JP2011057590A - Method for purifying isocyanurate derivative - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a purification method for producing an isocyanurate derivative containing slight amount of inorganic ions as impurities. <P>SOLUTION: The method for purifying an isocyanurate derivative is characterized by treating an isocyanurate derivative containing inorganic ions as impurities, with an adsorbent to produce an isocyanurate derivative containing slight amount of inorganic ions as impurities. The method is suitably applied to 1,3-diallyl isocyanurate as an isocyanurate derivative. Aluminum silicate is suitably used as an adsorbent. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a purification method for obtaining an isocyanurate derivative having a low content of inorganic ions as impurities.

Isocyanurate derivatives are extremely useful compounds such as being used as raw materials for plastics, lubricants, crosslinking agents, synthetic rubbers, electrical insulating materials, electronic materials and the like.
Among them, 1,3-diallyl isocyanurate is a useful compound because it has two allyl groups in one molecule and can be used as a crosslinking agent for a polymer compound.

As a method for producing 1,3-diallyl isocyanurate,
i) Method by reaction of triallyl cyanurate with allyl alcohol or acetic acid in the presence of a copper catalyst (Non-patent Document 1)
ii) Method by reaction of N, N′-diallylurea with N-chlorocarbonyl isocyanate (Patent Document 1)
iii) 1,3-diallyl isocyanurate which is an intermediate for producing triallyl isocyanurate by reacting isocyanuric acid and allyl chloride in the presence of a copper salt by adding an alkaline aqueous solution and reacting at a temperature higher than the boiling point of allyl chloride For recovering water (Patent Document 2)
Such a method is known.

  However, in the 1,3-diallyl isocyanurate synthesized by these methods, a large amount of inorganic ions generated by the metal catalyst during the synthesis and post-treatment remain. Due to the remaining inorganic ions, a product produced from 1,3-diallyl isocyanurate as a raw material is deteriorated, colored, or deteriorated in electrical characteristics. In particular, when it is used as a raw material of a resin composition that requires electrical characteristics, it is required that the remaining inorganic ions are extremely small.

In general, as a method of removing inorganic ions remaining in the crystal of an organic compound,
(1) A method in which a crystal is dissolved in an organic solvent and washed with water (2) A method in which a crystal is reslurried with water is known.

However, in general, many isocyanurate derivatives have low solubility in organic solvents, and 1,3-diallyl isocyanurate has extremely low solubility in various organic solvents. Therefore, it is difficult to purify by the method (1). Also, it is difficult to reduce inorganic ions by the method (2).
Thus, since there is no inorganic ion removal method applicable to various isocyanurate derivatives, the use of isocyanurate derivatives is limited.

Japanese Patent Publication No. 48-026023 JP-A-4-49285

Khimiya Getrotsikliskiskih Soedinenii, 1988, 3,376

  An object of the present invention is to provide a purification method for efficiently obtaining an isocyanurate derivative having a very small content of inorganic ions as impurities.

  The present invention has the following configuration.

  1). A method for purifying an isocyanurate derivative comprising treating an isocyanurate derivative containing an inorganic ion as an impurity with an adsorbent in a solvent.

  2). The purification method according to 1), wherein the isocyanurate derivative is 1,3-diallyl isocyanurate.

  3). The purification method according to 1) or 2), wherein the adsorbent is aluminum silicate.

  4). The solvent is any one of an ether solvent, a ketone solvent, and a nitrile solvent, and the purification method according to any one of 1) to 3).

  5). The purification method according to any one of 1) to 4), wherein the inorganic ions are sodium ions, copper ions, or chloride ions.

  6). An isocyanurate derivative characterized in that the content of all inorganic ions is 20 ppm or less.

  7). The isocyanurate derivative according to 6), wherein the content of sodium ions and copper ions is 3 ppm or less, respectively.

  8). A resin composition for electronic materials, comprising the isocyanurate derivative according to 6) or 7).

  9). A resin composition for electronic materials, comprising a silicone resin containing the isocyanurate derivative according to 6) or 7).

  10). 1,3-diallyl isocyanurate characterized in that the content of inorganic ions is 20 ppm or less.

  11). 1,3-diallyl isocyanurate according to 10), wherein the content of sodium ions and copper ions is 3 ppm or less, respectively.

  12). A resin composition for electronic materials, comprising the 1,3-diallyl isocyanurate according to 10) or 11).

  13). A resin composition for electronic materials, comprising a silicone resin containing the 1,3-diallyl isocyanurate according to 10) or 11).

  By the purification method of the present invention, an isocyanurate derivative having a very small content of inorganic ions as impurities can be efficiently obtained.

  In the present invention, by treating an isocyanurate derivative containing an inorganic ion as an impurity with an adsorbent, the inorganic ion can be efficiently reduced and used as a raw material for a resin composition that requires electrical characteristics. This is a method for obtaining an isocyanurate derivative having a low content.

  Although it does not specifically limit as an isocyanurate derivative in this invention, The following general formula (I):

(Wherein R ¹ , R ² and R ³ represent the same or different hydrogen, or an organic group or halogen having 1 to 50 carbon atoms. The organic group is an ether bond, an ester bond, an acetal bond, an imide bond or an amide bond. The compound represented by this may be preferred. Preferable specific examples of R ¹ , R ² and R ³ include hydrogen, methyl group, ethyl group, propyl group, butyl group, phenyl group, benzyl group, phenethyl group, methoxy group, ethoxy group, vinyl group, allyl group, Glycidyl group,

Etc. Furthermore, in order to make it easy to form a resin composition by an addition reaction or the like, at least one of R ^{1 to} R ³ preferably contains an allyl group. More preferably, R ¹ is hydrogen and at least one of R ² and R ³ is an allyl group. Particularly preferably, R ¹ is hydrogen, and R ² and R ³ are allyl groups.

  The production method of the isocyanurate derivative in the present invention is not particularly limited. For example, in the case of 1,3-diallyl isocyanurate, acetic acid and cupric chloride are used in a toluene solvent, and triallyl isocyanurate is heated to 1, It can be produced by a method by a method for obtaining 3-diallyl isocyanurate. However, this method usually contains 10 to 1000 ppm of various inorganic ions.

  As the adsorbent used in the present invention, an inorganic adsorbent and an organic adsorbent can be used.

  Examples of inorganic adsorbents include metal oxides such as silica, alumina, magnesium oxide, zinc oxide, and titanium oxide; composites such as aluminum silicate, magnesium silicate, aluminum magnesium composite oxide, aluminum magnesium silicate, and zeolite. Metal hydroxides; Metal hydroxides such as aluminum hydroxide and hydrotalcite-like compounds; Inorganic ion exchangers composed of bismuth oxoacid, antimony oxoacid, magnesium oxoacid, aluminum oxoacid, zirconium oxoacid, etc. IXE series manufactured by the company); activated clay, acid clay, diatomaceous earth, activated carbon and the like. These composites and hydrates may be used.

