JP2011064977A - Method of manufacturing optical waveguide and opto-electric composite substrate, and the optical waveguide and opto-electric composite substrate obtained by the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical waveguide and opto-electric composite substrate capable of avoiding a case where a remaining core or a foreign substance occurring near a patterned core layer directly comes into contact with the patterned core layer and suppressing degradation of the optical transmission loss, and to provide an optical waveguide and opto-electric composite substrate obtained by the method. <P>SOLUTION: This method of manufacturing the optical waveguide and opto-electric composite substrate includes a first process of forming a substantially rectangular member consisting of a lower clad layer of a substantially rectangular shape on a base material or electric wiring board and a core layer of a substantially rectangular shape mounted on the top surface of the lower clad layer, and a second process of forming an upper clad layer for covering the top surface and side surface of the core layer and the side surface of the lower clad layer. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an optical waveguide and an optoelectric composite substrate that reduces deterioration of light propagation loss due to residual cores and foreign matters between patterned core layers in the exposure and development processes, and the optical waveguide and optoelectric composite obtained thereby. It relates to a substrate.

  With the increase in information capacity, development of an optical interconnection technology that uses optical signals not only for communication fields such as trunk lines and access systems but also for information processing in routers and servers is underway. Specifically, in order to use light for short-distance signal transmission between boards in a router or a server device or in a board, an opto-electric composite board in which an optical transmission path is combined with an electric wiring board has been developed. As the optical transmission line, it is desirable to use an optical waveguide that has a higher degree of freedom of wiring and can be densified than an optical fiber, and among them, an optical waveguide that uses a polymer material that is excellent in processability and economy. Promising.

As a manufacturing method of this optical waveguide and an optical / electrical composite substrate in which the optical waveguide and the electric wiring board are integrally combined, for example, as described in Patent Document 1, a lower clad layer is formed by curing on a carrier film. Later, a build-up method was used in which a core layer was formed on the lower clad layer, a patterned core layer was formed by exposure and development, and the upper clad layer was laminated.
However, in these methods, when the patterned core layer is formed, the remaining core and foreign matter are likely to remain in the vicinity of the patterned core layer, and light propagation loss occurs when the remaining core and foreign matter are in direct contact with the core layer. Led to the deterioration.

JP2003-195081

  The present invention avoids the direct contact of the remaining core and foreign matter generated in the vicinity of the patterned core layer with the patterned core layer, and can suppress the deterioration of light propagation loss and It is an object of the present invention to provide a method for producing an optoelectric composite substrate, an optical waveguide obtained therefrom, and an optoelectric composite substrate.

As a result of intensive studies, the present inventors have found that the above problems can be solved by a new manufacturing method capable of improving the shape of the lower cladding layer, and have completed the present invention.
That is, the present invention
[1] A first step of forming a substantially rectangular parallelepiped shaped member comprising a substantially rectangular parallelepiped lower cladding layer and a substantially rectangular parallelepiped core layer mounted on the upper surface of the lower cladding layer, and the upper surface and side surfaces of the core layer And a second step of forming an upper clad layer covering a side surface of the lower clad layer, and a method of manufacturing an optical waveguide,
[2] The first step includes a step (A) of laminating the photosensitive lower cladding layer and the photosensitive core layer on a substrate, and after the step (A), the lower cladding layer and Patterning with the patterned lower cladding layer by pattern exposing the core layer simultaneously and then developing and removing uncured portions of the lower cladding layer and uncured portions of the core layer And (B) forming the substantially rectangular parallelepiped member made of the core layer, wherein the method for manufacturing an optical waveguide according to the above [1],
[3] The method for producing an optical waveguide according to [2], wherein the lower cladding layer is laminated on the base material via an adhesive layer,
[4] The above [2] or [2], wherein the second step includes a step (C) of laminating the upper clad layer from the patterned core layer side after the step (B) [3] a method for producing an optical waveguide according to [3],
[5] After the step (C), the second step is patterned by exposing the entire surface of the upper clad layer to form an upper clad layer after exposure and patterning the upper clad layer by pattern exposure. The method for producing an optical waveguide according to any one of the above [2] to [4], comprising any step (D) of the step of forming the upper cladding layer,
[6] An optical waveguide produced by the method of any one of [1] to [5] above,
[7] The optical waveguide according to [6], wherein the optical waveguide includes an optical path conversion mirror,
[8] A first step of forming a substantially rectangular parallelepiped member comprising a substantially rectangular parallelepiped lower cladding layer and a substantially rectangular parallelepiped core layer mounted on the upper surface of the lower cladding layer on the electric wiring board; And a second step of forming an upper cladding layer covering the upper and side surfaces of the layer and the side surface of the lower cladding layer,
[9] After the step (A ^* ) of laminating the photosensitive lower cladding layer and the photosensitive core layer on the electrical wiring board, and after the step (A ^* ), The lower clad layer and the core layer are subjected to pattern exposure at the same time, and then the uncured portion of the lower clad layer and the uncured portion of the core layer are developed and removed, whereby the patterned lower clad layer And (B ^* ) forming the substantially rectangular parallelepiped member comprising the patterned core layer, and the method for producing an optoelectric composite substrate according to the above [8],
[10] The method for producing an optoelectric composite substrate according to the above [9], wherein the lower clad layer is laminated on the electric wiring board via an adhesive layer,
[11] The above-mentioned [9], wherein the second step includes a step (C ^* ) of laminating the upper clad layer from the patterned core layer side after the step (B ^* ). ] Or the manufacturing method of the optoelectric composite substrate according to [10],
[12] The second step includes a step (D ^* ) of forming the patterned upper clad layer by pattern exposure of the upper clad layer after the step (C ^* ). The method for producing a photoelectric composite substrate according to [11] above,
[13] An optoelectric composite substrate obtained by combining the optical waveguide according to [6] or [7] and an electrical wiring board,
[14] The photoelectric composite substrate manufactured by the method of any one of [8] to [12], and [15] The above [14], wherein the photoelectric composite substrate has an optical path conversion mirror. The optoelectric composite substrate as described is provided.

  By the manufacturing method of the present invention, it is possible to avoid the remaining core and foreign matter generated in the vicinity of the patterned core layer from coming into direct contact with the patterned core layer, and to suppress the deterioration of the light propagation loss. It is possible to provide a method for producing an optical waveguide and an optoelectric composite substrate, and an optical waveguide and an optoelectric composite substrate obtained thereby. Furthermore, the manufacturing method of the present invention is superior in mass productivity because the curing process of the lower cladding layer can be omitted as compared with the conventional method.

It is a figure explaining an example of the manufacturing method of the optical waveguide of this invention. It is a figure explaining an example of the manufacturing method of the photoelectric composite board | substrate of this invention. It is a figure explaining another example of the manufacturing method of the photoelectric composite board | substrate of this invention. It is a figure explaining the manufacturing method of the conventional photoelectric composite board | substrate.

