JP2011023404A - Optical system, exposure apparatus, and method of manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical system capable of reducing effort for the assembly and maintenance and shortening the period of time therefor, to provide an exposure apparatus, and to provide a method of manufacturing the device. <P>SOLUTION: A projection optical system 14 constituting the exposure apparatus includes: a support member 17 extending along a Z-axial direction; and a plurality of optical units 21 to 25 each having an annular lens barrel divided member 26, 29, and a biconvex lens 28 or plano-concave lens 30 arranged in the lens barrel divided member 26, 29, and stacked along the Z-axial direction. Then the respective optical units 21 to 25 are supported being individually attached to the support member 17 detachably along a Y-axial direction orthogonal to the Z-axial direction. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical system including a plurality of optical members such as lenses, an exposure apparatus including the optical system, and a device manufacturing method using the exposure apparatus.

  Generally, in a lithography process for manufacturing a microdevice such as a semiconductor integrated circuit, an exposure apparatus for forming a predetermined pattern (circuit pattern or the like) on a substrate such as a wafer or a glass plate coated with a photosensitive material is used. It is done. A projection optical system mounted on such an exposure apparatus includes a lens barrel and a plurality of optical members (lenses and the like) accommodated in the lens barrel, and the lens barrel includes a plurality of mirrors having a substantially annular shape. In this configuration, the tube dividing members are arranged along the optical axis direction of the projection optical system.

  When manufacturing such a projection optical system, as a first step, at least one optical member is accommodated in each lens barrel dividing member. Subsequently, as a second step, the lens barrel dividing members are arranged along the optical axis direction. At this time, the lens barrel dividing members adjacent to each other in the optical axis direction are fixed to each other by a plurality of bolts or the like. Thereafter, in the third step, the projection optical system is mounted on the exposure apparatus, and various inspections such as aberrations of the projection optical system are performed.

  By the way, in the inspection of the projection optical system in the third step, the aberration of the projection optical system may exceed the allowable range. In this case, the projection optical system is once disassembled, and at least a part of the optical members among the optical members is taken out from the lens barrel, and the taken out optical members are exchanged or polished. Thereafter, the assembly of the projection optical system is performed again in the order of the above steps. For this reason, in the conventional projection optical system, the assembly and disassembly of the projection optical system may be performed a plurality of times depending on the inspection result at the time of manufacture, which may require much labor and time. Also, when replacing or cleaning some optical members during the maintenance of the projection optical system, it is necessary to disassemble the projection optical system once, and much labor and time are required during the maintenance of the projection optical system. Sometimes this happened. As projection optical systems capable of solving such problems, for example, projection optical systems described in Patent Documents 1 to 4 have been proposed.

  That is, one optical member (hereinafter referred to as “predetermined optical member”) among a plurality of optical members arranged along the optical axis direction is taken out of the lens barrel in the projection optical system. An opening is formed. Further, the projection optical system is provided with a moving mechanism for moving the predetermined optical member forward and backward between two positions, that is, an installation position in the lens barrel and a retracted position outside the lens barrel through the opening.

JP 2006-245085 A Special Table 2007-515797 Special table 2008-526004 gazette JP 2007-208257 A

  By the way, in the projection optical system, it is not necessary to disassemble the lens barrel when the predetermined optical member is taken out of the lens barrel. However, when taking out other optical members other than the predetermined optical member out of the lens barrel, it is also necessary to disassemble the lens barrel. For this reason, there are cases in which it is not possible to reduce the labor or the time during assembly and maintenance of the projection optical system.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide an optical system, an exposure apparatus, and a device manufacturing method capable of reducing labor and time during assembly and maintenance. It is to provide.

In order to solve the above-described problems, the present invention employs the following configuration corresponding to FIGS. 1 to 7 shown in the embodiment.
The optical system of the present invention includes a support member (17) extending along a first direction (Z-axis direction), an annular barrel dividing member (26, 29), and the barrel dividing member (26, 29). A plurality of optical units (21-25) having optical members (28, 30) disposed therein and disposed along the first direction. 25) is supported by the support member (17) in a detachable state along a second direction (Y-axis direction) intersecting the first direction (Z-axis direction). It is a summary.

