JP2011048254A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device which does not require an adhesive agent for fixing an electronic device cover to a substrate, and improves assembling workability. <P>SOLUTION: The electronic device has a printed circuit board, an electronic component mounted on the printed circuit board, an electronic component cover that covers a surface of the electronic component, and a clip spring that fixes the electronic component cover to the printed circuit board by holding the electronic component cover and the printed circuit board. A concave and convex portion is formed at a portion where the clip spring of the printed circuit board abuts. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic device including a board module in which an electronic component cover for holding an electronic component is fixed to a mounting surface of a board on which circuit components are mounted.

2. Description of the Related Art Conventionally, there has been known a camera including a strobe light emitting device in which light from a strobe light emitting unit is guided to a light emission amount control unit by a light guide device to control the light emission amount.
In addition, the following strobe light emitting device has been proposed by the present applicant in a camera in which a strobe light emitting portion is built in the camera when the strobe light is not used and the strobe light emitting portion pops up when the strobe light is used (see Patent Document 1). ).
Light from the strobe light emitting unit and the dimming sensor, which is the light emission amount control means in the main body of the apparatus, is collected by the flexible fiber, the optical path changing means, and the light from the fiber emitting unit to collect the light. On the other hand, a light guide device including lens means for diffusing and emitting the light is provided.
As a result, even if the positional relationship between the strobe light emitting unit and the light control sensor changes, the light from the strobe light emitting unit is guided to the light control sensor, ensuring proper strobe light emission and making assembly work easier. Is possible.

On the other hand, there is known a camera that eliminates lens means from the strobe light emitting device and further reduces the cost by forming the strobe light emitting device into a substrate module.
Below, the structure which aimed at such a board | substrate module is demonstrated easily. With reference to FIG. 6, the configuration of the substrate module in which the sensor cover is fixed to the substrate in the conventional example with an adhesive will be described.
6A is a front view of the substrate module, and FIG. 6B is a cross-sectional view taken along the line aa of the front view.
In FIG. 6, reference numeral 100 denotes a printed wiring board (hereinafter referred to as a substrate) on which circuit patterns are formed and circuit components for controlling the camera, and 101 is a strobe light emission stop signal output with a preset light amount. This is a light control sensor for controlling the flash emission. The light control sensor 101 is mounted on the substrate 100.
A sensor cover 102 includes an optical fiber 103 that is a light guide device for guiding light from a not-shown strobe light emitting unit to the light control sensor 101.
The sensor cover 102 is provided with an optical fiber 103 and an infrared cut filter 104 for removing infrared components from the strobe light and allowing only visible light used for photographing to enter the light control sensor 101.
Light from the strobe light emitting part is reflected through the optical fiber 103 to the reflecting surface 102a formed on the sensor cover 102 and guided to the sensor chip 101a of the light control sensor 101 so that the strobe light emission amount is controlled to be an appropriate light amount. .
The mounting standard of the sensor cover 102 is based on the surface of the light control sensor 101 and the two sides of the outer side surface, thereby guaranteeing the relative position of the light from the strobe light emitting unit and the sensor chip 101a. .
Therefore, the sensor cover 102 needs to be firmly held by the light control sensor 101, and the sensor cover 102 is fixed to the substrate 100 with an adhesive 105.

JP 2006-3081 A

In the conventional example in which the strobe light emitting device described above is formed as a substrate module, the light emitting portion of the strobe flashing device is guided to the light control sensor with a simple configuration, and the assembly workability is simplified.
However, in the above prior art, when the substrate module is formed, the electronic component cover such as the sensor cover is fixed to the substrate with an adhesive, and thus has the following problems.
In other words, it takes time for assembly work to proceed to the next process until the adhesive dries, and the adhesive must be removed when repairing the dimmer sensor due to a malfunction of the dimmer sensor, for example. Etc. will be required.

  In view of the above problems, the present invention provides an electronic device including a substrate module that does not require an adhesive for fixing an electronic component cover to a substrate and can improve the efficiency of assembly workability. Objective.

  The electronic apparatus according to the present invention includes a printed circuit board, an electronic component mounted on the printed circuit board, an electronic component cover that covers a surface of the electronic component, and the electronic component cover and the printed circuit board. A clip spring for fixing a component cover to the printed circuit board; and a concave and convex portion is formed on a portion of the printed circuit board in contact with the clip spring.