The optical waveguide manufacturing method of the present invention includes a first step of forming a substantially rectangular parallelepiped member comprising a substantially rectangular parallelepiped lower cladding layer and a substantially rectangular parallelepiped core layer mounted on the upper surface of the lower cladding layer; And a second step of forming an upper cladding layer covering the upper surface and side surfaces of the core layer and the side surfaces of the lower cladding layer.
Here, the substantially rectangular parallelepiped means “a rectangular parallelepiped having a rectangular or trapezoidal vertical section”. Note that the cubic shape is a special shape of a rectangle and is included in the rectangle. Depending on the exposure amount and development conditions, the right and left sides of the rectangle in the vertical section or the hypotenuse of the trapezoid may be curved, or the corners of the rectangle or trapezoid may be rounded. And Further, even when the thickness and width of the core pattern and the lower clad pattern are partially different, the cross section perpendicular to the wiring forming surface and perpendicular to the wiring direction is rectangular or trapezoidal, so that it is a substantially rectangular parallelepiped in a broad sense.

First step of optical waveguide manufacturing method The first step according to the optical waveguide manufacturing method of the present invention is a step of laminating the photosensitive lower cladding layer and the photosensitive core layer on a substrate (A). And after the step (A), the lower clad layer and the core layer are simultaneously subjected to pattern exposure, and then an uncured portion of the lower clad layer and an uncured portion of the core layer are developed and removed. The step (B) of forming the substantially rectangular parallelepiped member comprising the patterned core layer with the lower clad layer is preferably included.
Moreover, you may laminate | stack the said lower clad layer on the said base material through a contact bonding layer as needed.
Hereinafter, the patterned lower clad layer is referred to as a “lower clad pattern”, and the patterned core layer is referred to as a “core pattern”.

Second step of optical waveguide manufacturing method The second step following the first step according to the present invention is a step of laminating the upper cladding layer from the core pattern side after the step (B) in the first step (C ), And after this step (C), the upper clad layer is fully exposed to form an exposed upper clad layer (D ₁ ) and the upper clad layer is subjected to pattern exposure and patterned. It is further preferable to include any step (D) of the step (D ₂ ) of forming the upper cladding layer.
Hereinafter, the patterned upper clad layer is referred to as an “upper clad pattern”.

Each process of the manufacturing method of the optical waveguide of this invention is demonstrated based on drawing below. FIG. 1 is a diagram illustrating an example of a method for manufacturing an optical waveguide 1 according to the present invention.
Step (A)
First, as shown in FIG. 1A, an auxiliary bonding clad 61 that is an adhesive layer 60 is laminated on the upper surface of a carrier film 41 that is a base material 40 as desired. Next, the lower clad layer 10 is laminated on the upper surface of the adhesion auxiliary clad 61 {FIG. 1 (b)}. However, the lower cladding layer 10 may be laminated on the upper surface of the carrier film 41. The lamination method of the lower clad layer 10 is not particularly limited, and may be a known method. For example, the lower clad layer 10 may be formed by applying a lower clad layer forming resin composition or laminating a lower clad layer forming resin film.
Next, as shown in FIG. 1C, the core layer 20 is laminated on the upper surface of the lower cladding layer 10, and the carrier film 41 is laminated on the upper surface as desired. The method for laminating the core layer 20 is not particularly limited and may be a known method.
As a preferable method of the step (A), for example, a material for forming the lower cladding layer 10 is applied onto the base material 40 or the adhesive layer 60 by spin coating or the like, prebaked, and then the core is formed on the upper surface of the lower cladding layer 10. It can be formed by applying the material for forming the layer 20 by spin coating or the like.
Further, after the resin film for forming the lower clad layer 10 and the resin film for forming the core layer 20 are bonded together by lamination or the like, the resin film is bonded to the upper surface of the substrate 40 or the adhesive layer 60, or the substrate 40 or the adhesive layer 60 is bonded. The resin film for forming the lower clad layer 10 and the resin film for forming the core layer 20 may be sequentially bonded to the upper surface of the substrate. Here, the lower clad layer-forming resin film used for lamination is easily manufactured by, for example, dissolving the lower clad layer-forming resin composition in a solvent, applying it to the carrier film 41, and removing the solvent. Can do.

Process (B)
Next, the obtained laminate of the lower cladding layer 10 and the core layer 20 is subjected to pattern exposure at the same time, and then the uncured portion of the lower cladding layer 10 and the uncured portion of the core layer 20 are developed and removed. Then, a substantially rectangular parallelepiped member composed of the core pattern 21 with the lower clad pattern 11 shown in FIG.
When the auxiliary bonding clad 61 is used as the adhesive layer 60 on the substrate 40, the auxiliary bonding clad 61 is usually left on the substrate 40 without being subjected to pattern exposure.

Process (C)
Next, as shown in FIG. 1E, the upper clad layer 30 is laminated from the core pattern 21 side so as to cover the upper surface and side surfaces of the core pattern 21 and the side surfaces of the lower clad pattern 11. In the present invention, the method of forming the upper clad layer 30 is not particularly limited, and for example, it may be formed by applying an upper clad layer forming resin composition or laminating an upper clad layer forming resin film.
In the case of coating, the method is not limited. For example, a resin composition containing the components described later may be coated by a conventional method. The resin film for forming an upper clad layer used for laminating is obtained by, for example, dissolving the resin composition for forming an upper clad layer in a solvent and applying it to the carrier film 41 in the same manner as the resin film for forming a clad layer. It can be easily manufactured by removing. FIG. 1E shows a case where the resin film for forming an upper clad layer with the carrier film 41 is used. If desired, the carrier film 41 may be stuck on the upper surface of the upper clad layer 30 until use for the purpose of protecting the surface of the upper clad layer 30 or the like. Finally, the base material 40 and the carrier film 41 are removed, and the optical waveguide 1 is obtained.

Process (D)
After the step (C), the entire upper cladding layer 30 is exposed to form the exposed upper cladding layer 30. As described above, if desired, the upper cladding layer 30 may be patterned to form an upper cladding pattern.
In the optical waveguide 1 obtained by the method of the present invention, as shown in FIG. 1 (f)-1, the remaining core or the foreign material 90 does not come into contact with the core pattern 31. It was.

The optoelectric composite substrate of the present invention can be obtained by combining the optical waveguide 1 obtained by the above-described method of the present invention and an electric wiring board. However, there is a method of directly forming the optical waveguide 1 on the electric wiring board. preferable.
That is, a preferable method for manufacturing an optoelectric composite substrate according to the present invention comprises a substantially rectangular parallelepiped shape comprising a substantially rectangular parallelepiped lower cladding layer on an electrical wiring board, and a substantially rectangular parallelepiped core layer mounted on the upper surface of the lower cladding layer. The method includes a first step of forming a member, and a second step of forming an upper clad layer that covers an upper surface and a side surface of the core layer and a side surface of the lower clad layer.

