JP2011009261A - Pressurized ultrasonic vibration bonding method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressurized ultrasonic vibration bonding method and device suppressing a variation in bonding force, preventing reduction of the bonding force and reducing a time taken until coupling regardless of use of pressurized ultrasonic vibration bonding in bonding a lead wire to a thin substrate.SOLUTION: In the pressurized ultrasonic vibration bonding method, the thin substrate 11 is disposed on a predetermined table 10. Next, the conductive lead wire 12 is disposed on the substrate 11. Next, the lead wire 12 is bonded to the substrate 11 by applying ultrasonic vibration onto the lead wire 12 while putting pressure onto the predetermined table 10 side (pressurized ultrasonic vibration bonding). Here, in the pressurized ultrasonic vibration bonding, the pressure to the lead wire 12 is increased at least in two stages.

Description

  The present invention relates to a pressure-type ultrasonic vibration bonding method and a pressure-type ultrasonic vibration bonding apparatus, and is applied to, for example, ultrasonic vibration bonding of a conductive lead wire on a thin substrate.

  Conventionally, for example, as a method of joining an intermediate joint in a wire harness, pressurized ultrasonic vibration joining has been adopted. In the pressurization type ultrasonic vibration joining, a workpiece is placed on a predetermined member, and ultrasonic vibration is applied while pressing the workpiece. The workpiece is strongly bonded to a predetermined member by the energy of the pressing and ultrasonic vibration.

  Also in the field of semiconductors, a pressure-type ultrasonic vibration joining technique may be employed when mounting electronic components (see, for example, Patent Document 1).

JP 2004-6570 A

  By the way, there is an increasing demand for bonding a thin-film conductive lead to a substrate such as a thin glass having a thickness of 2 mm or less without damaging the glass substrate such as cracks. As a bonding method, a method using solder or paste may be considered. However, from the viewpoint of a simple bonding method, cost reduction, energy saving, and bonding at room temperature, it is expected that pressurized ultrasonic vibration bonding is adopted. The

  However, for example, when a lead wire is placed on the substrate and ultrasonic vibration is applied while applying pressure to the lead wire, bonding force variation occurs, bonding force decreases, or the time until bonding is long. There are harmful effects such as taking time.

  Therefore, the present invention suppresses the bonding force variation, prevents a decrease in the bonding force, even if the pressure type ultrasonic vibration bonding is used when bonding the lead wire to the thin substrate, and further reduces the bonding force. An object of the present invention is to provide a pressure-type ultrasonic vibration bonding method and a pressure-type ultrasonic vibration bonding apparatus that can shorten the time.

  In order to achieve the above object, the pressurization type ultrasonic vibration joining method according to claim 1 of the present invention includes (A) a step of placing a thin substrate on a predetermined table, and (B) a step on the substrate. And (C) joining the lead wire to the substrate by applying ultrasonic vibration on the lead wire while applying pressure to the predetermined table side. The step (C) is a step of increasing the pressure on the lead wire in at least two stages.

  According to a fifth aspect of the present invention, there is provided the pressurization type ultrasonic vibration welding apparatus according to the present invention, wherein the predetermined table in which a thin base is installed and the conductive lead wire is disposed on the base. A bonding tool that applies ultrasonic vibrations to the lead wire while applying a predetermined pressure to the table side; and a drive unit that controls driving of the bonding tool, the drive unit including the lead wire with respect to the lead wire Pressure control for increasing the pressure in at least two steps is performed on the bonding tool.

  In the present invention, the pressure applied to the lead wire is increased in at least two stages during the pressure type ultrasonic vibration bonding. Therefore, since the pressure drop of the bonding tool with respect to the lead wire can be suppressed in the second and subsequent pressure steps, the pressure necessary for bonding can be applied to the lead wire. As a result, the lead wire can be bonded to the substrate in a short time, a decrease in the bonding force to the substrate with respect to the lead wire can be prevented, and variations in bonding force can also be suppressed.

