JP2011040531A - Method of manufacturing laminated electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated electronic component that can improve cutting yield and also improve manufacturing efficiency. <P>SOLUTION: All cutting schedule lines CL can be determined by computing only three parameters of a cutting reference position, a cutting interval, and a cutting angle. Therefore, the load on the computation can be greatly reduced as compared with one-by-one computation of the respective cutting schedule lines. Further, cutting yield is estimated and the cutting schedule lines CL are optimized based upon an estimation result to improve the cutting yield. Furthermore, when the cutting yield is estimated, the estimation is carried out based upon positions of a predetermined number of sampling internal electrodes SP1 to SP9 to reduce the load of computation needed for the estimation even when the number of laminated electronic components that can be obtained from each laminate 100 becomes large. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multilayer electronic component.

  As a conventional method for manufacturing a multilayer electronic component, an image of an internal electrode is obtained by irradiating a laminated body in which a plurality of internal electrodes are arranged with visible light and transmitting the laminate with an X-ray camera, and based on the image It is known that a plurality of laminated body electronic components are created by creating cutting position data and cutting the laminated body with a cutting device along the cutting position data (see, for example, Patent Document 1). In this manufacturing method, cutting position data for one row is created based on the image of the internal electrode, and further, cutting position data for adjacent rows is created, and thus the cutting position data for all the rows is created one by one. create.

JP 2002-299153 A

  In the above-described manufacturing method of the multilayer electronic component, it is necessary to grasp the positions of all the internal electrodes from the image obtained by the X-ray camera, and it is necessary to create cutting position data one by one for all the columns. Therefore, calculation for grasping the positions of all the internal electrodes is required, and calculation for all the cutting position data one by one is required, so that the calculation load is very large. In particular, when the number of multilayer electronic components that can be acquired from a single laminate is increased, the calculation load further increases. On the other hand, when the cutting position data is calculated simply by reducing the amount of calculation, there is a possibility that the cutting position accuracy is lowered and the cutting yield is lowered. Therefore, it has been desired to improve the cutting yield and the manufacturing efficiency.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a method for manufacturing a multilayer electronic component that can improve the cutting yield and the manufacturing efficiency.

  The method of manufacturing a multilayer electronic component according to the present invention cuts a laminate formed in a plate shape by laminating a dielectric layer and an internal electrode layer in which a plurality of internal electrodes are arranged in a planar direction. A manufacturing method for manufacturing a plurality of multilayer electronic components, wherein a multilayer body in which a plurality of internal electrodes are arranged in a first direction and a second direction orthogonal to the first direction is prepared. A preparatory step, an internal electrode position acquisition step of acquiring the respective positions in the plane direction of a predetermined number of sampling internal electrodes among a plurality of internal electrodes by capturing an image transmitted through the inside of the laminate; As parameters of the scheduled cutting lines arranged in the direction, the cutting reference position indicating the position of the reference cutting scheduled line serving as a reference, the cutting interval indicating the interval between the cutting scheduled lines, and the cutting scheduled line Based on the planned cutting line setting step for setting the cutting angle indicating the angle in the surface direction, the position of the sampling internal electrode acquired in the internal electrode position acquisition step, and the planned cutting line set in the planned cutting line setting step, Based on the cutting yield estimation process for estimating the cutting yield and the estimation result estimated in the cutting yield estimation process, an optimum value of the cutting reference position, cutting interval, or cutting angle set in the scheduled cutting line setting process is obtained. A cutting planned line optimization step for optimizing the cutting planned line, and a laminate cutting step for cutting the laminated body based on the cutting planned line optimized in the cutting planned line optimization step. It is characterized by.

  In the manufacturing method of the multilayer electronic component according to the present invention, in the scheduled cutting line setting step, while setting a plurality of scheduled cutting lines by setting three parameters of a cutting reference position, a cutting interval, and a cutting angle, Each position in the plane direction of the sampling internal electrode can be acquired in the internal electrode position acquisition step. In the cutting yield estimation step, the cutting yield is estimated based on the set cutting scheduled line and the position of the sampling internal electrode, and the optimum value of each parameter is obtained based on the estimation result in the cutting planned line optimization. The cutting line can be optimized. And in a laminated body cutting process, a laminated body can be cut | disconnected based on the cutting scheduled line optimized. By calculating only the three parameters of the cutting reference position, the cutting interval, and the cutting angle, it is possible to determine all the planned cutting lines that are required to cut the laminate. Therefore, the calculation load can be reduced as compared with the case of calculating each cutting scheduled line one by one. In particular, when the number of internal electrodes is increased, the calculation load can be greatly reduced. Moreover, it is possible to improve the cutting yield by estimating the cutting yield for the once scheduled cutting line and optimizing the scheduled cutting line based on the estimation result. In addition, when estimating the cutting yield, it is not estimated based on the positions of all the internal electrodes, but by estimating based on the positions of a predetermined number of sampling internal electrodes, Even when the number of multilayer electronic components that can be obtained from the above increases, it is possible to reduce the computational load required for estimation. As described above, the manufacturing yield of the multilayer electronic component can be improved by improving the cutting yield and reducing the calculation load.

  Further, in the method for manufacturing a multilayer electronic component according to the present invention, the scheduled cutting line setting step, the cutting yield estimation step, and the planned cutting line optimization step are performed a plurality of times, and in the planned cutting line optimization step, the cutting reference position After the optimum value of one parameter among the cutting interval and the cutting angle is obtained, a scheduled cutting line setting step for setting a new scheduled cutting line is performed by substituting the optimum value into the one parameter. In a new cutting scheduled line, the value of another parameter different from the one parameter is changed, and a yield estimation step for estimating the yield at each value is performed, and the optimum value of the other parameter is determined based on the estimation result of the yield It is preferable to perform a cutting scheduled line optimization step for calculating. After the optimum value of one parameter is obtained, the cutting yield is estimated for a new cutting scheduled line that reflects the optimum value, and the optimum value of the other parameter is calculated, thereby improving the accuracy of the cutting planned line. Can be increased. Thereby, the cutting yield can be further improved.

  Here, the inventors of the present invention have not optimized the cutting reference position. For example, when the reference cutting scheduled line itself overlaps the internal electrode, the cutting angle and the cutting interval are optimized. However, it was found that it is preferable to first optimize the cutting reference position because the cutting yield cannot be improved. Furthermore, the inventors of the present invention can improve the cutting yield even if the cutting interval is optimized, for example, when the cutting angle of the planned cutting line is greatly inclined with respect to the internal electrode. Therefore, it has been found that it is preferable to optimize the cutting angle before the cutting interval.

  Therefore, in the method for manufacturing a multilayer electronic component according to the present invention, in the cutting scheduled line optimization step, when it is the first optimization, the cutting reference position is optimized, and the cutting reference is determined in the previous optimization. If the position is optimized, the cutting angle is optimized.If the cutting angle is optimized in the previous optimization, the cutting interval is optimized, and the previous optimization is performed. When the cutting interval is optimized in step 1, it is preferable that the cutting reference position is optimized. Thereby, the optimum value can be calculated in the order of the cutting reference position, the cutting angle, and the cutting interval with respect to the three parameters of the scheduled cutting line. Thus, by optimizing the parameters in a suitable order, it is possible to increase the accuracy of the line to be cut and reduce the calculation load.

  Further, in the method for manufacturing a multilayer electronic component according to the present invention, the positioning marks formed at the four corners in the planar direction of the rectangular flat plate-like laminate are detected before the scheduled cutting line setting step, It is preferable to further have a laminated body positioning step for positioning the laminated body in the planar direction based on it. If the laminated body is shifted with respect to the cutting device or the camera, the cutting scheduled line set in the cutting scheduled line setting process is also set to be shifted with respect to the internal electrode, and optimization is performed. The calculation at the time increases. However, by performing positioning based on the positioning marks at the four corners of the laminate in the previous stage of the scheduled cutting line setting process, it is possible to set an appropriate scheduled cutting line in the scheduled cutting line setting process. Thereby, it is possible to reduce the calculation load in the cutting scheduled line optimization process.

  In the method for manufacturing a multilayer electronic component according to the present invention, in the internal electrode position acquisition step, at least two internal electrodes existing in different rows in the second direction are acquired as sampling internal electrodes, and one sampling is performed. The internal electrode is preferably present in a row adjacent to the other sampling internal electrode in the first direction. As a result, if the cutting interval of the planned cutting line is negligibly large with respect to the internal electrode, it is only necessary to change the cutting reference position to the position of the sampling internal electrode adjacent in the first direction, and the optimum value of the cutting reference position Can be obtained, and the calculation load can be reduced.