  According to the said structure, since the some optical unit (21-25) is each supported in the state which can be attached or detached separately with respect to a support member (17), which is among each optical unit (21-25). Even when removing from the support member (17), it is not necessary to disassemble the optical system (14). That is, only the necessary optical unit among the optical units (21 to 25) can be individually attached to and detached from the support member (17) without disassembling the optical system (14). Therefore, it is possible to reduce labor and time during assembly and maintenance of the optical system (14).

  In addition, in order to explain this invention clearly, it demonstrated corresponding to the code | symbol of drawing which shows embodiment, but it cannot be overemphasized that this invention is not limited to embodiment.

  According to the present invention, labor and time during assembly and maintenance can be reduced.

1 is a schematic block diagram of an exposure apparatus in an embodiment. FIG. 2 is a schematic sectional view of a projection optical system of the exposure apparatus. FIG. 3 is a plan sectional view of the projection optical system. Sectional drawing of the optical unit of the projection optical system. Explanatory drawing which shows the positional relationship of the biconvex lens and the plano-concave lens in the optical unit of the projection optical system. The flowchart of the manufacture example of a device. The detailed flowchart regarding the board | substrate process in the case of a semiconductor device.

  Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS. In the present embodiment, the direction parallel to the optical axis of the projection optical system is the Z-axis direction, and the scanning direction of the reticle R and the wafer W during scanning exposure in a plane perpendicular to the Z-axis direction is the X-axis direction. The non-scanning direction orthogonal to the scanning direction will be described as the Y-axis direction. The rotation directions around the X, Y, and Z axes are also referred to as the θx direction, the θy direction, and the θz direction.

  As shown in FIG. 1, an exposure apparatus 11 according to this embodiment uses exposure light EL emitted from a light source device (not shown) to illuminate a reticle R as a mask on which a predetermined circuit pattern is formed. It is an apparatus for projecting an image of a circuit pattern to be formed on a wafer W coated with a photosensitive material such as a resist. Such an exposure apparatus 11 irradiates the wafer W with the illumination light EL 12 that illuminates the reticle R with the exposure light EL from the light source device, the reticle stage 13 that holds the reticle R, and the exposure light EL that passes through the reticle R. And a wafer stage 15 that holds the wafer W. As the light source device of the present embodiment, a light source that outputs ArF excimer laser light (wavelength 193 nm) as exposure light EL is used.

  The illumination optical system 12 includes an optical integrator (not shown) such as a fly-eye lens and a rod lens, various lens systems such as a relay lens and a condenser lens, and an aperture stop (not shown). Then, the exposure light EL emitted from the light source device (not shown) passes through the illumination optical system 12, so that the reticle R has a uniform light intensity distribution (also referred to as light luminance distribution) and has a Y axis. A substantially rectangular illumination region extending in a direction (a direction orthogonal to the paper surface in FIG. 1) is formed.

  The reticle stage 13 is arranged between the illumination optical system 12 and the projection optical system 14 so that the mounting surface 16 of the reticle R is substantially orthogonal to the optical path. That is, the reticle stage 13 is arranged on the object plane side (+ Z direction side, upper side in FIG. 1) of the projection optical system 14. Further, the reticle stage 13 is provided with a reticle holding unit (not shown) for holding the reticle R (for example, a vacuum chuck (not shown) for vacuum-sucking the reticle R). Such a reticle stage 13 is movable in the X-axis direction (left-right direction in FIG. 1) by driving a reticle stage drive unit (not shown). In other words, the reticle stage drive unit moves the reticle R held by the reticle holding unit in the X-axis direction with a predetermined stroke. In addition, the reticle stage drive unit can move the reticle R in the Y-axis direction and the θz direction as well.

  In the wafer stage 15, on the image plane side of the projection optical system 14 (on the −Z direction side and the lower side in FIG. 1), the mounting surface on which the wafer W is mounted is substantially orthogonal to the optical path of the exposure light EL. Are arranged as follows. The wafer stage 15 includes a wafer holder (not shown) for holding the wafer W (for example, a vacuum chuck (not shown) for vacuum-sucking the wafer W), a wafer holder (not shown) for holding the wafer holder, A Z leveling mechanism (not shown) for adjusting the position of the wafer holder in the Z-axis direction and the inclination angles around the X-axis and the Y-axis is incorporated. Such a wafer stage 15 can be moved in the X-axis direction by a wafer stage drive unit (not shown). That is, the wafer stage drive unit moves the wafer W held by the wafer holding unit in the X-axis direction with a predetermined stroke. The wafer stage driving unit is configured to be able to move the wafer W held by the wafer holding unit also in the Y-axis direction and the Z-axis direction.

