JP2010282881A - Heating device with cooling function - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heating device having a cooling function, excellent in heating efficiency and cooling efficiency, with less risk of giving bad influences to various characteristics of an object to be treated and relatively low in manufacturing cost. <P>SOLUTION: The heating device E1 includes an anode electrode 7 on which a tray 5 and a substrate 6 are mounted and heating members 31 and cooling members 32 buried in the anode electrode 7 from one end part to the other end part. The heating member 31 includes five pipe-like heaters 31 parallely arranged to be adjacent to each other, having a curved part 31a having a U-like plane shape at a point near the other end part of the anode electrode 7 and having a linear part 31b at a position other than that. The cooling member 32 includes seven cooling pipes 32 parallely arranged adjacent to each other along the outside of respective pipe-like heaters 31, having a meandering part 32c at a point facing the curved part 31a of a corresponding pipe-like heater 31 and having a linear part 32b at positions other than that. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a heating apparatus having a cooling function, and more particularly to a heating apparatus having a cooling function used for heating or firing a workpiece to a desired temperature, for example.

  2. Description of the Related Art Conventionally, as a heating device having a cooling function used for baking an object to be processed in semiconductor and liquid crystal panel baking processes and film forming processes, for example, the one described in Patent Document 1 is known.

JP-A-9-260029

  The heating device described in Patent Document 1 includes a base plate made of, for example, a metal plate, and a face plate made of, for example, a metal plate provided on one surface of the base plate. The base plate has a first groove formed on one side thereof and a second groove formed on the other side opposite to the one side. A cooling pipe for cooling the base plate is embedded in the first groove, and a sheathed heater for heating the base plate is embedded in the second groove. The cooling pipe has a contact surface that is flush with the one surface of the base plate and is exposed to the one surface. Further, the contact surface is in contact with one surface of the face plate facing the one surface of the base plate.

  According to the above heating device, since the cooling pipe and the sheathed heater are respectively embedded in the first groove and the second groove formed on the front and back surfaces of the base plate, and a part of the cooling pipe is in contact with the face plate, It is said that the heat treatment efficiency of the semiconductor in the baking process and the film forming process and the heating rate and cooling rate in the cooling process can be improved.

  However, when the above heating apparatus is applied to a plasma processing apparatus for performing plasma processing on the surface of an object to be processed, the following problems occur.

  That is, a sheathed heater is applied to a plasma processing electrode as a heating unit for heating an object to be processed in a plasma processing chamber of a plasma processing apparatus, and a cooling pipe is used to cool the electrode heated by the heating unit. If it applies to the same electrode as a cooling part for doing, a heating part and a cooling part will be provided in each slot for fitting in the front and back both sides of the electrode.

  For this reason, prior to providing the heating unit and the cooling unit in the above-described heating device, an operation or a process of forming a heating unit fitting groove and a cooling unit fitting groove on both surfaces of the plasma processing electrode is required. . In addition, in order to form such fitting grooves on both surfaces of the electrode, it is necessary to ensure that the electrode has a certain thickness or more. For these reasons, as a result, the manufacturing cost of the heating device, and hence the manufacturing cost of the plasma processing device, increases.

  Further, when the heating unit is formed on the front side surface of the electrode and the cooling unit is formed on the back side surface of the electrode, a workpiece is placed on the front side surface of the electrode to perform plasma processing. Then, the heating of the object to be processed by the heating unit formed on the front side surface on which the object to be processed is placed is performed efficiently. However, since the cooling portion is on the back side surface of the electrode, it is inefficient to cool the front side surface of the electrode, which is relatively thick, from the back side surface.

  Therefore, for the purpose of solving the above-mentioned problems, the present inventor has proposed that a groove for fitting a heating part and a groove for fitting a cooling part on one surface or inside of a substrate for placing an object to be processed. And a heating device having a cooling function constructed so that a tubular heating part for heating the substrate and a tubular cooling part for cooling the substrate are fitted in each groove.

  Specifically, in this heating apparatus, the tubular heating part is composed of a plurality of folded heating members arranged in parallel with each other, and the tubular cooling part is arranged in parallel with each other along the outside or inside of each heating member. A plurality of folded cooling members disposed on the surface. Then, the plurality of folded heating members are arranged in the fitting grooves in the substrate, and the plurality of folded cooling members are arranged in the fitting grooves in the substrate, respectively.