  Examples of organic adsorbents include styrene-based, acrylic-based, phenol-based, and cellulose-based ion exchange resins and chelate resins.

  The adsorbent may be in the form of a solid, a porous body, or a gel. A solid or porous adsorbent is preferred.

  Among these adsorbents, inorganic adsorbents are preferable because they have low elution properties in organic solvents and can be easily separated from allyl isocyanurate derivatives after the adsorption treatment. Among the inorganic adsorbents, composite metal oxides, metal hydroxides, activated carbon, etc. are preferable. Among them, aluminum silicate, magnesium silicate, magnesium aluminum composite oxide, hydrotalcite-like compound, aluminum hydroxide, activated carbon And the like are more preferable because they have a great effect of reducing inorganic ions.

In addition, the general formula:
_{^{xM n + n / 2 O ·}} Al 2 O 3 · y (SiO 2) · zH 2 O
(Wherein M is a metal ion such as Na, K, Mg, Ca, Zn, n is 1 or 2, x is 0 ≦ x ≦ 1, y is 0 <y ≦ 15, z is 0 ≦ z ≦ 15)
In particular, aluminum silicate (for example, Kyoward 700 manufactured by Kyowa Chemical Industry Co., Ltd.) is particularly preferable because inorganic ions can be significantly reduced. These adsorbents may be used alone or in combination.

The particle size and specific surface area of the adsorbent in this method are not particularly limited, but it is preferable that the average particle size is in the range of 0.1 to 500 μm and the specific surface area is in the range of 1 to 5000 m ² / g. This is because the smaller the particle size and the larger the specific surface area, the more efficiently inorganic ions can be reduced, and when the particle size becomes too small, it becomes difficult to separate from the isocyanurate derivative solution after the adsorption treatment. is there.

  In this method, the addition amount of the adsorbent is not particularly limited, but is preferably in the range of 0.01 to 20% by weight, more preferably in the range of 0.1 to 10% by weight with respect to the isocyanurate derivative. It is.

  The solvent used in the present method is not particularly limited, and is an organic solvent, water, or a mixture of an organic solvent and water.

  Examples of the organic solvent include diethyl ether, di-n-propyl ether, di-i-propyl ether, n-butyl methyl ether, i-butyl methyl ether, t-butyl methyl ether, dibutyl ether, dimethoxyethane, diethoxy. Ether solvents such as ethane, ethylene glycol dibutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, 1,3-dioxolane, anisole Acetone, methyl ethyl ketone, diethyl ketone, 4-heptanone, methyl amyl ketone, di-i-pro Ketone solvents such as ruketone, n-butyl methyl ketone, i-butyl methyl ketone, 5-nonanone, di-i-butyl ketone, cyclohexanone; nitrile solvents such as acetonitrile, propionitrile, benzonitrile; methyl acetate, ethyl acetate, acetic acid Propyl, butyl acetate, amyl acetate, methyl propionate, ethyl propionate, propyl propionate, butyl propionate, methyl butyrate, ethyl butyrate, propyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, dimethyl carbonate Ester solvents such as diethyl carbonate; pentane, hexane, heptane, octane, nonane, decane, petroleum ether, cyclopentane, cyclohexane, methylcyclohexane, benzene, toluene, o-xylene, m-xylene, p-key Hydrocarbon solvents such as len; halogens such as dichloromethane, chloroform, carbon tetrachloride, 1,2-dichloroethane, 1,1,2,2-tetrachloroethane, trichloroethylene, tetrachloroethylene, chlorobenzene, 1,2-dibromoethane, bromobenzene Solvent; methanol, ethanol, n-propanol, i-propanol, n-butanol, i-butanol, t-butanol, ethylene glycol, propylene glycol, diethylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, Alcohol solvents such as propylene glycol monoethyl ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether Ether acetate, propylene glycol monomethyl ether acetate such as glycol ester solvent; pyridine, N, N- dimethylformamide, nitrogen-containing solvents such as hexamethylphosphoric triamide; dimethyl sulfoxide, sulfur-containing solvents such as carbon disulfide and the like.

  These solvents may be used alone or in combination of two or more. Of these, ether solvents, ketone solvents, and nitrile solvents are preferred because of the high solubility of isocyanurate derivatives, more preferably low polarity solvents, and ether solvents are particularly preferred. Among them, 1,4-dioxane is particularly preferable because inorganic ions (particularly copper ions) can be efficiently reduced.

  If necessary, a small amount of water may be added to these organic solvents. The amount of water to be added is not particularly limited, but is preferably in the range of 0.01 to 10% by weight, more preferably 0.1 to 5% by weight with respect to the adsorbent. By adding water, inorganic ions may be more efficiently reduced.

  The temperature during the adsorption treatment is not particularly limited, but a temperature below the boiling point of the solvent within the range of 0 ° C. or higher and 200 ° C. or lower is preferable from the viewpoint of ease of operation. More preferably, it is 20 ° C. or higher and 150 ° C. or lower.

  The method for treating the adsorbent is not particularly limited. For example, a solvent and an adsorbent may be added to the isocyanurate derivative, and the temperature may be adjusted as necessary and stirred. After completion of the adsorption treatment, the reaction solution may be used in the next step as it is, but the adsorbent may be removed by filtration operation or the like.

  The filtration method is not particularly limited, and a generally widely used method can be used. Examples thereof include a method of filtering through a filter such as a filter paper, a filter cloth, a membrane filter, and a glass fiber filter. Furthermore, a filter aid may be laid on the filter and filtered as necessary, for example, in order to suppress mixing of insoluble substances such as adsorbent into the filtrate or clogging of the filter.

  The filter aid that can be used is not particularly limited, and commercially available filter aids can be used. Examples thereof include diatomaceous earth filter aids such as celite and radiolite, perlite filter aids such as locahelp, and silica. . These filter aids may be used alone or in combination of two or more.

  As another method of adsorbent treatment, an isocyanurate derivative solution in which inorganic ions are continuously reduced is obtained by packing the adsorbent in a container such as a column and passing the isocyanurate derivative dissolved in a solvent. Is the method.

  In the present method, the inorganic ions to be removed are not particularly limited, and examples thereof include metal ions and halide ions. Of these, sodium ions, copper ions, chloride ions, bromide ions, potassium ions, calcium ions, aluminum ions, and the like can be effectively removed.

