JP2011018573A - Conductive paste - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive paste capable of forming an internal electrode layer thinner than before in laminated ceramic electronic parts, and a manufacturing method of the laminated ceramic parts formed by using the conductive paste.SOLUTION: The conductive paste includes a water soluble metal salt, an organic solvent, an organic binder, and water. When an electrode layer of a prescribed pattern is formed, a de-binder easily progresses since organic components are small in number, a thin layer metal film is obtained, and the laminated ceramic parts can be multi-stratified.

Description

  The present invention relates to a conductive paste, a method for manufacturing a metal film using the conductive paste, and a method for manufacturing a multilayer ceramic electronic component using the conductive paste.

  In recent years, electronic devices are becoming lighter, thinner, and smaller. Along with this, further miniaturization and higher capacity have been promoted in the multilayer ceramic electronic parts used in the electronic devices.

  The most effective method for reducing the size and increasing the capacity of a multilayer ceramic capacitor as an example of a multilayer ceramic electronic component is to make both the internal electrode layer and the dielectric layer as thin as possible (thinning), and It is to laminate as many as possible (multi-layering).

  The multilayer ceramic capacitor has a capacitor body having a multilayer structure in which a plurality of dielectric layers and internal electrode layers are alternately arranged. A pair of external terminal electrodes is formed at both ends of the capacitor body. This multilayer ceramic capacitor is manufactured by first stacking a plurality of ceramic green sheets and pre-fired internal electrode layers alternately in a necessary number to produce a pre-fired capacitor body, and then firing the pre-fired capacitor body. It is manufactured by forming a pair of external terminal electrodes at both ends. As the internal electrode layer before firing, an internal electrode paste film or a metal thin film having a predetermined pattern is used.

  Thus, when manufacturing the multilayer ceramic capacitor, the ceramic green sheet and the internal electrode layer before firing are fired simultaneously. For this reason, the conductive material contained in the internal electrode layer before firing has a sintering temperature close to the sintering temperature of the dielectric material powder contained in the ceramic green sheet, does not react with the dielectric powder, It is required not to diffuse into the dielectric layer.

  Conventionally, in order to satisfy these requirements, noble metals such as Pt and Pd have been used for the conductive material contained in the internal electrode layer before firing. However, the noble metal itself is expensive, and as a result, there is a disadvantage that the finally obtained multilayer ceramic capacitor is expensive. Therefore, it is widely known that the sintering temperature of the dielectric powder is lowered to 900 to 1100 ° C., and an Ag—Pd alloy is used as the conductive material included in the internal electrode layer before firing, or an inexpensive base metal such as Ni is used. (Patent Document 1).

  However, when Ni is used for the conductive material contained in the internal electrode layer before firing, the Ni contained in the conductive material during firing in a reducing atmosphere when the thickness of the internal electrode layer before firing is reduced. Since the particles are spheroidized by sintering and adjacent Ni particles are connected and aggregated, there is a limit to reducing the thickness of the internal electrode layer before firing. Moreover, since there is a limit to the particle size of the Ni powder itself, there is a limit to reducing the thickness.

  In addition, in order to reduce the thickness of the internal electrode layer before firing, a method for manufacturing an electrode layer using a metal resinate has been proposed (Patent Documents 2, 3, and 4).

  However, since the metal resinate has many organic components, it is difficult to remove the binder in the firing step. Further, when the binder is removed, the volume change is large, causing delamination and the like, which may deteriorate the characteristics of the electronic component. Furthermore, the metal resinate is expensive, and there is a problem that the multilayer ceramic electronic component is expensive.

Japanese Patent No. 3944495 JP-A-2005-79504 JP-A-7-14420 Japanese Patent Laid-Open No. 7-176448

  The present invention has been made in view of such a situation, and an object thereof is to form an internal electrode layer that is used to form an internal electrode of a multilayer ceramic electronic component and is much thinner than a conventional internal electrode layer. It is providing the electrically conductive paste which can be performed. Another object of the present invention is to provide a method for producing a metal film produced using such a conductive paste and a method for producing a multilayer ceramic electronic component.

  In order to achieve the above object, the conductive paste according to the present invention includes a water-soluble metal salt, an organic solvent, an organic binder, and water.

  Preferably, the water-soluble metal salt is a Ni salt.

  Preferably, the organic binder is soluble in the organic solvent.

