JP2011056774A - Laminate molding apparatus - Google Patents

Laminate molding apparatus Download PDF

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JP2011056774A
JP2011056774A JP2009208620A JP2009208620A JP2011056774A JP 2011056774 A JP2011056774 A JP 2011056774A JP 2009208620 A JP2009208620 A JP 2009208620A JP 2009208620 A JP2009208620 A JP 2009208620A JP 2011056774 A JP2011056774 A JP 2011056774A
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mold
platen
turntable
movable
molding apparatus
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JP5440046B2 (en
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Noboru Kanie
登 蟹江
Akio Okamoto
昭男 岡本
Yuichiro Arima
祐一朗 有馬
Tadashi Shinada
忠 品田
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Takahashi Seiki Co Ltd
Ube Machinery Corp Ltd
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Takahashi Seiki Co Ltd
Ube Machinery Corp Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a versatile laminate molding apparatus applicable to user's various needs by one set of laminating apparatus. <P>SOLUTION: The laminate molding apparatus includes a fixed platen 3 provided with a first mold 21; a movable platen 5 provided with a second mold 8; a rotary platen 4 provided with a third mold 19 and a fourth mold 20 respectively; a mold clamping mechanism 7 moving the movable platen 5 and rotary platen 4 in the mold opening/closing direction; a rotary platen moving mechanism 12; a first injection unit 17 injecting and filling a first resin into a first cavity formed by clamping the first and third molds 21, 19; and a second injection unit 18 movably disposed in the mold opening/closing direction, and injecting and filling a second resin via any one of the first to fourth molds, into any one of the second cavity formed by clamping the first mold 21 and fourth mold 20, a third cavity formed by clamping the second mold 8 and third mold 19, and a fourth cavity formed by clamping the second mold 8 and fourth mold 20. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、1台の積層装置で多様な積層成形を行うことができる積層成形装置に関する。   The present invention relates to a lamination molding apparatus capable of performing various lamination moldings with a single lamination apparatus.

従来、複数材質又は複数色の樹脂を重ね合わせた積層成形品の成形に用いる積層成形装置として、2組の対向する射出機の間に、型開閉方向に固定盤、回転盤及び可動盤を設けたものが知られている(特許文献1参照)。この装置は、固定盤と、この固定盤から突設されたタイバーに案内されて固定盤に対して型開閉方向に進退自在に設けられた可動盤と、固定盤及び可動盤の間に型開閉方向に移動可能に設けた回転盤とを備え、回転盤の可動盤と固定盤とに相対する面にそれぞれ同じ雄型を取り付けると共に、回転盤の同じ雄型と組み合わせて異なるキャビティを形成する雌型を固定盤と可動盤とにそれぞれ取り付けて構成されている。この積層成形装置では、固定盤と可動盤間に設けられた回転盤を回転させて、型開閉動作により、回転盤の雄型を固定盤と可動盤の雌型に順次組み合わせて次々と異なるキャビティを形成し、可動盤側と固定盤側とにそれぞれ対向させた2組の射出機から、これらキャビティに次々と複数材質又は複数色の溶融樹脂を射出充填して積層成形品を成形する。この積層成形装置によれば、回転盤の一方の面に取り付けた雄型と可動盤に取り付けた雌型とで一次成形を行うと同時に、回転盤の他方の面に取り付けた雄型と固定盤に取り付けた雌型とで一次成形品に対する二次成形を行うことにより、型開閉動作1回につき1つの2層成形品を得ることができ、短いサイクルで積層成形品を得ることができる。   Conventionally, as a laminate molding device used to mold laminate molded products with multiple materials or multiple colors of resin, a fixed plate, a rotating plate and a movable plate are provided in the mold opening / closing direction between two sets of opposing injection machines. Is known (see Patent Document 1). This device has a fixed plate, a movable plate guided by a tie bar projecting from the fixed plate and movable in the mold opening / closing direction with respect to the fixed plate, and a mold opening / closing between the fixed plate and the movable plate. And a rotating disk provided so as to be movable in the direction, and the same male mold is attached to the surface of the rotating disk facing the movable disk and the fixed disk, respectively, and a female is formed in combination with the same male mold of the rotating disk to form different cavities. The mold is attached to a fixed platen and a movable platen respectively. In this laminating and forming apparatus, a rotating plate provided between the fixed platen and the movable platen is rotated, and the mold of the rotating plate is sequentially combined with the fixed plate and the female plate of the movable platen by a mold opening / closing operation, thereby successively different cavities. Then, from two sets of injection machines opposed to the movable platen side and the fixed platen side, a plurality of materials or a plurality of colors of molten resin are injected and filled one after another to form a laminated molded product. According to this laminated molding apparatus, primary molding is performed with a male mold attached to one surface of the rotating disk and a female mold attached to the movable disk, and at the same time, a male mold and a stationary disk attached to the other surface of the rotating disk. By performing the secondary molding on the primary molded product with the female mold attached to, one two-layer molded product can be obtained per mold opening / closing operation, and a laminated molded product can be obtained in a short cycle.

また、その他の積層成形装置として、可動金型を上下に移動させるものも知られている(特許文献2参照)。この装置は、固定側型板の機械中心に取り付けられる単一の固定金型と、上下方向へ移動可能に支持される可動板と、この可動板に対して上下方向へ所定の間隔をおいて取り付けられる少なくとも2個の可動金型と、可動板を移動して各可動金型を可動側型板の機械中心とほぼ一致する夫々の射出位置に選択的に位置させる上下駆動部材と、夫々の射出位置に配置された第1及び第2射出装置とを備える。この装置では、上下動可能に支持された可動板に取り付けられた複数の可動金型のうち、一の可動金型を単一の固定金型に対向させて第1射出装置により成形品を射出成形した後、可動板を上又は下に移動させて他の可動金型を固定金型に順次対向させて、第2射出装置により前に成形された成形品に他の成形品を順次積層成形する。この積層成形装置は、単一の固定金型に2以上の可動金型を交互に対向させて単一の金型キャビティを形成するものであるため、必要金型数を減少させ、金型コストを低減させることができる。   As another lamination molding apparatus, one that moves a movable mold up and down is also known (see Patent Document 2). This apparatus includes a single fixed mold attached to the machine center of a fixed side mold plate, a movable plate supported so as to be movable in the vertical direction, and a predetermined interval in the vertical direction with respect to the movable plate. At least two movable molds to be mounted, and a vertical drive member that moves the movable plate to selectively position each movable mold at a respective injection position that substantially coincides with the machine center of the movable side mold plate; A first injection device and a second injection device disposed at the injection position; In this apparatus, among a plurality of movable molds attached to a movable plate supported so as to be movable up and down, one movable mold is opposed to a single fixed mold and a molded product is injected by a first injection device. After molding, move the movable plate up or down to make the other movable molds sequentially face the fixed mold, and sequentially laminate the other molded products to the molded products previously molded by the second injection device To do. Since this laminated molding apparatus forms a single mold cavity by alternately opposing two or more movable molds to a single fixed mold, the number of molds required is reduced and the mold cost is reduced. Can be reduced.

特開昭62−60618号公報JP 62-60618 A 特開平01−113217号公報Japanese Patent Laid-Open No. 01-113217

しかしながら、特許文献1に記載の積層成形装置は、1次射出機と2次射出機を装置長手方向に対向させる配置に加えて、可動盤の型開閉動作に連動して1次射出機が型開閉方向、すなわち装置長手方向に進退するため、従来の単層成形装置と比較して装置全長が長くなってしまうという問題がある。また、1種類の積層成形品の成形のために、固定盤及び可動盤にそれぞれ金型を設けると共に、回転盤の可動盤と固定盤とに相対する面にそれぞれ同じ金型を設ける必要があったり、単層あるいは単色成形が困難であるといった汎用性の面で問題がある。   However, in the laminated molding apparatus described in Patent Document 1, in addition to the arrangement in which the primary injection machine and the secondary injection machine are opposed to each other in the longitudinal direction of the apparatus, the primary injection machine is connected to the mold opening / closing operation of the movable platen. Since it advances and retreats in the opening and closing direction, that is, in the longitudinal direction of the apparatus, there is a problem that the entire length of the apparatus becomes longer than that of a conventional single layer molding apparatus. In addition, in order to mold one type of laminated molded product, it is necessary to provide a mold for each of the fixed platen and the movable platen, and to provide the same mold for each of the surfaces of the rotating plate facing the movable platen and the fixed platen. There is a problem in terms of versatility such that it is difficult to form a single layer or a single color.

また、特許文献2に記載の多重射出成形装置は、固定側型板の機械中心に取り付けられる単一の固定金型に対して、複数の可動金型を上下動により順次対向させて単一の金型キャビティを形成する構成から、装置の高さ方向に少なくとも可動金型の3倍のスペースが必要となり、成形品の大きさに対して装置自体が大型化するため、大型の成形品には不向きであるという問題がある。また、型開閉動作2回につき1つの2層成形品を成形するものであるため、特許文献1に記載の積層成形装置と比較して、成形サイクルが長くかかるという問題がある。   Moreover, the multiple injection molding apparatus described in Patent Document 2 is configured such that a plurality of movable molds are sequentially opposed to each other by a vertical movement with respect to a single fixed mold attached to the machine center of the fixed side mold plate. The structure that forms the mold cavity requires a space at least three times that of the movable mold in the height direction of the device, and the device itself becomes larger than the size of the molded product. There is a problem of being unsuitable. In addition, since one two-layer molded product is molded every two mold opening / closing operations, there is a problem that a molding cycle takes longer than the lamination molding apparatus described in Patent Document 1.

これら成形サイクルと金型の数は、表裏一体の関係であり、特許文献1のように成形サイクルの短縮化を図ると金型数が増加し、特許文献2のように金型数の減少を図ると成形サイクルが長くなるため、使用者は、これらメリットとデメリットとを比較し、積層成形する成型品に最適な成形装置を選択するのが通常である。しかしながら、近年の製品のライフサイクルの短縮化に伴い、積層成形する成形品が短期間で変動し、使用している成形装置が変動した成形品のニーズに適合せず、成形コストが高額になるという問題がある。   These molding cycles and the number of molds are in an integrated relationship. If the molding cycle is shortened as in Patent Document 1, the number of molds increases, and the number of molds is decreased as in Patent Document 2. Since the molding cycle becomes longer as shown in the figure, the user usually compares these merits and demerits and selects the most suitable molding apparatus for the molded product to be laminated. However, with the recent shortening of the product life cycle, the molded product to be laminated is changed in a short period of time, and the molding equipment used does not meet the needs of the changed molded product, resulting in high molding costs. There is a problem.

そこで、本発明は、1台の積層装置で使用者の様々なニーズに応えられる万能な積層成形装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide a versatile laminate molding apparatus that can meet various needs of users with a single laminate apparatus.

上記の目的を達成するため、本発明の請求項1に係る積層成形装置は、第1金型が設けられた固定盤と、前記第1金型と対向する面に第2金型又はダミープレートが設けられると共に、前記固定盤に対して型開閉方向に進退自在に設けられた可動盤と、前記固定盤と前記可動盤との間において型開閉方向に移動可能で型開閉方向と直交する回転軸を中心として回転可能に設けられ、少なくとも2つの面を有し、異なる回転位置でそれぞれ前記第1金型と対向する異なる面に少なくとも第3金型及び第4金型がそれぞれ設けられた回転盤と、前記固定盤に対して前記可動盤を型開閉方向に移動させる型締機構と、前記固定盤に対して前記回転盤を型開閉方向に移動させる回転盤移動機構と、前記回転軸を中心として前記回転盤を回転させる回転盤回転機構と、前記第1金型に接続可能な状態で前記固定盤に配置されて前記第1金型と前記第3金型とが型締めされて形成される第1キャビティに第1の樹脂を射出充填する第1射出ユニットと、前記型開閉方向に移動可能に配置され、前記第1金型、第2金型、第3金型、第4金型及び前記回転盤の少なくとも1つに選択的に接続可能で、前記第1金型と前記第4金型とが型締めされて形成される第2キャビティ、前記第2金型と前記第3金型とが型締めされて形成される第3キャビティ、及び前記第2金型と前記第4金型とが型締めされて形成される第4キャビティのいずれか1つに前記第1乃至第4金型のいずれか1つを介して第2の樹脂を射出充填する第2射出ユニットとを備えたことを特徴とする。このように、本発明に係る積層成形装置は、第2射出ユニットを型開閉方向に移動可能に配置し、第2キャビティ、第3キャビティ及び第4キャビティのいずれにも第2の樹脂を射出充填可能とすることにより、1台の積層成形装置で単層成形や積層成形などの様々な成形方法を可能とすると共に、成形サイクル数や使用金型数などの成形条件を成形する成形品に応じて適宜変更し、常に最適な成形条件を採用することができる万能な積層成形装置とすることができる。   In order to achieve the above object, a laminated molding apparatus according to claim 1 of the present invention includes a stationary platen provided with a first mold, and a second mold or a dummy plate on a surface facing the first mold. And a movable plate provided to be movable in a mold opening / closing direction with respect to the fixed plate, and a rotation movable between the fixed plate and the movable plate in the mold opening / closing direction and orthogonal to the mold opening / closing direction. Rotation that is provided so as to be rotatable about an axis, has at least two surfaces, and is provided with at least a third die and a fourth die on different surfaces that respectively face the first die at different rotational positions. A plate, a mold clamping mechanism for moving the movable plate in the mold opening / closing direction with respect to the fixed plate, a rotating plate moving mechanism for moving the rotating plate in the mold opening / closing direction with respect to the fixed plate, and the rotating shaft. Rotation to rotate the rotating disk as a center A first resin is disposed in a first cavity formed by clamping the first mold and the third mold, which is disposed on the fixed plate in a state that can be connected to the rotation mechanism and the first mold. A first injection unit that injects and fills the mold, and is arranged to be movable in the mold opening and closing direction. At least one of the first mold, the second mold, the third mold, the fourth mold, and the turntable A second cavity that is selectively connectable and formed by clamping the first mold and the fourth mold, and formed by clamping the second mold and the third mold. And any one of the first to fourth molds through the third cavity and the fourth cavity formed by clamping the second mold and the fourth mold. And a second injection unit for injecting and filling the second resin. As described above, in the lamination molding apparatus according to the present invention, the second injection unit is disposed so as to be movable in the mold opening / closing direction, and the second resin is injected and filled into any of the second cavity, the third cavity, and the fourth cavity. By making it possible, various molding methods such as single layer molding and multilayer molding can be performed with a single laminating device, and the molding conditions such as the number of molding cycles and the number of molds used can be accommodated. Therefore, it is possible to obtain a versatile laminate molding apparatus that can always adopt optimum molding conditions.

