JP2011056606A - Apparatus and method for assembling thin plate member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for assembling thin plate members, which largely improve assembling efficiency and fit by tight fitting. <P>SOLUTION: An assembling apparatus 10 for assembling a reformer chip 20 in a bottomed hole 31 formed on an electromagnetic steel plate 30 includes: an upper die 11 and a lower die 12 whose mating surfaces are formed to be approximately spherical for sandwiching the electromagnetic steel plate 30; and a chip holder 13 for carrying the reformer chip 20 and disposing the carried reformer chip 20 in the bottomed hole 31 while the electromagnetic steel plate 30 is sandwiched between the upper die 11 and the lower die 12. A through-hole 18 through which the chip holder 13 can pass is formed at the center of the upper die 11. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an assembling apparatus and an assembling method for assembling a thin plate member into a bottomed hole. More specifically, the present invention relates to a thin plate member assembling apparatus and assembling method capable of improving assembling workability.

  When assembling the thin plate member in the bottomed hole formed in the counterpart material, for example, a method using the technique disclosed in Patent Document 1 can be considered. In the technique disclosed herein, a blade that is a sharp member having two separated tips is inserted into an opening (corresponding to a bottomed hole) of a holder that is a U-shaped member, and the inserted blade The width of the opening is expanded by widening the distance between the two tips, and a thin light guide (corresponding to a chip) is inserted into the expanded opening, and the light guide is inserted into the opening. After being done, the two tips of the blade are extracted from the opening. Thereby, the assembly workability is improved.

JP 2003-001528 A

  However, in the technique described in Patent Document 1 described above, since the two tips of the blade are hooked on the opening, a certain depth or more is required in the opening, but the thickness is very thin, about 0.15 mm. A very shallow bottomed hole having a depth of about 0.15 mm for assembling the thin plate member cannot secure a portion for hooking the tip of the blade. For this reason, it is very difficult to use the technique described in Patent Document 1 for assembling the thin plate member.

Here, after the thin plate member is assembled in the bottomed hole of the counterpart material, it is transported to another process in that state, but the thin plate member assembled at the time of transportation is held in the bottomed hole so that it does not come off from the bottomed hole. Need to be. Therefore, it is desirable that the thin plate member is fitted into the bottomed hole with a press fit or a slight clearance.
However, when fitting with press-fitting or fine clearance, chamfering is generally performed on the hole side and the shaft side. However, when the thin plate member is assembled, the bottomed hole is very shallow and the thin plate member is also very thin. Both of them are very difficult to perform chamfering treatment effective for press-fitting or fitting.

  Therefore, at present, the processing dimensions of the bottomed hole and the thin plate member outer diameter are finished with very high precision (clearance is controlled at φ0.003 to 0.006), and the bottom is manually bottomed by a skilled worker. A thin plate member is assembled in the hole. For this reason, there existed a problem that assembly workability | operativity was very bad.

  Accordingly, the present invention has been made to solve the above-described problems, and greatly improves the assembly workability and allows the thin plate member assembly apparatus and assembly to be fitted with an interference fit. It aims to provide a method.

  One aspect of the present invention made to solve the above problems is an assembly apparatus for assembling a thin plate member into a bottomed hole formed in a plate-like member, wherein the mating surface is formed in a substantially spherical shape, and the plate-like member is And a holding member that holds the thin plate member in the bottomed hole in a state where the thin plate member is held and the plate-like member is held between the convex type and the concave type. And a through-hole through which the chip holding member can pass is formed in the center of the concave mold.

  In this thin plate member assembling apparatus, a plate-like member in which a bottomed hole for assembling the thin plate member is formed is sandwiched between a convex type and a concave type. Since the convex and concave mating surfaces (opposing surfaces) are formed in a substantially spherical shape, the plate-like member sandwiched between the convex and concave shapes is curved. Due to the deformation of the plate member, the bottomed hole formed in the plate member is expanded. In this state, the thin plate member is disposed in the bottomed hole by the holding member through the through hole provided in the center of the concave mold. At this time, the through hole serves as a guide for disposing the thin plate member in the bottomed hole, and facilitates the work. After that, by separating the convex and concave molds, the deformation of the plate-like member is restored and the thin plate member is assembled to the bottomed hole.

  Thus, when the thin plate member is assembled to the bottomed hole, the bottomed hole is expanded and the clearance at the time of assembly is increased, so that the assembly workability can be greatly improved. Also, the assembly work can be automated. Further, after the thin plate member is arranged in the expanded bottomed hole, the thin plate member is fitted into the bottomed hole with an interference fit so that the deformation of the plate-like member is restored and the thin plate member is assembled to the bottomed hole. be able to. Furthermore, it is not necessary to finish the processing dimensions of the bottomed hole and the thin plate member outer diameter with very high accuracy.

