JP2011047127A - Window structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a window structure capable of suppressing dew condensation. <P>SOLUTION: This window structure includes: a window frame 25 with an opening; a window plate 12 which is arranged in the opening of the window frame 25; a thermoelectric conversion module 20 which is provided in the window frame 25; and a resistor 11 which is supplied with electric power output from the thermoelectric conversion module 20 and provided in the window plate 12. The window frame 25 comprises a first window frame member 15 which is exposed on the one surface side of the window plate 12, and a second window frame member 5 which is exposed on the other surface side of the window plate. A low-temperature side of the thermoelectric conversion module 20 is thermally connected to the first window frame member 15; and a high-temperature side of the thermoelectric conversion module is thermally connected to the second window frame member 5. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a window structure.

  In winter, outdoor temperatures are low, while indoor temperatures are high due to heating. Moisture in the indoor air is condensed when it comes into contact with the window plate cooled by the outdoor cold air. Water droplets attached to the window plate due to condensation may cause mold on the window plate or window frame.

  Patent Document 1 describes a window structure in which a Peltier element is arranged on a side surface on the indoor side of a member that supports the periphery of a window glass. The Peltier element is used to dehumidify the air by cooling the air, and the Peltier element. It is disclosed that condensation of the window glass is prevented by heating the gas near the window glass by the waste heat of the element.

JP-A-08-128285

  However, the conventional window structure cannot sufficiently prevent the window glass from condensing.

  Then, an object of this invention is to provide the window structure which can suppress dew condensation more.

  That is, the present invention relates to a window frame having an opening, a window plate disposed in the opening of the window frame, a thermoelectric conversion module provided in the window frame, power supplied from the thermoelectric conversion module, and a window. A resistor provided on the plate, and the window frame includes a first window frame member exposed on one side of the window plate and a second window frame member exposed on the other side of the window plate. And a window structure in which a low temperature side of the thermoelectric conversion module is thermally connected to a first window frame member, and a high temperature side of the thermoelectric conversion module is thermally connected to a second window frame member.

  According to the window structure of the present invention, when a difference in temperature occurs between one side and the other side of the window plate, a temperature difference is generated between the first window frame member and the second window frame member. Thus, the thermoelectric conversion module outputs power. Then, the window plate is heated by supplying this electric power to the resistor. Therefore, it is possible to reduce the occurrence of condensation on the surface of the window plate.

  Here, in the window structure according to the present invention, it is preferable that the first window frame member and the second window frame member are each made of metal mainly composed of aluminum.

  Since the metal mainly composed of aluminum has good thermal conductivity, the thermoelectric conversion module can generate electric power and output electric power by efficiently utilizing the temperature difference between the inside and outside.

  In the window structure according to the present invention, the window plate is preferably a glass plate.

  Although glass tends to condense, according to the present invention, condensation can be more effectively suppressed.

  In the window structure according to the present invention, the resistor is preferably a conductive film.

  Since the resistor is a conductive film, it is easy to obtain a transparent resistor. If the resistor is transparent, light can pass through, so that the function of the window plate is hardly impaired.

  In the window structure according to the present invention, the resistor is preferably provided on the other surface of the window plate.

  Of the two surfaces of the window plate, a resistor is provided on the surface that comes into contact with the relatively higher temperature air, thereby suppressing the heat generated by the resistor from being radiated to the air. And the window plate can be efficiently heated.

  In the window structure according to the present invention, it is preferable that the resistor is further provided on the second window frame member.

  Thereby, in addition to the window plate, condensation on the second window frame member can also be suppressed.

  ADVANTAGE OF THE INVENTION According to this invention, the window structure which can suppress dew condensation more can be provided.

FIG. 1 is a schematic view showing an example of a preferred embodiment of a window structure according to the present invention. 2 is a schematic cross-sectional view along the dotted line Ia-Ia of the window structure of FIG. FIG. 3 is a schematic cross-sectional view along the dotted line Ib-Ib of the window structure of FIG. FIG. 4 is a schematic view showing another example of a preferred embodiment of a window structure according to the present invention. FIG. 5 is a schematic view showing another example of the preferred embodiment of the window structure according to the present invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted. In addition, the dimensional ratio in each drawing does not necessarily match the actual dimensional ratio.

