JP2010266666A - Manufacturing method for wafer-level lens array, wafer-level lens array, lens module, and imaging unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a wafer-level lens array, for peeling a plurality of lens parts of the molded wafer-level lens array off a mold smoothly without damaging them, and also to provide the wafer-level lens array, a lens module, and an imaging unit. <P>SOLUTION: This manufacturing method for the wafer-level lens array has processes of: molding a base plate part 1 and a plurality of lens parts 10 as an integrated molded product by using the first mold and the second mold; and releasing the molded product from the molds. In this method, a protruding part is made to protrude from either of the first mold and the second mold while or before the molded product is released from the molds, and the molded product is pressed against a side for releasing the molded product while the protruding part is abutted on only the base plate part 1 except the lens parts 10. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a wafer level lens array, a wafer level lens array, a lens module, and an imaging unit.

  In recent years, portable terminals of electronic devices such as mobile phones and PDAs (Personal Digital Assistants) are equipped with small and thin imaging units. Such an imaging unit generally includes a solid-state imaging device such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) image sensor, a lens for forming a subject image on the solid-state imaging device, It has.

  With the downsizing and thinning of portable terminals, there is a demand for downsizing and thinning of imaging units. Moreover, in order to reduce the cost of the portable terminal, it is desired to increase the efficiency of the manufacturing process.

  As a method of manufacturing a small number of lenses, a lens module is manufactured by manufacturing a wafer level lens array having a configuration in which a plurality of lenses are formed on a substrate portion and cutting the substrate portion to separate the plurality of lenses. There are known methods for mass production.

  In addition, the imaging unit is obtained by integrally combining a substrate on which a plurality of lenses are formed and a semiconductor wafer on which a plurality of solid-state imaging elements are formed, and cutting the semiconductor wafer together with the substrate so as to include the lens and the solid-state imaging elements as a set. There are known methods for mass production.

  As a method for manufacturing a wafer level lens, for example, as shown in Patent Document 1 below, a method in which a substrate portion and a lens portion are integrally molded with a molding die using the same material has been proposed. This wafer level lens has the advantage that it can be manufactured with a small number of steps, without the need to separately manufacture a substrate portion and a lens portion or a step of assembling the lens portion to the substrate portion.

  When the wafer level lens is molded as a molded product by the molding die, it is necessary to perform a mold release process for separating the molded wafer level lens from the molding die.

  Patent Document 2 below relates to a method for releasing a molded product made of a resin. In the mold release method of Patent Document 2, a resin such as an epoxy resin having an adhesive effect is injected into a mold that is a casting mold open to the atmosphere having a cavity, and is heated and cured to form a molded product. After molding, a flat plate-like vibrator is disposed so as to be in direct contact with the molded product. Vibration is directly transmitted from the vibrator to the molded product, and the molded product can be peeled off from the mold.

WO08 / 093516 pamphlet JP 2004-74445 A

  By the way, when a wafer level lens in which the substrate portion and the lens are integrated is formed as a molded product, the substrate portion and the lens are stronger against the forming die after the completion of molding than when only the lens is formed by the forming die. It becomes more difficult to adhere and release. The reason for this is that the molded substrate portion comes into contact with the molding die over a wide area, and the thickness of the substrate portion is thin, so that the molded wafer level lens easily adheres to the molding die. is there. In addition, since the substrate portion is thin and sufficient rigidity cannot be secured, applying a load when peeling the wafer level lens attached to the mold may cause damage such as deformation or cracking in the substrate portion or the lens itself. There is.

  In Patent Document 2 described above, a mold release method is described in which a vibrator is directly brought into contact with a molded product to transmit vibration. However, it is conceivable that when the vibrator is brought into direct contact with the substrate portion and the lens, the substrate portion and the lens are damaged by the vibration.

  The present invention provides a method for manufacturing a wafer level lens array, a wafer level lens array, a lens module, and an imaging unit that can be smoothly removed from a mold without damaging the lens portion of the molded wafer level lens array. To do.

The present invention is a method for manufacturing a wafer level lens array in which a substrate portion and a plurality of lens portions arranged on the substrate portion are formed,
Forming the substrate part and the plurality of lens parts as an integral molded product with the first mold and the second mold;
A step of releasing the molded product,
Before releasing the molded product, the molded product is protruded from one of the first mold and the second mold, and the molded product is brought into contact with only the substrate unit other than the lens unit. This is a method for manufacturing a wafer level lens array in which is pressed to the mold release side.

Further, the present invention is a wafer level lens array manufacturing apparatus in which a substrate portion and a plurality of lens portions arranged on the substrate portion are formed,
The first type;
A second mold that forms a cavity for molding the substrate section and the plurality of lens sections as an integral molded article by closing the mold with respect to the first mold;
The molding includes a projecting portion projecting from one of the first mold and the second mold, and before the mold is released, the projecting portion abuts only on the substrate section other than the lens section. Is a wafer level lens array manufacturing apparatus that presses the lens toward the mold release side.

In the wafer level lens array manufacturing apparatus and method described above, when the substrate portion and the plurality of lenses are integrally molded as a molded product by the first mold and the second mold, one of the first mold and the second mold is used. The projecting part is projected from the side, and the projecting part is pressed to the side where the molded product is released. By this pressing, the molded product is peeled from the mold. Thereafter, when the molded product is taken out from the mold, it has already been peeled off, so that it can be taken out easily. Here, since the tip portion of the protruding portion in the protruding direction does not directly contact the lens portion, it is possible to prevent the lens portion from being damaged.
In particular, a wafer level lens having a structure in which a substrate portion and a plurality of lens portions are integrally molded has a thin substrate portion and a large area in contact with the mold. The tendency to adhere to any of the two types and become difficult to separate is remarkable. For this reason, in the manufacture of a wafer level lens array, it is possible to take out the molded product without applying a load to the molded product by separating the boundary between the mold and the molded product by the protruding portion, which is effective. .

  The wafer level lens array obtained by the above-described method for manufacturing a wafer level lens array is excellent in that there is no damage such as deformation or cracking in the substrate portion and the plurality of lenses.

  In addition, a lens module or an imaging unit including the wafer level lens is preferable because the substrate portion of the wafer level lens array and the plurality of lenses are not damaged.

  According to the present invention, a method for manufacturing a wafer level lens array, a wafer level lens array, a lens module, and an imaging unit that can be smoothly peeled off from a mold without damaging the lens portion of the molded wafer level lens array Can provide.