  When the circuit pattern of the reticle R is formed on one shot area of the wafer W, the reticle R is moved in the X-axis direction by driving the reticle stage driving unit in a state where the illumination optical system 12 forms the illumination area on the reticle R. The projection optical system 14 is moved with respect to the movement of the reticle R along the X-axis direction by moving the wafer stage drive unit (for example, from the + X direction side to the −X direction side) for every predetermined stroke. It is moved in synchronization with the X-axis direction (for example, from the −X direction side to the + X direction side) at a speed ratio corresponding to the reduction magnification. When the formation of the circuit pattern in one shot area is completed, the circuit pattern is continuously formed in the other shot areas of the wafer W.

  As shown in FIGS. 2 and 3, the projection optical system 14 is an optical system that reduces an image of a circuit pattern formed by illuminating the reticle R with exposure light EL to a predetermined reduction magnification (for example, 1/4 times). A support member 17 that is a system and has a substantially U-shaped cross-sectional view extending along the Z-axis direction, which is the first direction, is provided. The support member 17 includes two side walls that face each other in the X-axis direction, and one side wall that connects the ends on the −Y-axis direction side of the both side walls. Accordingly, the support member 17 has a box shape in which both sides in the Z-axis direction and the Y-axis direction side are opened. A rectangular plate-shaped lid member 18 is detachably attached to the support member 17 with a bolt (not shown) so as to cover the opening 17a on the Y-axis direction side of the support member 17.

  The inside of the support member 17 is a housing portion 19 that is U-shaped in plan view, and the housing portion 19 includes a plurality (five in this embodiment) of disk-shaped optical units 21 to 25 (see FIG. 4) Are stacked in the Z-axis direction so as to be 21, 22, 23, 24, 25 in order from the object plane side (upper side in FIG. 2). Each of the optical units 21 to 23 and 25 includes an annular lens barrel dividing member 26 and a biconvex lens 28 which is a kind of optical member supported in the lens barrel dividing member 26 via a support mechanism 27. ing.

  On the other hand, the optical unit 24 includes an annular lens barrel dividing member 29, a biconvex lens 28 supported in the lens barrel dividing member 29 via a support mechanism 27, and the biconvex lens in the lens barrel dividing member 29. And a plano-concave lens 30 which is a kind of an optical member which is disposed to face the image plane side (lower side in FIG. 2) 28 and is supported in the lens barrel dividing member 29 via a support mechanism 27. Yes. Each support mechanism 27 is configured to be able to displace the biconvex lens 28 and the plano-concave lens 30 that are individually supported in a plurality of directions. A detailed configuration of the support mechanism 27 is disclosed in, for example, Japanese Patent Application Laid-Open No. 2007-201342.

  Since the lens barrel dividing member 29 is accommodated in a state where the biconvex lens 28 and the plano-concave lens 30 face each other, the thickness in the Z-axis direction is larger than that of the lens barrel dividing member 26 in which the biconvex lens 28 is accommodated. It is thick. In the lens barrel dividing member 29, the plano-concave lens 30 has a concave surface 30a facing the convex surface 28a on the image surface side of the biconvex lens 28, and the concave surface 30a and the convex surface 28a are curved surfaces corresponding to each other.

  As shown in FIG. 5, in the lens barrel dividing member 29, the distance A between the peripheral portion and the central portion of the convex surface 28a of the biconvex lens 28 in the Z-axis direction is the peripheral portion of the convex surface 28a of the biconvex lens 28 in the Z-axis direction. And the distance B from the peripheral edge of the concave surface 30a of the plano-concave lens 30 is set to be larger. That is, the biconvex lens 28 and the plano-concave lens 30 are respectively disposed in the lens barrel dividing member 29 so that the distance A is larger than the distance B. In the present embodiment, a lens barrel is constituted by the four lens barrel dividing members 26 and one lens barrel dividing member 29, and the barrel is filled with a purge gas such as nitrogen gas. In addition, an aperture stop (not shown) is provided at a position that is optically Fourier-transformed with the wafer W in the lens barrel.

