JP2010287630A - Film package, electronic component mounting substrate, and electronic component mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively utilize a mounting space to increase mounting efficiency by mounting an electronic component constructed as a package having the degree of freedom in a lower space. <P>SOLUTION: In a film package 41 configured by mounting at least one electronic component on a film base material to be mounted on a printed board 2 on which an electronic component is mounted, when it is mounted on the printed board 2, each mounting part is press-bonded on the printed board 2 to stride over the small-sized electronic component 4 mounted on the printed board 2, a first connecting part, an electronic component mounting part, and a second connecting part are bent to have inverted C-shaped cross sections, and each inserting part 46 is bent inward and mounted on the printed board 2 with the first connecting part physically connected with the second connecting part. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a film package in which an electronic component is mounted on a film base, an electronic component mounting method for mounting the film package on a printed circuit board, and an electronic component mounting substrate, and more particularly, an electronic device mounted on the printed circuit board. The present invention relates to a technique for achieving high-density mounting by further disposing electronic components above the components.

  Conventionally, when an electronic component is mounted on a printed board, a method called lead insertion mounting or surface mounting is used. The lead insertion mounting is a method of fixing an electronic component to a printed board using a flow soldering method (wave soldering method) using jet solder after inserting the lead of the electronic component into a through hole of the printed board. For surface mounting, after solder printing on the printed circuit board with a cream solder printer (or applying adhesive to the component mounting position with a dispenser), electronic components are mounted with a chip mounter, and then heat is applied in a reflow oven. Then, the solder is melted and the electronic component is fixed to the printed circuit board.

  Here, since the shape of the electronic component differs depending on the capacity, resistance, or the like, useless space may be generated depending on the arrangement. In this case, the wasteful space in the horizontal direction can be reduced by devising the component arrangement, but the wasteful space in the upward direction due to the difference in component height cannot be dealt with by devising the component arrangement. Therefore, for example, Patent Document 1 describes a technique for improving the mounting density by using an electronic component having a long lead, providing a space below the electronic component, and arranging the electronic component in the vertical direction. Yes.

Japanese Unexamined Patent Publication No. 64-51644 (Released on February 27, 1989)

  However, the electronic component described in Patent Document 1 with a long lead has a problem that even if the lead is long, the space below the electronic component is constant, so that electronic components that can be mounted below are limited.

  Further, in order to obtain an electronic component having a long lead, an electronic component package having a long lead must be newly created. In addition, in the case of an electronic component having a long lead, since the shape of the entire component becomes large, the package at the time of transportation becomes large, and transportation costs increase. Furthermore, since the lead is long, it is vulnerable to impact, and the lead is bent by a slight impact, which makes it difficult to mount on a printed circuit board.

  The present invention has been made in view of the above-mentioned conventional problems, and its purpose is to effectively utilize the mounting space by mounting electronic components configured as a package having a degree of freedom in the lower space, An object of the present invention is to provide a film package, an electronic component mounting substrate, and an electronic component mounting method capable of improving the mounting efficiency.

  In order to solve the above-mentioned problems, the film package of the present invention is a film package in which at least one electronic component is mounted on a film base material for mounting on a printed circuit board on which the electronic component is mounted, and is bent. The front has a rectangular outer shape in plan view, and mounting portions to be mounted on the printed circuit board are respectively provided at the ends of two opposing sides, and the portions excluding the mounting portions are 4 parts of the portions. A notch formed inward from the corners, an electronic component mounting portion located in the center, a first connection portion adjacent to each of the two opposing sides of the electronic component mounting portion and adjacent to each mounting portion, and The second connecting portion is divided into a first insertion portion and a second insertion portion adjacent to the other two opposite sides of the electronic component mounting portion, respectively. When mounting, the mounting parts are pressure-bonded to the printed circuit board so as to straddle the electronic parts mounted on the printed circuit board, and the first connection part, the electronic component mounting part, and the second connection part are cross-sectionally connected. The first insertion portion and the second insertion portion are bent inward and physically connected to the first connection portion and the second connection portion, and mounted on the printed circuit board. It is characterized by being.

  According to the above configuration, the electronic components distributed in the market are simply arranged as a film package mounted on a film base material, and the electronic components are arranged side by side in a direction perpendicular to the mounting surface of the printed circuit board. Is possible. Further, by changing the bending position of the film package, a degree of freedom can be generated in the lower space of the film package. Therefore, it is possible to easily increase or decrease the number of electronic components disposed below the film package (the film package straddles). Therefore, it is possible to improve the mounting efficiency by effectively using the mounting space.

  Furthermore, the first insertion portion and the second insertion portion are bent inward and are physically connected to the first connection portion and the second connection portion, and thus mounted on the printed circuit board. Since it has mounting strength, it is possible to prevent deformation due to pressure from above.

  In the film package of the present invention, the first insertion portion and the second insertion portion are positioned at the ends forming the outer shape of the film package, on the extension lines of the bending positions of the first connection portion and the second connection portion. As described above, a first cutout is formed, and each of the first connection and the second connection is formed with a second cutout at each end formed by the cut. It is preferable that the physical connection is performed by the first cutting part and the second cutting part engaging each other. Thereby, it becomes possible to easily connect the first insertion portion and the second insertion portion, and the first connection portion and the second connection portion.

  In the film package of the present invention, it is preferable that each of the first cut portions is cut into a mountain shape.

  Further, in the film package of the present invention, each of the second cut portions is along a perpendicular line perpendicular to an end where the mounting portion is provided from an end formed by the cut, or It is preferable that a straight line is cut between an acute angle formed by the end formed by the cutting. Furthermore, it is preferable that each of the second cut portions is cut into a mountain shape by a cut from the end formed by the cut to the cut portion of the straight line.

  The electronic component mounting board of the present invention is characterized in that an electronic component composed of the film package is mounted.

  In order to solve the above problems, an electronic component mounting method of the present invention is a film in which at least one electronic component is mounted on a film base material in the electronic component mounting method in which a plurality of electronic components are mounted on a printed circuit board. Including a mounting step of mounting the package on the printed circuit board in a state where the package is bent so as to straddle other electronic components mounted on the printed circuit board, and the film package has a rectangular outer shape in plan view before bending The mounting portions mounted on the printed circuit board are respectively provided at the ends of the two opposing sides, and the portions excluding the mounting portions are formed by notches formed inside from the four corners of the portions, An electronic component mounting portion located in the center and a first connection adjacent to each of the mounting portions and adjacent to one opposing two sides of the electronic component mounting portion And the second connection portion, and the first insertion portion and the second insertion portion adjacent to the other two opposite sides of the electronic component mounting portion, respectively, and in the mounting step, the film package is The mounting portions are pressure-bonded to the printed circuit board, the first connection portion, the electronic component mounting portion, and the second connection portion are bent into a U-shaped cross section, and the first insertion portion and the second insertion portion are disposed inside. And is mounted on the printed circuit board in a state of being physically connected to the first connection portion and the second connection portion.

  According to the above method, the electronic components can be arranged side by side in a direction perpendicular to the mounting surface of the printed circuit board by mounting the electronic components in a film package. Further, by changing the bending position of the film package, a degree of freedom can be generated in the lower space of the film package. Therefore, it is possible to easily increase or decrease the number of electronic components disposed below the film package (the film package straddles). Therefore, it is possible to improve the mounting efficiency by effectively using the mounting space.

  Furthermore, by bending the first insertion portion and the second insertion portion inward and physically connecting the first insertion portion and the second connection portion to the printed circuit board, excellent mounting strength can be obtained. Since it has, it becomes possible to prevent the deformation | transformation by the pressure from upper direction.