  However, in such a heating apparatus, the folded portions of the plurality of heating members are positioned in a region facing the adjacent workpiece loading / unloading chamber in the plasma processing chamber of the plasma processing apparatus as described above. If the substrate is placed in the plasma processing chamber, the following new problem may occur.

  That is, in the area facing the workpiece loading / unloading chamber in the plasma processing chamber, the heat dissipation efficiency of the substrate at the portion corresponding to the folded portion of the heating member is worse than that at the other portion. The reason is that the radiant heat in the workpiece loading / unloading chamber is transmitted to the plasma processing chamber adjacent to the loading / unloading chamber, and the heat dissipation in the folded portion of the heating member in the plasma processing chamber is other than the folded portion of the heating member. This is probably because it is lower than the heat dissipation in the part.

  Further, in the same area, the folded portion of the cooling member is disposed corresponding to the folded portion of the heating member. However, the cooling of the folded portion of the heating member by the folded portion of the cooling member is sufficient for the above reason. Not done. For this reason, the cooling effect of the board | substrate by a cooling member is also inadequate. As a result, there is a possibility that various characteristics of the object to be processed after being placed on the substrate and processed will be adversely affected.

  The present invention has been made in consideration of the above situation. The problem is to provide a heating device having a cooling function that is excellent in heating efficiency and cooling efficiency, has no risk of adversely affecting the properties of the processed material after processing, and has a relatively low manufacturing cost. It is to be.

  According to the present invention, the heat conductive substrate on which the workpiece is placed, and the heating for heating the substrate disposed from one end portion of the substrate to the other end portion inside or on the surface of the substrate. And a cooling unit for cooling the substrate disposed in contact with the inside or the surface of the substrate from one end to the other end of the substrate, and the cooling unit and the substrate are in contact with each other. A heating device having a cooling function is provided in which the contact surface area of the portion is larger in the portion closer to the other end than in the portion closer to the one end of the substrate.

  Examples of the material constituting the thermally conductive substrate include stainless steel, steel, and aluminum alloy. The heating unit for heating the substrate and the cooling unit for cooling the substrate may be provided in an embedded manner so that each or all of them are embedded inside the substrate. May be provided so as to be exposed from the surface of the substrate.

  The heating unit and the cooling unit are disposed from one end of the substrate to the other end. The heating unit may be disposed in contact with the inside or the surface of the substrate, or may be disposed in a non-contact state with the inside or the surface of the substrate. On the other hand, the cooling unit is disposed in contact with the inside or the surface of the substrate. This is because the substrate needs to be cooled more efficiently.

  In the heating apparatus according to the present invention, the contact surface area of the portion where the cooling unit and the substrate are in contact is larger than the contact surface area of the substrate near the one end portion than the contact surface area at the other end portion. Has been. The reason is that the cooling efficiency at the location near the other end of the substrate is greater than the cooling efficiency at the location near the one end of the substrate.

  Here, the “contact surface area” at a certain location refers to the total surface area of the contact portion composed of a flat surface and / or a curved surface where the cooling unit disposed in contact with the substrate and the substrate are in contact with each other. .

  The difference in the contact surface area between the cooling part and the substrate between the part near the other end of the substrate and the part near the one end is that the cooling efficiency at the part near the other end of the substrate is reduced toward the one end. It is for solving a part of the above-mentioned subject of this invention by making it larger than the cooling efficiency in. A specific example of a configuration that causes the above-described difference regarding the contact surface area between the cooling unit and the substrate between the other end portion and the one end portion of the substrate will be described later.

  The heating unit in the heating device of the present invention is composed of, for example, a plurality of folded heating members arranged in parallel with each other. The cooling unit in this heating device is constituted by, for example, a plurality of folded cooling members arranged in parallel with each other along the outer side or the inner side of each folded heating member.

  At this time, the substrate can be formed from, for example, a pair of substrate halves that are joined to face each other in the thickness direction. And a heating member fitting groove and a cooling member fitting groove are formed in at least one of two opposing surfaces of these board | substrate half bodies. As the cross-sectional shape of these fitting grooves, a circular shape, an elliptical shape, a semicircular shape, a semi-elliptical shape, a rectangular shape, and the like corresponding to the cross-sectional shape of the heating member / cooling member can be considered.

  Here, the plurality of heating members and the plurality of cooling members are disposed, for example, such that each cooling member is along the outside of each heating member. That is, the plurality of heating members and the plurality of cooling members are placed in a fixed position on the substrate by the respective heating members being fitted into the heating member fitting grooves and the respective cooling members being fitted into the cooling member fitting grooves. Arranged. Then, the plurality of heating members and the plurality of cooling members are sandwiched between the pair of substrate halves joined together in the state of being arranged as described above.

