JP2011065748A - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
JP2011065748A
JP2011065748A JP2009212629A JP2009212629A JP2011065748A JP 2011065748 A JP2011065748 A JP 2011065748A JP 2009212629 A JP2009212629 A JP 2009212629A JP 2009212629 A JP2009212629 A JP 2009212629A JP 2011065748 A JP2011065748 A JP 2011065748A
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Prior art keywords
circuit board
connector
housing
electronic control
metal fitting
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Yoshinori Wakana
芳規 若菜
Masaru Kamoshida
勝 鴨志田
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Priority to JP2009212629A priority Critical patent/JP2011065748A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To overcome the problem in a conventional art, wherein a fitting is only mounted on surfaces of both ends of a connector so that the fitting and a substrate are easy to peal if a force is applied thereto from the external. <P>SOLUTION: The electronic control device includes a circuit board on which electronic parts are mounted, a connector having a fitting for fixating the circuit board and a terminal pin for connecting to the outside, a housing for protecting the circuit board, and an enclosure sandwiching the circuit board and the connector. The terminal pin and the fitting are connected by soldering, the fitting is fixated on surfaces of both ends and upper surface of the connector, and the upper surface of the connector and the enclosure are connected via an adhesive. An electrically conductive sealant may be used for the adhesive. The adhesive for bonding the enclosure and the connector, and the adhesive for bonding the fitting and the enclosure may be the same material. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、SMT(Surface mount technology)コネクタを実装している電子制御装置に関する。   The present invention relates to an electronic control device on which an SMT (Surface mount technology) connector is mounted.

従来、コネクタの両端の面に金具を取り付け、当該金具と基板をはんだにより接続する技術がある(特許文献1参照)。又、絶縁性ハウジング,金属製シールド、及び端子ピンと一体成形したボードロックからなり、ボードロックの爪が基板の回路形成された開口内壁に食い込んで固定され、端子ピンがパッドと表面実装するSMTコネクタ構造を備えた電子制御装置がある(特許文献2参照)。   Conventionally, there is a technique in which metal fittings are attached to both end faces of a connector, and the metal fittings and a substrate are connected by solder (see Patent Document 1). The SMT connector is composed of an insulating housing, a metal shield, and a board lock formed integrally with the terminal pin. The claw of the board lock bites into the inner wall of the circuit board where the circuit is formed, and the terminal pin is surface-mounted with the pad. There is an electronic control device having a structure (see Patent Document 2).

特開2004−319229号公報JP 2004-319229 A 特開2002−324606号公報JP 2002-324606 A

特許文献1によれば、金具がコネクタの両端の面にしか取り付けられていないため、外部から力がかかると、金具と基板が剥がれ易い、という課題がある。   According to Patent Document 1, since the metal fittings are attached only to both end surfaces of the connector, there is a problem that the metal fittings and the substrate are easily peeled off when a force is applied from the outside.

特許文献2によれば、金具がコネクタ全体を覆って、基板と接続する構成となっているが、金具と基板の接続部分において、基板の穴に金具が挿入されているのみであるため、上記同様、金具と基板が剥がれ易い、という課題がある。   According to Patent Document 2, the metal fitting covers the entire connector and is connected to the board. However, in the connection part between the metal fitting and the board, the metal fitting is only inserted into the hole of the board. Similarly, there exists a subject that a metal fitting and a board | substrate are easy to peel off.

そこで、本発明の目的は、コネクタと基板との接続をより強化した電子制御装置を提供することにある。   Accordingly, an object of the present invention is to provide an electronic control device in which the connection between a connector and a board is further strengthened.

上記課題を解決するため、本発明の望ましい態様の1つは次の通りである。   In order to solve the above problems, one of the desirable aspects of the present invention is as follows.

当該電子制御装置は、電子部品を実装する回路基板と、回路基板を固定するための金具、及び外部と接続するための端子ピンを有するコネクタと、回路基板を保護するハウジングと、回路基板とコネクタとを挟み込む筐体を備え、端子ピン及び金具は、はんだにより接続され、金具はコネクタの両端面及び上面で固定され、コネクタの上面と筐体は接着剤を介して接続される。   The electronic control device includes a circuit board on which electronic components are mounted, a metal plate for fixing the circuit board, a connector having terminal pins for connection to the outside, a housing for protecting the circuit board, a circuit board, and a connector. The terminal pins and the metal fittings are connected by soldering, the metal fittings are fixed at both end surfaces and the upper surface of the connector, and the upper surface of the connector and the housing are connected via an adhesive.

本発明によれば、コネクタと基板との接続をより強化した電子制御装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the electronic control apparatus which strengthened the connection of a connector and a board | substrate can be provided.