本発明に係る積層成形装置において、前記回転盤は、前記第3金型又は第4金型を介して前記第1乃至第4キャビティのいずれか1つに樹脂を充填可能な流路を有するものであることが好ましい。また、前記第2射出ユニットは、前記型開閉方向と直交する方向から前記第1金型乃至第4金型及び前記回転盤の少なくとも1つに接続し、前記第2キャビティ乃至第4キャビティのいずれか1つに第2の樹脂を射出充填するものであることが好ましく、これにより、装置の全長及び高さ方向の長さを抑え、形状のバランスの良い小型な成形装置とすることができる。   In the lamination molding apparatus according to the present invention, the rotating disk has a flow path capable of filling resin into any one of the first to fourth cavities via the third mold or the fourth mold. It is preferable that The second injection unit is connected to at least one of the first mold to the fourth mold and the turntable from a direction orthogonal to the mold opening / closing direction, and any one of the second cavity to the fourth cavity It is preferable to inject and fill the second resin into one of them, thereby suppressing the overall length of the apparatus and the length in the height direction, and a compact molding apparatus having a good shape balance.

また、前記第2射出ユニットは、成形装置本体に対して着脱可能な別部材であることが好ましく、これにより、汎用の単層成形装置を流用して、容易に本発明に係る積層成形装置を得ることができる。   In addition, the second injection unit is preferably a separate member that can be attached to and detached from the molding apparatus main body, whereby a general-purpose single-layer molding apparatus can be diverted to easily perform the lamination molding apparatus according to the present invention. Obtainable.

さらに、前記型締機構は、トグル式型締機構であることが好ましく、これにより、効率よく発泡積層成形品を成形することができる。   Furthermore, the mold clamping mechanism is preferably a toggle type mold clamping mechanism, whereby a foamed laminated molded product can be molded efficiently.

以上のように、本発明によれば、1台の積層装置で使用者の様々なニーズに応えられる万能な積層成形装置を提供することができる。   As described above, according to the present invention, it is possible to provide a versatile laminate molding apparatus that can meet various needs of users with a single laminate apparatus.

本発明の第1実施形態に係る積層成形装置の全体主要構造を示す説明図である。It is explanatory drawing which shows the whole main structure of the lamination molding apparatus which concerns on 1st Embodiment of this invention. 第1実施形態に係る積層成形装置の第1の成形例を示す説明図である。It is explanatory drawing which shows the 1st shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 第1実施形態に係る積層成形装置の第2の成形例を示す説明図である。It is explanatory drawing which shows the 2nd shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 第1実施形態に係る積層成形装置の第3の成形例を示す説明図である。It is explanatory drawing which shows the 3rd shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 第1実施形態に係る積層成形装置の第4の成形例を示す説明図である。It is explanatory drawing which shows the 4th shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 第1実施形態に係る積層成形装置の第5の成形例を示す説明図である。It is explanatory drawing which shows the 5th shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 第1実施形態に係る積層成形装置の第6の成形例を示す説明図である。It is explanatory drawing which shows the 6th shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 第1実施形態に係る積層成形装置の第1の成形例を示す工程図である。It is process drawing which shows the 1st shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 第1実施形態に係る積層成形装置の第2の成形例を示す工程図である。It is process drawing which shows the 2nd shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 第1実施形態に係る積層成形装置の第3の成形例を示す工程図である。It is process drawing which shows the 3rd shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 第1実施形態に係る積層成形装置の第4の成形例を示す工程図である。It is process drawing which shows the 4th shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 第1実施形態に係る積層成形装置の第5の成形例を示す工程図である。It is process drawing which shows the 5th shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 第1実施形態に係る積層成形装置の第6の成形例を示す工程図である。It is process drawing which shows the 6th shaping | molding example of the lamination molding apparatus which concerns on 1st Embodiment. 本発明の第2実施形態に係る積層成形装置の全体主要構造を示す説明図である。It is explanatory drawing which shows the whole main structure of the lamination molding apparatus which concerns on 2nd Embodiment of this invention. 第2実施形態に係る積層成形装置の第7の成形例を示す工程図である。It is process drawing which shows the 7th shaping | molding example of the lamination molding apparatus which concerns on 2nd Embodiment.

以下、添付の図面を参照しながら、本発明に係る積層成形装置の好適な実施形態を詳細に説明する。   Hereinafter, preferred embodiments of a lamination molding apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

まず、図1及び図2を参照しながら本発明の第1実施形態に係る積層成形装置1の構成について説明する。図1(a)は、第1実施形態に係る積層成形装置1の全体主要構造を示す平面図、同図(b)は同じく正面図である。
図1に示すように、この積層成形装置1は、型開閉方向に配設された固定盤3、回転盤4及び可動盤5と、これらに装着された金型により形成される金型キャビティに溶融樹脂を射出充填するための1次射出ユニット17及び2次射出ユニット18を備えて構成されている。
First, the structure of the lamination molding apparatus 1 which concerns on 1st Embodiment of this invention is demonstrated, referring FIG.1 and FIG.2. Fig.1 (a) is a top view which shows the whole main structure of the lamination molding apparatus 1 which concerns on 1st Embodiment, The same figure (b) is a front view similarly.
As shown in FIG. 1, the lamination molding apparatus 1 includes a stationary platen 3, a rotating plate 4 and a movable platen 5 arranged in the mold opening / closing direction, and a mold cavity formed by a mold attached thereto. A primary injection unit 17 and a secondary injection unit 18 for injecting and filling molten resin are provided.

固定盤3は、ベッド2に固定され、回転盤4側の前面の中央に固定盤側金型21が取り付けられている。固定盤側金型21には、この固定盤側金型21と後述する回転盤4の1次側金型19又は2次側金型20とが組み合わされて形成される第1キャビティ又は第2キャビティのそれぞれに樹脂を導入する、樹脂遮断開放切替弁(図示せず)を有する独立した樹脂流路23a、23bと、樹脂流路23a、23bにそれぞれ連通する充填孔27a、27bとが形成されている。固定盤3の四隅からはタイバー9が突出して設けられ、このタイバー9は、それぞれ可動盤5を貫通している。   The fixed platen 3 is fixed to the bed 2, and a fixed platen side mold 21 is attached to the center of the front surface on the rotating platen 4 side. The fixed platen die 21 is formed by combining the fixed platen die 21 with a primary die 19 or a secondary die 20 of the rotating plate 4 to be described later. Independent resin flow paths 23a and 23b having resin cutoff opening / closing switching valves (not shown) for introducing resin into the cavities and filling holes 27a and 27b communicating with the resin flow paths 23a and 23b, respectively, are formed. ing. Tie bars 9 are provided so as to protrude from the four corners of the fixed platen 3, and each tie bar 9 penetrates the movable platen 5.

可動盤5は、タイバー9に案内され、型締機構駆動装置7によって駆動される型締機構14により固定盤3に対して進退自在に設けられている。また可動盤5には可動盤側金型8が、後述する回転盤4の1次側金型19と2次側金型20とに相対する位置に取り付けられている。可動盤側金型8には、この可動盤側金型8と後述する回転盤4の1次側金型19又は2次側金型20とが組み合わされて形成される第3キャビティ又は第4キャビティに樹脂を導入する、樹脂遮断開放切替弁(図示せず)を有する樹脂流路26と、樹脂流路26に連通する充填孔30とが形成されている。   The movable platen 5 is guided by the tie bar 9 and is provided so as to be movable back and forth with respect to the fixed platen 3 by a mold clamping mechanism 14 driven by a mold clamping mechanism driving device 7. A movable platen mold 8 is attached to the movable platen 5 at a position opposite to a primary mold 19 and a secondary mold 20 of the rotating plate 4 described later. The movable platen mold 8 has a third cavity or a fourth cavity formed by combining the movable platen mold 8 and a primary mold 19 or a secondary mold 20 of the rotating disk 4 described later. A resin flow path 26 having a resin cutoff opening switching valve (not shown) for introducing resin into the cavity and a filling hole 30 communicating with the resin flow path 26 are formed.

回転盤4は、回転軸13を中心として回転盤4を垂直軸線回りに回転させる回転盤回転機構11を介して、回転盤移動機構12上に設置されている。回転盤回転機構11は、1次側金型19と2次側金型20とを含む回転盤4の荷重を支持し、回転させることができる円周状のガイド等で構成された支持機構を有し、サーボモータ等の独立した駆動装置により任意の移動位置で回転軸13を中心として回転盤4を回転させることができる。回転盤移動機構12は、ボールネジとボールネジナットと直動ガイドとの組合せ等で構成される直線状のガイド機構を有し、回転盤4を型開閉方向に移動させ、所定位置でその位置を保持させることができる。   The turntable 4 is installed on the turntable moving mechanism 12 via a turntable rotation mechanism 11 that rotates the turntable 4 about the vertical axis about the rotation shaft 13. The turntable rotating mechanism 11 is a support mechanism constituted by a circumferential guide or the like that can support and rotate the load of the turntable 4 including the primary side mold 19 and the secondary side mold 20. The rotating disk 4 can be rotated around the rotating shaft 13 at an arbitrary movement position by an independent driving device such as a servo motor. The turntable moving mechanism 12 has a linear guide mechanism composed of a combination of a ball screw, a ball screw nut and a linear guide, etc., and moves the turntable 4 in the mold opening / closing direction and holds the position at a predetermined position. Can be made.

回転盤4の両面、すなわち固定盤3の固定盤側金型21と可動盤5の可動盤側金型8とにそれぞれ相対する面の中央には、1次側金型19と2次側金型20とがそれぞれ取り付けられている。1次側金型19には、この1次側金型19と可動盤側金型8とが組み合わされて形成される第3キャビティに樹脂を導入する、樹脂遮断開放切替弁(図示せず)を有する樹脂流路25と、樹脂流路25に連通する充填孔29とが形成されている。2次側金型20には、この2次側金型20と固定盤側金型21又は可動盤側金型8とが組み合わされて形成される第2キャビティ又は第4キャビティに樹脂を導入する、樹脂遮断開放切替弁(図示せず)を有する樹脂流路24と、樹脂流路24に連通する充填孔28とが形成されている。   The primary side mold 19 and the secondary side mold are located on both surfaces of the rotating plate 4, that is, in the center of the surfaces facing the fixed platen side mold 21 of the fixed platen 3 and the movable platen side mold 8 of the movable platen 5. A mold 20 is attached to each. In the primary side mold 19, a resin shut-off switching valve (not shown) for introducing resin into a third cavity formed by combining the primary side mold 19 and the movable platen side mold 8. And a filling hole 29 communicating with the resin flow path 25 is formed. In the secondary side mold 20, resin is introduced into the second cavity or the fourth cavity formed by combining the secondary side mold 20 and the stationary platen side mold 21 or the movable platen side mold 8. A resin flow path 24 having a resin cut-off opening switching valve (not shown) and a filling hole 28 communicating with the resin flow path 24 are formed.

回転盤連結機構15は、可動盤5の可動盤側金型8と回転盤4の1次側金型19もしくは2次側金型20とが型合わせされた状態で、可動盤5から支持されたノックピン等の連結機構の先端部15aを油圧やサーボモータ等で進退させることにより、可動盤5と回転盤4とを連結し一体化するものである。回転盤連結機構15により可動盤5と回転盤4とを一体化した状態では、可動盤5の型開閉動作に連動して、回転盤4を型開閉方向に移動させることができる。ここで、この回転盤連結機構15は、可動盤5と回転盤4とのいずれに設けても良いし、可動盤5の可動盤側金型8もしくは回転盤4の1次側金型19と2次側金型20とに、油圧等で駆動されるクランプ機構等の連結機構を設ける形態でも良い。   The turntable coupling mechanism 15 is supported from the movable platen 5 in a state where the movable platen side mold 8 of the movable platen 5 and the primary side die 19 or the secondary side die 20 of the rotary platen 4 are matched. The movable platen 5 and the rotary platen 4 are connected and integrated by advancing and retracting the tip 15a of the connecting mechanism such as a knock pin by hydraulic pressure or a servo motor. In a state where the movable platen 5 and the rotary platen 4 are integrated by the rotary plate coupling mechanism 15, the rotary platen 4 can be moved in the die opening / closing direction in conjunction with the mold opening / closing operation of the movable platen 5. Here, the rotating plate coupling mechanism 15 may be provided on either the movable platen 5 or the rotating platen 4, or the movable platen side mold 8 of the movable platen 5 or the primary side die 19 of the rotary platen 4. The secondary side mold 20 may be provided with a coupling mechanism such as a clamp mechanism driven by hydraulic pressure or the like.

1次射出ユニット17は、固定盤側金型21の背面に接続可能に装着されている。また、2次射出ユニット18は、移動機構22に支持されて移動機構22によって型開閉方向に移動可能となっており、固定盤3、回転盤4及び可動盤5のいずれかに装着された金型の側面又は回転盤4の側面に、型開閉方向と直交する方向から着脱可能に装着されて樹脂を射出充填できるようになっている。ここで、2次射出ユニット18及び移動機構22は、積層成形装置本体に対して着脱可能に設けられている。   The primary injection unit 17 is attached to the back surface of the fixed platen mold 21 so as to be connectable. The secondary injection unit 18 is supported by the moving mechanism 22 and can be moved in the mold opening / closing direction by the moving mechanism 22, and the gold mounted on any of the fixed platen 3, the rotary platen 4, and the movable platen 5. It is detachably mounted on the side surface of the mold or the side surface of the turntable 4 from the direction orthogonal to the mold opening / closing direction so that the resin can be injected and filled. Here, the secondary injection unit 18 and the moving mechanism 22 are detachably provided to the layer forming apparatus main body.

