JP2011014735A - Method of moving chip, and tool for moving the chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of securely holding a chip upright in a simple manner.SOLUTION: A method of moving a rectangular chip includes: stacking a first tray having the chip in a pocket, a flat plate type tool, and a second tray in this order using the tool for moving the rectangular chip from the first tray to the second tray, the tool having a through-hole having a first opening facing the first tray, a second opening facing the second tray, and an inclined surface between the first opening and second opening such that the second opening is wider than the thickness of the chip and narrower than the length of short sides forming the rectangular surface of the chip; and moving the first tray and second tray so as to reverse the stacking direction of the first tray and second tray while maintaining the state wherein the first tray and second tray are stacked.

Description

  The present invention relates to a technique for mounting an electronic component and an optical component chip with their device surfaces perpendicular to a mounting substrate, and more particularly to a method for moving a chip to an upright state and a jig therefor.

2. Description of the Related Art In recent years, modules such as electronic components and optical components for mounting devices with their device surfaces standing vertically with respect to a mounting substrate have been proposed.
Examples of the device for that purpose include an optical component, a light emitting element, a light receiving element, and a magnetic sensor in an electronic azimuth meter. These are devices formed on a substrate such as a semiconductor such as silicon, glass, ceramics, metal, etc. using a thin film process or a MEMS process. It is a device for detecting a physical quantity having directionality such as.
FIG. 8 shows an arrangement example of magnetic sensors in the three-axis electronic azimuth meter 1. In the three-axis electronic azimuth meter 1, a signal processing IC 2 is arranged on a module substrate 6, and an X-axis magnetic sensor 3, a Y-axis magnetic sensor 4, and a Z-axis magnetic sensor 5 corresponding to an orthogonal coordinate system are arranged. The Z-axis magnetic sensor 5 is arranged to be perpendicular to the module substrate 6.
When a module is configured using a magnetic sensor that detects a magnetic field in the in-plane direction of the substrate, such as an MR sensor, an MI sensor, or a thin film fluxgate sensor, in order to detect a magnetic field perpendicular to the module substrate, a sensor element It is necessary to mount the sensor element chip upright so that the surface on which the is formed is perpendicular to the module substrate.

In order to stand the device vertically as described above, an apparatus called a parts feeder is conventionally used.
In addition, there is a method in which a stage having a collet and a groove or a rotation mechanism is used to rotate 90 degrees while adsorbing and moving the chips one by one with the collet.
FIG. 9 is a process diagram showing a method of standing a chip using a stage having a collet and a groove. (A) The collet 11 is moved to the chip 10. (B) The chip 10 is adsorbed using the collet 11. (C) The chip 10 adsorbed by the collet 11 is moved onto the groove of the stage 12 having the groove, and the chip 10 is released to stand the chip 10. (D) The chip 10 standing in the groove of the stage 12 having the groove is adsorbed by the collet 11. (E) The chip 10 standing on the mounting substrate 13 is moved and mounted using the collet 11.
FIG. 10 is a process diagram showing a method of standing a chip using a stage having a collet and a rotation mechanism. (A) The collet 11 is moved to the chip 10. (B) The chip 10 is adsorbed using the collet 11. (C) The chip 10 adsorbed by the collet 11 is moved onto a stage 14 having a rotation mechanism, and the chip 10 is released. (D) The stage 14 is rotated to raise the chip 10, and the standing chip 10 is adsorbed by the collet 11. (E) The chip 10 standing on the mounting substrate 13 is moved and mounted using the collet 11.

Japanese Patent Laid-Open No. 06-275664

When a chip is erected using a parts feeder, the chips rub against each other, so that the chip is easily damaged and chipped, and is not suitable for a device such as silicon or an optical component that is easily damaged or chipped. In addition, dust generated by rubbing between chips may be mixed as foreign matter.
When a chip is set up using a collet, it is necessary to pick up and move the chip one chip at a time, so that it takes time and precise control of the collet is required, which increases the cost of the apparatus. .
An object of the present invention is to provide a method for moving a chip, which is less likely to damage the chip, has a low manufacturing cost, and can be reliably moved so that the side surface of the chip becomes the bottom surface.