  ADVANTAGE OF THE INVENTION According to this invention, an adhesive agent is not required for fixation to the board | substrate of an electronic component cover, and the board | substrate module which can aim at efficiency improvement of assembly workability | operativity is realizable.

FIG. 2 is a block diagram illustrating a main configuration of a digital camera according to an embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating the main configuration of a digital camera according to an embodiment of the present invention. FIG. 3 is an assembly diagram illustrating a configuration of a strobe light emitting unit according to the embodiment of the present invention. The figure explaining the structure of the light control sensor unit in embodiment of this invention. The figure explaining the structure of the uneven | corrugated | grooved part formed in the printed wiring board in embodiment of this invention. The figure explaining the structure of the board | substrate module which is fixing to the board | substrate of the sensor cover in a prior art example with an adhesive agent.

Hereinafter, the configuration of an electronic device including a board module in which an electronic component cover for holding an electronic component is fixed to a mounting surface of the board on which the circuit component of the present invention is mounted will be described with reference to the drawings. A configuration example of the applied embodiment will be described.
FIG. 1 is a block diagram for explaining a main configuration of the digital camera according to the present embodiment. In FIG. 1, 1 is a CPU that controls the entire electronic camera, 2 is a photographic lens, 3 is a lens driving device, and 18 is a well-known phase difference type focus detection device, which is based on the output result of the device. Move to adjust the focus.
Reference numeral 4 denotes a shutter, and 5 denotes a shutter charge and mirror drive mechanism, which charges the shutter 4 and raises or lowers the mirror 6 between a retracted position and an observation position.
Reference numeral 7 denotes a photoelectric conversion element composed of a CCD or the like, which converts a subject image formed by the photographing lens 2 into an image signal.
Reference numeral 8 denotes image processing means, which performs various processing on the image signal of the photoelectric conversion element 7 and converts it into image data.
Reference numeral 9 denotes recording means for recording image data on a recording medium 10 comprising a magnetic recording device, a semiconductor memory or the like that is built in or removable from the camera.
Reference numeral 11 denotes a power source, 12 denotes a release switch having a SW1 function for starting a shooting preparation operation and SW2 function for starting a shooting operation, and 13 denotes a display unit including a liquid crystal display or the like, which displays a captured image and various information of the camera.
Reference numeral 14 denotes a stroboscopic light emitting unit which is a stroboscopic flash device. Reference numeral 15 denotes a dimming sensor which is an optical sensor for detecting the luminescence amount from the stroboscopic light emitting unit 14 and performing appropriate light quantity control. Reference numeral 16 denotes a stroboscopic light emitting control unit. It is a strobe circuit. A photometric sensor 17 measures the luminance of the subject.

FIG. 2 is a cross-sectional view of the main configuration of the digital camera of the present invention, showing a state in which the strobe light emitting unit 14 is in the light emitting position.
In FIG. 2, the same components as those shown in FIG. 1 are denoted by the same reference numerals, and description of overlapping portions is omitted.
In FIG. 2, reference numeral 30 denotes an upper cover that holds the strobe light emitting unit 14. The strobe light emitting unit 14 includes a strobe case 31, a strobe cover 32, a xenon tube 33, and a reflection shade 34 for efficiently irradiating the subject side with strobe light from the xenon tube 33.
Further, a strobe panel 35 for illuminating the subject with uniform and uniform strobe light, a trigger coil (not shown) for starting discharge of the xenon tube 33, and a flexible for guiding the strobe light to the light control sensor 15. The optical fiber 36 (light guide member) which has property is provided.
One end of the optical fiber 36 is fixed to the strobe panel 35, and the other end is attached to a light control sensor unit 51 described later.
Reference numeral 50 denotes a printed wiring board (printed circuit board) on which circuit patterns for controlling the camera are formed and circuit components are mounted, and a light control sensor unit 51 as an electronic component is attached thereto.
40 is a viewfinder screen, 41 is a pentaprism, and 42 is an eyepiece.

FIG. 3 is an assembly diagram showing the relationship among the xenon tube 33, the strobe panel 35, the reflection shade 34, and the optical fiber 36 of the strobe light emitting unit 14 when viewed from the top of the camera.
In FIG. 3, the strobe panel 35 is provided with a Fresnel lens 35a for uniformly irradiating strobe light emitted from the xenon tube 33.
A fiber insertion hole 35b is provided on the side surface of the Fresnel lens 35a.
The optical fiber 36 is inserted into the fiber insertion hole 35b, and a part of the strobe light incident on the Fresnel lens 35a is reflected by the reflecting surface 35c formed on the strobe panel 35 and is inserted into the fiber insertion hole 35b. It is guided.