  As shown in FIGS. 2 and 3, a ridge 31 is provided over the entire circumference in the center in the Z-axis direction on the outer circumferential surface of each of the lens barrel dividing members 26 and 29. In addition, a groove 32 into which each protrusion 31 can be inserted is formed at a position corresponding to the protrusion 31 of each of the lens barrel dividing members 26 and 29 on the inner peripheral surface of the support member 17. Further, in the lid member 18, a concave groove (not shown) that can accommodate a part of the ridge 31 is formed at each position corresponding to the ridge 31 of each of the lens barrel dividing members 26 and 29. And when accommodating each optical unit 21-25 in the accommodating part 19 of the supporting member 17 from the opening part 17a by the side of a Y-axis, respectively, the supporting member 17 corresponding to the protruding item | line 31 of each lens-barrel division | segmentation member 26 and 29 is supported. By sliding the optical units 21 to 25 after being inserted into the concave grooves 32, the optical units 21 to 25 are respectively set at the set positions where the optical units 21 to 25 are in contact with the side wall on the −Y axis direction side of the support member 17. It has come to be guided.

  Screw holes 33 are respectively formed at positions corresponding to the optical units 21 to 25 on both side walls in the X-axis direction and side walls on the −Y-axis direction side that constitute the support member 17. Bolts 34 are screwed into the holes 33 from the outside of the support member 17. Each bolt 34 can press each optical unit 21-25 in the set position, and by adjusting the screwing amount of each bolt 34, the position of each optical unit 21-25 in the set position can be adjusted. Fine adjustment is possible.

Next, the operation when the projection optical system 14 is assembled will be described.
When assembling the projection optical system 14, first, a part of the ridge 31 of the optical unit 21 is inserted into the corresponding groove 32 in the housing portion 19 of the support member 17 from the opening 17 a on the Y-axis direction side. . Then, the optical unit 21 is slid into the accommodating portion 19 along the −Y axis direction so that the inserted ridge 31 slides in the concave groove 32, and the optical unit 21 is guided to the set position. . Similarly, the optical units 22 to 25 are sequentially set at the set position in the accommodating portion 19.

  Subsequently, the screwing amount of each bolt 34 corresponding to each optical unit 21 to 25 is adjusted to finely adjust the position of each optical unit 21 to 25 in the set position. Subsequently, the exposure apparatus 11 is operated, a test pattern is formed on the wafer W, and a test for confirming the state of the projection optical system 14 is performed. If this test result is good, the lid member 18 is not shown on the support member 17 in a state where the lid member 18 is disposed at the restricting position that covers the opening 17a on the Y-axis direction side of the support member 17. Secure with bolts. Then, the lid member 18 restricts the optical units 21 to 25 from being detached from the opening 17a on the Y-axis direction side of the support member 17 in the Y-axis direction (second direction), and the projection optical system 14 is assembled. The work is complete.

  On the other hand, if the result of the test for confirming the state of the projection optical system 14 is poor, the problem of the test pattern formed on the wafer W from the biconvex lens 28 and the plano-concave lens 30 in the projection optical system 14 is Identify a lens. Only the optical units 22 to 25 having the specified lens are pulled out from the support member 17. At this time, the optical unit drawn out from the support member 17 does not come into contact with other optical units adjacent in the Z-axis direction. The optical unit pulled out in this way is returned to the support member 17 again after performing maintenance such as cleaning, polishing, or replacement of the problematic lens.

  Then, the same test as described above is performed again. If the test result is good, the lid member 18 is attached to the support member 17 with a bolt (not shown) so as to cover the opening 17a on the Y-axis direction side of the support member 17. Fix it. On the other hand, if the test result is poor, the lens is again maintained, and the lens maintenance and test are repeated until the test result is good. The lens maintenance as described above is performed not only when the projection optical system 14 is assembled, but also when the projection optical system 14 is maintained.