A method of moving a chip according to claim 1 of the present invention is a flat jig for moving a rectangular chip from a first tray to a second tray, and the jig includes at least a through hole. The through hole has a first opening toward the first tray and a second opening toward the second tray, the first opening and the second opening. An inclined surface that restricts the movement of the chip to change the direction of the chip in the vertical direction, and the second opening has a width wider than the thickness of the chip and a rectangular surface of the chip Using the jig having a width narrower than the length of the short side forming the first tray, the first tray provided with the chip in the pocket, the jig, and the second tray, A state in which the first tray and the second tray are overlapped. While lifting, including a step of overlapping direction of said first tray and said second tray moves to reverse.
A method for moving a chip according to a second aspect of the present invention uses the second tray according to the first aspect, wherein a surface on which the chip moves from the first tray forms a flat surface.
According to a third aspect of the present invention, there is provided a method for moving a chip according to the first aspect, wherein the surface from which the chip moves from the first tray forms the second tray that forms the bottom surface of a pocket in which the chip is vertically accommodated. Use.
A method for moving a chip according to a fourth aspect of the present invention uses the second tray according to the second or third aspect, wherein the surface on which the chip moves has adhesiveness.
A jig according to claim 5 of the present invention is a flat jig for moving a rectangular chip from the first tray to the second tray, and the jig has a through hole at least in the chip. The through hole has a first opening toward the first tray and a second opening toward the second tray, and is provided between the first opening and the second opening. Provided with an inclined surface that restricts the movement of the chip and changes the direction of the chip in the vertical direction, the first opening has the same dimensions as the pocket of the first tray, and the second opening It has a width wider than the thickness of the chip and a width narrower than the length of the short side forming the rectangular surface of the chip.

The method of moving the chip according to the present invention has the advantage that the chip can be erected simply by making the two trays on both sides of the jig move upside down.
In addition, since the width of the opening of the tip of the tip in the through-hole of the jig is wider than the thickness of the tip and narrower than the short side forming the rectangular surface of the tip, the tip does not stand upright or 180 degrees Defects such as inversion can be reduced.
Since the chips only come into contact with the tray and the jig, the chips do not rub against each other and can be erected without any scratches or chipping.

It is a top view which shows the jig | tool which concerns on this invention. It is sectional drawing which shows the (a)-(b) cut surface of FIG. It is a perspective view which shows the state which stood the chip | tip. It is sectional drawing which shows the jig | tool of another embodiment. It is a figure which shows the process of fitting the jig | tool of this invention, a chip tray, and an adhesive tray. It is a figure which shows the process of rotating the jig | tool fitted, the chip tray, and the adhesion tray. It is the schematic which shows the state at the time of using a chip tray instead of an adhesive tray. It is a perspective view which shows the example of arrangement | positioning of the magnetic sensor in a 3-axis electronic compass. It is process drawing which shows the method of standing a chip | tip using a collet and the stage which has a groove | channel. It is process drawing which shows the method of standing a chip | tip using a collet and the stage which has a rotation mechanism.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a view showing a jig 20 for vertically standing a chip 10 according to the present invention. FIG. 2 is a cross-sectional view showing a cut surface (a)-(b) in FIG. 1.
The jig 20 has a rectangular flat plate shape. However, the shape of the jig 20 is not necessarily limited to a rectangle, and an arbitrary shape such as a circle can be preferably used according to an embodiment. The flat jig 20 is provided with through holes 27 that penetrate both sides of the flat plate. The first surface 21 has a first opening 23 for receiving the chip 10, and the second surface 22 has a second opening 24 for feeding the chip 10. Inside the through hole 27, an inclined surface 25 is formed for changing the chip 10 from a lying state to an upright state.
FIG. 3 is a perspective view showing a state where the chip 10 is erected. Typically, the chip 10 is a rectangle having a width W, a length L, and a thickness T. Two narrow surfaces 62 each having a width W and a thickness T are used as an upper surface and a bottom surface, and two wide surfaces 63 each having a width W and a length L are provided as two side surfaces.
The size of the first opening 23 is approximately the same as the size of the surface 63 formed by the width W and the length L of the chip 10 and is a size through which the chip 10 can pass. The size of the second opening 24 is approximately the same as the surface 62 having the thickness T and the width W of the chip 10 and is a size through which the chip 10 can pass.
The size of the opening of the jig 20 will be described in detail. The width W1 of the jig 20 on the side that is widened by the inclined surface 25 of the first opening 23 is wider than the length L in the height direction when the chip 10 is stood vertically in order to receive the chip 10. There must be. In other words, the width W1 needs to be wider than the length L of the short side forming the rectangular surface of the chip 10. That is, the first opening 23 satisfies W1> L.
In order to take out the chip 10, the width W <b> 2 of the second opening 24 of the jig 20 must be wider than the thickness T of the chip 10. Further, since it is necessary to change the direction of the chip 10 to make it stand upright from the sleeping state, the width W2 of the second opening 24 of the jig 20 is the height direction when the chip 10 is stood vertically. Needs to be narrower than the length L. That is, the second opening 24 satisfies T <W2 <L.
The inclined surface 25 is a flat surface and is provided as a surface that is inclined so that the opening becomes narrower from the first opening 23 toward the second opening 24.
Further, a frame 26 is provided on the outer side of the jig 20 as a fitting portion for fitting with a recess of a tray described later.
As a material of the jig 20, PP (polypropylene), PPS (polyphenylene sulfide), PS (polystyrene), or the like is used to prevent the chip 10 from being attached to the jig 20 due to static electricity and causing the desired rotation of the chip 10. Conductive resin, ABS (acrylonitrile butadiene styrene) resin using antistatic processing, Teflon (registered trademark) resin, metal, or the like can be preferably used.

