JP2010258186A - Connection body for printed board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent lands from short-circuiting by enhancing efficiency of wiring connection between boards. <P>SOLUTION: A connection body 1 includes a printed board 11 having a thin and long insertion hole 16 and a printed board 21 having an insert portion 21a inserted into the hole 16. On a +Z side face of the board 11, first lands 13a are formed near the hole 16 on a +Y side with respect to the hole 16 in sequence at intervals along an X axis. On a -Z side face of the board 11, second lands 13c are formed near the hole 16 on the +Y side with respect to the hole 16 in sequence at intervals along the X axis. X positions of the second lands 13c shift from X positions of the first lands 13a. Third lands 23a are formed on a +Y side face of a board 21 corresponding to the first lands 13a and soldered thereto. Fourth lands 23c are formed on the +Y side face of the board 21 corresponding to the second lands 13c and soldered thereto. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a printed circuit board connection body in which printed circuit boards are connected to each other.

  In the following Patent Document 1, a board mounting hole is formed in a first printed board, a leg plate portion to be inserted into the board mounting hole is formed in a second printed board, and a connection land is formed in the leg plate section. And a connection land on the first printed circuit board side is formed in the immediate vicinity of the board mounting hole, and the connection land on the first printed circuit board side is inserted in a state where the leg plate portion is inserted into the board mounting hole. There is disclosed a vertical mounting structure of a printed circuit board in which a connection land on the second printed circuit board side is joined by automatic soldering.

JP 2000-31615 A

  However, in the conventional printed circuit board vertical mounting structure disclosed in Patent Document 1, the connection land on the first printed circuit board side is formed only on one surface of the first printed circuit board. The wiring connection efficiency (number of connections per space) between the first and second printed circuit boards is not so high.

  The present invention has been made in view of such circumstances, and can improve the wiring connection efficiency between printed circuit boards, and can further prevent an unintended short circuit between connection lands. The purpose is to provide.

  The following aspects are presented as means for solving the problems. The printed circuit board connector according to the first aspect includes (i) a first printed circuit board having an insertion hole, (ii) a second printed circuit board partially inserted into the insertion hole, and (iii) the first printed circuit board. A plurality of first connection lands formed in the vicinity of the insertion hole at intervals in the longitudinal direction of the insertion hole, and (iv) the other of the first printed circuit board. A plurality of second connection points formed in the vicinity of the insertion holes at intervals in the longitudinal direction, the positions in the longitudinal direction being shifted from the positions of the plurality of first connection lands. A land, (v) a plurality of third connection lands electrically connected to the plurality of first connection lands on one surface of the second printed circuit board, and (vi) the second The plurality of second surfaces on the one surface of the printed circuit board. A plurality of fourth connection land connected to connection lands electrically, those having a.

  In the printed circuit board connector according to the second aspect, the pitch of the plurality of first connection lands and the pitch of the plurality of second connection lands in the first aspect are the same. The positions of the first connection lands and the positions of the plurality of second connection lands are shifted by a half pitch of the pitch of the first and second connection lands.

  The printed circuit board connector according to the third aspect is the first or second aspect, wherein the plurality of first connection lands and the plurality of second connection lands are separated from the edge of the insertion hole. Are arranged.

  A printed circuit board connector according to a fourth aspect is the printed circuit board connection body according to any one of the first to third aspects, wherein: (i) the other surface in the width direction with respect to the insertion hole is formed on the one surface of the first printed circuit board. A plurality of fifth connection lands formed in the vicinity of the insertion hole at intervals in the longitudinal direction, and (ii) the insertion on the other surface of the first printed circuit board. On the other side of the hole, formed in the vicinity of the insertion hole at intervals in the longitudinal direction, and the position in the longitudinal direction is the position in the longitudinal direction of the plurality of fifth connection lands. A plurality of sixth connection lands that are offset from each other; and (iii) formed on the other surface of the second printed circuit board so as to correspond to the plurality of fifth connection lands, respectively. 5th connection A plurality of seventh connection lands respectively connected to the lands by solder; and (iv) formed on the other surface of the second printed circuit board in correspondence with the plurality of sixth connection lands. And a plurality of eighth connection lands respectively connected to the plurality of sixth connection lands by solder.

  According to a fifth aspect of the printed circuit board connector, in the fourth aspect, the longitudinal pitch of the plurality of fifth connection lands and the longitudinal pitch of the plurality of sixth connection lands. And the positions in the longitudinal direction of the plurality of fifth connection lands and the positions in the longitudinal direction of the plurality of sixth connection lands are the fifth and sixth connection lands. The pitch is shifted by a half pitch.

