JP2010271383A - Substrate for photoelectric assembly, and photoelectric assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for a photoelectric assembly that has fewer components, is simple in configuration, easily assembled, and small; and to provide a photoelectric assembly. <P>SOLUTION: The substrate 1 for the photoelectric assembly has: a substrate 2; a light-reflecting element 3 disposed on the back of the substrate 2 so as to face the photoelectric element-mounting part of the surface of the substrate 2; and a light transmission path 4 facing the light-reflecting element 3 and disposed along the back of the substrate 2. In the substrate for the photoelectric assembly, the back of the substrate 2 has a metal layer 5, and a light-reflecting surface serving as a light-reflecting element 3 is formed on the metal layer 5. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optoelectric assembly substrate and an optoelectric assembly that have a small number of parts, a simple configuration, and are easy to assemble.

  When an optical transmission line is connected to an information device that performs electrical signal processing and information exchange with an external device is performed using an optical signal, mutual signal conversion between electricity and light is performed between the information device and the optical transmission line. A signal conversion interface for performing the above is required. In addition, in an information device, in order to perform optical communication by connecting a plurality of electric circuit boards through an optical transmission line, it is necessary to connect a signal conversion interface to the electric circuit board.

  In the optoelectric assembly 101 used for the conventional signal conversion interface shown in FIG. 10, a flexible board connector 103 is mounted on a rigid board 102, and a flexible board 104 is inserted into the flexible board connector 103. An optical element 105 such as an optical IC is mounted. In order to guide light from the optical transmission path 106 to the photoelectric element 105, the optical transmission path 106 is inserted into the gap between the rigid substrate 102 and the flexible substrate 104. The optical transmission path 106 is fixed to the rigid substrate 102 with an adhesive 107. Since the light-emitting surface or the light-receiving surface of the photoelectric element 105 faces the flexible substrate surface, a mirror 108 is provided on the back side of the flexible substrate 104, and light from the photoelectric element 105 is reflected by the optical transmission path 106. Light from the optical transmission line 106 is reflected by the photoelectric element 105. The rigid board 102 is inserted into a rigid board connector of an information device (not shown). The photoelectric element 105 is covered and sealed with a sealing resin layer 109.

JP 2002-116326 A

  The photoelectric assembly 101 shown in FIG. 10 has a high number of parts, is complicated in configuration, and is not easy to assemble. Therefore, the cost is high.

  This photoelectric assembly 101 has a structure in which a rigid board 102 is inserted into a rigid board connector (not shown) of an information device, and a flexible board 104 is inserted into a flexible board connector 103 on the rigid board 102. The length (the left-right direction in the figure) is long. Further, the photoelectric assembly 101 has a high height due to the structure in which the rigid substrate 102, the adhesive 107, the optical transmission path 106, the flexible substrate 104, and the sealing resin layer 109 are stacked. Thus, since the conventional photoelectric assembly 101 is long and high, it occupies a large space in the information device.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, and to provide a small substrate for photoelectric assembly and a photoelectric assembly that have a small number of parts, a simple configuration, and can be easily assembled.

  To achieve the above object, an optoelectric assembly substrate according to the present invention includes a substrate, a light reflecting element provided on the back surface of the substrate so as to face a photoelectric element mounting position on the surface of the substrate, and the light reflecting element. And a light transmission path provided along the back surface of the substrate, and having a metal layer on the back surface of the substrate, and the light reflection on the metal layer serving as the light reflecting element A surface is formed.

  In addition, the substrate for photoelectric assembly of the present invention includes a substrate, a light reflecting element provided on the back surface of the substrate so as to face a mounting position of the photoelectric element on the surface of the substrate, and facing the light reflecting element. An optical assembly substrate provided with an optical transmission path provided along the back surface, and having a resin block embedded with an optical fiber as the optical transmission path on the back surface of the substrate, A light reflecting surface to be the light reflecting element is formed.

  The light reflecting surface may be formed on a cut surface formed by collectively cutting the resin block and the optical fiber.

  The substrate may be a rigid substrate or a flexible substrate.

  In the optoelectric assembly according to the present invention, the optoelectric element is placed in the notch by laminating the optoelectric assembly substrate on the other substrate so as to cover the notch of the other substrate having the notch. It is arranged.

  The present invention exhibits the following excellent effects.

  (1) The number of parts is small.

  (2) The configuration is simple.

  (3) Easy assembly.

  (4) Small size.

