JP2011049396A - Wiring substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a means to reduce the physical size of a mounting structure while favorably grasping the temperature state of an electronic component at a better level. <P>SOLUTION: A wiring substrate 3 comprises: a laminated body 7 including a plurality of insulating layers 13 and wiring L2; a mounting region disposed on the upper surface of the laminated body 7 to which an electronic component 2 is mounted; first to fourth connection pads 9 disposed outside the mounting region. The wiring has a measuring area, a first connection region that electrically connects one edge of the measuring area to the first connection pad, a second connection region that electrically connects one edge of the measuring area to the second connection pad, a third connection region that electrically connects the other edge of the measuring area to the third connection pad, and a fourth connection region that electrically connects the other edge of the measuring area to the fourth connection pad. Furthermore, at least part of the measuring area is disposed immediately under the mounting region. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a wiring board used for electronic equipment (for example, various audiovisual equipment, home appliances, communication equipment, computer equipment and peripheral equipment).

  2. Description of the Related Art Conventionally, as a mounting structure in an electronic device, an electronic component mounted on a wiring board is used.

  Patent Document 1 discloses a mounting structure including a wiring board, an electronic component mounted on the wiring board, and a temperature measuring means of any one of a diode, a thermistor, and a thermocouple disposed on the surface of the electronic component. Are listed.

  As described above, in order to obtain a mounting structure capable of measuring the temperature of the electronic component, when the mounting structure is provided with temperature measuring means, the components of the mounting structure increase, and the mounting structure is likely to be enlarged.

JP 2006-114575 A

  The present invention provides a wiring board that meets the demand for downsizing a mounting structure while better grasping the temperature state of an electronic component.

  A wiring board according to an embodiment of the present invention includes a stacked body including a plurality of insulating layers and wiring portions, a mounting area provided on an upper surface of the stacked body, on which an electronic component is mounted, and provided outside the mounting area. First to fourth external connection pads, and the wiring section includes a measurement region, a first connection region electrically connected to one end of the measurement region and the first external connection pad, and the measurement region. A second connection region in which the one end and the second external connection pad are electrically connected; a third connection region in which the other end of the measurement region and the third external connection pad are electrically connected; and the measurement region And the fourth connection region electrically connecting the other end and the fourth external connection pad, and at least a part of the measurement region is disposed immediately below the mounting region.

  According to the wiring board according to one embodiment of the present invention, the temperature state of the electronic component can be satisfactorily grasped by measuring the potential difference in the measurement region provided immediately below the mounting region of the electronic component. As a result, the temperature state of the electronic component can be satisfactorily grasped, and a wiring board constituting a small mounting structure can be obtained.

FIG. 1A is a top view of the mounting structure according to the first embodiment of the present invention seen through the electrode pad, and FIG. 1B is a cross-sectional view taken along the line I-I in FIG. 1A. 2a is a cross-sectional view taken along the line II-II in FIG. 1a, and FIG. 2b is a cross-sectional view showing an enlarged main part (region surrounded by a solid line) of the mounting structure shown in FIG. 2a. It is the top view which saw through the conductive layer containing the measurement area | region of the wiring board contained in the mounting structure shown to FIG. 1a. FIG. 4A is a cross-sectional view of the mounting structure according to the second embodiment of the present invention, and FIG. 4B is an enlarged cross-sectional view of the main part (region surrounded by a solid line) of the mounting structure shown in FIG. 4A. It is. It is the top view which saw through the conductive layer containing the measurement area | region of the wiring board contained in the mounting structure which concerns on 3rd Embodiment of this invention. 6a is a cross-sectional view of the mounting structure taken along line III-III in FIG. 5, and FIG. 6b is an enlarged cross-sectional view showing the main part (region surrounded by a solid line) of the mounting structure shown in FIG. 6a. It is. It is the top view which saw through the conductive layer containing the measurement area | region of the wiring board contained in the mounting structure which concerns on 4th Embodiment of this invention.

(First embodiment)
Hereinafter, a mounting structure including a wiring board according to a first embodiment of the present invention will be described in detail based on the drawings.