  Preferably, the water-soluble metal salt dissolved in the water is dispersed in the organic solvent in the form of a W / O emulsion.

  Preferably, the content ratio of the W / O emulsion is 20% by weight or less, more preferably in the range of 12 to 18% by weight with respect to 100% by weight of the conductive paste.

  Preferably, the volume of the organic solvent is larger than the volume of the water.

  Preferably, the weight ratio of (organic solvent + organic binder) / (water + water-soluble metal salt) is 4% or more, more preferably in the range of 4 to 49%.

  The manufacturing method of the metal film which concerns on this invention has the process of heating in the atmosphere containing a water | moisture content in a reducing atmosphere using the electrically conductive paste in any one of the above.

  A method for manufacturing a multilayer ceramic electronic component according to the present invention includes a green ceramic in which a plurality of ceramic green sheets and internal electrode layers formed in a predetermined pattern using the conductive paste described above are alternately stacked. The laminate is fired.

  Preferably, the conductive paste is applied to the ceramic green sheet and dried to obtain a green ceramic laminate.

  By forming a metal film using the conductive paste according to the present invention, an extremely thin internal electrode layer can be formed. According to the present invention, since the water-soluble metal salt (for example, Ni salt) is used for the conductive paste for forming the internal electrode layer and Ni particles are not used as the conductive material, there is a limit to the thickness of the internal electrode layer. It is no longer bound by the Ni particle size. That is, in order to reduce Ni ions and deposit Ni to form a film, the thickness of the metal film (internal electrode layer) can be made extremely thin. Further, since Ni particles are not used, aggregation of Ni particles does not occur, and it is easy to produce a conductive paste, and a conductive paste can be produced at a lower cost than a conductive paste using Ni particles. Furthermore, since there are few organic components compared with the electrically conductive paste using a metal resinate, it can be easily debindered, so that a multilayer ceramic electronic component can be easily manufactured.

1 is a schematic cross-sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention.

  Hereinafter, the present invention will be described based on embodiments shown in the drawings. First, as an embodiment of the multilayer ceramic electronic component according to the present invention, a multilayer ceramic capacitor will be described as an example.

Multilayer Ceramic Capacitor As shown in FIG. 1, a multilayer ceramic capacitor 1 according to this embodiment includes a capacitor body 10 having a configuration in which dielectric layers 2 and internal electrode layers 3 are alternately stacked. A pair of external electrodes 4, 4 are formed at both ends of the capacitor body 10 and are electrically connected to the internal electrode layers 3 arranged alternately in the body 10. The internal electrode layers 3 are laminated so that the side end faces are alternately exposed on the surfaces of the two opposite ends of the capacitor body 10. The pair of external electrodes 4, 4 are formed at both ends of the capacitor body 10 and are connected to the exposed end surfaces of the alternately arranged internal electrode layers 3 to constitute a capacitor circuit.

  The outer shape and dimensions of the capacitor body 10 are not particularly limited and can be appropriately set according to the application. Usually, the outer shape is substantially a rectangular parallelepiped shape, and the dimensions are usually vertical (0.2 to 5.7 mm) × It can be about horizontal (0.1-5.0 mm) × height (0.1-5.0 mm).

  The dielectric layer 2 is formed by firing a ceramic green sheet, which will be described later, and the material thereof is not particularly limited. For example, the dielectric layer 2 is made of a dielectric material such as calcium titanate, strontium titanate and / or barium titanate. . In this embodiment, the thickness of the dielectric layer 2 is preferably 3 μm or less, more preferably 2 μm or less.

  The internal electrode layer 3 is formed by firing a conductive paste having a predetermined pattern which will be described later. The thickness of the internal electrode layer 3 is preferably 1 μm or less, more preferably 0.7 μm or less.

  As the material of the external electrode 4, copper, a copper alloy, nickel, a nickel alloy, or the like is usually used, but silver, a silver-palladium alloy, or the like can also be used. The thickness of the external electrode 4 is not particularly limited, but is usually about 10 to 50 μm.

Method for Manufacturing Multilayer Ceramic Capacitor Next, an example of a method for manufacturing the multilayer ceramic capacitor 1 according to this embodiment will be described. First, a dielectric paste is prepared in order to manufacture a ceramic green sheet that will form the dielectric layer 2 shown in FIG. 1 after firing.