  Although the use of the isocyanurate derivative treated by this method is not particularly limited, it can be used as a raw material for plastics, lubricants, crosslinking agents, synthetic rubbers, electrical insulating materials, electronic materials and the like. Among these, since the content of inorganic ions is extremely small, it can be suitably used as a raw material for a resin composition for electronic substrates such as an electrical insulating material that requires electrical characteristics.

  As the content of inorganic ions contained in the isocyanurate derivative treated by the present method, the content of each inorganic ion is preferably 20 ppm or less in order to be used as a raw material of a resin composition for electronic materials such as an electrical insulating material. It is. Furthermore, it is more preferable that each inorganic ion is 15 ppm or less, sodium ion is 3 ppm or less, and copper ion is 3 ppm or less. In particular, when aluminum silicate is used as the adsorbent and 1,4-dioxane is used as the solvent, an isocyanurate derivative in which sodium ions are reduced to 2 ppm or less and copper ions are reduced to 0.1 ppm or less can be obtained.

  It does not specifically limit as a resin composition containing the isocyanurate derivative obtained by this method, Both a thermoplastic resin and a thermosetting resin can be used.

  Examples of the thermoplastic resin include polyolefin resins such as polypropylene, polyethylene, polymethylpentene, polynorbornene, and polystyrene, acrylic resins such as polymethyl methacrylate and poly (meth) acrylate, polyvinyl chloride, and polyvinylidene chloride. Chlorinated resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polylactic acid, polyhydroxyalkanoate, polybutylene succinate, polyethylene succinate, polyethylene succinate adipate, polyester resins such as polycarbonate, 6-nylon, Polyamide resins such as 6-6 nylon, 11 nylon and 12 nylon, and fluorine resins such as polytetrafluoroethylene and polyvinylidene fluoride Etc., and the like.

  Examples of the thermosetting resin include an epoxy resin, a silicone resin, a urethane resin, a phenol resin, a polyimide resin, and a melamine resin. Among them, since the content of inorganic ions is extremely small, it can be suitably used as a raw material for resin compositions for electronic materials such as additives and cross-linking agents for resin compositions that require electrical characteristics, especially electrical insulating materials, For example, an epoxy resin, a silicone resin, etc. are mentioned.

  Among these, silicone resins are useful resins having excellent heat resistance, light resistance, transparency, and insulation. A method for synthesizing the silicone resin is not particularly limited, but a method of synthesizing by a hydrosilylation reaction is preferable because side reactions during the reaction can be suppressed and the silicone resin can be efficiently synthesized.

As such a silicone resin, for example, as a polyorganosiloxane compound, a hydrosilylation reaction product obtained by adding the following compounds (α) to (γ) to 1,3-diallyl isocyanurate purified by the method of the present invention:
(Α) An organic compound having one or more carbon-carbon double bonds having reactivity with SiH groups in one molecule.
(Β) An organosiloxane compound having at least two SiH groups in one molecule.
(Γ) A compound having at least one photopolymerizable functional group and one or more carbon-carbon double bonds having reactivity with SiH groups in one molecule.
Can be used.

  The organic compound in the compound (α) is not particularly limited. For example, diallyl phthalate, triallyl trimellitate, diethylene glycol bisallyl carbonate, trimethylolpropane diallyl ether, trimethylolpropane triallyl ether, pentaerythritol triallyl ether, Pentaerythritol tetraallyl ether, 1,1,2,2-tetraallyloxyethane, diarylidene pentaerythritol, triallyl cyanurate, triallyl isocyanurate, diallyl monobenzyl isocyanurate, 1,2,4-trivinyl Cyclohexane, 1,4-butanediol divinyl ether, nonanediol divinyl ether, 1,4-cyclohexanedimethanol divinyl ether, triethyleneglycol Divinyl ether, trimethylolpropane trivinyl ether, pentaerythritol tetravinyl ether, diallyl ether of bisphenol S, divinylbenzene, divinylbiphenyl, 1,3-diisopropenylbenzene, 1,4-diisopropenylbenzene, 1,3-bis ( Allyloxy) adamantane, 1,3-bis (vinyloxy) adamantane, 1,3,5-tris (allyloxy) adamantane, 1,3,5-tris (vinyloxy) adamantane, dicyclopentadiene, vinylcyclohexene, 1,5- Hexadiene, 1,9-decadiene, diallyl ether, bisphenol A diallyl ether, 2,5-diallylphenol allyl ether, and oligomers thereof, 1,2-polybutadiene (1,2 ratio 1 0-100%, preferably 1,2 ratio 50-100%), novolak phenol allyl ether, allylated polyphenylene oxide,

In addition, there may be mentioned those in which all of the glycidyl groups of conventionally known epoxy resins are replaced with allyl groups.

  As the compound (α), low molecular weight compounds that are difficult to express separately by dividing into a skeleton portion and an alkenyl group (a carbon-carbon double bond reactive with the SiH group) can also be used. Specific examples of these low molecular weight compounds include aliphatic chain polyene compound systems such as butadiene, isoprene, octadiene and decadiene, fats such as cyclopentadiene, cyclohexadiene, cyclooctadiene, dicyclopentadiene, tricyclopentadiene and norbornadiene. Examples thereof include aromatic cyclic polyene compound systems and substituted aliphatic cyclic olefin compound systems such as vinylcyclopentene and vinylcyclohexene.

As the compound (α), an isocyanurate derivative is particularly preferable from the viewpoint of high heat resistance and light resistance, and triallyl isocyanurate is particularly preferable.
The compound (β) is not particularly limited as long as it is an organopolysiloxane compound having at least two SiH groups in one molecule, but from the viewpoint of imparting flexibility to the cured product,

(Wherein R ⁴ and R ⁵ represent an organic group having 1 to 6 carbon atoms and may be the same or different, l is 0 to 50, n is 1 to 50, and m is a number of 0 to 10. Represents.)
A linear organopolysiloxane having at least two SiH groups in one molecule represented by R ⁴ and R ⁵ are preferably methyl groups from the viewpoints of availability and heat resistance, and are preferably phenyl groups from the viewpoint of increasing the strength of the cured product.
Among these, from the viewpoint that the heat resistance of the cured product is high,

(Wherein, R ^6, R ⁷ represents an organic group having 1 to 6 carbon atoms, n represents a number from 0 to 50.)
An organopolysiloxane having at least two SiH groups in one molecule and having a T structure (X ₃ SiO _3/2 ) or a Q structure (SiO _4/2 ) in the molecule is preferably represented by: ⁶ and R ⁷ are particularly preferably methyl groups from the viewpoints of availability and heat resistance.