次に、図2を参照しながら、第1実施形態に係る積層成形装置1の動作を説明する。ここで、第1実施形態に係る積層成形装置1は、2次射出ユニット18から金型キャビティに樹脂を射出充填するに際し、2次射出ユニット18が型開閉方向に移動して、固定盤3の固定盤側金型21(21a)に接続する動作(図2A参照)、回転盤4の2次側金型20(20b及び20e)に接続する動作(図2B及び図2E参照)、回転盤4の1次側金型19(19c)に接続する動作(図2C参照)、及び可動盤5の可動盤側金型8(8d及び8f)に接続する動作(図2D及び図2F参照)を選択的に行なうことができるものである。以下、第1実施形態に係る積層成形装置1の第1乃至第6の成形例について、成形例毎に分けて詳細に説明する。   Next, the operation of the lamination molding apparatus 1 according to the first embodiment will be described with reference to FIG. Here, when the laminate molding apparatus 1 according to the first embodiment injects and fills the resin from the secondary injection unit 18 to the mold cavity, the secondary injection unit 18 moves in the mold opening / closing direction, and Operation to connect to the fixed platen side mold 21 (21a) (see FIG. 2A), operation to connect to the secondary side mold 20 (20b and 20e) of the turntable 4 (see FIG. 2B and FIG. 2E), turntable 4 Select the operation to connect to the primary side mold 19 (19c) (see FIG. 2C) and the operation to connect to the movable platen side mold 8 (8d and 8f) of the movable platen 5 (see FIGS. 2D and 2F). Can be done automatically. Hereinafter, the first to sixth molding examples of the lamination molding apparatus 1 according to the first embodiment will be described in detail for each molding example.

[第1の成形例]
まず、第1実施形態に係る積層成形装置1の第1の成形例について説明する。第1の成形例は、図2Aに示すように、2次射出ユニット18が固定盤3の固定盤側金型21aに接続し、第2キャビティに固定盤側金型21aを介して2次材料を射出充填することを特徴とするものである。図3は、第1の成形例を説明するための図である。
[First molding example]
First, a first molding example of the lamination molding apparatus 1 according to the first embodiment will be described. In the first molding example, as shown in FIG. 2A, the secondary injection unit 18 is connected to the stationary platen side mold 21a of the stationary platen 3, and the secondary material is connected to the second cavity via the stationary platen side mold 21a. Is injected and filled. FIG. 3 is a diagram for explaining a first molding example.

まず、図1(a)の全開状態から、図3(a)に示すように、可動盤5と回転盤4とを固定盤3方向に型閉めさせる。具体的には、まず、型締機構14により可動盤5を、回転盤移動機構12により前記所定位置に保持されている回転盤4まで型閉めさせて、可動盤5の可動盤側金型8aを2次側金型20aに型合わせさせる。型合わせ後、回転盤連結機構15により可動盤5と回転盤4とを一体化させてから、回転盤移動機構12による回転盤4の保持を解除する。次に、一体化した可動盤5と回転盤4とを型締機構14により型閉めさせて、回転盤4の1次側金型19aを固定盤3の固定盤側金型21aに型合わせさせる。   First, as shown in FIG. 3A, the movable platen 5 and the rotary platen 4 are closed in the direction of the fixed platen 3 from the fully opened state of FIG. Specifically, first, the movable platen 5 is closed by the mold clamping mechanism 14 to the rotary platen 4 held at the predetermined position by the rotary platen moving mechanism 12, and the movable platen side mold 8a of the movable platen 5 is closed. Is matched with the secondary mold 20a. After mold matching, the movable disk 5 and the rotating disk 4 are integrated by the rotating disk coupling mechanism 15, and then the holding of the rotating disk 4 by the rotating disk moving mechanism 12 is released. Next, the integrated movable platen 5 and rotating platen 4 are closed by the mold clamping mechanism 14 so that the primary side die 19 a of the rotating platen 4 is matched with the fixed platen side die 21 a of the fixed platen 3. .

ここで、回転盤4の前記型閉め動作は、型締機構14による可動盤5の型閉めによらず、回転盤移動機構12に、サーボモータ等の独立した駆動装置を設けて、その駆動装置により適宜、必要な動作を制御して行っても良い。   Here, the mold closing operation of the turntable 4 is performed by providing an independent drive device such as a servo motor on the turntable moving mechanism 12 regardless of the mold closing mechanism 14 closing the movable platen 5. Accordingly, necessary operations may be controlled as appropriate.

すべての型合わせが完了した後、型締機構14で回転盤4の1次側金型19aと固定盤3の固定盤側金型21a、および可動盤5の可動盤側金型8aと回転盤4の2次側金型20aとを型締めさせる。その状態で、回転盤4の1次側金型19aと固定盤3の固定盤側金型21aとで形成される第1キャビティに、固定盤側金型21aの充填孔27a及び固定盤側金型21aに形成された樹脂遮断開放切替弁を有する独立した樹脂流路23aを介して、1次射出ユニット17から予め設定された射出充填パターンに応じて1次材料を1次射出充填して、1次成形体41を成形する。   After all the molds have been aligned, the mold clamping mechanism 14 uses the primary side mold 19a of the turntable 4 and the fixed platen side mold 21a of the fixed platen 3 and the movable platen side mold 8a of the movable platen 5 and the turntable. 4 and the secondary side mold 20a are clamped. In this state, the filling hole 27a of the stationary platen side mold 21a and the stationary platen side die are formed in the first cavity formed by the primary side die 19a of the rotating platen 4 and the stationary platen side die 21a of the stationary platen 3. Primary injection filling of the primary material according to the injection filling pattern set in advance from the primary injection unit 17 through the independent resin flow path 23a having the resin cutoff opening switching valve formed in the mold 21a, The primary molded body 41 is molded.

1次成形体41の冷却固化時間経過後、図3(b)に示すように、1次成形体41が固定盤3の固定盤側金型21aに付着した状態で可動盤5と回転盤4を固定盤3から離間する方向に型開きさせる。具体的には、まず、一体化している可動盤5と回転盤4とを型締機構14により、回転盤4が前記所定位置に到達するまで型開きさせる。次に、回転盤4が前記所定位置に到達した時点で、回転盤移動機構12で回転盤4を停止させ、同時に回転盤連結機構15を解除する。そして、可動盤5はそのまま型開き限位置まで型締機構14で型開きされる。   After the cooling and solidifying time of the primary molded body 41 has elapsed, the movable platen 5 and the rotary platen 4 with the primary molded body 41 attached to the stationary platen mold 21a of the stationary platen 3 as shown in FIG. Is opened in a direction away from the fixed platen 3. Specifically, first, the movable platen 5 and the rotating plate 4 that are integrated are opened by the mold clamping mechanism 14 until the rotating plate 4 reaches the predetermined position. Next, when the turntable 4 reaches the predetermined position, the turntable moving mechanism 12 stops the turntable 4 and simultaneously releases the turntable connecting mechanism 15. The movable platen 5 is opened as it is by the mold clamping mechanism 14 to the mold opening limit position.

ここで、回転盤4の前記型開き動作は、型締機構14による可動盤5の型開きによらず、回転盤移動機構12に、サーボモータ等の独立した駆動装置を設けて、その駆動装置により適宜、必要な動作を制御して行っても良い。   Here, the mold opening operation of the turntable 4 is performed by providing an independent drive device such as a servo motor in the turntable moving mechanism 12 regardless of the mold opening of the movable platen 5 by the mold clamping mechanism 14. Accordingly, necessary operations may be controlled as appropriate.

この状態において、図3(c)に示すように、回転盤4を前記所定位置において回転盤回転機構11により回転させ、回転盤4の2次側金型20aを固定盤3の固定盤側金型21aに相対する位置に切替える。その後、図3(d)に示すように、再び、可動盤5と回転盤4とを型閉めさせて、回転盤4の2次側金型20aを、1次成形体41が付着した状態の固定盤3の固定盤側金型21aに型合わせさせる。すべての型合わせが完了した後、型締機構14によって回転盤4の2次側金型20aと固定盤3の固定盤側金型21a、および可動盤5の可動盤側金型8aと回転盤4の1次側金型19aとを型締めさせる。   In this state, as shown in FIG. 3C, the rotating disk 4 is rotated by the rotating disk rotating mechanism 11 at the predetermined position, and the secondary mold 20 a of the rotating disk 4 is fixed to the fixed disk side metal of the fixed disk 3. The position is switched to a position opposite to the mold 21a. Thereafter, as shown in FIG. 3D, the movable platen 5 and the rotating plate 4 are again closed, and the secondary mold 20a of the rotating plate 4 is in a state where the primary molded body 41 is attached. The mold is matched with the fixed platen side mold 21a of the fixed platen 3. After all the mold alignment is completed, the mold clamping mechanism 14 causes the secondary side mold 20a of the rotating plate 4 and the fixed plate side mold 21a of the fixed plate 3 and the movable plate side mold 8a of the movable plate 5 and the rotating plate. 4 and the primary side mold 19a are clamped.

次に、2次射出ユニット18を移動機構22によって固定盤3の固定盤側金型21aに形成された充填孔27bと整合する位置まで型開閉方向へ移動させると共に、2次射出ユニット18を固定盤側金型21aの充填孔27bと接触するように型開閉方向と直交する方向へ前進させる。この状態において、回転盤4の2次側金型20aと固定盤3の固定盤側金型21aに付着した1次成形体41の表面とで形成される第2キャビティに、固定盤側金型21aの充填孔27b及び固定盤側金型21aに形成された樹脂遮断開放切替弁を有する独立した樹脂流路23bを介して、2次射出ユニット18から予め設定された射出充填パターンに応じて2次材料を2次射出充填する。これにより、1次成形体41の表面の一部あるいは全面に2次成形体42が成形される。ここで、予め2次射出ユニット18が固定盤3の固定盤側金型21aに形成された充填孔27bと整合する位置に位置する場合には、2次射出ユニット18を型開閉方向へ移動させる動作を省略させることができる(図3(d)参照)。   Next, the secondary injection unit 18 is moved in the mold opening / closing direction by the moving mechanism 22 to a position aligned with the filling hole 27b formed in the stationary platen side mold 21a of the stationary platen 3, and the secondary injection unit 18 is fixed. It is advanced in the direction orthogonal to the mold opening / closing direction so as to come into contact with the filling hole 27b of the panel side mold 21a. In this state, the stationary platen side mold is formed in the second cavity formed by the secondary side die 20a of the rotating platen 4 and the surface of the primary molded body 41 attached to the stationary platen side die 21a of the stationary platen 3. 2 in accordance with an injection filling pattern preset from the secondary injection unit 18 through an independent resin flow path 23b having a resin cut-off opening switching valve formed in the filling hole 27b of 21a and the stationary platen mold 21a. Secondary injection fill with next material. Thereby, the secondary molded body 42 is molded on a part or the entire surface of the primary molded body 41. Here, when the secondary injection unit 18 is previously positioned at a position aligned with the filling hole 27b formed in the stationary platen mold 21a of the stationary platen 3, the secondary injection unit 18 is moved in the mold opening / closing direction. The operation can be omitted (see FIG. 3D).

所定の冷却固化時間経過後、図3(e)に示すように、2次射出ユニット18を固定盤側金型21aの充填孔27bから後退させて、可動盤5と回転盤4を型開きさせる。可動盤5と回転盤4の型開き動作は図3(b)で説明した通りである。型開き後、図3(f)に示すように、固定盤3の固定盤側金型21aに付着した、1次成形体41と2次成形体42とから成る積層成形品を、図示しない製品取出装置により取り出す。また、積層成形品の取り出し後、回転盤4を回転盤回転機構11により回転させ、回転盤4の1次側金型19aを固定盤3の固定盤側金型21aに相対する位置に切替え、再び図1(a)の状態にさせる。このようにして、以後、図1(a)及び図3(a)の状態から図3(f)の状態に至る成形サイクルを繰り返すことにより、積層成形品を連続的に成形することができる。なお、予め2次射出ユニット18が固定盤3の固定盤側金型21aに形成された充填孔27bと整合する位置に位置する場合には、2次射出ユニット18を固定盤側金型21aの充填孔27bから後退させる動作を省略させることができる。   After a predetermined cooling and solidifying time has elapsed, as shown in FIG. 3 (e), the secondary injection unit 18 is retracted from the filling hole 27b of the fixed platen mold 21a, and the movable platen 5 and the rotary platen 4 are opened. . The mold opening operation of the movable platen 5 and the rotary platen 4 is as described with reference to FIG. After the mold opening, as shown in FIG. 3 (f), a laminated molded product composed of the primary molded body 41 and the secondary molded body 42 attached to the stationary platen mold 21a of the stationary platen 3 is a product (not shown). Take out with take-out device. Further, after taking out the laminated molded product, the rotating disk 4 is rotated by the rotating disk rotating mechanism 11, and the primary mold 19a of the rotating disk 4 is switched to a position opposite to the fixed disk side mold 21a of the fixed disk 3, Again, the state shown in FIG. Thus, after that, by repeating the molding cycle from the state of FIGS. 1 (a) and 3 (a) to the state of FIG. 3 (f), a laminated molded product can be continuously molded. In addition, when the secondary injection unit 18 is previously positioned at a position aligned with the filling hole 27b formed in the fixed platen side mold 21a of the fixed platen 3, the secondary injection unit 18 is attached to the fixed platen side mold 21a. The operation of retracting from the filling hole 27b can be omitted.

[第2の成形例]
次に、第1実施形態に係る積層成形装置1の第2の成形例について説明する。第2の成形例は、図2Bに示すように、2次射出ユニット18が回転盤4の2次側金型20bに接続し、第2キャビティに2次側金型20bを介して2次材料を射出充填することを特徴とするものである。図4は、第2の成形例を説明するための図である。なお、1次成形体の成形工程は、第1の成形例と同様であるため、2次成形体の成形工程についてのみ説明する。
[Second molding example]
Next, a second molding example of the lamination molding apparatus 1 according to the first embodiment will be described. In the second molding example, as shown in FIG. 2B, the secondary injection unit 18 is connected to the secondary mold 20b of the turntable 4, and the secondary material is connected to the second cavity via the secondary mold 20b. Is injected and filled. FIG. 4 is a diagram for explaining a second molding example. Since the molding process of the primary molded body is the same as the first molding example, only the molding process of the secondary molded body will be described.

