JP2011047751A - Color filter substrate inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a color filter substrate inspection device for inspecting exposure positional deviation of an RGB pixel which is a colored pixel of a color filter. <P>SOLUTION: This color filter substrate inspection device for inspecting deviation of a colored pixel caused by exposure positional deviation, when a red, green or blue colored pixel is exposed and developed to form a pattern in a color filter manufacturing process includes: a conveyance means for conveying a color filter substrate; an illumination means for performing transmitted illumination; an imaging means for imaging the illuminated color filter substrate; an image comparison processing means for performing a determination processing of positional deviation of the colored pixel by performing a whole image processing, a projection comparison processing and an average lightness processing, by using a reference image having no positional deviation of the colored pixel and an imaged inspection image; and a visual inspection means for performing visual inspection by comparing and processing the same pattern close to the imaged image. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a color filter substrate inspection apparatus for inspecting an exposure position shift of a pattern generated during an exposure process performed when a pattern is formed in a color filter manufacturing process.

  FIG. 1 is a cross-sectional view showing an example of a color filter used in a color liquid crystal display device. The color filter 1 includes a black matrix (hereinafter referred to as BM) 3, a red R coloring pattern (hereinafter referred to as R pixel) 4-1, a green G coloring pattern (hereinafter referred to as G pixel) 4-2, blue on a glass substrate 2. A B coloring pattern (hereinafter referred to as B pixel) 4-3, a transparent electrode 5, a photo spacer (hereinafter referred to as PS) 6, and a vertical alignment (hereinafter referred to as VA) 7 were sequentially formed. Is.

  As a method for manufacturing a color filter having the above structure, a photolithography method, a printing method, and an ink jet method are known. FIG. 2 is a flow chart showing steps of a commonly used photolithography method. In the color filter, first, a step of forming BM on the glass substrate (C-1), a step of cleaning the glass substrate (C-2), and a step of applying and pre-drying a colored photoresist (C-3) ), A pre-baking step (C-4) for drying and curing the colored photoresist, a step (C-5) for exposing, a step (C-6) for developing, and a step (C-) for curing the colored photoresist. 7) The process of forming a transparent electrode (C-8) and the process of forming PS and VA (C-9) are performed in this order.

  The BM 3 is formed on the glass substrate 2 by, for example, forming a metal thin film on the glass substrate 2, applying a photoresist to the metal thin film, and then exposing, developing, and developing a pattern having a BM shape by a photolithography method. A method of forming by etching, or a black photoresist resin is applied on the glass substrate 2, and a pattern having a BM shape is exposed and developed by a photolithographic method to develop a so-called resin. A method of forming a pattern called BM is used.

  For example, when pixels are formed in the order of R pixel, G pixel, and B pixel, from the step (C-2) of cleaning the color filter glass substrate to the step of curing the colored photoresist (C- In 7), the color resist is changed in the order of red R, green G, and blue B, and the process is repeated three times to form R, G, and B pixels.

  In the exposure process (C-5) when forming the R pixel, the G pixel, and the B pixel, the positioning mark created when the BM pattern is formed is imaged by the camera, and the reference position is determined from the captured image. And is exposed using a photomask.

With the increase in size of liquid crystal display devices, the mother glass (mother glass: the base glass that forms the pattern of the color filter) itself tends to increase in size, and the color filter is generally formed with multiple faces on the mother glass. Is done. Recently, there are some that are longer than 2m. Similarly, exposure apparatuses and photomasks used for exposure processing tend to increase in size following the size of the mother glass. However, the photomask becomes expensive as it becomes larger, and moreover, since it is necessary to produce a photomask for each type of color filter, the cost required for the photomask is high. In order to cope with an increase in cost, there is a limit on the size of the photomask, so that a color filter is manufactured by dividing exposure using a small photomask.

  Although not shown, automatic appearance inspection is appropriately performed in the color filter manufacturing process for inspection of foreign matters and pattern defects. Using an automatic appearance inspection apparatus, fine pattern defects are detected after each process (BM formation process, R pixel formation process, G pixel formation process, B pixel formation process) of color filter manufacturing. In general, automatic appearance inspection is performed by so-called pattern comparison processing that uses the fact that color filters are a set of identical patterns and compares adjacent identical patterns. The image signal used for comparison is often acquired as a black and white image of 8-bit 256 gradation using a CCD camera.