First Step of Method for Producing Photoelectric Composite Substrate The first step according to the method for producing an optoelectric composite substrate of the present invention is to provide the photosensitive lower cladding layer and the photosensitive core layer on the electric wiring board. After the laminating step (A ^* ) and the step (A ^* ), the lower cladding layer and the core layer are simultaneously subjected to pattern exposure, and then the uncured portion of the lower cladding layer and the core layer are cured. A step (B ^* ) of forming the substantially rectangular parallelepiped member composed of a core pattern with a lower clad pattern by developing and removing a non-developing portion, and if necessary, the lower clad on the electric wiring board The layers may be laminated via an adhesive layer.

The second step following the first step of the second step the invention of a method of manufacturing an optical-electrical composite board, said step (B ^*) after the step of laminating the upper cladding layer from the core pattern side (C ^*) It is preferable that after the step (C ^* ), a step (D ^* ) of patterning the upper cladding layer to form the upper cladding pattern is further included.

Each step of the method for manufacturing an optoelectric composite substrate of the present invention will be described below with reference to the drawings. 2 and 3 are diagrams for explaining an example of the method for manufacturing the photoelectric composite substrate 2 of the present invention and another example.
Process (A ^* ) to (D ^* )
The method shown in FIG. 2 is obtained by changing the laminated body of the carrier film 41 and the adhesion auxiliary clad 61 shown in FIG. 1A to the electric wiring board 50. Similar to FIG. 1, the lower clad pattern 11 and the core pattern 21 The upper clad layer 30 is formed so as to cover the upper and side surfaces of the core pattern 21 and the side surface of the lower clad pattern 11, and the upper clad layer 30 is subjected to pattern exposure to form an upper clad pattern 31 to produce an optoelectric composite. A substrate 2 is obtained.
The method shown in FIG. 3 is obtained by changing the carrier film 41 shown in FIG. 1A to the electric wiring board 50, and the adhesion auxiliary clad 61 is laminated on the upper surface of the electric wiring board 50 as in FIG. Thereafter, as in FIG. 1, the lower clad pattern 11 and the core pattern 21 are formed on the upper surface of the adhesion auxiliary clad 61, and the upper clad pattern 31 is formed in the same manner as in FIG.
As shown in FIGS. 2 (e) -1 and 3 (f) -1, the photoelectric composite substrate 2 obtained by the method of the present invention has no optical propagation loss because the remaining core or foreign matter 90 does not contact the core pattern 31. It became possible to suppress the deterioration.

Hereinafter, each constituent material of the optical waveguide member will be described.
(Lower cladding layer and upper cladding layer)
Hereinafter, the lower cladding layer 10 and the upper cladding layer 30 used in the present invention will be described. As the lower clad layer 10, a clad layer forming resin composition or a clad layer forming resin film can be used.
The resin composition for forming a cladding layer used in the present invention is not particularly limited as long as it is a resin composition having a lower refractive index than that of the core layer 20 to be used and is cured by light, and a photosensitive resin composition is preferably used. Can be used. More preferably, the resin composition for forming a clad layer is preferably composed of a resin composition containing (a) a carrier polymer, (b) a photopolymerizable compound, and (c) a photopolymerization initiator.

  The carrier polymer (a) used here is for forming a clad layer and ensuring the strength of the clad layer, and is not particularly limited as long as the object can be achieved, phenoxy resin, epoxy resin, (Meth) acrylic resin, polycarbonate resin, polyarylate resin, polyether amide, polyether imide, polyether sulfone, etc., or derivatives thereof. These carrier polymers may be used alone or in combination of two or more. Of the carrier polymers exemplified above, the main chain preferably has an aromatic skeleton, and particularly preferably a phenoxy resin, from the viewpoint of high heat resistance. From the viewpoint of three-dimensional crosslinking and improving heat resistance, an epoxy resin, particularly a solid epoxy resin at room temperature (25 ° C.) is preferable. Furthermore, the compatibility with the photopolymerizable compound (b) described in detail later is important for ensuring the transparency of the resin composition for forming a cladding layer. From this point, the phenoxy resin and (meth) Acrylic resin is preferred. Here, (meth) acrylic resin means acrylic resin and methacrylic resin.

  Among phenoxy resins, those containing bisphenol A, bisphenol A type epoxy compounds or derivatives thereof, and bisphenol F, bisphenol F type epoxy compounds or derivatives thereof as a constituent unit of the copolymer component are heat resistant, adhesive and soluble. It is preferable because of its excellent properties. Preferred examples of the bisphenol A or bisphenol A type epoxy compound include tetrabromobisphenol A and tetrabromobisphenol A type epoxy compounds. Moreover, as a derivative of bisphenol F or a bisphenol F-type epoxy compound, tetrabromobisphenol F, a tetrabromobisphenol F-type epoxy compound, etc. are mentioned suitably. Specific examples of the bisphenol A / bisphenol F copolymer type phenoxy resin include “Phenotote YP-70” (trade name) manufactured by Toto Kasei Co., Ltd.

  As an epoxy resin solid at room temperature (25 ° C.), for example, “Epototo YD-7020, Epototo YD-7019, Epototo YD-7007” (all trade names) manufactured by Toto Chemical Co., Ltd., Japan Epoxy Resins Co., Ltd. Examples thereof include bisphenol A type epoxy resins such as “Epicoat 1010, Epicoat 1009, Epicoat 1008” (all trade names).

Next, (b) the photopolymerizable compound is not particularly limited as long as it is polymerized by light irradiation, and a compound having an ethylenically unsaturated group in the molecule or two or more epoxy groups in the molecule. And the like.
Examples of the compound having an ethylenically unsaturated group in the molecule include (meth) acrylate, vinylidene halide, vinyl ether, vinyl pyridine, vinyl phenol, etc., among these, from the viewpoint of transparency and heat resistance, (Meth) acrylate is preferred.
As the (meth) acrylate, any of monofunctional, bifunctional, trifunctional or higher polyfunctional ones can be used. Here, (meth) acrylate means acrylate and methacrylate.

