JP2011054374A - Conductor cable and its molding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductor cable which has a proper strength and can be deformed freely, and can hold the deformed shape as it is. <P>SOLUTION: The conductor cable has a core material 4 which has conductivity and in which a plurality of wire rods 5 are braided and a covering material 6 which covers the core material 4 and has a melting point lower than the core material. The covering material 6 holds the shape after deforming the braided core material 4 in a desired shape by solidifying after melting by heat treatment. The covering material 6 is formed so as to cover one by one the outer circumference of the wire rod to constitute the core material 4. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a conductor cable disposed on a wiring board and the like and a forming method thereof.

  In a conductor cable for electrically connecting electrodes provided on a card on which electronic components are mounted or between the cards, the thickness of the cable used for the power supply system is determined according to the amount of current. A cable that carries a large current has a thick conductor and is not easy to bend. As a conductor cable that is easy to bend, there is a net-like cable in which a thin wire conductor is knitted so as to form a belt shape (Patent Document 1). However, if the conductor is left exposed, there is a risk of short-circuiting due to contact with other conductor cables, components, and housings. Therefore, such a net-like cable is generally covered with an insulating material. is there.

  However, the conductor cable impairs the flexibility by providing the insulating coating. In addition, since stress is accumulated in the insulating coating at the bent portion and a force for returning the bent acts, it is difficult to hold the conductor cable while bending it into a desired shape.

  Therefore, as shown in FIG. 13, a metal bar 24 obtained by processing a metal plate having good conductivity, for example, a copper plate, into a desired shape can be used as an alternative structure of the cable. The metal bar 24 is disposed so as to be spaced between the mounting components 22 provided on the wiring board 21, and is connected to the electrode 23.

  Patent Document 2 discloses a configuration of a conductor cable in which the outer periphery of a solder ribbon core inserted inside is covered with a meshed cable.

  Patent Document 3 discloses a configuration of a conductor cable in which the outer circumferences of a plurality of coaxial wires are collectively connected by solder.

Japanese Patent Laid-Open No. 2005-174689 Japanese Patent Application Laid-Open No. 08-249928 JP 2003-123555 A

  However, the metal bar 24 shown in FIG. 13 needs to be processed into a desired shape in advance. For this reason, the same metal bar 24 cannot be used in a wiring board in which the positions where the electrodes 23 are arranged are different, and it is necessary to individually design and manufacture them, which has drawbacks in terms of manufacturing cost and lead time. It was.

  Further, in the conductor cable disclosed in Patent Document 2, when the internal solder is melted by heat treatment, the internal solder flows into the meshed cable covering the outer periphery, and the inside becomes hollow. For this reason, the conductor cable disclosed in Patent Document 2 cannot secure sufficient strength of the conductor cable after melting the solder.

  Further, in the conductor cable disclosed in Patent Document 3, since a plurality of coaxial wires are integrated and covered with solder, the conductor cable cannot be bent into an arbitrary shape before melting the solder. .

  Therefore, the present invention has been made for such a problem, and provides a conductor cable having sufficient strength and capable of holding the shape while being bent into an arbitrary shape. With the goal.

  The conductor cable according to the present invention has a conductive core material in which a plurality of wires are meshed, and a covering material that covers the core material and has a lower melting point than the core material. The covering material is solidified after being melted by heat treatment, so that the shape of the netted core material is maintained while being deformed into a desired shape.

  In addition, the method for forming a conductor cable according to the present invention includes a conductive core material in which a plurality of wires are meshed, and a covering material that covers the core material and has a lower melting point than the core material. A method for forming a conductor cable, wherein the covering material is solidified after being melted by heat treatment in a state where the conductor cable is deformed into a desired shape.

  According to the conductor cable according to the present invention, it is possible to provide a conductor cable having sufficient strength and capable of holding the shape while being bent into an arbitrary shape.

