JP2010274480A - Method of manufacturing three-dimensional structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a three-dimensional structure, improving uniformity in a large area. <P>SOLUTION: A hydrophobic region 21 is provided according to the dripping position of resin in each of an upper substrate 11 and a lower substrate 12, and a hydrophilic region 22 is provided on the outside of the hydrophobic region 21. The resin 30 made of an ultraviolet curable resin is dropped on the lower substrate 12. While the resin 30 contacting the hydrophobic region 21 receives a surface force wetly spreading on the lower substrate 12, the resin 30 contacting the hydrophilic region 22 and the air 40, grows into a spherical shape in order to minimize the surface energy. The resin 30 is aligned on the hydrophobic region 21 of the lower substrate 12 and the dripping position is prescribed. The upper substrate 11 is disposed on the resin 30 to cure the resin 30. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for producing a three-dimensional structure suitable for forming a structure on a large-area substrate.

  A three-dimensional microstructure having an arbitrary shape with a size of several hundred nm to several tens of μm has been realized by ultraviolet lithography using a thick film resist, laser processing on a polyimide resin, or the like.

US Pat. No. 6,936,196

  However, any of these conventional methods has a problem that it is difficult to make uniform in a large area of, for example, 10 inches or more. That is, in lithography, there are problems such as uniform uniformity of the photomask and resist and development uniformity, and in laser processing, there is a problem of non-uniform laser output and removal of processing residue called debris. In addition, these processing methods are so-called subtraction methods, and most of the materials used are discarded, so that they have a large environmental load and are not desirable from the viewpoint of effective use of materials.

  Incidentally, Patent Document 1 discloses a method for forming a microlens by applying an electrowetting phenomenon to a conductive ultraviolet curable resin, positioning the ultraviolet curable resin (position movement), and changing the shape by contact angle control. Is described. However, in this conventional method, there is a problem that a resin mixture for imparting conductivity to the ultraviolet curable resin is necessary, and there are many restrictions on material properties such as transparency and curability. In addition, since it is necessary to insert an electrode into the ultraviolet curable resin in order to develop an electrowetting phenomenon, the electrode itself is inserted into the ultraviolet curable resin when the ultraviolet curable resin is cured by ultraviolet irradiation later, and the microlens. It was a function restriction. Furthermore, the UV curable resin is contact angle controlled at the three-way interface with the substrate and air, but if the microlens diameter is smaller than the capillary length (diameter approximately 2 mm), the lens shape is spherical. Due to restrictions, it was impossible to form a three-dimensional microstructure having an arbitrary shape.

  This invention is made | formed in view of this problem, The objective is to provide the manufacturing method of the three-dimensional structure which can improve a uniformity, when a base material of a large area is used.

  The method for producing a three-dimensional structure according to the present invention includes a step of dropping a resin on a lower substrate having a plurality of regions having different degrees of hydrophobicity and a step of curing the resin.

  According to the method for producing a three-dimensional structure of the present invention, the resin is dropped and cured on the lower substrate having a plurality of regions having different degrees of hydrophobicity. It is possible to automatically align the region having a large hydrophobicity and uniformly dispose the resin at a desired position over a large area.

It is sectional drawing showing the manufacturing method of the three-dimensional structure which concerns on the 1st Embodiment of this invention in order of a process. FIG. 2 is a plan view illustrating an example of a hydrophobic region and a hydrophilic region illustrated in FIG. FIG. 2 is a cross-sectional view illustrating a process following FIG. 1. It is sectional drawing showing the manufacturing method of the three-dimensional structure which concerns on the 2nd Embodiment of this invention in process order. It is sectional drawing showing the manufacturing method of the three-dimensional structure which concerns on the 3rd Embodiment of this invention. It is sectional drawing showing the other example of the manufacturing method shown in FIG. It is sectional drawing showing the manufacturing method of the three-dimensional structure which concerns on the 4th Embodiment of this invention. It is sectional drawing showing the other example of the manufacturing method shown in FIG. It is sectional drawing showing the manufacturing method of the three-dimensional structure which concerns on the 5th Embodiment of this invention. It is a perspective view showing the example of the three-dimensional structure obtained by the manufacturing method shown in FIG. It is sectional drawing showing the manufacturing method of the three-dimensional structure which concerns on the 6th Embodiment of this invention in process order. It is sectional drawing showing the structure of the display apparatus provided with the three-dimensional structure shown in FIG. FIG. 13 is a plan view illustrating a schematic configuration of a module including the display device illustrated in FIG. 12. It is a perspective view showing the external appearance of the application example 1 of the display apparatus shown in FIG. (A) is a perspective view showing the external appearance seen from the front side of the application example 2, (B) is a perspective view showing the external appearance seen from the back side. 12 is a perspective view illustrating an appearance of application example 3. FIG. 14 is a perspective view illustrating an appearance of application example 4. FIG. (A) is a front view of the application example 5 in an open state, (B) is a side view thereof, (C) is a front view in a closed state, (D) is a left side view, and (E) is a right side view, (F) is a top view and (G) is a bottom view. It is sectional drawing showing the manufacturing method of the three-dimensional structure which concerns on the modification 1 of this invention. 10 is a cross-sectional view illustrating an example of a three-dimensional structure obtained in Modification 1. FIG. It is a top view showing the manufacturing method of the three-dimensional structure which concerns on the modification 2 of this invention to process order. FIG. 22 is a cross-sectional diagram illustrating a process following the process in FIG. 21. FIG. 23 is an exploded perspective view illustrating a process following FIG. 22. It is sectional drawing showing the structure of the fuel cell provided with the three-dimensional structure shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The description will be given in the following order.
1. First embodiment (an example in which an upper base material is placed after dropping a resin on a lower base material, and the upper base material is removed while curing the resin)
2. Second Embodiment (Example of controlling contact angle by inserting pure water into a space between an upper base material and a lower base material)
3. Third embodiment (an example in which the upper contact angle and the lower contact angle are both 90 degrees or less and the aspect ratio is changed)
4). Fourth embodiment (example in which the upper contact angle and the lower contact angle are both 90 degrees or more and the aspect ratio is changed)
5). Fifth embodiment (example in which the upper contact angle is 90 degrees or less, the lower contact angle is 90 degrees or more, and the resin has a truncated cone shape)
6). Sixth Embodiment (Example in which resin is formed into a truncated cone shape using the electrode of the upper substrate)
7). Application examples (display devices and electronic equipment)
8). Modification 1 (microlens)
9. Modification 2 (Micro TAS and fuel cell)