  In the thin plate member assembling apparatus described above, the convex sphere R is preferably set so as to be elastically deformed when the plate member is sandwiched between the convex mold and the concave mold.

  When assembling the thin plate member into the bottomed hole, the plate-like member is sandwiched between the convex shape and the concave shape and deformed. However, if the plate-like member is plastically deformed, the plate-shaped member is separated even if the convex shape and the concave shape are separated from each other. Will not return to its original shape. Then, the thin plate member cannot be fitted into the bottomed hole by an interference fit.

  Therefore, in this thin plate member assembling apparatus, the convex sphere R is elastically deformed when the plate member is sandwiched between the convex and concave shapes, that is, so that the plate member is not plastically deformed. It is set within the deformation limit. Thereby, when the plate-shaped member is sandwiched between the convex mold and the concave mold and deformed, it is possible to reliably prevent the plate-shaped member from being plastically deformed. Therefore, when the convex and concave molds are separated from each other, the deformation of the plate-shaped member is surely restored to the original, so that the thin plate member can be fitted into the bottomed hole by an interference fit.

  In the thin plate member assembling apparatus described above, the tip holding member insertion side end surface of the through hole is conical chamfered, and the tip holding member has the same diameter as the thin plate member. It is desirable that

  With such a configuration, the thin plate member can be arranged in the bottomed hole more easily and smoothly. Moreover, the thin plate member can be arranged in the bottomed hole with higher accuracy. This is particularly effective when automating the assembly of thin plate members.

  Another aspect of the present invention made to solve the above problems is a method of assembling a thin plate member into a bottomed hole formed in a plate-like member, and a convex shape in which the mating surfaces are formed in a substantially spherical shape. The thin plate member is assembled to the bottomed hole in a state where the plate-shaped member is sandwiched between the concave shape and the bottomed hole is expanded and deformed within the elastic limit of the plate-shaped member.

  Even in this thin plate member assembly method, in order to assemble the thin plate member into the bottomed hole in a state in which the bottomed hole is expanded and deformed within the elastic limit of the plate-shaped member by sandwiching the plate-shaped member between the convex and concave molds, Assembling workability can be greatly improved and fitting with an interference fit can be performed.

  The diameter of the thin plate member is preferably equal to or less than the diameter of the bottomed hole. In this way, the diameter of the plate member is made smaller than the diameter of the bottomed hole, that is, the diameter of the thin plate member is made equal to the diameter of the bottomed hole, or the diameter of the thin plate member is made slightly smaller than the diameter of the bottomed hole. Thus, the thin plate member can be securely fitted to the bottomed hole by an interference fit. As a result, it is possible to prevent the thin plate member from dropping or shifting in the subsequent process, and workability and productivity can be improved.

  According to the thin plate member assembling apparatus and the assembling method of the present invention, as described above, the assembling workability can be greatly improved and the fitting with the interference fit can be performed.

It is a schematic block diagram which shows the outline of the assembly | attachment apparatus which concerns on this Embodiment. It is a figure which shows the relationship between the bulb | ball R in the upper surface of a lower mold | type, and the expansion amount of the bottomed hole of an electromagnetic steel plate. It is a figure which shows the state which has arrange | positioned the chip | tip for a modification | reformation in the expanded bottomed hole. It is a figure which shows the state which separated the upper mold | type from the lower mold | type, and assembled | attached the chip | tip for a modification | reformation to the bottomed hole. It is a figure which shows the state which assembled | attached the chip | tip for a modification | reformation whose thickness is thicker than the depth of a bottomed hole to a bottomed hole.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the thin plate member assembling apparatus and the assembling method according to the present invention will be described below in detail with reference to the drawings. In the present embodiment, a case where a modification tip for making a part of a magnetic steel sheet non-magnetic is incorporated into a bottomed hole formed in the magnetic steel sheet is illustrated. The partial demagnetization of the electromagnetic steel sheet is a modification in which a reforming chip is incorporated in a bottomed hole of the electromagnetic steel sheet, and these are melted and integrated by energization to be reformed.