Therefore, in this embodiment, the following effects can be obtained.
(1) Since each of the optical units 21 to 25 is individually supported with respect to the support member 17, the projection optical system can be used even when any of the optical units 21 to 25 is removed from the support member 17. 14 need not be disassembled. That is, only the necessary optical units among the optical units 21 to 25 can be individually attached to and detached from the support member 17 without disassembling the projection optical system 14. Accordingly, it is possible to reduce labor and time during assembly of the projection optical system 14 and maintenance.

  (2) In the optical unit 24, the biconvex lens 28 and the plano-concave lens 30 are arranged adjacent to each other in the Z-axis direction, the convex surface 28a of the biconvex lens 28 faces the concave surface 30a of the plano-concave lens 30, and further in the Z-axis direction. The distance A between the peripheral portion of the convex surface 28a and the central portion is larger than the distance B between the peripheral portion of the convex surface 28a and the peripheral portion of the concave surface 30a.

  Therefore, for example, when the biconvex lens 28 and the plano-concave lens 30 are accommodated in separate lens barrel dividing members 26 to form separate optical units, these optical units are individually slid in the Y-axis direction. However, since the distance A is larger than the distance B, there is a problem that the biconvex lens 28 and the plano-concave lens 30 collide with each other.

  In this regard, in this embodiment, since both the biconvex lens 28 and the plano-concave lens 30 are accommodated in the lens barrel dividing member 29, the biconvex lens 28 and the plano-concave lens 30 collide when the optical unit 24 is attached to and detached from the support member 17. There is nothing.

  (3) The optical units 21 to 25 each have a ridge 31 and the support member 17 has a groove 32 corresponding to each ridge 31. Therefore, when the optical units 21 to 25 are attached to and detached from the support member 17, the optical units 21 to 25 are stabilized by sliding the convex lines 31 along the concave grooves 32. Smooth sliding movement is possible. That is, the optical unit can be attached to and detached from the support member 17 without making contact with another optical unit. Therefore, it is possible to prevent the lens barrel dividing members 26 and 29 and the lenses 28 and 30 from being damaged when the optical unit is attached and detached.

  (4) At least one of the biconvex lens 28 and the plano-concave lens 30 is supported in the lens barrel dividing members 26 and 29 via a support mechanism 27, and each support mechanism 27 is supported by each of the both. The convex lens 28 and the plano-concave lens 30 can be displaced in a plurality of directions. For this reason, the angle of each biconvex lens 28 and the plano-concave lens 30 can be easily changed. Therefore, the aberration of the projection optical system 14 can be easily finely adjusted.

  (5) Since the cover member 18 is configured to be fixed to the support member 17 so as to cover the opening 17a on the Y-axis direction side of the support member 17, it is accommodated in the accommodation portion 19 of the support member 17. Further, the lid member 18 can regulate the separation of the optical units 21 to 25 from the opening 17a on the Y axis direction side of the support member 17 in the Y axis direction.

In addition, you may change the said embodiment as follows.
A plurality of biconvex lenses 28 or plano-concave lenses 30 may be arranged in two or more optical units among the optical units 21 to 25 along the Z-axis direction. In this way, the number of optical units constituting the projection optical system 14 can be reduced, and consequently the number of parts of the projection optical system 14 can be reduced.

In the optical unit 24, one of the biconvex lens 28 and the plano-concave lens 30 may be omitted.
In the lens barrel dividing member 29, the distance A between the peripheral portion and the central portion of the convex surface 28a of the biconvex lens 28 in the Z-axis direction is equal to the peripheral portion of the convex surface 28a of the biconvex lens 28 and the concave surface of the plano-concave lens 30 in the Z-axis direction. You may set so that it may become the same as the distance B with the peripheral part of 30a.

  The lid member 18 is attached to the support member 17 via a hinge, so that the lid member 18 rotates between a restriction position that covers the opening 17a on the Y-axis direction side of the support member 17 and a non-regulation position that does not cover the opening 17a. You may comprise so that dynamic displacement is possible.