(First embodiment)
1 to 3 show a method of manufacturing a three-dimensional structure according to the first embodiment of the present invention in the order of steps. This manufacturing method includes, for example, a step of dropping a resin on the lower substrate, a step of placing the upper substrate on the dropped resin, and a step of curing the resin.

(Process of dripping resin)
First, as shown in FIG. 1A, a plurality of regions having different degrees of hydrophobicity are provided on each of the upper base material 11 and the lower base material 12 made of a glass substrate or the like to correspond to the resin dropping position. The hydrophobicity of the region is relatively higher than other regions. Specifically, a hydrophobic region 21 is provided corresponding to the dropping position of the resin, and a region having a lower degree of hydrophobicity than the hydrophobic region 21, for example, a hydrophilic region 22 is provided outside the hydrophobic region 21. .

  When the ultraviolet curable resin is used as the resin, the hydrophobic region 21 and the hydrophilic region 22 are desirably formed of a material that is transparent (transmitted) with respect to the photosensitive wavelength of the ultraviolet curable resin. As such a hydrophobic area | region 21, organic films, such as parylene and PTFE (polytetrafluoroethylene), can be used, for example. As the hydrophilic region 22, an inorganic surface such as a quartz glass base surface can be used.

  It is assumed that the hydrophobicity of the hydrophobic region 21 or the hydrophilicity of the hydrophilic region 22 is expressed by the characteristics of the material itself. However, by subjecting the material surface layer to a surface roughening treatment by plasma irradiation or the like, it is possible to finely adjust the hydrophobic region 21 to the more hydrophobic side and the hydrophilic region 22 to the more hydrophilic side.

  The hydrophobic region 21 and the hydrophilic region 22 are used when the upper substrate 11 or the lower substrate 12 is used as a part of a completed three-dimensional structure, or when used for a display device (display device) or the like. For this, it is desirable that the processing material be transparent (transmitted) with respect to the visible light wavelength.

  The combination and planar shape of the hydrophobic region 21 and the hydrophilic region 22 are not particularly limited. For example, in the present embodiment, as shown in FIG. 2, for example, the hydrophobic regions 21 having a circular planar shape are arranged in a matrix, and the outside thereof is set as the hydrophilic region 22. The planar shape of the hydrophobic region 21 is not limited to a circle but may be a regular polygon such as a hexagon or an octagon.

  Next, as illustrated in FIG. 1B, a resin 30 made of, for example, an ultraviolet curable resin is dropped onto the lower base 12. The dripping amount of the resin 30 is calculated and controlled as a volume V that is the same as or simulates the volume of the final structure. Further, the number of drops of the resin 30, that is, the number of the hydrophobic regions 21 is a number required according to the use of the structure, and a large area is obtained by dropping the resin 30 by relative movement of the lower substrate 12 or the dispenser. Deployment is easily possible.

  At this time, the resin 30 in contact with the hydrophobic region 21 of the lower substrate 12 receives a surface force that wets and spreads on the lower substrate 12, while the resin 30 is in contact with the hydrophilic region 22 of the lower substrate 12 and the air 40. 30 is spherical in order to minimize its surface energy (to minimize surface area). In this way, the resin 30 is aligned with the hydrophobic region 21 of the lower base 12 to define the dropping position.

(Step of placing the upper substrate)
Subsequently, as illustrated in FIG. 1C, the upper base material 11 is disposed on the dropped resin 30. At this time, the gap (gap) G between the upper base material 11 and the lower base material 12 is made equal to the desired dimension of the structure.

  At this time, the resin 30 in contact with the hydrophobic region 21 of the upper substrate 11 receives a surface force that wets and spreads on the upper substrate 11, while being in contact with the hydrophilic region 22 of the upper substrate 11 and the air 40. 20 is spherical to minimize its surface energy (to minimize surface area). Thereby, the resin 30 is aligned with the hydrophobic regions 21 of the upper base material 11 and the lower base material 12, and the upper contact angle θ1 with respect to the upper base material 11 and the lower contact angle θ2 with respect to the lower base material 12 are respectively defined. The upper contact angle θ1 is defined by three interfaces between the resin 30, the air 40, and the upper base material 11, and the lower contact angle θ2 is defined by three interfaces between the resin 30, the air 40, and the lower base material 12. In addition, when the alignment force of the lower base material 12 is sufficiently strong, the hydrophobic region 21 of the upper base material 11 is not necessary.