  At this time, in the electronic component mounting method of the present invention, the mounting step is performed by placing the film package on a lower jig having a U-shaped cross section placed on a flat base and Bending the first connection part, the electronic component mounting part, and the second connection part of the film package into a U-shaped cross-section by pressing the film package with a U-shaped upper jig and pressing the film package; After removing the upper jig, the folded film package is conveyed to the printed circuit board together with the lower jig, and is placed at a mounting position so as to straddle the other electronic components; and A crimping step of crimping each mounting portion of the film package to the printed circuit board; a extracting step of extracting the lower jig from the film package; a first insertion portion of the film package; Bending the second insertion portion inside, it is desirable to include a connecting step of the first connecting portion and the second connecting portion and physically connected.

  As described above, the film package of the present invention has a rectangular outer shape in plan view before being bent, and the mounting portions mounted on the printed circuit board are respectively provided at the ends of the two opposing sides. The part excluding the mounting part is adjacent to the electronic component mounting part located in the center and one opposing two sides of the electronic component mounting part by the notches formed inside from the four corners of the part, and the above The first connecting portion and the second connecting portion adjacent to each mounting portion, respectively, and the first inserting portion and the second inserting portion adjacent to the other two opposite sides of the electronic component mounting portion, respectively. When mounted on the printed circuit board, the mounting parts are pressure-bonded to the printed circuit board so as to straddle the electronic parts mounted on the printed circuit board, and the first connection part, the electronic component mounting part, and In a state where the two connecting portions are bent into a U-shaped cross section, and the first inserting portion and the second inserting portion are bent inward and physically connected to the first connecting portion and the second connecting portion. The configuration mounted on the printed circuit board.

  Therefore, it is possible to arrange the electronic components side by side in a direction perpendicular to the mounting surface of the printed circuit board only by configuring the electronic components distributed in the market as a film package mounted on a film substrate. Further, by changing the bending position of the film package, a degree of freedom can be generated in the lower space of the film package.

  Therefore, it is possible to easily increase or decrease the number of electronic components that are disposed below the film package (over the film package). Therefore, it is possible to provide an electronic component mounting board that can effectively use the mounting space and improve the mounting efficiency.

  Furthermore, the first insertion portion and the second insertion portion are bent inward and are physically connected to the first connection portion and the second connection portion, and thus mounted on the printed circuit board. Since it has mounting strength, it is possible to prevent deformation due to pressure from above.

  The electronic component mounting board of the present invention is configured to mount the electronic component composed of the film package.

  In the electronic component mounting method of the present invention, the printed circuit board is obtained by bending a film package in which at least one electronic component is mounted on a film base so as to straddle other electronic components mounted on the printed circuit board. The film package has a rectangular outer shape in plan view before being bent, and provided with mounting portions mounted on the printed circuit board at the ends of the two opposite sides, respectively, The parts excluding the mounting parts are adjacent to the electronic component mounting part located at the center and one opposing two sides of the electronic component mounting part by the notches formed inside the four corners of the part. And a first connecting portion and a second connecting portion adjacent to each of the mounting portions, respectively, and a first insertion portion and a second connecting portion adjacent to the other two opposite sides of the electronic component mounting portion, respectively. In the mounting step, the film package is crimped to the printed circuit board, and the first connection part, the electronic component mounting part, and the second connection part are cross-sectioned. The first insertion part and the second insertion part are bent inward and physically connected to the first connection part and the second connection part, and mounted on the printed circuit board. Is the method.

  Therefore, by mounting the electronic components in a film package, the electronic components can be arranged side by side in a direction perpendicular to the mounting surface of the printed circuit board. Further, by changing the bending position of the film package, a degree of freedom can be generated in the lower space of the film package.

  Therefore, it is possible to easily increase or decrease the number of electronic components that are disposed below the film package (over the film package). Therefore, it is possible to provide an electronic component mounting method capable of improving the mounting efficiency by effectively using the mounting space.

  Furthermore, by bending the first insertion portion and the second insertion portion inward and physically connecting the first insertion portion and the second connection portion to the printed circuit board, excellent mounting strength can be obtained. Since it has, there exists an effect that the deformation | transformation by the pressure from upper direction can be prevented.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view showing an embodiment of an electronic component mounting board according to the present invention, and FIG. It is a film package mounted on the electronic component mounting substrate, and shows an example of the configuration of the film package before mounting, (a) is a plan view of a surface on which no electronic component is mounted, (b ) Is a plan view of the surface on which the electronic component is mounted, and (c) is a cross-sectional view taken along the line AA ′ of (b). (A)-(i) is a figure which shows an example of the process of mounting the said film package on a printed circuit board. (A)-(i) is a figure which shows the other example of the process of mounting the said film package on a printed circuit board. (A)-(i) is a figure which shows the further another example of the process of mounting the said film package on a printed circuit board. (A)-(i) is a figure which shows an example of the process of mounting the said film package of another shape on a printed circuit board. (A)-(i) is a figure which shows an example of the process of mounting the said film package of another shape on a printed circuit board. The film package to be mounted on the electronic component mounting substrate, showing another example of the configuration of the film package before mounting, (a) is a plan view of the surface on which the electronic component is not mounted, (B) is a top view of the surface where the electronic component was mounted. (A) is a perspective view which shows the state by which the said film package was wound up by the reel, (b) is a top view which shows the form before the said film package is separated into pieces. (A)-(i) is a figure which shows an example of the process of mounting the said film package on a printed circuit board. The other embodiment of the electronic component mounting board | substrate in this invention is shown, (a) is a side view, (b) is a slope view. It is a film package mounted on the electronic component mounting substrate, and shows an example of the configuration of the film package before mounting, (a) is a plan view of a surface on which no electronic component is mounted, (b ) Is a plan view of a surface on which electronic components are mounted. (A) is a perspective view which shows the state by which the said film package was wound up by the reel, (b) is a top view which shows the form before the said film package is separated into pieces. It is a perspective view which shows an example of a structure of the mounting apparatus used when mounting the said film package on a printed circuit board. (A)-(c) is a figure which shows an example of the process of mounting the said film package in a printed circuit board. (A)-(c) is the schematic which looked at each process shown in Drawing 15 (a)-(c) from the side. It is a film package mounted on the electronic component mounting substrate, and shows still another example of the configuration of the film package before mounting, and (a) is a plan view of a surface on which no electronic component is mounted. (B) is a top view of the surface where the electronic component was mounted. (A) is a perspective view which shows the mode before fixing the insertion part at the time of bending and mounting the said film package, (b) is a perspective view which shows the mode after fixing the insertion part. is there. It is an enlarged view which shows the structure of the insertion cutting part in the said film package. (A) is a perspective view which shows the state by which the said film package was wound up by the reel, (b) is a top view which shows the form before the said film package is separated into pieces. (A)-(j) is a figure which shows an example of the process of mounting the said film package on a printed circuit board.

[Embodiment 1]
An embodiment of the present invention will be described below with reference to the drawings.

(Configuration of electronic component mounting board)
1A and 1B show a configuration example of an electronic component mounting board 1 according to the present embodiment, where FIG. 1A is a side view and FIG. 1B is a perspective view.

  As shown in FIG. 1, an electronic component mounting board 1 of the present embodiment is configured by mounting a film package 3, a small electronic component 4, and a large electronic component 5 on a printed board 2.

  The printed board 2 is a board in which a circuit pattern is formed on the surface of a resin base material such as glass epoxy. The printed circuit board 2 is configured such that electronic components can be mounted by lead insertion mounting or surface mounting. In the printed circuit board 2, an electrode portion is provided on one surface (hereinafter referred to as a mounting surface 2a) on which the film package 3, the small electronic component 4, and the large electronic component 5 are mounted. It has been. The material, structure, and shape of the printed circuit board 2 are not particularly limited.

