JP2011048220A - Lens member and illumination device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lens member in which dimension between lenses is formed exact, and positional deviation between an optical semiconductor element and the lens is prevented, and to provide an illumination device using the lens member. <P>SOLUTION: The illumination device includes an element substrate 1 and a plurality of optical semiconductor elements 3 on the element substrate 1. The lens member is provided opposed to the element substrate 1 of the illumination device and includes a plurality of lenses 5 corresponding to the respective optical semiconductor elements 3 on a lens substrate 4 made of metallic material. The lens substrate 4 has through-holes 20 at positions where the lenses 5 are provided. The lens 5 is formed by outsert-molding at a position of the through-hole 20 so that a periphery part holds both sides of the lens substrate 4 in between. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a lens member that is used in an illumination device that emits light from a plurality of optical semiconductor elements and includes a plurality of lenses that diffuse light from the optical semiconductor elements, and an illumination device that uses the lens member.

  Conventionally, lighting devices using optical semiconductor elements such as LEDs are known. The light from the optical semiconductor element is a point light source and has a wide emission angle. In order to use this light as illumination light, it is necessary to control the light emission angle and diffuse the light. Therefore, a lens is provided in the illumination device so as to face the optical semiconductor element. In addition, since the optical semiconductor element has a phenomenon in which the light emission efficiency decreases when the output is increased, a plurality of optical semiconductor elements are arranged in the lighting device as necessary, thereby ensuring the overall output. Yes. For this reason, a plurality of lenses are arranged in the illumination device corresponding to each optical semiconductor element.

  As a configuration for arranging a plurality of lenses, there are some that attach a plurality of lenses to an optical semiconductor element, but there are many cases in which the lens is individually formed and then mounted while positioning with the optical semiconductor element. However, there is a drawback that the manufacturing efficiency is low and the cost is high. In addition, when the optical semiconductor element is integrated so as to cover the optical semiconductor element with a lens made of a resin material or the like, there is a problem in that it is difficult to radiate heat from the optical semiconductor element and the life of the optical semiconductor element is shortened.

  On the other hand, it is also conceivable to form an array by forming a plurality of lenses in a single plate. In this case, a lens member having a plurality of lenses is formed by injection molding or the like, and the lens member is positioned and fixed in the lighting device, so that each lens is disposed so as to face the optical semiconductor element. As a result, man-hours can be greatly reduced and costs can be reduced. As a lens member used for such an illuminating device, for example, there is one described in Patent Document 1.

Japanese Utility Model Publication No. 62-92504

  In order to reliably collect and diffuse the light from the optical semiconductor element, it is necessary that the dimension between the lenses is accurately formed in the lens member, and the optical semiconductor element and the lens correspond to each other accurately. However, the conventional lens member is formed of a resin material, and since the linear expansion coefficient of the resin material is large, it is difficult to accurately form the dimensions between the lenses during processing by injection molding.

  In the lighting device, the optical semiconductor element is disposed on an element substrate made of a metal plate in order to improve heat dissipation. On the other hand, since the conventional lens member is formed of a resin material, the amount of elongation due to a temperature change is different, which is also a factor that shifts the positional relationship between the optical semiconductor element and the lens.

  The present invention has been made in view of the above problems, and provides a lens member capable of accurately forming a dimension between lenses and preventing positional displacement with an optical semiconductor element, and an illumination device using the same. With the goal.

In order to solve the above-described problem, a lens member according to the present invention is provided in a lighting device in which a plurality of optical semiconductor elements are arranged on an element substrate so as to face the element substrate. In a lens member having a lens substrate made of a metal material,
The lens substrate has a through hole at a position where the lens is provided, the lens is outsert-molded at the position of the through hole, and a peripheral portion sandwiches both surfaces of the lens substrate. Has been.

  The lens member according to the present invention is characterized in that a positioning hole is formed in the lens substrate in a penetrating manner.

  Furthermore, the lens member according to the present invention is characterized in that the positioning hole is outsert-molded so that a substantially cylindrical fixed boss extends over both surfaces of the lens substrate.