  Examples of the compound having two or more epoxy groups in the molecule include bifunctional or polyfunctional aromatic glycidyl ethers such as bisphenol A type epoxy resins, bifunctional or polyfunctional aliphatic glycidyl ethers such as polyethylene glycol type epoxy resins, and water. Bifunctional alicyclic glycidyl ether such as bisphenol A type epoxy resin, bifunctional aromatic glycidyl ester such as diglycidyl phthalate, bifunctional alicyclic glycidyl ester such as tetrahydrophthalic acid diglycidyl ester, N, N- Bifunctional or polyfunctional aromatic glycidylamine such as diglycidylaniline, bifunctional alicyclic epoxy resin such as alicyclic diepoxycarboxylate, bifunctional heterocyclic epoxy resin, polyfunctional heterocyclic epoxy resin, bifunctional Or polyfunctional silicon-containing epoxy resin It is. These (b) photopolymerizable compounds can be used alone or in combination of two or more.

  Next, the photopolymerization initiator of component (c) is not particularly limited. For example, as an initiator when an epoxy compound is used as component (b), aryldiazonium salt, diaryliodonium salt, triarylsulfonium salt, triallyl Examples include selenonium salts, dialkylphenazylsulfonium salts, dialkyl-4-hydroxyphenylsulfonium salts, and sulfonate esters.

In addition, as an initiator when a compound having an ethylenically unsaturated group in the molecule is used as the component (b), aromatic ketones such as benzophenone, quinones such as 2-ethylanthraquinone, benzoin ethers such as benzoin methyl ether Compounds, benzoin compounds such as benzoin, benzyl derivatives such as benzyldimethyl ketal, 2,4,5-triarylimidazole dimers such as 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- Benzimidazoles such as mercaptobenzimidazole, phosphine oxides such as bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, acridine derivatives such as 9-phenylacridine, N-phenylglycine, N-phenylglycine derivatives , Coumarin compound And the like. Moreover, you may combine a thioxanthone type compound and a tertiary amine compound like the combination of diethyl thioxanthone and dimethylaminobenzoic acid. Of the above compounds, aromatic ketones and phosphine oxides are preferable from the viewpoint of improving the transparency of the cladding layer.
These (c) photopolymerization initiators can be used alone or in combination of two or more.

(A) It is preferable that the compounding quantity of a carrier polymer shall be 5-80 mass% in the total amount of (a) component and (b) component. Moreover, it is preferable that the compounding quantity of (b) photopolymerizable compound shall be 95-20 mass% in the total amount of (a) and (b) component.
As a blending amount of the component (a) and the component (b), when the component (a) is 5% by mass or more and the component (b) is 95% by mass or less, the resin composition is easily formed into a film. Can do. On the other hand, when the (a) component is 80% by mass or less and the (b) component is 20% by mass or more, (a) the carrier polymer can be easily entangled and cured, and the optical waveguide 1 is formed. Furthermore, the pattern forming property is improved and the photocuring reaction proceeds sufficiently. From the above viewpoint, as the blending amount of the component (a) and the component (b), in the total amount of the components (a) and (b), the component (a) is 10 to 85% by mass, and the component (b) is 90 to 15 mass. % Is more preferable, (a) 20-70 mass% of component, (b) 80-30 mass% of component is still more preferable.
(C) It is preferable that the compounding quantity of a photoinitiator shall be 0.1-10 mass parts with respect to 100 mass parts of total amounts of (a) component and (b) component. When the blending amount is 0.1 parts by mass or more, the photosensitivity is sufficient, while when it is 10 parts by mass or less, the absorption in the surface layer of the photosensitive resin composition does not increase during exposure, and the internal Is sufficiently cured. Further, when used as the optical waveguide 1, it is preferable that the propagation loss does not increase due to the light absorption effect of the polymerization initiator itself. From the above viewpoint, it is more preferable that the amount of the (c) photopolymerization initiator is 0.2 to 5 parts by mass.

Regarding the thickness of the lower clad layer 10, the thickness after drying is preferably in the range of 5 to 500 μm. When the thickness is 5 μm or more, a clad thickness necessary for light confinement can be secured, and when the thickness is 500 μm or less, it is easy to control the film thickness uniformly. The exposure amount when exposing the core layer 20 may be a film thickness that can be cured by light transmitted through the core layer 20. In this respect, the thickness of the lower cladding layer 10 is more preferably in the range of 5 to 50 μm.
The thickness of the upper cladding layer 30 may be the same as or different from the thickness of the lower cladding layer 10, but the thickness of the upper cladding layer 4 is embedded in order to embed the substantially rectangular parallelepiped lower cladding pattern 11 and core pattern 21. The thickness is preferably larger than the total thickness of the lower cladding layer 10 and the core layer 3.

(Core layer forming resin composition and core layer forming resin film)
As the resin composition for forming the core layer 20, a resin composition that is designed so that the core pattern 21 has a higher refractive index than the lower clad pattern 11 and the upper clad pattern 31 and can form the core pattern 21 with actinic rays is used. A photosensitive resin composition is preferable. Specifically, it is preferable to use the same resin composition as that used in the resin composition for forming a clad layer.
In the case of application, the method is not limited, and the resin composition may be applied by a conventional method.

Hereinafter, the resin film for forming the core layer 20 used for lamination will be described in detail.
The resin film for forming the core layer 20 can be easily manufactured by dissolving the resin composition in a solvent and applying the resin composition to the lower cladding layer 10 and removing the solvent. The solvent used here is not particularly limited as long as it can dissolve the resin composition. For example, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, N, N-dimethyl A solvent such as acetamide, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, cyclohexanone, N-methyl-2-pyrrolidone, or a mixed solvent thereof can be used. The solid content concentration in the resin composition solution is usually preferably 30 to 80% by mass.

  The thickness of the resin film for forming the core layer 20 is not particularly limited, and the thickness of the core layer 20 after drying is usually adjusted to be 10 to 100 μm. When the thickness of the film is 10 μm or more, there is an advantage that the alignment tolerance can be increased in the coupling with the light emitting / receiving element or the optical fiber after the optical waveguide is formed, and when the thickness is 100 μm or less, the light receiving / emitting after the optical waveguide is formed. In coupling with an element or an optical fiber, there is an advantage that coupling efficiency is improved. From the above viewpoint, the thickness of the film is preferably in the range of 30 to 70 μm.

(Carrier film)
The material of the carrier film 41 used in the manufacturing process of the clad layer forming resin film is not particularly limited, and various materials can be used. For example, an FR-4 substrate, a polyimide substrate, a semiconductor substrate, a silicon substrate, a glass substrate, or the like can be used, which may be a flexible material or a non-flexible hard material.
Moreover, a flexible photoelectric composite member can be obtained by using a flexible material for the carrier film 41. The material of the material having flexibility is not particularly limited, but from the viewpoint of having flexibility and toughness, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene, polypropylene, polyamide, polycarbonate, Preferable examples include polyphenylene ether, polyether sulfide, polyarylate, liquid crystal polymer, polysulfone, polyether sulfone, polyether ether ketone, polyether imide, polyamide imide, and polyimide. Further, by applying the above-described cladding resin on the carrier film 41 as the carrier film 41 for the lower cladding layer 10 and using a film provided with the adhesion auxiliary cladding 61, the lower cladding layer 10 or the lower cladding layer 10 is used. It becomes possible to ensure sufficient adhesiveness with the pattern 11.
The thickness of the film may be appropriately changed depending on the intended flexibility, but is preferably 5 μm to 10 mm, and preferably 5 to 250 μm when flexibility is required. If it is 5 μm or more, there is an advantage that toughness can be easily obtained, and if it is 250 μm or less, sufficient flexibility can be obtained.

