JP2011019724A - Method for bonding object - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stably bond a jewel or the like when a base portion is small and the amount of adhesive is restricted to a small amount. <P>SOLUTION: At least either one of an object 1 and the base portion 3 is heated, heated hot-melt adhesive 4 is applied to the heated object 1 or base portion 3, the object 1 and the base portion 3 are brought into abutment on each other via the hot-melt adhesive 4, and the hot-melt adhesive 4 is hardened. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for bonding an object.

  2. Description of the Related Art Conventionally, a method of bonding a jewelry or a decorative article using a hot melt adhesive is known (for example, Patent Documents 1 and 2).

JP 2006-181151 A Japanese Unexamined Patent Publication No. 6-14891

  On the other hand, in recent years, preserved flowers obtained by specially processing fresh flowers have attracted attention. Since preserved flowers can enjoy the softness and color of fresh flowers for a long time even in the absence of water or light, there is a wide demand for, for example, weddings, gifts, and displays.

  In the process of studying preserved flowers, the present inventor combined flowers and jewels to achieve a high designability due to the synergistic effect of the natural beauty of the flowers and the glitter of the jewels. For example, as shown in FIG. 1, a flower arrangement in which a jewel 1 is arranged between a plurality of flowers has been created based on the assumption that a high-class feeling can be produced while attracting eyes.

  In such a flower arrangement, it is necessary to fix the jewel to the pedestal. At first, for example, after placing the jewel on the pedestal having the nail portion, the jewel is fixed and held from above by folding the nail portion. Was considered. However, the fixing of the jewel by bending the nail portion requires a very advanced technique, and it is very disadvantageous in terms of time and cost when a specialist engineer is requested. Moreover, in this method, since the jewel is held by the nail portion, it is inevitable that the jewel is scratched. Therefore, when the jewel removed from the pedestal is reused for another decoration, there is a problem that the commercial value of the jewel is impaired.

  In addition, it was also considered to fix the jewelry on the pedestal with a so-called instantaneous adhesive, but although the instantaneous adhesive has the advantage that it does not take time to fix the adhesive, it lacks the flexibility after curing the adhesive, so it will not be impacted. There was a problem that jewelry was dropped during product transportation.

  Therefore, the present inventor has paid attention to a hot melt adhesive that is characterized by being melted by heating and being cured at room temperature. The hot melt adhesive is excellent in workability and has elasticity like rubber even after curing, so that it is illustrated in FIG. 2 (A) under the assumption that the gemstone can be prevented from falling off due to impact. As described above, by applying a hot melt adhesive on the upper surface of the plastic pedestal 3 on which the long shaft member 2 is extended, the jewel 1 is brought into contact with the pedestal 3 to be bonded and cured. 3 (A), and tried to make the above-mentioned flower arrangement by arranging the jewel 1 by inserting the shaft member 2 at a desired position of the flower.

  However, in this method, the hot melt adhesive is difficult to see from the outside, and the design of the flower arrangement is excellent, but the problem that the jewel 1 easily falls off the pedestal 3 due to contact or impact has not been solved. .

  That is, this problem is: 1) Since the gemstone may be spherical like pearl or may be cut into various shapes such as brilliant cut, the contact area with the pedestal is small, Adhesion by hot melt adhesive tends to be unstable. 2) The amount of hot melt adhesive that can be applied because the pedestal is so small as to be hidden in jewelry so as not to impair the appearance of the flower arrangement. This is considered to be due to the fact that it is limited to a very small amount and it is difficult to ensure the adhesion stability of the gemstone.

  In such a situation, when the pedestal is small and the amount of the adhesive is limited to a small amount, the method for stably adhering gemstones, etc., at present, including the above Patent Documents 1 and 2, It has not been established as a technology, and no new proposal has been made.

  The present invention has been made in view of the circumstances as described above, and a method capable of stably adhering gemstones or the like when the pedestal portion is small and the amount of adhesive is limited to a small amount. The issue is to provide.