It is sectional drawing which shows an example of a structure of a wafer level lens array. It is sectional drawing which shows an example of a structure of a lens module. It is sectional drawing which shows an example of a structure of an imaging unit. It is a figure which shows the structural example of the shaping | molding die for shape | molding a lens part in the board | substrate part of a wafer level lens array. It is a figure which shows an example of the operation | movement at the time of mold release of a shaping | molding die. It is a flowchart which shows the procedure of the manufacturing method of a wafer level lens array. It is a figure explaining the procedure of shaping | molding and mold release by a shaping | molding die. It is a figure which shows an example of the position where a protrusion part contact | abuts with respect to a molded object in the shaping | molding die of FIG. It is a figure explaining the procedure of the shaping | molding by the shaping | molding die of another structural example, and a mold release. It is a figure which shows an example of the position where a protrusion part contact | abuts with respect to a molded object in the shaping | molding die of FIG. It is a figure explaining the process of peeling a wafer level lens array from a shaping | molding die. It is a figure explaining the process of dicing a wafer level lens array. It is a figure which shows the procedure of the manufacturing method of a lens module. It is a figure which shows the procedure which manufactures the lens module of a structure different from FIG. It is a figure which shows the procedure which manufactures an imaging unit. FIG. 16 is a diagram illustrating a procedure for manufacturing an imaging unit different from the configuration of FIG. 15.

  First, the configuration of the wafer level lens array, the lens module, and the imaging unit will be described.

FIG. 1 is a cross-sectional view showing an example of the configuration of a wafer level lens array.
The wafer level lens array includes a substrate unit 1 and a plurality of lens units 10 arranged on the substrate unit 1. The plurality of lens units 10 are arranged one-dimensionally or two-dimensionally with respect to the substrate unit 1. Hereinafter, a configuration in which a plurality of lens units 10 are two-dimensionally arranged with respect to the substrate unit 1 will be described as an example. The lens unit 10 is made of the same material as the substrate unit 1 and is integrally formed with the substrate unit 1. The shape of the lens unit 10 is not particularly limited, and can be appropriately changed depending on the application.

FIG. 2 is a cross-sectional view showing an example of the configuration of the lens module.
The lens module includes a substrate unit 1 and a lens unit 10 formed integrally with the substrate unit 1. For example, the lens unit 10 is diced by dicing the substrate unit 1 of the wafer level lens array shown in FIG. Use one separated for each. A spacer 2 is provided around the lens unit 10 on one surface of the substrate unit 1. The operation and configuration of the spacer 2 are the same as those of the imaging unit described below.

FIG. 3 is a cross-sectional view illustrating an example of the configuration of the imaging unit.
The imaging unit includes the lens module described above and a sensor module. The lens unit 10 of the lens module forms a subject image on the solid-state imaging device D provided on the sensor module side. The substrate portion 1 of the lens module and the semiconductor substrate W of the sensor module are formed in a substantially rectangular shape in plan view so as to be substantially the same.

  The sensor module includes a semiconductor substrate W and a solid-state imaging device D provided on the semiconductor substrate W. The semiconductor substrate W is formed by cutting a wafer formed of a semiconductor material such as silicon into a substantially rectangular shape in plan view. The solid-state image sensor D is provided at a substantially central portion of the semiconductor substrate W. The solid-state image sensor D is, for example, a CCD image sensor or a CMOS image sensor. The sensor module can have a configuration in which a solid-state imaging device D that is made into a chip is bonded onto a semiconductor substrate on which wirings and the like are formed. Alternatively, the solid-state imaging device D is configured by repeating a well-known film formation process, photolithography process, etching process, impurity addition process, and the like on the semiconductor substrate W to form electrodes, insulating films, wirings, and the like on the semiconductor substrate. May be.

  The lens module has a substrate portion 1 superimposed on a semiconductor substrate W of the sensor module via a spacer 2. The spacer 2 of the lens module and the semiconductor substrate W of the sensor module are bonded using, for example, an adhesive. The spacer 2 is designed so that the lens unit 10 of the lens module forms a subject image on the solid-state imaging device D of the sensor module, and the lens unit 10 and the solid-state imaging so that the lens unit 10 does not contact the sensor module. It is formed with a thickness separating a predetermined distance from the element D.

  The shape of the spacer 2 is not particularly limited as long as the spacer 2 can maintain a positional relationship with a predetermined distance between the substrate portion 1 of the lens module and the semiconductor substrate W of the sensor module, and can be appropriately modified. For example, the spacer 2 may be a columnar member provided at each of the four corners of the substrate. Further, the spacer 2 may be a frame-shaped member that surrounds the solid-state imaging device D of the sensor module. If the solid-state image pickup device D is surrounded by the frame-shaped spacer 2 to be isolated from the outside, the solid-state image pickup device D can be shielded from light other than the light passing through the lens. Moreover, it can prevent that dust adheres to the solid-state image sensor D by sealing the solid-state image sensor D from the outside.

  The lens module shown in FIG. 2 is configured to include one substrate unit 1 on which the lens unit 10 is formed, but may be configured to include a plurality of substrate units 1 on which the lens unit 10 is formed. At this time, the substrate portions 1 that are overlapped with each other are assembled together via the spacer 2.

  The imaging unit may be configured by joining a sensor module via a spacer 2 to the lowermost substrate portion 1 of the lens module including a plurality of substrate portions 1 on which the lens portions 10 are formed. A lens module including a plurality of substrate units 1 on which the lens unit 10 is formed and a method for manufacturing an imaging unit including the lens module will be described later.

  The imaging unit configured as described above is reflow-mounted on a circuit board (not shown) built in a portable terminal or the like. The circuit board is preliminarily printed with paste-like solder at a position where the imaging unit is mounted, and the imaging unit is mounted on the circuit board. The circuit board including the imaging unit is irradiated with infrared rays or hot air is blown. Heat treatment is performed, and the imaging unit is welded to the circuit board.

  As a material constituting the substrate unit 1 and the lens unit 10, for example, glass can be used. Glass is abundant in types and can be selected from those having a high refractive index, so it is suitable as a material for lenses that require high power. Further, glass has excellent heat resistance and is suitable for reflow mounting of the above-described imaging unit.

  In addition, a resin can be used as a material constituting the substrate unit 1 and the lens unit 10. Resin is excellent in processability and is suitable for forming a lens surface easily and inexpensively with a mold or the like. As the resin, any of an ultraviolet curable resin, a thermosetting resin, and a thermoplastic resin can be used. However, in consideration of the reflow mounting of the imaging unit described above, a softening point that is relatively high, for example, 200 ° C. or higher. Preferably, the thing of 250 degreeC or more is more preferable.