  Of the carrier film 41, the carrier film 41 used in the manufacturing process of the coating composition for forming the core layer 20 or the cladding layer 10 or 30 is also a resin composition for forming the core layer 20 or the cladding layer 10 or 30 later. Preferable examples include polyesters such as polyethylene terephthalate, polypropylene, and polyethylene from the viewpoint of easy peeling of the coating film and heat resistance and solvent resistance. In this case, the thickness of the carrier film 41 is preferably 5 to 50 μm. When it is 5 μm or more, there is an advantage that the strength as the carrier film 41 can be easily obtained, and when it is 50 μm or less, there is an advantage that a gap with the mask at the time of pattern formation becomes small and a finer pattern can be formed. From the above viewpoints, the thickness of the carrier film 41 used in the coating film production process is more preferably in the range of 10 to 40 μm, and particularly preferably 15 to 30 μm.

(Electric wiring board)
The electric wiring board 50 used in the present invention is not particularly limited, and various electric wiring boards 50 used for the photoelectric composite substrate 2 can be used, for example, an insulating substrate for an electric wiring board, Alternatively, the wiring board may be an insulating substrate having electrical wiring formed thereon, or a multilayer wiring board. Moreover, when there is no adhesive force between the electric wiring board 50, the lower clad layer 10, and the upper clad layer 30, a physical roughening treatment or a chemical bonding film may be appropriately formed on the surface of the electric wiring board. Further, an adhesive layer 60, for example, an auxiliary adhesion clad 61 may be provided on the electric wiring board 50.

(Adhesive layer)
The type of the adhesive layer 60 formed on the substrate 40 or the electric wiring board 50 is not particularly limited, and various adhesives can be used. Preferable examples of the adhesive material include prepregs, build-up materials, thermosetting adhesives, photo-curing adhesives, and laminates obtained by combining two or more thereof. In the optical waveguide 1, an adhesive layer 60 having a high transmittance is required for adhesion of a portion through which an optical signal is transmitted. In this case, the material of the adhesive layer 60 is not particularly limited, but for forming the cladding layer 10 or 30. It is more preferable to use a resin composition, a resin composition for forming the core layer 20 or an adhesive described later. The above-described adhesion assisting clad 61 may be used as the adhesion layer 60. Although the thickness of the contact bonding layer 60 does not have limitation in particular, it is preferable that it is 0.1-100 micrometers, and it is more preferable that it is 0.1-50 micrometers.

(Adhesive for adhesive layer 60)
Examples of the adhesive for the adhesive layer 60 include bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, polyfunctional epoxy resin, amine type epoxy resin, amine type epoxy resin and the like. One or more of the resins (p), polyfunctional phenols (particularly novolac-type or resol-type phenolic resins), amines, imidazole compounds, acid anhydrides, organophosphorus compounds and their halides, One or more curing agents (q) such as polyamide, polysulfide, boron trifluoride (q), acrylic copolymer, acrylic rubber, acrylonitrile butadiene rubber, silicone rubber, silicone resin, silicone modified polyamideimide Silicone modified resin such as One or more of polymer compounds such as polyurethane, polyimide, polyimide amide (r), aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide One or more fillers such as aluminum oxide, crystalline silica, amorphous silica, acrylonitrile butadiene rubber filler, silicone rubber filler (s), and tertiary amines, imidazoles, quaternary ammonium salts, etc. The adhesive containing 1 type (s) or 2 or more types (t) of this hardening accelerator is preferable.
The blending ratio of the component (p) and the component (q) is preferably 0.70 / 0.30 to 0.30 / 0.70 in terms of the equivalent ratio of epoxy equivalent and hydroxyl equivalent, [{(p) Component + (q) component} / (r) component] ratio (parts by mass) is preferably 0.24 to 1.0, and {part (p) component + (q) component} is 100 parts by mass. The component (s) is preferably 1 to 50 parts by mass and the component (t) is 5.0 parts by mass or less. Moreover, you may mix | blend a coupling agent, ion trapping agents, etc., such as a silane type, a titanium type, and aluminum type, as needed.

(Adhesive auxiliary cladding)
The material of the adhesion auxiliary clad 61 used as the adhesive layer 60 is not particularly limited, and various materials can be used, but a resin composition for forming the lower clad layer 10 is preferable.
The thickness of the auxiliary adhesion cladding 61 is not particularly limited, but if it is 1 to 50 μm, sufficient adhesion with the lower cladding layer 10 or the lower cladding pattern 11 can be ensured.

(Composite method of electrical wiring board and optical waveguide)
The method of combining the electrical wiring board 50 and the optical waveguide 1 to form the photoelectric wiring board 8 is not particularly limited, and various methods can be used. For example, the optical waveguide 1 prepared in advance and the electric wiring board 50 are bonded together via the adhesive layer 60, or the lower clad layer 10, the core layer 20, the upper clad layer 30 or the like on the electric wiring board 50 prepared in advance. The buildup forming method of sequentially forming the patterns 11, 21, and 31 and the method of building up the electrical wiring on the optical waveguide 1 produced in advance are exemplified.

(Exposure method for core pattern with lower clad pattern)
The exposure method of the core pattern 21 with the lower cladding pattern 11 is not particularly limited, and may be either a negative type in which an exposed part remains as a pattern or a positive type in which an unexposed part remains as a pattern. You may decide by the property of a resin composition and the resin composition for core layer formation. However, from the viewpoint of exposing the lower clad pattern 11 and the core pattern 21 simultaneously, the lower clad layer 10 and the core layer 20 need to be unified to a negative type or a positive type.

(Exposure method of upper clad layer or upper clad pattern)
The exposure method of the upper cladding layer 30 or the upper cladding pattern 31 is not particularly limited, and may be the entire surface exposure of the upper cladding layer 30 or the pattern exposure for forming the upper cladding pattern 31. When the adhesion between the lower clad pattern 11 and the core pattern 21 is weak, the upper clad pattern 31 is formed so as to remove the upper clad layer between the core patterns 21, whereby the lower clad pattern 11 due to the thermal contraction of the upper clad layer 30. And peeling between the core pattern 21 can be suppressed.