It is a figure which shows the structure of the pressurization type ultrasonic vibration joining apparatus which concerns on this invention. It is a figure for demonstrating the pressure control method of the bonding tool which concerns on this invention. It is a figure for demonstrating the speed control method of the bonding tool which concerns on this invention. It is a figure for demonstrating operation | movement of the pressurization type ultrasonic vibration bonding apparatus (especially bonding tool) which concerns on this invention. It is a figure for demonstrating operation | movement of the pressurization type ultrasonic vibration bonding apparatus (especially bonding tool) which concerns on this invention. It is a figure for demonstrating operation | movement of the pressurization type ultrasonic vibration bonding apparatus (especially bonding tool) which concerns on this invention. It is a figure for demonstrating operation | movement of the pressurization type ultrasonic vibration bonding apparatus (especially bonding tool) which concerns on this invention. It is a figure for demonstrating operation | movement of the pressurization type ultrasonic vibration bonding apparatus (especially bonding tool) which concerns on this invention. It is a figure for demonstrating operation | movement of the pressurization type ultrasonic vibration bonding apparatus (especially bonding tool) which concerns on this invention.

  The present invention relates to a pressure-type ultrasonic vibration bonding method and a pressure-type ultrasonic vibration bonding apparatus capable of ultrasonically bonding a conductive lead wire on a thin substrate. In the present invention, the base is a substrate or a substrate having a predetermined thin film (such as chromium or a transparent conductive film) formed on the upper surface. Further, the thickness of the substrate is, for example, about 2 mm or less. Hereinafter, the present invention will be specifically described with reference to the drawings showing embodiments thereof.

<Embodiment>
FIG. 1 is a diagram showing a configuration of a pressurized ultrasonic vibration bonding apparatus 100 according to the present invention. FIG. 1 is a view of the pressurized ultrasonic vibration bonding apparatus 100 as seen from the lateral direction.

  As shown in FIG. 1, the pressurized ultrasonic vibration bonding apparatus 100 includes an electric cylinder 1, a column (shaft) 2, a coupling 3, a rod 4, a contact tip 5, a vibration horn 6, a holder 7, and a super A sonic transducer 8, a pressure gauge (strain gauge) 9, and a predetermined table (for example, anvil) 10 are provided.

  A structure including the rod 4 and the contact tip 5 is referred to as a bonding tool 4.5. 1 is the y-axis direction, and the horizontal direction in FIG. 1 is the x-axis direction. Further, the x-axis and y-axis used in other drawings are the same directions as the x-axis and y-axis shown in FIG. In other drawings, a z-axis that is orthogonal to both the x-axis and the y-axis may be illustrated.

  The electric cylinder (which can be grasped as a drive unit) 1 can control the driving of the bonding tools 4 and 5. Specifically, the electric cylinder 1 can move the bonding tools 4 and 5 in the y-axis direction. Furthermore, the electric cylinder 1 can apply a predetermined pressure to the lead wire 12 via the contact tip 5. Note that the support column 2 is connected to the electric cylinder 1. Therefore, the driving force of the electric cylinder 1 is transmitted to the column portion 2.

  The coupling 3 is a part that connects the support column 2 and the rod 4. The power from the electric cylinder 1 is transmitted to the rod 4 via the support column 2.

  The rod 4 is supported by a holder 7, and the rod 4 is guided in the vertical direction inside the holder 7. A contact tip portion 5 is disposed at the tip portion of the rod 4 on the predetermined table 10 side. A vibration horn 6 is connected to the rod 4, and the ultrasonic vibration generated by the ultrasonic vibrator 8 is transmitted to the rod 4 through the vibration horn 6.

  The contact tip 5 is a part that is in contact with the workpiece (lead wire 12) during the ultrasonic vibration bonding process. A first concavo-convex shape of a predetermined pattern is formed on the contact surface of the contact tip 5 with the lead wire 12, and the first concavo-convex shape is further formed on the surface of the first concavo-convex shape. A plurality of smaller second uneven shapes are formed.

  A thin substrate 11 is installed on a predetermined table 10. Although not shown, at least one or more holes are formed on the upper surface of the predetermined table 10, and the base 11 is fixed to the predetermined table 10 by vacuum suction through the holes.