Examples of the ultraviolet curable resin include an ultraviolet curable silicon resin, an ultraviolet curable epoxy resin, and an acrylic resin. An epoxy resin having a linear expansion coefficient of 40 to 80 [10 ⁻⁶ / K] and a refractive index of 1.50 to 1.70, preferably 1.60 to 1.70 can be used. Examples of the thermosetting resin include a thermosetting silicone resin, a thermosetting epoxy resin, a thermosetting phenol resin, and a thermosetting acrylic resin. For example, a silicon resin having a linear expansion coefficient of 30 to 160 [10 ⁻⁶ / K] and a refractive index of 1.40 to 1.55 can be used. An epoxy resin having a linear expansion coefficient of 40 to 80 [10 ⁻⁶ / K] and a refractive index of 1.50 to 1.70, preferably 1.60 to 1.70 can be used. A phenol resin having a linear expansion coefficient of 30 to 70 [10 ⁻⁶ / K] and a refractive index of 1.50 to 1.70 can be used. As the acrylic resin, those having a linear expansion coefficient of 20 to 60 [10 ⁻⁶ / K] and a refractive index of 1.40 to 1.60, preferably 1.50 to 1.60 can be used. Specific examples of thermosetting resins include SMX-7852 / SMX-7877 manufactured by Fuji Polymer Industries Co., Ltd., IVSM-4500 manufactured by Toshiba Corporation, SR-7010 manufactured by Toray Dow Corning Co., Ltd., and the like. Can do. Examples of the thermoplastic resin include polycarbonate resin, polysulfone resin, polyether sulfone resin, and the like. Polycarbonate having a linear expansion coefficient of 60 to 70 [10 ⁻⁶ / K] and a refractive index of 1.40 to 1.70, preferably 1.50 to 1.65 can be used. A polysulfone resin having a linear expansion coefficient of 15 to 60 [10 ⁻⁶ / K] and a refractive index of 1.63 can be used. As the polyethersulfone resin, one having a linear expansion coefficient of 20 to 60 [10 ⁻⁶ / K] and a refractive index of 1.65 can be used.

In general, the optical glass has a linear expansion coefficient of 4.9 to 14.3 [10 ⁻⁶ / K] at 20 ° C., and a refractive index of 1.4 to 2.1 at a wavelength of 589.3 nm. Further, the linear expansion coefficient of quartz glass is 0.1 to 0.5 [10 ⁻⁶ / K], and the refractive index is about 1.45.

  Moreover, it is preferable to use an organic-inorganic composite material obtained by dispersing inorganic fine particles in a resin matrix. Examples of the inorganic fine particles include oxide fine particles, sulfide fine particles, selenide fine particles, and telluride fine particles. More specifically, for example, fine particles of zirconium oxide, titanium oxide, zinc oxide, tin oxide, zinc sulfide and the like can be mentioned.

  The inorganic fine particles may be used alone or in combination of two or more. Moreover, the composite by several components may be sufficient. In addition, for various purposes such as photocatalytic activity reduction and water absorption reduction, the inorganic fine particles are doped with different metals, the surface layer is coated with different metal oxides such as silica and alumina, silane coupling agents, The surface may be modified with an acid coupling agent, an organic acid (carboxylic acid, sulfonic acid, phosphoric acid, phosphonic acid, etc.) or a dispersant having an organic acid group.

  If the number average particle size of the inorganic fine particles is too small, the properties of the substance may change. In addition, when the refractive index difference between the resin matrix and the inorganic fine particles is large, if the number average particle size of the inorganic fine particles is too large, the influence of Rayleigh scattering becomes significant. For this reason, 1 nm-15 nm are preferable, 2 nm-10 nm are still more preferable, and 3 nm-7 nm are especially preferable. Further, it is desirable that the particle size distribution of the inorganic fine particles is narrow. There are various ways of defining such monodisperse particles. For example, a numerical value range as described in JP-A No. 2006-160992 applies to a preferable particle size distribution range. Here, the above-mentioned number average primary particle size can be measured by, for example, an X-ray diffraction (XRD) apparatus or a transmission electron microscope (TEM).

  The refractive index of the inorganic fine particles is preferably 1.90 to 3.00, more preferably 1.90 to 2.70 at 22 ° C. and a wavelength of 589.3 nm, and more preferably 2.00 to 2 .70 is particularly preferred.

  The content of the inorganic fine particles with respect to the resin is preferably 5% by mass or more, more preferably 10 to 70% by mass, and particularly preferably 30 to 60% by mass from the viewpoint of transparency and high refractive index.

  As the resin used for the organic-inorganic composite material, known ultraviolet curable resins, thermosetting resins, and thermoplastic resins can be used. Further, a resin having a refractive index higher than 1.60 described in JP-A-2007-93893, a block copolymer composed of a hydrophobic segment and a hydrophilic segment described in JP-A-2007-211114, and JP-A-2007 238929, Japanese Patent Application Nos. 2008-12645, 2008-208427, 2008-229629, and 2008-219952 can form arbitrary chemical bonds with inorganic fine particles at the polymer terminals or side chains. Examples thereof include resins having functional groups and thermoplastic resins described in Japanese Patent Application Nos. 2008-197054 and 2008-198878. If necessary, additives such as a plasticizer and a dispersant can be added to the organic-inorganic composite material.

Next, a manufacturing method of the wafer level lens array will be described in detail.
FIG. 4 is a diagram showing a configuration example of a molding die for integrally molding the substrate portion and the lens portion of the wafer level lens array. FIG. 4 shows the mold open state of the mold. FIG. 5 shows an example of the operation of the mold shown in FIG.

  As shown in FIGS. 4 and 5, the molding die of this configuration example includes an upper die 12 and a lower die 14. By sandwiching a material such as a resin constituting the lens unit 10 and the substrate unit 1 between the upper mold 12 and the lower mold 14, the lens unit and the substrate unit having a predetermined shape are integrally formed.

  In the upper mold 12, the surface on the side facing the lower mold 14 is equivalent to a region other than the concave portion 12 a for transferring the upper shape of the lens unit 10 and the region in the substrate unit 1 where the lens unit 10 is molded. And a flat portion 12b for transferring the flat shape to be transferred.