  The film package 3 is an electronic component package in which an IC 16 (electronic component) is mounted on a film base material. As shown in FIG. 1A, the film package 3 is folded in a U shape in a side view so as to have a predetermined height with respect to the mounting surface 2 a of the printed board 2. It is mounted on the mounting surface 2a. Thereby, since a space is formed below (inside) the film package 3, it is possible to mount other electronic components. That is, the predetermined height is determined by an electronic component disposed below and a mounting space that can be utilized. The detailed configuration of the film package 3 will be described later.

  The small electronic component 4 is a relatively small electronic component, such as a ceramic capacitor or a resistor. Two small electronic components 4 are arranged side by side in the lower space of the film package 3. In other words, the film package 3 is mounted on the mounting surface 2 a of the printed circuit board 2 in a state of being folded into a U shape in a side view so as to straddle the two small electronic components 4.

  The large electronic component 5 is a relatively large electronic component, such as an aluminum electrolytic capacitor. Two large electronic components 5 are arranged side by side on the side of the film package 3.

(Structure of film package)
Next, a detailed configuration of the film package 3 will be described with reference to FIG.

  2A and 2B show an example of the configuration of the film package 3 before being mounted on the printed circuit board 2. FIG. 2A is a plan view of a surface on which the IC 16 is not mounted, and FIG. (C) is a cross-sectional view taken along line AA ′ of (b).

  The film package 3 is bent as shown in FIG. 1 at the time of mounting, and is not bent before mounting. The film package 3 has a rectangular outer shape in plan view before mounting (before bending).

  The film substrate 11 is a highly flexible film and has a rectangular outer shape in plan view before mounting. That is, the film base 11 constitutes the outer shape of the film package 3 in plan view. As shown in FIG. 2B, the IC 16 is mounted on one surface (hereinafter referred to as an IC mounting surface) of the film base 11. On the other hand, as shown in FIG. 2A, the film substrate 11 is exposed on the other surface of the film substrate 11.

  An IC mounting portion (not shown) for mounting the IC 16 is formed on the IC mounting surface of the film base 11 at the center (not necessarily strictly the center). Moreover, the mounting part 12 crimped | bonded to the printed circuit board 2 is each formed in the edge (edge) of each short side.

  A wiring 13 made of copper is formed on the IC mounting surface of the film base 11. The wiring 13 is a wiring for electrically connecting the printed circuit board 2 and the IC 16 when the film package 3 is mounted on the printed circuit board 2. The wiring 13 is provided so as to extend from the IC mounting part to the one mounting part 12, and is provided so as to extend from the IC mounting part to the other mounting part 12.

  The IC mounting surface of the film base 11 is covered with a solder resist 14 except for the IC mounting portion and the mounting portion 12. That is, the wiring 13 is covered with the solder resist 14 except for the portion to be electrically connected. The solder resist 14 functions as an insulator while protecting the wiring 13 from an environment such as dust, heat, and humidity.

  Alignment marks 15 are formed at the four corners of the film base 11, that is, at both ends of each mounting portion 12. The alignment mark 15 is used for alignment when the film package 3 is mounted on the printed circuit board 2. The alignment mark 15 has a circular shape, but may be any shape suitable for alignment.

  The IC 16 has a chip shape and is a semiconductor element manufactured from, for example, silicon. As shown in FIG. 2C, a surface terminal (not shown) is formed on one surface of the IC 16, and a gold bump 17 is formed on the surface terminal. The IC 16 is mounted on the film substrate 11 by a face-down method in which gold bumps 17 are fixed to the wiring 13 on the IC mounting portion by solder. A sealing resin 18 is filled around the IC 16 and between the IC 16 and the film substrate 11. As the sealing resin 18, for example, a thermosetting resin such as an epoxy resin is used, but is not limited thereto.

  Here, the film package 3 having the above-described configuration is provided with folding positions P and Q that are the folding positions when the printed circuit board 2 is mounted.

  The bending position P is provided at the boundary of each mounting portion 12. The bending position P is determined by the size (width) of the mounting portion 12. The bending position Q is provided so as to be positioned between one mounting portion 12 and the IC 16 (IC mounting portion) and between the other mounting portion 12 and the IC 16 (IC mounting portion). The folding positions P and Q are parallel to each other, and the distance from one folding position P to the neighboring folding position Q is equal to the distance from the other folding position P to the neighboring folding position Q.

  The folding position P is bent 90 ° outward and the bending position Q is bent 90 ° inward so that the IC mounting surface is located inside. Thereby, the film package 3 will be in the state by which the space | interval between each mounting part 12 was bend | folded by the cross-sectional U shape.

  In other words, the film package 3 in a state where each mounting portion 12 is bent in a U-shaped cross section is adjacent to each mounting portion 12 and one mounting portion 12 and is perpendicular to the mounting portion 12. A first side surface portion; a second side surface portion adjacent to the other mounting portion 12 and perpendicular to the mounting portion 12; and a first side surface portion and a second side surface portion adjacent to the first side surface portion and the second side surface portion. It can also be expressed as comprising an upper surface portion perpendicular to the portion.

(Film package mounting method)
Next, a method of mounting the film package 3 on the printed circuit board 2 (electronic component mounting method) will be described with reference to FIG. The mounting process of the film package 3 described below is a part of the manufacturing process of the electronic component mounting substrate 1.

  FIGS. 3A to 3I are diagrams illustrating an example of a process for mounting the film package 3 on the printed circuit board 2.

  First, as shown in FIG. 3A, a film package 3 is prepared. Then, as shown in FIG. 3B, an upper jig 51 and a lower jig 52, which are jigs for shaping the film package 3, are prepared.

  The upper jig 51 includes one upper surface portion 51a, two side surface portions 51b and 51c, and two flat portions 51d and 51e. The upper surface portion 51a and the side surface portions 51b and 51c form an angle of 90 °, and the upper surface portion 51a and the side surface portions 51b and 51c are configured to have a U-shaped cross section. The side parts 51b and 51c and the flat parts 51d and 51e adjacent thereto form an angle of 90 °, and the side parts 51b and 51d and the side parts 51c and 51e have an L-shaped cross section. It is comprised so that it may have a shape.

  The lower jig 52 includes one upper surface portion 52a and two side surface portions 52b and 52c. The upper surface portion 52a and the side surface portions 52b and 52c form an angle of 90 °, and the upper surface portion 52a and the side surface portions 52b and 52c are configured to have a U-shaped cross section. An opening 53 is formed in the upper surface portion 52a.

  In this mounting step, the film package 3 is shaped by pressing the film package 3 between the upper jig 51 and the lower jig 52. Therefore, the film package 3 is shaped in the same shape as the inside of the upper jig 51 (the film package 3 is bent along the inner shape of the upper jig 51). Therefore, the inside of the upper jig 51 is shaped to bend the film package 3 at the folding positions P and Q. The lower jig 52 has a shape that fits into the upper jig 51 with a predetermined gap.

  The upper jig 51 and the lower jig 52 may be manufactured by bending a rectangular plate (thin plate) made of metal, or may be manufactured by assembling a plurality of components. .

  The lower jig 52 is installed on a flat shaping table so that the upper surface portion 52a faces upward. Further, the upper jig 51 is held by a tool or the like in an upper direction away from the lower jig 52 and in a direction that can be put on the lower jig 52.

  Subsequently, as shown in FIG. 3C, the film package 3 is placed on the upper surface portion 52a of the lower jig 52 so that the IC mounting surface faces the upper surface portion 52a. At this time, the film package 3 is placed so that the IC 16 is positioned in the opening 53 of the lower jig 52.

  Subsequently, as shown in FIG. 3D, the upper jig 51 is put on the lower jig 52 together with the film package 3, and the film package 3 is sandwiched between the upper jig 51 and the lower jig 52. Then, pressing is performed by applying a force from the upper jig 51 side. By this step, the film package 3 is shaped into a U-shape having flat portions at both ends, which is bent by 90 ° at the folding positions P and Q. During the shaping, the IC 16 is located in the opening 53, so that no stress is applied.