Production of Dielectric Paste First, a dielectric paste for forming a ceramic green sheet was produced. Preparation of BaTiO ₃ ceramic powder, polyvinyl butyral resin (PVB) (polymerization degree: 800) as an organic binder, propyl alcohol, xylene, methyl ethyl ketone, 2-butoxyethyl alcohol as a solvent, and dioctyl phthalate as a plasticizer did. Next, 6 parts by weight of PVB, 150 parts by weight of solvent, and plasticizer are weighed with respect to 100 parts by weight of ceramic powder, and kneaded with a zirconia ball having a diameter of 2 mm in a ball mill for 21 hours to form a slurry and dielectric. A body paste was obtained. The plasticizer was added in an amount of 50 parts by weight with respect to 100 parts by weight of polyvinyl butyral.

Formation of a ceramic green sheet, and a dielectric paste was applied to the surface of the PET film as a support subjected to a release treatment by a method such as a doctor blade, and dried to produce a green sheet. . The thickness of the green sheet is preferably about 0.5 to 30 μm, more preferably about 0.5 to 10 μm, and still more preferably about 0.5 to 5 μm.

Production of Conductive Paste Next, a conductive paste for forming the internal electrode layer 3 was produced. The conductive paste contains a water-soluble metal salt, an organic solvent, an organic binder, and water.

  Although it does not specifically limit as water-soluble metal salt, Carbonate, acetate, nitrate, sulfate, formate, etc. are mentioned, Among these, formate or acetate is preferable. Ni is preferable as the metal component. Further, nickel formate and nickel acetate having a relatively high Ni content are more preferable from the viewpoint that shrinkage of the multilayer ceramic electronic component in the binder removal step can be suppressed.

  Such a water-soluble metal salt is preferably contained in the conductive paste in an amount of 0.1 to 10% by weight, more preferably 0.1 to 1.0% by weight.

  The organic solvent is not particularly limited, but preferably contains terpinyl acetate as a main component. The content of terpinyl acetate in the total organic solvent is preferably 95% by weight or more, and more preferably 100% by weight. Solvents that can be used in combination with terpinyl acetate in trace amounts include α-terpinyl acetate, isobornyl acetate, isobornyl propionate, isobornyl butyrate, isobornyl isobutyrate, dihydro Examples include terpinyl acetate, dihydroterpinyl methyl ether, terpineol, and butyl carbitol.

  The organic solvent is preferably contained in the conductive paste in an amount of 1000 to 100,000 parts by weight, more preferably 5000 to 10,000 parts by weight with respect to 100 parts by weight of the water-soluble metal salt. If the amount of the organic solvent is too small, the paste viscosity becomes too high, and if it is too much, the paste viscosity becomes too low.

  The organic binder is not particularly limited, but preferably contains ethyl cellulose as a main component. The content of ethyl cellulose in the organic binder is preferably 95% by weight or more, and more preferably 100% by weight. Examples of resins that can be used in combination with ethyl cellulose, although very small, include polyvinyl butyral and acrylic resins.

  The organic binder is preferably contained in the conductive paste in an amount of 1000 to 10,000 parts by weight with respect to 100 parts by weight of the water-soluble metal salt. If the amount of the binder is too small, the film strength after printing tends to decrease. If the amount is too large, the ratio of the metal salt in the electrode pattern before firing decreases, and the smoothness of the internal electrode formed after firing is maintained. Can not do it. Moreover, there are a plasticizer, a leveling agent, and the like that can be contained together with an organic solvent and an organic binder although the amount is extremely small.

  The organic binder is preferably soluble in an organic solvent. And it is preferable that the water-soluble metal salt melt | dissolved in water disperse | distributes in an organic solvent, and becomes a W / O emulsion. The content ratio of the W / O emulsion is preferably 20% by weight or less, more preferably in the range of 12 to 18% by weight with respect to 100% by weight of the conductive paste. The volume of the organic solvent is preferably larger than the volume of water.

  The weight ratio of (organic solvent + organic binder) / (water + water-soluble metal salt) is preferably 4% or more, more preferably in the range of 4 to 49%.

