JP2011022068A - Scintillator panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a scintillator panel where deformation of sealing parts is not easily caused due to handling during the handling period of attaching a scintillator panel to a photoelectric conversion panel as well as shock during the transportation period, while deteriorating rate of sharpness and incidence rate of specific failure in a humidity test are both low, and climbing and peeling of sealing parts are avoided during the handling period. <P>SOLUTION: In scintillator panels which includes a substrate and a scintillator layer prepared on the substrate, the scintillator panel is characterized by protecting a selvage part with a protective member whose X-ray absorption rate is 5% or below and thickness thereof is 10 to 1,000 μm, such that the substrate concerned and the scintillator layer concerned are sealed by a first protective film arranged at the scintillator layer side and a second protective film arranged at the substrate side, and a circumference of the scintillator panel consists of the selvage part concerned formed from the protective film. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a scintillator panel used when a radiographic image of a subject is formed.

  Conventionally, radiographic images such as X-ray images are widely used for diagnosis of medical conditions in medical practice. Radiation images using intensifying screens and film systems, in particular, have been developed around the world as imaging systems that combine high reliability and excellent cost performance as a result of high sensitivity and high image quality achieved over a long history. Used in medical settings. However, these pieces of image information are so-called analog image information, and free image processing and instantaneous electric transmission such as digital image information that has been developing in recent years cannot be performed.

  In recent years, digital radiological image detection apparatuses represented by computed radiography (CR), flat panel type radiation detectors (FPD), and the like have appeared. In these, since a digital radiographic image is directly obtained and an image can be directly displayed on an image display device such as a cathode tube or a liquid crystal panel, image formation on a photographic film is not necessarily required. As a result, these digital X-ray image detection devices reduce the need for image formation by the silver halide photography method, and greatly improve the convenience of diagnosis work in hospitals and clinics.

  Computed radiography (CR) is currently accepted in medical practice as one of the digital technologies for X-ray images. However, the sharpness is insufficient and the spatial resolution is insufficient, and the image quality level of the screen / film system has not been reached.

  Further, as a new digital X-ray imaging technique, for example, Physics Today, November 1997, page 24, John Laurans' paper “Amorphous Semiconductor User in Digital X-ray Imaging”, SPIE 1997, Vol. 32, p. A flat panel X-ray detector using a thin film transistor (TFT) developed by a thin film transistor (TFT) described in the paper “Development of a High Resolution, Active Matrix, Flat-Panel Imager with Enhanced Fill Factor” ing.

  In order to convert radiation into visible light, a scintillator panel made of an X-ray phosphor having a characteristic of emitting light by radiation is used. In order to improve the S / N ratio in low-dose imaging, luminous efficiency is used. It is necessary to use a high scintillator panel. In general, the light emission efficiency of a scintillator panel is determined by the thickness of the scintillator layer (also referred to as “phosphor layer”) and the X-ray absorption coefficient of the phosphor, but the greater the thickness of the scintillator layer, Scattering of the emitted light occurs at, and sharpness decreases. Therefore, when the sharpness necessary for the image quality is determined, the film thickness is determined.

  On the other hand, cesium iodide (CsI) has a relatively high rate of change from X-rays to visible light, and phosphors can be easily formed into a columnar crystal structure by vapor deposition. Therefore, it was possible to increase the thickness of the scintillator layer.

  However, since CsI alone has low light emission efficiency, a mixture of CsI and sodium iodide (NaI) at an arbitrary molar ratio is vapor-deposited, for example, as described in Japanese Patent Publication No. 54-3560. Deposited as sodium-activated cesium iodide (CsI: Na) on the substrate, and recently, a mixture of CsI and thallium iodide (TlI) in an arbitrary molar ratio is vapor-deposited to deposit thallium-activated cesium iodide (CsI: Visible conversion efficiency is improved by performing annealing (heat treatment) as a post-process on the material deposited as Tl) and used as an X-ray phosphor.

  In recent years, in order to improve sharpness and image uniformity by combining these scintillator layers and a planar light receiving element, a method of forming a scintillator by vapor deposition directly on the planar light receiving element surface (on the imaging element) has been performed. .

  However, although the scintillator material deposited directly on the planar light receiving element has high image characteristics, the cost characteristic of wasting the expensive light receiving element when a defective product is deposited and the image characteristics of the scintillator material can be improved by heat treatment. However, the processing temperature is limited because the light receiving element is vulnerable to heat. In addition, there is a problem that it is necessary to incorporate cooling of the light receiving element in the heat treatment process. On the other hand, in the case of an indirect type in which a scintillator plate formed by vapor-depositing a scintillator layer on a substrate is combined with a planar light receiving element, there is an advantage that the disadvantages of the direct vapor-deposited scintillator material (direct type) are improved.

  However, even in an indirect scintillator, the scintillator layer based on cesium iodide (CsI) has a deliquescent property, and thus has a drawback that the characteristics deteriorate over time.

  That is, cesium iodide (CsI) is highly hygroscopic and will deliquesce by absorbing water vapor in the air if left exposed. The main object of the present invention is to prevent this.

  In order to prevent such moisture absorption, it is effective to form a moisture-proof protective layer on the surface of the scintillator plate containing cesium iodide (CsI). A form in which the scintillator plate is protected by a moisture-proof protective layer is called a scintillator panel.

  When using a protective film as the moisture-proof protective layer, the scintillator plate is excellently covered and sealed with a first protective film disposed on the scintillator layer side and a second protective film disposed on the substrate side. Yes. In order to make the sealing more complete and to improve the moisture resistance of the scintillator panel, the outer peripheral edges of the first protective film and the second protective film extend to the outside of the scintillator plate and are bonded to each other. It is preferable.

  In order to more reliably prevent moisture from entering a scintillator plate in which a scintillator layer is provided on a substrate cut into a predetermined size, the peripheral edges of the first protective film and the second protective film of the scintillator panel Is outside the periphery of the sheet-like scintillator plate and has a sealing structure in which it is bonded to the outside of the periphery of the scintillator layer by fusion or adhesive, thereby preventing moisture from entering from the outside. A portion that is outside the outer edge of the scintillator panel and is made of a protective film is called an ear portion.

  In order to realize the sealing structure, the uppermost layer resin on the surface in contact with the scintillator layer of the first protective film has a heat-fusible property, so that the upper and lower sides are in the region outside the peripheral portion of the scintillator layer. The moisture-proof protective film can be fused, and the sealing work is made efficient.

  The scintillator panel is assembled into the photoelectric conversion panel so that the first protective film of the scintillator panel thus produced and the light receiving surface of the photoelectric conversion panel (panel incorporating the flat light receiving element) are in contact with each other. Make a detector.