  As a result of further investigations on the adhesion and fixing of jewels by hot melt adhesives, the present inventor has found that the heated hot melt adhesive is cured from the surface side immediately after being applied to the pedestal or the jewel. It has been found that the starting point is that the amount of heat of the hot melt adhesive is suddenly taken away by the pedestal or the jewel. That is, when the amount of hot melt adhesive applied is large, even if curing from the surface side proceeds, the fluidity inside is high, and when the base and the jewel are brought into contact with each other, the adhesiveness is improved. While there is no adverse effect, when the amount of hot melt adhesive applied is limited to a small amount, the curing proceeds rapidly due to the heat amount of the hot melt adhesive being taken away by the pedestal or jewelry, Since the fluidity of the hot melt adhesive is reduced, the familiarity of the hot melt adhesive with respect to the jewel is deteriorated, and the adhesiveness of the jewel is found to be reduced, and the present invention has been completed.

That is, in order to solve the above-described problems, the present invention is characterized by the following as a method for bonding an object such as a jewel.
<1> A method for adhering an object that is a jewel or a decorative body to a pedestal portion, wherein at least one of the object and the pedestal portion is heated, and the heated hot melt adhesive is heated. After applying to the object or the pedestal part, the object and the pedestal part are brought into contact with each other via the hot melt adhesive to cure the hot melt adhesive.
<2> The object and / or the pedestal is heated to 40 ° C to 150 ° C.
<3> The object and / or the pedestal is heated to a temperature equal to or higher than the melting temperature of the hot melt adhesive.
<4> Each object and pedestal are heated.
<5> The object is held by a support and heated.
<6> The support is made of a material from which the hot melt adhesive can be peeled.
<7> The material from which the hot melt adhesive can be peeled is silicon resin or rubber.
<8> The support has a recess into which the object can be fitted.
<9> The pedestal is made of a transparent plastic.
The <10> pedestal has a disk shape and the upper surface is curved inward.
The diameter of the <11> pedestal is smaller than the maximum length of the object.

  According to the present invention, even when the pedestal is small and the amount of the adhesive is limited to a small amount, it is possible to stably bond and fix gems and the like, and the gems fall off due to impact after the bonding and fixing. There is nothing. Furthermore, when a support body is used, the object and the pedestal can be bonded and fixed more easily and stably.

It is a perspective view which illustrates the flower arrangement which combined the flower and the jewel. It is a perspective view which illustrates a base part. It is a perspective view which shows a mode that the jewelry was adhere | attached and fixed to the base part. It is process drawing which illustrates the process of the adhesion method of the target object of this invention. It is the perspective view which illustrated a mode that the jewelry was bonded and fixed to the broach. It is a perspective view which illustrates the support body holding a subject. It is a perspective view which illustrates the support body holding a subject. It is a perspective view which illustrates a hot-melt glue gun.

  As illustrated in the process diagram of FIG. 4, the present invention is a method of bonding the object 1 to the pedestal part 3, and heats at least one of the object 1 and the pedestal part 3 (process). 1) The heated hot melt adhesive 4 is applied to the heated object 1 or the pedestal 3 (step 2), and the object 1 and the pedestal 3 are applied to each other via the hot melt adhesive 4. The hot melt adhesive 4 is cured by contacting (step 3).

  Hereinafter, although embodiment of this invention is described in detail, the adhesion | attachment method of this invention is not limited to adhesion | attachment methods, such as jewelry used for a flower arrangement.

<Step 1> Warming of the object and / or the pedestal part At least one of the object 1 and the pedestal part 3 is heated. The process 1 of FIG. 4 has illustrated the form which heats each of the target object 1 and the base part 3.

  “Object” refers to, for example, a decorative body made of at least one of gemstones, ceramics, plastic beads, metal molded bodies, natural or synthetic organic bodies. Examples of the gem include diamond, emerald, sapphire, ruby, opal, coral, amethyst, crystal, tourmaline, onyx, coral, pearl, and the like. Examples of the metal molded body include those formed of noble metals such as gold, gold alloy, platinum, platinum alloy, and silver, and those formed of iron, stainless steel, copper, aluminum, zinc, and the like.

  Moreover, the shape of the target object 1, a magnitude | size, etc. are not specifically limited. For example, a brilliant-cut jewel, a spherical pearl-like jewel, a heart-shaped jewel, and the like can be stably bonded and fixed.

  The “pedestal portion” refers to a member that becomes a substrate for bonding and fixing the object 1. The material, shape, and size of the pedestal 3 are not particularly limited, but examples of preferable materials include plastic and metal. The shape is preferably a shape that can easily hold the object 1.