JP 2006-323188 A

  FIG. 3 shows an example of a color filter in which four color filter patterns 41 are arranged (four faces) on a glass substrate 42. Photoresist applied on a glass substrate using a single photomask (not shown) on a large glass substrate on which the entire four surfaces are drawn when creating a color filter having a pattern of four sides formed A method of exposing the entire surface of a pattern by one exposure is called a batch exposure method. This is because, for example, a photoresist applied on a wafer glass substrate in IC manufacturing is exposed many times by changing the position of the wafer substrate using a photomask on which a single IC pattern is drawn. This is a name for the method of exposing the IC in an impositioned state, that is, the step-and-repeat exposure method. In the batch exposure method, exposure is performed when the alignment mark on the BM pattern and the alignment mark on the photomask are moved to the alignment table on which the photomask is placed and the marks are optically matched. Done. At this time, the matching of the two marks is not always accurately performed, and so-called misalignment may occur.

  Furthermore, in such a batch exposure method, as the glass substrate increases in size, the photomask used also increases in size. The price of this photomask increases dramatically as the size increases. It becomes. Therefore, the four surfaces of the color filter pattern as described above are divided into two surfaces, and divided exposure is performed twice using a small photomask having the size of the two surfaces.

  FIG. 4 is a diagram for explaining an example of alignment (positioning) and exposure in the case of divided exposure. 4 includes a carry-in conveyor 51, an alignment stage 52, a carry-in / carry-out robot 53, an exposure apparatus main body 54, a carry-out conveyor 55, and the like. Reference numerals 56a, 56b, 56c, and 56d denote glass substrates on the carry-in conveyor 51, the alignment stage 52, the exposure apparatus main body 54, and the carry-out conveyor 55, respectively.

  FIG. 5 is a side view of the exposure apparatus 54 shown in FIG. As shown in FIGS. 4 and 5, the exposure apparatus main body 54 includes an exposure stage 61, and an exposure unit 62 including a light source 63, a photomask 64, and the like. The position (a) indicates the position of the first exposure in the double divided exposure on the exposure stage 61, and the position (b) indicates the position of the second exposure.

As shown in FIGS. 4 and 5, the glass substrate 56c on the exposure stage 61 is moved by the exposure stage 61 while the exposure unit 62 is fixed, and the first exposure is performed at the position (a). The exposure stage 61 stops after moving a certain distance, and the second exposure is performed at the position (b). That is, the glass substrate 56 a is moved from the carry-in conveyor 51 onto the alignment stage 52 (56 b), and is aligned on the alignment stage 52. Next, it is carried onto the exposure stage 61 by the carry-in / carry-out robot 53. The glass substrate 56c on the exposure stage 61 is fixed to the exposure stage 61, and after the above-mentioned two-time divided exposure, it is carried out from the exposure stage 61 onto the carry-out conveyor 55 by the same carry-in / out robot 53 (56d). Yes.

  That is, since the glass substrate is aligned on the alignment stage 52 and then loaded onto the exposure stage 61, the positional deviation on the alignment stage 52, the accuracy of the loading / unloading robot 52, and the accuracy of the exposure stage of the exposure apparatus 54 In addition, the glass substrate is displaced due to poor adjustment of the alignment stage 52, the loading / unloading robot 53, and the exposure stage of the exposure apparatus 54.

  FIG. 6 shows an example in which an exposure position shift of the R pixel occurs due to the position shift of the glass substrate. FIG. 6A shows a normally exposed R pixel, and the R pixel 67 is normally aligned with the BM 66. On the other hand, FIG. 6B shows a case where an exposure position shift occurs, and the position of the R pixel 67 shifts with respect to the BM 66, and as a result, a white spot 68 occurs at the boundary between the BM 66 and the R pixel 67. However, when this color filter is incorporated in a liquid crystal display device, it becomes a display device with poor contrast.

  In case of batch exposure using a normal large photomask, if the exposure position shift of the pattern occurs, the entire pattern exposed with the large photomask shifts, so whether the exposure position shift occurred by checking part of the pattern Although it is possible to confirm whether or not the exposure position shift has occurred in the divided exposure using a small photomask, it is necessary to confirm the entire glass substrate. However, measurement with a microscope requires measurement time, so that only a limited position within the glass substrate can be measured, and there is a problem that it takes a lot of time to inspect the entire surface of the glass substrate.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a color filter substrate inspection apparatus that inspects the entire surface of a substrate in a short time for exposure position shift of RGB pixels that are color pixels of a color filter.