(First embodiment)
First, the window structure 1 according to the first embodiment will be described with reference to FIGS. Here, FIG. 1 is a front view of an example of the window structure 1, FIG. 2 is a schematic cross-sectional view along the dotted line Ia-Ia in the portion of the window frame 25 of the window structure 1 shown in FIG. 1, and FIG. It is a schematic cross section along dotted line Ib-Ib in the window structure of 1.
As shown in FIG. 1, the window structure 1 according to the present embodiment is provided in a window frame 25 having an opening 25 a, a window plate 12 disposed in the opening 25 a of the window frame 25, and the window frame 25. The thermoelectric conversion module 20 and the resistor 11 provided with the electric power output from the thermoelectric conversion module 20 and provided on the window plate 12 are provided.

(Window frame)
As shown in FIGS. 1 and 3, the window frame 25 includes a rectangular window-shaped first window frame member 15 and second window frame member 5, which are fixed so as to face each other by a fixing member 30 such as a screw. Has been.
The first window frame member 15 is disposed so as to be exposed on one side of the window plate 12 (in this embodiment, the low temperature environment side, the lower side in FIG. 3), and the second window frame member 5 is disposed on the window plate 12. It arrange | positions so that it may expose to the other surface side (this embodiment high temperature environment side, the upper side of FIG. 3). Here, the material of the 1st and 2nd window frame members 15 and 5 is not specifically limited, Various metal materials, such as a metal which has aluminum as a main component, polyvinyl chloride, polyethylene, polypropylene, acrylic, polyethylene terephthalate, fluorine Various resin materials such as resin and urethane resin, or various kinds of wood can be used.

(Window plate)
The window board 12 is arrange | positioned so that the opening part 25a of the window frame 25 may be plugged up. Examples of the material of the window plate 12 include acrylic resin and glass. In particular, glass has relatively high thermal conductivity and is likely to condense. However, according to the invention according to the present embodiment, condensation can be effectively suppressed even if the window plate 12 is a glass plate. Note that the window plate 12 may not be transparent. The window plate may be a stack of a plurality of plates.

  As shown in FIG. 3, the window plate 12 is sandwiched between the first window frame member 15 and the second window frame member 5 via, for example, a resin packing 14, and the first window frame member 15 and the second window frame member 15. The window frame 25 is fixed to the window frame 25 by screws 30 that pass through and fix the window frame member 5.

(Resistor)
As shown in FIG. 1, the resistor 11 is disposed on the surface of the window plate 12. As the resistor 11, a circuit formed of a conductive film can be preferably used. A circuit formed from the conductive film can be formed by, for example, a sputtering method, a CVD method, a plating method, or the like. For example, a conductive film having a thickness of about 0.1 μm to 0.5 μm and a width of about 0.5 mm to 5 mm is almost transparent, and light can pass through when the resistor 11 is formed of such a conductive film. It is preferable because the function of the window plate is hardly impaired. As the material of the conductive film, for example, a tin oxide material such as ITO (Indium Tin Oxide) or tin oxide, a zinc oxide material such as GZO (Gallium Zinc Oxide) or AZO (Aluminum Zinc Oxide), or the like can be used. . The shape of the conductive film circuit is not particularly limited, and examples thereof include a spiral shape, a meandering shape, and a straight shape. In FIG. 1, it is meandering. The resistor 11 is supplied with electric power from a thermoelectric conversion module 20 to be described later via a lead 13. The resistor 11 is not limited to a circuit formed of a conductive film, and a resistance wire such as a nichrome wire may be attached.

  The location of the resistor 11 on the window plate 12 is not particularly limited. However, from the viewpoint of sufficiently preventing condensation of the window plate 12 by the heat generated from the resistor 11, the resistor 11 is a figure. As shown in FIG. 1, it is preferably formed over the entire surface of the window plate 12. Moreover, a resistor is a side made into high temperature environment among the both surfaces of the window board 12, ie, the upper surface (surface on the side by which the 2nd window frame member 5 is arrange | positioned, figure) in this embodiment. 3)). Thereby, it can suppress that the heat | fever of the resistor 11 is discharge | released outside, and can heat a window plate efficiently.