  In the lower mold 14, the surface on the side facing the upper mold 12 is provided with a recess 14 a for transferring the shape of the lower side of the lens unit 10 and a region other than the region where the lens unit 10 is molded in the substrate unit 1. A flat portion 14b for transferring a corresponding flat shape is provided.

  Here, “upper” and “lower” only indicate the positional relationship in the drawing explaining this configuration example. For example, the positional relationship may be switched up and down. That is, in the molding die, when one of the upper die 12 and the lower die 14 is the first die and the other is the second die, the first die and the second die can be in the closed state and the open state. If possible, their positional relationship is not particularly limited.

  The upper mold 12 and the lower mold 14 can be relatively moved between the position of the mold closed state and the position of the mold open state, respectively. In other words, at least one of the upper mold 12 and the lower mold 14 can be moved toward and away from the other.

  The mold open state is a state in which the upper mold 12 and the lower mold 14 are separated by a certain distance. The mold closed state means that the upper mold 12 and the lower mold 14 are close to each other, and a predetermined pressure is applied to the molded article sandwiched between the upper mold 12 and the lower mold 14. Is in a state of being completely adhered.

  As shown in FIG. 4, the lower mold 14 is provided with a plurality of ejector pins 18 that function as protrusions that press the molded product attached to the lower mold 14 when the molded product is peeled off. Each of the plurality of ejector pins 18 has a long cylindrical shape. One end portion of each ejector pin 18 is fixed to the upper surface of the movable plate 16, the other end portion is formed with a smaller diameter than the end portion on the movable plate 16 side, and the tip end portion 18 a penetrates the lower mold 14. The shape of the ejector pin 18 is not limited to a cylindrical shape.

  The movable plate 16 is held in a state substantially parallel to the flat portion 14b of the lower mold 14. A drive shaft 16s is coupled to the surface of the movable plate 16 opposite to the surface on which the plurality of ejector pins 18 are fixed.

  FIG. 5 shows a state in which a plurality of ejector pins are protruded. When the drive shaft 16s is driven in the axial direction, the movable plate 16 approaches the lower die 14 while being substantially parallel to the flat portion 14b of the lower die 14. Then, the tip end portions 18a of the plurality of ejector pins 18 protrude from the surface of the flat portion 14b of the lower die 14 toward the upper die 12 side. The protruding amount of the tip 18a protruding from the lower mold 14 is set according to the size of each ejector pin 18 and the moving amount of the drive shaft 16s in the axial direction.

  When the mold is closed, the shape of the lens portion 10 is defined by the recess 12a of the upper mold 12 and the recess 14a of the lower mold 14. The types of the upper mold 12 and the lower mold 14 of the mold may be appropriately changed according to the change in the shape of the lens unit 10 to be molded.

  As shown in FIG. 4, when the plurality of ejector pins 18 are not projected, the tip portions 18 a of the ejector pins 18 are flush with each other so as not to be uneven with respect to the flat portion 14 b of the lower mold 14. . By doing so, it is possible to prevent the softened molded product from entering the portion penetrating the tip portion 18a.

  In the case where an ultraviolet curable resin is used as the material of the lens portion, at least one of the upper mold 12 and the lower mold 14 located on the side irradiated with the ultraviolet light is made transparent to the ultraviolet light. Moreover, the board | substrate part 1 may be the material which permeate | transmits an ultraviolet-ray.

A manufacturing apparatus having the configuration shown in FIG. 4 will be described.
The manufacturing apparatus includes an upper mold 12 that functions as a first mold, and a cavity for molding the substrate unit 1 and the plurality of lens units 10 as an integral molded product by closing the mold with respect to the upper mold 12. And a lower mold 14 functioning as a second mold for forming. The upper mold 12 may be the second mold and the lower mold 14 may be the first mold. Moreover, the manufacturing apparatus includes a protruding portion that protrudes from one of the first mold and the second mold when releasing the molded product. In the configuration example of FIG. 4, the protrusion includes a plurality of ejector pins 18.

  Next, the procedure of the wafer level lens manufacturing method will be described with reference to FIG. In the following description, a configuration example of the wafer level lens manufacturing apparatus shown in FIGS. 4 and 5 will be referred to as appropriate.

  First, the upper mold 12 and the lower mold 14 are opened, and material is injected (step S1). Here, a thermosetting resin is used as the material.

  After injecting the material, a predetermined pressure is applied to the material by closing the upper die 12 and the lower die 14 (step S2).

  Next, the material is cured by heating while maintaining a state where a predetermined pressure is applied to the material (step S3). As a means for heating the material, for example, at least one of the upper mold 12 and the lower mold 14 is made of a metal material having good thermal conductivity, and the upper mold 12 and the lower mold 14 are heated by a heating unit such as a heater. Heat may be applied to the material.

  After the molded product is cured by heat, the upper mold 12 and the lower mold 14 are opened (step S4).

  Next, the protrusion is driven to peel off the molded product (step S5). FIG. 7A shows a state before driving the protrusion, and FIG. 7B shows a state after driving the protrusion.

  As shown in FIG. 7A, at the time of molding, the tip portions 18a of the plurality of ejector pins 18 are accommodated in the lower mold 14, and the substrate portion of the wafer level lens array to be molded is formed. Since no pressure is applied to 1, the shape of the molded substrate portion 1 is not affected.

  As shown in FIG. 7B, after molding, the movable plate 16 is moved to the upper die 12 side, so that the tip portions 18a of the ejector pins 18 fixed to the movable plate 16 protrude from the lower die 14, When the tip 18a presses the molded product, the molded product is peeled from the lower mold 14.

  When the distal end portion 18a presses the molded product, each distal end portion 18a contacts only the substrate portion 1 without contacting the lens portion 10 of the wafer level lens array.

  FIG. 8 shows the position of the tip of the ejector pin contacting the wafer level lens array, which is a molded product, in a plan view. As shown in FIG. 8, the tip portion 18 a of the ejector pin 18 abuts on the substrate portion 1 between the lens portions 10. In the example of FIG. 8, when the lens portions 10 arranged in the oblique direction are arranged in a row, the tip end portion 18a abuts between the adjacent lens portions 10 among the lens portions 10 in the same row for each row.