  According to the first aspect of the present invention, in the color filter manufacturing process, when the red, green, and blue colored pixels are exposed and developed to form a pattern, a color for inspecting the color pixel shift caused by the exposure misalignment is formed. A filter substrate inspection apparatus, which transports a color filter substrate, an illumination unit that transmits and illuminates, an imaging unit that captures an image of the illuminated color filter substrate, and a reference image that has no color pixel misalignment. Image comparison processing means that performs whole image processing, projection comparison processing, and average brightness processing using the inspection image to determine the positional deviation of the colored pixels, and appearance inspection by comparing the same pattern in the captured image And a color filter substrate inspection device.

  In the invention according to claim 2 of the present invention, the entire image processing is performed after taking a difference in average brightness of pixels of the imaging camera of the reference image and the inspection image and adding the difference to the entire inspection image to generate a corrected inspection image. The color filter substrate inspection apparatus according to claim 1, wherein a difference image between the reference image and the corrected inspection image is obtained, and a position shift is determined when a preset threshold value 1 is exceeded.

In the invention according to claim 3 of the present invention, the projection comparison process is performed by integrating the brightness in the vertical direction and the horizontal direction of the reference image and the corrected inspection image in units of pixels of the imaging camera to obtain projection data. 3. The color filter substrate inspection apparatus according to claim 1, wherein the color filter substrate inspection apparatus according to claim 1, wherein the difference is obtained and the position deviation is determined when a preset threshold value 2 is exceeded.

  In the invention according to claim 4 of the present invention, the average brightness processing is performed by providing line segments at predetermined pitches in the horizontal direction and the vertical direction of the reference image and the corrected inspection image. 4. The color filter substrate inspection apparatus according to claim 1, wherein an average of the brightness in the image surrounded by is obtained, and a position shift is determined when a predetermined threshold value 3 is exceeded. 5. is there.

  The invention according to claim 5 of the present invention is characterized in that when a defect is detected by misalignment or visual inspection, an image of the defective portion and a determination result are displayed and the determination result is fed back. To 4. The color filter substrate inspection apparatus according to any one of items 1 to 4.

  With respect to the color filter exposed by an exposure apparatus using a small photomask, it is possible to confirm whether the exposure position has shifted with respect to the imposition of the entire surface of the substrate.

  By providing automatic appearance inspection means, the color filter substrate inspection apparatus according to the present invention can be installed on the same line as the existing color filter manufacturing process, and the position of the colored pixels can be achieved without a significant increase in equipment cost. Deviation and visual inspection are possible.

The figure which showed an example of the color filter used for a color liquid crystal display device in a cross section. The flowchart of the process of the photolithographic method generally used. The figure which shows an example of the color filter with which the four-sided pattern was attached. The figure for demonstrating an example of position alignment in the case of division | segmentation exposure, and exposure. The side view seen from the direction of the arrow 57 of the exposure apparatus 54 shown in FIG. The figure which shows the example which the exposure position shift of R pixel generate | occur | produced. FIG. 6A is a diagram showing R pixels that have been normally exposed. FIG. 6B is a diagram illustrating a case where an R pixel is shifted in exposure position. The figure which shows schematic structure figure of the color filter board | substrate inspection apparatus which concerns on this invention. The figure which shows the flow of the exposure position shift inspection method which concerns on this invention. The figure which shows the flow of the exposure position shift inspection method which concerns on this invention. The figure which shows the flow of the exposure position shift inspection method which concerns on this invention. The figure which shows the flow of the exposure position shift inspection method which concerns on this invention. The figure which shows the projection data of the reference | standard image which concerns on this invention. The figure which shows the grid line and grid which concern on this invention. The figure which shows the operation | movement flow of the color filter board | substrate inspection apparatus which concerns on this invention.

  Embodiments of an exposure misalignment inspection method and inspection apparatus according to the present invention will be described below with reference to the drawings.