  The base 11 is a thin (2 mm or less) member such as ceramic, silicon, glass, or epoxy. Alternatively, the base 11 is a member in which a predetermined thin film is formed on these members (on the non-mounting side on the predetermined table 10). Further, the lead wire 12 to be ultrasonically bonded to the base 11 is a member of a thin film (about 100 μm) such as aluminum or copper, and has a linear shape having a predetermined line width (width in the x direction in FIG. 1). It has the shape of

  In a state where the conductive linear lead wire 12 is disposed on the base 11, the bonding tools 4 and 5 cause the lead wire 12 to apply a predetermined pressure toward the predetermined table 10 by the driving force from the electric cylinder 1. In addition, the bonding tools 4 and 5 apply ultrasonic vibration generated by the ultrasonic vibrator 8 on the lead wire 12.

  In the pressurized ultrasonic vibration bonding apparatus 100, a pressure gauge 9 is disposed in the coupling 2. More specifically, the pressure gauge 9 is disposed at a connection portion between the support column 2 and the rod 4. The pressure 9 can measure a pressure value at which the bonding tools 4 and 5 press the lead wire 12.

<Control of bonding tools 4 and 5 by electric cylinder 1>
The electric cylinder 1 controls the displacement of the bonding tools 4 and 5 in the y-axis direction, the speed of the bonding tools 4 and 5 in the y-axis direction, and the pressure value at which the bonding tools 4 and 5 press the lead wire 12. can do.

<Pressure control>
First, the pressure control with respect to the bonding tools 4 and 5 by the electric cylinder 1 will be described.

  A pressure value that is a measurement result output from the pressure gauge 9 is input to the electric cylinder 1 as needed. Thereby, the electric cylinder 1 can always monitor the pressure value applied to the lead wire 12 by the bonding tools 4 and 5. The electric cylinder 1 performs pressure control, which is control of the pressure applied to the lead wire 12 by the bonding tools 4 and 5, on the bonding tools 4 and 5 using the monitored pressure value.

  In the present embodiment, the bonding tools 4 and 5 apply ultrasonic vibration to the lead wire 12, and the electric cylinder 1 performs the following pressure control on the bonding tools 4 and 5. Specifically, the electric cylinder 1 performs pressure control on the bonding tools 4 and 5 to increase the pressure on the lead wire 12 in at least two stages.

  For example, pressure control for increasing the pressure in two steps by the electric cylinder 1 will be described with reference to FIG. Here, the vertical axis in FIG. 2 is a pressure value at which the bonding tools 4 and 5 press the lead wire 12, and the horizontal axis in FIG. 2 is time.

  In the pressure control for increasing the pressure in the two stages, first, the bonding tools 4 and 5 are lowered toward the lead wire 12, and the bonding tools 4 and 5 are brought into contact with the lead wire 12 at time T0.

  Thereafter, the pressure applied to the lead wire 12 by the bonding tools 4 and 5 increases. It is assumed that the pressure on the lead wire 12 by the bonding tools 4 and 5 reaches the first pressure P1 at time T1 due to the increase in pressure.

  When the pressure gauge 9 detects the arrival of the first pressure P1, the ultrasonic transducer 8 generates an ultrasonic wave in response to the detection. That is, at the detection timing, the bonding tools 4 and 5 start applying ultrasonic vibration to the lead wire 12. As a result, the bonding tools 4 and 5 apply pressure and ultrasonic vibration to the lead wires 12. As can be seen from the description, the measurement value transmitted from the pressure gauge 9 is received not only by the control unit (or the electric cylinder 1 including the control unit) but also by the ultrasonic transducer 8.

  Now, in a state where the pressure reaches the first pressure value P1 and the ultrasonic vibration is applied, the pressure applied to the lead wire 12 by the bonding tools 4 and 5 for a first predetermined period (for example, 30 ms). The increase is stopped (specifically, since the electric cylinder 1 stops driving the bonding tools 4 and 5, not only the pressure increase operation but also the pressure decrease operation is not performed).

  Here, even if the pressure increase to the lead wire 12 by the bonding tools 4 and 5 is stopped within the first predetermined period and the pressure is kept constant at the first pressure value P1, the ultrasonic vibration Due to the deformation of the lead wire 12 due to the above, the pressure from the bonding roots 4 and 5 applied to the lead wire 12 slightly decreases as shown in FIG.

  Now, after the first predetermined period (from time T2), the bonding tools 4 and 5 set the pressure to the lead wire 12 to the first pressure value P1 while maintaining the ultrasonic vibration application state to the lead wire 12. The pressure rises to a larger second pressure value P2.