  Further, in the method for manufacturing a multilayer electronic component according to the present invention, in the internal electrode position acquisition step, the position of at least one internal electrode may be acquired for each column in the first direction as the sampling internal electrode. preferable. As a result, if the cutting interval of the planned cutting line is negligibly large with respect to the internal electrode, the sampling existing in each column in the first direction wherever the reference cutting planned line exists in the first direction. If it overlaps with the internal electrode, it can be determined as an NG product, so that the cutting yield can be accurately estimated.

  Further, in the method of manufacturing a multilayer electronic component according to the present invention, in the cutting yield estimation step, the cutting yield is estimated by comparing the position of a pair of cutting scheduled lines adjacent to each other and the position of the sampling internal electrode. It is preferable that the verification is performed for all sets of a plurality of scheduled cutting lines. As a result, even if the sampling internal electrode does not exist between the scheduled cutting lines on the end side, it can be determined that it is an OK product if it exists between the other scheduled cutting lines. Therefore, even if the cutting reference position is shifted, the cutting yield can be estimated, and as a result, the manufacturing efficiency can be improved.

  Further, in the method for manufacturing a multilayer electronic component according to the present invention, in the internal electrode position acquisition step, by irradiating transmitted light so as to produce a difference in shade according to the overlapping ratio of the internal electrodes in the stacking direction (for example, It is preferable to take an image (as shown in FIG. 19). As a result of the difference in shading, the coordinate position of the overlapping portion of each sampling internal electrode can be acquired.

  In the multilayer electronic component manufacturing method according to the present invention, in the internal electrode position acquisition step, an image transmitted through the multilayer body (for example, as shown in FIG. 19) is captured a plurality of times. It is preferable that the coordinates of the darkly projected portion and the lightly projected portion are acquired for a plurality of images, the average value thereof is calculated, and the position of the sampling internal electrode is acquired based on the calculated average value. As a result, the accuracy of acquiring the position of the sampling internal electrode can be improved.

  According to the present invention, the cutting yield can be improved and the manufacturing efficiency can be improved.

It is a schematic block diagram of the manufacturing apparatus for performing the manufacturing method of the multilayer electronic component which concerns on embodiment of this invention. It is a top view which shows the laminated body used as the object of cutting | disconnection, Comprising: It is a figure which shows the captured image when it images with a X-ray. It is a flowchart which shows the manufacturing method of the multilayer electronic component which concerns on embodiment of this invention. It is a flowchart which shows the process content of the cutting scheduled line determination process shown in FIG. It is a figure which shows the coordinate acquired in a sampling internal electrode. It is the figure which drawn the cutting planned line which expanded the sampling internal electrode vicinity and changed the value of the cutting | disconnection reference position. It is a figure which shows the example of the NG pattern in a cutting yield estimation process. It is a graph which shows the relationship between a cutting yield and a cutting | disconnection reference position. It is the figure which drawn the cutting plan line which expanded the sampling internal electrode vicinity and changed the value of the cutting angle. It is a graph which shows the relationship between a cutting yield and a cutting angle. It is the figure which drawn the cutting planned line which expanded the sampling internal electrode vicinity and changed the value of the cutting | disconnection space | interval. It is a graph which shows the relationship between a cutting yield and a cutting | disconnection space | interval. It is a flowchart which shows the process content of the scheduled cutting line optimization repetition process shown in FIG. It is the figure which drawn the cutting planned line in the case where a sampling internal electrode vicinity is expanded and a cutting | disconnection space | interval is narrow and wide. It is a figure which shows the figure of the laminated body when a sampling internal electrode is selected 3 each in the same row | line | column in a X-axis direction, and the graph which shows the relationship between a cutting yield and a cutting | disconnection reference position. It is a figure which shows the figure of the laminated body when a sampling internal electrode is selected according to the cutting yield estimation process in the manufacturing method which concerns on a modification, and the relationship between a cutting yield and a cutting | disconnection reference position. The diagram of the laminated body when three sampling internal electrodes are selected in the same column in the X-axis direction, and the laminated body when the sampling internal electrode is selected according to the cutting yield estimation step in the manufacturing method according to the modified example FIG. It is the figure which drawn the cutting planned line in the case where the sampling internal electrode vicinity is expanded and the cutting | disconnection reference | standard position has not shifted, and when it has shifted. It is an example of the captured image of X-ray when a laminated body is imaged with an X-ray camera.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  FIG. 1 is a schematic configuration diagram of a manufacturing apparatus for executing a method for manufacturing a multilayer electronic component according to an embodiment of the present invention. FIG. 2 is a plan view showing a laminated body to be cut, and shows a picked-up image when picked up by X-rays.

  As shown in FIG. 1, the multilayer electronic component manufacturing apparatus 1 includes a control device 2 that controls the entire apparatus, a table 3 on which the multilayer body 100 is placed, and a camera 4 that captures a transmission image of the multilayer body 100. And a cutting device 6 for cutting the laminated body 100. The control device 2 has a function of performing various calculations when cutting the laminated body 100 and also has a function of outputting control signals to the base 3, the camera 4, and the cutting device 6 for control. The table 3 has a function of moving according to a control signal from the control device 2. The camera 4 has a function of capturing an image inside the multilayer body 100 by irradiating the multilayer body 100 with a transmitted light beam such as an infrared ray, an X-ray, or an ultrasonic beam. The camera 4 has a function of outputting the acquired image to the control device 2. The cutting device 6 can be a dicing saw that cuts the laminate 100 with a rotary blade or a cutter knife that cuts with a press blade.

  When the laminated body 100 is cut, the laminated body 100 can be cut by moving the table 3 in the XYZ axial direction and rotating it around the Z axis with respect to the operating cutting device 6. Alternatively, the stacked body 100 may be cut by fixing the table 3 and moving the cutting device in the XYZ axis direction and rotating around the Z axis line. Moreover, you may cut | disconnect the laminated body 100 by moving both the stand 3 and the cutting device 6, respectively.

  The laminated body 100 to be cut is formed by laminating a dielectric layer 101 made of a plurality of ceramic green sheets and a plurality of internal electrode layers 102 formed of a conductor pattern pasted on the ceramic green sheets. Is formed in a rectangular plate shape. The internal electrode layer 102 includes a plurality of internal electrodes 103 arranged in a plane direction, and the internal electrodes 103 in all the internal electrode layers 102 are arranged so as to be alternately shifted one by one in the Y-axis direction. It is formed so as to have portions that overlap each other in the direction. A set of internal electrodes 103 that overlap each other in the stacking direction constitutes an internal electrode of one stacked electronic component (indicated by a virtual line CP in the figure). In addition, the laminated body 100 is a thing before baking, and the dielectric material layer, internal electrode layer, and internal electrode in a claim have shown the thing before baking.

  As shown in FIG. 2, a plurality of internal electrodes 103 of the stacked body 100 are arranged in the X-axis direction and are arranged in the Y-axis direction. The stacked body 100 passes between the internal electrodes 103 adjacent in the X-axis direction, is cut along a plurality of scheduled cutting lines arranged in the X-axis direction, and is adjacent to the internal electrodes 103 in the Y-axis direction. And a plurality of multilayer electronic components are obtained by cutting along a plurality of scheduled cutting lines arranged in the Y-axis direction. The size of the laminate 100 in the X-axis direction is 50 to 500 mm, the size in the Y-axis direction is 50 to 500 mm, the thickness is 0.1 to 10 mm, and the size of the internal electrode 103 in the X-axis direction is 0.1 to 0.1 mm. 5.0 mm, the size in the Y-axis direction is 0.2 to 6.0 mm, the thickness is 1 to 3 μm, the space between the internal electrodes 103 in the X-axis direction is 0.05 to 1 mm, and the internal electrode 103 in the Y-axis direction. The distance between them is 0.05 to 1 mm. The stacked body 100 has positioning marks 104 at four corners in the planar direction. This positioning mark 104 is used as a reference mark when positioning the laminated body 100 in the plane direction before cutting the laminated body 100 with the cutting device 6. The positioning mark 104 may be formed on the upper surface of the laminated body 100, or may be provided inside the laminated body 100 so as to be transmitted through the camera 4 and detected.