実施例1における電子制御装置を示す断面図。FIG. 3 is a cross-sectional view illustrating the electronic control device according to the first embodiment. 図1の端子ピン接続面側の電子制御装置を示す断面図。Sectional drawing which shows the electronic control apparatus by the side of the terminal pin connection surface of FIG. 実施例2の電子制御装置を示す断面図。Sectional drawing which shows the electronic control apparatus of Example 2. FIG. 実施例3の電子制御装置を示す断面図。Sectional drawing which shows the electronic control apparatus of Example 3. FIG. 実施例3の電子制御装置を示す断面図。Sectional drawing which shows the electronic control apparatus of Example 3. FIG. 実施例3の電子制御装置を示す断面図。Sectional drawing which shows the electronic control apparatus of Example 3. FIG. 実施例3の電子制御装置を示す断面図。Sectional drawing which shows the electronic control apparatus of Example 3. FIG. 実施例4の電子制御装置を示す断面図。Sectional drawing which shows the electronic control apparatus of Example 4. FIG. 図7の両端クリップが一体となった電子制御装置を示す断面図。Sectional drawing which shows the electronic controller with which the both-ends clip of FIG. 7 was united.

以下、実施例について、具体的に説明する。   Examples will be specifically described below.

図1は、電子制御装置のSMTコネクタ(以下、コネクタ)周辺部を示す断面図である。   FIG. 1 is a cross-sectional view showing the periphery of an SMT connector (hereinafter referred to as a connector) of an electronic control device.

外部と接続するための端子ピン4及び端子ピン4を保護するハウジング2からなるコネクタ1は、一部外周に露出する形で固定された金具3を介して、回路基板5に固定されている。金具3は、コネクタ1の両端に取り付けられるとともに、上面の全体を覆う形で固定されている。金具3と回路基板5は、はんだ10により固定されている。   A connector 1 comprising a terminal pin 4 for connection to the outside and a housing 2 that protects the terminal pin 4 is fixed to a circuit board 5 via a metal fitting 3 that is fixed so as to be partially exposed to the outer periphery. The metal fitting 3 is fixed to the both ends of the connector 1 and covers the entire upper surface. The metal fitting 3 and the circuit board 5 are fixed by solder 10.

金具3は、回路基板5とコネクタ1とを上下で挟み込む筐体のカバー(以下、筐体)8と接触している。回路基板5のパッド6をはんだ10で実装して、金具3と筐体8とを接着剤9を介して接着する。   The metal fitting 3 is in contact with a cover (hereinafter referred to as a housing) 8 of a housing that sandwiches the circuit board 5 and the connector 1 vertically. The pads 6 of the circuit board 5 are mounted with solder 10, and the metal fitting 3 and the housing 8 are bonded via an adhesive 9.

ここで、放熱性の優れた電子制御装置を実現するためには、接着剤9を導電性のシール剤とするのがよい。これにより、回路基板5から、金具3,導電性シール剤,筐体8へとアース回路を電気的に接続することができる。   Here, in order to realize an electronic control device having excellent heat dissipation, it is preferable to use the adhesive 9 as a conductive sealant. Thereby, an earth circuit can be electrically connected from the circuit board 5 to the metal fitting 3, the conductive sealant, and the housing 8.

尚、コネクタ1と筐体8をより強固なものとするためには、接着剤9を絶縁性のシール剤とするのがよい。又、防水性,気密性を確保するための接着剤としては、熱硬化型,室温硬化型,紫外線硬化型等がある。   In order to make the connector 1 and the housing 8 stronger, the adhesive 9 is preferably an insulating sealant. Examples of the adhesive for securing waterproofness and airtightness include a thermosetting type, a room temperature curable type, and an ultraviolet curable type.

図2は、図1の端子ピン接続面側の電子制御装置を示す断面図である。   FIG. 2 is a cross-sectional view showing the electronic control device on the terminal pin connection surface side of FIG.

金具3は、端子ピン4のはんだ10の実装面と同一面ではんだ10を実装し、電子部品7は、金具3と回路基板5とのはんだ10実装面の回路基板5裏面側に配置する。   The metal fitting 3 mounts the solder 10 on the same surface as the solder 10 mounting surface of the terminal pin 4, and the electronic component 7 is arranged on the back side of the circuit board 5 of the solder 10 mounting surface of the metal fitting 3 and the circuit board 5.

図3は、実施例2の電子制御装置を示す断面図である。   FIG. 3 is a cross-sectional view illustrating the electronic control device according to the second embodiment.

端子ピン4とコネクタ1を固定するために、ハウジング2の外周に露出される形で固定された金具3が、接着剤9を介して、筐体8と接着している。   In order to fix the terminal pin 4 and the connector 1, the metal fitting 3 fixed in a form exposed on the outer periphery of the housing 2 is bonded to the housing 8 via an adhesive 9.