  In the printed circuit board connector according to the sixth aspect, in the fourth or fifth aspect, the plurality of fifth connection lands and the plurality of sixth connection lands are separated from an edge of the insertion hole. Are arranged.

  According to a seventh aspect of the printed circuit board connector, in any one of the first to sixth aspects, one or both of the first and second printed circuit boards are flexible printed circuit boards. It is.

  ADVANTAGE OF THE INVENTION According to this invention, the connection body of the printed circuit board which can improve the wiring connection efficiency of printed circuit boards, and can prevent the short circuit between the unintended connection lands can be provided.

It is a schematic front view which shows typically the connection body of the printed circuit board by the 1st Embodiment of this invention. It is a schematic sectional drawing in alignment with the Z1-Z2 line | wire in FIG. It is a schematic sectional drawing in alignment with the Z3-Z3 line | wire in FIG. It is a schematic plan view which shows one surface of the 1st printed circuit board in FIG. It is a schematic plan view which shows the other surface of the 1st printed circuit board in FIG. It is a schematic sectional drawing in alignment with the X1-X2 line | wire in FIG.4 and FIG.5. It is a schematic plan view which shows one surface of the 2nd printed circuit board in FIG. It is a schematic plan view which shows the other surface of the 2nd printed circuit board in FIG. It is a schematic front view which shows typically the connection body of the printed circuit board by a comparative example. It is a schematic sectional drawing in alignment with the Z5-Z6 line | wire in FIG. It is a schematic front view which shows typically the connection body of the printed circuit board by the 2nd Embodiment of this invention. It is a schematic sectional drawing in alignment with the Z7-Z8 line | wire in FIG. It is a schematic sectional drawing in alignment with the Z9-Z10 line | wire in FIG. It is a schematic plan view which shows one surface of the 1st printed circuit board in FIG. It is a schematic plan view which shows the other surface of the 1st printed circuit board in FIG. It is a schematic sectional drawing in alignment with the X5-X6 line | wire in FIG.14 and FIG.15.

  Hereinafter, a printed circuit board connector according to the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a schematic front view schematically showing a printed circuit board connection body 1 according to a first embodiment of the present invention. However, in FIG. 1, illustration of solders 31a and 31c (see FIGS. 2 and 3), which will be described later, is omitted. FIG. 2 is a schematic cross-sectional view taken along the line Z1-Z2 in FIG. FIG. 3 is a schematic cross-sectional view taken along line Z3-Z3 in FIG. FIG. 4 is a schematic plan view showing one surface (the surface on the + Z side) of the first printed circuit board 11 in FIG. FIG. 5 is a schematic plan view showing the other surface (the surface on the −Z side) of the first printed circuit board 11 in FIG. 1. 6 is a schematic cross-sectional view taken along line X1-X2 in FIGS. The schematic cross-sectional views along the line X3-X4 in FIGS. 4 and 5 are obtained by replacing the reference numeral 13a with the reference numeral 13b and the reference numeral 13c with the reference numeral 13d in FIG. FIG. 7 is a schematic plan view showing one surface (+ Y side surface) of the second printed circuit board 21 in FIG. 1. FIG. 8 is a schematic plan view showing the other surface (the surface on the −Y side) of the second printed circuit board 21 in FIG. 1.

  For convenience of explanation, as shown in FIGS. 1 to 8, an X axis, a Y axis, and a Z axis orthogonal to each other are defined. Both surfaces of the first printed circuit board 11 are parallel to the XY plane, and both surfaces of the second printed circuit board 21 are parallel to the XZ plane.

  The connection body 1 according to the present embodiment includes a first printed circuit board 11 having an insertion hole 16 elongated in the X-axis direction, and a second printed circuit board 21 having an insertion portion 21 a inserted into the insertion hole 16. ing. The longitudinal direction of the insertion hole 16 is the X-axis direction, and the width direction of the insertion hole 16 is the Y-axis direction. A rectangular portion on the −Z side of the second printed circuit board 21 constitutes the insertion portion 21a. The dimension of the insertion part 21a in the X-axis direction is slightly smaller than the dimension of the insertion hole 16 in the X-axis direction. The thickness of the insertion portion 21a (dimension in the Y-axis direction) is slightly smaller than the dimension of the insertion hole 16 in the Y-axis direction. Both side portions at the base of the insertion portion 21a constitute an insertion stop portion 21b that abuts against the first printed circuit board 11 when the insertion portion 21a is inserted into the insertion hole 16 and regulates the insertion amount of the insertion portion 21a. Yes.