EXAMPLES The present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.
Example 1
(1) Production of optical waveguide [production of resin film for forming clad layer]
(A) As base polymer, 48 parts by mass of phenoxy resin (trade name: Phenototo YP-70, manufactured by Toto Kasei Co., Ltd.), (b) Alicyclic diepoxycarboxylate (trade name: KRM) as a photopolymerizable compound -2110, molecular weight: 252, manufactured by Asahi Denka Kogyo Co., Ltd.) 50 parts by mass, (c) As a photopolymerization initiator, triphenylsulfonium hexafluoroantimonate salt (trade name: SP-170, manufactured by Asahi Denka Kogyo Co., Ltd.) 2 parts by weight, 40 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent are weighed in a wide-mouthed plastic bottle, and stirred for 6 hours under the conditions of a temperature of 25 ° C. and a rotation speed of 400 rpm using a mechanical stirrer, shaft and propeller. A clad layer forming resin varnish A was prepared. After that, using a polyflon filter (trade name: PF020, manufactured by Advantech Toyo Co., Ltd.) with a pore diameter of 2 μm, the mixture is filtered under pressure at a temperature of 25 ° C. and a pressure of 0.4 MPa, and further the degree of vacuum using a vacuum pump and a bell jar. Degassed under reduced pressure for 15 minutes under the condition of 50 mmHg.
The coating varnish A for clad layer formation obtained above is applied to a corona-treated surface of a polyamide film (trade name “Mikutron”, thickness 12 μm, manufactured by Toray Industries, Inc.) (Multicoater TM-MC, Inc. The resin film for clad layer formation was obtained by carrying out solvent drying at 80 ° C. for 10 minutes and then at 100 ° C. for 10 minutes. At this time, the thickness of the resin layer can be arbitrarily adjusted by adjusting the gap of the coating machine. In this embodiment, the film thickness after curing is 15 μm for the auxiliary adhesion cladding and 70 μm for the upper cladding layer. Adjusted. Thereby, the carrier film 41 with the adhesion auxiliary clad 61 and the resin film for forming the upper clad layer 30 were obtained.
Coating the resin varnish A for forming a clad layer obtained above on a release polyethylene terephthalate (hereinafter referred to as “PET”) film (trade name: Purex A31, Teijin DuPont Films, Inc., thickness: 25 μm) Coating was performed using a machine (Multicoater TM-MC, manufactured by Hirano Techseed Co., Ltd.), and the solvent was dried at 80 ° C. for 10 minutes and then at 100 ° C. for 10 minutes to obtain a resin film for forming the lower cladding layer 10. At this time, the thickness of the resin layer can be arbitrarily adjusted by adjusting the gap of the coating machine. In this example, the thickness after curing was adjusted to be 15 μm of the lower cladding layer. This obtained the resin film for lower clad layer 10 formation.

[Production of resin film for core layer formation]
(A) As a base polymer, 26 parts by mass of phenoxy resin (trade name: Phenototo YP-70, manufactured by Toto Kasei Co., Ltd.), (b) 9,9-bis [4- (2-acryloyl) as a photopolymerizable compound Oxyethoxy) phenyl] fluorene (trade name: A-BPEF, Shin-Nakamura Chemical Co., Ltd.) 36 parts by mass, and bisphenol A type epoxy acrylate (trade name: EA-1020, Shin-Nakamura Chemical Co., Ltd.) 36 mass Parts, (c) 1 part by weight of bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (trade name: Irgacure 819, manufactured by Ciba Specialty Chemicals) as a photopolymerization initiator, and 1- [4 -(2-Hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one (trade name: yl Cure 2959, manufactured by Ciba Specialty Chemicals Co., Ltd.) Resin varnish B for forming core layer 20 in the same manner and under the same conditions as in the above production example, except that 1 part by mass and 40 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent were used. Was formulated. Thereafter, pressure filtration and degassing under reduced pressure were performed under the same method and conditions as in the above production example.
The resin varnish B for forming the core layer 20 obtained above is applied to a non-treated surface of a PET film (trade name: Cosmo Shine A1517, manufactured by Toyobo Co., Ltd., thickness: 16 μm) in the same manner as in the above production example. Then, a release PET film (trade name: PUREX A31, Teijin DuPont Films Co., Ltd., thickness: 25 μm) is attached as a protective film so that the release surface is on the resin side, and the core layer 20 is formed. A resin film was obtained. In this example, the gap of the coating machine was adjusted so that the film thickness after curing was 50 μm.

The clad resin surface of the carrier film 41 with the adhesion auxiliary clad 61 obtained above was irradiated with 1.5 J / cm ^{2 of} ultraviolet rays (wavelength 365 nm) with an ultraviolet exposure machine (EXM-1172, manufactured by Oak Manufacturing Co., Ltd.) Then, it was made to dry at 80 degreeC for 12 minutes (refer Fig.1 (a)).
Next, a pressure laminator (HLM-1500, manufactured by Hitachi Chemical Technoplant Co., Ltd.) is used on the adhesion auxiliary clad 61 on the resin surface of the resin film for forming the lower clad layer 10 obtained as described above, pressure 0.4 MPa, temperature 50 ° C. Lamination was performed under the condition of a laminating speed of 0.2 m / min (see FIG. 1B). Next, the PET film that is the carrier film 41 of the resin film for forming the lower clad layer 10 is peeled, and the resin surface of the resin film for forming the core layer 20 is formed on the lower clad layer 10 with a roll laminator (manufactured by Hitachi Chemical Technoplant Co., Ltd., HLM-1500) was laminated under the conditions of a pressure of 0.4 MPa, a temperature of 50 ° C., and a lamination speed of 0.2 m / min (see FIG. 1C). Next, ultraviolet light (wavelength 365 nm) is irradiated at 0.8 J / cm ² through the negative photomask having a width of 50 μm with the above ultraviolet exposure machine, and the lower cladding pattern 11 and the core pattern 21 are photocured, and then at 80 ° C. Heating was performed after exposure for 12 minutes. Thereafter, the PET film which is the carrier film 41 of the resin film for forming the core layer 20 is peeled off, and the lower clad is formed using a developer (propylene glycol monomethyl ether acetate / N, N-dimethylacetamide = 7/3, mass ratio). The layer 10 and the core layer 20 were developed to obtain a lower clad pattern 11 and a core pattern 21. Then, it wash | cleaned using the washing | cleaning liquid (isopropanol), and heat-dried at 100 degreeC for 10 minute (refer FIG.1 (d)).
Next, the resin film for forming the upper clad layer 30 is subjected to conditions of a pressure of 0.4 MPa, a temperature of 50 ° C., and a pressurization time of 30 seconds using a vacuum pressurization type laminator (MVLP-500, manufactured by Meiki Seisakusho Co., Ltd.). And laminated (see FIG. 1B). Next, ultraviolet light (wavelength 365 nm) is irradiated with 3.0 J / cm ² with the above ultraviolet exposure machine to expose the entire upper cladding layer 30 to photocuring, and then heat-treated at 160 ° C. for 1 hour, The clad layer 30 was cured (see FIG. 1 (e)). Thereafter, in order to reduce the adhesive strength between the clad resin and the polyamideimide film, the polyamide film and the upper clad layer 30 forming resin adhered to the auxiliary adhesion clad 61 by being left in an environment of 85 ° C. and 85% humidity for 8 hours. The polyamide film which is the carrier film 41 of the film was peeled off to produce the optical waveguide 1 (see FIG. 1 (f)).
Among the optical waveguides 1 manufactured in this way, the optical propagation loss of the optical waveguide 1 in which foreign matter having a size of 5 to 10 μm exists in the vicinity of the core pattern 21 (within 1 μm) as shown in FIG. Using a 855 nm LED (manufactured by Advantest Co., Ltd., Q81201) and a light receiving sensor (manufactured by Advantest Co., Ltd., Q82214) as the light source, the cutback method (measurement waveguide length 5, 3, 2 cm, incident fiber; GI-50 / It was 0.07 dB / cm as measured with 125 multimode fiber (NA = 0.20), outgoing fiber; SI-114 / 125 (NA = 0.22), incident light; effective core diameter 26 μm.
Thereafter, a 45 ° mirror was formed from the side of the upper clad layer 30 of the optical waveguide 1 using a dicing saw (DAC552, manufactured by Disco Corporation) to obtain an optical waveguide 1 with a mirror.