FIG. 3 is a diagram illustrating a configuration example of a conductor cable according to the first embodiment. It is II-II sectional drawing of FIG. It is a figure which shows the state before forming the coating | covering material 6 of the conductor cable concerning Embodiment 2. FIG. It is IV-IV sectional drawing of FIG. It is a figure which shows the state after forming the coating | covering material 6 of the conductor cable concerning Embodiment 2. FIG. It is VI-VI sectional drawing of FIG. 1 is a perspective view showing an overall configuration of a conductor cable 1 according to a first embodiment. It is a figure which shows the cross section of the one wire 5 among the several wire 5 which comprises the net-like cable 2 of the conductor cable 1 concerning Embodiment 1. FIG. It is a figure which shows the state before bending the conductor cable 1 concerning Embodiment 1 to a desired shape. It is a figure which shows the state after the conductor cable 1 concerning Embodiment 1 is bent by the desired shape. It is a figure which shows the state after melt | dissolving the coating | covering material 6 in the state which bent the conductor cable 1 concerning Embodiment 1. FIG. It is a perspective view of the wiring board 13 with which the conductor cable 1 concerning Embodiment 1 was mounted. It is a perspective view which shows the wiring board 21 with which the conventional metal bar 24 was mounted.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the invention will be described with reference to the accompanying drawings. The conductor cable according to the embodiment of the present invention has a conductive core material in which a plurality of wires are meshed, and a covering material that covers the core material and has a lower melting point than the core material. Yes. The covering material is configured to be solidified after being melted by the heat treatment so that the meshed core material is held in a desired shape while being deformed.

  As a specific configuration of such a conductor cable, FIGS. 1 and 2 show the conductor cable according to the first embodiment of the present invention, and FIGS. 3 to 6 show the conductor cable according to the second embodiment. .

  1 is a plan view of a conductor cable 1 according to Embodiment 1, and FIG. 2 is a cross-sectional view taken along the line II-II in FIG. As shown in FIG. 1, in the first embodiment, a plurality of rod-like wire rods 5 are knitted in a net shape to constitute a core member 4. Here, the core material 4 shall show the aggregate | assembly of the wire 5 in which the coating | covering material 6 is not formed. In Embodiment 1, the coating | covering material 6 which covers the core material 4 is formed in the outer periphery of each one of the wire 5 as shown in FIG. The entire core material 4 on which the covering material 6 is formed is referred to as a reticulated cable 2.

  On the other hand, in Embodiment 2, the covering material 6 is not formed on each wire 5 but is formed so as to cover the entire core material 4. 3 and 4 show a plan view and a sectional view of the conductor cable according to the second embodiment before the covering material 6 is formed, and FIGS. 5 and 6 show the covering material 6 formed. The top view and sectional drawing of the state after having performed are shown.

  As shown in FIGS. 3 and 4, the wire 5 of the conductor cable according to the second embodiment is knitted in a mesh shape as in the first embodiment. The core material 4 is formed by braiding a plurality of wires 5. As shown in FIGS. 5 and 6, the core material 4 formed in this way has a covering material 6 formed on the entire core material 4 so as to integrate a plurality of knitted wire materials 5. .

  Here, the coating material 6 is formed so thin that the core material 4 can be bent. In FIG. 5, the covering material 6 is formed on the entire core material 4, but it is not necessary to form the covering material 6 on the entire core material 4, and the covering material 6 is formed only on the bent portion described later. It is also possible to do. Thereby, the coating | covering material 6 can be formed only in a required location according to the shape of the wiring board to mount.

  Embodiment 1 and Embodiment 2 shown above differ only in the place where the covering material 6 is formed, and the forming method and installation method of the conductor cable are substantially the same. Therefore, in the following, the present invention will be described in detail below with the first embodiment as an example.

Embodiment 1 FIG.
FIG. 7 is a diagram showing an overall configuration of the conductor cable 1 according to Embodiment 1 of the present invention. The conductor cable 1 includes a mesh cable 2 shown in FIGS. 1 and 2 and terminals 3 provided at both ends of the mesh cable 2. The reticulated cable 2 can flow a large current by weaving a plurality of wires 5. The reticulated cable 2 can move the wires 5 to some extent by the configuration in which the wires 5 are knitted. Therefore, the net-like cable 2 has excellent flexibility and flexibility.

  The net-like cable 2 is formed in a band shape. Therefore, the reticulated cable 2 is easy to bend in the direction in which the band is folded, and is difficult to bend in the direction in which the band is twisted. Thereby, as will be described later, when the conductor cable 1 is installed on the wiring board, it is only necessary to support the conductor cable 1 in one direction that is easily bent, and therefore, there is an advantage that the wiring board can be easily mounted. In addition, the shape of the mesh cable 2 does not need to be formed in a strip shape, and can be formed in an arbitrary shape. For example, the net-like cable 2 can also knit a wire in a string shape.