  Then, the manufacturing method of the multilayer electronic component which concerns on embodiment of this invention with reference to FIGS. 3-13 is demonstrated. FIG. 3 is a flowchart showing a method for manufacturing a multilayer electronic component according to an embodiment of the present invention.

  As shown in FIG. 3, in the method for manufacturing a multilayer electronic component, the process starts from a multilayer body preparation step S <b> 1 for preparing the multilayer body 100. In the multilayer body preparation step S1, after forming a ceramic green sheet to be the dielectric layer 101, the pattern of the internal electrode 103 is printed on the ceramic green sheet with a conductive paste and dried, whereby the internal structure shown in FIG. An electrode pattern of the electrode 103 is formed. A plurality of ceramic green sheets on which electrode patterns are formed in this way are stacked to form a laminate 100. The laminated body preparation process S1 is completed by placing the laminated body 100 on the upper surface of the table 3.

  After the laminate preparation step S1, a laminate positioning step S2 is performed. In the laminated body positioning step S2, the camera 4 images the laminated body 100. Next, the control device 2 detects the positioning marks 104 formed at the four corners in the planar direction of the stacked body 100 based on the image output from the camera 4. The control device 2 outputs a control signal to the pedestal 3, thereby moving the pedestal 3 in the XY axis direction to adjust the position, and rotating the pedestal 3 about the Z axis to adjust the position. As a result, the control device 2 performs positioning of the stacked body 100 in the planar direction, and the stacked body positioning step S2 ends.

  After the laminated body positioning step S2, an internal electrode position acquisition step S3 is performed. In the internal electrode position acquisition step S <b> 3, the camera 4 captures an image of the multilayer body 100 to acquire an image transmitted through the multilayer body 100. Based on the image captured by the camera 4, the control device 2 acquires the positions of a predetermined number of sampling internal electrodes among the plurality of internal electrodes 103. Specifically, as shown in FIG. 2, the control device 2 uses the internal electrode 103 at one end in the X-axis direction among the internal electrodes 103 at one end in the Y-axis direction as a sampling internal electrode SP1. The internal electrode 103 in the column at the center position in the X axis direction is specified as the sampling internal electrode SP2, and the internal electrode 103 in the column on the other end side in the X axis direction is specified as the sampling internal electrode SP3. Further, the control device 2 specifies the internal electrode 103 in the column on one end side in the X-axis direction as the sampling internal electrode SP4 among the internal electrodes 103 in the column in the central position in the Y-axis direction, and sets the central position in the X-axis direction. The internal electrode 103 in the column is specified as the sampling internal electrode SP5, and the internal electrode 103 in the column on the other end side in the X axis direction is specified as the sampling internal electrode SP6. Further, the control device 2 identifies the internal electrode 103 in the column on the one end side in the X axis direction among the internal electrodes 103 in the column on the other end side in the Y axis direction as the sampling internal electrode SP7, and the center position in the X axis direction The internal electrode 103 in the column is identified as the sampling internal electrode SP8, and the internal electrode 103 in the column on the other end side in the X-axis direction is identified as the sampling internal electrode SP9.

  In the internal electrode position acquisition step S3, after specifying the sampling internal electrodes SP1 to SP9, the control device 2 acquires the coordinates of the sampling internal electrodes SP1 to SP9, respectively. Specifically, as shown in FIG. 5, the control device 2 acquires the coordinates (x1, y1) and coordinates (x2, y2) at the midpoints of the long sides on both sides of the sampling internal electrodes SP4, SP5, SP6. At the same time, the coordinates (x3, y3) and coordinates (x4, y4) at the midpoint of the short sides on both sides are acquired. The control device 2 obtains coordinates (x1, y1), (x2, y2), (x3, y3), (x4, y4) for sampling internal electrodes SP1, SP2, SP3, SP7, SP8, SP9 (not shown). . Thereby, the control apparatus 2 can acquire each position in the plane direction of each sampling internal electrode SP1-SP9.

  After the internal electrode position acquisition step S3, a scheduled cutting line determination step S4 is performed. In the planned cutting line determination step S4, the control device 2 determines a planned cutting line CL (see FIG. 2) indicating a planned position to be cut by the cutting device 6. A plurality of cutting lines CL are arranged in the X-axis direction, and are arranged so as to pass between the internal electrodes 103. When the planned cutting line CL shown in FIG. 2 is set, the X-axis direction that is the arrangement direction of the planned cutting line CL corresponds to the “first direction” in the claims, and the plane direction is orthogonal to the arrangement direction of the planned cutting line The Y-axis direction that corresponds to “second direction” in the claims corresponds. After determining the scheduled cutting line arranged in the X-axis direction, the control device 2 also determines the scheduled cutting line arranged in the Y-axis direction. When setting the planned cutting line CL arranged in the Y-axis direction, the Y-axis direction that is the arranging direction of the planned cutting line CL corresponds to the “first direction” in the claims, and the arrangement direction of the planned cutting line The X-axis direction which is a plane direction orthogonal to the “second direction” in the claims corresponds to the “second direction” in the claims.

  The planned cutting line CL is composed of three parameters: a cutting reference position, a cutting interval, and a cutting angle. The cutting reference position is a position coordinate of one reference cutting planned line CLB serving as a reference among the plurality of cutting planned lines CL. When the position of the reference scheduled cutting line CLB indicating the cutting reference position moves, the entire plurality of scheduled cutting lines CL move accordingly. In the present embodiment, the scheduled cutting line CL at the center position is set as the reference scheduled cutting line CLB. The cutting interval indicates the interval between the scheduled cutting lines CL. The cutting angle indicates an angle in the plane direction of the planned cutting line CL. In the present embodiment, an inclination angle of the planned cutting line CL with respect to the Y axis is defined as a cutting angle.

  Here, specific contents of the scheduled cutting line determination step S4 will be described with reference to FIG. FIG. 4 is a flowchart showing the process contents of the scheduled cutting line determination process shown in FIG. Each process shown in FIG. 4 is a process executed by performing arithmetic processing inside the control device 2. As shown in FIG. 4, in the planned cutting line determination step S4, a planned cutting line setting step S10 is first performed. In the scheduled cutting line setting step S10, the control device 2 sets a provisional set value for each parameter of the scheduled cutting line CL. Specifically, the control device 2 sets 0 (center position in the X-axis direction) as the initial value of the setting value X of the cutting reference position, and a predetermined design value (target) as the initial value of the setting value Y of the cutting interval. Can be set arbitrarily from the interval between the internal electrodes 103 of the laminate 100 to be set), and 0 (parallel to the X-axis direction) is set as the initial value of the setting value Z of the cutting angle.

  After the scheduled cutting line setting step S10, a cutting yield estimation step S12 is performed. In the cutting yield estimation step S12, the control device 2 fixes the cutting reference value with the cutting interval value fixed at the set value Y and the cutting angle value fixed at the setting value Z among the parameters of the scheduled cutting line CL. The cutting yield is estimated by changing the position value and calculating the cutting yield at each value of the cutting reference position. Specifically, the control device 2 changes the value of the cutting reference position by the scale width a with respect to the set value X, and the values of the cutting reference position = X, X ± a, X ± 2a, X ± 3a, .., X ± na,..., X ± Na, and the cutting yield at each value is estimated.

  In the cutting yield estimation step S12, the control device 2 calculates whether or not each sampling internal electrode and the scheduled cutting line CL overlap when cutting at the planned cutting line CL, and determines that the sampling internal electrode that does not overlap is an OK product. The overlapping sampling internal electrodes are determined as NG products. The control device 2 estimates the cutting yield by calculating the ratio of the OK product and the NG product among the sampling internal electrodes.

  The estimation of the cutting yield will be described more specifically. FIG. 6 is a diagram illustrating a cutting planned line in which the vicinity of the sampling internal electrodes SP4, SP5 and SP6 is enlarged and the value of the cutting reference position is changed. FIG. 6 shows a reference cutting scheduled line CLB when the value of the cutting reference position is a set value X, and other cutting scheduled lines CL1, CL2, CL3, CL4, and CL5. Further, in FIG. 6, the reference cutting scheduled line CLB and the cutting scheduled lines CL1 to CL5 when the value of the cutting reference position is X-na are shown by alternate long and short dash lines, and the value of the cutting reference position is X + na. The reference cutting scheduled line CLB and the cutting scheduled lines CL1 to CL5 are indicated by dotted lines. In addition, the reference cutting schedule when the values of the cutting reference positions are X ± a, X ± 2a, X ± 3a,..., X ± (n−1) a, X ± (n + 1) a,. The line CLB and the scheduled cutting lines CL1 to CL5 are omitted.