  Then, while maintaining the ultrasonic vibration application state to the lead wire 12, the bonding tools 4 and 5 hold the pressure on the lead wire 12 at the second pressure value P2 for a second predetermined period (until time T3). To do.

  Here, in the first predetermined period, the lead wire 12 has already been deformed so much that the uneven shape of the contact tip portion 5 disposed at the tip of the rod 4 to be pressed is transferred. Therefore, the deformation amount of the lead wire 12 within the second predetermined period is very small. Therefore, the apparent pressure drop in the lead wire due to the very small amount of deformation within the second predetermined period is very gradual and remains at a very small pressure drop as shown in FIG. .

  The second pressure value P2 is a pressure value required for pressurizing ultrasonic bonding of the lead wire 12 to the base 11, and the first pressure value P1 is based on the required pressure value. A little small. The pressure values P1 and P2 should be determined in view of preventing damage to the thin base 11 and depend on the material and thickness of the base 11 and the lead wire 12. For example, when an aluminum lead wire 12 of about 100 μm is bonded to a glass substrate 11 of 2 mm or less, the first pressure value P1 is 0.10 to 0.15 MPa, and the second pressure value P2 is 0.15 to 0. .20 MPa can be employed.

  Unlike FIG. 2 described above, after applying the pressure at the second pressure value P2 to the lead wire 12 for a certain period of time, a third pressure value larger than the second pressure value P2 (third-stage pressure increasing step). ) May be applied to the lead wire 12 only for a certain period, and the electric cylinder 1 may control the pressure of the bonding tools 4 and 5. As described above, when applying three or more steps of pressure increase (increase the pressure step by step), the final pressure step is necessary to pressurize ultrasonically the lead wire 12 to the substrate 11. It is desirable that the pressure value be

<Descent control>
The electric cylinder 1 controls the lowering operation of the bonding tools 4 and 5 until the bonding tools 4 and 5 come into contact with the lead wire 12. The control of the descending operation will be described with reference to FIG. Here, the vertical axis in FIG. 3 is the displacement in the y-axis direction of the bonding tools 4 and 5 with the contact position of the lead wire 12 (the upper surface of the lead wire 12) being zero, and the horizontal axis in FIG. It is.

  In the lowering operation, first, the bonding tool is lowered at the first speed V1 at a constant speed until the height from the upper surface of the lead wire 12 to the tip of the bonding tools 4 and 5 reaches a predetermined height Y1. . Here, the predetermined height Y1 is, for example, 1 mm.

  Next (that is, after reaching the predetermined height Y1), the bonding tools 4, 5 are moved from the predetermined height Y1 until the bonding tools 4, 5 reach the upper surface of the lead wire 12 (until time tN). Lower at a constant speed at a second speed V2. Here, the second speed V2 is slower than the first speed V1.

  Each control sequence of the displacement and speed of each of the bonding tools 4 and 5 and the contact pressure with respect to the lead wire 12 is realized by using a control unit in which a predetermined program is installed. That is, a program including the above steps (steps of increasing pressure and steps of changing speed of bonding tools 4 and 5) for realizing the control sequence is created, and the program is installed in a control unit (not shown). And it implement | achieves because the said control part controls the electric cylinder 1 according to the said program.

  In addition, the said control part may be integrated in the electric cylinder 1, and another structure may be sufficient as it. Here, in the case of the separate configuration, the control unit receives the pressure value transmitted from the pressure gauge 9 as needed, and the control unit monitors the received pressure value and executes the above sequence. And the electric cylinder 1 which received the control signal from a control part implements the said pressure control and speed control with respect to the bonding tools 4 and 5 according to the said control signal.

<Description of operation>
Next, the operation of the pressure ultrasonic vibration bonding method using the pressure ultrasonic vibration bonding apparatus 100 will be described. In the following description of the operation, a case where the pressure applied by the bonding tools 4 and 5 to the lead wire 12 is increased in two stages (not three or more stages) will be mentioned. Further, the case where the control unit in which the program is installed is arranged in the electric cylinder 1 will be described.