  Among these, from the viewpoint of availability and reactivity with the 1,3-diallyl isocyanurate compounds (α) and (γ), the following general formula (II)

(Wherein R ⁸ and R ⁹ represent an organic group having 1 to 6 carbon atoms and may be the same or different, n represents 1 to 10, and m represents a number of 0 to 10). Cyclic organopolysiloxanes having at least 3 SiH groups per molecule are preferred.

The substituents R ⁸ and R ⁹ in the compound represented by the general formula (II) are preferably selected from the group consisting of C, H and O, and are preferably hydrocarbon groups. More preferably, it is a methyl group.

The compound represented by the general formula (II) is preferably 1,3,5,7-tetramethylcyclotetrasiloxane from the viewpoint of availability and reactivity.
The various compounds (β) described above can be used alone or in combination of two or more.

  The compound (γ) is not particularly limited as long as it is a compound having at least one photopolymerizable functional group and one or more carbon-carbon double bonds having reactivity with SiH groups in one molecule. .

Although it does not specifically limit as a photopolymerizable functional group, A generally known thing can be utilized, for example, an epoxy group acryloyl group, a methacryloyl group, etc. are raised.
Specific examples of the compound (γ) having an epoxy group as a photopolymerizable functional group include vinylcyclohexene oxide, allyl glycidyl ether, diallyl monoglycidyl isocyanurate, monoallyl diglycidyl isocyanurate, and the like. From the viewpoint of superiority, vinylcyclohexene oxide, which is a compound having an alicyclic epoxy group, is particularly preferable.

  Specific examples of the photopolymerizable functional group include those represented by the following general formula (III) from the viewpoint of availability and heat resistance.

(Wherein R ¹⁰ and R ¹¹ represent an organic group having 1 to 6 carbon atoms, n represents 1 to 3, and m represents a number of 0 to 10). From the viewpoint of easy removal of by-products, trimethoxyvinylsilane, triethoxyvinylsilane, dimethoxymethylvinylsilane, diethoxymethylvinylsilane, methoxydimethylvinylsilane, and ethoxydimethylvinylsilane are particularly preferable.

  Examples of the compound (γ) having an acryloyl group or a methacryloyl group as a photopolymerizable functional group include allyl (meth) acrylate, vinyl (meth) acrylate, dicyclopentenyl (meth) acrylate, and dicyclopentenyloxyethyl (meth). Acrylate, (meth) acrylic acid-modified allyl glycidyl ether (manufactured by Nagase ChemteX, trade name: Denacol acrylate DA111), and vinyl group or allyl group and the following general formula (IV)

(Wherein n represents a number from 0 to 16, R ¹² represents a hydrogen atom or a methyl group), a compound having one or more organic groups each in the same molecule, for example, the above general formula ( In I), at least one of R ^{1 to} R ^{3 in} the formula is a group represented by the general formula (IV), and at least one of R ^{1 to} R ³ is SiH such as a vinyl group or an allyl group. Examples thereof include a compound which is a group having a carbon-carbon double bond having reactivity with a group.

  Further, from the viewpoint of high selectivity for hydrosilylation, a compound in which a methacryloyl group coexists with an allyl or vinyl group in the same molecule is preferable, and allyl methacrylate, vinyl methacrylate, and the like are particularly preferable in terms of availability.

  Moreover, in the case of hydrosilylation reaction, 2 or more types of compounds ((gamma)) can also be used together regardless of the kind of photopolymerizable functional group.

As a catalyst for the hydrosilylation reaction, a known catalyst for hydrosilylation may be used. For example, the following can be used. Platinum simple substance, alumina, silica, carbon black or the like supported on solid platinum, chloroplatinic acid, a complex of chloroplatinic acid and alcohol, aldehyde, ketone or the like, platinum-olefin complex (for example, Pt (CH ₂ = CH ₂ ) ₂ (PPh ₃ ) ₂ , Pt (CH ₂ = CH ₂ ) ₂ Cl ₂ ), platinum-vinylsiloxane complex (for example, Pt (ViMe ₂ SiOSiMe ₂ Vi) _n , Pt [(MeViSiO) ₄ ]) _m ), platinum-phosphine complexes (eg, Pt (PPh ₃ ) ₄ , Pt (PBu ₃ ) ₄ ), platinum-phosphite complexes (eg, Pt [P (OPh) ₃ ] ₄ , Pt [P (OBu) ₃ ] ₄₎ (in the formula, Me represents a methyl group, Bu a butyl group, Vi is vinyl group, Ph represents a phenyl group, n, m is an integer.), and the like dicarbonyl dichloroplatinum

Examples of catalysts other than platinum compounds include RhCl (PPh) ₃ , RhCl ₃ , RhAl ₂ O ₃ , RuCl ₃ , IrCl ₃ , FeCl ₃ , AlCl ₃ , PdCl ₂ .2H ₂ O, NiCl ₂ , TiCl _4. , Etc.

  Of these, chloroplatinic acid, platinum-olefin complexes, platinum-vinylsiloxane complexes and the like are preferable from the viewpoint of catalytic activity. Moreover, these catalysts may be used independently and may be used together 2 or more types.

Although the addition amount of the catalyst is not particularly limited, the lower limit of the preferable addition amount is 1,3-diallyl isocyanurate, compound (α) in order to have sufficient curability and keep the cost of the curable composition relatively low. And a carbon-carbon double bond having reactivity with the SiH group of the compound (γ) (hereinafter sometimes simply referred to as “alkenyl group”), 10 ⁻⁸ mol, more preferably 10 ^−6. The upper limit of the preferable addition amount is 10 ⁻¹ mol, more preferably 10 ⁻² mol, relative to 1 mol of the alkenyl group of the above compound.

In addition, a cocatalyst can be used in combination with the above catalyst. Examples thereof include phosphorus compounds such as triphenylphosphine, 1,2-diester compounds such as dimethyl malate, 2-hydroxy-2-methyl-1 Examples include acetylene alcohol compounds such as butyne and 1-ethynyl-1-cyclohexanol, and sulfur compounds such as simple sulfur. The addition amount of the cocatalyst is not particularly limited, but the lower limit of the preferable addition amount with respect to 1 mol of the hydrosilylation catalyst is 10 ⁻² mol, more preferably 10 ⁻¹ mol, and the upper limit of the preferable addition amount is 10 ^2. Mol, more preferably 10 mol.