  Terminals 3 are attached to both ends of the mesh cable 2. The terminal 3 is preferably made of a material having excellent electrical conductivity such as copper or brass. As the terminal 3, for example, a structure in which the mesh cable 2 is sandwiched and crimped, or a structure in which the terminal 3 is fixedly connected by soldering is employed.

  FIG. 8 is a cross-sectional view of one wire 5 constituting the mesh cable 2. As described with reference to FIGS. 1 and 2, in the first embodiment, the covering material 6 is applied to the outer periphery of one wire 5. The thick reticulated cable 2 shown in FIG. 7 is formed by braiding the wire 5 with the covering material 6 into a reticulated shape.

  What is necessary is just to set the thickness of one of the wire 5 which comprises the net-like cable 2, and the number of weaving according to the amount of current required. For example, when the diameter of the wire 5 is 0.26 mm and 104 wires are knitted and bundled, the thickness is equivalent to # 8 in AWG (American Wire Gauge) widely used to indicate the thickness of the conductor.

  The wire 5 can be comprised by a copper fine wire, for example. The diameter of the wire 5 is preferably thinner so that the conductor cable 1 can be bent easily, but it is necessary to ensure a certain thickness in order to reduce resistance. Therefore, it is preferable that the diameter of the wire 5 is about 0.1 mm to 1 mm so as to satisfy all the conflicting conditions.

  Each wire 5 is provided with a covering material 6 of about 30 to 50 μm so that sufficient strength can be secured after melting the covering material 6. As described above, the covering material 6 has a melting point lower than the melting point of the internal wire 5. The covering material 6 is preferably a conductor in order to reduce the resistance value of the conductor cable 1.

  Specifically, solder plating can be used for the covering material 6. More specifically, lead-free solder containing no lead is preferable as the covering material 6 as environmental resistance, and it is preferable to select Sn—Cu based solder that is generally used.

  Next, a method for forming the conductor cable 1 configured as described above will be described. FIG. 9 is a diagram illustrating a state before the conductor cable 1 according to the first embodiment is bent into a desired shape. The mesh cable 2 of the conductor cable 1 has flexibility so that it can be bent into an arbitrary shape. As shown in FIG. 10, the conductor cable 1 can be bent at an arbitrary location (bending portion 10) in the direction in which the band is folded.

  When the electrodes of the card on which the electronic component is mounted or between the electrodes of different cards can be connected in a straight line, a metal member or a cable having no flexibility can be easily connected. However, when the electrodes to be connected are not on a straight line, the reticulated cable 2 that is freely bent is effective. Specifically, the reticulated cable 2 is bent into an arbitrary shape so as to avoid protrusions of card components and protrusions of the casing, and the conductor cable 1 is wound on the wiring board.

  Here, as shown in FIG. 10, in a state where the reticulated cable 2 is bent at an arbitrary position, a force acts to return the wire 5 and the covering material 6 of the bent portion 10 to the original state. For this reason, the bent position of the conductor cable 1 varies, and there is a risk of contact with an electronic component or a housing or contact with another cable, which may cause a problem such as an electrical short. Therefore, heat is applied to the bent portion 10 to melt the covering material 6 applied to the surface of the wire 5 of the mesh cable 2.

  Here, when the material of the covering material 6 is Sn-0.7 wt% Cu, the melting point of Sn-0.7 wt% Cu is about 230 ° C. Therefore, at least the entire bent portion 10 is heated to 240 to 250 ° C., which is higher than the melting point of the covering material 6 and lower than the melting point of the wire 5. Then, the covering material 6 on the surface of the wire 5 is melted, and the heating portion of the mesh cable 2 is covered with the material of the melted covering material 6. Thereafter, the mesh cable 2 is cooled, and the covering material 6 is solidified. In addition, the part which heat-processes should just contain the bending part 10 at least, and may heat the whole. In FIG. 11, the conductor cable 1 after performing said heat processing with respect to the whole shall be shown.