  The mounting structure 1 shown in FIGS. 1 to 3 is used for electronic devices such as various audiovisual devices, home appliances, communication devices, computer devices or peripheral devices thereof. The mounting structure 1 includes an electronic component 2 and a wiring board 3.

  The electronic component 2 is a semiconductor element such as an IC or LSI, and is flip-chip mounted on the wiring board 3 via bumps 4. The base material of the electronic component 2 is formed of a semiconductor material such as silicon, germanium, gallium arsenide, gallium arsenide phosphorus, gallium nitride, or silicon carbide. As the electronic component 2, for example, an average thickness, that is, an average thickness value of 0.1 mm or more and 1 mm or less can be used.

  The bump 4 is made of a conductive material such as solder including lead, tin, silver, gold, copper, zinc, bismuth, indium, or aluminum, and has a thermal conductivity of, for example, 10 W / (m · K) or more and 450 W. / (M · K) or less. Such thermal conductivity conforms to JIS R1611-11997.

  The wiring substrate 3 includes a laminated body 7 including a core substrate 5 and a pair of build-up portions 6 formed on both sides of the core substrate 5, a plurality of electrode pads 8 formed on the upper surface of the laminated body 7, and a laminated body 7 includes a plurality of external connection pads 9 formed on the lower surface of 7, and a mounting region M formed on the upper surface of the stacked body 7.

  The core substrate 5 is intended to increase the strength of the wiring substrate 3 while achieving conduction between the pair of build-up portions 6 and has an average thickness of, for example, 0.3 mm to 1.5 mm. The core substrate 5 includes a base body 10, a through-hole conductor 11, and an insulator 12.

  The substrate 10 is formed of, for example, resin. Examples of the resin include epoxy resin, bismaleimide triazine resin, cyanate resin, polyparaphenylene benzbisoxazole resin, wholly aromatic polyamide resin, polyimide resin, aromatic liquid crystal polyester resin, poly Ether ether ketone resin or polyether ketone resin can be used. Further, the base 10 may include a base material coated with a resin. As the base material, a woven fabric or a non-woven fabric composed of fibers or a fiber in which fibers are arranged in one direction can be used. As the fiber, for example, glass fiber, resin fiber, carbon fiber or metal fiber can be used.

  Further, the coefficient of thermal expansion of the substrate 10 is set to, for example, 1 ppm / ° C. or more and 16 ppm / ° C. or less. Such a coefficient of thermal expansion conforms to ISO11359-2: 1999. Further, the thermal conductivity of the base 10 is set to 1 W / (m · K) or less, for example.

  A plurality of through-hole conductors 11 penetrating the base body 10 in the thickness direction (Z direction) are formed in the base body 10 in a cylindrical shape. The through-hole conductor 11 is for electrically connecting the upper and lower buildup portions 6 of the core substrate 5 and uses, for example, one formed of a conductive material such as copper, silver, gold, aluminum, nickel, or chromium. The thermal conductivity is set to, for example, 10 W / (m · K) or more and 450 W / (m · K) or less.

  An insulator 12 is formed in a columnar shape inside the cylindrical through-hole conductor 11. The insulator 12 forms a support surface of a via conductor 15 to be described later. For example, a resin such as a polyimide resin, an acrylic resin, an epoxy resin, a cyanate resin, a fluorine resin, a silicon resin, a polyphenylene ether resin, or a bismaleimide triazine resin. What was formed with the material can be used.

  On the other hand, as described above, a pair of build-up portions 6 are formed on both sides of the core substrate 5. The build-up unit 6 includes a plurality of insulating layers 13, a plurality of conductive layers 14 formed on the base 10 or between the insulating layers 13 or on the insulating layer 13, a plurality of via conductors 15 penetrating the insulating layer 13, Is included.

  The plurality of insulating layers 13 not only function as a support member that supports the conductive layer 14, but also function as an insulating member that prevents a short circuit between the conductive layers 14, and have an average thickness of, for example, 10 μm or more and 30 μm or less. Is formed. Examples of the insulating layer 13 include epoxy resin, bismaleimide triazine resin, cyanate resin, polyparaphenylene benzbisoxazole resin, wholly aromatic polyamide resin, polyimide resin, aromatic liquid crystal polyester resin, polyether ether ketone resin, or polyether ketone. A resin formed from a resin material such as a resin can be used. The thermal expansion coefficient is set to, for example, 0 ppm / ° C. or more and 40 ppm / ° C. or less, and the thermal conductivity is, for example, 1 W / (m · K) or less. Is set.

