JP2011024278A - Method of manufacturing oscillating power generating element, and power generation element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture an oscillating power generating element which has substantially the same power generation performance as conventional power generating elements and does not use high-cost manufacturing processes. <P>SOLUTION: First, an oscillating part 201 is formed by forming an electrode 102, which includes an electret material on one main surface of an Si substrate 101 with which SiO<SB>2</SB>created at the surface (S101). A spring material layer 104 is formed via a peeling layer 901 to a support board 900 through application (S102). Here, a photosensitive material is used for the spring material layer 104. A frame part 141, a central island 142, and a spring part 143 are integrally formed from the spring material layer 104 by photolithography and selective etching (S103). An oscillating section 201 is bonded to the central island 142 by an adhesive or the like (S104). An oscillating layer 11 is formed by peeling off the supporting board 900 (S105). A base layer 16 is formed (S106) and an electrode 102 is charged with a charge (S107), and then the oscillating layer 11 and the base layer 16 are stuck together at a specified interval (S108). <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a vibration power generation element that converts vibration into an electric signal, and the vibration power generation element.

  Conventionally, as shown in Patent Document 1 and Non-Patent Document 1, various studies and publications have been made on vibration power generation elements that generate electricity by converting vibrations into electrical signals using electret elements.

  Such a vibration power generation element using the conventional electret element is manufactured by the following process. FIG. 20 is a diagram showing a manufacturing flow of a conventional vibration power generation element.

  First, as shown in FIG. 20A, on the one main surface of a Si substrate 101 having a predetermined area, rectangular electrodes 102 in a plan view are arrayed using Ni or Au. Further, an electret material is formed on the surface of the electrode 102.

  Next, as shown in FIG. 20B, a recess 103 for filling a spring material later is formed in the Si substrate 101. At this time, the recess 103 is formed by deep etching the Si substrate 101 using the RIE method.

  Next, as shown in FIG. 20C, the recesses 103 are filled with the parallel material 104, which is a spring material, by vapor deposition.

  Next, as shown in FIG. 20D, the Si substrate 101 is deep-etched again to leave the predetermined region and the peripheral portion of the Si substrate 101 where the electrodes 102 are formed, and to expose the parylene 104. To do. As a result, an opening 105 is formed, and a spring formed by the parylene 104 is formed in the opening 105.

  Next, as shown in FIG. 20E, electric charge is applied to the electric material of the electrode 102 by corona discharge or the like. The vibration layer 11 is formed by the above process.

  Next, as shown in FIG. 20F, the base layer 12 and the vibration layer 11 that are separately formed are attached by the side wall member 13 so that the electrodes formed in the respective layers face each other and are separated by a predetermined distance. wear. Through the above steps, a vibration power generation element using an electret is formed.

JP 2005-529574 A

Tsutsumi Takumi, Suzuki Yuji, Kasaki Nobuhide, Kashiki Noriaki, Morisawa Yoshitomi, “Development of Electret Generator with Large Deformation MEMS Vibrating Structure”, Proceedings of 12th Symposium on Power and Energy Technology, Japan Society of Mechanical Engineers, 2007 6.14, 15

  However, in the conventional method for producing a power generating element, the Si substrate is first deep-etched using the RIE method or the like in order to form a recess for filling the parylene, and then deepened again to expose the filled parylene. Must be etched. Such deep etching of the Si substrate requires a very expensive apparatus, and is an expensive manufacturing process. Furthermore, the process of depositing parelin is also a high-cost manufacturing process. For this reason, the power generating element manufactured by the conventional manufacturing method is inevitably expensive.

  Therefore, an object of the present invention is to provide a method for manufacturing a vibration power generation element that can obtain substantially the same power generation performance as a conventional power generation element without using an expensive manufacturing process, and a vibration power generation element manufactured by the manufacturing method. There is.

  The present invention relates to a method for manufacturing a vibration power generation element including a vibration layer in which a vibration electrode is formed and a base layer in which a fixed electrode is formed. In this method of manufacturing a vibration power generation element, a step of forming a vibration part by forming a vibration electrode on the surface of the insulating substrate, a step of forming a vibration layer by disposing the vibration part on the spring material layer, and an insulating substrate Forming a base layer by forming a fixed electrode on the surface; and bonding the vibration layer and the base layer so that the vibration electrode and the fixed electrode face each other.

  In this manufacturing method, the spring property of the vibration layer can be obtained by processing a spring material layer that can be easily etched without deep etching the insulating substrate forming the vibration part. Accordingly, a vibration power generation element can be manufactured with a relatively inexpensive and general-purpose apparatus without requiring an apparatus for deep etching an expensive insulating substrate.

  Further, the step of forming the vibration layer in the method for manufacturing a vibration power generating element of the present invention includes a central island part to which the vibration part is bonded, a frame part fixedly installed, and the central island part and the frame part. A step of forming a spring material layer including a connecting spring portion, and a step of bonding the vibrating portion to the central island portion after the central island portion, the frame body portion, and the spring portion are formed.

  This manufacturing method shows a specific process of the above-described manufacturing method. First, after forming the spring portion of the spring material layer, the vibrating portion is bonded.

  Further, the step of forming the vibration layer in the method of manufacturing a vibration power generation element of the present invention includes the step of disposing the vibration part on the flat spring material layer and the flat spring material layer on which the vibration part is disposed. And a step of forming a central island portion in which the vibration portion is disposed, a frame body portion fixedly installed, and a spring portion connecting the central island portion and the frame body portion.

  This manufacturing method also shows the specific steps of the above-described manufacturing method. In this method, first, the vibrating portion is formed on the spring material layer, and then the spring portion is formed.

  As described above, the vibration power generation element can be manufactured by a simple process regardless of which manufacturing method is used.

  The step of forming the vibration layer in the method for manufacturing a vibration power generation element of the present invention is arranged so that the vibration part is at least partially embedded in the spring material layer.

  In this manufacturing method, the vibration power generation element can be reduced in height by embedding the vibration portion in the spring material layer.

  Further, the step of forming the vibration layer in the method for manufacturing the vibration power generation element of the present invention is arranged so that the vibration part is not only embedded in the central island part but also the insulating body is embedded in the frame part. .

  In this manufacturing method, the mechanical strength is improved by embedding a part of the rigid insulating substrate in the frame portion. Thereby, a vibration power generating element with higher reliability can be easily manufactured.