  At this time, each of the plurality of heating members can be configured as, for example, a U-shaped member having a U-shaped curved portion near the other end of the substrate.

  When the plurality of heating members are configured in this way, the structure that brings about the above-described difference in the contact surface area between the cooling unit and the substrate between the portion near the other end of the substrate and the portion near the one end. As a specific example, there is a heating device in which each of the plurality of cooling members has a meandering portion at a location facing the curved portion of the corresponding heating member.

  Here, the “meandering portion” in the cooling member refers to a tortuous portion consisting of one S-shape provided at a specific portion of the cooling member (for example, a portion facing the curved portion of the corresponding heating member), or one A winding portion consisting of a plurality of S-shaped parts.

  The meandering portion of each cooling member is a portion for additionally cooling the curved portion of the corresponding heating member and the vicinity thereof.

  Each of the plurality of heating members and the plurality of cooling members can be configured as, for example, a U-shaped member having a U-shaped curved portion near the other end of the substrate.

  When the plurality of heating members and the plurality of cooling members are configured as described above, the contact surface area between the cooling unit and the substrate between the other end portion of the substrate and the one end portion of the substrate is as described above. As a specific example of the configuration that brings about the difference, the substrate further includes a cooling promotion member disposed outside the plurality of heating members and the plurality of cooling members inside the substrate, and the cooling promotion member is located near the other end of the substrate. The heating apparatus which has a meandering part in the location which faces the curved part of a some heating member is mentioned.

  The cooling promotion member is provided in addition to the cooling member that cools the substrate, and further increases the cooling efficiency of the substrate. Here, the “meandering portion” in the cooling promotion member is a tortuous portion consisting of one S-shape provided at a specific location of the cooling promotion member (for example, a location facing the curved portion of the corresponding heating member) or A winding portion consisting of a series of S-shaped.

  The meandering portion of the cooling promoting member is a portion for additionally cooling the curved portions of the plurality of heating members and the vicinity thereof. Here, the portion other than the meandering portion of the cooling promoting member is a portion for additionally cooling mainly the portion other than the curved portion of the heating member.

  In addition, as another specific example of the configuration that brings about the above-described difference in the contact surface area between the cooling unit and the substrate between the other end portion of the substrate and the one end portion, A heating device having a large-diameter portion where the diameter of the cooling member is larger than the other portions at the portions facing the curved portion of the corresponding heating member and the vicinity thereof can be cited. Here, the large-diameter portion of each cooling member is a portion for additionally cooling the curved portion of the corresponding heating member and the vicinity thereof.

  Any of the plurality of heating members as the heating section in the heating device of the present invention can be constituted by, for example, a sheathed heater. The plurality of cooling members as the cooling unit can be configured from, for example, a cooling gas flow pipe.

  Here, the cooling gas flow pipe is made of a material whose thermal conductivity is lower than that of the material (for example, stainless steel, steel, aluminum alloy, etc.) constituting the substrate (for example, stainless steel for aluminum alloy). More preferably, it is made of steel, steel, etc. When the cooling gas flow pipe is made of such a material, it is possible to suppress a rapid increase in the temperature of the cooling gas, so that the heating / cooling control of the substrate can be performed more effectively. Become.

  As the cooling gas introduced into the cooling gas flow pipe, a gas having low thermal conductivity, for example, air, oxygen, nitrogen, argon, hydrogen, etc. is used. It is preferable to select a gas species that does not easily react with the atmospheric gas around the heating device. When the atmospheric gas is a combustible gas, nitrogen, argon, or the like is preferably used as the cooling gas.

  Furthermore, it is more preferable that the plurality of heating members are configured so that the heating temperature can be controlled independently of each other, and the plurality of cooling members are configured so that the cooling temperature can be controlled independently of each other. When the plurality of heating members and the plurality of cooling members are configured in this manner, it becomes possible to selectively heat / cool a specific portion of the substrate, and the accuracy of the heating / cooling control for the entire substrate. It becomes possible to improve.

  A heating apparatus having a cooling function according to the present invention includes a thermally conductive substrate on which an object to be processed is placed, and a substrate disposed from one end of the substrate to the other end inside or on the surface of the substrate. A heating unit for heating, and a cooling unit for cooling the substrate disposed in contact with the inside or the surface of the substrate from one end to the other end of the substrate. The contact surface area of the portion in contact with the substrate is larger at the portion near the other end than at the portion near the one end of the substrate.