  In the example shown in FIG. 6, when the value of the cutting reference position is X (the scheduled cutting line is indicated by a solid line), the sampling internal electrode SP5 is provided between the reference scheduled cutting line CLB and the scheduled cutting line CL3. Therefore, the sampling internal electrode SP5 is determined to be an OK product. Since the sampling internal electrode SP4 exists without overlapping between the planned cutting line CL1 and the planned cutting line CL2, the sampling internal electrode SP4 is determined to be an OK product. Since the sampling internal electrode SP6 exists between the scheduled cutting line CL4 and the planned cutting line CL5 without overlapping, the sampling internal electrode SP6 is determined to be an OK product. When the value of the cutting reference position is X-na (the cutting planned line is indicated by a one-dot chain line), the sampling internal electrode SP5 exists between the reference cutting planned line CLB and the cutting planned line CL3 without overlapping. Therefore, the sampling internal electrode SP5 is determined to be an OK product. Since the scheduled cutting line CL2 and the sampling internal electrode SP4 overlap, the sampling internal electrode SP4 is determined to be an NG product. Since the sampling internal electrode SP6 exists between the scheduled cutting line CL4 and the planned cutting line CL5 without overlapping, the sampling internal electrode SP6 is determined to be an OK product. When the value of the cutting reference position is X + na (the planned cutting line is indicated by a dotted line), the reference cutting planned line CLB overlaps the sampling internal electrode SP5, so the sampling internal electrode SP5 is determined to be an NG product. Since the sampling internal electrode SP4 exists without overlapping between the planned cutting line CL1 and the planned cutting line CL2, the sampling internal electrode SP4 is determined to be an OK product. Since the scheduled cutting line CL4 and the sampling internal electrode SP6 overlap, the sampling internal electrode SP6 is determined to be an NG product. Sampling internal electrodes SP1, SP2, SP3, SP7, SP8, and SP9 are also judged as OK or NG depending on whether they overlap with the line to be cut.

  After determining the OK product and the NG product for the sampling internal electrodes SP1 to SP9, the control device 2 determines the plurality of stacked bodies 100 based on the determination results of the OK and NG products for the sampling internal electrodes SP1 to SP9. An NG pattern divided into blocks is obtained. Based on the obtained NG pattern, the cutting yield can be calculated. As shown in FIG. 7, the control device 2 divides the stacked body 100 into nine blocks BL1 to BL9, and determines whether each block is an area where NG products exist. Specifically, the control device 2 determines whether or not the block is in the NG region based on whether or not the sampling internal electrode existing in the corresponding block is an NG product. If the sampling internal electrode SP1 is an NG product, the control device 2 determines that the block BL1 is in the NG region. If the sampling internal electrode SP2 is an NG product, the control device 2 determines that the block BL2 is in the NG region. If the sampling internal electrode SP3 is an NG product, the control device 2 determines that the block BL3 is in the NG region. If the sampling internal electrode SP4 is an NG product, the control device 2 determines that the block BL4 is in the NG region. If the sampling internal electrode SP5 is an NG product, the control device 2 determines that the block BL5 is an NG region. If the sampling internal electrode SP6 is an NG product, the control device 2 determines that the block BL6 is in the NG region. If the sampling internal electrode SP7 is an NG product, the control device 2 determines that the block BL7 is in the NG region. If the sampling internal electrode SP8 is an NG product, the control device 2 determines that the block BL8 is in the NG region. If the sampling internal electrode SP9 is an NG product, the control device 2 determines that the block BL9 is in the NG region. In the example shown in FIG. 7A, all the sampling internal electrodes SP1 to SP9 are OK products, and the control device 2 creates an NG pattern in which all of the blocks BL1 to BL9 are OK regions, and cutting at this time The yield is calculated to be 100%. In the example shown in FIG. 7B, only the sampling internal electrode SP9 is an NG product, and the control device 2 creates an NG pattern in which only the block BL9 is an NG region, and the cutting yield at this time is 88.9%. It is calculated that In the example shown in FIG. 7C, only the sampling internal electrodes SP1 and SP9 are NG products, and the control device 2 creates an NG pattern in which only the blocks BL1 and BL9 are NG regions, and the cutting yield at this time is shown. It is calculated to be 77.8%.

  The control device 2 changes the cutting reference position values = X, X ± a, X ± 2a, X ± 3a,..., X ± na,. SP9 is determined, NG pattern is created, and cutting yield is calculated. Thereby, the control apparatus 2 acquires the graph which shows the cutting yield shown in FIG. In the graph shown in FIG. 8, the value of the cutting reference position is shown on the horizontal axis, the cutting yield is shown on the vertical axis, and the cutting yield corresponding to each value of the cutting reference position is plotted. The control device 2 acquires such a graph, and the cutting yield estimation step S12 ends.

  Returning to FIG. 4, after the cutting yield estimation step S12, a scheduled cutting line optimization step S14 is performed. In the planned cutting line optimization step S14, the planned cutting line CL is optimized by optimizing the value of the cutting reference position based on the estimation result estimated in the cutting yield estimation step S12. Specifically, the optimum value of the cutting reference position is calculated based on the graph obtained in the cutting yield estimation step S12. In the example illustrated in FIG. 8, the control device 2 acquires the maximum value Xmax and the minimum value Xmin of the value of the cutting reference position that can set the cutting yield to 100%, and the maximum value Xmax and the minimum value Xmin. An intermediate value (Xmax + Xmin) / 2 is acquired as the optimum value Xm of the cutting reference position. The optimum value Xm is acquired, and the scheduled cutting line optimization step S14 ends.

  Returning to FIG. 4, a scheduled cutting line setting step S16 is performed after the planned cutting line optimization step S14. In the planned cutting line setting step S16, the control device 2 sets a new cutting line by substituting the optimum value Xm acquired in the planned cutting line optimization step S14 into the setting value of the cutting reference position. Note that the setting value Z of the cutting angle is 0, and the setting value Y of the cutting interval is a design value.

  After the scheduled cutting line setting step S16, a cutting yield estimation step S18 is performed. In the cutting yield estimation step S18, the control device 2 fixes the cutting interval value at the set value Y among the parameters of the scheduled cutting line CL, and sets the cutting reference position value to the set value X (the optimum value set in S16). Xm), the cutting yield is estimated by changing the cutting angle value and calculating the cutting yield at each cutting angle value. Specifically, the control device 2 changes the value of the cutting angle in increments of b based on the set value Z, and the values of the cutting angle = Z, Z ± b, Z ± 2b, Z ± 3b,. Z ± nb,..., Z ± Nb, and the cutting yield at each value is estimated.

  The estimation of the cutting yield when the cutting angle is changed will be described more specifically. FIG. 9 is a diagram illustrating a cutting planned line in which the vicinity of the sampling internal electrodes SP4, SP5 and SP6 is enlarged and the value of the cutting angle is changed. FIG. 9 shows the reference scheduled cutting line CLB and the other scheduled cutting lines CL1, CL2, CL3, CL4, and CL5 when the value of the cutting angle is the set value Z. Further, in FIG. 9, the reference cutting scheduled line CLB and the cutting scheduled lines CL1 to CL5 when the value of the cutting angle is Z-nb are indicated by alternate long and short dash lines, and the reference cutting when the value of the cutting angle is Z + nb. The scheduled line CLB and the scheduled cutting lines CL1 to CL5 are indicated by dotted lines. Reference cutting scheduled line when the values of the cutting angles are Z ± b, Z ± 2b, Z ± 3b,..., Z ± (n−1) b, Z ± (n + 1) b,. CLB and scheduled cutting lines CL1 to CL5 are omitted.