  The step of forming the vibration layer in the method for manufacturing a vibration power generating element of the present invention is a step of disposing the spring layer in a shape formed from a bridge portion that connects the vibration portion and the insulating substrate of the frame portion. And a step of removing the bridge portion after the step of forming the central island portion, the frame body portion, and the spring portion.

  This manufacturing method shows a more specific manufacturing method for manufacturing a vibration power generation element in which an insulating substrate is embedded in the above-described frame body. Thus, by providing the bridge portion, the vibration portion and the insulating substrate of the frame portion can be disposed at the same time.

  Further, in the method for manufacturing a vibration power generating element of the present invention, the step of bonding the vibrating portion to both opposing main surfaces of the central island portion of the spring material layer and the vibrating portion bonded to both the main surfaces are opposed to each other. And bonding the two base layers to the vibration layer.

  In the method for manufacturing a vibration power generating element of the present invention, the vibration electrode is formed so as to face the vibration electrodes formed on both main surfaces of the insulating substrate and the vibration electrodes formed on both main surfaces of the insulating substrate. Bonding two base layers to the layer.

  In these manufacturing methods, two sets of the vibration electrode and the fixed electrode can be formed in the element, so that the power generation amount can be improved.

  In the method for manufacturing a vibration power generation element of the present invention, a photosensitive material is used for the spring material layer, and a photolithography method is used for forming the central island portion, the frame body portion, and the spring portion of the spring material layer.

  In this manufacturing method, general-purpose photolithography can be used for patterning the spring material layer, and a photosensitive material is used for the spring material layer, so that no resist is required for patterning the spring material layer. Thereby, a vibration electric power generation element can be manufactured at a further simple process and low cost.

  Further, in the method for manufacturing a vibration power generation element of the present invention, the spring portion of the spring material layer is formed in a shape having a fold-back that is point-symmetric with respect to the center in the extending direction of the spring portion, and the tip of the fold-back portion is rounded. It is formed in a shape having

  In this manufacturing method, the spring portion can be formed into a shape that is resistant to stress. Thereby, a highly reliable vibration power generation element can be manufactured.

  The present invention also relates to a vibration power generation element including a vibration layer in which a vibration electrode is formed and a base layer in which a fixed electrode is formed. This vibration power generation element includes a vibration layer having a vibration part and a base layer. The vibration part is formed by forming a vibration electrode on the surface of the insulating substrate. The vibration layer includes a spring material layer and a vibration layer. The spring material layer includes a photosensitive material, and includes a central island portion, a frame body portion, and a spring portion that connects the central island portion and the frame body portion. And a vibration part is arrange | positioned in this center island part. The base layer has a shape in which a fixed electrode is formed on the surface of the insulating substrate, and is affixed to the frame body portion of the vibration portion so that the fixed electrode is disposed to face the vibration electrode.

  In this configuration, a spring material layer of a photosensitive material is used, and the vibration part is disposed in the spring material layer that can be processed by such general-purpose photolithography, so that it is manufactured by a low-cost manufacturing method. A low-cost vibration power generation element can be realized.

  According to this invention, the vibration power generation element having the same characteristics as the conventional one can be manufactured at a low cost by a simpler process than the conventional one. Thereby, an inexpensive vibration power generation element having the same characteristics as the conventional one can be realized.

It is side surface sectional drawing and top view which show the structure of the vibration electric power generation element which concerns on the 1st Embodiment of this invention. It is a flowchart which shows the manufacturing method of the vibration electric power generation element of 1st Embodiment. It is a figure which shows typically the manufacturing process of the vibration electric power generation element formed with the manufacturing flow shown in FIG. It is a figure which shows typically the manufacturing process of the vibration electric power generation element formed with the manufacturing flow shown in FIG. It is a flowchart which shows the manufacturing method of the vibration electric power generation element of 2nd Embodiment. It is a figure which shows typically the manufacturing process of the vibration electric power generation element formed with the manufacturing flow shown in FIG. It is a flowchart which shows the manufacturing method of the vibration electric power generation element of 3rd Embodiment. It is a figure which shows typically the manufacturing process of the vibration electric power generation element formed with the manufacturing flow shown in FIG. It is a flowchart which shows the manufacturing method of the vibration electric power generation element of 4th Embodiment. It is a figure which shows typically the manufacturing process of the vibration electric power generation element formed with the manufacturing flow shown in FIG. It is side surface sectional drawing which shows the structure of the vibration electric power generation element which concerns on 5th Embodiment. It is a flowchart which shows the manufacturing method of the vibration electric power generation element of 5th Embodiment. It is a figure which shows typically the manufacturing process of the vibration electric power generation element formed with the manufacturing flow shown in FIG. It is a flowchart which shows the manufacturing method of the vibration electric power generation element of 6th Embodiment. It is a figure which shows typically the manufacturing process of the vibration electric power generation element formed with the manufacturing flow shown in FIG. It is a flowchart which shows the manufacturing method of the vibration electric power generation element of 7th Embodiment. It is a figure which shows typically the manufacturing process of the vibration electric power generation element formed with the manufacturing flow shown in FIG. It is a flowchart which shows the manufacturing method of the vibration electric power generation element of 8th Embodiment. It is a figure which shows typically the manufacturing process of the vibration electric power generation element formed with the manufacturing flow shown in FIG. It is a figure which shows the manufacture flow of the conventional vibration electric power generation element.

  A vibration power generation element and a method for manufacturing the vibration power generation element according to the first embodiment of the present invention will be described with reference to the drawings.

  First, the configuration of the vibration power generation element will be described with reference to FIG. FIG. 1A is a side sectional view showing the configuration of the vibration power generation element 1 of the present embodiment, and FIG. 1B is a plan view of the vibration power generation element 1. FIG. 1B is a plan view with the cover layer 17 removed.

  The vibration power generation element 1 has a structure in which the vibration layer 11 and the base layer 16 are separated by a sidewall member 13 at a predetermined interval. On the side of the vibration layer 11 facing the base layer 16, a cover layer 17 is disposed with a predetermined distance from the vibration layer 11 by the side wall member 13.

  The vibration layer 11 includes a spring material layer 104 and a vibration part 201. The spring material layer 104 is made of a resin made of a polymer material or the like, more preferably a photosensitive resin. The spring material layer 104 includes a frame-shaped spring frame portion 141 joined to the side wall member 13, a central island portion 142 having substantially the same area as the vibrating portion 201 arranged in the center of the layer, and a spring A spring portion 143 that connects the frame body portion 141 and the central island portion 142 is provided. With this structure, the central island part 142 is installed so as to be able to vibrate in the inner region of the spring frame part 141.