(Step of curing resin)
When the upper contact angle θ1 and the lower contact angle θ2 of the resin 30 satisfy the desired angles, ultraviolet rays UV are irradiated from the back side of the lower substrate 12 at this point as shown in FIG. The resin 30 is cured. However, when the resin 30 has an oxygen inhibition characteristic, curing is performed in a vacuum or a nitrogen atmosphere. The upper contact angle θ1 and the lower contact angle θ2 can be measured using a microscope or the like.

  When either the upper base material 11 or the lower base material 12 is not necessary for the use of the obtained structure, as shown in FIG. 3A, the resin on the side opposite to the irradiation surface of the ultraviolet ray UV is used. It is assumed that the photosensitive level 30 is low. The upper substrate 11 may be peeled off from the interface of the uncured resin 30, and then the uncured portion of the resin 30 may be fully cured.

  As described above, the three-dimensional structure 1 having the structure 31 is formed on the lower base 12 as shown in FIG. The structure 31 is aligned with the hydrophobic region 21 of the lower substrate 12.

  As described above, in the present embodiment, since the resin 30 is dropped on the lower substrate 12 having the hydrophobic region 21 and the hydrophilic region 22 and then cured, the dropped resin 30 is transferred to the hydrophobic region 21. It is possible to align automatically. Therefore, by adding multiple drops of the resin 30, it becomes possible to arrange the resin 30 uniformly at a desired position over a large area. Further, it is possible to improve the alignment accuracy when combined with other members.

  Furthermore, since the resin 30 is dropped on the lower base material 12 by a dispenser or the like, the amount of material used is minimized, and it is possible to effectively use the material and reduce the environmental load.

(Second Embodiment)
FIG. 4 shows a method of manufacturing a three-dimensional structure according to the second embodiment of the present invention in the order of steps. This manufacturing method includes, for example, a step of adjusting the upper contact angle θ1 and the lower contact angle θ2 of the resin 30 before the resin 30 is cured after the upper base material 11 is disposed. This is different from the embodiment. Therefore, the process which overlaps with 1st Embodiment is demonstrated with reference to FIG. 1 thru | or FIG.

(Process of dripping resin)
First, in the same manner as in the first embodiment, hydrophobicity corresponding to the dropping position of the resin is applied to each of the upper base material 11 and the lower base material 12 by the steps shown in FIG. 1 (A) and FIG. A region 21 is provided, and a hydrophilic region 22 is provided outside the hydrophobic region 21.

  Next, in the same manner as in the first embodiment, the resin 30 is dropped onto the lower substrate 12 by the process shown in FIG.

(Step of placing the upper substrate)
Subsequently, in the same manner as in the first embodiment, the upper base material 11 is disposed on the dropped resin 30 by the process shown in FIG. At this time, a gap (gap) G between the upper base material 11 and the lower base material 12 is made equal to a desired dimension of the structure.

(Step of adjusting the upper contact angle θ1 and the lower contact angle θ2)
When the upper contact angle θ1 and the lower contact angle θ2 of the resin 30 do not satisfy the desired angles, the space between the upper base material 11 and the lower base material 12 is formed as shown in FIG. Filled with a hydrophilic conductive liquid, for example, pure water 41. The injection amount of the pure water 41 is calculated and controlled from the size of the structure to be formed, the size of the gap G between the upper base material 11 and the lower base material 12, and the areas of the upper base material 11 and the lower base material 12.

  Accordingly, as shown in FIG. 4A, new upper contact angle θ11 and lower contact angle θ21 of the resin 30 are defined. The upper contact angle θ11 is defined by three interfaces of the resin 30, the pure water 41, and the upper base material 11, and the lower contact angle θ21 is defined by three interfaces of the resin 30, the pure water 41, and the lower base material 12. .

(Step of curing resin)
When the new upper contact angle θ11 and lower contact angle θ21 of the resin 30 satisfy the desired angles, as shown in FIG. 4B, ultraviolet rays UV are irradiated at this time, and the resin 30 is temporarily cured. I do. In the present embodiment, since the space between the upper base material 11 and the lower base material 12 is filled with pure water 41, the factor of oxygen inhibition of the resin 30 is sufficiently avoided, and a vacuum or nitrogen atmosphere Irradiation with ultraviolet UV is not necessary. The upper contact angle θ11 and the lower contact angle θ21 can be measured using a microscope or the like.

  When either the upper base material 11 or the lower base material 12 is not necessary for the use of the obtained structure, as shown in FIG. 4B, the resin on the opposite side to the irradiation surface of the ultraviolet ray UV is used. It is assumed that the photosensitive level 30 is low. The pure water 41 is removed, the upper substrate 11 is peeled off from the interface of the uncured resin 30, and then the uncured portion of the resin 30 is fully cured.

  As described above, as shown in FIG. 4C, the three-dimensional structure 2 having the structure 32 is formed on the lower base 12. The structure 32 is aligned with the hydrophobic region 21 of the lower substrate 12.

  Thus, in this embodiment, the upper contact angle θ1 and the lower contact angle θ2 are adjusted by filling the space between the upper base material 11 and the lower base material 12 with a hydrophilic conductive liquid, for example, pure water 41. Therefore, it is possible to easily adjust the upper contact angle θ1 and the lower contact angle θ2 to form the structure 32 having any upper contact angle θ1 and lower contact angle θ2.