Example 2
The resin surface of the resin film for forming the lower cladding layer 10 obtained above is FR-4 (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL-E-679F (b), thickness: 0.6 mm, copper on both sides. After laminating the film on the sheet with a roll laminator (HLM-1500, manufactured by Hitachi Chemical Technoplant Co., Ltd.) under the conditions of pressure 0.4 MPa, temperature 50 ° C., laminating speed 0.2 m / min, The release PET film which is the carrier film 41 of the clad layer 10 was peeled off (see FIG. 2A). Thereafter, the same resin film for forming the core layer 20 as in Example 1 was laminated on the lower clad layer 10 under the same conditions as above (see FIG. 2B). Next, ultraviolet light (wavelength 365 nm) is 0.8 J / cm ² from the resin film side for forming the core layer 20 through a negative photomask with a width of 50 μm using an ultraviolet exposure machine (EXM-1172, manufactured by Oak Manufacturing Co., Ltd.). Irradiation was followed by post-exposure heating at 80 ° C. for 12 minutes. Thereafter, the PET film which is a carrier film of the resin film for forming the core layer 20 is peeled off, and the lower clad pattern is formed using a developer (propylene glycol monomethyl ether acetate / N, N-dimethylacetamide = 7/3, mass ratio). 11 and the core pattern 21 were developed. Then, it wash | cleaned using the washing | cleaning liquid (isopropanol), and heat-dried at 100 degreeC for 10 minute (refer FIG.2 (c)).
Next, using a vacuum pressurization type laminator (MVLP-500, manufactured by Meiki Seisakusho Co., Ltd.) as a flat plate type laminator, after evacuating to 500 Pa or less, under conditions of pressure 0.4 MPa, temperature 50 ° C., pressurization time 30 seconds. The resin film for forming a clad layer was laminated as the upper clad layer 30 by thermocompression bonding (see FIG. 2D).
Further, the pattern is the same as the negative photomask for forming the core pattern, and the ultraviolet light is exposed so that the portion of the core pattern 21 and the lower clad pattern 11 is exposed to 100 μm through the negative photomask for the upper clad pattern with only the line width being 250 μm. (Wavelength 365 nm) was irradiated with 3.0 J / cm ² , and then post-exposure heating was performed at 80 ° C. for 12 minutes. Thereafter, the PET film which is the carrier film 41 of the resin film for forming the upper clad layer 30 was peeled off, and the upper clad layer 30 was developed using a developer (isopropanol) to obtain an upper clad pattern 31. Then, it wash | cleaned using the washing | cleaning liquid (isopropanol), and heat-dried at 100 degreeC for 10 minute (s). Next, the upper clad pattern 31 was cured by heat treatment at 160 ° C. for 1 hour to produce the photoelectric composite substrate 2 (see FIG. 2E).
Of the optical / electrical composite substrate 2 manufactured as described above, the light propagation loss of the optical waveguide 1 in which foreign matter having a size of 5 to 10 μm exists in the vicinity of the core pattern 21 (within 1 μm) as shown in FIG. Using a 855 nm LED (manufactured by Advantest Co., Ltd., Q81201) and a light receiving sensor (manufactured by Advantest Co., Ltd., Q82214) as a light source, and a cutback method (measurement waveguide lengths 5, 3, 2 cm, incident fiber; GI- 50/125 multimode fiber (NA = 0.20), outgoing fiber; SI-114 / 125 (NA = 0.22), incident light; effective core diameter 26 μm), 0.07 dB / cm. It was.

Example 3
FR-4 (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL-E-679F (b), thickness: 0.6 mm, double-sided copper) The film was etched on a roll laminator (HLM-1500, manufactured by Hitachi Chemical Technoplant Co., Ltd.) under the conditions of a pressure of 0.4 MPa, a temperature of 50 ° C., and a laminating speed of 0.2 m / min. Thereafter, ultraviolet rays (wavelength 365 nm) were irradiated at 1.5 J / cm ² using the above exposure machine, and then post-exposure heating was performed at 80 ° C. for 12 minutes. Thus, an electrical wiring board 50 with an adhesive layer 60 was obtained (see FIG. 3A). Next, similarly to Example 1, a lower clad pattern 11, a core pattern 21, and an upper clad pattern 31 were sequentially formed on the adhesive layer 60 to obtain an optoelectric composite substrate 2 (see FIG. 3F). In the optical / electrical composite substrate 2 manufactured in this way, the light propagation loss of the optical waveguide 1 in which foreign matter having a size of 5 to 10 μm exists in the vicinity of the core pattern 21 (within 1 μm) as shown in FIG. Using a 855 nm LED (manufactured by Advantest Co., Ltd., Q81201) and a light receiving sensor (manufactured by Advantest Co., Ltd., Q82214) as a light source, and a cutback method (measurement waveguide lengths 5, 3, 2 cm, incident fiber; GI- 50/125 multimode fiber (NA = 0.20), outgoing fiber; SI-114 / 125 (NA = 0.22), incident light; effective core diameter 26 μm), 0.07 dB / cm. It was.