  The position of the tip of the ejector pin that contacts the wafer level lens array can be changed as appropriate. As in the example shown in FIG. 8, it is preferable that the respective positions where the tip portions 18 a of the plurality of ejector pins 18 abut on the substrate portion 1 are substantially symmetrical with respect to the center of the molded product. If it carries out like this, the whole molded article can be uniformly pressed with an ejector pin, and it can prevent that the biased pressing force is added to the one part area | region of a molded article. Since the wafer level lens array has a substantially circular shape in plan view, the positions where the tip portions 18a of the plurality of ejector pins 18 and the substrate portion 1 abut each other are arranged in a circle around the center of the molded product. It is particularly preferable. In this way, the entire wafer level lens array can be pressed almost uniformly, and it is possible to prevent problems such as deformation in the wafer level lens array due to the pressing.

  The wafer level lens array has a configuration in which the substrate portion 1 and the plurality of lens portions 10 are integrally molded. The thickness of the substrate portion 1 is small, but the upper die 12 and the lower die 14 are in contact with each other over a wide area. . For this reason, after curing, the wafer level lens array, which is a molded product, is in close contact with either one of the upper mold 12 and the lower mold 14 and is difficult to release. If a load is applied to the wafer level lens array to release the mold, the substrate portion 1 is likely to be deformed or the substrate portion 1 or the lens portion 10 is likely to be damaged, such as a crack. Therefore, in order to make it easy to take out the wafer level lens array from the mold, the upper mold 12 and the lower mold 14 are opened with the upper mold 12 and the lower mold 14 opened before the step of taking out the molding from between the molds. The molded product is pressed from one side of the mold 14 with the protruding portion, and the molded product is separated from the mold. Then, the site | part which peeled between the molding and the type | mold arises by the press from a protrusion part.

  Specifically, the pressing of the molded product by the protruding portion is performed from the upper die 12 and the lower die 14 on the side where the wafer level lens array is likely to adhere. In this configuration example, it is assumed that the molded wafer level lens array easily adheres to the lower mold 14 side, and the ejector pins 18 that are protruding portions are projected from the lower mold 14 side. If the molded wafer level lens array is likely to adhere to the upper mold 12 side, the ejector pins may be similarly projected from the upper mold 12 side. At this time, in order to prevent the molded product pressed by the ejector pin 18 from being completely peeled off and dropped, the vertical positions of the upper mold 12 and the lower mold 14 may be changed in advance to be opposite to each other. Good.

  The side where the wafer level lens array is likely to adhere means the side where the wafer level lens array which is a molded product is likely to adhere due to the influence of the surface shape, material, etc. when releasing the mold.

  In the configuration example shown in FIG. 7, it is assumed that the wafer level lens is attached to the lower mold 14. That is, the lower die 14 corresponds to the die on the side to which the wafer level lens is attached, and the lower surface (lower surface in the figure) of the lower die 14 is relative to the surface to which the wafer level lens is attached. Corresponds to the opposite surface.

  Further, the thickness direction of the substrate portion is a direction perpendicular to the two-dimensional plane direction in which the plurality of lens portions 10 are arranged, and corresponds to the vertical direction in the drawing.

  The protruding portion is not limited to a configuration including only a plurality of ejector pins as in the configuration example described above, and presses the front shape toward the mold release side while contacting only the substrate portion 1 other than the lens portion 10. Any configuration that can be used can be changed as appropriate.

  FIG. 9 is a diagram showing another configuration example of the wafer level lens array manufacturing apparatus. FIG. 9A shows a state before driving the protrusion, and FIG. 9B shows a state after driving the protrusion.

  In this configuration example, a plurality of ejector pins 18 and a sleeve 22 erected in the extending direction of the ejector pins 18 are fixed to the movable plate 16 near the periphery of the movable plate. The sleeve 22 has a cylindrical shape and is configured with a height equal to the height of the ejector pin 18 with respect to the movable plate 16. The plurality of ejector pins 18 and the sleeve 22 function as protrusions.

  As shown in FIG. 9B, after molding, the movable plate 16 is moved to the upper mold 12 side, whereby the tip end portions 18a and the sleeves 22 of the ejector pins 18 fixed to the movable plate 16 are moved to the lower mold 14. The tip portion 18a and the sleeve 22 press the molded product, thereby urging the molded product to be peeled from the lower mold 14.

  When the tip portion 18a and the sleeve 22 press the molded product, each tip portion 18a and the sleeve 22 abut only on the substrate portion 1 without contacting the lens portion 10 of the wafer level lens array. The sleeve 22 abuts along the peripheral edge of the molded product.

FIG. 10 shows the positions of the tip 18a of the ejector pin 18 and the sleeve 22 in contact with the wafer level lens array, which is a molded product, in a plan view. As shown in FIG. 10, the distal end portion 18 a of the ejector pin 18 abuts on the substrate portion 1 between the lens portions 10. In the example of FIG. 10, when the lens portions 10 arranged in the oblique direction are arranged in a row, the tip portion 18 a abuts between the adjacent lens portions 10 among the lens portions 10 in the same row for each row. The sleeve 22 substantially matches the shape of the peripheral edge of the wafer level lens array and abuts along the peripheral edge.
The sleeve 22 may be composed of a plurality of arc-shaped ribs that are divided into several pieces along the circumferential direction.

  Returning to the flowchart of FIG. 6, the continuation of the procedure of the manufacturing method will be described. After the molded product is pressed and peeled off by the protruding portion, the wafer level lens on the lower mold 14 is taken out (step S6).

  FIG. 11 shows an example of means for taking out the wafer level lens array. In the example of FIG. 11, the wafer level lens array is peeled from the lower mold 14 by sucking the suction part 32 on the upper surface of the wafer level lens array and pulling it upward. At this time, the tip end portion 18a of the ejector pin 18 may support the surface on the opposite side of the portion adsorbed by the adsorbing portion 32 of the wafer level lens array. By so doing, it is possible to smoothly release the wafer level lens array.

  For example, the suction unit 32 is configured to adhere to the upper surface of the wafer level lens by performing air suction to generate a negative pressure. A plurality of suction units 32 are provided for one wafer level lens, and each suction unit 32 is disposed so as to be in close contact with a flat region other than the region where the lens unit 10 is formed in the wafer level lens. Since the suction part 32 does not come into contact with the lens part 10, it is possible to avoid the occurrence of damage such as deformation.

  The wafer level lens array can be taken out from the lower mold 14 by lifting the wafer level lens array upward in a state where the plurality of suction portions 32 are in close contact with the upper surface of the substrate unit 1 of the wafer level lens array. At this time, since the boundary between the lower mold 14 and the wafer level lens array has already been peeled off by pressing, it can be easily taken out without applying strong tension from the plurality of suction portions 32 that hold the wafer level lens array. it can.