It is sectional drawing of the board | substrate for photoelectric assemblies which shows one Embodiment of this invention. It is a figure of the photoelectric assembly which mounted the photoelectric element on the board | substrate for photoelectric assemblies of FIG. 1, (a) is a partial see-through | perspective side view, (b) is a top view. It is a figure of the photoelectric assembly of a reference example, (a) is a perspective view, (b) is a sectional side view. (A), (b) is a partial see-through | perspective side view of the photoelectric assembly which shows other embodiment of this invention. It is sectional drawing of the photoelectric assembly which mounted the photoelectric element on the substrate for photoelectric assemblies which shows other embodiment of this invention. It is a sectional side view of the photoelectric assembly of a reference example. (A) is a perspective view of a resin block, (b) is a perspective view of the rectangular parallelepiped block which manufactures a resin block. It is a figure of the photoelectric assembly which mounted the photoelectric element on the board | substrate for photoelectric assemblies which shows other embodiment of this invention, (a) is a sectional side view, (b) is a bottom view. It is a figure of the photoelectric assembly which mounted the photoelectric element on the board | substrate for photoelectric assemblies of FIG. 1, (a) is a partial see-through | perspective side view, (b) is a top view. 1 is a side view of a conventional photoelectric assembly.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  As shown in FIG. 1, a substrate 1 for an optoelectric assembly according to the present invention includes a substrate 2 made of a rigid substrate or a flexible substrate, and a back surface of the substrate 2 so as to face an optoelectric element mounting position on the surface of the substrate 2. In the optoelectric assembly substrate 1 comprising the light reflecting element 3 provided on the light reflecting element 3 and the light transmission path 4 provided along the back surface of the substrate 2 so as to face the light reflecting element 3, the back surface of the substrate 2 is provided. The metal layer 5 is provided with a light reflecting surface to be the light reflecting element 3 formed on the metal layer 5. Such a light reflecting surface may be formed by etching.

  Since the surface of the substrate 2 is a mounting surface for an electronic component including a photoelectric element, a conductor pattern 6 (except for an optical path) is provided on the surface of the substrate 2.

  With the above configuration, light incident on the light reflecting element 3 from the light transmission path 4 is emitted toward the surface of the substrate 2, and light incident on the light reflecting element 3 after being transmitted from the surface of the substrate 2 to the back surface is transmitted through the light. The light is emitted toward the path 4.

  A description will be given of a photoelectric assembly configured by mounting photoelectric elements on the photoelectric assembly substrate 1 of FIG.

  As shown in FIGS. 2A and 2B, in this optoelectric assembly 7, the substrate 2 is constituted by a flexible substrate 8. The flexible substrate 8 is laminated on the rigid substrate 10 so as to cover the notch 9 of the rigid substrate 10 having the notch 9. The photoelectric element 11 is mounted at the photoelectric element mounting position on the surface in the notch 9 of the flexible substrate 8. The light reflecting element 3 is located on the back surface of the mounting portion of the photoelectric element 11, and a 45 ° light reflecting surface is formed on the metal layer 5.

  The rigid board 10 includes an edge (not shown) that is inserted into a rigid board connector of an information device. The notch 9 is formed in a rectangular shape in top view from one end of the rigid substrate 10. For this reason, the rigid substrate 10 has a U-shape when viewed from above.

  The flexible substrate 8 is provided so as to cover the entire surface of the rigid substrate 10 including the notch 9. The upper surface of the flexible substrate 8 is a copper layer for electrical wiring that becomes a wiring pattern (not shown; see FIG. 1) 6. The wiring pattern (not shown) of the rigid substrate 10 and the wiring pattern of the flexible substrate 8 are made conductive by crimping the through holes to each other. A wiring pattern (not shown) for mounting the photoelectric element 11 on the flexible substrate 8 is formed in the notch 9.

  The photoelectric element 11 is a surface-mount type photoelectric element 11, and the light emitting surface or the light receiving surface faces the flexible substrate surface. The flexible substrate 8 is transparent at the light wavelength used by the photoelectric element 11. In the cutout portion 9, a sealing resin layer 12 that seals the photoelectric element 11 is provided.

  Here, FIGS. 3 (a) and 3 (b) show reference views of the optoelectric assembly studied by the present inventors up to the present invention.