  The plurality of conductive layers 14 are spaced apart from each other in the thickness direction and are disposed on the base 10 and the insulating layer 13 with a gap therebetween, and the average thickness is set to, for example, 3 μm or more and 20 μm or less. As the conductive layer 14, for example, a layer formed of a metal material such as copper, silver, gold, aluminum, nickel, or chromium can be used, and the coefficient of thermal expansion is set to, for example, 14 ppm / ° C. or more and 18 ppm / ° C. or less. The thermal conductivity is set to, for example, 10 W / (m · K) or more and 450 W / (m · K) or less.

  The via conductor 15 that is electrically connected to the conductive layer 14 connects the conductive layers 14 that are spaced apart from each other in the thickness direction, and is formed in a column shape that becomes narrower toward the core substrate 5. . As the via conductor 15, for example, one formed of a conductive material such as copper, silver, gold, aluminum, nickel, or chromium can be used, and the thermal expansion coefficient is set to, for example, 14 ppm / ° C. or more and 18 ppm / ° C. or less, The thermal conductivity is set to, for example, 10 W / (m · K) or more and 450 W / (m · K) or less.

  The core substrate 5 and the pair of buildup portions 6 described above constitute a laminate 7, and a plurality of layers are formed on the upper surface of the laminate 7, that is, on the upper surface of the buildup portion 6 located above the core substrate 5. The electrode pad 8 is formed. The plurality of electrode pads 7 function as a support portion of the electronic component 2 and an electrical connection portion with the electronic component 2, and are formed in a circular shape, for example, in plan view. As the electrode pad 8, the same material as that of the conductive layer 14 described above in terms of the constituent material, thickness, thermal expansion coefficient, or the like can be used. The plurality of electrode pads 8 are arranged so as to be square, for example.

  The electronic component 2 is mounted on the plurality of electrode pads 7 via the bumps 4, and the plurality of electrode pads 7 constitute a mounting region M of the electronic component 2 on the upper surface of the multilayer body 7. That is, as shown in FIG. 4, the mounting region M is a region surrounded by an imaginary line I connecting the outside of the electrode pads 8 located on the outermost periphery among the plurality of electrode pads 8 arranged.

  A plurality of external connection pads 9 are formed on the lower surface of the laminate 7, that is, on the lower surface of the buildup portion 6 located below the core substrate 5. The plurality of external connection pads 9 function as electrical connection portions with an external circuit, and are formed, for example, in a circular shape in plan view. As the external connection pad 9, the same material as that of the conductive layer 14 described above in terms of the constituent material, thickness, thermal expansion coefficient, or the like can be used. The external connection pad 9 includes a first external connection pad 9a, a second external connection pad 9b, a third external connection pad 9c, and a fourth external connection pad 9d.

  By the way, the through-hole conductor 11, the conductive layer 14, and the via conductor 15 are electrically connected to each other to form a wiring portion, and the multilayer body 7 includes the wiring portion. The wiring part has a first wiring part L1 and a second wiring part L2.

  As shown in FIG. 2, the first wiring portion L1 electrically connects the electrode pad 8 and the external connection pad 9, and functions as a ground wiring, a power supply wiring, and / or a signal wiring. Is.

  On the other hand, in the wiring board 3 of the present embodiment, as shown in FIGS. 3 and 4, the second wiring portion L2 includes the first external connection pad 9a, the second external connection pad 9b, the third external connection pad 9c, and The four terminals of the fourth external connection pad 9d are electrically connected.

  The conductive layer 14 constituting the second wiring portion L includes a measurement region 11a, a first connection region 11b1, a second connection region 11b2, a third connection region 11b3, and a fourth connection region 11b4.