  In the example shown in FIG. 9, when the value of the cutting angle is Z (the planned cutting line is indicated by a solid line), the sampling internal electrode SP5 is between the reference cutting planned line CLB and the cutting planned line CL3. Since they exist without overlapping, the sampling internal electrode SP5 is determined to be an OK product. Since the sampling internal electrode SP4 exists without overlapping between the planned cutting line CL1 and the planned cutting line CL2, the sampling internal electrode SP4 is determined to be an OK product. Since the sampling internal electrode SP6 exists between the scheduled cutting line CL4 and the planned cutting line CL5 without overlapping, the sampling internal electrode SP6 is determined to be an OK product. When the value of the cutting angle is Z-nb (the scheduled cutting line is indicated by a one-dot chain line), the sampling internal electrode SP5 exists between the reference scheduled cutting line CLB and the scheduled cutting line CL3 without overlapping. Therefore, the sampling internal electrode SP5 is determined to be an OK product. Since the scheduled cutting line CL2 and the sampling internal electrode SP4 overlap, the sampling internal electrode SP4 is determined to be an NG product. Since the scheduled cutting line CL4 and the sampling internal electrode SP6 overlap, the sampling internal electrode SP6 is determined to be NG. When the value of the cutting angle is Z + nb (the planned cutting line is indicated by a dotted line), the sampling internal electrode SP5 exists between the reference cutting planned line CLB and the cutting planned line CL3 without overlapping, Sampling internal electrode SP5 is determined to be an OK product. Since the sampling internal electrode SP4 exists without overlapping between the planned cutting line CL1 and the planned cutting line CL2, the sampling internal electrode SP4 is determined to be an OK product. Since the sampling internal electrode SP6 exists between the scheduled cutting line CL4 and the planned cutting line CL5 without overlapping, the sampling internal electrode SP6 is determined to be an OK product. Sampling internal electrodes SP1, SP2, SP3, SP7, SP8, and SP9 are also judged as OK or NG depending on whether they overlap with the line to be cut.

  The control device 2 changes the cutting angle values = Z, Z ± b, Z ± 2b, Z ± 3b,..., Z ± nb,..., Z ± Nb, and sampling internal electrodes SP1 to SP9 for all values. Determination, creation of an NG pattern, and calculation of cutting yield. Thereby, the control apparatus 2 acquires the graph which shows the cutting yield shown in FIG. In the graph shown in FIG. 10, the value of the cutting angle is shown on the horizontal axis, the cutting yield is shown on the vertical axis, and the cutting yield corresponding to each value of the cutting angle is plotted. The control device 2 acquires such a graph, and the cutting yield estimation step S18 ends.

  Returning to FIG. 4, after the cutting yield estimation step S18, a scheduled cutting line optimization step S20 is performed. In the planned cutting line optimization step S20, the planned cutting line CL is optimized by optimizing the value of the cutting angle based on the estimation result estimated in the cutting yield estimation step S18. Specifically, the optimum value of the cutting angle is calculated based on the graph obtained in the cutting yield estimation step S18. In the example illustrated in FIG. 10, the control device 2 acquires the maximum value Zmax and the minimum value Zmin of the cutting angle value at which the cutting yield can be 100%, and between the maximum value Zmax and the minimum value Zmin. (Zmax + Zmin) / 2 is obtained as the optimum value Zm of the cutting angle. The optimum value Zm is acquired, and the scheduled cutting line optimization step S20 ends.

  Returning to FIG. 4, a scheduled cutting line setting step S22 is performed after the planned cutting line optimization step. In the planned cutting line setting step S22, the control device 2 sets a new cutting line by substituting the optimum value Zm acquired in the planned cutting line optimization step S20 into the setting value of the cutting angle. Note that the setting value X of the cutting reference position is Xm, and the setting value Y of the cutting interval is a design value.

  After the scheduled cutting line setting step S22, a cutting yield estimation step S24 is performed. In the cutting yield estimation step S24, the control device 2 fixes the cutting angle value among the parameters of the planned cutting line CL at the set value Z (the optimum value Zm set in S22), and sets the value of the cutting reference position. The cutting yield is estimated by calculating the cutting yield at each value of the cutting interval by changing the value of the cutting interval in a state where the value X (the optimum value Xm set in S16) is fixed. Specifically, the control device 2 changes the value of the cutting interval by the scale width c with reference to the set value Y, and the values of the cutting interval = Y, Y ± c, Y ± 2c, Y ± 3c,. By changing Y ± nc,..., Y ± Nc, the cutting yield at each value is estimated.

  The estimation of the cutting yield when the cutting interval is changed will be described more specifically. FIG. 11 is a diagram illustrating a planned cutting line in which the vicinity of the sampling internal electrodes SP4, SP5 and SP6 is enlarged and the value of the cutting interval is changed. FIG. 11 shows the reference scheduled cutting line CLB and the other scheduled cutting lines CL1, CL2, CL3, CL4, and CL5 when the value of the cutting interval is the set value Y. Further, in FIG. 11, the reference cutting scheduled line CLB and the cutting scheduled lines CL1 to CL5 when the value of the cutting interval is Y + nc are indicated by dotted lines. When the values of the cutting intervals are Y ± c, Y ± 2c, Y ± 3c,..., Y ± (n−1) c, Y−nc, Y ± (n + 1) c,. The reference scheduled cutting line CLB and the scheduled cutting lines CL1 to CL5 are omitted.

  In the example shown in FIG. 11, when the value of the cutting interval is Y (the cutting planned line is indicated by a solid line), the sampling internal electrode SP5 is between the reference cutting planned line CLB and the cutting planned line CL3. Since they exist without overlapping, the sampling internal electrode SP5 is determined to be an OK product. Since the scheduled cutting line CL1 and the sampling internal electrode SP4 overlap, the sampling internal electrode SP4 is determined to be an NG product. Since the sampling internal electrode SP6 exists between the scheduled cutting line CL4 and the planned cutting line CL5 without overlapping, the sampling internal electrode SP6 is determined to be an OK product. When the value of the cutting interval is Y + nc (the scheduled cutting line is indicated by a dotted line), the sampling internal electrode SP5 exists without overlapping between the reference scheduled cutting line CLB and the planned cutting line CL3. Sampling internal electrode SP5 is determined to be an OK product. Since the sampling internal electrode SP4 exists without overlapping between the planned cutting line CL1 and the planned cutting line CL2, the sampling internal electrode SP4 is determined to be an OK product. Since the sampling internal electrode SP6 exists between the scheduled cutting line CL4 and the planned cutting line CL5 without overlapping, the sampling internal electrode SP6 is determined to be an OK product. Sampling internal electrodes SP1, SP2, SP3, SP7, SP8, and SP9 are also judged as OK or NG depending on whether they overlap with the line to be cut.

  The control device 2 changes the cutting interval values = Y, Y ± c, Y ± 2c, Y ± 3c,..., Y ± nc,..., Y ± Nc, and sampling internal electrodes SP1 to SP9 for all values. Determination, creation of an NG pattern, and calculation of cutting yield. Thereby, the control apparatus 2 acquires the graph which shows the cutting yield shown in FIG. In the graph shown in FIG. 12, the horizontal axis indicates the value of the cutting interval, the vertical axis indicates the cutting yield, and the cutting yield corresponding to each value of the cutting interval is plotted. The control device 2 acquires such a graph, and the cutting yield estimation step S24 ends.

  Returning to FIG. 4, after the cutting yield estimation step S24, a scheduled cutting line optimization step S26 is performed. In the scheduled cutting line optimization step S26, the scheduled cutting line CL is optimized by optimizing the value of the cutting interval based on the estimation result estimated in the cutting yield estimating step S24. Specifically, the optimum value of the cutting interval is calculated based on the graph obtained in the cutting yield estimation step S24. In the example shown in FIG. 12, the control device 2 acquires the maximum value Ymax and the minimum value Ymin of the value of the cutting interval that can set the cutting yield to 100%, and between the maximum value Ymax and the minimum value Ymin. (Ymax + Ymin) / 2 is obtained as the optimum value Ym of the cutting reference position. The optimum value Ym is acquired, and the scheduled cutting line optimization step S26 ends.

  Returning to FIG. 4, the scheduled cutting line setting step S <b> 28 is performed after the planned cutting line optimization step. In the planned cutting line setting step S28, the control device 2 sets a new planned cutting line by substituting the optimum value Ym acquired in the planned cutting line optimization step S26 into the setting value of the cutting interval. The cutting reference position setting value X is Xm, and the cutting angle setting value Z is Zm.