The vibration unit 201 includes a Si substrate 101 having an oxide layer such as SiO ₂ formed on the surface, and a plurality of electrodes 102 are formed on one main surface of the Si substrate 101. Each electrode 102 has a rectangular shape in plan view, Ti and Au are formed as a base metal, and an electret material is formed on the base electrode. The electret material is charged by corona discharge or the like. The plurality of arranged electrodes 102 are electrically connected by wiring electrodes 106. In the vibration part 201 having such a structure, the surface on which the electrode 102 is not formed is formed on one main surface (the lower surface in FIG. 1A) of the central island portion 141 of the spring material layer 104 using an adhesive. It is glued. In addition, the electrode 102 and the wiring electrode 106 of the vibrating portion 201 can be connected to the outside by a through hole 107 formed in the central island portion 141 of the spring material layer 104 and a lead-out electrode 108 formed in the spring portion 143. .

The base layer 16 includes a Si substrate 601 having an oxide layer such as SiO ₂ formed on the surface. An electrode 602 similar to the base metal of the electrode 102 of the Si substrate 101 of the vibration unit 201 is formed on the Si substrate 601. The plurality of arranged electrodes 602 are electrically connected by wiring electrodes 606, and can be connected to the outside by through holes 607 formed in the Si substrate 601. Note that an electret material may be formed on part of the electrode 602.

  For example, the cover layer 17 is simply a flat plate member made of the Si substrate 701.

  The vibration power generation element 1 having such a structure generates power on the following principle. First, in a state where no vibration is applied from the outside, as shown in FIG. 1, the electrode 102 of the vibration layer 11 and the electrode 602 of the base layer 16 are substantially opposed to each other. In this state, the electrode 102 and the electrode 602 are induced to have a charge corresponding to the substantially opposite state corresponding to the charge charged to the electret material.

  Next, when vibration is applied from the outside, the spring portion 143 of the spring member 104 of the vibration layer 11 expands and contracts (changes in shape), and the facing area between the electrode 102 and the electrode 602 changes. Since the amount of charge that can be induced by the electrodes 102 and 602 changes due to the change in the facing area, charges are released from a wiring pattern (not shown) according to the amount of change. An alternating current can be obtained by repeating the discharge of such charges by further vibration or the like.

Next, the manufacturing method of the vibration electric power generation element 1 of this embodiment is demonstrated with reference to FIGS.
FIG. 2 is a flowchart showing a method for manufacturing the vibration power generation element of this embodiment.
3 and 4 are diagrams schematically showing a manufacturing process of the vibration power generation element formed by the manufacturing flow shown in FIG. In the following description, an example in which the base layer 16 and the cover layer 17 are formed after the vibration layer 11 is formed is shown. However, the base layer 16 and the cover layer 17 can be formed separately from the vibration layer 11. Further, it may be performed separately in parallel before or after the step of forming the vibration layer 11. 3 and 4, the through hole 107, the wiring electrodes 106 and 606, and the routing electrode 108 are not shown.

First, the vibration part 201 is formed (FIG. 2: S101). Specifically, as shown in FIG. 3A, each vibrating part 201 is configured with respect to the Si substrate 101 ′ on which SiO ₂ is formed on the surface having an area where a plurality of vibrating parts 201 can be formed. A plurality of arranged electrodes 102 are formed. Here, formation of each electrode 102 consists of formation of a base metal and formation of an electret material. For the formation of the base metal, Au and Ti are sequentially formed by using photolithography, wet etching, or the like so that a rectangular pattern is arranged in a plan view as shown in FIG. For example, Au is formed with a thickness of about 200 nm, and Ti is formed with a thickness of about 5 nm. The electret material is formed by first applying an electret material film made of an amorphous fluororesin to a predetermined thickness (for example, about 15 μm), then masking a region corresponding to the electrode 102 with a resist, and etching with oxygen plasma or the like. Thereby, an electret material is formed only on the base metal Au / Ti of the electrode 102. Note that the shape of each electrode 102 is not limited to the above-described rectangular shape, and may be any shape that changes the area of the base layer 16 facing the electrode due to vibration. Further, through holes (see reference numeral 107 in FIG. 1) are formed in the Si substrate 101 ′ as necessary, and a part of the arranged rectangular pattern electrodes 102 are wiring electrodes (see FIG. 1). These electrodes are connected to the through holes.

  Here, the base electrode and the electret material are not limited to those described above, and any material can be used as long as desired characteristics can be obtained as the vibration power generation element 1. Moreover, the formation method of these base metals and electret materials is not restricted to the above-mentioned photolithography and etching. Further, the substrate is not limited to the Si substrate, and other insulating substrates may be used.

  Next, as shown in FIG. 3B, the size is divided into dimensions for each vibration unit 201 including the Si substrate 101 having a predetermined area and the electrodes 102 arranged and formed on the Si substrate 101.

  Next, the spring material layer 104 is formed (FIG. 2: S102). Specifically, first, a support substrate 900 is prepared, and a release layer 901 is formed with a predetermined thickness on one main surface of the support substrate 900 as illustrated in FIG. As the support substrate 900, an inexpensive glass substrate or the like may be used. For the release layer 901, for example, a material that can be dissolved by a release solution such as PMGI (polymethylglutarimide) is used. Further, as shown in FIG. 3C, a resin made of a polymer material or the like, more preferably a photosensitive resin, is applied to the surface of the release layer 901 (the surface opposite to the support substrate 900) and cured. At this time, the coating thickness is set to a thickness at which the spring portion 143 whose shape is formed in a later-described process has a desired strength. As a coating method, a printing method, a dip coating method, or the like is used.

  Next, the spring material layer 104 is patterned to integrally form the spring frame 141, the central island 142, and the spring 143 (FIG. 2: S103). Specifically, as shown in FIG. 3D, portions of the spring material layer 104 excluding the spring frame portion 141, the central island portion 142, and the spring portion 143 are removed by etching. Photolithography is used for this etching. Here, in the case where the spring material layer 104 is formed of a resin having no photosensitivity, after applying a resist agent, the mask frame portion 141, the central island portion 142, and the spring are applied by mask exposure and etching. The part 143 is integrally formed. When such a manufacturing method is used, the spring portion 143 can be formed without using deep etching by an expensive RIE method as in the prior art.

  Further, if the spring material layer 104 is formed of a photosensitive resin, the spring frame body portion 141, the central island portion 142, and the spring portion 143 are integrated by using only mask exposure and etching without using a resist agent. To form. According to such a manufacturing method, the resist coating process can be omitted without using a resist, so that the spring portion 143 can be formed more simply and inexpensively.