  However, fine peeling may occur on the bonded ears due to handling when transporting such a scintillator panel to a photoelectric conversion panel or impact during transportation. When the ear part (welded part) is peeled off, the sealing performance is deteriorated. As a result, the scintillator layer is deliquescent and causes characteristic deterioration.

  Patent Document 1 describes that the surface of the scintillator plate is covered with a protective film laminated with an ultraviolet curable resin layer to prevent image defects due to scratches on the surface of the protective film. However, when the ultraviolet curable resin is provided on the entire surface with such a thickness that provides a sufficient protective function, the distance between the scintillator and the planar light receiving element is increased, and the sharpness of the image is deteriorated. Further, if the thickness of the UV curable resin layer is such that the sharpness of the image does not become a problem, it is not possible to prevent fine peeling from occurring at the sealing portion of the ear portion.

  In Patent Document 2, the metal tape covering the ear part, which is a sealing part of the first protective film and the second protective film, is bent 180 degrees at the end part of the ear part, and from the front of the ear part It describes improving moisture resistance by bonding across the back. However, the width of the ear portion is narrow, and it is difficult to bond the metal tape only to the ear portion. The metal tape not only stays at the ears but sticks out to the inside and adheres, and the metal tape absorbs X-rays, so that the shadow of the metal tape is recognized. Moreover, although the moisture resistance was improved by the method of bending and bonding the metal tape 180 degrees at the end portion of the ear portion, a higher constitution was required.

JP-A-11-258398 JP 2009-27776 A

  The problem to be solved by the present invention is that the sealing portion is not easily deformed due to handling during transportation or mounting when the scintillator panel is attached to the photoelectric conversion panel, and the sharpness deterioration rate and specific failure occurrence rate in the moisture resistance test are low. The object is to provide a scintillator panel which is low and does not peel off the sealing part during handling.

  The above object of the present invention is achieved by the following configurations.

  1. In a scintillator panel having a substrate and a scintillator layer provided on the substrate, the substrate and the scintillator layer are disposed on the scintillator layer side, and a second protective film is disposed on the substrate side. The ear portion is formed by a protective member that is sealed and has an ear portion formed of a protective film at an outer peripheral portion of the scintillator panel, having an X-ray absorption rate of 5% or less and a thickness of 10 μm to 1000 μm. A scintillator panel characterized by being covered.

  2. 2. The scintillator panel according to 1 above, wherein the protective member is a plate-like workpiece, and the plate-like workpiece is bonded to the entire surface of the second protective film in a region overlapping the scintillator layer. .

  3. 2. The scintillator panel according to 1 above, wherein the protective member is mainly provided at an ear portion.

  4). 4. The scintillator panel according to 3 above, wherein the protective member is a protective member formed by curing a liquid composition.

  5. 5. The scintillator panel according to 3 or 4, wherein the protective member is a plate-like workpiece having a thickness of 10 μm to 500 μm.

  6). The scintillator panel according to any one of 1 to 5, wherein the total thickness of the protective film and the protective member is 100 μm to 1300 μm.

  7. The scintillator panel according to any one of 1 to 6, wherein the scintillator layer has a columnar crystal structure containing cesium iodide and is formed by a vapor phase method.

  8). The scintillator panel according to any one of 1 to 7, wherein a reflective layer, an undercoat layer, and a scintillator layer are provided in order on the substrate.

  By the above means of the present invention, the seal portion is hardly deformed by handling when mounting the scintillator panel to the photoelectric conversion panel or impact during transportation, and the sharpness deterioration rate and specific failure occurrence rate in the moisture resistance test are reduced. A scintillator panel that is low and does not peel off the sealing portion during handling can be provided.

It is sectional drawing of the scintillator panel in which the protection member is not provided. It is sectional drawing of the said scintillator panel, and the protection member which consists of a plate-shaped processed material is provided in the ear | edge part, and is reinforced. It is sectional drawing of the said scintillator panel, The protection member formed by hardening | curing a liquid composition is provided in the ear | edge part, and is reinforced. It is sectional drawing of the said scintillator panel, The plate-shaped processed material of the same size as the scintillator panel whole surface (an ear part is included) is adhere | attached on the surface of the 2nd protective film, and the ear part is protected. It is a schematic diagram of the vapor deposition apparatus which forms a scintillator layer on a board | substrate by a vapor deposition method. It is sectional drawing of a scintillator panel, and the metal tape is adhere | attached on the ear | edge part. It is sectional drawing of the said scintillator panel, The protection member formed by hardening | curing a liquid composition is provided in the ear | edge part, and is reinforced.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail, but the present invention is not limited thereto.

  The scintillator panel includes a substrate and a scintillator panel having a scintillator layer provided on the substrate. The scintillator panel includes a first protective film disposed on the scintillator layer side, and a second protective film disposed on the substrate side. The scintillator panel is formed by sealing with an outer peripheral portion of the scintillator panel formed from a protective layer, and this region is protected by a protective member.

  Hereinafter, the constituent requirements of the present invention will be described in detail.

(Configuration of scintillator plate and scintillator panel)
The scintillator plate is formed by providing a scintillator layer in this order on a substrate, but preferably has a configuration in which a reflective layer, an undercoat layer, and a scintillator layer are provided in this order on the substrate. The scintillator panel is formed by providing at least a protective layer on the scintillator plate. In the present invention, the scintillator panel has a protective layer composed of a first protective film disposed on the scintillator layer side and a second protective film disposed on the outside of the substrate, and the protective layer is the first protective film. And an ear portion which is a sealed portion by the second protective film, and the ear portion of the protective layer is further protected by a protective member.

  The ear part, which is the sealing part, is formed from a protective film formed by bonding the first protective film and the second protective film on the outside of the scintillator plate by bonding with an adhesive or fusion by heat. Means an area.

(Scintillator layer)
As a material for forming the scintillator layer, various known phosphor materials can be used, but the conversion rate from X-rays to visible light is relatively high, and the phosphor is easily formed into a columnar crystal structure by vapor deposition. Therefore, cesium iodide (CsI) is preferable because scattering of emitted light in the crystal can be suppressed by the light guide effect and the thickness of the scintillator layer can be increased.

  However, since only CsI has low luminous efficiency, various activators are added. For example, as shown in Japanese Patent Publication No. 54-35060, a mixture of CsI and sodium iodide (NaI) at an arbitrary molar ratio can be mentioned. Also, for example, CsI as disclosed in Japanese Patent Application Laid-Open No. 2001-59899 is deposited by thallium (Tl), europium (Eu), indium (In), lithium (Li), potassium (K), rubidium ( Rs) and CsI containing an activating substance such as sodium (Na) are preferred. In the present invention, thallium (Tl) and europium (Eu) are preferable, and thallium (Tl) is particularly preferable.