FIG. 4 is a cross-sectional view showing a jig 40 according to another embodiment. As shown in FIG. 4, the jig 40 has an inclined surface 45 having an R-shaped cross section and an overall 1/4 cylindrical shape. The jig 40 has a rectangular flat plate shape. However, the shape of the jig 40 is not necessarily limited to a rectangle, and an arbitrary shape such as a circle can be preferably used according to an embodiment. The flat jig 40 is provided with through holes 47 that penetrate both surfaces of the flat plate. The first surface 41 has a first opening 43 for receiving the chip 10, and the second surface 42 has a second opening 44 for feeding the chip 10. Inside the through hole 47, an inclined surface 45 for changing the direction of the chip 10 to the vertical direction is provided. As the inclined surface 45, not only a quarter cylindrical shape but also an inclined surface having an arbitrary curvature that can change the chip from a lying state to an upright state can be used.
The size of the first opening 43 is about the same as the size of the surface 63 composed of the width W and the length L of the chip 10 and is a size through which the chip 10 can pass. The size of the second opening 44 is approximately the same as the surface 62 having the thickness T and the width W of the chip 10 and is a size through which the chip 10 can pass.
The size of the opening of the jig 40 will be described in detail. The width W1 of the side of the jig 40 that is widened by the inclined surface 45 of the first opening 43 is wider than the length L in the height direction when the chip 10 is stood vertically in order to receive the chip 10. There must be. In other words, the width W1 needs to be wider than the length L of the short side forming the rectangular surface of the chip 10. That is, the first opening 43 satisfies W1> L.
In order to take out the chip 10, the width W <b> 2 of the second opening 44 of the jig 40 must be wider than the thickness T of the chip 10. In addition, since it is necessary to change the orientation of the chip from the sleeping state to the upright state, the width W2 of the second opening 44 of the jig 40 is the length in the height direction when the chip 10 is erected vertically. Must be narrower than L. That is, the second opening 44 satisfies T <W2 <L.
The inclined surface 45 has an R-shaped cross section and has a 1/4 cylindrical shape as a whole, and is provided as a surface that is inclined so that the opening narrows from the first opening 43 toward the second opening 44. It is done. Since there is no corner from the inclined surface 45 to the second opening 44, the chip 10 is more difficult to be damaged.
Further, a frame 46 which is a fitting portion for fitting with a recess of a tray which will be described later is provided on the outer side portion of the jig 40.
As a material of the jig 40, PP (polypropylene), PPS (polyphenylene sulfide), PS (polystyrene), or the like is used in order to prevent the chip 10 from rotating due to static electricity. Conductive resin, ABS (acrylonitrile butadiene styrene) resin using antistatic processing, Teflon (registered trademark) resin, metal, or the like can be preferably used.