  The measurement region 11a is an elongated region having one end 11a1 and the other end 11a2, and is linear. A first connection region 11b1 and a second connection region 11b2 are connected to one end 11a1 of the measurement region 11a, and a third connection region 11b3 and a third connection region 11b2 are connected to the other end 11a2 of the measurement region 11a. Has been.

  The first connection region 11b1 is for electrically connecting one end 11a1 of the measurement region 11a and the first external connection pad 9a. The second connection region 11b2 is for electrically connecting one end 11a1 of the measurement region 11 and the second external connection pad 9b. The third connection area 11b3 is for electrically connecting the other end 11a2 of the measurement area 11a and the third external connection pad 9c. The fourth connection area 11b4 is for electrically connecting the other end 11a2 of the measurement area 11a and the fourth external connection pad 9d.

  The second wiring portion L can measure the potential difference between the one end 11a1 and the other end 11b2 of the measurement region 11a by the four-terminal method using the above-described configuration. Furthermore, the temperature of the measurement region 11a can be calculated from the measured value of the potential difference in the measurement region 11a.

  The method for measuring the potential difference and temperature in the measurement region 11a using the four-terminal method can be specifically performed as follows.

  First, a power source and a potentiometer are prepared, the first external connection pad 9a and the third external connection pad 9c are electrically connected to the power source, and the second external connection pad 9b and the fourth external connection pad 9d are used as a potentiometer. Connect electrically.

  Next, a potentiometer is used while supplying a steady DC current to the first external connection pad 9a, the first connection region 11b1, the measurement region 11a, the third measurement region 11b3, and the third external connection pad 9c using a power source. Then, the potential difference between the second external connection pad 9b and the fourth external connection pad is measured. The steady current is set such that the current is, for example, 1 mA to 100 mA and the voltage is, for example, 1 V to 5 V.

  Here, since no current flows through the second connection region 11b2, the potential between the second external connection pad 9b and one end 11a1 of the first measurement region 11a is equipotential. Similarly, since no current flows through the fourth connection region 11b4, the fourth external connection pad 9d and the other end 11a2 of the first measurement region 11a are equipotential. Therefore, since the potential difference between the second external connection pad 9b and the fourth external connection pad can be regarded as the potential difference between the one end 11a1 and the other end 11a2 in the measurement region 11a, the potential difference in the measurement region 11a can be accurately determined. Can be measured.

  Next, the volume resistivity of the measurement region 11a is calculated from Equation 1 below using the measured value of the potential difference. In the measurement region 11a, Equation 1 represents the volume resistivity as ρ, the potential difference as V, the current as I, the length in the longitudinal direction (X direction) as L, and the width (Y direction) as W, The thickness in the vertical direction (Z direction) is T.

  Here, the volume resistivity is a value inherent to the substance and is proportional to the temperature. Therefore, the temperature can be calculated from the volume resistivity by specifying the material included in the measurement region. The material included in the measurement region can be specified by, for example, a conventionally known X-ray photoelectron analysis method.

  As described above, the wiring board 3 of the present embodiment can measure the potential difference in the measurement region 11a, and thus can grasp the temperature of the measurement region 11a.

  Incidentally, the conductive material constituting the bump 4 and the electrode pad 8 has a higher thermal conductivity than the resin material and the atmosphere. Therefore, when the mounting structure 1 is used, heat generated in the circuit inside the activated electronic component 2 is efficiently conducted to the wiring board 3 through the bumps 4 and the electrode pads 8.

  On the other hand, in the wiring board 3 of the present embodiment, at least a part of the measurement region 11a is disposed immediately below the mounting region M. Therefore, the heat generated in the circuit inside the electronic component 2 is efficiently conducted to the measurement region 11a immediately below the mounting region M through the bump 4 and the electrode pad 8 having high thermal conductivity. By grasping the temperature of the region 11a, the temperature of the electronic component 2 can be grasped satisfactorily. Moreover, since the temperature of the electronic component 2 can be grasped by the wiring board 3, the temperature of the electronic component 2 can be grasped without adding a temperature measurement component to the mounting structure 1. Therefore, the temperature in the electronic component 2 can be well grasped, and the small mounting structure 1 can be provided.