  First, a thin substrate 11 is set on a predetermined table 10. Then, the substrate 11 is fixed to the predetermined table 10 by vacuum suction through a hole (not shown) provided in the predetermined table 10.

  A thin film lead wire 12 having conductivity is wound around a reel (not shown). After fixing the base body 11 to the predetermined table 10, the lead wire 12 is pulled out from the reel, and the lead wire 12 thus pulled out is arranged at a predetermined position on the base body 11.

  Next, the electric cylinder 1 controls the operation of the bonding tools 4 and 5 as follows according to a predetermined program installed in the control unit. The following operations of the bonding tools 4 and 5 will be described with reference to enlarged views showing configurations around the bonding tools 4 and 5, the substrate 11, and the lead wires 12 in FIG. 1.

  First, the electric cylinder 1 moves the bonding tools 4 and 5 to the first speed until the height from the upper surface of the lead wire 12 to the end of the contact tip 5 reaches a predetermined height Y1 (here, 1 mm). At V1 (for example, V1 = 250 mm / s), it is lowered at a constant speed (see FIGS. 3 and 4).

  Then, the displacement position of the end of the contact tip 5 reaches a height of 1 mm from the upper surface of the lead wire 12. Thereafter, the electric cylinder 1 lowers the bonding tools 4 and 5 at the second speed V2 at a constant speed until the end of the contact tip 5 reaches the upper surface of the lead wire 12 (see FIG. 3 and FIG. 3). (See FIG. 5). Here, as described with reference to FIG. 3, the second speed V2 is slower than the first speed V1. For example, the second speed V2 is 5 mm / s.

  When the bonding tools 4 and 5 are brought into contact with the lead wires 12 (see T0 in FIG. 2), the pressure of the bonding tools 4 and 5 shown in FIG. Control (two-stage pressure increase control) is started. Note that, as described above, the electric cylinder 1 having the control unit monitors the pressure value (measured value) transmitted from the pressure gauge 9 as needed, and executes pressure control while referring to the monitoring result.

  First, the electric cylinder 1 is applied to the bonding tools 4 and 5 so that the pressure exerted on the lead wires 12 by the bonding tools 4 and 5 linearly increases until the pressure reaches the first pressure value P1. Perform pressure control. Here, as described with reference to FIG. 2, at the timing when the first pressure P1 is reached (at time T1 in FIG. 2), the ultrasonic transducer 8 starts to generate ultrasonic vibration. Thereby, the ultrasonic vibration is transmitted to the bonding tools 4 and 5 through the vibration horn 6, and pressurization type ultrasonic vibration (frequency: 20 to 40 KHz, amplitude: (4 to 10 μm)) with respect to the lead wire 12 is started. .

  Here, FIGS. 6, 7, 8, and 9 illustrate a case where ultrasonic vibration is performed in the extending direction of the linear lead wire 12. However, ultrasonic vibration may be performed in the line width direction of the linear lead wire 12 (the front and back sides of the drawings in FIGS. 6, 7, 8, and 9).

  It is assumed that the pressure with which the bonding tools 4 and 5 press the lead wire 12 reaches the first pressure value P1 and the application of the ultrasonic vibration to the lead wire 12 is started. Then, the bonding tools 4 and 5 stop increasing the pressure on the lead wire 12 from time T1 for a first predetermined period (for example, 30 ms) while applying ultrasonic vibration to the lead wire 12 (FIGS. 2 and 7). reference).

  Even if the pressure control of the bonding tools 4 and 5 by the electric cylinder 1 is stopped for the first predetermined period (that is, neither the pressure increase control nor the pressure decrease control is performed), as described above, the pressure ultrasonic vibration is applied. The lead wire 12 is deformed, and the apparent pressure is reduced.

  Now, after the first predetermined period, the pressure increase on the lead wire 12 by the bonding tools 4 and 5 is resumed while applying ultrasonic vibration to the lead wire 12. Here, the bonding tools 4 and 5 increase the pressure until the pressure on the lead wire 12 reaches the second pressure value P2 that is larger than the first pressure value P1 (see FIGS. 2 and 8).

  After the pressure value reaches the second pressure value P2, the bonding tools 4 and 5 continue to apply ultrasonic vibration to the lead wire 12 while the pressure on the lead wire 12 is changed to the second pressure P2. A second predetermined period (for example, about 500 ms) is maintained from T2 (see FIGS. 2 and 9).