  In the present invention, it is particularly preferable to use an activator containing one or more types of thallium compounds and cesium iodide as raw materials. That is, thallium activated cesium iodide (CsI: Tl) is preferable because it has a broad emission wavelength from 400 nm to 750 nm.

  As the thallium compound of the activator containing at least one kind of the thallium compound, various thallium compounds (compounds having oxidation numbers of + I and + III) can be used.

In the present invention, a preferable thallium compound is thallium bromide (TlBr), thallium chloride (TlCl), thallium fluoride (TlF, TlF ₃ ), or the like.

  The melting point of the thallium compound is preferably in the range of 400 to 700 ° C. When it exceeds 700 ° C., the activator in the columnar crystals exists non-uniformly, and the light emission efficiency decreases. The melting point is a melting point at normal temperature and pressure. Moreover, it is preferable that the molecular weight of a thallium compound exists in the range of 206-300.

  In the scintillator layer, it is desirable that the content of the activator is an optimum amount according to the target performance and the like, but 0.001 to 50 mol%, and further 0.1 to 10 with respect to the content of cesium iodide. It is preferably 0.0 mol%. Here, when the activator is less than 0.001 mol% with respect to cesium iodide, the target light emission luminance cannot be obtained without much difference from the light emission luminance obtained by using cesium iodide alone. Moreover, when it exceeds 50 mol%, the property and function of cesium iodide cannot be maintained.

  In the present invention, after forming a scintillator layer on the polymer film as a substrate by vapor deposition of the raw material of the scintillator, an atmosphere in a temperature range of −50 to 20 ° C. based on the glass transition temperature of the polymer film You may heat-process for 1 hour or more below. Thereby, there is no generation | occurrence | production of a deformation | transformation of a film or peeling of a fluorescent substance, and a scintillator panel with high luminous efficiency can be produced.

  As can be seen from the above description, the scintillator layer is preferably a columnar phosphor layer containing cesium iodide, and is preferably formed by a vapor phase method.

  As the vapor phase method, an evaporation method, a sputtering method, a CVD method, an ion plating method, or the like can be used, but an evaporation method is preferable.

(Reflective layer)
The reflective layer is for reflecting light emitted from the scintillator to enhance light extraction efficiency. The reflective layer is preferably formed of a material containing any element selected from the element group consisting of Al, Ag, Cr, Cu, Ni, Ti, Mg, Rh, Pt, and Au. In particular, it is preferable to use a metal thin film made of the above elements, for example, an Ag film or an Al film. Two or more such metal thin films may be formed.

(Undercoat layer)
The undercoat layer needs to be provided between the reflective layer and the scintillator layer from the viewpoint of protecting the reflective layer. The undercoat layer preferably contains a polymer binder, a dispersant and the like.

  The thickness of the undercoat layer is preferably 0.5 to 5 μm. If the thickness is 3 μm or less, light scattering in the undercoat layer is small and sharpness is good. Further, when the thickness of the undercoat layer is 2 μm or less, the columnar crystallinity is not disturbed even by heat treatment.

  Hereinafter, components of the undercoat layer will be described.

(Polymer binder)
The undercoat layer is preferably formed by applying and drying a polymer binder dissolved or dispersed in a solvent. Specific examples of the polymer binder include polyimide or polyimide-containing resin, polyurethane, vinyl chloride copolymer, vinyl chloride-vinyl acetate copolymer, vinyl chloride-vinylidene chloride copolymer, vinyl chloride-acrylonitrile copolymer. Polymer, butadiene-acrylonitrile copolymer, polyamide resin, polyvinyl butyral, polyester, cellulose derivative (nitrocellulose, etc.), styrene-butadiene copolymer, various synthetic rubber resins, phenol resin, epoxy resin, urea resin, melamine resin , Phenoxy resin, silicon resin, acrylic resin, urea formamide resin, and the like. Of these, polyurethane, polyester, vinyl chloride copolymer, polyvinyl butyral, and nitrocellulose are preferably used.

  As the polymer binder, polyimide or polyimide-containing resin, polyurethane, polyester, vinyl chloride copolymer, polyvinyl butyral, nitrocellulose and the like are particularly preferable in terms of adhesion to the scintillator layer. Moreover, it is preferable that the glass transition temperature (Tg) is a polymer having a temperature of 30 to 100 ° C. in terms of attaching a film between the deposited crystal and the substrate. From this viewpoint, a polyester resin is particularly preferable. However, if the heat treatment temperature is improved in order to improve image characteristics such as luminance, a polymer having a Tg of 30 to 100 ° C. may not be able to ensure sufficient heat resistance. In this case, polyimide or a polyimide-containing resin is used.

  Solvents that can be used to prepare the undercoat layer include N, N-dimethylacetamide, N-methyl-2-pyrrolidone, lower alcohols such as methanol, ethanol, n-propanol, and n-butanol, methylene chloride, and ethylene. Chlorine-containing hydrocarbons such as chloride, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, aromatic compounds such as toluene, benzene, cyclohexane, cyclohexanone and xylene, lower fatty acids and lower alcohols such as methyl acetate, ethyl acetate and butyl acetate And ethers such as dioxane, ethylene glycol monoethyl ester, ethylene glycol monomethyl ester, and mixtures thereof.

  The undercoat layer may contain a pigment or a dye to prevent scattering of light emitted from the scintillator and improve sharpness.

(Protective layer)
The protective layer focuses on protecting the scintillator layer. That is, cesium iodide (CsI) has a high hygroscopic property and, if left exposed, absorbs water vapor in the air and deliquesces, so the main purpose is to prevent this. The protective layer can be formed using various materials.

  Specifically, it is preferable to use a protective film which is a laminated material having a moisture-proof layer. Further, as an installation method, a protective film is formed in a bag shape or a cylindrical shape, a seal in which a scintillator plate is inserted and an opening is bonded, or a seal in which an outer peripheral edge is bonded between two protective films. .

(Protective film)
The protective film is a first protective film that is disposed on the scintillator layer side, and a second protective film that is disposed on the outside of the substrate. It is preferable that the scintillator plate is sealed with the first protective film and the second protective film, and the first protective film is not physically bonded to the scintillator layer.

  In the present invention, when the protective film is bag-shaped or cylindrical, the portion in contact with the scintillator layer is called the first protective film, and the portion in contact with the substrate is called the second protective film.

  Here, “not physically bonded” means not bonded by a physical interaction or chemical reaction using an adhesive. This unbonded state is a state in which the scintillator layer surface and the protective film can be treated as a discontinuous optically and mechanically even if the scintillator layer surface and the protective film are point contacted microscopically. It can be said.