  The first printed circuit board 11 includes a rigid insulating plate 12, a plurality of connection lands 13a and 13b formed on the surface of the insulating plate 12 on the + Z side, a resist formed on the + Z side of the insulating plate 12, and the like. An insulating layer 14 made of an insulating material, a plurality of connection lands 13c and 13d formed on the -Z side surface of the insulating plate 12, and an insulating material such as a resist formed on the -Z side of the insulating plate 12. And an insulating layer 15. A plurality of wiring patterns (not shown) such as copper foil are formed between the insulating plate 12 and the insulating layer 14, and the end portions thereof are not covered with the insulating layer 14 and are connected to the connection lands 13 a and 13 b. It has become. Further, a plurality of wiring patterns (not shown) such as copper foil are formed between the insulating plate 12 and the insulating layer 15, and the end portions thereof are not covered with the insulating layer 15, and the connection lands 13 c, 13d. Although not shown in the drawings, electronic components and the like are mounted on the first printed board 11 as necessary, and through holes and the like for connecting the wiring patterns on both surfaces of the insulating plate 12 are formed. .

  The plurality of connection lands 13 a are arranged on the + Z side surface of the first printed circuit board 11 on the + Y side with respect to the insertion hole 16 and in the vicinity of the insertion hole 16 at intervals in the X-axis direction. These connection lands 13a are arranged at a constant pitch P in the X-axis direction. These connection lands 13 a are arranged at a predetermined distance d from the edge of the insertion hole 16.

  Similarly, the plurality of connection lands 13b are arranged on the + Z side surface of the first printed circuit board 11 on the −Y side with respect to the insertion hole 16 and in the vicinity of the insertion hole 16 at intervals in the X-axis direction. Has been. These connection lands 13b are arranged at the pitch P in the X-axis direction. These connection lands 13b are arranged away from the edge of the insertion hole 16 by the predetermined distance d. In the present embodiment, the positions in the X-axis direction of the plurality of connection lands 13a coincide with the positions in the X-axis direction of the plurality of connection lands 13b, but may be appropriately deviated.

  The plurality of connection lands 13c are arranged in the vicinity of the insertion hole 16 on the + Z side of the first printed circuit board 11 on the + Y side with respect to the insertion hole 16 and sequentially spaced in the X-axis direction. . The positions of the plurality of connection lands 13c in the X-axis direction are shifted from the positions of the plurality of connection lands 13a in the X-axis direction. In the present embodiment, the plurality of connection lands 13c are also arranged at the pitch P in the X-axis direction like the plurality of connection lands 13a, but the plurality of connection lands 13c in the X-axis direction are also arranged. The position is shifted by a half pitch of the pitch P from the position in the X-axis direction of the plurality of connection lands 13a. Similarly to the connection land 13a, the connection land 13c is also arranged away from the edge of the insertion hole 16 by a predetermined distance d.

  Similarly, the plurality of connection lands 13d are arranged on the −Z side surface of the first printed circuit board 11 on the −Y side with respect to the insertion hole 16 and in the vicinity of the insertion hole 16 at intervals in the X-axis direction. Is arranged. The positions of the plurality of connection lands 13d in the X-axis direction are shifted from the positions of the plurality of connection lands 13b in the X-axis direction. In the present embodiment, the plurality of connection lands 13d are also arranged at the pitch P in the X-axis direction like the plurality of connection lands 13b, but the plurality of connection lands 13b in the X-axis direction are also arranged. The position is shifted by a half pitch of the pitch P with respect to the position in the X-axis direction of the plurality of connection lands 13b. Similarly to the plurality of connection lands 13b, the plurality of connection lands 13d are also separated from the edge of the insertion hole 16 by a predetermined distance d.

  The second printed circuit board 21 includes a rigid insulating plate 22, a plurality of connection lands 23 a and 23 c formed on the surface of the insulating plate 22 on the + Y side, a resist formed on the + Y side of the insulating plate 22, and the like. An insulating layer 24 made of the above insulating material, a plurality of connection lands 23b and 23d formed on the -Y side surface of the insulating plate 22, and an insulating material such as a resist formed on the -Y side of the insulating plate 22. And an insulating layer 25. A plurality of wiring patterns (not shown) such as copper foil are formed between the insulating plate 22 and the insulating layer 24, and the end portions thereof are not covered with the insulating layer 24, and the connection lands 23a, 23c and It has become. Further, a plurality of wiring patterns (not shown) such as copper foil are formed between the insulating plate 22 and the insulating layer 25, and the end portions thereof are not covered with the insulating layer 25, and the connection lands 23b, 23d. Although not shown in the drawings, electronic components and the like are mounted on the second printed circuit board 21 as necessary, and through holes and the like for connecting the wiring patterns on both surfaces of the insulating plate 22 are formed. .