In the projection optical system 14, the lid member 18 may be omitted.
In the projection optical system 14, each bolt 34 may be omitted.
-You may replace each convex strip 31 of each optical unit 21-25, and each concave groove 32 of the supporting member 17, respectively. That is, the ridges 31 may be changed to the grooves 32 in the optical units 21 to 25, and the grooves 32 may be changed to the ridges 31 in the support member 17.

-Each ridge 31 of each optical unit 21-25 may be provided intermittently.
In the projection optical system 14, the number of optical units may be arbitrarily changed.
In the projection optical system 14, the direction in which the optical units 21 to 25 are stacked and the direction in which the optical units 21 to 25 are attached to and detached from the support member 17 are not necessarily orthogonal to each other as long as they intersect. Absent.

The projection optical system 14 may be embodied as a projection optical system including a reflective optical member.
The configuration of the projection optical system 14 of the present embodiment may be applied to the illumination optical system 12.
In the embodiment, the exposure apparatus 11 may be embodied as a maskless exposure apparatus using a variable pattern generator (for example, DMD (Digital Mirror Device or Digital Micro-mirror Device)). Such a maskless exposure apparatus is disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-304135, International Patent Publication No. 2006/080285, and US Patent Publication No. 2007/0296936 corresponding thereto.

  In the embodiment, the exposure apparatus 11 is for manufacturing a reticle or mask used not only in a micro device such as a semiconductor element but also in an optical exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, and an electron beam exposure apparatus. In addition, an exposure apparatus that transfers a circuit pattern from a mother reticle to a glass substrate, a silicon wafer, or the like may be used. The exposure apparatus 11 is used for manufacturing a display including a liquid crystal display element (LCD) and the like, and is used for manufacturing an exposure apparatus that transfers a device pattern onto a glass plate, a thin film magnetic head, and the like. It may be an exposure apparatus that transfers to a wafer or the like, and an exposure apparatus that is used to manufacture an image sensor such as a CCD.

  In addition, the illumination optical system 12 of the above embodiment is mounted on a scanning stepper that transfers the pattern of the reticle R to the wafer W in a state where the reticle R and the wafer W are relatively moved, and sequentially moves the wafer W stepwise. Also good.

In the embodiment, the exposure light source is, for example, g-line (436 nm), i-line (365 nm), KrF excimer laser (248 nm), F ₂ laser (157 nm), Kr ₂ laser (146 nm), Ar ₂ laser (126 nm), etc. May be a light source capable of supplying Further, the exposure light source amplifies a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser with a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium), It may be a light source that can supply a harmonic converted into ultraviolet light using a nonlinear optical crystal.

  In the embodiment, a method of filling the optical path between the projection optical system and the photosensitive substrate with a medium (typically liquid) having a refractive index larger than 1.1, that is, a so-called immersion method may be applied. Good. In this case, as a method of filling the liquid in the optical path between the projection optical system and the photosensitive substrate, a method of locally filling the liquid as disclosed in International Publication No. WO99 / 49504, A method of moving a stage holding a substrate to be exposed as disclosed in Japanese Patent Application Laid-Open No. 6-124873 in a liquid bath, or a predetermined depth on a stage as disclosed in Japanese Patent Application Laid-Open No. 10-303114. A technique of forming a liquid tank and holding the substrate in the liquid tank can be employed.

  In the embodiment, the polarization illumination method disclosed in US Patent Publication No. 2006/0203214, US Patent Publication No. 2006/0170901, and US Patent Publication No. 2007/0146676 may be applied.

  Next, an embodiment of a microdevice manufacturing method using the device manufacturing method by the exposure apparatus 11 of the embodiment of the present invention in the lithography process will be described. FIG. 6 is a flowchart showing a manufacturing example of a micro device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micro machine, or the like).

  First, in step S101 (design step), function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and pattern design for realizing the function is performed. Subsequently, in step S102 (mask manufacturing step), a mask (reticle R or the like) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S103 (substrate manufacturing step), a substrate (a wafer W when a silicon material is used) is manufactured using a material such as silicon, glass, or ceramics.

  Next, in step S104 (substrate processing step), using the mask and substrate prepared in steps S101 to S104, an actual circuit or the like is formed on the substrate by lithography or the like, as will be described later. Next, in step S105 (device assembly step), device assembly is performed using the substrate processed in step S104. Step S105 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S106 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S105 are performed. After these steps, the microdevice is completed and shipped.