  There are various reaction orders and methods, but from the viewpoint that the synthesis process is simple, 1,3-diallyl isocyanurate, compound (α), compound (β) and compound (γ) can be combined in one pot. A method in which a hydrosilylation reaction is performed and an unreacted compound is removed at the end is preferable. From the viewpoint that it is difficult to contain a low molecular weight substance, any of 1,3-diallyl isocyanurate, a compound (α), and a compound (β) Is added in excess to cause hydrosilylation reaction, and then the unreacted 1,3-diallyl isocyanurate, compound (α) and compound (β) are removed, and the resulting reaction product and compound (γ) are hydrosilylated. The method of making it react is more preferable.

  The proportion of each compound to be modified is not particularly limited, but when 1,3-diallyl isocyanurate, the total alkenyl group amount of compounds (α) and (γ) is A, and the total SiH group amount of compound (β) is B 1 ≦ B / A ≦ 30 is preferable, and 1 ≦ B / A ≦ 10 is more preferable. When this value is small, unreacted alkenyl groups remain in the composition, which causes coloring, and when it is large, many unreacted SiH groups remain, causing foaming and cracking during curing of the composition. It may become.

  In addition, with respect to the modification ratio of 1,3-diallyl isocyanurate, compound (α) and compound (γ), the alkenyl group of 1,3-diallyl isocyanurate is A1, the alkenyl group of compound (α) is A2, the compound ( When the alkenyl group of γ) is A3, A1 + A2 + A3 = 1 is selected as appropriate within the range of 0.01 ≦ A1 ≦ 0.99, 0 ≦ A2 <0.99, 0.01 ≦ A3 ≦ 0.99. It can be denatured, the solubility in alkali can be improved by increasing the proportion of A1, the strength of the cured product can be improved by increasing the proportion of A2, and the proportion of A3 is increased. Therefore, curability can be improved.

  The reaction temperature can be variously set. In this case, the lower limit of the preferable temperature range is 30 ° C., more preferably 50 ° C., and the upper limit of the preferable temperature range is 200 ° C., more preferably 150 ° C. If the reaction temperature is low, the reaction time for sufficiently reacting becomes long, and if the reaction temperature is high, it is not practical.

  The reaction may be carried out at a constant temperature, but the temperature may be changed in multiple steps or continuously as required. Various reaction times and pressures during the reaction can be set as required.

  Oxygen can be used during the hydrosilylation reaction. The hydrosilylation reaction can be promoted by adding oxygen to the gas phase portion of the reaction vessel. From the point of setting the amount of oxygen to be below the lower limit of explosion limit, the oxygen volume concentration in the gas phase must be controlled to 3% or less. In view of promoting the hydrosilylation reaction effect by the addition of oxygen, the oxygen volume concentration in the gas phase is preferably at least 0.1%, more preferably at least 1%.

  A solvent may be used during the hydrosilylation reaction. Solvents that can be used are not particularly limited as long as they do not inhibit the hydrosilylation reaction. Specific examples include hydrocarbon solvents such as benzene, toluene, hexane, heptane, tetrahydrofuran, 1,4-dioxane, 1, Ether solvents such as 3-dioxolane and diethyl ether, ketone solvents such as acetone and methyl ethyl ketone, and halogen solvents such as chloroform, methylene chloride and 1,2-dichloroethane can be preferably used.

  The solvent can also be used as a mixed solvent of two or more types. As the solvent, toluene, tetrahydrofuran, 1,3-dioxolane and chloroform are preferable. The amount of solvent to be used can also be set as appropriate.

  After the hydrosilylation reaction, the solvent and / or unreacted compound may be removed. By removing these volatile components, the reaction product obtained does not have volatile components. Therefore, when creating a cured product using the reaction product, problems of voids and cracks due to volatilization of volatile components are unlikely to occur. . Examples of the removal method include vacuum devolatilization. When devolatilizing under reduced pressure, it is preferable to treat at a low temperature. The upper limit of the preferable temperature in this case is 100 ° C, more preferably 80 ° C. When treated at high temperatures, it tends to be accompanied by alterations such as thickening.

  In such a hydrosilylation reaction, when an unpurified isocyanurate derivative containing a large amount of inorganic ions is used, gelation, side reaction, decrease in activity due to catalyst poisoning, etc. are likely to occur. However, when the isocyanurate derivative purified by the present invention is used, gelation and the like can be suppressed, and a polyorganosiloxane compound can be obtained efficiently.

  Further, such a polyorganosiloxane compound containing 1,3-diallyl isocyanurate can be dissolved in an alkaline aqueous solution and has photocurability by a photopolymerizable functional group, so that it can be developed with an alkali. Can be applied as. Furthermore, by using 1,3-diallyl isocyanurate purified by the method of the present invention, it is possible to improve alkali developability, such as being able to reduce the polymerization initiator for curing.

  The preparation method of such a curable composition is not specifically limited, It can prepare with various methods. Various components may be mixed and prepared immediately before curing, or may be stored at a low temperature in a one-component state in which all components are mixed and prepared in advance.

  As a light source for photocuring, a light source that emits an absorption wavelength of a polymerization initiator or a sensitizer to be used may be used, and a light source usually containing a wavelength in the range of 200 to 450 nm, such as a high-pressure mercury lamp, High pressure mercury lamp, metal halide lamp, high power metal halide lamp, xenon lamp, carbon arc lamp, light emitting diode, etc. can be used.

The exposure amount is not particularly limited, but a preferable exposure amount range is 1 to 5000 mJ / cm ² , more preferably 1 to 1000 mJ / cm ² . If the exposure is small, it will not cure. If the exposure amount is large, the color may change due to rapid curing. A preferred curing time range is 30 to 120 seconds, more preferably 1 to 60 seconds. When the curing time is long, the characteristics of rapid curing of photocuring are not utilized.

  Further, for the purpose of removing the solvent and improving the physical properties of the cured product, pre-baking and after-baking may be performed by applying heat before and after photocuring. Various curing temperatures can be set, but a preferable temperature range is 60 to 400 ° C, more preferably 90 to 350 ° C.

  There is no particular limitation on the patterning formation by alkali development, and a desired pattern can be formed by dissolving and removing the unexposed portion by a general developing method such as an immersion method or a spray method.

  In addition, the developer at this time can be used without particular limitation as long as it is generally used. Specific examples thereof include an aqueous organic alkali solution such as an aqueous tetramethylammonium hydroxide solution and an aqueous choline solution, and an aqueous potassium hydroxide solution. Inorganic alkali aqueous solutions such as sodium hydroxide aqueous solution, potassium carbonate aqueous solution, sodium carbonate aqueous solution and lithium carbonate aqueous solution, and those obtained by adding alcohol or surfactant to these aqueous solutions for adjusting the dissolution rate, etc. .

  The aqueous solution concentration is preferably 25% by weight or less, more preferably 10% by weight or less, still more preferably 5% by weight or less from the viewpoint that the contrast between the exposed part and the unexposed part is easily obtained. preferable.