FIG. 7 is a diagram showing a schematic configuration diagram of a color filter substrate inspection apparatus according to the present invention. The color filter substrate inspection apparatus includes a transport unit 73 that is a transport unit for transporting the color filter substrate 70 in the direction of an arrow 75, a transmission light source unit 71 that is an illumination unit that illuminates the color filter substrate 70, and an illuminated color filter. An imaging unit 72 that is an imaging unit that images the substrate 70, and a control unit 74 that includes an image comparison processing unit, and an appearance inspection that performs an appearance inspection by performing comparison processing on the same pattern that is close to the captured image that is not illustrated. Have means. Transmitted light source 7
1. The image pickup unit 72 and the transport unit 73 are connected to the control unit 74 and controlled by signals from the calculation unit. However, each control may be separately controlled by dedicated hardware instead of software control by the calculation unit. .

  The transmission light source unit 71 is installed so as to perform uniform illumination over the entire width in the direction orthogonal to the conveyance direction of the color filter substrate 70, and a halogen light source, for example, is used. In the imaging unit 72, a plurality of two-dimensional CCD cameras are arranged with respect to the entire width in the direction orthogonal to the conveyance direction of the color filter substrate 70. The two-dimensional CCD camera used here may be for monochrome, and the captured image data is converted into 256 gradation digital data by an image data processing unit (not shown). The transport unit 73 may transport the color filter substrate 70 with the transport roller 76, or may be provided with a stage for transporting, placing the color filter substrate 70 on the stage, and transporting the stage by moving the stage. good. Furthermore, the transmission light source unit 71 and the imaging unit 72 may be driven and moved while the color filter substrate 70 is mounted on a stationary mounting table.

  The control unit 74 includes a storage unit, a calculation unit, a misregistration detection unit, an appearance detection unit, an operation unit, and a display unit. The misregistration detection unit further includes a pattern matching processing unit, which is an image comparison processing unit, and an image cutout process. Unit, an image brightness processing unit, and a determination processing unit. The transport unit includes a measurement object delivery mechanism and a mechanical alignment mechanism.

  The storage unit is a storage medium such as an HDD or a magnetic disk, a read-only ROM, a temporary storage RAM, or the like. The operation unit is a keyboard, a mouse, and various buttons. The display unit is a monitor, a display lamp, or the like.

  8, 9, 10, and 11 show the flow of the exposure misalignment inspection method according to the present invention. In FIG. 8, after the start (S-1), first, an image of a normal color filter substrate that has been confirmed to have no exposure position deviation is obtained with respect to the color filter substrate that has been exposed and developed using a small photomask. (S-2). This is a reference image. Next, a characteristic pattern position in the image of the reference image is set as a characteristic position (S-3), and an image obtained by cutting out an image around the characteristic position is set in advance (S-4). In this case, the position coordinates of the image around the feature position in the reference image are held (S-5) and used as means for cutting out the image.

  Next, it shifts to inspection. When carrying out the inspection, first, an image of a part of the color filter substrate to be inspected is acquired (S-6). Using the image obtained by cutting out the image around the feature position set in step (S-4), pattern matching is performed on the image obtained in step (S-6) to obtain the feature position (S- 7). An image corresponding to the same coordinates as the position coordinates of the image around the feature position in the reference image held in step (S-5) is cut out from the inspection image acquired in step (S-6) (S-8). This is an inspection image.

  An average value of brightness is calculated over the entire images of the reference image acquired in step (S-2) and the inspection image cut out in step (S-8) (S-9), and the average of the averaged reference image is calculated. The difference between the average of the inspection images (this is called the average image of the inspection images) that is the same as the average image (this is called the average image of the reference image) is calculated (S-10), and the difference value is calculated as the difference value. It adds to the whole image of the inspection image cut out in step (S-8) (S-11) (this is called a corrected inspection image). By step (S-11), it is possible to correct variations in illumination intensity over time of the transmissive light source unit 71 when the reference image is obtained and when the inspection image is obtained.

Next, using each image processing method after step (S-12) shown in FIG. First, the entire image is compared. In the entire image comparison, first, a difference between the reference image acquired in step (S-2) and the corrected inspection image obtained in step (S-11) is obtained (S-12). This is called a difference image. Next, with respect to the difference image, the location with the highest brightness (MH) or the location with the lowest brightness (ML) is within a preset threshold 1 (high brightness threshold (MHSH) or low brightness threshold (MLSH)). If it is not (YES in (S-13)), it is determined that the position is shifted (S-14), and then the process ends (S-28). On the other hand, if (S-13) is NO, the process proceeds to the next step (S-15). A defect with a large misalignment can be detected by misregistration determination using the threshold 1, and the inspection time can be shortened without proceeding to the subsequent steps.