First, an assembling apparatus according to the present embodiment will be described with reference to FIG. FIG. 1 is a schematic configuration diagram showing an outline of an assembling apparatus according to the present embodiment.
As shown in FIG. 1, the assembling apparatus 10 includes an upper mold 11, a lower mold 12, and a chip holder 13. Then, the electromagnetic steel plate 30 is sandwiched between the upper die 11 and the lower die 12, and the reforming tip 20 held at the tip of the tip holder 13 is incorporated into the bottomed hole 31 formed in the electromagnetic steel plate 30. ing.

  The upper mold 11 is a concave mold having a cylindrical shape and a lower surface 11b formed in a substantially spherical shape. The lower mold 12 is a convex mold having a cylindrical shape and an upper surface 12a formed in a substantially spherical shape. The upper mold 11 and the lower mold 12 are arranged in a hollow frame member 15. The lower mold 12 is disposed and fixed in the frame member 15, but the upper mold 13 is moved up and down in the frame member 15 by an operating mechanism. That is, in the assembling apparatus 10, the upper mold 11 is moved closer to and away from the lower mold 12 on the central axis X.

  One end of a connecting plate 16 that protrudes out of the frame member 15 is attached to the upper mold 11 with a bolt. The other end of the connecting plate 16 is connected to a rod 17 a of a cylinder 17 fixed to the frame member 15. As a result, the upper mold 11 moves up and down in conjunction with the movement of the cylinder 17. That is, the connecting plate 16 and the cylinder 17 constitute an operating mechanism that moves the upper mold 11 up and down in the frame member 15.

  A through hole 18 is provided at the center of the upper mold 11. The diameter of the through hole 18 is slightly larger than the diameter of the modifying tip 20 and the diameter of the tip holder 13. Thereby, the chip holder 13 can pass through the through-hole 18 when the reforming chip 20 is assembled. Since the diameter of the through hole 18 is slightly larger than the diameter of the chip holder 13, the through hole 18 also acts as a guide for the chip holder 13.

  In the case of automating the assembly of the reforming chip, it is preferable to conical chamfer the upper opening end surface of the through hole 18. This is because the modification tip 20 can be placed in the bottomed hole 31 with high accuracy and easily and smoothly, so that the assembly work can be automated more easily.

The sphere R on the lower surface 11 b of the upper mold 11 has a dimension obtained by adding the plate thickness of the electromagnetic steel sheet 30 to the sphere R on the upper surface 12 a of the lower mold 12. In addition, the plate | board thickness of the electromagnetic steel plate 30 in this Embodiment is 0.3 mm.
Here, the sphere R on the upper surface 12 a of the lower mold 12 is set within a range that elastically deforms when the electromagnetic steel sheet 30 is sandwiched between the upper mold 11 and the lower mold 12. Since the optimum value of the sphere R on the upper surface 12a of the lower mold 12 varies depending on the material of the thin plate member, the shapes of the upper surface 12a of the lower mold 12 and the lower surface 11b of the upper mold 11 are designed by experiments. That's fine.

  Here, the relationship between the sphere R on the upper surface 12a of the lower mold 12 and the expansion amount of the bottomed hole 31 of the electromagnetic steel sheet 30 in the present embodiment is shown in FIG. As can be seen from FIG. 2, the sphere R on the upper surface 12 a of the lower mold 12 may be set within 110 elastic deformation of the electromagnetic steel sheet 30, and may be set to 110 or more. On the other hand, the larger the amount of expansion of the bottomed hole 31, the better the workability. Therefore, the sphere R on the upper surface 12a of the lower mold 12 is ideally set to 110. However, if the ball R is 110 due to product variations of the electromagnetic steel sheet 30, plastic deformation may occur in the electromagnetic steel sheet 30. For this reason, in the present embodiment, a certain margin is provided for the elastic limit, and the sphere R on the upper surface 12a of the lower mold 12 is set to 150. Accordingly, the electromagnetic steel sheet 30 is prevented from being plastically deformed while securing the expansion amount of the bottomed hole 31 to some extent. The diameter of the bottomed hole 31 is 3 mm, and the depth is 0.15 mm.

  Returning to FIG. 1, a cutout portion 15 a is formed in the side portion of the frame member 15. The notch 15 a is provided near the upper surface 12 a of the lower mold 12. Thereby, the electromagnetic steel plate 30 in which the bottomed hole 31 is formed can be disposed between the upper die 11 and the lower die 12 from the cutout portion 15a. In addition, the electromagnetic steel plate 30 is arrange | positioned between the upper mold | type 11 and the lower mold | type 12 with the conveying apparatus not shown.