  More specifically, for example, when the bonding method of the present invention is used for bonding gemstones used in flower arrangements, for example, a disk shape as illustrated in FIGS. 2 (A), (B), and (C). The plastic pedestal 3 can be used. Further, when transparent plastic is used for the pedestal part 3, the pedestal part 3 is inconspicuous, so when used for flower arrangement, it gives an impression that the object 1 is floating between flowers, A more natural luxury can be produced.

  Further, as illustrated in FIGS. 2B and 2C, a plurality of pedestal portions 3 can be used according to the number of objects 1. For example, when a spherical jewel 1 such as a pearl is adhered on the pedestal 3 illustrated in FIG. 2C, the flower formed by the jewel 1 as illustrated in FIG. 3C. A noble atmosphere like this can also be produced.

  And when using the target object 1 for a flower arrangement, as illustrated in FIG. 2 and FIG. 3, while ensuring the stability of the target object 1, it is formed as small as possible so as not to impair the appearance design. In particular, when the pedestal portion 3 has a disk shape, it is considered that the diameter R of the pedestal portion 3 is smaller than the maximum length L of the object 1. The Thus, when the pedestal part 3 is formed smaller than the object 1, the appearance design is not impaired, but the application amount of the hot melt adhesive 4 is limited to a small amount.

  Furthermore, as illustrated in FIGS. 2A, 2 </ b> B, and 2 </ b> C, it is preferable to use the pedestal portion 3 whose upper surface is curved inward. When such a curved portion 3a is formed, the hot melt adhesive 4 can be filled in the curved portion 3a and the lower part of the object 1 is fitted or inserted into the curved surface 3a. The stability of adhesive fixing via the agent 4 can be enhanced. The size and depth of the bending portion 3a are appropriately determined according to the shape and size of the object 1.

  2A, 2B, and 2C, a long and deformable shaft member 2 is extended from the pedestal portion 3, and the shaft member 2 is inserted between the flowers. Free arrangement is possible.

  Furthermore, as the pedestal part 3 in the bonding method of the present invention, various accessories such as brooches, pendants, hair clasps and the like can be exemplified. In this case, the surface of the accessory can be obtained through the steps described below. It is possible to adhere and fix the object 1 such as a jewel. FIG. 5 illustrates a state in which the object 1 such as a jewel is bonded and fixed to the surface of the broach 5.

  Then, at least one of the object 1 and the pedestal part 3 as described above is heated. Either the object 1 or the pedestal part 3 can be heated, but it is preferable to heat each of the object 1 and the pedestal part 3 as shown in step 1 of FIG. When either the object 1 or the pedestal part 3 is heated, the one to be applied with the hot melt adhesive 4 described later is heated. Therefore, in this case, it is considered to select and heat the object 1 and the pedestal portion 3 in a shape where the hot melt adhesive 4 can be easily applied. The heating method is not particularly limited. For example, the object 1 and the pedestal 3 are placed on a plate-like heater and left for a predetermined time, for example, directly with a dryer or the like. A method of heating the object 1 and the pedestal 3 can be exemplified.

  Specifically, the temperature of the object 1 and / or the pedestal portion 3 given by the heating can be about 40 ° C. to 150 ° C., but the temperature is the melting of the hot melt adhesive 4 described later. It can be set according to the temperature. That is, since the melting temperature of the general hot melt adhesive 4 is approximately 70 ° C. to 150 ° C., the temperature of the object 1 and / or the pedestal 3 is 70 ° C. or higher from the viewpoint of the adhesiveness of the object 1. Is preferable. However, even if it is below the melting temperature of the hot melt adhesive 4, for example, at a temperature of about 40 ° C. to 70 ° C., the fluidity of the hot melt adhesive 4 after application does not rapidly decrease. Alternatively, when the hot melt adhesive 4 is applied to the pedestal 3 immediately after contact, or when the hot melt adhesive 4 to be used has a low melting temperature, stable adhesion is possible.

  On the other hand, if the temperature is too high, depending on the material, the object 1 and the pedestal part 3 may be modified and deformed. Therefore, the upper limit of the temperature of the object 1 and the pedestal part 3 is set in consideration of quality and the like. can do. As a temporary guide, a temperature of 100 ° C. or less can be exemplified.