Hereinafter, a method of moving the chip 10 by rotating it 90 degrees will be described.
First, an embodiment in which a chip tray 30 is used as the first tray and an adhesive tray 32 is used as the second tray will be described. FIG. 5 is a diagram showing a process of fitting the jig 20 of the present invention with the chip tray 30 and the adhesive tray 32. As shown in FIG. 5A, first, the plurality of chips 10 are placed on the chip tray 30 in a state in which they are laid down so that the wide surface of the chips 10 faces up. In general, a device formed on a wafer or a substrate is separated into pieces by dicing and placed on a chip tray 30 using an apparatus called a chip sorter. The chip tray 30 as the first tray includes a pocket 35 for placing the chip 10 in a lying state and a recess 31 that is a fitting portion for fitting with the jig 20. At this time, the size of the pocket 35 of the chip tray 30 is preferably about several hundreds of um larger than the size of the chip 10 so that the chip 10 is difficult to move or rotate and the chip 10 is not clogged in the pocket 35. The adhesive tray 32 as the second tray includes an adhesive surface 34 for adhering the moving chip 10 and a recess 33 that is a fitting portion for fitting with the jig 20. As shown in FIG. 5B, after the chips are arranged on the chip tray 30, the jig 20 is fitted into the chip tray 30, and on the opposite side, the adhesive tray 32 and the adhesive surface 34 are attached to the jig 20. Fit so that it faces the inside. As shown in FIG. 5C, at this time, the chip 10 is arranged so that the upper surface faces the direction in which the jig is inclined when the chip 10 is rotated 90 degrees. As the jig, the jig shown in FIG. 4 can be used in addition to the jig shown in FIG.

The process of rotating the fitted jig | tool 20, the chip tray 30, and the adhesion | attachment tray 32 is shown. First, as shown to Fig.6 (a), it exists in the state in which the side where the jig | tool 20 inclined was turned down. As shown in FIG. 6E, the chip tray 30, the jig 20 and the adhesive tray 32 in the fitted state are reversed so that the overlapping direction of the chip tray 30, the jig 20 and the adhesive tray 32 is reversed. , Rotate 180 degrees. As shown in FIGS. 6B, 6 </ b> C, and 6 </ b> D, by rotating 180 degrees in one direction, the chip 10 disposed in the chip tray 30 is inclined to the through hole 27 of the jig 20. It falls to the adhesive tray 32 side along the surface 25. Since the width W2 of the second opening 24 on the adhesive tray 32 side of the jig 20 is narrower than the height L when the chip 10 is erected, the chip 10 does not rotate or is reversed 180 degrees. Such defects can be reduced. The fitted jig 20, chip tray 30 and adhesive tray 32 are rotated 180 degrees, and the chip 10 stands vertically on the adhesive tray 32 in a state where the adhesive surface 34 of the adhesive tray 32 faces upward. Aligned by state. Thereafter, the chip tray 30 and the adhesive tray 32 are removed from the jig 20. Since the adhesive tray 32 is used, the chips 10 can be stably aligned even when the chips are erected, and the chip 10 can be prevented from falling when it is vibrated or moved.
Since the mechanism for rotating the chip tray 30, the jig 20, and the adhesive tray 32 in a fitted state can be realized by a simple device, an inexpensive device configuration is possible. Moreover, you may rotate manually.
Since a plurality of chips 10 are rotated together using a tray, a large number of chips 10 can be rotated at a time, and productivity is high.