  Subsequently, as shown in FIG. 3 (e), after the upper jig 51 is removed, the film package 3 is already mounted on the mounter together with the lower jig 52 as shown in FIG. 3 (f). It is transported to the installed printed circuit board 2. Then, the film package 3 and the lower jig 52 that have been conveyed are placed on the mounting surface of the printed circuit board 2 while performing alignment using the alignment marks 15. At this time, the film package 3 is placed so that each mounting portion 12 hits the mounting surface of the printed circuit board 2 and straddles the small electronic component 4.

  Here, it is essential that at least the small electronic component 4 is already mounted on the printed circuit board 2 as the transport destination. That is, the mounting process of the film package 3 is provided after the mounting process of the small electronic component 4 in the manufacturing process of the electronic component mounting substrate 1.

  Further, since the film package 3 is conveyed together with the lower jig 52, it is not crushed even if it is gripped by a tool or the like. Therefore, it is possible to easily carry and position the printed board 2 on the mounting surface.

  After the film package 3 is placed on the mounting surface of the printed circuit board 2, the electrode part formed on the mounting surface of the printed circuit board 2 and the wiring 13 formed on the mounting part 12 of the film package 3 are pressure-bonded. However, the connection is made using ACF (anisotropic adhesive), solder or the like.

  Subsequently, the lower jig 52 is pulled out from the film package 3 as shown in FIG. At this time, since the lower jig 52 has a U-shape, it can be pulled out without contacting the small electronic component 4, that is, without being obstructed by other components. Moreover, since the opening part 53 is formed in the lower jig | tool 52, the lower jig | tool 52 can be pulled out, without contacting IC16. Then, the lower jig 52 is completely removed from the film package 3 as shown in FIG.

  As a result, as shown in FIG. 3I, only the film package 3 remains on the printed circuit board 2 in a state of being mounted in a state of being folded into a U-shape. The film package 3 is mounted on the mounting surface of the printed circuit board 2 so as to straddle the small electronic component 4.

  As described above, the mounting method of the film package 3 is such that the film package 3 in which the IC 16 is mounted on the film base 11 is straddled over the small electronic component 4 mounted on the mounting surface 2a of the printed board 2. This is a method including a mounting step in which the mounting portion 12 is pressure-bonded to the mounting surface 2a of the printed circuit board 2, and the mounting portions 12 are mounted on the mounting surface 2a of the printed circuit board 2 in a state where the space between the mounting portions 12 is folded into a U-shaped cross section. .

  That is, the electronic component mounting substrate 1 is such that the film package 3 in which the IC 16 is mounted on the film base 11 as the electronic component straddles the small electronic component 4 mounted on the mounting surface 2a of the printed circuit board 2. Each mounting part 12 is pressure-bonded to the mounting surface 2a of the printed circuit board 2, and the mounting part 12 is mounted on the mounting surface 2a of the printed circuit board 2 with the space between the mounting parts 12 folded into a U-shaped cross section. is doing.

  Therefore, the small electronic component 4 and the IC 16 in the direction perpendicular to the mounting surface 2a of the printed circuit board 2 can be obtained simply by configuring the IC 16 distributed in the market as the film package 3 mounted on the film base 11. Can be arranged side by side.

  Further, by changing the bending position of the film package 3, a degree of freedom can be generated in the lower space of the film package 3. Therefore, it is possible to easily increase or decrease the number of the small electronic components 4 disposed below the film package 3 (over the film package 3).

  Therefore, it is possible to improve the mounting efficiency by effectively utilizing the useless space due to the height difference between the large electronic component 5 and the small electronic component 4.

  The film package 3 is in a planar state before mounting (before bending). Therefore, it can be conveyed in a form wound on a tape reel. In addition, a large number can be transported in a small package.

  In the electronic component mounting substrate 1, the numbers of the film package 3, the small electronic component 4, and the large electronic component 5 are not limited to those shown in FIG. 1 described above, and the number depends on the design. Can be determined. Moreover, components (not shown) other than the film package 3, the small electronic component 4, and the large electronic component 5 may be mounted on the mounting surface 2 a of the printed circuit board 2.

  Further, although the IC 16 is mounted on the film package 3, it is sufficient that at least one surface-mount type electronic component is mounted, and a configuration in which a plurality of electronic components are mounted may be employed.

  Furthermore, although the upper jig 51 and the lower jig 52 are used as shown in FIG. 3 in the mounting method of the film package 3 described above, the present invention is not limited to this, and the film package 3 is bent at a predetermined folding position. Any jig that can be (shaped into a predetermined shape) and can be easily removed after mounting the film package 3 may be used.

(Other variations)
FIGS. 4A to 4I are diagrams showing another example of the process of mounting the film package 3 on the printed board 2. In this mounting step, in order to mount the film package 3 shown in FIG. 4A, a lower jig 52 shown in FIG. 4B and a mounting portion crimping jig 54 shown in FIG. Use.

  First, as shown in FIG. 4C, one mounting portion 12 of the film package 3 is placed on the mounting surface of the printed circuit board 2 while performing alignment using the alignment marks 15. Then, after the mounting portion crimping jig 54 is overlaid on the mounting portion 12 of the film package 3, the electrode portion formed on the mounting surface of the printed circuit board 2 and the mounting portion 12 of the film package 3 are crimped. The wiring 13 formed above is electrically connected.

  The mounting portion crimping jig 54 has a rectangular column shape with a rectangular bottom surface and a height longer than the length of the short side of the film package 3 (film substrate 11). In the bottom surface, at least one side and an adjacent side form an angle of 90 °. The mounting portion crimping jig 54 is mounted on the film package 3 such that one surface forming an angle of 90 ° corresponds to the mounting portion 12 of the film package 3 and the other surface matches the folding position P of the film package 3. Overlaid on the part 12.

  Subsequently, as illustrated in FIG. 4D, the film package 3 is bent along the side surface of the mounting portion crimping jig 54 while the mounting portion 12 is pressed by the mounting portion crimping jig 54. That is, the film package 3 is bent 90 ° with respect to the printed circuit board 2 from the crimped mounting portion 12. Then, the lower jig 52 is disposed beside the film package 3. As a result, the film package 3 is sandwiched between the mounting portion crimping jig 54 and the lower jig 52.

  Subsequently, the mounting portion crimping jig 54 is removed, and the film package 3 is bent along the lower jig 52 as shown in FIG. In this mounting step, the film package 3 is shaped by bending the film package 3 along the lower jig 52 and the mounting portion crimping jig 54. Therefore, the film package 3 is shaped in the same shape as the outside of the lower jig 52. Therefore, the outer side of the lower jig 52 is shaped to bend the film package 3 at the folding positions P and Q.

  Subsequently, as shown in FIG. 4 (f), the other mounting portion 12 is pressed using the mounting portion crimping jig 54 while bending the film package 3. And the electrode part formed in the mounting surface of the printed circuit board 2 and the wiring 13 formed on the mounting part 12 of the film package 3 are electrically connected, pressing the mounting part crimping jig 54.

  Subsequently, as shown in FIG. 4G, the lower jig 52 is pulled out from the film package 3, and the lower jig 52 is completely removed from the film package 3 as shown in FIG. 4H. As a result, as shown in FIG. 4 (i), the mounting parts 12 are pressure-bonded to the printed circuit board 2 so that the film package 3 straddles the small electronic component 4, and the section between the mounting parts 12 is U-shaped. It can be mounted on the printed circuit board 2 while being bent into a mold.

  FIGS. 5A to 5I are diagrams illustrating still another example of the process of mounting the film package 3 on the printed circuit board 2. In this mounting step, an upper jig 51 and a U-shaped jig 55 shown in FIG. 5B are used to mount the film package 3 shown in FIG.