  Although it does not specifically limit as a polymerization initiator added in order to harden curable resin composition, For example, a cationic polymerization initiator, a radical polymerization initiator, etc. can be used.

  The cationic polymerization initiator is particularly limited as long as it is an active energy ray cationic polymerization initiator that generates a cationic species or Lewis acid by active energy rays, or a thermal cationic polymerization initiator that generates a cationic species or Lewis acid by heat. It can be used without being.

  The cationic active energy ray cationic polymerization initiator is not particularly limited, and examples thereof include arylsulfonium complex salts, aromatic sulfonium or iodonium salts of halogen-containing complex ions, and aromatic onium salts of group II, group V and group VI elements. Is mentioned.

  Some of these salts are FX-512 (3M), UVR-6990 and UVR-6974 (Union Carbide), UVE-1014 and UVE-1016 (General Electric), KI-85 (Degussa) ), SP-152 and SP-172 (Asahi Denka Co., Ltd.), Sun-Aid SI-60L, SI-80L and SI-100L (Sanshin Chemical Co., Ltd.), WPI113 and WPI116 (Wako Pure Chemical Industries, Ltd.), RHODORSIL PI2074 (Rhodia) As a product.

  The thermal cationic polymerization initiator is not particularly limited, and examples thereof include sulfonium salts, ammonium salts, pyridinium salts, phosphonium salts, iodonium salts, trifluoro acid salts, boron trifluoride ether complex compounds, boron trifluoride, and the like. Cationic or protonic acid catalysts can be used.

It can be said to be a latent curing catalyst because it has high stability until it generates cationic species by heating. The polymerization activity varies depending on the type of substituent and the type of anion of the onium salt. In particular, for the anion, BF ⁻ <AsF ₆ ⁻ <PF ₆ ⁻ <SbF ₆ ⁻ <B (C ₆ F ₅ ) ₄ ⁻ It is known that the polymerization activity increases in this order. In addition, it is known that specific phenol compounds such as an aluminum complex and a silanol compound, and an aluminum complex and bisphenol S serve as a cationic polymerization catalyst.

  On the other hand, among aromatic onium salts used as active energy ray cationic polymerization initiators, there are those that generate cationic species by heat, and these can also be used as thermal cationic polymerization initiators. Examples include Sun Aid SI-60L, SI-80L and SI-100L (Sanshin Chemical Co., Ltd.), RHODORSIL PI2074 (Rhodia). Among these cationic polymerization initiators, aromatic onium salts are preferable in that they are excellent in handleability and the balance between latency and curability.

  The amount of the cationic polymerization initiator used is preferably 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight with respect to 100 parts by weight of the modified polyorganosiloxane compound. When the amount of the cationic polymerization initiator is small, it takes a long time for curing or a cured product that is sufficiently cured cannot be obtained. When the amount of the initiator is large, the color of the initiator remains in the cured product, coloring or bulging due to rapid curing, or the heat and light resistance of the cured product is impaired.

  The radical polymerization initiator is not particularly limited as long as it is an active energy ray radical polymerization initiator that generates radical species by active energy rays, or a thermal radical polymerization initiator that generates radical species by heat.

  Active energy ray radical polymerization initiators include acetophenone compounds, benzophenone compounds, acylphosphine oxide compounds, oxime ester compounds, benzoin compounds, biimidazole compounds, α-diketone compounds, titanocene compounds, polynuclear compounds Quinone compounds, xanthone compounds, thioxanthone compounds, triazine compounds, ketal compounds, azo compounds, peroxides, 2,3-dialkyldione compounds, disulfide compounds, thiuram compounds, fluoroamine compounds, etc. Can be used.

  Specific examples of acetophenone compounds include 1- (4-dodecylphenyl) -2-hydroxy-2-methylpropan-1-one, 2,2-dimethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl- 1-phenylpropan-1-one, 1- (4′-i-propylphenyl) -2-hydroxy-2-methylpropan-1-one, 4- (2′-hydroxyethoxy) phenyl (2-hydroxy-2) -Propyl) ketone, 2,2-dimethoxyacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- (4'-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl-2- Dimethylamino-1- (4′-morpholinophenyl) butan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2,2 -Dimethoxy-1,2-diphenylethane-1-one, 2-hydroxy-1- [4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl] -2-methyl-propan-1-one Etc.

  Specific examples of the acylphosphine oxide compound include 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, and the like.

  Specific examples of oxime ester compounds include 1,2-octanedione 1- [4- (phenylthio) -2- (O-benzoyloxime)], ethanone 1- [9-ethyl-6- (2-methylbenzoyl) ) -9H-carbazol-3-yl] -1- (O-acetyloxime) and the like.

  Specific examples of the benzoin compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, methyl 2-benzoylbenzoate and the like.

  Specific examples of the benzophenone compounds include benzyl dimethyl ketone, benzophenone, 4,4′-bis (dimethylamino) benzophenone, 4,4′-bis (diethylamino) benzophenone, and the like.

  Specific examples of the α-diketone compound include diacetyl, dibenzoyl, methylbenzoylformate, and the like.

  Specific examples of the biimidazole compound include 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetrakis (4-ethoxycarbonylphenyl) -1,2′-biimidazole, 2 , 2'-bis (2,4-dichlorophenyl) -4,4 ', 5,5'-tetrakis (4-ethoxycarbonylphenyl) -1,2'-biimidazole, 2,2'-bis (2,4 , 6-trichlorophenyl) -4,4 ′, 5,5′-tetrakis (4-ethoxycarbonylphenyl) -1,2′-biimidazole, 2,2′-bis (2-bromophenyl) -4,4 ', 5,5'-tetrakis (4-ethoxycarbonylphenyl) -1,2'-biimidazole, 2,2'-bis (2,4-dibromophenyl) -4,4', 5,5'-tetrakis (4-ethoxycarbonylphenyl) -1, 2'-biimidazole, 2,2'-bis (2,4,6-tribromophenyl) -4,4 ', 5,5'-tetrakis (4-ethoxycarbonylphenyl) -1,2'-biimidazole 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2′-biimidazole, 2,2′-bis (2,4-dichlorophenyl) -4, 4 ', 5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis (2,4,6-trichlorophenyl) -4,4', 5,5'-tetraphenyl-1 , 2′-biimidazole, 2,2′-bis (2-bromophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2′-biimidazole, 2,2′-bis (2, 4-dibromophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2′-biimidazole, 2,2′-bi (2,4,6-bromophenyl) -4,4 ', 5,5'-tetraphenyl-1,2'-biimidazole.