(Thermoelectric conversion module)
As shown in FIG. 3, the thermoelectric conversion module 20 is sandwiched between the first window frame member 15 and the second window frame member 5 of the window frame 25, and is arranged so as to sandwich the window plate 12 as shown in FIG. Has been. In this embodiment, as shown in FIGS. 2 and 3, the first substrate 17 on the low temperature side of the thermoelectric conversion module 20 comes into contact with the first window frame member 15 so that they are thermally connected to each other, When the second substrate 7 on the high temperature side of the thermoelectric conversion module 20 comes into contact with the second window frame member 5, they are thermally connected to each other.

  As shown in FIG. 2, the thermoelectric conversion module 20 includes a plurality of thermoelectric conversion elements 10 connected in series between the first substrate 17 and the second substrate 7.

  The thermoelectric conversion module 20 includes a first substrate 17, a first electrode 18, a p-type thermoelectric conversion element 3 and an n-type thermoelectric conversion element 4 as the thermoelectric conversion element 10, a second electrode 8, and a second substrate 7. Is provided. The p-type thermoelectric conversion element 3 and the n-type thermoelectric conversion element 4 are alternately arranged between the first substrate 17 and the second substrate 7, and the first electrode 18 and the second electrode corresponding to both of these surfaces are arranged. The two electrodes 8 are electrically connected in series as a whole.

  The first substrate 17 has, for example, a rectangular shape, is electrically insulative and has thermal conductivity, and covers one end of the plurality of thermoelectric conversion elements 10. Examples of the material for the first substrate include alumina, aluminum nitride, magnesia, silicon carbide, zirconia, and mullite.

  The first electrode 18 is provided on the first substrate 17 and electrically connects one end faces of the thermoelectric conversion elements 10 adjacent to each other. The first electrode 18 can be formed at a predetermined position on the first substrate 17 by using a thin film technique such as sputtering or vapor deposition, or a method such as screen printing, plating, or thermal spraying. Further, a metal plate or the like having a predetermined shape may be bonded onto the first substrate 17 by soldering, brazing, or the like. The material of the first electrode 18 is not particularly limited as long as it has conductivity, but from the viewpoint of improving the heat resistance, corrosion resistance, and adhesion to the thermoelectric conversion element of the electrode, titanium, vanadium, chromium, manganese A metal containing at least one element selected from the group consisting of iron, cobalt, nickel, copper, molybdenum, silver, palladium, gold, tungsten and aluminum as a main component is preferable. Here, the main component refers to a component contained in the electrode material by 50% by volume or more.

  The second substrate 7 has a rectangular shape, for example, and covers the other end side of the thermoelectric conversion element 10. Further, the second substrate 7 is disposed to face the first substrate 17 in parallel. Similarly to the first substrate 17, the second substrate 7 is not particularly limited as long as it is electrically insulating and has thermal conductivity. For example, alumina, aluminum nitride, magnesia, carbonization, etc. Materials such as silicon, zirconia, and mullite can be used.

  The second electrode 8 is for electrically connecting the other end faces of the thermoelectric conversion elements 10 adjacent to each other. For example, thin film technology such as sputtering or vapor deposition, screen printing, It can be formed using a method such as plating or thermal spraying. The thermoelectric conversion element 10 is electrically connected in series by the second electrode 8 and the first electrode 18 provided on the lower end surface side of the thermoelectric conversion element 10.

  There are two types of thermoelectric conversion elements 10, a p-type thermoelectric conversion element 3 and an n-type thermoelectric conversion element 4. The material which comprises each thermoelectric conversion element 10 will not be specifically limited if it has the property of a p-type semiconductor or an n-type semiconductor, Various materials, such as a metal and a metal oxide, can be used.

  Here, examples of the material for the p-type thermoelectric conversion element and the n-type thermoelectric conversion element include the following materials.

For example, as a p-type material, a metal composite oxide such as Na _x CoO ₂ (0 <x <1), Ca ₃ Co ₄ O ₉ , MnSi _1.73 , Fe _1-x Mn _x Si ₂ , Si _{0 .8} Ge _0.2 : B (B-doped Si _0.8 Ge _0.2 ), silicide such as β-FeSi ₂ , CoSb ₃ , FeSb ₃ , RFe ₃ CoSb ₁₂ (R represents La, Ce, or Yb) Skutterudites such as PbTeSb, Bi ₂ Te ₃ , alloys containing Te such as PbTe, Sb ₂ Te ₃ , Bi _2−x Sb _x Tb ₃ (0 <x <2), Zn ₄ Sb _{3 and the} like. .