  When the area is large, the dimensional uniformity of the gap G between the upper base material 11 and the lower base material 12 is required. For this reason, for example, it is desirable to provide a spacer (not shown) in a portion that is not affected by fluctuations in the upper contact angle θ11 and the lower contact angle θ21 in the region where the pure water 41 is filled. In this case, it is assumed that the amount of pure water 41 injected by using the spacer is changed. The surface energy at the three interfaces of the resin 30, the pure water 41, and the upper base material 11 or the lower base material 12 is made uniform, and by providing the spacer, the capillary adhesive force by the resin 30 and the pure water 41 becomes uniform, An appropriate compressive stress is generated between the upper substrate 11 and the lower substrate 12. Therefore, the dimensional uniformity of the gap G is improved.

(Third embodiment)
5 and 6 show a method for manufacturing a three-dimensional structure according to the third embodiment of the present invention. In this embodiment, when the upper contact angle θ11 and the lower contact angle θ21 of the resin 30 are 90 ° or less, the aspect ratio is changed by increasing or decreasing the dripping amount of the resin 30 or changing the size of the gap G. It is made to let you. Except for this, the manufacturing method of the present embodiment is the same as that of the second embodiment, and the description of the overlapping steps is omitted.

  The aspect ratio is defined by the width W of the resin and the gap G. Therefore, for example, as shown in FIG. 5, the aspect ratio can be changed by increasing / decreasing the dropping amount of the resin 30 to increase / decrease the width W of the resin 30 to the width W1. Alternatively, the width W of the resin 30 can be increased by reducing the gap G between the upper base material 11 and the lower base material 12 to a gap G-δ as shown in FIG. Even in this way, the aspect ratio can be changed.

(Fourth embodiment)
7 and 8 show a method for manufacturing a three-dimensional structure according to the fourth embodiment of the present invention. This manufacturing method is different from the second embodiment in that the upper contact angle θ12 and the lower contact angle θ22 of the resin 30 are 90 ° or more. Therefore, the description of the overlapping process is omitted.

  In the present embodiment, each of the upper base material 11 and the lower base material 12 is provided with a large hydrophobic region 21A corresponding to the dropping position of the resin, and the small hydrophobic property outside the large hydrophobic region 21A. Region 21B is provided.

  When the ultraviolet curable resin is used as the resin, the large hydrophobic region 21A and the small hydrophobic region 21B are desirably formed of a material that is transparent (transmissive) to the photosensitive wavelength of the ultraviolet curable resin. Such a large hydrophobic region 21A is finely adjusted to the hydrophobic side by subjecting the surface layer of an organic film such as parylene or PTFE to a surface roughening treatment by plasma irradiation or the like. For example, a parylene or PTFE organic film can be used as the small hydrophobic region 21B.

  Furthermore, also in the present embodiment, it is possible to change the aspect ratio by increasing or decreasing the dripping amount of the resin 30 or changing the size of the gap G in the same manner as in the third embodiment. . That is, for example, as shown in FIG. 7, by increasing or decreasing the dropping amount of the resin 30, the aspect ratio can be changed by increasing or decreasing the width W of the resin 30 to the width W1. Alternatively, as shown in FIG. 8, the width W of the resin 30 can be increased by reducing the gap G between the upper base material 11 and the lower base material 12 to the gap G-δ. Even in this way, the aspect ratio can be changed.

(Fifth embodiment)
FIG. 9 shows a method for manufacturing a three-dimensional structure according to the fifth embodiment of the present invention. In the present embodiment, the upper substrate 11 is provided with a hydrophobic region 21 and a hydrophilic region 22, while the lower substrate 12 is provided with a large hydrophobic region 21A and a small hydrophobic region 21B. Accordingly, it is possible to set the upper contact angle θ11 to 90 degrees or less and the lower contact angle θ22 to 90 degrees or more to make the resin 30 into a truncated cone shape or a trapezoidal shape in which the side wall angle is gradually changed. Except for this, the manufacturing method of the present embodiment is the same as that of the second embodiment, and the description of the overlapping steps is omitted.

  FIG. 10 shows the overall configuration of the three-dimensional structure obtained by the manufacturing method of the present embodiment. The three-dimensional structure 5 has a truncated cone shape or a trapezoidal shape structure 35 whose side wall angle is gradually changed on the lower substrate 12. The structure 35 is aligned with the hydrophobic region 21A of the lower base 12.

  As will be described later, the three-dimensional structure 5 is used as a reflector (reflector) for improving the luminance of the display device. Moreover, it is also possible to manufacture a transfer mold by electroforming or the like using the large-area three-dimensional structure 5 as shown in FIG. 10 as a mother mold. When the aspect ratio of the structure 35 is increased, the structure 35 may be peeled off from the interface of the lower substrate 12 due to contact resistance with the electroforming transfer mold at the time of electroforming release, and may be buried in the electroforming transfer mold. . In this case, the resin 30 can be solved by using an ultraviolet curable resin having low surface energy or swelling and dissolution.

(Sixth embodiment)
FIG. 11 shows a method for manufacturing a three-dimensional structure according to the sixth embodiment of the present invention.
In this manufacturing method, an electrode is provided on the upper base material 11, and the upper contact angle and the lower contact angle of the resin 30 are controlled using this electrode to form a truncated cone shape.