  The U-shaped jig 55 is a U-shaped jig with a handle. The film package 3 is shaped by sandwiching the film package 3 between the upper jig 51 and the U-shaped jig 55 and performing pressing. That is, a U-shaped jig 55 is used instead of the lower jig 52 used in the mounting step shown in FIG.

  The steps shown in FIGS. 5B to 5H are basically performed in the same manner as the steps shown in FIGS. 3B to 3H. The difference is that a U-shaped jig 55 is used instead of the lower jig 52. As a result, as shown in FIG. 5 (i), the mounting portions 12 are pressure-bonded to the printed circuit board 2 so that the film package 3 straddles the small electronic component 4, and a cross-section of the U-shaped section is formed between the mounting portions 12. It can be mounted on the printed circuit board 2 while being bent into a mold.

  In addition, by using the U-shaped jig 55, the U-shaped jig 55 is attached to the printed circuit board 2 when the U-shaped jig 55 is pulled out from the film package 3 after the film package 3 is mounted on the printed circuit board 2. And it can be easily removed without contacting other parts.

  In the electronic component mounting substrate 1 described above, the film package 3 having the rectangular film base material 11 as a base material in a plan view is mounted on the printed circuit board 2 in a state of being folded into a U shape in a side view. However, depending on the convenience of component arrangement of the printed circuit board 2, the mounting surface of the IC 16 when the film package 3 is folded may need to be changed from a rectangle to a triangle or another polygon. Therefore, the film package 3 before being folded, that is, the film base material 11 can be formed in various shapes with an emphasis on the shape when folded.

  6A to 6I are diagrams illustrating an example of a process for mounting the film package 3a on the printed circuit board 2. FIG. As shown in FIG. 6A, the film package 3a before mounting has a shape in which the mounting surface of the IC 16 becomes a triangle when folded at the folding positions P and Q. In this mounting step, a triangular upper jig 56 and a triangular jig 57 shown in FIG. 6B are used to mount the film package 3a.

  The triangular upper jig 56 is a jig having the same function as the upper jig 51. The triangular jig 57 is a jig having the same function as the lower jig 52 and the U-shaped jig 55. The film package 3a can be shaped according to the bending positions P and Q by pressing the film package 3a between the triangle upper jig 56 and the triangle jig 57.

  The steps shown in FIGS. 6B to 6H are basically performed in the same manner as the steps shown in FIGS. 3B to 3H. The difference is that instead of the upper jig 51 and the lower jig 52, a triangular upper jig 56 and a triangular jig 57 are used. Thereby, as shown in FIG. 6 (i), the film package 3a can be mounted on the printed circuit board 2 in a state where the mounting surface of the IC 16 is bent in a triangle so as to straddle the small electronic component 4. It becomes possible.

  FIGS. 7A to 7I are diagrams illustrating an example of a process for mounting the film package 3b on the printed circuit board 2. FIG. As shown in FIG. 7A, the film package 3b before mounting has a shape in which the mounting surface of the IC 16 is a pentagon when folded at the folding positions P and Q. In this mounting process, a pentagonal upper jig 58 and a pentagonal jig 59 shown in FIG. 7B are used to mount the film package 3b.

  The pentagonal upper jig 58 is a jig having the same function as the upper jig 51. The pentagonal jig 59 is a jig having the same function as the lower jig 52. By sandwiching the film package 3b between the pentagonal upper jig 58 and the pentagonal jig 59 and performing pressing, the film package 3b can be shaped according to the folding positions P and Q.

  The steps shown in FIGS. 7B to 7H are basically performed in the same manner as the steps shown in FIGS. 3B to 3H. The difference is that a pentagonal upper jig 58 and a pentagonal jig 59 are used instead of the upper jig 51 and the lower jig 52. As a result, as shown in FIG. 7I, the film package 3b can be mounted on the printed circuit board 2 in a state where the mounting surface of the IC 16 is bent so as to be a pentagon so as to straddle the small electronic component 4. It becomes possible.

  The pentagonal jig 59 includes a partial jig 59a and a partial jig 59b and has a structure that can be divided into two. Therefore, as shown in FIG. 7G, even when the pentagonal jig 59 is pulled out, it can be easily taken out by dividing the pentagonal jig 59 even if the extraction port is narrow. .

  Thus, when the mounting surface of the IC 16 is an n-gonal shape in plan view (n: an integer greater than or equal to 3), the film package 3 has a mounting surface (electronic component mounting portion) of the IC16 having an n-view shape in plan view before bending. A rectangular portion (connecting portion) in plan view provided adjacent to two or more and n−1 or less sides of the n sides of the mounting surface, and a side facing the side adjacent to the mounting surface in each connecting portion It can be set as the structure which has the external shape which consists of the mounting part 12 of the planar view rectangle provided adjacently.

  In this case, in the mounting step, the printed circuit board 2 is formed in a state where the film package 3 is crimped to the printed circuit board 2 and the mounting surface of the IC 16 and each connection section are bent at 90 ° inside. Should be implemented.

[Embodiment 2]
The following will describe another embodiment of the present invention with reference to the drawings. Configurations other than those described in the present embodiment are the same as those in the first embodiment. For convenience of explanation, members having the same functions as those shown in the drawings of the first embodiment are given the same reference numerals, and explanation thereof is omitted.

  In the present embodiment, the appearance of the electronic component mounting substrate 1 shown in FIG. 1 is substantially the same as that of the first embodiment, but the configuration of the film package 3 and the mounting method of the film package 3 are different. Yes. That is, the electronic component mounting substrate 1 of the present embodiment includes a film package 21 shown in FIG. 8 instead of the film package 3.

(Structure of film package)
FIG. 8 shows an example of the configuration of the film package 21 before being mounted on the printed circuit board 2. FIG. 8A is a plan view of a surface on which the IC 16 is not mounted, and FIG. FIG.

  Compared with the film package 3 shown in FIG. 2, the film package 21 has a configuration in which the alignment mark 15 is not provided and a sprocket portion 22 is added.

  The sprocket portion 22 is provided on each short side end (edge) of the film package 21 (film base material 11), that is, on the outside of each mounting portion 12. A sprocket hole 23 is continuously formed in the sprocket portion 22. The sprocket hole 23 is used for feeding out the film base 11 in the manufacturing process of the film package 21 during component mounting on the film base 11 or a test after mounting.

  In other words, a film-based package such as the film package 3 or the film package 21 is not individually manufactured, but is a long tape-shaped film substrate 11 as shown in FIG. And is wound around a conductive plastic reel 61 as shown in FIG. The sprocket holes 23 are used when the film is fed in each process in the production.

  FIG. 9A is a perspective view showing a state in which the film package 21 is wound around the plastic reel 61, and FIG. 9B is a plan view showing the film package 21 before being singulated.

  As shown in FIG. 9B, the film package 21 before being singulated is in the form of a long tape, and the sprocket portions 22 are provided at both ends in the width direction. The film package 21 is manufactured by being positioned so that the mounting portion 12 is disposed adjacent to the sprocket portion 22. The film package 21 is conveyed in a state of being wound on a plastic reel 61, and is separated into pieces when mounted on the printed circuit board 2.

  When winding on the plastic reel 61, as shown in FIG. 9A, the conductive embossed spacer 62 is wound together. The conductive embossed spacer 62 functions as a cushioning material between the packages, and prevents static electricity from accumulating in the components mounted on the package and electrostatic breakdown.

  In addition, since the sprocket part 22 is normally used in the manufacturing process of a film package, it is discarded after singulation. For example, in the case of the film package 3 shown in FIG. 2, the sprocket part 22 is discarded because it is punched into a rectangular shape and separated into pieces. On the other hand, in the film package 21 of the present embodiment, the sprocket portion 22 is used as it is without being discarded.

(Film package mounting method)
Next, a method for mounting the film package 21 on the printed circuit board 2 will be described with reference to FIG.