  In the reticulated cable 2 after the heat treatment shown in FIG. 11, the adjacent wire members 5 are integrated by the covering member 6 in a bent state. Since the wire 5 is hardly melted by the heat treatment, it tries to restore the original shape from the bent state, but the coating material 6 solidified after melting by the heat treatment maintains the shape after deformation. At last. For this reason, the restoration of the wire 5 is prevented by the covering material 6, and the conductor cable 1 is held while being bent into a desired shape.

  Next, a mounting example of the conductor cable 1 according to the first embodiment molded in this way will be described. As shown in FIG. 12, the conductor cable 1 is mounted on a wiring board 13 or the like. Many mounting components 14 are mounted on the wiring board 13. When the electrodes 15 on the substrate are connected by a cable or the like, the conductor cable 1 needs to be wound so as to avoid the mounting component 14 as shown in the figure.

  Since the conductor cable 1 according to Embodiment 1 can be bent before the heat treatment of the covering material 6, the gap between the mounted components 14 can be freely broken. In this state, the mesh cable 2 can be held in a desired shape by melting the coating material 6 by heating the mesh cable 2 and then solidifying it. As a result, a predetermined gap can be secured between the mesh cable 2 and the mounted component, and a short circuit due to both members can be prevented.

  In addition, as a heating method for melting the covering material 6, a method of adding hot air or heating with a far infrared heater is preferable. In addition, when a desired shape is determined in advance, it is also effective to fit the conductor cable 1 in a heat-resistant molding die having a groove in the shape to be molded and to heat the whole to the solder melting temperature.

  Then, the effect of the conductor cable 1 which concerns on Embodiment 1 is demonstrated. The conductor cable 1 according to the first embodiment has a net-like cable 2 in which a wire 5 is knitted. Since the wire 5 can move to some extent when the conductor cable 1 is bent, the mesh cable 2 has good flexibility. Thereby, the conductor cable 1 can be bent into a desired shape, and can be deformed into an arbitrary shape according to the wiring board 13 to be mounted.

  In addition, since the coating material 6 is applied to the wire 5, by performing a heat treatment on the bent portion 10, the coating material 6 is temporarily melted, and then the bent portion 10 is solidified. The shape of the conductor cable 1 can be maintained while being bent into a desired shape.

  Moreover, since sufficient coating | covering material 6 is given to the outer periphery of the wire 5, the wire 5 can be hold | maintained with a desired shape by solidifying after the coating | covering material 6 melt | dissolves. Therefore, sufficient strength of the conductor cable 1 can be ensured even after the conductor cable 1 is formed into a desired shape.

  Moreover, since the coating | covering material 6 is distribute | arranged to the wire 5 one by one, after the coating | melting of the coating | covering material 6, the coating | covering material 6 is uniformly formed in the netting wire 5. FIG. Further, by covering the wire 5 with the covering material 6 one by one, a sufficient amount of the covering material 6 is maintained while maintaining a high flexibility as compared with the case where the covering material is formed on the entire wire rod 5 that is meshed. Can be arranged.

  Thus, when the conductor cable 1 according to the first embodiment is arranged on the wiring board 13 shown in FIG. 12, the electrodes 15 that are not on a straight line can be easily connected with a bendable configuration. . Moreover, since the shape of the bending part 10 is hold | maintained by the coating | covering material 6 which solidified the conductor cable 1 after melting, there is no danger that a conductor part contacts an electronic component or a housing | casing. In addition, the conductor cable 1 is provided with a sufficient covering material 6 to ensure sufficient strength even after being formed into a desired shape, and the reliability of the wiring board 13 can be improved.

  In addition, the heat treatment is preferably performed at a lower temperature and in a shorter time so as not to affect the other mounted components 14. However, since the melting point of the covering material 6 is lower than the melting point of the wire material 5, the wire material 5 is deformed. The shape of the wire 5 can be deformed to a desired shape by performing the heat treatment at a temperature sufficient to deform the coating material 6 without performing the heat treatment at such a high temperature.

Modified example.
When the covering material 6 is configured by solder plating in the first embodiment, in the step of melting the covering material 6 of the reticulated cable 2, the surface of the covering material 6 is heated by hot air heating or far-infrared heater heating in the atmosphere. Depending on the oxidation state, a good solder melting state may not be obtained. Therefore, a flux having a function of removing the oxide film on the solder surface is preliminarily applied and penetrated into the reticulated cable 2 when the solder is heated and melted.