(Process of dripping resin)
First, as shown in FIG. 11A, the resin 30 is dropped on the lower base 12. As in the fourth embodiment, the lower base 12 is provided with a large hydrophobic region 21A and a small hydrophobic region 21B.

(Step of placing the upper substrate)
Subsequently, as shown in FIG. 11A, the upper base material 11 is disposed on the dropped resin 30. At this time, the gap (gap) G between the upper base material 11 and the lower base material 12 is made equal to the desired dimension of the structure.

  Here, as in the fourth embodiment, the upper substrate 11 is provided with a large hydrophobic region 21A and a small hydrophobic region 21B. Further, in the present embodiment, the electrode 23 is provided between the upper substrate 11 and the small hydrophobic region.

(Step of adjusting the upper contact angle θ1 and the lower contact angle θ2)
After that, as shown in FIG. 11A, the space between the upper substrate 11 and the lower substrate 12 is filled with a hydrophilic conductive liquid, for example, pure water 41. The injection amount of the pure water 41 is calculated and controlled from the size of the structure to be formed, the size of the gap G between the upper base material 11 and the lower base material 12, and the areas of the upper base material 11 and the lower base material 12. At this time, the upper contact angle is θ12, and the lower contact angle is θ22.

  After the space between the upper base material 11 and the lower base material 12 is filled with pure water 41, as shown in FIG. 11 (B), the electrode 23 of the upper base material 11 is inserted negatively (−). A positive (+) voltage is applied to the pure water 41. As the voltage is applied, an electrowetting phenomenon occurs at the three interfaces of the resin 30, the pure water 41, and the upper substrate 11, and the upper contact angle θ12 decreases and gradually changes to θ11. The electrowetting phenomenon is an improvement in wettability caused by a decrease in the surface energy of pure water due to voltage application. A change in the lower contact angle θ22 does not occur, and a shape change in which the volume of the dropped resin 30 is the same occurs according to the size of the gap G between the upper substrate 11 and the lower substrate 12.

(Step of curing resin)
In this manner, temporary curing by ultraviolet irradiation is performed on the truncated cone-shaped resin 30 having the desired upper contact angle θ11 and lower contact angle θ22 at a certain applied voltage.

  When either the upper base material 11 or the lower base material 12 is not necessary for the use of the obtained structure, the photosensitive level of the resin 30 on the side opposite to the ultraviolet irradiation surface is set to a low state. The pure water 41 is removed, the upper substrate 11 is peeled off from the interface of the uncured resin 30, and then the uncured portion of the resin 30 is fully cured.

  As described above, the three-dimensional structure 5 having the truncated cone-shaped structure 35 is formed on the lower base 12 as shown in FIG.

  In the manufacturing method described above, the case where the electrode 23 is provided only on the upper base material 11 has been described. However, the lower contact angle θ22 may be adjusted by forming the electrode 23 on the lower base material 12 in the same manner. .

  As described above, in the present embodiment, the electrode 23 is provided between the upper base material 11 and the small hydrophobic region 21 </ b> B, and a negative voltage is applied to the electrode 23 and a positive voltage is applied to the pure water 41. Since the contact angle θ11 is adjusted, the upper contact angle θ11 can be freely adjusted. Therefore, it is possible to freely adjust the upper contact angle θ11 and the lower contact angle θ22 to form a structure 35 having an arbitrary shape as well as a spherical shape with a structure size equal to or shorter than the capillary length. In addition, since a voltage is applied between the electrode 23 and the pure water 41, it is not necessary to interpolate the electrode in the resin 30 and the optical function of the structure 35 is not restricted. Furthermore, it is possible to develop an electrowetting phenomenon without resin mixing that imparts conductivity to the resin 30, and it is possible to reduce the influence on various properties of the resin 30 such as transparency and curability.

(Display device)
FIG. 12 illustrates a configuration of a display device including the three-dimensional structure 5 illustrated in FIG. This display device is used for a mobile device or the like, and has a three-dimensional structure 5 as a reflector (reflector) on the light extraction side of the display panel 50. The display panel 50 is disposed on a support substrate 60 such as glass. A sealing frame 61 and an adhesive layer 62 are provided on the periphery of the support substrate 60. The display panel 50 and the three-dimensional structure 5 are bonded together by the adhesive layer 62, and the space between the display panel 10 and the three-dimensional structure 5 is a vacuum layer 70. Between the display panel 10 and the sealing frame 61, a getter 80 such as a sheet shape or a paste shape is disposed.

  The display panel 50 includes, as display elements, an organic light emitting element 50R that generates red display element light, an organic light emitting element 50G that generates green light, and an organic light emitting element that generates blue light. 50B are arranged in a matrix as a whole in order. A combination of adjacent organic light emitting elements 50R, 50G, and 50B constitutes one pixel.

  The driving substrate 51 is made of, for example, glass, silicon (Si) wafer, resin, or the like. A pixel driving circuit (not shown) is provided on the driving substrate 51. The organic light emitting elements 50R, 50G, and 50B are formed on the pixel drive circuit with a planarization layer (not shown) therebetween, and are covered with a protective film 52 as necessary.

  The three-dimensional structure 5 has a function as a reflector that increases the light extraction efficiency from the organic light emitting elements 50R, 50G, and 50B to improve the luminance, and the light generated by the organic light emitting elements 50R, 50G, and 50B. Is incident on the structure 35, reflected by the interface between the side surface of the structure 35 and the vacuum layer 70, and taken out to the outside.