  The tip holder 13 has a cylindrical shape for holding the reforming tip 20 at the tip by suction or the like. The diameter of the tip holder 13 is set to be the same as the diameter of the reforming tip 20. The diameter of the reforming tip 20 is 3 mm, and the thickness (height) is 0.15 mm. The chip holder 13 is connected to a rod 14 a of a cylinder 14 fixed to an upper plate 19 attached to the upper part of the frame member 15. A through hole 19 a is formed at the center of the upper plate 19. The through hole 19a is disposed coaxially with the through hole 18 (central axis X). The chip holder 13 is slidably disposed in the through hole 19a. Thereby, the tip holder 13 moves up and down while being guided by the through hole 19 a in conjunction with the movement of the cylinder 14.

  The tip holder 13 is also for placing the retained reforming tip 30 in the bottomed hole 31. That is, the tip holder 13 is lowered by the cylinder 14, and when the reforming tip 20 held at the tip reaches the bottomed hole 31, the reforming tip 20 is released to enter the bottomed hole 31. It comes to arrange.

  Next, referring to FIG. 1, FIG. 3, and FIG. 4 for the procedure (assembly method) for assembling the reforming chip 20 into the bottomed hole 31 of the electromagnetic steel sheet 30 using the assembly apparatus 10 having the above-described configuration. While explaining. FIG. 3 is a view showing a state in which the reforming chip is disposed in the expanded bottomed hole. FIG. 4 is a view showing a state in which the reforming tip is assembled to the bottomed hole with the upper die separated from the lower die.

  First, in the assembling apparatus 10, as shown in FIG. 1, the tip for reforming 20 is held at the tip of the tip holder 13 with the tip holder 13 being raised. At this time, the upper mold 11 is raised and separated from the lower mold 12. In this state, the electromagnetic steel sheet 30 in which the bottomed hole 31 is formed from the side of the assembling apparatus 10 is disposed between the upper mold 11 and the lower mold 12. At this time, the electromagnetic steel sheet 30 is disposed so that the center of the bottomed hole 31 is positioned on the central axis X of the assembling apparatus 10. Thereby, since the upper mold | type 11 and the lower mold | type 12 are previously arrange | positioned on the central axis X, the bottomed hole 31, the upper mold | type 11, and the lower mold | type 12 are arrange | positioned on the central axis X.

  Next, the cylinder 17 is operated to lower the upper mold 11, and the electromagnetic steel sheet 30 is sandwiched between the upper mold 11 and the lower mold 12. Then, a portion of the electromagnetic steel sheet 30 sandwiched between the upper die 11 and the lower die 12 is elastically deformed into a spherical shape following the shapes of the lower surface 11b of the upper die 11 and the upper surface 12a of the lower die 12. At this time, since the sphere R of the upper surface 12a of the lower mold 12 is set to 150, the electromagnetic steel sheet 30 is not plastically deformed (see FIG. 2). The bottomed hole 31 is expanded by elastic deformation of the electromagnetic steel sheet 30.

  In this state, the cylinder 14 is operated to lower the tip holder 13 holding the reforming tip 20. Then, the reforming tip 20 and the tip holder 13 pass through the through hole 18 provided in the upper mold 11, and the reforming tip 20 reaches the bottomed hole 31 of the electromagnetic steel sheet 30. Then, after the reforming chip 20 is released from the chip holder 13, the chip holder 13 is raised, and the reforming chip 20 is inserted into the bottomed hole 31 of the electromagnetic steel sheet 30 as shown in FIG. 3. Be placed.

  When the reforming tip 20 is disposed in the bottomed hole 31, the through hole 19 a of the upper plate 19 and the through hole 18 of the upper mold 11 serve as a guide for the chip holder 13, and the bottomed hole 31 is expanded. Therefore, the work of arranging the reforming tip 20 in the bottomed hole 31 can be performed easily and smoothly with high accuracy. That is, workability is greatly improved.

  Thereafter, the upper die 11 is separated from the lower die 12 by the cylinder 17. Then, the elastic deformation of the electromagnetic steel sheet 30 is released and the original shape is restored. Thereby, as shown in FIG. 4, the reforming tip 20 is firmly assembled in the bottomed hole 31 of the electromagnetic steel sheet 30. Thus, since the bottomed hole 31 is expanded when assembling the reforming tip 20, even a tight fit tolerance product can be easily assembled. That is, the modifying tip 20 can be reliably assembled to the bottomed hole 31 without finishing the processing dimensions of the bottomed hole 31 and the modifying tip 20 with high accuracy.