  Thus, a wafer level lens array in which the substrate unit 1 and the lens unit 10 are integrally molded can be obtained.

  In the above configuration example, when the substrate part 1 and the plurality of lenses 10 are integrally formed as a molded product by the upper mold 12 and the lower mold 14, the protruding part protrudes from one of the upper mold 12 and the lower mold 14, and the protruding part To press the molded product to the side to be released. By this pressing, the molded product is peeled from the mold. Thereafter, when the molded product is taken out from between the molds, it has already been peeled off, so that it can be taken out easily. When the molded product is pressed, the tip portion 18a in the projecting direction of the projecting portion does not directly contact the lens unit 10, so that the lens unit 10 can be prevented from being damaged.

  In particular, in a wafer level lens having a structure in which the substrate portion 1 and the plurality of lens portions 10 are integrally molded, the substrate portion 1 is thin and has a large area in contact with the mold. The tendency to adhere to either 12 or the lower mold 14 and to become difficult to separate is remarkable. For this reason, in the manufacture of a wafer level lens array, it is possible to take out the molded product without applying a load to the molded product by separating the boundary between the mold and the molded product by the protruding portion, which is effective. .

  Next, a procedure for manufacturing a lens module and an imaging unit using the wafer level lens array will be described.

  FIG. 12 is a diagram illustrating a process of dicing the wafer level lens array. As shown in FIG. 6A, a spacer 2 is bonded to one surface (a lower surface in the drawing) of the substrate 1 of the wafer level lens array. Then, as shown in FIG. 2B, alignment is performed between the substrate unit 1 of the wafer level lens array and the semiconductor substrate W formed in a wafer shape in the same manner as the substrate unit 1. On one surface of the semiconductor substrate W (the upper surface in the figure), the solid-state imaging device D is provided in the same arrangement as the arrangement of the plurality of lens units 10 provided on the substrate unit 1. Then, the substrate unit 1 of the wafer level lens array is superimposed on the semiconductor substrate W formed in a wafer shape like the substrate unit 1 through the spacer 2 and is integrally bonded. Thereafter, the integrated wafer level lens array, semiconductor substrate W, and spacer 2 are provided with cutting means such as a blade C along a cutting line defined between rows of the lens unit 10 and the solid-state imaging device D. And is separated into a plurality of imaging units. The cutting line is, for example, in a lattice shape in plan view of the substrate unit 1.

  In the figure, a description is given of an example of dicing when manufacturing an imaging unit. The dicing when manufacturing the lens module is performed by bonding the spacer 2 to the substrate unit 1 of the wafer level lens array, and then cutting it according to the arrangement of the lens units 10 without bonding it to the semiconductor substrate W. To separate.

  FIG. 13 is a diagram illustrating a procedure of a manufacturing method of the lens module. In this procedure, an example will be described in which a wafer level lens array in which a plurality of lens portions 10 are integrally formed on one substrate portion 1 is diced and separated into a plurality of lens modules.

  First, a wafer level lens array is prepared as shown in FIG. The wafer level lens array can be manufactured by the procedure described above, and in the following description, the procedure is omitted without being described.

  Next, as shown in FIG. 2B, the spacer 2 is bonded to the lower surface of the substrate portion 1 with an adhesive or the like.

  Then, as shown in FIG. 3C, the substrate unit 1 of the wafer level lens array is cut along a cutting line indicated by a dotted line in the drawing, and separated into a plurality of lens modules. At this time, the spacers 2 that are overlapped and joined on each cutting line are also cut at the same time, and the spacer 2 is divided with each cutting line as a boundary, and attached to each lens module adjacent to each cutting line. Thus, the lens module is completed.

  The separated lens module may be assembled to a substrate including a sensor module (not shown) and other optical elements via the spacer 2.

  In this way, if the spacer 2 is bonded to the wafer level lens array in advance, and then the substrate part 1 of the wafer level lens array is cut together with the spacer 2 in the dicing process, the spacer 2 is attached to each of the separated lens modules. The lens module can be mass-produced more efficiently than the case of joining, and the productivity can be improved.

  FIG. 14 is a diagram illustrating a procedure for manufacturing a lens module having a configuration different from that of FIG. 13. In this procedure, an example will be described in which two substrate portions 1 and a wafer level lens array in which a plurality of lens portions 10 are integrally formed on each substrate portion 1 are diced and separated into a plurality of lens modules.

  First, a plurality of wafer level lens arrays are prepared as shown in FIG. The wafer level lens array can be manufactured by the procedure described above, and in the following description, the procedure is omitted without being described. A spacer 2 is bonded to one surface of each substrate unit 1 of the plurality of wafer level lens arrays with an adhesive or the like. Then, the substrate portions 1 of the wafer level lens array to be superimposed are aligned with each other, and the lower surface of the substrate portion 1 of the wafer level lens array disposed above is placed on the upper surface of the substrate portion 1 of the wafer level lens array disposed below. , And joined through the spacer 2. In a state where the wafer level lens arrays are overlapped with each other, the position where the spacer 2 is bonded to each substrate unit 1 is set to be the same in each substrate unit 1.

  Then, as shown in FIG. 4B, the substrate unit 1 of the wafer level lens array is cut along a cutting line indicated by a dotted line in the drawing, and separated into a plurality of lens modules. At this time, the spacers 2 that are overlapped and joined on the respective cutting lines are also cut at the same time, and the spacers 2 divided with the respective cutting lines as boundaries are attached to the lens modules adjacent to the respective cutting lines. Thus, a lens module including a plurality of lens units 10 is completed. In this procedure, since the positions of the lens unit 10 and the spacer 2 with respect to the respective substrate units 1 to be superimposed are the same, the configurations of the plurality of separated lens modules are all the same. Further, the position of the cutting line may be determined based on the uppermost substrate portion 1 among the respective substrate portions 1 to be overlapped and cut.

  The separated lens module may be assembled to a substrate including a sensor module (not shown) and other optical elements via the spacer 2.

  As described above, if a plurality of wafer level lens arrays are overlapped with each other via a spacer, and then the substrate part 1 of the wafer level lens array is cut together with the spacers 2 in a dicing process, the separated lens modules are individually stacked. Compared with the case of matching, the lens module can be mass-produced more efficiently, and the productivity is improved.

  FIG. 15 is a diagram illustrating a procedure for manufacturing the imaging unit. In this procedure, an example will be described in which a single substrate unit 1 and a lens module in which a plurality of lens units 10 are integrally formed on the substrate unit 1 are joined to a sensor module and diced to be separated into a plurality of imaging units.