  Then, due to the above-described difference in the contact surface area between the cooling part and the substrate between the position near the other end of the substrate and the position near the one end, the cooling efficiency at the position near the other end of the substrate becomes one end. It becomes larger than the cooling efficiency at the side portion. Therefore, according to this heating apparatus, when the other end portion of the substrate is disposed in an area facing the workpiece loading / unloading chamber in the plasma processing chamber, the cooling efficiency of the substrate in the area can be improved. . As a result, it is possible to avoid the possibility that the various characteristics of the object to be processed placed on the substrate and processed will be adversely affected.

  Further, according to this heating device, since the configuration is as described above rather than the configuration in which grooves are formed on both surfaces of the plasma processing electrode as in the heating device described in Patent Document 1, the manufacturing cost is relatively low. Few.

It is a schematic front view of the plasma processing apparatus with which each heating apparatus (E1-E3) in Embodiment 1-3 of this invention was integrated. It is a top view of heating apparatus E1 in Embodiment 1 of this invention. It is a cross-sectional side view of the heating apparatus E1 along the AA line of FIG. It is an exploded view of the heating apparatus E1 shown by FIG. It is a top view of the heating apparatus E2 in Embodiment 2 of this invention. It is a top view of the heating apparatus E3 in Embodiment 3 of this invention.

  Hereinafter, three preferred embodiments of the present invention will be described with reference to FIGS. Note that the present invention is not limited by these.

Embodiment 1
As shown in FIG. 1, the plasma processing apparatus D in which the heating apparatus E1 according to Embodiment 1 is incorporated includes a first vacuum chamber 1 and a second vacuum chamber 2 that are provided adjacent to each other. These two vacuum chambers 1 and 2 are configured by dividing one casing that extends in a straight line from side to side in the longitudinal direction into two on the left and right sides by one isolation gate valve 4 that can be opened and closed.

  The two vacuum chambers 1 and 2 are both made of stainless steel, and the inner surface is mirror-finished. The gate valve 4 is configured to be movable up and down. The two vacuum chambers 1 and 2 are in communication with each other when the gate valve 4 is raised, and the two vacuum chambers 1 and 2 are isolated at the lowest position.

  The first vacuum chamber 1 is a workpiece loading / unloading chamber for loading / unloading a plate-shaped workpiece (here, the tray 5 and the plasma processing substrate 6 mounted on the tray 5). Has been. The second vacuum chamber 2 is a plasma processing chamber connected to the workpiece loading / unloading chamber 1 adjacent to the workpiece for performing plasma processing on the workpiece.

  Further, the workpiece loading / unloading chamber 1 is connected to an external vacuum pump 14 via an opening / closing valve 16a. The plasma processing chamber 2 is connected to an external vacuum pump 14 via an open / close valve 16a and a pressure adjustment valve 16b. The workpiece loading / unloading chamber 1 is provided with a workpiece loading / unloading door 17 on the entrance / exit side. The plasma processing chamber 2 is connected to a reaction gas introduction pipe 19 for introducing a plasma processing reaction gas. The workpiece loading / unloading chamber 1 is connected to a leak gas introduction pipe 20.

  A plurality of rollers 202 and 202 that convey the tray 5 on which the plasma processing substrate 6 is mounted in the workpiece loading / unloading chamber 1 and the plasma processing chamber 2 to the left and right in a state where the tray 5 is sandwiched between the front and rear long sides thereof. ... 202 (only the front roller is shown in FIG. 1) is provided.

  A plasma processing anode electrode 7 is provided in the plasma processing chamber 2. The anode electrode 7 and the tray 5 are electrically connected and grounded. Further, a plasma processing cathode electrode 18 is provided above the anode electrode 7 in the plasma processing chamber 2 so as to face each other. The cathode electrode 18 is electrically connected to a high frequency power source 23 via a capacitor 21 and a matching circuit 22 outside the plasma processing chamber 2.

  The anode electrode 7 constitutes a part of each component of the heating devices E1 to E3 in the first to third embodiments of the present invention for performing temperature control (heating / cooling) of the tray 5 and the substrate 6. .