  Thereby, the favorable melting state of the covering material 6 can be obtained at the time of heating and melting. Further, by passing through a good melting state of the covering material 6, it becomes possible to integrate the wire material 5 with good solder even after cooling. In addition, this problem can be solved also by providing the process of apply | coating a liquid flux at the time of a heating, without carrying out the application | coating penetration of a flux previously.

  Note that the present invention is not limited to the above-described embodiment, and can be modified as appropriate without departing from the spirit of the present invention.

  In the conductor cable 1 according to the first embodiment, the covering material 6 is formed on all of the wire members 5 that are meshed. However, the covering material 6 is formed in the wire material 5 that is meshed. It is sufficient that the wire 5 is included. For example, the structure in which the covering material 6 is formed only on the half wire 5 may be used.

  In the conductor cable 1 according to the first embodiment described above, the covering material 6 has been described using a conductor as an example. However, the covering material 6 may be a non-conductor. Specifically, a resin or the like can be used as the covering material 6. Since the resin has a lower melting point than solder plating or the like, it is not necessary to heat the conductor cable 1 at a high temperature. Therefore, when the conductor cable 1 is disposed on the wiring board 13, it is possible to reduce the influence on other mounting components 14 caused by the heat treatment.

  Note that the modification example of the first embodiment described above can also be applied to the second embodiment.

DESCRIPTION OF SYMBOLS 1 Conductor cable 2 Reticulated cable 3 Terminal 4 Core material 5 Wire material 6 Cover material 10 Bending part 13, 21 Wiring board 14, 22 Mounting component 15, 23 Electrode 24 Metal bar

Claims (19)

A core material having conductivity and a plurality of wire rods meshed;
Covering the core material and having a lower melting point than the core material,
The said covering material is a conductor cable which solidifies after melting | dissolving by heat processing, and hold | maintains the said shape, deform | transforming the said core material cored into the desired shape.   The conductor cable according to claim 1, wherein the covering material is formed so as to cover the outer periphery of the wire material constituting the core material one by one.   The conductor cable according to claim 1, wherein the covering material is formed so as to cover the entirety of the core material that is meshed.   The conductor cable according to claim 1, wherein the covering material has conductivity.   The conductor cable according to claim 1, wherein the covering material is solder.   The conductor cable according to claim 5, wherein a flux is applied to the covering material.   The conductor cable according to any one of claims 1 to 6, wherein a terminal for connecting the conductor cable to an external electronic component is provided at an end of the conductor cable.   The conductor cable according to claim 1, wherein the core material is formed in a band shape.   The conductor cable according to claim 1, wherein the wire has a diameter of 0.1 mm to 1 mm.   The conductor cable according to claim 1, wherein the covering material has a thickness of 30 to 50 μm. A method for forming a conductor cable comprising: a core material having conductivity and a plurality of wire rods, and a covering material covering the core material and having a melting point lower than that of the core material,
With the conductor cable deformed into a desired shape, the coating material is melted by heat treatment, and then the coating material is solidified.
A method for forming a conductor cable. The method for forming a conductor cable according to claim 11, wherein the covering material is solidified by cooling the covering material. The method for forming a conductor cable according to claim 11 or 12, wherein a temperature of the heat treatment is lower than a melting point of the core material and higher than a melting point of the covering material. The method for forming a conductor cable according to any one of claims 11 to 13, wherein the heat treatment is performed only on a deformed portion of the conductor cable. The method for forming a conductor cable according to claim 11, wherein the heat treatment is performed on the entire conductor cable including a deformed portion of the conductor cable. The method for forming a conductor cable according to claim 11, wherein the heat treatment is performed by applying hot air or heating with a far infrared heater. On the wiring board on which the conductor cable is installed, the conductor cable is deformed into a desired shape by being bent and installed,
The method for forming a conductor cable according to any one of claims 11 to 16, wherein the heat treatment is performed on at least a deformed portion of the conductor cable. By fitting the conductor cable into the mold, the conductor cable is transformed into a desired shape,
The method for forming a conductor cable according to claim 11, wherein the heat treatment is performed on at least a deformed portion of the conductor cable.   The method of forming a conductor cable according to any one of claims 11 to 18, wherein the covering material is formed so as to cover the outer circumference of the wire constituting the core material one by one.

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