In the above embodiment, the adhesive tray 32 is used as the second tray, but a tray or a substrate coated with an adhesive may be used. By using a tray or substrate coated with an adhesive instead of the adhesive tray 32, the adhesive is applied to the lower surface when the chip is turned upright by 90 degrees. By mounting on the module substrate before the adhesive is dried, the step of applying an adhesive for fixing the chip to the substrate when mounting on the module substrate can be omitted.
Further, the chip tray 50 may be used as the second tray. FIG. 7 is a schematic view showing a state in which a chip tray 50 is used instead of the adhesive tray. The chip tray 50 has a pocket, and the surface from which the chip moves from the first tray is the bottom surface of the pocket 55, and the chip 10 is placed vertically in the pocket 55. Similarly to the case where the adhesive tray 32 is used as the second tray in the above-described embodiment, the chip 10 is placed on the chip tray 30 as the first tray with its wide surface facing up. Then, the jig 20 and the chip tray 50 as the second tray are fitted. Thereafter, similarly to the case where the adhesive tray 32 is used as the second tray in the above embodiment, the trays are rotated so that the overlapping in the vertical direction is opposite. By this rotation, the chip 10 arranged in the first tray 30 falls to the chip tray 50 side having the pocket 55 along the inclination of the jig 20. The chip is placed in the pocket 55 of the second tray 50 in a standing state. By removing the second tray 50 from the jig 20, the chip 10 can be moved or stored while standing.

In the present embodiment, the fitting is realized by fitting the frames 26 and 46 that are fitting portions of the jigs 20 and 40 and the recesses 31 and 33 that are fitting portions of the respective trays. 20 and any means capable of maintaining the overlapping state of each tray.
Here, an example in which the chip 10 after wafer separation is assumed has been described, but the present invention can also be used for resin package chips such as SON (Small Outline Non-leaded Package) and QFN (Quad Flat No Lead Package). Can do.
Here, a three-axis electronic azimuth meter using a magnetic sensor that detects a magnetic field in the in-plane direction of the substrate, such as an MR sensor, an MI sensor, or a thin film fluxgate sensor, has been described. Can be used. If it is a sensor, a 3-axis gyro sensor, a 3-axis acceleration sensor, etc. will be mentioned, for example. Also, it can be widely used for electronic component chips, and in fields other than sensors, for example, light emitting elements such as LEDs and LDs, optical parts such as lenses, light receiving elements such as CCDs, etc. need to be upright depending on the mounting state. In some cases, the present invention can be utilized.

1 3 axis electronic compass, 2 signal processing IC, 3 X axis magnetic sensor 4 Y axis magnetic sensor, 5 Z axis magnetic sensor, 10 chip, 11 collet 12 stage with groove, 13 mounting substrate, 14 stage with rotating mechanism 20 Jig, 21 One side, 22 Other side, 23 First opening 24 Second opening, 25 Inclined surface, 26 Frame, 30 Chip tray 31 Recess, 32 Adhesive tray, 33 Recess, 34 Adhesive surface 35 Pocket, 40 Jig, 41 One side, 42 Other side 43 First opening, 44 Second opening, 45 Inclined surface, 46 Frame 50 Chip tray, 55 Pocket where chips fit vertically

Claims (5)

A flat jig for moving a rectangular chip from the first tray to the second tray,
The jig has at least as many through holes as the number of chips.
The through-hole includes a first opening toward the first tray and a second opening toward the second tray, and the chip moves between the first opening and the second opening. With an inclined surface that changes the direction of the chip in the vertical direction by limiting
The second opening has a width wider than the thickness of the chip, and a jig having a width narrower than the length of the short side forming the rectangular surface of the chip,
A step of sequentially stacking the first tray having the chip in the pocket, the jig, and the second tray;
Moving the first tray and the second tray so that the overlapping direction of the first tray and the second tray is reversed while maintaining the state where the first tray and the second tray are overlapped;
A method of moving a chip comprising:   2. The method of moving a chip according to claim 1, wherein the second tray is used in which a surface on which the chip moves from the first tray forms a flat surface.   2. The method of moving chips according to claim 1, wherein the second tray is used in which a surface on which the chips move from the first tray forms a bottom surface of a pocket in which the chips fit vertically.   The method of moving a chip according to any one of claims 2 and 3, wherein the second tray having an adhesive surface on which the chip moves is used. A flat jig for moving a rectangular chip from the first tray to the second tray,
The jig has at least as many through holes as the number of chips.
The through-hole includes a first opening toward the first tray and a second opening toward the second tray, and the chip moves between the first opening and the second opening. With an inclined surface that changes the direction of the chip in the vertical direction by limiting
The jig, wherein the second opening has a width wider than a thickness of the chip and a width narrower than a length of a short side forming a rectangular surface of the chip.

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