  As shown in FIG. 3B, the flexible substrate 38 of the photoelectric assembly 31 includes an electrical wiring copper layer 32 on which the photoelectric element 11 is surface-mounted, and a base resin that supports the electrical wiring copper layer 32. A layer 33, an optical fiber positioning copper layer 35 for positioning the optical fiber 34 serving as the optical transmission path 4, and a prism positioning copper layer 37 for the prism 36 on which the light reflecting element 3 is formed.

  As shown in FIG. 3A, the IC 13 is mounted on the rigid substrate 10. On the flexible substrate 38 laminated on the rigid substrate 10, the photoelectric element 11 is mounted on the surface in the notch 9. Since the wiring pattern of the rigid substrate 10 and the wiring pattern of the flexible substrate 38 are electrically connected, an electric signal can be transmitted between the photoelectric element 11 and the IC 13.

  A prism 36 is attached to the back side of the photoelectric element 11 (the lower surface of the flexible substrate 38). A plurality of light emitting surfaces or light receiving surfaces S are formed in a row on the lower surface of the photoelectric element 11. The reflecting surface (light reflecting element 3) of the prism 36 faces the light emitting surface or light receiving surface S at an inclination angle of 45 °. A plurality of optical fibers 34 are attached to the lower surface of the flexible substrate 38 so that the end surfaces of the light reflecting elements 3 face each other.

  The prism positioning copper layer 37 formed by printing on the flexible substrate 38 can form a step by having a predetermined layer thickness. In order to correctly form the optical paths of the light entering and exiting the optoelectric element 11 mounted on the upper surface of the flexible substrate 38 and the light entering and exiting the optical fiber 34, the position of the prism 36 (the longitudinal position relative to the optical fiber, the light It is necessary to accurately determine the angle with respect to the fiber, the angle with respect to the arrangement direction of the light emitting surface or the light receiving surface S, and the like. The prism positioning copper layer 37 is formed in a rectangular shape in a bottom view so that the upper surface (rectangular shape) of the prism 36 is fitted, and is formed at a predetermined distance from the optical fiber positioning copper layer 35. As a result, the alignment of the prism 36 is easy because the prism 36 can be simply brought into contact with the step of the prism positioning copper layer 37.

  The photoelectric assembly substrate 1 shown in FIG. 1 is a further improvement of the above reference example in which the prism 36 is aligned by the prism positioning copper layer 37. That is, the prism 36 is eliminated and the prism positioning copper layer 37 (metal layer 5) itself has the function of the light reflecting element 3. As a result, the photoelectric assembly 7 according to the present invention further reduces the number of parts, has a simple configuration, facilitates assembly, and achieves further miniaturization.

  The photoelectric assembly 7 of FIG. 2 in which the photoelectric element 11 is mounted on the photoelectric assembly substrate 1 according to the present invention has the following effects as compared with the conventional photoelectric assembly.

  In the optoelectric assembly 7, a flexible substrate 8 is laminated on a rigid substrate 10, and the wiring pattern of the rigid substrate 10 and the wiring pattern of the flexible substrate 8 are electrically connected by press-fitting a through hole. This eliminates the need for a flexible board connector on the rigid board 10, reduces the number of components, simplifies the configuration, and facilitates assembly. In addition, since there is no flexible board connector, the length is shortened and the height is lowered, thereby reducing the size.

  In the photoelectric assembly 7, the rigid substrate 10 has a notch 9, the flexible substrate 8 is laminated on the rigid substrate 10 so as to cover the notch 9, and the photoelectric element 11 is a surface in the notch 9 of the flexible substrate 8. Therefore, if the height of the photoelectric element 11 is lower than the height (thickness) of the rigid substrate 10, the photoelectric element 11 does not protrude in the height direction of the rigid substrate 10. Furthermore, the sealing resin layer 12 that seals the photoelectric element 11 does not protrude in the height direction of the rigid substrate 10. Even when the height of the photoelectric element 11 is higher than the height (thickness) of the rigid substrate 10, the amount of the photoelectric element 11 protruding in the height direction of the rigid substrate 10 can be reduced. Therefore, the photoelectric assembly 7 is smaller than the conventional one and becomes small.

  The photoelectric assembly 41 shown in FIG. 4A includes a rigid substrate 10 having a notch 9, a flexible substrate 8 laminated on the rigid substrate 10 so as to cover the notch 9, and the notch 9 of the flexible substrate 8. A photoelectric element 11 mounted at the photoelectric element mounting position on the inner surface, a light reflecting element 3 facing the photoelectric element 11 and provided on the back surface of the mounting position of the photoelectric element 11, and facing the light reflecting element 3 And an optical transmission path 4 provided along the back surface of the flexible substrate 8. The sealing resin layer 12 fills the entire cutout 9. The optical transmission line 4 is composed of a polymer layer or an optical fiber 34, and the light reflecting element 3 is composed of a light reflecting surface of the metal layer 5 or a 45 ° cut slope (details will be described later) of the optical fiber 34.

