer 4 having the same material and the same film thickness is laminated.

  Here, as the backer layer 4, a plastic film having a hard coat layer 3 coated on one side in advance is used, and this is applied to the structure of FIG. 3 so that the hard coat layer 3 is located on the outermost surface. By performing the matching, it is not necessary to separately apply the hard coat layer 3 in a subsequent process, and therefore it is possible to avoid an increase in the number of processes and an increase in cost.

  Furthermore, the configurations 101, 201, and 401 shown in FIGS. 5, 6, and 7 are the same as the configurations 10, 20, and 40 shown in FIGS. 1, 2, and 4, respectively. The buffer layer 5 is formed between the layers 1. By providing the buffer layer 5, the effect of blocking the influence of deformation due to thermal expansion and contraction of the plastic film 0, which is a base material, to the metal vapor deposition layer 1 can be obtained. It is effective. The material of the buffer layer 5 may be either organic or inorganic, and is preferably as thin as possible.

  Hereinafter, the metal-deposited film for insert molding of the present invention and the process of producing a resin molded product by insert molding using the same will be described with reference to examples.

  As the plastic film 0 serving as a base material, a PET film having a thickness of 125 μm with a hard coat 3 coated on one side was used. On the surface of the PET film on which the hard coat is not applied, the metal vapor-deposited layer 1 is formed by EB vapor deposition in a laminated structure of tantalum oxide and silicon dioxide, and has a total thickness of 280 nm. A film was formed. Then, the metal deposition film 10 for insert molding of this invention was obtained by forming the printing layer 2 restrained on this by screen printing.

  The metal vapor deposition film 10 for insert molding having the above-described layer structure is temporarily wound to form a roll-shaped roll, and the metal vapor-deposited film 10 is unwound from the roll-shaped roll, continuously on the front surface of the cavity forming surface of the injection mold. Inserted. Next, the metal vapor deposition film 10 is fixed by a clamp member around the cavity forming surface and softened so that the film surface temperature becomes 100 ° C., and the space between the metal vapor deposition film 10 and the cavity forming surface is vacuumed. The metal vapor-deposited film 10 was brought into close contact with the cavity forming surface of the injection molding die by suction.

  Next, an acrylic resin having a molding temperature of 220 to 250 ° C. was injection-molded as a molding resin into a cavity obtained by clamping the mold to obtain a resin molded product. After cooling this resin molded product, it was taken out from the mold, and a hard-coated blue colored mobile phone product was obtained.

  A layer having a thickness of 125 μm, which is not coated with a hard coat, is further used as the backer material 4 for the layer in which the suppression printing layer 2 is formed by the same process as in Example 1, and this is suppressed as the backer material 4. By sticking on 2, the metal vapor deposition film 20 for insert molding of this invention was obtained.

  Next, by using the metal-deposited film 20 for insert molding having the above-described structure, vacuum molding and injection molding are performed in the same process as in Example 1, thereby obtaining a blue mobile phone product with a hard coat. It was.

  As the plastic film 0 used as a base material, a 125 μm thick PET film coated with a hard coat on one side was used, and tantalum oxide and silicon dioxide were laminated on the hard coat by EB vapor deposition. A metal vapor deposition layer 1 having a thickness of 280 nm consisting of a total of 6 layers was formed.

  Subsequently, a suppression printing layer 2 was formed on the surface of the plastic film 0 opposite to the metal deposition surface 1. Thereby, the plastic film with a metal vapor deposition layer of the structure that the hard-coat layer which functions as the buffer layer 5 exists between the plastic film 0 of a base material and the metal vapor deposition layer 1 was produced.

  Furthermore, a 125 μm-thick PET film with a hard coat applied on one side is formed on the surface on which the hard coat is not applied, and the metal vapor-deposited layer 1 of the plastic film with the metal vapor-deposited layer configured as described above. The metal deposition film 401 for insert molding of this invention was obtained by bonding the surface of the side which is present.

Next, by using the metal mold deposition film 401 for insert molding having the above-described configuration, vacuum molding and injection molding are performed in the same process as in Example 1 to obtain a hard-coated blue mobile phone product. It was.

DESCRIPTION OF SYMBOLS 0 ... Plastic film for base materials 1 ... Metal vapor deposition layer 2 ... Control printing layer 3 ... Hard coat layer 4 ... Backer layer 5 ... Buffer layer 10 ... Insert without buffer layer Formed metal vapor deposition film 20 .. Insert molding metal vapor deposition film 30 with backer layer and no buffer layer... Metal vapor deposition layer was formed on one side of the plastic film, and printing layer was formed on the other side. In the metal molding film for insert molding 201... 20, in which a buffer layer is further formed in the metal deposition film for insert molding 101. Metal mold deposition film for insert molding in which a buffer layer is further formed in metal film for insert molding film 401. Irumu

Claims (9)

  A metal vapor deposition film for insert molding, wherein a metal vapor deposition layer having a thickness of 200 to 400 nm is formed on one surface of a plastic film to be a substrate, and a printing layer is formed on the metal vapor deposition layer.   2. The metallized film for insert molding according to claim 1, wherein a plastic film having the same material and the same film thickness as the base material is further bonded as a backer layer on the printed layer.   The metallized film for insert molding according to claim 1 or 2, wherein a hard coat layer is formed on a surface of the plastic film that is a base material on the side where the metal vapor deposited layer is not formed. A metal-deposited film for insert molding.   A metal vapor deposition film for insert molding, wherein a metal vapor deposition layer having a thickness of 200 to 400 nm is formed on one surface of a plastic film as a base material, and a printing layer is formed on the other surface of the plastic film. .   The surface on which the metal vapor deposition layer of the metal vapor deposition film for insert molding according to claim 4 is formed and the surface on which the hard coat layer is formed on one side are bonded to each other. A metal-deposited film for insert molding.   The metallized film for insert molding according to any one of claims 1 to 5, wherein a buffer layer is formed between the plastic film serving as a base material and the metallized metal layer. the film.   The metal-deposited metal film for insert molding according to any one of claims 1 to 6, wherein the metal-deposited layer of the metal-deposited film for insert molding has a laminated structure of tantalum oxide and silicon dioxide.   The metal-deposited metal film for insert molding according to any one of claims 1 to 6, wherein the metal-deposited layer of the metal-deposited film for insert molding has a laminated structure of zirconia and silicon dioxide.   The insert-deposited metal vapor-deposited film according to any one of claims 1 to 8 is placed in an injection-molding mold, heated, and vacuum-sucked to be processed into a three-dimensional shape so that the cavity of the injection-molding mold A method for producing an insert-molded product, comprising: adhering to a forming surface, then clamping and injecting a molding resin into a cavity, and simultaneously bonding a metal vapor-deposited film to the resin-molded product.

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