  The plurality of connection lands 23a are formed on the + Y side surface of the second printed circuit board 21 so as to correspond to the plurality of connection lands 13a, respectively, and face the plurality of connection lands 13a. In the present embodiment, the plurality of connection lands 23a are also arranged at the pitch P in the X-axis direction like the plurality of connection lands 13a, and the positions of the plurality of connection lands 23a in the X-axis direction are: The positions of the plurality of connection lands 13a in the X-axis direction are the same. In the present embodiment, the plurality of connection lands 23a are arranged at a predetermined distance d ′ in the + Z direction from the position in the Z-axis direction of the + Z side surface of the plurality of connection lands 13a. Yes. The plurality of connection lands 23a are respectively connected to the plurality of connection lands 13a by solder 31a.

  The plurality of connection lands 23c are formed on the surface on the + Y side of the second printed circuit board 21 so as to correspond to the plurality of connection lands 13c, respectively, and face the plurality of connection lands 13c. In the present embodiment, the plurality of connection lands 23c are also arranged at the pitch P in the X-axis direction like the plurality of connection lands 13c, and the positions of the plurality of connection lands 23c in the X-axis direction are: The positions of the plurality of connection lands 13c in the X-axis direction are the same. In the present embodiment, the plurality of connection lands 23c are separated from the position in the Z-axis direction on the −Z side surface of the plurality of connection lands 13c by the predetermined distance d ′ in the −Z direction. Has been placed. The plurality of connection lands 23c are respectively connected to the plurality of connection lands 13c by solder 31c.

  The plurality of connection lands 23b are formed corresponding to the plurality of connection lands 13b on the −Y side surface of the second printed circuit board 21 and face the plurality of connection lands 13b, respectively. . In the present embodiment, the plurality of connection lands 23b are also arranged at the pitch P in the X-axis direction like the plurality of connection lands 13b, and the positions of the plurality of connection lands 23b in the X-axis direction are: The positions of the plurality of connection lands 13b in the X-axis direction are the same. In the present embodiment, the plurality of connection lands 23b are arranged at a predetermined distance d ′ in the + Z direction from the position in the Z-axis direction of the surface on the + Z side of the plurality of connection lands 13b. Yes. The plurality of connection lands 23b are respectively connected to the plurality of connection lands 13b by solder 31b.

  The plurality of connection lands 23d are formed on the −Y side surface of the second printed circuit board 21 so as to correspond to the plurality of connection lands 13d, respectively, and face the plurality of connection lands 13d. . In the present embodiment, the plurality of connection lands 23d are also arranged at the pitch P in the X-axis direction like the plurality of connection lands 13d, and the positions of the plurality of connection lands 23d in the X-axis direction are: The positions of the plurality of connection lands 13d in the X-axis direction are the same. In the present embodiment, the plurality of connection lands 23d are separated from the position in the Z-axis direction on the −Z side surface of the plurality of connection lands 13d by the predetermined distance d ′ in the −Z direction. Has been placed. The plurality of connection lands 23d are respectively connected to the plurality of connection lands 13d by solder 31d.

  For example, the connecting lands 13a, 13b, 13c, 13d, 23a, 23b, 23c, and 23d have a width in the X-axis direction of 0.5 mm, the pitch P is 1.0 mm, and the predetermined distances d and d ′ are 0.2 mm. About 0.3 mm.

  Here, the connection body 101 by the comparative example compared with the connection body 1 by this Embodiment is demonstrated with reference to FIG.9 and FIG.10. FIG. 9 is a schematic front view schematically showing the connection body 101 according to this comparative example, and corresponds to FIG. FIG. 10 is a schematic cross-sectional view taken along line Z5-Z6 in FIG. 9 and 10, elements that are the same as or correspond to those in FIGS. 1 to 8 are given the same reference numerals, and redundant descriptions thereof are omitted.

  The connection body 101 according to this comparative example is different from the connection body 1 according to the present embodiment only in the first and second differences described below.

  First, the first difference will be described. In the present embodiment, as described above, the positions of the plurality of connection lands 13c in the X-axis direction are shifted by a half pitch of the pitch P with respect to the positions of the plurality of connection lands 13a in the X-axis direction. The positions of the connecting lands 13b in the X-axis direction are shifted by a half pitch of the pitch P with respect to the positions of the plurality of connecting lands 13b in the X-axis direction, and the connecting lands 23a, 23b, 23c, 23d are connected to the connecting lands 13a. , 13b, 13c, and 13d. In contrast, in this comparative example, the positions of the plurality of connection lands 13c in the X-axis direction coincide with the positions of the plurality of connection lands 13a in the X-axis direction, and the positions of the plurality of connection lands 13b in the X-axis direction. Coincides with the positions in the X-axis direction of the plurality of connection lands 13b, and the connection lands 23a, 23b, 23c, and 23d are formed corresponding to the connection lands 13a, 13b, 13c, and 13d, respectively.