  As a structural example of the protective film used for this invention, the multilayer laminated material which has the structure of an outer layer (protective function layer) / intermediate layer (moisture-proof layer) / innermost layer (thermal welding layer) is mentioned. Furthermore, each layer can be a multilayer as required.

  The first protective film (protective film disposed on the scintillator layer side) preferably has a thickness of 10 μm to 100 μm, and the second protective film (protective film disposed on the substrate side) has a thickness of 50 μm to 300 μm. Are preferably used.

<Innermost layer (thermal welding layer)>
The innermost thermoplastic resin film includes EVA, PP (polypropylene), LDPE (low density polyethylene), LLDPE (linear low density polyethylene) and LDPE, LLDPE produced using a metallocene catalyst, and these films and HDPE. It is preferable to use a film mixed with a (high density polyethylene) film.

<Intermediate layer (moisture-proof layer)>
As the intermediate layer (moisture-proof layer), a layer having at least one inorganic film as described in JP-A-6-95302 and the vacuum handbook revised edition p132 to 134 (ULVAC Japan Vacuum Technology KK) is used. Can be mentioned. Examples of the inorganic film include a metal vapor-deposited film and an inorganic compound vapor-deposited film.

  Examples of the metal vapor deposition film include single crystal Si, amorphous Si, W, and aluminum. Particularly preferable metal vapor deposition films include aluminum.

Thin film handbooks p879-901 (Japan Society for the Promotion of Science), vacuum technology handbooks p502-509, p612, p810 (Nikkan Kogyo Shimbun), vacuum handbook revised edition p132-134 (ULVAC Japan Vacuum Technology KK) Inorganic compound vapor-deposited films as described in (1). As these inorganic compound vapor deposition films, for example, Cr ₂ O ₃ , Si _x O _y (x = 1, y = 1.5 to 2.0), Ta ₂ O ₃ , ZrN, SiC, TiC, PSG, Si ₃ N ₄ , Al ₂ O ₃ or the like is used.

  Examples of the thermoplastic resin film used as the base material of the intermediate layer include ethylene tetrafluoroethyl copolymer (ETFE), high density polyethylene (HDPE), stretched polypropylene (OPP), polystyrene (PS), polymethyl methacrylate (PMMA). ) Film materials used for general packaging films such as biaxially stretched nylon 6, polyethylene terephthalate (PET), polycarbonate (PC), polyimide, polyether styrene (PES) can be used. The base material of the intermediate layer is used as an outer layer, and a protective film may be produced without providing an outer layer separately.

  As a method for forming a deposited film, vacuum technology handbook and packaging technology Vol 29-No. 8, for example, a resistance or high-frequency induction heating method, an electrobeam (EB) method, plasma (PCVD), or the like. The thickness of the deposited film is preferably in the range of 40 to 200 nm, more preferably in the range of 50 to 180 nm.

<Outer layer>
The thermoplastic resin film used as the outer layer is a low-density polyethylene (for example, a polymer film described in Toray Research Center, a new development of functional packaging materials) that is used as a general packaging material (for example, LDPE), HDPE, linear low density polyethylene (LLDPE), medium density polyethylene, unstretched polypropylene (CPP), OPP, stretched nylon (ONy), PET, cellophane, polyvinyl alcohol (PVA), stretched vinylon (OV), ethylene -A vinyl acetate copolymer (EVOH), vinylidene chloride (PVDC), a polymer of fluorine-containing olefin (fluoroolefin), a fluorine-containing olefin copolymer, or the like can be used.

  As these thermoplastic resin films, a multilayer film made by co-extrusion with a different film, a multilayer film made by bonding with different stretching angles, etc. can be used as needed. Furthermore, in order to obtain the required physical properties, it is naturally possible to combine the density and molecular weight distribution of the film used. As the thermoplastic resin film of the innermost layer, LDPE, LLDPE produced using LDPE, LLDPE and a metallocene catalyst, or a film using a mixture of these films and HDPE films are used.

  When the inorganic vapor deposition layer is not used, the outer layer needs to have a function as an intermediate layer. In this case, the thermoplastic resin film may be a single substance or may be used by laminating two or more kinds of films as necessary. For example, CPP / OPP, PET / OPP / LDPE, Ny / OPP / LDPE, CPP / OPP / EVOH, Saran UB / LLDPE (where Saran UB is a vinylidene chloride / acrylate ester co-product of Asahi Kasei Kogyo Co., Ltd. Biaxially stretched film made of polymerized resin as a raw material.), K-OP / PP, K-PET / LLDPE, K-Ny / EVA (where K is a film coated with vinylidene chloride resin) and the like. in use.

  As a method for producing these protective films, various generally known methods are used. For example, the protective film is produced using a wet lamination method, a dry lamination method, a hot melt lamination method, an extrusion lamination method, or a thermal lamination method. It is possible. Of course, the same method can be used when a film on which an inorganic material is deposited is not used, but in addition to these, depending on the material used, it can be formed by a multilayer inflation method or a coextrusion method.

  As the adhesive used for laminating, generally known adhesives can be used. For example, polyolefin thermoplastic resins such as various polyethylene resins and various polypropylene resins, hot-melt adhesives, ethylene-propylene copolymer resins, ethylene-vinyl acetate copolymer resins, ethylene-ethyl acrylate copolymer resins, and other ethylene copolymers. There are thermoplastic resin hot-melt adhesives such as polymer resins, ethylene-acrylic acid copolymer resins and ionomer resins, and other hot-melt rubber adhesives.

  Typical examples of emulsion-type adhesives that are emulsion and latex adhesives are polyvinyl acetate resin, vinyl acetate-ethylene copolymer resin, vinyl acetate and acrylate copolymer resin, vinyl acetate and maleate ester. There are emulsions such as copolymer resins, acrylic acid copolymers, and ethylene-acrylic acid copolymers.

  Typical examples of latex adhesives include rubber latexes such as natural rubber, styrene butadiene rubber (SBR), acrylonitrile butadiene rubber (NBR), and chloroprene rubber (CR). In addition, as adhesives for dry lamination, there are isocyanate adhesives, urethane adhesives, polyester adhesives, etc. In addition, paraffin wax, microcrystalline wax, ethylene-vinyl acetate copolymer resin, ethylene-ethyl acrylate copolymer. Known adhesives such as hot melt laminate adhesives, pressure sensitive adhesives, heat sensitive adhesives and the like blended with polymer resins can also be used.

  More specifically, the polyolefin-based resin adhesive for extrusion laminating includes, in addition to polymers and ethylene copolymer (EVA, EEA, etc.) resins made of polyolefin resins such as various polyethylene resins, polypropylene resins and polybutylene resins, Ionomer resin (ionic copolymer resin) such as L-LDPE resin copolymerized with ethylene and other monomers (α-olefin), DuPont Surlyn, Mitsui Polychemical Co., Ltd., and Mitsui Petrochemical Admer (adhesive polymer), etc.