  Thus, the lead wire 12 is joined to the base 11 by applying ultrasonic vibration on the lead wire 12 while applying pressure to the predetermined table 10 side.

  After bonding the lead wire 12 to the base body 11, the bonding tools 4 and 5 are moved upward by the driving force of the electric cylinder 1. In addition, when the ultrasonic vibration bonding is newly performed between the other portion of the lead wire 12 and the substrate 11, the above operation is repeated after the bonding tools 4 and 5 or the substrate 11 are moved.

  Next, effects of the pressurizing ultrasonic vibration bonding apparatus 100 and the pressurizing ultrasonic vibration bonding method will be described while presenting problems.

  First, the problem will be described.

  It is assumed that the pressure exerted on the lead wire 12 by the bonding tools 4 and 5 is increased to a predetermined pressure value, and the subsequent pressure increasing operation is not performed completely after reaching the predetermined pressure value. In this case, as described above, even if the lead wire 12 is deformed and the pressure control is stopped, the apparent pressure applied to the lead wire 12 by the bonding tools 4 and 5 is reduced. When pressurization type ultrasonic bonding is performed in a state where the apparent pressure is reduced, the following problem occurs. That is, a long-time pressure ultrasonic vibration treatment is required until the lead wire 12 is joined to the base body 11, and the joining force to the base body 11 with respect to the lead wire 12 is reduced. The joining force varies at each joining point.

  Therefore, in the present embodiment, when bonding the lead wire 12 to the base 11, a bonding tool is applied so that the ultrasonic wire is applied to the lead wire 12 and the pressure on the lead wire 12 is increased in at least two stages. 4 and 5 are controlled.

  Therefore, since the apparent pressure drop of the bonding tools 4 and 5 with respect to the lead wire 12 can be suppressed in the second and subsequent pressure steps, it is possible to apply the pressure necessary for bonding to the lead wire 12. Thereby, the lead wire 12 can be joined to the base body 11 in a short time, and a reduction in the joining force to the base body 11 with respect to the lead wire 12 can be prevented, and further, the variation in joining force can be suppressed.

  When the bonding tools 4 and 5 are lowered only at high speed and brought into contact with the lead wires 12, the thin base 11 may be damaged by the impact force of the bonding tools 4 and 5.

  Therefore, in the present embodiment, when the bonding tools 4 and 5 are brought into contact with the lead wires 12, as shown in FIG. 3, the bonding tools 4 and 5 are first lowered at a high speed, and then switched to a low speed. The bonding tools 4 and 5 are brought into contact with the lead wire 12 at a low speed.

  Accordingly, since the bonding tools 4 and 5 are brought into contact with the lead wire 12 in a low speed state, it is possible to suppress the thin base 11 from being damaged during the contact. Note that the bonding tools 4 and 5 are lowered at a predetermined height at high speed. Therefore, the time from the start of the lowering of the bonding tools 4 and 5 to the contact of the lead wire 12 can be shortened.

  In addition, the drive part which drives the bonding tools 4 and 5 can also be made into an air cylinder. However, when the air cylinder is employed, the pressure control of the bonding tools 4 and 5 becomes low accuracy. It is also possible to employ an air cylinder to suppress the low accuracy of the pressure control, but in this case, the time required for the pressure control is considerably long. That is, it takes a long time to join the lead wire 12 to the base 11, which is not efficient. Further, when the air cylinder is employed, the bonding tools 4 and 5 abruptly come into contact with the lead wire 12, and the base body 11 is damaged during the contact. Furthermore, when an air cylinder is employed, the entire drive unit is enlarged, and as a result, the pressurized ultrasonic vibration device itself is also enlarged.

  Therefore, in the present embodiment, the electric cylinder 1 is employed as a drive unit that drives the bonding tools 4 and 5.

  Therefore, since the bonding tools 4 and 5 can be driven electrically, the pressure control of the bonding tools 4 and 5 can be performed with high accuracy. Furthermore, the electric cylinder 1 is smaller than the air cylinder. Therefore, an increase in size of the pressurized ultrasonic vibration device can be suppressed.