  Here, the pattern shape of the spring part 143 extends perpendicularly from the center of the spring part with respect to the vibration direction (lateral direction in FIG. 3D), and is folded back at a position having the same length as the central island part 142. The shape is connected to the spring frame part 141 and the central island part 142. With such a structure, the spring part 143 has a point-symmetric shape, and the distortion of the spring due to the internal stress of the resin can be reduced. Moreover, by concentrating the tip shape of the folded portion, stress concentration can be relaxed and the durability of the spring can be improved. Note that the length of the spring is not limited to the above length (see FIG. 3D), and may be set to a length that provides a predetermined spring constant.

  Although omitted in FIG. 3, as shown in FIG. 1, in the case where a lead electrode is formed on the spring portion 143, a conductive material is disposed on the surface of the spring material layer 104 by coating or the like. The pattern may be formed in the same manner as the spring portion 143.

  Next, the vibration part 201 is bonded to the central island part 142 of the spring material layer 104 (FIG. 2: S104). Specifically, as shown in FIG. 3E, the vibrating part 201 is bonded to the surface of the central island 142 of the patterned spring material layer 104 opposite to the peeling layer 901 by bonding. At this time, the vibration part 201 is disposed such that the surface opposite to the surface on which the electrode 102 is formed is in contact with the central island part 142.

  Next, as shown in FIG. 3F, the composite member composed of the spring material layer 104 and the vibration part 201 is immersed in NMP (N-methyl-pyrrolidone), so that it peels off from the support substrate 900 and vibrates. Layer 11 is formed (FIG. 2: S105).

Next, as shown in FIG. 4A, the base layer 16 is formed (FIG. 2: S106). The base layer 16 is formed by the same method as the formation method of the electrode 102 excluding the Si substrate 101 and the electret material on which SiO ₂ is formed on the surface of the vibration unit 201 described above. That is, an electrode 602 made of a conductive material and having a shape in plan view with the electrode 102 is formed on the surface of the Si substrate 601. Further, in the Si substrate 601 of the base layer 16, although omitted in FIG. 4, similarly to the vibrating portion, a wiring electrode 606 that electrically connects the electrode 602 and a through hole for externally connecting these electrodes. 607 is formed (see FIG. 1). The base layer 16 is not limited to the Si substrate 601 and may be a substrate of other rigid insulating material, and the electrode 602 is not necessarily made of Ti / Au. Here, an example in which the electrode for external connection is formed using the wiring electrode 606 and the through hole 607 is shown, but the electrode for external connection may be formed by other methods.

  Next, as shown in FIG. 4B, the side wall member is formed by forming a solder paste with a predetermined thickness (for example, about 100 μm) in the peripheral edge region of the Si substrate 601 of the base layer 16 by using, for example, a screen printing method. Form 13 elements.

  Next, as shown in FIG. 4C, the electret material of the electrode 102 is charged by performing corona discharge with the electrode 102 of the vibration layer 11 and the electrode 602 of the base layer 16 facing each other at a predetermined interval. (FIG. 2: S107). Here, as discharge conditions, for example, the discharge voltage is 8 kV and the acceleration voltage is 600 V. This discharge condition may also be set as appropriate depending on the material of the electrodes 102 and 602, the charge charge amount, and the like.

  Next, as shown in FIG. 4D, the vibration layer 11 and the base layer 16 are bonded together using the side wall member 13, and as shown in FIG. 4E, the cover layer 17 and the vibration layer 11 are bonded together. Bonding is performed using another side wall member 13 (FIG. 2: S108). At this time, the vibration layer 11 and the base layer 16 are bonded so that the electrodes 102 of the vibration layer 11 and the electrodes 602 of the base layer 16 are spaced apart from each other at a predetermined interval and the main surfaces thereof face each other. This bonding method uses, for example, a reflow process. As another method, the vibration layer 11 and the base layer 16 may be bonded to the side wall member 13 using an adhesive.

  By using the manufacturing method as described above, the vibration power generation element 1 can be formed. At this time, the vibration power generation element can be manufactured only by a simple and low-cost process without using a special and expensive process as in the prior art. Therefore, an inexpensive vibration power generation element can be formed while obtaining characteristics equivalent to those of the conventional product.

  Next, a method for manufacturing a vibration power generation element according to the second embodiment will be described with reference to the drawings. FIG. 5 is a flowchart showing a method for manufacturing the vibration power generation element of this embodiment. FIG. 6 is a diagram schematically showing a manufacturing process of the vibration power generation element formed by the manufacturing flow shown in FIG. In this embodiment, the method for forming the vibration layer 11 is different from that of the first embodiment, and the process for bonding the vibration layer 11 to the base layer 16 and the cover layer 17 is the same. Will be explained. In FIG. 6, the through hole 107, the wiring electrodes 106 and 606, and the routing electrode 108 are not shown.

First, as shown in FIG. 6 (A), a Si substrate 101 in which SiO ₂ is formed on the surface having the same area as the outer peripheral area of the spring material layer 104 as the final form is prepared, and one main surface of the Si substrate 101 is prepared. A plurality of electrodes 102 are arrayed in a substantially central region (FIG. 5: S201). The formation method of these electrodes 102 is the same as that of the first embodiment, and a temporary vibration part is formed by this process.

  Next, as shown in FIG. 6B, the spring material layer 104 is applied and formed on the surface of the Si substrate 101 opposite to the surface on which the electrodes 102 are formed (FIG. 5: S202). At this time, as shown in FIG. 6C, a resist 800 is applied to the formation surface of the electrode 102 of the Si substrate 101.

  Next, as shown in FIG. 6D, the spring material layer 104 is patterned to integrally form the spring frame 141, the central island 142, and the spring 143 (FIG. 5: S203).

  Next, as illustrated in FIG. 6E, the Si substrate 101 other than the region to be the vibration portion 201 is etched by a photolithography method using the resist 800, and the resist 800 is removed, whereby FIG. ), The vibration layer 11 is formed (FIG. 5: S204).

  Thereafter, the base layer 16 is formed (FIG. 5: S205), the electret material of the electrode 102 is charged (FIG. 5: S206), and the vibration layer 11, the base layer 16, and the cover layer 17 are bonded together (FIG. 5). : S207), thereby forming the vibration power generation element.

  Even with such a manufacturing method, the vibration power generation element can be formed at low cost.