  That is, as shown in FIGS. 1 and 2, heating apparatus E1 according to Embodiment 1 of the present invention is an aluminum alloy as a thermally conductive substrate on which tray 5 and substrate 6 that are objects to be processed are placed. The anode electrode 7 and a plurality of folded heating members 31 as heating portions for heating the anode electrode 7 embedded in the anode electrode 7 from one end to the other end in contact. ,..., 31, and a plurality of folded cooling members 32 as cooling portions for cooling the anode electrode 7 embedded in contact with the anode electrode 7 from one end portion to the other end portion. , ..., 32.

  These heating members 31,..., 31 have curved portions 31a,..., 31a having a U-shaped planar shape near the other end of the anode electrode 7, and linear portions 31b at other locations. ,..., 31b, and is composed of seven U-shaped tubular heaters (here, sheathed heaters) 31,.

  These cooling members 32, ..., 32 are all made of stainless steel. These cooling members 32,..., 32 are serpentine portions at the portions facing the curved portions 31a,..., 31a of the tubular heaters 31,. 32c, linear portions 32b,..., 32b at other locations, and adjacent to each other in parallel along the outside of each tubular heater 31,. The cooling pipes (here, nitrogen gas flow pipes for cooling) 32,..., 32 are provided as seven substantially U-shaped members. Each of the cooling pipes 32 can be discharged to the outside after circulating the cooling gas introduced therein.

  These tubular heaters 31,..., 31 and cooling pipes 32,..., 32 are provided at the same height inside the anode electrode 7 (see FIG. 3). Each tubular heater 31 is connected to an external heater wire 33 at one end of the anode electrode 7. Further, these tubular heaters 31,..., 31 can be controlled in heating temperature independently of each other, and these cooling pipes 32,..., 32 can be controlled in cooling temperature independently of each other. Is.

  As shown in FIGS. 3 and 4, the anode electrode 7 is formed of anode electrode halves 7a and 7b as a pair of substrate halves joined to face each other in the thickness direction. The tubular heaters 31,..., 31 and the cooling pipes 32,..., 32 are sandwiched between the pair of anode electrode halves 7a, 7b.

  That is, grooves 8a,..., 8a, 8b,... For fitting the cooling pipes 32, ..., 32 are respectively fitted into the two facing surfaces 10a, 10b of the anode electrode halves 7a, 7b. 8b and grooves 9a,..., 9a, 9b... 9b for fitting the tubular heaters 31,. The tubular heaters 31,..., 31 and the cooling pipes 32,..., 32 are fitted with the tubular heaters 31 fitted in the grooves 9a and 9b and the respective cooling pipes 32 fitted in the grooves 8a and 8b. Are sandwiched between a pair of joined anode electrode halves 7a and 7b.

  Next, with reference to FIG. 3 and FIG. 4, the structure of the heating apparatus E1 and its manufacturing method are demonstrated.

  To fit the tubular heaters 31,..., 31 and the grooves 8a,..., 8a, 8b,. The grooves 9a,..., 9a, 9b,..., 9b can be formed, for example, by performing groove forming cutting in advance on the flat facing surfaces 10a, 10b of the anode electrode halves 7a, 7b. it can.

  These grooves 8a, ..., 8a, 8b, ... 8b, 9a, ..., 9a, 9b, ..., 9b are planes viewed from the facing surfaces 10a, 10b of the anode electrode halves 7a, 7b. The shape is substantially U-shaped or U-shaped. The cross-sectional shape of the grooves 8a, 8b may be any shape as long as the cooling pipes 32, ..., 32 are in contact with the inner surfaces of the grooves 8a, 8b. The cross-sectional shapes of the grooves 9a, 9b are Any shape that contacts the inner surfaces of the grooves 9a and 9b may be used.

  In the first embodiment, as shown in FIG. 4, the tubular heaters 31,..., 31 and the cooling pipes 32,. Further, the cross-sectional shapes of the grooves 8a, ..., 8a, 8b, ..., 8b, 9a, ..., 9a, 9b, ..., 9b are substantially the same as the cooling pipes 32, ... , 32 and the tubular heaters 31,...

  These anode electrode halves 7a and 7b can be integrated by caulking by cold rolling or by screwing. In the first embodiment, the anode electrode halves 7a and 7b are screwed together by screws 501, 501, and 501 so as to be integrated, so that the tubular heaters 31,. A heating device E1 including 32, ..., 32 is manufactured.

  In the heating device E1 thus manufactured, the tubular heaters 31,..., 31 and the cooling pipes 32,. It is embedded in contact with the anode electrode 7. Therefore, according to the heating device E1, it is possible to selectively control heating / cooling of specific portions of the tray 5, the substrate 6, and the anode electrode 7 that are objects to be processed.