  Next, projection data comparison is performed after step (S-15) shown in FIG. First, with respect to the reference image obtained in step (S-2), a sum of brightness (so-called projection data) (referred to as projection data of the reference image) in each of the pixels constituting the image in the horizontal and vertical directions is obtained. (S-15). FIG. 12 shows the projection data of the reference image. Similarly, for the corrected inspection image obtained in step (S-11), projection data of brightness in the horizontal direction and the vertical direction is obtained for each pixel constituting the image (this is called projection data of the corrected inspection image) (S -16). Next, the absolute value | S | of the difference between the projection data of the reference image obtained in step (S-15) and the projection data of the corrected inspection image obtained in step (S-16) is obtained (S-17). When the difference is equal to or greater than the threshold (SH), which is the difference threshold 2 set in advance (YES in (S-18)), the position is judged to be misaligned (S-19), and the process ends (S-28). . On the other hand, if (NO in S-18), the process proceeds to the next step (S-20). When the color pixel is displaced in the horizontal direction or the vertical direction by the threshold value 2, it can be detected.

  Next, the average brightness comparison is performed after step (S-20) shown in FIG. First, for the reference image acquired in step (S-2), the horizontal axis is the X axis and the vertical direction is the Y axis, and a line segment is drawn at a preset pitch on each axis to create a grid-like line (S-20). This grid-like line is called a grid line, and a range surrounded by the grid lines is called a grid. FIG. 13 shows a grid line 70 and a grid 71. An average value of brightness of pixels in each grid is obtained (S-21). This is called the grid brightness average image of the reference image. The corrected inspection image obtained in step (S-11) also has an X axis in the horizontal direction and a Y axis in the vertical direction, and draws a line segment at a preset pitch on each axis to obtain a grid-like line segment. (S-22), and the average value of the brightness of each grid is obtained (S-23). This is called a grid brightness average image of the corrected inspection image.

  Next, the absolute value of the difference in lightness for each grid between the grid lightness average image of the reference image obtained in step (S-21) and the grid lightness average image of the corrected inspection image obtained in step (S-23). The value │GS│ is obtained (S-24), and if it is equal to or greater than the threshold value of grid brightness (GSH), which is the threshold value 3 set in advance (in the case of YES in (S-25)), it is determined that there is a displacement (S- 26). On the other hand, in the case of NO in (S-25), it is determined that there is no displacement (S-27), and then the process ends (S-28). With the threshold 3, it is possible to detect a defect that is misaligned in both the horizontal and vertical directions and has a small misalignment amount.

  Even when pattern matching for acquiring a feature position fails in step (S-7), it is determined that a positional deviation has occurred.

  FIG. 14 shows an operation flow of the color filter substrate inspection apparatus according to the present invention. The color filter substrate to be inspected is transferred to the transfer roller 73 by a transfer mechanism such as a transfer device robot or a conveyor. Various parameters used for imaging data processing are set in advance in the imaging data processing unit from the storage unit.

First, after the start (K-1), the next presetting is performed. First, as the parameters, an upper limit threshold (MHSH) and a lower limit threshold (MLSH) of the difference image, a threshold (SH) of the difference between the projection data of the reference image and the projection data of the corrected inspection image, and an average grid brightness image of the reference image and the correction inspection A threshold value (GSH) of the grid brightness average image difference of the images is set (K-2), stored in the storage unit, and set in the imaging data processing unit. Further, a reference image, a feature position, and an image around the feature position are set (K-3), and the image data and position data are stored in the storage unit and set in the imaging data processing unit.

  Next, the color filter substrate is transferred to the transport unit 73 (K-4), and the substrate position is corrected by the alignment mechanism of the transport unit (K-5). The color filter substrate is transported on the transport roller 76 of the transport unit 73, and a part of the color filter substrate is captured by the image capturing camera 72 when passing between the image capturing unit 72 and the transmission light source unit 71 (K-6). The image data is subjected to a pattern matching process by a position shift detection unit (K-7), and further an image cut-out process is performed (K-8). The brightness of the cut out image data is adjusted by the image brightness processing unit (K-9), and a corrected inspection image is generated (K-10).