  First, a wafer level lens array is prepared as shown in FIG. The wafer level lens array can be manufactured by the procedure described above, and in the following description, the procedure is omitted without being described. Then, the spacer 2 is bonded to the lower surface of the substrate unit 1 with an adhesive or the like.

  Next, a semiconductor substrate W on which a plurality of solid-state imaging elements D are arranged is prepared. After aligning the substrate unit 1 of the wafer level lens array and the semiconductor substrate W, the substrate unit 1 is bonded to the upper surface of the semiconductor substrate W via the spacer 2. At this time, the extension of the optical axis of each lens unit 10 provided on the substrate unit 1 intersects with the central part of the solid-state imaging device D.

  Then, as shown in FIG. 3C, after the substrate unit 1 of the wafer level lens array and the semiconductor substrate W are joined, the substrate unit 1 is cut along a cutting line indicated by a dotted line in the drawing. Separate the imaging unit. At this time, the spacers 2 that are overlapped and joined on each cutting line are also cut at the same time, and the spacer 2 is divided with each cutting line as a boundary and attached to each imaging unit adjacent to each cutting line. Thus, the imaging unit is completed.

  In this way, the spacer 2 is bonded to the wafer level lens array in advance, and then the substrate of the wafer level lens array and the semiconductor substrate W provided with the solid-state imaging device D are overlapped to form the substrate unit 1 and the semiconductor substrate W. Can be mass-produced and produced more efficiently than the case of manufacturing the imaging unit by joining the sensor module to the separated lens modules via the spacers 2 respectively. Can be improved.

  FIG. 16 is a diagram showing a procedure for manufacturing an imaging unit different from the configuration of FIG. In this procedure, two substrate portions 1 and a wafer level lens array in which a plurality of lens portions 10 are integrally formed on each substrate portion 1 are bonded to a semiconductor substrate provided with a solid-state imaging device, and each is dized. An example of separation into a plurality of imaging units including one lens unit 10 will be described.

  First, two wafer level lens arrays are prepared as shown in FIG. The wafer level lens array can be manufactured by the procedure described above, and in the following description, the procedure is omitted without being described. Then, the spacer 2 is bonded to the lower surface of each of the two substrate portions 1 to be overlapped with an adhesive or the like. Then, the substrate portions 1 of the wafer level lens array to be superimposed are aligned with each other, and the lower surface of the substrate portion 1 of the wafer level lens array disposed above is placed on the upper surface of the substrate portion 1 of the wafer level lens array disposed below. , And joined through the spacer 2. In a state where the wafer level lens arrays are overlapped with each other, the position where the spacer 2 is bonded to each substrate unit 1 is set to be the same in each substrate unit 1.

  Next, a semiconductor substrate W on which a plurality of solid-state imaging elements D are arranged is prepared. The alignment of the semiconductor substrate W with the substrate portions 1 of the plurality of wafer level lens arrays in a superposed state is performed. Thereafter, the substrate portion 1 located at the bottom is bonded to the upper surface of the semiconductor substrate W via the spacer 2. At this time, the extension of the optical axis of each lens unit 10 provided on the substrate unit 1 intersects with the central part of the solid-state imaging device D.

  Then, as shown in FIG. 3C, after the substrate unit 1 and the semiconductor substrate W of the wafer level lens array are joined, the substrate unit 1 and the semiconductor substrate W are moved along the cutting line indicated by the dotted line in the drawing. Cut and separate into multiple imaging units. At this time, the spacers 2 that are overlapped and joined on each cutting line are also cut at the same time, and the spacer 2 is divided with each cutting line as a boundary and attached to each imaging unit adjacent to each cutting line. In this way, an imaging unit including a plurality of lens units 10 is completed.

  In this way, a plurality of wafer level lens arrays are bonded to each other via the spacer 2, and then, the substrate portion 1 of the lowermost wafer level lens array and the semiconductor substrate W including the solid-state imaging device D are overlapped. The substrate portion 1 and the semiconductor substrate W are cut together in a dicing process. According to such a procedure, the separated lens modules are overlapped with each other, and further, the image pickup units are more efficiently compared with the case of manufacturing each image pickup unit by joining the lens modules and the sensor modules. Mass production is possible and productivity can be improved.

This specification discloses the following contents.
(1) A method for manufacturing a wafer level lens array in which a substrate portion and a plurality of lens portions arranged on the substrate portion are formed,
Forming the substrate part and the plurality of lens parts as an integral molded product with the first mold and the second mold;
A step of releasing the molded product,
In the step of releasing the molded product, the molded product is caused to protrude from one of the first mold and the second mold, and the protruding portion is brought into contact with only the substrate unit other than the lens unit. For manufacturing a wafer level lens array that presses the lens toward the mold release side.
(2) A method for producing a wafer level lens array according to (1) above,
A method of manufacturing a wafer level lens array, wherein the protruding portion includes a plurality of ejector pins, and a tip portion of the protruding direction of the plurality of ejector pins is in contact with only the substrate portion excluding the lens portion.
(3) The method for producing a wafer level lens array according to (1) or (2) above,
A method of manufacturing a wafer level lens array, wherein the protruding portion includes a sleeve having a cylindrical shape, and a tip portion in a protruding direction of the sleeve is brought into contact with only a peripheral edge portion of the substrate portion.
(4) The method for producing a wafer level lens array according to (2) or (3) above,
A method of manufacturing a wafer level lens array, wherein respective positions where the tip portions of the plurality of ejector pins contact the substrate portion are substantially symmetrical with respect to the center of the molded product.
(5) The method for producing a wafer level lens array according to any one of (2) to (4) above,
A method of manufacturing a wafer level lens array, wherein respective positions where the tip portions of the plurality of ejector pins contact the substrate portion are arranged in a circle around the center of the molded product.
(6) The method for producing a wafer level lens array according to any one of (1) to (5), wherein the substrate portion and the plurality of lens portions are made of an ultraviolet curable resin or a thermosetting material. A method for manufacturing a wafer level lens array, which is either a resin or a thermoplastic resin.
(7) A wafer level lens array obtained by the method for producing a wafer level lens array according to any one of (1) to (6) above.
(8) A lens module obtained by dicing the substrate portion of the wafer level lens array according to (7) above and dividing the substrate portion for each lens portion.
(9) The lens module according to (8) above,
A lens module in which a spacer is provided around the lens portion of the substrate portion.
(10) The lens module according to (8) above,
A lens module comprising a plurality of the substrate portions on which the lens portions are formed, wherein the plurality of substrate portions are overlapped with a spacer interposed therebetween.
(11) An imaging unit including the lens module according to (9) or (10),
An image sensor;
A semiconductor substrate provided with the imaging device,
An imaging unit in which the substrate portion and the semiconductor substrate are integrally joined via the spacer.
(12) A wafer level lens array manufacturing apparatus in which a substrate portion and a plurality of lens portions arranged on the substrate portion are formed,
The first type;
A second mold that forms a cavity for molding the substrate section and the plurality of lens sections as an integral molded article by closing the mold with respect to the first mold;
A protrusion that protrudes from one of the first mold and the second mold is provided, and when the molded product is released, the protrusion comes into contact with only the substrate portion other than the lens portion and the molded product. For manufacturing a wafer level lens array that presses the lens toward the mold release side.
(13) The wafer level lens array manufacturing apparatus according to (12) above,
An apparatus for manufacturing a wafer level lens array, wherein the protruding portion includes a plurality of ejector pins, and a tip portion in a protruding direction of the plurality of ejector pins contacts only the substrate portion excluding the lens portion.
(14) The wafer level lens array manufacturing apparatus according to (12) or (13) above,
An apparatus for manufacturing a wafer level lens array, wherein the protruding portion includes a sleeve having a cylindrical shape, and a tip portion of the sleeve in a protruding direction contacts only a peripheral edge portion of the substrate portion.
(15) The wafer level lens array manufacturing apparatus according to (13) or (14) above,
An apparatus for manufacturing a wafer level lens array, wherein the respective positions where the tip portions of the plurality of ejector pins contact the substrate portion are substantially symmetrical with respect to the center of the molded product.
(16) The wafer level lens array manufacturing apparatus according to any one of (13) to (15) above,
An apparatus for manufacturing a wafer level lens array, wherein respective positions where the tip portions of the plurality of ejector pins contact the substrate portion are arranged in a circle around the center of the molded product.