  After the scheduled cutting line setting step S28, a scheduled cutting line optimization repeating step S30 is executed to further optimize each parameter. As shown in FIG. 13, the scheduled cutting line optimization iterative process S30 is started from a cutting yield estimation process S40 for the cutting reference position. In the cutting yield estimation step S40, the control device 2 executes the same process as in the cutting yield estimation step S12 in FIG. When the cutting yield estimation step S40 ends, a scheduled cutting line optimization step S42 for the cutting reference position is performed. In the planned cutting line optimization step S42, the control device 2 executes the same process as in the planned cutting line optimization step S14 of FIG. When the cutting-scheduled line optimization step S42 ends and the optimum value Xm for the cutting reference position is obtained, the control device 2 optimizes the value X that is currently set as the setting value for the cutting reference position and the cutting-scheduled line optimization. An optimum value determination step S44 for determining whether or not the optimum value Xm of the cutting reference position acquired in step S42 is the same value is performed.

  In the optimum value determining step S44, when the control device 2 determines that the set value X and the optimum value Xm are the same value, the controller 2 determines that a sufficiently optimal scheduled cutting line has been obtained, and proceeds to the scheduled cutting line determining step S62. Transition. In the planned cutting line determination step S62, the control device 2 determines the value of the cutting reference position among the parameters of the planned cutting line as the optimum value Xm acquired in the planned cutting line optimization step S42, and sets the value of the cutting interval. The set value Y that has already been set is determined, and the value of the cutting angle is determined to be the set value Z that has already been set. When the scheduled cutting line determination step S62 ends, the scheduled cutting line optimization iteration step shown in FIG. 13 ends, and the process returns to the process of FIG.

  On the other hand, in the optimal value determination step S44, when the control device 2 determines that the set value X and the optimal value Xm are different values, the control device 2 determines that a sufficiently optimal cutting scheduled line has not been obtained, and the cutting planned line The process proceeds to the setting step S46. In the scheduled cutting line setting step S46, the control device 2 executes the same process as in the scheduled cutting line setting step S16. When the planned cutting line setting step S46 is completed, a cutting yield estimation step S48 for the cutting angle is performed. In the cutting yield estimation step S48, the control device 2 executes the same process as in the cutting yield estimation step S18 of FIG. When the cutting yield estimation step S48 is completed, a scheduled cutting line optimization step S50 for the cutting angle is performed. In the planned cutting line optimization step S50, the control device 2 executes the same process as in the planned cutting line optimization step S20 of FIG. When the optimum cutting line optimization step S50 is completed and the optimum value Zm for the cutting angle is obtained, the control device 2 sets the value Z that is currently set as the setting value of the cutting angle and the scheduled cutting line optimization step S50. An optimum value determination step S52 is performed to determine whether or not the optimum value Zm of the cutting angle acquired in step S1 is the same value.

  In the optimal value determination step S52, when the control device 2 determines that the set value Z and the optimal value Zm are the same value, it determines that a sufficiently optimal cutting scheduled line has been obtained, and proceeds to the cutting scheduled line determination step S62. Transition. In the planned cutting line determination step S62, the control device 2 determines the value of the cutting angle among the parameters of the planned cutting line as the optimum value Zm acquired in the planned cutting line optimization step S50, and already sets the value of the cutting interval. The set value Y that has been set is determined, and the value of the cutting reference position is determined to be the set value X that has already been set. When the scheduled cutting line determination step S62 ends, the scheduled cutting line optimization iteration step shown in FIG. 13 ends, and the process returns to the process of FIG.

  On the other hand, in the optimal value determination step S52, when the control device 2 determines that the set value Z and the optimal value Zm are different values, the control device 2 determines that a sufficiently optimal cutting scheduled line has not been obtained, and the cutting planned line The process proceeds to setting step S54. In the scheduled cutting line setting step S54, the control device 2 executes the same process as in the scheduled cutting line setting step S22. When the scheduled cutting line setting step S54 ends, a cutting yield estimation step S56 for the cutting interval is performed. In the cutting yield estimation step S56, the control device 2 executes the same process as in the cutting yield estimation step S24 of FIG. When the cutting yield estimation step S56 ends, a scheduled cutting line optimization step S58 for the cutting interval is performed. In the planned cutting line optimization step S58, the control device 2 executes the same process as in the planned cutting line optimization step S26 of FIG. When the optimum cutting line optimization step S58 is completed and the optimum value Ym for the cutting interval is obtained, the control device 2 determines the value Y currently set as the setting value of the cutting interval and the scheduled cutting line optimization step S58. An optimal value determination step S60 is performed to determine whether or not the optimal value Ym of the cutting interval acquired in step S1 is the same value.

  In the optimum value determining step S60, when the control device 2 determines that the set value Y and the optimum value Ym are the same value, the controller 2 determines that a sufficiently optimal scheduled cutting line has been obtained, and proceeds to the scheduled cutting line determining step S62. Transition. In the planned cutting line determination step S62, the control device 2 determines the value of the cutting interval among the parameters of the planned cutting line as the optimal value Ym acquired in the planned cutting line optimization step S58, and sets the value of the cutting reference position. The set value X that has already been set is determined, and the value of the cutting angle is determined to be the set value Z that has already been set. When the scheduled cutting line determination step S62 ends, the scheduled cutting line optimization iteration step shown in FIG. 13 ends, and the process returns to the process of FIG.

  On the other hand, in the optimum value determining step S60, when the control device 2 determines that the set value Y and the optimum value Ym are different values, the controller 2 determines that a sufficiently optimal cutting scheduled line has not been obtained, and the cutting scheduled line is determined. The process proceeds to the setting step S64. In the scheduled cutting line setting step S64, the control device 2 executes the same process as in the scheduled cutting line setting step S28. Further, after the scheduled cutting line setting step S64, the control device 2 executes the cutting yield estimation step S40 for the cutting reference position again, and thereafter performs the same processing.

  Returning to FIG. 4, when the scheduled cutting line optimization iteration step S <b> 30 is finished and the scheduled cutting lines arranged in the X axis direction are determined, the cutting planned lines arranged in the Y axis direction are also shown in FIG. It is determined by performing the process shown in FIG. When the scheduled cutting lines arranged in the X-axis direction and the scheduled cutting lines arranged in the Y-axis direction are determined, the scheduled cutting line determination step shown in FIG. 4 ends. When the process of FIG. 4 is completed, the process returns to FIG. 3 to perform the laminate cutting process S5. In the laminated body cutting step S5, the control device 2 outputs a control signal to the table 3 and the cutting device 6 so that the laminated body 100 is cut along the scheduled cutting line determined in the scheduled cutting line determining step S4. Thus, the multilayer body 100 is cut to obtain a multilayer electronic component. When the laminated body cutting step S5 is finished, the manufacturing method shown in FIG. 3 is finished.

  Next, operations and effects of the method for manufacturing a multilayer electronic component according to the embodiment of the present invention will be described.

  In the method for manufacturing a multilayer electronic component according to the embodiment of the present invention, a plurality of scheduled cutting lines CL are set by setting three parameters of a cutting reference position, a cutting interval, and a cutting angle in the scheduled cutting line setting step. On the other hand, the respective positions in the plane direction of the sampling internal electrodes SP1 to SP9 can be acquired in the internal electrode position acquisition step. Further, in the cutting yield estimation step, the cutting yield is estimated based on the set cutting planned line CL and the positions of the sampling internal electrodes SP1 to SP9, and in the cutting planned line optimization, the optimum value of each parameter is determined based on the estimation result. Thus, the cutting scheduled line CL can be optimized. And in the laminated body cutting step, the laminated body 100 can be cut based on the optimized scheduled cutting line CL. By calculating only the three parameters of the cutting reference position, the cutting interval, and the cutting angle, it is possible to determine all of the planned cutting lines CL required for cutting the stacked body 100. Therefore, the calculation load can be reduced as compared with the case where each of the scheduled cutting lines CL is calculated one by one. In particular, when the number of internal electrodes increases, the calculation load can be greatly reduced. Moreover, it is possible to improve the cutting yield by estimating the cutting yield of the scheduled cutting line CL once set and optimizing the scheduled cutting line CL based on the estimation result. In addition, when estimating the cutting yield, it is not estimated based on the positions of all the internal electrodes 103, but is estimated based on the positions of a predetermined number of sampling internal electrodes SP1 to SP9. Even when the number of stacked electronic components that can be obtained from the surrounding stacked body 100 increases, it is possible to reduce the calculation load required for estimation. As described above, the manufacturing yield of the multilayer electronic component can be improved by improving the cutting yield and reducing the calculation load.