  In heating, for example, the object 1 can be held by the support 6 illustrated in FIG. 6, and the object 1 can be heated together with the support 6. The material, shape, and the like of the support 6 are not particularly limited, but the material is preferably a material from which the hot melt adhesive 4 can be peeled, and examples thereof include silicon and rubber. Furthermore, it is preferable that a concave portion 6a into which the objects 1 having various sizes and shapes can be fitted is formed on the surface of the support 6 in advance. By supporting the object 1 in the recess 6a, the object 1 can be heated safely and easily. In particular, since silicon, rubber, and the like conduct heat well, for example, by placing the support 6 on the heater while the object 1 is held by the recess 6a of the support 6, the object 1 can be stabilized. Heating can also be performed in a held state. The depth of the recess 6a is not particularly limited as long as it is deep enough to prevent the object 1 from falling off.

<Step 2> Application of Hot Melt Adhesive to Object or Pedestal Part As illustrated in Step 2 of FIG. 4, hot melt adhesive 4 is heated and melted, and then object 1 or pedestal part 3 Apply to.

  “Hot melt adhesive” is solid at room temperature, but is melted (liquefied) by heating at about 70 ° C. to 150 ° C. and applied to an adherend (object or pedestal). A thermoplastic adhesive that forms a bond at room temperature or by cooling and solidification. The hot melt adhesive 4 includes, for example, a polyamide resin-based adhesive, but in addition, for example, a copolymer such as ABS resin or SAN resin, polyacetals, polycarbonates, polyesters, etc. Any synthetic resin adhesive material that softens may be used. However, considering the appearance when holding a jewel or the like, it is preferable to use a hot melt adhesive 4 having high transparency. Thereby, the effect at the time of using the said transparent base part 3 will further increase.

  And the application of the hot melt adhesive 4 can use the hot melt glue gun 7 illustrated in FIG. 7, for example. The hot melt glue gun 7 is a pistol-type adhesive tool. When a stick-like hot melt glue (adhesive) 8 is inserted and the power cord is connected, the temperature rises in a few minutes. By pulling 10, the hot melt glue 8 (adhesive) is pushed out in the distal direction, and the warmed hot melt glue 8 (adhesive) comes out of the gun nozzle 11. Accordingly, the hot melt glue (adhesive) 8 can be applied simply by applying the gun nozzle 11 of the hot melt glue gun 7 to the object 1 or the pedestal 3 and pulling the trigger lever 10.

  Here, in the said process 1, when each of the target object 1 and the base part 3 is heated, the hot melt adhesive 4 may be applied to either the target object 1 or the base part 3, In consideration of the shape and the like, the hot melt adhesive 4 can be easily applied and can be applied by selecting the one that hardly flows down. On the other hand, in the step 1, when either the object 1 or the pedestal portion 3 is heated, the hot melt adhesive 4 is applied to the heated one. Moreover, in the said process 1, when it heats using the support body 6, although the application | coating method is the same, since the target object 1 is hold | maintained stably by utilizing the support body 6, it is to the target object 1. Even when the hot melt adhesive 4 is applied, the operation can be performed very easily. Furthermore, even when the hot melt adhesive 4 is spilled off when the hot melt adhesive 4 is applied to the object 1, the hot melt adhesive 4 does not adhere to the work table or the like, and the support 6 is further covered. Since the adhering hot melt adhesive 4 can be easily peeled off, it is possible to reduce the trouble of cleaning work and improve work efficiency. In addition, in the process 2 of FIG. 3, the state which apply | coated the hot-melt-adhesive 4 to the base part 3 is illustrated.

  Since the object 1 and / or the pedestal portion 3 are in a heated state in the step 1, the applied hot melt adhesive 4 is not deprived of heat even after being applied, so that the curing does not easily proceed. High fluidity is maintained.

<Step 3> Bonding and Fixing of Object and Pedestal Part As illustrated in step 3 of FIG. 3 are brought into contact with each other, and the hot melt adhesive 4 is cured.

  Specifically, for example, the object 1 can be held by tweezers and the object 1 can be brought into contact with the pedestal 3. Of course, when either one of the object 1 and the pedestal portion 3 is heated in the step 1, it can be brought into contact with a finger. Furthermore, as illustrated in FIG. 6, when the object 1 is held by the support 6, as shown in the step 2, after applying the hot melt adhesive 4 to the object 1 or the pedestal portion 3, By pressing the upper surface of the pedestal part 3 against the object 1, the object 1 and the pedestal part 3 can be brought into contact with each other. Spherical gemstones such as pearls are not easy to hold with tweezers or the like, but if the pearls are supported by the support 6, the object 1 and the pedestal 3 can be brought into contact stably and easily. Can do.