Comparative Example 1
In Example 2, the resin surface of the lower clad layer 10 forming resin film is FR-4 (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL-E-679F (b), thickness: 0.6 mm, copper on both sides The film was etched on a roll laminator (HLM-1500, manufactured by Hitachi Chemical Technoplant Co., Ltd.) under the conditions of a pressure of 0.4 MPa, a temperature of 50 ° C., and a laminating speed of 0.2 m / min. Thereafter, ultraviolet rays (wavelength 365 nm) were irradiated at 1.5 J / cm ² from the resin side with an ultraviolet exposure machine (manufactured by Oak Manufacturing Co., Ltd., EXM-1172). The lower clad layer 10 was formed by heat treatment for 10 minutes (see FIG. 4A).
Next, the core layer 20 was formed by laminating the resin film for forming the core layer 20 on the lower clad layer 10 under the same lamination conditions as above (see FIG. 4B).
Next, ultraviolet rays (wavelength 365 nm) were irradiated with 0.8 J / cm ² with a UV photomask through a negative photomask having a width of 50 μm, and then after exposure at 80 ° C. for 5 minutes, heating was performed. Thereafter, the PET film as the carrier film 41 is peeled off, and the core layer 20 is developed using a developer (propylene glycol monomethyl ether acetate / N, N-dimethylacetamide = 7/3, mass ratio), and the core pattern 21 It was. Then, it wash | cleaned using the washing | cleaning liquid (isopropanol), and heat-dried at 100 degreeC for 10 minute (refer FIG.4 (c)).

Next, a vacuum pressure laminator (MVLP-500, manufactured by Meiki Seisakusho Co., Ltd.) was used as a flat plate laminator, and the resin film for forming the upper clad layer 30 was evacuated to 500 Pa or less, and then pressure 0.4 MPa, temperature 50 ° C. The film is heated and pressure-bonded under a pressure time of 30 seconds, and then irradiated with 3.0 J / cm ^{2 of} ultraviolet rays (wavelength 365 nm) using the above-described ultraviolet exposure machine to form a carrier film for the resin film for forming the upper cladding layer 30. The 41 PET film was peeled off. Next, the upper clad layer 30 was cured by heat treatment at 160 ° C. for 1 hour, thereby producing the photoelectric composite substrate 2 (see FIG. 4D).
Among the thus produced optoelectric composite substrate 2, a 100 mm long optical waveguide 1 in which a foreign substance 90 having a size of 5 to 10 μm exists in the vicinity (within 1 μm) of the core pattern 21 as shown in FIG. Light propagation loss using a 855 nm LED (manufactured by Advantest Co., Ltd., Q81201) and a light receiving sensor (manufactured by Advantest Co., Ltd., Q82214) (measurement waveguide length 5 cm, incident fiber; GI-50 / 125 multi It was 0.14 dB / cm when measured with a mode fiber (NA = 0.20), an outgoing fiber; SI-114 / 125 (NA = 0.22), incident light; effective core diameter 26 μm).

  The optical waveguide and the photoelectric composite member obtained by the production method of the present invention can be applied to various fields such as various optical devices and optical interconnections.

DESCRIPTION OF SYMBOLS 1 Optical waveguide 2 Opto-electric composite board 10 Lower clad layer 11 Patterned lower clad layer (lower clad pattern)
20 Core layer 21 Patterned core layer (core pattern)
30 Upper Clad Layer 31 Patterned Upper Clad Layer (Upper Clad Pattern)
40 Substrate 41 Carrier film 50 Electric wiring board 60 Adhesive layer 61 Adhesive auxiliary clad 90 Remaining core or foreign matter

Claims (15)

  A first step of forming a substantially rectangular parallelepiped shaped member comprising a substantially rectangular parallelepiped lower cladding layer and a substantially rectangular parallelepiped core layer mounted on an upper surface of the lower cladding layer; an upper surface and a side surface of the core layer; and And a second step of forming an upper clad layer covering a side surface of the lower clad layer.   The first step includes a step (A) of laminating the photosensitive lower clad layer and the photosensitive core layer on a substrate, and the lower clad layer and the core layer after the step (A). Patterning of the lower clad layer and the uncured portion of the core layer by developing and removing the uncoated portion of the lower clad layer. The method for manufacturing an optical waveguide according to claim 1, further comprising a step (B) of forming the substantially rectangular parallelepiped member made of a core layer.   The method for manufacturing an optical waveguide according to claim 2, wherein the lower clad layer is laminated on the base material via an adhesive layer.   The said 2nd process includes the process (C) of laminating | stacking the said upper clad layer from the said core layer side patterned after the said process (B), The Claim 2 or 3 characterized by the above-mentioned. Manufacturing method of optical waveguide.   In the second step, after the step (C), the entire surface of the upper clad layer is exposed to form an upper clad layer after exposure, and the upper clad patterned by pattern exposure of the upper clad layer The method for manufacturing an optical waveguide according to claim 4, comprising any step (D) of forming a layer.   An optical waveguide manufactured by the method according to claim 1.   The optical waveguide according to claim 6, wherein the optical waveguide includes an optical path conversion mirror.   A first step of forming a substantially rectangular parallelepiped-shaped member comprising a substantially rectangular parallelepiped lower cladding layer and a substantially rectangular parallelepiped core layer mounted on the upper surface of the lower cladding layer on the electrical wiring board; and an upper surface of the core layer And a second step of forming an upper cladding layer covering the side surface and the side surface of the lower cladding layer. The first step includes a step (A ^* ) of laminating the photosensitive lower cladding layer and the photosensitive core layer on the electrical wiring board, and the step (A ^* ), and then the lower cladding layer. And patterning the pattern with the patterned lower cladding layer by exposing the core layer to pattern exposure simultaneously and then developing and removing the uncured portion of the lower cladding layer and the uncured portion of the core layer. The method for producing an optoelectric composite substrate according to claim 8, further comprising a step (B ^* ) of forming the substantially rectangular parallelepiped member comprising the formed core layer.   The method of manufacturing an optoelectric composite substrate according to claim 9, wherein the lower clad layer is laminated on the electric wiring board via an adhesive layer. The said 2nd process includes the process (C ^* ) of laminating | stacking the said upper clad layer from the said patterned core layer side after the said process (B ^* ), The Claim 9 or 10 characterized by the above-mentioned. The manufacturing method of the optoelectric composite board | substrate of description. 12. The second step includes a step (D ^* ) of patterning the upper clad layer to form the patterned upper clad layer after the step (C ^* ). The manufacturing method of the optoelectric composite board | substrate of description.   An optical / electrical composite substrate obtained by combining the optical waveguide according to claim 6 and an electrical wiring board.   A photoelectric composite substrate manufactured by the method according to claim 8.   The photoelectric composite substrate according to claim 14, wherein the photoelectric composite substrate has an optical path conversion mirror.

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