  Next, the second difference will be described. In the present embodiment, as described above, as shown in FIGS. 2 and 3, the connection lands 13a, 13b, 13c, and 13d are arranged at a predetermined distance d from the edge of the insertion hole 16, and the connection lands are arranged. 23a, 23b, 23c, and 23d are disposed at a predetermined distance d ′ in the Z-axis direction from the surfaces near the connection lands 13a, 13b, 13c, and 13d, respectively. In this embodiment, the connecting lands 13a and 23a are arranged so that those connected by the solder 31a are not in contact with each other, and the connecting lands 13b and 23b are not in contact with each other connected by the solder 31b. The connecting lands 13c and 23c are arranged so that those connected by the solder 31c are not in contact with each other, and the connecting lands 13d and 23d are arranged so that those connected by the solder 31d are not in contact with each other. ing. On the other hand, in this comparative example, d = 0 is set and the connection lands 13a, 13b, 13c, 13d are arranged up to the edge of the insertion hole 16, and d '= 0 is set to the connection lands 23a, 23b. , 23c, and 23d are disposed up to the position in the Z-axis direction on the surface near the connection lands 13a, 13b, 13c, and 13d. In this comparative example, the connecting lands 13a and 23a are arranged so that those connected by the solder 31a are in contact with each other, and the connecting lands 13b and 23b are in contact with each other connected by the solder 31b. The connecting lands 13c and 23c are arranged so that those connected by the solder 31c are in contact with each other, and the connecting lands 13d and 23d are arranged so that those connected by the solder 31d are in contact with each other. Yes.

  In both the present embodiment and the comparative example, the connection lands 13a and 13b are formed on one surface of the first printed circuit board 11, and the connection lands 23a and 13b are formed on the second printed circuit board 21 accordingly. 23 b is formed, and connection lands 13 c and 13 d are formed on the other surface of the first printed circuit board 11. Accordingly, connection lands 23 c and 23 c are formed on the second printed circuit board 21. ing. Therefore, according to the present embodiment and the comparative example, the wiring connection efficiency between the first and second printed circuit boards 11 and 21 is increased as compared with the above-described conventional vertical mounting structure of the printed circuit board.

  Due to the first difference, in the comparative example, an unintended short between connection lands is likely to occur when attaching the solders 31a, 31b, 31c, and 31d. In addition, in spite of this, defective products are likely to occur. In the present embodiment, unintentional short-circuits between the connecting lands when the solders 31a, 31b, 31c, 31d are attached are prevented, so that the soldering operation is facilitated. As a result, defective products are less likely to occur.

  This point will be supplementarily described. In the comparative example, as can be understood from FIG. 10, a set of connection lands 13a, 13c, 23a, and 23c are arranged at the same position in the X-axis direction. The solder 31a entering the solder 31c and the solder 31c entering the gap between the insertion holes 16 are easily connected, and the connection lands 13a and 23a and the connection lands 13c and 23c are easily short-circuited. In the comparative example, since one set of connection lands 13b, 13d, 23b, and 23d are arranged at the same position in the X-axis direction, the solder 31b inserted into the gap of the insertion hole 16 is inserted when soldering. The solder 31d entering the gap of the hole 16 is easily connected, and the connection lands 13b and 23b and the connection lands 13d and 23d are easily short-circuited. On the other hand, in the present embodiment, as can be understood from FIGS. 2 and 3, the positions of the connecting lands 13a and 23a in the X-axis direction are shifted from the positions of the connecting lands 13c and 23c in the X-axis direction. Therefore, during soldering, the solder 31a entering the gap of the insertion hole 16 and the solder 31c entering the gap of the insertion hole 16 are not connected, and a short circuit between the connection lands 13a, 23a and the connection lands 13c, 23c occurs. Is prevented. Further, in the present embodiment, the positions of the connecting lands 13b and 23b in the X-axis direction and the positions of the connecting lands 13d and 23d in the X-axis direction are shifted from each other. Since the solder 31b and the solder 31d entering the gap between the insertion holes 16 are not connected, a short circuit between the connection lands 13b and 23b and the connection lands 13d and 23d is prevented.

  In the present invention, if the positions of the plurality of connection lands 13c in the X-axis direction are deviated from the positions of the plurality of connection lands 13a in the X-axis direction, the amount of shift is the half pitch of the pitch P. The short circuit between the connection lands 13a and 23a and the connection lands 13c and 23c can be prevented. However, it is preferable that the amount of deviation is a half pitch of the pitch P as in the present embodiment, since the wiring connection efficiency between the first and second printed circuit boards 11 and 21 can be further increased. . The same applies to the amount of deviation between the positions of the plurality of connection lands 13d in the X-axis direction and the positions of the plurality of connection lands 13b in the X-axis direction.