筐体8とコネクタ1を接着するための接着剤と、金具3と筐体8を接着するためのシール剤は、同材料であってもよい。そうすると、筐体8とコネクタ1との接着と金具3と筐体8との接着の塗布工程を一度に行うことができる。   The same material may be sufficient as the adhesive agent for adhere | attaching the housing | casing 8 and the connector 1, and the sealing agent for adhere | attaching the metal fitting 3 and the housing | casing 8. FIG. If it does so, the application | coating process of adhesion | attachment with the housing | casing 8 and the connector 1 and adhesion | attachment with the metal fitting 3 and the housing | casing 8 can be performed at once.

図4〜図7は、実施例3の電子制御装置を示す断面図である。   4-7 is sectional drawing which shows the electronic control apparatus of Example 3. FIG.

図4において、ハウジング2と一体成形している金具3は、回路基板5とのはんだ10実装面、及び筐体8との接触面以外はハウジング2の樹脂で覆われている。金具3とハウジング2が一体成型により、コネクタ1の組み立て工数を低減、回路基板5のアース回路を確保できるため、両部品間からの破壊はなくなる。   In FIG. 4, the metal fitting 3 integrally molded with the housing 2 is covered with the resin of the housing 2 except for the solder 10 mounting surface with the circuit board 5 and the contact surface with the housing 8. Since the metal fitting 3 and the housing 2 are integrally molded, the number of steps for assembling the connector 1 can be reduced, and an earth circuit for the circuit board 5 can be secured.

図5において、筐体8は、金具3を両側から挟み込み、金具3と筐体8と接触していることにより、電子部品7の放熱経路、及び回路基板5のアース経路を設ける。   In FIG. 5, the housing 8 sandwiches the metal fitting 3 from both sides and is in contact with the metal fitting 3 and the housing 8, thereby providing a heat dissipation path for the electronic component 7 and a ground path for the circuit board 5.

図6において、金具3のはんだ10実装面の上側から筐体8と接触させることで、こじりに対して応力集中する、パッド6と金具3間のはんだ10のクラックを防ぎ、こじり強度を向上させる。   In FIG. 6, contact with the housing 8 from the upper side of the solder 10 mounting surface of the metal fitting 3 prevents the solder 10 from cracking between the pad 6 and the metal fitting 3 and concentrates the stress on the koji, thereby improving the koji strength. .

図7において、ハウジング2を挟めるために金属製のクリップ11は、穴加工を設けた回路基板5とクリップ11とでハウジング2を挟む。筐体8とクリップ11とを接着剤9を介して、筐体8と接触させることにより、筐体8へのアースを設ける。又、クリップ11が、回路基板5とハウジング2を挟み込むことにより、金具3とパッド間のはんだへの応力集中を低減できる。   In FIG. 7, in order to sandwich the housing 2, a metal clip 11 sandwiches the housing 2 between the circuit board 5 provided with a hole and the clip 11. The housing 8 and the clip 11 are brought into contact with the housing 8 through the adhesive 9 to provide a ground to the housing 8. Further, the clip 11 sandwiches the circuit board 5 and the housing 2 to reduce stress concentration on the solder between the metal fitting 3 and the pad.

図8は、実施例4の電子制御装置を示す断面図である。   FIG. 8 is a cross-sectional view illustrating an electronic control device according to a fourth embodiment.

回路基板5のパッド6と金具3とは、はんだ10を実装している。クリップ11は、図8の断面図から見るとU字型の形状で、回路基板5と金具3を挟んで固定することで、こじりで応力集中するパッド6と金具3間のはんだ10のクラック、及びパッド6の剥がれを防ぐ。又は、クリップ11で回路基板5と金具3をはさんで固定することではんだ10を無くし、こじり荷重を金属製のクリップ11で受けるようにする。   A solder 10 is mounted on the pad 6 and the metal fitting 3 of the circuit board 5. The clip 11 is U-shaped when viewed from the cross-sectional view of FIG. 8, and is fixed by sandwiching the circuit board 5 and the metal fitting 3, so that the cracks of the solder 10 between the pad 6 and the metal fitting 3 are concentrated by stress. And the peeling of the pad 6 is prevented. Alternatively, the solder 10 is eliminated by fixing the circuit board 5 and the metal fitting 3 with the clip 11, and the metal clip 11 receives the twisting load.

又、図9のように、ハウジング2の両側に、回路基板5と金具3を挟んで固定する両側のクリップ11が繋がっている。そしてハウジング下部の凹部にクリップ11を圧入することで、温度変化によるハウジング2と回路基板5の反りを低減させ、こじり強度を向上させる効果もある。   Further, as shown in FIG. 9, clips 11 on both sides that are fixed with the circuit board 5 and the metal fitting 3 interposed therebetween are connected to both sides of the housing 2. Then, by pressing the clip 11 into the recess at the lower part of the housing, there is an effect of reducing the warp of the housing 2 and the circuit board 5 due to a temperature change and improving the twisting strength.