1次成形体43の冷却固化時間経過後、図4(b)に示すように、1次成形体43が固定盤3の固定盤側金型21bに付着した状態で可動盤5と回転盤4を固定盤3から離間する方向に型開きさせる。さらに、回転盤4を所定位置に保持させ可動盤5を型開き限位置まで型開きさせた後、図4(c)に示すように、回転盤4を所定位置において回転盤回転機構11により回転させて、回転盤4の2次側金型20bを固定盤3の固定盤側金型21bに相対する位置に切替える。   After the cooling and solidifying time of the primary molded body 43 has elapsed, the movable platen 5 and the rotary platen 4 with the primary molded body 43 attached to the stationary platen mold 21b of the stationary platen 3 as shown in FIG. Is opened in a direction away from the fixed platen 3. Further, after the rotating plate 4 is held at a predetermined position and the movable platen 5 is opened to the mold opening limit position, the rotating plate 4 is rotated by the rotating plate rotating mechanism 11 at the predetermined position as shown in FIG. Thus, the secondary side mold 20b of the turntable 4 is switched to a position facing the fixed platen side mold 21b of the fixed platen 3.

次に、図4(d)に示すように、再び、可動盤5と回転盤4とを型閉めさせると共に、回転盤4の2次側金型20bを、1次成形体43を残した状態の固定盤3の固定盤側金型21bに型合わせさせ、型締機構14によって、回転盤4の2次側金型20bと固定盤3の固定盤側金型21b、および可動盤5の可動盤側金型8bと回転盤4の1次側金型19bとを型締めさせる。その後、2次射出ユニット18を移動機構22によって回転盤4の2次側金型20bに形成された充填孔28と整合する位置まで型開閉方向へ移動させると共に、2次射出ユニット18を回転盤4の2次側金型20bの充填孔28と接触するように型開閉方向と直交する方向へ前進させる。この状態において、回転盤4の2次側金型20bと固定盤3の固定盤側金型21bに付着した1次成形体43の表面とで形成される第2キャビティに、2次側金型20bの充填孔28及び樹脂流路24を介して、2次射出ユニット18から予め設定された射出充填パターンに応じて2次材料を2次射出充填する。これにより、1次成形体43の表面の一部あるいは全面に2次成形体44が成形される。   Next, as shown in FIG. 4 (d), the movable platen 5 and the turntable 4 are again closed, and the secondary mold 20 b of the turntable 4 is left in the primary molded body 43. The fixed platen side mold 21b of the fixed platen 3 is matched with the mold, and the mold clamping mechanism 14 moves the secondary side mold 20b of the rotating platen 4, the fixed platen side mold 21b of the fixed platen 3, and the movable platen 5. The board side mold 8b and the primary side mold 19b of the rotating board 4 are clamped. Thereafter, the secondary injection unit 18 is moved in the mold opening / closing direction by the moving mechanism 22 to a position where the secondary injection unit 18 is aligned with the filling hole 28 formed in the secondary side mold 20b of the turntable 4, and the secondary injection unit 18 is moved to the turntable. 4 is advanced in a direction orthogonal to the mold opening / closing direction so as to be in contact with the filling hole 28 of the secondary side mold 20b. In this state, the secondary mold is formed in the second cavity formed by the secondary mold 20b of the rotating disk 4 and the surface of the primary molded body 43 attached to the fixed mold 21b of the fixed disk 3. The secondary material is secondarily injected and filled from the secondary injection unit 18 according to a preset injection filling pattern through the filling hole 28 and the resin flow path 24 of 20b. Thereby, the secondary molded body 44 is molded on a part or the entire surface of the primary molded body 43.

所定の冷却固化時間経過後、図4(e)に示すように、2次射出ユニット18を回転盤4の2次側金型20bの充填孔28から後退させて、可動盤5と回転盤4を固定盤3から離間する方向に型開きさせると共に、可動盤5と回転盤4を型開きさせ、固定盤3の固定盤側金型21bに付着した1次成形体43と2次成形体44とから成る積層成形品を、図示しない製品取出装置により取り出す(図4(f)参照)。また、積層成形品の取り出し後、回転盤4を回転盤回転機構11により回転させ、回転盤4の1次側金型19bを固定盤3の固定盤側金型21bに相対する位置に切替え、再び図1(a)の状態にさせる。このようにして、以後、図1(a)及び図4(a)の状態から図4(f)の状態に至る成形サイクルを繰り返すことにより、積層成形品を連続的に成形することができる。   After the elapse of a predetermined cooling and solidifying time, as shown in FIG. 4 (e), the secondary injection unit 18 is moved backward from the filling hole 28 of the secondary side mold 20 b of the rotating disk 4 to move the movable disk 5 and the rotating disk 4. Are opened in a direction away from the fixed platen 3, and the movable platen 5 and the rotary platen 4 are opened, and the primary molded body 43 and the secondary molded body 44 attached to the fixed platen side mold 21 b of the fixed platen 3. Is taken out by a product take-out device (not shown) (see FIG. 4F). Further, after taking out the laminated molded product, the rotating disk 4 is rotated by the rotating disk rotating mechanism 11, and the primary side mold 19b of the rotating disk 4 is switched to a position facing the fixed plate side mold 21b of the fixed plate 3, Again, the state shown in FIG. Thus, after that, by repeating the molding cycle from the state of FIGS. 1 (a) and 4 (a) to the state of FIG. 4 (f), a laminated molded product can be continuously molded.

第1実施形態に係る積層成形装置1の第2の成形例において、回転盤4の2次側金型20bと固定盤3の固定盤側金型21bに付着した1次成形体43の表面とで形成される第2キャビティに、2次側金型20bの充填孔28及び樹脂流路24を介して、2次射出ユニット18から予め設定された射出充填パターンに応じて2次材料を2次射出充填するものであるとしたが、これに限定されるものではなく、2次射出ユニット18からの2次射出充填は、例えば回転盤4に充填孔と2次側金型20bに樹脂を導入する樹脂流路を設け、回転盤4の充填孔から樹脂流路及び2次側金型20bを介して行なわれるとしても良い。   In the second molding example of the layered molding apparatus 1 according to the first embodiment, the surface of the primary molded body 43 attached to the secondary side mold 20b of the rotating plate 4 and the stationary platen side mold 21b of the stationary platen 3; Secondary material is added to the second cavity formed in accordance with the injection filling pattern set in advance from the secondary injection unit 18 through the filling hole 28 and the resin flow path 24 of the secondary side mold 20b. However, the present invention is not limited to this, and the secondary injection filling from the secondary injection unit 18 is, for example, introducing a filling hole into the turntable 4 and a resin into the secondary mold 20b. It is also possible to provide a resin flow path to be performed, and to perform from the filling hole of the turntable 4 via the resin flow path and the secondary side mold 20b.

また、第1実施形態に係る積層成形装置1の第2の成形例の成形工程によれば、1次材料にガラス代替材としての透明ポリカ樹脂等の樹脂を用いると共に、2次材料に支持部材としての有色ポリカアロイ樹脂等の樹脂を用いることにより、ガラス樹脂化成形品を成形することも可能である。具体的には、上述した第2の成形例の成形工程における1次射出充填の際に、第1キャビティ内に圧縮ストローク分だけ空間が生じるように微少型開きさせ、1次材料である透明ポリカ樹脂等を第1キャビティ内に射出充填して、1次側金型19bと固定盤側金型21bとを閉じ、所定の型締力で圧縮すると共に、2次射出充填の際に、2次材料として有色ポリカアロイ樹脂等を射出充填することによって、ガラス樹脂化成形品を連続的に成形することができる。この場合において、成形されたガラス樹脂化成形品は、回転盤4の2次側金型20b側に付着した状態において、可動盤5と回転盤4の型開き後、図示しない製品取出装置により取り出される。なお、このガラス樹脂化成形品を成形するに際し、型締機構14は、精度の高い微少型開きが可能なトグル式型締機構であることが好ましい。   Further, according to the molding process of the second molding example of the multilayer molding apparatus 1 according to the first embodiment, a resin such as a transparent polycarbonate resin as a glass substitute is used as the primary material, and the support member is used as the secondary material. By using a resin such as a colored polyalloy resin, it is possible to mold a glass resin molded product. Specifically, during the primary injection filling in the molding step of the second molding example described above, the mold is slightly opened so that a space corresponding to the compression stroke is generated in the first cavity, and the transparent polycarbonate that is the primary material is used. Resin or the like is injected and filled into the first cavity, and the primary mold 19b and the stationary platen mold 21b are closed and compressed with a predetermined clamping force. By injection-filling a colored polyalloy resin or the like as a material, a glass resin molded product can be continuously formed. In this case, the molded glass-resin-molded product is taken out by a product take-out device (not shown) after the movable plate 5 and the turntable 4 are opened in a state of adhering to the secondary mold 20b side of the turntable 4. It is. In molding the glass resin molded product, the mold clamping mechanism 14 is preferably a toggle type mold clamping mechanism capable of opening a minute mold with high accuracy.

[第3の成形例]
次に、第1実施形態に係る積層成形装置1の第3の成形例について説明する。第3の成形例は、図2Cに示すように、2次射出ユニット18が回転盤4の1次側金型19cに接続し、第3キャビティに1次側金型19cを介して2次材料を射出充填することを特徴とするものである。図5は、第3の成形例を説明するための図である。ここで、第1実施形態に係る積層成形装置1の第3の成形例においては、回転盤4の1次側金型19c及び2次側金型20cは、同一形状のものを用いる。なお、1次成形体の成形工程は、第1の成形例と同様であるため、2次成形体の成形工程についてのみ説明する。
[Third molding example]
Next, a third molding example of the lamination molding apparatus 1 according to the first embodiment will be described. In the third molding example, as shown in FIG. 2C, the secondary injection unit 18 is connected to the primary mold 19c of the turntable 4, and the secondary material is connected to the third cavity via the primary mold 19c. Is injected and filled. FIG. 5 is a diagram for explaining a third molding example. Here, in the 3rd shaping | molding example of the lamination molding apparatus 1 which concerns on 1st Embodiment, the thing with the same shape is used for the primary side metal mold | die 19c and the secondary side metal mold | die 20c of the turntable 4. FIG. Since the molding process of the primary molded body is the same as the first molding example, only the molding process of the secondary molded body will be described.

1次成形体45の冷却固化時間経過後、図5(b)に示すように、1次成形体45が回転盤4の1次側金型19cに付着した状態で可動盤5と回転盤4を固定盤3から離間する方向に型開きさせ、次いで回転盤4を所定位置に保持させ可動盤5を型開き限位置まで型開きさせる。その後、図5(c)に示すように、回転盤4を所定位置において回転盤回転機構11により回転させて、1次成形体45が付着した回転盤4の1次側金型19cを可動盤5の可動盤側金型8cに相対する位置に切替えると共に、2次側金型20cを固定盤3の固定盤側金型21cに相対する位置に切替える。   After the cooling and solidifying time of the primary molded body 45 has elapsed, the movable platen 5 and the rotating disk 4 are in a state where the primary molded body 45 is attached to the primary side mold 19c of the rotating disk 4 as shown in FIG. Is opened in a direction away from the fixed platen 3, then the rotating platen 4 is held at a predetermined position, and the movable platen 5 is opened to the die opening limit position. Thereafter, as shown in FIG. 5C, the rotating disk 4 is rotated by the rotating disk rotating mechanism 11 at a predetermined position, and the primary side mold 19c of the rotating disk 4 to which the primary molded body 45 is adhered is moved to the movable disk. The secondary mold 20c is switched to a position facing the fixed platen mold 21c of the fixed platen 3 while switching to the position corresponding to the movable platen mold 8c.

次に、図5(d)に示すように、可動盤5の可動盤側金型8cと1次成形体45が付着した状態の回転盤4の1次側金型19cとを型合わせさせると共に、回転盤4の2次側金型20cを固定盤3の固定盤側金型21cに型合わせさせ、型締機構14によって、回転盤4の2次側金型20cと固定盤3の固定盤側金型21c、および可動盤5の可動盤側金型8cと回転盤4の1次側金型19cとを型締めさせる。その後、2次射出ユニット18を移動機構22によって回転盤4の1次側金型19cに形成された充填孔29と整合する位置まで型開閉方向へ移動させると共に、2次射出ユニット18を回転盤4の1次側金型19cの充填孔29と接触するように型開閉方向と直交する方向へ前進させる。この状態において、可動盤5の可動盤側金型8cと回転盤4の1次側金型19cに付着した1次成形体45の表面とで形成される第3キャビティに、1次側金型19cの充填孔29及び樹脂流路25を介して、2次射出ユニット18から予め設定された射出充填パターンに応じて2次材料を2次射出充填し、1次成形体45の表面の一部あるいは全面に2次成形体46を成形する。   Next, as shown in FIG. 5 (d), the movable platen side mold 8c of the movable platen 5 and the primary side mold 19c of the rotating plate 4 with the primary molded body 45 attached thereto are matched with each other. The secondary side mold 20c of the rotating plate 4 is matched with the fixed plate side mold 21c of the fixed platen 3, and the secondary side mold 20c of the rotating plate 4 and the fixed platen of the fixed plate 3 are fixed by the mold clamping mechanism 14. The side mold 21c, the movable platen mold 8c of the movable platen 5, and the primary mold 19c of the rotating plate 4 are clamped. Thereafter, the secondary injection unit 18 is moved in the mold opening / closing direction by the moving mechanism 22 to a position where the secondary injection unit 18 is aligned with the filling hole 29 formed in the primary side mold 19c of the turntable 4, and the secondary injection unit 18 is moved to the turntable. 4 is advanced in a direction orthogonal to the mold opening / closing direction so as to come into contact with the filling hole 29 of the primary side mold 19c. In this state, the primary mold is formed in the third cavity formed by the movable platen mold 8c of the movable platen 5 and the surface of the primary molded body 45 attached to the primary mold 19c of the rotating plate 4. A secondary material is secondarily injected and filled from the secondary injection unit 18 according to an injection filling pattern set in advance from the secondary injection unit 18 through the filling hole 29 and the resin flow path 25 of 19c, and a part of the surface of the primary molded body 45 Alternatively, the secondary molded body 46 is formed on the entire surface.