FIG. 7 is a diagram illustrating an example of a detailed process of step S104 in the case of a semiconductor device.
In step S111 (oxidation step), the surface of the substrate is oxidized. In step S112 (CVD step), an insulating film is formed on the substrate surface. In step S113 (electrode formation step), an electrode is formed on the substrate by vapor deposition. In step S114 (ion implantation step), ions are implanted into the substrate. Each of the above steps S111 to S114 constitutes a pretreatment process at each stage of the substrate processing, and is selected and executed according to a necessary process at each stage.

  When the above-mentioned pretreatment process is completed in each stage of the substrate process, the posttreatment process is executed as follows. In this post-processing process, first, in step S115 (resist formation step), a photosensitive material is applied to the substrate. Subsequently, in step S116 (exposure step), the circuit pattern of the mask is transferred to the substrate by the lithography system (exposure apparatus 11) described above. Next, in step S117 (development step), the substrate exposed in step S116 is developed to form a mask layer made of a circuit pattern on the surface of the substrate. Subsequently, in step S118 (etching step), the exposed member in a portion other than the portion where the resist remains is removed by etching. In step S119 (resist removal step), the photosensitive material that has become unnecessary after the etching is removed. That is, in step S118 and step S119, the surface of the substrate is processed through the mask layer. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the substrate.

  DESCRIPTION OF SYMBOLS 11 ... Exposure apparatus, 12 ... Illumination optical system, 14 ... Projection optical system, 17 ... Supporting member, 18 ... Lid member as regulation member, 21-25 ... Optical unit, 26, 29 ... Lens-barrel division member, 27 ... Displacement A support mechanism as a mechanism, 28 ... a biconvex lens as an optical member, 28a ... a convex surface as a second opposing surface, 30 ... a plano-concave lens as an optical member, 30a ... a concave surface as a first opposing surface, 31 ... a guide portion Ridges 32, concave grooves constituting guide portions, EL exposure light, W wafer as substrate.

Claims (9)

A support member extending along a first direction;
An annular lens barrel dividing member and an optical member arranged in the lens barrel dividing member, and a plurality of optical units arranged along the first direction,
The optical system, wherein the plurality of optical units are respectively supported in a state in which the plurality of optical units can be individually attached and detached along a second direction intersecting the first direction. 2. The optical system according to claim 1, wherein a plurality of the optical members are arranged along a first direction in at least one of the plurality of optical units. In the at least one optical unit, of the two optical members adjacent to each other in the first direction, a first facing surface facing the other optical member in one optical member is a concave surface, and in the other optical member The optical system according to claim 2, wherein the second facing surface facing the one optical member is a convex surface. The distance between the one optical member and the other optical member in the first direction between the peripheral portion of the second opposing surface and the central portion of the second opposing surface is the same as that of the peripheral portion of the second opposing surface. 4. The optical system according to claim 3, wherein the optical systems are arranged so as to be equal to or more than a distance in a first direction with respect to a peripheral portion of one opposing surface. 2. The apparatus according to claim 1, further comprising a plurality of guide portions provided for each of the optical units and configured to move the lens barrel dividing member along the second direction with respect to the support member. 5. The optical system according to any one of items 4. The optical system according to any one of claims 1 to 5, further comprising a displacement mechanism that displaces the optical member when the plurality of optical units are supported by the support member. . And a regulating member that regulates the detachment of the plurality of optical units from the supporting member in the second direction when the supporting member is disposed at a regulating position on the second direction side. The optical system according to any one of claims 1 to 6. An illumination optical system for illuminating a predetermined pattern with light;
A projection optical system for irradiating a substrate coated with a photosensitive material with light through the predetermined pattern, and
8. An exposure apparatus, wherein at least one of the illumination optical system and the projection optical system is the optical system according to any one of claims 1 to 7. An exposure step of exposing a surface of the substrate with a pattern image based on the predetermined pattern using the exposure apparatus according to claim 8;
After the exposure step, the development step of developing the substrate to form a mask layer having a shape corresponding to the pattern image on the surface of the substrate;
And a processing step of processing the surface of the substrate through the mask layer after the developing step.

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