  Next, a method for manufacturing a vibration power generation element according to the third embodiment will be described with reference to the drawings. FIG. 7 is a flowchart showing a method for manufacturing the vibration power generation element of this embodiment. FIG. 8 is a diagram schematically showing a manufacturing process of the vibration power generation element formed by the manufacturing flow shown in FIG. The present embodiment has a structure in which the vibration portion 201 is embedded in the spring material layer 104 in the vibration layer 11. The formation method associated with this structure is different from that of the first embodiment, and the vibration layer 11 is replaced with the base layer 16. Since the process of bonding to the cover layer 17 is the same, only different manufacturing processes will be described. In FIG. 8, the through hole 107, the wiring electrodes 106 and 606, and the routing electrode 108 are not shown.

First, as shown in FIGS. 8A and 8B, a vibrating portion 201 is formed that includes a Si substrate 101 having SiO ₂ formed on the surface and electrodes 102 arranged in an array. The formation method of this vibration part 201 is the same as 1st Embodiment (FIG. 7: S301).

  Next, as shown in FIG. 8C, the vibration part 201 and the support substrate 900 are bonded via a release agent 901 (FIG. 7: S302). At this time, the vibration unit 201 is disposed such that the formation surface side of the electrode 102 is on the support substrate 900 side. The support substrate 900 and the release agent 901 used in this step may be the same as those used when forming the spring material layer 104 in the first embodiment.

  Next, as shown in FIG. 8D, the spring material layer 104 is formed by coating on the surface of the release layer 901, that is, the side to which the vibrating portion 201 of the support substrate 900 is bonded (FIG. 7: S303). At this time, the spring material layer 104 is set to a thickness that completely covers the vibration portion 201 and a thickness that allows the spring portion 143 as a final form to have a desired strength.

  Next, as shown in FIG. 8E, the spring material layer 104 is patterned to integrally form the spring frame 141, the central island 142, and the spring 143 (FIG. 7: S304). This patterning method may be the same method as in the first embodiment.

  Next, as shown in FIG. 8F, the composite member composed of the spring material layer 104 and the vibration part 201 is immersed in NMP (N-methyl-pyrrolidone), so that the support member 900 peels off and vibrates. The layer 11 ′ is formed (FIG. 7: S305).

  Thereafter, the base layer 16 is formed (FIG. 7: S306), the electret material of the electrode 102 is charged (FIG. 7: S307), and the vibration layer 11, the base layer 16, and the cover layer 17 are bonded together (FIG. 7). : S308), thereby forming the vibration power generation element.

  Even with such a manufacturing method, the vibration power generation element can be formed at low cost. Furthermore, by using this manufacturing method, the vibrating portion 201 is embedded in the spring material layer 104, so that the thickness of the vibrating layer 11 can be reduced. As a result, a vibration power generation element having a lower height can be formed.

  Next, a method for manufacturing a vibration power generation element according to the fourth embodiment will be described with reference to the drawings. FIG. 9 is a flowchart showing a method for manufacturing the vibration power generation element of this embodiment. FIG. 10 is a diagram schematically showing a manufacturing process of the vibration power generation element formed by the manufacturing flow shown in FIG. In the present embodiment, the Si frame 111 is embedded in the spring frame 141 with respect to the vibration layer 11 ′ of the vibration power generation element of the third embodiment. Since the process of bonding the vibration layer 11 to the base layer 16 and the cover layer 17 is the same except for the third embodiment, only the different manufacturing processes will be described. In FIG. 10, illustration of the through hole 107, the wiring electrodes 106 and 606, and the routing electrode 108 is omitted.

First, as shown in FIG. 10A, an Si substrate 101 having a surface SiO ₂ having the same area as the outer peripheral area of the spring material layer 104 as a final form is prepared, and one main surface of the Si substrate 101 is prepared. A plurality of electrodes 102 are arranged in a substantially central region. This step is the same as in the second embodiment. A resist is formed on the Si substrate 101 on which the electrode 102 is formed in this way, and a photolithography method is used to form a central region (corresponding to 101 in FIG. 10) to be the vibrating portion 201 and the Si frame body portion 111. Etching is performed while leaving the bridge portion 112 connecting them. As a result, as shown in FIG. 10B, a vibrating portion 201 ′ is formed which is composed of the central region, the Si frame portion 111, and the bridge portion 112 and in which the electrodes 102 are arranged in the central region (FIG. 9). : S401).

  Next, as shown in FIG. 10C, the vibration part 201 'and the support substrate 900 are bonded via a release agent 901 (FIG. 9: S402). At this time, the vibration part 201 ′ is disposed so that the formation surface side of the electrode 102 is on the support substrate 900 side. Note that the support substrate 900 and the release agent 901 used in this step may be the same as those used in the third embodiment.

  Next, as shown in FIG. 10D, the spring material layer 104 is formed by coating on the surface of the release layer 901, that is, the side to which the vibration part 201 'of the support substrate 900 is bonded (FIG. 9: S403). At this time, the spring material layer 104 is set to a thickness that completely covers the vibration part 201 ′ and a thickness that allows the spring part 143 as a final form to have a desired strength.

  Next, as shown in FIG. 10E, the spring material layer 104 is patterned to integrally form the spring frame 141, the central island 142, and the spring 143 (FIG. 9: S404). The patterning method may be the same method as in the third embodiment.

  Next, as shown in FIG. 10F, a resist is applied to the surface of the Si substrate 101 opposite to the peeling layer 901, and only the bridge portion 112 is removed by etching using a photolithography method (FIG. 9). : S405). Thereby, the peeling layer 901 and the vibration layer 11 ″ with the support substrate 900 are formed.

  Thereafter, the support substrate 900 is peeled off (FIG. 9: S406), the base layer 16 is formed (FIG. 9: S407), the electret material of the electrode 102 is charged (FIG. 9: S408), the vibration layer 11, the base The layer 16 and the cover layer 17 are bonded together (FIG. 9: S409), thereby forming a vibration power generation element.

  Even with such a manufacturing method, the vibration power generation element can be formed at low cost. Furthermore, by using this manufacturing method, the vibrating portion 201 is embedded in the spring material layer 104, so that the thickness of the vibrating layer 11 can be reduced. Furthermore, since the Si frame body portion 111 having higher hardness exists in the spring frame body portion 141, the mechanical strength as the vibration power generation element can be improved without deteriorating the characteristics. As a result, it is possible to form a vibration power generation element with a reduced height and high reliability.

  Next, a vibration power generation element according to a fifth embodiment and a method for manufacturing the vibration power generation element will be described with reference to the drawings. FIG. 11 is a side cross-sectional view showing the configuration of the vibration power generation element 1 ′ of the present embodiment.