  Further, since there is no need to add a temperature measurement component to the mounting structure 1, for example, cracks in the electronic component 2 caused by arranging the temperature measurement means on the surface of the electronic component 2 can be reduced and reliability can be improved. An excellent mounting structure 1 can be provided.

  As shown in the drawing, at least a part of the measurement region 11a is preferably located immediately below the electrode pad 8. As a result, the measurement region 11a can be brought close to the electrode pad 8, and the heat generated in the circuit inside the electronic component 2 is efficiently conducted to the measurement region 11a via the electrode pad 8, so that the temperature of the electronic component 2 is increased. Can be better grasped.

  The electrode pad 8 in which the measurement region 11a is located immediately below is preferably the one closest to the centroid of the mounting region M in plan view among the plurality of electrode pads 8. As a result, the measurement region 11a can be brought close to the centroid in plan view of the mounting region M where heat is not easily dissipated, and thus the temperature of the electronic component 2 can be better understood.

  The electrode pad 8 in which the measurement region 11a is located immediately below is preferably the electrode pad 8 through which a high-frequency, high-speed transmission or large current flows among the plurality of electrode pads 8. As a result, the measurement region 11a can be brought close to the electrode pad 8 connected via the bump 4 to a circuit that generates a large amount of heat in the electronic component 2 due to high frequency, high-speed transmission, or a large current. It is possible to satisfactorily grasp the temperature of the part in the component 2 that becomes a high temperature.

  Here, when the electrode pad 8 in which the measurement region 11a is located immediately below is the signal electrode pad 8, it is desirable that the signal electrode pad 8 can transmit a clock signal. As a result, the measurement region 11a can be brought close to the electrode pad 8 connected via the bump 4 to the clock circuit that generates a large amount of heat due to the high frequency.

  More preferably, input / output data is transmitted to the signal electrode pad 8. As a result, the measurement region 11a can be brought close to the electrode pad 8 connected via the bump 4 to the data input / output circuit having a larger calorific value due to high-speed transmission and a large current.

  More preferably, the electrode pad 8 in which the measurement region 11a is located immediately below is the power supply electrode pad 8 for transmitting the power. As a result, the measurement region 11a is brought close to the power supply electrode pad 8 connected via the bump 4 to the power supply circuit in which a larger current flows in the electronic component 2 than the signal circuit and generates the largest amount of heat. As a result, the temperature at the highest temperature in the electronic component 2 can be detected with high sensitivity.

  The measurement region 11a is preferably formed in the build-up portion 6 formed on the upper surface of the core substrate 5. As a result, the measurement region 11a can be brought closer to the electronic component 2.

  The measurement region 11a is preferably formed on the lower surface of the uppermost insulating layer 13. As a result, the measurement region 11a can be brought closer to the electronic component 2.

  The measurement region 11a is preferably made of the same material as the first to fourth connection regions 11b1 to 11b4. As a result, when heat is applied to the wiring board 3, the thermal stress applied to the one end 11a1 and the other end 11a2 where the measurement region 11a and the first to fourth connection regions 11b1 to 4 are connected is reduced. The electrical reliability in the two wiring portions L2 can be improved.

  Further, it is desirable that the through-hole conductor 11, the conductive layer 14, and the via conductor 15 constituting the second wiring portion L2 are made of the same material as that of the first wiring portion L1. As a result, characteristics such as a coefficient of thermal expansion or rigidity in the wiring board 3 can be made more uniform, and distortion and warpage of the wiring board 3 can be reduced.

  Since the measurement region 11a has an elongated shape having one end 11a1 and the other end 11a2, the resistance value can be further increased. Therefore, since the resistance value and the potential difference are proportional to each other, by increasing the potential difference, it is possible to detect a change in the potential difference accompanying a temperature change in the measurement region 11a with high sensitivity, and thus improve the temperature of the electronic component 2 better. I can grasp it.

  The measurement region 11a is preferably smaller in width or thickness than the first to fourth measurement regions 11b1 to 11b. As a result, the resistance value of the measurement region 11a can be further increased.