  And since the target object 1 and / or the pedestal part 3 are in a heated state by the above step 1, the hot melt adhesive 4 is not deprived of heat after application in the step 2 and is fluid. Can maintain a high state. Therefore, the hot-melt adhesive 4 after application is familiar with the object 1, and the lower part of the object 1 is stored in the curved portion 3 a on the upper surface of the pedestal part 3 by the contact between the object 1 and the pedestal part 3. At the same time, the hot melt adhesive 4 is coated over the entire lower periphery of the object 1. Thereby, since the adhesive application area with respect to the target object 1 becomes large, strong adhesive fixing is realized. And since the hot-melt-adhesive 4 after hardening has elasticity like rubber | gum, it can absorb an impact and the target object 1 does not drop by an impact after adhesion | attachment. In particular, in the step 1, when each of the object 1 and the pedestal portion 3 is heated, even after the object 1 and the pedestal portion 3 are brought into contact with each other, the fluidity of the hot melt adhesive 4 is maintained for a certain time. Since the high state can be maintained, the object 1 can be further adhered and fixed stably.

  Since the hot melt adhesive 4 is cured at room temperature after application, the hot melt adhesive 4 is cured if the contact state between the object 1 and the pedestal 3 is maintained for a predetermined time. The pedestal 3 is bonded and fixed. In addition, if it cools in the contact state of the target object 1 and the base part 3, the time which the hot-melt-adhesive 4 requires for hardening will be shortened, and the target object 1 and the base part 3 can be adhere | attached and fixed in a shorter time. .

  As described above, according to the bonding method of the present invention, the object 1 and / or the pedestal part 3 is heated, and after the heated hot melt adhesive 4 is applied to either one, they are brought into contact with each other, In order to cure the hot melt adhesive 4, the object 1 such as a jewel can be stably bonded and fixed even when the pedestal portion 3 is small and the amount of the hot melt adhesive 4 is limited to a small amount. it can. Moreover, it is excellent in impact resistance by the elasticity of the hot-melt-adhesive 4 after hardening, and the target object 1 does not drop out. Actually, stable adhesion and fixation are confirmed in the object 1 such as pearl, zirconia, diamond, and sapphire.

  Moreover, although the hot-melt adhesive 4 after curing has high adhesion retention of the object 1, it can be removed relatively easily. For example, after using expensive jewelry for flower arrangements and accessories, It can also be reused for other decorations. According to the hot melt adhesive 4, the jewelry can be firmly fixed without being damaged, so that the commercial value of the jewelry is not impaired even after use.

1 Object (jewel)
2 Shaft member 3 Base part 3a Curved part 4 Hot melt adhesive 5 Broach 6 Support 6a Recess 7 Hot melt glue gun 8 Hot melt glue (adhesive)
9 Grip part 10 Trigger lever 11 Gun nozzle

Claims (11)

  A method of adhering an object that is a jewel or a decorative body to a pedestal, wherein at least one of the object and the pedestal is heated, and the heated hot melt adhesive is heated. Or after apply | coating to a base part, an object and a base part are contact | abutted mutually via a hot-melt-adhesive, and the hot-melt-adhesive is hardened.   The bonding method according to claim 1, wherein the object and / or the pedestal is heated to 40 ° C to 150 ° C.   The bonding method according to claim 1, wherein the object and / or the pedestal is heated to a temperature equal to or higher than a melting temperature of the hot melt adhesive.   The bonding method according to claim 1, wherein the object and the pedestal are each heated.   The bonding method according to any one of claims 1 to 4, wherein the object is heated by being held by a support.   6. The bonding method according to claim 5, wherein the support is made of a material from which the hot melt adhesive can be peeled.   The bonding method according to claim 6, wherein the material from which the hot melt adhesive can be peeled is silicon resin or rubber.   The bonding method according to claim 5, wherein the support is formed with a recess into which the object can be fitted.   The bonding method according to claim 1, wherein the pedestal is made of a transparent plastic.   The bonding method according to any one of claims 1 to 9, wherein the pedestal has a disk shape and an upper surface is curved inward.   The bonding method according to claim 10, wherein a diameter of the pedestal portion is smaller than a maximum length of the object.

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