  Specific examples of the polynuclear quinone compound include anthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 1,4-naphthoquinone and the like.

  Specific examples of the xanthone compound include xanthone, thioxanthone, 2-chlorothioxanthone, 2,5-diethyldioxanthone and the like.

  Specific examples of the triazine compound include 1,3,5-tris (trichloromethyl) -s-triazine, 1,3-bis (trichloromethyl) -5- (2′-chlorophenyl) -s-triazine, 1, 3-bis (trichloromethyl) -5- (4′-chlorophenyl) -s-triazine, 1,3-bis (trichloromethyl) -5- (2′-methoxyphenyl) -s-triazine, 1,3-bis (Trichloromethyl) -5- (4′-methoxyphenyl) -s-triazine, 2- (2′-furylethylidene) -4,6-bis (trichloromethyl) -s-triazine, 2- (4′-methoxy) Styryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (3 ′, 4′-dimethoxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- ( '-Methoxynaphthyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (2'-bromo-4'-methylphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2 -(2'-thiophenylethylidene) -4,6-bis (trichloromethyl) -s-triazine and the like.

  In particular, from the viewpoint of excellent thin film curability, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2-hydroxy-1- [4- [ 4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl] -2-methyl-propan-1-one, 1,2-octanedione 1- [4- (phenylthio) -2- (O-benzoyloxime) )], Ethanone 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] -1- (O-acetyloxime) is preferred.

  In particular, from the viewpoint that the cured product is excellent in transparency, 1-hydroxycyclohexyl phenyl ketone, 2,2-dimethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- ( 4′-i-propylphenyl) -2-hydroxy-2-methylpropan-1-one, 4- (2′-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, 2,2-dimethoxyacetophenone preferable.

  Specific examples of thermal radical polymerization initiators include diacyl peroxides such as acetyl peroxide and benzoyl peroxide, ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide, hydrogen peroxide, and tert-butyl hydroperoxide. , Hydroperoxides such as cumene hydroperoxide, dialkyl peroxides such as di-tert-butyl peroxide, dicumyl peroxide, dilauroyl peroxide, tert-butyl peroxyacetate, tert-butyl peroxypivalate Peroxyesters, azo compounds such as azobisisobutyronitrile, azobisisovaleronitrile, ammonium persulfate, sodium persulfate, potassium persulfate It is possible to persulfate salts, etc. of listed.

  These radical polymerization initiators may be used alone or in combination of two or more.

  The amount of radical polymerization initiator used is preferably 0.1 to 15 parts by weight, more preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the modified polyorganosiloxane compound. When the amount of the cationic polymerization initiator is small, there is a tendency that the curing is insufficient and a contrast cannot be obtained during alkali development. A large amount of initiator is not preferable because the cured film itself is colored.

  When curing with light energy, in order to improve the sensitivity of light and to give sensitivity to light of high wavelength such as g-line (436 nm), h-line (405 nm), i-line (365 nm) A sensitizer can be added. These sensitizers can be used in combination with the above cationic polymerization initiator and / or radical polymerization initiator to adjust the curability.

  Examples of the compound added as a sensitizer include anthracene compounds and thioxanthone compounds.

  Specific examples of the anthracene compound include anthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-dimethylanthracene, 9,10-dibutoxyanthracene, 9,10-dipropoxyanthracene, and 9,10-di. Ethoxyanthracene, 1,4-dimethoxyanthracene, 9-methylanthracene, 2-ethylanthracene, 2-tert-butylanthracene, 2,6-di-tert-butylanthracene, 9,10-diphenyl-2,6-di- tert-butylanthracene and the like are mentioned. From the viewpoint of availability, anthracene, 9,10-dimethylanthracene, 9,10-dibutoxyanthracene, 9,10-dipropoxyanthracene, 9,10-diethoxyanthracene, etc. preferable.

  Anthracene is preferable from the viewpoint of excellent transparency of the cured product, and 9,10-dibutoxyanthracene, 9,10-dipropoxyanthracene, and 9,10-diethoxy from the viewpoint of excellent compatibility with the curable composition. Anthracene and the like are preferable.

  Specific examples of the thioxanthone series include thioxanthone, 2-chlorothioxanthone, 2,5-diethyldioxanthone and the like.

  These sensitizers may be used alone or in combination of two or more.

  The resin composition thus obtained can be used for various applications. For example, transparent materials, optical materials, optical lenses, optical films, optical sheets, optical component adhesives, optical waveguide coupling optical adhesives, optical waveguide peripheral member fixing adhesives, DVD bonding adhesives, adhesives, Dicing tape, electronic materials, insulating materials (including printed circuit boards, wire coatings, etc.), high-voltage insulating materials, interlayer insulating films, TFT passivation films, TFT gate insulating films, TFT interlayer insulating films, TFT transparent flattening Membrane, insulating packing, insulation coating material, adhesive, high heat resistant adhesive, high heat dissipation adhesive, optical adhesive, LED element adhesive, various substrate adhesive, heat sink adhesive, paint, UV powder Body paint, ink, colored ink, UV inkjet ink, coating material (hard coat, sheet, film, release paper coat, optical disc coat, optical fabric ), Molding materials (including sheets, films, FRP, etc.), sealing materials, potting materials, sealing materials, light-emitting diode sealing materials, optical semiconductor sealing materials, liquid crystal sealing agents, display devices Sealing material, sealing material for electrical materials, sealing material for various solar cells, high heat resistant sealing material, resist material, liquid resist material, colored resist, dry film resist material, solder resist material, binder resin for color filter, color Transparent flattening material for filter, binder resin for black matrix, photo spacer material for liquid crystal cell, transparent sealing material for OLED element, stereolithography, solar cell material, fuel cell material, display material, recording material, vibration proof material , Waterproof materials, moisture-proof materials, heat-shrink rubber tubes, O-rings, photoconductor drums for copying machines, battery The electrolyte can be applied to a gas separation membrane. In addition, concrete protective materials, linings, soil injection agents, cold storage materials, sealing materials for sterilization treatment equipment, contact lenses, oxygen permeable membranes TFT passivation films, TFT gate insulation films, TFT interlayer insulation films, and TFT transparent flat surfaces Additives to other resins, etc., as well as chemical film, color filter binder resin, color filter transparent flattening material, black matrix binder resin, liquid crystal cell photo spacer material, OLED element transparent sealing material It is done.

(Quantification of anion)
As a pretreatment, 200 mg of the sample was burned with QF-02 manufactured by Dia Instruments and absorbed in 25 mL of ultrapure water containing one drop of hydrazine hydrate. 50 μL was injected into an ion chromatograph measuring device ICS-2000 manufactured by Dionex Co., Ltd. and analyzed.