  The measurement region 11a is desirably an elongated shape having a length set to 100 μm or more and 1000 μm or less, a width of 10 μm or more and 100 μm or less, and a thickness of 5 μm or more and 20 μm or less. As a result, the temperature of the electronic component 2 can be grasped satisfactorily.

  Thus, the mounting structure 1 described above exhibits a desired function by driving or controlling the electronic component 2 based on the power and signals supplied via the wiring board 3. Furthermore, since the temperature of the electronic component 2 at the time of operation can be grasped well, by controlling the electronic component 2 according to the temperature during the operation, failure of the electronic component 2 due to heat is reduced, and the mounting structure 1 reliability can be improved.

  Further, the mounting structure 1 described above, a current supply unit having the same function as the power source described above, a potential difference detecting unit having the same function as the above potentiometer, and the potential difference from the potential difference in the same manner as the temperature measuring method described above. The electronic device including the temperature calculation unit that calculates the electronic component 2 can control the electronic component 2 according to the operating temperature.

  In addition, an electronic device including the mounting structure 1, the current supply unit, the potential difference detection unit, and the electronic component control unit that controls the operation of the electronic component 2 using the potential difference measured by the potential difference detection unit, A function of reducing failure of the electronic component 2 due to heat can be provided.

  Next, a method for manufacturing the mounting structure 1 described above will be described.

  (1) The core substrate 5 is prepared. Specifically, this is performed as follows.

  First, for example, a plurality of resin sheets including an uncured resin and a base material are laminated, and the substrate 10 is produced by curing the uncured resin by heating and pressing. The uncured state is an A-stage or B-stage according to ISO 472: 1999. Next, a plurality of through holes penetrating the base body 10 in the thickness direction are formed by, for example, drilling or laser processing. Next, a cylindrical through-hole conductor 11 is formed by depositing a conductive material on the inner wall of the through-hole, for example, by electroless plating, vapor deposition, CVD, sputtering, or the like. Further, a conductive material layer is formed by depositing a conductive material on the upper surface and the lower surface of the substrate 10. Next, the inside of the cylindrical through-hole conductor 11 is filled with a resin material or the like to form the insulator 12. Next, after a conductive material is deposited on the exposed portion of the insulator 12, the conductive layer material layer is patterned by a conventionally known photolithography technique, etching, or the like to form the conductive layer.

  The core substrate 5 can be manufactured as described above.

  (2) A pair of build-up portions 6 are formed on both sides of the core substrate 5 and the electrode pads 8 and the external connection pads 9 are formed, whereby the wiring substrate 3 is manufactured. Specifically, this is performed as follows.

  First, an uncured resin is disposed on the conductive layer 14, and the insulating layer 13 is formed on the conductive layer 14 by further heating and curing the resin while heating and fluidly adhering the resin. Next, a via hole V is formed in the insulating layer 13 by, for example, a YAG laser device or a carbon dioxide gas laser device, and at least a part of the conductive layer 14 is exposed in the via hole V. Next, the via conductor 13 is formed in the via hole V and the conductive layer 14 is formed on the upper surface of the insulating layer 13 by, for example, a semi-additive method, a subtractive method, or a full additive method.

  By repeating this process, the build-up part 6 can be formed. When the conductive layer 14 is formed on the uppermost layer and the lowermost insulating layer 13, the electrode pad 8 and the external connection pad 9 can be formed in the same manner as the conductive layer 14.

  The wiring board 3 can be produced as described above.

  (3) By forming the bump 4 on the electrode pad 8 and flip-chip mounting the electronic component 2 on the wiring substrate 3 via the bump 4, the mounting structure 1 shown in FIGS.

(Second Embodiment)
Next, the mounting structure provided with the wiring board according to the second embodiment of the present invention will be described in detail with reference to the drawings. In addition, description is abbreviate | omitted regarding the structure similar to 1st Embodiment mentioned above.

  The second embodiment is different from the first embodiment in that a via conductor 15A penetrating the uppermost insulating layer 13A in the vertical direction is electrically connected to the lower surface of the electrode pad 8A in which the measurement region 11aA is arranged immediately below. At least a part of the measurement region 11aA is disposed immediately below the via conductor 15A. As a result, since the heat of the electronic component 2A is efficiently conducted to the measurement region 11aA via the via conductor 15A, the temperature of the electronic component 2A can be measured with high sensitivity.