  In the vibration power generation element 1 ′ of the present embodiment, electrodes 102 are arranged on both opposing surfaces of the vibration layer 51 as compared with the first embodiment. Further, the lower base layer 16D is disposed on one side (lower surface in FIG. 11) side of the vibration layer 51, and the upper base layer 16U is disposed on the other surface (upper surface in FIG. 11) side of the vibration layer 11.

  Specifically, the vibration layer 11 includes a spring material layer 104, an upper vibration part 201U, and a lower vibration part 201D. The structure of the spring material layer 104 is the same as that of the first embodiment, and includes a spring frame 141, a central island 142, and a spring 143 connecting them. The lower vibration portion 201D is bonded to one opposing main surface (the lower surface of the central island portion 142 in FIG. 11) of the central island portion 142 of the spring material layer 104, and the other main surface (the upper surface of the central island portion 142 in FIG. 11). The upper vibration part 201U is bonded to the. In the vibration layer 11, a wiring electrode 106, a through hole 107, and a lead-out electrode 108 for connecting the electrode 102 of the upper vibration part 201U and the electrode 102 of the lower vibration part 201D to the outside are formed.

  The lower base layer 16D and the upper base layer 16U have the same structure. The lower base layer 16D includes an Si substrate 601D and an electrode 602D arranged on the Si substrate 601D. The upper base layer 16U includes an Si substrate 601U. The electrode 602U is arranged on the Si substrate 601U. The Si substrates 601D and 601U and the electrodes 602D and 602D have the same structure as the Si substrate 601 and the electrodes 602 of the base layer 16 of the first embodiment.

  The vibration layer 51 and the lower base layer 16D are joined by the side wall member 13 so that the respective electrodes 102 and the electrode 602D are spaced apart from each other by a predetermined distance and face each other. Similarly, the vibration layer 51 and the upper base layer 16U are bonded to each other by the side wall member 13 so that the electrodes 102 and the electrode 602U are spaced apart from each other by a predetermined distance.

  With such a structure, the set of the electrode 102 and the electrode 602 of the first embodiment can be formed twice in the housing of the element. As a result, the amount of power generation can be approximately doubled.

  Next, a method for manufacturing the vibration power generation element 1 ′ of the present embodiment will be described with reference to the drawings.

FIG. 12 is a flowchart showing a method for manufacturing the vibration power generation element 1 ′ of the present embodiment.
FIG. 13 is a diagram schematically showing a manufacturing process of the vibration power generation element formed by the manufacturing flow shown in FIG. Note that the vibration power generation element 1 ′ of the present embodiment is different from the vibration power generation element 1 of the first embodiment in that vibration portions 201 U and 201 D are provided on the upper and lower surfaces of the vibration layer 51 and the upper base is used instead of the cover layer 17. Since the layer 16U is provided, only features that are different from the manufacturing method of the vibration power generation element 1 of the first embodiment will be described in detail. In FIG. 13, illustration of the through hole 107, the wiring electrodes 106 and 606, and the routing electrode 108 is omitted.

  First, as shown in FIGS. 13A and 13B, the vibrating portions 201D and 201U are formed by the same method as that of the vibrating portion 201 of the first embodiment (FIG. 12: S501).

  Next, as shown in FIG. 13C, the spring material layer 104 is formed on the surface of the support substrate 900 via the release layer 901 (FIG. 12: S502). Then, as shown in FIG. 13D, the spring material layer 104 is patterned using a photolithography method to integrally form the spring frame portion 141, the central island portion 142, and the spring portion 143 (FIG. 13D). 12: S503).

  Next, as shown in FIG. 13E, the spring material layer 104 is immersed in NMP (N-methyl-pyrrolidone) to be separated from the support substrate 900 (FIG. 12: S504).

  Next, as shown in FIG. 13F, the lower vibration portion 201D is bonded to one main surface (the lower surface of FIG. 13F) of the central island portion 142 of the spring material layer 104, and the other of the central island portions 142 is bonded. The vibration layer 51 is formed by bonding the upper vibration portion 201U to the main surface (the upper surface of FIG. 13F) (FIG. 12: S505).

  Next, as shown in FIG. 13G, the lower base layer 16D and the upper base layer 16U are formed using the same formation method as the base layer 16 of the first embodiment (FIG. 12: S506). Next, as shown in FIG. 13H, the base of the side wall member 13 is formed in the peripheral end region of the Si substrate 601D of the lower base layer 16D and the peripheral end region of the Si substrate 601U of the upper base layer 16U.

  Next, as shown in FIG. 13I, by performing corona discharge with the electrode 102D of the vibration layer 51 and the electrode 602D of the lower base layer 16D facing each other at a predetermined interval, the electret material of the electrode 102D is charged. Charge. Similarly, the electret material of the electrode 102U is charged by performing corona discharge with the electrode 102U of the vibration layer 51 and the electrode 602U of the upper base layer 16U facing each other at a predetermined interval. (FIG. 12: S507).

  Next, as shown in FIG. 13J, the vibration layer 51, the lower base layer 16D, and the upper base layer 16U are bonded together using the side wall member 13 (FIG. 12: S508). At this time, the vibrating layer 51 and the lower base layer 16D are placed so that the electrodes 102 on the lower side of the vibrating layer 51 and the electrodes 602D of the lower base layer 16D are spaced apart from each other at a predetermined interval and their main surfaces face each other. to paste together. Similarly, the vibrating layer 51 and the upper base layer 16U are pasted so that the electrodes 102 on the upper side of the vibrating layer 51 and the electrodes 602U of the upper base layer 16U are separated from each other at a predetermined interval and their main surfaces face each other. Match.

  By using such a manufacturing method, it is possible to manufacture a vibration power generation element with improved power generation in a simple and low-cost process.

  Next, a method for manufacturing a vibration power generation element according to the sixth embodiment will be described with reference to the drawings.

  FIG. 14 is a flowchart showing a method for manufacturing the vibration power generation element of this embodiment. FIG. 15 is a diagram schematically showing a manufacturing process of the vibration power generation element formed by the manufacturing flow shown in FIG. In this embodiment, only the method for forming the vibration layer 51 is different from that in the fifth embodiment, and the process of bonding the vibration layer 51 to the upper base layer 16U and the lower base layer 16D is the same. Only the process will be described. In FIG. 15, the through hole 107, the wiring electrodes 106 and 606, and the routing electrode 108 are not shown.

