JP2010278168A5 - - Google Patents
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- JP2010278168A5 JP2010278168A5 JP2009128391A JP2009128391A JP2010278168A5 JP 2010278168 A5 JP2010278168 A5 JP 2010278168A5 JP 2009128391 A JP2009128391 A JP 2009128391A JP 2009128391 A JP2009128391 A JP 2009128391A JP 2010278168 A5 JP2010278168 A5 JP 2010278168A5
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009128391A JP5385685B2 (en) | 2009-05-28 | 2009-05-28 | Cover-lay film, light-emitting element mounting substrate, and light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009128391A JP5385685B2 (en) | 2009-05-28 | 2009-05-28 | Cover-lay film, light-emitting element mounting substrate, and light source device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010278168A JP2010278168A (en) | 2010-12-09 |
| JP2010278168A5 true JP2010278168A5 (en) | 2011-01-27 |
| JP5385685B2 JP5385685B2 (en) | 2014-01-08 |
Family
ID=43424874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009128391A Expired - Fee Related JP5385685B2 (en) | 2009-05-28 | 2009-05-28 | Cover-lay film, light-emitting element mounting substrate, and light source device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5385685B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011007837A1 (en) * | 2011-04-21 | 2012-10-25 | Evonik Degussa Gmbh | Adhesive-free composite of a polyarylene ether ketone and a metal foil |
| JP2012244058A (en) * | 2011-05-23 | 2012-12-10 | Du Pont Mitsui Fluorochem Co Ltd | Reflector for light emitting diode and housing |
| JP2013074129A (en) * | 2011-09-28 | 2013-04-22 | Kuraray Co Ltd | Lcp board cover material and lcp circuit board using the same |
| JP6004795B2 (en) * | 2012-07-06 | 2016-10-12 | シチズンホールディングス株式会社 | LED light source device and light reflective substrate |
| JP2015191906A (en) * | 2014-03-27 | 2015-11-02 | 台虹科技股▲分▼有限公司 | Coating protection film having high temperature heat resistance and high reflectance for printed board |
| JP6033361B2 (en) * | 2015-05-07 | 2016-11-30 | 三井・デュポンフロロケミカル株式会社 | Molding |
| JP2015146469A (en) * | 2015-05-22 | 2015-08-13 | 株式会社クラレ | Lcp board cover material and lcp circuit board using the same |
| WO2019003775A1 (en) * | 2017-06-29 | 2019-01-03 | 京セラ株式会社 | Circuit board and light-emitting device provided with same |
| JP7226131B2 (en) * | 2019-06-25 | 2023-02-21 | 豊田合成株式会社 | Light emitting device and manufacturing method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3514668B2 (en) * | 1999-06-30 | 2004-03-31 | 三菱樹脂株式会社 | Coverlay film |
| JP5060707B2 (en) * | 2004-11-10 | 2012-10-31 | 日立化成工業株式会社 | Thermosetting resin composition for light reflection |
| JP4525917B2 (en) * | 2005-03-18 | 2010-08-18 | 株式会社クラレ | Polyamide resin composition for LED reflector molding and LED reflector |
| JP2007042668A (en) * | 2005-07-29 | 2007-02-15 | Toyoda Gosei Co Ltd | Led light emitting device |
| JP2007297601A (en) * | 2006-04-06 | 2007-11-15 | Hitachi Chem Co Ltd | Thermosetting resin composition for light reflection, substrate for loading photosemiconductor device using the same, method for producing the same, and photosemiconductor device |
| JP4938466B2 (en) * | 2007-01-12 | 2012-05-23 | 帝人株式会社 | Electronic mounting board, light reflective heat conductive coverlay film |
| JP5066376B2 (en) * | 2007-02-27 | 2012-11-07 | 株式会社タムラ製作所 | Solder resist composition for printed wiring board and printed wiring board |
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2009
- 2009-05-28 JP JP2009128391A patent/JP5385685B2/en not_active Expired - Fee Related