また、この2次射出充填と同時に、回転盤4の2次側金型20cと固定盤3の固定盤側金型21cとで形成される第2キャビティに、固定盤側金型21cの充填孔27a及び固定盤側金型21cに形成された樹脂流路23aを介して、1次射出ユニット17から予め設定された射出充填パターンに応じて1次材料を1次射出充填して、1次成形体45を成形する(図5(d)参照)。   Simultaneously with the secondary injection filling, the filling hole of the stationary platen side mold 21c is formed in the second cavity formed by the secondary side die 20c of the rotating platen 4 and the stationary platen side die 21c of the stationary platen 3. The primary material is subjected to primary injection filling according to an injection filling pattern set in advance from the primary injection unit 17 through the resin flow path 23a formed on the fixed platen die 21c and 27a. The body 45 is formed (see FIG. 5D).

所定の冷却固化時間経過後、図5(e)及び図5(f)に示すように、2次射出ユニット18を回転盤4の1次側金型19cの充填孔29から後退させて、可動盤5と回転盤4を固定盤3から離間する方向に型開きさせると共に、可動盤5と回転盤4を型開きさせ、回転盤4の1次側金型19cに付着した1次成形体45と2次成形体46とから成る積層成形品を、図示しない製品取出装置により取り出す。その後、回転盤4を回転盤回転機構11により回転させ、回転盤4の1次側金型19cを固定盤3の固定盤側金型21cに相対する位置に切替えると共に、2次側金型20cを可動盤5の可動盤側金型8cに相対する位置に切替える。これにより、1次側金型19cと2次側金型20cとが反転している図5(c)の状態となる(図5(g)参照)。この場合において、1次側金型19cと2次側金型20cとは同一形状の金型であるため、以後、図5(c)の状態から図5(f)の状態に至る成形サイクルを繰り返すことにより、短いサイクルで積層成形品を連続的に成形することができる。   After a predetermined cooling and solidification time has elapsed, the secondary injection unit 18 is moved backward from the filling hole 29 of the primary side mold 19c of the rotating disk 4 as shown in FIGS. 5 (e) and 5 (f). The panel 5 and the rotating disk 4 are opened in a direction away from the fixed disk 3, and the movable board 5 and the rotating disk 4 are opened, and the primary molded body 45 attached to the primary mold 19 c of the rotating disk 4. And a secondary molded body 46 are taken out by a product take-out device (not shown). Thereafter, the turntable 4 is rotated by the turntable rotation mechanism 11 to switch the primary side mold 19c of the turntable 4 to a position facing the fixed platen side mold 21c of the fixed platen 3 and the secondary side mold 20c. Is switched to a position facing the movable platen side mold 8c of the movable platen 5. As a result, the primary mold 19c and the secondary mold 20c are reversed (see FIG. 5C) (see FIG. 5G). In this case, since the primary side mold 19c and the secondary side mold 20c are molds having the same shape, the molding cycle from the state shown in FIG. 5C to the state shown in FIG. By repeating, the laminated molded product can be continuously formed in a short cycle.

第1実施形態に係る積層成形装置1の第3の成形例において、可動盤5の可動盤側金型8cと回転盤4の1次側金型19cに付着した1次成形体45の表面とで形成される第3キャビティに、1次側金型19cの充填孔29及び樹脂流路25を介して、2次射出ユニット18から予め設定された射出充填パターンに応じて2次材料を2次射出充填するものであるとしたが、これに限定されるものではなく、2次射出ユニット18からの2次射出充填は、例えば回転盤4に充填孔と1次側金型19cに樹脂を導入する樹脂流路を設け、回転盤4の充填孔から樹脂流路及び1次側金型19cを介して行なわれるとしても良い。   In the third molding example of the laminate molding apparatus 1 according to the first embodiment, the surface of the primary molded body 45 attached to the movable platen mold 8c of the movable platen 5 and the primary mold 19c of the rotating plate 4; Secondary material is added to the third cavity formed in accordance with the injection filling pattern preset from the secondary injection unit 18 via the filling hole 29 and the resin flow path 25 of the primary side mold 19c. However, the present invention is not limited to this, and the secondary injection filling from the secondary injection unit 18 is, for example, introducing a filling hole into the turntable 4 and a resin into the primary side mold 19c. It is also possible to provide a resin flow path to be performed and to perform the resin flow from the filling hole of the turntable 4 via the resin flow path and the primary side mold 19c.

[第4の成形例]
次に、第1実施形態に係る積層成形装置1の第4の成形例について説明する。第4の成形例は、図2Dに示すように、2次射出ユニット18が可動盤5の可動盤側金型8dに接続し、第3キャビティに可動盤側金型8dを介して2次材料を射出充填することを特徴とするものである。また、第1実施形態に係る積層成形装置1の第4の成形例においては、第3の成形例と同様に、回転盤4の1次側金型19d及び2次側金型20dは、同一形状のものを用いる。図6は、第4の成形例を説明するための図である。なお、1次成形体の成形工程は、第1の成形例と同様であるため、2次成形体の成形工程についてのみ説明する。
[Fourth Molding Example]
Next, the 4th shaping | molding example of the lamination molding apparatus 1 which concerns on 1st Embodiment is demonstrated. In the fourth molding example, as shown in FIG. 2D, the secondary injection unit 18 is connected to the movable platen side mold 8d of the movable platen 5, and the secondary material is connected to the third cavity via the movable platen side die 8d. Is injected and filled. Moreover, in the 4th shaping | molding example of the lamination molding apparatus 1 which concerns on 1st Embodiment, the primary side metal mold | die 19d and the secondary side metal mold | die 20d of the turntable 4 are the same similarly to the 3rd shaping | molding example. Use a shape. FIG. 6 is a diagram for explaining a fourth molding example. Since the molding process of the primary molded body is the same as the first molding example, only the molding process of the secondary molded body will be described.

1次成形体47の冷却固化時間経過後、図6(b)に示すように、1次成形体47が回転盤4の1次側金型19dに付着した状態で可動盤5と回転盤4と固定盤3とを型開きさせる。その後、図6(c)に示すように、回転盤4を所定位置において回転させて、1次成形体47が付着した回転盤4の1次側金型19dを可動盤5の可動盤側金型8dに相対する位置に切替えると共に、2次側金型20dを固定盤3の固定盤側金型21dに相対する位置に切替える。次いで、図6(d)に示すように、型締機構14によって、回転盤4の2次側金型20dと固定盤3の固定盤側金型21d、および可動盤5の可動盤側金型8dと回転盤4の1次側金型19dとを型締めさせる。   After the cooling and solidifying time of the primary molded body 47 has elapsed, the movable platen 5 and the rotary disc 4 are in a state where the primary molded product 47 is attached to the primary side mold 19d of the rotary disc 4 as shown in FIG. And the fixed platen 3 are opened. Thereafter, as shown in FIG. 6C, the rotating disk 4 is rotated at a predetermined position, and the primary mold 19 d of the rotating disk 4 to which the primary molded body 47 is adhered becomes the movable disk side metal of the movable disk 5. While switching to a position facing the mold 8d, the secondary mold 20d is switched to a position facing the stationary platen mold 21d of the stationary platen 3. Next, as shown in FIG. 6 (d), the mold clamping mechanism 14 causes the secondary side mold 20 d of the rotating plate 4, the fixed platen side die 21 d of the fixed platen 3, and the movable platen side die of the movable platen 5. 8d and the primary side mold 19d of the turntable 4 are clamped.

次に、2次射出ユニット18を移動機構22によって可動盤5の可動盤側金型8dに形成された充填孔30と整合する位置まで型開閉方向へ移動させると共に、2次射出ユニット18を可動盤5の可動盤側金型8dの充填孔30と接触するように型開閉方向と直交する方向へ前進させる。この状態において、可動盤5の可動盤側金型8dと回転盤4の1次側金型19dに付着した1次成形体47の表面とで形成される第3キャビティに、可動盤側金型8dの充填孔30及び樹脂流路26を介して、2次射出ユニット18から予め設定された射出充填パターンに応じて2次材料を2次射出充填し、1次成形体47の表面の一部あるいは全面に2次成形体48を成形する。   Next, the secondary injection unit 18 is moved in the mold opening / closing direction by the moving mechanism 22 to a position where the secondary injection unit 18 is aligned with the filling hole 30 formed in the movable plate side mold 8d of the movable plate 5, and the secondary injection unit 18 is movable. The board 5 is advanced in a direction orthogonal to the mold opening / closing direction so as to come into contact with the filling hole 30 of the movable board side mold 8d. In this state, the movable platen side mold is formed in the third cavity formed by the movable platen side die 8d of the movable platen 5 and the surface of the primary molded body 47 attached to the primary side die 19d of the rotating platen 4. A secondary material is secondarily injected and filled from the secondary injection unit 18 according to an injection filling pattern set in advance from the secondary injection unit 18 through the 8d filling hole 30 and the resin flow path 26, and a part of the surface of the primary molded body 47 Alternatively, the secondary molded body 48 is formed on the entire surface.

ここで、第3の成形例の場合と同様に、2次射出充填と同時に、回転盤4の2次側金型20dと固定盤3の固定盤側金型21dとで形成される第2キャビティに、固定盤側金型21dの充填孔27a及び固定盤側金型21dに形成された樹脂流路23aを介して、1次射出ユニット17から予め設定された射出充填パターンに応じて1次材料を1次射出充填して、1次成形体47を成形する(図6(d)参照)。   Here, as in the case of the third molding example, the second cavity formed by the secondary mold 20d of the rotating disk 4 and the fixed disk side mold 21d of the fixed disk 3 simultaneously with the secondary injection filling. The primary material according to the injection filling pattern set in advance from the primary injection unit 17 through the filling hole 27a of the stationary platen side mold 21d and the resin flow path 23a formed in the stationary platen side die 21d. The primary molded body 47 is molded by primary injection filling (see FIG. 6D).

所定の冷却固化時間経過後、図6(e)及び図6(f)に示すように、2次射出ユニット18を可動盤5の可動盤側金型8dの充填孔30から後退させて、可動盤5と回転盤4を型開きさせ、回転盤4の1次側金型19dに付着した1次成形体47と2次成形体48とから成る積層成形品を、図示しない製品取出装置により取り出す。その後、回転盤4を回転盤回転機構11により回転させ、回転盤4の1次側金型19dを固定盤3の固定盤側金型21dに相対する位置に切替えると共に、2次側金型20dを可動盤5の可動盤側金型8dに相対する位置に切替えることにより、1次側金型19dと2次側金型20dとが反転している図6(c)の状態にさせる(図6(g)参照)。この状態において、以後、図6(c)の状態から図6(f)の状態に至る成形サイクルを繰り返すことにより、短いサイクルで積層成形品を連続的に成形することができる。   After the elapse of a predetermined cooling and solidifying time, the secondary injection unit 18 is moved backward from the filling hole 30 of the movable platen side mold 8d of the movable platen 5 as shown in FIGS. 6 (e) and 6 (f). The board 5 and the turntable 4 are opened, and a laminated molded product composed of the primary molded body 47 and the secondary molded body 48 attached to the primary side mold 19d of the turntable 4 is taken out by a product take-out device (not shown). . Thereafter, the turntable 4 is rotated by the turntable rotation mechanism 11 to switch the primary side mold 19d of the turntable 4 to a position facing the fixed platen side mold 21d of the fixed platen 3 and the secondary side mold 20d. Is switched to a position opposite to the movable platen side mold 8d of the movable platen 5 so that the primary mold 19d and the secondary mold 20d are reversed as shown in FIG. 6 (g)). In this state, thereafter, by repeating the molding cycle from the state of FIG. 6C to the state of FIG. 6F, a laminated molded product can be continuously molded in a short cycle.

また、第1実施形態に係る積層成形装置1の第4の成形例に準じた成形工程(1次射出ユニット17による射出充填と、2次射出ユニット18による射出充填との工程を入れ替える成形工程)によれば、上述した第2の成形例の場合と同様に、ガラス樹脂化成形品を成形することが可能である。   Further, a molding step according to the fourth molding example of the multilayer molding apparatus 1 according to the first embodiment (a molding step in which the steps of injection filling by the primary injection unit 17 and injection filling by the secondary injection unit 18 are interchanged). According to the above, it is possible to mold a glass resin molded product as in the case of the second molding example described above.

具体的には、まず、2次射出ユニット18を移動機構22によって可動盤4の可動盤側金型8dに形成された充填孔30と整合する位置まで移動させる。次いで、型締機構14により、可動盤5の可動盤側金型8dと回転盤4の2次側金型20dとで形成される第4キャビティ内に圧縮ストローク分だけ空間が生じるように微少型開きさせると共に、第4キャビティに可動盤側金型8dの充填孔30及び樹脂流路26を介して、2次射出ユニット18から1次材料である透明ポリカ樹脂等を1次射出充填させる。その後、型締機構14により、2次側金型20dと可動盤側金型8dとを閉じて所定の型締力で圧縮させる。   Specifically, first, the secondary injection unit 18 is moved to a position aligned with the filling hole 30 formed in the movable platen side mold 8d of the movable platen 4 by the moving mechanism 22. Next, the mold clamping mechanism 14 makes a minute mold so that a space corresponding to the compression stroke is generated in the fourth cavity formed by the movable platen mold 8d of the movable platen 5 and the secondary mold 20d of the rotating platen 4. At the same time, the fourth cavity is filled with a primary injection material such as a transparent polycarbonate resin as a primary material from the secondary injection unit 18 through the filling hole 30 and the resin flow path 26 of the movable platen side mold 8d. Thereafter, the secondary mold 20d and the movable platen mold 8d are closed by the mold clamping mechanism 14 and compressed with a predetermined mold clamping force.

次に、透明ポリカ樹脂等からなる1次成形体が回転盤4の2次側金型20dに付着した状態で可動盤5と回転盤4を固定盤3から離間する方向に型開きさせ、回転盤4を回転させて2次側金型20dを固定盤3の固定盤側金型21dに相対する位置に切替える。次いで、固定盤3の固定盤側金型21dと透明ポリカ樹脂等からなる1次成形体が付着した状態の回転盤4の2次側金型20dとを型合わせさせると共に、回転盤4の1次側金型19dを可動盤5の可動盤側金型8dに型合わせさせ、型締機構14によって、回転盤4の2次側金型20dと固定盤3の固定盤側金型21d、および可動盤5の可動盤側金型8dと回転盤4の1次側金型19dとを型締めさせる。   Next, with the primary molded body made of transparent polycarbonate resin or the like attached to the secondary side mold 20d of the turntable 4, the movable platen 5 and the turntable 4 are opened in a direction away from the fixed platen 3 and rotated. The board 4 is rotated to switch the secondary mold 20d to a position facing the fixed board side mold 21d of the fixed board 3. Next, the stationary platen mold 21d of the stationary platen 3 and the secondary mold 20d of the rotating plate 4 in a state where the primary molded body made of transparent polycarbonate resin or the like is attached are matched with each other and The secondary mold 19d is matched with the movable panel side mold 8d of the movable panel 5, and the mold clamping mechanism 14 causes the secondary mold 20d of the rotating disk 4 and the stationary panel side mold 21d of the stationary disk 3 to The movable platen mold 8d of the movable platen 5 and the primary mold 19d of the rotating plate 4 are clamped.