First, the vibration part 201B with upper and lower electrodes is formed (FIG. 14: S601). Specifically, as shown in FIG. 15A, each vibration part 201B is configured with respect to the Si substrate 101 ′ on which SiO ₂ having an area where a plurality of vibration parts 201B can be arranged is formed. A plurality of arranged electrodes 102 are formed. At this time, the electrodes 102 are formed on both opposing main surfaces of the Si substrate 101 ′. The formation method and material of the electrode 102 are the same as those of the electrode 102 of the first embodiment. Next, as shown in FIG. 15B, the size is divided into dimensions for each vibration part 201B including the Si substrate 101 having a predetermined area and the electrodes 102 arranged on both sides of the Si substrate 101.

  Next, as shown in FIG. 15C, a support substrate 900 is bonded to the surface of the Si substrate 101 where one electrode 102 is formed via a release layer 901 (FIG. 14: S602).

  Next, as shown in FIG. 15D, the spring material layer 104 is formed on the surface of the support substrate 900 through the peeling layer 901 by coating (FIG. 14: S603). Then, as shown in FIG. 15E, the spring material layer 104 is patterned by using a photolithography method, and the spring frame body portion 141, the central island portion 142, and the spring portion 143 are integrally formed (see FIG. 15E). 14: S604).

  Next, as shown in FIG. 15F, the spring material layer 104 with the vibration part 201B is immersed in NMP (N-methyl-pyrrolidone), so that the vibration layer 51 is peeled off from the support substrate 900. It forms (FIG. 14: S605).

  Thereafter, the lower base layer 16D and the upper base layer 16U are formed as shown in FIGS. 15G and 15H (FIG. 14: S606), and the electret material of the electrode 102 is charged as shown in FIG. 15I. Is charged (FIG. 14: S607), and the vibration layer 51, the lower base layer 16D, and the upper base layer 16U are bonded together (FIG. 14: S608), thereby forming the vibration power generation element 1 ′.

  Even with such a manufacturing method, the vibration power generation element can be formed at low cost. Furthermore, since the vibration part 201B is embedded in the spring material layer 104, the vibration power generation element can be further reduced in height.

  Next, a method for manufacturing a vibration power generation element according to the seventh embodiment will be described with reference to the drawings. FIG. 16 is a flowchart showing a method for manufacturing the vibration power generation element of this embodiment. FIG. 17 is a diagram schematically showing a manufacturing process of the vibration power generation element formed by the manufacturing flow shown in FIG. In the present embodiment, the vibration layer 51 ′ has a structure in which the Si frame body portion 111 is embedded in the spring frame body portion 141 with respect to the vibration layer 51 of the vibration power generation element of the sixth embodiment. The formation method involved in this is only different from the sixth embodiment, and the process of bonding the vibration layer 51 ′ to the lower base layer 16D and the upper base layer 16U is the same, so only the different manufacturing processes will be described. In FIG. 17, the through-hole 107, the wiring electrodes 106 and 606, and the routing electrode 108 are not shown.

First, as shown in FIG. 17A, a Si substrate 101 on which SiO ₂ having the same area as the outer peripheral area of the spring material layer 104 as a final form is prepared, and both main surfaces of the Si substrate 101 are prepared. A plurality of electrodes 102 are arranged in a substantially central region. A resist is formed on the Si substrate 101 having the electrodes 102 formed on both sides in this way, and a central region (corresponding to 101 in FIG. 10) to be the vibration part 201B ′ is formed by using a photolithography method, and an Si frame Etching is performed leaving the body part 111 and the bridge part 112 connecting them. As a result, as shown in FIG. 17B, a vibrating portion 201B ′ is formed, which includes the central region, the Si frame portion 111, and the bridge portion 112, and the electrodes 102 are arranged in the central region (FIG. 16). : S701).

  Next, as shown in FIG. 17C, the vibration part 201B ′ and the support substrate 900 are bonded via a release agent 901 (FIG. 6: S702).

  Next, as shown in FIG. 17D, the spring material layer 104 is formed by coating on the surface of the release layer 901, that is, the side to which the vibrating portion 201B 'of the support substrate 900 is bonded (FIG. 16: S703). At this time, the spring material layer 104 is set to a thickness that completely covers the vibration part 201 </ b> B ′ and a thickness that allows the spring part 143 as a final form to have a desired strength.

  Next, as shown in FIG. 17E, the spring material layer 104 is patterned to integrally form the spring frame portion 141, the central island portion 142, and the spring portion 143 (FIG. 16: S704).

  Next, as shown in FIG. 17F, a resist is applied to the surface of the Si substrate 101 opposite to the peeling layer 901, and only the bridge portion 112 is removed by etching using a photolithography method (FIG. 16). : S705). Thereby, the vibration layer 51 ′ with the release layer 901 and the support substrate 900 is formed.

  Thereafter, the support substrate 900 is peeled (FIG. 16: S706), the lower base layer 16D and the upper base layer 16U are formed (FIG. 16: S707), and the electret material of the electrode 102 is charged (FIG. 16: S708). Then, the vibration power generation element is formed by bonding the vibration layer 51 ′, the lower base layer 16D, and the upper base layer 16U (FIG. 16: S709).

  Even with such a manufacturing method, the vibration power generation element can be formed at low cost. Furthermore, by using this manufacturing method, the vibrating portion 201 is embedded in the spring material layer 104, so that the thickness of the vibrating layer 11 can be reduced. Furthermore, since the Si frame body portion 111 having higher hardness exists in the spring frame body portion 141, the mechanical strength as the vibration power generation element can be improved without deteriorating the characteristics. As a result, a vibration power generation element with a reduced height, high reliability, and a large amount of power generation can be easily formed at low cost.

  Next, a method for manufacturing a vibration power generation element according to the eighth embodiment will be described with reference to the drawings. FIG. 18 is a flowchart showing a method for manufacturing the vibration power generation element of this embodiment. FIG. 19 is a diagram schematically showing a manufacturing process of the vibration power generation element formed by the manufacturing flow shown in FIG. In the present embodiment, the vibration layer 51 ″ has a structure in which the vibration portion 201B is embedded in the central island portion 142 of the spring material layer with respect to the vibration layer 51 of the vibration power generation element of the sixth embodiment. Only the manufacturing method according to the structure is different from that of the seventh embodiment, and the process of bonding the vibration layer 51 ″ to the lower base layer 16D and the upper base layer 16U is the same. Therefore, only the different manufacturing processes will be described. In FIG. 19, the through hole 107, the wiring electrodes 106 and 606, and the routing electrode 108 are not shown.