  It is preferable that a light shielding film 13 as a black matrix is provided in a region excluding the structure 35 of the lower base 12. The light-shielding film 13 absorbs external light reflected by the organic light-emitting elements 50R, 50G, and 50B and the wiring between them, and improves contrast. For example, the optical density mixed with a black colorant is 1 or more. The black resin film, or a thin film filter using thin film interference. The thin film filter is formed by, for example, laminating one or more thin films made of metal, metal nitride, or metal oxide, and attenuating light by utilizing interference of the thin film. Specific examples of the thin film filter include those in which chromium and chromium oxide (III) (Cr 2 O 3) are alternately stacked. Note that the light shielding film 13 is not necessarily provided.

  The sealing frame 61 and the adhesive layer 62 are made of a thermosetting resin or an ultraviolet curable resin. Note that a fixing layer (not shown) for fixing the structure 35 to the display panel 50 is preferably provided between the protective film 52 of the display panel 50 and the front end surface of the structure 35. . This fixing layer is made of, for example, a heat bonding sheet or a potting agent. Note that the fixing layer is not necessarily bonded by thermal bonding, and the fixing layer is not limited to a sheet-like one.

  The arrangement location and the number of getters 80 are not particularly limited. For example, it is preferable to arrange the getters 80 so as to surround the display panel 50. As such a getter 80, it is possible to use a moisture getter for an organic light emitting device, specifically, “DryFlex (registered trademark)” or “GDO (getter dryer)” (CaO powder) manufactured by SAES Getters. It is. As the getter 80, a sintered porous non-evaporable getter used for a MEMS device package or a flat panel display, specifically, an HPTF getter which is a mixture of titanium and a Zr—V—Fe getter alloy, or It is also possible to use hydrogen-pulverized zirconium having a purity of 90% or more.

  Note that a reflective mirror film of metal or the like may be provided on the side surface of the structure 35 without providing the vacuum layer 70. In that case, if necessary, the periphery of the structure 35 may be embedded with an embedded layer such as a resin. Further, the three-dimensional structure 5 and the display panel 50 may be bonded together with an adhesive layer over the entire surface.

  This display device can be manufactured, for example, as follows.

  First, similarly to the fifth embodiment or the sixth embodiment, a three-dimensional structure 5 having a truncated cone-shaped structure 35 on the lower substrate 12 as shown in FIG. Form. A light shielding film 13 is provided in a region other than the structure 35 of the lower substrate 12 as necessary.

  Further, the organic light emitting elements 50R, 50G, and 50B are formed on the driving substrate 51, and the display panel 50 is formed by covering with the protective film 52 as necessary.

  Next, as shown in FIG. 12, the display panel 10 is disposed on the support substrate 60, and a fixing layer (not shown) made of, for example, a heat bonding sheet is formed on the protective film 52. Further, a sealing frame 61 is formed along the periphery of the support substrate 60, and an adhesive layer 62 is formed on the sealing frame 61. Between the display panel 50 and the sealing frame 61 on the support substrate 60, a getter 80 such as a sheet or paste is disposed.

  Subsequently, as shown in FIG. 12, the display panel 50 and the three-dimensional structure 5 are positioned and overlapped, and then the display panel 50 and the three-dimensional structure 5 are loaded into a vacuum chamber (not shown). Then, the inside of the vacuum chamber is decompressed, and the display panel 50 and the three-dimensional structure 5 are bonded together by the adhesive layer 62 by pressurizing and heating in a vacuum atmosphere. Thereby, the space between the display panel 50 and the three-dimensional structure 5 becomes the vacuum layer 70. Thus, the display device shown in FIG. 12 is completed.

  In this display device, light generated by the organic light emitting elements 50R, 50G, and 50B is incident from the front end surface of the structure 35, reflected by the interface between the side surface of the structure 35 and the vacuum layer 70, and extracted outside. The upper contact angle θ11 and the lower contact angle θ22 of the structure 35 are adjusted as described in the fifth embodiment or the sixth embodiment, and the side surface of the structure 35 has a shape that satisfies the total reflection condition. By adjusting so as to make it possible, the light can be extracted after being totally reflected, and the light extraction efficiency and luminance are improved.

  Here, since the three-dimensional structure 5 described in the fifth embodiment or the sixth embodiment is provided, the structure 35 is aligned with the hydrophobic region 21A of the lower base 12. Even when the lower substrate 12 having a large area is used, the positional accuracy of the structure 35 is high. Therefore, the optical coupling between the organic light emitting elements 50R, 50G, and 50B and the structure 35 is uniformly performed in the plane, and the in-plane uniformity of luminance is improved.

(Modules and application examples)
Hereinafter, application examples of the display device described in the above embodiment will be described. The display device according to the above embodiment is an image signal that is input from the outside or is generated internally, such as a television device, a digital camera, a notebook personal computer, a mobile terminal device such as a mobile phone, or a video camera. Alternatively, the present invention can be applied to display devices for electronic devices in various fields that display images.

(module)
The display device according to the above-described embodiment is incorporated into various electronic devices such as application examples 1 to 5 described later, for example, as a module as illustrated in FIG. In this module, for example, a region 210 exposed from the three-dimensional structure 5 and the sealing frame 61 is provided on one side of the support substrate 60, and the signal line driving circuit 120 and the scanning line driving circuit 130 are provided in the exposed region 210. The wiring is extended to form an external connection terminal (not shown). The external connection terminal may be provided with a flexible printed circuit (FPC) 220 for signal input / output.