  In addition, the heating device E1 is provided with meandering portions 32c,..., 32c of the cooling pipes 32,..., 32 at locations facing the curved portions 31a,. It has been. Then, the contact surface area of the portion where the cooling pipes 32,..., 32 and the anode electrode 7 are in contact with each other is closer to the other end portion than to the one end portion of the anode electrode 7. It has been enlarged.

  Therefore, according to this heating device E1, the cooling efficiency of the anode electrode 7 at the location near the other end of the anode electrode 7, particularly the location facing the curved portions 31a,..., 31a of the tubular heaters 31,. It can be made larger than the cooling efficiency of the anode electrode 7 at a location other than the location near the other end of the anode electrode 7, particularly at a location facing the linear portions 31 b,. As a result, when the other end of the anode electrode 7 is disposed in an area facing the workpiece loading / unloading chamber 1 in the plasma processing chamber 2, the cooling efficiency of the anode electrode 7 in that area can be improved. . As a result, it is possible to avoid the possibility that the various characteristics of the workpiece to be processed placed on the anode electrode 7 will be adversely affected.

  Furthermore, according to this heating device E1, since it is not the structure which forms a groove | channel on both surfaces of the electrode for plasma processing like the heating apparatus described in patent document 1, it is the above structures, Therefore A manufacturing cost is also compared. Less.

Embodiment 2
As shown in FIGS. 1 and 5, the heating device E2 according to the second embodiment of the present invention includes an anode electrode 7 as a thermally conductive substrate on which a tray 5 and a substrate 6 that are objects to be processed are placed. A plurality of folded heating members 31,..., 31 serving as heating portions for heating the anode electrode 7 embedded in the anode electrode 7 in contact from one end portion to the other end portion. And a plurality of folded cooling members 32,..., 32 as cooling portions for cooling the anode electrode 7 embedded in the anode electrode 7 in contact from one end portion to the other end portion. And comprising.

  The heating members 31,..., 31 have curved portions 31a,..., 31a having a U-shaped planar shape near the other end of the anode electrode 7, and linear portions 31b,. .., 31b, and seven U-shaped tubular heaters (here, sheathed heaters) 31,..., 31 provided adjacent to each other in parallel.

  The cooling members 32,..., 32 have U-shaped curved portions 32a,..., 32a near the other end of the anode electrode 7, and linear portions 32b at other locations. ,..., 32b, and seven U-shaped cooling pipes (here, nitrogen for cooling) provided adjacent to each other in parallel along the outside of each tubular heater 31,. (Gas distribution pipe) 32...

  The heating device E2 includes a single cooling promotion tube (here, a cooling promotion member as a cooling promotion member disposed outside the tubular heaters 31,..., 31 and the cooling tubes 32,... 32 inside the anode electrode 7). A cooling nitrogen gas flow pipe) 35 is further provided.

  The cooling promotion pipe 35 includes a meandering portion 35a facing the curved portions 32a, ..., 32a of the seven tubular heaters 31, ..., 31 near the other end of the anode electrode 7, and the meandering portion 35a. It consists of linear portions 35b, 35b that are continuous and extend linearly along both side edges of the anode electrode 7.

  The meandering portion 35a of the cooling promotion tube 35 is a portion for additionally cooling the curved portions 32a,..., 32a of the seven tubular heaters 31,. Further, the linear portions 35b and 35b of the cooling promotion tube 35 are portions for additionally cooling the linear portions 31b and 31b of the two tubular heaters 31 and 31 mainly adjacent to both side edges of the anode electrode 7, respectively. It is.

  Other configurations, sizes, materials used, manufacturing methods, and the like in the heating device E2 are substantially the same as those in the heating device E1.

  In this heating device E2, the tubular heaters 31,..., 31 and the cooling pipes 32,..., 32 are in contact with the anode electrode 7 in the form of seven each inside the anode electrode 7 as described above. It is buried. Therefore, according to the heating device E2, it is possible to selectively control heating / cooling of specific portions of the tray 5, the substrate 6, and the anode electrode 7 that are the objects to be processed.

  Further, in the heating device E2, as described above, the meandering portion 35a facing the curved portions 32a,..., 32a of the seven tubular heaters 31,. A cooling promotion tube 35 is provided. As a result, the contact surface area of the locations where the cooling pipes 32,..., 32 and the cooling promotion pipe 35 and the anode electrode 7 are in contact with each other is closer to the other end than the one closer to the one end. It's bigger than that.