  Further, in the method for manufacturing a multilayer electronic component according to the present invention, the scheduled cutting line setting step, the cutting yield estimation step, and the planned cutting line optimization step are performed a plurality of times, and in the planned cutting line optimization step, the cutting reference position After the optimum value of one parameter among the cutting interval and the cutting angle is obtained, a scheduled cutting line setting step for setting a new scheduled cutting line CL is performed by substituting the optimum value into the one parameter. In the new cutting scheduled line, a yield estimation step is performed in which the value of another parameter different from the one parameter is changed to estimate the yield at each value, and the optimum of the other parameters is determined based on the estimation result of the yield. A cutting scheduled line optimization step for calculating a value is performed. After the optimum value of one parameter is obtained, the cutting yield is estimated for a new scheduled cutting line CL that reflects the optimum value, and the optimum value of the other parameter is calculated to calculate the cutting target line CL. Accuracy can be increased. Thereby, the cutting yield can be further improved.

  Here, the inventors of the present invention have not optimized the cutting reference position. For example, when the reference cutting scheduled line CLB itself overlaps the internal electrode, the cutting angle and the cutting interval are optimal. However, it has been found that it is preferable to first optimize the cutting reference position because the cutting yield cannot be improved. Furthermore, the inventors of the present invention can improve the cutting yield even if the cutting interval is optimized, for example, when the cutting angle of the planned cutting line is greatly inclined with respect to the internal electrode. Therefore, it has been found that it is preferable to optimize the cutting angle before the cutting interval.

  Therefore, in the method for manufacturing a multilayer electronic component according to the present invention, in the cutting scheduled line optimization step, when it is the first optimization, the cutting reference position is optimized, and the cutting reference is determined in the previous optimization. If the position is optimized, the cutting angle is optimized.If the cutting angle is optimized in the previous optimization, the cutting interval is optimized, and the previous optimization is performed. When the cutting interval is optimized in, the cutting reference position is optimized. Thereby, the optimum value can be calculated in the order of the cutting reference position, the cutting angle, and the cutting interval with respect to the three parameters of the scheduled cutting line. Thus, by optimizing the parameters in a suitable order, the accuracy of the scheduled cutting line CL can be increased, and the calculation load can be reduced.

  Further, in the method for manufacturing a multilayer electronic component according to the present invention, the positioning marks 104 formed at the four corners in the planar direction of the rectangular flat laminate 100 are detected and positioned prior to the scheduled cutting line setting step. A laminate positioning step S2 for positioning the laminate 100 in the plane direction based on the mark 104 is further included. When the laminated body 100 is arranged so as to be shifted with respect to the cutting device 6 or the camera 4, the planned cutting line CL set in the planned cutting line setting step is also set so as to be shifted with respect to the internal electrode 103. As a result, the number of operations during optimization increases. However, by performing positioning based on the positioning marks 104 at the four corners of the laminate 100 in the previous stage of the scheduled cutting line setting process, it is possible to set an appropriate scheduled cutting line CL in the planned cutting line setting process. It becomes. Thereby, it is possible to reduce the calculation load in the cutting scheduled line optimization process.

  The preferred embodiments of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

  For example, in the above-described embodiment, the sampling internal electrode is selected as the internal electrode 103 in each column on the end portion side and the central position in the stacked body 100. However, the sampling internal electrode can be changed by replacing the selected sampling internal electrode. The effect which becomes can be acquired.

  For example, as shown in FIG. 16A, at least two internal electrodes existing in different columns in the Y-axis direction are sampled as sampling internal electrodes, and one sampling internal electrode is compared with the other sampling internal electrode. , May be present in adjacent rows in the X-axis direction. Specifically, the sampling internal electrodes SP1, SP4, SP7 existing in different columns in the Y-axis direction are sampled, and the sampling internal electrode SP4 exists in a column adjacent to the sampling internal electrode SP1 in the X-axis direction. The sampling internal electrode SP7 is present in a column adjacent to the sampling internal electrode SP4 in the X-axis direction. Further, the sampling internal electrodes SP2, SP5, SP8 existing in different columns in the Y-axis direction are sampled, and the sampling internal electrode SP5 exists in a column adjacent to the sampling internal electrode SP2 in the X-axis direction. The internal electrode SP8 exists in a column adjacent to the sampling internal electrode SP5 in the X-axis direction. Further, the sampling internal electrodes SP3, SP6, SP9 existing in different columns in the Y-axis direction are sampled, and the sampling internal electrode SP6 exists in a column adjacent to the sampling internal electrode SP3 in the X-axis direction. The internal electrode SP9 is present in a column adjacent to the sampling internal electrode SP6 in the X-axis direction. In the example shown in FIG. 16A, the X-axis direction corresponds to the “first direction” in the claims, and the Y-axis direction corresponds to the “second direction” in the claims.

  First, when setting the cutting interval, for example, as shown in FIG. 14A, if the cutting interval is too narrow with respect to the width of the internal electrode 103, the internal electrode must be changed no matter how much the cutting reference position is changed. Therefore, the cutting yield cannot be 100%. Therefore, the cutting interval is preferably set to be larger than the sum of the internal electrode width and the distance between the internal electrodes. However, as shown in FIG. 14 (b), when the cutting interval becomes significantly larger than the internal electrode width, the cutting interval can be ignored. Therefore, if the cutting angle is fixed, the cutting yield becomes the cutting reference position. Only determined by.

  Consider a case where the sampling internal electrodes SP1 to SP9 are selected as shown in FIG. 15A when the cutting interval is greatly increased. In such a case, when the reference cutting scheduled line is changed from the position α to the negative direction in the X-axis direction, the cutting yield decreases when the reference cutting scheduled line overlaps the sampling internal electrodes SP2, SP5, SP8. . When the sampling internal electrodes SP2, SP5 and SP8 are exceeded, the cutting yield again becomes 100%, and the cutting yield continues to be 100% (although it overlaps with the internal electrode, it does not overlap with the sampling internal electrode, so the cutting yield). In the estimation step, it is determined that none of the sampling internal electrodes are NG products), the cutting yield decreases when they overlap with the sampling internal electrodes SP1, SP4, SP7, and the cutting yield again becomes 100% at the position indicated by β. . FIG. 15B shows the relationship between the cutting reference position and the cutting yield. As shown in FIG. 15 (b), the cutting yield peak becomes very wide. Thus, in order to obtain the optimum value of the cutting reference position, it is necessary to change the cutting reference position to the position indicated by β.

  On the other hand, when the sampling internal electrodes SP1 to SP9 are selected as shown in FIG. 16A, when the reference cutting scheduled line is changed from the position α to the negative direction in the X axis direction, the reference cutting planned line Is overlapped with the sampling internal electrode SP5, the cutting yield decreases. Further, when the sampling internal electrode SP5 is exceeded, the cutting yield again becomes 100%, and the cutting yield 100% continues between the sampling internal electrode SP5 and the sampling internal electrode SP2. Then, the cutting yield decreases when it overlaps the sampling internal electrode SP2, and the cutting yield again reaches 100% at the position indicated by β. FIG. 16B shows the relationship between the cutting reference position and the cutting yield. As shown in FIG. 16B, the peak of the cutting yield can be narrowed. Thus, the optimum value of the cutting reference position can be obtained only by changing the cutting reference position to the position of the sampling internal electrode adjacent in the X-axis direction, and the calculation load can be reduced.

  In FIG. 16A, the lines are shifted one by one in the X axis direction, but may be shifted one by one in the Y axis direction. In this case, the scheduled cutting lines arranged in the Y axis direction are determined. In this case, the above-described effects can be obtained. At this time, the X-axis direction corresponds to the “second direction” in the claims, and the Y-axis direction corresponds to the “first direction” in the claims.

  Further, at least one internal electrode may be sampled for each column in the X-axis direction as the sampling internal electrode. Specifically, as shown in FIG. 17B, in addition to the sampling internal electrodes SP1 to SP9 selected three by three in the same column in the X-axis direction, between the sampling internal electrode SP1 and the sampling internal electrode SP8, The internal electrodes shifted one by one in the Y-axis direction and the X-axis direction are selected as sampling internal electrodes, and are shifted one by one in the Y-axis direction and X-axis direction between the sampling internal electrode SP2 and the sampling internal electrode SP7. In addition, each internal electrode is selected as a sampling internal electrode, and each internal electrode shifted by one in the Y-axis direction and the X-axis direction between the sampling internal electrode SP2 and the sampling internal electrode SP9 is selected as the sampling internal electrode. , Y axis direction and X axis between sampling internal electrode SP3 and sampling internal electrode SP8 Selecting each of the internal electrodes which are shifted one by one in the direction sampling internal electrodes.