(Application example 1)
FIG. 14 illustrates an appearance of a television device to which the display device of the above embodiment is applied. This television apparatus has, for example, a video display screen unit 300 including a front panel 310 and a filter glass 320, and the video display screen unit 300 is configured by the display device according to the above embodiment.

(Application example 2)
FIG. 15 shows the appearance of a digital camera to which the display device of the above embodiment is applied. The digital camera includes, for example, a flash light emitting unit 410, a display unit 420, a menu switch 430, and a shutter button 440. The display unit 420 is configured by the display device according to the above embodiment. .

(Application example 3)
FIG. 16 illustrates an appearance of a notebook personal computer to which the display device of the above embodiment is applied. The notebook personal computer has, for example, a main body 510, a keyboard 520 for inputting characters and the like, and a display unit 530 for displaying an image. The display unit 530 is a display device according to the above embodiment. It is comprised by.

(Application example 4)
FIG. 17 shows the appearance of a video camera to which the display device of the above embodiment is applied. This video camera has, for example, a main body 610, a subject photographing lens 620 provided on the front side surface of the main body 610, a start / stop switch 630 at the time of photographing, and a display 640. Reference numeral 640 denotes the display device according to the above embodiment.

(Application example 5)
FIG. 18 illustrates an appearance of a mobile phone to which the display device of the above embodiment is applied. For example, the mobile phone is obtained by connecting an upper housing 710 and a lower housing 720 with a connecting portion (hinge portion) 730, and includes a display 740, a sub-display 750, a picture light 760, and a camera 770. Yes. The display 740 or the sub-display 750 is configured by the display device according to the above embodiment.

(Modification 1)
FIG. 19 shows a method for manufacturing a three-dimensional structure according to Modification 1 of the present invention. In this manufacturing method, after the resin 30 is dropped on the lower substrate 12, the upper substrate 11 is not disposed, and the resin 30 is irradiated with ultraviolet rays UV while being spherical.

  FIG. 20 shows the configuration of the three-dimensional structure obtained in the first modification. The three-dimensional structure 7 has a spherical structure 37 on the lower substrate 12. Similar to the fifth embodiment, the lower base 12 is provided with a large hydrophobic region 21A and a small hydrophobic region 21B. The structure 37 is aligned with the hydrophobic region 21A of the lower base 12 and the lower contact angle θ22 of the structure 37 with respect to the lower base 12 is 90 degrees or more. This three-dimensional structure 7 can be used as, for example, a microlens.

(Modification 2)
21 to 23 show a method for manufacturing a three-dimensional structure according to Modification 2 of the present invention in the order of steps. First, as shown in FIG. 21, a planar shape corresponding to a flow channel to be formed, for example, a meandering small hydrophobic region 21B (or hydrophilic region 22) is provided on the lower substrate 12, and a hydrophobic region is provided outside the surface. A large region 21A (or hydrophobic region 21) is provided.

  Next, the resin 30 is dropped onto the lower base 12 and, for example, the upper contact angle and the lower contact angle of the resin 30 are controlled in the same manner as in the sixth embodiment described above. Thereby, as shown in FIG. 22, the side wall 30A of the resin 30 is set to a desired side wall angle, for example, vertical. In the step of FIG. 22, the upper base material 11, the pure water 41 and the electrode 23 shown in FIG. 11 are used as in the sixth embodiment, but these are omitted in FIG.

  After that, when the resin 30 is cured, as shown in an exploded view in FIG. 23, the three-dimensional structure 7 having the structure 37 as a flow path in the lower base 12 is obtained. The flow path shape of the structure 37 is arbitrary depending on the planar shape of the hydrophilic region 22, such as a meandering shape, a parallel flow path, and a radial shape. The inlet 37A and the outlet 37B are not necessarily one by one. For example, a plurality of inlets 37A may be provided, and separate liquids may be introduced from each of the plurality of inlets 27A.

  This three-dimensional structure 7 can be used as, for example, a micro TAS. The micro TAS has a fine flow path in a substrate such as a glass substrate or a plastic film, and is used as an analyzer, a chemical reaction chip, a biochemical experiment chip, or the like. In the three-dimensional structure 7, fluid from an external system (not shown) is introduced into the inlet 37 </ b> A of the structure 37, and after mixing, reaction, separation, detection, and the like are performed in the structure 37, the outlet It is derived from 37B.

The three-dimensional structure 7 can also be used as a waveguide for guiding light by the structure 37.

  Alternatively, the three-dimensional structure 7 can be applied to a fuel flow path of a fuel cell as shown in FIG. 24, for example. This fuel cell is a so-called solid electrolyte fuel cell (PEFC), and has an electrolyte membrane 93 between a fuel electrode (anode) 91 and an oxygen electrode (cathode) 92. The three-dimensional structure 7 according to Modification 2 is provided outside the fuel electrode 91, and methanol as fuel is supplied to the fuel electrode 91 via the structure 37 of the three-dimensional structure 7. It has become so. In the case of a fuel cell, the upper substrate 11 of the three-dimensional structure 7 is removed, so that the fuel in the structure 37 can come into contact with the fuel electrode 91. An exterior member 94 such as a titanium (Ti) plate is provided outside the oxygen electrode 92.