  It is desirable that a single insulating layer 13A is interposed between the measurement region 11aA and the via conductor 15A. As a result, the heat of the electronic component 2A is efficiently conducted to the measurement region 11aA via the via conductor 15aA, so that the temperature of the electronic component 2A can be measured with high sensitivity.

(Third embodiment)
Next, a mounting structure provided with a wiring board according to a third embodiment of the present invention will be described in detail with reference to the drawings. In addition, description is abbreviate | omitted regarding the structure similar to 1st Embodiment mentioned above.

  Unlike the first embodiment, the third embodiment is configured such that at least a part of the measurement region 11aB is disposed immediately below a region located between the adjacent electrode pads 8B. As a result, the heat of the electronic component 2B is efficiently conducted to the measurement region 11aB via the two adjacent electrode pads 8B, so that the temperature of the electronic component 2B can be measured with high sensitivity.

  It is desirable that one of the two adjacent electrode pads 8B is closest to the centroid in plan view of the mounting region MB among the plurality of electrode pads 8B. As a result, the temperature of the electronic component 2B can be measured with high sensitivity by bringing the measurement region 11aB close to the centroid in plan view of the mounting region MB where heat is not easily dissipated. In addition, the heat of the electronic component 2B can be efficiently conducted to the measurement region 11aB through the electrode pad 8B that is closest to the centroid in plan view of the mounting region MB where heat is not easily dissipated.

  In addition, when via conductors 15B passing through the uppermost insulating layer 13B in the vertical direction are electrically connected to the lower surfaces of two adjacent electrode pads 8B, the conductivity connected to the lower ends of the via conductors 15B. It is desirable that the measurement region 11aB is disposed between the layers 14B. As a result, the heat of the electronic component 2B is efficiently conducted to the measurement region 11aB through the two adjacent electrode pads 8B, the via conductor 15B, and the conductive layer 14B, and thus the temperature of the electronic component 2B can be measured with high sensitivity. it can.

(Fourth embodiment)
Next, a mounting structure including a wiring board according to a fourth embodiment of the present invention will be described in detail based on the drawings. In addition, description is abbreviate | omitted regarding the structure similar to 1st Embodiment mentioned above.

  Unlike the first embodiment, the fourth embodiment differs from the first embodiment in that the electrode pad 8C where the measurement region 11aC is located immediately below is closest to the corner of the plurality of electrode pads 8C in the plan view of the mounting region MC.

  By the way, since the stress due to the warp of the wiring substrate 3 tends to concentrate on the electrode pad 8C closest to the corner in the plan view of the mounting region MC, the connection between the electrode pad 8C and the bump 4 is performed on the electrode pad 8C. Cracks are likely to occur in the connection portion between the portion or bump 4 and the electrode of the electronic component 2. Since the resistance value increases at the occurrence of such a crack as the crack progresses, the amount of generated heat tends to increase.

  On the other hand, in the wiring board 3C of the present embodiment, since the measurement region 11aC is disposed immediately below the electrode pad 8C closest to the corner in the plan view of the mounting region MC, the measurement region 11aC causes the occurrence of cracks. The generated heat can be detected. As a result, it is possible to detect the occurrence of a crack before disconnection occurs at such a connection portion, so that it is possible to easily deal with a crack before the disconnection occurs or to find a failure point in an electronic device including the mounting structure 1C. Can be specified.

  The present invention is not limited to the above-described embodiments, and various modifications, improvements, combinations, and the like can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the configuration using a semiconductor element as an electronic component has been described as an example, but a capacitor or the like may be used as the electronic component.

  In the above-described embodiment, the configuration in which the wiring layer is formed of the three insulating layers has been described as an example. However, the insulating layer may have any number of layers.

  Further, in the above-described embodiment, the configuration using the resin as the material for the base and the insulating layer has been described as an example. However, the base and the insulating layer are formed by coating a metal material with a resin material or ceramics. You may use things.