  FIGS. 10A to 10I are diagrams illustrating an example of a process for mounting the film package 21 on the printed circuit board 2.

  First, as shown in FIG. 10A, a film package 21 is prepared. Then, as shown in FIG. 10B, an upper jig 51 and a lower jig 52 are prepared. And the process shown to FIG.10 (b)-(e) is performed similarly to the process shown to FIG.3 (b)-(e).

  Subsequently, as shown in FIG. 10 (f), the film package 21 is transported together with the lower jig 52 to the printed circuit board 2 already installed in the mounter. At this time, the small electronic component 4 is already mounted on the mounting surface of the printed circuit board 2 and a mounting device including the sprocket 63 and the mounting portion crimping jig 64 is already mounted.

  The mounting apparatus is for placing the film package 21 on the mounting surface of the printed circuit board 2 in the same position. The mounting part crimping jig 64 is for crimping the mounting part 12 of the film package 21. Two mounting part crimping jigs 64 are arranged side by side on the mounting surface of the printed circuit board 2 so as to be positioned on each mounting part 12 of the film package 21 at the time of mounting. Further, the mounting portion crimping jig 64 is arranged at a predetermined interval from the mounting surface of the printed circuit board 2 so that the film package 21 can easily enter.

  Two sprockets 63 are gears, and two sprockets 63 are arranged next to the mounting portion crimping jig 64 so as to mesh with the sprocket holes 23 on both sides of the film package 21. The sprocket 63 is configured to be rotatable.

  Subsequently, as shown in FIG. 10G, the sprocket 63 is engaged with the sprocket hole 23 of the film package 21, and the sprocket 63 is rotated. Thereby, as shown in FIG.10 (h), the film package 21 is sent out. The film package 21 is inserted between the printed circuit board 2 and the mounting portion crimping jig 64 and is separated from the lower jig 52.

  When the sprocket 63 rotates a predetermined number of times, as shown in FIG. 10I, the film package 21 is completely pulled out from the lower jig 52 and reaches the mounting portion. After reaching the mounting portion, the mounting portion crimping jig 64 is pressed against the printed board 2 side, and the mounting portion 12 is crimped to the printed board 2 while applying heat or the like. Then, after crimping, the mounting device is removed.

  Thereby, as shown in FIG. 1, each mounting part 12 is pressure-bonded to the printed circuit board 2 so that the film package 21 straddles the small electronic component 4, and the section between the mounting parts 12 is formed in a U-shaped cross section. It can be mounted on the printed circuit board 2 in a bent state.

  In this mounting process, the film package 21 can be easily placed on the mounting surface of the printed circuit board 2 by using the sprocket holes 23 provided in the film package 21 without the need for alignment. It becomes possible to arrange.

[Embodiment 3]
The following will describe still another embodiment of the present invention with reference to the drawings. Configurations other than those described in the present embodiment are the same as those in the first and second embodiments. For convenience of explanation, members having the same functions as those shown in the drawings of Embodiments 1 and 2 are given the same reference numerals, and explanation thereof is omitted.

  In the electronic component mounting substrate 1 according to the first and second embodiments, the film package 3 and the film package 21 are folded at 90 ° at the folding positions P and Q (the spaces between the mounting portions 12 are U-shaped in cross section). It is mounted on the printed circuit board 2 in a bent state), but is not limited to this. The film package should just be mounted in the bent state so that it may have predetermined | prescribed height (space) with respect to the mounting surface 2a of the printed circuit board 2 which can straddle the components mounted below.

  In the present embodiment, as an example, a configuration in which a film package is mounted on the printed circuit board 2 in a state in which a space between the mounting portions 12 is bent in a cross-section shape and a mounting method thereof will be described.

(Configuration of component mounting board)
11A and 11B show a configuration example of the electronic component mounting board 31 according to the present embodiment, where FIG. 11A is a side view and FIG. 11B is a perspective view.

  As shown in FIG. 11, the electronic component mounting substrate 31 of the present embodiment is configured by mounting a film package 32, a small electronic component 4, and a large electronic component 5 on a printed circuit board 2.

  The film package 32 is an electronic part package in which an IC 16 (electronic component) is mounted on a film base material. As shown in FIG. 11A, the film package 32 is mounted on the printed circuit board 2 while being bent into a bow shape in a side view so as to have a predetermined height with respect to the mounting surface 2a of the printed circuit board 2. It is mounted on the surface 2a. Thereby, since a space is formed below (inside) the film package 3, it is possible to mount other electronic components.

(Structure of film package)
Next, a detailed configuration of the film package 32 will be described with reference to FIG.

  FIG. 12 shows an example of the configuration of the film package 32 before being mounted on the printed circuit board 2. FIG. 12A is a plan view of a surface on which the IC 16 is not mounted, and FIG. FIG.

  The film package 32 differs from the film package 21 shown in FIG. 8 in the arrangement of the sprocket portions 22. That is, in the film package 32, the sprocket part 22 in which the sprocket hole 23 is formed is provided at each long side end (edge). This is because the position of the package formed on the film substrate 11 is different from that of the film package 21 in the manufacturing process of the film package 32.

  FIG. 13A is a perspective view showing a state in which the film package 32 is wound around the plastic reel 61, and FIG. 13B is a plan view showing the film package 32 before being singulated.

  As shown in FIG. 13B, the film package 32 before being singulated is in the form of a long tape, and the sprocket portions 22 are provided at both ends in the width direction. The film package 32 is manufactured by being positioned so that the mounting portion 12 is disposed along the width direction of the film base 11 (so that the mounting portion 12 and the sprocket portion 22 are vertical). As shown in FIG. 13A, the film package 32 is conveyed in a state of being wound around a plastic reel 61 together with a conductive embossed spacer 62, and is separated into pieces when mounted on the printed circuit board 2.

  Depending on the punching position at the time of singulation, the mounting portion 12 is not strictly positioned at the end on the short side of the film package 32, but the film base material 11 remaining as a punching margin is also mounted on the printed circuit board 2. It becomes the mounting part.

(Film package mounting method)
Next, a method for mounting the film package 32 on the printed circuit board 2 will be described with reference to FIGS.

  FIG. 14 is a perspective view illustrating a configuration example of a mounting apparatus used when the film package 32 is mounted on the printed circuit board 2. FIGS. 15A to 15C are diagrams illustrating an example of a process of mounting the film package 32 on the printed circuit board 2. FIGS. 16A to 16C are schematic views of the steps shown in FIGS. 15A to 15C as viewed from the side.

  In the mounting process of the film package 32, as shown in FIG. 14, a mounting apparatus including a sprocket 65, a guide mounting portion crimping jig 66 and a mounting portion crimping jig 67 is used. The mounting apparatus is for appropriately mounting the film package 32 on the mounting surface of the printed circuit board 2 by performing alignment, shaping, and pressure bonding of the film package 32.

  Two sprockets 63 are gears, and two sprockets 63 are arranged side by side so as to mesh with the sprocket holes 23 on both sides of the film package 32. The sprocket 63 is configured to be rotatable.

  The guide mounting portion crimping jig 66 is for shaping the film package 32 and crimping one mounting portion 12 of the film package 21. The guide mounting portion crimping jig 66 includes a crimping portion and a bow-shaped (curved) guide portion. The mounting portion crimping jig with guide 66 is a small size in which a crimping portion is positioned on one mounting portion 12 of the film package 32 during mounting, and the guide portion is already mounted on the mounting surface of the printed circuit board 2. It is arranged on the mounting surface of the printed circuit board 2 so as to be located above the electronic component 4.

  Further, as shown in FIG. 16A, the guide portion of the guide mounting portion crimping jig 66 is configured to sandwich the film package 32 while avoiding the IC 16.

  The mounting portion crimping jig 67 is for crimping the other mounting portion 12 of the film package 21. The mounting portion crimping jig 67 is held above by a tool or the like except during crimping.