(Quantification of cations)
100 mg of a sample is precisely weighed in a PTFE decomposition vessel, ultra high purity sulfuric acid and ultra high purity nitric acid are added, and pressure acid decomposition is performed with a microwave decomposition apparatus MLS-1200MEGA manufactured by Milestone General, and the decomposition solution is set to 50 mL. I was satisfied. This was analyzed by ICP mass spectrometry using Agilent 7500CX manufactured by Agilent Technologies.

  Table 1 shows the amount of inorganic ions of 1,3-diallyl isocyanurate (unrefined product).

Example 1
1.75 g of 1,3-diallyl isocyanurate is added with 50 g of 1,4-dioxane and 0.375 g of aluminum silicate (specific surface area 542 m ² / g, Kyowa Kagaku Kogyo Kyodo 700SEN-S), 80 ° C. oil bath The mixture was stirred for 1 hour with heating. After cooling to room temperature, radiolite was used as a filter aid and filtered to remove insolubles, and the solvent was distilled off from the filtrate under reduced pressure. The ion content of the obtained 1,3-diallyl isocyanurate (yield 7.3 g, recovery rate 97%) was quantified.

(Example 2)
To 7.5 g of 1,3-diallyl isocyanurate, add 50 g of tetrahydrofuran and 0.375 g of aluminum silicate (specific surface area 542 m ² / g, Kyoward 700 SEN-S manufactured by Kyowa Chemical Industry Co., Ltd.) while heating in a 65 ° C. oil bath. Stir for 1 hour. After cooling to room temperature, radiolite was used as a filter aid and filtered to remove insolubles, and the solvent was distilled off from the filtrate under reduced pressure. The ion content of the obtained 1,3-diallyl isocyanurate (yield 7.3 g, recovery rate 97%) was quantified.

(Example 3)
38 g of 1,4-dioxane was added to 7.6 g of 1,3-diallyl isocyanurate and the mixture was stirred and then filtered. 0.375 g of aluminum silicate (specific surface area 542 m ² / g, Kyowa Kagaku Kogyo Kyodo 700SEN-S) was added to the obtained filtrate, and the mixture was stirred for 1 hour while heating in an 80 ° C. oil bath. After cooling to room temperature, radiolite was used as a filter aid and filtered to remove insolubles, and the solvent was distilled off from the filtrate under reduced pressure. The ion content of the obtained 1,3-diallyl isocyanurate (yield 7.4 g, recovery rate 97%) was quantified.

Example 4
To 7.5 g of 1,3-diallyl isocyanurate, 50 g of 1,4-dioxane and 0.375 g of aluminum hydroxide (KYOWARD 200S manufactured by Kyowa Chemical Industry Co., Ltd.) were added and stirred for 1 hour while heating in an 80 ° C. oil bath. After cooling to room temperature, radiolite was used as a filter aid and filtered to remove insolubles, and the solvent was distilled off from the filtrate under reduced pressure. The ion content of the obtained 1,3-diallyl isocyanurate (yield 7.4 g, recovery rate 99%) was quantified.

(Reference Example 1)
75 g of pure water was added to 10 g of 1,3-diallyl isocyanurate and stirred for 30 minutes to perform reslurry washing. The crystals were collected by suction filtration, dried at 80 ° C. for 1 h using a vacuum pump, and the ion content of the obtained 1,3-diallyl isocyanurate (yield 9.7 g, recovery rate 97%) was quantified.

(Example 5)
A 500 mL four-necked flask was charged with 52.6 g of toluene and 52.6 g of 1,3,5,7-tetramethylcyclotetrasiloxane, and the gas phase portion was purged with nitrogen, and then heated and stirred at an internal temperature of 105 ° C. 2.91 g of triallyl isocyanurate, 5.49 g of 1,3-diallyl isocyanurate purified by the method of Example 1, 38.1 g of 1,4-dioxane and a xylene solution of a platinum vinylsiloxane complex (containing 3 wt% as platinum) 0.01171 g of the mixed solution was added dropwise over 90 minutes. One hour after the completion of the dropping, the reaction was terminated by cooling. Unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure to obtain 27.85 g of a colorless and transparent liquid.

  The obtained colorless and transparent liquid 27.85 g was put into a 100 mL four-necked flask, 111 g of toluene was added, the gas phase was purged with nitrogen, and then heated at an internal temperature of 105 ° C. where 9.21 g of vinylcyclohexene oxide and toluene were added. 9.2 g of the mixture was added dropwise over 90 minutes. One hour after the completion of the dropping, the reaction was terminated by cooling. The reaction solution was cooled to obtain 37 g of “resin composition A” as a colorless and transparent liquid.

(Comparative Example 1)
A hydrosilylation reaction was carried out in the same manner as in Synthesis Example 1 except that the unpurified product 1,3-diallyl isocyanurate was used, but it gelled and no resin composition was obtained.

  Table 1 shows the inorganic ion content of 1,3-diallyl isocyanurate according to Examples 1 to 4, Comparative Example 1 and Reference Example 1 of the present invention.

  The allyl isocyanurate derivative obtained by this method has a very low ion content and can be suitably used as a raw material for synthesizing materials such as electronic parts that require a very low ion content.

Claims (13)

A method for purifying an isocyanurate derivative comprising treating an isocyanurate derivative containing an inorganic ion as an impurity with an adsorbent in a solvent. The purification method according to claim 1, wherein the isocyanurate derivative is 1,3-diallyl isocyanurate. The purification method according to claim 1 or 2, wherein the adsorbent is aluminum silicate. The purification method according to any one of claims 1 to 3, wherein the solvent is any one of an ether solvent, a ketone solvent, and a nitrile solvent. The purification method according to any one of claims 1 to 4, wherein the inorganic ions are sodium ions, copper ions or chloride ions. An isocyanurate derivative characterized in that the content of all inorganic ions is 20 ppm or less. The isocyanurate derivative according to claim 6, wherein the contents of sodium ions and copper ions are each 3 ppm or less. A resin composition for electronic materials, comprising the isocyanurate derivative according to claim 6. A resin composition for electronic materials, comprising a silicone resin containing the isocyanurate derivative according to claim 6 or 7. 1,3-diallyl isocyanurate characterized in that the content of inorganic ions is 20 ppm or less. The content of sodium ions and copper ions is 3 ppm or less, respectively, 1,3-diallyl isocyanurate according to claim 10. The resin composition for electronic materials characterized by including the 1, 3- diallyl isocyanurate of Claim 10 or 11. A resin composition for electronic materials, comprising a silicone resin containing the 1,3-diallyl isocyanurate according to claim 10 or 11.