  Therefore, according to this heating device E2, the cooling efficiency of the anode electrode 7 at the location near the other end of the anode electrode 7, particularly the location facing the curved portions 31a,..., 31a of the tubular heaters 31,. It can be made larger than the cooling efficiency of the anode electrode 7 at a location other than the location near the other end of the anode electrode 7, particularly at a location facing the linear portions 31 b,. As a result, when the other end of the anode electrode 7 is disposed in an area facing the workpiece loading / unloading chamber 1 in the plasma processing chamber 2, the cooling efficiency of the anode electrode 7 in that area can be improved. . As a result, it is possible to avoid the possibility that the various characteristics of the workpiece to be processed placed on the anode electrode 7 will be adversely affected.

  Furthermore, according to this heating device E2, since it is not the structure which forms a groove | channel on both surfaces of the electrode for plasma processing like the heating apparatus described in patent document 1, it is the above structures, Therefore A manufacturing cost is also compared. Less.

Embodiment 3
As shown in FIGS. 1 and 6, the heating device E3 according to the third embodiment of the present invention includes an anode electrode 7 as a thermally conductive substrate on which a tray 5 and a substrate 6 as processing objects are placed. A plurality of folded heating members 31,..., 31 serving as heating portions for heating the anode electrode 7 embedded in the anode electrode 7 in contact from one end portion to the other end portion. And a plurality of folded cooling members 32,..., 32 as cooling portions for cooling the anode electrode 7 embedded in the anode electrode 7 in contact from one end portion to the other end portion. And comprising.

  The heating members 31,..., 31 have curved portions 31a,..., 31a having a U-shaped planar shape near the other end of the anode electrode 7, and linear portions 31b,. .., 31b, and five U-shaped tubular heaters (here, sheathed heaters) 31,..., 31 provided adjacent to each other in parallel.

  The cooling members 32,..., 32 have large diameter portions 32d,..., 32d having a larger diameter and small diameter portions 32e,. .., 31 is composed of five U-shaped cooling pipes (here, cooling nitrogen gas flow pipes) 32,..., 32 provided adjacent to each other in parallel along the outside of 31.

  That is, the large-diameter portion 32d of each cooling pipe 32 is a portion that is partially curved and the diameter of the cooling pipe 32 is larger than other portions. Each large-diameter portion 32d is provided at a portion (a portion from the other end portion of the anode electrode 7 to the central portion) facing the curved portion 31a of the corresponding tubular heater 31 and the vicinity thereof. Moreover, the small diameter part 32e of each cooling pipe 32 is a linear part, and the diameter of the cooling pipe 32 is a part smaller than another location. Each small-diameter portion 32e is provided at a location other than the large-diameter portion 32d (location from the central portion to one end portion of the anode electrode 7).

  The large-diameter portion 32d of each cooling pipe 32 is a portion for additionally cooling the curved portion 31a of the corresponding tubular heater 31 and the vicinity thereof.

  Other configurations, sizes, materials used, manufacturing methods, and the like in the heating device E3 are substantially the same as those in the heating device E1.

  In the heating device E3, the tubular heaters 31,..., 31 and the cooling pipes 32,..., 32 are in contact with the anode electrode 7 in five pieces inside the anode electrode 7 as described above. It is buried. Therefore, according to the heating device E3, it is possible to selectively control heating / cooling of specific portions of the tray 5 and the substrate 6 and the anode electrode 7 which are objects to be processed.

  In the heating device E3, the large-diameter portions 32d of the cooling pipes 32,... 32 are provided at the portions facing the curved portions 31a,. 32d is provided. Then, the contact surface area of the portion where the cooling pipes 32,..., 32 and the anode electrode 7 are in contact with each other is closer to the other end portion than to the one end portion of the anode electrode 7. It has been enlarged.

  Therefore, according to the heating device E3, the anode electrode 7 is located near the other end portion of the anode electrode 7, particularly at the portions facing the curved portions 31a,..., 31a of the tubular heaters 31,. The cooling efficiency is made larger than the cooling efficiency of the anode electrode 7 at a location other than the location near the other end of the anode electrode 7, particularly at a location facing the linear portions 31b,..., 31b of the tubular heaters 31,. be able to. As a result, when the other end of the anode electrode 7 is disposed in an area facing the workpiece loading / unloading chamber 1 in the plasma processing chamber 2, the cooling efficiency of the anode electrode 7 in that area can be improved. . As a result, it is possible to avoid the possibility that the various characteristics of the workpiece to be processed placed on the anode electrode 7 will be adversely affected.