  The image data whose brightness has been adjusted is subjected to overall image comparison, projection comparison, and average brightness comparison by an image comparison processing unit, and a positional deviation determination process is performed (K-11).

  Next, a defect detection determination process is performed by comparing the adjacent identical patterns with the imaging data by the appearance inspection unit (K-12). The adjacent identical pattern comparison is performed by employing a conventionally used image processing technique.

  When a defect is detected by the positional deviation determination process and the defect detection determination process, the defect portion image and the determination result are displayed on the display unit (K-13). After the determination, the color filter substrate is paid out by the transfer mechanism of the transport unit (K-14).

  When a defect is displayed by the positional deviation determination process and the defect detection determination process, it is displayed on the display unit and the determination result is fed back, and by performing maintenance such as readjustment of the processing apparatus in the manufacturing process, Prevent the occurrence of the same defect.

  According to the color filter substrate inspection apparatus of the present invention, the exposure misalignment inspection that occurs when exposing the R pixel, G pixel, and B pixel patterns of the color filter that is multifaceted using a small photomask is multifaceted. This can be done for all impositions.

  In addition, by providing an appearance inspection function, the line configuration is the same as that of an existing color filter manufacturing process, and it is possible to detect an exposure misalignment without a significant increase in price.

DESCRIPTION OF SYMBOLS 1 ... Color filter 2 ... Glass substrate 3 ... Black matrix (BM)
4-1 ... Red R colored pixels (R pixels)
4-2 ... Green G coloring pixel (G pixel)
4-3 ... Blue B colored pixels (B pixels)
5 ... Transparent electrode 6 ... Photospacer (PS)
7 ... Vertical alignment (VA)
41 ... Color filter pattern 42 ... Glass substrate 51 ... Loading conveyor 52 ... Alignment stage 53 ... Loading / unloading robot 54 ... Exposure apparatus body 55 ... Unloading conveyors 56a, 56b, 56c, 56d ... on the carry-in conveyor, on the alignment stage, on the exposure apparatus main body, on the carry-out conveyor, the glass substrate 57 ... the arrow 61 indicating the direction of the exposure apparatus main body viewed from the side 61 ... the exposure stage 62 ...・ Exposure unit 63 ... light source 64 ... photomask 66 ... BM
67 ... R pixel 68 ... White part

Claims (5)

  A color filter substrate inspection apparatus for inspecting a color pixel shift caused by an exposure position shift when a red, green, and blue color pixel is exposed and developed in a color filter manufacturing process to form a pattern. The entire image processing and projection comparison using the transporting means for transporting the image, the illumination means for transmitting illumination, the imaging means for imaging the illuminated color filter substrate, the reference image without color pixel misalignment and the captured inspection image Image comparison processing means that performs processing and average lightness processing to determine misalignment of colored pixels, and appearance inspection means that performs a visual inspection by comparing and processing the same adjacent pattern of captured images. Characteristic color filter substrate inspection device.   The entire image processing takes the difference in the average brightness of the pixels of the imaging camera of the reference image and the inspection image, adds the difference to the entire inspection image to generate a corrected inspection image, and then calculates the difference image between the reference image and the corrected inspection image. The color filter substrate inspection apparatus according to claim 1, wherein the color filter substrate inspection apparatus is determined and determined to be misalignment when exceeding a preset threshold value 1.   In the projection comparison process, the brightness in the vertical direction and the horizontal direction of the reference image and the corrected inspection image are each integrated by the pixel unit of the imaging camera to obtain projection data, and a difference between the two projection data is obtained and exceeds a preset threshold value 2. The color filter substrate inspection apparatus according to claim 1, wherein the color filter substrate inspection apparatus is determined to be misalignment.   In the average brightness process, line segments are provided at predetermined pitches in the horizontal and vertical directions of the reference image and the corrected inspection image, and the average brightness in the image surrounded by the line segments in the reference image and the corrected inspection image is calculated. 4. The color filter substrate inspection apparatus according to claim 1, wherein the color filter substrate inspection apparatus is determined and determined to be misalignment when a preset threshold value 3 is exceeded.   5. The color filter substrate according to claim 1, wherein when a defect is detected by misalignment or visual inspection, an image of the defective portion and a determination result are displayed and the determination result is fed back. Inspection device.

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