  In the above-described embodiment, the configuration in which the external connection pads are formed on the lower surface of the multilayer body has been described as an example. However, the external connection pads may be outside the mounting region on the upper surface of the multilayer body 7.

  In the above-described embodiment, the configuration in which the measurement region and the first to fourth connection regions are formed in the same conductive layer has been described as an example. However, the measurement region and the first to fourth connection regions may be formed in the same second wiring portion.

  In the above-described embodiment, the configuration in which the measurement region is linear is described as an example. However, the measurement region may be an elongated shape, and for example, a serpentine shape is desirable. In this case, the measurement region can be efficiently arranged in the vicinity of the electrode pad, the heat conduction efficiency from the electrode pad to the measurement region can be increased, and the sensitivity in temperature measurement of the electronic component can be increased.

DESCRIPTION OF SYMBOLS 1 Mounting structure 2 Electronic component 3 Wiring board 4 Bump 5 Core board 6 Build-up part 7 Laminated body 8 Electrode pad 9 External connection pad 10 Base | substrate 11 Through-hole conductor
12 Insulator 13 Insulating Layer 14 Conductive Layer 15 Via Conductor M Mounting Area L1 First Wiring Portion L2 Second Wiring Portion I Virtual Line

Claims (13)

A laminated body including a plurality of insulating layers and wiring portions, a mounting area provided on an upper surface of the laminated body, on which electronic components are mounted, and first to fourth external connection pads provided outside the mounting area. ,
The wiring portion electrically connects the measurement region, a first connection region electrically connecting one end of the measurement region and the first external connection pad, and the one end of the measurement region and the second external connection pad. A second connection region connected electrically, a third connection region electrically connecting the other end of the measurement region and the third external connection pad, and the other end of the measurement region and the fourth external connection pad. A fourth connection region electrically connected,
The wiring board according to claim 1, wherein at least a part of the measurement area is arranged immediately below the mounting area. The wiring board according to claim 1,
A plurality of electrode pads located in the mounting region and electrically connected to the electronic component;
The wiring board according to claim 1, wherein at least a part of the measurement region is disposed immediately below the electrode pad. The wiring board according to claim 2,
The wiring board according to claim 1, wherein the measurement region is arranged immediately below the electrode pad closest to the centroid of the mounting region in plan view. The wiring board according to claim 2,
The mounting area has a corner on the outer periphery in plan view,
The wiring board according to claim 1, wherein the measurement region is arranged immediately below the electrode pad closest to the corner of the mounting region. The wiring board according to claim 2,
The wiring board according to claim 1, wherein the measurement region is disposed immediately below the electrode pad that transmits power. The wiring board according to claim 1,
A plurality of electrode pads located in the mounting region and electrically connected to the electronic component;
The wiring board according to claim 1, wherein the measurement region is disposed immediately below a region located at least partially between the adjacent electrode pads. The wiring board according to claim 1,
A plurality of electrode pads located in the mounting region and electrically connected to the electronic component; and via conductors passing through the uppermost insulating layer in the vertical direction and electrically connected to the lower surface of the electrode pads; Further comprising
The wiring board according to claim 1, wherein at least a part of the measurement region is arranged immediately below the via conductor. The wiring board according to claim 1,
The wiring board according to claim 1, wherein the measurement region is formed on a lower surface of the uppermost insulating layer. The wiring board according to claim 1,
The wiring board according to claim 1, wherein the measurement region is made of the same material as the first to fourth connection regions. The wiring board according to claim 1;
Electronic components mounted on the wiring board;
A mounting structure characterized by comprising: Passing a current through the measurement region via the first and third external connection pads of the mounting structure according to claim 10;
Measuring a potential difference between the one end and the other end of the measurement region through which the current flows through the second and fourth external connection pads;
A potential difference measuring method comprising:   A temperature measurement method comprising a step of calculating a temperature of the measurement region using a measured value of the potential difference measured by the potential difference measurement method according to claim 11. The mounting structure according to claim 10,
A current supply unit electrically connected to the first and third external connection pads of the mounting structure;
A potential difference detection unit electrically connected to the second and fourth external connection pads of the mounting structure;
An electronic device comprising:

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