Examples of the n-type material include SrTiO ₃ , Zn _1-x Al _x O, CaMnO ₃ , LaNiO ₃ , BaTiO ₃ , Ti _1-x Nb _x O, and other metal composite oxides, Mg ₂ Si, Fe _1-x Co _x Si ₂ , Si _0.8 Ge _0.2 : P (P-doped Si _0.8 Ge _0.2 ), silicide such as β-FeSi ₂ , skutterudite such as CoSb ₃ , Ba ₈ Al _{12 Si 30, Ba 8 Al x} Si 46-x, Ba 8 Al 12 Ge 30, Ba clathrate compound such as _{8 Al x Ge 46-x,} CaB 6, SrB 6, BaB 6, CeB boron compounds such as _{6, Bi 2 Te 3-x Se x} (0 <x <0.1), PbTeSb, Bi 2 Te 3, Sb 2 Te 3, an alloy containing Te such as PbTe, _Zn 4 Sb ₃ Hitoshigakyo It is.

Considering that the frequency of using the thermoelectric conversion module at a room temperature to 70 ° C. is high, from the viewpoint of power generation efficiency, the p-type thermoelectric conversion element and the n-type thermoelectric conversion element are Te ₂ such as Bi ₂ Te ₃ among the above materials. Alloys containing are preferred. Among them, Bi _2-x Sb _x Tb ₃ (0 <x <2) is preferable as the p-type material, and Bi ₂ Te _3-x Se _x (0 <x <0. 1) is preferred.

  A bonding material 9 is provided between the thermoelectric conversion element 10 and the first electrode 18 and the second electrode 8. The bonding material 9 bonds the thermoelectric conversion element 10 to the first electrode 18 and the second electrode 8, and electrically connects the plurality of thermoelectric conversion elements 10 in series. Examples of the bonding material 9 include AuSb, PbSb-based solder, silver paste, and the like. This bonding material is preferably solid when used as a thermoelectric conversion module.

  The plurality of thermoelectric conversion modules 20 are connected to each other in series by electrodes, leads, etc. (not shown). The thermoelectric conversion modules 20 connected in series are electrically connected to both ends of the resistor 11 by leads 13, and the electric power generated in the thermoelectric conversion module 20 is supplied to the resistor 11. In addition, in this embodiment, although the several thermoelectric conversion module is used, the thermoelectric conversion module 20 may be one.

  According to this embodiment, for example, in winter, the temperature on the upper side (for example, indoors) of the window plate 12 of the window structure 1 is high, and the temperature on the lower side (for example, outdoor) is low, and there is a temperature difference between them. When it arises, a temperature difference arises between the 1st window frame member 15 and the 2nd window frame member 5, and the thermoelectric conversion module 20 thermally connected with these generate | occur | produces the electric power according to a temperature difference. And this electric power is supplied to the resistor 11, and the window 11 is heated when the resistor 11 generates heat. According to such a window structure 1, it is possible to suppress the occurrence of condensation on the upper surface of the window plate 12 when warm air above the window plate 12 contacts the window plate 12.

  In particular, when the first window frame member 15 and the second window frame member 5 are made of a metal such as a metal having aluminum as a main component, thermoelectric conversion is performed by efficiently utilizing the temperature difference between the inside and outside because the heat conductivity is high. The module can generate electricity and is very effective in preventing condensation.

  According to the present embodiment, no external power is required, no power storage is required, and the higher the temperature difference between the inside and outside, the greater the amount of heat generated by the resistor. Therefore, it is possible to efficiently suppress the condensation of the window plate when necessary. Further, since wiring with the outside is not required, it is possible to easily install such a window structure and open and close such a window structure.

(Second embodiment)
Next, the window structure 40 according to the second embodiment will be described with reference to FIG. In the window structure 40 according to the second embodiment, the resistor 11 is disposed only on the surface of the window plate 12 along the window frame 25. Water droplets are likely to adhere to the window plate 12 in the vicinity of the window frame 25, and according to the window structure according to the present embodiment, the window plate 12 in the vicinity of the window frame 25 is selectively heated, so that dew condensation on the window plate 12 occurs. Can be effectively prevented. Further, since there is no resistor 11 in the central portion of the window plate 12, even if the resistor 11 is opaque, it is difficult to block the field of view.