  In addition, UV curable adhesives have recently begun to be used. In particular, LDPE resin and L-LDPE resin are preferable because they are inexpensive and have excellent laminating properties. A mixed resin in which two or more of the above resins are blended to cover the defects of each resin is particularly preferable. For example, when L-LDPE resin and LDPE resin are blended, spreadability is improved and neck-in is reduced, so that the lamination speed is improved and pinholes are reduced.

  Further, in consideration of sharpness, radiation image unevenness, manufacturing stability, workability, and the like, higher sharpness can be obtained when the haze ratio of the protective layer is 5% or less. Moreover, it is preferable that a haze value is 5% or less also at points, such as radiation image nonuniformity. However, since it is difficult to obtain a film having a general haze value of 0.1% or less, 0.1 to 5% is desirable. A haze rate shows the value measured by Nippon Denshoku Industries Co., Ltd. NDH 5000W. The required haze ratio is appropriately selected from commercially available polymer films and can be easily obtained.

《Protective member》
The protective member is provided in a region including at least the ear portion of the protective film, so that in the step of incorporating the scintillator panel into the flat panel detector, the fusion portion of the protective film is caused by an impact when the scintillator panel is handled manually. It has the effect of preventing peeling and destruction of the protective film on the ear.

  The scintillator panel may be used in combination with high-pressure X-rays or in combination with low-pressure X-rays depending on the shooting location of the human body. With respect to these X-rays, the X-ray exposure amount of the human body at the time of imaging must be kept as low as possible, and the scintillator panel is desired to have high sensitivity. Therefore, the protection member must have a low absorption rate for both high-pressure X-rays and low-pressure X-rays. The absorptance increases as the protective member becomes thicker. From this point, the thickness needs to be 1000 μm or less.

  Further, as described above, the protection member needs strength to protect the ear portion. When the thickness of the protective member is 10 μm or more, the protective member has sufficient strength to protect the ear portion.

  The protective member covers the ears of the protective film. Covering means that the protective member overlaps the ear as viewed from the direction perpendicular to the scintillator layer. The overlapping may be partially overlapped or the protective member may protrude from the ear. However, if the protruding width is too large, it will hinder the incorporation of the scintillator panel into the photoelectric conversion panel, so that it is limited by the structure of the photoelectric conversion panel. Moreover, covering may include a state in which the protective member is bonded or in close contact with the ear portion, and includes a state in which a gap is maintained between the ear portion.

  Examples of the method for installing the protective member include a method 1 in which the protective member is provided on the entire surface including the ear portion of the second protective film and a method 2 in which the protective member is mainly adhered to the ear portion. The term “ear part” mainly means that the width protruding from the ear part to the inner side (area overlapping the scintillator plate) is within 15 mm.

  The protective member used in Method 1 is preferably a plate-like workpiece because the thickness can be made uniform.

  The protective member used in Method 2 may be a plate-like processed product or a curable liquid composition.

(Plate work)
In the method 1, the plate-like workpiece may or may not be bonded to the ear portion. For example, as shown in FIG. 4, the second protective film adheres to the region overlapping the scintillator layer, but in the region of the ear, the protective member and the ear have a gap, and the plate-like workpiece reaches the region of the ear. Cover it. Thereby, it can prevent that an impact is added to an ear | edge part. In Method 1, since a sharpness decreases when a thick protective member is bonded to the first protective film, it is preferable to bond the protective member to the second protective film.

  The region where the plate-like workpiece overlaps with the scintillator layer is a region where the plate-like workpiece overlaps the scintillator layer when viewed from the direction perpendicular to the surface of the scintillator layer.

  In the case where the plate-like workpiece is provided on the entire surface on the second protective film side, the thickness of the plate-like workpiece is preferably 100 μm to 800 μm.

  When the plate-like workpiece is provided on the entire surface, the edge of the plate-like workpiece does not enter the imaging region, so the plate-like workpiece is not recognized at the time of imaging. However, if the X-ray absorption rate is large, The X-ray dose must be increased. Therefore, the X-ray absorption rate is preferably 5% or less.

  In the method 2, the protective member is mainly bonded to the ear portion, and when the force is applied to the ear portion, the stress applied to the fusion interface of the ear portion is reduced, and peeling of the fusion portion of the protective film is prevented. . Further, if the protective member is provided up to the tent region of the protective film (the region where the end face of the scintillator plate, the first protective film and the second protective film form a void portion), the tent region is caused by impact. It is possible to prevent the protective film from being broken. In Method 2, the protective member may be bonded to the first protective film side, or may be bonded to the second protective film side. As an example, a cross-sectional view when bonded to the second protective film is shown in FIG.

  In the method 2, the preferable thickness of the protective member is 10 μm to 500 μm. If it is 10 μm or more, sufficient strength for protection can be obtained, and if it is 500 μm or less, the protective member can be deformed along the shape of the ear portion, and a protective function can be exhibited. The thickness of the plate-like workpiece is more preferably 10 μm to 500 μm, and most preferably 10 μm to 300 μm.

  When the plate-like workpiece is mainly provided in the ear portion as in the method 2, since the width of the ear portion is narrow, if the plate-like workpiece is cut to the width of the ear portion, the handleability of the plate-like workpiece is too thin. Poor and difficult to adhere to the scintillator panel evenly. Therefore, it is preferable to use a plate-shaped workpiece having a width wider than the width of the ear portion. On the other hand, if it is too wide, air remains on the bonded portion, and it is difficult to apply it uniformly. Preferably, a plate-like workpiece having a width 5 to 15 mm wider than the width of the ear portion is used.

  When a plate-like workpiece having such a width is bonded, the plate-like workpiece covers a part of the peripheral portion of the scintillator layer. Therefore, if the plate-like workpiece has a large X-ray absorption rate, Objects are reflected. In order to prevent the plate-like workpiece from being reflected, it is necessary to use a plate-like workpiece having an X-ray absorption rate of 5% or less. Thus, when providing a plate-like processed material mainly in an ear | edge part, it is still more preferable that the X-ray absorption rate of a plate-shaped processed material is 2% or less, and it is most preferable that it is 1% or less.

  The plate-like workpiece is preferably bonded with an adhesive or a pressure-sensitive adhesive.

  The material of the plate-like workpiece may be anything as long as it can be processed into the above dimensions, is within the range of the X-ray absorption rate, and has sufficient strength, but a resin is preferable from the viewpoint of workability and work efficiency. Preferred materials for the plate-like processed material include, for example, density polyethylene (LDPE), HDPE, linear low density polyethylene (LLDPE), medium density polyethylene, unstretched polypropylene (CPP), OPP, stretched nylon (ONy), PET, PEN, polyimide, cellophane, polyvinyl alcohol (PVA), expanded vinylon (OV), ethylene-vinyl acetate copolymer (EVOH), vinylidene chloride (PVDC), CFRP (PAN system), CFRP (pitch system), etc. .