  The conductive paste may contain a plasticizer for improving adhesion. Examples of the plasticizer include phthalic acid esters such as benzylbutyl phthalate (BBP), adipic acid, phosphoric acid esters, glycols, and the like. In the present embodiment, preferably, dioctyl adipate (DOA), butyl butylene glycol phthalate (BPBG), didodecyl phthalate (DDP), dibutyl phthalate (DBP), benzyl butyl phthalate (BBP), dioctyl phthalate ( DOP), dibutyl sebacate and the like are used. Of these, dioctyl phthalate (DOP) is particularly preferable. The plasticizer is contained in an amount of preferably 25 to 150 parts by weight, more preferably 25 to 100 parts by weight, with respect to 100 parts by weight of the organic binder. By adding the plasticizer, the adhesive force of the electrode layer formed using the paste is increased, and the adhesive force between the electrode layer and the green sheet is improved. In order to obtain such an effect, the amount of the plasticizer added is preferably 25 parts by weight or more.

  In order to stabilize the W / O emulsion, a nonionic, anionic or cationic surfactant may be added.

When the viscosity of the conductive paste is measured under the conditions of a spindle (SC _4-14 ) / chamber (6R), a liquid temperature of 25 ° C., and a slip rate of 4S ⁻¹ using a VISCMETR HBDVI + manufactured by BROOKFIELD, preferably 1 to 20 Pa · s, more preferably 3 to 15 Pa · s. If the viscosity is too low, the ink is blurred.

  Since the conductive paste of this embodiment contains terpinyl acetate as an organic solvent, the viscosity change with time is small. Specifically, the viscosity change rate when measuring the viscosity V0 at the time of adjustment, the viscosity V1 after 1 day of standing, the viscosity V7 after 7 days of standing, and the viscosity V30 after 30 days of standing are extremely high. It is small and changes in viscosity with time are suppressed.

  The conductive paste can be obtained by kneading the above components with a ball mill or the like to form a slurry.

Formation of Electrode Layer Next, on the surface of the ceramic green sheet formed on the carrier sheet, an electrode layer (internal electrode pattern) having a predetermined pattern to be the internal electrode layer 3 shown in FIG. Form.

  The thickness of the electrode layer is 0.5 μm or less, preferably 0.1 to 0.3 μm. If the thickness of the electrode layer is too thick, the number of stacked layers must be reduced, the acquired capacity is reduced, and it is difficult to increase the capacity. On the other hand, if the thickness is too thin, it is difficult to form uniformly, and electrode breakage is likely to occur.

  The thickness of the electrode layer is in the above range in the current technology, but it is more desirable that the thickness of the electrode layer is as thin as possible without causing electrode breaks.

  The method for forming the electrode layer is not particularly limited as long as the layer can be formed uniformly, but in this embodiment, a screen printing method using a conductive paste is used.

Next, green chip fabrication, firing, etc. Next, a plurality of green sheets with internal electrode patterns of a predetermined pattern formed on the surface as described above are laminated to produce a green chip, and a binder removal process, a firing process, and so on. An external electrode paste is printed or transferred to a capacitor body 10 composed of a sintered body, which is formed through an annealing process performed in accordance with this, and fired to form external electrodes 4, 4. The capacitor 1 is manufactured. The green chip firing step is performed by heat treatment in a reducing atmosphere and in an atmosphere containing moisture.

Effects of the present embodiment In the present embodiment, the conductive paste contains a water-soluble metal salt, an organic solvent, an organic binder, and water. For this reason, a much thinner internal electrode layer can be formed as compared with the conductive paste using Ni particles as the conductive material. Further, it is possible to easily form an inexpensive and highly functional internal electrode layer as compared with the case of using a metal resinate.

  From the above, the conductive paste of this embodiment is extremely useful for reducing the size and increasing the capacity of the final electronic component.

Other Embodiments Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. it can.

  For example, in the above-described embodiment, the multilayer ceramic capacitor is exemplified as the electronic component according to the present invention. However, the electronic component according to the present invention is not limited to the multilayer ceramic capacitor and can be applied to a multilayer ceramic substrate or the like. It is.

  Hereinafter, the present invention will be described based on further detailed examples, but the present invention is not limited to these examples.

Preparation of conductive paste First, 4.8 g of nickel acetate tetrahydrate was dissolved in 100 g of ion-exchanged water to prepare a first liquid. Next, 100 g of ethylcellulose as an organic binder is dissolved in 300 g of terpinyl acetate as an organic solvent, and a spindle (SC _4-14 ) / chamber (6R), a liquid temperature of 25 ° C., a slip rate of 4 S using a VISCMETR HBDVI + manufactured by BROOKFIELD. 400 g of a second liquid having a viscosity of 1 to 20 Pa · s when measured under the condition of ⁻¹ .