The fuel electrode 91 and the oxygen electrode 92 are formed by forming a catalyst layer containing platinum (Pt) or ruthenium (Ru) on the surface of carbon cloth or the like and providing a current collector such as titanium (Ti) mesh on the back surface. It is. The electrolyte membrane 93 is made of, for example, a polyperfluoroalkylsulfonic acid resin (“Nafion (registered trademark)” manufactured by DuPont) or another resin membrane having proton conductivity. The fuel electrode 91, the oxygen electrode 92, and the electrolyte membrane 93 are fixed by a gasket (not shown).

  This fuel cell can be manufactured, for example, as follows.

First, the electrolyte membrane 93 made of the above-mentioned material is sandwiched between the fuel electrode 91 made of the above-described material and the oxygen electrode 92, and joined by thermocompression bonding. Next, the three-dimensional structure 7 having the structure 37 is formed on the lower substrate 12 by the manufacturing method shown in FIGS. At that time, the upper substrate 11 is removed. After that, the three-dimensional structure 7 is disposed outside the fuel electrode 91. An exterior member 94 made of the above-described material is provided outside the oxygen electrode 92. Thus, the fuel cell 2 shown in FIG. 24 is completed.

  While the present invention has been described with reference to the embodiment, the present invention is not limited to the above embodiment, and various modifications can be made. For example, in the third to fifth embodiments, the case where the contact angle control is performed by injecting pure water 41 has been described. However, the same contact angle tendency is obtained when the air 40 is not injected with pure water 41. It is possible to realize various shape variations.

  Further, the material and thickness of each layer described in the above embodiment, or the film formation method and film formation conditions are not limited, and other materials and thicknesses may be used, or other film formation methods and film formation. It is good also as conditions.

  Furthermore, in the above-described embodiment, the case where the display panel 50 includes the organic light emitting elements 50R, 50G, and 50B as display elements has been described. However, the display panel 50 is not limited to other displays such as a PDP (Plasma Display Panel). A light emitting element may be provided. Alternatively, the display panel 50 may be a liquid crystal display panel including a liquid crystal layer and a backlight as display elements.

  In addition, the display device illustrated in FIG. 12 can be applied to a light-emitting device for other purposes than display, such as a lighting device.

  Furthermore, the method for manufacturing a three-dimensional structure according to the present invention is not limited to a reflector or a microlens for a display device, but can be applied to manufacturing other optical components such as a prism.

DESCRIPTION OF SYMBOLS 11 ... Upper base material, 12 ... Lower base material, 21 ... Hydrophobic region, 21A ... Hydrophobic large region, 21B ... Hydrophobic small region, 22 ... Hydrophilic region, 23 ... Electrode, 30 ... Resin, 40 ... Air, 41 ... pure water

Claims (12)

Dropping the resin on the lower substrate having a plurality of regions having different degrees of hydrophobicity;
A method for producing a three-dimensional structure, comprising: curing the resin. The process of disposing an upper base material having a plurality of regions with different degrees of hydrophobicity between the step of dripping the resin and the step of curing the resin. A method for producing a three-dimensional structure. The method for producing a three-dimensional structure according to claim 2, wherein the lower substrate and the upper substrate have a hydrophobic region corresponding to a dropping position of the resin and a hydrophilic region other than the hydrophobic region. The method for producing a three-dimensional structure according to claim 3, wherein an ultraviolet curable resin is used as the resin, and a plurality of regions having different degrees of hydrophobicity are formed of a material that is transparent with respect to a photosensitive wavelength of the ultraviolet curable resin. First ultraviolet irradiation is performed from the back side of the lower substrate, and after the upper substrate is peeled off in a state where a part of the resin on the upper substrate side is uncured, the second ultraviolet irradiation is performed. The method of manufacturing a three-dimensional structure according to claim 4, wherein all of the resin is cured. The method of adjusting the contact angle with respect to the said upper base material of the said resin and the contact angle with respect to the said lower base material between the process of arrange | positioning the said upper base material, and the process of hardening | curing the said resin is included. The method for producing a three-dimensional structure according to any one of the above. The method for producing a three-dimensional structure according to claim 6, wherein in the step of adjusting a contact angle of the resin, a space between the upper base material and the lower base material is filled with a hydrophilic conductive liquid. The method for producing a three-dimensional structure according to claim 7, wherein, in the step of adjusting the contact angle of the resin, a distance between the upper base material and the lower base material is adjusted. The tertiary material according to claim 7 or 8, wherein the lower base material and the upper base material have a large hydrophobic region corresponding to a dropping position of the resin, and a small hydrophobic region other than the large hydrophobic region. A manufacturing method of the original structure. An electrode is provided between the upper substrate or the lower substrate and the small hydrophobic region,
The method for producing a three-dimensional structure according to claim 9, wherein in the step of adjusting the contact angle of the resin, a negative voltage is applied to the electrode and a positive voltage is applied to the hydrophilic conductive liquid. The upper substrate has a hydrophobic region corresponding to the dropping position of the resin, and a hydrophilic region other than the hydrophobic region,
9. The three-dimensional structure according to claim 7, wherein the lower base material has a large hydrophobic region corresponding to a dropping position of the resin, and a small hydrophobic region other than the large hydrophobic region. Method. The method of manufacturing a three-dimensional structure according to claim 6, wherein a spacer is provided between the upper base material and the lower base material in the step of adjusting the contact angle of the resin.

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