  The photoelectric assembly 42 shown in FIG. 4B is obtained by providing a rigid substrate 10 having a notch 9 on the lower surface of the flexible substrate 8 of the photoelectric assembly 41 shown in FIG. Since the flexible substrate 8 is sandwiched between the two rigid substrates 10, the balance of thermal expansion and stress is even on the upper and lower surfaces, and warpage can be prevented. Furthermore, by forming the sealing resin layers 12 in the upper and lower cutouts 9, the joint between the flexible substrate 8 and the optical transmission path 4 is strengthened. The sealing resin layers 12 on both the upper and lower surfaces respectively fill the entire notch 9.

  Next, another embodiment of the present invention will be described.

  As shown in FIG. 5, a substrate 51 for photoelectric assembly according to the present invention includes a substrate 52 made of a rigid substrate or a flexible substrate, and a back surface of the substrate 52 so as to face a photoelectric element mounting position on the surface of the substrate 52. In the optoelectric assembly substrate 51, which includes a light reflecting element 53 provided on the light reflecting element 53, and an optical transmission path 54 provided along the back surface of the substrate 52 so as to face the light reflecting element 53. Further, a resin block 55 in which an optical fiber 54a as the optical transmission path 54 is embedded is provided, and a light reflecting surface to be the light reflecting element 53 is formed on the optical fiber 54a.

  The cut surface of the optical fiber 54 a formed by cutting the resin block 55 and the optical fiber 54 a together is the light reflecting element 53.

  The photoelectric assembly 57 is configured by mounting the photoelectric element 11 on the photoelectric assembly substrate 51.

  Here, FIG. 6 shows a reference diagram of the optoelectric assembly studied by the inventor up to the present invention.

  As shown in FIG. 6, the light reflecting element 3 can be formed by cutting the optical fiber 34 by 45 °. The flexible substrate 38 is substantially the same flexible substrate 38 as shown in FIG. In the case where there are a plurality of optical fibers 34, the use of a ribbon optical fiber in which a plurality of optical fibers 34 are integrated makes it possible to eliminate the deviation of the light reflecting element 3 due to axial rotation.

  The photoelectric assembly substrate 51 of the present invention shown in FIG. 5 is a further improvement of the reference example in which the optical reflection element 3 is formed by cutting the optical fiber 34 by 45 ° as shown in FIG. That is, rather than positioning the optical fiber 34 with the optical fiber positioning copper layer 35, the resin block 55 in which the optical fiber 54 a is embedded is attached to the substrate 52. Thereby, the photoelectric assembly 57 according to the present invention has a simple configuration and is easy to assemble.

  As shown in FIG. 7A, a plurality of optical fibers 54 a can be embedded in the resin block 55. In the ribbon optical fiber, the optical fibers are arranged in contact with each other. However, in the configuration of FIG. 7A, the arrangement pitch of the plurality of optical fibers 54a is arbitrary. Therefore, when the photoelectric element 11 is an array element, it is matched with the array arrangement pitch, and when the photoelectric element 11 is a plurality of individual elements arranged, a plurality of optical fibers 54a are arranged according to the arrangement pitch. Can be arranged.

  As shown in FIG. 7B, the resin block 55 first forms a rectangular parallelepiped block 71 in which a plurality of optical fibers 54 a are embedded, and then inserts cutter teeth obliquely along the cut line C with respect to the rectangular parallelepiped block 71. Thus, the rectangular parallelepiped block 71 is equally divided. With this manufacturing method, two resin blocks 55 in which a plurality of optical fibers 54a are embedded can be manufactured simultaneously.

  In the photoelectric assembly 81 shown in FIGS. 8A and 8B, the photoelectric assembly substrate 51 similar to that in FIG. 5 is used. That is, the optoelectric assembly substrate 51 has a resin block 55 in which an optical fiber 54a as an optical transmission path 54 is embedded on the back surface of the substrate 52, and the resin block 55 and the optical fiber 54a are cut together. The optical fiber portion of the cut surface is a light reflecting element 53.