  Furthermore, the lens member according to the present invention is characterized in that the lens substrate has a gate trace portion and a runner trace portion formed when the lens is molded on the surface.

  The lens member according to the present invention is characterized in that the runner trace is bent at least once between the gate trace and the lens.

Further, the illumination device according to the present invention is a lighting device in which a plurality of optical semiconductor elements are arranged on an element substrate made of a metal material, and a lens is arranged to face each optical semiconductor element.
The lens is formed on a lens substrate made of a metal material to form a lens member. The lens substrate has a through hole at a position where the lens is provided, and the lens is outsert-molded at the position of the through hole. , The periphery of the lens sandwiches both surfaces of the lens substrate,
The lens member is configured to be opposed to the element substrate at a distance.

  According to the lens member of the present invention, the lens substrate made of a metal plate has a through hole at a position where the lens is provided, the lens is outsert-molded at the position of the through hole, and the peripheral portion covers both surfaces of the lens substrate. By sandwiching, the lens substrate material and the element substrate material can be combined to prevent the lens and the optical semiconductor element from being displaced due to thermal expansion, and a plurality of lenses can be formed at one time. The dimensions can be accurate.

  In addition, according to the lens member of the present invention, since the positioning hole is formed in the lens substrate so as to penetrate, the lens member and the element substrate can be easily positioned and fixed facing each other.

  Furthermore, according to the lens member according to the present invention, the positioning hole is outsert-molded so that the substantially cylindrical fixed boss extends over both surfaces of the lens substrate, so that the distance between the lens member and the element substrate is easy. The lighting device can be manufactured more easily.

  Furthermore, according to the lens member of the present invention, the lens substrate has a gate trace portion and a runner trace portion that are formed when the lens is molded on the surface, thereby using an injection molding technique for obtaining a large number of lenses. And can be formed easily.

  According to the lens member of the present invention, the runner trace portion is bent at least once between the gate trace portion and the lens so that even if the runner trace portion contracts after injection molding, the lens is not affected. Since it is not necessary to remove the runner trace portion, the number of manufacturing steps can be reduced and the cost can be further reduced.

It is sectional drawing of the illuminating device in this embodiment. It is a top view of a lens member. It is a conceptual sectional view at the time of injection molding of a lens member.

  Embodiments of the present invention will be described in detail with reference to the drawings. In FIG. 1, sectional drawing of the illuminating device in this embodiment is shown. As shown in this figure, the illumination device in the present embodiment is a lens member provided with an element substrate 1 on which a plurality of optical semiconductor elements 3 are arranged, and a plurality of lenses 5 provided corresponding to the respective optical semiconductor elements 3. 2 are arranged opposite to each other. Each light emitted from the optical semiconductor element 3 is divergent light, and is condensed by the lens 5 of the lens member 2 so as to spread at a predetermined angle.

  The element substrate 1 is configured by a metal plate made of any of aluminum, copper, and iron. On the surface of the element substrate 1, a circuit portion 10 that insulates each optical semiconductor element 3 and supplies power is formed. The optical semiconductor element 3 is made of an LED, and emits light so as to spread from a point at a predetermined angle in a direction perpendicular to the element substrate 1. In FIG. 1, the optical semiconductor elements 3 appear only in a line, but a plurality of optical semiconductor elements 3 are arranged in a similar arrangement on the front side or the back side. That is, the optical semiconductor elements 3 are arranged in a matrix on the element substrate 1.

  The lens member 2 is provided with a lens 5 on a lens substrate 4 made of a metal plate made of aluminum, copper, or iron so as to correspond to the respective optical semiconductor elements 3 of the element substrate 1 facing each other. The material of the lens substrate 4 is preferably the same as the material of the element substrate 1. A through hole 20 for transmitting light from the optical semiconductor element 3 is formed in the lens substrate 4 at a position immediately below each optical semiconductor element 3 when the lens substrate 4 is in a predetermined facing state with the element substrate 1. Has been. The lenses 5 are each formed by outsert molding so as to close these through holes 20.