  For example, if the main component of the window frame material is aluminum, the thermal conductivity of aluminum is high, so that water droplets are likely to adhere to the window plate 12 near the window frame 25. According to the window structure according to the present embodiment, the window plate 12 in the vicinity of the window frame 25 is selectively heated, so that condensation of the window plate 12 can be more effectively prevented.

(Third embodiment)
Next, the window structure 50 according to the third embodiment will be described with reference to FIG. In the window structure 50 according to the third embodiment, the resistor 11 is further provided on the second window frame member 5 in the window structure according to the first embodiment. Thereby, in addition to the window plate 12, dew condensation on the second window frame member 5 can also be suppressed.

  In the third embodiment, the resistor 11 provided on the surface of the window plate 12 and the resistor 11 provided on the second window frame member are connected in series to the thermoelectric conversion module 20. May be connected in parallel.

  The preferred embodiment according to the present invention has been described above, but the present invention is not limited to the above-described embodiment. For example, in the present embodiment, the resistor 11 is disposed on the upper surface of the window plate 12 (the surface on the side where the second window frame member 5 is disposed, see FIG. 3) and the surface of the second window frame member 5. Although the resistor 11 has been described, the resistor 11 includes the inside of the window plate 12, the lower surface of the window plate 12 (the surface on the side where the first window frame member 15 is disposed, see FIG. 3), the second window frame. The present invention can be implemented even if it is arranged inside the member 5 or on the surface or inside of the first window frame member 15.

  Moreover, in the said embodiment, the edge part of the low temperature side of the thermoelectric conversion module 20 and the edge part of a high temperature side are directly contacting with each of the 1st window frame member 15 and the 2nd window frame member 5, respectively. However, these may be thermally connected through another member having thermal conductivity.

  Moreover, in the said embodiment, although the 1st window frame member 15 and the 2nd window frame member 5 are formed separately, these may be formed integrally. The first window frame member 15 and the second window frame member 5 are not limited in any form as long as they are exposed on one side and the other side of the window plate 12, respectively. The fixing method is not particularly limited.

  Further, the form of the thermoelectric conversion module is not particularly limited. For example, there is no pair of substrates 7 and 17 facing each other in the thermoelectric conversion module 1 as shown in FIGS. 1 to 3, and instead, the height of each thermoelectric conversion element 10 is interposed between a plurality of thermoelectric conversion elements 10. A so-called skeleton-type thermoelectric conversion module 20 may be provided that includes a support frame that is held so as to surround the central portion of the direction and fixes each thermoelectric conversion element at an appropriate position. In this case, the low temperature side and the high temperature side of the thermoelectric conversion module are the electrodes 18 and 8. Here, when each window frame member is a conductive material, it is preferable to interpose an insulating film between the window frame member and the electrode in order to prevent a short circuit.

  Further, the window structure may be an open / close type or a fitting type.

  DESCRIPTION OF SYMBOLS 1, 40, 50 ... Window structure 3, 4, 10 ... Thermoelectric conversion element, 5 ... 2nd window frame member, 11 ... Resistor, 12 ... Window board, 15 ... 1st window frame member, 20 ... Thermoelectric conversion module 25 ... Window frame.

Claims (6)

A window frame having an opening; a window plate disposed in the opening of the window frame; a thermoelectric conversion module provided in the window frame; and an electric power output from the thermoelectric conversion module is supplied and the window plate And a resistor provided in
The window frame includes a first window frame member exposed on one side of the window plate, and a second window frame member exposed on the other side of the window plate,
A window structure in which a low temperature side of the thermoelectric conversion module is thermally connected to the first window frame member, and a high temperature side of the thermoelectric conversion module is thermally connected to the second window frame member.   2. The window structure according to claim 1, wherein each of the first window frame member and the second window frame member is made of a metal mainly composed of aluminum.   The window structure according to claim 1, wherein the window plate is a glass plate.   The window structure according to claim 1, wherein the resistor is a conductive film.   The window structure according to any one of claims 1 to 4, wherein the resistor is provided on the other surface of the window plate.   The window structure according to any one of claims 1 to 5, wherein a resistor is further provided on the second window frame member.

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