  The substrate 52 is composed of a flexible substrate 88. The flexible substrate 88 is laminated on the rigid substrate 90 so as to cover the notch 89 of the rigid substrate 90 having the notch 89. The resin block 55 is mounted on the surface in the notch 89 of the flexible substrate 88. The light reflecting element 53 appearing on the cut surface of the resin block 55 is located on the back surface of the mounting location of the photoelectric element 11.

  The resin block 55 may be insert-molded so as to embed the optical fiber 54a, or may be manufactured by punching a resin without a hole, and the optical fiber 54a may be inserted into the hole.

  The photoelectric assembly substrate 51 used in the photoelectric assemblies 57 and 81 shown in FIGS. 5 and 8 has the light reflecting element 53 formed on the cut surface of the resin block 55 in which the optical fiber 54a is embedded. The optical fiber 54a can be easily attached to 52, and the mounting operation of the photoelectric assemblies 57 and 81 is simplified.

  As shown in FIG. 9, the photoelectric assembly 91 according to the present invention includes a rigid substrate 93 having a cutout portion 92 whose periphery is closed, and a flexible substrate 8 laminated on the rigid substrate 93 so as to cover the cutout portion 92. The photoelectric element 11 mounted on the surface in the notch 92 of the flexible substrate 8, the light reflecting element 3 facing the photoelectric element 11 and provided on the back surface of the mounting portion of the photoelectric element 11, and the light reflecting element 3 And an optical transmission line 4 provided along the back surface of the flexible substrate 8.

  Unlike the notch 9 in FIG. 2, the notch 92 has a closed periphery. For this reason, the notch 92 forms a wall corresponding to the thickness of the rigid substrate 93 over the entire circumference of the flexible substrate 8.

  When a fluid filler is poured around the photoelectric element 11 in order to form the hermetic resin layer 12 for sealing the photoelectric element 11 in the notch 92, the notch 92 is formed on the flexible substrate 8. Since the wall is as thick as the rigid substrate 93 over the entire circumference, the filler does not flow out. As a result, the assembly of the photoelectric assembly 91 is further facilitated, and the appearance defect due to the outflow of the filler is prevented.

  Also in this configuration, the light reflecting element 3 has the metal layer 5 on the back surface of the flexible substrate 8 that is the substrate 2, and the light reflecting surface to be the light reflecting element 3 is formed on the metal layer 5.

  Similarly to the embodiment of FIG. 5, a resin block in which an optical fiber as an optical transmission path 4 is embedded is provided on the back surface of the substrate 2, and the optical fiber portion of the cut and cut surface between the resin block and the optical fiber is provided. The light reflecting element 3 may be used.

DESCRIPTION OF SYMBOLS 1,51 Substrate for optoelectric assembly 2,52 Substrate 3,53 Light reflecting element 4,54 Optical transmission line 5 Metal film 6 Conductor pattern 7 Photoelectric assembly 8 Flexible substrate 9 Notch 10 Rigid substrate 11 Photoelectric element 12 Sealing resin Layer 54a Optical fiber 55 Resin block

Claims (5)

A substrate, a light reflecting element provided on the back surface of the substrate so as to face the photoelectric device mounting position on the front surface of the substrate, and an optical transmission path provided along the back surface of the substrate facing the light reflecting element; A substrate for optoelectric assembly comprising:
A substrate for photoelectric assembly, comprising a metal layer on a back surface of the substrate, and a light reflecting surface serving as the light reflecting element formed on the metal layer. A substrate, a light reflecting element provided on the back surface of the substrate so as to face the photoelectric device mounting position on the front surface of the substrate, and an optical transmission path provided along the back surface of the substrate facing the light reflecting element; A substrate for optoelectric assembly comprising:
An optoelectric assembly having a resin block in which an optical fiber as an optical transmission path is embedded on the back surface of the substrate, and a light reflecting surface serving as the light reflecting element formed on the optical fiber. Substrate.   3. The substrate for optoelectric assemblies according to claim 2, wherein the light reflecting surface is formed on a cut surface formed by cutting the resin block and the optical fiber together.   The said board | substrate consists of a rigid board | substrate or a flexible substrate, The board | substrate for photoelectric assemblies of any one of Claims 1-3 characterized by the above-mentioned.   5. The photoelectric assembly substrate according to claim 1 is mounted on the photoelectric device mounting position by being laminated on the other substrate so as to cover the cutout portion of another substrate having a cutout portion. An optoelectric assembly, wherein the optoelectric element is disposed in the notch.

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