  First, as shown in the sixth embodiment and FIGS. 19A and 19B, a vibrating portion 201B with upper and lower electrodes is formed (FIG. 18: S801).

  Next, a release layer 901 is formed on the surface of the support substrate 900, and a first spring material layer 104D is further applied (FIG. 18: S802). Then, as shown in FIG. 19C, the first main surface of the vibrating portion 201B (the lower surface in FIG. 19) is brought into contact with and bonded to the first spring material layer 104D (FIG. 18: S803). At this time, the vibration part 201B is arranged so that the electrode 102 is embedded in the first spring material layer 104D.

  Next, as shown in FIG. 19D, a second spring material layer 104U is formed on the surface of the first spring material layer 104D by coating (FIG. 18: S804). Then, as shown in FIG. 19E, the second spring material layer 104U is patterned using a photolithography method, and the spring frame portion 141, the central island portion 142, and the spring portion 143 are integrally formed. (FIG. 18: S805).

  Next, as shown in FIG. 19F, the first spring material layer 104D and the second spring material layer 104U with the vibration part 201B are immersed in NMP (N-methyl-pyrrolidone), thereby supporting the substrate 900. (FIG. 18: S806).

  Next, as shown in FIG. 19G, the first spring material layer 104D is patterned using a photolithography method to integrally form the spring frame portion 141, the central island portion 142, and the spring portion 143. (FIG. 18: S807). Accordingly, the spring frame body portion 141, the central island portion 142, and the spring portion 143 are integrally formed from the first spring material layer 104D and the second spring material layer 104U, and the vibration layer 51 ″ is formed.

  Thereafter, the lower base layer 16D and the upper base layer 16U are formed (FIG. 18: S808), the electret material of the electrode 102 is charged (FIG. 18: S809), the vibration layer 51 ″, the lower base layer 16D, and the upper base layer 16U are charged. The base layer 16U is bonded (FIG. 18: S810) to form the vibration power generation element.

  Even with such a manufacturing method, a vibration power generation element with a large amount of power generation can be formed at low cost. Furthermore, since the vibration part 201B is embedded in the spring material layer 104 from both main surface sides, the mechanical reliability of the spring material layer can be further improved.

1, 1'-vibration power generation element, 11, 11 ', 11 ", 51, 51'-vibration layer, 13-side wall member, 16-base layer, 16U-upper base layer, 16D-lower base layer, 17-cover Layer, 101, 601, 701-Si substrate, 102, 602, 602D, 602U-electrode, 103-recess, 104-spring member, 105-opening, 106,606-wiring electrode, 107,607-through hole, 108 -Leading electrode, 111-Si frame part, 112- Bridge part, 141-Spring frame part, 142-Central island part, 143-Spring part, 201, 201 ', 201B, 201B'-Vibrating part, 201D-Bottom Vibration part, 201U-upper vibration part, 800-resist, 900-support substrate, 901-peeling layer

Claims (11)

A method for manufacturing a vibration power generation element comprising a vibration layer in which a vibration electrode is formed and a base layer in which a fixed electrode is formed,
Forming the vibrating electrode on the surface of the insulating substrate to form a vibrating portion;
Disposing the vibration part on a spring material layer to form the vibration layer;
Forming the fixed electrode on the surface of the insulating substrate to form a base layer;
Bonding the vibration layer and the base layer so that the vibration electrode and the fixed electrode face each other. The step of forming the vibration layer includes:
Forming the spring material layer composed of a central island part to which the vibrating part is bonded, a frame part fixedly installed, and a spring part connecting the central island part and the frame part;
After the central island portion, the frame body portion, and the spring portion are formed, bonding the vibrating portion to the central island portion;
The manufacturing method of the vibration electric power generation element of Claim 1 which has these. The step of forming the vibration layer includes:
Disposing the vibrating part on a flat spring material layer;
A flat island spring material layer on which a vibrating portion is disposed, a central island portion on which the vibrating portion is disposed, a frame body portion that is fixedly installed, and a spring that connects the central island portion and the frame body portion Forming a part;
The manufacturing method of the vibration electric power generation element of Claim 1 which has these. The step of forming the vibration layer includes:
The method for manufacturing a vibration power generation element according to claim 3, wherein the vibration part is disposed so as to be at least partially embedded in the spring material layer. The step of forming the vibration layer includes:
The method for manufacturing a vibration power generation element according to claim 4, wherein the vibration part is arranged not only to be embedded in a central island part but also to be embedded in the frame body part. The step of forming the vibration layer includes:
Disposing on the spring material layer in a shape formed from the vibration part, an insulating substrate of the frame body part, and a bridge part connecting the vibration part and the insulating substrate of the frame body part;
After the step of forming the central island portion, the frame portion, and the spring portion, the step of removing the bridge portion;
The manufacturing method of the vibration electric power generation element of Claim 5 which has these. Adhering the vibrating portion to both opposing main surfaces of the central island portion of the spring material layer;
Bonding two base layers to the vibration layer so as to face each of the vibration parts bonded to the two main surfaces;
The manufacturing method of the vibration electric power generation element of Claim 1 or Claim 2 which has these. Forming the vibrating electrode on both principal surfaces of the insulating substrate;
Bonding two base layers to the vibrating layer so as to face the vibrating electrodes formed on both main surfaces of the insulating substrate;
The manufacturing method of the vibration electric power generation element in any one of Claim 1 or Claim 3-Claim 6 which has these. A photosensitive material is used for the spring material layer,
The method for manufacturing a vibration power generation element according to claim 1, wherein the step of forming the central island portion, the frame body portion, and the spring portion of the spring material layer uses a photolithography method.   The spring part of the spring material layer is formed in a shape having a point-folded fold with respect to the center in the extending direction of the spring part, and the tip of the folded part is formed in a rounded shape. A method for manufacturing a vibration power generation element according to any one of claims 9 (the spring part is from claim 2, so the dependency relationship is set to claims 2). A vibration power generation element comprising a vibration layer in which a vibration electrode is formed and a base layer in which a fixed electrode is formed,
A vibrating portion in which the vibrating electrode is formed on an insulating substrate surface;
The vibration made of a photosensitive material, wherein the vibration portion is disposed on the central island portion of a spring material layer including a central island portion, a frame body portion, and a spring portion connecting the central island portion and the frame body portion. Layers,
The fixed electrode is formed on the surface of the insulating substrate, and the fixed electrode is disposed so as to face the vibrating electrode.
A vibration power generation element comprising:

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