その後、固定盤3の固定盤側金型21dと回転盤4の2次側金型20dに付着した透明ポリカ樹脂等からなる1次成形体の表面とで形成される第2キャビティに、固定盤側金型21dの充填孔27a及び固定盤側金型21dに形成された樹脂流路23aを介して、1次射出ユニット17から2次材料である有色ポリカアロイ樹脂等を2次射出充填することによって、ガラス樹脂化成形品を連続的に成形することができる。この場合において、成形されたガラス樹脂化成形品は、固定盤3側に付着した状態において、可動盤5と回転盤4の型開き後、図示しない製品取出装置により取り出される。   Thereafter, the fixed platen is formed in the second cavity formed by the fixed platen die 21d of the fixed platen 3 and the surface of the primary molded body made of transparent polycarbonate resin or the like attached to the secondary die 20d of the rotating platen 4. By secondary injection filling colored polycaloy resin or the like as a secondary material from the primary injection unit 17 through the filling hole 27a of the side mold 21d and the resin flow path 23a formed in the stationary platen side mold 21d. A glass resin molded product can be continuously molded. In this case, the molded glass resin molded product is taken out by a product take-out device (not shown) after opening the movable platen 5 and the rotary platen 4 while being attached to the fixed platen 3 side.

また、1次射出ユニット17による2次射出充填と同時に、可動盤5の可動盤側金型8dと回転盤4の1次側金型19dとで形成される第3キャビティ内に2次射出ユニット18による1次材料である透明ポリカ樹脂等の1次射出充填を行なうことにより、この動作以降、型開閉動作1回で固定盤3と回転盤4間に1個のガラス樹脂化成形品を連続的に成形することができる。なお、このガラス樹脂化成形品を成形するに際し、型締機構14は、精度の高い微少型開きが可能なトグル式型締機構であることが好ましい。   Simultaneously with the secondary injection filling by the primary injection unit 17, the secondary injection unit is placed in the third cavity formed by the movable platen side mold 8 d of the movable platen 5 and the primary side die 19 d of the rotating platen 4. By performing primary injection filling of transparent polycarbonate resin, etc., which is the primary material according to No. 18, after this operation, one glass resin molded product is continuously connected between the fixed platen 3 and the rotary platen 4 with a single mold opening / closing operation. Can be molded. In molding the glass resin molded product, the mold clamping mechanism 14 is preferably a toggle type mold clamping mechanism capable of opening a minute mold with high accuracy.

[第5の成形例]
次に、第1実施形態に係る積層成形装置1の第5の成形例について説明する。第5の成形例は、図2Eに示すように、固定盤3の固定盤側金型21eと回転盤4の1次側金型19eとが組み合わされて形成される第1キャビティと、可動盤5の可動盤側金型8eと回転盤4の2次側金型20eとが組み合わされて形成される第4キャビティとのそれぞれにおいて、単層成形品を成形するものである。ここで、第1実施形態に係る積層成形装置1の第5の成形例においては、固定盤3の固定盤側金型21e及び可動盤5の可動盤側金型8e、並びに回転盤4の1次側金型19e及び2次側金型20eは、それぞれ同一形状の金型を用いる。
[Fifth molding example]
Next, a fifth molding example of the lamination molding apparatus 1 according to the first embodiment will be described. As shown in FIG. 2E, the fifth molding example includes a first cavity formed by combining a stationary platen mold 21e of the stationary platen 3 and a primary mold 19e of the rotating plate 4, and a movable platen. A single-layer molded product is molded in each of the fourth cavity formed by combining the movable platen side mold 8e of 5 and the secondary side mold 20e of the rotating platen 4. Here, in the fifth molding example of the laminate molding apparatus 1 according to the first embodiment, the stationary platen side mold 21e of the stationary platen 3, the movable platen side die 8e of the movable platen 5, and the rotating plate 4 are one. As the secondary mold 19e and the secondary mold 20e, molds having the same shape are used.

図7は、第5の成形例を説明するための図である。第5の成形例では、型締機構14により回転盤4の1次側金型19eと固定盤3の固定盤側金型21e、および可動盤5の可動盤側金型8eと回転盤4の2次側金型20eとを型締めさせた状態で、2次射出ユニット18を移動機構22によって回転盤4の2次側金型20eに形成された充填孔28と整合する位置まで型開閉方向へ移動させると共に、2次射出ユニット18を回転盤4の2次側金型20eの充填孔28と接触するように型開閉方向と直交する方向へ前進させる。   FIG. 7 is a diagram for explaining a fifth molding example. In the fifth molding example, the mold clamping mechanism 14 allows the primary side mold 19e of the rotating disk 4 and the stationary disk side mold 21e of the stationary disk 3 and the movable panel side mold 8e of the movable disk 5 and the rotating disk 4 to be rotated. In a state in which the secondary mold 20e is clamped, the secondary injection unit 18 is moved to the position where the secondary injection unit 18 is aligned with the filling hole 28 formed in the secondary mold 20e of the turntable 4 by the moving mechanism 22. And the secondary injection unit 18 is advanced in a direction perpendicular to the mold opening / closing direction so as to come into contact with the filling hole 28 of the secondary side mold 20e of the rotating disk 4.

次に、図7(a)に示すように、回転盤4の1次側金型19eと固定盤3の固定盤側金型21eとで形成される第1キャビティに、固定盤側金型21eの充填孔27a及び固定盤側金型21eに形成された樹脂流路23aを介して、1次射出ユニット17から予め設定された射出充填パターンに応じて成形材料を射出充填する。また、この1次射出ユニット17からの射出充填と同時に、回転盤4の2次側金型20eと可動盤5の可動盤側金型8eとで形成される第4キャビティに、2次側金型20eの充填孔28及び2次側金型20eに形成された樹脂流路24を介して、2次射出ユニット18から予め設定された射出充填パターンに応じて成形材料を射出充填する。これにより、第1キャビティ及び第4キャビティのそれぞれに、単層成形品50が成形される。   Next, as shown in FIG. 7A, the fixed platen side mold 21e is formed in the first cavity formed by the primary side die 19e of the rotary platen 4 and the fixed platen side die 21e of the fixed platen 3. The molding material is injection-filled according to a preset injection-filling pattern from the primary injection unit 17 through the filling hole 27a and the resin flow path 23a formed in the stationary platen mold 21e. Simultaneously with the injection filling from the primary injection unit 17, the secondary side mold is formed in the fourth cavity formed by the secondary side mold 20 e of the rotating disk 4 and the movable panel side mold 8 e of the movable board 5. The molding material is injection-filled according to a preset injection-filling pattern from the secondary injection unit 18 through the filling hole 28 of the mold 20e and the resin flow path 24 formed in the secondary-side mold 20e. Thereby, the single-layer molded product 50 is shape | molded in each of a 1st cavity and a 4th cavity.

次に、単層成形品50の冷却固化時間経過後、図7(b)に示すように、2次射出ユニット18を回転盤4の2次側金型20eの充填孔28から後退させて、可動盤5と回転盤4を型開きさせる。なお、可動盤5と回転盤4の型開き動作は第1乃至第4の成形例と同様であるため割愛する。型開き後、図7(c)に示すように、回転盤4の1次側金型19eと2次側金型20eとのそれぞれに付着した単層成形品50を、図示しない製品取出装置により取り出す。このようにして、以後、図1(a)及び図7(a)の状態から図7(c)の状態に至る成形サイクルを繰り返すことにより、1サイクルにおいて2つの単層成形品を連続的に成形することができる。この第5の成形例によれば、回転盤4を回転させる必要がなく、また、1次射出ユニット17及び2次射出ユニット18による射出充填を同時に行い、それぞれの第1キャビティ及び第4キャビティにおいて単層成形品の成形を行なうものであるため、短時間で多量の単層成形品を成形することができる。   Next, after the cooling and solidifying time of the single-layer molded product 50 has elapsed, as shown in FIG. 7B, the secondary injection unit 18 is moved backward from the filling hole 28 of the secondary side mold 20e of the turntable 4, The movable platen 5 and the rotary platen 4 are opened. Note that the mold opening operation of the movable platen 5 and the rotary platen 4 is the same as in the first to fourth molding examples, and is omitted. After the mold opening, as shown in FIG. 7C, the single-layer molded product 50 attached to each of the primary side mold 19e and the secondary side mold 20e of the turntable 4 is removed by a product take-out device (not shown). Take out. In this way, thereafter, by repeating the molding cycle from the state of FIGS. 1 (a) and 7 (a) to the state of FIG. 7 (c), two single-layer molded products are continuously formed in one cycle. Can be molded. According to the fifth molding example, there is no need to rotate the rotating disk 4, and injection filling by the primary injection unit 17 and the secondary injection unit 18 is performed at the same time in each of the first cavity and the fourth cavity. Since a single-layer molded product is molded, a large amount of single-layer molded products can be molded in a short time.

第1実施形態に係る積層成形装置1の第5の成形例において、回転盤4の2次側金型20eと可動盤5の可動盤側金型8eとで形成される第4キャビティに、2次側金型20eの充填孔28及び2次側金型20eに形成された樹脂流路24を介して、2次射出ユニット18から予め設定された射出充填パターンに応じて成形材料を射出充填するものであるとしたが、これに限定されるものではなく、2次射出ユニット18からの射出充填は、例えば回転盤4に充填孔と2次側金型20eに樹脂を導入する樹脂流路を設け、回転盤4の充填孔から樹脂流路及び2次側金型20eを介して行なわれるとしても良い。   In the fifth molding example of the layered molding apparatus 1 according to the first embodiment, the second cavity formed by the secondary side mold 20e of the rotating plate 4 and the movable platen side mold 8e of the movable platen 5 has 2 The filling material 28 is injected and filled from the secondary injection unit 18 according to a preset injection filling pattern via the filling hole 28 of the secondary die 20e and the resin flow path 24 formed in the secondary die 20e. However, the present invention is not limited to this, and injection filling from the secondary injection unit 18 includes, for example, a filling hole in the turntable 4 and a resin flow path for introducing resin into the secondary mold 20e. It may be provided through the filling hole of the turntable 4 through the resin flow path and the secondary side mold 20e.

[第6の成形例]
次に、第1実施形態に係る積層成形装置1の第6の成形例について説明する。第6の成形例は、図2Fに示すように、第5の成形例と同様に、第1キャビティと第4キャビティとのそれぞれにおいて、単層成形品を成形するものであるが、2次射出ユニット18の第4キャビティへの樹脂導入経路が第5の成形例とは異なっている。
[Sixth Molding Example]
Next, a sixth forming example of the laminate forming apparatus 1 according to the first embodiment will be described. As shown in FIG. 2F, in the sixth molding example, a single-layer molded product is molded in each of the first cavity and the fourth cavity, as in the fifth molding example. The resin introduction path to the fourth cavity of the unit 18 is different from that of the fifth molding example.

図8は、第6の成形例を説明するための図である。第6の成形例では、第5の成形例と同様に、まず、型締機構14により回転盤4の1次側金型19fと固定盤3の固定盤側金型21f、および可動盤5の可動盤側金型8fと回転盤4の2次側金型20fとを型締めさせた状態で、2次射出ユニット18を移動機構22によって可動盤5の可動側金型8fに形成された充填孔30と整合する位置まで型開閉方向へ移動させると共に、2次射出ユニット18を可動盤5の可動側金型8fの充填孔30と接触するように型開閉方向と直交する方向へ前進させる。   FIG. 8 is a diagram for explaining a sixth forming example. In the sixth molding example, as in the fifth molding example, first, the primary clamping die 14 of the rotating disc 4, the stationary platen die 21 f of the stationary disc 3, and the movable disc 5 are moved by the mold clamping mechanism 14. In a state where the movable platen mold 8f and the secondary mold 20f of the rotating plate 4 are clamped, the secondary injection unit 18 is filled in the movable mold 5f of the movable platen 5 by the moving mechanism 22. The secondary injection unit 18 is moved forward in a direction orthogonal to the mold opening / closing direction so as to come into contact with the filling hole 30 of the movable mold 8f of the movable platen 5 until the position is aligned with the hole 30.

次に、図8(a)に示すように、回転盤4の1次側金型19fと固定盤3の固定盤側金型21fとで形成される第1キャビティに、固定盤側金型21fの充填孔27a及び固定盤側金型21fに形成された樹脂流路23aを介して、1次射出ユニット17から予め設定された射出充填パターンに応じて成形材料を射出充填する。また、この1次射出ユニット17からの射出充填と同時に、回転盤4の2次側金型20fと可動盤5の可動盤側金型8fとで形成される第4キャビティに、可動側金型8fの充填孔30及び可動側金型8fに形成された樹脂流路26を介して、2次射出ユニット18から予め設定された射出充填パターンに応じて成形材料を射出充填する。これにより、第1キャビティ及び第4キャビティのそれぞれに、単層成形品51が成形される。   Next, as shown in FIG. 8A, the fixed platen side mold 21f is formed in the first cavity formed by the primary side die 19f of the turntable 4 and the fixed platen side die 21f of the fixed platen 3. The molding material is injected and filled from the primary injection unit 17 through the filling hole 27a and the resin flow path 23a formed in the stationary platen mold 21f in accordance with a preset injection filling pattern. Simultaneously with the injection filling from the primary injection unit 17, the movable side mold is formed in the fourth cavity formed by the secondary side mold 20 f of the rotating plate 4 and the movable plate side mold 8 f of the movable platen 5. The molding material is injection-filled from the secondary injection unit 18 according to a preset injection-filling pattern through the filling hole 30 of 8f and the resin flow path 26 formed in the movable mold 8f. Thereby, the single-layer molded product 51 is molded in each of the first cavity and the fourth cavity.