  Also, due to the second difference, in the comparative example, when recycling or the like, the solders 31a, 31b, 31c, 31d are removed to separate the first and second printed circuit boards 11, 21 from each other. Further, as can be understood from FIG. 10, the solder 31a tends to remain in the corners formed by the connection lands 13a and 23a, and the solder 31b easily remains in the corners formed by the connection lands 13b and 23b. The solder 31c tends to remain in the corners formed by the connecting lands 13d, and the solder 31d easily remains in the corners formed by the connecting lands 13d and 23d, and the removal of the solders 31a, 31b, 31c and 31d is not easy. It is not easy to separate them from each other. On the other hand, in this embodiment, as can be understood from FIGS. 2 and 3, the solder 31a hardly remains in the corner formed by the connection lands 13a and 23a, and the solder is formed in the corner formed by the connection lands 13b and 23b. 31b hardly remains, the solder 31c hardly remains in the corner formed by the connecting lands 13c and 23c, and the solder 31d does not easily remain in the corner formed by the connecting lands 13d and 23d. The solder 31a, 31b, 31c, and 31d Since the removal is easy, the substrates 11 and 12 can be easily separated from each other. Even if d ′ = 0, if d is set to a certain value, it is difficult to leave the solders 31a, 31b, 31c, and 31d when the substrates 11 and 12 are separated from each other as in the present embodiment. Can do. Even if d = 0 is set, if d ′ is set to a certain value, it is difficult to leave the solders 31a, 31b, 31c, and 31d when the substrates 11 and 12 are separated from each other as in the present embodiment. Can do. In the present invention, d = 0 and d ′ = 0 may be set as in the comparative example.

[Second Embodiment]
FIG. 11 is a schematic front view schematically showing a printed circuit board connection body 201 according to the second embodiment of the present invention, and corresponds to FIG. 12 is a schematic cross-sectional view taken along line Z7-Z8 in FIG. 11, and corresponds to FIG. FIG. 13 is a schematic cross-sectional view taken along line Z9-Z10 in FIG. 11, and corresponds to FIG. FIG. 14 is a schematic plan view showing one surface (+ Z side surface) of the first printed circuit board 41 in FIG. 11, and corresponds to FIG. FIG. 15 is a schematic plan view showing the other surface (the surface on the −Z side) of the first printed circuit board 41 in FIG. 11, and corresponds to FIG. 16 is a schematic cross-sectional view taken along line X5-X6 in FIGS. The schematic cross-sectional views along the line X7-X8 in FIGS. 14 and 15 are obtained by replacing the reference numeral 43a with the reference numeral 43b and the reference numeral 43c with the reference numeral 43d in FIG. 11 to 16, the same or corresponding elements as those in FIGS. 1 to 8 are denoted by the same reference numerals, and redundant description thereof is omitted.

  The connecting body 201 according to the present embodiment is basically different from the connecting body 1 according to the first embodiment in that the first printed circuit board is a flexible circuit board instead of the rigid first printed circuit board 11. 41 is used. The first printed circuit board 41 has an insertion hole 46 (corresponding to the insertion hole 16) elongated in the X-axis direction into which the insertion part 21a of the second printed circuit board 21 is inserted.

  The first printed circuit board 41 includes a flexible base film 42 made of an insulating material, a plurality of connection lands 43 a and 43 b formed on the + Z side surface of the base film 42, and the + Z side of the base film 42. The protective cover film 44 made of the formed insulating material, the plurality of connection lands 43c and 43d formed on the −Z side surface of the base film 42, and the insulation formed on the −Z side of the base film 42 And a protective cover film 45 made of a material. A rectangular opening 44 a is formed in the cover film 44. Between the base film 42 and the cover film 44, a plurality of wiring patterns such as copper foil (only a part thereof is shown by a broken line in FIG. 14) is formed, and the end portions thereof are exposed from the opening 44a and connected. Lands 43a and 43b are provided. The cover film 45 has a rectangular opening 45a. Between the base film 42 and the cover film 45, a plurality of wiring patterns such as copper foil (only a part thereof is shown by a broken line in FIG. 15) is formed, and their end portions are exposed from the opening 45a and connected. Lands 43c and 43d are provided. Although not shown in the drawings, through holes or the like are formed in the first printed circuit board 41 to connect the wiring patterns on both surfaces of the base film 42 as necessary.

  The plurality of connection lands 43a are arranged on the + Z side surface of the first printed circuit board 41 on the + Y side with respect to the insertion hole 46 and in the vicinity of the insertion hole 46 at intervals in the X-axis direction. These connection lands 43a are arranged at a constant pitch P 'in the X-axis direction. These connection lands 43a are arranged apart from the edge of the insertion hole 46 by a predetermined distance d.