Next, the details of the light control sensor unit 51 will be described with reference to FIG.
4A is a front view showing a state in which the light control sensor 51 is attached to the printed wiring board 50, FIG. 4B is a detailed front view of the light control sensor unit 51, FIG. 4C is a rear view, and FIG. A cross-sectional view is shown.
As shown in FIG. 4, the light control sensor (electronic component) 15 is configured to be mounted on the mounting surface of the printed wiring board 50 on which the circuit components are mounted. A sensor cover (electronic component cover) 52 includes an optical fiber 36 that is a light guide member for guiding light from the xenon tube 33 to the light control sensor 15. The sensor cover 52 has a light shielding property, and light other than light guided from the optical fiber 36 does not enter the light control sensor 15.
The sensor cover 52 is abutted on the surface of the light control sensor in the Z direction, and in the X and Y directions, the light control sensor 15 is energized by urging each side surface of the light control sensor 15 by springs 52 a and 52 b formed on the sensor cover 52. Is positioned with respect to.
An infrared cut filter 53 removes an infrared component from the strobe light and allows only visible light used for photographing to enter the light control sensor 15. The infrared cut filter 53 is fixed to the surface of the light control sensor 15 by the sensor cover 52.
The sensor cover 52 is formed with a guide portion 52c for inserting the optical fiber 36, a fiber insertion hole 52d, and a reflection surface 52e for changing the optical path. The light from the xenon tube 33 is reflected by the reflection surface 52e through the optical fiber 36 and guided to the sensor chip 15a of the light control sensor, and is controlled so that the amount of stroboscopic light emission becomes an appropriate amount.

If the sensor cover 52 is lifted or removed from the light control sensor 15, the light from the xenon tube 33 is not correctly incident on the sensor chip 15a, and the strobe emission control with an appropriate amount of light cannot be performed. .
Therefore, the sensor cover 52 is fixed by sandwiching the sensor cover 52 and the printed wiring board 50 by a sensor cover spring 54 having a substantially U-shape constituting a clip spring. The sensor cover spring 54 is made of a conductive material.
The sensor cover spring 54 is attached by being slid in the direction of the arrow from the top of the figure in a state where the sensor cover 52 is attached to the light control sensor 15.
The bent portions 54a and 54b are formed so that they can be smoothly attached without being caught, and the bent portion 54a falls into a stepped portion 52f formed on the sensor cover to prevent detachment after the attachment is completed. It has become.
Further, a concavo-convex portion is formed on the back surface of the surface of the substrate on which the light control sensor 15 is mounted, and the bent portion 54b of the sensor cover spring 54 is engaged with the concavo-convex portion so as to prevent the detachment. . Therefore, the bent portion 54 b of the sensor cover spring 54 is a portion that comes into contact with the uneven portion of the sensor cover spring 54.
Specifically, an uneven portion 50c described later is formed in the sensor cover spring contact portion region 50a in the vicinity of the contact portion of the printed wiring board 50 with the bent portion 54b, and the uneven portion 50c is formed on the bent portion 54b. Is caught and engaged to prevent it from coming off.
The sensor cover spring 54 is attached while rubbing the surface of the printed wiring board 50 by the bent portion 54b.
Therefore, there is a possibility that the surface of the printed wiring board 50 is shaved to expose the pattern or cut the pattern.
Therefore, it is desirable that the sensor cover spring movable region (clip spring movable region) 50b of the bent portion 54b of the printed wiring board 50 be a ground pattern. In this way, even if the pattern is exposed or cut, the circuit is not affected at all.