  The method and apparatus for manufacturing a wafer level lens array can be applied when manufacturing an imaging lens provided in an imaging unit such as a digital camera, an endoscope apparatus, or a portable electronic device.

1 Substrate 10 Lens 12 Upper Die 14 Lower Die 18 Ejector Pin 22 Sleeve

Claims (16)

A method for manufacturing a wafer level lens array in which a substrate portion and a plurality of lens portions arranged on the substrate portion are formed,
Forming the substrate part and the plurality of lens parts as an integral molded product with the first mold and the second mold;
A step of releasing the molded product,
In the step of releasing the molded product, the molded product is caused to protrude from one of the first mold and the second mold, and the protruding portion is brought into contact with only the substrate unit other than the lens unit. For manufacturing a wafer level lens array that presses the lens toward the mold release side. A method of manufacturing a wafer level lens array according to claim 1,
A method of manufacturing a wafer level lens array, wherein the protruding portion includes a plurality of ejector pins, and a tip portion of the protruding direction of the plurality of ejector pins is in contact with only the substrate portion excluding the lens portion. A method for producing a wafer level lens array according to claim 1 or 2,
A method of manufacturing a wafer level lens array, wherein the protruding portion includes a sleeve having a cylindrical shape, and a tip portion in a protruding direction of the sleeve is brought into contact with only a peripheral edge portion of the substrate portion. A method for producing a wafer level lens array according to claim 2 or 3,
A method of manufacturing a wafer level lens array, wherein respective positions where the tip portions of the plurality of ejector pins contact the substrate portion are substantially symmetrical with respect to the center of the molded product. A method for producing a wafer level lens array according to any one of claims 2 to 4,
A method of manufacturing a wafer level lens array, wherein respective positions where the tip portions of the plurality of ejector pins contact the substrate portion are arranged in a circle around the center of the molded product.   6. The method of manufacturing a wafer level lens array according to claim 1, wherein the substrate part and the plurality of lens parts are made of an ultraviolet curable resin, a thermosetting resin, or a thermoplastic resin. A method for manufacturing a wafer level lens array, which is one of them.   A wafer level lens array obtained by the method for manufacturing a wafer level lens array according to claim 1.   The lens module formed by dicing the said board | substrate of the said wafer level lens array of Claim 7, and dividing | segmenting for every said lens part. The lens module according to claim 8, wherein
A lens module in which a spacer is provided around the lens portion of the substrate portion. The lens module according to claim 8, wherein
A lens module comprising a plurality of the substrate portions on which the lens portions are formed, wherein the plurality of substrate portions are overlapped with a spacer interposed therebetween. An imaging unit comprising the lens module according to claim 9 or 10,
An image sensor;
A semiconductor substrate provided with the imaging device,
An imaging unit in which the substrate portion and the semiconductor substrate are integrally joined via the spacer. A wafer level lens array manufacturing apparatus in which a substrate portion and a plurality of lens portions arranged on the substrate portion are formed,
The first type;
A second mold that forms a cavity for molding the substrate section and the plurality of lens sections as an integral molded article by closing the mold with respect to the first mold;
A protrusion that protrudes from one of the first mold and the second mold is provided, and when the molded product is released, the protrusion comes into contact with only the substrate portion other than the lens portion and the molded product. For manufacturing a wafer level lens array that presses the lens toward the mold release side. An apparatus for manufacturing a wafer level lens array according to claim 12,
An apparatus for manufacturing a wafer level lens array, wherein the protruding portion includes a plurality of ejector pins, and a tip portion in a protruding direction of the plurality of ejector pins contacts only the substrate portion excluding the lens portion. The wafer level lens array manufacturing apparatus according to claim 12 or 13,
An apparatus for manufacturing a wafer level lens array, wherein the protruding portion includes a sleeve having a cylindrical shape, and a tip portion of the sleeve in a protruding direction contacts only a peripheral edge portion of the substrate portion. The apparatus for producing a wafer level lens array according to claim 13 or 14,
An apparatus for manufacturing a wafer level lens array, wherein the respective positions where the tip portions of the plurality of ejector pins contact the substrate portion are substantially symmetrical with respect to the center of the molded product. The wafer level lens array manufacturing apparatus according to any one of claims 13 to 15,
An apparatus for manufacturing a wafer level lens array, wherein respective positions where the tip portions of the plurality of ejector pins contact the substrate portion are arranged in a circle around the center of the molded product.

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