  The plurality of connection lands 43b are arranged on the + Z side surface of the first printed circuit board 41 on the −Y side with respect to the insertion hole 46 and in the vicinity of the insertion hole 46 at intervals in the X-axis direction. . These connection lands 43b are arranged at the pitch P 'in the X-axis direction. These connection lands 43 b are arranged away from the edge of the insertion hole 46 by the predetermined distance d.

  The plurality of connection lands 43c are arranged in the vicinity of the insertion hole 46 on the + Z side of the first printed circuit board 41 on the + Y side with respect to the insertion hole 46 and sequentially spaced in the X-axis direction. . The positions of the plurality of connection lands 43c in the X-axis direction are shifted from the positions of the plurality of connection lands 43a in the X-axis direction. In the present embodiment, the plurality of connection lands 43c are also arranged at the pitch P ′ in the X-axis direction like the plurality of connection lands 43a. However, the plurality of connection lands 43c are arranged in the X-axis direction. Is shifted by a half pitch of the pitch P ′ with respect to the position in the X-axis direction of the plurality of connection lands 43a. Similarly to the connection land 43a, the connection land 43c is also separated from the edge of the insertion hole 16 by a predetermined distance d.

  The plurality of connection lands 43d are arranged in the vicinity of the insertion hole 46 on the -Z side surface of the first printed circuit board 41 on the -Y side with respect to the insertion hole 46 at intervals in the X-axis direction. Yes. The positions of the plurality of connection lands 43d in the X-axis direction are shifted from the positions of the plurality of connection lands 43b in the X-axis direction. In the present embodiment, the plurality of connection lands 43d are also arranged at the pitch P ′ in the X-axis direction like the plurality of connection lands 43b, but the plurality of connection lands 43b are arranged in the X-axis direction. Is shifted by a half pitch of the pitch P ′ with respect to the position in the X-axis direction of the plurality of connection lands 43b. Similarly to the plurality of connection lands 43b, the plurality of connection lands 43d are also separated from the edge of the insertion hole 46 by a predetermined distance d.

  In the present embodiment, the plurality of connection lands 23 a of the second printed circuit board 21 correspond to the plurality of connection lands 43 a of the first printed circuit board 41 on the + Y side surface of the second printed circuit board 21. And are respectively facing the plurality of connection lands 43a. Similarly to the plurality of connection lands 43a, the plurality of connection lands 23a are also arranged at the pitch P ′ in the X-axis direction, and the positions of the plurality of connection lands 23a in the X-axis direction are a plurality of connection lands. 43a is made the same as the position in the X-axis direction. The plurality of connection lands 23a are arranged at a predetermined distance d 'in the + Z direction from the position in the Z-axis direction of the + Z side surface of the plurality of connection lands 43a. The plurality of connection lands 23a are respectively connected to the plurality of connection lands 43a by solder 31a.

  The plurality of connection lands 23c of the second printed circuit board 21 are formed on the surface on the + Y side of the second printed circuit board 21 so as to correspond to the plurality of connection lands 43c, respectively. Each of them faces 43c. Similarly to the plurality of connection lands 43c, the plurality of connection lands 23c are also arranged at the pitch P ′ in the X-axis direction, and the positions of the plurality of connection lands 23c in the X-axis direction are a plurality of connection lands. 43c is made the same as the position in the X-axis direction. The plurality of connection lands 23c are arranged apart from the position in the Z-axis direction on the −Z side surface of the plurality of connection lands 43c by the predetermined distance d ′ in the −Z direction. The plurality of connection lands 23c are respectively connected to the plurality of connection lands 43c by solder 31c.

  The plurality of connection lands 23b of the second printed circuit board 21 are formed on the -Y side surface of the second printed circuit board 21 so as to correspond to the plurality of connection lands 43b, respectively. It faces the land 43b. Similarly to the plurality of connection lands 43b, the plurality of connection lands 23b are also arranged at the pitch P ′ in the X-axis direction, and the positions of the plurality of connection lands 23b in the X-axis direction are a plurality of connection lands. 43b is made the same as the position in the X-axis direction. The plurality of connection lands 23b are arranged at a predetermined distance d 'in the + Z direction from the position in the Z-axis direction of the + Z side surface of the plurality of connection lands 43b. The plurality of connection lands 23b are respectively connected to the plurality of connection lands 43b by solder 31b.