  The surface of the lens 5 facing the optical semiconductor element 3 is a flat entrance surface 5a, and the exit surface is a convex lens surface 5b. The divergent light emitted from the optical semiconductor element 3 is adjusted by the lens 5 so as to spread at a predetermined angle.

  Since the lens 5 is made of a resin material and is formed by outsert molding with respect to the lens substrate 4, the periphery of the lens 5 sandwiches the periphery of the through hole 20 formed in the lens substrate 4. Further, the lens substrate 4 has a gate trace portion 22 and a runner trace portion 23 that are formed when the lens 5 is formed by injection molding on the surface on the light emission side.

  FIG. 2 shows a plan view of the lens member 2. In this figure, the lens member 2 is viewed from the surface on the light emission side. As shown in FIG. 2, four lenses 5 are provided in one row in accordance with the arrangement of the optical semiconductor elements 3, and two rows are formed to provide a total of eight lenses. At the time of injection molding, the gate trace portion 22 has two gates corresponding to the gate for supplying the resin material to the four lenses 5 on the right side in the drawing and the gate for supplying the resin material to the four lenses 5 on the left side in the drawing. In addition, a total of three are provided for forming the fixed boss 24 described later.

  A runner trace 23 is formed between the gate trace 22 corresponding to the gate for supplying the resin material and the lens 5 or the fixed boss 24 corresponding to the runner at the time of injection molding. The runner trace portion 23 is formed to be bent at least once between the gate trace portion 22 and the lens 5 or the fixed boss 24. In the present embodiment, the runner trace 23 connecting the gate trace 22 and the lens 5 is bent once, and the runner trace 23 connecting the gate trace 22 and the fixed boss 24 is bent twice.

  Thus, that runner trace part 23 is bent means that the runner at the time of injection molding is bent. Since the runner trace portion 23 contracts after injection molding, it may cause an error in the position of the lens 5 after molding. However, since the runner is bent, the lens 5 is not affected even if contraction occurs. Can be. Therefore, there is no need to remove the runner trace portion 23 after molding, and the number of steps can be reduced and the cost can be reduced.

  As shown in FIG. 1, the lens substrate 4 is formed with a positioning hole 21 for positioning in addition to the through hole 20. In the element substrate 1, a hollow fixing portion 11 is formed for positioning with the lens member 2, and a positioning hole 21 of the lens substrate 4 is disposed corresponding to the fixing portion 11.

  A cylindrical fixed boss 24 is formed of a resin material in the central positioning hole 21 of the lens substrate 4 so as to surround the periphery. The fixed boss 24 is formed together with the lens 5 by outsert molding. The hollow interior of the fixed boss 24 and the hollow interior of the fixed portion 11 are in communication with each other, and a screw 25 is screwed therein.

  In addition, the fixing bosses 24 are not formed in the positioning holes 21 on both sides of the lens substrate 4, and a cylindrical spacer 26 is provided between the lens substrate 4 and the fixing portion 11. The hollow interior of the positioning hole 21 and the spacer 26 and the hollow interior of the fixing portion 11 are in communication with each other, and a screw 25 is screwed therein. The element substrate 1 and the lens member 2 are positioned and fixed by these screws 25.

  In the present embodiment, in order to fix the element substrate 1 and the lens member 2, a fixing boss 24 is partially formed in the positioning hole 21 provided in the lens substrate 4, and a part is left as it is, and the spacer 26. However, it goes without saying that positioning and fixing may be performed with only one of the structures.

  FIG. 3 shows a conceptual cross-sectional view of the lens member 2 during injection molding. A mold used for injection molding includes an upper mold 31 and a lower mold 32. The upper mold 31 includes a lens molding portion 31a and a fixed boss molding portion 31b on the surface, and the lower mold 32 also has a lens molding on the surface. A portion 32a and a fixed boss forming portion 32b are provided.