  As described above in detail, according to the assembling apparatus 10 according to the present embodiment, the upper die 11 having the lower surface 11b formed in a substantially spherical shape and the lower die 12 having the upper surface 12a formed in a substantially spherical shape. Then, the magnetic steel sheet 30 with the bottomed hole 31 formed is sandwiched and elastically deformed, and the chip 20 for modification is placed in the bottomed hole 31 by the chip holder 13 in a state where the bottomed hole 31 is expanded. Then, the upper die 11 is separated from the lower die 12, the deformation of the electromagnetic steel sheet 30 is restored, and the reforming tip 20 is assembled to the bottomed hole 31. Therefore, the workability of assembling the reforming tip 20 into the bottomed hole 31 can be greatly improved, and the reforming tip 20 can be fitted into the bottomed hole 31 by an interference fit.

  Further, since the sphere R on the upper surface 12a of the lower mold 12 is set within the elastic deformation limit so that it does not plastically deform when the electromagnetic steel sheet 30 is sandwiched between the upper mold 11 and the lower mold 12, the electromagnetic steel sheet 30 is It is possible to reliably prevent the electromagnetic steel sheet 30 from being plastically deformed when sandwiched between the upper mold 11 and the lower mold 12 and deformed. Thereby, when the upper die 11 is separated from the lower die 12, the deformation of the electromagnetic steel sheet 30 surely returns to the original state, so that the reforming tip 20 can be firmly assembled in the bottomed hole 31.

  It should be noted that the above-described embodiment is merely an example and does not limit the present invention in any way, and various improvements and modifications can be made without departing from the scope of the invention. For example, in the above-described embodiment, the case where the present invention is applied when assembling the reforming chip into the bottomed hole of the electromagnetic steel sheet is exemplified, but the modification is applied to the bottomed hole of a plate-like member other than the electromagnetic steel sheet. The present invention can be applied even when a thin plate member other than a chip is assembled.

In the above-described embodiment, the lower mold 12 is fixed and the upper mold 11 is operated. Conversely, the upper mold 11 may be fixed and the lower mold 12 may be operated. .
Furthermore, in the above-described embodiment, the upper mold 11 is a concave mold and the lower mold 12 is a convex mold. However, when assembling the reforming chip from below, the upper mold 11 is a convex mold and the lower mold 12 is It can also be concave.

  In the embodiment described above, the diameter of the bottomed hole 31 is the same as the diameter of the reforming chip 20, but the diameter of the bottomed hole 31 is slightly smaller than the diameter of the reforming chip 20. Also good. As a result, the reforming tip 20 can be securely fitted into the bottomed hole 31 with an interference fit. As a result, it is possible to prevent the reforming chip 20 from dropping or shifting in the post-process, and to improve workability and productivity.

  Furthermore, in the above-described embodiment, the case of assembling the reforming tip 20 having a thickness equal to the depth of the bottomed hole 31 is illustrated, but as shown in FIG. 5, the thickness is thicker than the depth of the bottomed hole 31. The present invention can be applied even when the modification chip 20a is assembled.

DESCRIPTION OF SYMBOLS 10 Assembling apparatus 11 Upper mold | type 11b Lower surface 12 Lower mold | type 12a Upper surface 13 Tip holder 18 Through hole 19a Through hole 20 Reforming chip 30 Electrical steel plate 31 Bottomed hole

Claims (4)

In the assembling apparatus for assembling the thin plate member in the bottomed hole formed in the plate-like member,
A mating surface is formed in a substantially spherical shape, and a convex shape and a concave shape sandwiching the plate-like member,
A chip holding member for holding the thin plate member and disposing the held thin plate member in the bottomed hole in a state where the plate-like member is sandwiched between the convex and concave molds;
Have
A thin plate member assembling apparatus, wherein a through hole through which the chip holding member can pass is formed at the center of the concave mold. In the assembly apparatus of the thin plate member according to claim 1,
The apparatus for assembling a thin plate member, wherein the convex sphere R is set to be elastically deformed when the plate member is sandwiched between the convex shape and the concave shape. In the assembly apparatus of the thin plate member according to claim 1 or 2,
The tip holding member insertion side end surface of the through hole has a conical chamfer,
A thin plate member assembling apparatus, wherein a diameter of the chip holding member is the same as a diameter of the thin plate member. In the assembly method of assembling the thin plate member in the bottomed hole formed in the plate-like member,
The plate member is sandwiched between a convex shape and a concave shape with a mating surface formed in a substantially spherical shape, and the bottom plate hole is expanded and deformed within the elastic limit of the plate-like member, and the thin plate member is A method of assembling a thin plate member, characterized by being assembled in a hole.

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