  The plurality of connection lands 23d of the second printed circuit board 21 are formed on the surface on the −Y side of the second printed circuit board 21 so as to correspond to the plurality of connection lands 43d, respectively. It faces the land 43d. Similarly to the plurality of connection lands 43d, the plurality of connection lands 23d are also arranged at the pitch P ′ in the X-axis direction, and the positions of the plurality of connection lands 23d in the X-axis direction are the plurality of connection lands 23d. 43d is the same as the position in the X-axis direction. The plurality of connection lands 23d are arranged apart from the position in the Z-axis direction on the −Z side surface of the plurality of connection lands 43d by the predetermined distance d ′ in the −Z direction. The plurality of connection lands 23d are respectively connected to the plurality of connection lands 43d by solder 31d.

  For example, the connecting lands 43a, 43b, 43c, 43d, 23a, 23b, 23c, 23d have a width in the X-axis direction of 0.5 mm, the pitch P is 1.0 mm, and the pitch P ′ is 1.1 mm to 1. About 2 mm, the predetermined distances d and d ′ are about 0.2 mm to 0.3 mm.

  Also in this embodiment, the same advantages as those in the first embodiment can be obtained.

  In the present embodiment, as described above, the first printed board 41 having the insertion hole 46 is a flexible board, and the second printed board 21 having the insertion portion 21a is a rigid board. However, in the present invention, the printed circuit board having the insertion hole may be a rigid substrate, the printed circuit board having the insertion portion may be a flexible substrate, and both printed circuit boards may be flexible substrates.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments. For example, in the first embodiment, the connection lands 13 b and 13 d are removed from the first printed circuit board 11, and the connection lands 23 b and 23 d are removed from the second printed circuit board 21 to obtain the second printed circuit board 21. A so-called single-sided printed board may be used.

DESCRIPTION OF SYMBOLS 1,101 Connection body of printed circuit board 11 1st printed circuit board 13a, 13b, 13c, 13d, 23a, 23b, 23c, 23d, 43a, 43b, 43c, 43d Connection land 16, 46 Insertion hole 21, 41 Second Printed circuit board 21a insertion part 31a, 31b, 31c, 31d solder

Claims (7)

A first printed circuit board having an insertion hole;
A second printed circuit board that partially inserts into the insertion hole;
A plurality of first connection lands formed on one surface of the first printed circuit board in the vicinity of the insertion hole at intervals in the longitudinal direction of the insertion hole;
The other surface of the first printed circuit board is formed in the vicinity of the insertion hole with a space in the longitudinal direction, and the position in the longitudinal direction is shifted from the position of the plurality of first connection lands. A plurality of second connection lands,
A plurality of third connection lands electrically connected to the plurality of first connection lands on one surface of the second printed circuit board;
A plurality of fourth connection lands electrically connected to the plurality of second connection lands on the one surface of the second printed circuit board;
A printed circuit board connector comprising: The pitch of the plurality of first connection lands is the same as the pitch of the plurality of second connection lands,
The positions of the plurality of first connection lands and the positions of the plurality of second connection lands are shifted by a half pitch of the pitch of the first and second connection lands. The printed circuit board connector according to claim 1.   The printed circuit board connector according to claim 1, wherein the plurality of first connection lands and the plurality of second connection lands are arranged apart from an edge of the insertion hole. On the one surface of the first printed circuit board, a plurality of fifth connections formed on the other side in the width direction with respect to the insertion hole and in the vicinity of the insertion hole at intervals in the longitudinal direction. For land,
On the other side of the first printed circuit board, the other side of the insertion hole is formed in the vicinity of the insertion hole at intervals in the longitudinal direction, and the position in the longitudinal direction is A plurality of sixth connection lands that are offset from the longitudinal positions of the plurality of fifth connection lands;
On the other surface of the second printed circuit board, a plurality of second connections formed corresponding to the plurality of fifth connection lands, respectively, and connected to the plurality of fifth connection lands with solder, respectively. 7 connection lands,
On the other surface of the second printed circuit board, a plurality of sixth connection lands formed corresponding to the plurality of sixth connection lands, and connected to the plurality of sixth connection lands with solder, respectively. An eighth connection land;
The printed circuit board connector according to claim 1, further comprising: The pitch in the longitudinal direction of the plurality of fifth connection lands is the same as the pitch in the longitudinal direction of the plurality of sixth connection lands,
The longitudinal positions of the plurality of fifth connection lands and the longitudinal positions of the plurality of sixth connection lands are a half pitch of the pitch of the fifth and sixth connection lands. The printed circuit board connector according to claim 4, wherein the printed circuit board connection is shifted.   6. The printed circuit board connector according to claim 4, wherein the plurality of fifth connection lands and the plurality of sixth connection lands are arranged apart from an edge of the insertion hole.   7. The printed circuit board connector according to claim 1, wherein one or both of the first and second printed circuit boards are flexible printed circuit boards.

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