(Liquid composition)
The liquid composition is a curable resin that is cured by heating or irradiation with energy rays such as ultraviolet rays. What hardened | cured curable resin has high hardness, and tough resin is preferable. Preferred curable resins include epoxy resins and acrylic resins.

(Epoxy resin)
The epoxy resin is in a liquid state and is configured by combining an epoxy compound and a curing agent. Some curing agents are polymerized by heating and others are polymerized by light.

  Preferred epoxy compounds include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy. Examples thereof include resins, biphenyl type epoxy resins, triglycidyl-p-aminophenol, and alicyclic epoxy resins.

  Preferred alicyclic epoxy compounds include 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate (commercial products are trade names UVR6105, UVR6110 and CELLOXIDE2021), and bis (3,4-epoxycyclohexylmethyl). ) Adipate (commercially available under the trade name UVR6128), vinylcyclohexene monoepoxide (commercially available under the trade name CELOXIDE 2000), ε-caprolactone modified 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate (commercial product) 1-methyl-4- (2-methyloxiranyl) -7-oxabicyclo [4,1,0] heptane (trade name of CELOXIDE 3000) Goods Yes) include alicyclic epoxy resins such as. Commercial products having the trade names of UVR 6105, UVR 6110 and UVR 6128 are all available from Dow Chemical Company. Commercial products having the trade names of CELOXIDE 2000, CELLOXIDE 2021, CELOXIDE 2081, and CELOXIDE 3000 are all available from Daicel Chemical Industries, Ltd. UVR 6105 is a low viscosity product of UVR 6110.

  Preferable curing agents that polymerize by heat include amines, cations, and acid anhydrides. As the amine, polyamide, dicyandiamide, triethylenediaminetetraminediethylenetriamine, triethylenetetramine, 2-ethyl-4-methylimidazole and the like are preferably used. Commercially available products (trade name: Adeka Opton CP-66, Adeka Opton CP-66, Adeka Opton CP-) available under the trade names Sun-Aid SI-60L, Sun-Aid SI-80L, Sun-Aid SI-100L, Sun-Aid SI-150L A commercially available product (manufactured by Adeka) available under 77 is preferably used. As the acid anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, dodecenyl succinic anhydride, methylendomethylenetetrahydrophthalic anhydride and the like are preferably used.

  Preferred curing agents that are polymerized by light include known sulfonium salts, ammonium salts, diaryl iodonium salts, triaryl sulfonium salts, and the like. JP-A-8-143806, 8-283320, etc. It can be used by appropriately selecting from those described. Moreover, a commercial item can be used as it is for the light / thermosetting agent. Representative examples of photocuring agents include trade names CI-1370, CI-2064, CI-2397, CI-2624, CI-2939, CI-2734, CI-2758, CI-2823, CI-2855 and CI-5102. Commercial products available under the trade name (all manufactured by Nippon Soda Co., Ltd.), commercial products available under the trade name PHOTOINITIATOR 2074 (manufactured by Rhodia), commercial products available under the trade names UVI-6974 and UVI-6990 Products (both manufactured by Union Carbide), Adeka optomer SP-150, Adeka optomer SP-152, Adeka optomer SP-170, Adeka optomer SP-172 commercially available products (Adeka) And so on.

(Acrylic resin)
The acrylic resin preferably used in the present invention is a resin comprising at least one of a monomer, an oligomer and a polymer containing any two or more of vinyl group, allyl group and methacryloyl group in the molecule.

  As the monomer, oligomer and polymer, those containing any two or more of vinyl group, allyl group and methacryloyl group in the molecular structure are preferably used.

  Monomers constituting such monomers, oligomers and polymers are liquid, and preferably have a boiling point of 80 ° C. or higher in order to prevent compositional change due to the volatile components of the monomers, in order to impart hardness to the coating film after the curing reaction. Furthermore, it is preferable that the monomer has a certain degree of cross-linking structure. Moreover, in order to provide weather resistance, it is preferable to have an aromatic group in the molecule.

  Accordingly, preferred monomers for the present invention are bifunctional or higher aliphatic or alicyclic (meth) acrylates, arylates and the like. Examples of such a monomer include the following compounds.

Hydroxy (meth) acrylate compounds such as
1. 1. Pentaerythritol triacrylate 2. Dipentaerythritol pentaacrylate 3. Ethylene glycol diglycidyl ether dimethacrylate 4. Ethylene glycol diglycidyl ether diacrylate 5. Diethylene glycol diglycidyl ether diacrylate 6. Diethylene glycol diglycidyl ether dimethacrylate Propylene glycol dimethacrylate8. Triglycerol diacrylate9. Triglycerol dimethacrylate 10. Acrylated isocyanurate non-hydroxy (meth) acrylate compounds, such as
11. Allylated cyclohexyl diacrylate 12. Dipentaerythritol hexaacrylate13. Caprolactone-modified dipentaerythritol hexaacrylate14. 14. alkyl-modified dipentaerythritol acrylate Pentaerythritol tetraacrylate 16. Polyethylene glycol (meth) acrylate 17. Trimethylolpropane acrylate 18. Modified trimethylolpropane acrylate The monomers and polymers may be used alone or in combination of two or more. In addition, the mixing ratio of monomers, oligomers and polymers other than the above (including monomers, oligomers and polymers other than the above) is usually at least relative to the total mass of the monomers, oligomers and polymers because the hardness of the coating is significantly reduced. It is 20-90 mass%.

  In order to adjust the viscosity, the main monomer, oligomer and polymer are alcohol solvents such as isopropanol and n-propanol; ketone solvents such as methyl ethyl ketone; and nonpolar solvents such as toluene and xylene. As may be added.

  As a curing agent for curing the acrylic resin, an initiator that initiates a reaction by heat or an initiator that initiates a reaction by light is used, and an initiator that initiates a reaction by light is preferably used. Specific examples include benzoin and derivatives, acetophenone, benzophenone, hydroxybenzophenone, Michler's ketone, α-amyloxime ester, thioxanthone, and the like. You may use with a photosensitizer.

(Method of applying liquid curable resin)
The liquid curable resin is mainly applied to the ear portion. That is, the liquid curable resin is applied only to the ear part or to the peripheral part near the ear part and the ear part. Moreover, when apply | coating to the peripheral part near an ear | edge part, it apply | coats thinner than the thickness applied to an ear | edge part.

(Method of curing liquid curable resin)
The liquid curable resin can be cured by applying various energy after coating.