  Furthermore, according to the heating device E3, the configuration is not the configuration in which the grooves are formed on both surfaces of the plasma processing electrode as in the heating device described in Patent Document 1, but the configuration is as described above. Less.

  The heating apparatus having a cooling function according to the present invention can be incorporated in a plasma processing apparatus for performing plasma processing on the surface of an object to be processed, as described in the first to third embodiments. In addition, the heating device having a cooling function according to the present invention can be applied to a wide range of uses as a heating device having a cooling function used for heating or baking a workpiece to a desired temperature.

1 ... 1st vacuum chamber (workpiece loading / unloading chamber)
2 ... Second vacuum chamber (plasma processing chamber)
4 ... Gate valve 5 ... Workpiece (tray)
6 ... Object to be processed (Plasma processing substrate)
7 ... Anode electrode (thermally conductive substrate)
7a ... Electrode half (substrate half)
7b .. Electrode half (substrate half)
8a .. Groove 8b .. Groove 9a .. Groove 9b .. Groove 10a .. Opposite surface 10b .. Opposite surface 14 ... Vacuum pump 16a .. Opening / closing valve 16b. Loading / unloading door 18... Cathode electrode 19... Reaction gas introduction pipe 20... Leak gas introduction pipe 21... Capacitor 22 ... Matching circuit 23. U-shaped member) (Heating member) (Heating part)
31a ·· curved portion 31b ·· linear portion 32 ... cooling pipe (U-shaped member) (substantially U-shaped member) (cooling member) (cooling portion)
32a ·· Curved portion 32b · · Straight portion 32c · · Serpentine portion 32d · · Large diameter portion 32e · · Small diameter portion 33 · · · Heater wiring 35 · · · Cooling promotion pipe (cooling promotion member)
35a ... Serpentine part 35b ... Linear part 202 ... Roller 501 ... Screw E1 ... Heating device E2 ... Heating device E3 ... Heating device

Claims (10)

  A heat conductive substrate on which an object is placed, a heating unit for heating a substrate disposed on one or both ends of the substrate on or inside the substrate, and the interior of the substrate Alternatively, the surface includes a cooling unit for cooling the substrate disposed in contact from one end of the substrate to the other end, and the contact surface area of the portion where the cooling unit and the substrate contact is A heating device having a cooling function in which a portion closer to one end of the substrate is made larger at a portion closer to the other end.   The heating unit includes a plurality of folded heating members arranged in parallel to each other, and the cooling unit includes a plurality of folded cooling members arranged in parallel to each other along the outer side or the inner side of each heating member. The heating device according to claim 1. The substrate is formed of a pair of substrate halves joined to face each other in the thickness direction, and a heating member fitting groove and a cooling member fitting groove are formed on at least one of the two opposing surfaces of these substrate halves. Formed,
In the plurality of heating members and the plurality of cooling members, each cooling member is disposed along the outside of each heating member, each heating member is in the heating member fitting groove, and each cooling member is in the above-mentioned The heating apparatus according to claim 2, wherein the heating apparatus is sandwiched between the pair of substrate halves joined together in a state of being fitted into the cooling member fitting groove.   4. The heating device according to claim 3, wherein each of the plurality of heating members is a U-shaped member having a U-shaped curved portion near the other end of the substrate.   5. The heating device according to claim 4, wherein each of the plurality of cooling members has a meandering portion at a position facing a curved portion of the corresponding heating member.   4. The heating device according to claim 3, wherein each of the plurality of heating members and the plurality of cooling members is a U-shaped member having a U-shaped curved portion at a location near the other end of the substrate.   A cooling promotion member disposed outside the plurality of heating members and the plurality of cooling members inside the substrate, wherein the cooling promotion member faces a curved portion of the plurality of heating members near the other end of the substrate The heating device according to claim 6, further comprising a serpentine portion.   The heating device according to claim 6, wherein each of the plurality of cooling members has a large-diameter portion in which a diameter of the cooling member is larger than other portions at a portion facing the curved portion of the corresponding heating member and the vicinity thereof. .   The heating device according to claim 2, wherein each of the plurality of heating members comprises a sheathed heater, and each of the plurality of cooling members comprises a cooling gas flow pipe.   The plurality of heating members are configured to be able to control the heating temperature independently of each other, and the plurality of cooling members are configured to be able to control the cooling temperature independently of each other. The heating device described.

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