  First, as shown in FIG. 14, FIG. 15 (a), and FIG. 16 (a), the mounting apparatus is installed on the printed circuit board 2 that is already installed in the mounting device and at least the small electronic component 4 is already mounted. . At this time, the mounting portion crimping jig with guide 66 is arranged at a predetermined interval from the mounting surface of the printed circuit board 2 so that the film package 32 can easily enter.

  Subsequently, the sprocket 65 is engaged with the sprocket hole 23 of the film package 32 and the sprocket 65 is rotated. Thereby, the film package 32 is sent out so that it may be inserted in the guide part of the mounting part crimping jig 66 with a guide. The film package 32 is sent out while being bent into a bow shape along the guide mounting part crimping jig 66. At this time, the film package 32 before being separated into pieces in a state of being wound around the plastic reel 61 is sent out.

  As shown in FIG. 15B and FIG. 16B, one mounting portion 12 of the fed film package 32 reaches the mounting portion of the printed circuit board 2. After reaching the mounting portion, the crimping portion of the guide mounting portion crimping jig 66 is pressed against the printed circuit board 2 side, and one mounting portion 12 is crimped to the printed circuit board 2 while applying heat or the like.

  Subsequently, the mounting portion crimping jig 67 is moved above the other mounting portion 12 and pressed against the printed circuit board 2 side while applying heat or the like, as shown in FIGS. 15 (c) and 16 (c). The other mounting portion 12 is pressure-bonded to the printed circuit board 2. After the pressure bonding, the film package 32 is cut by cutting the film substrate 11. Finally, the mounting device is removed.

  As a result, as shown in FIG. 11, the mounting portions 12 are pressure-bonded to the printed circuit board 2 so that the film package 32 straddles the small electronic component 4, and the space between the mounting portions 12 is bent into a bow-shaped section. In this state, it can be mounted on the printed circuit board 2.

  Further, in this mounting process, it is possible to automatically perform positioning, shaping, and crimping by simply sending out the film package 32 wound around the plastic reel 61 using the sprocket holes 23.

[Embodiment 4]
The following will describe still another embodiment of the present invention with reference to the drawings. Configurations other than those described in the present embodiment are the same as those in the first to third embodiments. For convenience of explanation, members having the same functions as those shown in the drawings of Embodiments 1 to 3 are given the same reference numerals, and descriptions thereof are omitted.

  In the electronic component mounting substrate 1 according to the first to third embodiments, for example, as illustrated in FIG. 1, the film package 3 is mounted on the printed circuit board 2 so as to be bridged by the two mounting portions 12. In such a configuration, when a large pressure is applied to the film package 3 from above, the film package 3 may be deformed. Therefore, it is desirable that the film package 3 is mounted in a strong state against pressure from above.

  In the present embodiment, a configuration of a film package having excellent mounting strength and a mounting method thereof will be described. That is, the electronic component mounting substrate 1 of the present embodiment includes a film package 41 shown in FIG. 17 instead of the film package 3.

(Structure of film package)
FIG. 17 shows one configuration example of the film package 41 before being mounted on the printed circuit board 2. FIG. 17A is a plan view of a surface on which the IC 16 is not mounted, and FIG. FIG. 18A is a perspective view showing a state before the insertion portion 46 is fixed when the film package 41 is bent and mounted, and FIG. 18B shows a state after the insertion portion 46 is fixed. It is a perspective view.

  Compared to the film package 3 shown in FIG. 2, the film package 41 has a configuration in which there are no alignment marks 15 and some cuts and cuts are formed in the film base 11.

  Specifically, the film base 11 is formed with a cut portion 42, a cut portion 43, a plug cut portion 44, and a cut portion 45. And since these are formed, as shown to Fig.18 (a) * (b), the film package 41 becomes a shape which can be bent-assembled.

  The cut portion 42 is formed in a straight line from the point where the bending position P and the side of the film base material 11 intersect to the folding position Q toward the vicinity of the center of the film base material 11. In other words, the cut portions 42 are formed inside from the four corners of the portion excluding the mounting portion 12, and are formed at four locations. As a result, the bending position Q is provided in the B-C portion and the B′-C ′ portion. Note that the cut portion 42 is formed at a position where it does not interfere with the wiring 13.

  The film package 41 is mounted on the mounting surface 2a of the printed circuit board 2 in a state where the film package 41 is bent by 90 ° at the bending positions P and Q, similarly to the film package 3 shown in FIG. However, since the cut portion 42 is formed, the insertion portion 46 having a plane continuous with the mounting surface of the IC 16 remains as shown in FIG.

  That is, in the film package 41, the part excluding the mounting part 12 is a rectangular part in plan view (electronic part mounting part) where the IC 16 is mounted by the notch part 42 and the electronic part mounting part. A trapezoidal portion in plan view (first connection portion and second connection portion) on which wiring 13 is formed, adjacent to each of the two opposing sides and adjacent to each mounting portion 12, and the other of the electronic component mounting portion It can also be expressed as being divided into trapezoidal insertion portions 46 (first insertion portion and second insertion portion) that are adjacent to two opposite sides of each other.

  The cut-out portion 43 is cut into a mountain shape (triangle), and B-C and B′-C ′ (bending position Q) on two sides different from the two sides on which the mounting portion 12 is disposed in the film package 41. ). That is, the cutout portion 43 is formed at a total of four locations, two at each end of the insertion portion 46 that forms the outer shape of the film package 41. Therefore, as shown in FIG. 18A, after the film package 41 is bent at the bending positions P and Q and the mounting portion 12 is pressure-bonded, the insertion portion 46 is bent downward by applying a force. The positions of the end (the film vertical portion 42 ′) formed by the portion 42 and the cutout portion 43 coincide with each other.

  The force applied when the film package 41 is folded at the folding positions P and Q is applied to a part of the insertion portion 46, so that the insertion portion 46 is also slightly deformed. However, since the cut-out portion 43 is cut in a mountain shape, the film vertical portion 42 ′ can easily enter the cut-out portion 43 even if deformation occurs.

  The insertion cut portion 44 has an acute angle formed by an end (film vertical portion 42 ′) formed by the cut and a perpendicular line perpendicular to the end where the mounting portion 12 is provided from the film vertical portion 42 ′. It is cut out in a straight line. A total of four insertion cuts 44 are formed in each film vertical part 42 ′. The cut portion 45 is a portion cut into a mountain shape (triangle) by a cut from the film vertical portion 42 ′ to the insertion cut portion 44.

  Therefore, when the insertion portion 46 is pushed in, the cutout portion 43 first reaches the cutout portion 45 and meshes therewith. After the cutout portion 43 reaches the cutout portion 45 and meshes, the force is further applied to the insertion portion 46 so that the cutout portion 43 reaches the depth of the insertion cutout portion 44 and meshes therewith.

  As a result, as shown in FIG. 18B, the insertion portion 46 has a trapezoidal portion (the first portion where the wiring 13 is formed) by the physical connection in which the cutout portion 43 and the insertion cutout portion 44 are engaged with each other. Connected to the connecting portion and the second connecting portion). Therefore, the film package 41 can have a package shape with less deformation due to pressure from above.

  In addition, as shown in FIG. 19, the insertion cut-in part 44 is between the acute angle (angle θ) formed by the film vertical part 42 ′ and a perpendicular line perpendicular to the mounting part 12 from the film vertical part 42 ′. However, it may be cut in a straight line along the vertical line. Further, the cut-out portion 45 is not necessarily provided, but functions as an introduction portion for engaging the cut-out portion 43 with the insertion cut-out portion 44. Therefore, by providing the cutout portion 45, the cutout portion 43 can be easily engaged.

  20A is a perspective view showing a state in which the film package 41 is wound around the plastic reel 61, and FIG. 20B is a plan view showing the film package 41 before being singulated.