  As the energy, heat, light, ultraviolet rays, and electron beams can be used, but ultraviolet rays are particularly preferable from the viewpoint that the material such as the scintillator is hardly deteriorated and can be cured efficiently.

  As an apparatus for irradiating ultraviolet rays, a low-pressure mercury lamp, a high-pressure mercury lamp, a metal lamp such as a ride lamp, a xenon lamp, or an ultraviolet LED is used.

(substrate)
As the substrate, various metals, carbon, α-carbon, a heat-resistant resin substrate and the like can be used, but a heat-resistant resin substrate is particularly preferable in view of image characteristics, cost, and the like.

  Conventionally known resins can be used as the heat resistant resin, but so-called engineering plastics are preferably used. Here, “engineering plastics” are high-performance plastics used in industrial applications (industrial applications), and generally have high strength, heat-resistant temperature, excellent chemical resistance, etc. Have advantages.

  The engineering plastics are not particularly limited. For example, polysulfone resin, polyethersulfone resin, polyimide resin, polyetherimide resin, polyamide resin, polyacetal resin, polycarbonate resin, polyethylene terephthalate resin, polybutylene. A terephthalate resin, an aromatic polyester resin, a modified polyphenylene oxide resin, a polyphenylene sulfide resin, a polyether ketone resin, or the like is preferably used. These engineering plastics may be used independently and 2 or more types may be used together.

  Furthermore, depending on the curing temperature, it is also preferable to use super engineering plastics represented by polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE) and the like.

  In the present invention, the substrate is preferably formed of a resin containing polyimide such as polyimide resin or polyetherimide resin, which is excellent in heat resistance, workability, mechanical strength, and cost.

  The X-ray absorption rate of the substrate is preferably 5% or less, more preferably 2% or less, and most preferably 1% or less.

  Note that when the scintillator panel and the planar light receiving element surface are brought into close contact with each other, the image quality is not uniform within the light receiving surface of the flat panel detector due to the influence of deformation of the substrate or warpage during vapor deposition. By making the substrate a resin substrate with a thickness of 50 μm or more and 500 μm or less, the scintillator panel is transformed into a shape that matches the shape of the planar light receiving element surface, and it is improved so that uniform sharpness can be obtained over the entire light receiving surface of the flat panel detector The

(Measurement method of X-ray absorption rate)
The dosimeter is placed so as to receive the X-rays irradiated from the X-ray tube device, and a dose of R measured by the dosimeter is measured by irradiating X-rays with a piece of material placed between the X-ray tube device and the dosimeter. And Let R ₀ be the dose measured in the same way without placing a piece of material. The X absorption rate (%) at that time is obtained by the following formula.

X absorption rate (%) = 100 × (R ₀ −R) / R ₀
Other measurement conditions are as follows.

X-ray tube voltage: 70 kV
Dosimeter: DIADOS T11003 (made by PTW)

  EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.

Example 1
(Preparation of scintillator plate)
(Preparation of substrate)
A polyimide film having a thickness of 0.125 mm and a width × length (90 mm × 90 mm) was prepared as a substrate.

(Formation of reflective layer)
Aluminum was sputtered on one side of the polyimide film substrate to a thickness of 0.07 μm.

(Formation of undercoat layer)
Byron 630 (manufactured by Toyobo Co., Ltd .: polymer polyester resin) 100 parts by mass Methyl ethyl ketone (MEK) 100 parts by mass Toluene 100 parts by mass The above formulations were mixed and dispersed in a bead mill for 15 hours to obtain a coating solution. After applying this coating liquid on the aluminum layer mounting surface of the substrate with a bar coater so as to have a dry film thickness of 1.0 μm, the substrate was prepared by providing an undercoat layer by drying at 100 ° C. for 8 hours. .

(Formation of scintillator layer)
A phosphor (CsI: 0.003 Tl) was vapor-deposited on the substrate prepared above using the vapor deposition apparatus shown in FIG. 5 to form a scintillator layer, and a scintillator plate was produced.

  A phosphor material (CsI: 0.003 Tl) was filled in a resistance heating crucible, a substrate was placed on the support holder, and the distance between the resistance heating crucible and the substrate was adjusted to 400 mm. Subsequently, the inside of the vapor deposition apparatus was once evacuated, Ar gas was introduced and the degree of vacuum was adjusted to 0.5 Pa, and then the substrate temperature was maintained at 140 ° C. while rotating the substrate at a speed of 10 rpm. Next, the resistance heating crucible was heated to deposit a phosphor, and when the scintillator layer had a thickness of 400 μm, the deposition was terminated to obtain a scintillator plate.

(Preparation of protective film)
The protective film of the following layer structure was prepared as a 1st protective film and a 2nd protective film.

  A layer of 50 nm alumina was deposited by vapor deposition on a 70 μm thick PET film, and a 30 μm CPP (casting polypropylene) layer was further formed thereon by dry lamination to form a protective film.

(Production of scintillator panel)
The scintillator plate was sealed in the form shown in FIG. 1 with the protective film to produce a scintillator panel. The protective film should be larger than the finished size of the scintillator panel, and sealed under a reduced pressure of 1000 Pa so that the width of the ear of the protective layer that becomes the fused portion is 5 mm. Unnecessary parts were discarded. The impulse sealer used for the fusion was a 10 mm wide heater.

(Adhesion of protective member)
As shown in 31 of FIG. 3, the following protective member C was applied to the second protective film of the ear part with a thickness of 100 μm with a dispenser over the entire circumference, and heated and cured at 120 ° C. for 2 hours to cure the sample. Produced.

  The scintillator panel with a protective member produced as described above was evaluated for sharpness MTF, moisture resistance, handling property, impact resistance and reflection property.

Protective member C:
Cel-2021P (3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexylcarboxylate; manufactured by Daicel Corporation) 10 g
Rikacid MH-700 (4-methylhexahydrophthalic anhydride / hexahydrophthalic anhydride = 70/30; manufactured by Shin Nippon Rika Co., Ltd.) 10 g
Diazabicycloundecene 0.1g
Megafax F-178K (manufactured by DIC Corporation) 0.2g
Example 2
The following protective member B is applied to the scintillator panel over the entire circumference of the first protective film with a thickness of 50 μm with a dispenser, as shown in 35 of FIG. 7, and cured by heating at 60 ° C. for 3 hours. A sample was prepared and evaluated in the same manner as in Example 1.

Protective member B:
jER828 (Japan epoxy resin; bisphenol A type epoxy resin) 10 g 2-ethyl-4-methylimidazole 1.5 g
Example 3
As shown in 31 of FIG. 3, a sample was prepared and evaluated in the same manner as in Example 1 except that the protective member C was applied to the second protective film of the ear part with a thickness of 50 μm with a dispenser over the entire circumference. did.