Next, the configuration of the concavo-convex portion formed on the printed wiring board 50 will be further described with reference to FIG.
FIG. 5A is a view in which a concavo-convex portion 50c is formed by a resist pattern in the sensor cover spring contact portion region 50a, and FIG. 5B is a sectional view of the same.
A resist 50d is applied to the surface of the printed wiring board 50 for pattern insulation.
A recess 50e is formed in the vicinity of the contact portion with the bent portion 54b by removing the resist, thereby forming an uneven portion 50c of a resist pattern on the surface of the printed wiring board.
A ground pattern 50f is formed in the movable region 50b of the sensor cover spring, and the pattern is exposed in the recess 50e.
When the sensor cover spring 54 is attached, the ridge line of the bent portion 54b comes into contact with the exposed ground pattern 50f so that it can be electrically connected.
Thereby, the sensor spring 54 is not a floating metal, which is preferable from the viewpoint of noise and static electricity.
Further, the uneven portion 50c may be formed by silk printing.

FIG. 5C is a view in which the uneven portion 50c is formed by silk printing on the sensor cover spring contact portion region 50a, and FIG. 5D is a sectional view of the same.
On the surface of the printed wiring board 50, silk printing 50g is applied for 1-pin mark and name display of the circuit elements mounted on the board.
A convex portion is formed by applying silk printing 50 g in the vicinity of the contact portion with the bent portion 54 b, and a retaining effect is obtained by the bent portion 54 b being hooked and engaged.
Moreover, you may form the uneven | corrugated | grooved part 50c with the copper foil pattern of a printed wiring board. FIG. 5 (e) is a view in which a concavo-convex portion 50c is formed with a copper foil pattern in the sensor cover spring contact portion region 50a, and FIG. 5 (f) is a sectional view of the same.
A recess 50h is formed by pattern cutting a part of the printed circuit board 50 in the vicinity of the contact portion with the bent portion 54b of the ground pattern 50f, and the bent portion 54b is hooked and engaged to obtain a retaining effect. It is done.
Moreover, you may form the uneven | corrugated | grooved part 50c by a through hole.
FIG. 5 (g) is a view in which a concavo-convex portion 50c is formed in the sensor cover spring contact portion region 50a by a through hole, and FIG. 5 (h) is a sectional view of the same.
A through hole 50i is provided in the vicinity of the contact portion of the printed wiring board 50 with the bent portion 54b of the ground pattern 50f.
In the case of forming a through hole, a resist opening equal to or larger than the through hole diameter is necessary for manufacturing the substrate. Therefore, the bent portion 54b is caught and engaged by the resist opening end face 50j formed thereby, thereby preventing the removal. Is obtained.
The arrangement of the through holes 50i is not limited to the arrangement as shown in FIG.

Although the configurations of the embodiments of the present invention have been described above, the present invention is not limited to these configurations, and for example, a part of the configurations of the embodiments may be appropriately combined.
According to such a configuration of the present embodiment, the sensor cover is fixed to the substrate by the cover spring having a clip shape, so that the number of assembling steps can be reduced and workability at the time of reworking can be facilitated.
Further, by providing unevenness on the surface of the substrate in the vicinity of the contact portion with the cover spring, it is possible to prevent the cover spring from being displaced or dropped during vibration or dropping.
As a result, it is possible to provide a substrate module that can ensure excellent light guiding performance, always ensure proper strobe light emission, and improve the efficiency of assembly workability.

36: Fiber 50: Printed circuit board 50a: Sensor cover spring contact area 50b: Sensor cover spring movable area (clip spring movable area)
50c: Concavity and convexity 52: Sensor cover 54: Sensor cover spring (clip spring)
54b: bending portion

Claims (7)

A printed circuit board;
Electronic components mounted on the printed circuit board;
An electronic component cover covering the surface of the electronic component;
A clip spring for fixing the electronic component cover to the printed circuit board by sandwiching the electronic component cover and the printed circuit board;
An electronic device, wherein an uneven portion is formed in a portion of the printed board where the clip spring contacts.   The electronic apparatus according to claim 1, wherein a bent portion that engages with the concavo-convex portion is formed at a portion that contacts the concavo-convex portion of the clip spring.   The electronic device according to claim 1, wherein the uneven portion is formed by a resist pattern, silk printing, a copper foil pattern, or a through hole.   4. The electronic device according to claim 1, wherein when the clip spring is attached to the printed circuit board, a ground pattern is formed in a region where the clip spring of the printed circuit board rubs. 5.   The electronic apparatus according to claim 4, wherein the clip spring has conductivity, the ground pattern is exposed, and is electrically connected to the clip spring.   The electronic device according to claim 1, wherein the electronic component is an optical sensor, and the electronic component cover has a light shielding property.   The electronic device according to claim 6, wherein the electronic component cover holds a light guide member.

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