  For example, as shown in FIG. 17A, when the sampling internal electrodes SP1 to SP9 are selected three by three in the same column in the X-axis direction, the reference cutting scheduled lines are the sampling internal electrodes SP1, SP4, SP7 and the sampling internals. If it exists between the electrodes SP2, SP5 and SP8, even if it overlaps with an internal electrode other than the sampling internal electrode, it does not overlap with the sampling internal electrode, so a high cutting yield is estimated.

  On the other hand, when the sampling internal electrode is selected as shown in FIG. 17B, the sampling internal electrode existing in each column in the X-axis direction does not matter where the reference cutting scheduled line exists in the X-axis direction. If it overlaps, it can be determined as an NG product, so the cutting yield can be accurately estimated.

  In the above-described embodiment, only the state in which the sampling internal electrode on the end side in the X axis direction exists between the pair of scheduled cutting lines existing on the end side in the X axis direction has been described. Further, it may be possible to cope with a case where there is no sampling internal electrode between a pair of scheduled cutting lines existing on the end side. Specifically, in the cutting yield estimation step, the cutting yield is estimated by comparing the position of a set of cutting planned lines adjacent to each other and the position of the sampling internal electrode, and the verification is performed on a plurality of cutting planned lines. This can be done for all pairs.

  For example, in the cutting yield estimation step, the cutting yield is estimated by comparing the position of a pair of cutting scheduled lines adjacent to each other and the position of the sampling internal electrode, and the sampling internal electrode is inserted between the cutting planned lines. A case will be considered in which it is determined that the product is an OK product when it exists, and the determination is made only for the line to be cut at the end side in the X-axis direction. In this case, in the state shown in FIG. 18A, the coordinates a and b of both ends of the sampling internal electrode SP1 exist between the set of the planned cutting line A and the planned cutting line B on the end side. Therefore, it can be determined as an OK product. However, in the state shown in FIG. 18B, the coordinates a and b of both ends of the sampling internal electrode SP1 do not exist between the set of the cutting planned line A and the cutting planned line B on the end side. Even if it exists between the planned cutting line B and the planned cutting line C, it is determined as an NG product.

  On the other hand, when collation is performed for all sets of a plurality of scheduled cutting lines, it can be determined as an OK product in the state shown in FIG. 18A, and at the same time, in the state shown in FIG. Since all of the group of lines A and B, the group of scheduled cutting lines B and C, the group of scheduled cutting lines C and D, and the subsequent groups are collated, it can be determined as an OK product. Thereby, even when the cutting reference position is shifted, the cutting yield can be estimated, and as a result, the manufacturing efficiency can be improved.

  Note that, in the drawings in the above description, for the sake of explanation, the description has been made using a diagram in which each of the internal electrodes 103 in the X-ray captured image of the stacked body 100 can be clearly distinguished. However, as shown in FIG. 1, the internal electrodes 103 of the multilayer body 100 are alternately displaced in the Y-axis direction one by one, so that the X-ray captured image is the Y-axis in the uppermost layer as shown in FIG. 19. The image is such that the lower-layer internal electrode 103 is thinly projected in the gap between the internal electrodes 103 adjacent in the direction.

  In the internal electrode position acquisition step, an image as shown in FIG. 19 can be taken by irradiating transmitted light so as to produce a difference in shading according to the overlapping ratio of internal electrodes in the stacking direction. As a result of the difference in shading, the coordinate position of the overlapping portion of each sampling internal electrode can be acquired.

  Further, in the internal electrode position acquisition step, an image as shown in FIG. 19 that has passed through the inside of the multilayer body is captured a plurality of times, and the coordinates of the portion in which the captured internal electrode is projected darkly and the portion that is lightly projected are converted into a plurality of coordinates. While acquiring about an image, the average value can be calculated and the position of a sampling internal electrode can be acquired based on the calculated average value. As a result, the accuracy of acquiring the position of the sampling internal electrode can be improved.

  DESCRIPTION OF SYMBOLS 100 ... Laminated body, 101 ... Dielectric layer, 102 ... Internal electrode layer, 103 ... Internal electrode, 104 ... Positioning mark, SP1-SP9 ... Sampling internal electrode, CL ... Scheduled cutting line, CLB ... Standard cutting scheduled line.

Claims (9)

A manufacturing method for manufacturing a plurality of stacked electronic components by cutting a stacked body formed by stacking a dielectric layer and an internal electrode layer in which a plurality of internal electrodes are arranged in a planar direction. Because
A laminate preparation step of preparing the laminate in which the plurality of internal electrodes are arranged in a first direction and a second direction orthogonal to the first direction;
An internal electrode position acquisition step of acquiring each position in the planar direction of a predetermined number of sampling internal electrodes among the plurality of internal electrodes by capturing an image that has passed through the inside of the stacked body;
As parameters of a plurality of scheduled cutting lines arranged in the first direction, a cutting reference position indicating the position of a reference cutting scheduled line serving as a reference, a cutting interval indicating an interval between the scheduled cutting lines, and the scheduled cutting line A cutting scheduled line setting step for setting a cutting angle indicating an angle in the plane direction of
Based on the position of the sampling internal electrode acquired in the internal electrode position acquisition step and the planned cutting line set in the planned cutting line setting step, a cutting yield estimation step that estimates a cutting yield;
Based on the estimation result estimated in the cutting yield estimation step, optimization of the planned cutting line is obtained by obtaining an optimum value of the cutting reference position, cutting interval, or cutting angle set in the planned cutting line setting step. Cutting line optimization process to perform,
A laminated body cutting step of cutting the laminated body based on the scheduled cutting line optimized in the scheduled cutting line optimization step. The cutting scheduled line setting step, the cutting yield estimation step, and the cutting planned line optimization step are performed a plurality of times,
After the optimum value of one parameter among the cutting reference position, cutting interval, and cutting angle is obtained in the cutting scheduled line optimization step,
The scheduled cutting line setting step of setting a new scheduled cutting line by substituting the optimum value into the one parameter is performed,
In the new scheduled cutting line, the yield estimation step of estimating the yield at each value by changing the value of another parameter different from the one parameter is performed,
2. The method of manufacturing a multilayer electronic component according to claim 1, wherein the scheduled cutting line optimization step of calculating an optimum value of the other parameter based on a yield estimation result is performed. In the cutting line optimization process,
If it is the first optimization, the cutting reference position is optimized,
If the cutting reference position was optimized in the previous optimization, the cutting angle was optimized,
If the cutting angle was optimized in the previous optimization, the cutting interval was optimized,
3. The method of manufacturing a multilayer electronic component according to claim 2, wherein when the cutting interval is optimized in the previous optimization, the cutting reference position is optimized.   Before the scheduled cutting line setting step, the positioning marks formed at the four corners in the planar direction of the rectangular flat plate-like laminate are detected, and the laminate is positioned in the planar direction based on the positioning marks. The method of manufacturing a multilayer electronic component according to any one of claims 1 to 3, further comprising a laminate positioning step. In the internal electrode position acquisition step, as the sampling internal electrode, at least the positions of two internal electrodes present in different columns in the second direction are acquired,
5. The stacked type according to claim 1, wherein one of the sampling internal electrodes is present in a row adjacent to the other sampling internal electrode in the first direction. 6. Manufacturing method of electronic components.   5. The position of at least one internal electrode for each column in the first direction is acquired as the sampling internal electrode in the internal electrode position acquisition step, respectively. The manufacturing method of the multilayer electronic component of description. In the cutting yield estimation step, the cutting yield is estimated by comparing the position of a set of cutting planned lines adjacent to each other and the position of the sampling internal electrode,
The method for manufacturing a multilayer electronic component according to claim 1, wherein the collation is performed for all sets of the plurality of scheduled cutting lines.   In the internal electrode position acquisition step, the image is picked up by irradiating transmitted light so as to produce a difference in shade according to the overlapping ratio of the internal electrodes in the stacking direction. The manufacturing method of the multilayer electronic component as described in any one of these.   In the internal electrode position acquisition step, the image that has passed through the inside of the multilayer body is imaged a plurality of times, and the coordinates of the portion in which the captured internal electrode is projected dark and the portion in which the image is thinly projected are associated with the plurality of images. The multilayer electronic component according to any one of claims 1 to 7, wherein the average value is calculated and the position of the sampling internal electrode is acquired based on the calculated average value. Production method.