Example 4
A sample was prepared and evaluated in the same manner as in Example 1 except that the following protective member D was placed at the ear portion of the scintillator panel as shown in 30 of FIG.

Protective member D:
A 127 μm thick PET film (Toray; Lumirror) was cut to a width of 15 mm, and a heat-sealing sheet NP608 (Sony Chemical; 50 μm) was adhered. The X-ray absorption rate of the protective member D was 0.2%.

Example 5
As shown in 32 and 33 in FIG. 4, an epoxy resin having the same composition as that of the protective member B is applied to a thickness of 20 μm on one side of the protective member E, and the scintillator panel and the epoxy resin of the protective member B face each other. After bonding, the sample was prepared and evaluated in the same manner as in Example 1 except that it was cured at 60 ° C. for 3 hours.

Protective member E:
A carbon plate (PAN-based unidirectional CFRP) having a thickness of 500 μm was cut into the same size as the scintillator panel. The X-ray absorption rate of the protective member E was 0.1%.

  The X-ray absorption rate was measured according to the above (Method for measuring X-ray absorption rate).

Comparative Example 1
A sample was prepared and evaluated in the same manner as in Example 1 except that the protective member was not provided on the scintillator panel.

Comparative Example 2
A sample was prepared and evaluated in the same manner as in Example 1 except that the protective member A was adhered to the scintillator panel as indicated by 34 in FIG. FIG. 6 shows a cross-sectional view of the scintillator panel when the protective member is bonded.

Protective member A:
A metal tape (antireflection layer 3 μm / aluminum foil 18 μm / adhesion layer 18 μm) was prepared as described in Example 1 of JP-A-2009-27776, and was cut into a width of 15 mm. The X-ray absorption rate of the protective member A was 6.5%.

  The scintillator panel produced as described above was evaluated as follows, and the results are shown in Table 1.

(Evaluation of scintillator panel)
(Sharpness)
Each sample is set on a 10 cm long × 10 cm wide CMOS flat panel (X-ray CMOS camera system Shad-o-Box 4KEV manufactured by Radicon), and MTF is measured and calculated for each sample from 12-bit output data.

  Specifically, X-rays having a tube voltage of 80 kVp were irradiated from the back surface (second protective film side) of each sample through an MTF chart made of lead, and image data was detected by a CMOS flat panel and recorded on a hard disk. Thereafter, the recording on the hard disk was analyzed by a computer to calculate the modulation transfer function (MTF (Modulation Transfer Function)) of the X-ray image recorded on the hard disk. The calculation result (MTF value (%) at a spatial frequency of 1 cycle / mm) was obtained. The higher the MTF value, the better the sharpness.

(Moisture resistance)
The scintillator panel obtained above was left for 3 days in an environment of 70 ° C. and 90% RH, and then the surface shape of the scintillator layer was visually evaluated with an optical microscope. Based on the following criteria, the ranking was divided into three levels.

1: No change 2: Melting is observed at a part of the crystal tip, and the melting rate is less than 0.5% of the entire crystal area 3: The melting rate of the crystal tip is 0.5% to 5% of the entire crystal area %.

(Handability)
After the scintillator panel is once set on the photoelectric conversion panel, it is taken out and the protective film of the scintillator panel is unsealed. The ear part of the protective film is visually observed, and the protective film including the ear part, the tent part and the periphery thereof having a large damage is cut out. Leak checker (ageless seal check solution; manufactured by Mitsubishi Gas Chemical Co., Ltd.) is dropped onto the tent with a dropper with the opening of the tent up and the ear down, and observed with a microscope after standing for 2 hours. To do.

1: There is no leak in the ear part of the protective film 2: There is a leak in the ear part of the protective film.

(Impact resistance)
Set the scintillator panel on the photoelectric conversion panel and give an impact with half-sine waves at 20G, 2ms 6 times (± 3 times each) in the X, Y, and Z directions, then the scintillator panel from the photoelectric conversion panel Take out and observe visually.

1: No change 2: Protective film ear part is deformed, but protective film is not broken 3: Protective film ear part is partially deformed, and protective film is broken.

(Reflection)
Each sample is set to a 10 cm long and 10 cm wide CMOS photoelectric conversion panel (Radicon X-ray CMOS camera system Shad-o-Box 4KEV), and X-ray with a tube voltage of 80 kVp is irradiated from the back surface of each sample. An uncorrected image was taken. This was reproduced as an image by an image reproducing device, the image of the sealing ear was observed, and reflection of the protective member was evaluated.

1: No reflection of protective member 2: Boundary with / without protective member is confirmed in some areas 3: Boundary with / without protective member is confirmed in all areas.

  From Table 1, it can be seen that, according to the present invention, sharpness, moisture resistance, handleability, impact resistance and reflection characteristics are improved at the same time, and in particular, moisture resistance is improved.

DESCRIPTION OF SYMBOLS 1 Scintillator panel 2 Scintillator layer 3 Reflective layer 4 Board | substrate 5 Undercoat layer 10 2nd protective film 20 1st protective film 30 Plate-shaped processed material 31 Hardened | cured material of a liquid composition 32 Plate-shaped processed material 33 Adhesive 34 Metal tape 35 Cured material of liquid composition 200 Vapor deposition apparatus 201 Vacuum container 202 Evaporation source 203 Substrate holder 204 Substrate rotation mechanism 205 Vacuum pump

Claims (8)

  In a scintillator panel having a substrate and a scintillator layer provided on the substrate, the substrate and the scintillator layer are disposed on the scintillator layer side, and a second protective film is disposed on the substrate side. The ear portion is formed by a protective member that is sealed and has an ear portion formed of a protective film at an outer peripheral portion of the scintillator panel, having an X-ray absorption rate of 5% or less and a thickness of 10 μm to 1000 μm. A scintillator panel characterized by being covered.   2. The scintillator according to claim 1, wherein the protective member is a plate-like workpiece, and the plate-like workpiece is bonded to the entire surface of the second protective film in a region overlapping the scintillator layer. panel.   The scintillator panel according to claim 1, wherein the protection member is mainly provided at an ear portion.   The scintillator panel according to claim 3, wherein the protective member is a protective member formed by curing a liquid composition.   The scintillator panel according to claim 3 or 4, wherein the protective member is a plate-like workpiece having a thickness of 10 µm to 500 µm.   The scintillator panel according to claim 1, wherein a total thickness of the protective film and the protective member is 100 μm to 1300 μm.   The scintillator panel according to any one of claims 1 to 6, wherein the scintillator layer has a columnar crystal structure containing cesium iodide and is formed by a vapor phase method.   The scintillator panel according to any one of claims 1 to 7, wherein a reflective layer, an undercoat layer, and a scintillator layer are provided in order on the substrate.

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