本発明によれば、コネクタに露出されている金属の金具と、電子部品が実装されている回路基板とがアース回路で繋がっていることで、放熱を必要とする電子部品の熱を筐体へ逃すことができる。   According to the present invention, the metal fitting exposed to the connector and the circuit board on which the electronic component is mounted are connected by the ground circuit, so that the heat of the electronic component requiring heat radiation is transferred to the housing. Can be missed.

1 コネクタ
2 ハウジング
3 金具
4 端子ピン
5 回路基板
6 パッド
7 電子部品
8 筐体
9 接着剤
10 はんだ
11 クリップ
DESCRIPTION OF SYMBOLS 1 Connector 2 Housing 3 Metal fitting 4 Terminal pin 5 Circuit board 6 Pad 7 Electronic component 8 Case 9 Adhesive 10 Solder 11 Clip

Claims (7)

電子部品を実装する回路基板と、
前記回路基板を固定するための金具、及び外部と接続するための端子ピンを有するコネクタと、
前記回路基板を保護するハウジングと、前記回路基板と前記コネクタとを挟み込む筐体を備え、
前記端子ピン及び前記金具は、はんだにより接続され、
前記金具は、前記コネクタの両端面及び上面で固定され、
前記コネクタの上面と前記筐体は接着剤を介して接続される、電子制御装置。
A circuit board for mounting electronic components;
A metal fitting for fixing the circuit board, and a connector having terminal pins for connection to the outside;
A housing that protects the circuit board; and a housing that sandwiches the circuit board and the connector.
The terminal pin and the metal fitting are connected by solder,
The metal fittings are fixed at both end surfaces and the upper surface of the connector,
An electronic control device, wherein the upper surface of the connector and the housing are connected via an adhesive.
前記接着剤は、導電性シール剤である、請求項1記載の電子制御装置。   The electronic control device according to claim 1, wherein the adhesive is a conductive sealant. 前記接着剤は、絶縁性シール剤である、請求項1記載の電子制御装置。   The electronic control device according to claim 1, wherein the adhesive is an insulating sealant. 前記筐体と前記コネクタを接着するための接着剤と、前記金具と前記筐体を接着するための接着剤は、同材料である、請求項1記載の電子制御装置。   The electronic control device according to claim 1, wherein an adhesive for bonding the housing and the connector and an adhesive for bonding the metal fitting and the housing are made of the same material. 前記コネクタと前記回路基板を固定するためのクリップを更に備え、
前記回路基板と前記クリップが引っかかる面がアース回路と繋がっており、前記クリップと前記接着剤を介して、前記カバーと接着する、請求項1記載の電子制御装置。
A clip for fixing the connector and the circuit board;
The electronic control device according to claim 1, wherein a surface on which the circuit board and the clip are hooked is connected to a ground circuit, and is bonded to the cover via the clip and the adhesive.
前記クリップで前記金具と前記回路基板とを前記回路基板端面側から挟み込み、両端の前記クリップが繋がっており、前記ハウジング下部のコネクタ間口側から凹部を設け、前記クリップをコネクタ間口部側から圧入する、請求項1記載の電子制御装置。   The clip and the circuit board are sandwiched from the end face side of the circuit board by the clip, the clips at both ends are connected, a recess is provided from the connector opening side of the lower part of the housing, and the clip is press-fitted from the connector opening side. The electronic control device according to claim 1. 電子部品を実装する回路基板と、
前記回路基板を固定するための金具、及び外部と接続するための端子ピンを有するコネクタと、
前記回路基板を保護するハウジングと、
前記回路基板と前記コネクタとを挟み込む筐体を備え、
前記端子ピン及び前記金具は、はんだにより接続され、
前記回路基板と前記金具は、U字型の形状で挟んで固定される、電子制御装置。
A circuit board for mounting electronic components;
A metal fitting for fixing the circuit board, and a connector having terminal pins for connection to the outside;
A housing protecting the circuit board;
A housing for sandwiching the circuit board and the connector;
The terminal pin and the metal fitting are connected by solder,
The electronic control device, wherein the circuit board and the metal fitting are fixed with being sandwiched in a U-shape.
JP2009212629A 2009-09-15 2009-09-15 Electronic control device Pending JP2011065748A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015186496A1 (en) * 2014-06-02 2015-12-10 株式会社オートネットワーク技術研究所 Connector structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015186496A1 (en) * 2014-06-02 2015-12-10 株式会社オートネットワーク技術研究所 Connector structure
JP2015228333A (en) * 2014-06-02 2015-12-17 株式会社オートネットワーク技術研究所 Connector structure
US9728901B2 (en) 2014-06-02 2017-08-08 Autonetworks Technologies Connector structure

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