  As shown in FIG. 20B, the film package 41 before separation is a long tape shape, and the sprocket portions 22 are provided at both ends in the width direction. The film package 41 is manufactured by being positioned so that the mounting portion 12 is disposed adjacent to the sprocket portion 22. As shown in FIG. 20A, the film package 41 is conveyed in a state of being wound around a plastic reel 61 together with a conductive embossed spacer 62, and is separated into pieces when mounted on the printed circuit board 2.

  Note that when cutting into individual pieces, that is, when the film package 41 is punched using a die or the like, the cutout portion 42, the cutout portion 43, the insertion cutout portion 44, and the cutout portion 45 are simultaneously punched out. Cut out. At this time, the film package 41 is fed in order using the sprocket holes 23, so that the film package 41 can be easily cut out while being set at the cutout position of the mold.

(Film package mounting method)
Next, a method for mounting the film package 41 on the printed circuit board 2 will be described with reference to FIG.

  21A to 21J are diagrams illustrating an example of a process for mounting the film package 41 on the printed circuit board 2.

  First, as shown in FIG. 21A, a film package 41 is prepared. Then, as shown in FIG. 21B, an upper jig 51 and a lower jig 52 are prepared. The steps shown in FIGS. 21C to 21H are basically performed in the same manner as the steps shown in FIGS. 3C to 3H. As a preparation for mounting, as shown in FIG. 21C, the mounting portion 12 (folding position P) of the film package 41 is bent by 90 °.

  As shown in FIG. 21 (h), after removing the lower jig 52, the film package 41 is folded at 90 ° at the folding positions P and Q so as to straddle the small electronic component 4 in the printed circuit board. 2 is mounted on the mounting surface. At this time, each insertion portion 46 is not bent.

  Subsequently, as shown in FIG. 21 (i), each insertion portion 46 of the film package 41 is bent downward (inward) while applying a force. At this time, each insertion part 46 bends along the part of BB 'and the part of CC' shown to Fig.17 (a). In addition, although the part of BB 'and the part of CC' may be bent, since the film base material 11 is highly flexible, it is not necessary to bend.

  Then, while further applying force to the insertion portion 46, the cutout portion 43 is inserted into the cutout portion 45 to reach the insertion cutout portion 44. Thereby, as shown in FIG. 21J, each insertion portion 46 is fixed.

  As a result, the mounting portion 12 is pressure-bonded to the printed circuit board 2 so as to straddle the small electronic component 4 and the film package 41 is bent at 90 ° at the bending position PQ, and each insertion portion 46 is bent inward. It can be mounted on the printed circuit board 2 in a state where it is physically connected to an adjacent portion.

  Since the film package 41 mounted in such a form has excellent mounting strength, it is possible to prevent deformation due to pressure from above. The film package 41 can be easily bent and assembled.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  INDUSTRIAL APPLICABILITY The present invention can be suitably used not only in the field related to a printed circuit board on which an electronic component is mounted, but also preferably in the field related to an electronic component package. It can also be widely used in the field related to the mounting method.

1, 31 Electronic component mounting board 2 Printed circuit board 3, 3a, 3b, 21, 32, 41 Film package 4 Small electronic component (electronic component)
5 Large electronic components (electronic components)
DESCRIPTION OF SYMBOLS 11 Film base material 12 Mounting part 13 Wiring 14 Solder resist 16 IC (electronic component)
22 Sprocket part 23 Sprocket hole 42 Cut part (cut)
42 'Film vertical part 43 Cut part (1st cut part)
44 Insert cutting part (2nd cutting part)
45 Cutting part (second cutting part)
46 Insertion portion 51 Upper jig 52 Lower jig 53 Opening portion 54 Mounting portion crimping jig 55 U-shaped jig (lower jig)
56 Triangular upper jig (Upper jig)
57 Triangular jig (lower jig)
58 pentagonal upper jig (upper jig)
59 Pentagonal jig (lower jig)
61 Plastic reel (reel)
62 Conductive embossed spacer 63 Sprocket 64 Mounting part crimping jig 65 Sprocket 66 Guided mounting part crimping jig (mounting jig)
67 Mounting part crimping jig (crimping jig)

Claims (8)

A film package in which at least one electronic component is mounted on a film base material for mounting on a printed circuit board on which the electronic component is mounted,
Before bending, it has a rectangular external shape in plan view, and mounting portions mounted on the printed circuit board are provided at the ends of two opposing sides, and the portions excluding the mounting portions are By an incision formed inside from four corners, an electronic component mounting portion located in the center, and a first connection portion adjacent to each of the two opposing sides of the electronic component mounting portion and adjacent to each mounting portion And a second connection part, and a first insertion part and a second insertion part adjacent to the other two opposite sides of the electronic component mounting part, respectively,
When mounted on the printed circuit board, the mounting parts are pressure-bonded to the printed circuit board so as to straddle the electronic parts mounted on the printed circuit board, and the first connection part, the electronic component mounting part, and the second connection The first insertion portion and the second insertion portion are bent inward and physically connected to the first connection portion and the second connection portion, and the portion is bent into a U-shaped section. A film package mounted on a printed circuit board. The first insertion part and the second insertion part have a first cutout part at an end forming the outer shape of the film package so as to be positioned on an extension line of a bending position of the first connection part and the second connection part. Each formed,
In the first connection part and the second connection part, a second cutout part is formed at each end formed by the cut,
2. The film package according to claim 1, wherein the physical connection is performed by the first cutting part and the second cutting part engaging each other.   The film package according to claim 2, wherein each of the first cut portions is cut into a mountain shape.   Each of the second cut-out portions has a perpendicular line extending perpendicularly to an end provided with the mounting portion from an end formed by the cut, or an end formed by the vertical line and the cut. The film package according to claim 2, wherein the film package is cut in a straight line between acute angles formed.   5. The film package according to claim 4, wherein each of the second cut portions is cut into a mountain shape by a cut from an end formed by the cut to the straight cut portion.   The electronic component mounting board | substrate which mounts the electronic component comprised with the film package of any one of Claims 1-5. In an electronic component mounting method for mounting a plurality of electronic components on a printed circuit board,
Including a mounting step of mounting a film package on which at least one electronic component is mounted on a film base material on the printed circuit board in a state where the film package is bent so as to straddle other electronic components mounted on the printed circuit board;
The film package has a rectangular outer shape in plan view before bending, and mounting portions mounted on the printed circuit board are respectively provided at the ends of two opposing sides, and the portions excluding the mounting portions However, due to the incisions formed on the inside from the four corners of the portion, the electronic component mounting portion located in the center is adjacent to one opposing two sides of the electronic component mounting portion and adjacent to the mounting portions. The first connecting portion and the second connecting portion, and the first inserting portion and the second inserting portion adjacent to the other two opposite sides of the electronic component mounting portion, respectively,
In the mounting step, the film package is bonded to the printed circuit board with the mounting portions, the first connection portion, the electronic component mounting portion, and the second connection portion are bent into a U-shaped cross section, and the first A mounting method of an electronic component, wherein the first insertion portion and the second insertion portion are bent inward and are physically connected to the first connection portion and the second connection portion. . The mounting process is
By placing the film package on a lower jig with a U-shaped cross section placed on a flat table, and pressing the film package with an upper jig with a U-shaped cross section from above A bending step of bending the first connection portion, the electronic component mounting portion, and the second connection portion of the film package into a U-shaped cross section;
After removing the upper jig, the folded film package is conveyed to the printed circuit board together with the lower jig, and is placed in a mounting position so as to straddle the other electronic components,
A crimping step of crimping each mounting portion of the film package to the printed circuit board;
An extraction step of extracting the lower jig from the film package;
A connection step of bending the first insertion portion and the second insertion portion of the film package inward to physically connect the first insertion portion and the second connection portion to each other. The electronic component mounting method described.

Images