次に、単層成形品51の冷却固化時間経過後、図8(b)に示すように、2次射出ユニット18を可動盤5の可動側金型8fの充填孔30から後退させて、上述した第5の成形例と同様の工程により、回転盤4の1次側金型19fと2次側金型20fとのそれぞれに付着した単層成形品51を、図示しない製品取出装置により取り出す(図8(c)参照)。このようにして、以後、図1(a)及び図8(a)の状態から図8(c)の状態に至る成形サイクルを繰り返すことにより、1サイクルにおいて2つの単層成形品を連続的に成形することができる。この第6の成形例によっても、第5の成形例と同様に、短時間で多量の単層成形品を成形することができる。   Next, after the cooling and solidifying time of the single-layer molded product 51 has elapsed, the secondary injection unit 18 is retracted from the filling hole 30 of the movable mold 8f of the movable platen 5 as shown in FIG. The single-layer molded product 51 adhering to each of the primary side mold 19f and the secondary side mold 20f of the turntable 4 is taken out by a product take-out device (not shown) by the same process as in the fifth molding example. (Refer FIG.8 (c)). In this way, thereafter, by repeating the molding cycle from the state of FIGS. 1 (a) and 8 (a) to the state of FIG. 8 (c), two single-layer molded products are continuously formed in one cycle. Can be molded. According to the sixth molding example, a large amount of single-layer molded product can be molded in a short time as in the fifth molding example.

これら第5及び第6の成形例においては、単層成形品50、51が回転盤4の1次側金型19e、19f及び2次側金型20e、20fに付着した状態で図7(c)及び図8(c)に示す型開き状態とし、回転盤4を回転させることにより製品取り出しを固定盤3と回転盤4間、あるいは可動盤5と回転盤4間のいずれか一方のみで行う形態としても良い。   In these fifth and sixth molding examples, the single-layer molded products 50 and 51 are attached to the primary side molds 19e and 19f and the secondary side molds 20e and 20f of the rotating disk 4 in FIG. ) And the mold open state shown in FIG. 8 (c), and the rotating plate 4 is rotated to take out the product only between the fixed plate 3 and the rotating plate 4 or between the movable plate 5 and the rotating plate 4. It is good also as a form.

次に、図9及び図10を参照しながら本発明の第2実施形態に係る積層成形装置100の構成について説明する。図9(a)は、第2実施形態に係る積層成形装置100の全体主要構造を示す平面図、同図(b)は同じく正面図である。なお、第1実施形態に係る積層成形装置1と同一の構成に関する詳細な説明は割愛し、同一の符号を用いる。   Next, the configuration of the lamination molding apparatus 100 according to the second embodiment of the present invention will be described with reference to FIGS. 9 and 10. Fig.9 (a) is a top view which shows the whole main structure of the lamination molding apparatus 100 which concerns on 2nd Embodiment, The same figure (b) is a front view similarly. In addition, the detailed description regarding the same structure as the lamination molding apparatus 1 which concerns on 1st Embodiment is omitted, and the same code | symbol is used.

第2実施形態に係る積層成形装置100は、第1実施形態に係る積層成形装置1の型締機構14として、具体的にトグル式型締機構14aを採用したものであり、他の構成は第1実施形態と同様である。   The laminate molding apparatus 100 according to the second embodiment specifically employs a toggle type mold clamping mechanism 14a as the mold clamping mechanism 14 of the laminate molding apparatus 1 according to the first embodiment. This is the same as in the first embodiment.

[第7の成形例]
次に、第2実施形態に係る積層成形装置100を用いた第7の成形例について説明する。図10は、第7の成形例を説明するための図である。
[Seventh Molding Example]
Next, a seventh molding example using the lamination molding apparatus 100 according to the second embodiment will be described. FIG. 10 is a diagram for explaining a seventh molding example.

第7の成形例は、2次材料に発泡性溶融樹脂を用いると共に、2次射出充填後に発泡膨張工程を加えることにより、発泡積層成形品を成形するものである。具体的には、上述した第1乃至第6の成形例と同様に、まず、図9(a)の全開状態において、回転盤回転機構11により回転盤4を回転させ、回転盤4の1次側金型19gを固定盤3の固定盤側金型21gに相対する位置に切替えた後、トグル式型締機構14aにより可動盤5と回転盤4とを固定盤3方向に型閉めさせ、回転盤4の1次側金型19gと固定盤3の固定盤側金型21g、および可動盤5の可動盤側金型8gと回転盤4の2次側金型20gとを型締めさせる。   In the seventh molding example, a foamed laminated molded product is molded by using a foamable molten resin as a secondary material and adding a foam expansion step after secondary injection filling. Specifically, as in the first to sixth molding examples described above, first, in the fully opened state of FIG. 9A, the rotating disk 4 is rotated by the rotating disk rotating mechanism 11, and the primary of the rotating disk 4. After the side mold 19g is switched to the position of the fixed platen 3 opposite to the fixed platen side mold 21g, the movable platen 5 and the rotating platen 4 are closed in the direction of the fixed platen 3 by the toggle type mold clamping mechanism 14a. The primary side mold 19 g of the panel 4, the fixed panel side mold 21 g of the stationary panel 3, the movable panel side mold 8 g of the movable panel 5, and the secondary side mold 20 g of the rotating disk 4 are clamped.

次に、図10(a)に示すように、回転盤4の1次側金型19gと固定盤3の固定盤側金型21gとで形成される第1キャビティに、固定盤側金型21gの充填孔27a及び固定盤側金型21gに形成された樹脂流路23aを介して、1次射出ユニット17から予め設定された射出充填パターンに応じて1次材料を1次射出充填して、1次成形体52を成形する。   Next, as shown in FIG. 10 (a), the fixed platen side mold 21g is formed in the first cavity formed by the primary side die 19g of the turntable 4 and the fixed platen side die 21g of the fixed platen 3. Primary injection filling of the primary material according to the injection filling pattern set in advance from the primary injection unit 17 through the resin flow passage 23a formed in the filling hole 27a and the fixed platen side mold 21g, The primary molded body 52 is molded.

1次成形体52の冷却固化時間経過後、図10(b)に示すように、1次成形体52が固定盤3の固定盤側金型21gに付着した状態で可動盤5と回転盤4を固定盤3から離間する方向に型開きさせると共に、図10(c)に示すように、回転盤4を所定位置において回転盤回転機構11により回転させて、回転盤4の2次側金型20gを固定盤3の固定盤側金型21gに相対する位置に切替える。   After the cooling and solidifying time of the primary molded body 52 has elapsed, as shown in FIG. 10B, the movable platen 5 and the rotating platen 4 with the primary molded body 52 attached to the stationary platen mold 21g of the stationary platen 3 are provided. Is opened in a direction away from the fixed platen 3 and the rotating plate 4 is rotated by the rotating plate rotating mechanism 11 at a predetermined position as shown in FIG. 20 g is switched to a position facing the fixed platen side mold 21 g of the fixed platen 3.

次に、図10(d)に示すように、再び、可動盤5と回転盤4とを型閉めさせると共に、回転盤4の2次側金型20gを、1次成形体52が付着した状態の固定盤3の固定盤側金型21gに型合わせさせ、トグル式型締機構14aによって、回転盤4の2次側金型20gと固定盤3の固定盤側金型21g、および可動盤5の可動盤側金型8gと回転盤4の1次側金型19gとを型締めさせる。その後、2次射出ユニット18を移動機構22によって回転盤4の2次側金型20gに形成された充填孔28と整合する位置まで型開閉方向へ移動させると共に、2次射出ユニット18を回転盤4の2次側金型20gの充填孔28と接触するように型開閉方向と直交する方向へ前進させる。   Next, as shown in FIG. 10 (d), the movable platen 5 and the turntable 4 are closed again, and the secondary mold 20g of the turntable 4 is attached to the primary molded body 52. The fixed platen die 21g of the fixed platen 3 is matched with the mold 21g of the fixed platen 3, and the secondary die 20g of the rotary platen 4, the fixed platen side die 21g of the fixed platen 3 and the movable platen 5 by the toggle type clamping mechanism 14a. The movable platen mold 8g and the primary mold 19g of the rotating plate 4 are clamped. Thereafter, the secondary injection unit 18 is moved in the mold opening / closing direction by the moving mechanism 22 to a position where the secondary injection unit 18 is aligned with the filling hole 28 formed in the secondary side mold 20g of the turntable 4, and the secondary injection unit 18 is moved to the turntable. 4 is advanced in a direction orthogonal to the mold opening / closing direction so as to come into contact with the filling hole 28 of the secondary side mold 20g.

次に、回転盤4の2次側金型20gと固定盤3の固定盤側金型21gに付着した1次成形体52の表面とで形成される第2キャビティに、2次側金型20gの充填孔28及び樹脂流路24を介して、2次射出ユニット18から予め設定された射出充填パターンに応じて発泡性溶融樹脂である2次材料を2次射出填する。その後、図10(e)に示すように、2次射出ユニット18を回転盤4の2次側金型20gの充填孔28から後退させて、トグル式型締機構14aと回転盤連結機構15とにより可動盤5と回転盤4と一体で所定量αだけ型開きさせる。これにより、微少型開きされた第2キャビティ内に発泡性溶融樹脂を発泡膨張させ、1次成形体52の表面の一部あるいは全面に、表面が非発泡のスキン層で、内部に微細発泡セルを有する2次材料発泡層53を成形する。   Next, the secondary mold 20g is formed in a second cavity formed by the secondary mold 20g of the rotating disk 4 and the surface of the primary molded body 52 attached to the fixed mold 21g of the fixed disk 3. The secondary material, which is a foamable molten resin, is subjected to secondary injection filling according to a preset injection filling pattern from the secondary injection unit 18 through the filling hole 28 and the resin flow path 24. Thereafter, as shown in FIG. 10 (e), the secondary injection unit 18 is retracted from the filling hole 28 of the secondary mold 20g of the turntable 4, and the toggle type mold clamping mechanism 14a, the turntable connecting mechanism 15, Thus, the movable platen 5 and the rotary platen 4 are integrally opened by a predetermined amount α. As a result, the foamable molten resin is expanded and expanded in the second cavity opened slightly, and the surface of the primary molded body 52 is partially or entirely on the non-foamed skin layer, and the inside of the fine foam cell. The secondary material foam layer 53 having the above is molded.

所定の冷却固化時間経過後、図10(f)に示すように、可動盤5と回転盤4を型開きさせ、固定盤3の固定盤側金型21gに付着した1次成形体52と2次材料発泡層53とから成る発泡積層成形品を、図示しない製品取出装置により取り出す(図10(g)参照)。その後、回転盤4を回転盤回転機構11により回転させ、回転盤4の1次側金型19gを固定盤3の固定盤側金型21gに相対する位置に切替える。このようにして、以後、図10(a)の状態から図10(g)の状態に至る成形サイクルを繰り返すことにより、発泡積層成形品を連続的に成形することができる。   After a predetermined cooling and solidifying time has elapsed, as shown in FIG. 10 (f), the movable platen 5 and the rotary platen 4 are opened, and the primary molded bodies 52 and 2 attached to the fixed platen side mold 21 g of the fixed platen 3. The foamed laminated molded product composed of the next material foam layer 53 is taken out by a product take-out device (not shown) (see FIG. 10G). Thereafter, the turntable 4 is rotated by the turntable rotation mechanism 11, and the primary side mold 19 g of the turntable 4 is switched to a position facing the fixed platen side mold 21 g of the fixed platen 3. Thus, after that, by repeating the molding cycle from the state of FIG. 10 (a) to the state of FIG. 10 (g), the foamed laminated molded product can be continuously formed.

ここで、第2実施形態に係る積層成形装置100の成形例においては、2次射出充填時においてのみ発泡成形させるものであるが、これに限らず1次射出充填時のみ、あるいは1次射出充填時及び2次射出充填時の双方において発泡成形させることも可能である。また2次射出ユニット18を回転盤4の2次側金型20gの充填孔28から後退させた際には、発泡性溶融樹脂が発泡圧によって噴出しないように、2次射出ユニット18及び2次側金型20gの充填孔28の先端部には遮断機構を設けると良い。   Here, in the molding example of the lamination molding apparatus 100 according to the second embodiment, foam molding is performed only at the time of secondary injection filling, but not limited thereto, only at the time of primary injection filling, or primary injection filling. It is also possible to perform foam molding both at the time and at the time of secondary injection filling. Further, when the secondary injection unit 18 is retracted from the filling hole 28 of the secondary side mold 20g of the turntable 4, the secondary injection unit 18 and the secondary injection unit 18 and the secondary injection unit 18 are prevented so that the foamable molten resin is not ejected by the foaming pressure. A blocking mechanism may be provided at the tip of the filling hole 28 of the side mold 20g.

第2実施形態に係る積層成形装置100の成形例において、2次射出ユニット18を移動機構22によって回転盤4の2次側金型20gに形成された充填孔28と整合する位置まで移動させ、2次射出ユニット18から2次側金型20gの充填孔28及び樹脂流路24を介して、第2キャビティ内に発泡樹脂を充填するものであるとしたが、これに限定されるものではなく、2次射出ユニット18からの2次射出充填は、任意の金型において行なわれるとしても良い。また、上記第1実施形態に係る積層成形装置1の第1乃至第6の成形例に、発泡性溶融樹脂を用いて発泡膨張工程を加えた形態も可能である。これら発泡成形品を成形するに際し、型締機構14は、精度の高い微少型開きが可能なトグル式型締機構であることが好ましい。   In the molding example of the laminating apparatus 100 according to the second embodiment, the secondary injection unit 18 is moved to a position aligned with the filling hole 28 formed in the secondary mold 20g of the turntable 4 by the moving mechanism 22. The second cavity is filled with the foamed resin through the filling hole 28 and the resin flow path 24 of the secondary side mold 20g from the secondary injection unit 18, but the present invention is not limited to this. The secondary injection filling from the secondary injection unit 18 may be performed in an arbitrary mold. Moreover, the form which added the foam expansion process using the foamable molten resin to the 1st thru | or 6th molding example of the lamination molding apparatus 1 which concerns on the said 1st Embodiment is also possible. When molding these foam molded products, the mold clamping mechanism 14 is preferably a toggle type mold clamping mechanism capable of opening a minute mold with high accuracy.