  The lens substrate 4 is inserted between the upper mold 31 and the lower mold 32, and the upper and lower lens molding portions 31a and 32a are disposed at the positions of the through holes 20 of the lens substrate 4, and the upper and lower fixed boss moldings are formed. The portions 31 b and 32 b are arranged at the positions of the positioning holes 21 of the lens substrate 4 to form space portions having the shapes of the lens 5 and the fixed boss 24, respectively. The space portion overlaps the portion around the through hole 20 and the positioning hole 21 of the lens substrate 4, and the resin material sandwiches the lens substrate 4 at this portion. Further, the upper mold 31 is formed with a gate 33 and a runner 34.

  A nozzle device 30 is inserted into the upper mold 31, and the tip of the nozzle device 30 communicates with the gate 33. The resin material constituting the lens 5 and the fixed boss 24 is injected from the nozzle device 30 into the mold through the gate 33 and fills the space between the molds through the runner 34, so that the lens 5 and the fixed boss 24 are filled. Is formed. A runner 34 extends from the gate 33 in a plurality of directions, and a multi-cavity technique in injection molding is used. On the other hand, the molded lens 5 and the fixed boss 24 do not need to be separated from the runner trace portion 23, and the lens member 2 can be easily and collectively formed. The arrangement of the gate 33 and the runner 34 is not limited to that shown in FIG. 2, and may be formed on the opposite surface of the lens member 2 or may be provided on both surfaces.

  In the lens member 2 formed in this manner, since the lens substrate 4 is made of a metal plate like the element substrate 1, the expansion and contraction due to the temperature change can be made comparable, and the optical semiconductor element 3 and the lens 5. Can be prevented. Further, since the lens 5 and the fixed boss 24 are collectively formed by outsert molding, it is possible to accurately collect the light from the optical semiconductor element 3 by making these positional relationships accurate. Furthermore, since the lens member 2 is disposed opposite to the element substrate 1, the heat radiation from the optical semiconductor element 3 can be improved, and the life of the optical semiconductor element 3 can be extended.

  Although the embodiment of the present invention has been described above, the application of the present invention is not limited to this embodiment, and can be applied in various ways within the scope of its technical idea. For example, the number and arrangement of the optical semiconductor elements 3 in the element substrate 1 and the number and arrangement of the lenses 5 in the lens member 2 are not limited to the present embodiment, and are appropriately set as necessary.

DESCRIPTION OF SYMBOLS 1 Element substrate 2 Lens member 3 Optical semiconductor element 4 Lens substrate 5 Lens 10 Circuit part 11 Fixed part 20 Through-hole 21 Positioning hole 22 Gate trace part 23 Runner trace part 24 Fixed boss 25 Screw 26 Spacer

Claims (6)

In a lighting device in which a plurality of optical semiconductor elements are arranged on an element substrate, a lens is provided opposite to the element substrate, and has a plurality of lenses corresponding to each of the optical semiconductor elements on a lens substrate made of a metal material. In the member,
The lens substrate has a through hole at a position where the lens is provided, the lens is outsert-molded at the position of the through hole, and a peripheral portion sandwiches both surfaces of the lens substrate. Lens member.   The lens member according to claim 1, wherein a positioning hole is formed in the lens substrate in a penetrating manner.   The lens member according to claim 2, wherein the positioning hole is outsert-molded so that a substantially cylindrical fixed boss extends over both surfaces of the lens substrate.   The lens member according to claim 1, wherein the lens substrate has a gate trace portion and a runner trace portion formed when the lens is molded on a surface thereof.   The lens member according to claim 4, wherein the runner trace portion is bent at least once between the gate trace portion and the lens. In an illuminating device in which a plurality of optical semiconductor elements are arranged on an element substrate made of a metal material, and lenses are arranged to face each optical semiconductor element,
The lens is formed on a lens substrate made of a metal material to form a lens member. The lens substrate has a through hole at a position where the lens is provided, and the lens is outsert-molded at the position of the through hole. , The periphery of the lens sandwiches both surfaces of the lens substrate,
The illumination device according to claim 1, wherein the lens member is disposed opposite to the element substrate.

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