  In the present embodiment, the pressure gauge 9 is provided, the pressure applied to the lead wire 12 by the bonding tools 4 and 5 is monitored as needed, and the pressure control of the bonding tools 4 and 5 is performed based on the monitoring result. ing.

  In this way, pressure control can be performed while monitoring the actual pressure applied to the lead wire 12, so that precise pressure control of the bonding tools 4 and 5 is possible. Therefore, the bonding force between the lead wire 12 and the base body 11 can be stabilized.

DESCRIPTION OF SYMBOLS 1 Electric cylinder 2 Support | pillar part 3 Coupling 4 Rod 5 Contact tip part 6 Vibration horn part 7 Holder 8 Ultrasonic vibrator 9 Pressure gauge 10 Predetermined table 11 Base 12 Lead wire 100 Pressurization type ultrasonic vibration joining apparatus

Claims (10)

(A) installing a thin substrate on a predetermined table;
(B) disposing a conductive lead wire on the substrate;
(C) joining the lead wire to the base by applying ultrasonic vibration on the lead wire while applying pressure to the predetermined table side,
The step (C)
Increasing the pressure on the lead in at least two stages,
A pressure-type ultrasonic vibration joining method. The step (C)
(C-1) increasing the pressure on the lead wire to a first pressure value;
(C-2) After the step (C-1), applying the ultrasonic vibration to the lead wire, and stopping the increase of the pressure on the lead wire for a first predetermined period;
(C-3) After the first predetermined period, while applying the ultrasonic vibration to the lead wire, the pressure on the lead wire is increased to a second pressure value larger than the first pressure value. A process of
The pressurized ultrasonic vibration joining method according to claim 1. The step (C)
(C-4) After the step (C-3), applying the ultrasonic vibration to the lead wire while maintaining the pressure on the lead wire at the second pressure value for a second predetermined period. And more,
The pressurized ultrasonic vibration joining method according to claim 2. The member for applying the ultrasonic vibration is:
A bonding tool,
(D) Before the step (C), further comprising a step of lowering the bonding tool toward the lead wire,
The step (D)
(D-1) lowering the bonding tool at a first speed until the height from the upper surface of the lead wire reaches a predetermined height;
(D-2) After the step (D-1), the step of lowering the bonding tool at a second speed slower than the first speed until reaching the upper surface of the lead wire is provided. ,
The pressurization type ultrasonic vibration joining method according to any one of claims 1 to 3. A predetermined table on which a thin substrate is installed;
A bonding tool for applying ultrasonic vibration on the lead wire while applying a predetermined pressure to the predetermined table side in a state where the conductive lead wire is disposed on the base body,
A drive unit for controlling the drive of the bonding tool,
The drive unit is
Performing pressure control on the bonding tool to increase the pressure on the lead in at least two stages;
A pressure-type ultrasonic vibration bonding apparatus. The drive unit is
Increasing the pressure on the lead wire to a first pressure value, and after reaching the first pressure value, stop increasing the pressure on the lead wire for a first predetermined period of time, Performing the pressure control on the bonding tool to increase the pressure on the lead wire to a second pressure value greater than the first pressure value after a predetermined period of time;
The pressurized ultrasonic vibration bonding apparatus according to claim 5. In the state where the bonding tool is applying the ultrasonic vibration to the lead wire, the drive unit is
The pressure control for maintaining the pressure on the lead wire at the second pressure value for a second predetermined period is performed on the bonding tool.
The pressurized ultrasonic vibration bonding apparatus according to claim 6. The drive unit is
Electric cylinder,
The pressurization type ultrasonic vibration joining device according to any one of claims 5 to 7. A pressure gauge that measures the pressure applied by the bonding tool to the lead wire,
The drive unit is
Monitoring the pressure gauge measurement results,
The pressurization type ultrasonic vibration bonding apparatus according to claim 8. The drive unit is
The bonding tool is lowered at a first speed until the height from the upper surface of the lead wire reaches a predetermined height, and the bonding tool is moved from the predetermined height until reaching the upper surface of the lead wire. The descent operation of the bonding tool is also controlled so that the descent is performed at a second speed slower than the first speed.
The pressurization type ultrasonic vibration bonding apparatus according to any one of claims 5 to 9.

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