上記第1実施形態及び第2実施形態において、回転盤4は、垂直軸線回りに回転されるものであるが、装置長手方向に直交する水平軸線回りに回転される形態であっても良い。   In the first embodiment and the second embodiment, the turntable 4 is rotated around the vertical axis, but may be rotated around a horizontal axis perpendicular to the longitudinal direction of the apparatus.

また、上記第1実施形態及び第2実施形態に係る積層成形装置における構成及び成形例は、例示的なものであり、本発明の範囲を逸脱しない範囲において変更しても良い。このように、本発明に係る積層成形装置は、第1実施形態及び第2実施形態に限定されるものではない。   Moreover, the structure and the example of a shaping | molding in the lamination molding apparatus which concern on the said 1st Embodiment and 2nd Embodiment are illustrations, You may change in the range which does not deviate from the scope of the present invention. Thus, the lamination molding apparatus according to the present invention is not limited to the first embodiment and the second embodiment.

また、上記第1実施形態に係る積層成形装置1の第1及び第2の成形例、並びに上記第2実施形態に係る積層成形装置100の成形例においては、可動盤に設けられた可動盤側金型を、平板状のダミープレートとしても良い。このように、可動盤側金型をダミープレートとすることにより、型締時における可動盤の金型取付面と回転盤の可動盤側に位置する金型(1次側金型又は2次側金型)の保護を図ることができると共に、使用する金型を少なくして金型コストを低減させることができる。さらに、第1実施形態に係る積層成形装置1及び第2実施形態に係る積層成形装置100において、回転盤4は、両面に1次側金型19と2次側金型20とがそれぞれ取り付けられているとしたが、これに限定されるものではなく、例えば回転盤4の形状を多面を有する多面体として、それぞれの面に金型をそれぞれ設ける構成としても良い。   Further, in the first and second molding examples of the lamination molding apparatus 1 according to the first embodiment and the molding example of the lamination molding apparatus 100 according to the second embodiment, the movable board side provided on the movable board The mold may be a flat dummy plate. Thus, by using the movable plate side mold as a dummy plate, the mold mounting surface of the movable plate at the time of mold clamping and the mold located on the movable plate side of the rotating plate (primary side mold or secondary side). The mold can be protected, and the mold cost can be reduced by using less molds. Further, in the laminate molding apparatus 1 according to the first embodiment and the laminate molding apparatus 100 according to the second embodiment, the rotary disk 4 has a primary side mold 19 and a secondary side mold 20 attached to both sides, respectively. However, the present invention is not limited to this. For example, the configuration of the rotating disk 4 may be a polyhedron having multiple surfaces, and a mold may be provided on each surface.

以上のように、本発明の第1実施形態及び第2実施形態に係る積層成形装置は、2次射出ユニット18を固定盤、回転盤、可動盤のいずれにも移動及び射出可能な構成としたことにより、1台の積層成形装置で様々な成形方法により成形品を成形することができる。すなわち、本発明の積層成形装置によれば、単層、単色成形や通常の多層、多色成形に加えて、発泡成形や型内被覆成形方法など、型締機構によって可動盤を固定盤に対して進退させる従来の単層成形装置で実施されている種々の成形方法が実施可能となり、更に、それらを組み合わせた積層成形品の成形も可能となるため、積層成形品、発泡積層成形品、単層成形品及びガラス樹脂化成形品等の様々な成形品を、全て一台の積層成形装置で成形することができる。   As described above, the lamination molding apparatus according to the first embodiment and the second embodiment of the present invention has a configuration in which the secondary injection unit 18 can be moved and injected to any of the fixed platen, the rotary platen, and the movable platen. Thus, a molded product can be molded by various molding methods using a single lamination molding apparatus. That is, according to the lamination molding apparatus of the present invention, in addition to single layer, single color molding, normal multilayer, and multicolor molding, the movable platen is fixed to the fixed platen by a mold clamping mechanism such as foam molding or in-mold coating molding method. Therefore, it is possible to carry out various molding methods that have been implemented in conventional single-layer molding devices that are advanced and retracted, and it is also possible to mold laminated molded products that combine them. Various molded products such as layer molded products and glass resin molded products can all be molded with a single laminating apparatus.

また、上記第1実施形態及び第2実施形態に係る積層成形装置において、2次射出ユニット18及び移動機構22は、積層成形装置本体に対して着脱可能に設けられた別部材である。従って型締機構で可動盤を固定盤に対して進退させる汎用の単層成形装置に、2次射出ユニット18及び移動機構22と1次側金型19及び2次側金型20を備える回転盤4とを追加することにより、汎用の単層成形装置を流用して、容易に本発明の第1実施形態及び第2実施形態に係る積層成形装置を得ることができる。これにより、装置の設置スペースあるいは装置の設置費用の制約のため、専用の積層成形装置を設置することが困難であった企業、特に中小規模の企業においても、既に設置している汎用の単層成形装置を、低コストで、多機能を有する万能な積層成形装置に容易に改造することができる。   Moreover, in the lamination molding apparatus according to the first embodiment and the second embodiment, the secondary injection unit 18 and the moving mechanism 22 are separate members that are detachably attached to the lamination molding apparatus main body. Therefore, a general-purpose single-layer molding apparatus that moves the movable plate back and forth with respect to the fixed plate by a mold clamping mechanism is provided with a secondary injection unit 18, a moving mechanism 22, a primary die 19, and a secondary die 20. By adding 4, the multi-layer molding apparatus according to the first embodiment and the second embodiment of the present invention can be easily obtained by diverting a general-purpose single layer molding apparatus. As a result, general-purpose single-layers that have already been installed in companies that have been difficult to install dedicated lamination molding equipment due to restrictions on equipment installation space or equipment installation costs, especially in small and medium-sized companies. The molding apparatus can be easily remodeled into a versatile laminated molding apparatus having multiple functions at low cost.

本発明に係る積層成形装置によれば、近年の傾向の一つである、多種少量生産が求められる様々な積層成形品に対応して、様々な成形方法を1台の積層成形装置で行なうことができ、使用者のニーズに応えられる万能な積層成形装置を提供することができる。   According to the laminate molding apparatus according to the present invention, various molding methods can be performed by a single laminate molding apparatus in response to various laminate molded products that require one of the recent trends, which are required to be produced in various small quantities. It is possible to provide a versatile laminate molding apparatus that can meet the needs of users.

1、100…積層成形装置、2…ベッド、3…固定盤、4…回転盤、5…可動盤、7…型締機構駆動装置、8…可動盤側金型、9…タイバー、11…回転盤回転機構、12…回転盤移動機構、13…回転軸、14…型締機構、15…回転盤連結機構、17…1次射出ユニット、18…2次射出ユニット、19…1次側金型、20…2次側金型、21…固定盤側金型、22…移動機構   DESCRIPTION OF SYMBOLS 1,100 ... Lamination molding apparatus, 2 ... Bed, 3 ... Fixed board, 4 ... Rotation board, 5 ... Movable board, 7 ... Mold clamping mechanism drive device, 8 ... Movable board side metal mold, 9 ... Tie bar, 11 ... Rotation Disc rotating mechanism, 12 ... Rotating disc moving mechanism, 13 ... Rotating shaft, 14 ... Clamping mechanism, 15 ... Rotating disc coupling mechanism, 17 ... Primary injection unit, 18 ... Secondary injection unit, 19 ... Primary mold 20 ... secondary mold, 21 ... fixed platen mold, 22 ... moving mechanism

Claims (11)

第1金型が設けられた固定盤と、
前記第1金型と対向する面に第2金型又はダミープレートが設けられると共に、前記固定盤に対して型開閉方向に進退自在に設けられた可動盤と、
前記固定盤と前記可動盤との間において型開閉方向に移動可能で型開閉方向と直交する回転軸を中心として回転可能に設けられ、少なくとも2つの面を有し、異なる回転位置でそれぞれ前記第1金型と対向する異なる面に少なくとも第3金型及び第4金型がそれぞれ設けられた回転盤と、
前記固定盤に対して前記可動盤を型開閉方向に移動させる型締機構と、
前記固定盤に対して前記回転盤を型開閉方向に移動させる回転盤移動機構と、
前記回転軸を中心として前記回転盤を回転させる回転盤回転機構と、
前記第1金型に接続可能な状態で前記固定盤に装着されて前記第1金型と前記第3金型とが型締めされて形成される第1キャビティに第1の樹脂を射出充填する第1射出ユニットと、
前記型開閉方向に移動可能に配置され、前記第1金型、第2金型、第3金型、第4金型及び前記回転盤の少なくとも1つに選択的に接続可能で、前記第1金型と前記第4金型とが型締めされて形成される第2キャビティ、前記第2金型と前記第3金型とが型締めされて形成される第3キャビティ、及び前記第2金型と前記第4金型とが型締めされて形成される第4キャビティのいずれか1つに前記第1乃至第4金型のいずれか1つを介して第2の樹脂を射出充填する第2射出ユニットと
を備えたことを特徴とする積層成形装置。
A stationary platen provided with a first mold;
A second mold or a dummy plate is provided on a surface facing the first mold, and a movable plate provided to be movable in a mold opening / closing direction with respect to the fixed plate;
It is movable between the fixed platen and the movable platen in the mold opening / closing direction and is rotatable about a rotation axis orthogonal to the mold opening / closing direction. A rotating table provided with at least a third mold and a fourth mold on different surfaces facing one mold,
A mold clamping mechanism for moving the movable plate in the mold opening / closing direction with respect to the fixed plate;
A turntable moving mechanism for moving the turntable in a mold opening / closing direction with respect to the fixed plate;
A rotating disk rotating mechanism for rotating the rotating disk around the rotation axis;
A first resin is injected and filled into a first cavity that is mounted on the fixed plate in a state connectable to the first mold and is formed by clamping the first mold and the third mold. A first injection unit;
The first mold, the second mold, the third mold, the fourth mold, and the turntable are selectively connectable to the first mold, the second mold, the third mold, the fourth mold, and the turntable. A second cavity formed by clamping a mold and the fourth mold, a third cavity formed by clamping the second mold and the third mold, and the second mold A second resin is injected and filled into any one of the fourth cavities formed by clamping the mold and the fourth mold through the one of the first to fourth molds. A laminate molding apparatus comprising: two injection units.
前記第2射出ユニットは、前記第1金型の位置で該第1金型に接続し、該第1金型を介して前記第2キャビティに第2の樹脂を射出充填するものであることを特徴とする請求項1記載の積層成形装置。   The second injection unit is connected to the first mold at the position of the first mold, and injects and fills the second resin into the second cavity through the first mold. The lamination molding apparatus according to claim 1. 前記第2射出ユニットは、前記第4金型又は前記回転盤の位置で該第4金型又は該回転盤に接続し、該第4金型を介して前記第2キャビティに第2の樹脂を射出充填するものであることを特徴とする請求項1記載の積層成形装置。   The second injection unit is connected to the fourth mold or the turntable at the position of the fourth mold or the turntable, and the second resin is supplied to the second cavity through the fourth mold. The lamination molding apparatus according to claim 1, wherein the apparatus is injection-filled. 前記第2射出ユニットは、前記第3金型又は前記回転盤の位置で該第3金型又は該回転盤に接続し、該第3金型を介して前記第3キャビティに第2の樹脂を射出充填するものであることを特徴とする請求項1記載の積層成形装置。   The second injection unit is connected to the third mold or the turntable at the position of the third mold or the turntable, and the second resin is supplied to the third cavity via the third mold. The lamination molding apparatus according to claim 1, wherein the apparatus is injection-filled. 前記第2射出ユニットは、前記第2金型の位置で該第2金型に接続し、該第2金型を介して前記第3キャビティに第2の樹脂を射出充填するものであることを特徴とする請求項1記載の積層成形装置。   The second injection unit is connected to the second mold at the position of the second mold, and injects and fills the second resin into the third cavity through the second mold. The lamination molding apparatus according to claim 1. 前記第2射出ユニットは、前記第4金型又は前記回転盤の位置で該第4金型又は該回転盤に接続し、該第4金型を介して前記第4キャビティに第2の樹脂を射出充填するものであることを特徴とする請求項1記載の積層成形装置。   The second injection unit is connected to the fourth mold or the turntable at the position of the fourth mold or the turntable, and the second resin is supplied to the fourth cavity through the fourth mold. The lamination molding apparatus according to claim 1, wherein the apparatus is injection-filled. 前記第2射出ユニットは、前記第2金型の位置で該第2金型に接続し、該第2金型を介して前記第4キャビティに第2の樹脂を射出充填するものであることを特徴とする請求項1記載の積層成形装置。   The second injection unit is connected to the second mold at the position of the second mold, and the second resin is injected and filled into the fourth cavity through the second mold. The lamination molding apparatus according to claim 1. 前記回転盤は、前記第3金型又は第4金型を介して前記第1乃至第4キャビティのいずれか1つに樹脂を充填可能な流路を有するものであることを特徴とする請求項1乃至7いずれか1項記載の積層成形装置。   The rotating disk has a flow path capable of filling a resin into any one of the first to fourth cavities via the third mold or the fourth mold. The lamination molding apparatus of any one of 1 thru | or 7. 前記第2射出ユニットは、前記型開閉方向と直交する方向から前記第1金型乃至第4金型及び前記回転盤の少なくとも1つに接続し、前記第2キャビティ乃至第4キャビティのいずれか1つに第2の樹脂を射出充填するものであることを特徴とする請求項1乃至8いずれか1項記載の積層成形装置。   The second injection unit is connected to at least one of the first to fourth molds and the turntable from a direction orthogonal to the mold opening / closing direction, and any one of the second to fourth cavities. The lamination molding apparatus according to any one of claims 1 to 8, wherein the second resin is injected and filled. 前記第2射出ユニットは、成形装置本体に対して着脱可能な別部材であることを特徴とする請求項1乃至9いずれか1項記載の積層成形装置。   The lamination molding apparatus according to claim 1, wherein the second injection unit is a separate member that can be attached to and detached from the molding apparatus main body. 前記型締機構は、トグル式型締機構であることを特徴とする請求項1乃至10いずれか1項記載の積層成形装置。   The lamination molding apparatus according to any one of claims 1 to 10, wherein the mold clamping mechanism is a toggle type mold clamping mechanism.
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