  While stirring the second liquid, the first liquid was added dropwise to the second liquid at 0.2 μl / s using a micropipette. Then, it stirred for 2 hours with the media mill using a micro media, and produced the electrically conductive paste which is a W / O emulsion.

Preparation of Dielectric Paste BaTiO ₃ -based ceramic powder, polyvinyl butyral (PVB) as an organic binder, and methanol as a solvent were prepared. Next, 10% by weight of organic binder and 150% by weight of solvent were weighed with respect to the ceramic powder, kneaded with a ball mill, and slurried to obtain a dielectric paste.

Formation of Metal Film The dielectric paste was applied to a predetermined thickness on a PET film by a doctor blade method and dried to form a ceramic green sheet having a thickness of 1 μm. Next, on the ceramic green sheet, the transmission volume is adjusted by plate making so that the amount of the conductive paste adhered is 0.4 mg / cm ^2, and a conductive paste film having a thickness of about 0.2 μm is formed by screen printing. Formed.

  The conductive paste film was heat-treated (800 ° C., 10 min) in an atmosphere with a hydrogen concentration of 3% and a dew point of 30 ° C. to form a metal film.

The obtained metal film had continuity, and when the specific resistance of the metal film was measured, it was 6.9 × 10 ⁻⁵ Ω · cm, which was almost the same as the theoretical value of Ni.

  From the above, a metal film having almost no defect is formed, and when the cross section of the film is measured by SEM, the thickness of the metal film is about 100 nm, and it is confirmed that an extremely thin metal film can be formed. did it.

  In general, reduction firing is used in a multilayer ceramic electronic component having a base metal such as Ni or Cu as an internal electrode to suppress metal oxidation. For this reason, an ultrathin internal electrode layer can be formed by forming a metal film using the conductive paste according to the present invention. According to the present invention, since the water-soluble metal salt (for example, Ni salt) is used for the conductive paste for forming the internal electrode layer and Ni particles are not used as the conductive material, there is a limit to the thickness of the internal electrode layer. It is no longer bound by the Ni particle size. That is, in order to reduce Ni ions and deposit Ni to form a film, the thickness of the metal film (internal electrode layer) can be made extremely thin. Further, since Ni particles are not used, aggregation of Ni particles does not occur, and it is easy to produce a conductive paste, and a conductive paste can be produced at a lower cost than a conductive paste using Ni particles. Furthermore, since there are few organic components compared with a metal resinate, it can be easily debindered, so that a multilayer ceramic electronic component can be easily manufactured.

  Moreover, a more homogeneous alloy film can also be formed by using other water-soluble metal salt with Ni salt as water-soluble metal salt for the electrically conductive paste of this invention.

  In the above embodiment, a metal film having a thickness of 100 nm can be formed. Needless to say, a metal film having an arbitrary thickness can be formed by changing the metal ion concentration of the first liquid.

DESCRIPTION OF SYMBOLS 1 ... Multilayer ceramic capacitor 2 ... Dielectric layer 3 ... Internal electrode layer 4 ... External electrode 10 ... Capacitor body

Claims (10)

  A conductive paste containing a water-soluble metal salt, an organic solvent, an organic binder, and water.   The conductive paste according to claim 1, wherein the water-soluble metal salt is a Ni salt.   The conductive paste according to claim 1, wherein the organic binder is soluble in the organic solvent.   The conductive paste according to claim 1, wherein the water-soluble metal salt dissolved in water is dispersed in the organic solvent in the form of a W / O emulsion.   The conductive paste according to claim 4, wherein a content ratio of the W / O emulsion is 20% by weight or less with respect to 100% by weight of the conductive paste.   The conductive paste according to claim 1, wherein a volume of the organic solvent is larger than a volume of the water.   The conductive paste according to claim 1, wherein a weight ratio of (organic solvent + organic binder) / (water + water-soluble metal salt) is 4% or more.   The manufacturing method of the metal film which has the process of heating in the atmosphere containing a water | moisture content in a reducing atmosphere using the electrically conductive paste in any one of Claims 1-7.   A multilayer ceramic electronic component for firing a green ceramic laminate in which a plurality of ceramic green sheets and internal electrode layers formed in a predetermined pattern using the conductive paste according to any one of claims 1 to 7 are alternately stacked. Manufacturing method.   The method for producing a multilayer ceramic electronic component according to claim 9, wherein the conductive paste is applied to the ceramic green sheet and dried to obtain a green ceramic multilayer body.

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